You are on page 1of 685

5RFKH'LDJQRVWLFV+LWDFKL

(OHFV\V

6HUYLFH0DQXDO9HUVLRQ$SULO

&DW1R
RD/Hitachi Immunoassay System 2010 Service Manual

1. Application/Introduction
1.1 Instrument
1.2 Specifications
1.3 Operating Precautions and Hazards
1.4 Service Concept
1.5 Rack Sampler/Rack Sampler Connected to CLAS 1 System

2. Installation / Set Up
2.1 Site Requirements
2.2 Inventory
2.3 Analyzer Installation
2.4 Software Installation
2.5 Rack Sampler Connected to CLAS 1 System Installation
2.6 Check/Adjustment During Installation

3. Flow Path
3.1 Description of Flow Path
3.2 Overall Piping Diagram
3.3 List of Fluidic Parts
3.4 System Volume

4. Mechanics
4.1 Overview
4.2 Location of Mechanisms
4.3 List of Motors, Sensors and Other Mechanisms
4.4 Detailed Explanation of Each Mechanism
4.5 Mechanical Adjustment
4.6 Rack Sampler System
4.7 Rack Sampler Connected to CLAS 1 System

5. Electronics
5.1 Boards
5.2 Power Source
5.3 Electronic Modules
5.4 Printed Circuit Boards
5.5 Cross Wiring Diagrams
5.6 How to Check Photo Interrupters

6. Service Software
6.1 Overview

1
7. Troubleshooting
7.1. Alarms List
7.2 Data Alarms
7.3 Troubleshooting List
7.4 Data File Load Errors
7.5 Quality Control Check

8. Spare Parts/Recommended Parts


8.1 Special Service Tools
8.2 Complete Recommended Parts List
8.3 Printed Circuit Boards List

9. Host Interface (not applicable)

10. Maintenance
10.1 Operator Maintenance
10.2 Preventive Maintenance

Appendix

2
1. Application / Introduction

1.1 Instrument
1.1.1 Name of Each Part
1.1.2 System Description
1.1.3 Description of Movement

1.2 Specifications
1.2.1 Technical Data for Transportation and Storage
1.2.2 Technical Data for Operation of Instrument

1.3 Operating Precautions and Hazards


1.3.1 Operating Procedure and Hazards
1.3.2 Warning Labels

1.4 Service Concept


1.4.1 Service Level
1.4.2 Conditions

1.5 Rack Sampler/Rack Sampler Connected to Clas 1 System


1.5.1 Name of Each Part
1.5.2 Movement of the Rack Sampler
1.5.3 Movement of the Rack Sampler Connected to Clas 1 System
RD/Hitachi Elecsys 2010 Service Manual

1. Application/Introduction
1.1 Instrument

1.1.1 Name of Each Part

User Interface (U/I) Analyzer Unit

Main Power
Switch

Front Switch

Fig. 1-1 Immunoassay System 2010

V 1.6 – April 1999 1 Chapter 1.1.1


RD/Hitachi Elecsys 2010 Service Manual

Top Cover (L) Top Cover (R)


Incubator

Detection Unit

System Reagents

System Water
Container

Sample Disk

Reagent Disk Vessels Tips Liquid Waste Container

Fig. 1-2 The Components of the Analyzer Unit (1/2)

Chapter 1.1.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Microparticle mixer Pipetter Buffer

Pipetter
Sipper

Cap Opener

BCR

Pipetter and
Sipper Syringes

Rinse Station
(Sipper)
Rinse Station (Pipetter FD Drive and Solid Waste Gripper
and Beads Mixer) Container (Inside Front Door)

Fig. 1-3 The Components of the Analyzer Unit (2/2)

V 1.6 – April 1999 3 Chapter 1.1.1


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1-4 Rack Sampler System

Fig.1-5 Rack Sampler connected to CLAS 1 System (front view)

Chapter 1.1.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Fig.1-6 Rack Sampler connected to CLAS 1 System (rear view)

Chapter 1.1.1 5 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

1.1.2 System Description

The movement for the analysis consists of following steps.

1) First pipetting
2) Incubation
3) Second pipetting
4) Incubation
5) Determination

• Press START key on U/I, and the pre-operation movement starts.


The pre-operation movement includes reset movement of all mechanisms, inventory control
(reagent disk scan, sample disk scan, checking the position of Tip/Vessel that is
picked up first and checking the remaining volume of system reagent), discard tips and
vessels on the buffer position and incubator and microparticle mixing.
• The above-mentioned 5 steps of movement start after the pre-operation movement has been completed.

The details of each step are as follows.

V 1.6 – April 1999 1 Chapter 1.1.2


RD/Hitachi Elecsys 2010 Service Manual

1.1.3 Description of Movement

1) First Pipetting
The pipetting movement begins with the gripper carrying a tip from the tip magazine to the pipetting station. The
pipetter then picks up the tip and aspirates reagent or microparticles from a RackPack on the reagent disk and
aspirates sample from the sample disk according to the assay protocol. The vessel is carried by the gripper to the
pipetting station and the pipetter discharges the mixture into the vessel. The point of the tip is washed after every
aspiration of reagent or microparticles, and the tip is discarded after discharging the mixture into a vessel.

2) Incubation
The vessel which has the sample/reagent mixture in it is carried to the incubator by the gripper.

3) Second Pipetting
The gripper carries a new tip to the pipetting station and the gripper returns the vessel in the incubator to the
pipetting station. The pipetter carries out the second pipetting with the tip according to assay protocol.

4) Incubation
The vessel which has the mixture in it is carried back to the incubator by the gripper.

5) Determination
The gripper carries the vessel from the incubator to the aspiration station. The sipper then aspirates the mixture, and
then aspirates ProCell to introduce the mixture into the measuring cell. A magnet is applied to the cell to capture the
microparticles in the measuring cell. After applying voltage and detecting the luminescence, the sipper aspirates
CleanCell to wash the measuring cell and flow path.

V 1.6 – April 1999 1 Chapter 1.1.3


RD/Hitachi Elecsys 2010 Service Manual

1.2 Specifications

1.2.1. Technical Data for Transportation and Storage

System transpiration conditions:

Temperature : - 20 ∼ 55 degrees C
Humidity : 5 ∼ 95 % (80 % or less on average)
Positioning : up to 30 degrees temporarily
The precision mechanical units require very careful transportation of the system.
The system should be packed as shipped from HID unless very careful transportation is expected.

System storage conditions:

Temperature : - 20 ∼ 55 degrees C
Humidity : 5 ∼ 95 % (80 % or less on average)
Dust : as little as possible

Note) If the Rack Sampler/Rack Sampler is connected to a CLAS 1 System,


the same conditions as those described above apply.

V 1.6- April 1999 1 Chapter 1.2.1


RD/Hitachi Elecsys 2010 Service Manual

1.2.2. Technical Data for Operation of Instrument

Operating conditions:

Temperature: 18 ∼ 32 degrees C
Temperature gradient : within ± 2 degrees C/h
Humidity: 20 ∼ 80 % excluding conditions under which condensation takes place
In addition, the system should also meet the specifications under the following conditions:
Temperature: 5 ∼ 40 degrees C
Humidity: 20 ∼ 95 % excluding conditions under which condensation takes place

Mains power consumption:

(1) Analyzer Unit

800 VA or less

(2) Rack Sampler System

Sampler unit: 250 VA maximum

(3) Rack Sampler connected to CLAS 1 System

250 VA maximum

Dimensions and weight:

(1) Analyzer Unit

Size: 1,200 mm (W) × 730 mm (D) × 560 mm (H) (48 x 29 x 23 in.), excluding the user
interface
Weight: 170 kg (375 lbs.) or less

(2) Rack Sampler System

Size: See Chapter 1.5.1


Weight: 40 kg / 88 lbs. (sampler unit only)

(3) Rack Sampler connected to CLAS 1 System

Size: See Chapter 2.5, Fig. 10


Weight: Sampler unit, turntable C 54 kg (119 lbs.)
I line, I line base 18 kg (40 lbs.)

V 1.6 – April 1999 1 Chapter 1.2.2


BM/Hitachi Elecsys 2010 Service Manual

Operation:

Process: run
Operating mode: random access
Throughput: ca. 86 tests/h at the most. Throughput depends on the test combination
Sample loading capacity: 30 positions for samples, controls and assay calibrators
STAT capacity: STAT samples can be loaded on any positions of the sample disk as
long as they are not occupied
Continuous loading: available during the sampling stop
Test capacity: 180 vessels (60 vessels in each magazine) and 360 tips (120 tips in each magazine)
Reagent capacity: 15 positions for assay RackPacks, two for diluent RackPacks and one for a blank cell
Walkaway capacity: 180 determinations
Water loading capacity: 3 liters
Liquid waste capacity: 4 liters
PSID: conventional bar codes
PRID: matrix barcodes
Assay protocols: 26 kinds of assay protocols
Automatic dilution: Available up to 1:100
Instrument calibration: Initial Blank Cell during preventive maintenance
Microparticle mixing: automatic
Inventory control: automatic
Evaporation protection: RackPacks are automatically capped and decapped
Disposables: automatic handling and discarding
Data input: via matrix barcodes or the interface to HOST
Result output: via interfaces to the external printer or HOST
Interface: a bi-directional RS232C interface to HOST and a parallel interface to the printer
Interface to the modular system: available

Liquid level detection (LLD) :

Samples, controls and assay calibrators on the sample disk: capacitance LLD
RackPacks: capacitance LLD
Assay buffer and cell cleaner: capacitance LLD
Hovering detection: available for samples, controls and assay calibrators on the sample disk
Sample short detection: available for samples, controls and assay calibrators on the sample
disk according to the functions installed in the system software
Specification of pipetter dead volume:
Final target pipetter dead volume: to be included after RD agrees with Hitachi’s proposal.

Clot detection: available for samples, controls and assay calibrators on the sample
disk according to the functions installed in the system software

Consumption:

Water: 12 ml or less per cycle


Assay buffer: 2.2 ml or less per cycle
Cell cleaner: 2.2 ml or less per cycle
Tip: one or two tips for each determination
Vessel: one, two or three vessels for each determination
Assay reagent: 50 ∼ 80 µl for each reagent depending on the assay protocols
Microparticles: 30 ∼ 50 µl depending on the assay protocols
Sample/control/calibrator: 10 ∼ 50 µl depending on the assay protocols

Chapter 1.2.2 2 V 165 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Specific examples of primary sample tubes, secondary tubes, rack and tray :

- Only the Hitachi Standard rack (P/N741-6560 onward) is suitable as a rack for Rack Sampler/Rack Sampler
connected to CLAS 1 System.

- Only the Hitachi Standard tray is suitable as a tray for Rack Sampler/Rack Sampler connected to CLAS 1
System.

- Suitable primary sample tubes for the Hitachi Standard Rack are as follows.

13 x 75 mm 15.65 x 100 mm
13 x 100 mm 16 x 75 mm
13.25 x 78 mm 16 x 100 mm
14.0 x 100 mm 16.2 x 100 mm
15.3 x 75 mm 16.5 x 92 mm

V 1.6 – April 1999 3 Chapter 1.2.2


RD/Hitachi Elecsys 2010 Service Manual

1.3 Operating Precautions and Hazards

1.3.1 Operating Procedure and Hazards

1. All electrical equipment is potentially hazardous. Never remove covers without first ensuring that the equipment
is isolated from AC supply, unless specific maintenance instructions or repairs are being carried out by
authorized Hitachi or Roche Diagnostics personnel.

2. All samples and reagents should be handled according to precautionary measures for material known to contain
pathogenic organisms. Similarly, cleaning of components of Elecsys 2010, such as needles, tubings, waste
pathway, sample disk should be done with regard to human health.

3. The hard and software are subject to a program of continuous evaluation and improvement, and may therefore
be changed in the future. This also applies to service requirements.

V 1.6 – April 1999 1 Chapter 1.3.1


RD/Hitachi Elecsys 2010 Service Manual

1.3.2 Warning Labels


1. Meaning of the warning labels
See the location of the warning labels on the next pages.

Table 1.3.2-1 Description of warning labels


No. Label Description
1 Biohazard
Avoid directly touching samples which may contain
pathogens or entail danger to the human body.
If sample adheres to the instrument, wipe it off
immediately.
Avoid touching the pipetter mechanism, cap open /
close mechanism, gripper mechanism and other moving
parts while the instrument is operating.

2
Dispose of waste solution, tips and vessels properly
according to relevant government regulations.
Otherwise pollution may be caused.

3
See the instructions for details of reagent handling.
In event of skin contact, wash the affected area
thoroughly and consult a doctor if necessary.

4
Hazardous voltage (1000 V).
Can cause death or severe injury.
Do not open this cover with the main power switch
turned on.

5
PMT can be damaged.
Do not open the front cover or the service cover of
the detection unit with the main power switch turned
on.

V 1.6-April 1999 1 Chapter 1.3.2


RD/Hitachi Elecsys 2010 Service Manual

2. Location

Fig.1.3.2-1

Chapter 1.3.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1.3.2-2

V 1.6 – April 1999 3 Chapter 1.3.2


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1.3.2-3

Chapter 1.3.2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

1.4 Service Concept

1.4.1 Service Level

From the early stage of development, Elecsys 2010 was designed for simple error detection and easy exchangeability
of modules. This allows the service workshops fast and easy repair of the instrument on service level A (module
level). No big stock or expensive equipment is necessary and service technicians are easier to train. Also, a
permanent technical improvement in layout and components took and takes place for better productivity and
economic production.

On repairable modules the quality and function is always provided by the manufacturer according to the latest
technology. This ensures that Elecsys 2010 always meets the highest quality standards.

1.4.2 Conditions

Warranty period for instruments and spare parts

The warranty period for instruments is 16 months starting with the date of shipment ex works
Mannheim/Federal Republic of Germany or 12 months starting with the date of the first installation,
whichever period is shorter.

The warranty period for spare parts is 6 months from installation date of the part, however not longer than
24 months after having been delivered ex works Mannheim/Federal Republic of Germany.

Note:
If the instrument has a remaining warranty period of more than 6 months, the parts remain under warranty
until the warranty period of the instrument expires.

Handling of Warranty Claims

The warranty claim has to be handled via the Return Authorization (RA) procedure or accepted
equivalent. Please answer all the questions on the RA form with the greatest care.
In particular, a detailed fault description is needed or the warranty claim will not be accepted by the
manufacturer.
Complete instruments are not accepted unless this has been agreed with the service department of the
relevant product group responsible at RD GmbH.

Important information:

* Only parts marked with "A" in the price list are generally accepted under warranty.
* Only return those parts marked with "R" in the spare parts price list.
* Warranty claims for "R" parts will be accepted, if the part is returned to Mannheim.
* All defective parts ( non-"R" and "A" parts ) should be kept on stock for a period of 7 months. In
case the manufacturer needs the part for investigation it will be requested from Mannheim.
* All parts returned to Mannheim and not requested by Mannheim will be sent back at the expense of the
countries.
* The RA claim for warranty has to be in Mannheim no later than 8 weeks after the problem date.

V 1.6 April 1999 1 Chapter 1.4


RD/Hitachi Elecsys 2010 Service Manual

Exclusion of warranty

The aforementioned warranties do not apply in case of improper use, handling, transportation or storage,
faulty installation, repair or maintenance, chemical influence or contamination as well as damages
resulting from that, failure to follow operating instructions, alterations or modifications of instruments or
parts thereof not authorized or recommended by RD GmbH and resulting damages, normal wear and tear
and in case of other circumstances beyond the control of RD GmbH.

Handling of repairs

As a general rule, all instrument repairs should be carried out by authorized and trained personnel only.

Repair of "R" parts

Parts which are economically worth repairing are marked with "R" in the spare parts price list. New and
repaired parts could be recognized by different material numbers (language version).

(e.g. new part: 1234567-001, repaired part: 1234567-984)

Repaired parts should be ordered together with new parts via the order processing department in
Mannheim (OU-VDG). Parallel to the ordering process of a repaired part, the defective part should be
returned together with the completed RA form (giving full details of the defect and choice box marked
repair) to Logistic Instruments (Goods Receipt) in MA-Wohlgelegen (LI-LV).

Repair of instruments:

Complete instruments are not accepted for replacement or repair unless this has been agreed with the
product group responsible at RD GmbH.
Before replacement or repair can take place, the validity of the request must be examined and the question
of costs must be settled in a written agreement with RD GmbH.

Terms of delivery

Shipments to the countries with the routine truck are c.i.f./ shipments; outside this procedure are ex works
Mannheim .

Emergency shipments require additional costs to be charged.

Handling of costs

"Repaired" parts (Material No. 1234567-984) are shipped at a repair price. If the defective parts are not
returned within 3 weeks (for European countries) or 8 weeks (for overseas countries) of ordering the
repaired part, the countries will subsequently be charged with the difference to the new price.

After the receipt of a warranty request for "A" parts, RD will credit 100 % of the currently effective ex
MA price.

If the manufacturer does not accept the warranty request, the countries will subsequently be charged with
the R price for R parts and the new price for non-R parts.

Chapter 1.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

RA form

Return Authorization

Please complete the following parts of the RA form and then sign the form.

* Country code
* Problem date
* Type of instrument
* Serial no. of the instrument
* Installation date of instrument
* Defective instrument or spare part
* Part number and material number of the spare part
* Old / new serial no.
* Fault description
* Alarm code
* Service / workshop report no.

In case of instrument out of warranty

* Installation date of spare part

All returned parts should be individually labeled with the corresponding RA no. and shipped together with the
completed RA form to:

Roche Diagnostics GmbH


Logistic Instruments
RA Management
Friedrich-Ebert-Str. 100
D - 68167 Mannheim
Germany

V 1.6 April 1999 3 Chapter 1.4


RD/Hitachi Elecsys 2010 Service Manual

RA Form

An example of the RA form is given below.

Chapter 1.4 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

1.5 Rack Sampler/Rack Conveyor System


1.5.1 Dimensions

Fig. 1.5.1.1 Rack Sampler System

V 1.6 April 1999 1 Chapter 1.5.1


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1.5.1.2 Rack Conveyor System

V 1.6 – April 1999 2 Chapter 1.5.1


RD/Hitachi Elecsys 2010 Service Manual

1.5.2 Movement of the Rack Sampler

1.5.2.1 A line

This line sets the rack in which the samples (maximum 15) are placed to the tray and conveys it to the
B line.

1.5.2.2 B line

This line accurately conveys the rack that has the samples that have been received from the A line
to the bar code reading position and the pipetting position. After reading of the sample bar code and
the rack bar code and after pipetting, the rack is conveyed to the C line (storage unit) or the D line.

1.5.2.3 C line

This line unloads the rack that has the samples that have been conveyed by the B line
to the tray with the arm used for rack conveying.

V 1.6 – April 1999 1 Chapter 1.5.2


RD/Hitachi Elecsys 2010 Service Manual

1.5.3 Movement of the Rack Sampler Connected to CLAS 1 System

(1) A line

This line is used as a rack entry line where racks (up to 15 racks) with samples are set using trays. These
racks are transferred to the B2 line. Any rack transferred from the A line is treated as a STAT sample rack,
which takes precedence over racks transferred from the I line.

(2) B2 line

This line receives sample racks from the A line or turntable C and transfers them accurately to the barcode
reading position and the sampling position. After the sample and rack barcodes are read and sampling has
been performed, the racks are transferred to the C line.

(3) C line

The C line receives sample racks from the B2 line and stores them onto trays by means of the rack transfer
arm.

(4) I line

This line receives sample racks from the transfer connection line. It hooks the front of each rack with the rear
claw, changes the clamping position, and pushes the back of each rack with the front claw toward the buffer
position. Then, each rack is transferred to turntable C through the buffer position.

(5) Turntable C

Turntable C receives sample racks from the I line and turns each rack through 90° counterclockwise. Then,
each rack is transferred to the B2 line.

Chapter1.5.3 1 V 1.6 – April 1999


2. Installation / Set Up

2.1 Site Requirements


2.1.1 Delivery Space Requirements
2.1.2 Physical Space Requirements
2.1.3 Ambient Conditions Requirements
2.1.4 Electrical Requirements
2.1.5 Water Requirements

2.2 Inventory

2.3 Analyzer Installation


2.3.1 Unpacking
2.3.2 Explanation of Packing Position in the System (Based on Disk only)
2.3.3 U/I Installation and AC Power Supply Confirmation
2.3.4 Setup
2.3.5 Mounting a Measuring Cell
2.3.6 Installation of System Software
2.3.7 Fill Liquid System
2.3.7.1 Pipetter/Sipper Priming
2.3.7.2 Beads Mixing
2.3.8 Adjustments to be Checked During Installation and After Replacement
2.3.9 Measuring Cell Preparation
2.3.9.1 Preparation
2.3.9.2 Check Procedure
2.3.9.3 Overview
2.3.10 System Volume Check
2.3.10.1 Preparation
2.3.10.2 Procedure
2.3.11 High Voltage Check / Adjustment
2.3.11.1 Preparation
2.3.11.2 Check Procedure
2.3.11.3 Evaluation of the PMT HV Adjustment Run
2.3.11.4 Restore Parameter
2.3.11.5 Adjustment of High Voltage
2.3.12 Initial BlankCell Calibrations
2.3.12.1 Concept of BlankCell Calibration
2.3.12.2 Preparation
2.3.12.3 Check Procedure
2.3.12.4 Evaluation of Initial BlankCell
2.3.13 Instrument Checks
2.3.13.1 Artificial Media Test (AM Test)
2.3.13.2 TSH Assay Test
2.3.13.3 Assay Performance Check (APC) Troubleshooting
2.3.14 Assay Calibration
2.3.15 Installation Procedures Overview / Checklist
2.3.16 Procedure for Multiple Installations

2.4 Software Installation


2.4.1 Overview
2.4.2 Installation Procedure

2.5 Rack Sampler / Rack Sampler Connected to CLAS 1 System Installation


2.5.1 Rack Sampler System Installation
2.5.2 Rack Sampler Connected to CLAS 1 System Installation
2.5.3 How to Turn Power On
2.5.3.1 Power Source Cable
2.5.3.2 How to Turn Power On

2.6 Checks / Adjustments During Installation


2.6.1 Bead Mixer
2.6.1.1 Check Mixer Speed
2.6.1.2 Mixer Adjustment
2.6.1.3 Mixer Paddle Shape
2.6.2 Pipetter Adjustment
2.6.3 Sipper Adjustment
2.6.4 Electronic Adjustments
2.6.5 Rack Sampler Adjustments
2.6.5.1 Adjustment Table
2.6.5.2 Explanation Adjustment Sample Position
RD/Hitachi Elecsys 2010 Service Manual

2. Installation / Set Up

2.1 Site Requirements


2.1.1 Delivery Space Requirements

1) Receiving
A loading dock or other suitable facility is needed to allow the analyzer to be safely unloaded.

2) Routing
It is necessary to move the analyzer safely from the unloading point to the proposed point of operation.
Following spaces are required:
a. Minimum door width is 91 cm (36 in.).
b. Minimum turning radius is 167 cm (66 in.).
c. Loading size & capacity of elevator, if required, are minimum 95 cm x 150 cm
(38 in. x 60 in.) and 250 kg (550 lbs).

2.1.2 Physical Space Requirements* (*See Chapter 1.2.2 for details for Rack and Rack/Clas 1 systems.)

1) The Elecsys 2010 analyzer weighs approximately 170 kg (375 lbs). The weight is distributed onto two (2)
leveling feet with two (2) ball casters.
The analyzer is 73 cm (29 in.) in depth, 120 cm (48 in.) in width and 56 cm (46 in.) high.
The analyzer requires 10 cm (4 in.) clearance from wall, which means the table needed must have a minimum
depth of 80 cm (33 in.) to insure air circulation and service access.
2) The analyzer requires 60 cm (24 in.) height clearance from the top of instrument (total 116 cm (46 in.) from top
of table) to allow opening of the top cover.

Wall
Back Space AC Cable
10 cm (4 in.) 2.5 m (6 ft.)

Printer Host
Depth Table Depth
73 cm 83 cm
Elecsys 2010 (26 in.) (33 in.)

Width
120 cm
(48 in.)

2.1.3 Ambient Conditions Requirements* (*See Chapter 1.2.2 for details for Rack and Rack/Clas 1 systems.)

1. Ten air changes per hour are required in the immediate area of operation without air flow directly
onto or across the top of the analyzer.
2. The analyzer dissipates approximately 1000W while requiring an ambient room temperature of 18 to
32 °C and a temperature gradient within ±2 °C / h to insure analyzer reliability.
3. The ambient relative humidity should be between 20 and 80%.
4. The environment should be dust-free and vibration-free.
5. The analyzer should not be installed in direct sunlight or with air conditioning or heat blowing
directly onto it.

V 1.6 – April 1999 1 Chapter 2.1.1


RD/Hitachi Elecsys 2010 Service Manual

2.1.4 Electrical Requirements

The 220 volt or 115 volt single phase line should meet the following requirements.
1. Voltage at power source: 180 VAC ~ 264 VAC for 220 VAC, and 92 VAC ~ 132 VAC for /
115 VAC.
2. Amperage rating of circuit breaker at all loads.

Input voltage Rush current Current interval


200VAC 250 A peak 5 ms
100VAC 180 A peak 5 ms

3. Safety ground : safety ground must not be able to assume any potential above any fixture located in the
immediate vicinity of the analyzer (0.1V max.). Also, earth ground must be prepared with 3rd grade (less
than 10 Ohm).
4. The maximum voltage between neutral and ground should not exceed 2 V RMS.
5. Location of power source: the power source should be located within 5 m (6 ft.) of the proposed
operation place.

2.1.5 Water Requirements

The Elecsys 2010 requires approximately 2 liters of deionized water per 180 tests (per run).

Specification of deionized water:


Bacteria-free deionized water with a conductivity of 10.0 µS/cm or less.

Chapter 2.1.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.2 Inventory
Note

The current Inventory List is packed with the instrument. Please check the parts according to this list
when unpacking the instrument.

V 1.6 – April 1999 1 Chapter 2.2


RD/Hitachi Elecsys 2010 Service Manual

2.3 Analyzer Installation


General
When installing the analyzer we highly recommend that you follow the instructions in this Chapter.
Apart from Setup of the instrument, this description is valid for E2010 disk, E2010 rack and E2010
connected to Clas 1.

2.3.1 Unpacking
• Make sure that the counter on which you will set the instrument satisfies the set up requirements.
Refer to Chapter 2.1.
• Unpack Elecsys 2010, and make sure that all accessories are in the box. Refer to the inventory list
paked with the instrument.
• After complete unpacking of the instrument, remove all the safety devices from bead mixer, pipetter,
gripper, sipper, magnet drive and liquid waste container. See Figs. 2.3.2-1 to 2.3.2-9.
• Check if there is any transport damage and report details via RD to HID-QA.
• Place the plate (P/N741-1770) on the counter top under the 2010 and verify that all the feet of the
2010 are on the plate.
Note: The plate is only necessary if the table surface is weak.
We offer a special table (Systable) on which to place the system, on stock. A side extension can
also be ordered for Rack instruments.
• Place the two rubber plates (P/N 741-1760) under the front two leveling feet.
• Level the 2010.
• Make sure that the analyzer is stable (sliding should not be possible).

2.3.2 Explanation of Packaging Position in the System (Based on Disk Only)

The arrangement of the parts and packaging is shown in the following figures

V 1.6 – April 1999 1 Chapter 2.3.1-2


RD/Hitachi Elecsys 2010 Service Manual

741-0119
BEADS MIXER ASSY

741-0302
741-0117 741-0627 741-1510 WATER RESERVOIR ASSY
S DISK ASSY R DISK ASSY L WATER TANK

Chapter 2.3.1-2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Packing of S Disk Assy


The S Disk Assy is held with a cushion and fixed with a tape at one position.

741-0117
S Disk Assy

Cushion

Tape

Tape

Cushion

741-0117
S Disk Assy

V 1.6 – April 1999 3 Chapter 2.3.1-2


RD/Hitachi Elecsys 2010 Service Manual

Packing of R Disk Assy


The R Disk Assy is fixed with tapes at two positions.

Tape
Tape
741-0627
R Disk Assay

Chapter 2.3.1-2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Packing of L Waste Tank


The L Waste Tank is held with a cushion and fixed with a tape at one position.

741-1510
L Waste Tank Cushion Tape

741-1510
L Waste Tank Cushion

Tape

V 1.6 – April 1999 5 Chapter 2.3.1-2


RD/Hitachi Elecsys 2010 Service Manual

Packing of Water Reservoir Assy


The connection part of Buffer Tank Assy and Water Reservoir Assy is covered with a vinyl resin bag.
A cushion is placed on the Buffer Tank Assy, and the Water Reservoir Assy is placed on it; they are fixed with a
tape at one position. Water Reservoir Assy is placed so that the lid is on the front side.

Lid Tape 741-0302 Water Reservoir Assy

Vinyl resin bag

741-0561
Buffer Tank
Assy

Chapter 2.3.1-2 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Packing of Beads Mixer Assy


The Beads Mixer Assy is held with a cushion, and fixed with tapes at two positions.

741-0119
Beads Mixer Cushion
Assy

Tapes

741-0119
Beads Mixer Assy Cushion

Tape

Tape

Note: The mixing paddle (P/N741-0516) is detached from the head of beads mixer and is packed with two
(2) hex screws in a box together with the accessory parts (P/N741-0900) from serial number 1059-01
onwards.

V 1.6 – April 1999 7 Chapter 2.3.1-2


RD/Hitachi Elecsys 2010 Service Manual

2.3.3 U/I Installation and AC Power Supply Confirmation

Place the U/I on the instrument and connect U/I cable with a connector on the left side of the instrument.
Connect the shield cable to ground (screw beside plug J2).
Make sure that the AC power voltage is between 200 and 240 V and its capacity is 2kVA or more. If not,
confirm that AC power voltage is 115V and change voltage selector on DC power supply unit to 100V.
Refer to Chapter 5.2.2.
Connect power cables.

2.3.4 Setup

Note:
For Rack, first refer to Chapter 2.5.1, for Rack Sampler connected to Clas 1 refer to Chapter 2.5.2.

Mount the following items on the instrument.


Reagent disk, sample disk
Liquid waste container (empty)
System water container filled with system water (max. 3.5 L).
Waste box tray with a CleanLiner (new version black).
1 (one) or 2 (two) sets of system reagent ProCell/CleanCell bottles filled with ProCell/CleanCell on the
system reagent container.
Three (3) magazines filled with assay tips and three (3) magazines filled with assay cups on a magazine
tray.

Check the following items before you switch the instrument on.
• Pipetter probe and sipper probe are attached straight and vertically.
• Mixing rod is attached straight and tightly to the part of Bead Mixer.
• No foreign items should be placed on the instrument, especially in the area of the sample
• disk, reagent disk, assay tip/assay cup magazine tray and system reagents.
• Waste box tray is attached correctly to the container.
• Liquid waste container is mounted correctly.

2.3.5 Mounting a Measuring Cell

• Unpack Reference Electrode (RE) and Cell Body.


• Uncap the reference electrode and verify that the O ring at the MC junction is in place.
• Place the reference electrode in distilled water for about 30 min.
• Shake the reference electrode vigorously about 10 times to wet the ceramic junction.
• Tap the electrode gently on a hard surface.
• Attach the RE into the cell body by screwing firmly.

V 1.6 – April 1999 1 Chapter 2.3.3-5


RD/Hitachi Elecsys 2010 Service Manual

• Mount the measuring cell (for mechanical details and mounting description refer to Chapter
4.4.13.3), using the two screws taped to the bottom of the MC unit.
• Attach inlet/outlet tubings.
• Connect electrically ( J610). Make sure that the cable cannot be jammed between the MC body and
the magnet arm by placing the cable across the RE and using additional tie rap if necessary.

2.3.6 Installation of System Software

Install current system software (use only original software package, released by Roche Diagnostics
GmbH) even if a software version has already been installed on the system.
Refer to Chapter 2.4 Software Installation.
Never run the system with the delivered database!

2.3.7 Fill Liquid System

Note:
1. If water is not rinsed after the start of the priming function, the main pump may run in air. To
remove, detach the pipe from the main pump (located on the right side below drain cover).
2. Make sure that no bubbles are left in the syringes or tubings after priming.

2.3.7.1 Pipetter/Sipper Priming

1. Make sure that the instrument is in standby status.


2. Concerning pipetter priming/sipper priming, refer to Chapter 6.1.6 Maintenance.
Carry out pipetter priming until water comes out of the pipetter probe.
Carry out sipper priming until water comes out of the sipper probe.

2.3.7.2 Beads Mixing

1. Make sure that the instrument is in standby status.


2. Concerning beads mixing, refer to Chapter 6.1.10 Mechanism Check.

• Carry out beads mixing mechanism check until the bead mixer wash station fills with liquid.

2.3.8 Adjustments to be Checked During Installation and After Replacement

Refer to Chapter 2.6 for adjustments to be checked during installation for Disk and Rack System and
confirm the positions described.

Chapter 2.3.6-8 2 V 1.5 April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.9 Measuring Cell Preparation

Introduction
All measuring cells (MC) have been checked by the QA department at HID. For storage and
transportation the MCs are dried again after having been released. The reference electrodes (RE) are
packed with the MCs. To prepare the measuring cell the two components have to be treated as follows to
ensure good measuring results.
The procedure described in this manual is based on the measuring cell versions V4.3, V6.1 and V6.2. The
V4.3 cell is the first MC with black gasket material.
The V6.1 has molded body material and also has a black gasket (Viton).
The V6.2 is comparable to the V6.1 but the outer gasket shape has been changed to ensure better
tightness between the cell body, gasket and top cell
After some intermediate solutions needing a lot of preparation work, the latest cell generation can again
be prepared using only MC prepare cycles (10 cycles are sufficient).
In case of any changes to the MC preparation procedure we will inform you in Service News.

2.3.9.1 Preparation
Place system reagent bottles in the appropriate positions.
Place 1 (one) set of system reagent ProCell/CleanCell bottles filled with ProCell/CleanCell at Position 1,
right side on the System Reagent Container.
Make sure the liquid waste container is empty.
Fill the system water container with system water (max. 3.5 liters).

2.3.9.2 Check Procedure


Make sure that the instrument is in standby status.
Touch the [Util] button in the Main screen.
Touch the [Maintenance] button in the [Util] screen.
Touch the [MC Preparation] button in the [Maintenance] screen.
Having touched the button in the screen, you will see a popup.
Input the number of repetitions in the screen. (the number of cycles depends on the type of MC: refer to
the table below).
Touch the START button in the screen.

V 1.6 – April 1999 1 Chapter 2.3.9


RD/Hitachi Elecsys 2010 Service Manual

2.3.9.3 OVERVIEW

Version 4.3 Version 6.1


Viton gasket (black) Viton gasket (black)
molded body
10
prepare cycles

2.3.10 System Volume Check

2.3.10.1 Preparation
Place 1 (one) set of system reagent ProCell/CleanCell bottles filled with ProCell/CleanCell at Position 1,
right side on the System Reagent Container.

2.3.10.2 Procedure
Make sure that the instrument is in standby status.
Touch the [Util] button in the Main screen.
Touch the [Service] button
Touch the [Service Maintenance] button
Touch the [System Volume Check] button.
Touch the START button in the screen.

The system volume will be determined (for details refer to Chapter 3.4).

Note: After the procedure has been finished successfully the instrument returns to Stand By. In
case of an error message, check the liquid flow path (sipper side) for possible leakage or
refer to troubleshooting.

Chapter 2.3.9-10 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.11 High Voltage Check/Adjustment

Introduction
Each MC in combination with a PMT represents a complete detection unit, which has to be adjusted
correctly. The high voltage adjustment should be carried out after measuring cell preparation to obtain
initial information about the instrument signal level.
The high voltage value has been adjusted initially in the quality control department at Hitachi in the
course of checks on the instrument, but not for some MC/PMT combinations. With the high voltage
adjustment (check) the field engineer should make sure that the combination of instrument
(photomultiplier tube, electronic components) and measuring cell work in the expected signal range.
If the signal is not in the required range, the photomultiplier tube (PMT) voltage has to be adjusted to
make the signal levels comparable between the different instruments. BlankCell reagent is used to check
the signal level (refer also to Chapter 6, Assay performance explanation, for more details).
Note: The [PMT high voltage adjustment] run only checks the current signal level of instrument
Calibrator BlankCell reagent.
The high voltage adjustment to the correct signal range then has to be carried out manually by the field
engineer.

6LJQDO
%&57DUJHW
‹ 5DQJH


%&55DQJH


  +LJKYROWDJH

Fig. 2.3.11-1

V 1.6 – April 1999 1 Chapter 2.3.11


RD/Hitachi Elecsys 2010 Service Manual

Fig. 2.3.11-2: Assay performance check screen

2.3.11.1 Preparations

1 Place system reagent bottles in the appropriate positions.

2 Place the BlankCell reagent pack as shown below:

Reagent rotor RackPack Beads R1 R2

Pos. No.

2 BlankCell set BCR1 BCR2 -

Chapter 2.3.11 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3 Sample arrangement

3a For Disk System:

Run Cup in rotor pos. Liquid

PMT HV adjust. Stop BC in Pos. 4 –

3b For Rack Sampler (R/S):

Run Racks in A line Cup in rack Liquid


pos.

PMT HV adjust. 1 1, 2, 3 –

Use Hitachi cups.

4 Load disposable assay tips and assay cups in magazines on the tray (120 tips and 60 vessels are
sufficient for this test).

V 1.6 – April 1999 3 Chapter 2.3.11


RD/Hitachi Elecsys 2010 Service Manual

2.3.11.2 Check Procedure

1 Select [PMT HV adjustment] in the [Assay Performance Check] screen (Fig. 2.3.11.2-1). Start the
measurement by pressing the Start button in the popup.

Operator-Id: 47 Stand-by 07:40


Assay Performance Admin
Util
Check

PMT HV Adjustment

Start Close

Fig. 2.3.11.2.-1 Popup screen of PMT HV Adjustment

Chapter 2.3.11 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.11.3 Evaluation of the PMT HV Adjustment Run

• Check the result in the [PMT HV adjustment] popup after the run has finished (Fig. 2.3.11.3-1).
Operator-Id: 47 07:40
Assay Performance Admin
Util
Check

PMT HV Adjustment

Pos. effective dark


signal level

1 123456 630

2 124356 635

3 121212 630

Start Close

Fig. 2.3.11.3-1 Result screen of PMT HV Adjustment

• Calculate the mean value of the BCR2 effective signals from the Result screen.
• Note the target value from the package insert of the BlankCell lot used.
• Compare the mean value of the BCR2 counts with the target. It should be in the range of ± 5% of
the target value.
Over time, the BCR2 level should be in the range of ± 10% (refer to Maintenance).

• If the current mean is outside the range, you may readjust the high voltage (refer to 2.3.11.5).
Note: We highly recommend that the high voltage is not changed in the first step if the signal
level of the BCR2 mean is outside the range of ± 7% of the target value.
First of all, the measuring cell preparation should be extended by another 50 or 100 measuring cell
preparation cycles (refer to Chapter 2.3.9).
In the second step make sure that the measuring cell is mounted properly and that the BlankCell reagent
is O.K. (refer also to Chapters 6 (Assay performance check/troubleshooting) and 7 for troubleshooting
information).

• The second row of values in the Result popup shows the dark level of the photomultiplier tube.
• The dark level should be between 625 and 635 counts.

V 1.6 – April 1999 5 Chapter 2.3.11


RD/Hitachi Elecsys 2010 Service Manual

2.3.11.4 Restore Parameter

F Carry out "RESTORE PARAMETER" after you have performed


or even selected any assay performance check (APC).
Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the
assay performance section. You do not need to restore if you want to perform another APC run.

2.3.11.5 Adjustment of High Voltage

• Note the current high voltage by measuring the control voltage signal (CVS) between TP1 (GND)
and TP2 (CVS) on the PMT-SHV PCB (refer to Chapter 5.4.13 for details).
• Calculate the corresponding high voltage using the formula:

[PMT HV voltage] current = Control voltage ×


1100
6

• Calculate the new PMT HV voltage using the following formula.

0.137
 BCR2 
Vnew = Vold
 BCR2 Target 

Vnew: PMT HV voltage that will be applied after measurement.


Vold: PMT HV voltage that was applied previously.
(See the PMT HV record label on the PMT SHV cover).
BCR2 Target: BCR2 value specified by RD.

• Calculate the new control voltage relative to the PMT HV voltage using the following formula.

[Control voltage] new = Vnew × 6


1100

Chapter 2.3.11 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

• Adjust the voltage between TP1 (GND) and TP2 (control voltage signal) by changing the resistance
of the corresponding variable resistor (VR1, VR2 or VR3) according to the calculated control
voltage.
The resistor is chosen by the jumper setting of JP1 (Pos.1, 2 or 3; refer to Chapter 5.4.13 for
details).
• If the new high voltage value is outside the selected range you have to change the setting of JP1.
• Repeat the procedure, return to 2.3.11.2
• If the new high voltage value is the O.K., change the PMT HV record (the label is on the PMT
SHV cover).

Note:
In case of problems make sure that LED1 located on the PMT-SHV PCB is lit. Check connection J400.

Adjustment of HV in Practice
From our experience we recommend the following procedure for determining the new High Voltage
value.

Comment:

On the high voltage side (HV voltage)


1 V §FRXQWV

On the low voltage side (control voltage)


0.005 V §FRXQWV

Example:

To change the BRC2 count result from 100,000 to 105,000 counts (ca. 5000 counts difference), the HV
voltage has to be increased by 5 V (+ 5 V §FRXQWVGLIIHUHQFe). To adjust the value, change the
control voltage by +0.025 V §FRXQWV

V 1.6 – April 1999 7 Chapter 2.3.11


RD/Hitachi Elecsys 2010 Service Manual

2.3.12 Initial BlankCell Calibrations


Introduction
After the measuring cell has been prepared and it has been checked that the signal level is in the expected
signal range by means of the high voltage adjustment, the initial BlankCell calibration has to be
performed. The instruments are calibrated to give the same homogeneous signal level.
The initial BlankCell measurement is the first calibration done on the instrument before other assays can
be calibrated. Each measured signal will first be BlankCell-corrected (parameters a (intercept) and b
(slope)). The corresponding concentration is then read from the specific assay calibration.

• Initial Calibration
r Determine factors (a) and (b)

7DUJHW
YDOXHV

6ORSH E

2IIVHW D

%&5 %&5 &XUUHQWYDOXHV

2.3.12.1 Concept of BlankCell Calibration


• Target values of BlankCell R1 and R2, measured in the standardization department, are stored in the
barcode.
• Three determinations of BlankCell R1 and R2 are measured and the medians of BlankCell R1 and R2
are calculated.
• Calculation of the BlankCell correction parameters:

V 1.6 – April 1999 1 Chapter 2.3.12


RD/Hitachi Elecsys 2010 Service Manual

* Calculation of BlankCell correction parameters - factors a and b:

BCR 2measured − BCR1measured


b (slope) =
BCR 2t arg et − BRC1t arg et

a (intercept) = BCR1measured - b (slope) * BCR1target

Each calibrator, control and sample signal measured is corrected by the BlankCell correction parameters
as shown below.

Actually measured calibrator, control, sample signal - a (intercept)


Corrected signal =________________________________________________________
(Calibrator, control, sample) b (slope)

2.3.12.2 Preparation
1. Place system reagent bottles in the appropriate positions.
2. Place BlankCell reagent pack as shown:
Reagent rotor RackPack Beads R1 R2
Pos. no.
18 (or any other BlankCell set BCR1 BCR2 -
pos.)

3. Sample arrangement
For Disk system and for Rack Sampler (R/S):
Note: Samples need not be placed to perform Initial BlankCell!

For disk systems, remember that the instrument needs to read the Stop BC (place in Pos. 11).

Chapter 2.3.12 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.12.3 Check Procedure


Reagent

1. Start Reagent Scan (Inventory Screen ) Scan

2. After the scan the BLANK CELL button in the inventory screen should be yellow (unless a
BLANK CELL has been performed within the last 17 h ), so BLANK CELL is requested by
the instrument.
Blank Cell

xxx 18

Note: If there is no request for Blank Cell after scan (button still green), you can set this request manually
in the software. Select the Blank Cell button in the Inventory screen. Change the setting of the button
Calibration Request to ON in this popup. (Change only possible when instrument is in Stand By.)

Blank Cell pop up Calib.Request

xxx 18 ON

3. Set Initial Blank Cell button to ON (Util screen).


The INITIAL ON button should be blue when active.

Initial Initial
Blank pop up
Cell ON

4. Press the Start button.

5. After the Blank Cell procedure has finished, check the printout of the results carefully. The
quality criteria should look the same as in the specimen printout.

See attached printout of successful Initial Blank Cell (specimen).

V 1.6 – April 1999 3 Chapter 2.3.12


RD/Hitachi Elecsys 2010 Service Manual

BlankCell Procedure Operator ID 30/10/96 17:21


BlankCell was generated

BlankCell procedure date 30/10/96


Reagent pack number : 142
Lot. no. : 189856
Exp. date 03/97
Next BlankCell procedure : 10/30/96

Quality Criteria
Missing values ------
Deviation of replicate measurements ok
Achievement of targets ok
Comparison to last valid BlankCell

Last valid BlankCell Current BlankCell


Lot : 0 Lot : 189856
Mean 0 276
Target 0 268
Lower 0 110
Upper 0 426
Repl. limit 0% 20%

Mean 0 101425
Target 0 110000
Lower 0 63300
Upper 0 157000
Repl. limit 0% 10%

6. It is very important that the Initial Blank Cell is successful. If not, repeat the process until it is
successful, otherwise all results may not be corrected properly. Refer to 2.3.12.3 for current
result targets. (If necessary start procedure once more. Go back to point 3.)

7. If the Initial Blank Cell was successful, remove the BLANK CELL RackPack. This is very
important, otherwise the instrument will do the periodic blank cell automatically.

8. Start reagent scan.


Reagent

Scan

Chapter 2.3.12 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.12.4 Evaluation of Initial BlankCell


• Compare the mean value of the BCR1 (all values are on the printout) counts with the target. It
should be:
BCR1 Target range 200 to 400 counts

• Check the slope value from [Initial BlankCell] screen:


BCR2 Slope should be 1.0 ± 0.05 (= parameter (b)).

• If one of the targets is outside these limits refer to the recommendations given and repeat the
procedure until the targets are reached.

V 1.6 – April 1999 5 Chapter 2.3.12


RD/Hitachi Elecsys 2010 Service Manual

2.3.13 Instrument Checks


Finally, we recommend that the artificial media test and the TSH assay test are performed to check the instrument
performance. To perform the runs you need the Elecsys check reagents (refer to Chapter 6.1.9 for all APC runs and
further details).

2.3.13.1 Artificial Media Test (AM Test)


Introduction
The Artificial Media Test is a button in the menu [Assay Performance Check] in the [Util] screen. It is a short
instrument check and principally measures the same criteria as the RD internal instrument check.

A Homogeneous Determination
With homogeneous determination magnetic separation is not used. A solution of free label is transported inside the
measuring cell and the performance of the detection unit (MC/PMT) can be analyzed. With equal height of
BCR2 1:20, the performance of the pipetter side can be analyzed.

B Heterogeneous Determination
The heterogeneous determination simulates an assay. The iSAP test uses beads and a biotinylated and ruthenium-
labeled antibody. A immuno-independent bead/antibody complex is generated to analyze the detection unit,
measuring cell and magnet function.
If all performance data for the homogenous determination are in order, then disturbance in the heterogeneous
determination can only be caused by the liquid flow system (tubing/fittings, connectors, sipper),the magnet or the
MC

BCR1, BCR2 and BCR2 1:20 are homogeneous, ProCell, iSAP and TSH are heterogeneous.

The test takes about 45 min.

Materials Required

RackPack name Amount Material No.


BlankCell 2 1729306-122
CellCheck 2 1820451-122
SAP 1 1820435-122

Samples Required

Sample name Amount


ProCell 7 ml
BCR2 1 ml

2.3.13.1.1 Preparations
1. Place system reagent bottles in the appropriate positions.
2. Set reagent rack packs in reagent disk positions 1 to 5 as follows:

Pos. No. RackPack Beads R1 R2


1 BlankCell set BCR1 BCR2 -
2 BlankCell set BCR1 BCR2 -
3 CellCheck ProCell ProCell ProCell
4 CellCheck ProCell ProCell ProCell
5 SAP test Beads Buffer FC

Chapter 2.3.13 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3 Sample arrangement
3a For Disk System:
Run Cup in Rotor Liquid
pos.
Artificial Media Check. 3 BCR2 (1 ml)
4 to 10 ProCell (1 ml)

Use Hitachi normal sample cups; remember to use the Stop BC (place in Pos. 11).
Pipette 1 ml of BCR2 into sample disk position 3 and 1 ml of ProCell into each sample disk position from 4 to 10.

3b For Rack Sampler (R/S):


To perform the AM test with the R/S you need at least two racks.

Run Rack in A line Cup in rack Liquid


pos.
No.
Artificial Media Check 1 1, 2 No
3 BCR2 (1 ml)
4, 5 ProCell (1 ml)
2 1 to 5 ProCell (1 ml)

Use Hitachi normal sample cups.


Pipette 1 ml of BCR2 into rack no. 1 position 3, and 1 ml of ProCell into rack 1 positions 4 and 5 and rack 2
positions 1 to 5.
Note: Two empty cups also have to be placed in pos. 1 and 2 of rack 1.

4. Load disposable tips and vessels in magazines on the tray (120 tips and 60 vessels are sufficient for this test).

Chapter 2.3.13 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.13.1.2 Check Procedure


1. For Disk System:
After touching the [Artificial Media] test button in the [Assay Performance Check] screen in the user interface start
the measurement by pressing the start button.
2. For Rack Sampler (R/S):
On the rack sampler simply place rack 1 and rack 2 in the A line and start the AM test by pressing the artificial
media test button in the [Assay Performance Check] screen.
3. Test items performed by the artificial media check

For For
Rack Disk

Pos. Pos. Sample Item Item Item Item Item Item Item Item Item Item
No. No. 1 2 3 4 5 6 7 8 9 10
R 1 1 - BCR1 BCR1 BCR1 BCR1 BCR1
a 2 2 - BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2
c 3 3 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2
k€ (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20)
4 4 ProCell ProCell ProCell ProCell ProCell ProCell
5 5 ProCell iSAP
R 1 6 ProCell ProCell
a
2 7 ProCell iSAP
c
3 8 ProCell ProCell

4 9 ProCell iSAP
5 10 ProCell ProCell

2.3.13.1.3 Evaluation of the AM Test


From software version 03-08 onwards the results can be automatically calculated by the instrument. Press the [Print
result] button in the [Assay performance] screen.
To evaluate the results use the parameters and acceptable ranges for the artificial media test given in the table.
(for target values refer to table 2.3.13.1.5-1 “APC test; Targets, AM test”).
If troubleshooting is necessary refer to the charts given in 2.3.13.3.

Note: If a result is missing, the mean and CV are calculated wrongly. In such cases calculate the
corresponding result manually with the formulas given in 2.3.13.1.4.

Chapter 2.3.13 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

• The BCR (BlankCell reagent) target value should be reached; this is used for the instrument calibration. The
determination of BCR1 means the lower, BCR2 the higher calibration value. This reflects the recovery and the
variance of the target value.
Note: None of the measured counts with tests from the Assay Performance Checks are connected with
the instrument calibration factor.
• BCR2 is used to adjust the PMT-HV and indicates problems with the PMT and excitation.
• BCR2 (1:20 dilution) is a dilution of BCR2 with BCR1 and shows the functionality of the pipetter, the pipetter
precision and general problems with the liquid handling.
• ProCell is determined using the measuring cycle for heterogeneous assays. These values are the basic values
used for calculating carryover.
• iSAP is a model assay based on streptavidin beads. iSAP facilitates the evaluation of the complete LFS (liquid
flow, magnet, capturing, detection) in a routine assay.
• Carryover is the measurable influence on the assay performance and is the consequence of carryover of beads
into the measuring cell in this case.

2.3.13.1.4 Calculation Formulas


All values are calculated with the signal counts.

iSAPmax−iSAPmin
iSAP Precision, Range = ∗100%
iSAPaverage

Carryover = average of 5 ∗1 Pr oCell [counts] − average of 3 Pr oCell [counts] ∗ 1,000,000


average of 3 ∗ 1 iSAP [counts]

( BCR2 average− BCR1 average)


Dilution factor = BCR2 (1 : 20) =
( BCR2 (1 : 20) average - BCR1 average)

2.3.13.1.5 Restore Parameter

F Carry out "RESTORE PARAMETER" after you have performed or even selected any assay
performance check (APC).
Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the Assay
performance section. You do not need to restore if you want to perform another APC run.

Chapter 2.3.13 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Table 2.3.13.1.5-1

APC Tests; Targets (AM test)


Version 1.0

No. Parameter Unit Green Range Orange Range Red Range

1 Signal BCR1 average (counts) 200 - 400 400 to 450 > 450

2 BCR1 precision (CV) ≤ 4.0% 4.0 to 6.0% > 6.0%

3 Signal BCR2 average (counts) Target ± 10% Target ± 15% Target ± ≥ 15%

4 BCR2 precision (CV) ≤ 2.0% 2.0 to 3.5% > 3.5%

5 Signal BCR2 (1:20) dilution Factor range 17 - 21 - <17 or > 21

6 BCR2 (1:20) precision (CV) ≤ 5.0% - > 5.0%

7 iSAP range (CV) ≤ 8.0% 8.0 to 10.0% > 10.0%

8 Carryover (CO) (ppm) ≤ 100 100 to 150 > 150

9 Signal iSAP average (counts) 850,000 to 1,200,000 800,000 to 1,300,000 < 800,000 or > 1,300,000

If all values are in the green range or ≤ 2 values are in the orange range, then the instrument may be released.
If > 2 values are in the orange range or one value is in the red range, then the instrument may not be released

Chapter 2.3.13 5 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.13.2 TSH Assay Test


TSH assay (heterogeneous determination) is a button in the menu [assay performance check]. Unlike to the
artificial media test, this immunoassay is performed by the customer as a matter of routine.
The TSH assay is a necessary service tool as it reveals problems in the assay performance that occur in
determinations where high dynamic, very low LDL (lower detection limit) and very high precision are required. For
instrument/instrument performance criteria we have to use more detailed checks. There, the calibration also plays a
role.

The test takes about 45 min.

Materials required

Rack pack name Amount Material No.


TSH 1 1731459-122
CellCheck 1 1820451-122

Required samples:

Sample name Amount Material No.


ProCell 1 ml
TSH Cal 1 650 µl 1731483-122
TSH Cal 2 400 µl 1731483-122

2.3.13.2.1 Preparations:
1. Place system reagent bottles in the appropriate positions.
2. Set reagent racks for TSH assay test in reagent disk positions 6 and 7.

Pos. No. RackPack Beads Reagent 1 Reagent 2

6 CellCheck ProCell ProCell ProCell


7 TSH Beads R01 R02

3. Sample arrangement
3a For Disk-System:
Run Cup in rotor Liquid
pos.
TSH assay test 15 ProCell (1 ml)
16 TSH Cal1
17 TSH Cal2

Use Hitachi normal cups and RD calibrator vials.

Chapter 2.3.13 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual
3b For Rack Sampler (R/S):
Run Rack in A line Cup in rack Liquid
pos.
No.
TSH assay test 1 1 ProCell (1 ml)
2 TSH Cal1
3 TSH Cal2

Use Hitachi normal cups and RD calibrator vials.

4. Load disposable tips and vessels in magazines on the tray (120 tips and 60 vessels are sufficient for this test).

2.3.13.2.2 Check Procedure


1. For Disk System:
After touching the [TSH assay test] button in the [Assay Performance Check] screen of the user interface start the
measurement by pressing the start button
2. For Rack Sampler (R/S):
On the rack sampler simply place rack 1 in the A line and start the TSH test by pressing the [TSH assay test] button
in the [Assay Performance Check] screen of the user interface.

3. Test items performed by the TSH assay test


Pos. Sample Item Item Item Item Item Item Item Item Item Item
No. 1 2 3 4 5 6 7 8 9 10

1/15 ProCell ProCell ProCell ProCell


2/16 TSH Cal1 TSH TSH TSH TSH TSH TSH TSH TSH TSH TSH
3/17 TSH Cal2 TSH TSH TSH TSH TSH

2.3.13.2.3 Evaluation of the TSH Assay Test


From software version 03-08 onwards the results can be automatically calculated by the instrument. Press the [Print
result] button in the [Assay performance check] screen.
To evaluate the results use the parameters and acceptable ranges for the TSH assay test given in Table 2.3.13.2.5-1
on the next page (APC tests; Targets, TSH test)
If troubleshooting is necessary refer to the charts in Chapter 2.3.13.3.

Note: If a result is missing, the mean and CV are calculated wrongly. In such cases calculate the
corresponding result manually using the formulas given in Chapter 2.3.13.2.4

• The tangent (TSH Cal2) describes concentration-independent dynamics. A tangent value outside target
indicates problems with the measuring cell, LFS and MC or the magnet.
• The LDL (lower detection limit) is the lowest value that differs significantly from the concentration of
0 µU/ml. Dynamics and precision in the lower range influence the LDL. Apart from problems with the
measuring cell, the pipetter or the magnet, problems with the sipper, liquid handling and liquid flow (tubing,
foam, bubbles, ...) and temperature influences increase the LDL, i.e. give poorer assay performance.

• An increased first value of the TSH Cal1 (TSH Cal1 1st value high) is seen in the event of a preceding
homogeneous determination (e.g. ProCell, Prepare, Idle). In most cases it is related to the performance of the
measuring cell. A high first value is only observed if a ProCell/Prepare cycle is run before a very low signal in
a heterogeneous determination.

Chapter 2.3.13 7 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.13.2.4 Calculation Formulas


All calculations are done using the signal counts.

averageof TSH Cal 2 − averageof TSH Cal1


Tangent (TSH Cal 2) =
conc.of TSH Cal 2[µIU / ml ] − conc.of TSH Cal1[µIU / ml ].
Concentrations are lot-specific (for concentrations call RD Customer Support).

LDL = 2 ∗ SD of TSH Cal1


Tangent ( TSH Cal 2)

A = First value of TSH Cal1B = Average of the remaining 9 values in the first determination (n=10)
TSH Cal1 1st value high = A − B ∗ 100
B

2.3.13.2.5 Restore Parameter

FCarry out "RESTORE PARAMETER" after you have performed or even selected any assay
performance check (APC).
Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the Assay
performance section. You do not need to restore if you want to perform another APC run.

Chapter 2.3.13 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Table 2.3.13.2.5-1

APC tests, Targets (TSH test)


Version 1.0

No. Parameter Unit Green Range Orange Range Red Range

1 Tangent TSH Cal2 [counts] ≥ 12,000 11,500 – 12,000 ≤ 11,500

2 Signal TSH Cal1 [counts] ≤ 1300 ≤ 1350 ≥ 1350

3 TSH Cal1 precision, [CV] ≤ 4.0% 4.0 - 5.5% ≥ 5.5%


n=10

3 TSH Cal2 precision [CV] ≤ 2.0% 2.0 - 3.5% ≥ 3.5%

4 Lower detection limit [µU/ml] ≤ 0.005 ≤ 0.007 ≥ 0.007


(LDL)

5 TSH Cal1 first value [counts] ≤ 8.0% ≤ 10% ≥ 10 %


high

If all the values are in the green range or if 2 ≤ values are in the orange range, the instrument may be released.
If > 2 values are in the orange range or if one value is in the red range, then the instrument may not be released.

Chapter 2.3.13 9 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.3.13.3 Assay Performance Check Troubleshooting


2.3.13.3.1 Flow Diagram

APC Tests
Check of HW 2010

Signal out of range OK


NO Targets see SPECS
BCR1, BCR2, BCR2 1:20

Yes

PMT, Potentiostat, MC (RE) HW control


(Liquid Handling, Liquid Flow) DO •HV adjustment
•Temperature control OK?
•MC current OK? <5>15 mA

CV out of range NO OK Targets see SPECS


BCR2, BCR2 1:20

Yes

Liquid Handling (LH) HW control (LH; leakage)


[(Liquid Flow (LF)] DO •Tubings
•Tip gripping
•Dilutor (pipettor)

[HW control (LFS)]


•Bubles in LFS
•LFC of MC/LFS (clots, filaments, deposits)
•Dilutor (sipper)

Legend
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell BCR = BlankCell Reagent
RE = Reference Electrode PMT = Photomultiplier Tube
HV = High Voltage LF(C) = Liquid Flow (Cleaning)
LFS = Liquid Flow System LH = Liquid Handling

Chapter 2.3.13 10 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

APC Tests
Check of HW 2010

Signal out of range


NO OK Targets see SPECS
SAP and TSH Test

Yes If BCR1/BCR2 signal within range

Magnet (LF) DO Magnet adjustment OK?

Yes If BCR1/BCR2 signal also out of range

PMT, Potentiostat, MC (RE) DO HW control


(Liquid Handling, Liquid Flow) •HV adjustment
•Temperature control OK?
•MC current OK? <5>15 mA

CV out of range
NO OK Targets see SPECS
TSH Test

If BCR1/BCR2 CV within range


Yes

Liquid Flow (LF) HW control LF


sipper, tubings, line DO •LFC of MC/LFS (clots, filaments, deposits)
heater, fittings, valves •Bubbles in LF (tightness)
•Dilutor (sipper, tightness)

Legend
SAP = Special service reagent TSH = Thyroid-specific Hormone
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell RE = Reference Electrode
PMT = Photomultiplier Tube HV = High Voltage
LF(C) = Liquid Flow (Cleaning) LFS = Liquid Flow System
LH = Liquid Handling BCR = Blank Cell Reagent

Chapter 2.3.13 11 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

APC Tests
Check of HW 2010

Carryover out of range


NO OK Targets see SPECS
SAP test

Yes If BCR2 and/or TSH CV also out of range

MC/LFS DO HW control LFS


•LFC of MC/LFS
•Bubbles on gasket (MC)
If BCR2 and/or TSH
CV inside range •Tubings (tight, clean)
D but CO out of range
O
Not
OK OK?

Exchange MC (life time?)

Legend
SAP = Special service reagent TSH = Thyroid-specific Hormone
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell BCR = Blank Cell Reagent
LFC = Liquid Flow Cleaning LFS = Liquid Flow System
LH = Liquid Handling

Chapter 2.3.13 12 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Troubleshooting of Assay Performance Check

Check items Phenomenon Possible cause Remedy


PMT HV adjustment Signal≅0, DL=625 1. HV connector is not 1.Confirm the following connections:
connected l between P400 and J400 on PMT-SHV board.
l between P401 and J401 on PMT-SHV board.
l between P610 and J610 in Detection Unit.
2.PMT connector is not 2.Others, refer to the Cross Wiring Diagrams for details.
connected.
3.Connector of L-Amp. board Confirm the following connections:
is not connected. l between P430 and J430 on L-AMP(1) board.
4.Shield plug is not connected. l P/J431 on L-AMP(1) board or P/J119 on EECL board.
5.PMT or L-Amp(1) board is Replace the PMT or L-Amp(1) board.
to be defected.
6.Shield cable is Confirm the following connection.
open-circuited. l between P430 and J430 on L-AMP(1) board.
l P/J431 on L-AMP(1) board or P/J119 on EECL board.
Signal≅0, DL>625 1.Measuring cell is 1.Confirm no ADC alarm 31-02-01 or 31-02-02 takes place.
not mounted.
2.Connector of measuring 2. Confirm the following connection:
cell is not connected. l between P610 and J610 in detection unit.
3.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
4.Liquid leakage occurs in Check the pipetter flow system.
pipetter flow system.
Signal<70,000, DL>625 1.Wrong reagent or reagent 1.Confirm that the Reagent Lot is valid.
position. 2.Replace the reagent.
2.Measuring cell is Confirm position of the measuring cell relative to PMT.
not mounted correctly.
3.PMT is not mounted
correctly.
4.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
5.Liquid leakage occurs in Check the pipetter flow system.
pipetter flow system.

Chapter 2.3.13 13 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Check items Phenomenon Possible cause Remedy


PMT HV adjustment Signal is not stable. 1.Shading to the detection unit 1.Confirm the dark level value is lower than 640.
is not sufficient. 2.Confirm that the sponge lid between PMT and the plug P401 has not become
detached.
2.Shield plug is not 1.Confirm the connection between P430 and J430 on L-AMP(1) board.
connected correctly. 2. P/J431 on L-AMP(1) Board or P/J119 on EECL board.
3.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
4.Temperature control of the Confirm temperature of the detection unit on the temperature
detection unit is not sufficient. monitor screen, refer to Chapter 6.1.7.
AM test Normalized BCR1>400 1.Wrong reagent or reagent 1.Confirm that the Reagent Lot is valid.
position. 2.Replace the reagent.
2. L-AMP(1) board is Replace the L-AMP(1) board.
defective.
3. Active bleeder is defective. Replace the active bleeder.
BCR2 CV% >2% 1. System volume check not done. Perform system volume check.
2. Liquid leakage occurs in sipper Check of the sipper flow system.
flow system.
3. Number of MC preparations is Repeat MC preparation again at least 30 times as described in
not sufficient. Chapter 2.3.9.
4. Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
BCR2(1:20) CV% >5%, 1. Liquid leakage occurs in pipetter Check the pipetter flow system.
flow system.
2.Dust on pipetter probe end. Use gauze moistened with distilled water to clean the end of the pipetter probe.
3.Height of pipetter probe, Z axis Adjust the Z axis position of pipetter according to Chapter 4.5.
position is not correct.
Carryover >100 ppm 1. Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
2.Position of magnet relative to the Use the magnet drive tool, adjust the position by referring to
Measuring cell is not sufficient. Chapter 4.4.14.
3. Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.

Chapter 2.3.13 14 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Check Items Phenomenon Possible cause Remedy


AM test Sensitivity >6E-15W 1. Anode dark current of PMT is 1.Confirm the dark level value. If the value is more than 640,
bigger than usual value. leave the PMT in instrument standby status overnight.
2.Shading to the detection unit 2. Confirm that the sponge lid between PMT and the plug P401 has not become
is not sufficient. detached.
3. Number of MC preparations is Repeat MC preparation again at least 30 times as described in
not sufficient. Chapter 2.3.9.
4.Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
TSH assay test Tangent <11000 1.Magnet itself is defective. Confirm iSAP signal value. If the value is lower than 1.2E 6,
Tangent/CAL 1<10 replace the magnet or check position of magnet relative to the
measuring cell.
2.Temperature control of the Confirm temperature of the detection unit on the temperature
detection unit is not sufficient. monitor screen, refer to Chapter 6.1.7.
3.Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
4.L-AMP(1) board is Replace the L-AMP(1) board.
defective.
CAL 2 CV% >2% 1. Liquid leakage occurs in pipetter Check the pipetter flow system.
LDL >0.005 flow system.
2.Dust on pipetter probe end. Use gauze moistened with distilled water to clean the end of the pipetter probe.
3.Height of pipetter probe, Z axis Adjust the Z axis position of pipetter according to Chapter 4.5.
position is not correct.
CAL 1 signal >1200 Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
1st value >8%

Chapter 2.3.13 15 V 1.6 – April 1999


RD/ Hitachi Elecsys 2010 Service Manual

2.3.14 Assay Calibration

After the procedures described above have been finished successfully, we recommend that the field engineer
carries out at least one or two assay calibrations. To check the installation in routine some controls should
be performed finally. We recommend running PCU1/PCU2 for the TSH assay.

2.3.15 Installation Procedures Overview / Checklist

Note) You may copy the following table and use it as an installation checklist

Step Procedure Refer to DONE


chapter
1 Unpacking 2.3.1
2 U/I installation and AC power supply confirmation 2.3.3
3 Setup 2.3.4
4 Mounting a measuring cell 2.3.5
5 Installation of system software 2.3.6; 2.4
6 Fill liquid system 2.3.7
7 Check important adjustments 2.6
8 Measuring cell preparation 2.3.9
9 System volume check 2.3.10
10 High voltage check/adjustment 2.3.11
11 Initial BlankCell calibration 2.3.12
12 Instrument checks 2.3.13
-Artificial media check 2.3.13.1
-TSH assay test 2.3.13.2
13 Assay calibration 2.3.14

2.3.16 Procedure for Multiple Installations

In the event of multiple instrument installations, the following results should be compared.
Precondition:
Individual results for AM, TSH and PCU1/PCU2 must be determined on the instruments.

Refer to Done
Step Procedure chapter
14 Instrument checks 2.3.13
-TSH assay test
• Targets as described in this chapter (Targets/Ranges of APC Tests).
• SAP signals and or Calset 1 and 2 signal difference should be max.
10% between systems.
=> Change measuring cell and restart with point 8 if the signal difference
not within the limits.
=> Change system and restart with point 1 if the signal difference is not
within limits after exchanging the measuring cell.

15 Carry out Assay Calibration for TSH and measure Precicontrol Universal
sample.
• Control concentration difference should be max. 5% between systems
=> Change measuring cell and restart with point 8 if the concentration
difference is not within the limits.
=> Change system and restart with point 1 if the concentration
difference is not within the limits after exchanging the measuring cell.

Chapter 2.3.14 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.4 Software Installation

2.4.1 Overview
Install current system software. (Use only the original software package released by Roche Diagnostics
GmbH.)

The software package should contain six (6) diskettes:

• Install F/D
• System F/D No.1-1
• System F/D No.1-2
• System F/D No.2

• two database diskette(s)

Note:
The system software for disk and rack systems is provided on the same set of diskettes (e.g. SW version
03-08 / 03-12). For rack sampler connected to Clas 1, a specific SW version has to be installed (e.g.
version 05-07 or higher).

2.4.2 Installation Procedure


• Insert the Install Disk and turn the instrument “on.”

• The following menu appears on the screen:

FLASH ROM loading Enter "1" key


FLASH ROM SUM Check Enter "2" key
Serial No. Install Date Enter "3" key

• Press the “1” key to start ROM initialization.

• The following message appears on the screen.

Insert No 1-1 F/D and enter any key


(or cancel key)

• Insert F/D No 1-1 and press the “Enter” key.

• The following message appears on the screen.

Insert No 1-2 F/D and enter any key


(or cancel key)

• Insert F/D No 1-2 and press the “Enter” key.

• The following message appears on the screen.

Insert No 2 F/D and enter any key


(or cancel key)

• Insert F/D No 2 and press the “Enter” key.

• The following message appears on the screen.

/fd0/English
/fd0/French
.....................
Select No. key Input updated

V 1.6 – April 1999 1 Chapter 2.4.1-2


RD/Hitachi Elecsys 2010 Service Manual

• Press a number according to your language choice.

• The following message appears on the screen.

FLASH ROM SUM Get Total SUM = *****


enter any key

• Insert Data F/D

Insert Data Disk 00-14 ib or hb according to the following table

Disk system/Rack system/


Rack + Clas 1
Aluminum base 00-14 hb
< SN 0806-11
Molded base 00-14 ib
=> SN 0806-11

• Press the “Enter” key; the following message appears on the screen again.

FLASH ROM loading Enter "1" key


FLASH ROM SUM Check Enter "2" key
Serial No., install Date Enter "3" key

• Press the “3” key to create an instrument-specific data disk

• The following message appears on the screen.

Insert Data F/D and enter any key


or cancel key

• Input the Instrument serial No. and the date of installation.

Confirm entries with the “Enter” key.


Example: serial number is 0945-33

Input “094533”
Input the date of installation in the format “mm/dd/yy”

• Afterwards press the “1” key to save the entries in the S-RAM and on the data disk !
Note: The data disk will be system-specific afterwards.

• Turn the instrument “off” and then “on” again.

• Wait until the instrument is in stand-by.

• Insert the Hitachi Data Disk that is delivered with new instruments.

• Load the adjustment data into the SRAM: [UTIL] [Service] [Service F/D Utility] [Adj. Data read]

• Insert an empty high performance diskette (1.4 MB DOS formatted).

• Perform FD Backup: [UTIL] [Service] [Service F/D Utility] [FD Write]

Chapter 2.4.1-2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

• When backup is finished label the disk with the following:

a) Software version
b) Database version
c) Serial number of instrument
d) Date of installation (software)

E2010 Database disk

Version (00) – (14)

SW Version (03) – (08)

Instr. # [0945]-(33)

Copy date: dd.mm.yy

• Set current date and analyzer time and check the installation entries: [Util] [Instrument setup]

V 1.6 – April 1999 3 Chapter 2.4.1-2


RD/Hitachi Elecsys 2010 Service Manual

• The instrument is now ready to START.

Notes:

• Never boot the Hitachi Data Disk that is delivered with new instruments!
• We recommend replacing the database disk every 4 weeks to prevent F/D write problems.

Replacement procedure:

• Insert an empty high performance diskette (1.4 MB DOS formatted).

• Perform FD Backup: [UTIL] [Service] [Service F/D Utility] [FD Write]

Chapter 2.4.1-2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.5 Rack Sampler/Rack Sampler Connected to CLAS 1 System Installation


2.5.1 Rack Sampler System Installation

*Upgrade procedure: disk system to rack system

1. Setting Up Elecsys 2010

1. Preparing Elecsys 2010 main unit---------------------------------------------------------------------------------------------- Fig.1


(1) Remove the rear cover.
(2) Remove the cover for gripper.
(3) Remove the R. lid.
(4) Remove the table cover L.
(5) Remove the front cover.
(6) Remove the S jacket assembly with the ground wire.
(7) Remove the S disk driving unit.
(8) Remove the side base.
(9) Connect a dummy connector to the connector from which the S disk driving unit has been removed. (P510,
P511)

2. Setting Up the Rack Sampler Unit

1. Set the rack sampler unit in the position to be installed.


2. Remove the loader cover (2 screws M4, top surface,2 screws M4, left side)....................................................... Fig.2
3. Remove the sampler rear cover (2 screws M4, front surface, 2 screws M4, left side)
4. Remove 3 bushes for fixing slide unit.
5. Slide the base to the left by 160 mm, and fix it with 1 bush. -------------------------------------------------------------- Fig.3
! When sliding the base, be sure to hold the handle of the base to slide.
! When mounting the bush, take care not to catch the wire.
6. Remove the coupling plate. (2 screws M6, pan-head screws)

∗ Procedures 3 - 5 are required for upgrading from the Disk System to the Rack Sampler

*3. Adding PC Board, and Setting DIP Switches

1. Remove the cover for PCB rack (P/N 741-4541).


2. Remove all the connectors at the upper part of PCB rack.
3. Remove the cover for circuit board (P/N 741-1581).
4. Remove the EIO PC board (P/N 741-5030) from the PCB rack.
5. Connect the RS CONT PC board (P/N 741-5050) through spacer. ------------------------------------------------------ Fig.4
6. Set the DIP switches on the RS CONT PC board.

Set all the DSW2 to Off.

7. Attach the EIO PC board to which the RS CONT PC board is attached to the PCB rack.
8. Attach the cover (R) for circuit board (P/N 741-4627) to which J900 rectangular hole has been added.

*4. Connecting Communication Cable -------------------------------------------------------------------------------------------- Fig. 5

1. Remove the DIST-F PC board (P/N 741-5028).


2. Connect the communication cable to the J900 connector on the RS CONT PC board.
3. Change the nylon clamp (HP-5N ⇒ HP-10N), bundle the communication cable with the existing cable.
4. Connect the BRC cable to the J343 connector on the UIRS-B PC board (P/N741-5049)--------------------------- Fig. 5
5. Pass the communication cable through the side hole of the Elecsys 2010 main unit.
6. Attach the connector of the upper part of PCB rack.
7. Attach the cover for PCB rack (P/N 741-4541).
8. Attach the DIST-F PC board.

V 1.6 – April 1999 1 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

*5. Attaching BCR Assembly, and Connecting BCR Cable ----------------------------------------------------------------- Fig. 5

1. Attach the BCR assembly to the Elecsys 2010 main unit.


2. Attach the ground wire.
3. Connect the BCR cable to the connector on the BCR PI PC board (P/N 741-5056).

6. Connecting Rack Sampler Unit to Main Unit

1. Attach the coupling plate to the aluminum base of the Elecsys 2010 main unit. (3 screws M5, pan head screws).
Put the communication cable between the main unit and the coupling plate.
2. Connect the rack sampler unit to the Elecsys 2010 main unit. ----------------------------------------------------------- Fig. 6

! When connecting, make sure that the couple blocks meet each other so that there is no gap between the “A” plane
and “B” plane, and fix them with screws.

7. Wiring between Units

Connect the communication cable from the Elecsys 2010 to the J908 connector on the rack sampler PC board.
Arrange wiring as shown in the figure, fasten the cable with clamps at five positions. ---------------------------------- Fig.7

8. Fixing Rack Sampler Unit

1. Remove the bush attached in procedure 2-5, slide the rack sampler unit onto the Elecsys 2010 main unit.
2. Attach the 3 bushes removed in procedure 2-4, fix the unit.

9. Height Adjustment

1. Loosen the lock nut of the adjuster (×2). Then, while checking levelness using a level gauge, turn the adjuster to
adjust the height as shown in Fig. 8.
2. When good levelness is obtained, tighten the lock nut to fix the adjuster.

10. Attaching Cover ---------------------------------------------------------------------------------------------------------------- Fig. 7

1. Attach the front cover and rear cover to the Elecsys 2010 main unit.
2. Attach the cover for rack sampler unit by following the procedure for removal in reverse (refer to Procedure 2).
3. Attach the Stat cover. (2 screws M4, top surface)
4. Attach the screw lids to the rack sampler unit and Elecsys 2010 main unit.
5. Attach label. (Only if the Elecsys 2010 main unit has a molded base.)

• Fig. 9 shows dimensions.

Note) Be careful not to detach the photocoupler PI213 located at the Stat position from the plate of the B line.

V 1.6 – April 1999 2 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

11. Adjusting Sampling Position (refer also to Chapter 2.6.5.2)

After turning on the power of the instrument, wait until it goes into standby and perform the sampling position
adjustment by following the following procedures.
1. Fix the test tube guide with tape so that it stays open.
2. Press the B line Sampling Pos key on the adjustment rack.
(Put 13 mm diameter test tubes onto the rack, and attach tip to P nozzle.)
Check roughly how far the tip of the Tip is from the center position of the container. --------------------------Fig. 10
3. Loosen the sensor fixing screws (2 screws M4, 1 screw M3), shift the sensor fixing plate by about the same
distance as checked in 2., and fix the plate. -----------------------------------------------------------------------------Fig. 10
4. Perform 2. again.
5. If the tip of the tip shifts by a large amount from the center position of the container, perform 3. again.
6. Press the Adjustment Pipetter R. Disk B Mix key to perform fine adjustment in the moving direction of pipetter.
(The same as sampling position adjustment of the main unit).
7. When the tip of the tip has been adjusted to be roughly in the center of the container by procedures 1. - 6., perform
2. again to adjust finely the flow direction of the rack.
(If fine adjustment is not required, you do not need to perform 7. and 8..)
8. Press the Front key or Back key on U/I screen to perform fine adjustment of rack stop position.
(Moving forward and backward for 5 pulses can be performed, resolution: 0.15 mm/pulse)
After completion, press the OK key to finish adjustment.
9. Remove the fixing of the test tube guide performed in 1..
10. Perform 2. again.
11. Loosen the test tube guide fixing screws (4 screws, M4) and adjust the fixing position so that all 4 resin rollers
of the test tube guide can touch the test tube.---------------------------------------------------------------------------Fig. 11
12. Attach the table cover L2.
(3 screws M4, top surface).

V 1.6 – April 1999 3 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

T a b le C o ve r L

S D is k D riv e A s s y

S Jacket A ssy

F ro n t C o v e r A s s y S id e B a s e
R ear C over
S . D is k R . L id
C o ve r fo r G rip p e r

Fig. 1 Setting up the Elecsys 2010

V 1.6 – April 1999 4 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

Rear Cover for Sampler

Bush

Bush

Loader Cover

Bush

Fig. 2 Remove Three Bushes

V 1.6 – April 1999 5 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

Coupling Plate

160 mm Slide

M6 Screw

Bush
Pull

M6 Screw

Fig. 3 Removing the Coupling Plate

V 1.6 – April 1999 6 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

PCB Rack Assy Cover for Circuit Board


Cover for PCB Rack (P/N 741-1581)
(P/N 741-4541)

PCB Rack Assy

Cover (R) for Circuit Board


(P/N 741-4627)

Spacer

EIO Circuit
PCB Rack Assy Board Assy
(P/N 741-5030) Nut M3
Spring Washer 3
RS CONT Circuit Board Assy
(P/N 741-5050)
Screw M3×6
Washer 3
Spacer Spring Washer

DIP Switch Spacer

Put between EIO BOARD


and RS CONT BOARD.

Spacer

Fig. 4 Setting up the PCB and DSW

V 1.6 – April 1999 7 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

BCR Assy
BCR Cable
P510, P511 Connector

Earth

Earth

J900

BCR
M5 Screw
Cable BCR Circuit Board Assy
M5 Screw M5 Screw
Clamp (HP-10N)
Cable Coupling Plate
Clamp (HP-10N)
DIST-F Circuit Board
(P/N 741-5028)
Cable

Coupling Plate
J342

J343
Connector

UIRS-B Circuit Board Assy


(P/N 741-5049)
Fig. 5 Connection of the Cable
V 1.6 – April 1999 8 Chapter 2.5.1
RD/Hitachi Elecsys 2010 Service Manual

Screw

A B

Couple Block 1

Couple Block 2
Fig. 6 Connection to the Instrument
V 1.6 – April 1999 9 Chapter 2.5.1
RD/Hitachi Elecsys 2010 Service Manual

The Communication Cable Label


Rear Cover for Sampler
Label Clamp Clamp
Rear Cover

(70)

Clamp

Clamp

J908

Front Cover Assy


Table Cover L2
Acryl Cover Assy
Loader Cover Stat Cover

Fig. 7 Installation of Covers

V 1.6 – April 1999 10 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

Adjuster

Adjuster

Water Level
Lock Nut

6 (Min) 13 (Max)

Fig. 8 Height Adjustment

V 1.6 – April 1999 11 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

(734)

(948)

(1700)

(755)

(557.5)

(290)

Fig. 9 Rack Sampler System

V 1.6 – April 1999 12 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

Test Tube Guide


Open/Close direction
Test Tube Guide

Sensor moving direction

Sensor fixing screw (M3)

Sensor fixing screw (M4)


Sampling position
Sensor fixing plate

B line
A line

Fig. 10 B Line (Top View)

V 1.6 – April 1999 13 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

Test Tube Guide moving direction

Roller made of resin


(Opposite side, too) Test Tube Guide Fixing Screw (M4)
(Opposite side, too)

Fig. 11 B Line (Side View)

V 1.6 – April 1999 14 Chapter 2.5.1


RD/Hitachi Elecsys 2010 Service Manual

2.5.2 Rack Sampler connected to CLAS1 System Installation

*Upgrade procedure: Disk system to Clas 1

1. Setting Up Elecsys 2010 .................................................................................................................................. Fig. 1

Preparing Elecsys 2010 main unit


(1) Set the Elecsys 2010 main unit at an installation position on the Systable.
(2) Remove the rear cover assembly.
(3) Remove the cover for T/C carrier.
(4) Remove the R lid.
(5) Remove the front cover assembly.
(6) Remove the table cover L assembly.
(7) Remove the S disk.
(8) Remove the S jacket assembly with the ground wire.
(9) Remove the S disk drive assembly.
(10) Connect a dummy connector to the connector from which the S disk drive assembly has been removed
(P510, P511). .................................................................................................................. ....................... Fig. 5
(11) Remove the side base. (3 screws M5, 3 screws M4)

Note) The above steps (6) to (10) are required for upgrading from the disk system to the CLAS1 connection
system.

2. Setting Up CLAS1 Sampler S Unit

(1) Set the CLAS1sampler S unit at an installation position on the Systable............................................... Fig. 2
(2) Remove the R cover assembly (with acrylic resin cover). (3 screws M4, top surface)
(3) Remove the loader cover 2. (4 screws M4, top surface, 2 screws M4, left side)
(4) Remove the rear cover 2. (2 screws M4, front surface, 2 screws M4, left side)
(5) Remove three bushes for slide unit retention.
(6) Slide the base by 160 mm to the left, and secure it with one bush. ........................................................ Fig. 3

Note) a) When sliding the base, be sure to hold the handle of the base to slide.
b) When mounting the bush, take care not to let wires be caught with it.

(7) Remove the junction plate C assembly (with rack switching mechanism 3 assembly). (2 pan-head screws
M6)

* The following procedures 3 to 5 are required for upgrading from the disk system to the CLAS1
connection system.

*3. Adding PC Board, and Setting DIP Switches .............................................................................................. Fig. 4

(1) Remove the upper cover (P/N 741-4541) for PCB rack assembly.
(2) Remove all the connectors from the upper part of PCB rack assembly.
(3) Remove the circuit board cover (P/N 741-1581). (Discard this cover.)
(4) Remove the EIO PC board (P/N 741-5030) from the PCB rack assembly.
(5) Connect the RS CONTA PC board (P/N 741-5057) to the EIO PC board through spacer.
(6) Set the DIP switches (DSW2) on the RS CONTA PC board.

Set SW6 of DSW2 to On, and other switch elements to Off.

(7) On the PCB rack assembly, mount the EIO PC board with RS CONTA PC board connected.
(8) Attach the cover (R) (P/N 741-4627) with the additional J900 rectangular hole.

V 1.6 – April 1999 1 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

*4. Connecting Communication Cable .............................................................................................................. Fig. 5

(1) Remove the DIST-F PC board (P/N 741-5028).


(2) Connect the communication cable to the J900 connector on the RS CONTA PC board.
(3) Replace the nylon clamp (HP-5N -> HP-10N), and bundle the communication cable with the existing
cables.
(4) Run the communication cable through the side hole of the Elecsys 2010 main unit.
(5) On the upper part of PCB rack, attach all the connectors that were removed in at step 3-(2).
(6) Attach the upper cover (P/N 741-4541) for PCB rack assembly.
(7) Mount the DIST-F PC board.

*5. Mounting BCR Assembly, and Connecting BCR Cable ............................................................................ Fig. 5

(1) Mount the BCR assembly on the Elecsys 2010 main unit.
(2) Connect one end of the ground wire attached on the BCR assembly to the ground plate of the main unit.
(3) Connect the BCR cable to the J343 connector on the UIRS-B PC board (P/N 741-5049).

6. Connecting CLAS1 Sampler S Unit to Main Unit

(1) Mount the junction plate assembly (with rack switching mechanism 3 assembly) onto the aluminum base of
the Elecsys 2010 main unit. (3 pan-head screws M5) .......................................................................... Fig. 5
(2) At this step, run the communication cable between the main unit and the junction plate assembly.
(3) Connect the CLAS1 sampler S unit to the Elecsys 2010 main unit. ...................................................... Fig. 6

Note) When connecting the CLAS1 sampler S unit, mate the side A of the holder with side B of the block such
that there is no clearance between them, and then secure them with screws.

(4) Remove the bush that was attached in step 2-(6), and slide the CLAS1 sampler S unit onto the Elecsys 2010
main unit.
(5) Attach the three bushes that were removed in step 2-(5), and secure the CLAS1 sampler S unit.

7. Wiring between Units .............................................................................................................................. ...... Fig. 7

(1) Connect the communication cable from the Elecsys 2010 to the connector (J905) of the PS CONTA PC
board.
Arrange wiring as shown in the figure, and secure the cable with clamps at five points.

8. Height Adjustment of CLAS1 Sampler S Unit ............................................................................................ Fig. 8

(1) Loosen the lock nut on the adjustable foot (x2). Then, while observing levelness with a level gauge, turn
the adjustable foot to adjust the height of the CLAS1 sampler S unit.
(2) After making sure that the levelness is correct, loosen the lock nut and secure the adjustable foot (x2).

9. Connecting with CLAS1

(1) Mount the Joint Bracket (P/N 741-7791) on the fixture of CLAS1 side. When mounting the Joint Bracket,
insert an insulating sheet between the it and the fixture. Also, use an insulating boss for the retaining screw
(M6 hexagon socket head screw)............................................................................ Fig. 9 (Partial drawing B)

Note) On the CLAS1 side, prepare the fixture, insulating sheet, retaining screw (M6 hexagon socket head
screw), and insulating boss.

(2) Set the Systable on which the Elecsys 2010 has been mounted at an installation position. .................. Fig. 10
(3) Put the one end of joint base 2 (P/N 741-7790) on the joint bracket, and the other end on the junction plate
C assembly. .......................................................................................................................................... Fig. 9
(4) Secure the joint base 2 to the joint bracket. (2 screws M4)
(5) Adjust the position of the Systable finely so that the mounting hole on the joint base 2 is aligned with the
mounting screw hole on the junction plate C assembly. In this step, align the end face and side face of

V 1.6 – April 1999 2 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

base 4 (P/N 741-7783) with respect to the top face and side face of the base block (x2) mounted on the joint
base 2.
(6) While observing levelness of the Systable with a level gauge, secure the position with the Systable adjuster.
(Since the entire height is to be adjusted in the subsequent step, extend the adjuster to a minimum length
necessary for fixing.)
(7) Measure the distance between the floor and the top of the joint bracket so that the top of joint plate 2 and
the top of the joint bracket will be the same in Systable height adjustment in the next step.
(8) Adjust the height of the Systable so that the top of the lower stage of the junction plate secured on the
Elecsys 2010 will meet the top of the joint bracket measured in the preceding step.

Note) To adjust the height of the Systable, insert the handle provided into the hexagonal hole located at the top
on the front of table and turn.

(9) Mount joint base 2 on the junction plate (2 screws M4).

10. Mounting Rack Feed 1 Assembly

(1) Remove the hinge cover (P/N 741-7861), cover 11 (P/N 741-7854), cover 12 assembly (P/N 741-6621) and
duct cover (P/N 741-7866) from the rack feed 1 assembly. ................................................................. Fig.11
(2) Secure the rack feed 1 assembly onto joint base 2 (4 screws M4). ....................................................... Fig.12
(3) Attach the connectors P810 and P812 to the rack switching mechanism 2 assembly, and the connectors
P912, P914, P915, P917, P918 and P919 to the DO5 PC board on the CLAS1 sampler S unit.
(4) Make sure that the wires will not be tensed even when base 4 is shifted to its full stroke position. Then
secure the signal wires and power wires separately with clamps.

11. Sampling Position Adjustment (Refer also to Chapter 2.6.5.2) .................................................................... Fig. 13

After turning on power to the instrument, wait until it goes into standby. Then adjust the sampling position
following the steps given below. (For adjustment, remove the front cover, sampler/conveyor loader cover and
unloader cover from the main instrument unit.)

(1) Secure the test tube guide with tape so that it stays open.
(2) Press the service key, and enter a password. Then, check an adjustment value indicated below the B line
sampling pos key. Thereafter, press the B line Sampling Pos key.
(3) Press the Front or Back key so that the adjustment value will be 0.
(4) Perform step 2 again. (Put the sampling position adjust jig A (short jig) in No.1 position on the rack. Also,
attach the tip to the P nozzle.) Check the end of the tip for deviation in the flow direction and pipetter
moving direction with respect to the center of the jig (ÿ3 concave mark is indicated at the center of the top
of the jig).

(5) Loosen the sensor retaining screws (2 screws M4, 1 screw M3), and shift the sensor retaining plate
according to the distance checked in the preceding step. Then, adjust the B line flow direction, and secure
the sensor retaining screws.
(6) Perform step 2 again.
(7) If the end of the tip deviates significantly with respect to the center of the container, perform step 3 again.
(8) Enter the password after pressing the Service key, and then press the Adjustment Pipetter R Disk B Mix key
for fine adjustment of the moving direction of the pipetter. (As for sampling position adjustment for the
main unit).
Adjustment specified: To be adjusted to provide less than ±0.3 mm from the center of jig)
(9) After steps (1) to (8), if the end of the tip has been adjusted to be approximately centered with respect to the
center of the jig, perform step 2 for fine adjustment of the rack flow direction. (Note: if fine adjustment is
not required, it is not necessary to perform steps (9) and (10).)
(10) Perform step (2) again. On the U/I screen, press the Front or Back key, and then carry out fine adjustment
for the rack stop position. (Movement can be made to an extent of five pulses in the forward or backward
direction. Resolution: 0.15 mm/pulse).
On completion of fine adjustment, press the OK key to indicate the end of adjustment. (Adjustment
specified: Make adjustment so that an adjustment value will be ±2 pulses.)
(11) Release the test tube guide that was been secured in step 1.
(12) Perform step 2 again.

V 1.6 – April 1999 3 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

(13) Loosen the test tube guide retaining screws (4 screws M4) and adjust the fixing position so that the resin
rollers (4 pieces) of the test tube guide will all come into contact with the side faces of the sampling position
adjust jig A (short jig) and the sampling position adjust jig B (long jig).

12. Attaching Covers ........................................................................................................................................... Fig. 11

(1) On the Elecsys 2010 main unit, attach the covers that were removed in procedure 1 (front cover, rear cover,
T/V carrier cover) and cover L2 (P/N 741-7248).
(2) Attach the covers of CLAS1 sampler S unit that were removed in procedure 2 (rear cover 2, loader cover 2,
R cover assembly) in the reverse order of removal.
(3) Attach the covers that were removed in procedure 10-(1) (cover 11, cover 12 assembly, duct cover, hinge
cover).
(4) Attach the cable cover (P/N 741-7869).
(5) Attach the screw cups on the CLAS1 sampler S unit and Elecsys 2010 main unit.

V 1.6 – April 1999 4 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

TABLE C O VER L ASSY

S D IS K D R IV E A S S Y

S JACKET ASSY

FRO NT CO VER ASSY S ID E B A S E


REAR CO VER ASSY
S . D IS K R . L ID
C O V E R (F O R T /V C A R R IE R )

Fig. 1 SETTING UP THE ELECSYS 2010

V 1.6 – April 1999 5 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

REAR COVER 2

BUSH

BUSH

R COVER ASSY
LOADER COVER 2

BUSH

Fig. 2 CLAS1 SAMPLER S UNIT (1)

V 1.6 – April 1999 6 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

160 mm SLIDE JUNCTION PLATE C ASSY

M6 SCREW

BUSH

GRIPS

M6 SCREW

Fig. 3 CLAS1 SAMPLER S UNIT (2)

V 1.6 – April 1999 7 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

CIRCUIT BOARD COVER


UPPER COVER (FOR PCB RACK) PCB RACK ASSY
(P/N 741-1581)
(P/N 741-4541)

PCB RACK ASSY


(P/N 741-4032)

COVER (R) FOR CIRCUIT BOARD


(P/N 741-4627)

SPACER

CIRCUIT BOARD
PCB RACK ASSY ASSY EIO
(P/N 741-5030)
Nut M3
SPRING WASHER 3
CIRCUIT BOARD ASSY RS CONTA
(P/N 741-5057) SCREW M3×6
WASHER 3
SPACER SPRING WASHER

DIP SWITCH SPACER

Put between EIO BOARD


and RS CONT BOARD.

