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01/03/2011 - 24/05/2012
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Urduca - / Advanced
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12.01.2019 / 109-0
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Letter of Intent
I have done my undergraduate study in the field of Information Technology from National Institute of
Technology Srinagar, India. The duration of the program was four years. Over the course of this period, I was
exposed to various subjects of Computer Science. The subjects ranged from hardware-based—Computer
Architecture, Basic Electronics, Digital Electronics, and Microprocessor; to software-based—Data Structures,
Algorithm Design & Analysis, Operating Systems, Functional Programming, Object-Oriented Programming,
Database Systems, and Artificial Intelligence. During my undergraduate program, I developed a strong interest
in Artificial Intelligence. The very fact that machines can learn from past data and make near accurate
predictions caught my imagination. As I delved more into Artificial Intelligence, I found a field which really
induced an urge in me to pursue Masters study, namely Machine Learning. With the help of my professors and
the internet, I learned about various machine learning models and algorithms. As a result, I did my final year
project in Machine Learning wherein I predicted process variations in optical interconnects using Machine
Learning approach. With over 100,000 international students from 180 countries, Turkey provides a favorable
and inclusive atmosphere to pursue masters study. The strong alumni network with 150,000 alumni spread all
over the world reflects the success that people get from studying in Turkey. Home to many world-class
universities, Turkey has done extensive research in Machine Learning applications. My future plan after
studying in Turkey is to apply the knowledge that I would gain in Turkey back home in India.
In this section, it is expected to explain following details: your academic and social experiences relating the field you want to take an education, your
reasons for choosing Turkey for study and the importance of your future plans for your education and scholarship in Turkey.You can write the letter
of intent in the language you can express yourself.
Area of Study: Process Variation in On-chip optical networks using Machine Learning On-chip optical
networking is set to be a path-breaking technology in the future. For the past 10 years, there has been
tremendous activity in both industry and academia in the area of designing fast, efficient and feasible on-chip
optical networks. On-Chip electrical networks have some inherent disadvantages. They have high
communication latency (35 ps/mm) and offers lower bandwidth. The global interconnect latency in the
traditional on-chip electrical interconnect has not scaled down as the technology evolves. On contrary, wire
delay is worsening with technology scaling. Under these circumstances, interconnect solution that can provide
low latency, high sustained bandwidth and low energy consumption is mostly desired for the multi-core and
many core systems. Researchers have found optical interconnects as one of the best alternatives. However,
optical interconnects have their own inherent problems. Optical interconnects suffer from the problems of high
static power consumption. Another major issue that presents itself as the hindrance in the commercialization of
optical interconnects is 'Process Variations'. Process variations refer to the fabrication errors that can cause
devices to malfunction rendering communication unreliable. For example, micro-ring resonator, a preferred
optical modulator device, may not resonate at the designated wavelength under process variations (PV),
leading to communication errors and bandwidth loss, rendering such devices unreliable. Process variation is
caused by the inability to accurately control the fabrication process at small-scale technologies. It has die-die
(D2D) and within-die (WID) components. Die-to-die (D2D) variation, which is also called inter-die variation or
between-die variation, describes the variation that affects parameters in different dies differently, but affect
parameters within a die equally. Within-die (WID) variation, which is also called intra-die variation, across-chip
variation, on-chip variation, spatial variation, or spatial correlation, describes the variation that affects process
parameters at different locations of the same die differently. According to the scale of their causes, process
variations can also be classified into the following two categories: 1) Systematic variation describes the
deterministic portion of the variation. The physical causes of this variation are usually those identifiable
deterministic features or patterns. 2) Random variation describes the variation that is independent of any other
conditions. The physical cause of this variation is usually not well understood, and thus, it behaves more like a
stochastic process. The main aim is to design a mathematical model using Machine Learning for variation in
resonant wavelength with respect to variation in height and width of the micro-ring resonator.
1- Subject of study
The main topic is to predict the process variations in on-chip optical interconnects and devising ways to reduce
these process variations so that optical interconnects can replace the existing electrical interconnects in
modern processors. We need to reduce the process variations in such a way that power required to reverse the
process variation is minimized. In the domain of electrical interconnects many mathematical functions have
been proposed to model process variation. For example, with respect to electrical interconnects, there is a
spherical correlation model for within die components. To predict the process variation, machine learning will be
used. We have to first develop a mathematical function to model process variations and optimize the function
using machine learning. We also need to develop a correlation between process variation parameters (resonant
wavelength) of optical devices (micro-ring resonators) as a function of their distance in the chip and design a
mathematical model of the same.
3- Analysis of the Problem (at least 75, maximum 300 words)(In this section, briefly describe the topic and your theory (concept map) to be used in
the study.)
Research Methods will include the following: 1) Literature Survey: It includes studying various research papers
about process variation. This will give us information on the physical causes of process variation. 2) Data
Gathering: We need to collect data about variations in resonant wavelength of a ring resonator with respect to
variations in its physical parameters (diameter, refractive index, and height). We can collect this data by running
simulations on software called ‘Lumerical Mode’. 3) Data preprocessing: Before running machine learning
algorithms, we need to do data cleansing which involves eliminating null values. 4) Data Visualization: We need
to plot graphs of our data. This will help us in deciding the mathematical model for modeling process variation
in optical interconnects. 5) Selecting Mathematical Model: We need to select an appropriate mathematical
model for predicting process variation which would be further optimized using machine learning algorithms. 6)
Selecting a Machine Learning Algorithm: We need to select the proper machine learning algorithm to optimize
our mathematical model. We have to determine which algorithm will best optimize our model and give accurate
predictions.