SPACER

Fig. 4 SETTING UP THE PCB AND DSW

V 1.6 – April 1999 8 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

BCR Assy
EARTH PLATE
BCR CABLE
CONNECTOR P510, P511

EARTH

EARTH
J900

M5 SCREW BCR
CIRCUIT BOARD ASSY BCR
CABLE
CLAMP (HP-10N)
M5 SCREW M5 SCREW RACK SWITCHING MECHANISM 3 ASSY
CABLE
CLAMP (HP-10N) JUNCTION PLATE C ASSY

CIRCUIT BOARD ASSY DIST-F


(P/N 741-5028)
CABLE
JUNCTION PLATE C ASSY
J342

CONNECTOR J343

CIRCUIT BOARD ASSY UIRS-B


(P/N 741-5049)

Fig. 5 CONNECTION OF THE CABLE AND THE PLATE


V 1.6 – April 1999 9 Chapter 2.5.2
RD/Hitachi Elecsys 2010 Service Manual

SCREW

B
A

HOLDER

BLOCK 1

Fig. 6 CONNECTION TO THE INSTRUMENT


V 1.6 – April 1999 10 Chapter 2.5.2
RD/Hitachi Elecsys 2010 Service Manual

THE COMMUNICATION CABLE

CLAMP
CLAMP

CLAMP

CLAMP

J905

Fig. 7 WIRING THE COMMUNICATION CABLE

V 1.6 – April 1999 11 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

ADJUSTABLE FOOT

ADJUSTABLE FOOT

LOCK NUT
WATER LEVEL

8 (MAX)
6 (MIN)

Fig. 8 HEIGHT ADJUSTMENT

V 1.6- April 1999 12 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

SIDE VIEW C THE FRONT SIDE OF


BASE
THE UPPER SIDE OF
BASE BLOCK

BASE 4

EAGE OF
BASE 4

THE BACK SIDE


OF BASE BLOCK
BASE BLOCK
JUNCTION PLATE
JOINT BASE 2
(P/N 741-7790)

B
C

B A HOLE FOR HEIGHT ADJUSTMENT


CLAS 1 JOINT BRACKET OF SYSTABLE (TWO PLACE ON BOTH SIDE)
BASE (P/N 741-7791)
MEASURE A
ADJUST
HEIGHT FROM
THE SAME
A FLOOR TO
HEIGHT
THE UPPER
AS (A) SYSTABLE
SIDE OF JOINT
BARCKET (A) METAL FITTINGS INSULATING BOSS
OF CLAS1 SIDE (25)

INSULATING SHEET ADJUSTER

FLOOR FLOOR
Fig. 9 CONNECTING TO CLAS1
V 1.6- April 1999 13 Chapter 2.5.2
RD/Hitachi Elecsys 2010 Service Manual
(1700)

(734)

(950)

(2000)

(750)

(557.5)

(290)

(155)

Fig. 10 CLAS1 CONNECTED SYSTEM

V 1.6- April 1999 14 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

REAR COVER ASSY


REAR COVER 2
(P/N 741-7871)

LOADER COVER 2
(P/N 741-7799)

TOP COVER ASSY


(P/N 741-6511)
CABLE COVER
(P/N 741-7869) COVER L2
(P/N 741-7248)

FRONT DUCT COVER


COVER (P/N 741-7866)
ASSY

HINGE COVER
(P/N 741-7861) R COVER ASSY
COVER I1 (P/N 741-6620)
(P/N 741-7854) COVER I2 ASSY
(P/N 741-6621)

Fig. 11 COVERS

V 1.6- April 1999 15 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual
J915
SIGNAL CABLE
CLAMP
FOR SIGNAL CABLE
J912
CLAMP POWER CABLE
FOR SIGNAL CABLE
J914
CLAMP
SIGNAL CABLE
FOR SIGNAL CABLE
CLAMP J917
FOR POWER CABLE SIGNAL CABLE
CLAMP
J919 FOR SIGNAL CABLE
SIGNAL CABLE

CLAMP
FOR POWER CABLE
J918
SIGNAL CABLE
CLAMP
FOR SIGNAL CABLE

CLAMP
CLAMP FOR POWER CABLE
FOR
POWER CABLE

J810
J812 CLAMP
FOR POWER CABLE

CABLE

Fig. 12 WIRING CABLES

V 1.6- April 1999 16 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

PLASTIC ROLLER
(OPPOSITE SIDE TEST TUBE GUIDE
TOO) (4 POINTS)

SENSOR FIXING
TEST TUBE GUIDE
MOVEMENT DIRECTION SCREW
(M3)

TEST TUBE GUIDE SAMPLING


FIXING SCREW SENSOR FIXING SCREW (M4) POSITION
(M4) (2 POINTS) SENSOR
(OPPOSITE SIDE FIXING
TOO) NUMBER

Fig. 13 SAMPLING POSITION ADJUSTMENT

V 1.6- April 1999 17 Chapter 2.5.2


RD/Hitachi Elecsys 2010 Service Manual

2.5.3 How to Turn Power On

2.5.3.1 Power Source Cable Same as for the analyzer unit

100VAC (Japan & for the U.S.)P/N:J832812


Product Name: P47-SJT-C0028A 3X14AWG
200VAC (for Europe) P/N:J832815
Product Name: PI-H05VV-F-CHE14 3X1mm2
<Precautions>
The rack sampler system and units should be connected to the same power source. It is not possible to supply a bundled
power source cable by using extension cables, etc.

2.5.3.2 How to Turn Power On


Connect the power source cable (refer to the above) to each of the units (sampler unit)
and to the 2010 mainframe. After turning on the switches for each of the units (sampler
unit), turn on the main switch for the 2010 mainframe.

<Precautions>
As mentioned above, there are 2 power source switches for the rack sampler system.
When turning the power on, always make sure that all of the switches are turned on, and when turning
the power off make sure that all of the switches are actually OFF.

Chapter 2.5.3 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2.6 Checks/Adjustments During Installation

The following adjustments should be checked during analyzer installation because they are very import
for good instrument performance. The instrument should always be observed during the initial
operations. Refer to Chapter 4.5.2 with regard to any other positions that need to be adjusted.

2.6.1 Bead Mixer


2.6.1.1 Check Mixer Speed (see also Chapter 5.3.8)
To check the mixer speed, use one of the following procedures:

1. Start the AM Test (initial bead mixing performed Pos. 1-5; 14 sec per Pos.). Place reagent packs
in positions 1 to 5.
2. Start the Bead Mixer Check (Maintenance Chapter 6.1.10; 4 sec per Pos.). Place a reagent pack
filled with ca. 3 ml of beads or ProCell in position 1.

Confirm the following mixer speeds using an rpm meter (Ident No. 1903152):

In air In liquid

2050 rpm ± 100 rpm 2000 rpm ± 100 rpm

No foam should be present on the surface of the liquid. If foam is present, proceed with mixer
adjustment (Chapter 2.6.1.2).

V 1.6 – April 1999 1 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

2.6.1.2 Mixer Adjustment

No. Adjusted item Item to be confirmed How to adjust


1 Beads Mixer-R a) Make sure that the mixing paddle is straight. Carry out the “Beads
Wash Mixer-R Wash” function
b) Confirm visually that when the beads mixer is in the
in the “Adjustment B
horizontal home position, there is a distance of 2 mm
Mixer Pipetter R Disk”
or more between the mixing arm and the end of the U-
screen.
shaped cut of the table cover and that the mixing arm is
located approximately in the middle of the U-shaped
(See Chapter 4.4.4.
cut. If not, adjust the beads mixer and/or relevant units
Service Manual)
referring to the procedures described in the latter half
of c).
c) Confirm visually that the mixing paddle is adjusted as
concentrically as possible with the washing station *1.
If not, adjust the beads mixer and/or relevant units by
applying one or more of the following three options.
i. Adjust the table cover mechanically.
ii. Carry out the "Beads Mixer-R Wash" function
in the "Adjustment B Mixer Pipetter R Disk"
screen.
iii. Adjust mechanically the beads mixer head
rotational angle around the arm.
d) Make sure that the mixing arm in home pos. does not
interfere with the pipetter.
2 Beads Mixer-R Carry out the “Beads
l Attach the reagent disk cover.
Mix Mixer-R Mix” function in
a) Confirm visually that the mixing paddle is adjusted as
the “Adjustment B Mixer
concentrically as possible with the reagent disk cover
Pipetter R Disk” screen.
hole.
3 Beads Mixer Carry out the “Beads
l Detach the reagent disk cover.
U/D Mixer U/D” function in
l Place a RackPack in pos. 1 of the reagent disk.
the “Adjustment B Mixer
a) Confirm visually that the mixing paddle lower end Pipetter R Disk” screen.
is just level with the upper edge of the opening of
the RackPack *2.

Notes:
*1: You may manually push down the mixing arm to allow easier confirmation.
*2: You may put a thin sheet of paper on the RackPack opening to allow easier confirmation (paddle
top should touch the paper).

V 1.6 – April 1999 2 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

2.6.1.3 Mixer Paddle Shape

2.6.1.3.1 Examination of Paddle Shape


a. To examine the mixing effect, a new or used RackPack (not mixed for at least 20 hours) should be
placed in reagent rotor pos. 1.
b. Start the Running Test from [Assay performance check] screen because the RackPack will be
mixed initially (15 s).
The initial mixing should create a homogeneous solution of microparticles.
c. Stop the running test after mixing and check the bead solution: No foam should be visible on the
reagent surface (only valid for 3 to 5 ml filling volume).
No bead sediment should be visible at the bottom of the bottle (check from below, see
Figures 6.2.13.1-1 and -2)

F Perform restore parameter after running test has been stopped

Figure 6.2.13.1-1
No bead sediments visible at the bottom of the bottle (seen from below): PADDLE OK

Figure 6.2.13.1-2
Bead sediments visible at the bottom of the bottle (seen from below): PADDLE NOT OK

V 1.6 – April 1999 3 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

2.6.2 Pipetter Adjustment

Adjusted item Procedure How to adjust


1 Pipetter-Z T/V Buffer Detach the tip, if any from the pipetter Carry out the "Pipetter-
probe. Z T/V Buffer" function
in the "Adjustment B
a) Confirm visually the pipetter
Mixer Pipetter R Disk"
probe end with no tip is pretty level with
screen.
the buffer station surface at the tip eject
position.
2 Pipetter-Z T/V Bottom Detach the tip, if any from the pipetter Carry out the "Pipetter-
probe. Z T/V Bottom" function
in the "Adjustment B
Place a tip in Tip Pos. 1 of the buffer
Mixer Pipetter R Disk"
station.
screen.
a) Confirm visually that the pipetter
probe end with no tip is pretty level with
the buffer station surface at the tip eject
position.
3 Pipetter-Z Beads Attach a tip to the pipetter probe. Carry out the "Pipetter-
Bottom Z Beads Bottom"
Place an empty RackPack in pos. 1 of the
function in the
reagent disk.
"Adjustment B Mixer
a) Automatically checked. Pipetter R Disk" screen.
4 Pipetter-Z S.Cup Attach a tip to the pipetter probe. Carry out the "Pipetter-
Bottom Place a Hitachi sample cup in Pos. 1 of the Z S. Cup Bottom"
sample disk or Pos. 1 of a rack in STAT function in the
pos. "Adjustment B Mixer
Pipetter R Disk" screen.
a) Automatically checked.

2.6.3 Sipper adjustment

Adjusted item Procedure How to adjust

Sipper Z adjustment The sipper Z adjustment has to be done without a bottle in place.
1 Sipper-Z Incubator a) Confirm visually that the sipper probe Carry out the “Sipper-Z
end is just level with the upper surface of Incubator” function in the
the holder in the sipping position. “Adjustment Sipper
S.Disk C. opener BCR”.
2 Sipper-Z Inc. Bottom l Take AB1 bottle and CC2 bottle off. Carry out one of the
Sipper-Z AB1Bottom a) Automatically checked. following functions in the
Sipper-Z CC2 Bottom “Adjustment Sipper
S.Disk C. opener BCR”.
i. Sipper-Z Inc. Bottom
ii. Sipper-Z AB1Bottom
iii.Sipper-Z CC2 Bottom

V 1.6 – April 1999 4 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

2.6.4 Electronic adjustments

The following electronic checks should be done:


No. Unit Refer to

1 Pipettor LLD Refer to chapter 5.3; Adjustment procedure of Pipettor


LLD, Sipper LLD and Clot.

Sipper LLD

Pressure sensor

2.6.5 Rack Sampler adjustments

2.6.5.1 Adjustment table

In case of Rack Sampler installation we recommend that all positions are checked.
Refer also to Chapter 4.5.2.2.
No. Unit Adjusted Item Item to be Confirmed How to Adjust
1 A Line 1. Belt tension. Not applicable ---
2. Mounting The rack guide and the rack feed arm Mechanical adjustment
position of the on the rack tray must be at right angles.
rack feed arm.
3. Position of the The center of the rack guide on the rack Mechanical adjustment
rack guide at the tray must correspond with the center of
buffer base. the rack guide on the buffer base.
4. Position of the The space between the rack feed arm Carry out the “A Line Loading
rack feed end. and the rack must be 1 to 2 mm when Pos.” function in the
the rack is pressed against the rack rail Adjustment Rack Sampler
on the B Line. Screen.
2 B Line 1. Belt tension. Not applicable ---
2. Sampling The tip must be in the center of the Carry out the “B Line
position. tubes (within ±1 mm). Sampling Pos.” function in the
Adjustment Rack Sampler
Screen.
3. Position of the The center of the notch to prevent the Carry out the “B Line
rack feed end. rack from toppling must correspond Unloading Pos.” function in the
with the center of the rack guide on the Adjustment Rack Sampler
buffer base of the C Line Screen.
(within ±1mm).
4. BCR Reading Automatically determines the reading Carry out the “B Line B.C.R.
Position. position. Auto” function in the
Adjustment Rack Sampler
Screen.
3 C Line 1. Belt tension Not applicable. ---
2. Mounting The rack guide and the rack feed arm Mechanical adjustment
position of the on the rack tray must be at right angles
rack feed arm. (within ±1 mm).
3. Position of rack The center of the rack guide on the rack Mechanical adjustment
guide at the tray must correspond with the center of
buffer base. the rack guide on the buffer base
(within ±5 mm).

V 1.6 – April 1999 5 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

2.6.5.2 Explanation Adjustment Sample Position


Place a rack with a primary tube (diameter 10 or 13 mm) in rack position one at the STAT position of
rack sampler unit.
Carry out "B line sampling pos." from the screen "Adjustment rack sampler".

Check the current sample position adjustment!


If the pipetter needs correction to left/right (x-axis, see Figure 2.6.5.2-1), quit the current screen with
"Cancel" key, change to the "Adjustment pipetter R.Disk" screen and carry out "Pipetter-X S.Disk"
from the screen (as on 2010 disk version).

B line sample position

Fig. 2.6.5.2-1

If the pipetter needs correction in up/down direction (y-axis, see Figure 2.6.5.2-1), change the rack
position with "Forward" or "Backward" key.
Note:
The hook will only move the rack backwards (see Figure 2.6.5.2-1). For forward hook movement, you
have to push the rack by hand to get the actual position.
The range of software adjustment for B line sample pos. is only ± 5 steps because of the design of the
racks (Figure 2.6.5.2-2).

V 1.6 – April 1999 6 Chapter 2.6


RD/Hitachi Elecsys 2010 Service Manual

Elecsys 2010 rack

Fig. 2.6.5.2-2

If the range of software adjustment for B line sample pos. is not sufficient, change the sample position
manually. To adjust manually, move the whole sample detector B assembly (see figure 2.6.5.2-3) in
the corresponding direction. The detector B assembly is fastened with two screws on the left and one
screw on the right. After changing the position manually, optimize again with the software (as
described above).

B line sample position, adjustment possibilities

Fig. 2.6.5.2-3

V 1.6 – April 1999 7 Chapter 2.6


3. Fluidics

3.1 Description of Flow Path


3.1.1 Overall Piping Diagram
3.1.2 List of Parts

3.2 System Volume


3.2.1 Definition of System Volume
3.2.2 Determination of System Volume
3.2.3 Storage of System Volume Values / Data Handling

3.3 Cleaning Procedures


3.3.1 Liquid Flow Cleaning
3.3.2 Cleaning Procedure for Fluidics System

3.4 SysWash
3.4.1 Modification of the S/R Rinse Station
RD/Hitachi Elecsys 2010 Service Manual

3. Fluidics

3.1. Description of Flow Path

• System water is supplied by the water supply bottle (capacity: 3.5 liters) and the water level is monitored by a
float switch.
• Water is pumped by a magnet pump and distributed to the pipetter and sipper inside/outside wash and also to
the mixing paddle wash via a branch pipe and the solenoid valves (SV).

• The pipetter line has clot detection (Refer to Chapter 5.3.4 for principle of clot detection), and checks for
blood clots and serum gel separator clots, etc.

• Reacted solution is sipped into the measuring cell in the detection unit by means of the sipper probe; waste is
transferred to the waste solution bottle after measuring. All system water that is used for washing (P) & (S)
probes and paddle is collected in the waste solution bottle via the cleaning path (P), & (S). The waste bottle
has a capacity of 4 liters. A mechanical switching unit detects whether the bottle is full and causes the
instrument to go into sampling stop.

• System water quality requires less than 10 µS/cm conductivity. If water conductivity is higher, liquid level
detection fails will occur because the detection method relies on a capacitance principle.

• Refer to the overall piping diagram for details of the flow path.

V 1.6 – April 1999 1 Chapter 3.1


RD/Hitachi Elecsys 2010 Service Manual
3.1.1 Overall Piping Diagram
3
Measuring Cell
Valve Block

System Water Circulation


17
Liquid Flow System Pressure SV3 SV4
15

Waste Tubing Sensor


0
18
Pipettor Tubing Line Heater
8 9
Degassing Tubing
19

16
P / R Syringe Sipper Syringe

1
2
Washing Station P 4

Washing Station S
7
5

SV1/2/7/5/6
14
12/13
System Water
6 Liquid Waste

10

Pump
11
Filter

V 1.6 – April 1999 1 Chapter 3.1.1


RD/Hitachi Elecsys 2010 Service Manual

3.1.2 List of Parts


3.1.2.1 List of Valves and Pumps

SV/Pump No. Part Name Type Voltage Application Part No.


SV1 Solenoid Valve UDV-2-M6C 24VDC For Pipetter Syringe 741-0830
SV2 ↑ ↑ ↑ For Sipper Syringe 741-0830

SV3 Pinch Valve AP-2602-13-H ↑ For Sipper Line Probe 741-0831

SV4 ↑ ↑ ↑ For Sipper line Drain 741-0831

SV5 Solenoid Valve UDV-2-M6C ↑ For External Washing 741-0830


of Pipetter Tip
SV6 ↑ ↑ ↑ For Washing Beads 741-0830
Mixing Paddle
SV7 ↑ ↑ ↑ For External Washing 741-0830
of Sipper Probe
Pump Magnet Pump MD-6Z-DC24V-7 ↑ Water Supply 741-0832

V 1.6 – April 1999 1 Chapter 3.1.2


RD/Hitachi Elecsys 2010 Service Manual

3.1.2.2 List of Tubes

No. Part Name Material, Length Part No. Remarks


0 Tube for Sipper Syringe 741-0966
0* Tube B for Sipper Syringe 741-0821
1 Tube (1) 741-0807
2 Tube (2) 741-0808
3 Sipper Drain Tube TYGON Tube R3603 G153001
3.17ID x 3.35OD L=750
4 Drain Tube Silicone Rubber Tube G153025
Cleaning Bath (S) 8ID x 2T L=150
5 Tube for Tip Wash L=930 G153001
6 Tube for Mixer Bath L=760 G153001
7 Tube (7) 741-0809
8 Tube (8) 741-0543
9 Tube(9) 741-0803
10 Tube 560 741-1778
11 Water Supply Tube Silastic Tube 8ID x 3T L=140 G153171
12 Pump Out Tube L=50 G153171
13 Joint Tube L=80 G153171
14 Ventilation Tube Silicone Rubber Tube, L=300 G153014
15 Tube for Measuring Cell 741-0969
15* Tube B for Measuring Cell 741-0822
16 Tube for Sipper C 741-0641
16* Tube B for Sipper C 741-0820
17 Pinch Tube 741-1610
18 Water Return Tube Silicone Rubber Tube G153014
4ID x 2T Red L=350
19 Tube 465 741-1775

20 Line Heater 741-0967

*New Tubes

Chapter 3.1.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3.2 System Volume

- Introduction
The system volume value is needed by the system to ensure that the sample is transported to the measuring cell
working electrode surface. If the system volume is wrong the results may vary (bad CVs).

F Whenever a part on the sipper line (excluding the measuring cell ) is


exchanged the system volume has to be determined.
3.2.1 Definition of System Volume

The volume between the sipper needle top and the measuring cell outlet. The mean system volume of the
Elecsys 2010 is 460 µl ± 30 µl.
The measuring cell itself has a volume of 60 µl ± 5 µl.

3.2.2 Determination of System Volume

3.2.2.1 Preparation
Place 1 (one) set of system reagent ProCell/CleanCell bottles filled with ProCell/CleanCell at Position 1,
right side in the system reagent container.

3.2.2.2 Procedure
l Make sure that the instrument is in standby status.
l Touch the [Util] button in the Main screen.
l Touch the [Service] button.
l Enter the password “11111111”
l Touch [OK]
l Touch the [Service Maintenance] button.
l Touch the [System Volume Check] button.
l Touch the START button in the screen.

The system volume is determined as follows:


The sipper line is first filled with ProCell. An air bubble of 100 µl is set. The air bubble is transported to
the measuring cell. Before the bubble arrives at the cell the measuring cell voltage is switched on. The
bubble separates the reference electrode (RE) from the counter electrode (CE) and working electrode
(WE). When the bubble leaves the cell a current peak is created, and this peak is measured to calculate the
volume (refer to Figs. 3.2.2.2-1 and 3.2.2.2-2).

Note) After the procedure has been finished successfully the instrument returns to Standby.
If an error message appears, refer to troubleshooting.
The system volume value is not displayed.

V 1.6 – April 1999 1 Chapter 3.2


RD/Hitachi Elecsys 2010 Service Manual

'HWHFWLRQ 0HDVXULQJ&HOO

8QLW 69RSHQ 69FORVHG

0&RXWOHW
7XEHIRU6LSSHU

3UHKHDWSLSH

7XEHIRU6LSSHU6\ULQJH

&HOO7XEH



H
E
X
7

7LPHUVWDUW 6LSSHU

6\ULQJH

$LU%XEEOH—O

Fig. 3.2.2.2-1

'HWHFWLRQ 0HDVXULQJ&HOO

8QLW 0&RXWOHW 69RSHQ 69FORVHG

7XEHIRU6LSSHU

3UHKHDWSLSH

7XEHIRU6LSSHU6\ULQJH

&HOO7XEH

&XUUHQW3HDN



H
E
X
7
W

7LPHU6WRS 6LSSHU

6\ULQJH
W

9 Y W $; 6WRUH6\VWHPYROXPHYDOXH

Fig. 3.2.2.2-2

3.2.3 Storage of the System Volume Value / Data Handling


The determined system volume is stored as a value between 1 to 7 in the static RAM of the CPU. The
value is also stored on the database file.
When the instrument is switched on (main switch), the value is loaded from the static RAM (like
adjustment data). If the data in the S-RAM are corrupted, a load error is displayed and the value will be
loaded from the data disk.
Whenever the F/D write function is performed the current value from the S-RAM is written to the
database.

Chapter 3.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3.3 Cleaning Procedures

Introduction
Two cleaning procedures are recommended for the E2010 flowpath.
1. Liquid flow cleaning (see Chapter 3.3.1)
This cleaning procedure is also part of the customer maintenance (see Operator’s Manual) and should be
carried out frequently.

Service liquid flow cleaning (equivalent to 3 customer cleanings) should only be performed in the event of
high grade contamination problems (e.g. heat pipe blockage)

2. Cleaning for Fluidics System (see Chapter 3.3.2)


This procedure cleans tubings and the washing stations, but not the sipper line.

3.3.1 Liquid Flow Cleaning

Introduction
Contamination in the sipper system could potentially degrade sample accuracy and precision, or possibly
block the measuring cell flowpath. Liquid flow cleaning keeps the sipper liquid flowpath clean and
maintains the integrity of the measuring cell.

The customer should perform LFC on a frequent basis. Please train all your customers according to the
procedure described below and inform them about the importance of keeping the liquid flow path clean
and the measuring cell at the best performance level.

If operators perform this procedure frequently it will lead to fewer customer complaints.

Required materials: SysClean adapter Ident. No.: 1933159.910


ISE Cleaning Solution Ident. No.: 1298500

Software version: (03)-(08)

Recommended frequency*: Every two weeks or after 2500 - 3000 cycles

*If customer maintenance has been done as recommended, it is only necessary to carry out an additional customer
cleaning at the PM visit. The service LFC is only necessary during PM if the sipper line is highly contaminated or if
LFC has not been carried out regularly by the customer.

Operator time: Approx. 3 minutes

Analyzer time: User LFC: Approx. 16 minutes (user)

Service LFC: Approx. 32 min + time for MC prepare


cycles

Precautions: The cleaning solution is corrosive. Wear protective gloves and


glasses when handling this solution.

V 1.6 – April 1999 1 Chapter 3.3


RD/Hitachi Elecsys 2010 Service Manual

Procedure for Customer / Service

1. User Replace the PC bottle at position 3 by the SysClean adapter (keep the CC
bottle in position).

USER

SERVICE

Insert the adapter with the marking "USER" in direction towards the back of
the instrument. Fill the ISE cleaning solution to the edge of the fill mark on
the adapter (approx. 9 ml). PC/CC bottle has to be placed at the left side.

2. Service Same procedure as for customers but using the Service position of the
adapter.

3. User / Touch the Liquid Flow Cleaning button on the screen (Screen: Util /
Service Maintenance).

4. User The number of LFCs should be 1 for User maintenance.

5. Service
The number of LFCs should be 3 for service.

Take out the SysClean adapter and place ProCell and CleanCell bottles in all
positions.

Perform Measuring Cell Preparation cycles. [Press ”MC Preparation” in


Maintenance screen; select number of cycles]

• Start the LFC procedure shortly after filling up the ISE solution.

• After the instrument returns to Stand by remove the SysClean adapter and discard the remaining ISE
solution.

• To avoid an unpleasant odor, please empty the waste container at the end of the liquid flow cleaning
procedure.

Chapter 3.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

• After a Service LFC has been performed customers should check all controls and carry out a
calibration if necessary. This is not necessary for normal routine with customer LFC.

3.3.2 Cleaning Procedure for Fluidics System

The fluidics system consists of the tubing system, the pipettor, all wash stations except the part between
the sipper probe and SV3) The cleaning procedure is a function to be carried out when frequent high water
conductivity errors happen and if the system is contaminated with bacteria, algae, etc. Contamination can
lead to problems with the pipetting or washing processes, thereby degrading the sample accuracy and
precision.

Note: This is not a part of the routine maintenance for the Elecsys 2010. This procedure should only
be used if contamination has occurred.

Required materials
- 30 % Perhydrol-Solution; Fa. Merck Cat. No.: 1.07209.1000

Procedure

1. Remove the system water container. Fill with 3% Perhydrol solution and empty the liquid waste
container.
(Put about 100 ml 30 % Perhydrol solution in the tank, and fill up with purified water to the 3 L
mark. (3.5 L volume). Mix carefully.
Replace the system water container.

2. Touch the Maintenance button on the screen.

3. Touch the Cleaning button on the screen.

4. Start.
The procedure takes 50 min and consumes about 2.8 L.
When cleaning is finished the status changes to Stand-by. Allow the solution to react for 20 min.

5. Empty the liquid waste container.

6. Clean the system water container and refill with system water. Replace the container on system.

7. Touch the Cleaning button again. Rinsing with system water starts (50 min).

8. Repeat points 5 to 7 twice to guarantee that the whole system is filled with system water.

9. After finishing, the top of the screen changes to Stand-by. Please empty the liquid waste container
and refill the system water container with system water.
The system is now ready for the normal routine.

V 1.6 – April 1999 3 Chapter 3.3


RD/Hitachi Elecsys 2010 Service Manual

In case of frequent high water conductivity errors, check that the pipettor LLD voltage is 1.5 V or lower.
Otherwise, repeat the cleaning process with system water until the voltage is reduced to 1.5 V.

In case of strong contamination repeat the whole cleaning procedure again.

Note: There are some instruments that generate the alarm "Distilled Water: 25-01-01" during
Cleaning and the status shifts to Stand-by. However there is no problem with the performance
of cleaning function if enough system liquid (around 3 L) has run.

Chapter 3.3 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3.4 SysWash

Introduction
SysWash is used as an additive to the wash water in the Elecsys 2010. SysWash increases the rinsing
efficiency between pipetting steps.
SysWash also contains a preservative to protect the system from contamination (e.g. by bacteria).
The detergent solution is particularly necessary when performing analyses using Elecsys 2010 infectious
disease assays, but can also be used for the other parameters.

Before SysWash is regularly used on the instrument, service has to carry out the Rinsing procedure
(see below).
After the rinsing procedure has been finished, SysWash has to be used in the system water in the
recommended concentration (prepared working solution contains 0.075% detergent).

Note: For further details refer to “Product Information” (= package insert SysWash).
The Second Generation SysWash (containing preservative) is recommended for use in all systems.

SysWash Cat No. #1930346 1x500mL

SysWash rinsing procedure

1. Preparing the Mixture in the System Water Container

• Take 35 mL of SysWash and pour it into the empty Elecsys 2010 wash water container. Fill the
container with distilled water to the highest mark (dilution ratio is now 1 + 100).

Note
When pouring in the water make sure that it flows quickly enough, but avoid the formation of
foam. This ensures that the additive will be dispersed evenly in the wash water, so no additional
mixing will be necessary.

2. Analyzer Rinsing Procedure

Proceed as follows to ensure that the active component is present in the tip wash station for the
first determination:

• Start CLEANING-function ([Util] [Maintenance] [Cleaning] [Start])


• Run the CLEANING-function 2-3 times. Make sure that the total rinse volume is ≥ 5 L *).

*) This amount is necessary to replace the volume in the buffer container below the system water
container.

Note

In the event of foam formation in the tip wash station, wrap adhesive tape around the edge of the
station to increase the height during the rinsing procedure.

V 1.6 – April 1999 1 Chapter 3.4


RD/Hitachi Elecsys 2010 Service Manual

3.4.1 Modification of the S/R Rinse Station

Introduction
The S/R Rinse station has been modified to allow the use of infectious disease tests on Elecsys 2010.
The NEW Modified Rinse Station part should be available from the end 1999 and will be
implemented in the latest instruments.
For already installed instruments the old station should be exchanged by the new one in the
course of preventive maintenance (please refer to corresponding Service News).

We have added the tentative modification procedure for the S/R Rinse Station (OLD TYPE)
until new one is available.

Note
If a NEW Rinse Station has been installed, water pressure reduction and the check procedure
described below are no longer necessary.

Proposed modification procedure for S/R Rinse Station (OLD TYPE)

In order to use infectious disease tests on Elecsys 2010 the following preconditions have to be met:

No. Item Remarks


1. Implementation of upgrade Instrument History M + N
package 1
2. Software Version 03-08 or Instrument History M + N
higher
3. S/R Probe wash station Contents of this chapter
modification
4. Use of SysWash Refer to "SysWash rinsing procedure" above

Note
The availability of S/R probe wash station modification parts (adapter) is limited. If more
adapters are needed please contact Global System Support.

Materials required

1. S/R probe wash station adapter


2. Rapid glue
3. SysWash (Cat No. 1930 346)

Chapter 3.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Installation targets
1. The assay tip should be washed in the height of 4 to 5 mm (at the tip end).
2. The distance between tip and water outlet should be around 2 mm.
3. Water leaves the adapter horizontally and centred up.
4. No water exits laterally or below the adapter.
5. The water stream should not reach the mixer wash water area.

Installation

Note
Perform the "SysWash rinsing procedure" before adapter installation
(see above).
1. First insert the adapter without gluing to get a feeling for the right position (compare Figs. 3.4.1-1
and 3.4.1-2).
2. Check the water stream with the CLEANING-function ([Util] [Maintenance] [Cleaning] [Start])
according to the installation targets described above.
3. Glue the adapter into the water outlet. Ensure that the water flow will not be restricted by glue.
4. Adjust the tip wash station (manually) and the pipettor adjustment (software) according to the
installation targets described above.
5. Check the wash water stream again by means of the CLEANING function and ensure that no
water reaches the mixer wash water area (see also Fig. 3.4.1.1). If necessary adjust the water
stream by fixing a tie wrap around the wash water inlet tube (tube 5, see Fig. 3.4.1-2).

Check

Carry out the artificial media check (AM check; for details refer to Chapter 2) and pay particular
attention to the dilution result.

Note: The new target for dilution with SysWash (table below). If the dilution factor is outside the
specified range check the installation targets again.

Parameter Unit Target


BCR2 (1:20) precision (CV) [CV] < = 3.5 %
Dilution factor *with SysWash 19.7 ± 1
Dilution factor *without SysWash 18.2 ± 1

( signal BCR2 average − signal BCR1 average)


*Calculation of Dilution factor = BCR2 (1:20) =
( signal BCR2 (1:20) average - signal BCR1 average)]

V 1.6 – April 1999 3 Chapter 3.4


RD/Hitachi Elecsys 2010 Service Manual

Mixer wash water


area

Adapter
position

Fig. 3.4.1.-1

Tie wrap
position
around tube
5

Fig. 3.4.1-2

Chapter 3.4 4 V 1.6 – April 1999


4. Mechanics

4.1 Overview
4.1.1 Location
4.1.2 Outline of Mechanical Units

4.2 Location of Mechanisms


4.2.1 Analyzer
4.2.2 Rack Sampler System

4.3 List of Motors, Sensors, and Other Mechanisms


4.3.1 List of Motors
4.3.2 List of Sensors
4.3.3 List of Peltier, Heater , and Fan Motor
4.3.4 List of Motors for Rack Sampler System
4.3.5 List of Sensors for Rack Sampler System
4.3.6 List of LEDs and Fan Motor for Rack Sampler System

4.4 Detailed Explanation of Each Mechanism


4.4.1 Sample Disk Drive Mechanism
4.4.2 Reagent Disk Drive Mechanism
4.4.3 Cap Open/Close Mechanism
4.4.4 Beads Mixer Mechanism
4.4.5 Pipetter Mechanism
4.4.6 Gripper Mechanism
4.4.7 Sipper Mechanism
4.4.8 System Reagent Mechanism
4.4.9 Syringe Mechanism
4.4.10 System Water Container (Float SW) Mechanism / Pump Assembly
4.4.11 Liquid Waste Container Mechanism
4.4.12 Solid Waste Mechanism
4.4.13 Detection Unit
4.4.14 Magnet Drive Mechanism
4.4.15 Matrix BCR Mechanism
4.5 Mechanical Adjustment
4.5.0 Overview
4.5.1 Mechanical Adjustment Procedure
4.5.2 Mechanical Adjustment Procedure for Rack Sampler

4.6 Rack Sampler System


4.6.0 Overview
4.6.1 Rack Sampler Movement
4.6.2 A Line
4.6.3 B Line
4.6.4 C Line

4.7 Mechanical Adjustment for Rack Sampler Connected to CLAS 1 System


4.7.1 Overview
4.7.2 Location of Mechanisms
4.7.3 List of Motors, Sensors and Other Mechanisms for Rack Sampler connected to CLAS 1 System
4.7.4 Explanation of each Mechanism
- A Line
- B Line
- C Line
- I Line
- Turntable C
4.7.5 Mechanical Adjustment Procedure for Rack Sampler connected to CLAS 1 System

4.8 Instrument History


4.8.1 Instrument History – Rack Systems
4.8.2 Instrument History – Disk Systems
RD/Hitachi Elecsys 2010 Service Manual

4. Mechanics

4.1 Overview
4.1.1 Location
See Chapter 4.2.
4.1.2 Outline of Mechanical Units

1. Sample Disk Mechanism


The sample disk mechanism rotates the sample disk to position the sample in the pipetting position.

2. Reagent Disk Mechanism


The reagent disk mechanism consists of the following two units:
1) Reagent Disk Mechanism: The reagent disk mechanism causes the rotation of the reagent disk to bring the
reagent in the pipetting position.
2) Reagent Cooling Unit: The reagent cooling unit is a Peltier-element temperature controller that controls the
reagent temperature.

3. Cap Open/Close Mechanism


The cap open/close mechanism has three separate hooks. Using these hooks, the mechanism opens and closes
the snap-in cap of the rack pack, coinciding with the reagent pipetting or the stirring by the beads.

4. Beads Mixer Mechanism


The beads mixer stirs the beads in the reagent rack pack right before the pipetting of the reagent.

5. Pipetter Mechanism
The pipetter is a unit that picks up the disposable tip using the X-Z mechanism, aspirates a sample, calibrator,
reagent (beads, R1, and R2), and diluent, and injects the material into the reaction vessel.

6. Buffer Station
The buffer station is a picking up position of tips for the pipetter and a injection position for sample and reagent
into the reaction vessel.

7. Gripper Mechanism
The gripper consists of the following three units. It carries the tip/vessel from the container to buffer station and
from the buffer station to the incubator, and vice versa.
1) Tip/Vessel Carrier - Transports the tip/vessel by using the X/Y/Z/Grip mechanism.
2) Container Station - Capable to carry up to three tip containers and three vessel containers.
3) Incubator Station - On its heat blocks are 32 incubator stations and 1 sipping station.

8. Sipper Mechanism
The sipper carries the probe that is connected to the syringe with a tube to each station via the measuring cell.

9. System Reagent Mechanism


The system reagent mechanism is a unit that keeps the liquid temperature constant inside the AB and CC bottles.
It has a case that has grooves for an AB bottle and a CC bottle. By setting an AB bottle and a CC bottle, one at
a time, it adjusts the case temperature by using a Peltier temperature controller.

V 1.6 – April 1998 1 Chapter 4.1.1


RD/Hitachi Elecsys 2010 Service Manual

10. Syringe Mechanism


The syringe consists of the two systems below. It moves the liquid by pumping it up with the force driven by
the plunger’s up-and-down movement and by the shift of the position of the probe in each system.
1) Pipetter Syringe (on the left side) - Aspirates and pipettes a specified amount of each of sample, reagent, or
beads using the pipetter probe and tube.
2) Sipper Syringe (on the right side) - Aspirates the reaction mixture via the sipper probe, tube, and measuring
cell.

11. System Water Container (Float SW)


The system water container consists of the following two units. Driven by the pump and valve, it provides
system water to each wash bath and syringe.
• System Water Container - capacity: 3 liters
• Buffer Tank - capacity: 1 liter, with float SW.

12. Liquid Waste Container


The liquid waste container consists of the following two units. It collects the wash solution and reaction
mixture.
1) Liquid Waste Container - capacity 4 liters.
2) Container Station (with a fill-level detector with a detection level: 3.5 1iters)

13. Solid Waste Mechanism


The solid waste mechanism vibrates the waste box to smooth the used tips and vessels piled up in the waste box
so that the space to collect the tips and vessels is maximized.

14. Magnet Drive Mechanism


The magnet drive mechanism is located in the detection unit below the measuring cell. In the analyzer, it is used
for positioning the magnet in the detection point of the measuring cell and for taking the magnet away from the
cell.

15. Matrix BCR Mechanism


The matrix BCR mechanism is a unit that contains an oscillating mechanism that is used for scanning bar-coded
data with a bar-code reader. The bar-code reader scans bar codes attached to reagent rack packs and sample
tubes, or bar codes that also carry the analytical information.

Chapter 4.1.1 2 V 1.6 – April 1998


RD/Hitachi Elecsys 2010 Service Manual

4.2 Location of Mechanisms


4.2.1 Analyzer

Pipetter BCR Cap Open/Close Beads Mixer Sipper System Detection Unit Syringe
Mechanism Mechanism Mechanism Mechanism Mechanism Reagent Unit Mechanism

Sample Disk Reagent Disk Solid Waste Gripper Liquid Waste System Water
Mechanism Mechanism Mechanism Mechanism Mechanism Container

V 1.6 – April 1999 1 Chapter 4.2.1


RD/Hitachi Elecsys 2010 Service Manual

4.2.2 Rack Sampler System

BCR & BCR Board(P/N741-5056)


in the Analyzer.
C Line

A Line B Line STAT Sample Position

Fig. 4.2.2-1 Rack Sampler Unit

V 1.6 – April 1999 2 Chapter 4.2.2


RD/Hitachi Elecsys 2010 Service Manual

LED201

PI201 (A Line HOME Position) PI202 (A Line Rack Feed End Position)

PI200 (A Line Tray Detection)

Motor SM200

Fig. 4.2.2-2 Overview of the A Line

V 1.6 – April 1999 3 Chapter 4.2.2


RD/Hitachi Elecsys 2010 Service Manual

PI213 PI210 PI216 PI211


(B Line STAT (B Line HOME (B Line BCR (B Line Rack Feed
Position) Position) Read Position) End Position)

PI217(B lline cup Detection)

PI212 (B Line Rack PI215 (B Line Sampling


Detection) Position)

Fig. 4.2.2-3 Overview of the B Line

V 1.6 – April 1999 4 Chapter 4.2.2


RD/Hitachi Elecsys 2010 Service Manual

PI224(C Line Tray Detection) LED202 PI223(C Line Rack Full Detection)

PI226 PI225 Rack Feed Arm


(C Line Tray Full (CLine Tray Full
2 Detection) 1 Detection)

PI221(C Line HOME PI222(C Line Rack


Position) Feed End Position)

Fig. 4.2.2.4 Overview of the C Line

V 1.6 – April 1999 5 Chapter 4.2.2


RD/Hitachi Elecsys 2010 Service Manual

4.3 List of Motors, Sensors, and Other Mechanisms

4.3.1 List of Motors


No. Unit Type Part No. Drive PCB Control PCB
1 Sample Disk KP56KM1-014 741-0550 DO1 GPCONT1
2 Reagent Disk KH56LM2-027 741-0551 DO2 GPCONT1
3 Cap Open Close Mecha. (F/B) KH56HM2-016 741-4257 DO1 GPCONT2
4 Cap Open Close Mecha (O/C) PH264-01-C97 741-4255 DO1 GPCONT2
5 Beads Mixer (Rotation) PX244M-02A 741-0601 DO1 GPCONT3
6 Beads Mixer (U/D) KH42HM2-052 741-0603 DO1 GPCONT3
7 Beads Mixer (Mix.) 12CL-20 741-0593 EIO GMCONT
8 Pipetter (X-axis) KH56LM2-027 741-4244 DO1 GPCONT5
9 Pipetter (U/D) KH42HM2-052 741-4245 DO1 GPCONT5
10 Gripper (X-axis) KH42JM2-011 741-4320 DO1 GPCONT7
11 Gripper (Y-axis) KH56LM2-027 741-4319 DO1 GPCONT8
12 Gripper (U/D) PF25-48D4 741-4321 DO1 GPCONT7
13 Gripper Solenoid 2ER45-33x3x9 741-4322 EIO GMCONT
14 Pipetter Syringe PH265M-33-C3 741-0804 DO1 GPCONT9
15 Sipper Syringe KH56KM2-016 741-0806 DO2 GPCONT9
16 Sipper (X-axis) KH56LM2-027 741-4248 DO1 GPCONT6
17 Sipper (U/D) KH42HM2-052 741-4249 DO2 GPCONT6
18 D Unit (Mag. Drive) KH42HM2-052 741-4316 DO2 GPCONT8
19 Solid Waste KH56HM2-016 741-0581 DO1 GPCONT4
20 BCR Rotate KH42HM2-052 741-0600 DO2 GPCONT4

V 1.6 – April 1999 1 Chapter 4.3.1-6


RD/Hitachi Elecsys 2010 Service Manual

Motor Reference List

This is a cross-reference list for motors used in the Elecsys 2010 instrument. The part numbers in the current pasts
list mainly include motors with connected wires. Due to the fact that we only stock single motors, the part numbers
cannot be used for ordering purposes.

Page of Part number Part number BM material Part name


Parts List (motor with number
(motor itself, (motor itself, without lead wires)
lead wires)
without lead wires)

8 741-0551 741-1120 1708368.001 Pulse Motor KH56LM2-027


11 741-4244 741-1120 1708368.001 Pulse Motor KH56LM2-027
13 741-4247 741-1049 1708244.001 Pulse Motor KH42HM2-052
20 741-4320 K591137 1709461.001 Pulse Motor KH42JM2-011
24 741-4319 741-3132 1807501.001 Pulse Motor KH56LM2-049
26 741-4257 741-1048 1708236.001 Pulse Motor KH56HM2-016
28 741-4248 741-1120 1708368.001 Pulse Motor KH56LM2-027
29 741-4251 741-1049 1708244.001 Pulse Motor KH42HM2-052
32 741-0806 741-1560 1708082.001 Pulse Motor KH56KM2-016
37 741-4316 741-1049 1708244.001 Pulse Motor KH42HM2-052
41 741-0603 741-1049 1708244.001 Pulse Motor KH42HM2-052
43 741-0600 741-1049 1708244.001 Pulse Motor KH42HM2-052
44 741-0581 741-1048 1708236.001 Pulse Motor KH56HM2-016

Chapter 4.3.1-6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.3.2 List of Sensors


No. Item Description Type Part No. Bright/Dark
1 Photo-Coupler S.Disk Home P GP1A34LC J339165 Dark
2 Photo-Coupler S.Disk Stop P GP1A34LC ↑ Bright
3 Photo-Coupler R.Disk Home P GP1A34LC ↑ Dark
4 Photo-Coupler R.Disk Stop P GP1A34LC ↑ Bright
5 Photo-Coupler BCR Home P GP1A34LC ↑ Dark
6 Photo-Coupler Cap Opener F/B Home.P GP1A34LC ↑ Dark
7 Photo-Coupler Cap Opener F/B Stop.P GP1A34LC ↑ Dark
8 Photo-Coupler Cap Opener O/C Home P GP1A34LC ↑ Dark
9 Photo-Coupler Pipetter U/D UDP GP1A34LC ↑ Dark
10 Photo-Coupler Pipetter X-axis Home P GP1A34LC ↑ Dark
11 Photo-Coupler Pipetter X-axis End P GP1A34LC ↑ Dark
12 Photo-Coupler Pipetter Z-axis Abnormal D TLP830 J339168 Bright
13 Photo-Coupler Beads Mixer Arm Home P GP1A34LC J339165 Dark
14 Photo-Coupler Beads Mixer Arm End P GP1A34LC ↑ Dark
15 Photo-Coupler Beads Mixer U/D UDP GP1A34LC ↑ Dark
16 Photo-Coupler Solid Waste Home P GP1A34LC ↑ Dark
17 Photo-Coupler Solid Waste Box Det. DET-C 741-5026 Dark
18 Photo-Coupler Sipper U/D UDP GP1A34LC J339165 Dark
19 Photo-Coupler Sipper X-axis Home P GP1A34LC ↑ Dark
20 Photo-Coupler Sipper X-axis End P GP1A34LC ↑ Dark
21 Photo-Coupler Sipper Z-axis Abnormal D TLP830 J339168 Dark
22 Photo-Coupler Magnet Drive Home P GP1A34LC J339165 Dark
23 Photo-Coupler Pip. Syringe UDP DETECT1 741-0805 Dark
24 Photo-Coupler Sip Syringe UDP DETECT1 ↑ Dark
25 Photo-Coupler Gripper U/D UDP TLP830 J339168 Dark
26 Photo-Coupler Gripper X-axis Home P TLP830 ↑ Dark
27 Photo-Coupler Gripper Y-axis Home P TLP830 ↑ Dark
28 Photo-Coupler Gripper Y-axis End P TLP830 ↑ Dark
29 Photo-Coupler Gripper Y-axis Rest P TLP830 ↑ Dark
30 Photo-Coupler Gripper Solenoid Abnormal D TLP830 ↑ Dark
31 Photo-Coupler Gripper Solenoid Grip D TLP830 ↑ Bright
32 Photo-Coupler Waste Tank Detection GP1A34LC J339165 Bright
33 Photo-Coupler Waste Tank Full GP1A34LC ↑ Bright
34 Float Switch Distilled Water Level OLV-5-1 741-0563 -

V 1.6 – April 1999 3 Chapter 4.3.1-6


RD/Hitachi Elecsys 2010 Service Manual

35 Photo-Coupler Tip Buffer 1 PLI-523 741-4318 Dark


36 Photo-Coupler Tip Buffer 2 PLI-523 ↑ Dark
37 Photo-sensor System Reagent Bottle EE-Spy412 741-1385 Presence
38 Thermistor R.Disk Temp. Control - 741-0552 -
39 Thermistor Incubation Temp Control - 741-0582 -
40 Thermistor D.Unit Temp. Control - 741-4316 -
41 Thermistor S.Reagent Temp Control - 741-0547 -

4.3.3 List of Peltier, Heater and Fan Motor


No. Item Application Type Parts No. Voltage
1 Peltier Reagent Disk Jacket EC-50FL 741-1202 ±15V
2 Peltier Reagent Disk Jacket EC-50FL ↑ ↑
3 Peltier System Reagent EC-50FL ↑ ↑
4 Peltier Detection Unit EC-50FL ↑ ↑
5 Fan Motor Reagent Disk Jacket 0915-12M ↑ 12V
6 Fan Motor Reagent Disk Jacket 0915-12M ↑ ↑
7 Fan Motor System Reagent 0915-12M ↑ ↑
8 Fan Motor Detection Unit 0915-12M ↑ ↑
9 Fan Motor PCB Rack 109P1212H40 741-4555 ↑
2
10 Fan Motor Cooling of Instrument 109P1212H40 ↑ ↑
2
11 Fan Motor Cooling of Instrument 109P1212H40 ↑ ↑
2
12 Heater Incubator SD-124--520 741-1282 ↑

4.3.4 List of Motors for Rack Sampler System


No. Unit Type Part No. Drive PCB Control PCB
1 A Line A3339-9212 725-1153 DO4 GPCONT12
2 B Line KP56-KM1-014 K591127 DO4 GPCONT13
3 C Line A3339-9212 725-1153 DO4 GPCONT12

Chapter 4.3.1-6 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.3.5 List of Sensors for Rack Sampler System


No. Item Description Type Parts No. Bright/Dark
1 Photo-Coupler PI200 A Line Tray Detection PM2-LF10 J684014 Dark
2 Photo-Coupler PI201 A Line Home Pos. GP1A34LC J339165 Dark
3 Photo-Coupler PI202 A Line Rack Feed End Pos. GP1A34LC ↑ Dark
4 Photo-Coupler PI210 B Line Home Pos. GP1A34LC ↑ Bright
5 Photo-Coupler PI211 B Line Rack Feed End Pos. GP1A34LC ↑ Dark
6 Photo-Coupler PI212 B Line Rack Detection PM2-LF10 J684014 Dark
7 Photo-Coupler PI213 B Line STAT Pos. GP1A34LC J339165 Dark
8 Photo-Coupler PI215 B Line Sampling Pos. PH-D 741-5053 Bright
PH-T 741-5054
9 Photo-Coupler PI216 B Line BCR Read Pos. GP1A34LC J339165 Dark
10 Photo-Coupler PI217 B Line Cup Detection PM2-LF10 J684014 Dark
11 Photo-Coupler PI221 C Line Home Pos. GP1A34LC J339165 Dark
12 Photo-Coupler PI222 C Line Rack Feed End Pos. GP1A34LC ↑ Dark
13 Photo-Coupler PI223 C Line Rack Full Detection PM2-LF10 J684014 Dark
14 Photo-Coupler PI224 C Line Tray Detection PM2-LF10 ↑ Dark
15 Photo-Coupler PI225 C Line Tray Full(1) Detection PM2-LF10 ↑ Dark
16 Photo-Coupler PI226 C Line Tray Full(2) Detection PM2-LF10 ↑ Dark

4.3.6 List of LEDs and Fan Motor for Rack Sampler System
No. Item Description Type Parts No. Voltage
1 LED201 A Line Tray Exchange BD-703G J853635 5V
2 LED202 C Line Tray Exchange BD-703G ↑ 5V
3 Fan Motor Cooling of DC Power Supply MD-825- L542069 24V
BM-24

See Chapter 10, Maintenance, for details of parts held on stock at Roche Diagnostics.

V 1.6 – April 1999 5 Chapter 4.3.1-6


RD/Hitachi Elecsys 2010 Service Manual

4.4 Detailed Explanation of Each Mechanism

1. Sample Disk Drive Mechanism

2. Reagent Disk Drive Mechanism

3. Cap Open/Close Mechanism

4. Beads Mixer Mechanism

5. Pipetter Mechanism

6. Gripper Mechanism

7. Sipper Mechanism

8. System Reagent Mechanism

9. Syringe Mechanism

10. Distilled Water Container (Float SW)

11. Liquid Waste Mechanism

12. Solid Waste Mechanism

13. Detection Unit

14. Magnet Drive Mechanism

15. Matrix BCR Mechanism

V 1.6 – April 1999 1 Chapter 4.4


RD/Hitachi Elecsys 2010 Service Manual

4.4.1. Sample Disk Drive Mechanism

4.4.1-1 Overview
The sample disk drive mechanism is a unit that activates the rotation movement of sample disk and transfers
samples to the pipetting position.

Note
This part has been modified Å history label: N

Field retrofit: Upgrade pack 1


Implemented in instrument production from serial No. 1053-23 onwards.

Please also refer to Chapter 4.8, Instrument History, for details.

4.4.1-2 Location
See Chapter 4.2.

4.4.1-3 Function Explanation Details


This unit consists of the following parts:
• Sample Disk
• Rotation Mechanism
1) Sample Disk
The sample disk can has positions for thirty (30) samples and controls and be removed from the device in a single
operation. Upon delivery, the Sample Disk is wrapped independently from the main body as an accessory.
a) Suitable test tubes for the sample disk:
• ∅13mm x 75 mm
• ∅13mm x 100 mm
• ∅16mm x 75 mm
• ∅16mm x 100 mm

b) Suitable sample cups for the sample disk:
• HITACHI sample cup

c) The 2~3 ml calibrator bottle can be used for the sample disk.

d) Table diameter: ∅ 219 mm


Table height: 100 mm

2) Rotation Mechanism
The rotation mechanism is a mechanism activated by the timing belt and the motor that activates the rotation
movement of the sample disk.
• Speed reduction comparison: 1:10
• Step angle after speed reduction: 0.045°

V 1.6 – April 1999 1 Chapter 4.4.1


RD/Hitachi Elecsys 2010 Service Manual

4.4.1-4 Explanatory Diagram

HOME PCP

Chapter 4.4.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.1-5 Parts List

Pos. No. Part Name Part No.


1 Pillow Base 741-1185
2 Pulley 741-1186
3 Center Holder 2R 741-2158
4 GND Ring R 741-2159
5 Cone Spring 741-2166
6 GND Spring (S) assembly 741-0556
7 BB 6002 ZZ L111060
8 BB 6010 ZZ 741-1215
9 Timing Belt 741-1211
10 Pulley L237010
11 Photo Interrupter GP1A34LC J339165
12 Motor (S) assembly 741-0550
13 J511 Cord Assembly 741-4300
14 Clamp CKS-05-H J839408
15 Sample Jacket 741-1187
16 Plate R 741-3166
17 ES, K Bar 707-2284
18 GND Stopper (S) Assembly 741-0558
19 New Sample Disk, Revision A 741-0117

4.4.1-6 Disassembly and Assembly Procedures

Removing the units


Remove the parts in the following order:
a) Remove waste tank and water supply tank.
b) Take out the R lid, reagent disk, and sample disk.
c) Take out cover Y (side cover of the gripper).
d) Take out rear cover.
e) Take out front cover.
f) Take out table cover.
g) Unscrew the M4 screw that press-fixes the GND stopper (S) assembly.
h) Remove the sample jacket.
i) Remove the connectors (J510 and J511) and the GND wire.
j) Pull out the sample disk drive unit.

Disassembly and Assembly of Unit


A. Rotation Motor
Disassembly
a) Remove the motor
• Unscrew the M4 Screw that secures the motor.
Assembly
a) Temporarily fix the motor with the M4 screw, and put the timing belt on the small pulley for the motor.
b) Put the timing belt SR on the big pulley, then rotate the pulley by a small amount (2 or 3 teeth) in either
direction to ensure secure fit.
c) Adjust the belt tension. The belt tension is indicated in the figure below.

V 1.6 – April 1999 3 Chapter 4.4.1


RD/Hitachi Elecsys 2010 Service Manual

B. Big Pulley
Disassembly
When removing the big pulley, remove it before dismounting the unit from the main body.
a) Remove the sample jacket.
b) Detach the center holder 2.
c) Take out the GND ring and GND spring 1.
d) Remove the timing belt SR.
e) Pull out the big pulley (the small bearing does not need to be removed.).
• Support the outer circumference by hand
Assembly
Assemble after dismounting the motor for rotation.
a) Put the big pulley horizontally on the bearing, and push firmly to set.
b) Insert the small bearing, GND spring, GND ring, and center holder 2 sequentially and fix with the screw.
c) Install the rotation motor.
d) Adjust the belt tension as described above.

C. Home Position Sensor and Position Sensor


Disassembly
a) Pull out the big pulley.
b) Unhook the hook of the sensor from the back of the unit.
c) Pull out the connector of the sensor.
Assembly
a) Insert the sensor and install the connector.
b) Install the big pulley.
c) Mount the rotation motor.

4.4.1.7. The Motion and Motion Check Method


Check the motion via Reset Motion and confirm that Position No. 1 stops at the sampling position.

Chapter 4.4.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.2. Reagent Disk Drive Mechanism

4.4.2-1 Overview
The reagent disk drive mechanism is a unit that activates the rotation movement of reagent disk and transfers
reagents to the pipetting positions.

4.4.2-2 Location
See Chapter 4.2.

4.4.2-3 Functional Details


This unit consists of the following parts:
• Reagent Disk
• Rotation Mechanism

1) Reagent Disk
The reagent disk can be used to set more than eighteen (18) reagent rack packs on the circumference. On delivery,
the reagent disk is packaged independently from the main body as an accessory.

2) Rotation Mechanism
The rotation mechanism is activated by the timing belt and the motor that activates the rotation
movement of the reagent disk.
• Speed reduction comparison: 1:10
• Step angle after speed reduction: 0.18° / step (during operation)
0.0225° / step (during initialization)

V 1.6 – April 1999 1 Chapter 4.4.2


RD/Hitachi Elecsys 2010 Service Manual

4.4.2-4 Explanatory Diagram

HOME PCP

STOP PCP

Chapter 4.4.2 2 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.2-5 Parts List


Pos. No. Part Name Part No.
1 Pillow Base 741-1185
2 Pulley 741-1186
3 Center Holder 2 741-1193
4 GND Ring 741-1197
5 GND Spring 1 741-1195
6 GND Spring (S) assembly 741-0557
7 BB 6002 ZZ L111060
8 BB 6010 ZZ 741-1215
9 Timing Belt SR 741-1211
10 Pulley L237010
11 Photo Interrupter GP1A34LC J339165
12 Motor (S) Assembly 741-0551
13 J521 Cord Assembly 741-4301
14 Rubber Packing 707-2007
15 R Stop Bracket 741-1217
16 Clamp CKS-05-H J839408
17 Set Plate 741-1198
18 Insulation R 741-1598
19 Reagent Disk 741-1180
20 M6 Knob 741-1199

4.4.2-6 Disassembly and Assembly Procedures


Removing the Units
Remove the parts in the following order:
a) Remove waste tank and water supply tank.
b) Take out the R lid, reagent disk, and sample disk.
c) Take out cover Y (side cover of the gripper).
d) Take out rear cover.
e) Take out front cover.
f) Take out table cover L and table cover R.
g) Remove the set plate.
h) Remove the reagent cooler unit.
• Take out connectors J520, J521, and the GND wire.
i) Dismount the reagent disk drive unit.

Disassembly and Assembly of Unit


A. Rotation Motor
Disassembly
a) Remove the motor
• Unscrew the M4 screw that secures the motor.
Assembly
a) Temporarily fix the motor with the M4 screw, and put the timing belt on the small pulley for the motor.
b) Put the timing belt SR on the big pulley, and turn the pulley a small amount (2 or 3 teeth) in either
direction to ensure secure fit .
c) Adjust the belt tension. The belt tension is indicated in the figure below.

V 1.6 – April 1999 3 Chapter 4.4.2


RD/Hitachi Elecsys 2010 Service Manual

B. Big Pulley
Disassembly
When removing the big pulley, remove it before dismounting the unit from the main body.
a) Remove center holder 1.
b) Take out the GND ring and GND spring 1.
c) Remove the timing belt SR.
d) Pull out the big pulley.
• Support the outer edge by hand.
(The small bearing does not need to be removed.)
Assembly
Assemble after dismounting the rotation motor.
a) Put the big pulley horizontally on the bearing and insert it firmly.
b) Insert the small bearing, GND spring, GND ring, and center holder 2 sequentially and fix with the screw.
c) Install the rotation motor.
d) Adjust the belt tension.

C. Home Position Sensor and Position Sensor


Disassembly
a) Pull out the big pulley.
b) Unhook the hook of the sensor from the back of the unit.
c) Pull out the connector of the sensor.
Assembly
a) Insert the sensor and install the connector.
b) Install the big pulley.
c) Mount the rotation motor.

4.4.2-7 The Motion and Motion Check Method


Check the motion via Reset Motion and confirm that Position No.1 stops at the Cap O/C position.

Chapter 4.4.2 4 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.2-8 Reagent Cooler Unit

4.4.2-8-1 Overview
The reagent cooler unit is a reagent-temperature control unit by Peltier element.

4.4.2-8-2 Location
See Chapter 4.2.

4.4.2-8-3 Functional Details


This unit consists of the following parts:
• Peltier cooling unit
• Copper jacket part
• R. lid (cover at the top part)
• Window section to read bar code
• R. lid O/C sensor part
1. Peltier Cooling Unit
The Peltier cooling unit consists of a Peltier element, cooling fin, and DC fan. It maintains the reagent
temperature at 20°C ± 3°C using two (2)sets.
2. Copper Jacket Part
The copper jacket part consists of a pot-shaped copper jacket and insulating material that covers the round
copper plate (THK: 5mm) and maintains a constant internal temperature.
3. R. Lid
The R. lid prevents temperature increases via the top of the reagent cooler unit.
4. Window Section to Read Bar Code
This window allows the labels on reagent bottles to be read by the two-dimensional bar-code reader. The
heater prevents condensation.
5. R. Lid O/C Sensor Part
The R. lid O/C Sensor part detects opening/closing of the R lid via a microswitch.

V 1.6 – April 1999 5 Chapter 4.4.2


RD/Hitachi Elecsys 2010 Service Manual

4.4.2-8-4 Explanatory Diagram

includes Peltier

R.Disk Temp. Control


Thermistor

Chapter 4.4.2 6 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.2-8-5 Parts List


Pos. No. Part Name Part No.
1 TEMP Jacket 741-1200
2 TEMP Disk 741-0525
3 Inner Ring 741-1188
4 Outer Ring 741-1189
5 Insulation Cup 741-1190
6 Micro Cooler, Assembly 741-0552
7 Window, Assembly 741-0596
8 Thermistor R, Assembly 741-0554
9 Micro Switch, Assembly 741-0555
10 Packing S 741-1571
11 Sensor Lever 741-1209
12 Heater Holder 741-1206
13 Bush B 741-1383
14 Sensor Plate 741-1219
15 Holder Packing 741-1210
16 Window Insulation S 741-1572
17 Window Insulation 741-1573
18 Silicone Grease F440079
19 Rubber Compound F375003
20 R. Lid 741-1191
21 Lock Knob 741-1192
22 Hold Rubber F721011

4.4.2-8-6 Disassembly and Assembly Procedures


Removing the Units
Remove the parts in the following order (start with covers):
a) Remove waste tank and water supply tank.
b) Take out the R lid, reagent disk, and sample disk.
c) Take out cover Y (side cover of the gripper).
d) Take out rear cover.
e) Take out front cover.
f) Take out table cover L and table cover R.
g) Remove P plate cover.
h) Take out the following connectors: J523, J524, and J525.
I) Remove set plate.
j) Dismount reagent cooler unit.
Disassembly and Assembly of Units
A. Microcooler assembly
B. Thermistor R assembly
C. Outer ring, inner ring
D. Window heater
E. R. lid
A. Microcooler Assembly
Disassembly
a) Take out the two (2) packing S.
b) Unscrew the two (2) screws of the thermostat.
c) Remove the J523 connector.
d) Pull out #3 and #6 pins (for window heater) of J523 connector.
• Use tweezers to pull out the pins.
e) Release two (2) microcoolers.

V 1.6 – April 1999 7 Chapter 4.4.2


RD/Hitachi Elecsys 2010 Service Manual

Assembly
a) Apply a thin coat of silicone grease (heat-conducting) to the cooling surface of the microcooler.
b) Fix the two (2) microcoolers evenly using screws.
c) Push the pins for window heater to #3 and #6 of J523 connector (no polarity in the window heater).
d) Assemble the thermostat, packing S, and J523 connector.
B. Thermistor R. Assembly
Disassembly
a) Remove the microcooler assembly.
b) Take out insulation cup.
c) Remove thermistor R assembly.
Assembly
To assemble the thermistor R assembly, re-install the parts removed during disassembly procedures (see
above) in the reverse order.
C. Outer Ring, Inner Ring
Disassembly
a) Dismount the microcooler assembly.
b) Take out insulation cup.
c) Remove thermistor R assembly.
d) Remove outer ring and inner ring.
Assembly
To assemble the outer ring and inner ring, re-install the parts removed during disassembly procedures (see
above) in the reverse order.
D. Window Heater
Disassembly
a) Remove the microcooler assembly.
b) Take out insulation cup.
c) Remove thermistor R. assembly.
d) Remove outer ring.
e) Remove the heater holder.
f) Remove window heater.
Assembly
To assemble the window heater, re-install the parts removed during disassembly procedures (see above) in the
reverse order.
E. R. Lid
Disassembly
a) Pull out the lock knob.
Assembly
a) Apply a very thin coat of silicone grease (heat-conducting) to the tip of the lock knob.
b) Push and insert the hold rubber in the R. lid.
c) Turn the lock knob to insert it into the R. lid.

Chapter 4.4.2 8 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.3. Cap Open/Close Mechanism

4.4.3-1 Overview
The cap open/close mechanism is a unit that opens/closes the snap cap of RackPacks according to the timing of
beads stirring or reagent pipetting by means of three (3) independent hooks.

4.4.3-2 Location
See Chapter 4.2.

4.4.3-3 Functional Details


This unit consists of the following parts:
• Rotation mechanism
• Front-rear mechanism
• RackPack stopper

1) Rotation Mechanism

The rotation mechanism activates three (3) hooks to start rotation movement to open the cap. The rotation
mechanism constitutes the crank mechanism with the fork link that rotates around the center of a spinning fulcrum
of hook and the drive link installed to the motor shaft with speed reduction control. The three (3) hooks are
installed in a special manner:
1. The hooks are attached to the hook plate by a coil spring.
2. Each hook can independently work on the hook-plate that moves following the motion of fork link.
• Speed reduction comparison: 1:10
• Step angle after speed reduction: 0.18° / step
• Stroke: 51.1° / step
2) Front-Rear Mechanism
The front-rear mechanism activates the rotation mechanism in a front-rear movement. It constitutes the straight-
line movement mechanism by the timing belt and the stepping motor installed at the base of the unit.
• Step angle: 0.9°
• Stroke: 113 mm
3) RackPack Stopper
The RackPack stopper is a rod-shaped mechanism that initiates front-rear movement at the same time as the
rotation mechanism part executes front-rear movement. Upon opening the cap, the RackPack stopper prevents the
rack pack from rising.
• Stroke: 58.2mm

V 1.6 – April 1999 1 Chapter 4.4.3


RD/Hitachi Elecsys 2010 Service Manual

4.4.3-4 Explanatory Diagram

4.4.3-5 Parts List


Pos. No. Part Name Part No.
1 CAP O/C Cord assembly 741-4257
2 J532 Cord assembly 741-4255
3 Speed Reduction Control H0051 741-1262
4 Pulley SSX 741-1121
5 Timing Belt 741-1267
6 Photo Interrupter GPIA34LC J339165

4.4.3-6 Disassembly and Assembly Procedures


1. Removing and Mounting of Unit
If removing from the front cover.
Removal:
a) Remove the following covers:
• Rear cover
• R. lid
• Y cover
• Front cover assembly
• Table cover R
• Table cover L
b) Take out R. disk.
• See 4.4.2.
c) Dismount the unit with base sheet assembly.

Chapter 4.4.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

• Unscrew the two (2) M4 x 6 screws.


d) Remove the unit from the base sheet assembly.
• Unscrew the two (2) M4 x 6 screws.
Mounting
Mount the units by re-installing the parts removed during the removal procedures (see above) in the reverse
order.
If removing from the rear cover
Removal
a) Remove the rear cover.
b) Dismount the unit.
• Unscrew the M4 x 6 screw.
Mounting
Assemble the units by re-installing the parts removed during the removal procedures (see above) in the reverse
order.
2. Disassembly and Assembly of Units
A. Rotation mechanism
B. Front-rear mechanism
A. Rotation mechanism (link mechanism assembly)
Disassembly
a) Unscrew the M4 x 6 screws that fix the clamp on the plug (J532) side.
b) Remove the tie wraps that fix the CAP O/C cord assembly and the J532 cord assembly.
c) Take out the P532 socket.
d) Dismount the photo interrupter (PI033) and the cord together.
• You can replace the photo interrupter (PI033) by removing the connector.
e) Detach the E-type fix ring 4 located at the tip of the rear part of the RackPack stopper assembly.
f) Pull out the RackPack stopper assembly. Do not misplace the dumping spring.
g) Detach the E-type fix ring 6 attached to the inside of the cap open/close mechanism base from
the two (2) slick shafts.
h) Support the link mechanism assembly and pull out the two (2) slick shafts.
i) Remove the timing belt from the motor bracket.
j) Unscrew the two (2) M4 x 4 point screws that fix the link pin assembly.
k) Pull out the J532 cord assembly.
• Unscrew four (4) M4 x 40 screws.
l) Remove speed reduction control H0051.
Assembly
a) Assemble the unit by re-installing the parts removed during the disassembly procedure (see above) in
the reverse order.
b) Fix the link assembly by adjusting bearing to fork link assembly.

V 1.6 – April 1999 3 Chapter 4.4.3


RD/Hitachi Elecsys 2010 Service Manual

B. Front-Rear Mechanism
Disassembly
a) Unscrew the two (2) M4 x 6 screws that fix the pulley base.
b) Remove the timing belt from the motor bracket.
c) Detach one (1) E-type fix ring 4 from the pulley shaft (See Figure**), and remove pulley S5M and timing
belt.
d) Remove the photo interrupters (PI031, PI032) and the cord together.
• You can replace the photo Interrupters (PI031, PI032) by removing the connector.
e) Unplug plugs (J530, J531) from the cap open/close mechanism base.
f) Unscrew the two (2) M4 x 6 screws that fix the clamp.
g) Take out the tie wraps that fix the CAP O/C cord assembly and the J532 cord assembly.
h) Remove P532 socket.
i) Remove the photo interrupter (PI033) and the cord together.
• You can replace the photo interrupter (PI033) by removing the connector.
j) Pull out the cord from the clamp that fixes the cord.
k) Unscrew the two (2) M4 x 16 screws that fix stepping motor KH56.
l) Unscrew two (2) M4 x 4 W point screws, and remove pulley S5M.

- Location of PCP

Chapter 4.4.3 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.4 Beads Mixer Mechanism

4.4.4-1 Overview
The beads mixer mechanism is a mechanism that stirs the beads inside the reagent rack pack immediately before the
pipetting of the reagent.

4.4.4-2 Location
See Chapter 4.2.

4.4.4.3 Functional Details


The beads mixer mechanism consists of the following components:
• Stirrer head vertical movement mechanism
• Stirrer head rotating mechanism
• Stirring paddle rotating mechanism

1) Stirrer Head Vertical Movement Mechanism


The Stirrer Head Vertical Movement Mechanism moves the stirring paddle up and down over the RackPack with its
cap open and over the wash bath. The stirrer head that supports the stirring paddle and the vertical movement
mechanism are vertically connected with an arm pipe. A nut holder and slide guide that are installed on the inner
and outer rings of the ball bearings are installed in the vertical movement mechanism. A spline nut is inserted in the
nut holder. The slide guide and the nut holder shift up and down guided by the spline shaft and guide shaft; the slide
guide stops the rotation and the vertical movement, and the nut holder controls the rotation triggered by the rotation
of the spline shaft and makes vertical movement.
Pulleys are positioned above and below the moving parts keeping a sufficient axle distance from the stirring paddle
so that they will not contact with each other when the stirring paddle makes strokes. The slide guide, which is
hooked up to the timing belt, is moved vertically, driven by the stepping motor.
• Slow down rate 1:1
• Motor step angle 0.9°/step
• Shift range 0.1 mm/step

2) Stirrer Head Rotating Mechanism


A nut holder is fixed on the inner ring of the ball bearings and a slide guide on the outer ring. An arm pipe that
secures the stirrer head is fixed to the nut holder. The ball bearings guide the arm pipe and nut holder to swing
together within a range limited by the stopper that is installed on the slide guide.
Driven by the stepping motor, the moving parts cause rotation of the pulley that is attached to the bottom of the
spline shaft. The rotating force is conveyed to the pulley via the timing belt.
• Slow down rate 1:1
• Motor stepping angle 0.45°/step
• Shift range 0.235 mm/step

V 1.6 – April 1999 1 Chapter 4.4.4


RD/Hitachi Elecsys 2010 Service Manual

3) Stirring Paddle Rotating Mechanism


The stirring paddle rotating mechanism is driven by a DC motor and its pulley causes the rotation of the pulley that
is attached to one end of the stirring paddle. The rotating force is conveyed to the rotation pulley via the rectangular
elastic belt connected to it.
• Slow down rate 1:1
• Applied voltage 4.8 V (adjustable)
• Rotation 2050 ± 100 rpm in air
2000 ± 100 rpm in liquid (refer to Chapter 5.3.8 for details)

HOME PCP
U/D PCP
END PCP

26

Chapter 4.4.4 2 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.4-3 Parts List

Pos. No. Part Name Part No.


1 Mixing Frame 741-1220
2 Slide Guide 741-1221
3 Nut Holder 741-1222
4 Arm Pipe 741-0576
5 O Ring 741-1463
6 Bearings 741-1244
7 Ball Spline Shaft 741-1239
8 Spline Nut 741-1239
9 Timing Belt 741-1243
10 Spline Shaft Pulley 741-0549
11 Motor Z 741-0603
12 Motor M 741-0603
13 Timing Belt 741-1338
14 Arm Head 741-1227
15 Head Cover 741-1228
16 Pulley 741-1461
17 Shaft 741-1234
18 Bearings L111270
19 Joint 741-1236
20 Mixing Belt S 741-2244
21 Motor 741-0593
22 Motor Plate 741-0593
23 Stirring Paddle 741-0934
24 W Point Screw M7311021
25 E Ring M883003
26 Cable set mixer* 741-4303
*Refer to Chapter 10, Maintenance

V 1.6 – April 1999 3 Chapter 4.4.4


RD/Hitachi Elecsys 2010 Service Manual

4.4.4-4 Disassembly and Assembly Procedures

Removing the Beads Mixer Unit


First remove the reagent disk mechanism (see Chapter 4.4.2.6). After removing the reagent disk, unscrew three (3)
screws, two (2) connectors (P540 and P541), and one (1) grounding terminal set screw to remove the beads mixer
unit from the main unit base.

Disassembly and Assembly of the Beads Mixer Unit


• Stirrer head vertical movement / rotating mechanism
• Moving parts
• Stirring arm head

1) Stirrer Head Vertical Movement / Rotating Mechanism


Disassembly Procedure
a) Remove the stirrer arm head from the arm pipe.
• Take out the head cover and pull out the DC motor wiring connector pin inside.
• Unscrew two (2) W point screws on the side of the stirrer arm head.
b) Pull out the guide shaft.
• Remove two (2) E rings.
c) Remove the mechanism that is installed in the spline hut and the ball spline shaft together.
• Remove two (2) E rings.
• Unscrew two (2) W point screws on the timing pulley.
• Unhook the belt off the belt hook of the slide guide.
• Lift the spline shaft with the bearings on its top by about 20 mm and remove the spline shaft from the
timing pulley.
• Remove the spline shaft and spline nut mechanism by pulling them downward. Note: Be careful not to pull
the spline nut mechanism off the shaft.
d) Remove the slide guide.
• Remove the C ring.
e) Remove the nut holder.
• Remove the four (4) screws from the spline nut.
f) Remove the lead wire and grounding wire from the DC motor.
• To remove the lead wire from the DC motor, disconnect the connector terminal from connector J541 and
pull the wire through the arm pipe.
• To remove the grounding wire, remove the screw from the terminal attached to the hut holder and remove
the wire from the O ring.
Assembly Procedure
Assemble the mechanism by re-installing the parts removed during the disassembly procedure (see above) in the
reverse order.

Chapter 4.4.4 4 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2) Moving Parts (Vertical, Rotating)


Disassembly Procedure
a) Remove the stepping motor.
• Remove the two (2) screws.
b) Remove the timing belt.
Assembly Procedure
Assemble the moving parts by re-installing the parts removed during the disassembly procedure (see above) in the
reverse order.
Adjusting the Belt Tension
a) Adjust the belt by sliding the stepping motor (see Figure 2, Adjustment of Belt Tension).

3) Stirrer Arm Head


Disassembly Procedure
a) Remove the stirrer belt (a rectangular elastic belt) from the pulley.
b) Remove the mixing motor assembly.
• Unscrew the two screws that secure the motor plate.
c) Remove the stirring paddle.
• Loosen the bottom parts of the two W point screws of the joint.
d) Pull out the stirrer pulley and shaft from the bearings.
• Loosen the top parts of the two W point screws of the joint and remove them.
• Remove the E ring.
Assembly Procedure
Assemble the stirrer arm head by re-installing the parts removed during the disassembly procedure (see above) in the
reverse order.

V 1.6 – April 1999 5 Chapter 4.4.4


RD/Hitachi Elecsys 2010 Service Manual

- Location of PCP

Chapter 4.4.4 6 V 1.4 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.5 Pipetter Mechanism

4.4.5-1 Overview
The pipetter mechanism is a mechanism that picks up disposable tips and pipettes sample, calibrator, reagent (beads,
R1, R2 and diluent, etc.) into the reaction vessel by means of an X-Z moving mechanism.
Note
This part has been modified Å history label: BC

Field retrofit: OSK 7.0


Implemented in instrument production from serial No. 0804-01 onwards.

Please also refer to Chapter 4.8, Instrument History, for details.

4.4.5-2 Location
See Chapter 4.2.

4.4.5.3 Functional Details


The beads mixer mechanism consists of the following components:
• X-Axis movement mechanism
• Z-Axis movement mechanism
• Tip/Vessel buffer
• Pressure (clot) sensor

1) X-Axis Movement Mechanism


The X-axis movement mechanism moves the pipetter probe to each sampling position and replaces the disposable
tip. The X-axis movement mechanism drives Z-axis mechanism that is mounted on the timing belt with a stepping
motor.

2) Z-Axis Movement Mechanism


The Z-axis movement mechanism moves the pipetter probe and disposable tip to each sampling height position, and
drives the nozzle head that is mounted on the timing belt with a stepping motor via the LM guide.

3) Tip/Vessel Buffer
• The tip/vessel buffer is the area where the gripper places the disposable tips and the reaction vessels so that the
pipetter probe has access to them.
• There are sensors in the first two positions to detect the presence of a tip; the gripper mechanism also checks the
tip and vessel placement
• The tip eject position is at the edge of tip/vessel buffer.

4) Pressure (Clot) Sensor


This detects clots in sample, calibrator, reagent or diluent during piping by monitoring pressure changes inside the
tube.

V 1.6- April 1999 1 Chapter 4.4.5


RD/Hitachi Elecsys 2010 Service Manual

4.4.5-4 Explanatory Diagram U/D PCP


Z Abnormal PCP

END PCP

HOME PCP

Tip Pos.1 PCP


Tip Pos.2 PCP

Chapter 4.4.5 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.5-5 Parts List


Pos. No. Part Name Part No.
1 FPC Cable (P) Assembly 741-4503
2 X Motor Assembly 741-4244
3 P557 Cord Assembly 741-4247
4 LLD-P3 PCB 741-5048
5 Timing Belt P (X) 741-1062
6 Timing Belt P (Z) 741-1063
7 P Probe Assembly 741-0931
8 DISTPA PI Assembly 741-5045
9 Photo - Interrupter GP1A34LC (X) J339165
10 Photo - Interrupter GP1A34LC(Z) J339165
1 Tube 510 Assembly 741 1778
12 Tube 465 Assembly 741-1775
13 Sensor PMS-1 741-1043
14 J559 Cord Assembly 741-4318

4.4.5-6 Disassembly and Assembly Procedures


1) Removing the Pipetter Mechanism
- Remove the rear cover.
- Remove cover Y from gripper.
- Remove the reagent disk cover.
- Remove the table cover L.
- Remove the front cover.
- Remove the connector of the pressure sensor.
- Remove the syringe tube of pressure detecting part.
- Unscrew the screw fixing the pipetter mechanism.

2) Disassembly and Assembly of each Unit

A. X-axis movement mechanism


B. Z-axis movement mechanism
C. FPC cable
D. Tube
E. Photo interrupter
F. Pressure (clot) sensor
G. Tip/vessel buffer

V 1.6- April 1999 3 Chapter 4.4.5


RD/Hitachi Elecsys 2010 Service Manual

A. X-Axis Movement Mechanism - - - - - - - Replacement of Motor and Timing Belt


Disassembly Procedure
• Remove the fixing screw which is located at the right side of center cover.
• Remove the motor bracket and X pulley from P side base.
• Remove the timing belt.
Assembly Procedure
• Assemble in reverse order of disassembly procedure (see above).
• Adjust the timing belt tension.
Tension : Push middle of the timing belt with a vertical force of 2±0.5 N, then adjust pulley position by
loosening the X pulley screw as shown in the diagram below.

B. Z-Axis Movement Mechanism ------- Replacement of Motor and Timing Belt.


Disassembly Procedure
• Remove the P carrier cover .
• Remove the Z-axis stepping motor.
Assembly Procedure
•Adjust the timing belt tension.
Tension : Push middle of the timing belt with a vertical force of 1.5±0.3 N, then adjust motor position by
loosening the motor fixing screw as shown in the diagram below.

Chapter 4.4.5 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

C. FPC Cable
Disassembly Procedure
• Remove the PK cover.
• Remove the FPC cable from PCB.
• Pull out the FPC cable from the Z-axis movement unit.
• Remove the P arm cover.
• Pull out FPC holder.
• Remove PCB from the P arm, and pull out the FPC cable from the PCB.
Assembly Procedure
• Assemble in reverse order of disassembly procedure (see above).

D. Tube (L1=465, L2=510)


Disassembly Procedure for L1
• Remove the P arm cover.
• Disconnect the tube nipple from the probe.
Assembly Procedure
• Attach the tube nipple to the probe. (tightening torque is 2.5 kgf⋅cm).
• Tubing as original.
• Confirm that P arm moves smoothly without catching.

Disassembly Procedure for L2


• Remove P plate.
• Cut the tie-wrap tube clamping.
• Disconnect the tube nipple the tube joint.
Assembly Procedure
• Attach the tube nipple to the tube joint.
• Fix the tube with tie-wrap.
• Move the Z-axis movement unit to the left and right and confirm that the tube does not come out
from between the tube guide and the rear cover.

E. Photo Interrupter (X Axis, Z Axis, Probe Abnormal Detection)


Disassembly Procedure for X-Axis Photo Interrupter
• Remove the bracket of the photo interrupter from left and right of pipetter mechanism side frame.
• Disconnect the connector.
• Remove the photo interrupter from bracket.

Assembly Procedure
• Assemble in reverse order of disassembly procedure (see above).

V 1.6- April 1999 5 Chapter 4.4.5


RD/Hitachi Elecsys 2010 Service Manual

Disassembly Procedure for Z-Axis Photo Interrupter


• Remove the photo interrupter from the bracket of the Z-axis movement unit, and pull out to the side.
Assembly Procedure
• Assemble in reverse order of disassembly procedure (see above).

Disassembly Procedure of Probe Abnormal Descent Photo Interrupter


• Refer to FPC cable disassembly procedure.
Assembling Procedure
• Refer to FPC Cable assembly procedure.

F. Pressure (Clot) Sensor (X Axis, Z Axis, Probe Abnormal Detection)


Disassembly Procedure
• Loosen the screw of the driver base.
• Remove the pressure sensor cable from ANG-EP PCB and the rear cover of the pipetter mechanism.
• Remove the rear cover of the pipetter mechanism.
• Disconnect the pressure sensor from the tube joint, and put cap or cover on the top.
Note: Do not touch the top of the screw part of the pressure sensor with your fingers.
Assembly Procedure
• Attach about 70 mm spiral tube onto the pressure sensor cable.
• Remove cap or cover from top of the pressure sensor.
• Put seal packing on the screw part of the pressure sensor, and attach to the tube joint.
• Mount the rear cover of the pipetter mechanism.
• Fix the spiral tube part of the pressure sensor cable taking care not to catch the cable in the open close
mechanism.
• Fix the pressure sensor cable to the rear cover.
• Connect the cable to ANG-EP PCB.
• Tighten the screw of the driver base.

Chapter 4.4.5 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.5-7 Procedure for exchanging TUBE 465

(1) TUBE 465

How to remove TUBE 465


1. Remove two (2) screws A from PR cover (refer to Fig. 2).
2. Move P carrier to the left end, and remove TUBE 465 from tube joint 2 (refer to Fig. 5).
3. Remove the P arm cover, and remove tube holder from both the P arm cover and the P arm internal cover (refer
to Fig. 7).
4. Remove TUBE 465 from P nozzle (refer to Fig. 7). Be careful not to lose the nozzle seal between the nipple and
the P nozzle.

How to attach TUBE 465


1. Insert TUBE 465 into the P nozzle. Make sure that there is a nozzle seal between TUBE 465 and the P nozzle.
Note that the torque of screwing the nipple should be 0.25 N•m.
2. Set the tube holder into both the P arm internal cover and the P arm cover, and attach the P arm cover.
3. Arrange TUBE 465 as shown in Fig. 6, and insert into tube joint 2 (refer to Fig. 7). Note that the torque of
screwing the nipple should be 0.25 N•m.
4. Attach screw A of the PR cover.
5. Make sure that the tube moves smoothly when the P arm is moved vertically.

(2) TUBE 510

How to remove TUBE 510


1. Remove the tube guide assembly (refer to Fig.1).
2. Remove two (2) screws A from the PR cover (refer to Fig. 2).
3. Move the P Carrier to the left end, and cut the two (2) tie wraps that fix TUBE 510.
4. Remove TUBE 510 from the tube joint (refer to Figs. 3 and 4).
5. Remove TUBE 510 from tube joint 2 (refer to Fig. 5).

How to attach TUBE 510


1. Insert TUBE 510 into both tube joint and tube joint 2. Note that the torque of screwing the nipple should be
0.25 N•m.
2. Fix TUBE 510 with two (2) tie wraps (Refer to Figs. 3, 4 and 5). Ensure that the direction of the nail of the tie
wrap is the same as in the figures. Be careful not to twist the tube.
3. Attach the tube guide assembly. Be careful not to nip the GNP line.
4. Attach screw A of the PR cover.

V 1.6 – April 1999 7 Chapter 4.4.5


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1 Pipetter Unit

Chapter 4.4.5 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Fig.2 Pipetter Unit Fig.3 Back

Fig.4 Tube 510 Fig.5 Tube Joint

Fig.6 TUBE 465 Fig.7 P Carrier left side

Chapter 4.4.5 9 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.6 Gripper Mechanism

4.4.6-1 Overview
The gripper mechanism consists of the following 3 components and transfers tips/vessels between the container
station, buffer station, and incubator.
1. Gripper --- transfers tips/vessels via X/Y/Z grip mechanism.
2. Container station --- can hold 3 tip containers and 3 vessel containers.
3. Incubation station --- There are 32 incubator stations and one sipping station on the heat block.
Note
This part has been modified Å history label: B

Field retrofit: OSK 7.0


Implemented in instrument production from serial No. 0802-51 onwards.

Please also refer to Chapter 4.8, Instrument History, for details.

4.4.6-2 Location
See Chapter 4.2.
4.4.6-3 Detailed Function
This unit consists of the following components:
• Base frame
• Y carriage
• X carriage
• Grip part
• Container station
• Incubator station

1) Base Frame
Base frame is fixed on the four (4) pillars that are secured to the main base. The carrier mechanisms such as the
Y carriage, container station, and incubator station, are attached to the base frame.

2) Y Carriage
The Y carriage contains the X carriage (mentioned below). It driven in the Y direction (back and forth movement)
and placed (at 0.25 mm/step) via the stepping motor and the pulley belt mechanism. The Y carriage is supported by
the following bearings:
• On the right side: two (2) linear bearings that are guided by a shaft
• On the left side: one (1) radial bearing that is guided by the channel.
A shielding plate on the right of the Y carriage passes via three (3) photo interrupters fixed on the base frame and
detects home position, rest position, and end position (the order starts from the front).

3) X Carriage
The X carriage contains the grip parts described below. It is driven in the X direction (left and right movement) and
placed (at 0.125 mm/step) via the stepping motor and the pulley belt mechanism. A shielding plate on right of the
X carriage passes via 3 photo interrupters on the right side of the Y Carriage and detects home position.

V 1.6 – April 1999 1 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

4) Grip Part
The grip part consists of the Z-driving part and the grip-driving part. The grip-driving part consists of a rack gear
driven in the Z direction (up and down shift) and placed (at 0.2 mm/step) via the stepping motor and the Z-drive part
of the rack/pinion mechanism. The grip-drive part is supported by a linear guide fixed to the X carriage and is pulled
up via a spring. A shielding plate secured at the upper side of the grip-drive part passes via 3 photo interrupters at
the upper side of the X carriage and detects home position.
The grip-drive part is driven to open/close via a cam rotated by a rotary solenoid and a pair of arms with a grip nail
positioned to catch the cam. The tip/vessel is gripped at the nail by the power of pull-spring attached to close a pair
of arms and is positioned on X & Y where the back arm is pushed by the cam. A shielding plate located at the tip of
the front arm passes via Photo Interrupter under the condition w/o tip/vessel and detects “None.” Also, a pair of
arms are supported and guided to up and down shift as well as holder which retains the arms above and below and
positioned to the lower edge by two (2) push-springs. If Grip-drive part is lowered to abnormal positions on XY,
the head part of tip/vessel halts the down movement of a grip nail, arms, and a holder. A shielding plate located at
the bottom side of Grip-drive part passes via Photo Interrupter secured to the holder and detects “Abnormal Down
Position.”

5) Container Station
The container station has a partition to hold three (3) tip containers and three (3) vessel containers and is positioned
at the base frame via two (2) pins located at the bottom side and secured by four (4) screws.

6) Incubator Station
Incubator Station consists of the heat block with thirty-two (32) storage holes for vessel incubation with one (1)
vessel storage hole sipping, heater, and thermistor. It is secured to the base frame by two (2) screws.

Chapter 4.4.6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.6-4 Explanatory Figures

Y HOME PCP

Y REST PCP

U/D PCP

X HOME PCP

Gripper Z Abnormal PCP

Finger Open/Close PCP

V 1.6 – April 1999 3 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

Chapter 4.4.6 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.6-5 Parts List

Position Short Part name Material number Part number


No. Name Comment
1 Transport assy 1804740001 741-0120
2 PM062 Pulse motor Y assy 1807501001 741-4319
Motor Y assy; motor & cable &
pully & dumper
3 PI063 PCB ASSY DET-A 1709259001 741-5016
Y-HP; PI 063
4 PI064 PCB ASSY DET-B 1709267001 741-5017
PI065 Y-EP-RP; PI 064/65
5 DIST TV Board Assembly 741-5012
6 X Motor Assembly with 741-4320
PM061 PULSE MOTOR KH42JM2- 1709461001 K591137
011
Motor C assy, motor x-move
7 X Motor Cover 741-1151
8 X Motor Holder 741-1139
9 PM063 Pulse motor PFC25-4804 assy 1709135001 741-4321
Gripper-Z; UP DOWN PF25;
motor
10 Z Cover 741-1159
11 Carrier Z assy / Blind plate 1707779001 741-0123 / 741-1154
12 SOL Rotary solenoid 2ER45-33 assy 1709143001 741-4322
13
14 FPC-C1 FPC CABLE (C 1) ASSY 1709151001 741-4323
From Dist-TVA to Gripper-Z
15 FPC-C2 FPC CABLE (C 2) ASSY 1709160001 741-4324
From Dist-TVA to carrier x-
motor
16 FPC-C11 FPC CABLE (C11) ASSY 1709178001 741-4325
Gripper-Z; open/close PI068;
Abn. PI067
17 FPC-C21 FPC CABLE (C21) ASSY 1709186001 741-4326
Gripper-Z; UP DOWN PF25;
PI066
18 Heater I Assembly 741-0583
19 Thermistor I Assembly 741-0582
Belt timing C(X) 1708406001 741-1143
Gripper X-belt
Belt timing C(Y) 1708376001 741-1124
Gripper Y-belt
Sensor
TLP830 PCB ASSY DETECT 3 1709437001 J339168
TLP830
Signal photo coupler used in
Gripper assy; see list of
Sensors SM chapter 4.3.2
Tool gripper adjustment 1802941001 741-1471
Gripper sensor tool 1807552001 741-2022
Tool transport module 1909967001 741-2154
adjustment
For automatic adjust

V 1.6 – April 1999 5 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

4.4.6-6 Disassembly and Assembly Procedures


Note:
• Do not damage the FPC cable, handle with care.
• When removing the FPC cable from the connector, move the slide lock of the connector towards the cable and
take out the cable.
• When mounting the FPC cable, mount it in the right direction and lock it.
• When peeling double-sided tape from the FPC cable, hold the cable so that no extra tension is placed on the
corner and peel slowly.

Removing the Units


Remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
• Table cover R
• Sipper front cover
• Container station
• S guide plate/board cover (at the right side of solid waste)
• Unscrew four (4) screws and four (4) connectors to remove the unit from the main base pillars.
• Assemble the units by re-installing the units removed during the disassembly procedure (see above) in the
reverse order.
• However, position-teaching adjustment is required after assembly. See Adjustment Operation.

Chapter 4.4.6 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Disassembly and Assembly of the Units


A. Y motor assembly
B. P563, P564 cord assembly (Y-axis photo interrupter board)
C. DIST-TV board assembly
D. X motor assembly
E. Z motor assembly
F. Solenoid assembly
G. FPC cable C1, C2, C11, C21 assemblies (including X axis, Z axis, and photo interrupter at grip).
H. X carriage assembly
I. Heater I assembly (including thermostat).
J. Thermistor I assembly

A. Y Motor Assembly
Disassembly Procedure
a) Remove the Y motor.
• Unscrew two (2) screws.
b) Pull out cords.
• Remove two (2) clamps, FPC holder, FPC connector, DIST-TV board connector.
Assembly:
• Assemble the motor by re-installing the parts removed during the disassembly procedure (see above) in
the reverse order.
• Fix the belt at the position where the tension of the belt satisfies the conditions shown in the following
figure.
• The cable should be straight.

Pull with 27 ± 3.0 N


Y Motor Assembly

B. P563, P564 Cord Assembly (Photo Interrupter Board for Y Axis)


Disassembly
a) Remove DET-A (Y-HP), DET-B (Y-RP/EP) board.
• Unscrew two (2) screws from each.
• b) Pull out the cord.
• Release four (4) tie wraps, three (3) clamps.
• Unscrew the DIST-TV board connector.

V 1.6 – April 1999 7 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

Assembly
• Assemble the cord assembly by re-installing the parts removed during the disassembly procedure (see
above) in the reverse order.

C. DIST-TVA Board Assembly


Disassembly
a) Remove the DIST-TVA board assembly
• Unscrew two (2) screws and five (5) connectors.
Assembly
• Assemble the DIST-TVA board assembly by re-installing the parts removed during the disassembly
procedure (see above) in the reverse order.

D. X Motor Assembly
Disassembly
a) Take out the X motor cover.
• Unscrew two (2) screws.
b) Remove the X motor holder.
• Unscrew two (2) screws.
Assembly
• Assemble the X motor assembly by re-installing the parts removed during the disassembly procedure
(see above) in the reverse order.
• Fix the belt at the position where the belt tension satisfies the following conditions.

10 mm X Motor Assembly
4 ± 0.25 N(400±25gf)

E. Z Motor Assembly
Disassembly
a) Take out the Z cover.
• Unscrew two (2) screws.
• b) Take out blind plate.
• Unscrew two (2) screws.
• c) Remove the Z motor assembly.
• Unscrew two (2) screws and a connector.

Chapter 4.4.6 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Assembly
• Assemble the Z motor assembly by re-installing the parts removed during the disassembly procedure
(see above) in the reverse order.
• Fix the Z motor and the opponent rack where backlash of the rack gear and pinion of the motor is 0.1 ~
0.2 mm.
• Hold the pinion with fingers, confirm the backlash.

F. Solenoid Assembly
Disassembly
a) Take out the Z cover .
• Unscrew two (2) screws.
b) Remove lead wire from the solenoid.
• Release two (2) tie wraps and two (2) ‘1P’ connectors.
c) Remove grip/trouble detect board of FPC cable C11 assembly.
• Unscrew two (2) screws.
d) Dismount grip-drive assembly.
• Unscrew two (2) screws.
• Unhook lower hook of spring.
e) Rotate half and remove solenoid assembly.
• Unscrew two (2) nuts.
Assembly
• Assemble the solenoid assembly by re-installing the parts removed during the disassembly procedure
(see above) in the reverse order.
• Fix grip/trouble detect board at the position where the shielding plate is centered in photo interrupter.

G. FPC cable C1, C2, C11, C21 assemblies (including X axis, Z axis, and photo interrupter at grip. See Handling
Note for FPC Cable).
Disassembly
a) Take out the X motor cover.
• Unscrew two (2) screws.
b) Take out the X Cover
• Unscrew two (2) screws.
c) Take out the Z Cover
• Unscrew two (2) screws.
d) Remove the cable (Y driving part) between the Y carriage and the DIST-TV board.
• Remove two (2) FPC holders, two (2) board connectors, and tape-glued part.
e) Dismount the X motor connector board
• Unscrew two (2) screws and a connector.
• Release tie wrap.
• Remove a board connector and tape-glued part.

V 1.6 – April 1999 9 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

f) Remove the X motor holder.


• Unscrew two (2) screws.
• the See section on X motor assembly.
g) Remove FPC holders located at the upper right side of Y carriage.
• Unscrew four (4) screws.
h) Dismount the relay connector board.
• Unscrew each screw and a connector.
• Then remove FPC cable C1, C2 assembly.
i) Remove the cable (X-driving part) between relay connector and X carriage.
• Release 2 saucer screws and FPC holder fixtures,.
• Pull out the cable.
j) Take out the FPC holder at the upper part of the Z motor.
• Unscrew one (1) screw.
k) Dismount the Z motor connector board.
• Unscrew two (2) screws.
l) Remove the Z-HP photo interrupter board.
• Unscrew one (1) screw.
m) Take out the grip/trouble detect board.
• Unscrew two (2) screws.
• Release tie wrap and connector.
• See the section on solenoid assembly.
Assembly
• Assemble the FPC Cable C1, C2, C11, C21 Assemblies by re-installing the parts removed during the
disassembly procedure (see above) in the reverse order.

H. X Carriage Assembly
Disassembly
a) Take out the X cover.
• Unscrew two (2) screws.
b) Release FPC cable C11, C21 assemblies from relay connector and FPC holder
• Unscrew two (2) saucer screws.
• Pull out the cable.

Chapter 4.4.6 10 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

c) Remove X carriage assembly.


• Unscrew two (2) back-lower screws.
• Release gear of the belt.

Assembly
• Assemble the X carriage assembly by re-installing the parts removed during the disassembly procedure
(see above) in the reverse order.
• Fix the X carriage assembly on the tip container at the position where the left surface of the X carriage
assembly and the top side of the tip container satisfy the perpendicular angle 0.2 mm/100mm.

I. Heater I Assembly (including thermostat)


Disassembly
a) Dismount the incubator station from the base frame.
• Unscrew two (2) screws.
b) Remove the J570 connector.
• Take out tie wrap and clamps.
c) Remove heater and thermostat.
• Unscrew two(2) screws from each.
Assembly
• Assemble the heater I assembly by re-installing the parts removed during the disassembly procedure
(see above) in the reverse order.
• Apply sufficient Amicon epoxy resin to the heater part.

J. Thermistor I Assembly
Disassembly
a) Dismount the incubator station from the base frame.
• Unscrew two (2) screws.
b) Take out the J571 connector.
• Remove tie wrap and clamps.
c) Remove the heat block from the base.
• Unscrew three (3) bottom screws.
d) Peel off insulation packing.
e) Peel off aluminum tape.
f) Remove the thermistor I assembly.
Assembly
• Assemble the thermistor I assembly by re-installing the parts removed during the disassembly
procedure (see above) in the reverse order.
• Apply sufficient Amicon epoxy resin to the heater part.

V 1.6 – April 1999 11 Chapter 4.4.6


RD/Hitachi Elecsys 2010 Service Manual

- Detail of incubator

Chapter 4.4.6 12 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.7 Sipper Mechanism

4.4.7-1 Overview
The sipper transports the probe that is connected to the syringe with tubes from one station to another via the
measuring cell.

4.4.7-2 Location
See Chapter 4.2.

4.4.7-3 Functional Details


The sipper unit consists of the following:
• Base Frame
• X Carriage
• Z Carriage

1) Base Frame
The base frame is fixed on the platform that is secured on the top part of the main unit base. The X carriage and
Z carriage are installed on the base frame.

2) X Carriage
The X carriage contains the Z carriage, which is explained below. The X carriage shifts horizontally at a speed of
0.3 mm/step to its position, and is driven by the stepping motor and pulley / belt mechanism. At its top, the
X carriage is held up by two linear bearings that are supported by the shaft, and at the bottom the X carriage is
supported by two radial bearings.
There are two photo interrupters on the base frame. The home position sensor is on the right and the end position
sensor is on the left (as viewed from the front of the 2010). The X carriage stops in six positions: CC2, AB2, CC1,
AB1, Washing Pos., and Sipping Pos. in a normal operation.

3) Z Carriage
The Z carriage shifts vertically at a speed of 0.1 mm/step (during the aspiration of the reaction agent at 0.025
mm/step) to its position, and is driven by the stepping motor and the pulley / belt mechanism. The Z carriage is
supported by the linear guide that is installed on the X carriage. The shielding plate that is installed on the right side
of the Z carriage passes the photo interrupter above the top of the X carriage and detects the home position. The
probe inside the Z carriage is moved vertically and is positioned to the bottom end by a spring. If the Z carriage
descends from an abnormal position, the mechanism interrupts the descent of the probe and the shielding plate
interrupts the beam from the photo interrupter that is installed on the Z carriage. This leads to an error, “Abnormal
Descending.”

V 1.6 – April 1999 1 Chapter 4.4.7


RD/Hitachi Elecsys 2010 Service Manual

4.4.7-4 Detailed Diagrams

U/D PCP

Z Abnormal PCP

HOME PCP

X END PCP

Chapter 4.4.7 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.7-5 Parts List


Pos. No. Part Name Part No.
1 X Carriage Assembly 741-0139
2 X Motor Assembly 741-4248*
3 Photo Interrupter GP1A34LC J339165
4 Front Cover 741-1440
5 FPC Holder 741-1409
6 Top Cover 741-1433
7 Z Motor Assembly 741-4251*
8 X Carriage Cover (R) 741-1482
9 X Carriage Cover (L) 741-1483
10 Photo Interrupter Holder 741-1474
11 Sipper Probe S1C 741-0933
12 Z Carriage Cover 741-1480
13 DIST-S Board Assembly 741-5011
14 FPC Cable S Assembly 741-4253
15 FPC Holder Z 741-1481
16 Z Carriage Base 741-1479
*Refer to Motor Reference List, Chapter 4.3.1

4.4.7-6 Disassembly and Assembly Procedures

Removing the Sipper Unit


First remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
Then remove the following parts from the sipper unit and take out the sipper from the main unit platform:
• Four screws
• One tube
• Three connectors
• One grounding wire
To reassemble the sipper unit, you can re-install the parts removed in the above procedure in the reverse order. Be
sure to position the unit so that the tip of the probe passes the center of the sipper position vessel and the reagent
container cap. Also, adjust its position by tapping, following the procedure in the adjustment procedure that is
described separately.

V 1.6 – April 1999 3 Chapter 4.4.7


RD/Hitachi Elecsys 2010 Service Manual

Disassembly and Assembly Procedures


A. X Motor Assembly & Photo Interrupter
B. Z Motor Assembly & Photo Interrupter
C. Probe Assembly
D. DIST-S PCB Assembly
E. FPC Cable S Assembly

A. X Motor Assembly and Photo Interrupter


Disassembly
1. Remove the front cover by unscrewing three (3) screws.
2. Remove the FPC holder by unscrewing three (3) screws.
3. Remove the top cover by unscrewing one (1) screw.
4. Remove the X motor assembly by removing two (2) screws and connector P585.
5. Remove the photo interrupter by removing the connector and pushing the hook on its back.
Assembly
Re-install all the parts removed in the disassembly procedure in the reverse order. When installing the X motor
assembly, secure the part at the position where the belt tension satisfies the specifications below.

2) Z motor assembly

5mm
1.5±0.3 N
10mm
3±0.5 N

1) X motor assembly

B. Z Motor Assembly and Photo Interrupter


Disassembly
1. Remove X carriage covers (R), (L) by unscrewing two (2) screws each.
2. Remove the Z motor assembly by removing two (2) screws, motor connector, and tie-wraps.
3. Remove the photo interrupter holder by removing two (2) screws.
4. Remove the photo interrupter by removing the connector and pushing the hook on its back.

Chapter 4.4.7 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Assembly
Re-install all the parts removed in the disassembly procedure in the reverse order. When re-installing the Z motor
assembly, be sure that the belt tension meets the specifications described in the figure above.

C. Probe Assembly
Disassembly
1. Remove the Z carriage cover by pushing the hook on the bottom.
2. Take out the probe assembly by removing the 1P connector.
Assembly
Re-install the parts removed in the disassembly procedure in the reverse order.

D. DIST-S Board Assembly


Disassembly
Remove the DIST-S PCB assembly by unscrewing by two (2) screws and four (4) connectors and then release the
sliding lock of the connector to the cable side, and taking out the DIST-S board.
Assembly
Re-install all the parts removed in the disassembly procedure in the reverse order.

E. FPC Cable 3 Assembly


Caution: Be careful not to damage the cable.
Disassembly
1. Remove the FPC holder by unscrewing three (3) screws.
2. Remove the top cover by unscrewing three (3) screws.
3. Release the sliding lock and disconnect the cable from the DIST-S board connector.
4. Remove the connector which side of Z motor cord.
5. Remove the holder from the relay board by unscrewing two (2) screws.
6. Remove the double-sided tape and the cable from the left side of the holder.
7. Remove the FPC holder of the Z carriage (by unscrewing one (1) screw) and take out the Z carriage.
8. Slide out the failure-detection photo interrupter board.
9. Remove the 1P connector from the Z carriage base by pushing it up from the bottom with tweezers.
Assembly
Re-install all the parts removed in the disassembly procedure in the reverse order. Make sure that none of the cables
are entangled.

V 1.6 – April 1999 5 Chapter 4.4.7


RD/Hitachi Elecsys 2010 Service Manual

4.4.8 System Reagent Mechanism

4.4.8-1 Overview
The system reagent mechanism is a unit that keeps the liquid temperature constant inside the AB and CC bottles.
The case of the system reagent mechanism has grooves for an AB bottle and a CC bottle. By setting an AB bottle
and a CC bottle, one at a time, it adjusts the case temperature by means of a Peltier temperature controller.

4.4.8-2 Location
See Chapter 4.2.

4.4.8-3 Functional Details


The System Reagent Mechanism consists of the following components:
• Bottle Heating Unit
• Case Heating Unit
• Thermostat

1) Bottle Heating Unit


The bottle heating unit is a die-cast product made of flat aluminum (5 mm thick). Its function is to keep the liquid
temperature inside the AB and CC bottles at 28 °C. This aluminum case detects the signals from the sipper probe
when the sipper probe detects the liquid level in the bottle, and is therefore insulated from other parts and the main
unit base.

2) Case Heating Unit


Insulating material is attached to the bottom and sides of the aluminum case and, in addition, the case is enclosed in
a steel case frame so that the bottles inside the case are not be subject to the ambient temperature. In order to secure
the thermostat, the case frame is installed on the main unit base and is fixed to the cooling unit holder. The case
frame is also used as a holder for the sipper probe wash bath.

3) Thermostat
A Peltier element thermostat is installed on the outside bottom of the aluminum case. A thermistor is installed in the
space between the case surface and the side of the case. It measures the difference between the ambient temperature
and the case temperature, and the thermostat regulates the case temperature.

V 1.6 – April 1999 1 Chapter 4.4.8


RD/Hitachi Elecsys 2010 Service Manual

4.4.8-4 Detailed Diagram

System Reagent
Presence/Absence
PCP

Temp. Control
Thermistor

4.4.8-5 Parts List


Pos. No. Part Name Part No.
1 Reagent Case 741-1379
2 Cooling Unit Holder 741-1371
3 Case Frame Assembly 741-0539
4 Case Cover Assembly 741-0540
5 Bush A 741-1382
6 Bush B 741-1383
7 Microcooler SR Assembly 741-0547
8 Thermistor Assembly 741-0548
9 Washer M874001
10 Photo Sensor 741-1385

Chapter 4.4.8 2 V 1.6 –April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.8-6 Disassembly and Assembly Procedures

Removing the System Reagent Unit


To remove the system reagent unit, first remove the following covers:
• Rear Cover
• Gripper Y Cover
• Front Cover
• SR Cover
Then, remove two (2) screws and three (3) connectors (P660, P661, and P662). Also, pull out the fixtures of the
cooling unit holder from the case table installed on the main unit base.

Disassembly and Assembly of the System Reagent Unit


Disassembly Procedure
a) Remove the steel plate around the case cover assembly and case frame assembly.
• Remove the sockets from connectors J660, J661, and J662.
• Remove the four (4) screws from each.
b) Turn the unit upside down.
c) Remove the thermostat.
• Remove the four (4) screws.
d) Remove the cooling unit holder.
Assembly Procedure
Assemble the system reagent unit by re-installing parts removed during the disassembly procedure (see above) in the
reverse order. When installing the thermostat, apply heat-conducting grease to the surface that is contact with the
aluminum case. Since the unit is installed through the cooling unit holder, install bush A, bush B, and washer in this
order as shown in the figure below:

V 1.6 – April 1999 3 Chapter 4.4.8


RD/Hitachi Elecsys 2010 Service Manual

4.4.9 Syringe Mechanism

4.4.9-1 Overview
The syringes consist of the two systems described below. The syringes transport liquid, driven by the pumping force
generated by the up and down movement of the plunger and by the movement of the probe of each system.
1. Pipetter Syringe (Left): Aspirates and pipettes specified amounts of the sample, reagent, and beads via the
pipetter probe and tube.
2. Sipper Syringe (Right): Aspirates specified amounts of the reaction mixture via the sipper probe, tube, and
measuring cell.

4.4.9-2 Location
See Chapter 4.2.

4.4.9-3 Functional Details


Each syringe consists of the following components:
• Base Frame
• Syringe Motor
• Flow Route Switch

1) Base Frame
The base frame is fixed to the main unit base. The syringe motor and the flow route switch are installed on the base
frame.

2) Syringe Motor
In the syringe motor, the slider that moves the syringe plunger moves in the vertical direction is driven by the
stepping motor and pulley / belt mechanism to a specified position. The slider is supported by two linear bearings
that are guided by the shaft. A shielding plate is installed on the back of the slider, and when the slit passes by the
photo interrupter that is located above it the home position is detected. On the slider is the plunger assembly, which
is supported by the sealing inside the sealing body, the O ring, and the syringe, mounted in this order. These parts are
secured at the top with a nut and connected with each other by tubing. The plunger assembly, O ring, and syringe are
different in the two syringe systems. The parts for the sipper syringe (on the right side) have larger diameters.

3) Flow Route Switch


The sipper syringe system is connected with pinch valves SV3 (at the measuring cell) and SV4 (at the liquid waste
container) by tubing.

V 1.6 – April 1999 1 Chapter 4.4.9


RD/Hitachi Elecsys 2010 Service Manual

4.4.9-4 Detailed Diagrams

P.Syringe U/D
PCP
S.Syringe U/D
PCP

4.4.9-5 Parts List


The parts for the pipetter syringe system are installed on the left side of the unit, those for the sipper syringe system
on the right side.
Pos. No. Part Name Part No.
1 Base Frame 741-1601
2 Syringe Motor Assembly 741-0301
3 Motor Assembly (Pip, PH265M) 741-0804
4 Motor Assembly (Sip, KH56KM2) 741-0806*
5 Photo Interrupter Assembly 741-0805
6 Syringe Plunger Assembly (Pip) 741-0801
7 Syringe Plunger Assembly (Sip) 741-0802
8 Taper Syringe (Pip) G 82 5045
9 Taper Syringe (Sip) 741-1313
10 Pinch Valve Assembly 741-0831
*Refer to Motor Reference List, Chapter 4.3.1.

Chapter 4.4.9 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.9-6 Disassembly and Assembly Procedures


Caution: Before removing the flow route tubing, prepare a beaker, a syringe, and a cloth wiper. Drain water from
the tubing, and wipe up any spillage.

Removing the Syringes


First remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
• Sipper FPC holder (secured with 3 screws)
• Sipper top cover (secured with 1 screw)
• Sipper bottom cover (secured with 2 screws)
Then, remove the three (3) screws, four (4) tubes (two small tubes, one small black tube, and one big tube), five (5)
connectors (P622, P591, P592, P593, J630), and finally remove the syringes from the main unit base.

Disassembly and Assembly of Syringes


A. Syringe Motor Assembly, Motor Assembly, Photo Interrupter Assembly
B. Syringe Plunger Assembly
C. Pinch Valve Assembly

A. Syringe Motor Assembly, Motor Assembly, and Photo Interrupter Assembly


Disassembly Procedure
1. Remove the syringe motor assembly by unscrewing the upper and lower screws and removing the tube and lead
wire from the clamp.
2. Remove the motor assembly by unscrewing two (2) screws, removing the lead wire from the clamp, and
removing the connector and contact.
3. Remove the photo interrupter assembly by unscrewing one (1) screw, removing the lead wire from the clamp,
and removing the connector and contact.
Assembly Procedure
Reassemble the unit by following the disassembly procedure in the reverse order. Note: If you have loosened the
belt, readjust the belt tension by (1) loosening the tension bolt, (2) adjusting the tension axle phase, and (3) securing
the tension bolt again. (See the figure below.)

V 1.6 – April 1999 3 Chapter 4.4.9


RD/Hitachi Elecsys 2010 Service Manual

Adjusting the Timing Belt Tension


As shown in the above figure, press the gauge against the belt, adjust the tension axle until the gauge shaft is aligned
with the red marking, and tighten the tension bolt to secure the belt.

B. Syringe Plunger Assembly


Disassembly Procedure
1. Remove the two (2) tubes, one upper and one lower.
2. Loosen the clamp nut on the top of the unit.
3. Remove the syringe plunger assembly.
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure in the reverse order.

C. Pinch Valve Assembly


Disassembly Procedure
Remove pinch valves SV3 and SV4 by removing two (2) screws, a tube, a connector, and a contact.
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure in the reverse order.

Chapter 4.4.9 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.10 System Water Container (Float SW) Mechanism / Pump Assembly

4.4.10-1 Overview
The system water container contains system water for each wash bath and syringe. It consists of the following two
parts.
1. System Water Container (capacity: 3 liters)
2. Buffer Tank (capacity: 200 mL, with float SW)

4.4.10-2 Location
See Chapter 4.2.
4.4.10-3 Functional Details
The system water container consists of the following components:
• System Water Container
• Buffer Tank

1) System Water Container


The system water container has a handle and a cap on its upper part and a plug in its bottom part. It is filled with
system water and is connected to the piping when positioned as specified.

2) Buffer Tank
The buffer tank is installed on the main unit base. It has a guide for container installation and a plug that faces the
plug of the system water container. It also has a float SW and a degassing tube in its inside upper corner. A tube for
connection to the pump and a tube for connection to the valve are connected on the back of the tank.

V 1.6 – April 1999 1 Chapter 4.4.10


RD/Hitachi Elecsys 2010 Service Manual

4.4.10-4 Detailed Diagrams


Float SW 5
(System Water
Level Detection)

4.4.10-5 Parts List


Pos. No. Part Name Part No.
1 System Water Container 741-0302
2 Buffer Tank Assembly 741-0561
3 Ball Sealing Assembly 741-0560
4 Tank Lid 741-1502
5 Float SW Assembly 741-0563

Chapter 4.4.10 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.10-6 Disassembly and Assembly Procedures


Caution: Before removing the flow route tubing, prepare a beaker, a syringe, and a wiper. Drain water from
the tubing, and wipe up any spillage.

Removing the System Water Container Unit


First remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
Then remove the three (3) screws, three (3) tubes. Finally, remove the system water container unit from the main unit
base.

Disassembly and Assembly of the Unit


A. Ball sealing assembly of system water container
B. Buffer tank assembly, ball sealing assembly, and float SW

A. Ball sealing assembly of system water container


Disassembly Procedure
Remove the ball sealing assembly that is secured with a closed nut. When you remove the inner closed nut, you will
find a filter, a spring, ball, and an O ring installed over the nut and packing outside the nut.
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure (see above) in the reverse order.

B. Buffer tank assembly, ball sealing assembly, float SW


Disassembly Procedure
1. Remove the tank lid by unscrewing the seven (7) screws. When you turn the tank upside down and remove the
closed nut of the ball sealing assembly, you will find a filter, a spring, ball, and an O ring installed over the nut.
2. Remove the float SW that is secured with a nut.
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure (see above) in the reverse order.

4.4.10-7 Pump Assembly

1. Overview
The pump assembly supplies system water from the system water container to the wash baths and syringes via the
valve block.
Note
This part has been modified Å history label: O

Field retrofit: If necessary (refer also to Chapter 10, Maintenance)


Implemented in instrument production from serial No. 1057-01 onwards.

Please also refer to Chapter 4.8, Instrument History, and pages 4 and 5 in this chapter for details.

V 1.6 – April 1999 3 Chapter 4.4.10


RD/Hitachi Elecsys 2010 Service Manual

2. Functional Details
The pump assembly consists of the following components.
• Drain pipe
• DC magnet pump
• Valve block
For further details, refer to Chapter 3, Fluidics.

3. Detailed Diagram / Parts List

Chapter 4.4.10 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.11 Liquid Waste Container Mechanism

4.4.11-1 Overview
The liquid waste container consists of the following two units. It collects wash liquid and reaction waste.
1. Liquid waste container (capacity: 4 liters)
2. Container station (capacity: 3.5 liters, with fill level detector; also detects whether or not the container is
installed.)

4.4.11-2 Location
See Chapter 4.2.

4.4.11-3 Functional Details


The liquid waste container consists of the following components:
• Liquid waste container
• Container station

1) Liquid Waste Container


The liquid waste container has a handle and a cap on its upper part. Remove the cap and position the liquid waste
container in the specified position.

2) Container Station
The container is located in the inner station of the container station. The inner station is attached to the outer station
that is installed in the main unit base and is pushed up by a shaft on the back and by a spring in the front. A shielding
plate is installed in the inner station. This shielding plate is depressed as the waste liquid level increases. When it is
depressed, it passes the beam from the photo interrupter installed in the outer station and thus indicates when the
waste liquid container is full. A pressure plate with a shaft and coil spring is attached to the front of the inner station.
This pressure plate is installed so that it pushes in the container. A shielding plate is installed on one end of the
pressure plate. If a container is not installed, the pressure plate will cause the photo interrupter beam to come
through the shielding plate and the “no container” state is detected.

V 1.6 – April 1999 1 Chapter 4.4.11


RD/Hitachi Elecsys 2010 Service Manual

4.4.11-4 Detailed Diagrams

Waste Tank
Presence/Absence PCP

Waste Tank Full PCP

4.4.11-5 Parts List


Pos. No. Part Name Part No.
Liquid Waste Container 7411510
2 Container Station 7410565
3 Cord Assembly J631 7414310
4 Photo Interrupter GP1A34LC J339165
5 Pressure Plate Assembly 7411566
6 Inner Station 7411513
7 Shaft 7411526
8 Spring 7411523

Chapter 4.4.11 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.11-6 Disassembly and Assembly Procedures

Removing the Liquid Waste Container Unit


First remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
Then remove the three (3) screws, and then the liquid waste container unit from the main unit base.

Disassembly and Assembly of the Unit


A. Photo Interrupter
B. Inner Station and Pressure Plate Assembly

A. Photo Interrupter
Disassembly Procedure
1. Remove the cord assembly (J631).
2. Remove the photo interrupter (P1132: container detector; P1133: fill level detector)
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure (see above) in the reverse order.

B. Inner Station and Pressure Plate Assembly


Disassembly Procedure
1. Remove the pressure plate assembly by unscrewing two (2) screws.
2. Remove the inner station, a shaft, and a spring. Remove the E ring to remove the shaft.
Assembly Procedure
Reassemble the unit by re-installing the parts removed in the disassembly procedure (see above) in the reverse order.

4.4.11-7 .Adjustment Procedure regarding Liquid Waste Full after few cycles during installation

Check that Waste Full Error takes place correctly as follows;

- Check Procedure

(1) Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.

(2) Fill with distilled water to a depth of 115 mm from the bottom of waste tank (equal to 3.4 liters).

(3) Make sure that a Waste Full Error is not shown in Reset status.

If a Waste Full Error is shown, adjust according to the adjustment procedure.

(4) Add a further 200 ml of distilled water to the tank.

(5) Make sure that a Waste Full Error is shown in Reset status.

If a Waste Full Error is shown, the setting is OK.

If not, adjust according to the adjustment procedure.

V 1.6 – April 1999 3 Chapter 4.4.11


RD/Hitachi Elecsys 2010 Service Manual

- Adjustment Procedure

(1) Remove the rear cover and front cover.

(2) Switch on the instrument.

(3) Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.

(4) Fill with distilled water to a depth of 120mm from the bottom of the waste tank (equal to 3.5 liters).

(5) Unfasten the hex nut shown in Fig. 4.4.11-1.

Fig. 4.4.11-1 Side view of liquid waste container

(6) Find a border point where the voltage changes between high (ca. 5V) and low (ca. 0V) by turning the minus
screw located at the top of support L(P/N741-1527) with a minus screwdriver. Measure the voltage between Pin #5
and Pin #6 on connector J631.

(7) Fasten the hex nut at the border point.

(8) Check the function again according to the check procedure.

Chapter 4.4.11 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.12 Solid Waste Mechanism

4..4.12-1 Overview
The solid waste mechanism is designed to efficiently collect tips and vessels used by the analyzer. It levels the used
tips and vessels collected by vibrating the waste box periodically.

4.4.12-2 Location
See Chapter 4.2.
4.4.12-3 Functional Details
The mechanism of this unit is shown below.
1. Mechanism of Solid Waste
The solid waste mechanism generates vibration towards the long dimension of the waste box set in the unit. The
crank mechanism consists of the assembly, lever and roller bearing that are fixed to the stepping motor and motor
shaft as well as the drive tray that holds a tray to settle waste in the box. The solid waste mechanism generates
straight-line forward & reverse movement referenced to the long dimension.
Step angle 1.8°/step

Stroke 30 mm

4.4.12-4 Detailed Diagrams

Tray Presence/Absence PCP

HOME PCP

V 1.6 – April 1999 1 Chapter 4.4.12


RD/Hitachi Elecsys 2010 Service Manual

4.4.12-5 Parts List


Pos. No. Part Name Part No.
1 Assembly, Motor S 741-0581*
2 Assembly, J641 Cord 741-4311
3 SW Base 741-1369
4 Photo Interrupter GP1A34LC J339165
5 Clamp CKS-05-L J839400
6 Clamp CKS-10-L J839402
7 Tie Wrap TY-23M J839050
8 Sensor Holder 741-1361
9 Assembly, Drive Tray 741-0534

*Refer to Motor Reference List, Chapter 4.3.1.

4.4.12-6 Procedures for Disassembly/Assembly


Removal of the unit
1. Confirm that the disposable tray assembly (waste box) is not left in the equipment. Remove if still present.
2. Remove the gripper of each cover (see 4.4.8.6).
3. Remove FDD base S, FDD base L, MC latch, FDD guard, and floppy disk.
4. Unscrew four (4) screws and two (2) connectors. Then remove the unit from the main base.

To assembly the unit re-install the parts removed during the removal procedure (see above) in the reverse order
(4~1). Position adjustment is not required.
Disassembly/Assembly of the Unit
A. Motor S assembly
B. J641 cord assembly
C. Photo Interrupter GP1A34LC

A. Motor S Assembly
Disassembly
a) Remove the motor.
• Unscrew four (4) screws.
b) Remove the motor S assembly.
• Release clamps in two (2) places.
Assembly
Assemble the motor S assembly by re-installing the parts removed during the disassembly procedure (see
above) in the reverse order.

Chapter 4.4.12 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

B. J641 Cord Assembly


Disassembly
a) Remove the sensor holder from SW base.
• Unscrew two (2) screws.
b) Remove the J641 cord assembly.
• Replace tie wraps in three (3) places, clamps in four (4) places
• Unscrew two (2) screws for sensor holder.
• Remove photointerrupter GP1A34LC connector.
Assembly
Assemble the J641 cord assembly by re-installing the parts removed during the disassembly procedure (see
above) in the reverse order.
C. Photo Interrupter GP1A34LC
Disassembly
a) Replace photo interrupter GPA.
• Release connector.
Assembly
Assemble photo interrupter GP1A43LC by re-installing the parts removed during the disassembly
procedure (see above) in the reverse order.

Disassembly 2 (without removing unit)


a) Confirm that the disposal tray assembly (waste box) is not left in the equipment. Remove if still present.
b) Dismount the container station of the gripper unit.
• Unscrew four (4) screws.
c) Move drive-tray forwards manually.
d) Remove photo interrupter GP1A34LC.
• Remove the connector of the J641 cord assembly.
Assembly 2
Assemble photo interrupter GP1A34LC by re-installing the parts removed during the disassembly
procedure (see above) in the reverse order.

V 1.6 – April 1999 3 Chapter 4.4.12


RD/Hitachi Elecsys 2010 Service Manual

4.4.13 Detection Unit


4.4.13.1 Overview
The detection unit of Elecsys 2010 has the following major components.
1) Photomultiplier and its housing
2) Circuit boards for PMT and amplifier
3) Peltier heat exchanger
4) Magnet driver
5) Measuring cell
6) Heat insulating casing
4.4.13.2 Location
See Chapter 4.2.
The figures below show the principal components and the parts in the
detection unit as each number.

Components
Pos. No. Component
1 PMT assembly
2 PMT HV circuit assembly
3 Peltier heat exchanger
4 Magnet driver
5 Amplifier assembly for PMT signals
6 Measuring cell

Parts
Pos. No. Part Name Part No.
7 Signal cable cord, P119 741-4232
8 Tube B for sipper 741-0820
9 PMT-HV record 741-1954
10 PMT-SHV PCB 741-5024
11 PMT holder 741-1805
12 PMT fixing plate 741-1803
13 Detection unit cover 741-0618
14 Detection unit casing 741-0617
15 Tube B for measuring cell 741-0822
16 Upper connectors 741-4314
17 Lower connectors 741-4317 and 741-4316
18 Service window cover 741-0619
19 MC lead wire connector included in 741-4317
20 Photomultiplier tube 741-1827

V 1.6 – April 1999 1 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 1 Detection unit cross-sectional view with slanted PMT housing

V 1.6 – April 1999 2 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 2 Details of Measuring Cell Mounting (PMT Holder) MC fixing

V 1.6 – April 1999 3 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 3 Details of Measuring Cell Mounting (PMT Holder) Support Fixing

V 1.6 – April 1999 4 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 4 Top view of detection unit

V 1.6 – April 1999 5 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 5 Rear view of detection unit

V 1.6 – April 1999 6 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

4.4.13.3 Measuring Cell


The measuring cell has 2 (two) separable components as shown in Fig. 6.
1) Cell body
2) Reference electrode (RE)

- Preparation of the Measuring Cell


• RE is originally covered with a cap. On use, it should be detached by unscrewing.
• Attach the RE into the cell body by screwing firmly.
• Connect the plug into the RE terminal.
• The ECL signals are obtained through PMMA window (see Fig. 6).
As the window tends to become dirty, be sure not to touch it with your bare fingers.

PMMA
Window
Cell Body

RE
(Reference Electrode)

Connector J610

Fig. 6 Assembled measuring cell

V 1.6 – April 1999 7 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

- Replacement of Measuring Cell


1) Make sure that the instrument is switched off.
2) Remove the lid of the detection unit by unscrewing the 2 (two) M3 screws located on the rear cover.
3) Remove the detection unit cover by unscrewing the 6 (six) M3 screws.
4) Detach the inlet/outlet tubings from the measuring cell by unfastening their nipples.
5) Detach connector J610 from connector P610.
6) Unfasten 2 (two) M3 screws.
7) Slide the measuring cell base forwards and then downwards.
8) Detach the measuring cell itself by unfastening 2 (two) M3 screws located on the base.
9) Replace the measuring cell by a new one.
10) Slide the measuring cell base upwards and then backwards into the detection unit.
11) Replace the 2 (two) M3 screws.
12) Replace the inlet/outlet tubings and the connector.
13) Replace the covers.
14) Switch the instrument on.
15) Refer to Chapter 2.3.9 for details concerning conditioning of the measuring cell.

- When to replace the measuring cell


1) The measuring cell should be replaced if the measuring cell position relative to the PMT and magnet is correct
and the BSR2 mean value is lower than an acceptable limit specified by RD/Hitachi
2) After six (6) months or 50,000 cycles if TSH values are out of the acceptable range as specified by RD/Hitachi.
3) If there is no mechanical/electrical trouble but the result of the Performance Check shows abnormal behavior
within the warranty term according to the specification between RD and Hitachi.

V 1.6 – April 1999 8 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

4.4.13.4 PMT (Photomultiplier Tube)


• The PMT in the Elecsys 2010 has the following specifications.
• The figures below show side views of the PMT and PMT socket.
• The PMT is very sensitive to environmental lighting and magnetic fields, and must be treated with great care.
Whenever you open the cover of the detection unit, be sure to avoid direct irradiation by light and sunshine.
• Be sure not to touch the window of the PMT with your bare fingers.

- Specification of PMT R1617-05

Description Specifications
Photosensitive window Head-on type
Photocathode material Multialkali
Spectral response range 300-850 nm
Peak wavelength 420 nm
Anode-to-cathode supply (Max.) 1250 Vdc
Anode-to-last dinode voltage (Max.) 250 Vdc
Average anode current 0.1 mA
Storing environmental temperature -80 ∼ +50°C
Cathode sensitivity (Sk) ≥120µA/lm
Anode sensitivity (Sp) ≥200 A/lm
Equivalent dark current (Sp=200A/lm) 5 nA
Red/white ratio (R/W) 150 X 10-3

V 1.6 – April 1999 9 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

20

Fig. 7 Side view of PMT

V 1.6 – April 1999 10 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

Fig. 7 Side view of PMT socket assembly

V 1.6 – April 1999 11 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

- Replacement of PMT
1) Make sure that the instrument is switched off.
2) Remove the lid of the detection unit by unscrewing the 2 (two) M3 screws located on the rear cover.
3) Remove the detection unit cover by unscrewing 6 (six) M3 screws.
4) Detach the inlet/outlet tubings from the measuring cell by unfastening their nipples.
5) Detach the connector J610 from the connector P610.
6) Unfasten 2 (two) M3 screws.
7) Slide the measuring cell base forwards and then downwards.
8) Detach the fixing frame from the PMT socket by unfastening the screw .
9) Detach the PMT holder with the PMT and the PMT socket.
10) Remove the PMT and the PMT socket from the PMT holder.
11) Remove the PMT from the PMT socket.
12) Insert a new PMT.
13) Attach the PMT, the PMT socket, and the PMT holder as before.
(Note) Make sure that the PMT window reaches the rubber cushion at the bottom of the PMT holder.
14) Attach the PMT holder to the measuring cell base.
(Note) Push the PMT socket tail lightly to ensure sufficient fixing f the PMT window, and
attach the fixing frame of the PMT socket by fastening the screw.
15) Slide the measuring cell base upwards and then backwards into the detection unit.
16) Replace the 2 (two) M3 screws.
17) Replace the inlet/outlet tubings and the connector.
18) Replace the covers.
19) Switch the instrument on.

(Caution)
• PMT replacement must be carried out in subdued lighting.
• The PMT window must be cleaned.
• Use clean gloves when you handle the PMT.
• Allow 1 (one) hour stabilization time.

V 1.6 – April 1999 12 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

4.4.13.5 Replacement of Sipper Tubing

1) Make sure that the instrument is switched off.


2) Remove the rear cover by unscrewing the 2 (two) M3 screws.
3) Remove the detection unit cover by unscrewing the 6 (six) M3 screws.
4) Detach the inlet/outlet tubings from the measuring cell by unfastening their nipples.
5) Detach the other side of the inlet/outlet tubings by unfastening their nipples.
6) Attach the new tubings firmly by fastening their nipples as before.

Caution
• In order to avoid liquid leakage from the nipples, the tubes must be inserted straight and firmly.
• Check that none of the nipple screws are damaged.

4.4.13.6 Replacement of Detection Unit

1) Make sure that the instrument is switched off.


2) Remove the rear cover by unscrewing the 2 (two) M3 screws.
3) Unfasten the four (4) screws locate at the feet of the detection unit itself.
4) Detach the inlet tubing from the sipper probe by unfastening the nipple.
5) Detach the outlet tubing from branch block located on the syringe unit
by unfastening the nipple.
6) Disconnect wires and cables attached to the outside connector.
7) Replace the detection unit by a new one.
8) Replace the four (4) screws.
9) Replace the inlet/outlet tubings and the connectors.

4.4.13.7 Housing
- Disassembly/ reassembly of detection unit
1) Disassembly
• Similar to the procedure described in 4.4.14.6.
• Each component will be separated during disassembly procedure.
2) Reassembly
• Follow the disassembly procedure in reverse.

V 1.6 – April 1999 13 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

- Casing
The detection unit is equipped with heat insulating casing for temperature control. White polymer foam sheets are
glued to the outer surface of the unit casing. Black polymer sheets are also applied around the unit cover and the
service window to shield from light. The entire casing must be replaced if the polymer sheets are damaged or come
off the casing over a wide area.

- PMT stabilization time


Following disassembly/reassembly, of the Detection Unit, one hour is needed for stabilization of the PMT,

V 1.6 – April 1999 14 Chapter 4.4.13


RD/Hitachi Elecsys 2010 Service Manual

4.4.14 Magnet Drive Mechanism

4.4.14.1 Overview
The magnet drive mechanism is used to position the magnet at the detection point of
the measuring cell and to take the magnet away from the cell.

4.4.14.2 Location
The magnet drive mechanism is located in the detection unit below the measuring cell.
See Chapter 4.2.

4.4.14.3 Functional Details


The magnet drive mechanism consists of the following components:
• Magnet Drive Mechanism
is driven by a stepping motor which rotates in 2W, 1-2 phase, bipolar microsteps, the magnet driving
mechanism rotates the arm fixed to the magnet by 90 ° from the home position to move it to and from
the detection point of the measuring cell.
• Step angle 0.225°/step
• Rotation angle 90 °

V 1.6 – April 1999 1 Chapter 4.4.14


RD/Hitachi Elecsys 2010 Service Manual

4.4.14.4 Detailed Diagram

Magnet HOME PCP

Fig.2

Chapter 4.4.14 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.14.5 Parts List


Pos. No. Part Name Part No.
1 Main Cover Assembly 741-0618
2 Service Cover Assembly 741-0619
3 L-AMP PCB 741-5018
4 Shield Case LOG 741-1808
5 Cell Holder 741-1838
6 PC Cover 741-1810
7 Photo multiplier Socket 741-1828
8 PC Base 741-1842
9 PC Base (2) 741-1843
10 a. P601 Cord Assembly 741-4315*
b. P601-1 Cord Assembly 741-4242**
11 Case Insulation Assembly 741-0617
12 Main Frame Assembly 741-0620
13 aP600 Cord Assembly 741-4314
14 Support Frame Assembly 741-0621
15 Cell Frame 741-1832
16 M2.6 Screw 604-1058
17 Locking Fixture HD-LNA J833361
18 MG Base Assembly 741-1351
19 Photo interrupter GP1A34LC J339165
20 J600 Cord Assembly 741-4316
21 PMT-SHV PCB 741-5024
22 Pipe Assembly (Heat Pipe) 741-0967
*Up to Serial No. 806-10
**From Serial No. 806-11 onwards

4.4.14.6 Assembly and Disassembly Procedure

Removing the Unit


1. Remove the rear cover.
2. Remove the detection unit from the main unit (base (00) assembly) by taking out three (3) nipples, three (3)
connectors, four (4) screws, and four (4) spacer DEs.
3. Reassemble the unit by re-installing the parts disassembled in steps 1 and 2 in the reverse order. Adjustment of
the position is not necessary.

V 1.6 – April 1999 3 Chapter 4.4.14


RD/Hitachi Elecsys 2010 Service Manual

Disassembly and Assembly of the Unit


• A. Magnet Drive Assembly
• A-1. J600 Cord Assembly
• A-2. Photo Interrupter (GP1A34LC)

A. Magnet Drive Assembly


Disassembly Procedure
1. Remove the main cover assembly by removing six (6) screws from it and then remove the service cover
assembly by removing four (4) screws from it.
2. Take out the L-AMP PI assembly together with the shield case LOG by removing the three (3) connectors and
one (1) screw.
3. Remove the cell holder, PC cover, and PMT-HV PI assembly in this order. (You need to remove three (3)
screws from the cell holder, one (1) screw from the PC cover, and four (4) screws and one (1) connector from
the PMT-HV PI assembly.)
4. Remove the PC base and PC base (2) by unscrewing two (2) screws from each.
5. Remove the P600 cord assembly by taking out two (2) M2.6 screws and one (1) cramp.
6. Remove the micro cooling unit and then the P601 cord assembly by unscrewing four (4) screws and two (2)
M2.6 screws.
7. Remove the four (4) screws (screw a) that secure the main frame assembly to the case insulation assembly.
8. Slide the main frame assembly, support frame, cell frame, and pipe assembly together with the lead wire of the
photo multiplier out of the case insulation assembly. (Unscrew two (2) M4 screws and two (2) M3 screws.) Be
careful not to expose the photomultiplier to light.
9. Remove the magnet drive assembly by unscrewing two (2) screws.
10. Remove the J600 cord assembly by removing two (2) locking fixtures, two (2) tie wraps, and one (1) screw.

Assembly Procedure
Reassemble the unit by re-installing the component removed during the disassembly procedure in the reverse order.
Note 1: When reassembling the unit, generously apply Amicon epoxy resin (F440079) to the bottom (b) of the micro
cooling unit. Also, thickly apply Amicon epoxy resin in groove (c) of the main frame where the pipe assembly is to
be mounted.
Note 2: After removing the magnet drive assembly from the unit, adjust the positions of the magnet drive and the
measuring cell position. Refer to Chapter 5.2.1, Replacement of Measuring Cell.

A-1. J600 Cord Assembly


Disassembly Procedure
Replace the J600 cord assembly.
Assembly Procedure
Re-install the parts removed in the disassembly procedure in the reverse order.

A-2. Photo Interrupter (GP1A34LC)


Disassembly Procedure
Replace the photo interrupter (GP1A34LC).
Assembly Procedure
Re-install the parts removed in the disassembly procedure in the reverse order.

Chapter 4.4.14 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.14.7 Adjustment Procedure for Magnet Position

1) Switch off the instrument.


2) Take out measuring cell from the cell plate as described above.
3) Attach the positioning tool to the cell plate in the same manner as for the measuring cell.
4) Loosen two (2) screws for magnet driver in rear part of cell plate.
5) Move magnet arm upwards and insert the magnet part of magnet arm in the hole of positioning tool.
6) Tighten the two (2) screws for magnet driver.
7) Take out the positioning tool.
8) Attach measuring cell to cell plate.
9) Follow the procedure for cell replacement and close the cover and lid of the detection unit.

V 1.6 – April 1999 5 Chapter 4.4.14


RD/Hitachi Elecsys 2010 Service Manual

4.4.15 Matrix BCR Mechanism

4.4.15.1 Overview
The matrix BCR mechanism is a unit that contains a rotating mechanism that is used for scanning bar-coded data
with a bar-code reader. The bar-code reader scans a bar code attached to a sample cup, a sample tube, or a reagent
rack pack, or scans a bar-code card that carries the information of these three in combination.
Note
This part has been modified Å history label: K

Field retrofit: Not necessary


Implemented in instrument production from serial No. 0945-01 onwards.

Please also refer to Chapter 4.8, Instrument History, and pages 3 and 4 in this chapter.

4.4.15.2 Location
See Chapter 4.2.

4.4.15.3 Functional Details


The matrix BCR mechanism consists of the following components:
• Rotating Unit
• Bar-code Reader
• Bar-code Card Holder

1) Rotating Unit
The rotating unit rotates and shifts the bar-code reader to the scanning point on either the sample disk or the reagent
disk. This unit conveys the movement of the stepping motor via a flat gear to the bar-code reader so that the bar-code
reader will rotate slowly when scanning a bar-code card.
• Slow Down Rate 1 : 8.438
• Motor Stepping Angle 0.225 °/step to 0.9 °/step

• Shifting Angle 0.027 °/step to 0.107 °/step

2) Bar-code Reader
The bar-code reader is installed onto a molded bracket at a gear fixed to the bracket with a screw. The gear controls
the rotation of the bar-code reader. The bracket is supported by a rotating axle which is inserted into ball bearings.

3) Bar-code Card Holder

The bar-code card holder supports the table cover L and also guides a card into the appropriate card position.

V 1.6 – April 1999 1 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

4.4.15.4 Detailed Diagrams

HOME PCP

Chapter 4.4.15 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 3 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

Chapter 4.4.15 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.15.5 Parts List


Pos. No. Part Name Part No.
1 BCR Base 741-1320
2 BCR Bracket 741-1321
3 Card Holder 741-1322
4 Motor 741-0600
5 Motor Gear 741-1323
6 BCR Axle 741-1324

V 1.6 – April 1999 5 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

4.4.15.6 Disassembly and Assembly Procedures

Removing the Matrix BCR Unit


Before removing the matrix BCR unit, remove the following covers:
• Rear cover
• Gripper Y cover
• Front cover
• R lid
• Table cover L
• Table cover R
• P plate assembly (at the front bottom of the pipetter unit)
Then, remove three (3) screws, two (2) connectors (P650 and P651), and the bar-code reader cable connector from
the relay board (UI-RS) and remove the unit from the main unit base.

Disassembly and Assembly of the Matrix BCR Unit


Disassembly Procedure
a) Remove the bar-code reader.
• Remove four (4) screws.
b) Remove the motor.
• Remove two (2) screws.
c) Remove the rotating axle from the BCR bracket.
• Remove one (1) screw.
d) Pull out the rotating axle from the BCR base.
Assembly Procedure
Assemble the Matrix BCR Unit by re-installing the parts removed disassembly procedure in the reverse order.
If you have removed the motor, re-adjust the backlash of the gear, referring to the diagram below.
Adjustment of Backlash.
First, make the BCR bracket rotate and shift to the stopper positions at both ends to fix the stopper for the motor
gear rotation. Then, adjust the backlash of the BCR bracket in the direction of its circumference to 0.1 to 0.2 by
shifting the motor position.

unit: mm
Fig. 3

Chapter 4.4.15 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.4.15.7 Adjustment Procedure for BCR

1. Overview
l The BCR base positions itself. It is not necessary to adjust it mechanically because there is enough tolerance.
l If you replace the BCR itself, first you just make sure whether it is possible to read a label according
to the Check Procedure.

2. Check Procedure
Check that the BCR functions well as follows. Refer to attached flow diagrams.

Sample BC Scanning
l Place a Sample Rack with primary tubes to all of which BCR labels are attached.
l Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.
l Perform Sample BC Scanning by touching the button in the Mechanism check screen.
Refer to Chapter 6.1.10.
l Confirm whether you hear a beep at each position during scanning.

If everything is OK, the BCR reader is ready for further checks, e.g. Barcode Card Reading
and Reagent Pack BC Scanning. See Comment 1.
If not OK, begin BCR adjustment as described in the Adjustment Procedure.

l Stop Sample BC Scanning by pressing the STOP button.

Barcode Card Reading


l Place a Barcode Card into the Barcode Card Holder.
l Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.
l Perform Barcode Card Reading by touching the button in the Mechanism check screen.
Refer to Chapter 6.1.10.
l Confirm whether you hear a beep during reading.

If everything is OK, the BCR reader is ready for further checks like Reagent Pack BC Scanning.
If not OK, begin BCR adjustment as described in the Adjustment Procedure.

l Stop Barcode Card Reading by pressing the STOP button.

V 1.6 – April 1999 7 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

Reagent Pack BC Scanning


l Place a Reagent Rack with RackPacks to all of which BCR labels are attached.
l Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.
l Perform Reagent Pack BC Scanning by touching the button in the Mechanism check screen.
Refer to Chapter 6.1.10. See comment 2.
l Confirm whether you hear a beep at each position during scanning.

If everything is OK, the BCR reader is ready for operation.


If not OK, begin BCR adjustment as described in the Adjustment Procedure.

l Stop the Reagent Pack BC Scanning by pressing the STOP button.

3. Adjustment Procedure

Sample ID
This procedure adjusts the angle of BCR itself relative to slit of the Sample Disk at Sample position.
The BCR angle moves one (1) pulse by touching the button once in the popup screen (Fig. 4.4.15-1).
In the meantime, find a beep area within ca. ± five (5) pulses of the zero (0) value.
In principle, you do not have to adjust the angle of the Sample Disk rotation, even though the function is available.

l Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.
l Touch the Util button.
l Touch the Adjustment Sipper S.Disk C. Op/Clse BCR button.
l Having touched the button, a popup appears.
l Input the password “ 11111111” and touch the OK button.
l Perform the BCR adjustment as follows.
(1) Touch the BCR S.Disk button.
(2) Having touched the button, a popup appears (Fig. 4.4.15-1).

Chapter 4.4.15 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Operator-ID: 47 Adjustment 07:40


Adjustment Sipper Util
S.Disk C.Op/Clse BCR

Cap Open/Close Cap Open/Close Cap Open/Close BCR BCR


Mechan. In/Out M. U/D Home M. U/Down R.Disk S.Disk
2 -4 0
BCR S.Disk
Sample Disk
Pipetting Pos. Left Right
7 - +
Sample Disk
Sipper-X
CC2 Left Right
-8 - +

Sipper-Z
Incubator OK Cancel
-3

Reagent Pack
Open/Close Cap BC Scanning BC Scanning Gripper check

Fig. 4.4.15-1 Popup screen of BCR & S.disk

(3) In the meantime, the BCR continuously scans at half (0.5) second intervals.

If everything is OK, the BCR beeps. It is now ready for further checks like those in item (4).
If not OK, the BCR does not beep; adjust the BCR as described in items (5) and (6).

(4) Check whether the BCR can be read when you move the Sample Rack by hand by about 2 mm to the left or
right.
See comment 3.
If everything is OK, the BCR beeps. It is ready for check of retry function. Touch Cancel button.
In not everything is OK, the BCR does not beep; repeat from items (5) to (6).

(5) Adjust the BCR angle to find a beep area within ca. ± five (5) pulses
of the zero (0) value by touching the following buttons.

If you touch the BCR Right + button once, the BCR moves one (1) step to the right.
If you touch the BCR Left - button once, the BCR moves one (1) step to the left.
See comment 4.
(6) Confirm that the BCR beep is stable. If it is stable beep, touch the OK button.
In the meantime, the BCR returns to the HOME position (in reset status) once and it
moves to an updated position, the BCR scans again.

V 1.6 – April 1999 9 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

If everything is OK, the BCR beeps. It is now ready for operation. See comment 5.
In not everything is OK, the BCR does not beep; repeat from items (5) to (6).

Check Procedure of Retry function of Sample ID See comment 6


l There is a BCR Retry function during Sample BC Scanning in operation.
l If the BCR is not readable at first, S.Disk rotates ca. 2mm to the right (CW) and it performs a
second reading.
(1) Check the Retry function by setting up a BCR position equivalent to the position of
the second reading as follows.
l Make sure that the instrument is in Stand-by status.
l Touch the BCR S.Disk button.
l Having touched the button, a popup appears (Fig. 4.4.15-1).
l Touch the BCR Left - button ten (10) times.
l Confirm that the BCR beep is stable.

In case of all: If it is stable beep, touch the Cancel button. Perform the Sample Scan.
In case of all: If it is not OK, touch the Cancel button and repeat from items (5) to (6) of Sample ID.

(2) Confirm that the Retry function works well as follows.


l Perform a Sample Scan by touching the Sample Scan button in the Orders screen.
l Momentarily block the first Sample Scan with paper; remove the paper and check that
the second Sample Scan is performed.
See comment 7.

See comment 8.

Reagent ID

l The BCR has a sufficiently wide angle of readable area. Therefore, in principle, it is not necessary to adjust
even though an adjustment function is available.
l The adjustment value is to set zero (0) during production. See comment 9.

Chapter 4.4.15 10 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Attachment 1

Comment 1
Some customers are using narrow width barcodes (out of specification) and primary tubes (diameter 13mm) that
rotate with rotation of the sample disk. Therefore, please check sample BC Scanning by using the adjustment
procedure for Sample ID.

Comment 2
Before you perform Reagent Pack BC Scanning, check that the window of the Reagent Jacket is clean. If you find
any stains, clean the window.

Comment 3
(4)’ Check whether the BCR can be read when you touch the BCR Right +button three (3) times and touch the
BCR Left - button three(3) times.

Comment 4 :
(5)’ If you cannot find a beep area within ca. ± five (5) pulses of the zero (0) value, adjust the sample disk position
by touching the following buttons.

If you touch the Sample Disk Right + button once, the sample disk moves one (1) step to the right (CW).
If you touch the Sample Disk Left - button once, the sample disk moves one (1) step to the left (CCW).

Comment 5
Return to (4) and (4)’ (comment 3) for checking.

Comment 6
You need to set up function status of barcode reading on the Data Disk if you want to use the Retry function.

Comment 7
If everything is OK, the BCR beeps and it is now ready for operation.
If not OK, the BCR does not beep; repeat Sample ID adjustment after checking for stains on the Barcode label itself.

Comment 8
-Barcode Card
l The BCR has a sufficiently wide angle of readable area. In principle, it is not necessary to adjust.
(1) Change angle of the barcode holder.
(2) Confirm whether you hear a beep by using the check procedure for Barcode Card Reading.

Comment 9
l Make sure that the instrument is in Stand-by status by checking that Stand-by appears on the screen.
l Touch the Util button.
l Touch the Adjustment Sipper S.Disk C. Op/Clse BCR button.

V 1.6 – April 1999 11 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

l Having touched the button, a popup appears.


l Input the password “11111111” and touch the OK button.
l Perform the BCR adjustment as follows.

(1) Touch the BCR R.Disk button.


(2) Having touched the button, a popup appears (Fig. 4.4.15-2).

Operator-ID: 47 Adjustment 07:57


Adjustment Sipper Util
S.Disk C.Op/Clse BCR

Cap Open/Close Cap Open/Close Cap Open/Close BCR BCR


Mechan. In/Out M. U/D Home M. U/Down R.Disk S.Disk
2 -4 0
BCR R.Disk
Sample Disk
Pipetting Pos.
7
Left Right
Sipper-X - +
CC2
-8

Sipper-Z
Incubator OK Cancel
-3

Reagent Pack
Open/Close Cap BC Scanning BC Scanning Gripper check

Fig. 4.4.15-2 Popup screen of BCR & R.disk

(3) In the meantime, the R.Disk rotates continuously and the BCR scans.

If everything is OK, the BCR beeps; it is now ready for further checks like the Retry function for Reagent ID. Touch
the Cancel button.
In not everything is OK, the BCR does not beep; adjust the BCR angle as described in item (4).

(4) Adjust the BCR angle to find a beep area by touching the following buttons.

If you touch the BCR Right + button once, the BCR moves one (1) step to the right.
If you touch the BCR Left - button once, the BCR moves one (1) step to the left.

(5) Confirm that the BCR beep is stable.

Chapter 4.4.15 12 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

If everything is OK, the BCR beeps; it is now ready for further checks like the Retry function for Reagent ID. Touch
the OK button.
If not OK, the BCR does not beep; return to item (4).

- Check Procedure for Retry function of Reagent ID


l You need to set up function status of barcode reading on the Data Disk if you want to use the retry function.
l The BCR Retry function is in operation during Reagent BC Scanning.
l If the bar code is not readable at first, the R.Disk rotates again and a second reading is performed.

(1) Confirm that the Retry function works well as follows.


l Perform the Reagent Scan by touching the Reagent Scan button in Inventory screen.
l Momentarily block the first Sample Scan with paper; remove the paper and check that
the second Sample Scan is performed.

If everything is OK, the BCR beeps. It is now ready for operation.


In not OK, the BCR does not beep; repeat Reagent ID adjustment, after checking for stains on the window and on
the Barcode Label itself.

V 1.6 – April 1999 13 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

Attachment 2

- Flow Diagram for BCR Adjustment

START

NO Sample ID
Sample Scan
Adjustment

OK

Sample ID
Adjustment

NO Bar code Card


Bar code Card
Adjustment

OK
NO Reagent ID
Reagent Scan
Adjustment

OK

END

Chapter 4.4.15 14 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Sample ID Adjustment

START

Note)
Open the Window Adjust
(1)(2) the S.Disk angle (5)’

NO

NO Adjust
Beep ? (3) Find out ?
the BCR angle (5)

OK OK
NO
Touch OK
Beeep ? (4)(4)’

OK
Cancel NO OK
Beep ? (6)
the Window

NG
Retry Function ?
Note)
In principle, you do not have to adjust the
OK
angle of the S.Disk rotation.
END

V 1.6 – April 1999 15 Chapter 4.4.15


RD/Hitachi Elecsys 2010 Service Manual

- Bar code Card Adjustment

START

Adjust
Card Holder

END

- Reagent ID Adjustment

START

Open the Window


(1)(2)

NO Adjust
Beep ? (3)
the BCR angle (4)

OK
Cancel NO
Beep ? (5)
the Window

OK

Touch OKl

NO
Retry Function ?

OK
END

Chapter 4.4.15 16 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.5 Mechanical Adjustment


4.5.0 Overview

The following are detailed procedures for adjusting the mechanical positions. The procedures are described in the order in which you can carry out the adjustments most
conveniently.
1. Make sure that the mechanical positions of the unit which you have just replaced or adjusted are well adjusted relative to those units that share the same working areas
with the unit. For instance, when you replace the reagent disk, you should make sure that it is well adjusted relative to the cap opener, pipetter and beads mixer.
2. The belt tension must always be adjusted prior to the position adjustment by means of the software because you have to take the units out when you adjust their belt
tension.
3. Refer to Chapter 6.1.12 for general procedures on how to operate the mechanical adjustment software.

4.5.1 Mechanical Adjustment Procedure

No. Unit Adjusted item What is to be confirmed How to adjust


1. Base 1) Horizontal level l Place two rubber plates under the front two leveling feet. l Adjust the height of two front leveling
a) Level : within ± 3 mm for the whole instrument on the feet.
laboratory bench.
b) Water must flow well from the cleaning bath for the
pipetter probe to the waste tank.

No. Unit Adjusted item What is to be confirmed How to adjust


2. Sample Disk 1) Belt tension a) Relief of belt : 3 N(300 kgf)/2.5 ~ 3.0 mm See Chapter 4.4.1.
2) Sample Disk Pipetting Pos. l Attach a tip to the pipetter probe. Carry out the “S/R Probe-x S.Disk” in
*1 l Place a Hitachi sample cup in position 1 of the sample the “Adjustment Sipper S.Disk
disk. C.Op/Clse BCR” screen.
a) Confirm visually that the pipetter probe end with a tip is
in the center of the sample cup opening on the sample
disk.
Note.
*1 : In principle, you need not adjust the sample disk, i.e. you should usually leave the adjustment parameter zero. Instead, you should adjust the pipetter horizontal
position, Pipetter-X S.Disk if adjustment is necessary. You should adjust the sample disk position, Sample Disk Pipetting Pos, only if you find the distance between
the pipetter probe and the protector hole is 2 mm or less with no sample disk position adjustment.

V 1.6 – April 1999 1 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual
No. Unit Adjusted item What is to be confirmed How to adjust
3. Pipetter 1) X axis belt tension a) Relief of belt : 2 ± 0.5 N/15 mm See Chapter 4.4.5.
2) Z axis belt tension a) Relief of belt : 1.5 ± 0.3 N/5 mm See Chapter 4.4.5.
3) Buffer station Y directional l Detach the tip from the pipetter probe. See Chapter 4.4.5.
position relative to the a) Confirm visually that the pipetter probe end can be put in
pipetter probe the center of the hole of Tip Pos.1 and in the center of
the U shape cut of the tip eject position by looking at the
pipetter probe from the side. If not, adjust the buffer
station plate mechanically.
4) Y directional position of the l Attach a tip to the pipetter probe. See Chapters 4.4.5 and 4.4.1.
pipetter probe over the l Place a Hitachi sample cup in position 1 of the sample
sample disk disk.
a) Confirm visually that the pipetter probe end with a tip is
in the center of the sample cup opening on the sample
disk by looking at the pipetter probe from the side. If
not, adjust the pipetter position mechanically and, if
additionally necessary, adjust the sample disk position
mechanically.
5) Y directional position of the l Attach the reagent disk cover. See Chapter 4.4.5.
pipetter probe over the l Attach a tip to the pipetter probe
reagent disk a) Confirm visually that the pipetter probe end with a tip is
in the center of the reagent disk cover hole (beads) by
looking at the pipetter probe from the side. If not, adjust
the pipetter position mechanically.
6) Pipetter-X Tip Pos 1 l Attach a tip to the pipetter probe. Carry out the “S/R Probe-x P.Stn. 1”
a) Confirm visually that the pipetter probe end with a tip is function in the “Adjustment S/R Probe
in the center of the hole of Tip Pos.1 by looking at the R. Disk, B. Mix” screen.
pipetter probe from the front.
7) Pipetter-X Wash l Attach a tip to the pipetter probe. Carry out the “S/R Probe-x Wash”
a) Confirm visually that the pipetter probe end with a tip is function in the “Adjustment S/R Probe
in the middle of the nozzle in the washing station by R. Disk, B. Mix” screen.
looking at the pipetter probe from the front.
8) Pipetter-X Beads *1 l Attach a tip to the pipetter probe. Carry out the “S/R Probe-x
l Place the reagent disk cover. Microparticles” function in the
a) Confirm visually that the pipetter probe is in the center of “Adjustment S/R Probe R. Disk, B.
the reagent disk cover hole while the pipetter probe is Mix” screen.
moving.

Chapter 4.5.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


3. Pipetter 9) Pipetter-X R1 *1 l Attach a tip to the pipetter probe. Carry out the “S/R Probe-x R1” function
l Place the reagent disk cover. in the “Adjustment S/R Probe R. Disk,
a) Confirm visually that the pipetter probe is in the center of B. Mix” screen.
the reagent disk cover hole while the pipetter probe is
moving.
10)Pipetter-X R2 l Attach a tip to the pipetter probe. Carry out the “ S/R Probe-x R2”
l Place a RackPack in Pos. 1 of the reagent disk. function in the “Adjustment S/R Probe
a) Confirm visually that the pipetter probe end with a tip is R. Disk, B. Mix” screen.
adjusted as concentrically as possible with the hole of the
RackPack placed in the R2 position when the reagent
disk cover is removed.
l Place the reagent disk cover.
b) Confirm visually that the pipetter probe is in the center of
the reagent disk cover hole while the pipetter probe is
moving.
11)Pipetter-X S. Disk l Attach a tip to the pipetter probe. Carry out the “ S/R Probe-y S. Disk”
l Place a Hitachi sample cup in Pos. 1 of the sample disk function in the “Adjustment S/R Probe
*2. R. Disk, B. Mix” screen.
a) Confirm visually that the pipetter probe is in the center of
the reagent disk cover hole while the pipetter probe is
moving.
b) Confirm visually that the pipetter probe end with a tip is
adjusted as concentrically as possible with the sample
cup opening placed in the sample disk.
12)Pipetter-X VB l Attach a tip to the pipetter probe. Carry out the “ S/R Probe-x P. Stn”
l Place a vessel in the VB position of the buffer station. function in the “Adjustment S/R Probe
a) Confirm visually that the pipetter probe end with a tip is R. Disk, B. Mix” screen.
adjusted as concentrically as possible with the vessel
opening placed in the VB position of the buffer station.
13)Pipetter-Z T/V Buffer l Detach the tip, if any, from the pipetter probe. Carry out the “S/R Probe-z P. Stn”
a) Confirm visually that the pipetter probe end with no tip is function in the “Adjustment S/R Probe
pretty level with the buffer station surface at the tip eject R. Disk, B. Mix” screen.
position. Refer to Fig. 4.5.1-1.

V 1.6 – April 1999 3 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


3. Pipetter 14)Pipetter-Z T/V Bottom l Detach the tip, if any, from the pipetter probe. Carry out the “S/R Probe-z T/V
l Place a tip in Tip Pos. 1 of the buffer station. Bottom” function in the “Adjustment
a) Confirm visually that the pipetter probe end with no tip is S/R Probe R. Disk, B. Mix” screen.
pretty level with the buffer station surface at the tip eject
position. Refer to Fig. 4.5.1-1.
15)Pipetter-Z Beads Bottom l Attach a tip to the pipetter probe. Carry out the “S/R Probe-z R2 Bottom”
l Place a RackPack in Pos. 1 of the reagent disk. function in the “Adjustment S/R Probe
a) Automatically checked. R. Disk, B. Mix” screen.
16)Pipetter-Z S.Cup Bottom l Attach a tip to the pipetter probe. Carry out the “ S/R Probe-z S.Cup
l Place a Hitachi sample cup in Pos. 1 of the sample disk. Bottom” function in the “Adjustment
a) Automatically checked. S/R Probe R. Disk, B. Mix” screen.
Note.
*1 : You must adjust the reagent disk relative to the reagent disk for these pipetter positions.
*2 : To allow easier confirmation, a Hitachi sample cup on a tube 100 mm long can be used instead of one directly placed in the sample disk.

Chapter 4.5.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Adjustment position

T/V Buffer

Vessel position

Tip waste position

New pipetter probe resistant to higher system water conductivity

Fig. 4.5.1-1 A comparison of the adjustment positions for S/R Probe-z T/V Bottom

V 1.6 – April 1999 5 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


4. Beads Mixer 1) Rotation belt tension a) Relief of belt : 3 ± 0.5 N/2.5 ~ 3.0 mm See Chapter 4.4.4.
2) Z axis belt tension a) Relief of belt : 3 ± 0.5 N/4.5 ~ 5.0 mm See Chapter 4.4.4.
3) Beads Mixer-R Rinse a) Make sure that the mixing paddle is straight. Carry out the “Mixer-Horiz. Rinse”
station *2 b) Confirm visually that when the beads mixer is in the function in the “Adjustment S/R Probe
horizontal home position, the distance is 2 mm or more R. Disk, B. Mix” screen.
between the mixing arm and the end of the U-shaped cut
of the table cover and that the mixing arm is located See Chapter 4.4.4.
approximately in the middle of the U-shaped cut. If not,
adjust the beads mixer and/or relevant units referring to
the procedures described in the latter half of c).
c) Confirm visually that the mixing paddle is adjusted as
concentrically as possible with the washing station *1.
If not, adjust the beads mixer and/or relevant units by
applying one or more of the following three options.
i. Adjust the table cover mechanically.
ii. Carry out the “Beads Mixer-R Wash” function in the
“Adjustment B Mixer Pipetter R Disk” screen.
iii. Adjust the beads mixer head rotational angle around
the arm mechanically.
d) Make sure that the mixing arm in Home Pos. does not
interfere with the pipetter.
4) Beads Mixer-R Mix l Attach the reagent disk cover. Carry out the “Mixer-Horiz. Reag.
a) Confirm visually that the mixing paddle is adjusted as Mix” function in the “Adjustment S/R
concentrically as possible with the reagent disk cover Probe R. Disk, B. Mix” screen.
hole.
5) Beads Mixer U/D l Detach the reagent disk cover. Carry out the “Mixer Up/Down”
l Place a RackPack in Pos. 1 of the reagent disk. function in the “Adjustment S/R Probe
a) Confirm visually that the mixing paddle lower end is just R. Disk, B. Mix” screen.
level with the upper edge of the opening of the RackPack
*3.
Note.
*1 : You may manually push down the mixing arm for easier confirmation.
*2 : Refer to Fig. 4.5.1-2.
*3 : You may put a thin sheet of paper over the RackPack opening for easier confirmation.

Chapter 4.5.1 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2 mm or more

Fig. 4.5.1-2 The mixing arm in the U-shaped cut

V 1.6 – April 1999 7 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


5. Reagent Disk 1) Belt tension a) Relief of belt : 3 N/2.5 ~ 3.0 mm See Chapter 4.4.2.
2) Reagent Disk Pos.1 l Detach the reagent disk cover. Carry out the “Reagent Disk Pos.1”
l Attach a tip to the pipetter probe function in the “Adjustment S/R Probe
l Place a RackPack in Pos. 1 of the reagent disk. R. Disk, B. Mix” screen.
a) Confirm visually that the pipetter probe stops at the
center of the R2 bottle opening.
3) Reagent Disk R1 l Detach the reagent disk cover. Carry out the “Reagent Disk R1”
l Attach a tip to the pipetter probe function in the “Adjustment S/R Probe
l Place a RackPack in Pos. 1 of the reagent disk. R. Disk, B. Mix” screen.
a) Confirm visually that the pipetter probe stops at the
center of the R1 bottle opening.
4) Reagent Disk Beads l Detach the reagent disk cover. Carry out the “Reagent Disk
l Attach a tip to the pipetter probe Microparticle”
l Place a RackPack in Pos. 1 of the reagent disk. function in the “Adjustment S/R Probe
a) Confirm visually that the pipetter probe stops at the R. Disk, B. Mix” screen.
center of the beads bottle opening.
5) Reagent Disk Beads Mixing l Detach the reagent disk cover. Carry out the “Reagent Disk Mixing”
l Place a RackPack in Pos. 1 of the reagent disk. function in the “Adjustment S/R Probe
a) Confirm visually that the mixing paddle stops at the R. Disk, B. Mix” screen.
center of the beads bottle opening.

Chapter 4.5.1 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


6. Cap Opener 1) Belt tension a) Tension of sub-active pulley: 6 ± 1 N See Chapter 4.4.3.
2) RackPack Stopper *1 l Detach the reagent disk cover. Carry out the “Cap Open/Close M. U/D
l Place a RackPack in Pos. 1 of the reagent disk. Home” function in the “Adjustment
a) Confirm visually that the distance between the RackPack Sipper S.Disk C.Op/Clse BCR” screen.
stopper and the RackPack side wall is 1.0 mm ~ 1.5 mm.
If not, go to 2’) to adjust the reagent disk position having
confirmed and adjusted, if necessary, the RackPack
stopper angle as is described in b) *2.
b) Adjust mechanically the RackPack stopper angle by
loosing and fastening two screws so that the RackPack
stopper is 0.5 ~ 1.0 mm away from the neck plate *2.
2’)RackPack Stopper a) Adjust the reagent disk position “Reagent Disk Pos. 1” as Carry out the “Reagent Disk Pos.1”
is described in 5. Reagent Disk 2) Reagent Disk Pos. 1 function in the “Adjustment S/R Probe
*3. R. Disk Mixer” screen.
3) Cap Opener F/B Cap l Detach the reagent disk cover. Carry out the “Cap Open/Close
l Place a RackPack in Pos. 1 of the reagent disk. Mechan. In/Out” function in the
a) Confirm visually that the hook stops in the middle of the “Adjustment Sipper S.Disk C.Op/Clse
gaps between snap caps at the bottle side. BCR” screen.
4) Cap Opener U/D Home l Detach the reagent disk cover. Carry out the “Cap Open/Close M. U/D
l Place a RackPack in Pos. 1 of the reagent disk. Home” function in the “Adjustment
a) Confirm visually that the distance between opened snap Sipper S.Disk C.Op/Clse BCR” screen.
caps and the hook is 2 mm or more *4.
5) Cap Opener U/D Cap l Detach the reagent disk cover. Carry out the “Cap Open/Close M. U/D
l Place a RackPack in Pos. 1 of the reagent disk. Home” function in the “Adjustment
a) Confirm visually that the hook touches the completely Sipper S.Disk C.Op/Clse BCR” screen.
closed snap caps *5.
Note.
*1 : The purpose of this adjustment is simply to check the RackPack stopper position.
*2 : Refer to Fig. Fig. 4.5.1-3.
*3 : If you have adjusted the reagent disk position “Reagent Disk Pos. 1”, check whether or not the pipetter probe X-axis R2-position is still well adjusted (Pipetter-X R2).
*4 : Refer to Fig. Fig. 4.5.1-4.
*5 : Refer to Fig. Fig. 4.5.1-5.

V 1.6 – April 1999 9 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

2 mm or more

Distance 1.0 to 1.5 mm

Distance 0.5 to 1.0 mm

Fig. 4.5.1-3 The distance between the stopper and the side wall Fig. 4.5.1-4 The distance between snap caps and the hook

Chapter 4.5.1 10 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Fig. 4.5.1-5 The hook touching closed snap caps

V 1.6 – April 1999 11 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual
Note:
To adjust the gripper (T/V transport) unit, either mechanical adjustment or automatic adjustment may be performed. We recommend performing automatic adjustment (new
version implemented from SW version 03-08 onwards). Refer to Chapter 6.1.11. Manual adjustment should be used in case of pre-adjusting the whole unit, e.g. after
transport assembly exchange or if the automatic adjustment fails (red buttons?). For manual adjustment, the main cover of the analyzer and the transport unit cover should be
detached.

No. Unit Adjusted item What is to be confirmed How to adjust


7. Gripper *1 1) X axis belt tension a) Relief of belt : 2.0 ± 0.5 N/7 mm See Chapter 4.4.6.
2) Y axis belt tension a) Tension of sub-active pulley : 30 ± 5 N See Chapter 4.4.6.
3) Z axis backlash of pinion a) Backlash : 0.1 ~ 0.2 mm See Chapter 4.4.6.
4) Gripper-X/Y TM Front l Place an empty tip container in the tray *2. Carry out the “Gripper-X/Y Tip Front”
① Front-right l Insert the adjustment tool into the gripper *3. function in the “Adjustment Gripper”
a) Confirm visually that the adjustment tool can be inserted screen.
into the hole in the empty tip container.
Subarea 1 5) Gripper-X/Y TM Back l Place an empty tip container in the tray *2. Carry out the “Gripper-X/Y TM Back”
② Back-Right l Insert the adjustment tool into the gripper.. function in the “Adjustment Gripper”
a) Confirm visually that the adjustment tool can be inserted screen.
into the hole in the empty tip container.
6) Gripper-X/Y VM Left l Place an empty vessel container in the tray *2. Carry out the “Gripper-X/Y VM Left”
③ Back-Left l Insert the adjustment tool into the gripper. function in the “Adjustment Gripper”
a) Confirm visually that the adjustment tool can be inserted screen.
into the hole in the empty vessel container.
Add offset values. Refer to 4.5.1-1.
7) Gripper-X/Y Sipping l Insert the adjustment tool into the gripper. Carry out the “Gripper-X/Y Sipping”
④ Sipping a) Confirm visually that the adjustment tool can be inserted function in the “Adjustment Gripper”
Subarea 2 into the hole in the sipping position. screen.
8) Gripper-X/Y Incubator l Insert the adjustment tool into the gripper. Carry out the “Gripper-X/Y incubator”
⑤ Incubator a) Confirm visually that the adjustment tool can be inserted function in the
into the hole in the incubator. “Adjustment Gripper” screen.
Add offset values. Refer to 4.5.1-1.

Chapter 4.5.1 12 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to Adjust


9) Gripper-X/Y Tip Pos. 1 l Remove the tip, if any, from Tip Pos. 1. Carry out the “Gripper-X/Y P. Stn.
⑥ Tip Pos. 1 l Insert the adjustment tool into the gripper. Tip” function in the “Adjustment
a) Confirm visually that the adjustment tool can be inserted Gripper” screen.
Subarea 3 into the hole of Tip Pos. 1 in a concentric manner.
l Make the gripper grip a tip vertically.
b) Confirm visually that the tip can be inserted into the hole
of Tip Pos. 1 with as little eccentricity as possible, i.e.
1.0 mm eccentricity at the most.
10) Gripper-X/Y VB Pos. l Insert the adjustment tool into the gripper. Carry out the “Gripper-X/Y P. Stn.
⑦ a) Confirm visually that the adjustment tool can be inserted Cup” function in the “Adjustment
into the hole in VB Pos. of the buffer station. Gripper” screen.
Add offset values. Refer to 4.5.1-1.
11) Gripper-Z Sipping l Place a vessel in the sipping position.
a) Confirm visually that the distance between the vessel top
and the grip finger end is approximately 0 ~ 0.5 mm at the
sipping position.
7. Gripper 12) Gripper-Z VB Pos. l Place a vessel in VB Pos. of the buffer station. Carry out the “Gripper-Z Sipping”
a) Confirm visually that the distance between the vessel top function in the “Adjustment Gripper”
and the grip finger end is approximately 0 ~ 0.5 mm at screen.
VB Pos.

Note.
*1 : General notes common to all the gripper adjustment positions.
l Always detach the Z cover for easier confirmation and the motor cover, rail cover X and rail cover Y if it seems easier to adjust the gripper.
l The adjustment area can be split into three sub-areas: the magazine tray, incubator and buffer plate.
l Each adjustment position is closely dependent on the other positions assigned to the same sub-area.
l Set the offset values only when you have completed the adjustment for all the gripper positions. Refer to Table 4.5.1-1 for the offset values.
l Confirm visually the relative position of the following mechanical units prior to the gripper adjustment although there are no digital specifications for the following
confirmation.
- How parallel the incubator is to the X rail? The edge line of the incubator block must be parallel to the X rail.
- How perpendicular is the Z mechanism to the incubator and the magazine tray? The Z mechanism must be perpendicular to the incubator as well as the magazine
tray. You should check it using floppy disks, for example.
- How parallel is the horizontal surface of the finger grip end to the incubator? The surface must be parallel to the top surface of the incubator.
*2 : Refer to Fig. 4.5.1-6.
*3 : Adjustment tool, Part No. 741-1471.

V 1.6 – April 1999 13 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

÷ Tip Pos. 1 ⑦ VB Pos.

ö Sipping
ú Incubator

ì Back-Left ó Back-Right

Vessel Tray Tip Tray


for Back-Left for Back-Right

Tip Tray
for Front-Right € Front-Right

Fig. 4.5.1-6 Where to place magazines on the tray

Chapter 4.5.1 14 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Table 4.5.1-1 Offset values

No. Position Parameter Offset Value Subarea


1. Front Right X axis -2
Y axis -1
2. Back Right X axis -2 1
3. Back Left Y axis -1
4. Sipping X axis -2
Y axis -1 2
5. Incubator Y axis -1
6. Tip Pos. 1 X axis 0
Tip Pos. 1 Y axis 0 3
7. Vessel Buffer (VB) X axis -2
Y axis -1

Add offset values after subarea (1, 2 or 3) positions have been adjusted to center. To add the offset values, detach the adjustment tool.
Enter pos. and add steps as shown in the table above.
Confirm the values with the OK button.

Legend:
TM = Tip
VM = Vessel Magazine
VB = Vessel Buffer

V 1.6 – April 1999 15 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

Fig.6.2.5.5 Offset Description

Chapter 4.5.1 16 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


8. Sipper 1) X axis belt tension a) Relief of belt : 3 ± 0.5 N/10 mm See Chapter 4.4.7.
2) Z axis belt tension a) Relief of belt : 1.5 ± 0.3 N/5 mm See Chapter 4.4.7.
3) Y axis position l Place a vessel in the sipping position. See Chapter 4.4.7.
a) Confirm that the sipper probe end is in the center of the
vessel opening in the sipping position by looking at the
sipper probe from the side.
4) Sipper-X CC2 l Place an uncapped CC bottle in the CC2 position. Carry out the “Sipper-X CC2” function in
a) Confirm that the sipper probe end is in the center of the the “Adjustment Sipper S.Disk C.
CC bottle in the CC2 position. Op./Clse BCR” screen.
5) Sipper-X Rinse l Make sure that the sipper probe is straight. Carry out the “Sipper-X Rinse” function
a) Confirm visually from the front that the sipper probe end in the “Adjustment Sipper S.Disk C.
is at the middle of water hole of the washing station. Op./Clse BCR” screen.
b) Confirm visually from the side that the distance between
the front of water hole of the washing station and the
sipper probe is 2 ± 0.5 mm. If not, adjust the position of
the washing station.
6) Sipper-X Sipping l Place a vessel in the sipping position. Carry out the “Sipper-X Sipping” function
l Make sure that the sipper probe is straight. in the “Adjustment Sipper S.Disk C.
a) Confirm that the sipper probe end is in the center of the Op./Clse BCR” screen.
vessel opening in the sipping position.
7) Sipper-Z Incubator a) Confirm visually that the sipper probe end is just level Carry out the “Sipper-Z Incubator”
with the upper surface of the holder in the sipping function in the “Adjustment Sipper
position. S.Disk C. Op./Clse BCR” screen.
8) Sipper-Z Inc. Bottom l Take AB1 bottle and CC2 bottle off. Carry out one of the following functions in
Sipper-Z AB1Bottom a) Automatically checked. the “Adjustment Sipper S.Disk C.
Sipper-Z CC2 Bottom Op./Clse BCR” screen.
i. Sipper-Z Inc. Bottom
ii. Sipper-Z AB1Bottom
iii.Sipper-Z CC2 Bottom

No. Unit Adjusted item What is to be confirmed How to adjust


9. Pipetter Syringe 1) Belt tension a) Relief of belt : 1.67 N/0.4 mm See Chapter 4.4.9.
Sipper Syringe

V 1.6 – April 1999 17 Chapter 4.5.1


RD/Hitachi Elecsys 2010 Service Manual

No. Unit Adjusted item What is to be confirmed How to adjust


10. BCR *1 1) Reagent Position No adjustment is necessary in principle. See Chapter 4.4.15.

2) Barcode card Position No adjustment is necessary in principle. See Chapter 4.4.15.


3) Sampling Position a) Confirm the reading performance. Refer to Chapter See Chapter 4.4.15.
4.4.15 for details.
Note.
*1 : General notes common to all the BCR adjustment positions.
l The BCR has a sufficiently wide angle of readable area. Therefore, it is not necessary to adjust the BCR even though some adjustment functions are available. If
really necessary, adjust the BCR positions according to the BCR adjustment procedures described in Chapter 4.4.15-7.

Chapter 4.5.1 18 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.5.2 Mechanical Adjustment Procedure for Rack Sampler

4.5.2.1 Position of the Adjustment

C line Position of Rack feed


on B line

Sampling Postion

A line
BCR Reading Position

B line
Adjustment points
Position of Rack feed on A line

Figure 4.5.2-1 Rack Sampler’s Range of Adjustment

V 1.6 – April 1999 1 Chapter 4.5.2


RD/Hitachi Elecsys 2010 Service Manual

4.5.2.2 Mechanical Adjustment Procedures for the Rack Sampler System

No. Unit Adjusted Item What is to be confirmed How to Adjust


1 A line 1) Belt tension Not applicable ---
2) Mounting position of the Rack guide and the rack feed arm on the rack tray Mechanical adjustment
rack feed arm must be at a right angle.
3) Position of the rack guide at The center of the rack guide on the rack tray must Mechanical adjustment
the buffer base correspond with the center of the rack guide on the
buffer base.
4) Position of the rack feed end • Set a tray with a rack on the A line. Carry out the “A Line Loading Pos.” function in the
• The space between the rack feed arm and the Adjustment Rack Sampler screen.
rack must be 1 to 2 mm when the rack is pressed
against the rack rail on the B line.
2 B line 1) Belt tension. Not applicable ---
2) Sampling position • Set a rack with a tube in Pos. 1 of the rack at the Carry out the “B Line Sampling Pos.” function in the
(details are given below) STAT position. Adjustment Rack Sampler screen.
• The tip must be in the center of the test tubes
(within ±1 mm).
3) Unloading position • Set a rack with a tube in Pos. 1 of the rack at the Carry out the “B Line Unloading” function in the
STAT position. Adjustment Rack Sampler screen.
• The center of the notch to prevent the rack from
toppling must correspond with the center of the
rack guide on the buffer base of the C line
(within ±1mm).
4) BCR Reading Position • Set a rack with 5 tubes with BC labels at the Carry out the “B Line B.C.R. Auto” function in the
STAT position. Adjustment Rack Sampler screen.
• Automatically determines the reading position.
3 C line 1) Belt tension Not applicable. ---
2) Mounting position of the The rack guide and the rack feed arm on the rack Mechanical adjustment
rack feed arm tray must be at a right angle (within ±1 mm).
3) Position of rack guide at the The center of the rack guide on the rack tray must Mechanical adjustment
buffer base correspond with the center of the rack guide on the
buffer base (within ±5 mm).

V 1.6 – April 1999 2 Chapter 4.5.2


RD/Hitachi Elecsys 2010 Service Manual

Explanation Adjustment Sample Position


Place a rack with a primary tube (diameter 10 or 13 mm) in rack position one at the STAT position of rack
sampler unit.
Carry out "B line sampling pos." from the screen "Adjustment rack sampler".

Check the current sample position adjustment!


If the pipetter needs correction to left/right (x-axis, see Figure 4.5.2.2-1), quit the current screen with
"Cancel" key, change to the "Adjustment pipetter R.Disk" screen and carry out "Pipetter-X S.Disk" from the
screen (as on 2010 disk version).

B line sample position

Fig. 4.5.2.2-1

If the pipetter needs correction in up/down direction (y-axis, see Figure 4.5.2.2-1), change the rack position
with "Forward" or "Backward" key.
Note:
The hook will only move the rack backwards (see Figure 4.5.2.2-1). For forward hook movement, you have
to push the rack by hand to get the actual position.
The range of software adjustment for B line sample pos. is only ± 5 steps because of the design of the racks
(Figure 4.5.2.2-2).

V 1-6 – April 1999 3 Chapter 4.5.2


RD/Hitachi Elecsys 2010 Service Manual

Elecsys 2010 rack

Fig. 4.5.2.2-2

If the range of software adjustment for B line sample pos. is not sufficient, change the sample position
manually. To adjust manually, move the whole sample detector B assembly (see figure 4.5.2.2-3) in the
corresponding direction. The detector B assembly is fasten with two screws on the left and one screw on the
right. After changing the position manually, optimize again with the software (as described above).

B line sample position, adjustment possibilities

Fig. 4.5.2.2-3

Chapter 4.5.2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.6 Rack Sampler System

Rack Sampler Unit


Analyzer

Fig. 4.6-1 Rack Sampler System

V 1.6 – April 1999 1 Chapter 4.6.0


RD/Hitachi Elecsys 2010 Service Manual

4.6.0 Overview
For details of Photo Sensor and Photo Interrupter indicated by PIxxx, see Chapter 4.3.5.

Rack feed end pos. (PI222) Home position (PI221)


Tray det.
(PI224)
Rack Feed Arm

C - line Buffer

Rack feed end pos. (PI211)


B - line
Tray full (2) Tray full (1) Rack full Sampling pos. (PI215)
det. (PI226) det. (PI225) detection (PI223)
Cup detection (PI217)
Tray det.
(PI200) BCR reading pos. (PI216)
A - line Buffer
Rack detection (PI212)

Home position (PI210)


Home pos. (PI201) Rack feed end
pos. (PI202) STAT position (PI210)

V 1.6 – April 1999 2 Chapter 4.6.0


RD/Hitachi Elecsys 2010 Service Manual

4.6.1 Rack Sampler Movement

4.6.1.1 A Line

This line sets the rack in which the samples (maximum 15) are placed to the tray and conveys it to the
B line.

4.6.1.2 B Line

This line accurately conveys the rack that has the samples that have been received from the A line
to the bar code reading position and the pipetting position. After reading the sample bar code and
the rack bar code and after pipetting, the rack is conveyed to the C line (storage unit) or the D line.

4.6.1.3 C Line

This line unloads the rack that has the samples that have been conveyed by the C line
to the tray with the arm used for rack conveying.

V 1.6 – April 1999 1 Chapter 4.6.1


RD/Hitachi Elecsys 2010 Service Manual

4.6.2 A Line

4.6.2.1 Composition

(Stroke : 441 mm Delay : 2 mm Sensor to Sensor : 437 mm, 2778P)

(1) Motor used SM200 : A3339-9212

•2 phase motor, step angle 0.9o / full step


•Rated current 1.2A
•Use with 1-2 phase

(2) Tray used

•Tray for Rack Sampler (space for 15 racks: 75 samples)


•Construct buffer downstream from Tray (space for 5 racks: 25 samples)

(3) Rack Feed Speed

•High-speed feeding 849.2 PPS (134.8 mm/s)


•Low-speed feeding 445.2 PPS (70.7 mm/s)

Chapter 4.6.2 1 V 1.6 – April 1999


Service Manual RD/Hitachi Elecsys 2010

4.6.2.2 Overview of Operation

This line sets the rack in which the samples (maximum 15) are placed to the tray and conveys it to the
B line.

4.6.2.3 Rack Feed Operation

(1) The rack is conveyed when the following requirements are fulfilled on operation:

•That the Rack Feeding Detection (PI212: dark) is not on.


•That STAT samples do not exist and the STAT SW is not on.
•That the Rack that has the samples is not on the tray, Home Detection (PI201:dark) is not on.
•That the Rack Detection for rotation machines are not on, for rack conveyors only.
•That Rack Full detection (PI223: dark) for the C line buffer is not in, for rack samples only.

(2) The Rack Feed Operation is not done at reset.

•When the rack that has the samples is not on the tray and Home Detection is not on, the rack feed arm
returns to the Home Position.
•When the rack that has the samples is on the tray and Home Detection is on, the rack feed arm leaves
the Home Position and then returns to the Home Position.

4.6.2.4 Explanation of Operation

(1) Home detection (PI201 detection: dark) interrupts and stops the Home position.

(2) Rack feed to the B-Line is interrupted and stopped by the Rack Feed Detection (PI212:dark) or
the Rack Feed End Detection. The rack feed arm returns to the Home Position every time after
the Rack Feed End Detection or the Rack Feed Detection.

(3) When a STAT sample (STAT input/output) is received, the STAT sample rack is given priority
and the A line rack feed operation is not executed after moving the B line rack.

(4) If Rack Feed End Detection (PI202:dark) enters, it returns to the Home Position and executes
the rack feed operation once more in the next cycle.

•If the Rack Feed Detection enters anew, the operation is continued.

•If the Rack Feed End Detection enters, the alarm (S. STOP) for the Rack Feed End is outputted,
and sampling stops.

(5) The LED (green) lights up when addition of trays is possible.

V 1.6 – April 1999 2 Chapter 4.6.2


BM/Hitachi Elecsys Service Manual

4.6.3 B Line
4.6.3.1 Composition
(Stroke:364 mm+153 mm including 2 mm delay)

Chapter 4.6.3 1 V 1.6 – April 1999


RD/Hitachi Elecsys Service Manual

(1) Motor used SM210 P: PH265M-31B-A5

• 2 phase motor, step angle 0.9o / 2 phase

• Use 0.45o / P with 1-2 phase

(2) Rack Feed speed: overmoderated pulse 250P (0.237S)

• High-speed feeding 1917 PPS (304.4mm/s)

• Low-speed feeding 191 PPS(30.3mm/s)

4.6.3.2 Overview of Operation

This line accurately conveys the rack that has the samples that have been received from the A line
to the bar code reading position and the pipetting position. After reading the sample bar code and
the rack bar code and after pipetting, the rack is conveyed to the C line (storage unit) or the D line.

4.6.3.3 Rack Feeding Operation

(1) The rack is conveyed when the following requirements are fulfilled during the operation:

• When the Rack Detection (PI212:dark) or the STAT SW is inputted. However, when there is a detection
at the same time, the Rack Detection(PI212) is given priority.

(2) The rack is conveyed when the following requirements are fulfilled during reset:

• Home removal is done when Home Detection (PI210: dark) is on

• When Home Detection (PI210: dark) remains on, if there is SW recognition it remains in standby after
moving to STAT rack position (Interrupt half as a result of STAT Detection (PI213:dark by H.P).
If there is no recognition of the STAT SW, Rack Feeding is done when the C line and the D line are
in a condition to carry. After that, it returns to home and then goes into standby.
If Home Detection (PI210: dark) is not attached; it goes into standby after returning to home.

• If Home Detection (PI210: dark) is not attached, Rack Feeding is done when the C line and
the D line are in a condition to convey. After that, it returns to home and then goes into standby.

• The rack prior to reading the bar code should not be a reset rack.

(3) The rack is conveyed to the pipetting position when the following requirements are fulfilled.

When the Rack Full Detection (PI223) for the C line buffer is on and when the rack detection for the
rotation mechanism (PI241, P1244) is on, a series of analyses is continued and after the final sample
pipetting of the rack that has been loaded, and until the above detections are canceled, it will be in a standby
mode in that position.