4- Research Method (minimum 50 maximum 300 words)"(Give information about the academic research methods you intend to use in this study. For
example, in-depth interviews, observations, surveys, experiments, etc.) For example, in-depth interviews, observations, surveys, experiments, etc.)
Main Headings: 1) Process Variations: Process variations refer to the fabrication errors that can cause devices
to malfunction rendering communication unreliable. For example, micro-ring resonator, a preferred optical
modulator device, may not resonate at the designated wavelength under process variations (PV), leading to
communication errors and bandwidth loss, rendering such devices unreliable. 2) Machine Learning: Machine
learning is an application of artificial intelligence (AI) that provides systems with the ability to automatically learn
and improve from experience without being explicitly programmed. Machine learning focuses on the
development of computer programs that can access data and use it to learn for themselves. It is the scientific
study of algorithms and statistical models that computer systems use to effectively perform a specific task
without using explicit instructions, relying instead on models and inference. Machines use past data to make
predictions and learn from mistakes to improve accuracy. 3) On-chip optical interconnects: In integrated
circuits, optical interconnects refer to any system of transmitting signals from one part of an integrated circuit to
another using light. As compared to electrical networks optical networks have some inherent advantages: low
latency communication (7ps/mm as compared to 35 ps/mm in electrical networks), and high bandwidth (owing
to the fact that 32-64 wavelengths can be multiplexed on the same physical channel). However, before the
large-scale commercial adoption of optical networks, it is necessary to solve the problem of high static power
dissipation. Static power dissipation can increase the total optical NoC power by up to 600% and can render
such networks infeasible.
5- General Structure of the Study (at least 75, maximum 300 words)Write the main headings of the study.)
This study will help in understanding the problems associated with using optical interconnects. Modeling
process variations in on-chip optical interconnect using Machine Learning will aid in studying and reducing the
process variations in optical interconnects. The implications of using optical interconnects can be huge. We can
process data much faster. Modern day processors which presently use electrical interconnects can have even
higher performance if we use optical interconnects. The optical interconnects have higher bandwidth and very
less delay as compared to electrical interconnects. Our machines can work much faster. Harnessing the power
of Wavelength Division Multiplexing, we can send 64 bits at a time with each bit modulated on one wave. This
means a lot of information can be sent in very less time.
6- Academic Contribution of the Study (minimum 75, maximum 300 words) (Explain how this study will contribute to your academic field.)
With respect to the grading system in my undergraduate institute, I want to clarify that it follows an absolute
grading system, not a relative grading system. It means that even if one tops a subject and has scored say 70
out of 100, his/her percentage will be 70 % even though the percentile is 100. The grades are awarded based
on the marks obtained and not on how many students he/she has surpassed.
If you have a subject in your application documents that you think is not clear enough and you want to explain, or if you want to draw the attention of
the evaluation committee, please briefly explain in this section. You can write the description in the language you can express yourself.
Field Questions
Family Information Total Monthly Income : 1000-2500 ($)
REYAZ AHMAD JEELANI / Yes Central University of Kashmir Engineer / Executive Engineer
Father’s Name / Is your father alive? The institution/company your father works at Your Father’s Occupation / Title/Position
+917006782929 +917006782929 İş
Phone (Home) Mobile Phone Purpose of your stay in this country
Professors Colony
Cadde / Sokak / Bina No / Kapı No
Academic Qualification
Social Activities
Award,
Project,
Certificate
Type Name Field Date Institution Description
Certificate Salesforce Cloud 23.09.2018 Salesforce Salesforce is a cloud computing platform specialized in
Certified Computing Customer Relationship Management. This certificate is
Administrator provided by Salesforce to recognize professionals who are
proficient in Salesforce Administration work.
Projects Efficient Computer 1.06.2018 NIT Srinagar Final Year project in my undergraduate program. It was based
Communication Science on developing a multi-core architecture using silicon photonics.
Framework for The silicons phtonics were meant to replace electrical
MultiCore interconnects in muti-core computer architecture. The project
Architecture focused on predicting the process variations (deviations in
physcial parameters) in silicon photonics and devising ways to
reduce the variations.
Certificate Salesforce
Certified
Cloud
Computing
25.01.2019 Salesforce Salesforce certified platform developer declaring proficiency in
programming languages used by Salesforce to develop
Platform applications. The programming languages are 'Apex',
Developer-I 'VisualForce', and 'Lightning Component Framework'
IIT Delhi / Predicting Process Variation in optical interconnects using Machine Learning / 1 Month
Company/Institution Name / Subject/topic of Internship / Duration of Internship
Academic Activities
Information on Hobbies
Voluntary Activities
Institution/NGO
Name you served at Description
Flood Local Mosque In September 2014, Kashmir Valley was badly hit by floods. During that time, I volunteered to collect
Relief Community food, clothes, money for the flood victims on behalf of local mosque community.
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Turkiye Experience
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Start date / Graduation Date Have you ever received a scholarship from any institution or
organisation in Turkey?
- Sosyal Medya
Institution/organisation that provided the scholarship Please specify how you learned about this scholarship?
No No
Do you have a relative who is currently or was previously a holder of a Do you have any relatives living in Turkey?
Türkiye Scholarship?