Chapter 4.6.3 2 V 1.6 – April 1999


BM/Hitachi Elecsys Service Manual

4.6.3.4 Explanation of Operation

(1) In the Home position, it will interrupt and stop when Home is detected (PI260: dark).
(2) The bar code reading position detection will interrupt and stop the movement of the bar code
reading position (PI216: dark). The same is true for the movement between samples but from
the 5th sample to the bar code position shall be a fixed pulse feed.
(3) The Sampling Position Detection (PI215: dark → bright) will interrupt and stop the movement
from the bar code reading position to the pipetting position. Also, the Sampling Position
Detection (PI215: dark → bright) shall interrupt and stop the movement between the samples.
Skip processing shall be done for samples that have no analysis requests and if there are empty
positions. For empty racks, one machine cycle shall be used to process.
(4) the Rack Feed End Detection (PI211: dark) will interrupt and stop the movement from the 5th
position to the storage position.
(5) By pressing the STAT SW after placing the rack in the STAT rack position, the STAT rack
processing makes the machine recognize that there is a STAT rack. The STAT detection
(P1211) from H.P will interrupt and stop the movement to the STAT rack position. If the STAT
SW is pressed, it will give priority from the rack feed of the A-Line after analysis of all of the
samples in the rack that are currently being processed and will convey the STAT rack.
(6) If the STAT SW is pressed when Rack Detection (PI212) is on, the regular rack conveyor rather
than the STAT Rack will be given priority.

Chapter 4.6.3 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.6.4 C Line

4.6.4.1 Composition

(Stroke : 139 mm Delay : 2 mm Including 2 mm delay)

(1) Motor used SM200 : A3339-9212

• 2 phase motor, step angle 0.9o / full step


• Rated current 1.2A
• Use with 1-2 phase

(2) Tray used

• Tray for Rack Sampler (space for 15 racks: 75 samples)


• Construct buffer upstream from tray (space for 5 racks:25 samples)

(3) Rack Feed Speed

• High-speed feeding 955.7 PPS (151.7 mm/s)


• Low-speed feeding 183.1 PPS (29.1 mm/s)

Chapter 4.6.4 1 V 1.6 – April 1999


Service Manual RD/Hitachi Elecsys 2010

4.6.4.2 Overview of Operation

This line unloads the rack that has the samples that have been conveyed by the B line to the
tray with the arm used for rack conveying.

4.6.4.3 Rack Feed Operation

(1) The rack is conveyed when the following requirements are fulfilled at operation:

• When the C line is in the Home Position (PI221 detection: dark)


• When the Tray Full detection 1 (PI225 detection: dark) is OFF, the Tray Full detection 2 (PI296
detection: dark) is OFF, the tray detection (PI224 detection: dark) is ON, and the Rack Full detection
(PI292 detection: dark) is OFF. (Feed to tray: Stroke 139 mm)
• When the Tray Full detection 1 (PI225 detection: dark) is OFF, the Tray Full detection 2 (PI226
detection: dark) is OFF, the tray detection (PI224 detection: dark) is OFF, and the Rack Full detection
(PI223 detection: dark) is OFF. (Feed to buffer: Stroke 27 mm)
• When the Tray Full detection 1 (P1225 detection: dark) is ON, the Tray Full detection 2 (P1226
detection: dark) is OFF, the tray detection (P1224 detection: dark) is ON, and the Rack Full detection
(P1223 detection: dark) is OFF. Feed to the tray if the previous unloading operation is sent to the tray.
If the previous unloading operation is sent it to the buffer, then send to the buffer.
• When the Tray Full detection 1 (PI225 detection: dark) is ON, the Tray Full detection 2 (PI226 detection:
dark) is ON, the tray detection (PI224 detection: dark) is ON, and the Rack Full detection
(PI223 detection: dark) is OFF. (Feed to buffer: Stroke 27 mm)
• Cannot feed when the Tray Full detection 1 (PI225 detection: dark) is ON, the Tray Full detection 2
(PI226 detection: dark) is OFF, the Tray detection (PI224 detection: dark) is ON, and the Rack Full
detection (PI223 detection: dark) is ON.

No. Tray detection Rack Full Tray Full Tray Full Discriminant
PI293 Detection 1 PI292 Detection 1 PI294 Detection 2 PI296
1 ON OFF OFF OFF Can feed (to tray)
2 OFF OFF OFF OFF Can feed (to buffer)
3 ON OFF ON OFF Can feed (to tray or buffer)
4 ON OFF ON ON Can feed (to buffer)
5 ON ON ON OFF Cannot feed
6 OFF ON OFF OFF Cannot feed
7 ON ON ON ON Cannot feed
8 ON ON OFF ON Cannot feed

(2) The rack is conveyed when the following requirements are fulfilled at reset:

• When the C line is in the Home Position (PI221 detection: dark), the rack is conveyed in the same
manner as (1).
• When the C line is not in the Home Position , the rack is conveyed in the same manner as (1) after
H.P return is performed.

V 1.6 – April 1999 2 Chapter 4.6.4


RD/Hitachi Elecsys 2010 Service Manual

4.6.4.4 Explanation of Operation

(1) Movement from the 5th position to the storage position(PI221 detection: dark).
(2) For regular rack feeding, interrupt stop by the rack feed end detection (PI222 detection: dark)
from H.P. (1 rack shall be fed to the tray.) Returns to Home Position after feeding.
However, at the end of feeding, when both the Rack Full detection 1 and Rack Full detection 2
(PI296 detection: dark) has entered, a ‘Warning’ alarm goes off. Also, after that, until the Rack
Full detection (PI296 detection: dark) goes in, it continues a 1 pitch feed.
(3) When both the Tray Full detections are resolved, all of the racks that are in the buffer are fed to
a batch of trays. (feeds a maximum of 5)
(4) When both the Tray Full detection and the Rack Full detection (PI223 detection: dark) both go
in, a ‘Warning’ alarm goes off.
(5) After that, when both the Tray Full detections have been cleared, analysis automatically starts up again.
(6) When returning to Home after 1 rack is fed, (1 pitch feed) a check on the remaining pulse is done
and checks whether the 1 rack feeding is being performed normally or not.
(7) When the Rack Full detection (PI223: dark) for the Buffer is on, rack feeding of the A line is not done.

Chapter 4.6.4 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.7 Mechanical Adjustment of Rack Sampler Connected to CLAS 1 System

4.7.1 Overview

4.7.1 Location
See Chapter 4.7.2

4.7.1.2 The movement of the System


(1) A Line
This line is used as a rack entry line where racks (up to 15 racks) with samples are set using trays. These
racks are transferred to the B2 line. Any rack transferred from the A line is treated as a STAT sample
rack, which takes precedence over racks transferred from the I line.

(2) B2 Line
This line receives sample racks from the A line or turntable C and transfers them accurately to the barcode
reading position and the sampling position. After the sample and rack barcodes are read and sampling has
been performed, the racks are transferred to the C line.

(3) C Line
The C line receives sample racks from the B2 line and stores them onto trays by means of the rack transfer
arm.

(4) I Line
This line receives sample racks from the transfer connection line. It hooks the front of each rack with the
rear claw, changes the clamping position, and pushes the back of each rack with the front claw toward the
buffer position. Then, each rack is transferred to turntable C through the buffer position.

(5) Turntable C
Turntable C receives sample racks from the I line and turns each rack through 90° counterclockwise.
Then, each rack is transferred to the B2 line.

V 1.6 – April 1999 1 Chapter 4.7.1


RD/Hitachi Elecsys 2010 Service Manual

4.7.2 Location of Mechanisms

- Rack Sampler connected to CLAS 1 System

A Line C Line B2 Line

I Line Turntable C

V 1.6 – April 1999 1 Chapter 4.7.2


RD/Hitachi Elecsys 2010 Service Manual

- B2 Line

Motor SM210
PI212(B2 line Rack Detection) PI217(B2 line Cup Detection)

PI216
PI218 (B2 line BCR Read Pos.)
(Rack Detection)

PI213
(Rack Receiving Pos.)

PI210(B2 line HOME Pos.) PI216(B2 line BCR Read Pos.) PI211(B2 line Rack Feed End Pos.)

V 1.6 – April 1999 2 Chapter 4.7.2


RD/Hitachi Elecsys 2010 Service Manual

- I Line PI302(I line Rack Detection) PI303(I line Rack Buffer Pos.)

Motor SM300 LED300

LED301 PI300(I line HOME Pos.)

PI301(I line Rack Feed End Pos.)

V 1.6 – April 1999 3 Chapter 4.7.2


RD/Hitachi Elecsys 2010 Service Manual

- Turntable C

PI310 (Rack Detection) PI311 (Rack Detection)

Motor SM310 PI312 (HOME Pos.) Motor SM311 PI313 (Turn End Pos.)

V 1.6 – April 1999 4 Chapter 4.7.2


RD/Hitachi Elecsys 2010 Service Manual

4.7.3 List of Motors, Sensors, and Other Mechanisms for Rack Sampler connected to CLAS 1
System

- List of Motors

No. Unit Type Part No. Drive PCB Control PCB


1 A line C7640-9212K 741-7258 DO5 GPCONT12
2 B2 line KP56-KM1-014 K591127 DO5 GPCONT13
3 C line A3339-9212 725-1153 DO5 GPCONT12
4 I line KP56-KM1-014 K591127 DO5 GPCONT14
5 Turntable C KH42-HM2-052 741-1049 DO5 GPCONT16
(for Belt)
6 Turntable C KH56-HM2-016 741-1048 DO5 GPCONT16
(for Rotation)

- List of Sensors

No. Item Description Type Part No. Bright/Dark


1 Photo-Coupler PI200 A line Tray Detection PM2-LF10 J684015 Dark
2 Photo-Coupler PI201 A line Home Pos. GP1A34LC J339165 Dark
3 Photo-Coupler PI202 A line Rack Feed End Pos. GP1A34LC ↑ Dark
4 Photo-Coupler PI210 B2 line Home Pos. GP1A34LC ↑ Dark
5 Photo-Coupler PI211 B2 line Rack Feed End Pos. GP1A34LC ↑ Dark
6 Photo-Coupler PI212 B2 line Rack Detection PM2-LF10 J684015 Dark
7 Photo-Coupler PI213 B2 line Receiving Pos. GP1A34LC J339165 Dark
8 Photo-Coupler PI215 B2 line Sampling Pos. PH-D 741-5053 Bright
PH-T 741-5054
9 Photo-Coupler PI216 B2 line BCR Read Pos. GP1A34LC J339165 Bright
10 Photo-Coupler PI217 B2 line Cup Detection PM2-LF10 J684015 Dark
11 Photo-Coupler PI218 B2 line Rack Detection PM2-LF10 ↑ Dark
12 Photo-Coupler PI221 C line Home Pos. GP1A34LC J339165 Dark
13 Photo-Coupler PI222 C line Rack Feed End Pos. GP1A34LC ↑ Dark
14 Photo-Coupler PI223 C line Rack Full Detection PM2-LF10 J684015 Dark
15 Photo-Coupler PI224 C line Tray Detection PM2-LF10 ↑ Dark
16 Photo-Coupler PI225 C line Tray Full(1) Detection PM2-LF10 ↑ Dark
17 Photo-Coupler PI226 C line Tray Full(2) Detection PM2-LF10 ↑ Dark
18 Photo-Coupler PI300 I line Home Pos. GP1A34LC J339165 Dark

V 1.6 – April 1999 1 Chapter 4.7.3


RD/Hitachi Elecsys 2010 Service Manual

19 Photo-Coupler PI301 I line Rack Feed End Pos. GP1A34LC ↑ Dark


20 Photo-Coupler PI302 I line Rack Detection PM2-LF10 J684015 Dark
21 Photo-Coupler PI303 I line Rack Buffer Pos. PM2-LF10 ↑ Dark
22 Photo-Coupler PI310 Turntable C Rack Detection PM2-LF10 J684015 Dark
23 Photo-Coupler PI311 Turntable C Rack Detection PM2-LF10 ↑ Dark
24 Photo-Coupler PI312 Turntable C Home Pos. GP1A34LC J339165 Dark
25 Photo-Coupler PI313 Turntable C Turn End Pos. GP1A34LC ↑ Dark

- List of LEDs and Fan Motor

No. Item Description Type Part No. Voltage


1 LED201 A line Tray Exchange BD-703G J853635 5V
2 LED202 C line Tray Exchange BD-703G ↑ 5V
3 LED300 Power ON Indicator BD-703G ↑ 5V
4 LED301 I line Set Rack Indicator BD-703G ↑ 5V
5 Fan Motor Cooling of DC Power Supply MD-825- L542069 24V
BM-24

Chapter 4.7.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.7.4 Explanation of Each Mechanism

- A Line

Structure
(Stroke: 441 mm Delay: 2 mm Sensor-to-sensor: 437 mm, 2778P)

(1) Motor Equipped SM200: C7640-9212K

• Two-phase motor, step angle 0.9°/full step


• Rated current 1.0 A
• 1-2 phase drive
• Equipped with magnet damper

(2) Tray Employed

• Rack sampler tray


(15 racks provided: 75 samples)
• Buffer equipped on downstream of tray feed
(5 racks provided: 25 samples)

(3) Rack Feed Rate

• High-speed feed 1917.2 PPS (304.3 mm/s) --- at return of arm


• Low-speed feed 458.2 PPS (72.7 mm/s) --- at return of arm
• Constant-speed feed 849.2 PPS (134.8 mm/s)

Overview of Operation

On this line, sample racks (up to 15 racks) are set on a tray and it is transferred to the B line. This line is also available as a
STAT sample entry line. (Racks on the A line take precedence over those on the transfer connection line.)

Chapter 4.7.4 1 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
Rack Feed Operation

(1) Conditions for Starting Rack Feed Operation in OPE State

• The rack detection signal (PI212 detection: dark) is not turned off.
• The home detection signal (PI201) is turned on.

(2) Rack not Ded in RESET State

• When the home detection (PI201 detection: dark) is not turned on, the home-return operation is carried out.
• When the home detection signal (PI201: dark) is turned on, the home-release home-return sequence is carried out.

Operation Rules

(1) Upon detection of the home position (PI201 detection: dark), an interrupt is made to stop movement.

(2) In rack feed to the B line, an interrupt for stopping movement is made at the time of rack detection (PI212) detection:
dark). It is ORed with rack feed end detection (PI202: dark). After rack feed end detection or rack detection, a return
to the home position is made each time. At the time of rack feed end detection (PI202 detection), an interrupt is also
performed to stop movement.

(3) In the STANDBY state, it is possible to start rack feed operation by setting the rack tray and pressing the START key.
(The OPE state is set up.) All the samples on the tray are treated as STAT samples. Until the rack feed end detection
(PI202) signal is turned on, the racks on the A line are fed with the highest priority. When all the racks are fed out of
the A line, the racks can be transferred to the B line from the transfer connection line side.

(4) In the OPE state, entry of STAT samples is recognized through rack tray setting detection (tray detection PI200 OFF -
> ON) and the rack feed operation on the A line is started. When the processing of samples on the tray is completed
and all the racks are fed out of the A line, the same sample operation sequence as in (3) is carried out.

(5) When the rack feed end detection signal (PI202 detection) is turned on, a return to the home position is made and then
the rack feed operation is performed again.
• When the rack detection signal (PI212 detection) is turned on, the operation is continued.
• When the rack feed end detection signal (PI202 detection) is turned on, a return to the home position is
performed and a waiting condition is taken in the OPE state.
(In a state that the racks can be transferred from the transfer connection line side to the B line.)

(6) When there is no rack on the A line in the OPE state and the A line arm is set at the home position, it is possible to
make addition on a rack-by-rack basis. In this case, the feed operation of STAT sample racks to the B line can be
started by STAT key input.

(7) The tray change allowable timing is indicted by LED (color: green).

(8) In rack feed to the B line, when there is a rack at the sample position, the rack is fed at the last sampling cycle for the
last sample on it.

Chapter 4.7.4 2 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

- B Line

Structure
(Stroke: 207 + 125 mm Delay: 2 mm included)

Details of Barcode Reading Position


(Re-clamping with claw after reading of rack barcode)

(1) Motor Equipped SM210: KP56KM1-014

• Two-phase motor, step angle: 0.9°/full step


• 1-2 phase drive

(2) Rack Feed Rate: Accelerating/decelerating pulse 250P (0.237S)

• High-speed feed 1917 PPS (304.4 mm/s)


• Low-speed feed 191 PPS (30.3 mm/s)

(3) Overview of Operation

On this line, the sample racks are received from the A line or the rotating mechanism C (transfer connection line) and
transferred to the barcode reading position and the sampling position accurately. Then, after the sample and rack
barcodes are read and the sampling is performed, the racks are fed to the C line (storage unit) or D line.

Chapter 4.7.4 3 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
Rack Feed Operation

(1) Condition for Starting Rack Feed Operation in OPE State

• The rack detection signal (PI212: dark) or the rack receiving position detection signal (PI218: dark) is turned on.

(2) Conditions for Starting Rack Feed Operation in RESET State

• When the home detection signal (PI210: dark) is turned on, the releasing from home position is performed and then
the following sequence is taken.
1) If the home detection signal (PI210: dark) remains on, it is checked whether the rotation end detection signal
(PI313) for the rotating mechanism C of the transfer connection line is turned on.
If the rotation end detection signal (PI313) is not turned on, the system waits until it becomes on. After
movement to the rack receiving position, if the rack receiving position detection signal (PI218: dark) is turned
on, the system waits until the OPE state is set. (When the OPE state is set, the processing is carried out for the
relevant rack with the highest priority.) If the rack receiving position detection signal (PI218: dark) is off, the
system waits until the C line (storage unit) or D line becomes ready to receive racks. Then, the racks are
transferred to the C line or D line. Thereafter, the home return operation is performed, and then the system
waits until the OPE state is reached.
2) If the home detection signal (PI210: dark) is turned off, the home return operation is performed. Then, the
system waits until the OPE state is reached.
• If the home detection signal (PI210: dark) is turned off, the system waits until the C line (storage unit) or D line
becomes ready to receive racks. Then, the racks are transferred to the C line or D line. Thereafter, the home return
operation is performed, and then the system waits until the OPE state is reached.
• Before barcode reading, the racks are not reset.

(3) Condition for Feed to Sampling Position

When the rack full detection signal (PI223) for the C line (storage unit) buffer is turned on, a series of analytical
operations is performed continuously. After completion of sampling of the last sample on the transferred rack, the
system waits at the sampling position until the rack full detection signal turns off.

Operation Rules

• Upon detection of the home position (PI210: dark), an interrupt is made to stop movement.
• Upon detection of the barcode reading position (PI216: dark), movement to the sample barcode reading position is
interrupted and stopped (for five samples). After the firth sample, the constant pulse feed is performed to the rack
barcode reading position. (This constant pulse feed is adjustable with T/M.)
• After barcode reading, the re-clamping with claw is performed.
• Upon detection of the sample position (PI2156: dark -> bright), movement from the barcode reading position to the
sampling position is interrupted and stopped. Also, upon detection of the sampling position (PI215: dark -> bright),
movement between samples is interrupted and stopped. For samples requiring no analysis or empty positions, the skip
processing is performed. In case of an empty rack, the processing is performed using one machine cycle.
• Movement from the sampling position to the C line (storage unit) or D line is interrupted and stopped upon detection of
the rack feed end signal (PI211: dark).
• STAR rack processing
The same operation sequence as for the A line is carried out.

Chapter 4.7.4 4 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

- C Line

Structure
(Stroke: 139 mm Delay: 2 mm included)

(1) Motor Equipped SM220: A3339-9212

• Two-phase motor, step angle : 0.9°/full step


• Rated current : 1.2 A
• 1-2 phase drive

(2) Tray Employed

• Rack sampler tray (15 racks provided: 75 samples)


• Buffer equipped on upstream of tray feed (5 racks provided: 25 samples)

(3) Rack Feed Rate

• High-speed feed 955.7 PPS (151.7 mm/s)


• Low-speed feed 550.2 PPS (29.1 mm/s)

Overview of Operation

On this line, the sample racks are received from the B line and transferred to the storage tray using the rack transfer arm.
(Maximum number of racks transferred: 15)

Chapter 4.7.4 5 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
Rack Feed Operation

(1) Conditions for Rack Feed in OPE State

• The C line is set at the home position. (PI221 detection: dark)


• The tray full detection signal (1) (PI225 detection: dark) is turned off, the tray full detection signal (2) (PI226
detection: dark) is off, the tray detection signal (PI224: dark) is on, and the rack full detection signal (PI223
detection: dark) is off.
(Feed to tray: Stroke 139 mm)
• The tray full detection signal (1) (PI225 detection: dark) is off, the tray full detection (2) (PI226 detection: dark) is
off, the tray detection signal (PI224: dark) is off, and the rack full detection IPI223 detection: dark)is off.
(Feed to buffer: Stroke 27 mm)
• The tray full detection signal (1) (PI225 detection: dark) is on, the tray full detection signal (2) (PI226 detection:
dark) is off, the tray detection signal (PI224: dark) is on, and the rack full detection signal (PI223 detection: dark)
is off.
(Feed to tray in case that the feed-to-tray storage operation was performed previously;
Feed to buffer in case that the feed-to-buffer operation was performed previously)
• The tray full detection signal (1) (PI225 detection: dark) is on, the tray full detection signal (2) (PI226 detection:
dark) is on, the tray detection signal (PI224: dark) is on, and the rack full detection signal (PI223 detection: dark)
is off.
(Feed to buffer: Stroke 27 mm)
• The tray full detection signal (1) (PI225 detection: dark) is on, the tray full detection signal (2) (PI226 detection:
dark) is off, the tray detection signal (PI224: dark) is on, and the rack full detection signal (PI223: dark) is on.
(Fee operation disabled)

No. Tray detection Rack full detection Tray full detection Tray full detection Judgment
signal signal signal (1) signal (2)
PI224 PI223 PI225 PI226
1 ON OFF OFF OFF Feeding to tray
2 OFF OFF OFF OFF Feeding to buffer
3 ON OFF ON OFF Feeding to tray or
buffer
4 ON OFF ON ON Feeding to buffer
5 ON ON ON OFF Not fed
6 OFF ON OFF OFF Not fed
7 ON ON ON ON Not fed
8 ON ON OFF ON Not fed

(2) Conditions for Rack Feed in RESET State

• When the C line is set at the home position (PI221 detection: dark), the rack transfer operation is carried out in the
same manner as mentioned above.
• When the C line is not set at the home position, a return to the home position is performed and then the rack
transfer operation is carried out as mentioned above.

Chapter 4.7.4 6 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
Operation Rules

• Upon detection of the home position (PI221: dark), an interrupt is made to stop movement.
• In the normal rack feed operation, when the home positioning is performed and the rack feed end detection (PI222:
dark) is made, an interrupt is issued to stop movement. (One rack is fed to the tray.) On completion of feed, a return to
the home position is performed.
If both the rack full detection signal (1) (PI225: dark) and the rack full detection signal (2) (PI226: dark) are turned on
after completion of feed, a warning alarm is issued. Thereafter, one-pitch feed is performed until the rack full detection
signal (PI223 detection: dark) is turned on.
• When both the tray full detection signals are turned off, all the racks stored in the buffer are fed to the tray collectively.
(Up to five racks are fed.)
• If both the tray full detection signal and the rack full detection signal (PI223 detection: dark) are turned on, a warning
alarm is issued.
• Thereafter, if both the tray full detection signals are turned off, the analytical operation is resumed automatically.
• In returning to the home position after one rack is fed (one-pitch feed), the remaining pulse check is performed. In this
check, it is judged whether the one-rack feed has been made normally or not. (If the remaining pulse count is more than
30 P, a line-stop-level alarm is issued.)
• The timing for enabling tray exchange is indicated by the LED (color: green).

Chapter 4.7.4 7 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

- I line

Structure
(Stroke: 689 mm Delay: 2 mm included) Two-claw operation

(1) Motor Equipped SM300: KP56HM2-016

• Two-phase motor, step angle : 0.9°/full step


• Rated current : 0.85 A
• 1-2 phase energization : 0.45°/P

(2) Rack Feed Rate: Accelerating/decelerating pulse 250P

• High-speed feed 1917 PPS (304.4 mm/s)


• Low-speed feed 191 PPS (30.3 mm/s)

Overview of Operation

On this line, each sample rack received form the transfer connection line is transferred by hooking the front of the rack with
the rear claw. Then, the clamping position is changed, and the rear of the rack is pushed with the front claw. Thus, the rack
if transferred to turntable C through the buffer position.

Rack Feed Operation

(1) Conditions for Rack Feed in OPE State

• The I line is set at the home position (PI300: dark).


• The inlet-position rack detection signal (PI302) is turned on, or the waiting-position rack detection signal (PI303)
is turned on.

Chapter 4.7.4 8 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
(2) Conditions for Rack Feed in RESET State

• When the I line is set at the home position regardless of the inlet-position rack detection signal (PI302). (PI300:
dark)
(a) When the waiting-position rack detection signal (PI303) is turned on, the system waits until the OPE state is
reached.
(b) When the waiting-position rack detection signal (PI303) is not turned on, the home position releasing and
returning operations are performed. Then, the rack receiving, front-claw feed, rack re-clamping, etc. are
performed for feeding until the waiting position is reached. Then, with the waiting-position rack detection
signal (PI303), it is checked whether the rack is present or not.
1) If the rack is present, the system waits until the OPE state is reached.
2) If the rack is not present, the home return operation is performed.
• When the I line is not set at the home position and the waiting-position rack detection signal (PI303) and the inlet-
position rack detection signal (PI302) are turned off, the returning to home position is performed and then the
remaining pulse check is made. Thereafter, the rack receiving, front-claw feed, rack re-clamping, etc. are
performed for feeding until the waiting position is reached. Then, with the waiting-position rack detection signal
(PI303), it is checked whether the rack is present or not.
(a) The returning to home position is performed if the remaining pulse count is 753 P or more.
(b) If the remaining pulse count is less than 753 P, the presence/absence of the rack is checked with the rack
detection signal (PI311) at turntable C.
(c) If the rack is present, the system waits until the OPE state is reached.
(d) The result of the previous remaining pulse check is examined.
(e) For the remaining pulse data, the home return operation is performed.
(f) If the rack is not present, the system waits until turntable C is returned to the home position. Then, the rack
feed operation is performed until the end of rack feed is detected (PI301: dark).
• When the I line is not set at the home position, the inlet-position rack detection signal (PI302) is turned on and the
waiting-position rack detection signal (PI303) is not turned on, the following operations are carried out: After
returning to the home position, the remaining pulse check is carried out. Then, the transfer operation is performed
in a range from home positioning to re-clamping reparation position setup. Thereafter, using the inlet-position rack
detection signal (PI302), it is checked whether the rack is present or not.
(a) If the rack is present, the transfer operation is performed until the waiting position is reached. Then, using the
rack detection signal (PI303) at the waiting position, it is checked whether the rack is present or not.
1) If the rack is present, the system waits until the OPE state is reached.
2) If the rack is not present, the result of the previous remaining pulse check is examined.
a) If the remaining pulse count is 753 P or more, the home return operation is performed.
b) If the remaining pulse count is less than 753 P, the rack detection signal (PI311) at turntable C is
examined.
(i) If the rack detection signal is turned on, the home return operation is performed.
(ii) If the rack detection signal is not turned on, the system waits until turntable C returns to the home
position. Then, the rack feed operation is performed until the end of rack feed is detected
(PI301: dark).
(b) If the rack is not present, the rack re-clamping return operation and re-clamping preparatory positioning
operation are performed. Thus, the transfer operation is performed until the waiting position is reached, and
then the system waits until the OPE state is reached.
• If the I line is not set at the home position and the rack detection signal (PI303) at the waiting position is turned on,
the home position returning operation is performed regardless of the inlet-position rack detection signal (PI302).
Then, the transfer operation is performed until the waiting position is reached. Thereafter, the system waits until
the OPE state is reached.

Operation Rules

• Upon detection of the home position (PI300: dark), an interrupt is made to stop movement.
• At the time of rack transfer, the rack is transferred forward with the rear claw.
• After forward transfer, the rack re-clamping is performed (the rack is fed on the rear with the front claw).
• In rack transfer operation, after the waiting position is set (temporary stop), the rack feed end detection signal (PI301:
dark) is turned on to make an interrupt for stop.
• The rack received on this line form the transfer side is not reset.
• The rack waiting position timing is indicated by the LED (color: green).

Chapter 4.7.4 9 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Turntable C

Structure

(1) Motor Equipped

1) Belt drive motor SM310: KH42HM2-052


• 1-2 phase energization (directly connected with pulley), Step angle 0.9°/1-2 phase
• Speed 601 PPS

2) Rotary table motor SM320: KM56HM2-016


• 1-2 phase energization, Step angle 0.9°
• 90° operation
• Rotating speed
a) High-speed rate: 200 PPS
b) Low-speed rate: 30 PPS
• Pulley employed
φ25 ... 118 mm/s

Overview of Operation

(1) Conditions for Rotation of Turntable C in OPE State

The home detection signal (PI312: dark) and the rack detection signal (PI311: dark) are turned on, and also the motor
(SM311) is stopped.
• When the rotation end detection signal (PI313: dark) is turned on, the rack detection signal (PI310/PI311: dark) is
not turned on, and also the motor (SM311) is stopped. Still more, both the rotation end detection signal (PI313)
and the rack detection signal (PI310/PI311) are turned on, and also the motor (SM311) is stopped.

(2) Condition for Belt Drive Operation in OPE State (except for resetting)

• The home detection signal (PI312: dark) or the rotation end detection signal (PI313: dark) is turned on.

Chapter 4.7.4 10 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual
(3) RESET Operation

No. Home detection signal Rotation end detection Rack detection signal Operation
PI312 signal PI311
PI313
1 ON OFF ON Operation in a)
2 OFF ON ON Operation in b)
3 OFF OFF ON Operation in c)
4 ON OFF OFF Operation in d)
5 OFF ON OFF Operation in e)
6 OFF OFF OFF Operation in f)

a) When transfer-in is allowed on the downstream line, the rotary table motor (SM311) is driven until the rotation end
detection signal is turned on. Then, the belt drive motor (SM310) is run to transfer out the rack. If transfer-in is
not allowed on the downstream line, the system waits until it becomes allowable.
b) When transfer-in is allowed on the downstream line, the belt drive motor (SM310) is run to transfer out the rack. If
transfer-in is not allowed on the downstream line, the system waits until it becomes allowable. If the rack detection
signal (PI311) is not released after operation, the rotation end detection release/return operation is performed to
run the belt drive motor (SM311) again for transferring out the rack.
c) The rotary table motor (SM311) is run until the rotation end detection signal is turned on. Then, when transfer-in
is allowed on the downstream line, the belt drive motor (SM310) is run to transfer out the rack. If transfer-in is not
allowed on the downstream line, the system waits until it becomes allowable.
d) The home position release/return operation is performed, and then the system waits.
e) The rotary table motor (SM311) is run to perform the home position returning operation, and then the system
waits.
f) Same as described in e).

Operation Rules

(1) Rotating Mechanism

Upon detection of the home position (PI312: dark), an interrupt is made for stop. Upon detection of the rotation end
position (PI313: dark), an interrupt is made for stop.

(2) Belt Line

a) For transfer-in, the rack detection signal (PI311: dark) is turned on to make an interrupt for stop.
b) In transfer-out, the constant-pulse feed is performed.

Chapter 4.7.4 11 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

4.7.5 Mechanical Adjustment Procedure for Rack Sampler connected to CLAS 1 System

Unit Adjustment item Specification Adjustment method


A Line 1. Adjustment of A line arm mounting Perpendicularity between rack guide of rack tray and arm (≤ ±1°) (Mechanism adjustment)
position
2. Adjustment of rack guide position on Alignment between rack guide center on rack tray and rack guide center on buffer (Mechanism adjustment)
buffer base base (≤ ±0.5 mm)
3. Adjustment of buffer base position Buffer base position should be adjusted so that no clearance is left between buffer (Mechanism adjustment)
base and B line rack guide.
4. Adjustment of rack feed position on Adjustment of clearance between A line arm and rack (with rack being pushed on (Software adjustment)
A line (Adjustment of rack transfer in B line rack rail) (1 to 2 mm)
position on B line)

5. Belt tension No adjustment 


B2 Line 1. Adjustment of sampling position Tip should be aligned with center of test tube. (≤ ±0.3 mm) (Software and mechanism
adjustment)
2. Adjustment of BCR reading position  (Automatic software adjustment)
3. Adjustment of rack feed position on Center of notch for rack overturning prevention should be aligned with center of rack (Software adjustment)
B line(Adjustment of C line rack guide on buffer base. (≤ ±1 mm)
transfer-in position)
4. Belt tension No adjustment 
C Line 1. Adjustment of C line arm mounting 1. Perpendicularity between rack guide of rack tray and arm (≤ ±1 mm) 
position
2. Alignment between rack rail plane on B line and arm plane (-1 to 0 mm) (Mechanism adjustment)
2. Adjustment of rack guide position on Rack guide center on rack tray should be aligned with rack guide center on buffer (Mechanism adjustment)
buffer base base. (≤ ±0.5 mm)
3. Adjustment of buffer base position Buffer base position should be adjusted so that no clearance is left between buffer (Mechanism adjustment)
base and B line rack guide.
4. Belt tension No adjustment 
Turntable C 1. Adjustment of home position Belt line of Turntable C should be in parallel to I line. (≤ ±1°) (Software adjustment)
2. Adjustment of end position Belt line of Turntable C should be in parallel to B line. (≤ ±1°) (Software adjustment)
I Line Belt tension No adjustment 

V 1.6 – April 1999 1 Chapter 4.7.5


RD/Hitachi Elecsys 2010 Service Manual

4.8 Instrument History

4.8.1 Instrument History – Rack Systems

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part name and Part Serial No. Label Retrofit
before the name after
change the change
1 741-7363 741-7641 The barcode reading sometimes fails. Change of the mounting direction of Barcode Reader. 0902-01 Interchangeable. A
Barcode Holder Barcode onward Change with no. 2
Holder
2 741-7362 741-7642 The barcode reading sometimes fails. Change of the mounting direction of Barcode Reader. 0902-01 Interchangeable. A
Base for Base for onward Change with no. 1
Barcode Reader Barcode
assy Reader assy
3 741-7436 741-7474 To use the same Rear Cover between the Rack Change of the Rear Cover. 0902-01 Interchangeable. A
Rear Cover Rear Cover Sampler and Rack Conveyer. onward Change with no. 4
4 741-7437 741-7275 To use the same Rear Cover between the Rack Change of the Rear Cover.´ 0902-01 Interchangeable. A
Rear Cover 2 Rear Cover 2 Sampler and Rack Conveyer. onward Change with no. 3
5 741-6531 Not changed Shutter B is sometimes loose from mounted on the Fix the Guide (741-7466) to the shutter B and mount the 0904-01 B
Slider B assy Slider B assy. Shutter B on the Slider B assy with a screw. onward
6 --- --- When packing instrument, the B Line The Cover Plate added on the Sensor Plate to protect the B 0904-01 B
Sensor(PI213)sometimes touch’s to the packing line sensor. onward
material and is removed from the Sensor Plate.(741-
7486)
7 741-7500 Not changed The additional two holes to mount the R Plate.(741- Improvement of Dead Volume. 0908-18 Interchangeable. C Yes
Arm T 7649) onward Change with no. 8
8 --- 741-7649 Mount the newly designed R Plate(741-7649) on the Improvement of Dead Volume. 0908-18 Interchangeable. C Yes
R Plate new arm T.(741-7500) onward Change with no. 7
9 --- 741-4691 Wrap the cord J710(741-4639) Improvement of Dead Volume. 0908-18 C Yes
Cable 220 onward
10 --- 741-4692 Wrap the cord J711(741-4640), and the cord J712 Improvement of Dead Volume. 0908-18 C Yes
Cable 490 onward
11 741-7248 Not changed The shape of Table Cover L2 has been altered. The test tube guide sometimes touch’s the Table Cover L2 0908-53 D
Table CoverL2 so that the test tube guide cannot be opened fully, and onward
obstructs Rack transfer..

V 1.6 – April 1999 1 Chapter 4.8


RD/Hitachi Elecsys 2010 Service Manual

4.8.2 Instrument History – Disk Systems

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part name and Part Serial No. Label Retrofit
before the name after
change the change
1 741-0129 741-0137 Probe and LLD PC board have been improved to Changed from 2 layer structure to 3 layer structure. 0808-06 Interchangeable. D Yes
P Nozzle P Nozzle 2 prevent misdetection of Pipetter LLD caused by onward. Change with no. 2.
dirty water.
2 741-5043 741-5048 The same as no. 1. With the change of no. 1. 0808-06 Interchangeable. D Yes
LLD-PA PCB LLD-P3 PCB onward. Change with no. 1.
Assy Assy
3 741-4319 Not changed. Damper has been added to reduce Y motor Motor has been changed to Both Shafts type (same part 0802-51 Interchangeable. B OSK7.0
Motor Assy vibration of T/V Carrier. number). onward.
Damper has been added to Motor (L420000 Damper).
4 741-1116 Not changed. Shape of insert part has been changed to prevent Shape of insert part has been changed 0802-51 Interchangeable. B OSK7.0
Slider Y detaching of molded insert part of T/V Carrier. (stopper has been added in pulling out direction). onward.
5 741-1138 Not changed. Mounting dimensions have been changed to Insert part is processed so that the projection amount is 0 - 0802-51 Interchangeable. B OSK7.0
Slider X prevent detaching of molded insert part of T/V 0.2 mm. onward.
Carrier.
6 741-1136 Not changed. The same as no. 5. The same as no.5. 0802-51 Interchangeable. B OSK7.0
Base X onward.
7 741-1152 Not changed. The same as no. 5. The same as no. 5. 0802-51 Interchangeable. B OSK7.0
Case Z onward.
8 741-1155 Holder 741-1624 Vibrations in operation have been reduced by 2 parts have been made to single part. 0802-51 Interchangeable. B OSK7.0
Z Holder Z2 reinforcing T/V Carrier. onward. Change with no. 9
741-2010 and no. 10.
Support XZL
9 741-2011 741-1499 With the change of no. 8, related part has been Shape has been altered to prevent interference with part of 0802-51 Interchangeable. B OSK7.0
Support XZH Support XZH2 changed. CARRIER UNIT no. 8. onward. Change with no. 8
and no. 10.
10 741-1150 Not changed. The same as no. 9. The same as no. 9. 0802-51 Interchangeable. B OSK7.0
Cover C onward.
11 741-1162 Not changed. Shape of Cam has been changed to improve Area of Cam contacting part when Gripper Finger 0802-51 Interchangeable. B OSK7.0
Cam reliability of open/close function of Gripper Finger. opens/closes has been enlarged, and chamfering has been onward.
added.
12 741-1996 Not changed. Shape has been changed to improve grip force and Shape of part that contacts Tip/Vessel when gripping, has 0802-51 Interchangeable. B OSK7.0
Gripper Finger L to prevent rust, and surface process has been added. been changed, and non-electrolyzing nickel plating has been onward.
Carrier Unit added.
13 741-1130 Not changed. Dimension precision of Magazine Tray has been Dimension precision has been improved by the change of 0802-51 Interchangeable. B OSK7.0
Magazine Tray changed to improve reliability of conveyance mold. through 60.
function of T/V Carrier, and the material has been The material has been changed. 0803-21

Å
changed for measures against static electricity. ABS containing conductive substance amount 6% (light onward.
green stripes) 8% (black).

Chapter 4.8 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part and Part Serial No. Label Retrofit
name before name after
the change the change
14 741-1124 Not changed. Replaced with a good one because of incorrect Manufacturer is restricted to Sansei Co. 0802-01 Interchangeable. B OSK7.0
Timing Belt dimensions of Y belt. through 50.
C(Y) CARRIER UNIT Defective part

15 741-1050 Not changed. A drain hole has been added to the part covering A hole of 6 mm diameter for draining water has been made 0804-01 Interchangeable. C
P Arm Base Pipetter LLD PC board. at the bottom of the part covering LLD PC board. onward.
16 741-1322 Not changed. The mounting heights of Bar-code Card for A Guide (protruding) has been added to Card Inserting Unit 0802-51 Interchangeable. B OSK7.0
Holder Adjustment and actually used Sample/ Reagent to modify the height of Bar-code Card for Adjustment. onward.
Bar-code have been made equal to improve reading
rate.
BCR UNIT
17 741-0606 Not changed. A Cushion has been added to protect Front Cover Added part 0802-51 Interchangeable. B OSK7.0
Front Cover which is hit when opening/closing Front Covers 741-3136 onward.
Assy (two, large and small) covering Drive Unit. Cushion Rubber
18 741-1503 Not changed. Shape of Seal Unit in Valve has been changed to Shape of Seal Surface to which O-Ring in Valve Body 0803-21 Interchangeable. B OSK7.0
Valve Body prevent leak of water from Valve mounted to under contacts has been changed. The color of Valve Body has onward.
Water Supply Bottle. been changed from Vega-white to gray as a mark.
19 J839006 741-1327 Pipe connecting Washing Station P and S has been Pipe Fixing Part has been changed from "without Stopper" 0802-51 Interchangeable. B OSK7.0
Nylon Clip Pipe Guide fixed with Stopper to prevent disconnection. to "Hook Shaped Metal Piece with Stopper" onward.
HP-10N TUBING
20 A List of adjustment values when shipping from A sheet of adjustment values in a vinyl plastic bag is 0803-01 Interchangeable. B
--- --- Instrument Division is attached as a reference for attached to the back of Maintenance Cover for Detection onward.
readjustment of Mechanical Part for servicing. Unit with a adhesive tape.
21 --- 741-2028 Check Label has been attached to Instrument to Check Label has been attached to Front of Instrument 0803-01 Interchangeable. B OSK7.0
Check Label make the modification state clear. behind FDD Cover of Instrument Front onward.
22 741-1463 741-3155 Change of Lead Wire fixing part of Beads Mixer The part has been changed from rubber O-Ring to SUS hook 0802-51 Interchangeable. C OSK7.0
O-Ring Fork Spring Unit. spring to prevent break by stress. through 60.
0804-01
inward.
23 741-0632 Not changed. The Pulley has been made smaller to prevent Piping The diameter of Pulley has been changed from 0802-51 Interchangeable. C OSK7.0
Pulley Guide Pulley of Pipetter Unit from touching Front 20.5 mm to 18 mm. through 60.
Cover. 0804-01
onward.
24 741-0891 Not changed. Pulley mounting position has been changed to Base to which Pulley is mounted has been changed. 0802-51 Interchangeable. C OSK7.0
PB Base prevent no. 26 Pulley of Pipetter Unit from through 60.
touching Front Cover. 0804-01
onward.

V 1.6 – April 1999 3 Chapter 4.8


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part and Part name Serial No. Label Retrofit
name before after the change
the change
25 M4 Screw, M4 Screw Screws for fixing Pulley for Pipetter X belt and To avoid touching of the protruding screw head to Timing 0802-51 Interchangeable. C OSK7.0
Washer Spring (with Washer) part of Base have been changed. Belt, Washer and Spring Washer have been removed, Screw through 60.
Washer kind has been changed. 0804-01
onward.
26 741-1778 Not changed. Tube length has been enlarged, the arranging way The length of Tube has been changed from 510 mm to 675 0802-51 Interchangeable. C OSK7.0
Tube 510 has been changed to prevent Tube for Pipetter mm, and the arranging way of Tube has been changed. through 60.
from getting entangled. 0804-01
onward.
27 741-0895 Not changed. Shape of Tube Guide has been changed to Shape of Guide has been changed to prevent Tube 510 for 0802-51 Interchangeable. C OSK7.0
Guide prevent Tube for Pipetter from getting entangled. which the arranging way has been changed from touching through 60.
Guide. 0804-01
onward.
28 741-4325 Not changed. Since connecting part of Gripper FPC Cable and Silicone rubber has been applied to connecting part of Gripper 0802-51 Interchangeable. C OSK7.0
Cord FPC C11 Solenoid Lead Wires was weak, it has been FPC Cable and Solenoid Lead Wires for reinforcement. through 60.
reinforced. 0804-01
onward.
29 741-0606 Not changed. Protection tape has been attached to Front Cover Addition of component part 0802-51 Interchangeable. C OSK7.0
Front Cover contacting part to prevent Tube for Pipetter from 725-1851 Tape through 60.
Assy touching the back of Front Cover. 0804-01
onward.

Å
30 741-0109 741-0108 Process of Main Base has been changed from Change of Base material, 0806-11 Not interchangeable.
Main Unit Main Unit Base Aluminum Cutting to Plastic Mold to improve Aluminum PPE resin onward.
Base Assy Assy production efficiency.

Å
31 741-4030 741-4035 To pass Plastic Base instrument CE, GS, UL Change of component part 0806-11 Before the change:
AC Unit Assy AC Unit Assy Standards. 741-1631 Base 741-1723 Base M onward. For aluminum base,
After the change:
For plastic base.

Å
32 741-4031 741-4031 The same as No.31. Change of component part 0806-11 Before the Change:
DC Power DC power 1. 741-1994 741-1723 onward. For aluminum base,

Å
Supply Assy Supply Assy DC Base DC Base M After the change:
2. 741-1995 741-1725 For plastic base.
DC Connector 2 DC Connector M

Chapter 4.8 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Part Part number Content of Change Details of Change Affected Interchangeability History Field
number and and Part name Serial No. Label Retrofit
Part name after the change
before the
change

Å
33 741-0113 741-0165 To change to High Bright TFT. Change of component part 0806-11 Before the change:
U/I Assy U/I (3.3) Assy 1. 741-5912 741-5917 onward. For aluminum base,

Å
TFT-2 Assy TFT-3 Assy After the change:
2. 741-1987 741-1596 For plastic base.

Å
Shield Plate Shield Plate M
3. 741-1949 741-1998

Å
Support Support 2
4. 271-4084 271-4184
EUIF101 PCB ASSY EUIF102 PCB Assy

Added part
1. 714-4339 TFT Cable Assy
2. 741-3127 Joint Plate L
3. 741-3128 Joint Plate R
34 741-1822 Not changed. Part filling up the opening has been changed to Notched Part to hold the lead wires of Photo multiplier has 0807-01 Interchangeable. C
Bush HV prevent the light from entering the photo been closed with both sides adhesive tape. onward.
multiplier through the opening.
35 There is only There is only Since it was too long, the lead wires of Photo The lead wires have been folded to the minimum length and 0809-01 Interchangeable. E
Instruction Instruction for multiplier have been folded to the suitable length fixed with a fixer so that the lead wires will not be pulled when onward.
for works, works, but no and fixed. Photo multiplier is pulled out.
but no parts. parts.
36 741-5042 Not changed. To change to high Bright TFT. IC Drive voltage has been changed from 5.OV to 3.3V. 0806-11 Before the change:
Circuit onward. For aluminum base,
Board UIRS- After the change:
A For plastic base.

Å
37 741-0571 741-0630 The length of Washing Station S has been Change of component part 0806-11 Before the change:
Washing Washing Station shortened by 7 mm by restriction on 741-1617 741-1727 onward. For aluminum base,
Station S S(M) Assy manufacturing plastic bases. Pipe 2 Pipe 2M After the change:
Assy For plastic base.

V 1.6 – April 1999 5 Chapter 4.8


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part and Part name Serial No. Label Retrofit
name before after the change
the change

Å
38 741-4201 741-4202 CE correspondence of plastic base instrument.. Change of component part 0806-11 Before the change:
Connection Connection 1. 741-4265 741-4340 onward. For aluminum base,

Å
Cords Assy Cords (2) Assy Cord P401 Cord (1) P400 After the change:
2. 741-4277 741-4341 For plastic base.

Å
Cord P413 Cord (1) P413
3. 741-4267 741-4338
Cord P345 Cord 2 P345
39 741-4267 741-4338 Change of Printer Cable Centronix-Parallel Interface-Connector has been changed to 0806-11 Before the change:
Cord P345 Cord 2 p345 IBM-PC style Parallel-Interface-Connector. onward. For aluminum base,
After the change:
For plastic base.
40 305-4002 J832815 AC Cable that has passed safety standards as an The color of Cable has been changed from gray to black. Interchangeable.
Cord Set (2) Cord Set (GS) AC Cable itself has been changed to Cable
Assembly that has passed safety standards as an
assembly.
41 305-4001 J832812 The same as no. 40. The color of Cable has been changed from gray to black. Interchangeable.
Cord Set (1) Cord Set (UL)
42 741-1841 741-1844 The material of insulation part has been changed The material has been changed from Neoprene Rubber to 0810-01 Interchangeable. F
Cushion Holder D to remove insulation trouble between PMT and Teflon resin. onward.
Rubber Base.
43 741-0544 741-0644 Piping joints between Sipper Nozzle and The inside of Nozzle has been polished, and the shape of joint 0809-01 Interchangeable. E Yes
Nozzle S1 Nozzle S1C Measuring Cell have been changed to reduce with Tube has been changed so that Teflon Packing can be onward. Change with No.44
carry-over. inserted. and 47.
44 741-0965 741-0641 The same as no. 43. The shape of joint with Nozzle has been changed so that 0809-01 Interchangeable. E Yes
Tube for Tube C for Teflon Packing can be inserted. onward. Change with No.43
Sipper Sipper and 47.
45 741-0967 Not changed. The same as no. 43. The shape of joint with Tube has been changed so that the joint 0809-01 Interchangeable. E
Pipe can be fitted within fit tolerance. onward.
46 741-0969 Not changed. The same as no. 43. The shape of joint with Pipe has been changed so that the joint 0809-01 Interchangeable. E
Tube for can be fitted within fit tolerance. onward.
Measuring
Cell

Chapter 4.8 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Interchangeability History Field
and Part and Part name Serial No. Label Retrofit
name before after the change
the change
47 --- 741-2064 The same as no. 43. S Nozzle Seal (Teflon Packing) has been added between 0809-01 Change with No.43 E Yes
S Nozzle Seal Nozzle SIC and Tube C for Sipper. onward. and 44.
(added)
48 741-0909 The same as no. 43. A part of a vinyl bag in which S Nozzle Seals 0809-01 E
--- S Nozzle Seal (2 pieces) are put as furnished parts has been added. onward.
Set (added)
49 741-0641 741-0641 Since the appearances of no. 44 before and after A mark of white color is put on Tube. 0811-01 Interchangeable. E
Tube C for Tube C for the change are the same, a mark is put to the onward. Change with No.43
Sipper Sipper ”after the change” to distinguish them. and 47.
50 --- 741-1045 A Collar has been inserted between Pulley and Collars have been fitted to the both ends of Pulley Hole 0812-01 Interchangeable. G
Collar Shaft to prevent eccentricity of X-Pulley of through which Shaft passes. onward.
”Inverted” side.
51 741-0137 Not changed. Nozzle has been reinforced to remove Hovering The Inside Nozzle is adhered at the middle of Medium 0812-08 Interchangeable. D Yes
P Nozzle 2 Alarm caused by vibrations of Pipetter Unit signal Pipe with Collar. onward. Change with No.2.
driving.
52 741-2114 To prevent loss of Data FD, the packing position Cushion FD is placed on Magazine Tray of Vessel 0814-01
--- Cushion FD has been changed from the cardboard box with Magazine mounting side, Data FD in a vinyl bag is fixed on onward.
styrene foam to the inside of Instrument. it with adhesive tape.

53 There is only There is only Fixing of Tube for Pipetter has been removed by Fixing of Pipetter Tube by adhesive tape has been removed. 0814-01
change of change of request of BM. onward.
Instruction for Instruction for
works, but no works, but no
parts. parts.
54 741-5030 Not changed To remove a capacitor which has polarity, Capacitor(part mark:C7)on EIO PCB (P/N741-5030) 0813-48 Interchangeable. H Yes
EIO PCB attached to EIO PCB, with wrong polarity is removed. onward.
55 741-5030 Not changed Resistance mounted on EIO PCB has been Up the rotation rate of bead mixing to 2050 ± 100 rpm. 0940-01 Interchangeable. J Yes
EIO PCB modified onward.
to variable type.
56 741-1321 Not changed To change the bracket itself due to apply the wide Modification of bracket for wide BCR. 0945-01 Before the change: K
Bracket BCR. onward. For only normal
BCR,
After the change:
For normal and wide
BCR.

V 1.6 – April 1999 7 Chapter 4.8


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Serial Interchangeability History Field
and Part and Part name No. Label Retrofit
name before after the
the change change
57 There is only There is only To find the rubber pads when Elecsys 2010 is Rubber pads are taped on the steel plate (P/N741- 0923-01 onward. I
change of change of placed on the table because the pads are packed in 1770)
Instruction for Instruction for the accessory box. together with an instruction sheet packed in the box
works, but no works, but no where Elecsys 2010 is also packed.
parts. parts.
58 741-1131 Not changed The wire of the bead mixer might be touched to the The shape of the BB guide assy has been changed in 0923-01 onward. Interchangeable. I
BB guide part of the assy during rotating the mixer at upper order not to touch to the wire of the bead mixer.
Assy dead position.
59 ------------ 741-1210 Fan guard is attached to the Micro-Cooler There is possibility to touch to the Fan by fingers 0929-01 onward. Yes
Finger Guards Assy(741-0552) for R Jacket Assy(741-0115) in during instrument power on.
order to prevent touching to the Fan by fingers.
60 System FD Not changed System FD’s and Install FD eliminate from According to BM´s request. 0939-01
accessory box. onward
61 741-5041 Not changed Change the adjustment voltage of ANG-EP PCB in Change the adjustment voltage of ANG-EP PCB are 0945-01 Yes
Change the order to secure the margin respect to voltage drift. as follows. onward
adjustment 1.0±0.3V⇒1.5+0.3V
voltage for
clot on ANG-
EP PCB
62 Change of Not changed Analyzer and accessories are packaged with two The accessories together with the analyzer, will be 0945-01
transport box boxes. packaged after change. onward
63 741-1057 Not changed Since the conductive paint which is applied to the Replace the P Carrier Cover. 0947-01 L Yes
P Carrier back of P Carrier Cover is not exposed at the GND 0940-01 to 0946-50:P Carrier Cover has been onward
Cover wire fixing screw in some cases. replaced in HID with out paint over the mark "L".
64 PMT label attached PMT label which is attached PMT will be modified. Modified label should be include with Anode Ebb 0948-01
voltage which is necessary to readjust PMT-SHV onward
PCB.
65 741-2064 741-2065 The improvement of the Sipper flow system. Change the dimension of the S NOZZLLE SEAL for 1053-01 M Upgrade
S NOZZLE S NOZZLE Nozzle S1C. *Please mark the History label as onward package
SEAL SEAL2 following serial No. 1053-01 to 22 no 1
66 741-0900 741-0900 and Change of Packing Spare parts and Consumables The following two corrugated cartons. 1053-01
Spare Parts others BOX. A small carton with P/N 741-0900 :Spare parts and onward
and Spare Parts the consumable box.
Consumables and A big carton with out P/N :small carton of above and
BOX Consumables other parts.(P/N:741-0580,741-0641,741-
BOX and 1834,J832815)
others
67 741-0137 Not changed A screw of the P Nozzle 2 Assy is sometimes A screw of the P Nozzle 2 Assy is glued. 1054-01 Interchangeable
P Nozzle 2 loosen. Marked the head of the screw with a red pen. onward
Assy

Chapter 4.8 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No. Part number Part number Content of Change Details of Change Affected Serial Interchangeability History Field
and Part and Part name No. Label Retrofit
name before after the
the change change
68 741-1005 741-7485 Easy to dispose the Side Base only the Elecsys Change the Side Base of plastic to the Side Frame of 1054-04 Interchangeable
Side Base Side Frame 2010 with Rack Sampler. metal. onward
69 741-4506 741-4613 Barcode reader changed normal BCR to wide one. According to BM´s request. 1056-01 Interchangeable
Barcode Barcode onward
reader(1) reader(2)
70 741-0531 741-0664 Change structure of block in incubator assy. For improve productivity of block. 1057-01 Interchangeable.
BLOCK BLOCK2 onward
71 741-1493 Not changed The cover may touch the Radiator on the Circuit The Radiator must be separated from the edge of this
Cover Board Assy UIRS-B in some cases. opening.
72 741-5041 Not changed Change of the gain of the amplifier for the Improvement the drift of pressure sensor voltage. 1053-23 M Upgrade
ANG-EP PCB pressure sensor. onward package
Change of the parameter of the clot detection. no 1
Change of the adjustment voltage for the pressure
sensor.
73 741-0614 741-0666 To attach the ground cable. Improvement of Dead Volume. N Upgrade
Table cover L Table cover LR package
assy assy no 1
74 741-1212 741-3166 To attach the ground cable of the Table cover LR Improvement of Dead Volume. N Upgrade
Plate Plate R assy(741-0666) to the Plate R. package
no 1
75 741-1195 741-2166 The improvement of the grounding. Improvement of Dead Volume. N Upgrade
GND Spring1 Cone spring package
no 1
76 741-1197 741-2195 The improvement of the grounding. Improvement of Dead Volume. N Upgrade
GND Ring GND Ring R package
no 1
77 741-1194 741-2158 To attach the New spring(741-2166) and New Improvement of Dead Volume. N Upgrade
Center holder Center holder GND Ring(741-2195) package
2 2R no 1

V 1.6 – April 1999 9 Chapter 4.8


5. Electronics

5.1 Boards
5.1.1 System Overview
- General Wiring Diagram
Wiring Diagram for Rack Sampler/connected to CLAS 1 System
5.1.2 Location of Boards
- Analyzer
- Rack Sampler/connected to CLAS 1 System

5.2 Power Source


5.2.1 AC Power
5.2.2 DC Power Supply
5.2.3 DC Power Supply for Rack Sampler/connected to CLAS 1 System

5.3 Electronic Modules / Electronic Adjustments


5.3.1 Principle of Temperature Control
5.3.2 Principle of LLD
5.3.3 Principle of Clot Detection
5.3.4 Adjustment / Check Procedure of LLD/Clot Detection
5.3.5 Function Explanation of FRONT SW
5.3.6 Details of Temperature Control / Troubleshooting of Temp. Units
5.3.7 Serial Data Communication
5.3.8 Adjustment of Mixer Speed

5.4 Printed Circuit Boards


5.4.1 ECPU 237 Board
5.4.2 EECL111 Board
5.4.3 EMOT110 Board
5.4.4 EIO Board
5.4.5 DO1 Board
5.4.6 DO2 Board
5.4.7 DO3 Board
5.4.8 DIST-PA Board
5.4.9 DIST-SA Board
5.4.10 DIST-T/VA Board
5.4.11 DIST-F Board
5.4.12 ANG-EP Board
5.4.13 PMT-SHV Board
5.4.14 L-AMP(1) Board
5.4.15 LLD-SA Board
5.4.16 LLD-P3 Board
5.4.17 UIRS-A Board
5.4.18 EUIF101 Board
5.4.19 MVLB Board
5.4.20 S.AB-CE Board
5.4.21 DET-A Board
5.4.22 DET-B Board
5.4.23 DET-C Board
5.4.24 FUSE Board
5.4.25 RS CONTA Board
5.4.26 PS CONTA Board
5.4.27 DO4 Board
5.4.28 BCR Board
5.4.29 FAN Board
5.4.30 PH-D Board
5.4.31 PH-T Board
5.4.32 DIST CR1 Board
5.4.33 DO5 Board

5.5 Cross Wiring Diagrams


- Analyzer
- Rack Sampler System
- Rack Sampler Connected to CLAS 1 System

5.6 How to Check Photo Interrupters


5.6.1 Photo Interrupters
5.6.2 How to check the PCPs
RD/Hitachi Elecsys 2010 Service Manual

5. Electronics

5.1 Boards

5.1.1 System Overview

- General Wiring Diagram

See the next diagram.

- Location of boards in the PCB. rack

DO1 Board
RS CONTA Board(Note)
EIO Board
EMOT 110 Board
EECL 111/110 Board(Note)
ECPU 237 Board

Fig. 5.1.1-1 Location

(Note) 1. EECL110 Board(P/N 271-3904) is mounted on instruments 0701-01 to 0701-60.


2. EECL111 Board(P/N 271-4082) is mounted on instruments 0802-01 and later.
3. RS CONTA (P/N 741-5057) mounted for Rack Sampler connected to CLAS 1 system

5.1.2 Location of Boards

See the figures below.

(Note) 1. Fuse board (P/N 741-5040) is included on instruments 0802-01 and later.
However, on instruments 0701-45 and 0701-46 only, the board has been
mounted UL/GS on purpose.
2. DC power supply (P/N741-4512) does not include the cables, the terminal
block, the S.AB-CE board, etc.
3. EUIF101 board (P/N271-4084) is mounted on UI for instruments 0802-01
to 0806-10.
4. EUIF102 board (P/N271-4084) is mounted on UI for instruments 0806-11
and later.
5. EUIF100-16 board (P/N741-5005) is mounted partly for external evaluation
purposes only on UI for instruments 0701-01 to 0701-60 (16 colored).
6. EUIF100 board (P/N271-3622) is mounted on UI for instruments 0701-01
to 0701-60 (8 colored).

V 1.6 – April 1999 1 Chapter 5.1.1


RD/Hitachi Elecsys 2010 Service Manual

General Wiring Diagram

V 1.6 – April 1999 2 Chapter 5.1.1


RD/Hitachi Elecsys 2010 Service Manual

- Wiring Diagram for Rack Sampler System

now P/J343

V 1.6 – April 1999 3 Chapter 5.1.1


RD/Hitachi Elecsys 2010 Service Manual

- Wiring Diagram for Rack Sampler connected to CLAS 1 System

V 1.6 – April 1999 4 Chapter 5.1.1


RD/Hitachi Elecsys 2010 Service Manual

5.1.2 Location of Boards

- PCB list

PCB Name Part No. Location Primary Function


ECPU237 271-3734 PCB rack 1. CPU board for system control.
2. FD control available.
3. RS232C x 4 channel equipped.
EECL111 271-4082 PCB rack 1. Temperature control.
2. LLD signal control.
3. ADC function for log amp (DI).
4. Reading current & volt of potentio circuit.
5. TFT controller.
EMOT110 271-3901 PCB rack 1. Motor control function (PPMC)
2. FLASH ROM equipped (memory)
EIO 741-5030 PCB rack 1. Solenoid driver.
2. Photo interrupter buffer.
3. DC power failure detection.
DO1 741-5031 PCB rack 1. Pulse motor driver for 2 or 1-2 phase control.
DO2 741-5032 PCB placement 1. Pulse motor driver for W1-2 or 2W1-2 phase control
plate at rear of the energized method -
instrument. Reagent disk: 2 or W1-2 phase
Sample disk: 1-2 or 2W1-2 phase
Magnet drive: 1-2 or 2W1-2 phase
Barcode reader: 1-2 or 2W1-2 phase
DO3 741-5033 Front/side of the 1. Peltier control driver for temperature of reagent disk,
PCB rack incubator, system reagent.
2. Heater control driver for detection unit.
3. DC fan motor driver
DIST-PA 741-5045 In the pipetter unit 1. Distribution of photo interrupter signal and pulse
motor signal for pipetter.
DIST-SA 741-5046 In the sipper unit 1. Distribution of photo interrupter signal and pulse
motor signal for sipper
DIST-TVA 741-5047 In the gripper unit. 1. Distribution of photo interrupter signal and pulse
motor signal for gripper unit.
DIST-F 741-5028 Left side of the 1. Fuse and LED for DC+5V, +12V and +24V
instrument
ANG-EP 741-5041 PCB placement plate 1. Potentiostat voltage generated
at rear of the 2. Conversion of pressure sensor signal
instrument. 3. +12VDC for PMT-SHV board

PMT-SHV 741-5024 On the detection 1. High voltage generator for PMT


unit
L-AMP(1) 741-5038 In the detection unit 1. Log conversion of PMT electric current to voltage
LLD-SA 741-5044 PCB placement plate 1. Liquid level detection of sipper.
at rear of the
instrument
LLD-P3 741-5048 In the pipetter head 1. Liquid level detection of pipetter

V 1.6 – April 1999 1 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

PCB Name Part No. Location Primary Function


UIRS-B 741-5049 Left/rear side 1. Connection of TFT drive signal.
of the instrument 2. Connection of RS232C signal for 2-set of BCR, HOST,
and user interface.
EUIF102 271-4184 In the user interface 1. Communication of touch panel and key switch function.
2. TFT signal driver.
MVLB110 271-3907 Under the PCB 1. Mother board for PCB rack
rack
S.AB-CE 725-5029 In the AC power unit 1. Surge absorber circuit
DET-A 741-5016 In the gripper 1. Photo interrupter equipped (gripper Y-axis)
DET-B 741-5017 In the gripper 1. Photo interrupter equipped (gripper Y-axis)
DET-C 741-5026 In the solid waste box 1. Photo interrupter equipped (solid waste
box presence/absence)
FUSE 741-5040 In the DC power 1. +5VDC fuse for FDD
supply unit 2. +5VDC fuse for EIO board power down monitor
RS CONTA 741-5057 PCB rack 1. Motor control function
(for R/S) (On the EIO Pcb) 2. Conversion from parallel signals to serial signals
PS CONTA 741-5058 In the R/S 1. Conversion from serial signals to parallel signals
(for R/S) (Under the DO4 Pcb)
DO4 741-5052 In the R/S 1. Pulse motor driver for 2 or 1-2 phase control
(for R/S) 2. Photo interrupter buffer
BCR 741-5056 In the B line 1. Connection of RS232C signal for BCR
(for R/S)
FAN 741-5055 In the DC power unit 1. +24VDC fuse for DC fan motor
(for R/S)
PH-D 741-5053 In the B line 1. Photo transistor equipped
(for R/S)
PH-T 741-5054 In the B line 1. Photo diode equipped
(for R/S)
DO5 741-5060 In the R/S unit, instead 1. Pulse motor driver for 2 or 1-2 phase control
(for R/S connected of the DO4 board 2. Photo interrupter buffer
to CLAS 1 System)
DIST CR 741-5061 In the I line 1. Current loop circuit for transferring control signal with
(for R/S connected CLAS 1 system
to CLAS 1 System)

Note
For history of boards, refer to Chapters 5.4 and 8.3.

Chapter 5.1.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Analyzer

PMT-SHV Board LLD-SA Board ANG-EP Board DO2 Board

S.AB-CE Board DC Power Supply UIRS-A Board

V 1.6 – April 1999 3 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

LLD-P3 Board

FRONT SW DIST-PA Board

V 1.6 – April 1999 4 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

DO3 Board

DIST-F Board

V 1.6 – April 1999 5 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

DIST-SA Board

V 1.6 – April 1999 6 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

DET-B Board DET-A Board

DIST-TVA Board

V 1.6 – April 1999 7 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

DET-C Board

V 1.6 – April 1999 8 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

J17 J16 J18 J14 J15 J13 J17

FUSE Board

V 1.6 – April 1999 9 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

L-AMP(1) Board

V 1.6 – April 1999 10 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

- Rack Sampler System


BCR & BCR Board (P/N741-5056)
in the Analyzer

DC Power Supply

DO4 Board PS CONTA Board


(P/N741-5052) (P/N741-5058)

Note)
1. PS CONTA board (P/N741-5058) is located just behind the DO4 board(P/N741-5052) as shown in the picture above.
2. BCR Board (P/N741-5056) and BCR are located at the BCR reading position on the B line in the analyzer.

V 1.6 – April 1999 11 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

PH-D Board PH-T Board(P/N741-5054)


(P/N741-5053) located on other side

Note)
1. FAN Board (P/N741-5055) are mounted on the DC power supply.
2. PH-D Board (P/N741-5053) should be mounted with PH-T Board (P/N741-5054) as a pair at the sampling position
in the B-line.

Chapter 5.1.2 12 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Rack Sampler connected to CLAS 1 System

DO5 Board DIST CR1 Board

V 1.6 – April 1999 13 Chapter 5.1.2


RD/Hitachi Elecsys 2010 Service Manual

5.2 Power Source

5.2.1 AC Power

• AC lines are only connected to the DC power supply through main switch and noise filter.
• The surge absorber provides protection from electrical surges of more than 600V and is connected
between the main switch and the noise filter.

Fig 5.2.1-1 Power Supply System Diagram

V 1.6 – April 1999 1 Chapter 5.2.1


RD/Hitachi Elecsys 2010 Service Manual

5.2.2 DC Power Supply

1) Specification of DC Power Supply


Range of Input Voltage: Single phase 100VAC(90 ∼ 132VAC) or single phase 200VAC (180 ∼ 264VAC)
Tolerance of AC frequency change: 47 ∼ 63 Hz
Rush Current: 75 A (p-p)
Efficiency: 80% (TYP)
Sound Noise: 45 dB (A) (MAX)
Safety Regulations: UL, CSA, TUV BG
EMI: VDE0871, FCC20780 Class A
DC Output Holding time: 10 msec (MIN)
Power Factor: 0.75 (Input 100VAC, Line Impedance 25 ohm)
Load Fluctuation Factor: 0.1% (TYP) 10 ∼ 100% load
Input Fluctuation Factor: 0.1% (TYP)
Ripple Noise: Larger value of 1% against output voltage with 100% load or 50 mV
(Frequency band: 20 mHz)
Protection of Output Over voltage: 110 ∼135%
Protection of Over current: 105 ∼ 130% of MAX Current of each package.
Weight: 5 kg
Dimensions:

Fig. 5.2.2-1

V 1.6 – April 1999 1 Chapter 5.2.2


RD/Hitachi Elecsys 2010 Service Manual

2) Selection of Input AC Voltage (100 VAC / 200 VAC)


Select the input AC voltage, 100 VAC or 200 VAC, by using the inserted selector (see the figure below). To remove the
inserted selector, unscrew the two M2 plus screws.
Before turning on the power to the unit, verify that the indication of the input voltage is placed close to the arrow sign on
the input label. The input voltage ranges are as follows:
• 100 VAC : 90 V to 132 V
• 200 VAC : 180 V to 264 V

Fig..5.2.2-2

3) Output Voltage & Adjustment


l The output voltage of the DC power source is preset to the values in the table below.

Table 5.2.2-1

Voltage Preset Voltage Check Pin No. (GND)

+5 V 5.35 V ± 5% (+5.08 to +5.61) DIST-F Board TP1 (TP4)

+12 V 12.3 V ± 10% (+10.8 to +13.5) DIST-F Board TP2 (TP5)

+15 V 16.0 V ± 10% (+14.4 to +17.6) DO3 Board TP4 (TP5)

-15 V -16.0 V ± 10% (-17.6 to -14.4) DO3 Board TP6 (TP5)

+24 V 24.45 V ± 10% (+22.0 to +26.9) DIST-F Board TP3 (TP6)

l To adjust or inspect the voltage turn the variable resistors (shown in the figure below) on the terminal
side of the power supply unit without an electric load. (DC output has sensing line and voltage is maintained
even if the electric load is changed.)

Chapter 5.2.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Table 5.2.2-2

Voltage Adjustment Voltage Tolerance at Terminal Adjust Position

+5 V 5.35 V ± 5% (+5.08 to +5.61) VR between +5V and GND terminal

+12 V 12.3 V ± 10% (+10.8 to +13.5) VR between +12V and GND terminal

+15 V 16.0 V ± 10% (+14.4 to +17.6) VR between +15V and GND terminal

-15 V -16.0 V ± 10% (-17.6 to -14.4) VR between -15V and GND terminal

+24 V 24.45 V ± 10% (+22.0 to +26.9) VR between +24V and GND terminal

Fig. 5.2.2-3 Output Terminal Side of the Power Supply Unit

V 1.6 – April 1999 3 Chapter 5.2.2


RD/Hitachi Elecsys 2010 Service Manual

J17 J16 J18 J14 J15 J13 J17

Fig. 5.2.2-4 Side View of the Power Supply Unit


FUSE Board

Fig. 5.2.2-5 Wiring Diagram of the Power Supply Unit

Chapter 5.2.2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.2.3 DC Power Supply for Rack Sampler Connected to CLAS 1 System

1) Specification of DC Power Supply


Range of Input Voltage: Single Phase 100VAC (90V to 132V )
Single Phase 200VAC (180V to 264V )
Tolerance of AC Frequency Change: 47 ∼ 63 Hz
Rush Current: 27AP-P in moment (at 100VAC)
54 AP-P in moment (at 200VAC)
Efficiency: 75% min.
Safety Regulations: UL, TUV, CSA
EMI: VDE0871 Class A, FCC part 15 Class A
DC Output Holding Time: 20 msec. min.
Power Factor: 0.6 Type( Input 100VAC), 0.5 Type (Input 200VAC)
Weight: 1.4 kg max.
Dimensions: See Fig. 5.2.3-1

Fig. 5.2.3-1

V 1.6 – April 1999 1 Chapter 5.2.3


RD/Hitachi Elecsys 2010 Service Manual

2) Selection of Input AC Voltage (100 VAC/200 VAC)

l Select the input AC voltage 100 VAC or 200 VAC with the short bar by fastening and unfastening a minus
screw as shown in Fig. 5.2.3-2.
l Before turning on the power to the unit, verify that the rack unit is turned on. The input voltage ranges are as
follows.

Input Voltage Short bar between ST1 and ST2


100 VAC (90 V to 132 V) Short
200V AC (180 V to 264 V) Open

Fig. 5.2.3-2

Chapter 5.2.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3) Output Voltage & Adjustment


The output voltage of the DC power source is preset to the values shown in Table 5.2.3-1 below.

Table 5.2.3-1
Voltage Preset Voltage Check Pin No. (GND) Adjustment Position
+5 V 5.3 ± 5% PS CONTA Board See the Fig.
(+5.04 V to +5.57 V) TP11(TP12)

+24 V 24.3 ± 10% DO4 Board See the Fig.


(+21.9 V to +26.7 V) TP1(TP2)

l Adjust and check the voltage by turning the adjustment VR on the terminal side of the power supply unit
without an electric load (as shown in Fig. 5.2.3-3).

Fig. 5.2.3-3

V 1.6 – April 1999 3 Chapter 5.2.3


RD/Hitachi Elecsys 2010 Service Manual

5.3 Electronic Modules / Electronic Adjustments

5.3.1 Principle of Temperature Control


The temperature control is performed by the microprocessor ANGCNT on the EECL110 board. Temperature is
controlled by four units by one of the following two methods.

1) Incubator, System Reagent Unit


The unit calculates the control signal using the deviation between the target temperature given by the CPU and the
actual temperature measured at the control point and outputs the signal on the DO3 board. The signal is augmented
on the DO3 board, and the system runs electricity to the Peltier or the heater. The fan is used to maximize the heat
release efficiency. As the voltage applied to the Peltier increases, the fan turns on. No fan is used in the incubator.

Fig. 5.3.1-1 Temperature Control Block Diagram (Incubator, System Reagent)

V 1.6 - April 1999 1 Chapter 5.3.1


RD/Hitachi Elecsys 2010 Service Manual

2) Reagent Disk, Detection Unit


The reagent disk determines the target temperature from the ambient temperature of the reagent disk unit. The
detection unit determines the target temperature from the ambient temperature of the system reagent unit. The
system calculates the control signal using the deviation between the target temperature and the actual temperature
measured at the control point and outputs the signal to the DO3 board. The DO3 board augments the signal and the
system runs the electricity to the Peltier or the heater. The fan is used to maximize the heat release efficiency and
turns on as the voltage applied to the Peltier increases.

Fig. 5.3.1-2 Temperature Control Block Diagram (Detection Unit, Reagent Disk)

Chapter 5.3.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.3.2 Principle of LLD

• The liquid level detector of the Elecsys 2010 detects the change of the static electricity capacity between the
detection electrode and GND before and after its contact with the liquid.
• The structure of the liquid level detector is shown in Fig. 5.3.2-1. The detection electrodes used for the pipetter
are a nozzle tip and a disposable tip made of a conductive material. The sample disk and reagent disk are also
made of a conductive material and are grounded. The detection electrode used for the sipper is the system
reagent unit, and is grounded via the sipper nozzle. The outer wall of the system reagent unit is shielded.
• When the CPU sends a command to the GPCNT (motor controller) to lower the pipetter (or the sipper), it also
sends a command to the LLD CNT (liquid level detection controller) to start the liquid level detection. Upon
receiving the start command, LLD CNT starts monitoring the signal output from the LLD-P3 board (or the LLD-
SA board for the sipper). LLD CNT processes the received signal and when the signal is for the liquid surface, it
sends a "motor stop" command to GPCNT. The output and "motor stop" signals from the LLD-P3 board (or the
LLD-SA) are described in Fig. 5.3.2-2 (Fig. 5.3.2-3 for the LLD-SA).

Fig. 5.3.2-1 LLD Composition

V 1.6 – April 1999 1 Chapter 5.3.2


RD/Hitachi Elecsys 2010 Service Manual

Fig. 5.3.2-3 Sipper LLD Signal

Chapter 5.3.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.3.3 Principle of Clot Detection

• Clot detection is a monitoring function of liquid pressure in the pipetter tube when sampling to detect abnormal
situations as a result of a blood clot, fibrin, etc.

• Liquid pressure is detected by a semiconductor pressure sensor and a half bridge circuit on ANG-EP PCB, and
this signal is also amplified on ANG-EP PCB. Then, the pressure signal (range 0 - 5 volts) is converted to a
digital signal by EECL PCB and sent to ECPU 237 PCB.

• The clot detection algorithm is fixed by software parameters in the Data FD.

Pipetter ANG-EP PCB EECL PCB

Half Bridge LLDCNT


Pressure ECPU
& AMP A/D converter

V 1.6 – April 1999 1 Chapter 5.3.3


RD/Hitachi Elecsys 2010 Service Manual

5.3.4 Adjustment / Check Procedure of LLD/Clot Detection


This describes an adjustment procedure if the following items are replaced or checked.
l Pipetter Probe/LLD-P3 Board
l LLD-SA Board/System Reagent Unit
l Pressure Sensor/Tubing of Pipetter System/ANG-EP Board

5.3.4.1 Pipetter Probe/LLD-P3 Board


(1) Adjustment of Pipetter LLD Voltage
l Concerning the pipetter LLD voltage monitoring, see Chapter 6.1.8.
l Remove the pipetter head cover as illustrated in Fig. 5.3.4.1-1.

Fig. 5.3.4.1-1 How to Remove the Cover from the Pipetter Head

Precondition: Ensure that the pipetter tube is primed


Use a plastic screwdriver to adjust the variable capacitor on
the LLD-P3 PCB as shown in Fig. 5.3.4.1-5.
When monitoring the voltage, keep your hands off the pipetter arm.

1. After “Reset”, select “Voltage Monitor” and execute “Pipetter LLD”.

2. Adjust the voltage to the minimum value while the pipetter head is at the highest position.

The voltage without tip has to be below 1.5V (see Fig. 5.3.4.1-3 for testing position) and the
principle LLD curve (check pos. 1) should be in the recommended range (see also
Fig. 5.3.4.1-2).

3. Put a tip onto the pipetter nozzle.

The voltage with tip should be increased by 0.1 V to 1.5 V (check pos. 2, see Fig. 5.3.4.1-2).

V 1.6 – April 1999 1 Chapter 5.3.4


RD/Hitachi Elecsys 2010 Service Manual

If the voltage decreases, re-adjust the trimmer so that the voltage increases with a tip.

4. Take out the RackPack from positions 1, 17 and 18 on reagent disk.

5. Move the pipetter to reagent position 18 by hand. The pipetter should be in the position of R2 aspiration
(see Fig. 5.4.1-4)

6. Move the pipetter down to position “A” by hand, see Figs. 5.3.4.1-4 and 5.3.4.1-5 for detailed
position. The tip should not touch any plastic. Memorize the monitoring voltage.

7. Move the pipetter down to position “B” by hand, see Fig. 5.3.4.1-4.

Make sure that the monitoring voltage increases between 0.3 V and 0.7 V (see
Fig. 5.4.3.1-2).

Fig. 5.4.3.1-2 Principle LLD Curve , Check Positions

Explanation:
1. Recommended adjustment range
-Pipettor in upper dead point
-No Tip attached
2. -Pipettor in upper dead point
-Tip attached
3. -Pipettor in pos. A
-Tip attached
4. -Pipettor in pos. B (lower dead point)
-Tip attached

Chapter 5.3.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Item 5,6 & 7


at reagent
position

Item 2 & 3
at sampling
position
Fig. 5.3.4.1-3

Position A

Position B

Reagent Disk

Fig. 5.3.4.1-4

Reagent Disk

V 1.6 – April 1999 3 Chapter 5.3.4


RD/Hitachi Elecsys 2010 Service Manual

Nozzle Position R2

15
15

(unit: mm)

Fig. 5.3.4.1-5

l If the voltage is OK, touch the Monitoring Stop button in the Voltage Monitor screen.

Fig. 5.3.4.1-6 Location of the variable capacitor

Chapter 5.3.4 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(2) Adjustment of Pipetter Z Abnormal Detection range


Check the crash sensor signal output by measuring the voltage between the connector pin#A3 of J552 and TP2
(AG) on DIST-PA Board as follows.
l Detach the Pipetter head cover as shown in Fig.5.3.4.1-1.
l Make sure that the voltage is 0.5 V or lower (ca. 35 mV) under normal conditions, i.e. no crash is detected.
Note) Keep the current height of the pipetter head. This means that only pipetter probe itself
should go up and down during the next measurements.
l Make sure that the voltage is 0.5 V or lower (ca. 35 mV) when the thickness tool (0.8), which is 0.8 mm in
thickness, is inserted into the gap between the pipetter probe and the flat place as shown in Fig.5.3.4.1-1.
l Also make sure that the voltage increases up to ca. 4.5 V or more (ca. 5 V) when the tool is replaced by the
1.2mm thickness tool under the same conditions.
l If the increase is not sufficient, bend the detection plate on the pipetter probe upwards or downwards with
pliers (see Fig. 5.3.4.1-7).
l Repeat the above procedure until the specification is met.
l Replace the pipetter head cover as before.

Figure 5.3.4.1-7 Pipettor Z abnormal detection adjustment

V 1.6 – April 1999 5 Chapter 5.3.4


RD/Hitachi Elecsys 2010 Service Manual

(3) Adjustment of Pipetter Y Direction


l Check the pipetter probe position relative to Tip pos.1 on buffer station, washing station, reagent disk, sample
disk and vessel buffer. All positions should be at the center of the hole in each.
l In particular, if the Y-direction pos. of the pipetter probe is not sufficient on the buffer station when viewed
from the side, adjust the pipetter probe Pos. at the center of Tip pos.1 and the vessel buffer by unfastening
and fastening two (2) screws shown by the arrows in Fig 5.3.4.1-8.

Fig 5.3.4.1-8 Side View of Pipetter

Chapter 5.3.4 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.3.4.2 LLD-SA Board/System Reagent Unit


Adjust the LLD-SA only when the LLD-SA board or the system reagent unit is replaced. The LLD-P3 PCB
must not be adjusted in any other circumstances.

(1) Adjustment of Sipper LLD Voltage


• Concerning the Sipper LLD Voltage Monitoring, see Chapter 6.1.8.
• Lift the sipper probe up to the upper home position. It is not important where you place the sipper head
between the two horizontal ends as long as the tubing is not detached from the sipper probe.
• Adjust the variable capacitor TC2 on the LLD-SA PCB (Fig. 5.3.4.2-1) with a plastic or ceramic tool
so that the minimum voltage displayed is 3.50 V or lower.
• If the voltage is OK, touch the Monitoring Stop button in the Voltage Monitor screen.

Fig. 5.3.4.2-1 LLD-SA PCB

(2) Insulation Resistance between the Aluminum Block and the Shield Plate
• Remove the system reagent unit.
• Disconnect the connector J662.
• Measure the insulation resistance between the aluminum block and the shield plate (outer cover
of the system reagent unit) with a multimeter.
• If the resistance is normal, it goes up beyond the measurable limit of the multimeter.
• If it is low, it will indicate a value below 1,000 kΩ. If low, replace the nozzle or replace the system
reagent unit.
Note) The resistance cannot be measured if connector J662 is connected. Also, damaged
wiring and damaged FPC will cause an abnormality of the sipper LLD function.

5.3.4.3 Pressure Sensor/Tubing of Pipetter System/ANG-EP Board


V 1.6 – April 1999 7 Chapter 5.3.4
RD/Hitachi Elecsys 2010 Service Manual

Adjust the ANG-EP PCB only when the pressure sensor or tubing in the pipetter system is replaced. The ANG-EP
PCB must be prevented from being adjusted in any other cases.

(1) Adjustment of Pressure Sensor Voltage


• Touch the Pipetter Prime button in the Maintenance screen to start pipetter priming.
See Chapter 6.1.6 Maintenance.
• Press the Stop key when the Pipetter System has filled with water.
• Concerning the Pressure Sensor Voltage Monitoring, see Chapter 6.1.8.
• Leave the instrument for 2 minutes or longer.

• Touch the pressure sensor button in the voltage monitor screen.


• Adjust the pressure sensor voltage to 2.00 ± 0.20 V by turning the VR1 on the ANG-EP PCB. (Rotate the
trimmer slowly in order not to keep the mechanical inertia of the rotation mechanism inside the trimmer
resistance).
• If the voltage is OK, touch the Monitoring Stop button in the Voltage Monitor screen.

Note) The following modification applies to production SN 1053-23 onwards and field instruments. Refer to
Chapter 5.4.12 for details.

Item Before change After change

1 Resistor R63 on the ANG-EP PCB 56 ohm 150 ohm


(P/N 741-5041) replacement

2 Adjustment voltage of the pressure 1.50 to 1.80 V 2.0 ± 0.20 V


sensor (VR1 on the ANG-EP PCB) After pipetter prime, leave for 2 After pipetter prime, leave for
change min. or more, then adjust the 2 min. or more, then adjust
VR1 the VR1

5.3.4.4 Troubleshooting of LLD function

The LLD may be malfunctioning if it shows any of the following problems:


1) It stops before it reaches the liquid surface.
2) It does not stop at the liquid surface, but goes deep in the liquid.
3) It starts descending from an incorrect position.

(1) Pipetter
Abnormality of the liquid level detection for the pipetter may be caused by one of the following problems.
Use the following procedures for troubleshooting.

Chapter 5.3.4 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- The insulation resistance of the probe is low.

• Detach the two (2) wires from the probe.

• Measure the insulation resistance with a voltage multimeter or any similar device.

• If the resistance is normal, the resistance goes up beyond the measurable limit of the multimeter.

• If the resistance is low, it will be shown by a value below 1,000 kΩ. In this case replace the pipetter probe.

- The electrical conductivity of the water inside the pipetter tube is too high.

• Measure the output voltage of the LLD-P3 board twice as follows.

1) With the tubing located inside of the pipetter head connected.

2) With the tubing disconnected.

• If there is a difference in the output voltage between the former and the latter, the conductivity of the water
could be increased.

• With the tube connected, move the pipetter horizontally and check the voltage. If the output
voltage varies depending on where the pipetter is located on the horizontal axis, the conductivity
of the water could be increased.

• If high conductivity is detected, replace the water in the water supply tank by water with
conductivity meeting the specification. Repeat the pipetter prime to clean the flow path.

- The spring of the pipetter nozzle holder is mispositioned.


• If the spring of the pipetter nozzle holder, which is installed in the upper cover of the pipetter case, is
mispositioned, the inner pipe (detection electrode) and the outer pipe (shield) of the pipetter become mutually
conductive. In such a case, the voltage output from the LLD-P3 board goes up by ca. 10 V.
• If the output voltage is normal when the cover is open, but it is not when the cover is closed, mispositioning of
the spring may be the cause. In this case, return the spring to the normal position.

- The board is damaged due to liquid leakage.

- The liquid level is too low or there is no liquid in the container.


- Damaged wiring and damaged FPC will cause abnormal liquid level detection with the pipetter.

(2) Sipper
Abnormality of the liquid level detector for the sipper may be caused by one of the following problems.

- The insulation resistance of the system reagent unit is low.


• See Chapter 5.3.4.2.

V 1.6 – April 1999 9 Chapter 5.3.4


RD/Hitachi Elecsys 2010 Service Manual

5.3.5 Functional Details of FRONT SW

1) Function of the Front SW


Analyzer Status Function of the Switch
1 Operation SW ON/OFF is ignored.
2 Stand By With SW OFF, status changes to sleep (+24 V off, U/I off).
With SW ON, status recovers from sleep and the system is
reset.
*1: If the switch is turned off during operation and kept off, the analyzer shifts to the sleep status as the
operation is completed and the status changes to stand-by.

V 1.6 – April 1999 1 Chapter 5.3.5


RD/Hitachi Elecsys 2010 Service Manual

5.3.6 Details of Temperature Control / Troubleshooting of Temp. Units

1) Principle of temperature control


• Temperature control is based on PI control. ANG CNT determines the control parameter for the
peltier or heater by calculating every 100 ms as follows.
• It first calculates the difference (En) between the current temperature of the control point (Tn), which is the
temperature n ∗ 100ms after temperature control started, and the target temperature (Ttrg).

(a) En = Tn - Ttrg

• It then sums up Ens to the Esumn .

(b) Esumn = En + Esum(n-1)

• Finally, it determines the control parameter (Vout).

(c) Vout = K1*(K2*En + K3*Esumn) (K1, K2 and K3 are coefficients)

• The voltage of the incubator is limited from 0 V to 5 V, the voltages of other unit are limited within ±5 V.
• The temperature of the reagent disk and the detection unit is influenced by the ambient temperature around the
units. So the target temperatures (Ttrg) for the two units are calculated according to the formula below. The Ttrg
of the R.Disk refers to the temperature around the reagent disk, and the Ttrg of the detection unit refers to the
temperature around the system reagent unit.

Ttrg = A*Tamb + B (A and B are control coefficients)

Table 5.3.6-1 Coefficients of Temperature Control


A B Tamb Source
Detection Unit -1.00 30.0 System Reagent unit
Reagent Disk -0.46 29.0 R.Disk

• The fans of the peltier rotate when the voltages (Vout) are more than ca.+1.0 V or less than ca.-1.0 V.

Note 1) You can see the temperatures of the control points (Tn), the ambient temperatures (Tamb), the target
temperatures (Ttrg) and the control parameters (Vout) on the Temperature Monitor Screen.

V 1.6 – April 1999 1 Chapter 5.3.6


RD/Hitachi Elecsys 2010 Service Manual

Fig. 5.3.6-1 Temperature Monitor Screen

Note 2) The Peltier works as a heater when the control parameter is positive and as a cooler when the control
parameter is negative.
Note 3) The control parameters (Vout) are multiplied by +1 at the EIO board and by -2.6 at the DO3 board.
Voltages are limited within ± 12 V on the DO3 board.
Note 4) The control parameter for the detection unit turns over when it comes to ANGCNT.
On the Temperature Monitor Screen you can see the voltage which does not turn over.
It turns over by the cable (P/N 741-4237) between the DO3 board and the detection unit

Chapter 5.3.6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

2) Troubleshooting

• If temperature below 4.6 degrees C is displayed


1. If temperature control is being normally operated, the temperature displayed in the screen should
be 13 to 15 degree C at the lowest.
2. Therefore, if the screen displays a temperature below 4.6 degrees C, this may be due to
the thermistor wire or the cable between the EECL110 board and the thermistor breaking.
3. What is displayed is identical to that which is displayed if the thermistor resistance were infinite.

• If temperature higher than 80.0 degrees C is displayed


1. If temperature control is normal, the thermostat breaks the input for peltier or heater at around 60 degrees C.
2. Therefore if the temperature is displayed higher than 80.0 degrees C, this may be due to
the thermistor or the cable between the EECL110 board and the thermistor being shortcircuited.
3. This phenomenon is identical to that which takes place if the resistance of the thermistor were zero (0) ohm.

• If temperature does not meet the specification


1. Check whether covers the are closed or not. For example, temperature control of the R. Disk does not work
well without the R. Disk cover.
2. Check that there was not a steep temperature gradient. The specification of the temperature gradient is
± 2 degrees C /h. Direct wind from air conditioners, etc., must be avoided.
3. Check the relation between the indication temperature and the ambient temperature of the thermistor.
(1) Check the peltier or the heater if the two temperatures are nearly the same.
(2) Check the thermistor if the two temperatures are significantly different.
Because of the thermometer accuracy might be within ± 0.5 degrees C, only a rough
comparison is possible.

• How to check the peltier and heater.


1. Check the resistance between the wires of the peltier or heater to detect any abnormalities in the element.
2. The resistance changes according to its temperature so the value given in the table below is only
approximate. The peltier is a semiconductor element, and when the temperature is over 60 degrees C, the
current is cut off by the thermostat.
3. Therefore measure the resistance at less than 60 degrees C. Table 5.3.6-2 shows the check pins of the
peltier or heater.

V 1.6 – April 1999 3 Chapter 5.3.6


RD/Hitachi Elecsys 2010 Service Manual

Table 5.3.6-2 Check pins of peltier or heater


Unit Element Pins to measure Resistance
Detection peltier J603 5pin-6pin Ca. 2.7Ω
R.Disk peltier J523 2pin-5pin Ca. 2.7Ω
J523 8pin-11pin
System Reagent peltier J660 4pin-7pin Ca. 2.7Ω
Incubator heater J570 3pin-4pin Ca. 7.2Ω

• How to check the thermistor


1. Check the resistance between the wirings of the thermistor to determine whether or not the thermistor
is normal.
2. Thermistor errors are usually caused by moisture.
3. With the usual ambient humidity, the thermistor never absorbs moisture.
However, if the thermistor gets wet as a result of condensation, the resistance of the thermistor
goes down significantly. Therefore, there are no circumstances in which the thermistor only slightly
defective, and so the error is quick to find.
4. Table 5.3.6-3 shows the check pins of the thermistor.
5. Table 5.3.6-4 shows the outline of the resistances of thermistor.
6. Details are shown in the data sheet for the thermistor.

Table 5.3.6-3 Check pins for thermistor


Unit Thermistor Pins to measure
Detection Control point J603 11pin-12pin
R.Disk Control point J524 1pin-2pin
Ambient J524 3pin-4pin
System Reagent Control point J661 1pin-2pin
Ambient J661 3pin-4pin
Incubator Control point J571 1pin-2pin

Table 5.3.6-4 Relation between thermistor resistance and temperature


Temperature
(degrees C) 10 15 20 25 30 35 40 45 50
Resistance (kΩ) 9.95 7.86 6.25 5.00 4.03 3.27 2.66 2.18 1.80

Note
Refer to Chapter 8.4 for Temp. Parts stocked by Roche Diagnostics

Chapter 5.3.6 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.3.7 Serial Data Communication

5.3.7.1 General Description


Use a 26 bit parallel data, a shift register and convert for a serial data and transmit/receive it at a speed of
1250[Kbps].

5.3.7.2 Functional Description

- Block Diagram

(1) Parallel - Serial Conversion


Latch the parallel data, and with the shift register convert to parallel → serial.

Chapter 5.3.7 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(2) Serial-Parallel Conversion


With the shift register convert the serial data from serial → parallel, and latch the parallel data.

Chapter 5.3.7 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.3.8 Adjustment of Mixer Speed

The mixer speed should be measured with a tachometer (Ident No. 1903152) or stroboscope during each maintenance and
whenever the assay performance is insufficient.
Refer to Chapter 2.6.1 for the complete mixer adjustment procedure.

To check the mixer speed, use one of the following procedures:

1. Start the AM Test (initial bead mixing performed Pos. 1-5; 14 sec per Pos.). Place reagent packs in positions 1 to 5.
2. Start the Bead Mixer Check (Maintenance Chapter 6.1.10; 4 sec per Pos.). Place a reagent pack in position 1.

Confirm the following mixer speeds using an rpm meter (Ident No. 1903152):

In air In liquid

2050 rpm ± 100 rpm 2000 rpm ± 100 rpm

The figure below shows the location of the resistor to be adjusted on the EIO PCB (see also Chapter 5.4.4).

Chapter 5.3.8 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4 Printed Circuit Boards

5.4.1 ECPU237 Board

5.4.1.1 General Description


• ECPU237 PCB has MC68EC020 as main CPU and does the central processing of the instrument.
• FDD controller and RS-232C controller (4 channels) also are mounted on the board.
• Main memories are 8MByte-DRAM, and 32KByte-SRAM which are backed up with a battery for
memorizing the instrument’s parameters.
• 512KB EEPROM (so called FLASH ROM) is also mounted and memorizes the system programming.

- Block Diagram

M ain CPU
ECPU Bo ard M C68EC020 32M Hz
CLK DRV Xtal
16M Hz
Lo cal b u s

RS-232C FDD ROM DRA M SRA M VM E b u s A d res s Data


Co n troller Co n tro ller 512KB 8M B 32KB Co n troller Bu ffer Buffer

Battery

UIRS-A FDD
Bo ard VM E b u s

Ho s t
BCR
U/I

5.4.1.2 Location

DO1 Board
EIO Board
EMOT Board
EECL 110/111 Board
ECPU237 Board

Fig. 5.4.1.1 Location in the PCB Rack

V 1.6 – April 1999 1 Chapter 5.4.1


RD/Hitachi Elecsys 2010 Service Manual

5.4.1.3 Functional Description


1) FDD Control
One floppy disk drive is used and controlled by the FDD controller. 2HD and MS-DOS 1.44MB formatted
floppy disks can be used.
2) RS-232C Controller
This controller communicates with the following units via UIRS-A PCB.
• Host Computer to receive the Test Order and send back the Measured Results.
• Barcode Reader to Read Rack Pack information and Sample ID.
• User Interface(U/I) to receive the Touch Panel and Key Input/Output to LED and Buzzer.
3) Battery
• The specifications of the battery are as follows.

No. Description Specification


1 Data holding time during Power off 240 hours (with full charge)
2 Recharging time from empty status 24 hours
3 Life time 5 years (must be replaced by a service
engineer every 5 years.)

• Power Supply of SRAM on the board is provided by a re-chargeable battery during


Main Switch off.

- Switch/Connector Description

Switch/Connector No. Function Remarks


SW1 To set the Operation mode. DIPSW
SW2 To reset the ECPU237 and the system. RST
SW3 Abort function which generates an NMI ABT
interruption in the MPU.
RSCN Debug monitoring mode RS232C
MBSICN Four channel serial communication.
AUICN Connector for the internet AUI.
BCN Connector for battery

- Fuse Description
Fuse No. Rated Rated Supplied Purpose
current voltage voltage
FUSE1 0.5A 48V +12V To avoid PCB burn-out the
voltage is supplied via
MVLB110 PCB.

Chapter 5.4.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- LED Description

LED No. Supplied voltage Purpose Remark


RUN 5V CPU running monitor is lit when CPU Green
is running except for HALT status.
DMA 5V I/O has reserved bus for DMA Green
transmission.
INT 5V MPU interruption Green
MBSY 5V Memory bus busy Green
FAIL 5V Is lit at time-up in the WDT (Watch Red
Dog Timer); is also lit if CPU STOP
occurs by double bus fault or WDT
time-up.
DIAG 5V Self diagnostic indication Red
PERR 5V Parity error occurs. Red

- Dip Switch Setting


(SW1: see next page)

1 2 3 4 5 6 7 8

OFF

V 1.6 – April 1999 3 Chapter 5.4.1


RD/Hitachi Elecsys 2010 Service Manual

5.4.1.4 Parts Mounting Diagram

- The parts mounting diagram for the ECPU237 board is shown below.

SW1

Chapter 5.4.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual
5.4.1.5 Connector Description
Chapter 5.4.1 5 V 1.6 – April 1999
RD/Hitachi Elecsys 2010 Service Manual
Chapter 5.4.1 6 V 1.6 – April 1999
RD/Hitachi Elecsys 2010 Service Manual

5.4.2 EECL111 Board

Refer to Chapter 8.3 for the history of the PCB

5.4.2.1 General Description


- This circuit board consists of the following four (4) functions.
• Display Controller
• Printer Controller
• Analog Data Controller(H8 ADCCNT)
• LLD Controller(H8 LLDCNT)

- Block Diagram

V M E bus
E E C L B o a rd

A d d res s b u ffe r D a ta b u ffe r V M E c o n tro lle r

Local bus

P rin te r D is p la y H8 H8
C o n tro lle r C o n tro lle r ANGCNT LLD C N T

P a ra lle l to S e ria l ADC DAC DAC

M PX

U IR S -A B o a rd P M T P o ten tio -s ta t L L D -P A EM OT
T em p . C o n tro l L L D -S A B o a rd

P rin te r U /I
TFT LC D

5.4.2.2 Location

DO1 Board
EIO Board
EMOT Board
EECL 110/111 Board
ECPU237 Board

Fig. 5.4.2.1 Location in the PCB Rack

V 1.6 – April 1999 1 Chapter 5.4.2


RD/Hitachi Elecsys 2010 Service Manual

5.4.2.3 Functional Description

(1) Display Controller


• The display controller unfolds the character data transmitted from CPU and transmits them to
the display on the U/I as images.
• The image data are transmitted to the U/I via the UIRS-A circuit board with serial communication.
(2) Printer Controller
• The printer controller stores the data transmitted from the CPU temporarily and puts them out to the printer
according to the order from CPU. The data are transmitted to the printer via UIRS-A circuit board.
(3) Analog Controller (ANGCNT)
- Potentiostat
• The ANGCNT sends the potentiostat voltage twice as high as the order according to the timing
chart for potentiostat which comes from the CPU.
- Data Collection
• The luminescence data are converted to logarithmic values in the L-AMP(1) circuit board, then ANGCNT
carries out analog-to-digital conversion and transmits the data to the CPU.
• GMCNT converts the current running through the cell and voltage between CE and WE from analog
to digital and transmits the data to the CPU.
- Temperature Control
• The ANGCNT determines the output voltage to the Peltier and the heater according to the temperature measured
by the thermistor thermometers, and it controls ON/OFF of the fans.
(4) LLD Controller (LLDCNT)
- Liquid Level Detection
• LLDCNT determines the liquid level according to the signal from LLD-P3 or LLD-SA circuit board,
sends the interruption signal to GPCNT on the EMOT circuit board and stops the motor.
- Clot Detection
• LLDCNT takes in the pressure sensor signal from ANG-EP circuit board and transmits the data to CPU.
• CPU decides whether or not a clot is detected.

- LED Description

LED No. Supplied Voltage Purpose Remark


RUN 5V CPU running monitor is lit when CPU
is running, other than in HALT status.
INT 5V MPU interruption
CRT 5V
ADC 5V DC bus busy

Chapter 5.4.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.2.4 Parts Mounting Diagram


The parts mounting diagram for the EECL111 board is shown below.

V 1.6 – April 1999 3 Chapter 5.4.2


RD/Hitachi Elecsys 2010 Service Manual

5.4.3 EMOT110 Board

5.4.3.1 General Description


This circuit board consists of the following controllers and memory.
• GPCNT Motor Controller x ten (10)
• GMCNT DI/DO controller x one (1)
• Flash Memory 4MB

- Block Diagram

V M E bus
E M O T B o a rd

A d d re s s b u ffe r D a ta b u ffe r V M E c o n tro lle r

Local bus

F la sh m em o ry H8 H8
4M B GPCONT GM CONT
10

B u ffe r

DO DI

DO2 DO1 E IO
B o a rd B o a rd B o a rd

5.4.3.2 Location

DO1 Board
EIO Board
EMOT Board
EECL 110/111 Board
ECPU237 Board

Fig. 5.4.3.1 Location in the PCB Rack

V 1.6 – April 1999 1 Chapter 5.4.3


RD/Hitachi Elecsys 2010 Service Manual

5.4.3.3 Functional Description

(1) Motor Control


• GPCNT generates pulse signal, and sends it to DO1 or DO2 circuit board when it receives
the order of drive pattern of motor and pulses from the CPU.
• GPCNT stops a motor when it finishes the pulses ordered from the CPU or it receives
the signal from photo interrupter or the signal of LLD.

(2) DI/DO control


- DI function
• The status information from EIO circuit board about the power supply watching, fuse detection, tip detection, R.
Disk cover detection, water level watching in the distilled water tank, etc. are written on GMCNT.
• CPU scans DI at regular intervals, and gets these statuses.
- DO function
• CPU writes the status of switching of micro step and static current drive and ON/OFF of SV, beads mixer, HV,
potentiostat and +24V on GMCNT.
• Each driver on EIO circuit board or other boards drives them.

(3) Flash Memory


• The software of the instrument is memorized in the flash memory on this circuit board after installation.
• The software is loaded from the flash memory when the instrument is switched on.
• The lifetime of the Flash Memory is ca. 1000 times of writing/reading.

Chapter 5.4.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Dip Switch Setting

SW1

1 2 3 4 5 6 7 ‚8

OFF

SW2

‚1 ,2 ‚3 ‚4 ‚5 ‚6 ‚7 ‚8

OFF

V 1.6 – April 1999 3 Chapter 5.4.3


RD/Hitachi Elecsys 2010 Service Manual

5.4.3.4 Parts Mounting Diagram


The parts mounting diagram for the EMOT110 board is shown below.

Chapter 5.4.3 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.4 EIO Board

5.4.4.1 General Description


This circuit board has many functions like wave shaping of sensor signal, driving SV, switching ON/OFF for HV,
detection of fuse blowing on DO circuit board and other boards, signal buffer, driving a motor for beads mixing, power
supply for circuit boards and modules, watching the power supply and generating the signal for system reset.

Note
The PCB has been modified.
1. Field History Label: H
Field retrofit: during PM or other service visit
Implemented in instruments from serial No. 0813-48 onwards.
Please refer to Chapter 4.8 and parts mounting board on p. 4.

2. Field History Label: J


Field retrofit: if necessary (bead mixer speed out of specified range)
Implemented in instruments from serial No. 0940-01 onwards.
Please refer to Chapter 4.8 and modifications on p. 5.

3. Field History Label: No change


Parts revision: changed from “d” to “e”
Field retrofit: No
Implemented in instruments from serial No. 1053-26 onwards.
Please refer to this chapter for details. Both revisions are interchangeable.

- Block Diagram

EIO MVLB ECPU


Board Board Board
+5V
Power
Watch
IC J1 J1
DC J16 J211 Signal VACFAIL B3 B3
Power 1 AC Fail A10 generator SYSRESET C12 C12
Supply

5.4.4.2 Location

DO1 Board
EIO Board
EMOT Board
EECL 110/111 Board
ECPU237 Board

Fig. 5.4.4.1 Location in the PCB Rack

V 1.6 – April 1999 1 Chapter 5.4.4


RD/Hitachi Elecsys 2010 Service Manual

5.4.4.3 Functional Description


(1) Wave shaping and power supply for the sensors
• EIO shapes the wave from photointerrupter into TTL level and transmits it to EMOT Board.
• The main chips for this function are MDIR1 - 6.

(2) Driving SV etc.


• EIO drives SV1 - 8, ON/OFF of the pump and the solenoid for gripping mechanism of T/V carrier.
• The main chip is for this function is MP4501 (transistor array).

(3) Switching ON/OFF for HV etc.


• EIO switches ON/OFF HV, potentiostat, +24V power supply and power supply for DO3 board.
• EIO stores the ON/OFF status of GMCNT on the EMOT board in the buffer memory and switches
each function.

(4) Detection of fuse burning out and abnormal temperature on the DO3 board
• A circuit on the EIO board detects that a fuse that is mounted on DO1, DO2, DO3 or EIO
board is burned out, and it informs GMCNT on EMOT board of the issue.
• A circuit on the EIO board also detects an abnormal temperature of a fan on DO3 board,
and it informs GMCNT on EMOT board of the issue.

(5) Buffer for signals


A circuit on the EIO board stores the output signal of peltier and fan from EECL board
into the buffer memory ,and it transmits them to DO3 board.

(6) Driving a motor for beads mixing


A circuit on the EIO board supplies the power to a DC motor for beads mixing.

(7) Power supply for the following printed circuit boards and electronic modules.
• ±12V for LLD - P3 board via DIST - PA board
• ±12V for LLD - SA board
• ±15V for ANG - EP board
• ±12V for L - AMP (1) board via ANG - EP board

(8) Watching the power supply


A circuit on the EIO board compares the supplied voltage (V) with the reference voltage (Vref) ,
and it puts LOW level signal out to the EMOT board if the supplied voltage (V) is
lower than the reference voltage (Vref).

Chapter 5.4.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(9) Generating the signal for SYSTEM RESET


• A circuit on the EIO board generates the VACFAIL signal according to the ACFAIL signal from DC power
supply and 5V power watch IC (IC17 : MAX791), and it transmits SYSRESET signal to the ECPU board.
• Following switching on of the instrument, the main CPU is informed by VACFAIL signal, and the main CPU is reset
by SYSRESET signal. When the instrument is switched off, VACFAIL signal cuts in on main CPU just before DC
power supply is off.

- Fuses/LEDs Description

Fuse No. Rated Rated LED Supplied Purpose


current voltage No. voltage
F1 5.0 A 48 V LED1 5V Power supply for the wave shaping circuit
LED2 5 V (1) Power supply for photocoupler on SV
driving circuit
F2 ditto ditto LED3 12 V (1) For driving HV, potentiostat, beads mixer,
+24V ON/OFF
LED4 5 V (2) For controlling HV, potentiostat, beads
mixer, +24V ON/OFF
F3 ditto ditto LED5 24 V (1) For driving SV5 - SV8
F4 ditto ditto LED6 24 V (2) For driving SV1 - SV4 and pump
LED7 5 V (3) For controlling SV1 - SV8 and pump
F5 ditto ditto LED8 +15 V (1) Power supply for LLD-P3, LLD-SA and
L-AMP(1)
F6 ditto ditto LED9 -15 V (1) Power supply for ANG-EP and EECL111

V 1.6 – April 1999 3 Chapter 5.4.4


RD/Hitachi Elecsys 2010 Service Manual

5.4.4.4 Parts Mounting Diagram


The parts mounting diagram for the EIO board is shown below.

J212 J1

J210

J2
J211

Modification
H

J211

J3

Chapter 5.4.4 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

The following figure shows a modification of the EIO board implemented from SN 1053-26 onwards.

PCB Modification level “d” PCB Modification level “e”

VR1 (on B plane) VR1 (on A plane)

Note
• Both revision levels are interchangeable.
• Modification level of instrument is J for variable resistor.

V 1.6 – April 1999 5 Chapter 5.4.4


RD/Hitachi Elecsys 2010 Service Manual

5.4.5 DO1 Board

5.4.5.1 General Description


The DO1 board has fourteen (14) constant current motor drivers and two (2) constant voltage motor drivers
for the stepping motor and supply current to each motor.

- Block Diagram

EMOT Board MVLB Board DO1 Board

+24V

Stepping Motor

GPCNT
(Drive wave Driver
generator)

5.4.5.2 Location

DO1 Board
EIO Board
EMOT Board
EECL 110/111 Board
ECPU237 Board

Fig. 5.4.5.1 Location in the PCB Rack

V 1.6 – April 1999 1 Chapter 5.4.5


RD/Hitachi Elecsys 2010 Service Manual

5.4.5.3 Functional Description

The motor driving signals from GPCNT on the EMOT board are converted to motor driving current
on the DO1 board for the following stepping motors.

No. Motor No. Drive method Function


1 SM011 Constant Current 1-2 phase S.DISK rotation
2 SM031 Constant Current 1-2 phase Cap Open / Close (Forward / Back)
3 SM032 Constant Current 2 phase Cap Open / Close (Open / Close)
4 SM041 Constant Current 1-2 phase Beads Mixer (Arm Rotate)
5 SM042 Constant Current 1-2 phase Beads Mixer (Up/Down)
6 SM141 Constant Current 1-2 phase Solid Waste
7 SM051 Constant Current 1-2 phase Pipetter
8 SM052 Constant Current 1-2 phase Pipetter
9 SM081 Constant Current 1-2 phase Sipper
10 SM061 Constant Current 1-2 phase Gripper
11 SM063 Constant Current 1-2 phase Gripper
12 SM062 Constant Current 1-2 phase Gripper
13 - - -
14 - - -
15 SM091 Constant Voltage 1-2 phase Pipetter Syringe
16 - - -

- Fuses/LEDs Description

Fuse No. Rated Rated LED No. Supplied Purpose


current voltage voltage
F1 3.2 A 48 V LED1 5 V(1) DC power after photo coupler (PCP)
LED2 24 V(1) Driving power for S.Disk, and
Cap Open/Close (Forward/Backward)
F2 Ditto Ditto LED3 24 V(2) Driving power for Cap Open/Close
(Open/Close) and Beads Mixer
Rotation.
F3 Ditto Ditto LED4 24 V(3) Driving power for Cap Open/Close
(Up/Down), S.WASTE
F4 Ditto Ditto LED5 24 V(4) Driving power for Pipetter X axis / Z
axis
F5 Ditto Ditto LED6 24 V(5) Driving power for Sipper X axis,
and Gripper X axis
F6 Ditto Ditto LED7 24 V(6) Driving power for Gripper Z axis / Y axis
F7 Ditto Ditto LED8 24 V(7) Spare × 2
F8 Ditto Ditto LED9 24 V(8) Pipetter Syringe & Spare

Chapter 5.4.5 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.5.4 Parts Mounting Diagram


The parts mounting diagram for the DO1 board is shown below.

V 1.6 – April 1999 3 Chapter 5.4.5


RD/Hitachi Elecsys 2010 Service Manual

5.4.6 DO2 Board

5.4.6.1 General Description

The board has five (5) micro step driver circuits for the stepping motor and supplies current to the
following motors.

- Block Diagram

EMOT Board DO2 Board

Stepping Motor
GPCNT
(Switch of the
drive method)
Micro Step
Driver
GPCNT
(Pulse
generator)

5.4.6.2 Location
See Chapter 5.1.2.

5.4.6.3 Functional Description


• The motor driving signals from GMCNT on the EMOT board are converted to motor driving
current on the DO2 board.
• Micro step driving (2W1-2 phase or W1-2 phase) and constant current drive will be
switched by control signal from GMCNT on EMOT the board.

No. Motor Drive method Function


1 SM021 W1-2/2 R.DISK Rotation
2 SM151 2W1-2/1-2 Barcode Reader Rotation
3 SM082 2W1-2/1-2 Sipper Up/Down
4 SM111 2W1-2/1-2 Magnet Drive
5 SM101 2W1-2/1-2 Sipper Syringe

V 1.6 – April 1999 1 Chapter 5.4.6


RD/Hitachi Elecsys 2010 Service Manual

- Fuses/LEDs Description

Fuse No. Rated Rated LED No. Voltage Purpose


current voltage
F1 3.2 A 48 V LED1 5 V1 DC power for after photo coupler
LED2 24 V1 R.Disk rotation ,BCR rotation
F2 Ditto Ditto LED3 24 V2 Sipper Up/Down, Magnet Drive
F3 Ditto Ditto LED4 24 V3 Syringe (Sipper) Drive

5.4.6.4 Parts Mounting Diagram


The parts mounting diagram for the DO2 board is shown below.

Chapter 5.4.6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.7 DO3 Board

5.4.7.1 General Description


The DO3 board is a current driver for the peltier and heater.

- Block Diagram

EECL Board MVLB Board EIO Board DO3 Board

Current Peltier/
Amp.
Buffer Driver Heater
ANGCNT
Buffer Current
Fan
Driver

5.4.7.2 Location
See Chapter 5.1.2
5.4.7.3 Functional Description
• Control parameter (value is indicated on U/I) from ANGCNT on EECL Board is amplified 2.6 times
by EIO board & this PCB, and converted to current by the driver circuit for peltier or heater.
• Also, the fan motor for the peltier is driven by this board with ANGCNT signal.

- Fuses/LEDs Description
Fuse No. Rated Rated LED No. Voltage Purpose
current voltage
F1 5.0 V 48 V LED1 5 V1 DC power for photocoupler
LED2 12 V Fan motor
F2 Ditto Ditto LED3 +15 V1 Peltier for R. disk
F3 Ditto Ditto LED4 +15 V2 Ditto
F4 Ditto Ditto LED5 +15 V3 Peltier for measuring unit
F5 Ditto Ditto LED6 +15 V4 Peltier for system reagent unit
F6 Ditto Ditto LED7 +15 V5 Heater for incubator
F7 Ditto Ditto LED8 -15 V1 Peltier for R. disk
F8 Ditto Ditto LED9 -15 V2 Ditto
F9 Ditto Ditto LED10 -15 V3 Peltier for measuring unit
F10 Ditto Ditto LED11 -15 V4 Peltier for system reagent unit
F11 Ditto Ditto LED12 -15 V5 Heater for incubator

V 1.6 – April 1999 1 Chapter 5.4.7


RD/Hitachi Elecsys 2010 Service Manual

5.4.7.4 Parts Mounting Diagram


The parts mounting diagram for the DO3 board is shown below.

V 1.6 – April 1999 2 Chapter 5.4.7


RD/Hitachi Elecsys 2010 Service Manual

5.4.8 DIST-PA Board

5.4.8.1 General Description


• This board distributes DO1 output signal to the pipetter assembly and connects detector signal including LLD
signal from the pipetter assembly to the EIO board.

- Block Diagram

DIST-PA Board
J553
Motor for
J550
Pipetter X
DO1 Board J554
Photo
interrupter
J551 J555
EECL Board Photo
interrupter
J556
J552 Motor for Pipetter Z
EIO Board Photo Interrupters
LLD-P3

5.4.8.2 Location
See Chapter 5.1.2

V 1.6 – April 1999 1 Chapter 5.4.8


RD/Hitachi Elecsys 2010 Service Manual

5.4.8.3 Parts Mounting Diagram


The parts mounting diagram for the DIST-PA board is shown below.

T P 3(+ 5V )

T P1
(L L D Sig.)

T P2(A .G )

5.4.8.4 Check Procedure

- Pipetter Z Abnormal Detection


Check the voltage between Pin# A3( Z-ABN) of J552 and TP2(A.G) with a voltage multimeter.

- Pipetter LLD
Check the voltage between TP1(LLD Sig.) and TP2(A.G) with a voltage multimeter.

- Supplied Voltage + 5 V on Board


Check the voltage between TP3(5V) and TP2(A.G) with a voltage multimeter.

V 1.6 – April 1999 2 Chapter 5.4.8


RD/Hitachi Elecsys 2010 Service Manual

5.4.9 DIST-SA Board

5.4.9.1 General Description


This board distributes DO1 & DO2 output signal to the sipper assembly and connects detector
signal from the sipper assembly to the EIO board.

- Block Diagram

DIST-SA Board
J583
Photo
J580
interrupter
DO1 Board J584
Photo
interrupter
J581 J585
DO2 Board Motor for
Sipper X
J586
J582 Motor for Sipper Z
EIO Board Photo Interrupters
Sipper probe

5.4.9.2 Location
See Chapter 5.1.2

V 1.6 – April 1999 1 Chapter 5.4.9


BM/Hitachi Elecsys 2010 Service Manual

5.4.9.3 Parts Mounting Diagram


The parts mounting diagram for the DIST-SA board is shown below.

V 1.6 – April 1999 2 Chapter 5.4.9


RD/Hitachi Elecsys 2010 Service Manual

5.4.10 DIST-TVA Board

5.4.10.1 General Description

This board distributes DO1 output signal to following devices, gathers detection signal from the following
devices and connects to the EIO board.

- Block Diagram

DIST-TVA Board
J562
Motor for
J560
Gripper Y
DO1 Board
J563
DET-A
Board
J561 J564
EIO Board DET-B
Board
J565
Motor for Gripper X,Z
Photo Interrupters
J566
Solenoid
Photo Interrupters

5.4.10.2 Location
See Chapter 5.1.2.

V 1.6 – April 1999 1 Chapter 5.4.10


RD/Hitachi Elecsys 2010 Service Manual

5.4.10.3 Parts Mounting Diagram


The parts mounting diagram for the DIST-TVA board is shown below.

V 1.6 – April 1999 2 Chapter 5.4.10


RD/Hitachi Elecsys 2010 Service Manual

5.4.11 DIST-F Board

5.4.11.1 General Description

This board distributes DC power from DC power supply to MVLB and protects it from the DC power line.

- Block Diagram

DIST-F Board +5V


+12V
DC Power J30 J31 +24V
Supply Fuse MVLB Board

5.4.11.2 Location
See Chapter 5.1.2.

5.4.11.3 Functional Description

- Fuses/LEDs Description

Fuse No. Rated Rated LED No. Corresponding power Purpose


current voltage
F1 3.2 A 48 V LED1 +5 V(1) For ECPU board
F2 5.0 A ditto LED2 +5 V(2) For EECL board
F3 5.0 A ditto LED3 +5 V(3) For EMOT board
F4 5.0 A ditto LED4 +5 V(4) For EIO board
F5 3.2 A ditto LED5 +5 V(5) For DO1 board
- - - LED6 +12 V +12 V for MVLB board
- - - LED7 +24 V +24 V for MVLB board

V 1.6 – April 1999 1 Chapter 5.4.11


RD/Hitachi Elecsys 2010 Service Manual

5.4.11.3 Parts Mounting Diagram


The parts mounting diagram for the DIST-F board is shown below.

Note) Fuse F4 should be mounted with a rated current of 5.0 A.


5.4.11.4 Check Procedure
- Check the supplied voltage with a voltage multimeter as follows.
Fuse No. LED No. Corresponding power Check point Voltage
F1 LED1 +5 V(1)
F2 LED2 +5 V(2) Voltage between
F3 LED3 +5 V(3) TP1 and TP4. ca. 5 V
F4 LED4 +5 V(4)
F5 LED5 +5 V(5)
- LED6 +12 V Voltage between ca. 12 V
TP2 and TP5.
- LED7 +24 V Voltage between ca. 24 V
TP3 and TP6.

V 1.6 – April 1999 2 Chapter 5.4.11


RD/Hitachi Elecsys 2010 Service Manual

5.4.12 ANG-EP Board

5.4.12.1 General Description


This printed circuit PCB acts as a potentiostat for the measuring cell, amplifier of pressure sensor, ON/OFF
of PMT high voltage and power supply for L-AMP(1) PCB.
Note
The PCB has been modified: history label M
Field retrofit: Upgrade package 1
Implemented in instruments from serial No. 1053-23 onwards
Please refer to Chapter 4.8 for details.

5.4.12.2 Functional Description


(1) Potentiostat
• This circuit has the function of applying constant voltage between RE-WE of the measuring cell by regulating
the current. The voltage is switched by the software. With relay the voltage will be cut off when the software
is not activated.
• Also, there is a function for sending voltage between CE and WE and current for the measuring cell to the
EECL board.

- Block Diagram

ANG-EP
Board Detection Unit
EECL Board
J413 J602 J601 J610
J113 J411 TP2 4 WE(GND) 4 7 1
A1 Vref 1
TP3 5 RE 5 3 2
B1 GND 2 Potentio Cell
-stat TP4 6 CE 6 8 3
A2 Cur 3

B2 GND 4
A3 Vol 5
B3 GND 6

EIO Board
J213 J410
6A +12V(3) B4
Relay
4B POT On/Off A5

Vref : order voltage of potentiostat voltage × (-2)


Vol : voltage between CE and WE
Cur : current for Cell
+12(3) : DC driving power for relay

V 1.6- April 1999 1 Chapter 5.4.12


RD/Hitachi Elecsys 2010 Service Manual

(2)Amplifier of Pressure Sensor


• The pressure sensor signal is picked up by half of the bridge circuit in the pressure sensor and half of the bridge
circuit on this board, and this signal is amplified and sent to EECL PCB.
• For the adjustment procedure for the bridge circuit see the ANG-EP PCB adjustment procedure.
- Block Diagram

ANG-EP
Board
EECL Board
J415
J113
V(-) 6 J414
B TP5
1 Sig. A7
TP7 Amp.
Vp 2
Pressure R Half TP6
V(+) 2 GND B7
Sensor GND 4 Bridge
W
GND 8
Shield

(3)ON/OFF function of PMT-High Voltage


DC power for PMT-SHV PCB and drive signal for relay of PMT High Voltage ON / OFF.
- Block Diagram

EIO Board ANG-EP


J213 J410 Board PMT-SHV
J412 Board J400
6A +12V(2) B3
1 +12V(2) 1
5B HV On/Off A4
2 HV On/Off
8A +12V(1) B1 2
3 +12V(1) 3
7B A2 Noise
Filter 4 GND 4
7A GND B2
6B A3

+12 V(1) : HV input voltage


+12 V(2) : DC driving power for PMT-SHV PCB.

Chapter 5.4.12 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(4)DC Power Supply for L-AMP(1) PCB


±15V from EIO PCB is filtered on this PCB and connected to L-AMP(1) PCB.
- Block Diagram

EIO Board ANG-EP


J213 J410 Board Detection Unit

4A +15V B5 Noise J413 J602 J601 J422


1 +15V 1 1 1
Filter
3B A6
3A GND B6 TP1 2 GND 2 6 2 L-AMP(1)
Board
2B A7
3 -15V 3 2 3
2A -15V B7 Noise
Filter
1B A8

- Fuses/LEDs Description

Fuse No. Rated Rated LED No. Corresponding power Purpose


current voltage
F1 0.5 A 48 V LED4 15 V LOG-AMP board
LED5 -15 V LOG-AMP board
F2 0.5 A ditto LED3 12 V PMT-SHV board
F3 1.0 A ditto LED1 15 V +15 V in PCB for
potentiostat circuit
LED2 -15 V -15 V in PCB for
potentiostat circuit

V 1.6- April 1999 3 Chapter 5.4.12


RD/Hitachi Elecsys 2010 Service Manual

5.4.12.3 Parts Mounting Diagram


The parts mounting diagram for the ANG-EP board is shown below.

VR1 R 63

TP6

TP5 TP1

TP7

TP4

TP3

TP2

Modification Note
Resistor R63: before change 56 Ohm, after change 150 Ohm.

Chapter 5.4.12 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.12.4 Check Procedure


- Pressure Sensor Voltage Output
• Check the voltage between TP5 (Signal) and TP6 (A.G) with a voltage multimeter.
• If it is out of specification, adjust the voltage by turning variable resistor VR1 to 2.00V±0.20V.
- Voltage output +9 V
• Check the voltage output +9 V between TP7 (+9V) and TP6 (A.G) with a voltage multimeter.

V 1.6- April 1999 5 Chapter 5.4.12


RD/Hitachi Elecsys 2010 Service Manual

5.4.13 PMT-SHV Board

5.4.13.1 General Description


This PCB converts DC+12V to DC-1000V and applies the voltage to PMT.

- Block Diagram
+12 V(1): input voltage for HV
+12 V(2): driving power for PMT-SHV PCB

PMT-SHV
Board
J412 J400
1 +12V(2) 1
Relay
2 HV On/Off 2 J401
3 +12V(1) 3 HV
DDC PMT
4 GND 4 Shield
TP1 TP2

Gain
Adjuster

5.4.13.2 Functional Description


• When High Voltage ON command is issued by software, the relay will be switched on and DC+12V will be
applied to DDC (DC-DC converter).
• DDC will convert to High Voltage around DC-1000V and it will be applied to the PMT.
• GAIN Adjuster consists of voltage generator (DC+10V), three (3) variable resistors VR1,VR2,VR3 and three (3)
jumper sockets J1, J2, J3 that are changeable.

- LED Description

LED No. Supplied Voltage Purpose Remarks

LED1 +12 V Confirmation of HV ON/OFF

V 1.6 – April 1999 1 Chapter 5.4.13


RD/Hitachi Elecsys 2010 Service Manual

5.4.13.3 Parts Mounting Diagram


The parts mounting diagram for the PMT-SHV board is shown below.

T P1

T P2

5.4.13.4 Adjustment of PMT-SHV Board

• Refer to Chapter 2.3.8 concerning calculation of control voltage.


• Control Voltage (CV) between TP2 (VCON-IN) and TP1(GND) is to be adjusted instead of the
high voltage by turning the necessary variable resistor and setting a jumper socket according to the
calculated Control Voltage (CV) relative to the high voltage as shown in the following table.

High Voltage Output JP1 Setting / Variable Resistor Control Voltage (CV)
1 -1100 (V) to –960 (V) JP1 / VR1 6.43 (V) to 5.24 (V)
2 -1030 (V) to –810 (V) JP2 / VR2 5.61 (V) to 4.39 (V)
3 -870 (V) to –660 (V) JP3 / VR3 4.76 (V) to 3.57 (V)

V 1.6 – April 1999 2 Chapter 5.4.13


RD/Hitachi Elecsys 2010 Service Manual

5.4.14 L-AMP(1) Board

5.4.14.1 General Description


Luminescence from the cell is converted to current signal by the PMT. Then, the current signal is converted by the
logarithmic function on this board and is sent to the EECL board.

- Block Diagram
See the figure below.

5.4.14.2 Location
See Chapter 5.1.2.

5.4.14.3 Functional Description


The output voltage of the L-AMP (1) board is calculated as follows.

V=A log I + B

V: Output voltage(V)
I: PMT current (A)
A: Gain of log amplifier
B: Offset value

L-AMP(1)
Board
EECL Board
J430 J431 J119
I V
PMT Alog I+B

Shield Shield

V 1.6 – April 1999 1 Chapter 5.4.14


RD/Hitachi Elecsys 2010 Service Manual

5.4.14.4 Parts Mounting Diagram


The parts mounting diagram for the L-AMP(1) board is shown below.

Caution
Be careful not to touch the variable resistors on the board.
• L-AMP(1) board is preadjusted in production.
• Any changes made in the field by the service engineer will have a significant effect on measured data. The
warranty is no longer valid in this case.

V 1.6 – April 1999 2 Chapter 5.4.14


RD/Hitachi Elecsys 2010 Service Manual

5.4.15 LLD-SA Board

5.4.15.1 General Description


This board has the function of detecting and amplifying the liquid surface signal from the sipper and sending it to the
EECL board.

- Block Diagram

LLD-SA
Board

Oscillator T P3 EECL Board


J113
J5 J10
Sign al
3 Sig. A6
Bridge Rectifier Amp.
circuit 4 GND B6
GND

Syst em R eagen t U n it

5.4.15.2 Location
See Chapter 5.1.2.

5.4.15.3 Functional Description


• Variation of static capacity between sipper and system reagent unit is converted
to unbalance the signal of the bridge circuit, then amplified and sent to the EECL board.
• Refer to Chapter 5.3.2 Principle of Liquid Level Detection for details.

V 1.6 – April 1999 1 Chapter 5.4.15


RD/Hitachi Elecsys 2010 Service Manual

5.4.15.4 Parts Mounting Diagram


The parts mounting diagram for the LLD-SA board is shown below.

T P3

T P1

TC2
5.4.15.5 Check Procedure
- Sipper LLD Voltage Output (refer to Chapter 5.3.4.2)

Chapter 5.4.15 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.16 LLD-P3 Board

5.4.16.1 General Description


This PCB has the function of detecting and amplifying the liquid surface signal from the pipetter and sending it to
the EECL board. For history of the PCB, refer to Chapter 8.3.

- Block Diagram

LLD-P3 DIST-PA
Board Board

Oscillator TP1 EECL Board


J113
J1 J556 J551
Signal
1 Sig. 8 1 A4
Bridge Rectifier Amp. Noise
GND circuit 2 GND 6 filter 2 B4

Pipetter Probe

5.4.16.2 Location
See Chapter 5.1.2.

5.4.16.3 Functional Description


• Variation of pipetter’s static capacity is converted to unbalance the signal of the bridge circuit,
then amplified and sent to the EECL PCB via DIST-PA PCB.
• Refer to Chapter 5.3.2 Principle of Liquid Level Detection.

V 1.6 – April 1999 1 Chapter 5.4.16


RD/Hitachi Elecsys 2010 Service Manual

5.4.16.4 Parts Mounting Diagram


The parts mounting diagram for the LLD-P3 board is shown below.

Sign al(wh it e)

G N D (black )

Sign al(wh it e)
variable-
capacitor TC1

G N D (black )

U pper B oar d

L ower B oar d

F PC C ables

5.4.16.5 Check Procedure


- Pipetter LLD Voltage Output (refer to Chapter 5.3.4.1)

V 1.6 – April 1999 2 Chapter 5.4.16


RD/Hitachi Elecsys 2010 Service Manual

5.4.17 UIRS-A Board

5.4.17.1 General Description


This is a connection board between ECPU237, EECL board and user interface, and it also connects
RS232 communication for BCR, host and printer. For history of the PCB, refer to Chapter 8.3.

- Block Diagram

UIRS-A Board
J2
J340
U/I
ECPU Board J342
BCR
J1
J343
Reserved
EECL Board J344
J341 Host
J345
Printer

5.4.17.2 Location
See Chapter 5.1.2.

V 1.6 – April 1999 1 Chapter 5.4.17


RD/Hitachi Elecsys 2010 Service Manual

5.4.17.3 Parts Mounting Diagram


The parts mounting diagram for the UIRS-A board is shown below.

V 1.6 – April 1999 2 Chapter 5.4.17


RD/Hitachi Elecsys 2010 Service Manual

5.4.18 EUIF101 Board

5.4.18.1 General Description


This board has a display signal buffer and user interface (UI) control function. For history of the PCB, refer to
Chapter 8.3.

- Block Diagram

ECPU237/ EECL111

EUIF Board J130

RS-232C
+12V
Driver

Picture Data
UICNT Buffer

Buffer Buffer

J131 J132 J133 J134

Inverter
Touch panel Key board

TFT LCD

5.4.18.2 Location
This board is located in the user interface (UI) itself.

5.4.18.3 Functional Description

(1) Display Signal Buffer


TFT type LCD picture signals from ECPU237 & EECL111 PCB are buffered with this
PCB and connected to TFT LCD.
(2) User Interface Control
• The function detects Keyboard input or Touch Panel input and sends the
information to the ECPU Board.
• Also, the LED and buzzer are controlled by the user interface control (UICNT) function.

V 1.6 – April 1999 1 Chapter 5.4.18


RD/Hitachi Elecsys 2010 Service Manual

5.4.18.3 Parts Mounting Diagram


The parts mounting diagram for the EUIF101 board is shown below.

- LED Description

No. LED No. Description


1 LED0 After initializing, operation is ready
2 LED1 During scanning of key input
3 LED2 During judgement of key input
4 LED3 Program stop

- Adjustment of VR1/VR2

No. VR No. Function Direction Contents


1 VR1 Brightness change of back Turn to right Bright
light for TFT display Turn to left Dark
2 VR2 Volume change of buzzer Turn to right Volume up
sound Turn to left Volume down

V 1.6 – April 1999 2 Chapter 5.4.18


RD/Hitachi Elecsys 2010 Service Manual

5.4.19 MVLB Board

5.4.19.1 General Description


This is the mother board for the following PCBs.

- Block Diagram

+5V MVLB Board


+12V
DIST-F +24V
VME bus
Board

FDD ECPU Board EECL Board EMOT Board EIO Board DO1 Board

5.4.19.2 Location
This board is located under the PCB rack.

5.4.19.3 Parts Mounting Diagram


The parts mounting diagram for the MVLB board is shown below.
FDCN

V 1.6 – April 1999 1 Chapter 5.4.19


RD/Hitachi Elecsys 2010 Service Manual

5.4.20 S.AB-CE Board

5.4.20.1 General Description


This is a surge absorber circuit board.

- Block Diagram

to Noise
Filter

Surge
SW
AC Inlet Absorber

C C
S.AB-CE
Board

5.4.20.2 Location
See Chapter 5.1.2.

5.4.20.3 Parts Mounting Diagram


The parts mounting diagram of the S.AB-CE board is shown below.

V 1.6 – April 1999 1 Chapter 5.4.20


RD/Hitachi Elecsys 2010 Service Manual

5.4.21 DET-A Board

5.4.21.1 Overview

- Block Diagram

DET-A Board P563

+5V
1 1
PI063 R.GND
2 2 DIST-T/VA
(Y-HP)
Y-H.P
3 3

5.4.21.2 Location
See Chapter 5.1.2.

5.4.21.3 PCP Description


See Chapter 5.6 for details.

V 1.6 – April 1999 1 Chapter 5.4.21


RD/Hitachi Elecsys 2010 Service Manual

5.4.22 DET-B Board

5.4.22.1 Overview

- Block Diagram

DET-B P564

+5V
1 1
PI065 R.GND
2 2
(Y-RP) Y-R.P
3 3
R.GND DIST-T/VA
PI064 4 4
Y-E.P
(Y-EP) 5 5

5.4.22.2 Location
See Chapter 5.1.2.

5.4.22.3 PCP Description


See Chapter 5.6 for details.

V 1.6 – April 1999 1 Chapter 5.4.22


RD/Hitachi Elecsys 2010 Service Manual

5.4.23 DET-C Board

5.4.23.1 Overview

5.4.23.2 Location
See Chapter 5.1.2.

5.4.23.3 PCP Description


See Chapter 5.6 for details.

V 1.6 – April 1999 1 Chapter 5.4.23


RD/Hitachi Elecsys 2010 Service Manual

5.4.24 Fuse Board

5.4.24.1 Overview

5.4.24.2 Location
See Chapter 5.1.2.

5.4.24.3 Block Diagram

from DC power supply for EIO Pcb (Power down monitor)

F1 : 0.5A
for Floppy disk drive

F2 : 1.0A

- Fuse Description

Fuse Rated Rated Supplied Purpose


No. current voltage voltage
F1 0.5 A 48 V 5V +5 VDC Fuse for EIO board power down monitor
F2 1.0 A ditto ditto +5 VDC Fuse for FDD

V 1.6 – April 1999 1 Chapter 5.4.24


RD/Hitachi Elecsys 2010 Service Manual

5.4.25 RS CONTA Board

5.4.25.1 General Description

Five (5) motor controllers GPCNT, a DI/DO buffer controller and serial transmit/receive signal
controller are located on this board.

- Block Diagram

VME bus
RS CONTA Board

Address buffer Data buffer VME controller

Local bus

H8
GPCNT DI DO
×5

Parallel − > Serial − > Parallel data


Serial Parallel Input/Output
Converter Converter Driver

PS CONTA Board

5.4.25.2 Location

See Chapter 5.1.2.

Chapter 5.4.25 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.25.3 Function Description

(1) Motor Controller


When a drive pattern of the motor and the command for the number of pulses are received from
the CPU, the GPCNT will output a magnetization signal and a pulse and transmits to the PS
CONTA board.
The GPCNT sends the number of pulses that were ordered or stops the motor if it receives a
photo-interrupter signal.

(2) DI/DO Buffer Controller


(a) DI
Status information such as power supply surveillance, fuse detection, rack detection, cup
detection and tray full detection are received from the PS CONTA board.
By READING each DI address, the CPU knows the status of the above-mentioned items.
(b) DO
The CPU will WRITE the ON/OFF condition of the +24 V power supply, the tray exchange
indicator, the cup detection timing, etc., into each address. This is then WRITTEN into each latch
within the RS CONTA board and transmitted to the PS CONTA board.

(3) Serial Transmit/Receive Signal Controller


Executes the transmit/receive signal between the device itself and the rack unit with 16bit serial
data. Executes the parallel → serial data exchange and the serial → parity data exchange such as
motor control signal and DI/DO signal.

- Location of DIP SW

Chapter 5.4.25 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- DIP SW Description (DSW1)

1 2 3 4

OFF

bit 1 bit 2 bit 3 bit 4 RS CONTA Board address


ON OFF OFF ON $D06000 to $D06FFF
ON OFF OFF OFF $D07000 to $D07FFF
DSW1 OFF ON ON ON $D08000 to $D08FFF (Initialize)
OFF ON ON OFF $D09000 to $D09FFF
OFF ON OFF ON $D0A000 to $D0AFFF
OFF ON OFF OFF $D0B000 to $D0BFFF
others not used

- DIP SW Description (DSW2)

1 2 3 4 5 6 7 8

OFF

bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 bit 8 Which unit is set up
OFF OFF OFF OFF OFF OFF OFF OFF RACK SAMPLER Initialize
DSW2 OFF OFF OFF OFF OFF ON OFF OFF RACK sampler connected to CLAS 1
others not used

Chapter 5.4.25 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.25.4 Parts Mounting Diagram


The parts mounting diagram for the RS CONTA board is shown below.

Chapter 5.4.25 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.26 PS CONTA Board

5.4.26.1 General Description

Loaded on this board are a serial transmit/receive signal controller and a serial communication command circuit
with the RS CONTA board.

- Block Diagram

5.4.26.2 Location

See Chapter 5.1.2.

5.4.26.3 Functional Description

(1) Serial Transmit/Receive Signal Controller

Executes the transmit/receive signal between the device itself and the rack unit with 16bit serial data.
Executes the parallel → serial data exchange and the serial → parity data exchange such as motor
control signal and DI/DO signal.

(2) Serial Communication Command Circuit

Commands the CLK signal of the serial communication; if a malfunction occurs within the
communication, an ERR occurs in the RS CONTA board.

Chapter 5.4.26 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.26.4 Parts Mounting Diagram

The parts mounting diagram for the PS CONTA board is shown below.

Chapter 5.4.26 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.27 DO4 Board

5.4.27.1 General Description

This board loads the constant-current drive motor driver of the stepping motor, then supplies the current to the motor.
It also performs the waveform shape of the sensor, the ON/OFF fuse disconnect detection of the DC+24V power supply
and the voltage command.

- Block Diagram

RS CONTA Board PS CONTA Board DO4


+24V
Stepping
Motor

GPCNT S/P
P/S
(Drive Driver
Driver Driver
wave

5.4.27.2 Location

See Chapter 5.1.2.

Chapter 5.4.27 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.27.3 Functional Description

(1) Stepping Motor Drive


Using the drive waveform from the GPCNT of the RS CONTA board, supplies the current that drives the motors.

CH-No. Drive method Motor Function Motor Function Motor Function


(Sampler) (Loader) (Unloader)
1 Constant Current SM200 A-Line SM200 A-Line - Spare
1-2 phase
2 Constant Current SM220 C-Line - Spare - Spare
1-2 phase
3 Constant Current SM210 B-Line - Spare - Spare
1-2 phase
4 Constant Current - Spare - Spare SM260 E-Line
1-2 phase
5 Constant Current - Spare SM230 D-Line SM280 F-Line
1-2 phase
6 Constant Current - Spare - Spare - Spare
1-2 phase
7 Constant Current - Spare SM240 Rotate SM240 Rotate
1-2 phase (Belt) (Belt)
8 Constant Current - Spare SM241 Rotate SM241 Rotate
1-2 phase
9 Constant Current - Spare - Spare - Spare
1-2 phase
10 Constant Current - Spare - Spare - Spare
1-2 phase

(2) Sensor Waveform Shape


Signal waveform (e.g. from photo-interrupters) is shaped in the TTL level and sent to the RS CONTA board.
The main element is MDI-R1~ 5.
(3) DC+24V Power Supply ON/OFF
Buffers the ON & OFF signal from the RS CONTA board and turns the DC+24V power supply
ON & OFF. The main element is MP4501 (transistor array)

Chapter 5.4.27 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(4) Fuse Disconnect Detection and Voltage Command


Detects disconnected fuses within the DO4 board and sends a detection signal to the RS CONTA board.
Also, if the DC+24V voltage within the DO4 board is low, it sends a detection signal of the low voltage
condition to the RS CONTA board.

- Fuse/LED Description

Fuse Rated Rated LED Supplied Purpose Remarks


No. current voltage No. voltage
F1 3.2 A 48 V LED1 5V Logic drive use power supply within the board
F2 ditto ditto LED2 24 V1 Power supply for the stepping motor drive (1) CH-1,2
F3 ditto ditto LED3 24 V2 Power supply for the stepping motor drive (2) CH-3,5
F4 ditto ditto LED4 24 V3 Power supply for the stepping motor drive (3) CH-10,6
LED7 5 V1 Power supply for the latter part of the photo-
coupler
F5 ditto ditto LED5 24V4 Power supply for the stepping motor drive (4) CH-7,8
F6 ditto ditto LED6 24V5 Power supply for the stepping motor drive (5) CH-4,9

Chapter 5.4.27 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.27.4 Parts Mounting Diagram

The parts mounting diagram for the DO4 board is shown below.

Chapter 5.4.27 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.28 BCR Board

5.4.28.1 General Description


This is the BCR board which connects the RS232C signal between the UIRS-B board and the BCR.

- Block Diagram

BCR Board
J340 J343 J920 J921
CPU Board UIRS-B
BCR
Board

5.4.28.2 Location

See Chapter 5.1.2.

5.4.28.3 Parts Mounting Diagram

The parts mounting diagram for the BCR board is shown below.

V 1.6 – April 1999 1 Chapter 5.4.28


RD/Hitachi Elecsys 2010 Service Manual

5.4.29 FAN Board

5.4.29.1 General Description


This is the FAN board on which is mounted a +24VDC fuse for the DC fan motor.

- Block Diagram

FAN Board

DC Power J920 Fuse J921


Supply 0.5A FAN
+24V

5.4.29.2 Location

See Chapter 5.1.2.

- Fuse Description

Fuse No. Rated Rated Supplied Purpose


current voltage voltage
FUSE 0.5 A 48 V 24 V For DC fan motor

5.4.29.3 Parts Mounting Diagram

The parts mounting diagram for the FAN board is shown below.

V 1.6 – April 1999 1 Chapter 5.4.29


RD/Hitachi Elecsys 2010 Service Manual

5.4.30 PH-D Board


5.4.31 PH-T Board

- Location

See Chapter 5.1.2.

- Parts Mounting Diagrams

The parts mounting diagrams for the PH-D and PH-T boards are shown below.

PH-T Board PH-D Board

V 1.6 – April 1999 1 Chapter 5.4.30 - 31


RD/Hitachi Elecsys 2010 Service Manual

5.4.32 DIST CR1 Board

5.4.32.1 General Description

This board has current loop circuits for transferring control signal to the CLAS 1 System.

- Block Diagram

RS-CONTA PS-CONTA DO5 DIST-CR

+5V +5V

P/S S/P
Drive Drive

5.4.32.2 Location

See Chapter 5.1.2.

5.4.32.3 Functional Description

- Fuse Description

Fuse No. Rated Rated LED No. Supplied Purpose


current voltage voltage
FUSE1 0.5 A 48 V LED1 +5 V +5VDC for the board

5.4.32.4 Parts Mounting Diagram

The parts mounting diagram for the DIST CR1 board is shown below.

V 1.6 – April 1999 1 Chapter 5.4.32


RD/Hitachi Elecsys 2010 Service Manual

5.4.33 DO5 Board

5.4.33.1 General Description

This board loads the constant-current drive motor driver of the stepping motor, then supplies the current to the motor.
It also performs the waveform shape of the sensor, the ON/OFF fuse disconnect detection of the DC+24V power supply
and the voltage command.

- Block Diagram

RS CONTA Board PS CONTA Board DO5


Board
+24V
Stepping
Motor

GPCNT
P/S S/P
(Drive Driver
Driver Driver
wave
generator)

5.4.33.2 Location

See Chapter 5.1.2.

Chapter 5.4.33 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.33.3 Functional Description

(1) Stepping Motor Drive


Using the drive waveform from the GPCNT of the RS CONTA board, it supplies the current that drives the motors.

CH-No. Drive method Motor Function


(Rack Sampler connected to CLAS 1 System)
1 Constant Current 1-2 phase SM200 A Line
2 Constant Current 1-2 phase SM220 C Line
3 Constant Current 1-2 phase SM210 B2 Line
4 Constant Current 1-2 phase - Spare
5 Constant Current 1-2 phase - Spare
6 Constant Current 1-2 phase SM300 I-Line
7 Constant Current 1-2 phase - Spare
8 Constant Current 1-2 phase - Spare
9 Constant Current 1-2 phase SM310 Turntable C (for belt)
10 Constant Current 1-2 phase SM311 Turntable C (for rotation)

(2) Sensor Waveform Shape


Signal waveform (e.g. from photo-interrupters) is shaped in the TTL level, and sent to the RS CONTA board.
The main element is MDI-R1~ 5.

(3)DC+24V Power Supply ON/OFF


Buffers the ON & OFF signal from the RS CONTA board and turns the DC+24V power supply
ON & OFF. The main element is MP4501 (transistor array)

(4)Fuse Disconnect Detection and Voltage Command


Detects disconnected fuses within the DO5 board and sends a detection signal to the RS CONTA board.
Also, if the DC+24V voltage within the DO5 board is low, it sends a detection signal of the low voltage
condition to the RS CONTA board.

Chapter 5.4.33 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Fuse/LED Description

Fuse Rated Rated LED Supplied Purpose Remarks


No. current voltage No. Voltage
F1 3.2 A 48 V LED7 5V Power supply for the latter part of the photo-
coupler
F2 ditto ditto LED1 24 V1 Power supply for the stepping motor drive (1) CH-1,2
F3 ditto ditto LED2 24 V2 Power supply for the stepping motor drive (2) CH-3,4
F4 ditto ditto LED3 24 V3 Power supply for the stepping motor drive (3) CH-7,8
F5 ditto ditto LED4 24 V4 Power supply for the stepping motor drive (4) CH-5,9
F6 ditto ditto LED5 24 V5 Power supply for the stepping motor drive (5) CH-6,10
F7 LED6 24 V6 Power supply for converting to +5 V1 and
+5 V2
LED8 5 V1 Logic drive use power supply within the board
LED9 5 V2 Power supply for the DIST CR1 Board

Chapter 5.4.33 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.4.33.4 Parts Mounting Diagram


The parts mounting diagram for the DO5 board is shown below.

Chapter 5.4.33 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.5 Cross Wiring Diagrams

V 1.6 – April 1999 1 Chapter 5.5


RD/Hitachi Elecsys 2010 Service Manual

Chapter 5.5 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 3 Chapter 5.5


RD/Hitachi Elecsys 2010 Service Manual

Chapter 5.5 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 5 Chapter 5.5


RD/Hitachi Elecsys 2010 Service Manual

Chapter 5.5 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 7 Chapter 5.5


RD/ Hitachi Elecsys 2010 Service Manual

Chapter 5.5 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 9 Chapter 5.5


RD/Hitachi Elecsys 2010 Service Manual

Chapter 5.5 10 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

V 1.6 – April 1999 11 Chapter 5.5


Cross Wiring Diagrams for Rack Sampler System
A-Line YEL 1 A2 24V
SM200 WHT 2 B2
BLK 3 A3 1 IC1 6 10 PC1 8 A 3 2 IC32 1 15 IC8 14 9 IC2 11 6 PC3 4 A3 A3 2 IC53 1 9 IC59 14 9 IC58 15 3 IC21 17 57 IC2
GRN 4 B3 8 17 12 6 B 3 12 13 1 1 5 15 58
RED 5 A4 11 5 14 4 C3 4 3 2 P/J905 P/J900 2 7 13 59
BLU 6 B4 18 16 16 2 A 4 10 11 3 3 9 11 60

P/J700 P/J911 P/J1 GPCNT 12


DO4 PS-CONTA RS CONTA

B-Line BLK 1 A8 24V


SM210 WHT 2 B8
RED 3 A9 1 IC3 6 10 PC3 8 C 8 2 IC35 1 15 IC10 14 12 IC2 8 7 PC3 1 A5 A5 4 IC53 2 9 IC61 14 9 IC60 15 3 IC24 17 57 IC2
RED/WHT 4 B9 8 17 12 6 A 9 12 13 1 1 5 15 58
GRN 5 A10 11 5 14 4 B9 4 3 2 P/J905 P/J900 2 7 13 59
GRN/WHT 6 B10 18 16 16 2 C 9 10 11 3 3 9 11 60

P/J710 P/J911 P/J1 GPCNT 13


DO4 PS-CONTA RS CONTA

C-Line YEL 1 A5 24V


SM200 WHT 2 B5
BLK 3 A6 1 IC2 6 10 PC2 8 C5 6 IC31 9 15 IC7 14 9 IC8 14 9 IC2 11 6 PC3 4 A3 A3 2 IC53 1 9 IC59 15 12 IC21 8 46 IC2
GRN 4 B6 8 17 12 6 A6 8 5 1 1 14 6 45
P/J905 P/J900 2 16 4 44
3 18 2 43
RED 5 A7 11 5 14 4 B 6 2 IC30 1 2
BLU 6 B7 18 16 16 2 C 6 12 13 3 GPCNT 12

P/J700 P/J911 P/J1


DO4 PS-CONTA RS CONTA
Cross Wiring Diagrams for Rack Sampler
A-Line Tray A 1 B41 5V
Change K 2 B40 18 HC244 2 C3 4 IC47 3 2 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 2 6 IC79
-1

A-Line Tray 5V +V 4 B50 5V


Det Sig OUT 5 B49 6 MDI-R1 2 2 HC240 18 C22 2 IC49 18 15 IC20 9 14 IC19 9 11 IC29 10 B7 B7 4 PC2 6 14 IC74 9 14 IC75 15 2 IC34
GND0V 6 B48 -1
5G
P/J 702

A-Line Home 5V 1 4 B47 5V


Pos GND 2 5 B46 5G
Sig 3 6 B45 7 MDI-R1 3 C8 2 IC51 18 15 IC22 9 14 IC21 9 3 IC29 4 B3 B3 4 PC1 6 14 IC70 15 2 IC20 18 18 IC2

P/J905 P/J900
A-Line End 5V 1 7 B44 5V
Pos GND 2 8 B43 5G
Sig 3 9 B42 8 MDI-R1 4 A9 17 3 15 1 4 16 19

P/J701 GPCNT 12

B-Line Home 5V 1 1 B39 5V


Pos GND 2 2 B38 5G
Sig 3 3 B37 9 MDI-R1 5 B11 2 IC50 18 15 9 14 IC71 15 2 IC23 18 18 IC3

B-Line End 5V 1 4 B36 5V


Pos GND 2 5 B35 5G
Sig 3 6 B34 10 MDI-R114 C11 17 3 1 1 4 16 19

B-Line Smp K 1 7 B33 5G


Pos A 2 8 B32 5V
B31
P/J713
C 3 9 B30 5V
E 4 10 B29 11 MDI-R115 A12 4 16 2 2 6 14 20

P/J714
B-Line BCR 5V Vcc 11 B28 5V
Read GNDGND 12 B27 12 MDI-R116 4 HC240 16 B12 15 5 3 3 8 12 78
Pos Sig Vo 13 5G -1
P/J2 GPCNT 13
P/J711 P/J913
DO4 PS CONTA RS CONTA
B-Line Rack 5V +V 1 B26 5V
Det Sig OUT 3 B25 5G
GND0V 2 B24 13 MDI-R117 B9 4 IC49 16 2 IC20 9 14 IC19 9 11 IC29 10 B3 B3 4 PC1 6 14 IC70 2 14 IC19 6 20 IC2

GPCNT 12
A23 17 IC52 3 1 IC23 9 13 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 1 4 IC34
B-Line Stat 5V 1 4 B23 5V
Pos GND 2 5 B22 5G
Sig 3 6 B21 6 MDI-R2 2 B23 4 16 2 2 6

B-Line Cup 5V +V 7 B20 5V


Det Sig OUT 8 B19 7 MDI-R2 3 3 HC74 6 6 HC24414 C23 15 5 3 3 8
GND0V 9 B18 -1 -1
5G
P/J712 1 12 HC244 8 B 5 12 IC46 13 7 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 7 19 IC79
-1

C-Line Home 5V 1 1 B17 5V


Pos GND 2 2 B16 5G
Sig 3 3 B15 8 MDI-R2 4 A10 6 IC49 14 4 IC20 9 14 IC19 9 11 IC29 10 B3 B3 4 PC1 6 14 IC70 4 11 IC20 9 79 IC2

C-Line End 5V 1 4 B14 5V


Pos GND 2 5 B13 5G
Sig 3 6 B12 9 MDI-R2 5 B10 13 7 5 5 13 7 80

P/J721 GPCNT 12

C-Line Tray 5V +V 1 B11 5V


Det Sig OUT 2 B10 10 MDI-R114 6 HC240 14 B24 13 IC52 7 5 IC23 9 13 IC29 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 5 13 IC34
GND0V 3 B9 -1
5G

C-Line Tray 5V +V 4 B8 5V
Full (1) Sig OUT 5 B7 11 MDI-R115 8 HC240-112 C24 8 12 6 6 15
GND0V 6 B6 -1
5G

C-Line Tray 5V +V 7 B5 5V
Full (2) Sig OUT 8 B4 12 MDI-R116 11 HC240-1 9 A25 11 9 7 7 17
GND0V 9 B3 -1
5G

C-Line Tray A 10 B2 5V
Change K 11 B1 16 HC244 4 B3 12 IC47 13 1 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 1 5 IC79
-1
P/J722
C-Line Rack 5V +V 1 A3 5V
Full Sig OUT 2 A2 13 MDI-R217 13 HC240 7 A24 6 IC52 14 4 IC23 9 13 IC29 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 4 11 IC34
GND0V 3 A1 -1
5G
P/J723 P/J913 P/J2 P/J905 P/J900
DO4 PS CONTA RS CONTA
Cross Wiring Diagrams for Rack Sampler connected to CLAS 1 System
A-Line YEL 1 A2 24V
SM200 WHT 2 B2
BLK 3 A3 1 IC1 6 10 PC1 8 A 3 2 IC32 1 15 IC8 14 9 IC2 11 6 PC3 4 A3 A3 2 IC53 1 9 IC59 14 9 IC58 15 3 IC21 17 57 IC2
GRN 4 B3 8 17 12 6 B 3 12 13 1 1 5 15 58
RED 5 A4 11 5 14 4 C3 4 3 2 P/J905 P/J900 2 7 13 59
BLU 6 B4 18 16 16 2 A 4 10 11 3 3 9 11 60

P/J700 P/J911 P/J1 GPCNT 12


DO5 PS-CONTA RS CONTA

B2-Line BLK 1 A8 24V


SM210 WHT 2 B8
RED 3 A9 1 IC3 6 10 PC3 8 C 8 2 IC35 1 15 IC10 14 12 IC2 8 7 PC3 1 A5 A5 4 IC53 2 9 IC61 14 9 IC60 15 3 IC24 17 57 IC2
RED/WHT 4 B9 8 17 12 6 A 9 12 13 1 1 5 15 58
GRN 5 A10 11 5 14 4 B9 4 3 2 P/J905 P/J900 2 7 13 59
GRN/WHT 6 B10 18 16 16 2 C 9 10 11 3 3 9 11 60

P/J710 P/J911 P/J1 GPCNT 13


DO5 PS-CONTA RS CONTA

C-Line YEL 1 A5 24V


SM220 WHT 2 B5
BLK 3 A6 1 IC2 6 10 PC2 8 C5 6 IC31 9 15 IC7 14 9 IC8 14 9 IC2 11 6 PC3 4 A3 A3 2 IC53 1 9 IC59 15 12 IC21 8 46 IC2
GRN 4 B6 8 17 12 6 A6 8 5 1 1 14 6 45
P/J905 P/J900 2 16 4 44
3 18 2 43
RED 5 A7 11 5 14 4 B 6 2 IC30 1 2
BLU 6 B7 18 16 16 2 C 6 12 13 3 GPCNT 12

P/J700 P/J911 P/J1


DO5 PS-CONTA RS CONTA
I-Line BLK 1 A11 24V
SM300 WHT 2 B11
RED 3 A12 1 IC10 6 10 PC10 8 A17 6 IC37 5 15 IC11 14 9 IC12 14 5 IC2 15 6 PC4 4 A7 A7 6 IC53 5 9 IC63 15 12 IC27 8 46 IC4
RED/WHT 4 B12 8 17 12 6 B17 8 9 1 1 14 6 45
P/J905 P/J900 2 16 4 44
3 18 2 43
GRN 5 A13 11 5 14 4 C17 2 IC36 1 2
GRN/WHT 6 B13 18 16 16 2 A18 12 13 3 GPCNT 14

P/J760 P/J912 P/J1


DO5 PS-CONTA RS CONTA

Rotate C RED 1 1 A5 24V


(Belt) SM310 BLU 2 2 B5
BLK 3 3 A6 1 IC8 6 10 PC8 8 C25 2 IC44 1 15 IC16 14 3 IC2 17 6 PC5 4 A11 A11 10 IC53 11 9 IC67 14 9 IC66 15 3 IC33 17 57 IC4
BROWN 4 4 B6 8 17 12 6 A26 12 13 1 1 5 15 58
YEL 5 5 A7 11 5 14 4 B26 4 3 2 P/J905 P/J900 2 7 13 59
ORANGE 6 6 B7 18 16 16 2 C26 10 11 3 3 9 11 60

P/J811 P/J810 P/J912 P/J1 GPCNT 12


DO5 PS-CONTA RS CONTA

Rotate C RED 7 A9 24V


(Rotate) SM311 BLU 8 B9
BLK 9 A10 1 IC9 6 10 PC9 8 B28 6 IC43 5 15 IC15 14 9 IC16 14 3 IC2 17 6 PC5 4 A11 A11 10 IC53 11 9 IC67 15 12 IC33 8 46 IC3
BROWN 10 B10 8 17 12 6 C28 8 9 1 1 14 6 45
P/J905 P/J900 2 16 4 44
3 18 2 43
YEL 11 A11 11 5 14 4 A29 2 IC42 1 2
ORANGE 12 B11 18 16 16 2 B29 12 13 3 GPCNT 12

P/J810 P/J912 P/J1


DO5 PS-CONTA RS CONTA
Cross Wiring Diagrams for Rack Sampler connected to CLAS 1 System
A-Line Tray A 1 A4 5V
Change K 2 A5 18 HC244 2 C3 4 IC47 3 2 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 2 6 IC79
-2

A-Line Tray 5V +V 3 A1 5V
Det Sig OUT 4 A2 6 MDI-R1 2 2 HC240 18 C22 2 IC49 18 15 IC20 9 14 IC19 9 11 IC29 10 B7 B7 4 PC2 6 14 IC74 9 14 IC75 15 2 IC34
GND 0V 5 A3 -1
5G
P/J 702

A-Line Home 5V 1 4 A6 5V
Pos GND 2 5 A7 5G
Sig 3 6 A8 7 MDI-R1 3 C8 2 IC51 18 15 IC22 9 14 IC21 9 3 IC29 4 B3 B3 4 PC1 6 14 IC70 15 2 IC20 18 18 IC2

P/J905 P/J900
A-Line End 5V 1 7 A9 5V
Pos GND 2 8 A10 5G
Sig 3 9 A11 8 MDI-R1 4 A9 17 3 15 1 4 16 19

P/J701 GPCNT 12

B2-Line Home 5V 1 1 A12 5V


Pos GND 2 2 A13 5G
Sig 3 3 A14 9 MDI-R1 5 B11 2 IC50 18 15 9 14 IC71 15 2 IC23 18 18 IC3

B2-Line End 5V 1 4 A15 5V


Pos GND 2 5 A16 5G
Sig 3 6 A17 10 MDI-R1 14 C11 17 3 1 1 4 16 19

B2-Line Smple K 1 7 A18 5G


Pos. A 2 8 A19 5V

P/J713
C 3 9 A20 5V
E 4 10 A21 11 MDI-R1 15 A12 4 16 2 2 6 14 20

P/J714
B2-Line BCR 5V Vcc 11 A22 5V
Read GND Vo 12 A23 5G 3 8 12 78
Pos. Sig GND 13 A24 12 MDI-R1 16 4 HC240 16 B12 15 5 3
-1 GPCNT 13
P/J711 P/J913 P/J2

DO5 PS CONTA RS CONTA


B2-Line Rack 5V 1 1 A25 5V
Det1 GND 2 3 A26 5G
Sig 3 2 A27 13 MDI-R1 17 17 HC240 3 B9 4 IC49 16 2 IC20 9 14 IC19 9 11 IC29 10 B3 B3 4 PC1 6 14 IC70 2 14 IC19 6 20 IC2
-2
GPCNT 12
A23 17 IC52 3 1 IC23 9 13 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 1 4 IC34
B2-Line Stat 5V 1 4 A28 5V
Pos GND 2 5 A29 5G
Sig 3 6 A30 6 MDI-R2 2 B23 4 16 2 2 6

B2-Line Cup 5V +V 7 A31 5V


Det Sig OUT 8 A32 7 MDI-R2 3 3 HC74 6 6 HC244 14 C23 15 5 3 3 8
GND 0V 9 A33 5G -1 -1

1 12 HC244 8 B5 12 IC46 13 7 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 7 19 IC79
-1
B2-Line Rack 5V +V 10 A34 5V
Det2 Sig OUT 11 A35 13 MDI-R4 17 6 HC240 14 C20 4 IC53 16 2 IC24 9 14 IC23 9 13 IC29 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 2 6 IC34
GND 0V 12 A36 5G -2

P/J712 C30 11 IC54 9 7 IC25 9 1 IC29 2 B9 B9 1 PC2 7 14 IC76 9 14 IC77 7 17 IC36

C-Line Home 5V 1 1 B1 5V
Pos GND 2 2 B2 5G
Sig 3 3 B3 12 MDI-R2 16 A10 6 IC49 14 4 IC20 9 14 IC19 9 11 IC29 10 B3 B3 4 PC1 6 14 IC70 4 11 IC20 9 79 IC2

C-Line End 5V 1 4 B4 5V
Pos GND 2 5 B5 5G
Sig 3 6 B6 13 MDI-R2 17 B10 13 7 5 5 13 7 80

P/J721 GPCNT 12

C-Line Tray 5V +V 1 B7 5V
Det Sig OUT 2 B8 6 MDI-R3 2 6 HC240 14 B24 13 IC52 7 5 IC23 9 13 IC29 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 5 13 IC34
GND 0V 3 B9 -1
5G

C-Line Tray 5V +V 4 B10 5V


Full (1) Sig OUT 5 B11 7 MDI-R3 3 8 HC240-1 12 C24 8 12 6 6 15
GND 0V 6 B12 -1
5G

C-Line Tray 5V +V 7 B13 5V


Full (2) Sig OUT 8 B14 8 MDI-R3 4 11 HC240-1 9 A25 11 9 7 7 17
GND 0V 9 B15 -1
5G

C-Line Tray A 10 B16 5V


Change K 11 B17 16 HC244 4 B3 12 IC47 13 1 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 1 5 IC79
-2
P/J722 P/J913 P/J2 P/J905 P/J900

DO5 PS CONTA RS CONTA


C-Line Rack 5V +V 1 B18 5V
Full Sig OUT 2 B19 9 MDI-R3 5 13 HC240 7 A24 6 IC52 14 4 IC23 9 13 IC29 12 B7 B7 4 PC2 6 14 IC74 9 14 IC75 4 11 IC34
GND 0V 3 B20 -1
5G
P/J723 P/J913

I-Line Home 5V 1 1 B1 5V
Pos GND 2 2 B2 5G
Sig 3 3 B3 10 MDI-R3 14 C15 6 IC51 14 4 IC22 9 14 IC21 9 3 IC29 4 B5 B5 1 PC1 7 14 IC72 4 11 IC26 9 79 IC4

I-Line End 5V 1 4 B4 5V
Pos GND 2 5 B5 5G
Sig 3 6 B6 11 MDI-R3 15 A16 13 7 5 5 13 7 80

GPCNT 14
I-Line A 7 A13 5V
K 8 A14 14 HC244 5 A3 2 IC47 1 15 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 14 9 IC68 15 2 IC79
-2
P/J801

I-Line Rack 5V +V 7 B7 5V
Det1 Sig OUT 8 B8 12 MDI-R3 16 11 HC240 9 B16 8 IC51 12 6 IC22 9 14 IC21 9 3 IC29 4 B5 B5 1 PC1 7 14 IC72 6 15 IC26 5 27 IC4
GND 0V 9 B9 5G -2
GPCNT 14

I-Line Rack 5V +V 1 B10 5V


Det2 Sig OUT 2 B11 13 MDI-R3 17 13 HC240-1 7 A27 6 IC55 14 4 IC26 9 14 IC25 9 2 IC29 1 B9 B9 1 PC2 7 14 IC76 4 11 IC35
GND 0V 3 B12 5G -2

I-Line Rack 5V +V 4 B13 5V


Det3 Sig OUT 5 B14 15 MDI-R4 2 8 HC240-1 5 B27 8 12 6 5 13
GND 0V 6 B15 5G -2

P/J802 P/J2 P/J905 P/J900


DO5 PS CONTA RS CONTA
Rotate Rack 5V +V 1 A1 5V
Det (1) Sig OUT 2 A2 12 MDI-R3 16 4 HC240 16 A20 2 IC53 18 15 IC24 9 14 IC23 9 12 IC29 13 B7 B7 4 PC2 6 14 IC74 15 2 IC32 18 18 IC34
GND 0V 3 A3 -2
5G

Rotate Rack 5V +V 4 A4 5V
Det (2) Sig OUT 5 A5 11 MDI-R3 15 2 HC240 18 B20 17 3 1 1 4 16 19
GND 0V 6 A6 -2
5G

Rotate Home 5V 1 7 A7 5V
Pos GND 2 8 A8 5G
Sig 3 9 A9 13 MDI-R3 17 B21 6 14 4 4 11 9 79

Rotate End 5V 1 10 A10 5V


Pos GND 2 11 A11 5G
Sig 3 12 A12 6 MDI-R4 2 C21 13 7 5 5 13 7 80

P/J812 P/J915

Loop op PC1 5 A3 A3 5V
4 B3 B3 C5 6 IC46 5 15 IC17 14 9 IC18 14 18 IC2 2 7 PC5 1 A13 A13 12 IC53 13 9 IC69 15 2 IC80

1 A4 A4 5V
2 B4 B4 A6 8 9 1 1 5

P/J930 P/J919 P/J2 P/J905 P/J900


DO5 PS CONTA RS CONTA
RD/Hitachi Elecsys 2010 Service Manual

5.6 How to Check Photo Interrupters


5.6.1 Photo Interrupters
The following Photo Interrupters (hereafter referred to as PCPs or PCP) are mounted in 2010. See sketch in Fig. 5.6.1-1.

No. PCP Name Appearance Position in 2010


1. GP1A34LC PCP with a connector •All the other positions described in the rows below
2. P1144-03 Smallish PCP with a circuit board •Home position for syringes
3. P2140 Largish PCP with a circuit board •Solid waste container present/absent detection
4. TLP830 Small PCP •On FPC for pipetter/gripper home (HP), end (EP) and
rest(RP) position for gripper Y movement
5. TWIN-DETECT PCP attached to a plastic base •On buffer station for tip present/absent detection
PLI-523
6. PM2-LF10 Reflection PCP Rack tray and rack detection for A line, B line, C line and
(for R/S,R/C unit) I line units
7. PH-D and PH-T boards Through PCP •Sampling position for B line unit
(for R/S,R/C unit)

V 1.6 – April 1999 1 Chapter 5.6.1


RD/Hitachi Elecsys 2010 Service Manual

PCP Name Wiring Diagram

GP1A34LC

P1144-03/P2140

TLP830

PLI-523

Fig. 5.6.1-1

Chapter 5.6.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

5.6.2 How to check the PCPs


Voltage and current at the PCP terminals are to be checked according to the following instructions.

No. PCP Name How to check the voltage and the current Light path Voltage
1. GP1A34LC l Check the voltage at Pin#3(Sig.) against Pin#2(GND). Close: ca. 5 V
l Your voltage multimeter should show the right voltage Reflection is interrupted
Open: ca. 0 V
Reflection is uninterrupted
2. P1144-03 l Check the voltage at Pin#1(Sig.) against Pin#3(R.GND). Close: ca. 0 V
l Your voltage multimeter should show the right voltage Light path is interrupted
if the PCP is functioning properly. Open: ca. 5 V
Be careful not to short-circuit Pin#2(5V) and Pin#3(R.GND). This Light shines across the gap
PCP breaks readily in the event of a short circuit.
3. P2140 l Same as P1144-03. The only difference is the gap width. Close: ca. 0 V
Light path is interrupted
Be careful not to short-circuit Pin#2(5V) and Pin#3(R.GND). This Open: ca. 5 V
PCP breaks readily in the event of a short circuit. Light shines across the gap
4. TLP830 l Check the voltage at Pin#4(Sig.) against Pin#2(R.GND). Close: ca. 0 V
l Your voltage multimeter should show the right voltage if the Light path is interrupted
PCP is functioning properly.
l Find a short-circuit on FPC when you try to find the Pin location. Open: ca. 5 V
l Short-circuited on FPC are Pin#1(R.GND) and Pin#3(5V). Light shines across the gap
l Check the voltage at the other two (2) Pins against Pin#1 or
Pin#3 (5V) to find other Pin location.
Be careful not to short-circuit Pin#1 or #3(5V) and Pin#2
(R.GND). This PCP breaks readily in the event of a short circuit.
5. PLI-523 l Check the voltage at Pin#5(Sig.1) against Pin#2 or #3(R.GND) Close: Light path is interrupted ca. 0 V
with and without a tip in Tip Pos. 1. by a tip
l Check the voltage at Pin#6(Sig.2) against Pin#2 or #3(R.GND) Open: Light shines across the ca. 5 V
with and without a tip in Tip Pos. 2. gap
l Your voltage multimeter should show the right voltage if the PCP without a tip
is functioning properly.

V 1.6 – April 1999 3 Chapter 5.6.2


RD/Hitachi Elecsys 2010 Service Manual

No. PCP How to check the voltage and the current Light path Voltage
Name
6. PM2- l Check the voltage at Pin#2(Sig.) against Pin#3(GND). Close: ca. 0 V
LF10 l Your voltage multimeter should show the right voltage if the PCP is Light path is interrupted
functioning properly.
Open: ca. 5 V
Light shines across the gap
7. PH-T l Check the voltage at Pin#3(Sig) against Pin#1(5V). Close: ca. 0 V
board l Your voltage multimeter should show the right voltage if the PCP is Light path is interrupted
functioning properly.
(PH-D Be careful not to short-circuit Pin#1(5V) and Pin#3(Sig). Open: ca. 5 V
board) This PCP breaks readily in the event of a short circuit. Light shines across the gap

Chapter 5.6.2 4 V 1.6 – April 1999


6. Service Software

6.1 Overview
6.1.1 Message History
6.1.2 Interface Setup
6.1.3 Instrument Setup
6.1.4 Initial BlankCell
6.1.5 Operation Mode Setup
6.1.6 Maintenance
6.1.7 Temperature Monitor
6.1.8 Voltage Monitor
6.1.9 Assay Performance Check
6.1.9.1 Running Test
6.1.9.2 PMT High Volt. Adjustment
6.1.9.3 Artificial Media Test
6.1.9.4 TSH Assay
6.1.9.5 MC CO Check
6.1.9.6 LH Check
6.1.9.7 Programmable Test
6.1.9.8 Print Result
6.1.9.9 Restore Parameter
6.1.9.10 Troubleshooting of Assay Performance Check
6.1.10 Mechanism Check
6.1.11 Automatic Adjustment
6.1.11.1 Overview
6.1.11.2 Function of the Automatic Adjustment
6.1.11.3 How to Operate Automatic Adjustment
6.1.11.4 Adjustment Procedure
6.1.11.5 Display of the Adjustment Values and the Displayed Colors
6.1.12 Service
6.1.12.1 Manual Adjustment
6.1.12.2 Adjustment Rack
6.1.12.3 BCR Setup
6.1.12.4 Service Setup
6.1.12.5 Service Maintenance
6.1.12.6 Service FD Utility
6.1.12.7 Monitoring Sensors
RD/Hitachi Elecsys 2010 Service Manual

6. Service Software
6.1 Overview
The service software is part of the system software that which provides you with tools with which you can
carry out programs for the instrument and measuring cell maintenance, check and adjust mechanical units,
monitor temperature, unit temperature and LLD voltage, etc. All functions with which service engineers
should be acquainted are described in the following chapter. The screen structure (where to find what) can be
seen on the following page. Screens that are not described in Chapter 6 are discussed in detail in the Software
Guide of the Operator’s Manual.

Fig 6.1-1 Util Screen: Rack System

Fig 6.1-2 Util Screen: Disk System

V 1.6 – April 1999 1 Chapter 6.1


RD/Hitachi Elecsys 2010 Service Manual

Orders Results QC Status (OHFV\V6HUYLFH6RIWZDUH2YHUYLHZIRUDQG)LQDO 9HUVLRQV DYDLODEOHLQ


Util

Control Calibration Test Message Interface Instrument Configuration Documentat. Initial Keep Func. Retry Func.
Definition Data Conditions History Setup Setup Printout Setup BlankCell Setup Setup

Temperat. Assay Mechanism


Voltage Automatic
Maintenance performance check
Display Monitor adjustment
check

F/D Reagent Cap Preparation/ Adjustment Adjustment Reagent


S/R Probe Restore BCR Service Adjustment Monitoring Adjustment
write Open/Close Adjustment Sipper S.Disk S/R Probe Disk
LLD Parameter Setup Setup Rack * Sensors* Gripper
Mech. C.Open BCR R.Disk B. Mix R1
Monitoring Print Micropart. Gripper Total Reagent Reagent
FDD A Line A Line Gripper X/Y Cap Opener
Stop Result Mixing All Positions Initialize Test Counter LoadingPos.* Tray* Disk Disk
Cleaning Tip Front F/B Cap
Reset Pos. 1 Microparticle
Liquid Flow Sipper Programm. Magnet Cell A Line Reagent Mixer-
Tray B Line Gripper X/Y Cap Opener Disk
LLD Test ** UP/DOWN Ceck Digit Test Counter Home* Horizontal
Cleaning Sampl. Pos.* Tip Back U/D Home
Reset Mixing Reag. Mix
Pressure MC CO Waste Tray Inc./ Rack ID Effective B Line A Line Gripper X/Y Cap Opener Mixer Mixer
Rack Clear* check Shaking Aspiration Stn Signal Unloading* Loading End Cup Left U/D Cap Horizontal Up/Down
Sensor Setup * Rinse
L and A LH Sample BC Pipetting B Line B Line Gripper X/Y BCR S/R Probe-x S/RProbe-x
All Reset * check Scanning Station B.C.R. Auto* Home* Sipping R. Disk P. Stn. 1 wash

Finalization TSH Bar Code B line B Line Gripper X/Y Sipper-x S/R Probe-x S/RProbe-x
Assay Test Gripper-z
Maintenance Card Read B.C.R. man. Loading End* Incubator CC2 Micropartical R1
Reagt. PackGripper S/R Probe-x
S/R Pip. Artificial Adjust Data Sampler B Line Gripper X/Y Sipper-x S/RProbe-x
Prime media test BC Scan Check* Rack* S. Disk /
FD write P. Stn. Tip 1 Wash R2
Rack Sampl.*
PMT High V. Gripper Gripper Service
Sipper Pip. Adjust Data Service B Line Gripper X/Y Sipper-x S/R Probe-x S/R Probe-z
Prime Adjustment Quick Check Printout Maintenance F/D Utility Stat* P. Stn. Cup Sipping P. Stn. P. Stn.
Disinfection Running Gripper System System Pipetter B Line Gripper Z Sipper-z S/R Probe-z S/R Probe-z
Test Repetition Volume Specific Abnormal Sampling* Sipping Incubator P. Stn Bottom Beads Bottom
Check Check Data Read Decent
Rgt. Pipetting B Line Gripper Z Sipper-z S/R Probe-z Cap
Cleaning FD write Tip
cycle B.C.R* P. Stn. Cup Incubator S. Cup Open/Close
Buffer 1
Bottom Bottom Cap
S/R Probe/
M. Cell Read Tip B Line Gripper Sipper-z Microparticles S/R Probe
Gripper
Exchange Ref. Data Buffer 2 Cup* Quick Check AB1 Bottom Mixing
Check
M. Cell Gripper C Line Gripper S/R Probe /
Sipper Read Sipper-z
Preperation Finger Home* Repetion Gripper
Adj. Data CC2 Bottom Check
Check
System S/R Probe Distilled C Line S/R Probe / Rack Pack
Rack Adjust
Loading End* Gripper
Reset LLD water Open/Close
Data Read * lower limit Check Cap
Liquid waste C Line Gripper Rack Pack
Sampler
Check *
container Rack Full* Adjust Data BC Scanning
level FD write
C Line C Line Gripper S/R Probe /
Tray Full 2* Tray* Adjust Data Gripper
Printout Check
Sensor Test C Line
Start* Tray Full 1*
New feature in final version * Rack System only
**No function implemented SWSC51.cdr

V 1.6 – April 1999 2 Chapter 6.1


RD/Hitachi Elecsys 2010 Service Manual

6.1.1 Message History


Message History prints out the Alarm History.
l Touch the Print Message History button in Message History screen as shown in Fig. 6.1.1-1.
l After touching the button in the screen, a pop-up window appears as shown in Fig. 6.1.1-2.
l Enter the number of lines to be printed (max. 200).
l Touch the Printout button.
Note: The last 200 instrument alarm messages are stored (FIFO principle). The latest alarm is printed first. Identical
alarms only have to be printed out once.
Operator-Id: 47 Stand-by 07:40
Message History Admin
Util

Print
Message
History

Fig. 6.1.1-1 Message History screen

Operator-Id: 47 Stand-by 07:40


Message History Admin
Util

Print Message History

Print
Message up to line :
History

Printout Close

Fig. 6.1.1-2 Pop-up window

V 1.6 – April 1999 1 Chapter 6.1.1


RD/Hitachi Elecsys 2010 Service Manual

6.1.2 Interface Setup


The Interface Setup screen allows you to check and set up the interface parameters (see Fig. 6.1.2-1).

Fig. 6.1.2-1 Interface Setup Screen

Screen buttons
All buttons for selecting specific parameters act as a toggle switch. The default setting for communication is OFF.
You can only make changes to this screen when the analyzer is in Stand-by and communication is OFF.

Communication
Touching this button accesses the Interface Setup “Confirmation” pop-up window. This window lets you turn
communication ON or OFF.

Baud Rate
Continue to touch this button until the desired baud rate is reached. The baud rate choices are: 2400, 4800, 9600 and
19200. You can select the baud rate only when communication is OFF.

Data Bits
The data bit choices are 7 and 8. You can change the number of data bits only when communication is OFF.

Stop Bits
The stop bit choices are 1 and 2. You can change the number of stop bits only when communication is OFF.

Parity
The parity choices are None, Odd and Even. You can change the parity only when communication is OFF.

Sync
The synchronization method choices are On and Off. You can change the synchronization method only when
communication is OFF.

V 1.6 – April 1999 1 Chapter 6.1.2


RD/Hitachi Elecsys 2010 Service Manual

6.1.3 Instrument Setup


The Instrument Setup screen allows you to check the analyzer information, including the software version, and set
the current date and time (see Fig. 6.1.3-1).

Fig. 6.1.3-1 Instrument Setup Screen

Data Fields
These fields have no user access; they are for display only.

Serial no.
The serial number of the analyzer.

Install date
The software installation date.

Software version
The version of software currently loaded in the system.

Actual time
The current time.

Actual date
The current date. Note: If no date or the wrong date is entered after instrument installation, application
problems are likely to occur.

Total test counter


The total cumulative number of tests that have been performed on the analyzer. There is no user access to this field.
This number is not reset by reloading software.

Cell exchange counter


This field tracks the number of assays performed on the measuring cell currently on the analyzer. This number must
be reset to “0” if a new measuring cell is installed.

Screen buttons

Setup Date/Time
Touch this button to access the “Setup Date/Time” pop-up window.

V 1.6 – April 1999 1 Chapter 6.1.3


RD/Hitachi Elecsys 2010 Service Manual

6.1.4 Initial Blank Cell

Introduction
After the measuring cell has been prepared and it has been checked that the signal level is in the expected
signal range by means of the high voltage adjustment, the initial BlankCell calibration has to be
performed. The instruments are calibrated to give the same homogeneous signal level.
The initial BlankCell measurement is the first calibration done on the instrument before other assays can
be calibrated. Each measured signal will first be BlankCell-corrected (parameters a (intercept) and b
(slope)). The corresponding concentration is then read from the specific assay calibration. For further
details refer to Chapter 2.12.3.

Reagent
1. Start Reagent Scan (Inventory Screen ) Scan

2. After the scan the BLANK CELL button in the inventory screen should be yellow (unless a
BLANK CELL has been performed within the last 17 h ), so BLANK CELL is requested by
the instrument.
Blank Cell

xxx 18

Note: If there is no request for Blank Cell after scan (button still green), you can set this request manually
in the software. Select the Blank Cell button in the Inventory screen. Change the setting of the button
Calibration Request to ON in this popup. (Change only possible when instrument is in Stand By.)

Blank Cell pop up Calib.Request

xxx 18 ON

3. Set Initial Blank Cell button to ON (Util screen).


The INITIAL ON button should be blue when active.

Initial Initial
pop up
Blank
Cell ON

4. Press the Start button.

5. After the Blank Cell procedure has finished, check the printout of the results carefully. The
quality criteria should look the same as in the specimen printout.

See attached printout of successful Initial Blank Cell (specimen).

V 1.6 – April 1999 1 Chapter 6.1.4


RD/Hitachi Elecsys 2010 Service Manual

BlankCell Procedure Operator ID 30/10/96 17:21


BlankCell was generated

BlankCell procedure date 30/10/96


Reagent pack number : 142
Lot. no. : 189856
Exp. date 03/97
Next BlankCell procedure : 10/30/96

Quality Criteria
Missing values ------
Deviation of replicate measurements ok
Achievement of targets ok
Comparison to last valid BlankCell

Last valid BlankCell Current BlankCell


Lot : 0 Lot : 189856
Mean 0 276
Target 0 268
Lower 0 110
Upper 0 426
Repl. limit 0% 20%

Mean 0 101425
Target 0 110000
Lower 0 63300
Upper 0 157000
Repl. limit 0% 10%

6. It is very important that the Initial Blank Cell is successful. If not, repeat the process until it is
successful, otherwise all results may not be corrected properly. Refer to Chapter 2.3.12.3 for
current result targets. (If necessary start procedure once more. Go back to point 3.)

7. If the Initial Blank Cell was successful, remove the BLANK CELL RackPack. This is very
important, otherwise the instrument will do the periodic blank cell automatically.

8. Start reagent scan. Reagent

Scan

Chapter 6.1.4 2 V 1.6 – April 1999


Evaluation of Initial BlankCell
• Compare the mean value of the BCR1 (all values are on the printout) counts with the target. It should be:
BCR1 Target range 200 to 400 counts.

• Check the slope value from [Initial BlankCell] screen:


BCR2 Slope should be 1.0 ± 0.05 (= parameter (b)).

• If one of the targets is outside these limits refer to the recommendations given and repeat the procedure until the
targets are reached.

Further Explanation of the Results Printed Out

1. Headline messages and interpretations


two messages are possible:

BlankSet calibration was generated.


This message means that the procedure was successful; all quality criteria were met.
No need for further action.

BlankSet calibration can’t be generated.


This means that the procedure failed; one or more of the quality criteria failed.
The detailed quality messages and the data groups below have to be studied to determine the cause.

2. Quality messages and interpretations

Three messages are possible, each depending on the results of the quality checks with status ok / not ok.
In case of Õok no further action is needed.
In case of any Õnot ok the following interpretations are possible:

Missing values
This field displays six dashes representing the six single measurements of the procedure.
In case of problems the data are not complete. The instrument was not able to perform the six
measurements. If a number appears instead of a dash, there was a problem with this measurement, and
this may indicate a mechanical problem.
Problems with missing values cause further messages as achievement of targets and deviations of
replicates Õnot ok.

V 1.6 – April 1999 3 Chapter 6.1.4


RD/Hitachi Elecsys 2010 Service Manual

Deviation of replicate measurements


This field reads Õok if the replicate measurements are within the replicate limits listed in the columns
below. Õ In case of any Õnot ok a new BlankSet request has to be set and a new initial BlankSet
has to be performed :

Achievement of targets
This field reads Õ ok if all values of the replicate measurements are within the corresponding ranges
Lower and Upper around the targets.
If the field reads Õ not ok, it indicates abnormal signal levels.
It is possible that only one single measurement has failed. In this case the means seem to be Õok but the
achievement of targets and probably the deviation of replicates are Õnot ok.

Comparison to last valid BlankSet

This quality message was only designed for user´s periodical BlankSet.
Therefore, it is ignored in case of the Initial BlankSet.

3. Data groups and interpretations

mean The median (not mean) of the replicate measurements. The value is given in PMT counts.

target The target value in PMT counts. The value is encoded on the BlankSet reagent barcode.

lower The lower acceptable limit in PMT counts.


The limit was formerly designed as the limit for a working range for the user’s periodical
BlankSet.
For initial BlankSet it detects only extreme problems (< 200 counts for BCR1 / - 7% for
BCR2).
A better criterion for signal levels are parameters a and b in the screen (-79 for a, 0.93 for
b).

upper The upper acceptable limit in PMT counts.


The limit was formerly designed as the limit for a working range for the user’s periodical
BlankSet.
For initial BlankSet it detects only extreme problems (> 400 counts for BCR1 / + 7% for
BCR2).
A better criterion for signal levels are parameters a and b in the screen (79 for a, 1.07 for b).

replicate The maximum acceptable deviation of replicates to their median in percent.


limit

Upper group shows data for measurements with BlankSet Reagent BCR1.
Lower group shows data for measurements with BlankSet Reagent BCR2.

Left column shows data for BlankSet measurements of last valid BlankSet procedure.
This column was only designed for the user’s periodical BlankSet.
Right column shows data for actual BlankSet measurements.

Chapter 6.1.4 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.5 Keep Function Setup

The Keep Function Setup screen allows you to choose different “Keep” functions – the sample type, the default sample type
and the test selection.

Stand-by Operator-Id: 47 07:40


Keep Function Setup QC Status Admin
Util

Keep Sample Type : On Off

Default Sample Type : Normal

Keep Test Selection : On Off

Fig. 6.1.5-1 Keep function Setup screen

l Touch the Keep Function Setup button in the Util screen.

l Select the Keep Sample Type by touching the On or Off button in the screen.

l Select the Default Sample Type (Normal or Reduce) by touching the button.

l Select the Keep Test Selection (On or Off) by touching the button.

V 1.6 – April 1999 1 Chapter 6.1.5


RD/Hitachi Elecsys 2010 Service Manual

6.1.6 Maintenance

Fig. 6.1.6-1 Maintenance screen for Rack System

Fig. 6.1.6-2 Maintenance screen for Disk System

To start a maintenance function, touch the respective button.

V 1.6 – April 1999 1 Chapter 6.1.6


RD/Hitachi Elecsys 2010 Service Manual

The general functions of each button and the input area are as follows.

Start button : To start the maintenance function corresponding to the button


Close button : To close the pop-up window and return to the Maintenance screen without carrying out any
maintenance functions
Input area : To define how many times the maintenance function is to be carried out

There is no Stop button in the pop-up window. Instead, the Stop key can be used to stop the maintenance
function.
The following table shows a summary of the maintenance functions.

Table 6.1.6-1 Summary of the maintenance functions


No. Name Function
1. System Reset Resetting all the mechanical units and priming the pipetter
system
2. Measuring Cell Preparation Conditioning the measuring cell
3. Measuring Cell Exchange Priming the sipper system three times and draining the
measuring cell.
4. Cleaning Decontaminating the tubing system except for that between
the sipper probe and SV3
5. Disinfection Disinfecting the tubing system
6. Sipper Pipettor Prime Priming the sipper system with system water
7. S/R Pipetter Prime Priming the pipetter system with system water
8. Liquid Flow Cleaning A function that decontaminates the liquid flow system
9. L&A All Reset* Resetting all the mechanical units including Rack
Sampler
10. Rack Clear* Carrying all racks in the line to the output area (C line)
11. Finalization Maintenance A function that carries out the finalization cycle
12. FDD Cleaning FDD cleaning performed.
13. F/D Write Back up of database to FD performed.

*Note: these maintenance functions are only available for rack and CLAS 1 systems

Chapter 6.1.6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Initial conditions for the maintenance functions


When you start each maintenance function, make sure that the instrument is put in the condition
corresponding to the function described in Table 6.1.6-2.

Table 6.1.6-2 Initial conditions for the maintenance functions


No. Function Name Initial Condition
1 System Reset 1)Water container contains at least 1L system water.
The water consumption is about 20 ml per cycle.
2 Measuring Cell Preparation 1)Water container contains at least 1L system water.
The water consumption is
150ml + n × 5 ml.
2)Mount AB and CC bottles in system reagent
position 2. The consumption of each system reagents
is n × 2ml.
3 Measuring Cell Exchange 1)Water container contains at least 1L system water. The
water consumption is about 15 ml per cycle.
4 Cleaning Fill water container with cleaning solution.
5 Disinfection 1)Water container contains at least 1L system water. The
water consumption is about 11 ml per cycle.
6 Sipper Prime 1)Water container contains at least 1L system water. The
water consumption is about 5 ml per cycle.
7 Pipetter Prime 1)Water container contains at least 1L system water. The
water consumption is about 6 ml per cycle.
8 Liquid Flow Cleaning See Chapter 6.1.6, Section 8
9 L&A All Reset 1)Water container contains at least 1L system water.
The water consumption is about 20 ml per cycle.
10 Rack Clear 1)Water container contains at least 1L system water.
The water consumption is about 20 ml per cycle
11 Finalization maintenance See Chapter 6.1.6, Section 11
12 FDD Cleaning Insert cleaning FD in the FDD.
13 F/D Write Insert FD in the FDD to back up instrument database.

Detailed Description of Each Maintenance Function


1) System Reset
System Reset is a maintenance function that resets all the mechanical units and primes the pipetter system.
This function is to be carried out when an operation is aborted due to an error and takes all the mechanical
units to their original positions. The reset function in the Service software is identical to the reset that is
carried out at the beginning of each run. Only Start and Close are available in the System Reset pop-up
window. About 20 ml water are needed each time System Reset is carried out.

V 1.6 – April 1999 3 Chapter 6.1.6


RD/Hitachi Elecsys 2010 Service Manual

2) Measuring Cell Preparation


Measuring Cell Preparation is a maintenance function that carries out preparation cycles in order to
condition a newly mounted measuring cell or measuring cells which have undergone maintenance (refer to
Installation and Maintenance). In addition, this function can be used just to initialize the sipper system,
especially just after the sipper prime to fill the MC with assay buffer. In addition to Start and Close buttons
in the pop-up window, the iteration number of the preparation cycles can be set in the input area. The
maximum iteration number is 100. Place ProCell and CleanCell bottles in system reagent position 1 when
you start this function. The consumption of water and system reagents to carry out Measuring Cell
Preparation are as follows:
Water : 150ml + iteration number × 5 ml
System reagents : iteration number × 2 ml

The following functions are to be carried out sequentially when Measuring Cell Preparation is started.
1. Reset
2. Priming the sipper system between the sipper syringe and the waste via SV4 (ca. 20 s)
3. Checking the system reagent inventory
4. Preparation 1 cycle (once without potential application)
5. Preparation 2 cycles according to the iteration number with the potential application
6. Preparation 3 cycle (once with the potential application)
7. Sipper finalization
When Measuring Cell Preparation is completed the sipper system is set in the usual condition in which the
system is set when a run is completed in the normal manner.

3) Measuring Cell Exchange


Measuring Cell Exchange is a maintenance function that primes the sipper system three times and drains the
measuring cell. This function is to be carried out before you replace or take out the measuring cell mounted
in the detection unit. Only Start and Close buttons are available in the pop-up window. About 15 ml water
are needed to carry out the Measuring Cell Exchange function once.

4) Cleaning
Cleaning is a maintenance function that decontaminates the tubing system apart from that between the sipper
probe and SV3.
Only Start and Close buttons are available in the pop-up window.
The following functions are be carried out sequentially when cleaning is started.
1. Cleaning 1 : Priming the sipper, pipetter, pipetter washing station, bead mixer washing station and
sipper washing station sequentially with the solution in the system water container for one minute
followed by circulation of the solution in the pump system for 5 minutes
2. Cleaning 2: Priming the sipper, pipetter, pipetter washing station, bead mixer washing station and
sipper washing station sequentially with the solution in the system water container for four minutes,
four minutes, 30 seconds, one minute and 30 seconds, respectively.

Chapter 6.1.6 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3. Cleaning 2 is repeated a further 3 times.

About 50 min and 2.8 L water are needed to carry out the Cleaning function once. There are some instruments
that generate the alarm "Distilled Water: 25-01-01" during Cleaning and the status shifts to Stand-by. However,
there is no problem in performing the Cleaning function if enough water (around 2.8 L) has run.

Note: This is not a part of the routine maintenance for the Elecsys 2010. This procedure should only be
used if contamination has occurred. This function is to be carried out if there are frequent high
water conductivity errors.

Required materials
- 30 % Perhydrol-Solution; Fa. Merck Cat. No.: 1.07209.1000

Procedure

1. Remove the system water container. Fill with 3% Perhydrol solution and empty the liquid waste
container.
(Put about 100 ml 30 % Perhydrol solution in the tank, and fill up with purified water to the 3 L
mark. (3.5 L volume). Mix carefully.
Replace the system water container.

2. Touch the Maintenance button on the screen.

3. Touch the Cleaning button on the screen.

4. Start.
The procedure takes 50 min and consumes about 2.8 L.
When cleaning is finished the status changes to Stand-by. Allow the solution to react for 20 min.

5. Empty the liquid waste container.

6. Clean the system water container and refill with system water. Replace the container on the system.

7. Touch the Cleaning button again. Rinsing with system water starts (50 min).

8. Repeat points 5 to 7 twice to guarantee that the whole system is filled with system water.

9. After finishing, the top of the screen changes to Stand-by. Please empty the liquid waste container
and refill the system water container with system water.
The system is now ready for the normal routine.

Having completed Cleaning, confirm that the pipetter LLD voltage is 1.5 V or lower. Otherwise, repeat
the pipetter priming 50 times until the voltage is reduced to 1.5 V.

V 1.6 – April 1999 5 Chapter 6.1.6


RD/Hitachi Elecsys 2010 Service Manual

5) Disinfection
Note: RD does not provide a special solution for disinfection. Use the Cleaning and LFC functions for this
purpose. This function is not a function to be carried out regularly. For instance, it should only be performed
when the instrument is packed for transportation.

Only Start and Close buttons are available in the pop-up window. The disinfection cycle is composed of priming
the pipetter system and sipper system, and air introduction to the sipper system up to around SV3.
About 11 ml water are needed to carry out the Disinfection function once.

6) Sipper Prime
Sipper Prime is a maintenance function that primes the sipper system with system water. This function is to
be carried out when the tubing in the sipper system is drained due for reason such as replacing the tubing.
However, this function should not be carried out unless it is followed by measuring cell preparation. This is
because the measuring cell is filled with water after the Sipper Prime, and this might cause the luminescence
signal to drift at the beginning of the following run. In addition to Start and Close buttons in the pop-up
window, the iteration number can be set in the input area. The maximum iteration number is 100. It takes
ca. 10 s to carry out the Sipper Prime function once, and the process consumes ca. 5 ml water.

7) Pipetter Prime
Pipetter Prime is a maintenance function that primes the pipetter system with system water. This function is
to be carried out when the tubing in the pipetter system is drained for some reason such as replacing the
tubing, although the Pipetter Prime is always carried out when the system is reset or a run is started. In
addition to Start and Close buttons in the pop-up, the iteration number can be set in the input area. The
maximum iteration number is 100. It takes ca. 11 s to carry out the Pipetter Prime function once, and the
process consumes ca. 6 ml water.

8) Liquid Flow Cleaning

Contamination in the sipper system could potentially degrade sample accuracy and precision, or possibly
block the measuring cell flowpath. Liquid flow cleaning keeps the sipper liquid flowpath clean and maintains
the integrity of the measuring cell.

The customer should perform LFC on a frequent basis. Please train all your customers according to the
procedure described below and inform them about the importance of keeping the liquid flow path clean and
the measuring cell at the best performance level.

If operators perform this procedure frequently it will lead to fewer customer complaints.

Chapter 6.1.6 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Required materials: SysClean adapter Ident. No.: 1933159.910


ISE Cleaning Solution Ident. No.: 1298500

Software version: (03)-(08)

Recommended frequency*: Every two weeks or after 2500 - 3000 cycles

*If customer maintenance has been done as recommended, it is only necessary to carry out an additional customer cleaning at
the PM visit. The service LFC is only necessary during PM if the sipper line is highly contaminated or if LFC has not been
carried out regularly by the customer.

Operator time: Approx. 3 minutes

Analyzer time: User LFC: Approx. 16 minutes (user)

Service LFC: Approx. 32 min + time for MC prepare cycles

Precautions: The cleaning solution is corrosive. Wear protective gloves and


glasses when handling this solution.

Procedure

1. User Replace the PC bottle in position 3 by the SysClean adapter (keep the CC
bottle in position).

Insert the adapter with the marking "USER" in direction towards the back of
the instrument. Fill the ISE cleaning solution to the edge of the fill mark on
the adapter (approx. 9 ml). PC/CC bottle has to be placed at the left side.

2. Service Same procedure as for customers but using the Service position of the
adapter.

3. User / Touch the Liquid Flow Cleaning button on the screen (Screen: Util /
Service Maintenance).

V 1.6 – April 1999 7 Chapter 6.1.6


RD/Hitachi Elecsys 2010 Service Manual

4. User The number of LFCs should be 1 for User maintenance.

5. Service
The number of LFCs should be 3 for service.

Take out the SysClean adapter and place ProCell and CleanCell bottles in all
positions.

Perform Measuring Cell Preparation cycles. [Press ”MC Preparation” in


Maintenance screen; select number of cycles]

• Start the LFC procedure shortly after filling up the ISE solution.

• After the instrument returns to Stand by remove the SysClean adapter and discard the remaining ISE
solution.

• To avoid an unpleasant odor, please empty the waste container at the end of the liquid flow cleaning
procedure.

• After a Service LFC has been performed customers should check all controls and carry out a calibration if
necessary. This is not necessary for normal routine with customer LFC.

When Liquid Flow Cleaning is completed the Liquid Flow system is set in the usual condition in which the
system is set when a run is completed in the normal manner. The function takes about quarter of an hour.

9) L&A All Reset*


*This function is available only for Rack Sampler and Rack Sampler connected to CLAS 1 System.
L&A All Reset is a maintenance function that carries racks whose barcode has already been read to the
unloader, resets all the mechanical units and primes the pipetter system.
This function is to be carried out when an operation is aborted due to an error to take all the mechanical
units in the original position and the operation should be restarted from the condition before the error
occurred. The reset function in the Service software is identical to the reset which is carried out at the
beginning of each run. Only Start and Close are available in the reset pop-up window.
About 20 ml water are needed to carry out the Reset function once.

10) Rack Clear*


*This function is available only for Rack Sampler and Rack Sampler connected to CLAS 1 System.
Rack Clear is a maintenance function that carries all racks in the line to the output line (C line).
Only Start and Close are available in the reset pop-up window.

Chapter 6.1.6 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

11) Finalization Maintenance


The Finalization Maintenance pop-up window initiates the daily maintenance procedure of finalization
maintenance. Finalization is the analyzer status that occurs between the time when the analyzer stops pipetting
samples (S. Stop or R. Stop) and Stand-by. Finalization allows the analyzer to stand unused for several hours
(e.g. overnight). The system is primed with water, the measuring cell is filled with ProCell and the sipper probe
is cleaned with water.
The function takes about three (3) minutes.

12) FDD Cleaning


The FDD Cleaning pop-up window is used to clean the floppy disk drive. This maintenance procedure is to
be performed every month. A special cleaning disk must be placed in the drive when this procedure is
carried out.
Refer to Maintenance, Chapter 10.

13) FD Write
The FD Write pop-up window is used to write data files that are currently in the analyzer memory onto a
PC-formatted data disk (database back up). We recommend that the database back up function is carried out
once monthly as part of the customer maintenance.

V 1.6 – April 1999 9 Chapter 6.1.6


RD/Hitachi Elecsys 2010 Service Manual

6.1.7 Temperature Monitor


You can see the temperatures of the control points (Tn), the ambient temperatures (Tamb), the
target temperatures (Ttrg) and the output voltages (Vout) in the Temperature Monitor screen.

Fig. 6.1.7-1 Temperature monitor screen

For details refer to Chapter 5.3.1 and 5.3.6:


• Principle of temperature control
• Troubleshooting of temperature units

V 1.6 – April 1999 1 Chapter 6.1.7


RD/Hitachi Elecsys 2010 Service Manual

6.1.8 Voltage monitor


Check the output voltages of the Pipetter LLD sensor, the Pressure sensor and the Sipper LLD sensor on the
Voltage Monitor Screen when the instrument is in Stand-by status according to the following steps.

1. Touch the Voltage Monitor button in the Util screen.


2. Touch the Voltage Button in which you want to see the voltage. If the instrument is not in Stand-by
status there will be no response.
3. If you want to see another voltage, touch the Monitoring Stop button followed by the Voltage button.
If you do not touch the Monitoring Stop button, touching other buttons is not possible.
4. If you want to switch to another screen, touch the Monitoring Stop button and the Util tab.

Fig. 6.1.8-1 Voltage monitor screen

The following table shows the tolerance limits for each voltage and the Head Line Monitor.
Table 6.1.8-1*
Description Tolerance Limit Head Line Monitor
Pipetter LLD sensor 1.5 V or less when no Tip attached Pipetter LLD
to the Pipetter Probe Output Voltage
Pipetter Pressure sensor 2.00±0.20 V after Pipetter Priming Clot Detection
and leave for 2 min. Output Voltage
Sipper LLD sensor 3.5 V or less Sipper LLD
Output Voltage

*For details, refer to Chapter 5.3.4

V 1.6 – April 1999 1 Chapter 6.1.8


RD/Hitachi Elecsys 2010 Service Manual

Operator-Id: 47 Stand-by 07:40


Voltage Admin
Monitor Util

Pipetter Pressure Sipper


LLD Sensor LLD
0.5V

1:Touch the "Voltage Button." in which you want to display the voltage.

2: When you see another voltage, touch the "Monitoring Stop Button."
and touch the "Voltage Button".

3: When you change screens, touch the "Monitoring Stop Button"


and touch the "Admin Tab".

Monitoring
STOP

Fig. 6.1.8-2 Pipetter LLD Voltage monitoring

Operator-Id: 47 Stand-by 07:40


Voltage Admin
Util
Monitor

Pipetter Pressure Sipper


LLD Sensor LLD
0.08V

1:Touch the "Voltage Button." in which you want to display the voltage.

2: When you see another voltage, touch the "Monitoring Stop Button."
and touch the "Voltage Button".

3: When you change screens, touch the "Monitoring Stop Button"


and touch the "Admin Tab".

Monitoring
STOP

Fig. 6.1.8-3 Pressure Sensor Voltage monitoring

V 1.6 – April 1999 2 Chapter 6.1.8


RD/Hitachi Elecsys 2010 Service Manual

Operator-Id: 47 Stand-by 07:40


Voltage Admin
Util
Monitor

Pipetter Pressure Sipper


LLD Sensor LLD
2.0V

1:Touch the "Voltage Button." in which you want to display the voltage.

2: When you see another voltage, touch the "Monitoring Stop Button."
and touch the "Voltage Button".

3: When you change screens, touch the "Monitoring Stop Button"


and touch the "Admin Tab".

Monitoring
STOP

Fig. 6.1.8-4 Sipper LLD Voltage monitoring

V 1.6 – April 1999 3 Chapter 6.1.8


RD/Hitachi Elecsys 2010 Service Manual

6.1.9 Assay Performance Check


The Assay Performance Check screen is shown below (Fig. 6.1.9-1).

Fig. 6.1.9-1 Assay Performance Check Screen


6.1.9.1 Running Test
Introduction
This test is carried out to check the mechanical movements of the system.

Materials Required

RackPack name Amount Material No.


CellCheck 6 1820451-122

Samples Required: Disk

Sample name Cups in Rotor Pos. Amount


ProCell 1-30 1 ml per test

Samples Required: Rack

Sample name No. of racks Cups in Pos. Amount


ProCell 6 1-5 1 ml per test

(1) Preparation
l Place six (6) sets of RackPacks filled with CellCheck in positions 1 to 6 on the reagent disk.
l Load thirty (30) Hitachi sample cups filled with ProCell on 6 racks for Rack System, or into positions 1 to 30
on the sample disk for Disk System.
V 1.6 – April 1999 1 Chapter 6.1.9
RD/Hitachi Elecsys 2010 Service Manual

Place 2 of the 6 racks on the I line and the others on the A line of the 2010 instrument for CLAS 1 connected
analyzers.
l Make sure the liquid waste container is empty.
l Fill the system water container with system water (max. 3.5 liters).
l Place a CleanLiner in the solid waste tray.
Note) Reset the waster number counter mechanically by detaching the solid waste tray.
l Place 1 (one) or 2 (two) sets of system reagent ProCell/CleanCell bottles filled with ProCell/CleanCell in the
system reagent container.
l Place three (3) magazines filled with tips and three (3) magazines filled with assay cups on a magazine tray.
(2) Check Procedure
l Make sure that the instrument is in standby status.
l First perform Reset (Maintenance Screen)
(Note) Make sure that no mechanical problem takes place by carrying out the “RESET” in reset status.
l Touch the Util button in the screen.
l Touch the Assay Performance Check button in the Util screen.
l Touch the Running Test button in the Assay Performance Check screen (Fig. 6.1.9-1).
l Having touched the button in the screen, you will see a popup (Fig. 6.1.9-2).
l Start the Running Test by touching the Start button in the screen.
180 determinations according to the Assay Protocol 2 are carried out on the instrument.
This procedure lasts 2.5 hours.
(3) Evaluation
l At the beginning, check whether all mechanical positions (especially position relative to
pipetter, sipper, beads mixer) are sufficient within a tolerance limit, refer to Chapter 4.5
Mechanical Adjustment.
l Observe the mechanical functions during the Running Test. Mechanical errors should not take place.
If you observe irregular movements, refer to Chapter 4.5 and carry out Mechanical Adjustment.
l Confirm that pipetter LLD functions properly.

Operator-Id: 47 Stand-by 07:40


Assay Performance Admin
Util
Check

Running Test

Start Close

Fig. 6.1.9-2 Popup screen of Running Test

Chapter 6.1.9 2 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.2 PMT High Volt. Adjustment

Introduction
Each MC in combination with a PMT represents a complete detection unit, which has to be adjusted
correctly. The high voltage adjustment should be carried out after measuring cell preparation to obtain
initial information about the instrument signal level.
The high voltage value has been adjusted initially in the quality control department at Hitachi in the
course of checks on the instrument, but not for some MC/PMT combinations. With the high voltage
adjustment (check) the field engineer should make sure that the combination of instrument
(photomultiplier tube, electronic components) and measuring cell work in the expected signal range.
If the signal is not in the required range, the photomultiplier tube (PMT) voltage has to be adjusted to
make the signal levels comparable between the different instruments. BlankCell reagent is used to check
the signal level.
Note: The [PMT high voltage adjustment] run only checks the current signal level of instrument
Calibrator BlankCell reagent.
The high voltage adjustment to the correct signal range then has to be carried out manually by the field
engineer.

6LJQDO
%&57DUJHW
‹ 5DQJH


%&55DQJH


  +LJKYROWDJH

Fig. 6.1.9-3

V 1.6 – April 1999 3 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Fig. 6.1.9.-4: Assay performance check screen

Preparations

1 Place system reagent bottles in the appropriate positions.

2 Place the BlankCell reagent pack as shown below:

Reagent rotor RackPack Beads R1 R2

Pos. No.

2 BlankCell set BCR1 BCR2 -

Chapter 6.1.9 4 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

3 Sample arrangement

3a For Disk System:

Run Cup in rotor pos. Liquid

PMT HV adjust. Stop BC in Pos. 4 –

3b For Rack Sampler (R/S):

Run Racks in A line Cup in rack Liquid


pos.

PMT HV adjust. 1 1, 2, 3 –

Use Hitachi cups.

4 Load disposable assay tips and assay cups in magazines on the tray (120 tips and 60 vessels are sufficient
for this test).

V 1.6 – April 1999 5 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Check Procedure

1 Select [PMT HV adjustment] in the [Assay Performance Check] screen (Fig. 6.1.9-5). Start the
measurement by pressing the Start button in the popup.

Operator-Id: 47 Stand-by 07:40


Assay Performance Admin
Util
Check

PMT HV Adjustment

Start Close

Fig. 6.1.9-5 Popup screen of PMT HV Adjustment

Chapter 6.1.9 6 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Evaluation of the PMT HV Adjustment Run

• Check the result in the [PMT HV adjustment] popup after the run has finished (Fig. 6.1.9-6).

Operator-Id: 47 07:40
Assay Performance Admin
Util
Check

PMT HV Adjustment

Pos. effective dark


signal level

1 123456 630

2 124356 635

3 121212 630

Start Close

Fig. 6.1.9-6 Result screen of PMT HV Adjustment

• Calculate the mean value of the BCR2 effective signals from the Result screen.
• Note the target value from the package insert of the BlankCell lot used.
• Compare the mean value of the BCR2 counts with the target. It should be in the range of ± 5% of
the target value.
Over time, the BCR2 level should be in the range of ± 10% (refer to Maintenance).

• If the current mean is outside the range, you may readjust the high voltage (refer to
Chapter 6.1.9 p. 8).
Note: We highly recommend that the high voltage is not changed in the first step if the signal
level of the BCR2 mean is outside the range of ± 7% of the target value.
First of all, the measuring cell preparation should be extended by another 50 or 100 measuring cell
preparation cycles (refer to Chapter 2.3.9).
In the second step make sure that the measuring cell is mounted properly and that the BlankCell reagent
is O.K. (refer also to Chapter 7 for additional troubleshooting information).

• The second row of values in the Result popup shows the dark level of the photomultiplier tube.
• The dark level should be between 625 and 635 counts.

V 1.6 – April 1999 7 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Restore Parameter

F Carry out "RESTORE PARAMETER" after you have performed or


even selected any assay performance check (APC).
Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the
assay performance section. You do not need to restore if you want to perform another APC run.

Adjustment of High Voltage

• Note the current high voltage by measuring the control voltage signal (CVS) between TP1 (GND)
and TP2 (CVS) on the PMT-SHV PCB (refer to Chapter 5.4.13 for details).
• Calculate the corresponding high voltage using the formula:

[PMT HV voltage] current = Control voltage ×


1100
6
• Calculate the new PMT HV voltage using the following formula.

0.137
 BCR2 
Vnew = Vold
 BCR2 Target 

Vnew: PMT HV voltage that will be applied after measurement.


Vold: PMT HV voltage that was applied previously.
(See the PMT HV record label on the PMT SHV cover).
BCR2 Target: BCR2 value specified by RD.

• Calculate the new control voltage relative to the PMT HV voltage using the following formula.

[Control voltage] new = Vnew × 6


1100

Chapter 6.1.9 8 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

• Adjust the voltage between TP1 (GND) and TP2 (control voltage signal) by changing the resistance
of the corresponding variable resistor (VR1, VR2 or VR3) according to the calculated control
voltage.
The resistor is chosen by the jumper setting of JP1 (Pos.1, 2 or 3; refer to Chapter 5.4.13 for details).
• If the new high voltage value is outside the selected range you have to change the setting of JP1.
• Repeat the procedure, return to 2.3.11.2
• If the new high voltage value is the O.K., change the PMT HV record (the label is on the PMT SHV
cover).

Note:
In case of problems make sure that LED1 located on the PMT-SHV PCB is lit. Check connection J400.

Adjustment of HV in Practice
From our experience we recommend the following procedure for determining the new High Voltage
value.

Comment:

On the high voltage side (HV voltage)


1 V §FRXQWV

On the low voltage side (control voltage)


0.005 V §FRXQWV

Example:

To change the BRC2 count result from 100,000 to 105,000 counts (ca. 5000 counts difference), the HV
voltage has to be increased by 5 V (+ 5 V §FRXQWVGLIIHUHQFH 7RDGMXVWWKHYDOXHFKDQJHWKH
control voltage by +0.025 V §FRXQWV

V 1.6 – April 1999 9 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.3 Artificial Media Test (AM Test)


Introduction
The Artificial Media Test is a button in the menu [Assay Performance Check] in the [Util] screen. It is a
short instrument check and principally measures the same criteria as the RD internal instrument check.

A Homogeneous Determination
With homogeneous determination magnetic separation is not used. A solution of free label is transported
inside the measuring cell and the performance of the detection unit (MC/PMT) can be analyzed. With
BCR2 1:20, the performance of the pipetter side can be analyzed.

B Heterogeneous Determination
The heterogeneous determination simulates an assay. The iSAP test uses beads and a biotinylated and
ruthenium-labeled antibody. A immuno-independent bead/antibody complex is generated to analyze the
detection unit, measuring cell and magnet function.
If all performance data for the homogenous determination are in order, then disturbance in the
heterogeneous determination can only be caused by the liquid flow system (tubing/fittings, connectors,
sipper),the magnet or the MC

BCR1, BCR2 and BCR2 1:20 are homogeneous, ProCell, iSAP and TSH are heterogeneous.

The test takes about 45 min.

Materials Required

RackPack name Amount Material No.


BlankCell 2 1729306-122
CellCheck 2 1820451-122
SAP 1 1820435-122

Samples Required

Sample name Amount


ProCell 7 ml
BCR2 1 ml

Chapter 6.1.9 10 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Preparations

1. Place system reagent bottles in the appropriate positions.

2. Set reagent rack packs in reagent disk positions 1 to 5 as follows:

Pos. No. RackPack Beads R1 R2


1 BlankCell set BCR1 BCR2 -
2 BlankCell set BCR1 BCR2 -
3 CellCheck ProCell ProCell ProCell
4 CellCheck ProCell ProCell ProCell
5 SAP test iSAP Buffer FC

3 Sample arrangement

3a For Disk System:

Run Cup in Rotor Liquid


pos.

Artificial Media Check. 3 BCR2 (1 ml)

4 to 10 ProCell (1 ml)

Use Hitachi normal sample cups; remember to use the Stop BC (place in Pos. 11).
Pipette 1 ml of BCR2 into sample disk position 3 and 1 ml of ProCell into each sample disk position
from 4 to 10.

3b For Rack Sampler (R/S):

To perform the AM test with the R/S you need at least two racks.

Run Rack in A line Cup in rack Liquid


pos.
No.

Artificial Media Check 1 1, 2 No

3 BCR2 (1 ml)

4, 5 ProCell (1 ml)

2 1 to 5 ProCell (1 ml)

Use Hitachi normal sample cups.


Pipette 1 ml of BCR2 into rack no. 1 position 3, and 1 ml of ProCell into rack 1 positions 4 and 5 and
rack 2 positions 1 to 5.
Note: Two empty cups also have to be placed in pos. 1 and 2 of rack 1.

4. Load disposable tips and cups in magazines on the tray (120 tips and 60 cups are sufficient for this
test).

V 1.6 – April 1999 11 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Check Procedure

1. For Disk System:

After touching the [Artificial Media] test button in the [Assay Performance Check] screen in the user
interface start the measurement by pressing the start button.
2. For Rack Sampler (R/S):

On the rack sampler simply place rack 1 and rack 2 in the A line and start the AM test by pressing the
artificial media test button in the [Assay Performance Check] screen.

3. Test items performed by the artificial media check

For For
Rack Disk

Pos. Pos. Sample Item Item Item Item Item Item Item Item Item Item
No. No. 1 2 3 4 5 6 7 8 9 10
R 1 1 - BCR1 BCR1 BCR1 BCR1 BCR1
a 2 2 - BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2
c 3 3 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2 BCR2
k€ (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20) (1:20)
4 4 ProCell ProCell ProCell ProCell ProCell ProCell
5 5 ProCell iSAP
R 1 6 ProCell ProCell
a 2 7 ProCell iSAP
c 3 8 ProCell ProCell
kó 4 9 ProCell iSAP
5 10 ProCell ProCell

Evaluation of the AM Test

From software version 03-08 onwards the results can be automatically calculated by the instrument. Press
the [Print result] button in the [Assay performance] screen.
To evaluate the results use the parameters and acceptable ranges for the artificial media test given in the
table.
(for target values refer to Table 6.1.9-1 “APC test; Targets, AM test”).
If troubleshooting is necessary refer to the charts given in Chapter 6.1.9.10.

Note: If a result is missing, the mean and CV are calculated wrongly. In such cases calculate the
corresponding result manually with the formulas given below.

Chapter 6.1.9 12 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

• The BCR (BlankCell reagent) target value should be reached; this is used for the instrument
calibration. The determination of BCR1 means the lower, BCR2 the higher calibration value. This
reflects the recovery and the variance of the target value.
Note: None of the measured counts with tests from the Assay Performance Checks are
connected with the instrument calibration factor.
• BCR2 is used to adjust the PMT-HV and indicates problems with the PMT and excitation.
• BCR2 (1:20 dilution) is a dilution of BCR2 with BCR1 and shows the functionality of the pipetter,
the pipetter precision and general problems with the liquid handling.
• ProCell is determined using the measuring cycle for heterogeneous assays. These values are the
basic values used for calculating carryover.
• iSAP is a model assay based on streptavidin beads. iSAP facilitates the evaluation of the complete
LFS (liquid flow, magnet, capturing, detection) in a routine assay.
• Carryover is the measurable influence on the assay performance and is the consequence of carryover
of beads into the measuring cell in this case.

Calculation Formulas

All values are calculated with the signal counts.

iSAPmax−iSAPmin
iSAP Precision, Range = ∗100%
iSAPaverage

Carryover = average of 5 ∗1 Pr oCell [counts] − average of 3 Pr oCell [counts] ∗ 1,000,000


average of 3 ∗ 1 iSAP [counts]

( BCR2 average− BCR1 average)


Dilution factor = BCR2 (1 : 20) =
( BCR2 (1 : 20) average - BCR1 average)

Restore Parameter

F Carry out "RESTORE PARAMETER" after you have performed or even selected any
assay performance check (APC).
Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the
Assay performance section. You do not need to restore if you want to perform another APC run.

V 1.6 – April 1999 13 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

APC Tests; Targets (AM test)


Table 6.1.9-1

No. Parameter Unit Green Range Orange Range Red Range

1 Signal BCR1 average (counts) 200 - 400 400 to 450 > 450

2 BCR1 precision (CV) ≤ 4.0% 4.0 to 6.0% > 6.0%

3 Signal BCR2 average (counts) Target ± 10% Target ± 15% Target > ± 15%

4 BCR2 precision (CV) ≤ 2.0% 2.0 to 3.5% > 3.5%

5 Signal BCR2 (1:20) dilution Factor range 17 – 21 - < 17 or > 21

6 BCR2 (1:20) precision (CV) ≤ 5.0% - > 5.0%

7 iSAP range (CV) ≤ 8.0% 8.0 to 10.0% > 10.0%

9 Carryover (CO) (ppm) ≤ 100 100 to 150 > 150

9 Signal iSAP average (counts) 850,000 to 1,200,000 800,000 to 1,300,000 < 800,000 or > 1,300,000

If all values are in the green range or ≤ 2 values are in the orange range, then the instrument may be released.
If > 2 values are in the orange range or one value is in the red range, then the instrument may not be released

Chapter 6.1.9 14 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.4 TSH Assay

TSH assay (heterogeneous determination) is a button in the menu [assay performance check]. Unlike to
the artificial media test, this immunoassay is performed by the customer as a matter of routine.
The TSH assay is a necessary service tool as it reveals problems in the assay performance that occur in
determinations where high dynamic, very low LDL (lower detection limit) and very high precision are
required. For instrument/instrument performance criteria we have to use more detailed checks. There, the
calibration also plays a role.

The test takes about 45 min.

Materials Required

Rack pack name


Amount Material No.
TSH 1 1731459-122
CellCheck 1 1820451-122

Samples Required

Sample name Amount Material No.


ProCell 1 ml
TSH Cal 1 650 µl 1731483-122
TSH Cal 2 400 µl 1731483-122

Preparations:

1. Place system reagent bottles in the appropriate positions.

2. Set reagent racks for TSH assay test in reagent disk positions 6 and 7.

Pos. No. RackPack Beads Reagent 1 Reagent 2

6 CellCheck ProCell ProCell ProCell


7 TSH Beads R01 R02

3. Sample arrangement

3a For Disk System

Run Cup in rotor Liquid


pos.

TSH assay test 15 ProCell (1 ml)

16 TSH Cal1

17 TSH Cal2

Use Hitachi normal cups and RD calibrator vials.

V 1.6 – April 1999 15 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

3b For Rack Sampler (R/S)

Run Rack in A line Cup in rack Liquid


pos.
No.

TSH assay test 1 1 ProCell (1 ml)

2 TSH Cal1

3 TSH Cal2

Use Hitachi normal cups and RD calibrator vials.

4. Load disposable tips and cups in magazines on the tray (120 tips and 60 cups are sufficient for this
test).

Check Procedure

1. For Disk System:

After touching the [TSH assay test] button in the [Assay Performance Check] screen of the user interface
start the measurement by pressing the start button
2. For Rack Sampler (R/S):

On the rack sampler simply place rack 1 in the A line and start the TSH test by pressing the [TSH assay
test] button in the [Assay Performance Check] screen of the user interface.

3. Test items performed by the TSH assay test

Pos. Sample Item Item Item Item Item Item Item Item Item Item
No. 1 2 3 4 5 6 7 8 9 10

1/15 ProCell ProCell ProCell ProCell

2/16 TSH Cal1 TSH TSH TSH TSH TSH TSH TSH TSH TSH TSH

3/17 TSH Cal2 TSH TSH TSH TSH TSH

Evaluation of the TSH Assay Test

From software version 03-08 onwards the results can be automatically calculated by the instrument. Press
the [Print result] button in the [Assay performance check] screen.
To evaluate the results use the parameters and acceptable ranges for the TSH assay test given in
Table 6.1.9-2 (APC tests; Targets, TSH test).
If troubleshooting is necessary refer to the charts in 6.1.9.10.

Chapter 6.1.9 16 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Note: If a result is missing, the mean and CV are calculated wrongly. In such cases calculate the
corresponding result manually using the formulas below.

• The tangent (TSH Cal2) describes concentration-independent dynamics. A tangent value outside
target indicates problems with the measuring cell, LFS and MC or the magnet.
• The LDL (lower detection limit) is the lowest value that differs significantly from the concentration
of 0 µU/ml. Dynamics and precision in the lower range influence the LDL. Apart from problems
with the measuring cell, the pipetter or the magnet, problems with the sipper, liquid handling and
liquid flow (tubing, foam, bubbles, ...) and temperature influences increase the LDL, i.e. give poorer
assay performance.

• An increased first value of the TSH Cal1 (TSH Cal1 1st value high) is seen in the event of a
preceding homogeneous determination (e.g. ProCell, Prepare, Idle). In most cases it is related to the
performance of the measuring cell. A high first value is only observed if a ProCell/Prepare cycle is
run before a very low signal in a heterogeneous determination.

Calculation Formulas

All calculations are done using the signal counts.

averageof TSH Cal 2 − averageof TSH Cal1


Tangent (TSH Cal 2) =
conc.of TSH Cal 2[µIU / ml ] − conc.of TSH Cal1[µIU / ml ].
Concentrations are lot-specific (for concentrations call RD Customer Support).

LDL = 2 ∗ SD of TSH Cal1


Tangent ( TSH Cal 2)

A = First value of TSH Cal1B = Average of the remaining 9 values in the first determination (n=10)
TSH Cal1 1st value high = A − B ∗ 100
B

Restore Parameter

FCarry out "RESTORE PARAMETER" after you have performed or even selected any assay
performance check (APC).

Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the
Assay performance section. You do not need to restore if you want to perform another APC run.

V 1.6 – April 1999 17 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

APC tests, Targets (TSH test)


Table 6.1.9-2

No. Parameter Unit Green Range Orange Range Red Range

1 Tangent TSH Cal2 [counts] ≥ 12,000 11,500 – 12,000 ≤ 11,500

2 Signal TSH Cal1 [counts] ≤ 1300 ≤ 1350 ≥ 1350

3 TSH Cal1 precision, [CV] ≤ 4.0% 4.0 - 5.5% ≥ 5.5%


n=10

3 TSH Cal2 precision [CV] ≤ 2.0% 2.0 - 3.5% ≥ 3.5%

4 Lower detection limit [µU/ml] ≤ 0.005 ≤ 0.007 ≥ 0.007


(LDL)

5 TSH Cal1 first value [counts] ≤ 8.0% ≤ 10% ≥ 10 %


high

If all the values are in the green range or if ≤ 2 values are in the orange range, the instrument may be released.
If > 2 values are in the orange range or if one value is in the red range, then the instrument may not be released.

Chapter 6.1.9 18 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.5 MC CO Check
Introduction
The MC CO (measuring cell carryover) Check is part of the AM Test and is carried out if only MC carryover is to
be checked. In the event of a general test of the system (e.g. when installing the instrument, replacing the measuring
cell or carrying out a performance check during maintenance) both the complete AM test and the TSH assay test
should be carried out.

The following measurements are carried out:


5 x BCR1 (homogeneous measurement)
5 x ProCell (heterogeneous measurement)
3 x iSAP (heterogeneous measurement)
3 x Carry Over (heterogeneous measurement)

The test takes about 30 minutes.

Materials Required
Pos. No. Name Beads R1 R2
1 BlankCell set BCR1 BCR2 -
2 - - - -
3 - - - -
4 CellCheck ProCell ProCell ProCell
5 SAP test iSAP Beads Buffer FC

Samples Required

Disk System
Place 1 ml ProCell in positions 2 to 8 and an empty Hitachi cup in Pos. 1.

Rack Sampler
Place 1 ml ProCell in positions 2 to 5 of a rack and an empty Hitachi cup in Pos. 1. In a second rack, pipette 1 ml of
ProCell in positions 1 to 3.
The further procedure is as described for the AM Test in Chapter 6.1.9.3.

6.1.9.6 LH Check

Introduction
The LH (liquid handling) Check is part of the AM Test and is carried out if only liquid handling is to be checked. In
the event of a general test of the system (e.g. when installing the instrument, replacing the measuring cell or
carrying out a performance check during maintenance) both the complete AM test and the TSH assay test should be
carried out.

The following measurement is carried out:


10 x BCR2 (homogeneous measurement)

The test takes about 18 minutes.

Materials Required
Pos. No. Name Beads R1 R2
1 - - - -
2 - - - -
3 CellCheck ProCell ProCell ProCell
4 - - - -
5 - - - -

V 1.6 – April 1999 19 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Samples Required

Disk System
Place 1 ml BCR2 in Pos. 1.

Rack Sampler
Place 1 ml BCR2 in Pos. 1 of a rack.
The further procedure is as described for the AM Test in Chapter 6.1.9.3.

6.1.9.7 Programmable Test


This test is not implemented.

6.1.9.8 Print Result


This function is to print out the results of the artificial media test, MC CO test, LH test and the TSH assay test.

F Carry out “Print Results” after you finish each “AM test”, “TSH test”, “MC CO
test”, “LH test” of the Assay Performance Check, and before you touch the
[Restore Parameter] button or start any Assay Performance Check (APC).
l Select the [Print Results] button in the [Assay Performance] check screen after you finish each test of Assay
the Performance Check.
l Having touched the button in the screen, you will see a popup (Fig. 6.1.9-7 or Fig. 6.1.9-8).
l Touch the [print out] button on the popup if the instrument has APC results.
l Input “Date”, “Operator name”, “Instrument No.”, “BCR1 target value” and “BCR2 target value” on the printed
results sheet, and compare the results for each item with the criteria and evaluate whether the results are
acceptable or not.

Chapter 6.1.9 20 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Operator-Id: 47 Stand-by 07:40


Assay Performance Admin
Util
Check

Print Out APC Results

Artificial media Test

print out cancel

Fig. 6.1.9-7 Popup screen of the printout (in the event that the instrument has APC results)

Operator-Id: 47 Stand-by 07:40


Assay Performance Admin
Util
Check

Print Out APC Results

No Results

print out cancel

Fig. 6.1.9-8 Popup screen of the printout (in the event that the instrument has no APC results)

V 1.6 – April 1999 21 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.9 Restore Parameter


F Carry out “RESTORE PARAMETER” after you have performed or even selected
any Assay Performance Check (APC).

Select the [Restore Parameter] button in the [Assay Performance] check screen if you have finished the Assay
performance section. You do not need to restore if you have performed another APC run.

When and what

l You must check the instrument according to the procedures in the following cases.
l The detailed checking procedures and acceptable ranges are described in the preceding sections.
l Some checking procedures are necessary as shown in the following table when some parts or assemblies are
replaced.
l The Running Test is to be performed if you make adjustments to the instrument to check
the reliability of the hardware.

Table 6.1.9-3 When and what has to be performed (see below for further details)
Case MC System PMT-HV Initial Artificial TSH Assay
Prepare Volume Check BlankSet Media Test Test
check
1. Instrument Installation X X X X X X
2. Detection Unit Replacement X X X X X X
3. Measuring Cell Replacement X - X X X X
4. PMT Replacement X X X X
5. ANG-EP Replacement
6. L-AMP(1) Replacement
7. Magnet Drive Replacement - - - - X X
8. Sipper Probe Replacement - X - X - -
9. Sipper Tubing Replacement - X - X - -
10. Pipetter Probe Replacement - - - X X -
11. Pipetter Tubing Replacement - - - X X -
12. Long-term Rest

1. Installation of instrument
Refer to Chapter 2 for details

2. Replacement of detection unit


3. Replacement of measuring cell
4. Replacement of PMT
5. Replacement of ANG-EP
6. Replacement of L-AMP(1)
7. Replacement of magnet driver
The same procedures to check instrument / MC performance as recommended for installation: refer to
Chapter 2.3.9 and following.

8. Replacement of sipper probe


9. Replacement of sipper tubing
In case of changing a tube or any other part in the sipper flow path, a system volume check must be
performed. In addition, system performance should be checked after exchange (AM, TSH assay test) in the
same way as during PM exchange.

10. Replacement of pipetter probe


11. Replacement of pipetter tubing
In case of changing any part in the pipetter liquid handling path, we recommend checking liquid handling
precision. At least the LH check (refer to Chapter 6.1.9.6) should be performed (or, alternatively, the AM
test).

Chapter 6.1.9 22 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

12. Long-term rest


Depending on the condition of the instrument, at least LFC and system performance check should be
performed.

Note
If the system appears to be contaminated we recommend performing the System Cleaning function (refer
to Maintenance) or exchanging the affected parts (tubings, etc.). For instruments not used for more than
3 months, the 12 month PM procedure should also be carried out (refer to Chapter 10).

General note
If any major performance shift is detected, assay calibration must be performed.

F Test Report
After finishing all testing, send the Test Report to Roche Diagnostics GmbH.

V 1.6 – April 1999 23 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

6.1.9.10 Assay Performance Check Troubleshooting

Flow Diagram

APC Tests
Check of HW 2010

Signal out of range OK


NO Targets see SPECS
BCR1, BCR2, BCR2 1:20

Yes

PMT, Potentiostat, MC (RE) HW control


(Liquid Handling, Liquid Flow) DO •HV adjustment
•Temperature control OK?
•MC current OK? <5>15 mA

CV out of range NO OK Targets see SPECS


BCR2, BCR2 1:20

Yes

Liquid Handling (LH) HW control (LH; leakage)


[(Liquid Flow (LF)] DO •Tubings
•Tip gripping
•Dilutor (pipettor)

[HW control (LFS)]


•Bubles in LFS
•LFC of MC/LFS (clots, filaments, deposits)
•Dilutor (sipper)

Legend
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell BCR = BlankCell Reagent
RE = Reference Electrode PMT = Photomultiplier Tube
HV = High Voltage LF(C) = Liquid Flow (Cleaning)
LFS = Liquid Flow System LH = Liquid Handling
Chapter 6.1.9 24 V 1.6 - April 1999
RD/Hitachi Elecsys 2010 Service Manual

APC Tests
Check of HW 2010

Signal out of range


NO OK Targets see SPECS
SAP and TSH Test

Yes If BCR1/BCR2 signal within range

Magnet (LF) DO Magnet adjustment OK?

Yes If BCR1/BCR2 signal also out of range

PMT, Potentiostat, MC (RE) DO HW control


(Liquid Handling, Liquid Flow) •HV adjustment
•Temperature control OK?
•MC current OK? <5>15 mA

CV out of range
NO OK Targets see SPECS
TSH Test

If BCR1/BCR2 CV within range


Yes

Liquid Flow (LF) HW control LF


sipper, tubings, line DO •LFC of MC/LFS (clots, filaments, deposits)
heater, fittings, valves •Bubbles in LF (tightness)
•Dilutor (sipper, tightness)

Legend
SAP = Special service reagent TSH = Thyroid-specific Hormone
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell RE = Reference Electrode
PMT = Photomultiplier Tube HV = High Voltage
LF(C) = Liquid Flow (Cleaning) LFS = Liquid Flow System
LH = Liquid Handling BCR = Blank Cell Reagent

V 1.6 – April 1999 25 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

APC Tests
Check of HW 2010

Carryover out of range


NO OK Targets see SPECS
SAP test

Yes If BCR2 and/or TSH CV also out of range

MC/LFS DO HW control LFS


•LFC of MC/LFS
•Bubbles on gasket (MC)
If BCR2 and/or TSH
CV inside range •Tubings (tight, clean)
D but CO out of range
O
Not
OK OK?

Exchange MC (life time?)

Legend
SAP = Special service reagent TSH = Thyroid-specific Hormone
CV = Coefficient of Variation HW = Hardware
MC = Measuring Cell BCR = Blank Cell Reagent
LFC = Liquid Flow Cleaning LFS = Liquid Flow System
LH = Liquid Handling

Chapter 6.1.9 26 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Troubleshooting of Assay Performance Check

Check items Phenomenon Possible cause Remedy


PMT HV adjustment Signal≅0, DL=625 1. HV connector is not 1.Confirm the following connections:
connected l between P400 and J400 on PMT-SHV board.
l between P401 and J401 on PMT-SHV board.
l between P610 and J610 in Detection Unit.
2.PMT connector is not 2.Others, refer to the Cross Wiring Diagrams for details.
connected.
3.Connector of L-Amp. board Confirm the following connections:
is not connected. l between P430 and J430 on L-AMP(1) board.
4.Shield plug is not connected. l P/J431 on L-AMP(1) board or P/J119 on EECL board.
5.PMT or L-Amp(1) board is Replace the PMT or L-Amp(1) board.
to be defected.
6.Shield sable is Confirm the following connection.
open-circuited. l between P430 and J430 on L-AMP(1) board.
l P/J431 on L-AMP(1) board or P/J119 on EECL board.
Signal≅0, DL>625 1.Measuring cell is 1.Confirm no ADC alarm 31-02-01 or 31-02-02 takes place.
not mounted.
2.Connector of measuring 2. Confirm the following connection:
cell is not connected. l between P610 and J610 in detection unit.
3.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
4.Liquid leakage occurs in Check the pipetter flow system.
pipetter flow system.
Signal<70,000, DL>625 1.Wrong reagent or reagent 1.Confirm that the Reagent Lot is valid.
position. 2.Replace the reagent.
2.Measuring cell is Confirm position of the measuring cell relative to PMT.
not mounted correctly.
3.PMT is not mounted
correctly.
4.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
5.Liquid leakage occurs in Check the pipetter flow system.
pipetter flow system.

V 1.6 – April 1999 27 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

Check items Phenomenon Possible cause Remedy


PMT HV adjustment Signal is not stable. 1.Shading to the detection unit 1.Confirm the dark level value is lower than 640.
is not sufficient. 2.Confirm that the sponge lid between PMT and the plug P401 has not become
detached.
2.Shield plug is not 1.Confirm the connection between P430 and J430 on L-AMP(1) board.
connected correctly. 2. P/J431 on L-AMP(1) Board or P/J119 on EECL board.
3.Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
4.Temperature control of the Confirm temperature of the detection unit on the temperature
detection unit is not sufficient. monitor screen, refer to Chapter 6.1.7.
AM test Normalized BCR1>400 1.Wrong reagent or reagent 1.Confirm that the Reagent Lot is valid.
position. 2.Replace the reagent.
2. L-AMP(1) board is Replace the L-AMP(1) board.
defective.
3. Active bleeder is defective. Replace the active bleeder.
BCR2 CV% >2% 1. System volume check not done. Perform system volume check.
2. Liquid leakage occurs in sipper Check of the sipper flow system.
flow system.
3. Number of MC preparations is Repeat MC preparation again at least 30 times as described in
not sufficient. Chapter 2.3.9.
4. Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
BCR2(1:20) CV% >5% 1. Liquid leakage occurs in pipetter Check the pipetter flow system.
flow system.
2.Dust on pipetter probe end. Use gauze moistened with distilled water to clean the end of the pipetter probe.
3.Height of pipetter probe, Z axis Adjust the Z axis position of pipetter according to Chapter 4.5.
position is not correct.
Carryover >100 ppm 1. Liquid leakage occurs in sipper Check the sipper flow system.
flow system.
2.Position of magnet relative to the Use the magnet drive tool, adjust the position by referring to
Measuring cell is not sufficient. Chapter 4.4.14.
3. Measuring cell is defecive. Replace the measuring cell as described in Chapter 4.4.13.3.

Chapter 6.1.9 28 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

Check Items Phenomenon Possible cause Remedy


AM test Sensitivity >6E-15W 1. Anode dark current of PMT is 1.Confirm the dark level value. If the value is more than 640,
bigger than usual value. leave the PMT in instrument standby status overnight.
2.Shading to the detection unit 2. Confirm that the sponge lid between PMT and the plug P401 has not become
is not sufficient. detached.
3. Number of MC preparations is Repeat MC preparation again at least 30 times as described in
not sufficient. Chapter 2.3.9.
4.Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
TSH assay test Tangent <11000 1.Magnet itself is defective. Confirm iSAP signal value. If the value is lower than 1.2E 6,
Tangent/CAL 1<10 replace the magnet or check position of magnet relative to the
measuring cell.
2.Temperature control of the Confirm temperature of the detection unit on the temperature
detection unit is not sufficient. monitor screen, refer to Chapter 6.1.7.
3.Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
4.L-AMP(1) board is Replace the L-AMP(1) board.
defective.
CAL 2 CV% >2% 1. Liquid leakage occurs in pipetter Check the pipetter flow system.
LDL >0.005 flow system.
2.Dust on pipetter probe end. Use gauze moistened with distilled water to clean the end of the pipetter probe.
3.Height of pipetter probe, Z axis Adjust the Z axis position of pipetter according to Chapter 4.5.
position is not correct.
CAL 1 signal >1200 Measuring cell is defective. Replace the measuring cell as described in Chapter 4.4.13.3.
1st value >8%

V 1.6 – April 1999 29 Chapter 6.1.9


RD/Hitachi Elecsys 2010 Service Manual

6.1.10 Mechanism Check

1) How to select a mechanical unit check function in the Mechanism Check screen
There are 13 mechanical unit check functions available. Each of them corresponds to a button in the
Mechanism Check screen. Touch the Mechanism Check button in the Util screen in order to display the
Mechanism Check screen. After touching a button in the Mechanism Check screen, a pop-up window appears
in the screen.

Fig. 6.1.10-1 Mechanism Check screen for Rack System

Fig. 6.1.10-2 Mechanism Check screen for Disk System

V 1.6 – April 1999 1 Chapter 6.1.10


RD/Hitachi Elecsys 2010 Service Manual

Some functions can also be activated by touching a button in one of the screens for the mechanical unit
adjustment.
There are some buttons in each pop-up window; some pop-up windows also have an input area.
The general functions of each button and the input area are as follows.

Start button : To start the maintenance function corresponding to the button


Close : To close the pop-up and return to the Maintenance screen without carrying out any
maintenance functions
Input area : To define how many times the maintenance function is to be carried out

There is no Stop button in the pop-up window. Instead, the Stop key can be used to stop the maintenance
function. While a mechanical unit check function is in process, the remaining iteration number is displayed in
the corresponding button. The number is reset to 1 when the Stop key is pressed and to 0 when the function
is completed.

Chapter 6.1.10 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

The following table shows a summary of the mechanical unit check functions.

Table 6.1.10-1 Summary of the mechanical unit check functions


No. Name Function
1. Reagent Cap Open/Close M. Repeats the RackPack cap opening/closing from the
RackPack in position 1 counterclockwise as many times as
entered in the input area. The maximum repetition number
is 180.
This function is also activated by touching the button in the
screens for the mechanical position adjustment.
2. Microparticle Mixing Repeats the bead mixing from the RackPack in position 1
counterclockwise as many times as entered in the input area.
The maximum repetition number is 180.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
3. Magnet Up/Down Repeats the magnet drive upward and downward movement
as many times as entered in the input area. The maximum
repetition number is 180.
4. Waste Tray Shaking Repeats the solid waste shaking as many minutes as entered
in the input area. The maximum repetition number is 180.
5. Sample BC Scanning (for Carries out S. Scan once including the database update and
disk system only) the transmission to HOST.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
6. Bar Code Card Reading Carries out Barcode Card Scan once including the database
update and the transmission to HOST.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
7. Reagent Pack BC Scanning Carries out R. Scan once including the database update and
the transmission to HOST.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
8. Gripper Quick Check Carries out a mock operation with tips and vessels mounted
on each corner of each magazine. Only the gripper and the
pipetter move according to the AP 2, whereas the pipetter
carries out only picking up a tip and discarding it moving
between the pipetter buffer and the pipetter washing station.
This function is also activated by touching the buttons in the
screen for the mechanical position adjustment.
9. Gripper Rep. Check Carries out a mock operation with all full magazines. Only
the gripper moves according to the AP 2 although no
tip/vessel discarding takes place. Instead, all tips and
vessels are to be returned back to their original positions.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
10. Rgt. Pipetting Cycle Carries out mock pipetter, reagent disk and cap opener
cycles as many times as entered in the input area with no
liquid handling except for the LLD. The maximum
repetition number is 180.
The gripper carries a vessel to the vessel buffer (VB) at the
beginning of the function and discards it at the end.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.

V 1.6 – April 1999 3 Chapter 6.1.10


RD/Hitachi Elecsys 2010 Service Manual

No. Name Function


11. S/R Probe/Gripper Check Carries out mock cycles except for the sipper as many times
as entered in the input area with no liquid handling except
for the LLD. The maximum repetition number is 180.
This function is also activated by touching the button in the
screens for the mechanical position adjustment.
12. Sipper Carries out mock sipper cycles as many times as entered in
the input area. The current position is switched alternately
every cycle. The gripper carries a vessel to the sipping
position at the beginning of the function and discards it at
the end. The maximum repetition number is 180.
This function is also activated by touching the button in the
screen for the mechanical position adjustment.
13. S/R Probe LLD Checks the pipetter LLD function by moving the pipetter
down to the sample disk and the RackPack at position No. 1
of the sample disk and the middle bottle at position No.1 of
the reagent disk, respectively.
14. Sampler Check Carries out a mock operation with all racks on rack loader
(only for Rack Sampler) after reset action, checks the BC reading function on the
rack sampler, and prints out the result. Only the rack sampler
moves in the same manner as in the operation.

Chapter 6.1.10 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.11 Automatic Adjustment

6.1.11.1 Overview
Gripper automatic adjustment is used to adjust the gripper instead of manual adjustment.

6.1.11.2 Functions of the automatic adjustment


This automatic adjustment has six (6) functions. The following table shows the purpose of each adjustment
function and the adjustment area corresponding to each adjustment function. Fig. 6.1.11-1 shows how to mount
tips and vessels for automatic adjustment.

No. Adjustment Function Purpose Adjustment Area


1 Preparation and To adjust all positions when adjustment Magazine, Incubator, Buffer
Adjustment has never been performed.
2 Gripper All Position To adjust all positions when adjustment Magazine, Incubator, Buffer
has been performed.
3 Magazine To adjust positions on magazines. Magazine
4 Sipping – Inc To adjust positions on the incubator. Incubator
5 Vessel Buffer To adjust positions on the buffer. Buffer
6 Gripper – Z To adjust the height direction. Magazine, Incubator, Buffer

The following table shows the adjustment positions in each adjustment area that are described in Fig.6.1.11-1.

No. Adjustment Area Adjustment Positions


1 Magazine TM1_12, TM12_29, VM1_1, VM29_1
2 Incubator Inc1_1, Inc4_1, Inc4_8, Sipping
3 Buffer Tip Pos.1, VB

V 1.6 – April 1999 1 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

Buffer Area
Adjustment Tool
VB Incubator Area

Inc1_1 Inc4_8
Tip Pos.1

Sipping

VM1_1 Inc4_1
TM1_12

Magazine Area

VM29_1 TM12_29

, : Tips should be placed in these positions.


, : Vessels should be placed in these positions.
, : These positions are adjustment positions
: These positions should be empty.
Note) Adjustment Tool for buffer area should be placed on buffer plate.

Fig.6.1.11-1 How to mount tips and vessels for automatic adjustment

V 1.6 – April 1999 2 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

6.1.11.3 How to operate the automatic adjustment

l Touch the Automatic Adjustment button in the Util screen.

Fig.6.1.11-2 Automatic adjustment screen

l Touch the Gripper All Positions button in the Automatic Adjustment screen.
Operator-Id: 47 Stand-by 07:40
Automatic Admin
Util
Adjustment

Automatic Adjustment

Gripper
Tip Vessel Carrier

AllPositions
All Position

Start Close

Fig. 6.1.11-3 Pop-up screen of Gripper All Positions

V 1.6 – April 1999 3 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

(1) Preparation and Adjustment


At first, all adjustment values are set to zero (0) internally and the Preparation movement is performed. All areas
are continuously adjusted.
Preparation is a movement to find roughly a position that can pick up Tip or Vessel at each adjustment position.
Adjustment of all areas is performed in two (2) or three (3) cycles. Whether or not the third cycle is performed is
decided automatically on the basis of the results of the first and second cycles, but height adjustment is performed
in three cycles. Adjustment values in the memory and on the FD are overwritten when each adjustment cycle is
finished. The colorNote 1) of the display windows for adjustment value(s) depends on the adjustment situation.

(2) Tip Vessel Carrier All Position


Adjustment of all areas is performed using the adjustment values in the memory. See Point (1) for details of the
adjustment process.

(3) Magazine
Adjustment of the magazine area is performed using the adjustment values in the memory. See Point (1) for
details of the adjustment process.

(4) Sipping - Inc


Adjustment of the incubator area is performed using the adjustment values in the memory. See Point (1) for
details of the adjustment process.

(5) Vessel Buffer


Adjustment of the buffer area is performed using the adjustment values in the memory. See Point (1) for details
of the adjustment process.

(6) Gripper - Z
The height adjustment is performed in three cycles in the order of Sipping position and VB position.
Adjustment values in the memory and on the FD are overwritten when each adjustment cycle is finished. The
color Note 1) of the display windows for adjustment value(s) depends on the adjustment situation.

Note1)
The display window is green, yellow or red. Refer to Chapter 6.1.11.5 for details of the meanings of the three
colors.

V 1.6 – April 1999 4 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

6.1.11.4 Adjustment procedure

Caution)
Do not execute System Reset when the adjustment tool is on the buffer plate because the
pipetter probe will be damaged.

(1) Place Tips and Vessels as shown in Fig. 6.1.11-1 according to purpose.
(2) Place the adjustment tool for the buffer area on the buffer plate as shown in Fig. 6.1.11-1.
(3) Touch the Automatic Adjustment button in the Util screen.
(4) Touch one of the adjustment item buttons in the Automatic Adjustment screen.
(5) If an alarm occurs during the adjustment, perform automatic adjustment again after troubleshooting.
(6) After finishing the automatic adjustment, repeat the procedure if the display windows for adjustment
value(s) is red. Refer to Chapter 6.1.11.5.
(7) In order to confirm that the automatic adjustment has been completed successfully, perform the pipetter /
gripper check.

V 1.6 – April 1999 5 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

6.1.11.5 Display of Adjustment Values and the Displayed Colors

(1) Display of Adjustment Values


Adjustment values are displayed in the display windows for adjustment value(s) in the manual adjustment screen.
These displayed adjustment values are calculated from the value(s) obtained from adjustment position(s) as
shown in the following table.

Adjustment Area The Display Windows of Adjustment Position


Adjustment Value Using for Calculation
Magazine TM Front X TM12_29(X) and VM29_1(X)
Y TM1_12(Y) and TM12_29(Y)
TM Back X TM1_12(X) and VM1_1(X)
VM Left Y VM1_1(Y) and VM29_1(Y)
Incubator Sipping X Inc4_1(X) and Inc4_8(X)
Y Inc4_8(Y)
Incubator Y Inc1_1(Y) and Inc4_1(Y)
Buffer Tip Pos.1 X TP1(X)
Y TP(Y)
V.Buffer X VB(X)
Y VB(Y)
Magazine, Incubator Sipping Z Z Sipping(Z)
Buffer V.Buffer Z Z VB(Z)

(2) Meaning of the Displayed Colors


The color of the display window for adjustment value(s) changes depending on the situation of adjustment.
However, if the instrument is switched off and on, all display windows change to green. The following
table shows the meaning of the displayed colors.

Displayed Color Description


Green Adjustment finished successfully.
Yellow Corresponds to alarm code 51_01_02.
The Gripper could pick up a Tip or Vessel at the adjustment limit of the adjustment
position(s) that is (are) used to calculate the adjustment value. Therefore, there is
the possibility that the automatic adjustment was not finished successfully.
Red Corresponds to alarm code 51_01_01.
The Gripper could not pick up a Tip or Vessel at the adjustment position(s) that is
(are) used to calculate the adjustment value on at least one occasion. Therefore, the
automatic adjustment failed.
Note)
If the displayed color is red, the adjustment value does not change. However, if the adjustment values for X and
Y are displayed in the same display window, one of the adjustment values may be overwritten because the
adjustment values for X and Y are calculated separately.

V 1.6 – April 1999 6 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

(3) What to do for each color of the display window


The following table shows what is to be done for each color of the display window of adjustment value(s).

Displayed color What to do


Green > No need to adjust again because the automatic adjustment was
finished successfully.
If any alarms occur during operation, check the cause of alarm, e.g. vessels floating
on the incubator, or tips and vessels leaning to the side on the magazine.
Yellow > Basically, no need to adjust again.
If any alarms occur during operation, take the following measures.
(1) If the area for which the display window of adjustment value(s) has changed to
yellow and the area in which alarm has happened are the same, perform
automatic adjustment in the same area or adjust manually.
(2) If the area for which the display window of adjustment value(s) has changed to
yellow and the area in which alarm has happened are different, check the cause
of the alarm, e.g. vessels floating on the incubator or tips and vessels leaning to
the side on the magazine.
Red > Readjustment is necessary because automatic adjustment failed.
(1) After performing manual adjustment of the affected position roughly, carry out
automatic adjustment of the area.
(2) After checking mechanical position etc., carry out automatic adjustment of the
affected area or adjust manually.

+ Check the Gripper X/Y Tip Pos. 1


l Attach a Tip between the gripper fingers.
l Touch the Gripper X/Y Tip Pos. 1 button in the screen as shown in Fig.6.1.11-2.
l Having attached a Tip, adjust the position so that the Tip end remains at the center of the hole.

+ Carry out the Pipetter/Gripper Check


In order to confirm that the automatic adjustment has been completed successfully, carry out the Pipetter /Gripper
Check by touching the corresponding button as shown in Figs. 6.1.10-1/2, Fig. 6.1.12-1, Fig. 6.1.12-2, or
Fig. 6.1.12-3.
l Load three (3) magazines filled with Tips and three (3) magazines filled with vessels.
l Mount the System Water Container fill with system water (max. 3.5 Liters).
l Make sure that the Waste Box Tray is mounted correctly.
Carry out mechanical reset of the waste number counter by detaching the Waste Box Tray.
l Make sure that the Liquid Waste Container is mounted correctly.
l System Reagent AB/CC Bottles are not to be mounted.

V 1.6 – April 1999 7 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

If you ignore a Pipetter LLD function which means LLD functions, but no liquid handling
functions during the Pipetter/Gripper Check, the following need not be prepared.
If an LLD error takes place in normal condition.
l Thirty (30) Hitachi Sample Cups filled with tap water.
l Eighteen (18) RackPacks filled with tap water.

l Make sure that the instrument is in Stand-by status.


l Touch the RESET button in the Maintenance screen.
l Touch the Pipetter/Gripper Check button in the screen as shown in Figs. 6.1.10-1/2.
l After touching the button in the screen, a pop-up window appears.
l Input a number of repetitions up to 180 and touch the OK button.
l Press the START button on the UI.
l Then confirm the mechanical reliability of the gripper movement.

V 1.6 – April 1999 8 Chapter 6.1.11


RD/Hitachi Elecsys 2010 Service Manual

6.1.12 Service

How to select a Service function


l Touch the Service button in the Util screen.
l After touching the button in the Util screen, a pop-up window appears as shown in Fig. 6.1.12-1.
l The password is “11111111” and is not editable for each service engineer.

Operator-Id: 47 Stand-by 07:40


Service Admin
Util

PassWord ?

Ok Cancel

Fig. 6.1.12-1 Pop-up window

Operator-Id: 47 Stand-by 07:40


Service Results QC Status Admin
Util

Adjustment Adjustment Adjustment Adjustment


Pipetter Sipper S.Disk Tip/Vessel Rack
R.Disk B.Mix C.Opener BCR Carrier

BCR Service
Setup Setup

Service Service Monitoring


Maintenance F/D Utility Sensor

Fig. 6.1.12-2 Service screen (for rack sampler)

Chapter 6.1.12 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.12.1 Manual Adjustment


The three manual adjustment screens are shown below (Figs. 6.1.12-3, 6.1.12-4 and 6.1.12-5). For details of
the adjustment (adjustment items, what is to be confirmed), refer to the table in Chapter 4.5.1 “Mechanical
Adjustment”.
How to select a unit to be adjusted in the Manual Adjustment screens
Manual adjustment functions are available on three screens together with mechanical unit check functions for
some units. Each of them corresponds to a button in the manual adjustment screens. Touch one of the
manual adjustment buttons in the Service screen in order to display the screen. After touching a button in one
of the manual adjustment screens, a pop-up window appears in the screen.

Stand-by Operator ID: 01 10:04


Service Adjustment B.Mix Util
Pipetter R.Disk

Reagent Disk Reagent Disk Reagent Disk Reagent Disk Beads M ixer-R
Pos.1 R1 Beads Beads Mixing Wash
-3 -5 0 -1 3

Beads Mixer-R Beads Mixer Pipetter-x Pipetter-x Pipetter-x


Mix U/D P1 wash Beads
-5 2 -3 -1 -2

Pipetter-x Pipetter-x Pipetter-x Pipetter-x


R1 R2 Rack Sampling VB
6 2 -4 -3

Pipetter-z Pipetter-z Pipetter-z Pipetter-z


T/V Buffer T/V Bottom Beads Bottom Rack S.Cup
-20 -20 -10 Bottom -15

Rack Pack Beads Pipetter


Open/Close Mixing Pipetter /Gripper
Cap Check

Fig. 6.1.12-3 Manual adjustment screen 1

V 1.6 – April 1999 2 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

Stand-by Operator ID: 01 10:04

Service Adjustment Sipper Util


C. Opener BCR

Cap Opener Cap Opener Cap Opener BCR


F/B Cap U/D Home U/D Cap R.Disk
-4 -2 0 -1

Sipper-x Sipper-x Sipper-x


CC2 Wash Sipping
0 -1 5

Sipper-z Sipper-z Sipper-z


Sipper-z Incubator AB1 Bottom CC2 Bottom
Incubator -15 Bottom -20 -20 -20

Rack Pack Rack Pack Pipetter


Open/Close BC Scanning /Gripper
Cap Check

Fig. 6.1.12-4 Manual Adjustment screen 2

Chapter 6.1.12 3 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Stand-by Operator ID: 01 10:04


Service Adjustment Util
Tip/Vessel Carrier

Gripper X/Y Gripper X/Y Gripper X/Y Gripper X/Y Gripper X/Y
TM Front TM Back VM Left Sipping Incubator
x: 8 y: 2 x: 8 y: 2 x: 8 y: 4 y: 5

Gripper X/Y Gripper X/Y


Tip Pos.1 V. Buffer
x: 3 y: 2 x: 5 y: -1

Gripper Z Gripper Z
Sipping V. Buffer
z: 1 z: 5

Gripper Gripper Pipetter


Quick Check Repetion Check /Gripper
Check

Fig. 6.1.12-5 Manual adjustment screen 3

In principle, the manual adjustment be carried out according to the following steps.
1. Touch a button corresponding to the unit and the position to be adjusted.
2. A pop-up window appears in which there are a maximum of most six buttons: OK, Cancel and two or
four buttons for the horizontal or vertical movement (Right, Left, Up, Down, Back, Forward).
3. At the same time the unit moves to the position where the adjustment should take place.
4. Adjust the mechanical unit position by pressing buttons for the horizontal or vertical movement.
5. After adjusting so that the gripper seems to stay in the best position, additionally move the unit
according to the offset value described in the Table in Chapter 4.5.1 for the positions for which the
offset values are defined (only some gripper positions).
6. Press the OK button when you are sure you have completed the adjustment successfully. If not, press
Cancel.
7. The pop-up window closes and the unit moves to the adjusted position when you touch the OK button.

V 1.6 – April 1999 4 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

The adjustment parameters are updated when you close an adjustment by pressing the OK button. This
update is carried out even if an error takes place while the mechanical unit is moving after the OK button has
been touched. The adjustment parameters are displayed in the buttons in the three screens for the adjustment.
By the time that the unit arrives at the position where the adjustment takes place, touching the buttons is no
longer effective. If the initial movement or the movement triggered by touching one of the buttons for the
movement is suspended for some reason, e.g. an error, the pop-up window can only be closed using the
Cancel button.

Usually the database update takes place in both the SRAM and FD as long as FD writing is available.

Note
If alarm message 41-01-03 “FD Write Error” appears, the adjustment file is not on the FD. The new
adjustment value is nevertheless stored in the SRAM.

Perform the FD Write function to backup the adjustment file (adjust.dat) to the FD.

If error 41-01-03 occurs again, check the FDD or refer to the error list (Chapter 7).

6.1.12.2 Adjustment Rack

1) How to select a unit to be adjusted in the Adjustment Rack screen


Touch the Adjustment Rack button in the Service screen to display the screen. After touching a button in the
Adjustment Rack screen, a pop-up window appears in the screen.
In principle, the Adjustment Rack is carried out in the same manner as described in Chapter 6.1.12.1. For
details of the adjustment, refer to the Table in Chapter 4.5.2.

Operator-Id: 47 Stand-by 07:40


Adjustment
Service Adjustment Admin
Rack Sampler Util
Rack

A Line A Line :Set a Tray with a Rack.


Loading Pos B Line :Set a Rack at STAT position.
3

B Line B Line B Line


Sampling Pos Unloading B.C.R Auto
5 -4 -10

Sampler
Check

Fig. 6.1.12-6 Adjustment Rack screen

Chapter 6.1.12 5 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

The following table summarizes the Adjustment Rack.

Table 6.1.12-1 Summary of the Adjustment Rack

Unit Position Preparation Adjustment


A Line Loading Pos. 1. Set a tray with a rack on the A line. Right + /Left -
B Line Sampling 1. If there is a rack on the line, remove it. Front - /Back +
Pos.
2. Set a rack with a tube in the position 1 of
the rack at the STAT position.
Unloading 1. If there is a rack on the line, remove it. Front - /Back +
Pos. 2. Set a rack with a tube in the position 1 of
the rack at the STAT position.
BCR 1. If there is a rack on the line, remove it Automatic
Reading
2. Set a rack with five tubes with BC labels at Adjustment
Pos. the STAT position.

Adjustment Rack for Rack Sampler connected to CLAS 1 System

How to select a unit to be adjusted in the Adjustment Rack screen


Touch the Adjustment Rack button in the Service screen to display the screen. After touching a button in the
Adjustment Rack Sampler screen, a pop-up window appears in the screen. In principle, the Adjustment Rack
for Rack Sampler connected to CLAS 1 System is carried out in the same manner as for the Rack
Sampler/Rack Conveyor System.
Operator-Id: 47 Stand-by 07:40
Adj ustment
Service Adjustment Admin
Util
Rack Sampler Rack

A Line Set a Tray with a Rack.


Loading Pos
3

B Line B Line B Line Turn Table Turn Table


Sampling Pos Unloading B.C.R Auto Home End Pos
5 -4 -10 -4 3

Sampler
Check

Fig. 6.1.12-7 Adjustment Rack screen

V 1.6 – April 1999 6 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

The following table summarizes the Adjustment Rack for the System.
Table 6.1.12-2 Summary of the Adjustment Rack

Unit Position Preparation Adjustment


A Line Loading Pos. Set a tray with a rack on the A line. Right + / Left -
B2 Line Sampling Set a rack with a tube in the position 1 of the Front - / Back +
Pos. rack on the A line.
Unloading Set a rack with a tube in the position 1 of the Front - /Back +
Pos. rack on the A line.
BCR Set a rack with 5 primary tubes which attached Automatic
Reading barcode label on the A line. Adjustment
Pos.
Turntable C Home Pos. no preparation is necessary CW + / CCW -
End Pos. no preparation is necessary CW + / CCW -

6.1.12.3 BCR Setup

There are three BCR Setup functions corresponding to a button in the screen shown in Fig. 6.1.12-8.
Note) The BCR Setup should be carried out if you replace the BCR itself.

Operator-Id: 47 Stand-by 07:40


BCR Setup Admin
Service BCR Setup Util

Initialize Check Digit Rack-Id Read


Digit

Fig.6.1.12-8 BCR Setup screen

Chapter 6.1.12 7 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

1) Initialize
The BCR Initialize function is to be carried out as follows when you replace the BCR.
l Touch the Initialize button in the BCR Setup screen (see Fig. 6.1.12-8).
l After touching the button in the BCR Setup screen, a pop-up window appears as in Fig. 6.1.12-9.
l Touch the OK button to complete the BCR Initialize function.

Operator-Id: 47 Stand-by 07:40


Barcode
ServiceReader BCR Setup Admin
Util
Setup

Barcode Reader Initialize

Send Initial Parameter ?

Initialize Che

Ok Cancel

Fig. 6.1.12-9 Pop-up window for Initialize

Note) 1. The FLASH memory in the BCR has a lifetime of up to 1000 storage times.
Therefore, the Initialize and Check Digit functions should not be carried out too often.
2. The above items are stored into the FLASH memory of the BCR even if you
switch the instrument off.
3. The trigger mode of BCR was changed from Auto trigger to Manual trigger, when
the version of the software changed from V01-19 to V01-27 or later.
Therefore, carry out the initialize function if you change the version of the software from
V01-19 to another version. Once the trigger mode is changed from Auto to Manual, it is no longer
possible to return to Auto trigger.

V 1.6 – April 1999 8 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

2) Check Digit
Four Sample BCR decode functions are available.
Code39, Interleaved 2 of 5, Codabar(NW-7) and Code128 correspond to a button in the Check Digit screen shown
in Fig. 6.2.8-4. Code128 is automatically available.

l Touch the Check Digit button in the BCR Setup screen shown in Fig. 6.1.12-8.
l After touching the button in the BCR Setup screen, a Check Digit pop-up window appears as
shown in Fig. 6.1.12-10.
l Select a Check Digit according to the Barcode label required by the customer by touching the appropriate
button.
l Touch the Send button if OK.

Operator-Id: 47 Stand-by 07:40


Barcode
ServiceReader BCR Setup Admin
Util
Setup

Sample Barcode Reader Setup (Check digit)

Code 39 Interleaved 2 of 5 Codabar(NW-7)

Check Check Modulo 16


(AIM)

NoCheck No Check Modulo 10

No Check

Send Cancel

Fig. 6.1.12-10 Check Digit Popup screen

Note) 1.On instruments serial no. 0701-01 to 0701-60 only the “Module10” or
“No Check” function can be selected.
2. The FLASH memory in the BCR has lifetime of up to 1000 storage times.
Therefore, the Initialize and Check Digit functions should not be carried out too often.
3.The above items are memorized into the FLASH memory of the BCR even if you
switch the instrument off.
4.The user is recommended to use a bar code label that contains a check digit in order to
ensure reliable bar code reading.

Chapter 6.1.12 9 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

3) Rack-Id Read Digit


This function is not available for the disk version.
l Touch the Rack-Id Read Digit button in the BCR Setup screen as shown in Fig. 6.1.12-8.
l After touching the button in the BCR Setup screen, a Rack-Id setup pop-up window appears
as shown in Fig. 6.1.12-11.
l Select a digit number for Rack-Id reading.
l Touch the OK button after selecting the number.

Operator-Id: 47 Stand-by 07:40


BCR Setup BCR Setup Admin
Service Util

Rack-Id Setup

Digits of Rack-Id :
Initialize Che
3 4 5

Ok Cancel

Fig. 6.1.12-11 Digit Pop-up window

V 1.6 – April 1999 10 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

6.1.12.4 Service Setup

There are three functions available for service activities as follows.

Operator-Id: 47 Stand-by 07:40


Service Setup QC Status Admin
Util

Overall Cell
Test counter Test counter Effective
Reset Reset signal

Fig.6.1.12-12 Service Setup screen

(1) Overall Test counter Reset

This function resets the Test Counter by touching the button.


After resetting the Test Counter, confirm the action in the Instrument Setup screen.
The counter should not normally be reset, since it allows the total number of cycles performed on the instrument to
be checked.

(2) Cell Test counter Reset

This function resets the Measuring Cell Test Counter by touching the button. The cell test counter should be reset if
the measuring cell is exchanged.
After resetting the Measuring Cell Test Counter, confirm the action in the Instrument Setup screen.

(3) Effective signal

This function prints out an Effective Signal [count] for the test result by touching the button when you want to know
the count for detailed service activities.
Note:
This function should only be used for service activities. The number of total results to be stored in the database is
lower when this function is activated.

Chapter 6.1.12 11 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

6.1.12.5 Service Maintenance


(1) System Volume Check
System Volume Check is a maintenance function that measures the system volume and updates the flag
corresponding to the system volume in the database.
Only Start and Close buttons are available in the pop-up window.
The function must always be carried out when a part of the sipper line (sipper probe, tubing, heat pipe
or measuring cell) is replaced. Place ProCell and CleanCell bottles in system reagent position 1 when you
start this function. About 140 ml water and 5 ml assay buffer are needed to carry out the System Volume
Check function once. For further details refer to Chapter 3.2.2.

Operator-Id: 47 Stand-by 07:40


Service Maintenance
Service Maintenance QC Status Admin
Util

System
Volume
Check

Fig. 6.2.12-13 Service Maintenance screen

V 1.6 – April 1999 12 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

6.1.12.6 Service FD Utility


There are five FD Utility functions which correspond to a button in the screen shown in Fig. 6.1.12-14.

Operator-Id: 47 Stand-by 07:40


F/D Utility F/D Utility QC Status Admin
Service Util

System
Specific Backup
FD Write Ref. Data Adj. Data
Data Read Read Read

Rack Adjust
Data Read

Fig. 6.1.12-14 F/D Utility screen (for rack system/CLAS 1)

Chapter 6.1.12 13 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

1) System Specific Data Read


The System Specific Data Read function uploads thirty-four kinds of files for an Assay Performance Check from the
FD into the SRAM of the instrument.
l Touch the System Specific Data Read button in the screen as shown in Fig. 6.1.12-14.
l After touching the button in the screen, a pop-up window appears as shown in Fig. 6.1.12-15.
l Touch the Start button to complete the System Specific Data Read function.

Operator-Id: 47 Stand-by 07:40


FService
/D Utility F/D Utility Admin
Util

Confirmation

Want to start"System
Specific Data Read"?

Start Close

Fig. 6.1.12-15 Pop-up window for System Specific Data Read

2) FD Write
The FD Write function downloads thirty-four kinds of files for an Assay Performance Check from the SRAM
into the FD.
l Touch the FD Write button in the screen as shown in Fig. 6.1.12-14.
l After touching the button in the screen, a pop-up window appears as shown in Fig. 6.1.12-16.
l Touch the Start button to complete the Back Up function.

Note
This is the same function as in the maintenance screens used to copy the database to the FD.
Procedure: Insert an empty DOS-formatted 1.44 MB disk (we recommend using HD disks). Start the FD write
function. After writing has finished, a copy or the original disk may be used.

V 1.6 – April 1999 14 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

Operator-Id: 47 Stand-by 07:40


F/D Utility
Service F/D Utility Admin
Util

Confirmation

Want to start"Back
"FD Up"?
write"?

Start Close

Fig. 6.1.12-16 Pop-up window for FD Write

3) Reference Data Read


The Ref. Data Read function uploads “Refer.dat” and “Param.dat” which were created by RD from the FD
into the SRAM of the instrument.
l Touch the Ref. Data Read button in the screen as shown in Fig. 6.1.12-14.
l After touching the button in the screen, a pop-up window appears as shown in Fig. 6.1.12-17.
l Touch the Start button to complete the Ref. Data Read function.
Operator-Id: 47 Stand-by 07:40
F/D Utility
Service F/D Utility Admin
Util

Confirmation

Want to start"Ref.Data Read"?

Start Close

Fig. 6.1.12-17 Pop-up window for Ref. Data Read

Chapter 6.1.12 15 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

4) Adjustment Data Read


The Adjustment Data Read function uploads “Adjust.dat” and “Analysis.dat” from the FD into the SRAM of the
instrument.
l Touch the Adj. Data Read button in the screen as shown in Fig. 6.1.12-14.
l After touching the button in the screen, a pop-up window appears as shown in Fig. 6.1.12-18.
l Touch the Start button to complete the Adj. Data Read function.

Operator-Id: 47 Stand-by 07:40


F/D Utility
Service F/D Utility Admin
Util

Confirmation

Want to start"Adj. Data Read"?

Start Close

Fig. 6.1.12-18 Pop-up window of Adj. Data Read

5) Rack Adjust Data Read


The Rack Adjust Data Read function uploads just adjustment data for lines of the Rack Sampler or Rack
Conveyor from the FD into the SRAM of the instrument.
l Touch the Rack Adjust Data Read button in the screen as shown in Fig. 6.1.12-14.
l After touching the button in the screen, a pop-up window appears.
l Touch the Start button to complete the Rack Adjust Data Read function.

V 1.6 – April 1999 16 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

6.1.12.7 Monitoring Sensors

This function is additionally available for the Rack Sampler/Rack Sampler connected to CLAS 1 System. There are
two screens for each Rack Sampler Unit on the Rack Sampler System and Rack Sampler connected to CLAS 1
System.

1) How to select the Monitoring Sensors function

Touch the Monitoring Sensors button in the Service screen.

- Rack Sampler System

Operator-Id: 47 Monitoring Sensors 07:40


Monitoring
Service Sensors Monitoring sensors Admin
Util

A Line A Line A Line B Line B Line


Tray Home Loading End Home Loading End

B Line B Line B Line B Line B Line


Rack Stat Sampling B.C.R Cup

C Line C Line C Line C Line C Line


Home Lo adi ng End Rack Full Tray Tray Full 1

C Line
Tray Full 2

Monitoring
Stop

or

Monitoring
Start

Fig. 6.1.12-19 Monitoring Sensors screen for Rack Sampler System

l Select the Monitoring Start or Stop button.


After touching the Monitoring Start button, the energy of the motors are OFF.
After touching the Monitoring Stop button, the energy of the motors are ON.
l Select the sensor you want to check by touching a button.
l Check whether color of the button changes when the sensor detects. See Table 6.1.12-3.

Chapter 6.1.12 17 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Table 6.1.12-3 Sensors corresponding to the buttons

Unit Sensor No. Button name Remarks


A Line PI200 A Line Tray Tray Detection
PI201 Home Home Pos. Detection
PI202 Loading End Rack Feed End Pos. Detection
B Line PI210 B Line Home Home Pos. Detection
PI211 Loading End Rack Feed End Pos. Detection
PI212 Rack Rack Detection
PI213 Stat STAT Pos. Detection
PI215 Sampling Sampling Pos. Detection
PI216 B.C.R BCR Read Pos. Detection
PI217 Cup Cup Detection
C Line PI221 C Line Home Home Pos. Detection
PI222 Loading End Rack Feed End Pos. Detection
PI223 Rack Full Rack Full Detection
PI224 Tray Tray Detection
PI225 Tray Full 1 Tray Full 1 Detection
PI226 Tray Full 2 Tray Full 2 Detection

- Rack Sampler connected to CLAS 1 System

Operator-Id: 47 Monitoring Sensors 07:40


Monitoring
Service Sensors Monitoring Sensors Admin
Util

A Line A Line A Line B Line B Line B Line B Line


Tray Home End Home End Rack Entrance

B Line B Line B Line B Line C Line C Line C Line


Sampling B.C.R Cup Receive Home End Rack
Full

C Line C Line C Line Turn Belt Turn Belt Rotation Rotation


Tray Tray Tray Rack 310 Rack 311 Home End
Full 1 Full 2

I Line I Line I Line I Line


Entrance Buffer Home End

Monitoring
Stop

or

Monitoring
Start

Fig. 6.1-12-20 Monitoring Sensors screen for Rack Sampler connected to CLAS 1 System

V 1.6 – April 1999 18 Chapter 6.1.12


RD/Hitachi Elecsys 2010 Service Manual

l Select the Monitoring Start or Stop button.


After touching the Monitoring Start button, the energy of the motors are OFF.
After touching the Monitoring Stop button, the energy of the motors are ON.
l Select the sensor you want to check by touching a button.
l Check whether color of the button changes when the sensor detects. See Table 6.1.12-4.

Table 6.1.12-4 Sensors corresponding to the buttons

Unit Sensor No. Button name Remarks


A Line PI200 A Line Tray Tray Detection
PI201 Home Home Pos. Detection
PI202 Loading End Rack Feed End Pos. Detection
B Line PI210 B Line Home Home Pos. Detection
PI211 Loading End Rack Feed End Pos. Detection
PI212 Rack Rack Detection
PI215 Sampling Sampling Pos. Detection
PI216 B.C.R BCR Read Pos. Detection
PI217 Cup Cup Detection
C Line PI221 C Line Home Home Pos. Detection
PI222 Loading End Rack Feed End Pos. Detection
PI223 Rack Full Rack Full Detection
PI224 Tray Tray Detection
PI225 Tray Full 1 Tray Full 1 Detection
PI226 Tray Full 2 Tray Full 2 Detection
B Line PI218 B Line Entrance Rack Entrance Detection
PI213 Receive Rack Receive Detection
Turntable C PI310 Turntable C Rack310 Rack 1 Detection
(Belt) PI311 (Belt) Rack311 Rack 2 Detection
Turntable C PI312 Turntable C Home Home Pos. Detection
(Rotation) PI313 (Rotation) End End Pos. Detection
I Line PI302 I Line Entrance Rack Entrance Detection
PI303 Buffer Rack Buffer Detection
PI300 Home Home Pos. Detection
PI301 End End Pos. Detection

Chapter 6.1.12 19 V 1.6 – April 1999


7. Troubleshooting

7.1 Alarms List


7.1.1 Reagent Disk
7.1.2 Cap Opener
7.1.3 Beads Mixer
7.1.4 Bar Code Reader
7.1.5 Sample Disk
7.1.6 Pipetter
7.1.7 Pipetter Syringe
7.1.8 Gripper
7.1.9 Solid Waste
7.1.10 Sipper
7.1.11 Sipper Syringe
7.1.12 Magnet Drive
7.1.13 Pipetter Buffer
7.1.14 Flow Path and Others
7.1.15 Motor Controller
7.1.16 Motor Controller (Timeout)
7.1.17 ADC , DC, Power Supply , Fuse
7.1.18 Pipetter LLD, Temperature Control and Others
7.1.19 Floppy Disk Drive, Printer, User Interface and Host Communication
7.1.20 Inventory
7.1.21 Rack Sampler/Rack Sampler Connected to CLAS 1 System

7.2 Data Alarms


- Data Alarms List

7.3 Troubleshooting List


7.3.1 Reagent Disk
7.3.2 Cap Opener
7.3.3 Beads Mixer
7.3.4 Bar Code Reader
7.3.5 Sample Disk
7.3.6 Pipetter Mechanism
7.3.7 Pipetter / Sipper Syringe
7.3.8 Gripper Mechanism
7.3.9 Solid Waste
7.3.10 Sipper Mechanism
7.3.11 Magnet Drive Mechanism
7.3.12 Pipetter Buffer
7.3.13 Distilled Water Float Switch
7.3.14 System Reagent Unit
7.3.15 Liquid Waste Mechanism
7.3.16 Troubleshooting List for Rack Sampler System
7.1.17 Troubleshooting List for Rack Sampler Connected to CLAS 1 System

7.4 Data File Load Errors

7.5 Quality Control Check


RD/Hitachi Elecsys 2010 Service Manual

7. Troubleshooting

7.1 Alarms List


This is an explanation of the alarm levels (P. Stop, S. Stop, Stop, E. Stop) in the alarm list.
1. P. Stop (Partial Stop)
Stops the mechanism that is the cause of the trouble, and the others move generally operation.
2. S. Stop (Sampling Stop)
Stops rotation of sample disk and aspirating movement of pipetting from sample disk.
3. Stop
System removes Stand-by after, it finished movement of all mechanisms in this cycle when happen trouble.
4. E. Stop
Cuts off DC 24 V power supply and all mechanisms stop moving.

7.1.1 Reagent Disk


Error Code Mechanism Level Alarm Description Remedy
11_01_01 Reagent Stop The reagent disk did not move out of the 1. Check home position detector
Disk home position while the instrument was (PI021, GP1A34LC) signal,
resetting itself. then replace if it is defective.
: Home Position detection, (mode 3-1) 2. Replace Motor (SM021).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
11_01_02 Stop The reagent disk did not reach or stop at 1. Check home position detector
the home position while the instrument (PI021, GP1A34LC) signal,
was resetting itself. and replace if defective.
: Home Position detection, (mode 3-2) 2. Replace motor (SM021).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
11_01_03 Stop The reagent disk did not reach or stop at 1. Check count detector (PI022,
Position 1 while the instrument was GP1A334LC) signal and replace
resetting itself. if defective.
: Count detection, (mode 5-1,5-2) 2. Replace motor (SM021).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
11_01_05 P.Stop The reagent disk did not reach or stop at 1. Check count detector (PI022,
/Stop the R2 (Cap/Open position) position GP1A334LC) signal and replace
correctly. However, this does not apply if defective.
when the reagent disk rotates from R1 2. Replace motor (SM021).
position to R2 position in CCW rotation. 3. Replace DO2 PCB.
: Count detection, (mode 2-1) 4. Replace EMOT110 PCB.
11_01_07 P.Stop The reagent disk did not reach or stop at 1. Check count detector (PI022,
/Stop the beads mixing position correctly. GP1A334LC) signal and replace
: Count detection, (mode 5-1,5-2) if defective.
2. Replace motor (SM21,
KH56HM2-503).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
11_01_09 P.Stop The reagent disk moved from the R2 1. Check count detector (PI022,
/Stop (Cap/Open position) position. GP1A334LC) signal and replace
It is detected just before cap opener if defective.
moves. 2. Replace motor (SM21,
: Count detection, (mode 1-1) KH56HM2-503).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.

V 1.6 – April 1999 1 Chapter 7.1.1


RD/Hitachi Elecsys 2010 Service Manual

7.1.2 Cap Opener

Error Code Mechanism Level Alarm Description Remedy


12_01_01 Cap Stop The cap opener did not move out of the 1. Check home position detector
Opener F/B home position while the instrument (PI031, GP1A34LC), and replace.
F/B was resetting itself. 2. Replace the motor (SM031) for
: F/B Home detection L1, (mode 1-1) front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_02 Stop The cap opener did not reach or stop at 1. Check home position detector
the F/B home position while the (PI031, GP1A34LC) signal, and
instrument was resetting itself. replace.
: F/B Home detection L1, (mode 2-1) 2. Replace the motor (SM031) for
front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_03 Stop The cap opener did not move out of the 1. Check capping position detector
F/B capping position while the instrument (PI032, GP1A34LC) signal, and
was resetting itself. replace.
: F/B position detection L2, (mode 1-1) 2. Replace the motor (SM031) for
front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
Stop The cap opener did not reach or stop at 1. Check capping position detector
12_01_04 the F/B capping position correctly while (PI032, GP1A34LC), and replace.
the instrument was resetting itself. 2. Replace the motor (SM031) for
: F/B position detection L2, (mode 2-1) front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_05 P.Stop The cap opener did not reach or stop at 1. Check home or capping position
/Stop either the F/B home position or the F/B detector (PI031,PI032, GP1A34LC)
capping position. signal, and replace.
: F/B Home detection L1 or F/B position 2. Replace the motor (SM031) for
detection L2, (mode 2-1) front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_06 P.Stop The cap opener did not reach or stop at 1. Check position detector (PI032,
/Stop the F/B home position. GP1A34LC) signal, and replace.
: F/B Home detection L1, (mode 5-1,5-2) 2. Replace the motor (SM031) for
front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_07 P.Stop The cap opener did not reach or stop at 1. Check position detector (PI032,
/Stop the F/B capping position. GP1A34LC) signal, and replace.
: F/B position detection L2, (mode 5-1,5- 2. Replace the motor (SM031) for
2) front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter 7.1.2


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


12_01_08 Cap P.Stop The cap opener did not reach or stop 1. Check home position detector
Opener /Stop at the F/B Opening/Closing position. (PI031, GP1A34LC) signal, and
F/B : F/B Home detection L1, (mode 1-1) replace.
2. Replace the motor (SM031) for
front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_01_09 P.Stop The cap opener did not reach or stop 1. Check capping position detector
/Stop at the F/B Opening/Closing position. (PI032, GP1A34LC) signal, and
: F/B position detection L2, (mode replace.
1-1) 2. Replace the motor (SM031) for
front/back movement.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_01 Cap Stop The cap opener did not move out of 1. Check home position detector
Opener the rotational home position while the (PI033, GP1A34LC) signal, and
U/D instrument was resetting itself. replace.
: U/D Home detection L3, (mode 1-1) 2. Replace the motor (SM032) for
hook rotation.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_02 Stop The cap opener did not reach or stop 1. Check home position detector
at the rotational home position while (PI033, GP1A34LC), and replace.
the instrument was resetting itself. 2. Replace the motor (SM032).
: U/D Home detection L3, (mode 2-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_03 P.Stop The cap opener did not reach or stop 1. Check home position detector
/Stop at the rotational home position. (PI033, GP1A34LC), and replace
: U/D Home detection L3, (mode 5-1, if defective.
5-2) 2. Replace the motor (SM032).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_05 P.Stop The cap opener did not reach or stop 1. Check home position detector
/Stop at the rotational closing position. (PI033, GP1A34LC), and replace.
: U/D Home detection L3, (mode 1-1) 2. Replace the motor (SM032).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_06 P.Stop The cap opener did not reach or stop 1. Check home position detector
/Stop at the rotational capping position. (PI033, GP1A34LC), and replace
: U/D Home detection L3, (mode 1-1) if defective.
2. Replace the motor (SM032).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
12_02_07 P.Stop The cap opener moved out of the ditto
/Stop rotational home position.
: U/D Home detection L3, (mode 2-1)

Chapter 7.1.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.3 Beads Mixer

Error Code Mechanism Level Alarm Description Remedy


13_01_01 Beads Stop The beads mixer did not move out 1. Check home position detector
Mixer of the rotational home position (PI041, GP1A34LC) signal and
rotational while the instrument was resetting replace.
movement itself. 2. Replace the rotation motor
: Home Position (Washing Pos.) (SM041).
detection P2, (mode 1-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_01_02 Stop The beads mixer did not reach or 1. Check home position detector
stop at the rotational home position (PI041, GP1A34LC) signal and
while the instrument was resetting replace.
itself. 2. Replace the rotation motor
: Home Position (Washing Pos.) (SM041).
detection P2, (mode 2-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_01_03 P.Stop The beads mixer did not reach or 1. Check home position detector
/Stop stop at the rotational home (PI041, GP1A34LC) signal and
position. replace.
: Home Position (Washing Pos.) 2. Replace the rotation motor
detection P2, (mode 5-1,5-2) (SM041).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_01_04 P.Stop The beads mixer did not reach or 1. Check mixing position detector
/Stop stop at the rotational mixing (PI042, GP1A34LC) signal and
position. replace.
: Mixing Position detection P3, 2. Replace the rotation motor
(mode 5-1,5-2) (SM041).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_01_05 P.Stop The beads mixer moved out of the 1. Check home position detector
/Stop rotational home position when (PI041, GP1A34LC) signal and
mixing started. replace.
: Home Position (Washing Pos.) 2. Replace the rotation motor
detection P2, (mode 2-1) (SM041).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter7.1.3


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


13_02_01 Beads Stop The beads mixer did not move out 1. Check home position detector
Mixer of the vertical home position while (PI043, GP1A34LC) signal and
vertical the instrument was resetting itself. replace.
movement : Home Position detection P1, 2. Replace arm up/down motor
(mode 1-1) (SM042).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_02_02 Stop The beads mixer did not reach or 1. Check home position detector
stop at the vertical home position (PI043, GP1A34LC) signal and
while the instrument was resetting replace.
itself. 2. Replace arm up/down motor
: Home Position detection (SM042).
P1,(mode 2-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_02_03 P.Stop The beads mixer did not reach or 1. Check home position detector
/Stop stop at the vertical home position. (PI043, GP1A34LC) signal and
: Home Position detection P1, replace.
(mode 5-1,5-2) 2. Replace arm up/down motor
(SM042).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_02_04 P.Stop The beads mixer did not reach or 1. Check home position detector
/Stop stop at the vertical mixing position (PI043, GP1A34LC) signal and
or at the vertical washing position replace.
other than in home position. 2. Replace arm up/down motor
: Home Position detection P1, (SM042).
(mode 1-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
13_02_05 P.Stop The beads mixer moved out of the 1. Check upper dead position detector
/Stop vertical home position. (PI043,GP1A34LC) signal and
: Home Position detection P1 replace if defective.
2. Remove any blockages.
3. Replace arm up/down motor
(SM042).
4. Replace DO1 PCB.
5. Replace EMOT110 PCB.
6. Replace EIO PCB.

Chapter 7.1.3 2 V April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.4 Barcode Reader

Error Code Mechanism Level Description Remedy


14_01_01 Bar Code P.Stop The bar-code reader did not move out of 1. Check home position detector
Reader /Stop the home position (R. disk) while the (PI151, GP1A34LC) signal, and
instrument was resetting itself. replace.
: Home Position detection, (mode 1-1) 2. Replace the motor (SM151)
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
14_01_02 P.Stop The bar-code reader did not reach or 1. Check home position detector
/Stop stop at the home position (R. disk) while (PI151, GP1A34LC) signal, and
the instrument was resetting itself. replace.
: Home Position detection, (mode 2-1) 2. Replace the motor (SM151)
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
14_01_03 Stop The bar-code reader did not reach or 1. Check home position detector
stop at the home position (R. disk). (PI151,GP1A34LC) signal, and
: Home Position detection, (mode 5-1, replace.
5-2) 2. Replace the motor (SM151)
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
14_01_04 P.Stop The bar-code reader did not reach or 1. Check home position detector
/Stop stop at the reading position (other than (PI151,GP1A34LC) signal, and
home position). replace.
: Home Position detection, (mode 1-1) 2. Replace the motor (SM151)
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

Chapter 7.1.4 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.5 Sample Disk

Error Code Mechanism Level Alarm Description Remedy


15_01_01 Sample Stop The sample disk did not move out of the 1. Check home position
Disk home position while the instrument was detector (PI011, GP1A34LC)
resetting itself. and replace.
: Home Position detection, (mode 3-1) 2. Remove any blockages.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
15_01_02 Stop The sample disk did not reach or stop at 1. Check home position
the home position while the instrument was detector (PI012,GP1A34LC)
resetting itself. and replace.
: Home Position detection, (mode 3-2) 2. Remove any blockages.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
15_01_03 Stop The sample disk did not reach or stop at 1. Check count detector (PI012,
Position 1 while the instrument was GP1A34LC) and replace.
resetting itself. 2. Remove any blockages.
: Count detection, (mode 5-1,5-2) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
15_01_04 P.Stop The sample disk did not reach or stop at 1. Check count detector (PI012,
/Stop the sampling position correctly. GP1A34LC) and replace.
: Count detection, (mode 6-1,6-2,6-3) 2. Remove any blockages.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
15_01_05 P.Stop The sample disk did not stop at the 1. Check count detector (PI012,
/Stop barcode reading position correctly. GP1A34LC) and replace.
2. Remove any blockages.
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
15_01_06 P.Stop The sample disk moved out of the 1. Check count detector (PI012,
/Stop sampling position while sampling was GP1A34LC) and replace.
being performed. 2. Replace DO1 PCB.
: Count detection, (mode 2-1) 3. Replace EMOT110 PCB.
4. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter 7.1.5


RD/Hitachi Elecsys 2010 Service Manual

7.1.6 Pipetter

Error Code Mechanism Level Alarm Description Remedy


16_01_01 Pipetter Stop The pipetter did not move out of the 1. Check home position detector
horizontal horizontal home position while the (PI051, GP1A34LC) signal,
movement instrument was resetting itself. and replace.
: X Home detection P1, (mode 1-1) 2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_02 Stop The pipetter did not reach or stop at the 1. Check home position detector
horizontal home position while the (PI051,GP1A34LC) signal,
instrument was resetting itself. and replace.
: X Home detection P1, (mode 2-1) 2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_03 P.Stop The pipetter did not reach or stop at the 1. Check home position detector
horizontal home Position. (PI051, GP1A34LC) signal,
: X Home detection P1, (mode 5-1,5-2) and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_04 P.Stop The pipetter did not move out of the 1. Check home position detector
home position when pipetter moved to (PI051,GP1A34LC) &
the horizontal tip waste position. sample position detector
: X Home P1 & Sampling P2 detection, (PI052, GP1A34LC) signal
(mode 1-1) and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_05 P.Stop The pipetter did not move out of the 1. Check home position detector
home position when pipetter moved to (PI051,GP1A34LC) &
the horizontal vessel position. sample position detector
: X Home P1 & Sampling P2 detection, (PI052, GP1A34LC) signal
(mode 1-1) and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_06 P.Stop The pipetter did not move out of the S 1. Check home position detector
position when pipetter moved to the (PI051,GP1A34LC) &
horizontal DS2 position. sample position detector
: X Home P1 & Sampling P2 detection, (PI052, GP1A34LC) signal
(mode 1-1) and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_07 P.Stop The pipetter did not move out of S 1. Check home position detector
position when pipetter moved to the (PI051,GP1A34LC) &
horizontal DS1 position. sample position detector
: X Home P1 & Sampling P2 detection, (PI052, GP1A34LC) signal
(mode 1-1) and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
16_01_14 P.Stop The pipetter did not reach or stop at the 1. Check home position detector
horizontal sample position . (PI051,GP1A34LC)&
: X Home P1 & Sampling P2 detection, Sample position detector
(mode 5-1,5-2) (PI052, GP1A34LC) signal
and replace.
2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
V 1.6 – April 1999 1 Chapter 7.1.6
RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


16_02_02 Pipetter Stop The pipetter did not reach or stop at the 1. Check home position detector
vertical vertical home position while the (PI054,GP1A34LC) signal
movement instrument was resetting itself. and replace.
: Z Home detection P4, (mode 2-1) 2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_03 P.Stop The pipetter did not reach or stop at the 1. Check home position detector
vertical home position. (PI054, GP1A34LC) signal
: Z Home detection P4, (mode 5-1,5-2) and replace.
2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_04 P.Stop The pipetter did not move downwards. 1. Check home position detector
: Z Home detection P4, (mode 1-1) (PI054,GP1A34LC) signal
and replace.
2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_05 P.Stop The pipetter detected abnormal descent 1. Check abnormal descent
when moving downwards. detector (PI055, TLP830)
: Abnormal Descent detection P5, signal and replace.
(mode 7-1) 2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_06 P.Stop The pipetter detected abnormal descent 1. Check home position detector
when moving upwards. (PI054,GP1A34LC) signal
: Abnormal Descent Detection P5 and replace.
2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_07 P.Stop The pipetter moved out of the vertical 1. Check home position detector
home position when pipetter moved (PI054,GP1A34LC) signal
horizontally. and replace.
: Z Home detection P4, (mode 2-1) 2. Replace the motor (SM052).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
16_02_13 W The pipetter detected abnormal descent 1. Check abnormal descent
when moving downwards at the sample detector (PI055, TLP830)
position during operation. signal and replace.
: Abnormal Descent detection P5, 2. Replace the motor (SM052).
(mode 7-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

Chapter 7.1.6 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.7 Pipetter Syringe

Error Code Mechanism Level Alarm Description Remedy


17_01_01 Pipetter Stop The pipetter syringe did not move out of 1. Check home position detector
Syringe the home position while the instrument was (PI091,GP1A34LC) signal
resetting itself. and replace.
: Home detection, (mode 1-1) 2. Replace the motor (SM091).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
17_01_02 Stop The pipetter syringe did not reach or stop at 1. Check home position detector
the home position while the instrument was (PI091,GP1A34LC) signal
resetting itself. and replace.
: Home detection, (mode 2-1) 2. Replace the motor (SM091).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
17_01_03 P.Stop The pipetter syringe did not reach or stop at 1. Check home position detector
/Stop the home position. (PI091,GP1A34LC) signal
: Home detection, (mode 5-1,5-2) and replace.
2. Replace the motor (SM091).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
17_01_05 P.Stop The pipetter syringe did not move out of 1. Check home position detector
/Stop the home position. (PI091,GP1A34LC) signal
: Home detection, (mode 1-1) and replace.
2. Replace the motor (SM091).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

Chapter 7.1.7 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.8. Gripper

Error Code Mechanism Level Alarm Description Remedy


18_01_01 Gripper X Stop The gripper did not move out of the X 1. Check home position
horizontal horizontal home position while the detector (PI061,TLP830)
movement instrument was resetting itself. signal and replace.
: X Home Position detection P1, (mode 1- 2. Replace the motor (SM061).
1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_01_02 Stop The gripper did not reach or stop at the X 1. Check home position
horizontal home position while the detector (PI061, TLP830)
instrument was resetting itself. signal and replace.
: X Home Position detection P1, (mode 2- 2. Replace the motor (SM061).
1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_01_03 P.Stop The gripper did not reach the X horizontal 1. Check home position
home position during removal as follows; detector (PI061,TLP830)
INC→RP, V→RP, DS1→RP, DS2→RP, signal and replace.
P1→RP, P2→RP, SW→RP 2. Check home position
: X Home Position detection P1, detector (PI062,TLP830) and
(mode 5-1,5-2) replace.
3. Replace the motor (SM061).
4. Replace DO1 PCB.
5. Replace EMOT110 PCB.
6. Replace EIO PCB.
18_01_04 P.Stop The gripper moved out of the X horizontal 1. Check home position
home position during removal as follows; detector (PI061,TLP830)
RP→VC, RP→TC(partly),RP→ INC, signal and replace.
RP→V, RP→DS1, RP→ DS2, RP→ P1, 2. Replace the motor (SM061).
RP→SW 3. Replace DO1 PCB.
: X Home Position detection P1, (mode 4. Replace EMOT110 PCB.
1-1) 5. Replace EIO PCB.
18_01_05 P.Stop The gripper moved out of the X horizontal 1. Check home position
home position during removal between detector (PI061,TLP830)
4 points; signal and replace.
HP, SP, RP, STP. 2. Replace the motor (SM061).
: X Home Position detection P1, (mode 2- 3. Replace DO1 PCB.
1) 4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_01_10 P.Stop The gripper moved out of the X horizontal 1. Check home position
home position. detector (PI061,TLP830)
: X Home Position detection P1, (mode 2- signal and replace.
1) 2. Replace the motor (SM061).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
Note) INC: Incubator pos. , V: Vessel pos.1 on Buffer, DS1: Dilution pos. 1 on Buffer,
DS2: Dilution pos. 2 on Buffer , P1: Tip pos.1 on Buffer, P2: Tip pos.2 on Buffer,
SW: Solid Waste pos. , RP: Rest pos. , TC: Tip magazine , VC: Vessel magazine,
HP: Home pos. , SP : Shunt pos., STP : stand-by pos., SIP: Sipping pos.

V 1.6 – April 1999 1 Chaptor 7.1.8


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


18_02_01 Gripper Y Stop The gripper did not move out of the Y 1. Check home position
horizontal horizontal home position while the detector (PI063,TLP830)
movement instrument was resetting itself. signal and replace.
: Y Home Position detection P3, (mode 2. Replace the motor (SM062).
1-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_02_02 Stop The gripper did not reach or stop at the Y 1. Check home position
horizontal home position while the detector (PI063,TLP830)
instrument was resetting itself. signal and replace.
: Y Home Position detection P3, (mode 2. Replace the motor (SM062).
2-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_02_04 Stop The gripper did not move out of the Y 1. Check home position
horizontal home position while the detector (PI063,TLP830)
instrument was resetting itself, and during signal and replace.
removal as follows; 2. Replace the motor (SM062).
HP→RP 3. Replace DO1 PCB.
: Y Home Position detection P3, mode 1-1) 4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_02_09 P.Stop The gripper did not reach or stop at the Y 1. Check rest position detector
horizontal reset position during removal as (PI065,TLP830) signal and
follows. replace.
TP→RP, SIP→RP, INC→RP, V→RP, 2. Replace the motor (SM062).
DS1→RP, DS2→RP, P1→RP, P2→RP, 3. Replace DO1 PCB.
SW→RP, 4. Replace EMOT110 PCB.
: Y Reset position detection P5, 5. Replace EIO PCB.
(mode 5-1,5-2)
18_02_10 P.Stop The gripper did not move out of the Y 1. Check rest position detector
horizontal reset position during removal (PI065,TLP830) signal and
as follows; replace.
RP→SP, RP→STP, RP→VC, RP→TC, 2. Replace the motor (SM062).
RP→SIP, RP→INC, RP→V, RP→DS1, 3. Replace DO1 PCB.
RP→ DS2, RP→ P1, RP→SW 4. Replace EMOT110 PCB.
: Y Reset Position detection P5, (mode 5. Replace EIO PCB.
1-1)
18_02_13 P.Stop The gripper moved out of the Y horizontal 1. Check rest position detector
reset position. (PI065,TLP830) signal and
: Y Reset Position detection P5, (mode replace.
2-1) 2. Replace the motor (SM062).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

Chapter 7.1.8 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


18_03_02 Gripper Stop The gripper did not reach or stop at the 1. Check home position
vertical vertical home position while the instrument detector (PI066, TLP830)
movement was resetting itself. signal and replace.
: Z Home Position detection P6, (mode 2. Replace the motor (SM063).
2-1) 3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_03_03 P.Stop The gripper did not reach or stop at the 1. Check home position
vertical home position. detector (PI066, TLP830)
: Z Home Position detection P6, signal and replace.
(mode 5-*1,5-2) 2. Replace the motor (SM063).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_03_04 P.Stop The gripper did not move downwards. 1. Check home position
: Z Home Position detection P6, (mode detector (PI066,TLP830)
1-1) signal and replace.
2. Replace the motor (SM063).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_03_05 W The gripper detected an abnormal status 1. Check abnormal status
when moving downwards. detector (PI067,TLP830)
: Abnormal Status detection P7, (mode signal and replace.
7-1) 2. Replace DO1 PCB.
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_03_06 P.Stop The gripper moved out of the vertical 1. Check home position
home position . detector (PI066, TLP830)
The error applies to all X-Y movements signal and replace.
when gripper just moves from the HP, SP, 2. Replace the motor (SM063).
RP, or STP. 3. Replace DO1 PCB.
: Z Home Position detection P6, (mode 4. Replace EMOT110 PCB.
2-1) 5. Replace EIO PCB.
18_04_01 Gripper P.Stop The gripper finger did not close. 1. Check gripper finger detector
finger : Gripper finger detection P8, (mode 2-1) (PI068, TLP830) and
function replace.
2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_04_02 P.Stop The gripper finger did not open . 1. Check gripper finger detector
: Gripper finger detection P8, (mode 1-1) (PI068,TLP830) signal and
replace.
2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_04_03 P.Stop The gripper finger did not find a tip. 1. Check gripper finger detector
: Gripper finger detection P8, (mode 1-1) (PI068,TLP830) signal and
replace.
2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.

V 1.6 – April 1999 3 Chaptor 7.1.8


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


18_04_05 Gripper P.Stop The gripper finger found no vessel. 1. Check gripper finger detector
finger : Gripper finger detection P8, (mode 1-1) (PI068,TLP830) signal and
function replace.
2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_05_01 P.Stop Vessel pick up failed (VB). 1. Check gripper finger detector
/Stop The gripper did not get a vessel at VB (PI068, TLP830) signal and
position. replace.
P.Stop: If the alarm takes place during 2. Replace the gripper solenoid
operation. (DCS061).
Stop: If the alarm takes place out of 3. Replace EMOT110 PCB.
operation. 4. Replace EIO PCB.
18_05_02 W Vessel pick up failed (INC to VB). 1. Check gripper finger detector
The gripper did not get a vessel at (PI068,TLP830) signal and
incubator position before it would carry the replace.
vessel to VB position when operation. 2. Replace the gripper solenoid
3. (DCS061).
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
18_05_03 Stop Vessel pick up failed (INC to VB). 1. Check gripper finger detector
The gripper did not get a vessel at (PI068,TLP830) signal and
incubator position before it would carry the replace.
vessel to 2. Replace the gripper solenoid
VB position when T/M. (DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_05_04 W Vessel pick up failed (IND to SIP). 1. Check gripper finger detector
The gripper did not get a vessel at (PI068,TLP830) signal and
incubator position before it would carry the replace.
vessel to VB position when operation. 2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_05_05 Stop Vessel pick up failed (INC to SIP). 1. Check gripper finger detector
The gripper did not get a vessel at (PI068,TLP830) signal and
incubator position before it would carry the replace.
vessel to VB position when T/M. 2. Replace the gripper solenoid
(DCS061).
3. Replace EMOT110 PCB.
4. Replace EIO PCB.
18_05_06 P.Stop Vessel pick up failed (SIP). 1. Check gripper finger detector
/Stop The gripper did not get a vessel at sipping (PI068,TLP830) signal and
position. replace.
P.Stop: If the alarm takes place during 2. Replace the gripper solenoid
operation. (DCS061).
Stop: If the alarm takes place out of 3. Replace EMOT110 PCB.
operation. 4. Replace EIO PCB.

Chapter 7.1.8 4 V 1.6 – April 1999


BM/Hitachi Elecsys 2010 Service Manual

7.1.9. Solid Waste

Error Code Mechanism Level Alarm Description Remedy


19_01_01 Solid Stop The solid waste mechanism did not move 1. Check home position
Waste out of the home position while the detector (PI141,GP1A34LC)
instrument was resetting itself. signal and replace.
: Home Position detection, (mode 3-1) 2. Replace the motor (SM141).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
19_01_02 Stop The solid waste mechanism did not reach 1. Check home position
or stop at the home position while the detector (PI,141GP1A34LC)
instrument was resetting itself. signal and replace.
: Home Position detection, (mode 3-2) 2. Replace the motor (SM141).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
19_01_03 P.Stop The solid waste mechanism did not reach 1. Check home position
/Stop or stop at the home position. detector (PI,141,GP1A34LC)
: Home Position detection, signal and replace.
(mode 6-1,6-2,6-3) 2. Replace the motor (SM141).
3. Replace DO1 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter 7.1.9


RD/Hitachi Elecsys 2010 Service Manual

7.1.10.Sipper

Error Code Mechanism Level Alarm Description Remedy


20_01_01 Sipper Stop The sipper did not move out of the 1. Check home position
horizontal horizontal end position while the detector (PI081,GP1A34LC)
movement instrument was resetting itself. signal and replace.
: X home detection P1, (mode 1-1) 2. Replace the motor (SM081).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_01_02 Stop The sipper did not reach or stop at the 1. Check home position
horizontal end position while the detector (PI081,GP1A34LC)
instrument was resetting itself. signal and replace.
: X home detection P1, (mode 2-1) 2. Replace the motor (SM081).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_01_03 P.Stop The sipper did not reach or stop at the 1. Check home position
/Stop horizontal home position. detector (PI081,GP1A34LC)
: X home detection P1, (mode 5-1,5-2) signal and replace.
2. Replace the motor (SM081).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_01_07 P.Stop The sipper did not move out of the home 1. Check home position or end
/Stop position or SIP position when moving to position detector
horizontal WA position. (PI081,PI082, GP1A34LC)
: X home position detection P1 or X end and replace.
detection position P2, (mode 1-1) 2. Replace the motor (SM081).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_01_08 P.Stop The sipper did not reach or stop at the 1. Check end position detector
/Stop horizontal SIP position. (PI082,GP1A34LC) signal
: X end (SIP) position detection P2, and replace.
(mode 5-1,5-2) 2. Replace the motor (SM081).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_02_02 Sipper Stop The sipper did not reach or stop at the 1. Check home position
vertical vertical home position while the instrument detector (PI083, GP1A34LC)
movement was resetting itself. and replace.
: Z home detection P4, (mode 2-1) 2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_02_03 P.Stop The sipper did not reach or stop at the 1. Check home position
/Stop vertical home position. detector (PI083,GP1A34LC)
: Z home detection P4, (mode 5-1,5-2) and replace.
2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter 7.1.10


RD/Hitachi Elecsys 2010 Service Manual

Error Code Mechanism Level Alarm Description Remedy


20_02_04 Sipper P.Stop The sipper did not move downwards. 1. Check home position
vertical /Stop : Z home detection P4, (mode 1-1) detector (PI083, P1A34LC)
movement and replace.
2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_02_05 P.Stop The sipper detected an abnormal status 1. Check abnormal detector
/Stop when moving downwards. (PI084, TLP830) and
: Abnormal detection P5, (mode 7-1) replace.
2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_02_06 P.Stop The sipper detected an abnormal status 1. Check home position
when moving upwards. detector (PI083, GP1A34LC)
: Z home detection P4, (mode 1-1) and replace.
2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
20_02_07 P.Stop The sipper moved out of the vertical home 1. Check home position
/Stop position when it moved in a horizontal detector (PI083, GP1A34LC)
direction. and replace.
: Z home detection P4, (mode 2-1) 2. Replace the motor (SM082).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 2 Chapter 7.1.10


RD/Hitachi Elecsys 2010 Service Manual

7.1.11.Sipper Syringe

Error Code Mechanism Level Alarm Description Remedy


21_01_01 Sipper Stop The sipper syringe did not move out of the 1. Check home position
Syringe home position while the instrument was detector (PI101) signal, and
resetting itself. replace.
: Home detection, (mode 1-1) 2. Replace the motor (SM101).
3. Replace DO2 PCB.
4. Replace EMOT110, PCB.
5. Replace EIO PCB.
21_01_02 Stop The sipper syringe did not reach or stop at 1. Check home position
the home position while the instrument detector (PI101) signal, and
was resetting itself. replace.
: Home detection, (mode 2-1) 2. Replace the motor (SM101).
3. Replace DO2 PCB.
4. Replace EMOT110, PCB.
5. Replace EIO PCB.
21_01_03 P.Stop The sipper syringe did not reach or stop at 1. Check home position
/Stop the home position. detector (PI101) signal, and
: Home detection, (mode 5-1,5-2) replace.
2. Replace the motor (SM101).
3. Replace DO2 PCB.
4. Replace EMOT110, PCB.
5. Replace EIO PCB.
21_01_05 P.Stop The sipper syringe did not move out of the 1. Check home position
/Stop home position . detector (PI101) signal, and
: Home detection, (mode 1-1) replace.
2. Replace the motor (SM101).
3. Replace DO2 PCB.
4. Replace EMOT110, PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 Chapter 7.1.11


RD/Hitachi Elecsys 2010 Service Manual

7.1.12.Magnet Drive

Error Code Mechanism Level Alarm Description Remedy


22_01_01 Magnet Stop The magnet did not move out of the home 1. Check home position
Drive position while the instrument was resetting detector (PI111, GP1A34LC)
itself. signal, and replace.
: Home detection, (mode 1-1) 2. Replace the motor (SM111).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
22_01_02 Stop The magnet did not reach or stop at the 1. Check home position
home position while the instrument was detector (PI111,GP1A34LC)
resetting itself. signal, and replace.
: Home detection, (mode 2-1) 2. Replace the motor (SM111).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
22_01_03 Stop The magnet did not reach or stop at the 1. Check home position
home position. detector (PI111,GP1A34LC)
: Home detection, (mode 5-1,5-2) signal, and replace.
2. Replace the motor (SM111).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.
22_01_04 Stop The magnet did not move out of the home 1. Check home position
position. detector (PI111,GP1A34LC)
: Home detection, (mode 1-1) signal, and replace.
2. Replace the motor (SM111).
3. Replace DO2 PCB.
4. Replace EMOT110 PCB.
5. Replace EIO PCB.

V 1.6 – April 1999 1 Chapter 7.1.12


RD/Hitachi Elecsys 2010 Service Manual

7.1.13.Pipetter Buffer

Error Code Mechanism Level Alarm Description Remedy


23_01_01 Pipetter P.Stop A vessel was detected at the V position on 1. Check that gripper has been
Buffer /Stop the buffer station when gripper put a vessel adjusted in the normal way,
into the V position. otherwise adjust the gripper.
23_01_02 P.Stop A vessel was not detected at the V position 1. Check that gripper has been
/Stop on the buffer station. adjusted in the normal way,
otherwise adjust the gripper.
23_01_03 P.Stop A vessel was detected at the DS1 position 1. Check that gripper has been,
/Stop on the buffer station when gripper put a adjusted in the normal way,
vessel into the DS1 position. otherwise adjust the gripper.
23_01_04 P.Stop A vessel was not detected at the DS1 1. Check that gripper has been
/Stop position on the buffer station. adjusted in the normal way,
otherwise adjust the gripper.
23_01_05 P.Stop A vessel was detected at the DS2 position 1. Check that gripper has been
/Stop on the buffer station when gripper put a adjusted in the normal way,
vessel into the DS2 position. otherwise adjust the gripper.
23_01_06 P.Stop A vessel was not detected at the DS2 1. Check that gripper has been
/Stop position on the buffer station. adjusted in the normal way,
otherwise adjust the gripper.
23_01_07 P.Stop A tip was detected at the P1 position on 1. Check that gripper has been
/Stop the buffer station when gripper put a tip adjusted in the normal way,
into the P1 position. otherwise adjust the gripper.
: Present/Absent detection TB1, (mode 2. Check position detector
1-1) (PS051, twin detector)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110 PCB.
23_01_08 P.Stop A tip was not detected at the P1 position 1. Check that gripper has been
/Stop on the buffer station. adjusted in the normal way,
: Present/Absent detection TB1, (mode otherwise adjust the gripper.
2-1) 2. Check position detector
(PS051, twin detector)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110 PCB.
23_01_09 P.Stop A tip was detected at the P2 position on 1. Check that gripper has been
/Stop the buffer station when gripper put a tip adjusted in the normal way,
into the P2 position. otherwise adjust the gripper.
: Present/Absent detection TB2, (mode 2. Check position detector
1-1) (PS051, twin detector)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110 PCB.
23_01_10 Pipetter P.Stop A tip was not detected at the P2 position 1. Check that gripper has been
Buffer /Stop on the buffer station. adjusted in the normal way,
: Present/Absent detection TB2, (mode otherwise adjust the gripper.
2-1) 2. Check position detector
(PS051, twin detector)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110 PCB.

Chapter 7.1.13 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.14. Flow Path and Others

Error Mechanism Level Alarm Description Remedy


Message
24_01_01 Liquid P.Stop The liquid waste tank is full. 1. Check liquid waste level.
Waste : Liquid waste detection, (mode 1-1) 2. Check liquid waste detector
(PI132,GP1A34LC) signal,
and replace.
3. Replace EIO PCB.
4. Replace EMOT110, PCB.
24_02_01 Liquid E.Stop There is no liquid waste tank. 1. Check that the liquid waste
Waste : Liquid waste tank detection, (mode 1-1) tank is correctly positioned.
Tank 2. Check liquid waste tank
detector (PI132,GP1A34LC)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110, PCB.
25_01_01 Distilled P.Stop The level of the distilled water goes down 1. Check distilled water level.
Water and is short. 2. Check distilled water detector
: Distilled water level detection float SW, (PI131,GP1A34LC) signal,
(mode 1-1) and replace.
3. Replace EIO PCB.
4. Replace EMOT110, PCB.
26_01_01 Solid E.Stop There is no solid waste box. 1. Check that the solid waste
Waste : Solid waste box detection, (mode 1-1) box is correctly positioned.
2. Check solid waste box
detector (PI142,GP1L03)
signal, and replace.
3. Replace EIO PCB.
4. Replace EMOT110, PCB.
26_02_01 P.Stop The solid waste box is full. 1. Discard the tips and vessels
(There are more than 650 tips and vessels in the solid waste box.
in the solid waste box.)

27_01_01 DC Power W The temperature of the DC power supply is 1. Check temperature at DC


Supply heating up . power supply.
: Heat Detector 2. Check temperature detector
( ) signal, and replace.
3. Check fan motor rotation.
4. Replace EIO PCB.
5. Replace EMOT110.PCB.
28_01_01 Reagent W The cover of the reagent disk is open. 1. Check cover detector
Disk (MSW021, VX-015-1A3)
Cover signal, and replace.
2. Replace EIO PCB.
3. Replace EMOT110 PCB.

:This function is nothing now

V 1.6 – April 1999 1 Chapter 7.1 14


RD/Hitachi Elecsys 2010 Service Manual

7.1.15.Motor Controller

Error Code Assembly Level Alarm Description Remedy


29_01_01 EMOT110 E.Stop Controller error signal for the sample disk 1. Check PCB connector
PCB rotation is detected. contact.
: GPCONT1 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_02 E.Stop Controller error signal for the reagent disk 1. Check PCB connector
rotation is detected. contact.
: GPCONT1 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_03 E.Stop Controller error signal for the cap opener 1. Check PCB connector
F/B movement is detected. contact.
: GPCONT2 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_04 E.Stop Controller error signal for the cap opener 1. Check PCB connector
open/close movement is detected. contact.
: GPCONT2 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_05 E.Stop Controller error signal for the beads 1. Check PCB connector
mixing arm rotation is detected. contact.
: GPCONT3 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_06 E.Stop Controller error signal for the beads 1. Check PCB connector
mixing up/down movement is detected. contact.
: GPCONT3 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_07 E.Stop Controller error signal for the solid waste 1. Check PCB connector
movement is detected. contact.
: GPCONT4 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_08 E.Stop Controller error signal for the bar code 1. Check PCB connector
reader rotation is detected. contact.
: GPCONT4 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_09 E.Stop Controller error signal for the pipetter X 1. Check PCB connector
movement is detected. contact.
: GPCONT5 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_10 E.Stop Controller error signal for the pipetter Z 1. Check PCB connector
movement is detected. contact.
: GPCONT5 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_11 E.Stop Controller error signal for the sipper X 1. Check PCB connector
movement is detected. contact.
: GPCONT6 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_12 E.Stop Controller error signal of the sipper Z 1. Check PCB connector
movement is detected. contact.
: GPCONT6 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.

V 1.6 – April 1999 1 Chapter 7.1.15


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


29_01_13 EMOT110 E.Stop Controller error signal for the gripper X 1. Check PCB connector
PCB movement is detected. contact.
: GPCONT7 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_14 E.Stop Controller error signal for the gripper Z 1. Check PCB connector
movement is detected. contact.
: GPCONT7 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_15 E.Stop Controller error signal for the gripper Y 1. Check PCB connector
movement is detected. contact.
: GPCONT8 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_16 E.Stop Controller error signal for the magnet 1. Check PCB connector
movement inside the detection unit is contact.
detected. 2. Replace EMOT110 PCB.
: GPCONT8 3. Replace ECPU237 PCB.
29_01_17 E.Stop Controller error signal for the pipetter 1. Check PCB connector
syringe movement is detected. contact.
: GPCONT9 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_18 E.Stop Controller error signal for the sipper 1. Check PCB connector
syringe movement is detected. contact.
: GPCONT9 2. Replace EMOT110 PCB.
3. Replace ECPU237 PCB.
29_01_19 E.Stop GPCONT10
29_01_20 E.Stop GPCONT10
29_02_01 E.Stop Controller error signal for the solenoid 1. Check PCB connector
valve, HV switching, +24VDC on/off7, contact.
etc. is detected. 2. Replace EMOT110 PCB.
: GMCONT 3. Replace ECPU237 PCB.

Note) 1. The following abbreviations apply to positions on the buffer station.


P1: Tip pos.1, P2: Tip pos.2
2. See the table for GPCONT/GMCONT on the EMOT110 board for details.

Chapter 7.1.15 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.16. Motor Controller(2)

Error Assembly Level Alarm Description Remedy


Message
GPCONT EMOT110 E.Stop Timeout of sample disk rotation is 1. Check PCB connector contact.
TIMEOUT PCB detected. 2. Replace EMOT110 PCB.
30-01-01 : GPCONT1 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of reagent disk rotation is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-02 : GPCONT1 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of cap opener F/B movement 1. Check PCB connector contact.
TIMEOUT is detected. 2. Replace EMOT110 PCB.
30-01-03 : GPCONT2 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of cap opener open/close 1. Check PCB connector contact.
TIMEOUT movement is detected. 2. Replace EMOT110 PCB.
30-01-04 : GPCONT2 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of beads mixing arm rotation is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-05 : GPCONT3 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of beads mixing up/down 1. Check PCB connector contact.
TIMEOUT movement is detected. 2. Replace EMOT110 PCB.
30-01-06 : GPCONT3 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of solid waste movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-07 : GPCONT4 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of bar code reader rotation is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-08 : GPCONT4 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of pipetter X movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-09 : GPCONT5 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of pipetter Z movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-10 : GPCONT5 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of sipper X movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-11 : GPCONT6 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of sipper Z movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-12 : GPCONT6 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of gripper X movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-13 : GPCONT7 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of gripper Z movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-14 : GPCONT7 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of gripper Y movement is 1. Check PCB connector contact.
TIMEOUT detected. 2. Replace EMOT110 PCB.
30-01-15 : GPCONT8 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of magnet movement inside 1. Check PCB connector contact.
TIMEOUT the detection unit is detected. 2. Replace EMOT110 PCB.
30-01-16 : GPCONT8 3. Replace ECPU237 PCB.

V 1.6 – April 1999 1 Chapter 7.1.16


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


GPCONT EMOT110 E.Stop Timeout of pipetter syringe 1. Check PCB connector contact.
TIMEOUT PCB movement is detected. 2. Replace EMOT110 PCB.
30-01-17 : GPCONT9 3. Replace ECPU237 PCB.
GPCONT E.Stop Timeout of sipper syringe 1. Check PCB connector contact.
TIMEOUT movement is detected. 2. Replace EMOT110 PCB.
30-01-18 : GPCONT9 3. Replace ECPU237 PCB.
GPCONT E.Stop GPCONT10 1. Check PCB connector contact.
TIMEOUT 2. Replace EMOT110 PCB.
30-01-19 3. Replace ECPU237 PCB.
GPCONT E.Stop GPCONT10 1. Check PCB connector contact.
TIMEOUT 2. Replace EMOT110 PCB.
30-01-20 3. Replace ECPU237 PCB.
GMCONT E.Stop Timeout of solenoid valve, HV 1. Check PCB connector contact.
TIMEOUT switching, +24VDC on/off, DC 2. Replace EMOT110 PCB.
30-02-01 power failure, fuse, or temp. control 3. Replace ECPU237 PCB.
etc. is detected.
: GMCONT

Note) See the table for GPCONT/GMCONT on the EMOT100 board for details.

Chapter 7.1.16 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.17. ADC, DC Power Supply, Fuse

Error Code Part Level Alarm Description Remedy


31-01-01 ADC W Abnormal ADC detected. 1. Check the connector and PCB
contact.
2. Replace EECL110 PCB.
3. Replace ECPU237.
31-01-02 W ADC timeout detected. 1. Check the connector and PCB
contact.
2. Replace EECL110 PCB.
3. Replace ECPU237.
31-01-03 W Abnormal ADC standard voltage detected. 1. Check the connector and PCB
contact.
2. Replace EECL110 PCB.
3. Replace ECPU237.
31-02-01 W Abnormal AB count level detected in AB 1. Replace AB of system reagent
level check. with new one.
2. Exchange measuring cell.
31-02-02 W Abnormal current range detected in current 1. Exchange measuring cell.
check.
32-01-01 DO2 W Abnormal temperature status of the DO2
Board board.

32-01-02 DO3 W Abnormal temperature status of the DO3


Board board.

33-01-01 Power Stop Low signal limit of +15VDC (for temp. 1. Check short circuit of DC line.
Supply control) detected. 2. Replace DC power supply.

33-01-02 Stop Low signal limit of -15VDC (for temp. 1. Check short circuit of DC line.
control) detected. 2. Replace DC power supply.

33-01-03 Stop Low signal limit of +15VDC (for analog) 1. Check short circuit of DC line.
detected. 2. Replace DC power supply.

33-01-04 Stop Low signal limit of-15VDC (for analog) 1. Check short circuit of DC line.
detected. 2. Replace DC power supply.

33-01-05 Stop Low signal limit of +12VDC (for analog) 1. Check short circuit of DC line.
detected. 2. Replace DC power supply.

33-01-06 Stop Low signal limit of –12VDC (for analog) 1. Check short circuit of DC line.
detected. 2. Replace DC power supply.

33-01-07 Stop Low signal limit of +12VDC detected. 1. Check short circuit of DC line.
2. Replace DC power supply.
33-01-08 E.Stop Low signal limit of +24VDC detected. 1. Check short circuit of DC line.
2. Replace DC power supply.
34-01-01 DO1 E.Stop Burnt out fuse detected on the DO1 board. 1. Check short circuit.
Board 2. Replace fuse.
3. Replace DO1. PCB.

V 1.6 – April 1999 1 Chapter 7.1.17


RD/Hitachi Elecsys 2010 Service Manual

Error Code Part Level Alarm Description Remedy


34-01-02 DO2 E.Stop Burnt out fuse detected on the DO2 board. 1. Check short circuit.
Board 2. Replace fuse.
3. Replace DO2. PCB.
34-01-03 DO3 E.Stop Burnt out fuse detected on the DO3 board. 1. Check short circuit.
Board 2. Replace use.
3. Replace DO3. PCB.
34-01-04 EIO E.Stop Burnt out fuse detected on the EIO board. 1. Check short circuit.
Board 2. Replace fuse.
3. Replace EIO. PCB.

Chapter 7.1.17 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.18. Pipetter LLD, Temperature Control and Others

Error Code Part Level Alarm Description Remedy


35_01_01 Pipetter W The pipetter does not detect a liquid level 1. Replace pipetter probe.
LLD at the sample position. 2. Replace LLD-P PCB.
Sub-code : Pos.No.1-30 3. Replace DIST-P PCB.
4. Replace EIO PCB.
35_01_02 W The sample is short (pipetter). 1. Replace pipetter probe.
Sub-code : Pos.No.1-30 2. Replace LLD-P PCB.
3. Replace DIST-P PCB.
4. Replace EIO PCB.
35_01_05 W Hovering on the sample disk 1. Remove static electricity.
(Liquid level is misdetected due to static
electricity or film.)
35_01_06 W Hovering on the sample disk 1. Check water conductivity.
[Environmental error: heavy] 2. Prime pipetter tubes.
(The LLD function fails because of a
significant increase in water conductivity or
conduction of the nozzle.)
35_01_07 W Sample pipetter hovering 1. Check water conductivity.
[Environmental error: light] 2. Prime pipetter tubes.
(The LLD function fails because of an 3. Clean tip of nozzle
increase in water conductivity.)
36_01_02 W The temperature of the R. disk exceeds the 1. Replace the thermistor
tolerance limit for 30 min or more. (TH021).
2. Replace the thermistor
(-0.46*(outside temperature of R. disk) (TH022).
+29.0) 3. Replace the Peltier unit.
4.0 °C 4. Replace EECL110 PCB.
5. Replace ECPU237 PCB.
6. Replace DO3 PCB.
36_02_02 W The temperature of the incubator exceeds 1. Replace the thermistor
the tolerance limit for 30 min or more. (TH071).
(37.0±0.5 °C) 2. Replace the heater (HT071).
3. Replace EECL110 PCB.
4. Replace ECPU237 PCB.
5. Replace DO3 PCB.
36_03_02 W The temperature of the cell exceeds the 1. Replace the thermistor
tolerance limit for 30 min or more. (TH071).
2. Replace the thermistor
(-0.10*(outside temperature of detection (TH182)
unit)+30.0) 3. Replace the heater (HT071).
±0.5 °C 4. Replace EECL110 PCB.
5. Replace ECPU237 PCB.
6. Replace DO3 PCB.

V 1.6 – April 1999 1 Chapter 7.1.18


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


36_04_02 W The temperature of AB/CC exceeds the 1. Replace the thermistor
tolerance limit for 30 min or more. (TH181).
(28.0±2.5 °C) 2. Replace the Peltier.
3. Replace EECL110 PCB.
4. Replace ECPU237 PCB.
5. Replace DO3 PCB.
36_05_01 W The temperature of system reagent 1. Exchange the detector of the
position 1 is not in equilibrium . system bottle.
2. Wait 15 minutes.
36_05_03 W The temperature of system reagent 1. Exchange the detector of the
position 2 is not in equilibrium . system bottle.
2. Wait 15minutes.
36_05_05 Stop The temperature of system reagent 1. Exchange the detector of the
positions 1 and 2 are not in equilibrium . system bottle.
2. Wait 15 minutes.
37_01_01 Pipetter W The pipetter does not detect liquid level 1. Check assay reagent
LLD for the assay reagent for Test ***. volume.
Subcode: test No. 2. Replace pipetter probe.
3. Replace LLD-P PCB.
4. Replace DIST-P PCB.
5. Replace EIO PCB.
37_01_02 W The assay reagent is short for Test ***. 1. Check assay reagent
volume.
37_01_04 W Pipetter film was detected on pipetting of 1. Check RackPack .
the assay reagent for Test ***. 2. Replace LLD-P PCB.
Subcode: test No. 3. Replace DIST-P PCB.
4. Replace EIO PCB.
5. Cleaning of pipetter tubing.
37_01_05 W Hovering on the assay reagent bottle 1. Remove static electricity.
(Liquid level is misdetected due to static
electricity or film.)
37_01_06 W Hovering on the assay reagent bottle 1. Check water conductivity.
[Environmental error: heavy] 2. Prime pipetter tubes.
(The LLD function fails because of a
significant increase in water conductivity
or conduction of the nozzle.)
37_01_07 W Hovering on the assay reagent bottle 1. Check water conductivity.
[Environmental error:light] 2. Prime pipetter tubes.
(The LLD function fails because of an 3. Clean tip of nozzle
increase in water conductivity.)
37_02_01 W The pipetter does not detect liquid level 1. Check diluent volume.
for the diluent for Test ***. 2. Replace pipetter probe.
Subcode: test No. 3. Replace LLD-P PCB.
4. Replace DIST-P PCB.
5. Replace EIO PCB.
37_02_02 W The diluent is short for Test ***. 1. Check diluent volume.
Subcode: test No.
37_02_04 W Pipetter film was detected on pipetting of 1. Check RackPack .
diluent. 2. Replace LLD-P PCB.
Subcode: test No. 3. Replace DIST-P PCB.
4. Replace EIO PCB.
5. Cleaning of pipetter tubing.
37_02_05 W Hovering on the diluent bottle 1. Remove static electricity.
(Liquid level is misdetected due to static
electricity or film.)

Chapter 7.1.18 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


37_02_06 W Hovering on the diluent bottle 1. Check water conductivity.
[Environmental error: heavy] 2. Prime pipetter tubes.
(The LLD function fails because of a
significant increase in water conductivity or
conduction of the nozzle.)
37_02_07 W Hovering on the diluent bottle 1. Check water conductivity.
[Environmental error: light] 2. Prime pipetter tubes.
(The LLD function fails because of an 3. Clean tip of nozzle
increase in water conductivity.)
37_03_01 W The pipetter does not detect liquid level for 1. Check pretreatment
the pretreatment for Test ***. volume.
Subcode: test No. 2. Replace pipetter probe.
3. Replace LLD-P PCB.
4. Replace DIST-P PCB.
5. Replace EIO PCB.
37_03_02 W The pretreatment is short for Test ***. 1. Check pretreatment
Subcode: test No. volume.
37_03_04 W Pipetter film was detected for pretreatment. 1. Check RackPack .
Subcode: test No. 2. Replace LLD-P PCB.
3. Replace DIST-P PCB.
4. Replace EIO PCB.
5. Cleaning pipetter tubing.
37_03_05 W Hovering on the pretreatment reagent bottle 1. Remove static electricity.
(Liquid level is misdetected due to static
electricity or film.)
37_03_06 W Hovering on the pretreatment reagent bottle 1. Check water conductivity.
[Environmental error: heavy] 2. Prime pipetter tubes.
(The LLD function fails because of an
increase in water conductivity.)
37_03_07 W Hovering on the pretreatment reagent bottle 1. Check water conductivity.
[Environmental error: light] 2. Prime pipetter tubes.
(The LLD function fails because of a 3. Clean tip of nozzle
significant increase in water conductivity or
conduction of the nozzle.)
37_04_01 W The pipetter does not detect liquid level for 1. Check BlankSet volume.
the BlankSet. 2. Replace pipetter probe.
Subcode: test No. 3. Replace LLD-P PCB.
4. Replace DIST-P PCB.
5. Replace EIO PCB.
37_04_02 W The BlankSet is short for Test ***. 1. Check BlankSet volume.
37_04_04 W Pipetter Film was detected on pipetting of 1. Check RackPack .
Blank Set. 2. Replace LLD-P PCB.
3. Replace DIST-P PCB.
4. Replace EIO PCB.
5. Cleaning pipetter tubing.
37_04_05 W Hovering on the BlankSet bottle 1. Remove static electricity.
(Liquid level is misdetected due to static
electricity or film.)
37_04_06 W Hovering on the BlankSet bottle 1. Check water conductivity.
[Environmental error: heavy] 2. Prime pipetter tubes.
(The LLD function fails because of a
significant increase in water conductivity or
conduction of the nozzle.)
37_04_07 W Hovering on the BlankSet bottle 1. Check water conductivity.
[Environmental error: light] 2. Prime pipetter tubes.
(The LLD function fails because of an 3. Clean tip of nozzle
increase in water conductivity.)

V 1.6 – April 1999 3 Chapter 7.1.18


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


37_05_01 Sipper LLD W The sipper does not detect liquid level for the 1. Check AB/CC volume.
AB/CC. 2. Replace sipper probe.
(Only 1 set) 3. Replace system reagent
tray.
4. Replace DIST-S PCB.
5. Replace DO1 PCB.
6. Replace EIO PCB.
37_05_02 Stop The sipper does not detect liquid level for the 1. Check AB/CC volume.
AB/CC. 2. Replace sipper probe.
(Neither set 1 nor set 2) 3. Replace system reagent
tray.
4. Replace DIST-S PCB.
5. Replace DO1 PCB.
6. Replace EIO PCB.
37_05_03 Stop AB/CC is short. 1. Check AB/CC volume.
37_06_01 AB/CC W Film is detected at AB/CC Pos. 1 during
Film aspiration.
37_06_02 Detected Stop Film is detected at AB/CC Pos. 1 during level
check.
37_06_03 W Film is detected at AB/CC Pos. 2 during
aspiration.
37_06_04 Stop Film is detected at AB/CC Pos. 2 during level
check.
37_06_05 Stop AB/CC not available due to film detection
during aspiration.
38_01_01 Bar Code W Incorrect RackPack bard code reading. (Only 1. Check bar code label.
Reader during RackPack bar code reader check) 2. Clean bar code reader
window.
3. Replace bar code reader.
4. Replace UI-RS PCB.
38_01_02 W Incorrect sample bar code reading. 1. Check bar code label.
(Only during sample bar code reader check) 2. Clean bar code reader
window.
3. Replace bar code reader.
4. Replace UI-RS PCB.
38_01_03 W Incorrect bar code card reading. 1. Check bar code label.
2. Clean bar code reader
window.
3. Replace bar code reader.
4. Replace UI-RS PCB.
38_01_04 W Communication error with the bar code 1. Check connector of BCR
reader and PCBs.
(parity, framing, overrun). 2. Replace Barcode Reader.
3. Replace UI-RS PCB.

Chapter 7.1.18 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Error Code Assembly Level Alarm Description Remedy


39_01_01 Gripper W Either there are no tips in the tip container 1. Replace container.
or it was determined to be empty due to 2. Check relation between tip
pickup failure (when one of the containers is and gripper finger
empty).
39_01_02 P.Stop/ Either there are no tips in the tip container 1. Replace container.
S.Stop or it was determined to be empty due to 2. Check relation between tip
pickup failure (other than during preparation and gripper finger.
when all 3 are empty: P. STOP, Operation.
when all 3 are empty: S. STOP).
39_02_01 W Either there are no tips in the vessel 1. Replace container.
container or it was determined to be empty 2. Check relation between
due to pickup failure (when one container is vessel and gripper finger.
empty).
39_02_02 P.Stop Either there are no tips in the vessel 1. Replace container.
container or it was determined to be empty 2. Check relation between
due to pickup failure (when all three are vessel and gripper finger.
empty).
40_01_01 Software W Failed in measurement of the BlankSet. 1. Check pipetter and sipper
tubing.
2. Check measuring cell.
3. Check detector unit.
40_01_02 W BlankSet is invalid because the 1. Measure BlankSet.
reproducibility period has expired or there is
no valid BlankSet data.

V 1.6 – April 1999 5 Chapter 7.1.18


RD/Hitachi Elecsys 2010 Service Manual

7.1.19 Floppy Disk Drive, Printer, User Interface and Host Communication

Error Code Part Level Alarm Description Remedy


41_01_01 Floppy W F/D is write-protected. 1. Check F/D write protection.
Disk Drive 2. Replace FDD.
41_01_03 W 1. There is no appropriate file in the F/D 1. Replace F/D media.
(during auto backup). 2. Replace FDD.
2. Available space on the F/D is less than the
file size (during F/D Utility backup).
3. F/D is not inserted.
4. F/D is damaged.
41_01_04 W 1. There is no appropriate file on the F/D. 1. Replace F/D media.
2. F/D is not inserted. 2. Replace FDD.
3. F/D is damaged.
41_01_05 W Number of access times to F/D has exceeded 1. Replace F/D media.
100,000
41_01_06 Stop 1. There is no appropriate file on the F/D 1. Exchange FD media.
(**00.dat). 2. Exchange FDD.
2. F/D is not inserted.
3. F/D is damaged.
4. APC was performed during access to the
F/D.
41_01_07 Stop 1. There is no appropriate file on the F/D. 1. Exchange FD media.
2. F/D is damaged. 2. Exchange FDD.
41_01_08 Stop 1. There is no appropriate file on the F/D 1. Exchange FD media.
(**00.dat). 2. Exchange FDD.
2. F/D is not inserted.
3. F/D is damaged.
42_01_01 Printer W Printer is not ready. 1. Check printer cable
connection.
2. Replace printer cable.
3. Replace printer.
42_01_02 W Printer is out of paper. 1. Check printer cable
connection.
2. Replace printer cable.
3. Replace printer.
43_01_01 User W Message was sent again during transmission of 1. Check connection of user
Interface the message. interface.
2. Replace UI-RS PCB.
3. Replace user-I/F cable.
4. Replace user I/F.
44_01_01 Host W Message was aborted in the middle of a 1. Check host cable connection.
transmission. 2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_02 W Reception of the message was aborted. 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.

V 1.6 – April 1999 1 Chapter 7.1.19


RD/Hitachi Elecsys 2010 Service Manual

Error Code Part Level Alarm Description Remedy


44_01_03 Host W Re-sending of the message was aborted. 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_04 W Re-sending of message failed (low level). 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_05 W Re-sending of message failed (low Level). 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_06 W Time out (low level) 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_07 W Time out (low level) 1. Check host cable connection.
2. Check host condition and
program.
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_08 W 1. There is a valid record but no termination Check host condition and
record. program.
2. There is no valid record. Replace UI-RS.
3. The first record is not a header record.
4. There is an undefined record.
5. There is data other than that defined.
44_01_09 W Unable to renew data to the DB 1. Check host cable connection.
2. Check host condition and
program .
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_10 W Hardware error. 1. Check host cable connection.
2. Check host condition and
program .
3. Replace host communication
cable.
4. Replace UI-RS.
44_01_11 W Application error. 1. Check host cable connection.
2. Check host condition and
program .
3. Replace host communication
cable.
4. Replace UI-RS.

Chapter 7.1.19 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.20 Inventory

Error Code Part Level Alarm Description Remedy


45_01_01 Stop Unable to measure the amount of the Check remaining volume with
inventory (REAGENT). Inventory screen and replace
RackPack. Then carry out reagent
scan.
45_04_01 Stop Unable to measure the amount of the Check remaining volume with
inventory (BLANKSET1). Inventory screen and replace
RackPack. Then carry out reagent
scan.
45_05_01 Stop Unable to measure the amount of the Check remaining volume with
inventory (BLANKSET2). Inventory screen and replace
RackPack. Then carry out reagent
scan.
45_06_01 Stop Unable to measure the amount of the Replace container then carry out
inventory (TIP). reagent scan.
45_07_01 Stop Unable to measure the amount of the Replace container then carry out
inventory (VESSEL). reagent scan.
45_08_01 Stop Unable to measure the amount of the Check remaining volume with
inventory (ABCC). Inventory screen and replace
RackPack. Then carry out reagent
scan.
46_01_01 Inc. P.Stop Incubator is full. -
47_01_01 Stop RP bar code information registration for Check that the total number of
Assay + Pretreatment has exceeded 15. assay reagent and pretreatment
reagent RackPacks on board is less
than 15.
47_01_02 Stop RP bar code information registration for the Check that the number of diluent
diluent has exceeded 2. RackPacks on board is less than 2.
47_01_03 Stop RP bar code information registration for the Check that there is more than 1
BlankSet is more than 1. BlankSet RackPack on board.
48_01_01 system W System volume value is outside the range. Check whether the nipples have
volume become loose.
Make one more Preparation.
49_01_01 clot det. W Clot was detected during aspiration of the a.) Check sample volume.
sample in position No.** (pipetter, sub- b.) Check the sample for clots.
code: Pos. No. 1 ~ 30). c.) Repeat the sample.
Remove stains from tip of pipetter
nozzle.
Prime pipetter tubes.

Chapter 7.1.20 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Error Code Part Level Alarm Description Remedy


50_01_01 Sample W PSID: Unable to read before sampling -
ID but able to read during SSCAN (Sub-
code: Pos. No. 1 ~ 30).
50_01_02 W PSID: Able to read before sampling -
but unable to read during SSCAN
(Sub-code: Pos. No. 1 ~ 30).
50_01_03 W PSID: ID read before sampling does -
not match ID read during SSCAN
(Sub-code: Pos. No. 1 ~ 30).
50_02_02 W Stored sample detached from pos.
50_02_03 W No programming/ID for sample pos.
50_02_04 W Sample could not be processed: no
demands for this sample in the system.
51_01_01 Gripper W There was an item that was not -
Automatic adjusted during automatic adjustment.
51_01_02 Adjustment W There was an item that was not fully -
adjusted due to it being up to the limit
during automatic adjustments.
52_01_01 AC W Power failure. -
Power
Fail
53_01_01 CPU W CPU error 1 due to power outage.
53_01_02 Error W CPU error 2 due to power outage. -

Chapter 7.1.20 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.1.21 Rack Sampler/Rack Sampler connected to CLAS 1 System

The Troubleshooting list for the Rack Sampler System is attached in Chapter 7.3.16.
The Troubleshooting list for the Rack Sampler connected to CLAS 1 System is attached in Chapter 7.3.17.

- A line
Error Code Line Level Alarm Description Remarks
61_01_01 A line S A line mechanism: Does not move from the
home position (during reset).
61_01_02 S A line mechanism: Does not stop at the
home position (during reset).
61_01_03 not applicable
61_01_04 AL/S A line mechanism: Does not stop at the
home position.
61_01_05 AL/S A line mechanism: Does not stop at the
correct home detected.
61_01_06 AL/S A line mechanism: Does not stop at the
rack detected, and does not stop at the rack
feed end position.
61_01_07 AL/S A line mechanism: Does not stop at the
rack detected, also does not stop at the
correct rack feed end position detected.
61_01_08 AL/S A line mechanism: Does not stop at the For sampler connected to CLAS 1
home position. system
61_01_09 AL/S A line mechanism: Does not stop at the For sampler connected to CLAS 1
correct home detected. system
61_02_01 R/S A line mechanism: Completed rack feed for
all the racks.
61_02_02 W A line mechanism: Rack tray is missing.

Notes)

W: Warning
L: Line alarm
An alarm occurred on a line.
AL: A line stop
An alarm occurred on the A line.
IL: I line stop
An alarm occurred on the I line, turntable C and the turn belt.
R: Rack supplying stop
S: Stop
P: P. Stop (partial stop)
E.S E. Stop (emergency stop)

V 1.6 – April 1999 1 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- B line
Error Code Line Level Alarm Description Remarks
62_01_01 B line S B line mechanism: Does not stop at the
home position (during reset).
62_01_02 S B line mechanism: Does not stop at the
receiver or D line exchange position (during
reset).
62_01_03 S B line mechanism: Does not stop at the
STAT rack position (during reset).
62_01_04 L/S B line mechanism: Does not stop at the
home position.
62_01_05 L/S B line mechanism: Does not stop at the
receiver or D line exchange position.
62_01_06 L/S B line mechanism: Does not stop at the
STAT rack position.
62_01_07 L/S B line mechanism: Rack does not stop at
BC reading position.
62_01_08 L/S B line mechanism: Rack does not stop at
the pipetting position.
62_01_09 L/S B line mechanism: Does not stop at the
correct home detected.
62_01_10 L/S B line mechanism: Does not stop at the
correct receiver or D line exchange
detected.
62_01_11 L/S B line mechanism: Does not stop at the
proper STAT rack position detected.
62_01_12 L/S B line mechanism: Rack does not stop at
the proper BC read detected.
62_01_13 L/S B line mechanism: Rack does not stop at
the proper pipetting position detected.
62_01_14 S B line mechanism: Does not stop at the rack For sampler connected to CLAS 1
receipt position (during reset). system
62_01_15 L/S B line mechanism: Does not stop at the rack For sampler connected to CLAS 1
receipt position. system
62_01_16 L/S B line mechanism: Rack does not stop at For sampler connected to CLAS 1
the proper rack receipt position detected. system
62_01_17 L/S B line mechanism: Rack fed from the For sampler connected to CLAS 1
rotating mechanism C to the rack receipt system
position (PI218) cannot be transferred
inside.
62_02_01 - not applicable

62_02_02 - not applicable

62_02_03 W B line mechanism: No rack on the rack


receipt position on the B line.
62_02_04 W B line mechanism: Rack cannot be sent to
C line (rack buffer is also full).
62_02_05 S B line mechanism: Rack does not stop at
the pipetting position (during reset).
62_02_06 L/S B line mechanism: No rack is fed from the For sampler connected to CLAS 1
rotating mechanism. system

V 1.6 – April 1999 2 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- C line
Error Code Line Level Alarm Description Remarks
63_01_01 C line S C line mechanism: Does not stop at the
home position (during reset).
63_01_02 S C line mechanism: Does not stop at the rack
receipt end position (during reset).
63_01_03 L/S C line mechanism: Does not stop at the
home position.
63_01_04 L/S C line mechanism: Does not stop at the rack
receipt end position.
63_01_05 L/S C line mechanism: Does not stop at the
proper home position detected.
63_01_06 L/S C line mechanism: Does not stop at the
detected rack receipt end position.
63_01_07 S C line mechanism: Unable to send rack to
the buffer position (during reset).
63_01_08 W C line mechanism: Unable to send a rack to
the buffer position.
63_02_01 W C line mechanism: No rack recovery tray.
63_02_02 W C line mechanism: Rack recovery tray is
full.

- Barcode Communication
Error Code Line Level Alarm Description Remarks
38_02_01 B line Rack ID W B line mechanism: Rack ID reading error.
38_02_03 B line W B line mechanism: Error in the communication
with the barcode reader.

- Cup/Rack Detection
Error Code Line Level Alarm Description Remarks
71_01_01 No STAT Rack W No STAT rack in the STAT rack position.
71_01_02 Illegal setting of IL/S Rack is has been set at the I line buffer For sampler connected to
a Rack on I line position with improper timing. CLAS 1 system
71_01_03 Illegal setting of L/S Rack has been set at an improper position on
a Rack on B line the B line.
72_01_01 B line No Cups W B line mechanism: There are no cups on the
On Rack rack.

V 1.6 – April 1999 3 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- Motor Controller
Error Code Line Level Alarm Description Remarks
29_01_21 GPCNT E.S Abnormal motor controller detected.
(Motor No. 21: GPCONT)
29_01_22 E.S Abnormal motor controller detected.
(Motor No. 22: GPCONT)
29_01_23 E.S Abnormal motor controller detected.
(Motor No. 23: GPCONT)
29_01_24 E.S Abnormal motor controller detected.
(Motor No. 24: GPCONT)
29_01_25 E.S Abnormal motor controller detected.
(Motor No. 25: GPCONT)
29_01_26 E.S Abnormal motor controller detected.
(Motor No. 26: GPCONT)
29_01_27 E.S Abnormal motor controller detected.
(Motor No. 27: GPCONT)
29_01_28 E.S Abnormal motor controller detected.
(Motor No. 28: GPCONT)
29_01_29 E.S Abnormal motor controller detected.
(Motor No. 29: GPCONT)
29_01_30 E.S Abnormal motor controller detected.
(Motor No. 30: GPCONT)
29_01_31 E.S Abnormal motor controller detected.
(Motor No. 31: GPCONT)
29_01_32 E.S Abnormal motor controller detected.
(Motor No. 32: GPCONT)
29_01_33 E.S Abnormal motor controller detected.
(Motor No. 33: GPCONT)
29_01_34 E.S Abnormal motor controller detected.
(Motor No. 34: GPCONT)
29_01_35 E.S Abnormal motor controller detected.
(Motor No. 35: GPCONT)
29_01_36 E.S Abnormal motor controller detected.
(Motor No. 36: GPCONT)
29_01_37 E.S Abnormal motor controller detected.
(Motor No. 37: GPCONT)
29_01_38 E.S Abnormal motor controller detected.
(Motor No. 38: GPCONT)
29_01_39 E.S Abnormal motor controller detected.
(Motor No. 39: GPCONT)
29_01_40 E.S Abnormal motor controller detected.
(Motor No. 40: GPCONT)

V 1.6 – April 1999 4 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- Motor Controller
Error Code Line Level Alarm Description Remarks
30_01_21 GPCNT E.S Motor controller time-out detected.
Timeout (Motor No. 21: GPCONT)
30_01_22 E.S Motor controller time-out detected.
(Motor No. 22: GPCONT)
30_01_23 E.S Motor controller time-out detected.
(Motor No. 23: GPCONT)
30_01_24 E.S Motor controller time-out detected.
(Motor No. 24: GPCONT)
30_01_25 E.S Motor controller time-out detected.
(Motor No. 25: GPCONT)
30_01_26 E.S Motor controller time-out detected.
(Motor No. 26: GPCONT)
30_01_27 E.S Motor controller time-out detected.
(Motor No. 27: GPCONT)
30_01_28 E.S Motor controller time-out detected.
(Motor No. 28: GPCONT)
30_01_29 E.S Motor controller time-out detected.
(Motor No. 29: GPCONT)
30_01_30 E.S Motor controller time-out detected.
(Motor No. 30: GPCONT)
30_01_31 E.S Motor controller time-out detected.
(Motor No. 31: GPCONT)
30_01_32 E.S Motor controller time-out detected.
(Motor No. 32: GPCONT)
30_01_33 E.S Motor controller time-out detected.
(Motor No. 33: GPCONT)
30_01_34 E.S Motor controller time-out detected.
(Motor No. 34: GPCONT)
30_01_35 E.S Motor controller time-out detected.
(Motor No. 35: GPCONT)
30_01_36 E.S Motor controller time-out detected.
(Motor No. 36: GPCONT)
30_01_37 E.S Motor controller time-out detected.
(Motor No. 37: GPCONT)
30_01_38 E.S Motor controller time-out detected.
(Motor No. 38: GPCONT)
30_01_39 E.S Motor controller time-out detected.
(Motor No. 39: GPCONT)
30_01_40 E.S Motor controller time-out detected.
(Motor No. 40: GPCONT)

V 1.6 – April 1999 5 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- Others
Error Code Line Level Alarm Description Remarks
73_01_01 DC Power Temp E.S Abnormal DC power temperature.
73_01_02 DC24V Low or E.S Low DC24V pressure or blown fuse on the
DO4 Fuse or DO4 board or DO5 board.
DO5 Fuse
73_01_03 Serial Com CLK E.S Serial communication CLK error.
73_01_04 PSCNT Fuse E.S Blown fuse on the PSCNT board.
73_01_05 D04 Fuse or DO5 E.S Blown fuse on the D04 board or DO5 board.
Fuse
73_01_06 DC Power Error E.S Abnormal DC power input pressure.
73_01_07 RSCNT Fuse E.S 1. The sampler unit, loader unit or unloader
unit was turned off while the instrument
Note) was turned on.
2. Alternatively, the sampler unit, loader
unit or unloader unit was not turned on
although the instrument was already
turned on.
3. Blown fuse on the RS CONTA Board.

73_01_08 Line Power Fail E.S Power failure on the line side.
73_01_09 DIST-CR Fuse E.S Blown fuse on the DIST-CR board. For sampler connected
(Sampler connected to CLAS 1 system) to CLAS 1 system
74_01_01 B line BCR S B line mechanism:
Automatic Automatic adjustment for rack B/C reading
Adjustment Fail position failed.

Note) If fuse F1 to F4 has blown on the RS CONTA board,


1. In the meantime, if the instrument has been turned on, sample disk: Code 15-01-02 may
be generated.
2. No alarm code appears on the screen, but the “START” key cannot be used.

- I line
Error Code Line Level Alarm Description Remarks
75_01_01 I line S I line mechanism: Does not stop at the home For sampler connected
position (in resetting operation). to CLAS 1 system
75_01_02 S I line mechanism: Does not stop at the rack
feed end position (in resetting operation).
75_01_03 S I line mechanism: Does not stop at the home
position (in resetting operation).
75_01_05 IL/S I line mechanism: Does not stop at the home
position.
75_01_06 IL/S I line mechanism: Does not stop at the
correct home position detected.
75_01_07 IL/S I line mechanism: Does not stop at the rack
feed end position.
75_01_08 IL/S I line mechanism: Does not stop at the
correct rack feed end position detected.
75_01_09 IL/S I line mechanism: Rack cannot be transferred
inside.
75_01_10 IL/S I line mechanism: Rack is not transferred to
the buffer position.
75_02_01 IL/S No rack found at the I line buffer position.
75_02_02 W No rack found at the I line input port position.

V 1.6 – April 1999 6 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

- Turntable C
Error Code Line Level Alarm Description Remarks
76_01_01 Turntable C S Rotating mechanism C (Rotation): Does not For sampler connected
stop at the home position (in resetting to CLAS 1 system
operation).
76_01_02 S Rotating mechanism C (Rotation): Does not
move out of the home position (in resetting
operation).
76_01_03 S Rotating mechanism C (Rotation): Does not
stop at the rack transfer-out position (in
resetting operation).
76_01_04 S Rotating mechanism C (Rotation): Does not
move out of the rack transfer-out position (in
resetting operation).
76_01_05 IL/S Rotating mechanism C (Rotation): Does not
stop at the home position.
76_01_06 IL/S Rotating mechanism C (Rotation): Does not
stop at the rack transfer-out position.
76_01_07 IL/S Rotating mechanism C (Rotation): Does not
stop at the correct home position detected.
76_01_08 IL/S Rotating mechanism C (Rotation): Does not
stop at the correct rack transfer-out position
detected.
76_01_09 IL/S Rotating mechanism C (Rotation): Deviated
from the home position.
76_03_01 S Rotating mechanism C (Belt): Rack is not
transferred outside through transfer-out
operation (in resetting operation).
76_03_02 L/S Rotating mechanism C (Belt): Rack is not
transferred outside through transfer-out
operation.
76_03_03 S Rotating mechanism C (Belt): Rack is not
transferred inside through transfer-in
operation (in resetting operation).
76_03_04 IL/S Rotating mechanism C (Belt): Rack is not
transferred in through transfer-in operation.
76_04_01 L/S Rotating mechanism C (Belt): Rack found at
transfer-out position.

V 1.6 – April 1999 7 Chapter 7.1.21


RD/Hitachi Elecsys 2010 Service Manual

7.2 Data Alarms

The data alarms are shown in Table 7.2.1.

“Level” shows level of the alarm concerned; the lower the level number, the more serious the alarm.
“No result” indicates whether no data is available for a test as a result of the alarm occurring.
“System block” indicates whether the data for the test is blocked for the system as a result of the alarm occurring.

Data alarms are handled according to the following rules.


1. It is added alarm which is detected the fastest (except the temperature alarm).
2. It is added alarm which is detected higher and the fastest when it detected the temperature and the others.
3. Data which is not blocked can be blocked or released by the user.
Data which is blocked or released by user is added independently in describe above (1, 2).
4. Data which without a data alarm can be blocked by the user. Then “block” alarm is added to the data.

V 1.6 – April 1999 1 Chapter 7.2.1


RD/Hitachi Elecsys 2010 Service Manual

Table 7.2.1 Data Alarms


No Data Alarm Flag Level No result System block Alarm Description
1 Power Fail / Power Off 1 1 √ √ The test concerned was canceled by
Cancel power fail or power off.

2 E.Stop Cancel 2 2 √ √ The test concerned was canceled by


E.Stop.
3 Stop Cancel 3 3 √ √ The test concerned was canceled by
Stop.
4 P.Stop Cancel 4 4 √ √ The test concerned was canceled by
P.Stop.
5 S.Stop Cancel 5 4 √ √ The test concerned was canceled by
S.Stop.
6 Recovery Cancel 6 5 √ √ The test concerned was canceled by
Recovery.
7 Sample Short 7 6 √ √ Sample short detected.

8 Assay Reagent Short 8 6 √ √ Reagent short detected.

9 Diluent Short 9 6 √ √ Diluent short detected.

10 Pretreatment Reagent 10 6 √ √ Pretreatment reagent


Short short detected.

11 Diluted Sample Short 11 6 √ √ Diluted sample short detected.

12 Abnormal Reagent Disk 12 7 Temperature of reagent disk above


Temperature permitted range.
13 Abnormal Incubator 13 7 Temperature of incubator is above
Temperature permitted range.
14 Abnormal Measuring 14 7 Temperature of measuring cell is
Cell Temperature above permitted range.
15 Abnormal AB / CC 15 7 Temperature of AB / CC is above
Temperature permitted range.
16 AB / CC Short 16 6 √ √ AB / CC short detected.

17 ADC abnormal 17 6 √ √ ADC data is abnormal.

18 Peak out of Range 18 6 √ Peak data is out of range.(not used)

19 Blank Signal out of 19 6 √ Blank data is out of range.(not used)


Range

Chapter 7.2.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

No Data Alarm Flag Level No result System block Alarm Description


21 Peak width out of Range 21 6 √ The width of Peak data is out of
range.(not used)
22 Signal out of Range 22 6 √ Measuring data makes Error.(not used)

23 Concentration out of 23 6 Concentration is out of range.


Range
24 Calculation Error 24 6 √ √ Calculation not possible.
Only “No Value” may be shown and printed out
independently without data flag.
25 No Calibration Data 25 6 √ The measured data concerned is not
accepted because of a failed calibration
26 Previous Calibration Data 26 8 The measured data were calculated using
previous calibration data.
27 System Block S - The measured data concerned is
blocked by system.
28 User Block B - The measured data concerned is
blocked by user.
29 User Release R - The measured data concerned is
released by user.
30 Sample Hovering 30 6 √ √ It detected Sample Hovering.

31 Assay Reagent Hovering 31 6 √ √ Assay reagent hovering detected.

32 Diluent Hovering 32 6 √ √ Diluent hovering detected.

33 Pretreatment Hovering 33 6 √ √ Pretreatment reagent


hovering detected.
34 <Reserved>
35 Assay Reagent Film 35 6 √ √ Assay reagent film detected.
Detected

36 Diluent Film Detected 36 6 √ √ Diluent film detected.

37 Pretreatment Film 37 6 √ √ Pretreatment reagent film detected.


Detected
38 AB/CC Film Detected 38 6 √ √ AB/CC film detected.

39 <Reserved>
40 AB Level Range Over 40 6 AB level is out of range.
41 AB Level Check Error 41 6 Check of AB level failed.
42 Current Range Over 42 6 Electrical current data is out of range.
43 Current Range Check 43 6 Check of electrical current
Error data failed.

V 1.6 – April 1999 3 Chapter 7.2.1


RD/Hitachi Elecsys 2010 Service Manual

No Data Alarm Flag Level No result System block Alarm Description


44 AB / CC Temperature 44 6 AB / CC temperature is unstable.
Unstable
45 Sample Clot Detected 45 6 √ √ Clot detected when pipetter
aspirates sample.
46 Low signal Sample 46 6 Measured signal is lower than
standard data.
47 Sample ID Error Cancel 47 6 √ √ No sample ID scanning took place

48 Below normal 48 6 Final concentration is below normal


(expected) range (expected) range, less than lower limit.
49 Above normal 49 6 Final concentration is above normal
(expected) range (expected) range, more than upper limit.
50 Below measuring range 50 6 Concentration (not including diluent ratio) is below
measured range, less than lower limit.
51 Above measuring range 51 6 Concentration (not including diluent ratio) is above
measured range, more than upper limit.
52 Expired RackPack 52 7 Expired RackPack was used.
53 No Sample 53 6 √ √ No sample has been set up.

54 Sample LLD Inexecution 54 6 √ √ Before sample LLD is carried out, it stops because tip of
the pipetter probe is dirty, etc.
55 Sample LLD Noise 55 6 √ √ Sample LLD error generated due to detection of
electrostatic discharge, the tip of the pipetter probe
touched the inside of the tube, etc.

Note 1) Alarm No.23 “Concentration out of range” has been deleted; Nos. 48 to 51 have been added for details.
Note 2) Alarm No.30 “Sample hovering” has been deleted; Nos. 53 to 55 have been added for further details in
software versions 05-04 onward.
Note 3) Flags 18, 19, 21, 22, 23 and 30 no longer appear in the current software.

Chapter 7.2.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3 Troubleshooting list

7.3.1. Reagent Disk


7.3.1-1 R. Disk Home Position Detection, R. Disk Stop Position Detection

No Check Item Remedy


1 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Remove R jacket assembly (P/N 741-0115).
Check connections of each of the photocouplers below.
Home Pos.: PI021
Stop Pos.: PI022
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N 741-1186).
Exchange pulley if detection plate of pulley is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1 : +5V) on each of the photocouplers below.
Home Pos.: PI021
Stop Pos.: PI022
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J520 connector (for R. disk rotation) in the
Stand-by situation.
Rotate the R. disk by hand.
Check the signal voltage output of J521 connector below.
Home. Pos. : #3 pin (closed: ca. 5V, open : ca. 0V)
Stop Pos. : #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.2.
Check tension of timing belt.
Adjust tension of timing belt by moving the motor R assembly
(P/N 741-0551) again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor fixed properly? Check that the motor R assembly (P/N 741-0551) is fixed.
Fix motor R assembly by tightening the fixing screws if it is not
properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.1


RD/Hitachi Elecsys 2010 Service Manual

7.3.1-2 R. Disk Cover Open/Close Detection

No Check Item Remedy


1 Reagent disk cover closed correctly? Check that the reagent disk cover is closed correctly.
Put Reagent Disk Cover correctly again when it was not good.
2 No catch for detection changed the shape? Check Sensor Lever (P/N 741-1209) changed the shape.
Exchange Sensor Lever when it could not detect by changed the
shape.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange the DC power supply if it does not output +5V .
5 Signal voltage output correct? Turn on power SW of instrument and then wait for Stand-by.
Check the signal voltage output of the J525 connector below.
#3 Pin (open: ca. 5V, closed: ca. 0V)
Exchange the micro SW assembly (P/N 741-0555) if it does not
output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

V 1.6 – April 1999 2 Chapter 7.3.1


RD/Hitachi Elecsys 2010 Service Manual

7.3.2. Cap Opener


7.3.2-1 Cap Opener F/B Home Position Detection, Cap Opener F/B Stop Position Detection

No Check Item Remedy


1 Cap opener is touching something? Execute Cap Open / Close Mecha in Maintenance screen.
Check whether cap opener is touching anything.
Readjust cap opener if it touched something.
2 Photocoupler detached from plate? Remove rear cover (P/N 741-3105).
Check whether the photocouplers below have become detached
from plate.
Home Pos.: PI031
Stop Pos.: PI032
Exchange photocoupler if it is detached from plate.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V .
Check pin (#1 : +5V) of each of the photocouplers below.
Home Pos: PI031
Stop Pos: PI032
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J530 connector (for cap opener F/B movement) in the
Stand-by situation.
Move cap opener back and forth by hand.
Check signal voltage output of J531 connector below.
Home Pos: #3 pin (closed: ca. 5V, open: ca. 0V)
Stop Pos: #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.3.
Check tension of timing belt.
Adjust tension of timing belt by moving the pulse motor assembly
(P/N 741-4257) again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor and pulley fixed properly? Check that the pulse motor assembly and mount (P/N 741-1265)
are fixed.
Fix pulse motor assembly and mount by tightening the fixing
screws if they are not properly fixed.

Chapter 7.3.2 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.2-2 Cap Opener Open / Close Home Position Detection

No Check Item Remedy


1 Photocoupler detached from plate? Remove rear cover (P/N 741-3105).
Check whether the photocoupler below has become detached from
plate.
Home Pos: PI033
Exchange photocoupler if it is detached from plate.
2 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
3 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1 : +5V) on the photocoupler below.
Home Pos: PI033
Exchange the photocoupler if it does not output +5V.
4 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J530 connector (for cap opener O/C movement) in the
Stand-by situation.
Move the hook of the cap opener up and down by hand.
Check the signal voltage output of J531 connector below.
Home Pos: #9 pin (closed: ca. 5V, open: ca. 0V)
Exchange photocoupler if it does not output signal voltage.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
6 Tension of timing belt loose? Refer to Chapter 4.4.3.
Check tension of timing belt.
Adjust tension of timing belt by moving the pulse motor
PH264-C97 assembly (P/N 741-4255) again if the timing belt is
loose.
7 Cam itself defective? Check whether pin (P/N 741-0522) and holder (741-0520) are
defective.
Exchange if defective.
8 Motor fixed properly? Check that the pulse motor PH264-C97 assembly is fixed.
Fix the pulse motor assembly by tightening the fixing screws if it
not properly fixed.

V 1.6 – April 1999 2 Chapter 7.3.2


RD/Hitachi Elecsys 2010 Service Manual

7.3.3. Beads Mixer


7.3.3-1 Beads Mixer Arm Home Position Detection, Beads Mixer Arm Stop Position Detection

No Check Item Remedy


1 Vessel or tip around photocoupler? Remove cover R (P/N 741-1017).
Check whether there are vessels or tips around the beads mixer
mechanism and remove.
2 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Check connections of each of the photocouplers below.
Home Pos: PI041
Stop Pos: PI042
Connect lead wire between photocoupler and connector if
disconnected.
3 Detection plate damaged? Check detection plate of pulley S (P/N 741-0549) for damage.
Exchange pulley if detection plate of pulley is damaged.
4 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if pin is disconnected from the
connector.
5 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V .
Check Pin (#1: +5V) of each of the photocouplers below.
Home Pos: PI041
Stop Pos: PI042
Exchange photocoupler if it does not output +5V.
6 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J540 connector (for beads mixer arm rotation) in the
Stand-by situation.
Rotate the beads mixer arm by hand.
Check signal voltage output of J541 connector below.
Home Pos: #3 pin (closed: ca. 5V, open: ca. 0V)
Stop Pos : #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
7 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Tension of timing belt loose? Refer to Chapter 4.4.4.
Check tension of timing belt.
Adjust tension of timing belt by moving the pulse motor
PX 244M-02A assembly (P/N 741-0601) again if the timing belt is
loose.
9 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
10 Motor or pulley fixed properly? Check that the pulse motor PX 244M-02A assembly
(P/N 741-0601) and pulley (P/N 741-0549) are fixed.
Fix the pulse motor PX 244M-02A assembly and pulley S by
tightening the fixing screws if they are not properly fixed.

Chapter 7.3.3 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.3-2 Beads Mixer Upper Dead Position Detection

No Check Item Remedy


1 Cap of RackPack defective? Check whether cap of RackPack closes by itself after opening it by hand.
Exchange cap of RackPack if closes by itself.
2 Photocoupler detached down from plate? Remove front cover assembly (P/N 741-0606).
Remove beads mixer mechanism from instrument.
Check whether photocoupler for upper dead position detection has
become detached from frame (P/N 741-1220).
Upper Dead Pos: PI043
Exchange photocoupler if it is detached from plate.
3 Wire lead disconnected from the Refer to cross wiring reference.
connector? Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply when it did not output +5V .
Check Pin (#1 : +5V) on the photocoupler below.
Upper Dead Pos: PI043
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J540 connector (for beads mixer arm rotation) in the
Stand-by situation. Rotate the beads mixer arm by hand.
Check signal voltage output of J541 connector below.
Upper Dead Pos.: #9 pin (closed: ca. 5V , open : ca. 0V)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.4.
Check tension of timing belt.
Adjust tension of timing belt by moving the motor Z assembly
(P/N 741-0603) again if the timing belt is loose.
8 Timing Belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if it is defective.
9 Motor fixed properly? Check that the pulse motor Z assembly is fixed.
Fix the motor Z assembly by tightening the fixing screws if it is not
properly fixed.

V 1.6 – April 1999 2 Chapter 7.3.3


RD/Hitachi Elecsys 2010 Service Manual

7.3.4 Barcode Reader Mechanism


7.3.4-1 BCR Home Position Detection

No Check Item Remedy


1 Photocoupler connected correctly? Remove table cover L ((P/N 741-0614).
Check connections of the photocoupler below.
Home Pos: PI151
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of bracket (P/N 741-1321) for damage.
Exchange bracket if detection plate of bracket is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check Pin (#1 : +5V) on the photocoupler below.
Home Pos: PI151
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J650 connector (for BCR rotation) in the Stand-by
situation.
Rotate the BCR mechanism by hand.
Check signal voltage output of J651 connector below.
Home Pos: #3 pin (closed: ca. 5V , open: ca. 0V)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Motor fixed properly? Check that the motor BCR assembly (P/N 741-0600) is fixed.
Fix the motor BCR assembly by tightening the fixing screws if it is
not properly fixed.
8 Gear defective? Check whether part of gear of bracket (P/N 741-1321) is
defective.
Exchange bracket if defective.

Chapter 7.3.4 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.5 Sample Disk Mechanism


7.3.5-1 S.Disk Home Position Detection
S.Disk Stop Position Detection

No Check Item Remedy


1 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Remove sample jacket (P/N 741-1187).
Check connections of each of the photocouplers below.
Home Pos: PI021
Stop Pos: PI022
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N 741-1186) for damage.
Exchange pulley if detection plate of pulley is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1: +5V) on each of the photocouplers below.
Home Pos: PI011
Stop Pos: PI012
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J510 connector (for S. disk rotation) in the Stand-by
situation. Rotate the S. disk by hand.
Check signal voltage output of J511 connector below.
Home Pos: #3 pin (closed: ca. 5V, open: ca. 0V)
Stop Pos: #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.1.
Check tension of timing belt.
Adjust tension of timing belt by moving the motor S assembly
(P/N 741-0550) again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor fixed properly? Check that the motor S assembly is fixed.
Fix motor S assembly by tightening the fixing screws if it is not
properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.5


RD/Hitachi Elecsys 2010 Service Manual

7.3.6 Pipetter Mechanism


7.3.6-1 Pipetter-X Home Position Detection, Pipetter-X End Position Detection

No Check Item Remedy


1 Photocoupler detached from plate? Check whether the photocouplers below have become detached
from plate.
Home Pos: PI051
End Pos: PI052
Exchange photocoupler if it is detached from plate.
2 Detection plate damaged? Check detection plate of P. carrier (P/N 741-1053) for damage.
Exchange P. Carrier if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V .
Check pin (#1: +5V) of each of the photocouplers below.
Home Pos: PI051
End Pos: PI052
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
Move the pipetter mechanism X direction by hand.
Check signal voltage output of each connector on Dist-PA board
below.
Home Pos: #3 pin (closed: ca. 5V, open: ca. 0V) of J554
connector.
End Pos: # 3 pin (same as above) of J555 connector.
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.5.
Check tension of timing belt.
Adjust tension of timing belt by moving the base (P/N 741-0506)
again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor and pulley fixed properly? Check that the motor X and X pulley assembly (P/N 741-0602)
are fixed.
Fix motor X and X pulley assembly by tightening the fixing
screws if they were not properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.6


RD/Hitachi Elecsys 2010 Service Manual

7.3.6-2 Pipetter Upper Dead Position Detection, Pipetter-Z Abnormal Descent Detection

No Check Item Remedy


1 Photocoupler detached down from plate? Check whether the photocoupler below has become detached from
plate.
Upper dead Pos: PI054
Exchange photocoupler if it is detached from plate.
2 Detection plate damaged? In case of pipetter upper dead position detection:
Check detection plate of P. arm base (P/N 741-1050) for damage.
Exchange P. arm base if its detection plate is damaged.
In case of pipetter Z abnormal descent detection:
Check detection plate of pipetter probe for damage.
Exchange pipetter probe if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 FPC cable scratched? Check whether FPC cable is scratched.
Exchange FPC cable if scratched.
Refer to cross wiring reference.
Check that resistance between each pin on the FPC cable is ca.0 []
using a multimeter.
Exchange FPC cable if the resistance between each pin
on the FPC cable is more than a few hundred ohms.
5 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check +5V is output at the pin of each of the photocouplers
below.
Upper dead Pos: #1 pin of PI054
Pipetter Z abnormal descent : #1, #3 pin of PI055
Exchange photocoupler if it does not output +5V.
6 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
In case of pipetter upper dead position detection:
Move pipetter mechanism in Z direction by hand.
In case of pipetter Z abnormal descent detection:
Move pipetter probe up by hand.
Check signal voltage output of J556 connector on Dist-PA
board below.
Upper dead Pos : #9 pin (closed: ca. 5V, open: ca. 0V)
Pipetter Z abnormal descent: #3 pin (open: ca. 5V,
closed: ca.0V).
Exchange photocoupler if it does not output signal voltage.
7 All cable leads connected correctly? Refer to Cross Wiring Reference.
Connect the connector when it disconnected.
8 Tension of timing belt loose? Refer to Chapter 4.4.5.
Check tension of timing belt.
Adjust tension of timing belt by moving pulse motor KH423
M2-052. (P/N 741-1049) again if the timing belt is loose.

Chapter 7.3.6 2 V 1.6 - April 1999


RD/Hitachi Elecsys 2010 Service Manual

No Check Item Remedy


9 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
10 Motor and pulley fixed properly? Check that the pulse motor and pulley P (P/N 741-1055) are fixed.
Fix pulse motor and pulley P by tightening the fixing screws if they
were not properly fixed.

V 1.6 – April 1999 3 Chapter 7.3.6


RD/Hitachi Elecsys 2010 Service Manual

7.3.7 Pipetter / Sipper Syringe


7.3.7-1 Pipetter Syringe Upper Dead Position Detection, Sipper Syringe Upper Dead Position Detection

No Check Item Remedy


1 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Check the connections of each of the photocouplers below.
Pipetter syringe upper dead Pos: PI091
Sipper syringe upper dead Pos: PI101
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of fixture (P/N 725-1072) for damage.
Exchange fixture if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#2: +5V) of the photocouplers below.
Pipetter syringe upper dead Pos: PI091
Sipper syringe upper dead Pos: PI101
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Execute Pipetter Prime and Sipper Prime in Maintenance
Screen.
Check signal voltage output of J591 connector below.
Pipetter syringe upper dead Pos : #3 pin (closed: ca. 0V,
open: ca. 5V)
Sipper syringe upper dead Pos : #6 pin (same as above).
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.9.
Check tension of timing belt.
Adjust tension of timing belt by moving pulse motor PH265M
33 assembly (P/N 741-0804) again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor and pulley fixed properly? Check that the pulse motor PH265M33 and pulley 2
(P/N 741-1094) are fixed.
Fix pulse motor and pulley 2 by tightening the fixing screws if
they are not properly fixed.

Chapter 7.3.7 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.8 Gripper Mechanism


7.3.8-1 Gripper-X Home Position Detection

No Check Item Remedy


1 Carrier-Z is touching something? Move carrier-Z assembly (P/N 741-0123) in the X direction by hand.
Check whether carrier-Z touches anything.
Readjust carrier-Z if it touched something.
2 Detection plate damaged? Remove cover C (P/N 741-1150).
Check detection plate of slider X (P/N 741-1138) for damaged.
Exchange slider X if its detection plate is damaged.
3 FPC cable scratched? Check whether FPC cable is scratched.
Exchange FPC cable if scratched.
Refer to cross wiring reference.
Check that resistance between each pin on the FPC cable is ca.0 []
using a multimeter.
Exchange FPC cable if the resistance between each pin on the FPC
cable is more than a few hundred ohms.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check Pin (#1, #3: +5V) of the photocoupler below.
Home Pos: PI061
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Remove cover Y and magazine tray (P/N 741-1130).
Move carrier-Z in the X direction by hand.
Check signal voltage output of J565 connector below.
Home Pos: #12 pin (closed: ca. 0V, open: ca. 5V)
Exchange photocoupler if it does not output signal voltage.
6 Wire lead disconnected from the Refer to the cross wiring reference.
connector? Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
7 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Tension of timing belt loose? Refer to Chapter 4.4.6.
Check tension of timing belt.
Adjust tension of timing belt by moving holder C (P/N 741-1123)
again if the timing belt is loose.
9 Timing Belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
10 Motor and pulley fixed correctly? Check that the motor C assembly (P/N 741-4320) and pulley C
(P/N 741-1140) are fixed.
Fix motor C assembly and pulley C by tightening the fixing screws if
they were not properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.8


RD/Hitachi Elecsys 2010 Service Manual

7.3.8-2 Gripper-Y Home Position Detection, Gripper-Y End Position Detection, Gripper-Y Rest Position
Detection

No Check Item Remedy


1 Slider-Y is touching something? Move the gripper mechanism in the Y direction by hand.
Check whether slider Y (P/N 741-1116) touches the DET A board
(P/N 741-5016) or DET B board (741-5017).
Readjust the DET A or DET B board if slider Y touched it.
Check whether slider Y touches cover Y (P/N 741-1128).
Adjust cover Y if slider Y touched it.
2 Detection plate damaged? Remove cover Y.
Check detection plate of slider Y (P/N 741-1116) for damage.
Exchange slider Y if its detection plate is damaged.
3 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1, #3: +5V) of each of the photocouplers below.
Home Pos: PI063
End Pos: PI 064
Rest Pos: PI 065
Exchange photocoupler if it does not output +5V.
4 Signal voltage output correct? Turn on power SW of instrument.
Remove cover Y (P/N 741-1128) and magazine tray
(P/N 741-1130).
Move the gripper mechanism in the X direction by hand.
Check signal voltage output of each connector on the Dist-TVA
board below.
Home Pos: #3 pin of J563 connector (closed: ca. 0V,
open: ca. 5V).
End Pos #5 pin of J564 connector (same as above).
Rest Pos: #3 pin of J564 connector (same as above).
Exchange photocoupler if it does output signal voltage.
5 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.6.
Check tension of timing belt.
Adjust tension of timing belt by moving holder C (P/N 741-1139)
again if the timing belt is loose.
8 Timing belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor and pulley fixed properly? Check that the motor C assembly (P/N 741-4320) and pulley C
(P/N 741-1140) are fixed.
Fix motor C assembly and pulley C by tightening the fixing if they
are not properly fixed.

Chapter 7.3.8 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.8-3 Gripper Solenoid Abnormal Descent Detection, Gripper Finger Grip Detection

No Check Item Remedy


1 Fingers opened/closed correctly? Remove cover Z (P/N 741-1159).
Check open/close movement of gripper finger by hand.
Exchange rotary solenoid 2ER45-33 assembly (P/N 741-4322) if the
open/close movement of gripper finger was not good.
2 Photocoupler located correctly? Check that the photocoupler (abnormal descent: PI067 , grip: PI068)
is located correctly.
Reposition the photocoupler if the location was not good.
3 Detection plate damaged? In case of abnormal descent detection:
Check the detection plate of arm S (P/N 741-1165) for damage.
Exchange arm S if damaged.
In case of grip detection:
Check detection plate of arm L (P/N 741-1164) for damage.
Exchange arm L if damaged.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1, #3: +5V) of each of the photocouplers below:
Abnormal descent: PI067
Grip detection: PI068
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Remove cover Y (P/N 741-1128) and magazine tray (P/N 741-1130).
Move gripper finger arm up by hand.
Make the gripper finger catch a vessel or tip.
Check signal voltage output of J566 connector of Dist-TVA board
below.
Abnormal descent : #4 pin (closed: ca. 0V, open: ca. 5V).
Grip Detection: #3 pin (same as above).
Exchange photocoupler if it does not output signal voltage.
6 Wire lead disconnected from the Refer to the cross wiring reference.
connector? Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
7 FPC cable scratched? Check whether FPC cable is scratched.
Exchange FPC cable if scratched.
Refer to cross wiring reference.
Check that the resistance between each pin on the FPC cable is ca.0 []
using a multimeter.
Exchange the FPC cable if the resistance between each pin on the
FPC cable is more than a few hundred ohms.
8 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

V 1.6 – April 1999 3 Chapter 7.3.8


RD/Hitachi Elecsys 2010 Service Manual

7.3.8-4 Gripper Upper Dead Position Detection

No Check Item Remedy


1 Photocoupler located correctly? Remove cover Z (P/N 741-1159).
Check that the photocoupler (upper dead position: PI066)
is located correctly.
Reposition the photocoupler if the location was not good.
2 Movement of gripper assembly Turn off power SW of instrument.
(P/N 741-0124) is smooth? Check that the movement of the gripper assembly is smooth when
moved up and down by hand.
Check whether the gripper assembly touches something.
Move the part of touching the gripper assembly out of the way.
3 Detection plate damaged? Check the shield plate (P/N 741-1169) for damage.
Exchange the shield plate if damaged.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1, #3: +5V) of photocoupler below.
Abnormal descent: PI066
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Remove cover Y (P/N 741-1128) and magazine tray (P/N
741-1130).
Move gripper finger arm up by hand.
Check signal voltage output of J565 connector of Dist-TVA board
below.
Upper dead position: #10 pin (closed: ca. 0V,
open: ca. 5V).
Exchange photocoupler if it does not output signal voltage.
6 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
7 FPC cable scratched? Check whether FPC cable is scratched.
Exchange FPC cable if scratched.
Refer to cross wiring reference.
Check that resistance between each pin on the FPC cable is ca.0
[V]
using a multimeter.
Exchange the FPC cable if the resistance between each pin on the
FPC cable is more than a few hundred ohms.
8 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

Chapter 7.3.8 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.8-5 Adjustment of Gripper Mechanism

No Check Item Remedy


1 Gripper finger catches vessel or tip Check that gripper finger L (P/N 741-1996) and gripper finger LL
correctly? (P/N741-1145) are parallel with each other.
Adjust gripper fingers L and LL so that they are parallel with each
other again.
2 Vessel left on incubator after running? Remove cover Z (P/N 741-1159).
Check that gripper finger L and gripper finger LL are mounted
vertically to the incubator.
Adjust gripper fingers L and LL so that they are vertical to the
incubator if they were not vertical.
Check that the incubator is mounted parallel to magazine tray.
Adjust so that incubator is again parallel to magazine tray.
Check input offset value after adjusting each gripper position
using the gripper position adjustment jig (P/N 741-1471).
Offset value: front 2 pulse, right 2 pulse
3 Adjusted value was reflected operation Check whether floppy disk is write-protected.
moving? Make floppy disk writable.
Check that light on FDD turned on and off after adjusting.
Exchange FDD if light did not turn on and off.

V 1.6 – April 1999 5 Chapter 7.3.8


RD/Hitachi Elecsys 2010 Service Manual

7.3.9. Solid Waste


7.3.9-1 Solid Waste Home Position Detection

No Check Item Remedy


1 Vessel or tip around the solid waste? Remove magazine tray (P/N 741-1130).
Check whether there are vessels or tips around solid waste and
remove.
2 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Remove cover R (P/N 741-1017).
Check the connections for each of the photocouplers below.
Home Pos: PI141
Box detection: PI142
Connect lead wire between photocoupler and connector if
disconnected.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1: +5V) of each of the photocouplers below:
Home Pos: PI141
Box detection: PI142
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J640 connector (for solid waste shaking) in Stand-by.
Move the solid waste container back and forth by hand.
Check signal voltage output of the J641 connector below.
Home Pos: #3 pin (closed: ca. 5V, open: ca. 0V)
Box detection: #4 pin (closed: ca. 0V, open: ca.5V)
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

V 1.6 – April 1999 1 Chapter 7.3.9


RD/Hitachi Elecsys 2010 Service Manual

7.3.10. Sipper Mechanism


7.3.10-1 Sipper-X Home Position Detection, Sipper-X End Position Detection

No Check Item Remedy


1 Photocoupler connected correctly? Remove front cover assembly (P/N 741-0606).
Remove front cover (SIP) (P/N 741-1440).
Check connections of each of the photocouplers below.
Home Pos: PI081
End Pos: PI082
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of shield plate (P/N 741-1475) for damage.
Exchange shield plate if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check pin (#1: +5V) of each of the photocouplers below.
Home Pos: PI081
End Pos: PI082
Exchange photocoupler if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Disconnect J585 connector (for sipper-X movement) in Stand-by.
Move sipper Z assembly (P/N 741-0139) in the X direction by
hand.
Check signal voltage output of each connector on the Dist-SA
board below.
Home Pos: #3 pin of J583 connector (closed: ca. 5V,
open: ca. 0V).
End Pos: #3 pin of J584 connector (same as above).
Exchange photocoupler if it does not output signal voltage.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
7 Tension of timing belt loose? Refer to Chapter 4.4.7.
Check tension of timing belt.
Adjust tension of timing belt by moving holder MD (P/N 741-
1484) again if the timing belt is loose.
8 Timing Belt itself defective? Check whether the timing belt is defective.
Exchange the timing belt if defective.
9 Motor and pulley fixed correctly? Check that the X motor S assembly (P/N 741-4248) and holder
MD (P/N 741-1484) are fixed.
Fix X motor S assembly and holder MD by tightening the fixing
screws if they are not fixed.

V 1.6 – April 1999 1 Chapter 7.3.10


RD/Hitachi Elecsys 2010 Service Manual

7.3.10-2 Sipper Upper Dead Position Detection, Sipper-Z Abnormal Descent Position Detection

No Check Item Remedy


1 Photocoupler detached from plate? Check whether photocoupler below has become detached from
plate.
Upper dead Pos : PI083
Exchange photocoupler if it is detached from plate.
2 Detection plate damaged? In case of sipper upper dead position detection:
Check detection plate of base (P/N 741-1479) for damage.
Exchange base if its detection plate is damaged.
In case of sipper-Z abnormal descent detection:
Check detection plate of sipper probe for damage.
Exchange sipper probe if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 FPC cable scratched? Check whether FPC cable is scratched.
Exchange FPC cable if scratched.
Refer to the cross wiring reference.
Check that the resistance between each pin on the FPC cable is
ca.0 [] using a multi meter.
Exchange FPC cable if the resistance between each pin on the
FPC cable is more than a few hundred ohms.
5 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V .
Check +5V is output at pin of each of the photocouplers below.
Upper dead Pos.: #1 pin of PI083.
Pipetter-Z abnormal descent: #1, #3 pin of PI084
Exchange photocoupler if it does not output +5V.
6 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
In case of sipper upper dead position detection:
Move sipper-Z assembly (P/N 741-0139) in the Z direction by
hand.
In case of sipper-Z abnormal descent detection:
Move sipper probe up by hand.
Check signal voltage output of J586 connector on Dist-SA
board below.
Upper dead Pos: #8 pin (closed: ca. 5V, open: ca. 0V)
Pipetter-Z abnormal descent: #3 pin (open: ca. 5V, closed:
ca. 0V).
Exchange photocoupler if it does not output signal voltage.
7 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Tension of timing belt loose? Refer to Chapter 4.4.7. Check tension of timing belt.
Adjust tension of timing belt by moving cord P587 assembly
with motor (P/N 741-4251) again if the timing belt is loose.

Chapter 7.3.10 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

9 Timing belt itself defective? Check whether the timing belt is defective.
Exchange timing belt if it is defective.
10 Motor and pulley fixed properly? Check that cord P587 assembly with motor (P/N 741-4251)
and pulley P (P/N 741-1055) are fixed.
Fix cord P587 assembly with motor and pulley P by tightening
the fixing screws if they are not properly fixed.

V 1.6 – April 1999 3 Chapter 7.3.10


RD/Hitachi Elecsys 2010 Service Manual

7.3.11. Magnet Drive Mechanism


7.3.11-1 Magnet Drive Home Position Detection

No Check Item Remedy


1 Photocoupler detached from plate? Check whether the photocoupler below has become detached from
the plate.
Home Pos: PI111
Exchange photocoupler if it is detached from plate.
2 Detection plate damaged? Check detection plate of magnet arm assembly (P/N 741-0610) for
damage.
Exchange magnet arm assembly if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 Magnet arm assembly touches a cable? Remove side cover (P/N 741-3114), front cover (P/N 741-0618).
Check whether the magnet arm assembly touches a cable.
Change the way the cable is bundled if the magnet arm
assembly is touching a cable.
5 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check +5V is output at pin of the photocoupler below.
Home Pos.: #1 pin of PI083.
Exchange photocoupler if it does not output +5V.
6 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
Move the magnet arm assembly back and forth by hand.
Check the signal voltage output of the J601 connector below:
Home Pos.: #9 pin (closed: ca. 5V, open: ca. 0V)
Exchange photocoupler if it does not output signal voltage.
7 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Motor functions correctly? Remove cover (741-0619).
Execute Magnet Up/Down in the Mecha Check Screen.
Check that the magnet arm assembly moves correctly.
Remove the magnet drive assembly (P/N 741-0151) if it does not
move correctly.
Repair or exchange the faulty part.

Chapter 7.3.11 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.12. Pipetter Buffer

No Check Item Remedy


1 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check +5V is output at pin of the photocoupler below:
Twin detect: #2, #5 pin of J559 connector.
Exchange photocoupler PS051 if it does not output +5V.
2 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
Insert tip into buffer position by hand.
Check signal voltage output of J559 connector below:
Signal 1: #6 pin (closed: ca. 0V, open: ca. 5V)
Signal 2: #4 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
4 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

V 1.6 – April 1999 1 Chapter 7.3.12


RD/Hitachi Elecsys 2010 Service Manual

7.3.13. Distilled Water Float Switch

No Check Item Remedy


1 Wire lead disconnected from the connector? Remove rear cover and front cover assembly.
Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from
the connector.
2 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC power supply if it did not output +5V.
Check +5V is output at pin of the photocoupler below:
Float SW: #1 pin of J630 connector.
Exchange float SW PI131 if it does not output +5V.
3 Signal voltage output correct? Turn on power SW of instrument.
Wait until instrument goes into Stand-by.
Check signal voltage output of J630 connector below:
Float SW: #3 pin (closed: ca. 5V, open: ca. 0V)
Closed means water empty in buffer tank, Open means
water in buffer tank.
Exchange float SW if it does output signal voltage.
4 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

Chapter 7.3.13 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.14. System Reagent Unit


7.3.14-1 AB / CC Bottle Detection

No Check Item Remedy


1 Does LED on the sensor light up? Remove S.R cover (P/N 741-1378).
Check whether the LED on the sensor lights up when AB/CC
bottle is put in the system reagent unit.
Exchange sensor assembly (P/N 741-4327) if the LED does not
light up.
2 Wire lead disconnected from the connector? Remove rear cover and front cover assembly and S.R cover.
Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
3 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC poser Supply if it did not output +5V.
Check +5V is output at pin of the photocoupler below.
Bottle 1: #1 pin of J663 connector.
Bottle 2: #4 pin of J663 connector.
Photocoupler outputs ca. +5V when there is AB/CC bottle in the
system reagent unit and ca. 0V when there is no bottle in the
system reagent unit.
Exchange the photosensor if it does not output +5V.
4 Signal voltage output correct? Turn on power SW of instrument.
Wait until the instrument goes into Stand-by.
Place AB/CC bottle in the system reagent unit by hand.
Check signal voltage output of J663 connector below.
Signal 1: #3 pin (closed: ca. 0V, open: ca. 5V)
Signal 2: #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

Chapter 7.3.14 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.3.15 Liquid Waste Mechanism


7.3.15-1 Waste Tank Detection, Waste Tank Full Detection

No Check Item Remedy


1 No Waste Tank Container changed the Check Waste Tank Container (P/N 741-1510) changed the shape.
shape? Exchange Waste Tank Container when it changed the shape.
2 No Detection Plate changed the shape? Check Detection Plate of Support (P/N 741-1513) and Plate (P/N
741-1515) changed the shape.
Exchange Support or Plate when it changed the shape.
3 Wire lead disconnected from the connector? Remove rear cover and front cover assembly.
Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Exchange DC poser Supply if it did not output +5V .
Check +5V is output at pin of the photocoupler below:
Waste tank container: #1 pin of J631 connector.
Waste tank full: #4 pin of J631 connector.
Exchange photosensor if it does not output +5V.
5 Signal voltage output correct? Turn on power SW of instrument.
Wait until the instrument goes into Stand-by.
Place a waste tank container in the liquid waste base assembly by
hand.
Place a waste tank container full of water in the liquid waste base
assembly.
Check signal voltage output of J631 connector below:
Waste tank container: #3 pin (close: ca. 5V, open: ca. 0V)
Waste tank full: #6 pin (same as above)
Exchange photocoupler if it does not output signal voltage.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.

V 1.6 – April 1999 1 Chapter 7.3.15


RD/Hitachi Elecsys 2010 Sevice Manual

7.3.16 Troubleshooting list for Rack Sampler System.


- A Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Tray detection: PI200
Home Pos. detection: PI201
Rack feed end Pos. detection: PI202
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N7672840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to Cross Wiring Reference.
Connect the connector when it disconnected.
6 Timing belt itself defective? Check whether timing belt A (P/N741-7571) is defective.
Exchange timing belt A (P/N741-7571) if defective.
7 Motor fixed properly? Check that the motor assembly is fixed properly.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.16


RD/Hitachi Elecsys 2010 Sevice Manual

- B Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Home Pos. detection: PI210
Rack feed end Pos. detection: PI211
Rack detection: PI212
STAT Pos. detection: PI213
Sampling Pos. detection: PI215
BCR read Pos. detection: PI216
Cup detection: PI217
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N767-2840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Timing belt itself defective? Check whether timing belt B (P/N741-7572) is defective.
Exchange timing belt B (P/N741-7572) if defective.
9 Motor fixed properly? Check that motor assembly (P/N 741-0551) is fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 2 Chapter 7.3.16


RD/Hitachi Elecsys 2010 Sevice Manual

- C Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below:
Home Pos. detection: PI221
Rack feed end Pos. detection: PI222
Rack full detection: PI223
Tray detection: PI224
Tray full 1 detection: PI225
Tray full 2 detection: PI226
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N767-2840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
6 Timing belt itself defective? Check whether timing belt CG (P/N741-7573) is defective.
Exchange timing belt CG (P/N741-7573) if defective.
7 Motor fixed properly? Check that the motor assembly is properly fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 3 Chapter 7.3.16


RD/Hitachi Elecsys 2010 Sevice Manual

7.3.17 Troubleshooting list for Rack Sampler connected to CLAS1 System

- A Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Tray detection: PI200
Home Pos. detection: PI201
Rack feed end Pos. detection: PI202
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N7672840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to Cross Wiring Reference.
Connect the connector when it disconnected.
6 Timing belt itself defective? Check whether timing belt A (P/N741-7571) is defective.
Exchange timing belt A (P/N741-7571) if defective.
7 Motor fixed properly? Check that the motor assembly is fixed properly.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 1 Chapter 7.3.17


RD/Hitachi Elecsys 2010 Sevice Manual

- B Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Home Pos. detection: PI210
Rack feed end Pos. detection: PI211
Rack detection: PI212
STAT Pos. detection: PI213
Sampling Pos. detection: PI215
BCR read Pos. detection: PI216
Cup detection: PI217
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N767-2840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
6 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
8 Timing belt itself defective? Check whether timing belt B (P/N741-7572) is defective.
Exchange timing belt B (P/N741-7572) if defective.
9 Motor fixed properly? Check that motor assembly (P/N 741-0551) is fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 2 Chapter 7.3.17


RD/Hitachi Elecsys 2010 Sevice Manual

- C Line
No Check Item Remedy
1 Photocoupler connected correctly? Check the connections for each of the photocouplers below:
Home Pos. detection: PI221
Rack feed end Pos. detection: PI222
Rack full detection: PI223
Tray detection: PI224
Tray full 1 detection: PI225
Tray full 2 detection: PI226
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N767-2840,767-2846).
Exchange pulley if its detection plate is damaged.
3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
6 Timing belt itself defective? Check whether timing belt CG (P/N741-7573) is defective.
Exchange timing belt CG (P/N741-7573) if defective.
7 Motor fixed properly? Check that the motor assembly is properly fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 3 Chapter 7.3.17


RD/Hitachi Elecsys 2010 Sevice Manual

- Turntable C

No Check Item Remedy


1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Turn belt, rack detection: PI310
Turn belt, rack detection: PI311
Rotation, home Pos. detection: PI312
Rotation, turn end Pos. detection: PI313
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley (P/N741-7332,741-7523).
Exchange pulley if its detection plate is damaged.

3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
6 Timing belt itself defective? Check whether the conveyor belt (P/N741-7521) is defective.
Exchange conveyor belt (P/N741-7521) if defective.
7 Motor fixed properly? Check that the motor assembly is properly fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 4 Chapter 7.3.17


RD/Hitachi Elecsys 2010 Sevice Manual

- I Line

No Check Item Remedy


1 Photocoupler connected correctly? Check the connections for each of the photocouplers below.
Home Pos detection: PI300
Rack feed end Pos. detection: PI301
Rack detection: PI302
Rack buffer Pos. Detection: PI303
Connect lead wire between photocoupler and connector if
disconnected.
2 Detection plate damaged? Check detection plate of pulley.
Exchange pulley if its detection plate is damaged.

3 Wire lead disconnected from the connector? Refer to cross wiring reference.
Check whether pin is disconnected from the connector.
Insert pin into the connector again if it is disconnected from the
connector.
4 +5V supply voltage supplied? Check that +5V is supplied by DC power supply.
Signal voltage output correct? Exchange DC power supply if it did not output +5V.
Confirm the function of each photocoupler by using the
Monitoring Sensors function in the Admin screen.
Exchange photocoupler if defective.
5 All cable leads connected correctly? Refer to cross wiring reference.
Connect the connector if it is disconnected.
6 Timing belt itself defective? Check whether the timing belt is defective.
Exchange timing Belt E if defective.
7 Motor fixed properly? Check that the motor assembly is properly fixed.
Fix the motor assembly by tightening the fixing screws if it was
not properly fixed.

V 1.6 – April 1999 5 Chapter 7.3.17


RD/Hitachi Elecsys 2010 Service Manual

7.4 Data File Load Errors

<Error Messages on Failure in Data File Loading>

1. The data files indicated in the following table are loaded onto DRAM.
2. On occurrence of a failure in loading, the relevant error message is presented on UI and the power-up sequence is
forced to stop. Note, however, that the power-up sequence is not stopped for "param.dat".

No. Error Message on Storage Medium File Name Description Cause


Failure in Loading
1 Data File 1 Load Error FLASH ROM - An error has occurred during loading Stop
of device information (serial number,
version number, etc.).
2 Data File 2 Load Error FD - ID check is performed in loading of Stop
data FD ID.
An error has occurred during loading
of data FD ID.
3 Data File 3 Load Error FLASH ROM - An error has occurred during loading Stop
of time chart data.
4 Data File 4 Load Error FLASH ROM - An error has occurred during loading Stop
of time chart control parameters.
5 Data File 5 Load Error FLASH ROM - An error has occurred during loading Stop
of multi-lingual character strings.
6 Data File 6 Load Error FLASH ROM - An error has occurred during loading Stop
of color definition data.
7 Data File 7 Load Error FLASH ROM - - -
8 Data File 8 Load Error FLASH ROM - - -
9 Data File 9 Load Error FD reagent.dat An error has occurred during loading Retry/Stop
of reagent information.
10 Data File 10 Load FD sample.dat An error has occurred during loading Retry/Stop
Error of sample information.
11 Data File 11 Load FD control.dat An error has occurred during loading Retry/Stop
Error of control information.
12 Data File 12 Load FD calib.dat An error has occurred during loading Retry/Stop
Error of calibration information.
13 Data File 13 Load FD status.dat An error has occurred during loading Retry/Stop
Error of status information.
14 Data File 14 Load - - - -
Error
15 Data File 15 Load FD message.dat An error has occurred during loading Retry/Stop
Error of message history information.
16 Data File 16 Load FD setup.dat An error has occurred during loading Retry/Stop
Error of setup information.
17 Data File 17 Load FD refer.dat An error has occurred during loading Stop
Error of reference information.
18 Data File 18 Load SRAM - An error has occurred during loading Continue
Error of mechanism adjustment value data.
19 Data File 19 Load SRAM - An error has occurred during loading Continue
Error of tip/vessel position data.
20 Data File 20 Load SRAM - An error has occurred during backup Continue
Error of message history information.
21 Data File 21 Load SRAM - An error has occurred during backup Continue
Error of measurement count data.
22 Data File 22 Load SRAM - An error has occurred during backup Continue
Error of solid waste information.
23 Data File 23 Load - - - -
Error
24 Data File 24 Load - - - -
Error
25 Data File 25 Load FD param.dat An error has occurred during loading Continue
Error of constant-value parameter
information.

V 1.6 – April 1999 1 Chapter 7.4


RD/Hitachi Elecsys 2010 Service Manual

<Error Messages on Power-Up Sequence>

No. Error Message Source File Name Description Cause


1 Self Test Error Boot ROM - An error has occurred during self-test. Stop
2 Boot Error Boot ROM - An error has occurred during loading Stop
of system software.
3 OS initial Error OS - An error has occurred during OS Stop
initialization.
4 Data File 1 Load Error application - Loading of device information (serial -
number, version number, etc.) has
failed.
5 Data File 2 Load Error ditto - Loading of data FD ID has failed. -
6 Data File 3 Load Error ditto - Loading of time chart data has failed. -
7 Data File 4 Load Error ditto - Loading of time chart control -
parameters has failed.
8 Data File 5 Load Error ditto - Loading of multi-lingual character -
strings has failed.
9 Data File 6 Load Error ditto - Loading of color definition data has -
failed.
10 Data File 7 Load Error ditto - - -
11 Data File 8 Load Error ditto - - -
12 Data File 9 Load Error ditto reagent.dat Loading of reagent information has -
failed.
13 Data File 10 Load ditto sample.dat Loading of sample information has -
Error failed.
14 Data File 11 Load ditto control.dat Loading of control information has -
Error failed.
15 Data File 12 Load application calib.dat Loading of calibration information -
Error has failed.
16 Data File 13 Load ditto status.dat Loading of status information has -
Error failed.
17 Data File 14 Load ditto - - -
Error
18 Data File 15 Load ditto message.dat Loading of message history -
Error information has failed.
19 Data File 16 Load ditto setup.dat Loading of setup information has -
Error failed.
20 Data File 17 Load ditto refer.dat Loading of reference information has -
Error failed.
21 Data File 18 Load ditto - Loading of mechanism adjustment -
Error value data has failed.
22 Data File 19 Load ditto - Loading of tip/vessel position data -
Error has failed.
23 Data File 20 Load ditto - Backup loading of message history -
Error information has failed.
24 Data File 21 Load ditto - Backup loading of message count -
Error data has failed.
25 Data File 22 Load ditto - Backup loading of solid waste -
Error information has failed.
26 Data FD ID Error ditto - Data FD ID is invalid. Continue
27 Motor Controller ditto - Initialization of motor controller has Stop
Initialize Error failed.
28 Analog Controller ditto - Initialization of analog controller has Stop
Initialize Error failed.
29 Front Panel SW Off ditto - The front panel switch is turned off. Stop
30 Data File 25 Load ditto - Loading of constant-value parameter -
Error information has failed.
31 Line Main Power Off ditto - The line power supply is turned off. Stop

Chapter 7.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

7.5 Quality Control Check

1. Covers
-check for lead wires is pinched
-check for photo couplers move out
-check for shift of positioning

2. Sample/Assay Reagent Rotation Mechanism


Sample Disk Rotor (after exchange);
-adjust the cup position on sample disk and pipetter nozzle
-adjust the sample disk rotor
-adjust the sample disk rotor belt tension
Assay Reagent Rotor (after exchange);
-adjust the rack pack position on reagent disk and pipetter nozzle
-adjust the reagent disk rotor belt tension

3. Cap Open/Close Mechanism


Forward/Backward Mechanism (after exchange);
-adjust the belt tension
-check for forward/backward movement
Cap Opener Mechanism (after exchange);
-check for hook shift of positioning
-check for cap opener movement

4. Beads Mixer Mechanism


Up/Down Mechanism (after exchange);
-adjust for height of mixing paddle
-check for up/down movement
-check for mixing paddle warp
Rotation Mechanism (after exchange);
-adjust for positioning of rack pack and mixing paddle
-check for rotating movement
Mixing Mechanism (after exchange)
-check for wrap of rubber belt
-check for mixing movement
-check for mixing paddle wrap

V 1.6 – April 1999 1 Chapter 7.5


RD/Hitachi Elecsys 2010 Service Manual

5. Barcode Reader Mechanism


Barcode Reader (after exchange);
-check for light of led
-check for reading label
-rotation Mechanism (after exchange);
-adjust for backlash at gear
-check for rotating movement

6. Pipetter, Sipper Mechanism


Pipetter Mechanism
-check for tube leakage
-adjust for each position
-check for abnormal movement
-check for X direction movement
-check for Z direction movement
Sipper Mechanism (after exchange);
-same as pipetter mechanism

7. Syringes Mechanism (after exchange);


-check for leakage
-check for up/down movement of plunger

8. Gripper Mechanism
X direction motor (after exchange);
-adjust for each position
-check for x direction movement
-adjust for belt tension
Y direction motor (after exchange);
-adjust for each position
-check for Y direction movement
-adjust for belt tension

Chapter 7.5 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Z direction motor (after exchange);


-adjust for each position
-adjust for Z direction movement
-adjust for belt tension
-check for obstacle detection
Solenoid (after exchange);
-check for finger movement

9. solid Waste Mechanism


Motor (after exchange);
-check for shaking movement

10. Incubation Unit


-check for gap temperature of incubator
-check for concerning position with gripper

11. Detection Unit


Measuring Cell (after exchange);
-check for gap between Cell and Cell Base
-check for tube leakage
PMT (after exchange);
-check for socket
-check for gap between PMT and Cell Base
Magnet Drive (after exchange);
-check for out of touch with lead wire
-adjust for position center of Cell
-check for up/down movement

12. Pump Module (after exchange);


-check for tube leakage
-check for noise
-check for fixing certainly
-check for water volume

V 1.6 – April 1999 3 Chapter 7.5


RD/Hitachi Elecsys 2010 Service Manual

13. Solenoid Valves (after exchange);


-check for tube leakage
-check for open/close movement (ON/OFF)
-check for fixing certainly
-check for tube connection

14. PCBs (after exchange);


-check for connectors insert certainly
-check for connectors insert position
-check for out of touch some objects

15. User Interface (after exchange);


-check for indication screen
-check for input touch key
-check for input key switch
-check for buzzer sound

16. Check for the measuring data below Assay Performance Check
-PMT-HV Adjustment
-Artificial media test
-TSH Assay test

Chapter 7.5 4 V 1.6 – April 1999


8. Spare Parts / Recommended Parts

8.1 Special Service Tools

8.2 Complete Recommended Parts List (including Acceptable Parts)


8.2.1 Complete Recommended Parts List (including Acceptable Parts) for Elecsys 2010
8.2.2 Complete Recommended Parts List (including Acceptable Parts) for Rack Sampler / connected
to CLAS 1 System

8.3 Printed Circuit Boards List

8.4 Temperature Parts Available on Stock at Roche Diagnostics


RD/Hitachi Elecsys 2010 Service Manual

8. Spare Parts/Recommended Parts

8.1 Special Service Tools


The following are necessary/recommended special tools for service activities.
No. Name Part Number What purpose is Referred Chapter
1 Gripper Adjustment 741-1471 is to be used for manual gripper adjustment by Chapter 6.2.5
Tool attaching between the gripper fingers.
2 Gripper Tool 741-2154 is to be used for automatic adjustment. Chapter 6.1.11
3 Gripper Sensor Tool 741-2022 is to be used for adjusting a tolerance limit
where the gripper fingers open and close.
The tool consists of two(2) different diametric
ones.
4 Magnet Drive Tool 741-1627 is to be used for adjusting a magnet position Chapter 4.4.14.7
where may be sufficient for Beads capturing. Adjustment of
Attach the tool into a Base in stead of a Magnet Position
Measuring Cell.
5 Tin Plate 0.8 741-1985 is to be used for adjusting a tolerance limit Chapter 5.3.4
where Pipetter detects a crash. Adjustment of
Pipetter Z Abnormal
6 Tin Plate 1.2 741-1986 According to Adjustment Procedure, check the Detection
crash sensor signal output by measuring the
voltage between the connector pin#3 of J556
and TP2 AG on DIST-P Board.
7 Pin Extraction Tool 1 741-5916 is to be used for detaching a wire from a
connector for instance, P591, P592, etc.
8 Pin Extraction Tool 2 741-5919 is to be used for detaching a wire from a
connector for instance, J591, J592, etc.
9 Pin Extraction Tool 3 741-5915 is to be used for detaching a wire from a
connector for instance, P16, J16 etc.
10 Pin Extraction Tool 4 J826845 is to be used for detaching a wire from a
connector for instance, P13, P14, J13, J14, etc.
11 Long Driver N330013 is to be used for dis- and re-assembling a
mechanical part.
12 PPM Meter 1903152 is to be used for mixer speed adjustment. Chapter 2.6.1.1
13 Flange Kit 1802208 is to be used for tubings.

V 1.6 – April 1999 1 Chapter 8.1


RD/Hitachi Elecsys 2010 Service Manual

8.2 Completed Recommended Parts List (including Acceptable Parts)


8.2.1 Completed Recommended Parts List (including Acceptable Parts)
for Elecsys 2010

Note1) a: Acceptable Parts


Note2) A: Kits for Service man box.
B: Stock in each country.
C: General Stock in RD.
I: Number of Parts mounted per each instrument.

No. P/N a Part Name Quantity Unit to be applied


A B C I
1 741-0550 ✓ Pulse Motor KP56KM1-014 1 S.Disk
2 741-1120 ✓ Pulse Motor KH56KM2-027 4 4 R.Disk, Pipetter, T/V Carrier, Sipper

3 741-1048 ✓ Pulse Motor KH56HM2-016 2 2 Cap Opener, Solid Waste

4 741-4255 ✓ Pulse Motor PH264-C97 Assy 2 1 Cap Opener


5 741-0601 ✓ Pulse Motor PX244M-02A Assy 2 1 Bead Mixer
6 741-1049 ✓ Pulse Motor KH42HM2-052 2 5 Bead Mixer, Pipetter, Sipper, Magnet
Drive, BCR

7 K591137 ✓ Pulse Motor KH42JM2-011 4 1 T/V Carrier


8 741-4321 ✓ Pulse Motor PFC25-4804 Assy 2 1 T/V Carrier
9 741-0804 ✓ Pulse Motor PH265M-33 Assy 2 1 Pipetter Syringe
10 741-1560 ✓ Pulse Motor KH56KM2-016 2 1 Sipper Syringe
11 741-0593 ✓ DC Motor 12CL-2031 Assy 2 1 Bead Mixer
12 741-4322 ✓ Rotary Solenoid 2ER45-33 Assy 2 1 T/V Carrier
13 741-1262 ✓ Gear Head H0051-122 2 1 Cap Opener
14 741-0832 ✓ DC Magnet Pump Assy 2 1 Tubing
15 741-0830 ✓ Solenoid Valve UDV Assy 10 5 Tubing
16 741-0831 ✓ Pinch Valve Assy 4 2 Syringe
17 L116170 ✓ Linear Ball Bush LB6YH 2 4 Syringe
18 L116304 ✓ Linear Ball Bush LM8 2 2 Sipper
19 L116306 ✓ Linear Ball Bush LM12 2 2 Pipetter
20 L116307 ✓ Linear Ball Bush LM13 2 2 T/V Carrier
21 741-1263 ✓ Linear Ball Bush LM8S 2 3 Cap Opener
22 741-1137 ✓ LM Guide RSR (X) 1 1 T/V Carrier
23 741-1153 ✓ Linear Guide C(Z) 1 1 T/V Carrier
24 741-1411 ✓ Linear Guide S(Z) 1 1 Sipper
25 741-1059 ✓ Linear Guide Z(P) 1 1 Pipetter

V 1.6 – April 1999 1 Chapter 8.2.1


RD/Hitachi Elecsys 2010 Service Manual

26 741-1215 ✓ B.B. 6010ZZ 2 1 S.Disk


27 741-1244 ✓ B.B. 6804ZZ 2 1 Bead Mixer
28 741-1318 ✓ B.B. 6800ZZ 2 4 Syringe
29 L111420 ✓ B.B. LF-840ZZ 2 8 Syringe
30 L111427 ✓ B.B. DDLFW-1680HHRD 2 2 Magnet Drive
31 L111236 ✓ B.B. DDR-1560ZZR 2 2 Bead Mixer
32 L111431 ✓ B.B. DDLF-1050ZZR 2 4 Bead Mixer, Pipetter
33 L111270 ✓ B.B. DDRFW-830ZZ 2 2 Bead Mixer
34 L111424 ✓ B.B. LFW-1360ZZR 2 4 Pipetter, T/V Carrier
35 L111418 ✓ B.B. DDLF-630ZZH 2 2 Pipetter, T/V Carrier
36 L111240 ✓ B.B. DDR-830ZZ 2 1 Pipetter, T/V Carrier
37 L111272 ✓ B.B. DDRFW-1560ZZR 2 4 Cap Opener
38 741-0894 ✓ Bearing Assy 2 1 Pipetter
39 741-1022 ✓ Pulley Bearing 2A 2 1 Pipetter
40 741-0609 ✓ Pulley Bearing 1 2 3 Pipetter
41 741-1366 ✓ Roller Bearing 2 1 Solid Waste
42 741-1062 ✓ Timing Belt P(X) 2 1 Pipetter
43 741-1063 ✓ Timing Belt P(Z) 2 1 Pipetter
44 741-1124 ✓ Timing Belt C(Y) 2 1 T/V Carrier
45 741-1143 ✓ Timing Belt C(X) 2 1 T/V Carrier
46 741-1211 ✓ Timing Belt SR 2 2 S.Disk, R.Disk
47 741-1267 ✓ Timing Belt 2 1 Cap Opener
48 741-1243 ✓ M Timing Belt 2 1 Bead Mixer
49 741-1337 ✓ Timing Belt S(X) 2 1 Sipper
50 741-1338 ✓ Timing Belt S(Z) 2 1 Sipper
51 725-1096 ✓ Timing Belt - 2 Syringe
52 L111350 ✓ B.B. DDL-840 ZZH 2 3 Pipetter, Cap Opener
53 L111060 ✓ B.B. 6002 ZZ 2 2 S.Disk, R.Disk
54 L111433 ✓ B.B. DDLF-1150 ZZR 2 2 Sipper
55 741-1058 ✓ FPC Cable (P) Assy 3 1 Pipetter
56 741-4323 ✓ FPC Cable (C1) Assy 3 1 T/V Carrier
57 741-4324 ✓ FPC Cable (C2) Assy 3 1 T/V Carrier
58 741-4253 ✓ FPC Cable (S) Assy 3 1 Sipper
59 741-4325 ✓ FPC Cable (C11) Assy 3 1 T/V Carrier
60 741-4326 ✓ FPC Cable (C21) Assy 3 1 T/V Carrier
61 741-1463 ✓ O Ring 3 1 Bead Mixer
62 741-0548 ✓ Thermistor SR Assy 2 1 System Reagent
63 741-0582 ✓ Thermistor I Assy 2 1 Incubator
64 741-0554 ✓ Thermistor R Assy 2 1 R.Disk
65 J339165 ✓ Photo Interruptor GP1A34L 3 10 17 Almost All Units

Chapter 8.2.1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

66 736-0824 ✓ Detect 3 PCB Assy 1 - 1 Solid Waste


67 J339168 ✓ Detect 3 PCB TLP830 2 5 9 Pipetter, T/V Carrier
68 741-0805 ✓ Detect 3 PCB 130 Assy 1 2 2 Syringe
69 741-4318 ✓ Twin Detector Assy 1 2 1 Pipetter
70 R621018 ✓ Floppy Disk Drive 2 1 Console
71 741-4263 ✓ Fan Assy 2 3 Console, Board Rack
72 741-3080 ✓ Magnet Catch 4 2 Console
73 741-1556 ✓ Torque Bush 1R 2 1 Console
74 741-1557 ✓ Torque Bush 1L 2 1 Console
75 741-1558 ✓ Torque Bush 2L 4 2 Console
76 741-1014 ✓ Cam Rock Fastener 2 1 Console
77 741-0583 ✓ Heater I Assy with Thermostat 2 1 Incubator
78 741-1185 ✓ Base 2 2 S.Disk, R.Disk
79 741-1186 ✓ Pulley 2 2 S.Disk, R.Disk
80 741-0117 ✓ S.Disk Assy 2 1 S.Disk
81 741-1597 ✓ Rubber 5 60 30 S.Disk
82 741-0610 ✓ Magnet Arm Assy 2 1 Magnet Drive
83 741-1336 ✓ Spring 2 1 Magnet Drive
84 741-1298 ✓ Slide Bearing 4 4 Solid Waste
85 741-1228 ✓ Arm Cover 4 1 Bead Mixer
86 741-1462 ✓ Mixing Belt 4 1 Bead Mixer
87 741-0516 ✓ Mixing Paddle 1 10 1 Bead Mixer
88 741-0547 ✓ Micro-Cooler SR Assy 2 1 System Reagent
89 741-0123 ✓ Carrier Z Assy 2 1 T/V Carrier
90 741-1160 ✓ Gripper Base 2 1 T/V Carrier
91 741-1145 ✓ Gripper Finger LL 2 1 T/V Carrier
92 741-1996 ✓ Gripper Finger L 2 1 T/V Carrier
93 741-1168 ✓ Spring 2 1 T/V Carrier
94 741-1157 ✓ Spring 2 1 T/V Carrier
95 741-1130 ✓ Magazine tray 2 1 T/V Carrier
96 741-1159 ✓ Cover Z 2 1 T/V Carrier
97 741-1151 ✓ Motor Cover 2 1 T/V Carrier
98 741-1250 ✓ Motor Bracket 2 1 Cap Opener
99 741-1258 ✓ Hook Spring 2 3 Cap Opener
100 741-0627 ✓ Reagent Disk 2 1 R.Disk
101 741-1199 ✓ Rock Knob 5 2 R.Disk
102 707-2007 ✓ Rubber Washer - 3 R.Disk
103 741-0552 ✓ Micro-Cooler R Assy 2 1 R.Disk
104 741-0553 ✓ Heater Assy 2 1 R.Disk
105 741-0555 ✓ Cover SW Assy 2 1 R.Disk

V 1.6 – April 1999 3 Chapter 8.2.1


RD/Hitachi Elecsys 2010 Service Manual

106 741-1204 ✓ Window Glass 2 1 R.Disk


107 741-1209 ✓ Sensor Lever 2 1 R.Disk
108 741-0302 ✓ Water Reservoir Assy 4 1 Distilled Water
109 L472061 ✓ Filter 4 1 Distilled Water
110 L456010 ✓ O Ring P12 FPM 4 1 Distilled Water
111 741-1507 ✓ Gasket 4 1 Distilled Water
112 741-1503 ✓ Valve Body 4 1 Distilled Water
113 741-1505 ✓ Filter Cap 4 1 Distilled Water
114 741-0561 ✓ Buffer Tank Assy 4 1 Distilled Water
115 741-1501 ✓ Buffer Tank 4 1 Distilled Water
116 741-1502 ✓ Buffer Tank Cover 4 1 Distilled Water
117 741-1508 ✓ Tank Gasket 1 4 1 Distilled Water
118 741-1506 ✓ Plunger 2 1 Distilled Water
119 741-1509 ✓ Plunger Guide 2 1 Distilled Water
120 741-1520 ✓ Spring 2 2 Distilled Water
121 741-0563 ✓ Float Switch Assy 2 1 Tubing
122 L456015 ✓ O-Ring P20 NBR 2 1 Tubing
123 L456001 ✓ O-Ring P4 NBR 5 7 Tubing
124 741-1603 ✓ Piping Block 2 1 Tubing
125 741-1380 ✓ Washing Station S 2 1 Tubing
126 741-1381 ✓ Washing Station P 2 1 Tubing
127 L456008 ✓ O-Ring P10A NBR 2 1 Tubing
128 741-1616 ✓ Pipe 1 2 1 Tubing
129 741-1617 ✓ Pipe 2 2 1 Tubing
130 741-1604 ✓ Tubing Block 2 1 Tubing
131 741-0801 ✓ Syringe P Assy 2 1 Syringe
132 741-1300 ✓ Plunger P 2 1 Syringe
133 741-1302 ✓ Seal Piece P 60 1 Syringe
134 741-0802 ✓ Syringe S Assy 2 1 Syringe
135 741-1301 ✓ Plunger S 2 1 Syringe
136 741-1303 ✓ Seal Piece S 60 1 Syringe
137 L456006 ✓ O-Ring P9 NBR 2 1 Syringe
138 L456013 ✓ O-Ring P16 NBR 2 1 Syringe
139 L456002 ✓ O-Ring P5 NBR 2 1 Syringe
140 741-1510 ✓ L Waste Tank 5 1 Liquid Waste
141 741-1053 ✓ P Carrier 2 1 Pipetter
142 741-1057 ✓ P Carrier Cover 2 1 Pipetter
143 741-1050 ✓ P Arm Base 2 1 Pipetter
144 741-1051 ✓ P Arm Cover 10 1 Pipetter
145 741-1111 ✓ Nozzle Guide P 4 1 Pipetter

Chapter 8.2.1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

146 F729501 ✓ Nozzle Seal 2 10 1 Pipetter


147 741-0129 ✓ P Nozzle Assy 5 1 Pipetter
148 741-1065 ✓ Spring Z(P) 2 1 Pipetter
149 741-1472 ✓ Z Base 2 1 Sipper
150 741-1479 ✓ S Arm Base 2 1 Sipper
151 741-1486 ✓ Nozzle Guide S 4 1 Sipper
152 741-0544 ✓ Nozzle S Assy 10 1 Sipper
153 741-1480 ✓ S Arm Cover 4 1 Sipper
154 L913591 ✓ Spring 2 1 Sipper
155 741-1775 ✓ Tube 465 1 5 1 Pipetter
156 741-1778 ✓ Tube 510 5 1 Pipetter
157 741-0807 ✓ Tube 1 5 1 Syringe
158 741-0808 ✓ Tube 2 5 1 Syringe
159 741-0809 ✓ Tube 7 5 1 Syringe
160 741-0543 ✓ Tube 8 5 1 Syringe
161 741-0803 ✓ Tube 9 5 1 Syringe
162 741-0965 ✓ Tube for Sipper 5 1 Detection Unit
163 741-0966 ✓ Tube for Sipper Syringe 5 1 Detection Unit
164 717-2098 ✓ Tube for Pinch Valve 1 2 1 Syringe
165 741-5030 ✓ EIO PCB Assy 3 1 Board Rack
166 741-5031 ✓ DO1 PCB Assy 3 1 Board Rack
167 741-5033 ✓ DO3 PCB Assy 3 1 Board Rack
168 271-3734 ✓ ECPU237 PCB Assy 3 1 Board Rack
169 271-4082 ✓ EECL111 PCB Assy 5 1 Board Rack
170 271-3901 ✓ EMOT110 PCB Assy 3 1 Board Rack
171 741-5024 ✓ PMT-SHV PCB Assy 3 1 detection Unit
172 741-5184 ✓ L-AMP PCB Assy 3 1 detection Unit
173 741-5043 ✓ LLD-PA PCB Assy 5 1 Pipetter
174 741-5045 ✓ DIST-PA PCB Assy 3 1 Pipetter
175 741-5041 ✓ ANG-EP PCB Assy 3 1 Detection Unit
176 741-5032 ✓ DO2 PCB Assy 3 1 Pipetter
177 741-5044 ✓ LLD-SA PCB Assy 3 1 Sipper
178 741-5046 ✓ DIST-SA PCB Assy 3 1 Sipper
179 741-5042 ✓ UIRS-A PCB Assy 3 1 Console
180 741-5028 ✓ DIST-F PCB Assy 3 1 Console
181 741-5016 ✓ DET-A PCB Assy 5 1 T/V Carrier
182 741-5017 ✓ DET-B PCB Assy 5 1 T/V Carrier
183 741-5026 ✓ DET-C PCB Assy 5 1 Solid Waste
184 741-4512 ✓ DC Power Supply 3 1 DC Power Supply

V 1.6 – April 1999 5 Chapter 8.2.1


RD/Hitachi Elecsys 2010 Service Manual

185 ✓ Noise Filter SUP-P20H-E1PR-4-


J182166 3 2 AC Unit
A
186 K214382 ✓ Circuit Breaker IEGH-6-11-63F-15A 3 1 AC Unit

187 725-5029 ✓ S.AB-CE. PCB Assy 3 1 AC Unit


188 741-4551 ✓ Inlet NC-174-10N-C-F6.4 3 1 AC Unit
189 741-4554 ✓ Cable NCS-501-5M 3 1 AC Unit
190 P7360824 ✓ DETECT1 Board Assy 5 2 Syringe
191 J821158 ✓ Fuse LM32 5 20 DIST-F, EIO, DO1, DO2, ANG-E
PCBs
192 J821159 ✓ Fuse LM50 5 16 DIST-F, EIO, DO3 PCBs

193 J826845 Tool for Detaching H8 (IS-516J) 1 For Service


194 L456009 O Ring P11 NBR 2
195 741-0969 Tube for Measuring Cell 5
196 271-4084 EUIF101 PCB Assy 3
197 741-1043 Pressure Sensor 3
198 741-4506 Bar Code Reader 3
199 741-5040 Fuse PCB Assy 3
200 271-3904 EECL110 PCB Assy 5 1 for S/N 0701-01 to 60
201 741-5027 UI-RS PCB Assy 3 1 ditto
202 271-3904 EUIF100 PCB Assy 3 for 8 Color UI
203 741-5005 EUIF100-16 PCB Assy 2 for 16 Color UI

Chapter 8.2.1 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

8.2.2 Completed Recommended Parts List (including Acceptable Parts)


for Rack Sampler/Rack Sampler connected to CLAS 1 system

Note1) a: Acceptable Parts


Note2) A: Kits for Service man box.
B: Stock in each country.
C: General Stock in RD.
I: Number of Parts mounted per each instrument.

No. P/N a Part Name Quantity Unit to be applied


A B C I
1 ✓
741-4636 S. Motor A7640-9212K

Assy
2
741-4667 S. Motor A3339-9219 Assy

3 ✓
741-4639 S. Motor KP56KM1-014 Assy

4 ✓
741-1049 Stepping Motor KH42HM2-052

5 ✓
741-1048 Stepping Motor KH56HM2-016
6 ✓
L111240 Ball Bearing DDR-830ZZR
7 ✓
L111245 Ball Bearing SSR-1350ZZR

8 ✓
L111424 Ball Bearing DDLFW--1360ZZR
9 ✓
L111427 Ball Bearing DDLFW--1680HHPRO
10 ✓
741-7466 Ball Bearing W684ZZA
11 ✓
741-7336 Ball Thrust Bearing 51106
12 ✓
L116307 Linear Ball Bush LM13

13 ✓ for A-line
741-7571 Timing Belt A
14 ✓ for B-line
741-7572 Timing Belt B
15 ✓ for C-line
741-7573 Timing Belt C
19 ✓
741-4600 DC Power Supply 3
20 ✓
741-7521 Plane Belt

21 ✓
J684015 Micro-Photo Sensor PM2-LF10

V 1.6 – April 1999 1 Chapter 8.2.2


RD/Hitachi Elecsys 2010 Service Manual

22 ✓
J339165 Photo Interrupter GP1A34LC
23 ✓
713-4003 Bar Code Reader
24 ✓
L939236 Gas Spring

25 ✓
741-5057 RS CONT A PCB

26 ✓
741-5058 PS CONT A PCB

27 ✓
741-5052 DO-4 PCB
28 ✓
741-5053 PH-P PCB
29 ✓
741-5054 PH-T PCB
30 ✓
741-5056 BCR PCB
31 ✓
J821158 Fuse LM32
32 ✓
J821159 Fuse LM50
33 J821154 ✓ Fuse LM05
34 741-5055 ✓ Fan PCB
35 741-7813 ✓ Timing Belt B2 1 for B2 line
36 741-7577 ✓ Timing Belt 1 1 for I line
37 741-5060 ✓ DO5 PCB 1
38 741-5061 ✓ DIST-CR1 PCB 1
39 ✓
40 ✓

Chapter 8.2.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

8.3 Printed Circuit Board List

# 1 series
P/N Name of PCB Unit to be #0 Al Plastic Remarks
applied base base
1 271-3734 ECPU 237 PCB Rack ✓ ✓ ✓

2 271-3904 EECL 110 PCB Rack ✓

271-4082 EECL 111 ✓ ✓ for CE marking


3 271-3901 EMOT110 PCB Rack ✓ ✓ ✓

4 741-5030 EIO PCB Rack ✓ ✓ ✓

5 741-5081 DO1 PCB Rack ✓ ✓ ✓

6 741-5088 DO3 PCB Rack ✓ ✓ ✓

7 271-3907 MVLB110 PCB Rack ✓ ✓ ✓

8 741-5032 DO2 Rear panel ✓ ✓ ✓

9 ANG-E1 Rear panel ✓ out of production


741-5041 ANG-EP ✓ ✓ ✓ *1
10 741-5020 LLD-S Rear panel ✓

741-5044 LLD-SA ✓ ✓ ✓ for CE Marking


11 741-5024 PMT-SHV D-unit ✓ ✓ ✓

12 741-5039 L-AMP D-unit ✓ ✓

741-5038 L-AMP(1) ✓ ✓ ✓ for CE Marking


13 741-5048 LLD-PA Pipetter ✓ ✓ ✓ Use with P Nozzle (P/N741-0129)
741-5048 LLD-P3 ✓ ✓ ✓ Use with P Nozzle2 (741-0137)
14 741-5010 DIST-P ✓ ✓ ✓
741-5045 DIST-PA ✓ ✓ ✓ for CE Marking
15 741-5011 DIST-S Sipper ✓
741-5046 DIST-SA ✓ ✓ ✓ for CE Marking
16 741-5027 UI-RS ✓
741-5042 UIRS-A ✓
741-5049 UIRS-B ✓ for CE Marking

17 741-5016 DET-A Gripper ✓ ✓ ✓

18 741-5017 DET-B Gripper ✓ ✓ ✓

19 741-5012 DIST-TV Gripper ✓

741-5047 DIST-TVA ✓ ✓ ✓ for CE Marking


20 986-5022 SAB AC unit ✓ ✓ ✓

725-5029 S.AB-CE ✓ ✓ ✓ for CE Marking

V 1.6 – April 1999 1 Chapter 8.3


RD/Hitachi Elecsys 2010 Service Manual

# 1 series
P/N Name of PCB Unit to be #0 Al- Plastic- Remarks
applied base base
21 736-0824 DETECT1 Syringe ✓ ✓ ✓

22 741-5026 DET-C Solid waste ✓ ✓ ✓

28 271-3622 EUIF100 User interface ✓ for #0 series 8 colored U/I


741-5005 EUIF100-16 ✓ for #0 series 16 colored U/I
271-4084 EUIF101 ✓ for CE Marking
271-4184 EUIF102 ✓ for CE Marking
24 741-5028 DIST-F Left side ✓ ✓ ✓

25 741-5040 Fuse DC unit ✓ ✓ for GS/UL

*1 For #0 series instrument, exchange the pressure sensor (741-1043) together.

#0 Series: SN 0701-01 to 0701-60


#1 Series: (Aluminum Base Version): from S No. 0802-01 to
0806-10
(Plastic Base Version): from S No. 0806-11
onwards

Chapter 8.3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

8.4 Temperature parts Elecsys 2010 available on stock at Roche

8.4.1 Incubator

Part Name P/N Id. No.


1 Thermistor I 741-0582 1707981001
2 Heater I assy with Thermostat 741-0583 1707990001

8.4.2 Reagent assy

8.4.2.1 Thermistor

V 1.6 – April 1999 1 Chapter 8.4


RD/Hitachi Elecsys 2010 Service Manual

8.4.2.2 Peltiers and Thermostat

Part Name P/N Id. No.


2.1 Thermistor R assy 741-0554 1707892001
2.2 Micro Cooler R assy 741-0552 1707876001

Chapter 8.4 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

8.4.3 System Reagent

8.4.3.1 Thermistor

8.4.3.2 Peltier and Thermostat

Part Name P/N Id. No.


3.1 Thermistor assy 741-0548 1707850001
3.2 Micro Cooler SR assy 741-0547 1707841001
V 1.6 – April 1999 3 Chapter 8.4
RD/Hitachi Elecsys 2010 Service Manual

8.4.4 Detection Unit

8.4.4.1 Peltier

Chapter 8.4 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

8.4.4.2 Thermistor with Thermostat and Magnet Motor

Part Name P/N Id. No.


4.1 Cord P 600 with Micro Cooler 741-4314 1902199001
4.2 Cord J 600 assy with motor 741-4316 1902202001

V 1.6 – April 1999 5 Chapter 8.4


9. Host Interface
Separate Elecsys Host Interface Manual available under Ident. No. 1 804 022-001.
10. Maintenance

10.1 Operator Maintenance

10.2 Preventive Maintenance


RD/Hitachi Elecsys 2010 Service Manual

10.1 Operator Maintenance


- Refer to the Operator’s Manual.

10.2 Preventive Maintenance


The intention of this recommendation is to optimize the efficiency of the maintenance procedure to guarantee system
stability and reliability by defining the necessary workload.
At the end of this chapter we have added a recommendation for a "field maintenance checklist".

No. Maintenance procedure RD ID no. <3 6 12 Remarks


months* months months
1 Reception of current analyzer condition: X X
-Printout of calibration data
-Note Initial BlankCell parameters (a) and
(b)
2 Perform backup FD X X
3 Perform HV check X X
4 Exchange tube for MC 1709577001 X
5 Tube for sipper C
-check for mech. stress X
-exchange 1901460001 X
6 Exchange tube for sipper syringe 1708171001 X
7 Exchange sipper nozzle seal 2 set 1908405001 X
8 Exchange pipetter tube 510 1707914001 X
9 Exchange pipetter tube 465 1707817001 X
10 Exchange pinch tubes 1905937001 X
11 Exchange seal piece (P) 1708716001 X
12 Exchange seal piece (S) 1708724001 X
13 Exchange nozzle seal pipetter 1709402001 X
14 Liquid flow cleaning X X 1
15 Measuring unit 2
-check measuring cell X X
-exchange measuring cell 1803867001 X
-check magnet X X
16 S/R rinse station 3
-clean / exchange 1708791001 X X
-cleaning by customer (new operator
17 Exchange mixer belt 1708813001 X
18 Check / clean mixer paddle X X 4
19 Check / clean gripper finger X X 5
20 Check / clean water system X X 6
21 Clean filter water main pump X X
22 Clean BCR window X X
23 Clean sipper / pipetter probes X X
25 Clean floppy disk drive X X 7
26 Check / adjustments electronic:
- LLD voltage sipper / pipetter X X
- Mixer speed X X
- Clot voltage X X
27 Check / clean temperature units X X 8
28 Check / adjust needle wash X X 9
29 System volume check X X
30 Artificial media check X X 10
31 Initial BlankCell X X
32 Assay calibration X X 11

V 1.6 – April 1999 1 Chapter 10.2


RD/Hitachi Elecsys 2010 Service Manual

Important notes

To ensure the specified dead volumes on disk and rack systems with software version 03-08 you must readjust / check the
following items:

Adjusted item What is to be confirmed How to adjust


1 Pipetter-Z T/V buffer Detach the tip from the pipetter probe, if any. Carry out the "Pipetter-Z T/V
a) Confirm visually that the end of the pipetter probe Buffer" function in the
with no tip is pretty level with the buffer station "Adjustment B Mixer Pipetter R
surface at the tip eject position. Disk" screen.
2 Pipetter-Z T/V bottom Detach the tip from the pipetter probe, if any. Carry out the "Pipetter-Z T/V
Place a tip in Tip Pos. 1 of the buffer station. Bottom" function in the
a) Confirm visually that the end of the pipetter probe "Adjustment B Mixer Pipetter R
with no tip is pretty level with the buffer station Disk" screen.
surface at the tip eject position.
3 Pipetter-Z beads bottom Attach a tip to the pipetter probe. Carry out the "Pipetter-Z Beads
Place an empty RackPack in Pos. 1 of the reagent Bottom" function in the
disk. "Adjustment B Mixer Pipetter R
Disk" screen.
a) Automatically checked.
4 Pipetter-Z S. cup bottom Attach a tip to the pipetter probe. Carry out the "Pipetter-Z S. Cup
Place a Hitachi sample cup in Pos. 1 of the sample disk. Bottom" function in the
a) Automatically checked. "Adjustment B Mixer Pipetter R
Disk" screen.
5 Sipper Z adjustment With software version 03-08 the sipper Z adjustment must be repeated without a bottle in
place.

* 3-MONTH MAINTENANCE
The 3-month maintenance is only for introduction of Upgrade Package No. 1.
REMARKS
1) Liquid flow cleaning (LFC)
Please Note
Carry out the service liquid flow cleaning after exchanging the tubing on the sipper side and before checking the
performance of the measuring cell.

For details of the LFC procedure, please refer to SN 22/97.

2) Measuring unit
l Measuring cell handling
a. After 6 months the measuring cell should be checked using the artificial media checks and should be
replaced if necessary.
b. After 12 months the measuring cell has to be replaced.

Chapter 10.2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Criteria for MC replacement:

No. Parameter Unit Green range Orange range Red range


1 Signal BCR1 [counts] < 400 400 – 450 ≥ 450
mean
2 Signal BCR2 [counts] Target ± 10 % Target ± 15 % Target ≥ ± 15 %
mean
3 Carryover [ppm] ≤ 100 ppm 100 - 150 ppm ≥ 150 ppm
4 Measuring cycles number - - ≥ 100,000
Note: Criteria 1 and 2 are only valid in combination

l Installation of a new measuring cell (not a pre-installed MC)

The use of SysClean (LFC) during installation of a new measuring cell leads to an temporary increase of the
carryover values. To bring the MC into a carryover range below 100 ppm you must perform one of the
following actions:

½ either minimum 100 MC preparation cycles before AM testing or

½ 50 MC preparation cycles and 2-3 AM test runs.

l Check magnet

a. Check the correct movement of magnet arm.


b. Check the magnet position.

3) S/R rinse station

We recommend exchanging the rinse station because the price is very low, but careful cleaning might be done
as well (refer also to remark 6)

4) Check / clean mixer paddle

The mixer paddle should be checked for mechanical damage. It should be replaced if it is not straight.

5) Check / clean gripper fingers

a. We recommend cleaning the gripper fingers with a wet cotton stick.


b. Clean the light barriers and mechanical parts of the gripper mechanism.
c. Check gripper height (z adjustment on incubator and buffer pos.).
d. Check the solid waste tray area for assay cups and tips discarded beside it.

6) Check water system

The whole water system should be checked for contamination:


a. Check / clean water supply bottle and buffer tank (wipe out)
b. Check / clean distilled water tank filter
c. Check drain tubes for contamination (contaminated tubes should be exchanged)
d. If the whole tubing system (except sipper side) seems to be contaminated perform the cleaning procedure
with Perhydrol solution (refer to service news 23/98).

7) Clean floppy disk drive

To clean the floppy disk drive use a clean set (cleaning disk; e.g. wet cleaning set) and perform the "FDD
cleaning" function from the “Maintenance” screen.

V 1.6 – April 1999 3 Chapter 10.2


RD/Hitachi Elecsys 2010 Service Manual

8) Check / clean temperature units

The temperatures in the temperature monitor should be checked to meet the following target temperatures:
• Cell unit 28°C
• Incubator unit 37°C
• Reagent unit 18°C
• AB/CC (system reagents unit) 28°C
The peltier elements should be checked and freed from dust if necessary.

9) Check / adjust sipper needle

The needle washing should be checked for it is efficiency.


Adjustment possibilities:
a. Change wash station pos. (for y adj.).
b. Change the needle pos. in x direction by SW.
If not enough water is available:
c. Cleaning of the whole liquid system may be necessary (refer to remark 6).
d. Cleaning / exchange of supply tubes or wash stations.
e. Check / exchange wash valve.

10) Artificial media check

For detailed explanation refer to enclosed service news on AM check.

11) Assay calibration

At least one assay parameter should be calibrated to check instrument assay performance.

Chapter 10.2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Name: ____________________ Date: _______________


®
2010
SN: _______________

Cover C* R* E* A* Remarks Temp. system C R E A Remarks


Cover parts Cell unit
Main cover Incubator
Feet Reagent rotor
Fluidic system System reagent
Tube for measuring cell Transport assembly
Tube for sipper C Gripper
Tube for sipper syringe Light barriers
Tube 510 Mechanical parts
Tube 465 Mixer assembly
Pinch valve tubing Paddle
Nozzle seal sipper Mixer belt
Nozzle seal pipetter Speed rpm
Seal piece (S) Voltage monitor
Seal piece (P) S/R Probe LLD V
Filter MD6 Pressure sensor V
Wash stations Sipper LLD V
S/R probe Barcode reader
Sipper probe Window
Distilled water and waste bottle Floppy disk drive
Liquid flow cleaning Data disk / backup
System volume check Test runs
Measuring unit Initial BlankCell a: b:
M. Cell / Reference electrode Artificial media test
Magnet Assay calibration
*C: check; R: repair; E: exchange; A: adjust

V 1.6 – April 1999 5 Chapter 10.2


Appendix

- Timing Chart Table

(1) Operation
(2) Maintenance
(3) Reset
(4) Initialization
(5) Finalization
(6) R. Scan
(7) Tip/Vessel Carrier
(8) S. Scan
(9) Preoperation

- Assay Timetable
RD/Hitachi Elecsys 2010 Service Manual

Appendix

Timing Chart Table

(1) Operation

- Reagent Disk
Time Interval Action
-4.4 1.3 CAP to OPEN
-3.1 2.7 No operation
-0.4
-0.4 0.4 OPEN to R1
0.0 3.5 No operation
3.5
3.5 0.5 R1 to R2
4.0 4.4 No operation
8.4
8.4 1.3 R2 to CAP
9.7 2.5 No operation
12.2
12.2 1.3 CAP to OPEN
13.5 2.7 No operation
16.2
16.2 0.7 OPEN to BM
16.9 7.0 No operation
23.9
23.9 0.4 BM to B
24.3 8.1 No operation
32.4
32.4
32.4
32.4 1.3 B to CAP
33.7 3.9 No operation
37.6
37.6
37.6

V 1.6 – April 1999 1 Appendix 1


RD/Hitachi Elecsys 2010 Service Manual

- Cap Open/Close Mechanism


Time Interval Action
-3.1 2.7 Opening
-0.4
-0.4 10.1 No operation
9.7
9.7
9.7
9.7 2.4 Capping
12.1
12.1
12.1 1.4 No operation
13.5
13.5
13.5 2.7 Opening
16.2
16.2 17.5 No operation
33.7
33.7
33.7
33.7 2.4 Capping
36.1
36.1 2.8 No operation
38.9

Appendix 1 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Beads Mixer
Time Interval Action
-4.4 20.8
16.4
16.4
16.4 0.5 Move to mixing position
16.9
16.9 1.0 Move down to mixing position
17.9 0.0 On mixing
17.9 3.7 No operation
21.6 0.0 Off mixing
21.6 1.7 Move up from mixing position 1
23.3 0.6 Move up from mixing position 2
23.9
23.9 0.5 Move to wash position
24.4 1.0 Move down to wash
25.4 0.0 On mixing
25.4 2.0 No operation
27.4 0.0 Off mixing
27.4 0.7 Move up from wash (2.6s)
28.1 0.7 Open SV6
28.8 0.0 Close SV6
28.8
28.8 8.8 No operation
37.6

- BCR
Time Interval Action
19.0 20.9 No operation
39.9
39.9
39.9
39.9 1.1 R. disk to S. disk
41.0
41.0 1.0 Trigger on
42.0 0.0 Trigger off
42.0 4.1 No operation (data transmission)
46.1
46.1 1.0 Trigger on (retry)
47.1 0.0 Trigger off
47.1 4.1 No operation (data transmission)
51.2
51.2 1.3 S. disk to R. disk
52.5
52.5 8.5 No operation
61.0
61.0
61.0
61.0

V 1.6 – April 1999 3 Appendix 1


RD/Hitachi Elecsys 2010 Service Manual

- Sample Disk
Time Interval Action
19.0 16.9 No operation
35.9
35.9 4.3 Move to next pipetting position
40.2 0.1 No operation
40.3
40.3 0.7 Move to BCR position
41.0 0.1 No operation
41.1 0.5 Move for reading
41.6
41.6 4.5 No operation (data transmission)
46.1
46.1 0.5 Move for reading (retry)
46.6
46.6 4.5 No operation (data transmission)
51.1
51.1 0.7 Move to pipetting position
51.8
51.8 1.0 No operation
52.8 3.4 No operation during aspiration
56.2
56.2 4.8 No operation
61.0
61.0

Appendix 1 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Pipetter
Pipetter Syringe and Valves
Time Interval Action Time Interval Action
-2.7 1.0 No operation -2.7 0.0 Open SV1
-1.7 -2.7 0.7 Prime the probe
-1.7 -2.0 0.0 Close SV1
-1.7 -2.0 0.3 No operation
-1.7 0.3 Move from W to P1 -1.7 1.3 No operation
-1.4 1.0 Pick up a tip -0.4
-0.4 -0.4
-0.4 0.5 Move from P1 to R1 -0.4 0.5 No operation
0.1 0.9 Move down to R1 0.1 0.9 No operation
1.0 1.5 No operation 1.0 1.5 Aspirate R1
2.5 0.8 Move up from R1 2.5 0.8 No operation
3.3 0.1 No operation 3.3 0.1 No operation
3.4 3.4
3.4 0.1 No operation 3.4 0.1 No operation
3.5 0.4 Move from R1 to W 3.5
3.9 0.6 Wash the tip 3.5 1.5 No operation
4.5 0.5 Move from W to R2 5.0
5.0 0.1 No operation 5.0 0.1 Aspirate air
5.1 0.9 Move down to R2 5.1 0.9 No operation
6.0 1.5 No operation 6.0 1.5 Aspirate R2
7.5 0.8 Move up from R2 7.5 0.8 No operation
8.3 0.1 No operation 8.3 0.1 No operation
8.4 8.4
8.4 0.6 Move from R2 to W 8.4
9.0 0.6 Wash the tip 8.4 2.4 No operation
9.6 0.2 No operation 10.8
9.8 1.0 Move from W to S 10.8
10.8 10.8
10.8 0.1 No operation 10.8 0.1 Aspirate air
10.9 0.9 Move down to S 10.9 0.9 No operation
11.8 1.5 No operation 11.8 1.5 Aspirate S
13.3 0.8 Move up from S 13.3 0.8 No operation
14.1 0.1 No operation 14.1 0.1 No operation
14.2 14.2
14.2 1.2 Move from S to V 14.2 1.2 No operation
15.4 15.4
15.4 0.3 Move down to V 15.4 0.3 No operation
15.7 3.2 No operation 15.7 3.2 Discharge M
18.9 0.3 Move up from V 18.9 0.3 No operation
19.2 19.2
19.2 0.3 Move from V to SW 19.2 2.3 No operation
19.5 1.6 Discard the tip 21.5
21.1 0.4 Move from SW to W 21.5
21.5 21.5
21.5 1.0 No operation 21.5 0.0 Open SV1
22.5 21.5 0.7 Prime the probe
22.5 22.2 0.0 Close SV1

V 1.6 – April 1999 5 Appendix 1


RD/Hitachi Elecsys 2010 Service Manual

Pipetter Syringe and Valves


Time Interval Action Time Interval Action
22.5 22.2 0.3 No operation
22.5 0.3 Move from W to P2 22.5 1.3 No operation
22.8 1.0 Pick up a tip 23.8
23.8 23.8
23.8 0.5 Move from P2 to B 23.8 0.5 No operation
24.3 0.9 Move down to B 24.3 0.9 No operation
25.2 1.5 No operation 25.2 1.5 Aspirate B
26.7 0.8 Move up from B 26.7 0.8 No operation
27.5 0.1 No operation 27.5 0.1 No operation
27.6 27.6
27.6 0.3 Move from B to W 27.6
27.9 0.6 No operation 27.6 1.4 No operation
28.5 0.5 No operation 29.0
29.0 3.4 No operation 29.0 3.4 No operation
32.4 0.8 Move from W to V 32.4 0.8 No operation
33.2 0.3 Move down to V 33.2 0.3 No operation
33.5 1.2 No operation 33.5 1.2 Discharge M
34.7 1.0 Move down for aspirate 34.7 1.0 Aspirate M
35.7 0.3 Move up for discharge 35.7 1.0 Discharge M
36.0 0.7 No operation 36.7
36.7 0.3 Move up from V 36.7 0.3 No operation
37.0 37.0
37.0 0.3 Move from V to SW 37.0 2.3 No operation
37.3 39.3
37.3 1.6 Discard the tip 39.3
38.9 39.3
38.9 0.4 Move from SW to W 39.3
39.3 39.3

Appendix 1 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Tip/Vessel Carrier
All Case
Time Interval Action
-1.5 4.5 Move from TC to P1
3.0
3.0
3.0 3.0 Move from V to INC
6.0
6.0
6.0 3.7 Move from VC to V
9.7
9.7
9.7 4.4 Move from TC to P2
14.1
14.1 10.2 No operation
24.3
24.3 3.1 Move from V to INC
27.4
27.4
27.4 3.1 Move from INC to V
30.5
30.5
30.5 3.1 Move from INC to SIP
33.6 0.3 Move from SIP to SP
33.9 3.2 No operation during sipping
37.1 0.7 Move from SP to RP
37.8
37.8 2.7 Move from SIP to SW
40.5
40.5 0.0 No operation
40.5

- Solid Waste
Time Interval Action
-4.4 18.3 No operation
13.9
13.9
13.9
13.9 1.5 Shaking
15.4
15.4
15.4 22.2 No operation
37.6
37.6
37.6
37.6

V 1.6 – April 1999 7 Appendix 1


RD/Hitachi Elecsys 2010 Service Manual

- Sipper
Sipper, Magnet Driver and SV7 Syringe, Valve3/4 Voltage
Time Interval Action Time Interval Action Time Interval Action
0.0 0.0 No operation 0.0 0.2 No operation 0.0 0.7 0 mv
0.0 0.3 Move from WA to SP 0.2 0.1 Open SV4 0.7
0.3 0.3 0.2 Backlash 0.7
0.3 0.5 0.1 No operation 0.7
0.3 0.6 0.1 Close SV4 0.7
0.3 0.7 0.0 Open SV3 0.7
0.3 0.4 Move down to SP 0.7 0.7
0.7 1.2 No operation 0.7 1.0 Aspirate 150ml at 150ml/s 0.7 0.5 1000 mv
1.9 0.4 Move up from SP 1.7 0.4 No operation 1.2 0.5 -1200 mv
2.3 2.1 0.2 Aspirate 10ml at 50ml/s 1.7 3.5 0 mv
2.3 0.3 Move from SP to WA 2.3 0.1 No operation 5.2
2.6 0.0 Open SV7 2.4 0.1 Close SV3 5.2
2.6 0.1 Move down to WA 2.5 0.0 Open SV4 5.2
2.7 0.7 Wash probe 2.5 0.9 Reset to home 5.2
3.4 3.4 0.2 Backlash 5.2
3.4 3.6 0.1 No operation 5.2
3.4 0.0 Close SV7 3.7 0.0 Open SV2 5.2
3.4 0.2 Move up from WA 3.7 0.9 Sipper prime 5.2
3.6 0.4 Move from WA to AB 4.6 0.1 Close SV2 5.2
4.0 0.2 Move down to AB (0.8s) 4.7 0.1 Close SV4 5.2
4.2 0.5 Magnet to Cell 4.8 0.0 Open SV3 5.2
4.7 20.8 No operation 4.8 0.4 No operation 5.2
25.5 5.2 1.0 Aspirate 180ml at 180ml/s 5.2 0.4 1000 mv
25.5 6.2 0.2 No operation 5.6 0.4 -1200 mv
25.5 6.4 9.3 Aspirate 250ml at 27.5ml/s 6.0 20.4 0 mv
25.5 15.7 0.1 No operation 26.4
25.5 15.8 2.6 Aspirate 445ml at 175ml/s 26.4
25.5 18.4 0.5 Discharge 75ml at 175ml/s 26.4
25.5 18.9 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 19.7 0.5 Discharge 75ml at 175ml/s 26.4
25.5 20.2 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 21.0 0.5 Discharge 75ml at 175ml/s 26.4
25.5 21.5 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 22.3 0.5 Discharge 75ml at 175ml/s 26.4
25.5 22.8 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 23.6 0.5 Discharge 75ml at 175ml/s 26.4
25.5 24.1 1.4 Aspirate 245ml at 175ml/s 26.4
25.5 0.0 Move up from AB (0.8s) 25.5 0.1 No operation 26.4
25.5 0.5 Magnet down to home 25.6 0.1 Close SV3 26.4
26.0 0.2 No operation 25.7 0.0 Open SV4 26.4
26.2 0.4 Move from AB to CS 25.7 1.3 Reset to home 26.4
26.6 0.5 No operation 27.0 0.2 Backlash 26.4 0.8 ADC (3 s)
27.1 0.8 Move down to CS 27.2 0.7 No operation 27.2 2.4 1400 mv
27.9 0.1 Move up to air 27.9 0.1 Close SV4 29.6
28.0 0.1 No operation 28.0 0.0 Open SV3 29.6
28.1 28.0 0.1 Aspirate 20ml at 200ml/s 29.6
28.1 0.1 Move down from air 28.1 0.1 No operation 29.6
28.2 1.2 No operation 28.2 6.3 Aspirate 2268ml at 360ml/s 29.6
29.4 0.1 Move up to air 34.5 29.6
29.5 0.1 Move down from air 34.5 29.6
29.6 0.3 No operation 34.5 29.6 4.0 3000 mv
29.9 0.1 Move up to air 34.5 33.6
30.0 0.1 Move down from air 34.5 33.6

Appendix 1 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Sipper, Magnet Driver and SV7 Syringe, Valve3/4 Voltage


Time Interval Action Time Interval Action Time Interval Action
30.1 0.3 No operation 34.5 33.6
30.4 0.1 Move up to air 34.5 33.6
30.5 0.1 Move down from air 34.5 33.6
30.6 0.3 No operation 34.5 33.6
30.9 0.1 Move up to air 34.5 33.6
31.0 0.1 Move down from air 34.5 33.6
31.1 0.3 No operation 34.5 33.6
31.4 0.1 Move up to air 34.5 33.6
31.5 0.1 Move down from air 34.5 33.6
31.6 0.3 No operation 34.5 33.6
31.9 0.1 Move up to air 34.5 33.6
32.0 0.1 Move down from air 34.5 33.6
32.1 0.3 No operation 34.5 33.6
32.4 0.1 Move up to air 34.5 33.6
32.5 0.1 Move down from air 34.5 33.6
32.6 0.3 No operation 34.5 33.6
32.9 0.1 Move up to air 34.5 33.6
33.0 0.1 Move down from air 34.5 33.6
33.1 1.4 No operation 34.5 33.6 0.9 -1200 mv
34.5 34.5 34.5
34.5 0.8 Move up from CS 34.5 34.5
35.3 0.4 Move from CS to WA 34.5 0.3 No operation 34.5
35.7 0.0 Open SV7 34.8 0.1 Aspirate 20ml at 34.5
200ml/s
35.7 0.2 Move down to WA 34.9 0.1 No operation 34.5
35.9 0.7 Wash probe 35.0 0.1 Close SV3 34.5
36.6 0.2 Move up from WA 35.1 0.0 Open SV4 34.5
36.8 0.0 Close SV7 35.1 2.2 Reset to home 34.5 3.5 0 mv
36.8 0.4 Move from WA to AB 37.3 0.2 Backlash 38.0
37.2 0.8 Move down to AB 37.5 38.0
38.0 37.5 0.1 No operation 38.0
38.0 37.6 0.1 Close SV4 38.0
38.0 37.7 0.3 No operation 38.0
38.0 2.1 No operation 38.0 0.0 Open SV3 38.0 1.2 -1200 mv
40.1 0.2 No operation 38.0 1.4 Aspirate 500ml at 39.2
360ml/s
40.3 0.8 Move up from AB 39.4 0.1 No operation 39.2 0.3 0 mv
41.1 39.5 0.6 Aspirate 90ml at 39.5 0.3 1000 mv
150ml/s
41.1 40.1 0.1 Close SV3 39.8 0.3 -1200 mv
41.1 40.2 0.0 Open SV4 40.1
41.1 40.2 0.2 Backlash (ccw) 40.1
41.1 0.3 Move from AB to WA (0.4s) 40.4 0.1 No operation 40.1 1.9 0 mv
41.4 40.5 0.1 Close SV4 42.0
41.4 40.6 0.7 No operation 42.0
41.4 0.0 Open SV7 41.3 0.0 Open SV3 42.0
41.4 0.6 Wash probe 41.3 0.1 Discharge 35ml at 42.0
360ml/s
42.0 0.0 Close SV7 41.4 0.1 No operation 42.0
42.0 41.5 0.1 Close SV3 42.0
42.0 41.6 0.0 Open SV4 42.0
42.0 41.6 0.4 No operation 42.0
42.0 0.0 No operation 42.0 0.0 Close SV4 42.0
42.0 42.0 42.0

V 1.6 – April 1999 9 Appendix 1


RD/Hitachi Elecsys 2010 Service Manual

(2) Maintenance

- Pipetter Prime

Pipetter
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming: following action is repeated the input number of cycles
0.0 11.0 Open SV1
11.0 0.0 Close SV1
11.0 End of priming

Other Units
Time Interval Action Remarks
Reset: Refer to the table in Reset

- Sipper Prime

Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming: following action is repeated the input number of cycles
0.0 0.1 Close SV3
0.1 0.1 Open SV4
0.2 9.6 Open SV2
9.8 0.1 Close SV2
9.9 0.1 Close SV4
10.0 The end of priming

Other Units
Time Interval Action Remarks
Reset: Refer to the table in Reset

- Cell Exchange

Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming (3 times): Refer to the table in Sipper Prime
Air substitution
0.0 0.1 Close SV4
0.1 0.0 Open SV3
0.1 12.0 Aspirate 600ml of air at 50ml/s
12.1 0.1 No operation
12.2 0.1 Close SV3
12.3 0.0 Open SV4
12.3 0.9 Reset (700 pulses)
13.2 0.1 Close SV4
13.3 End of air substitution

V 1.6 – April 1999 1 Appendix 2


RD/Hitachi Elecsys 2010 Service Manual

Other Units

Time Interval Action Remarks


Reset: Refer to the table in Reset

- Measuring Cell Preparation

Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset
Prime: Refer to the table in Initialization
Checking the volume in the System Reagent Bottles: Refer to the table in R. Scan
Preparation 1 (without ADC and potentiostat)
Preparation 2 (without ADC): this action is repeated the input number of cycles
Preparation 3
Water substitution: Refer to the table in Finalization

Preparation 1, 2, 3
Sipper, Magnet Driver and SV7 Syringe Valve2/3/4 Voltage
Time Interval Action Time Interval Action Time Interval Action
0.0 0.0 No operation 0.0 0.2 No operation 0.0 1.1 0mv
0.0 0.3 Move from WA to AB 0.2 0.1 Open SV4 1.1
0.3 0.3 0.2 Backlash 1.1
0.3 0.5 0.1 No operation 1.1
0.3 0.6 0.1 Close SV4 1.1
0.3 0.7 0.4 No operation 1.1
0.3 0.8 Move down to AB 1.1 0.0 Open SV3 1.1
1.1 3.1 No operation 1.1 1.0 Aspirate 150ml at 150ml/s 1.1 0.5 1000mv
4.2 2.1 0.4 No operation 1.6 0.5 -1200mv
4.2 2.5 0.3 No operation 2.1 3.1 0 mv
4.2 2.8 0.1 No operation 5.2
4.2 2.9 0.1 Close SV3 5.2
4.2 3.0 0.0 Open SV4 5.2
4.2 3.0 0.9 Reset to home 5.2
4.2 3.9 0.2 Backlash 5.2
4.2 4.1 0.1 No operation 5.2
4.2 4.2 0.0 Open SV2 5.2
4.2 4.2 0.4 Sipper prime 5.2
4.2 4.6 0.1 Close SV2 5.2
4.2 4.7 0.1 Close SV4 5.2
4.2 0.5 Magnet to cell 4.8 0.0 Open SV3 5.2
4.7 20.8 No operation 4.8 0.4 No operation 5.2
25.5 5.2 1.0 Aspirate 180ml at 180ml/s 5.2 0.4 1000mv
25.5 6.2 0.2 No operation 5.6 0.4 -1200mv
25.5 6.4 9.3 Aspirate 250ml at 6.0 20.4 0mv
27.5ml/s
25.5 15.7 0.1 No operation 26.4
25.5 15.8 2.6 Aspirate 445ml at 175ml/s 26.4
25.5 18.4 0.5 Discharge 75ml at 175ml/s 26.4
25.5 18.9 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 19.7 0.5 Discharge 75ml at 175ml/s 26.4
25.5 20.2 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 21.0 0.5 Discharge 75ml at 175ml/s 26.4
25.5 21.5 0.8 Aspirate 130ml at 175ml/s 26.4
25.5 22.3 0.5 Discharge 75ml at 175ml/s 26.4
25.5 22.8 0.8 Aspirate 130ml at 175ml/s 26.4

Appendix 2 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

25.5 23.6 0.5 Discharge 75ml at 175ml/s 26.4


25.5 24.1 1.4 Aspirate 245ml at 175ml/s 26.4
25.5 0.0 Move up from AB 25.5 0.1 No operation 26.4
(0.8s)
25.5 0.5 Magnet down to home 25.6 0.1 Close SV3 26.4
26.0 0.2 No operation 25.7 0.0 Open SV4 26.4
26.2 0.4 move from AB to CS 25.7 1.3 Reset to home 26.4
26.6 0.5 No operation 27.0 0.2 Backlash 26.4 0.8 ADC
(3s)
27.1 0.8 Move down to CS 27.2 0.1 No operation 27.2 2.4 1400mv
27.9 27.3 0.0 Open SV2 29.6
27.9 27.3 0.5 Sipper prime 29.6
27.9 27.8 0.1 Close SV2 29.6
27.9 0.1 Move up to air 27.9 0.1 Close SV4 29.6
28.0 0.1 No operation 28.0 0.0 Open SV3 29.6
28.1 28.0 0.1 Aspirate 20ml at 200ml/s 29.6
28.1 0.1 Move down from air 28.1 0.1 No operation 29.6
28.2 1.2 No operation 28.2 6.3 Aspirate 2268ml at 29.6
360ml/s
29.4 0.1 Move up to air 34.5 29.6
29.5 0.1 Move down from air 34.5 29.6
29.6 0.3 No operation 34.5 29.6 4.0 3000mv
29.9 0.1 Move up to air 34.5 33.6
30.0 0.1 Move down from air 34.5 33.6
30.1 0.3 No operation 34.5 33.6
30.4 0.1 Move up to air 34.5 33.6
30.5 0.1 Move down from air 34.5 33.6
30.6 0.3 No operation 34.5 33.6
30.9 0.1 Move up to air 34.5 33.6
31.0 0.1 Move down from air 34.5 33.6
31.1 0.3 No operation 34.5 33.6
31.4 0.1 Move up to air 34.5 33.6
31.5 0.1 Move down from air 34.5 33.6
31.6 0.3 No operation 34.5 33.6
31.9 0.1 Move up to air 34.5 33.6
32.0 0.1 Move down from air 34.5 33.6
32.1 0.3 No operation 34.5 33.6
32.4 0.1 Move up to air 34.5 33.6
32.5 0.1 Move down from air 34.5 33.6
32.6 0.3 No operation 34.5 33.6
32.9 0.1 Move up to air 34.5 33.6
33.0 0.1 Move down from air 34.5 33.6
33.1 1.4 No operation 34.5 33.6 0.9 -1200mv
34.5 34.5 34.5
34.5 0.8 Move up from CS 34.5 34.5
35.3 0.4 Move from CS to WA 34.5 0.3 No operation 34.5
35.7 0.0 Open SV7 34.8 0.1 Aspirate 20ml at 200ml/s 34.5
35.7 0.2 Move down to WA 34.9 0.1 No operation 34.5
35.9 0.7 Wash probe 35.0 0.1 Close SV3 34.5
36.6 0.2 Move up from WA 35.1 0.0 Open SV4 34.5
36.8 0.0 Close SV7 35.1 2.2 Reset to home 34.5 3.5 0mv
36.8 0.4 Move from WA to AB 37.3 0.2 Backlash 38.0
37.2 0.8 Move down to AB 37.5 38.0
38.0 37.5 0.1 No operation 38.0
38.0 37.6 0.1 Close SV4 38.0
38.0 37.7 0.3 No operation 38.0
38.0 2.1 No operation 38.0 0.0 Open SV3 38.0 1.2 -1200mv
40.1 0.2 No operation 38.0 1.4 Aspirate 500ml at 360ml/s 39.2
40.3 0.8 Move up from AB 39.4 0.1 No operation 39.2 0.3 0mv

V 1.6 – April 1999 3 Appendix 2


RD/Hitachi Elecsys 2010 Service Manual

41.1 39.5 0.6 Aspirate 90ml at 150ml/s 39.5 0.3 1000mv


41.1 40.1 0.1 Close SV3 39.8 0.3 -1200mv
41.1 40.2 0.0 Open SV4 40.1
41.1 40.2 0.2 Backlash (ccw) 40.1
41.1 0.3 Move from AB to WA 40.4 0.1 No operation 40.1 1.9 0mv
(0.4s)
41.4 40.5 0.1 Close SV4 42.0
41.4 40.6 0.7 No operation 42.0
41.4 0.0 Open SV7 41.3 0.0 Open SV3 42.0
41.4 0.6 Wash probe 41.3 0.1 Discharge 35ml at 360ml/s 42.0
42.0 0.0 Close SV7 41.4 0.1 No operation 42.0
42.0 41.5 0.1 Close SV3 42.0
42.0 41.6 0.0 Open SV4 42.0
42.0 41.6 0.4 No operation 42.0
42.0 0.0 No operation 42.0 0.0 Close SV4 42.0
42.0 42.0 42.0

Other Units
Time Interval Action Remarks
Reset: Refer to the table in Reset

- Disinfection

Pipetter
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming: Refer to the table in Pipetter Prime

Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming: Refer to the table in Sipper Prime
Air substitution: Refer to the table in Cell Exchange

Other Units
Time Interval Action Remarks
Reset: Refer to the table in Reset

Appendix 2 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- System Volume Check

Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset

Sipper, Magnet Driver and SV7 Syringe Valve3/4 Voltage


Time Interval Action Time Interval Action Time Interval Action
0.0 0.4 Move from WA to AB 0.0 0.1 Close SV4 0.0 14.2 No operation
0.4 0.1 0.0 Open SV3 14.2
0.4 0.1 0.3 No operation 14.2
0.4 0.8 Move down to AB 0.4 1.0 No operation 14.2
1.2 12.2 No operation 1.4 12.0 Aspirate 600ml at 50ml/s 14.2
13.4 0.8 Move up from AB 13.4 0.8 No operation 14.2
14.2 14.2 14.2
The following action is repeated 5 times
0.0 0.2 No operation 0.0 0.1 Close SV4 0.0 9.5 0mv
0.2 0.1 0.1 Open SV3 9.5
0.2 1.0 No operation 0.2 1.0 Aspirate 100ml at 9.5
100ml/s
1.2 0.8 Move down to AB 1.2 0.8 No operation 9.5
2.0 12.0 No operation 2.0 12.0 Aspirate 600ml at 50ml/s 9.5 0.0 ADC (3.0s)
14.0 0.2 No operation 14.0 0.1 No operation 9.5 2.0 1400mv
14.2 0.8 Move up from AB 14.1 0.1 Close SV3 11.5 4.3 0mv
15.0 14.2 0.0 Open SV4 15.8
15.0 0.8 No operation 14.2 1.3 Reset (1200 pulses) 15.8
15.8 15.5 0.2 Backlash 15.8
15.8 15.7 0.1 No operation 15.8
15.8 15.8 15.8
The following action is carried out after finishing the repetition:
0.0 0.4 Move from AB to WA 0.0 0.7 Close SV4 0.0 3.0 No operation
0.4 0.0 Move down to WA (0.2s) 0.7 0.0 Open SV3 3.0
0.4 0.0 Open SV7 0.7 1.1 Aspirate 100ml at 3.0
100ml/s
0.4 1.5 No operation 1.8 0.1 Close SV3 3.0
1.9 0.0 Close SV7 1.9 0.1 No operation 3.0
1.9 0.2 No operation 2.0 0.0 OpenSV4 3.0
2.1 0.2 Move up from WA 2.0 0.9 Reset 3.0
2.3 0.7 No operation 2.9 0.1 Close SV4 3.0
3.0 3.0 3.0

Other Units
Time Interval Action Remarks
Reset: Refer to the table in Reset

V 1.6 – April 1999 5 Appendix 2


RD/Hitachi Elecsys 2010 Service Manual

Cleaning
Time Interval Action Remarks
0 600 Cleaning1 Details are shown below
600 2400 Cleaning2 (repeat 4 times) Details are shown below
3000 End of cleaning

Cleaning 1
Time Interval Action Remarks
0.0 0.0 Pump on
0.0 0.1 Close SV3
0.1 0.0 Open SV4
0.1 0.0 Open SV2
0.1 59.9 No operation Cleaning sipper syringe
60.0 0.0 Close SV2
60.0 0.0 Close SV4
60.0
60.0 0.0 Open SV1
60.0 60.0 No operation Cleaning pipetter syringe
120.0 0.0 Close SV1
120.0 0.0 Open SV6
120.0 60.0 No operation Cleaning pipetter wash station
180.0 0.0 Close SV6
180.0
180.0 0.0 Open SV5
180.0 60.0 No operation Cleaning beads mixer wash station
240.0 0.0 Close SV5
240.0
240.0 0.0 Open SV7
240.0 60.0 No operation Cleaning sipper wash station
300.0 0.0 Close SV7
300.0
300.0 300.0 No operation
600.0 End of cleaning 1

Appendix 2 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

Cleaning 2
Time Interval Action Remarks
0.0 0.1 Close SV3
0.1 0.0 Open SV4
0.1 0.0 Open SV2
0.1 239.9 No operation Cleaning sipper syringe
240.0 0.0 Close SV2
240.0 0.0 Close SV4
240.0
240.0 0.0 Open SV1
240.0 240.0 No operation Cleaning pipetter syringe
480.0 0.0 Close SV1
480.0 0.0 Open SV6
480.0 30.0 No operation Cleaning pipetter wash station
510.0 0.0 close SV6
510.0
510.0 0.0 Open SV5
510.0 60.0 No operation Cleaning beads mixer wash station
570.0 0.0 Close SV5
570.0
570.0 0.0 Open SV7
570.0 30.0 No operation Cleaning sipper wash station
600.0 0.0 Close SV7
600.0 0.0 Pump off The action is carried out at 4th
repetition
600.0 End of cleaning 2

V 1.6 – April 1999 7 Appendix 2


RD/Hitachi Elecsys 2010 Service Manual

(3) Reset

- R. Disk
Time Interval Action Remarks
0.0 3.5 No operation
3.5 2.2 Move to home - 1
5.7 2.3 Move to home - 2
8.0 0.4 Home to Pos.1
8.4 11.6 No operation
20.0 End of reset

- Cap Open/Close Mechanism


Time Interval Action Remarks
0.0 1.1 Move to cap or home (F/B) No operation when the unit is in
the home or cap position
1.1 0.2 Outside cap (F/B) No operation when the unit is in
the home position
1.3 0.2 Move to cap (F/B) No operation when the unit is in
the home position
1.5 0.4 Outside home (U/D) No operation when the unit is not
in the home position
1.9 0.7 Move to home (U/D)
2.6 0.5 Cap to home (F/B) No operation when the unit is in
the home position
3.1 0.2 Outside home (F/B)
3.3 0.2 Move to home (F/B)
3.5 16.5 No operation
20.0 End of reset

- Beads Mixer
Time Interval Action Remarks
0.0 2.3 Move to home (U/D) No operation when the unit is in
the home position
2.3 0.2 Outside washer (R) No operation when the unit is not
in the washer position
2.5 0.6 Move to washer (R)
3.1 0.3 Outside home (U/D)
3.4 0.3 Outside home to home (U/D)
3.7 16.3 No operation
20.0 End of reset

- S. Disk
Time Interval Action Remarks
0.0 0.9 No operation
0.9 4.2 Move to home - 1
5.1 4.4 Move to home - 2
9.5 0.4 Home to Pos.1
9.9 10.1 No operation
20.0 End of reset

V 1.6 – April 1999 1 Appendix 3


RD/Hitachi Elecsys 2010 Service Manual

- BCR
Time Interval Action Remarks
0.0 0.5 Outside home No operation when the unit is in
the home position
0.5 2.1 Move to home
2.6 17.4 No operation
20.0 End of reset

- Pipetter
Time Interval Action Remarks
0.0 0.0 Close SV1
0.0 0.0 Close SV5
0.0 0.9 Move to home (Z) No operation when the unit is in
the home position
0.9 3.6 No operation
4.5 0.3 Outside home (X) No operation when the unit is not
in the home position
4.8 5.9 Move to home (X)
10.7 0.5 Move down for discarding tip (Z)
11.2 0.2 SW to discarding position (X)
11.4 0.6 Move up for discarding tip (Z)
12.0 0.4 Discarding position to W (X)
12.4 0.4 Outside home (S) No operation when the unit is not
in the home position
12.8 2.5 Move to home (S)
15.3 0.2 Open SV1
15.5 0.1 Close SV1
15.6 End of reset

- Tip/Vessel Carrier
Time Interval Action Remarks
0.0 0.9 Move up to home (Z) No operation when the unit is
in the home position
0.9 0.3 Outside HPY No operation when the unit is
in the home position
1.2 3.6 Move to HPY
4.8 0.3 Outside HPX No operation when the unit is not
in the home position
5.1 2.9 Move to HPX
8.0 0.9 HPY to RPY
8.9 0.4 RP to VW
9.3 0.4 Move down to VW (Z)
9.7 0.2 On SOL1
9.9 0.2 Move up to home (Z, 0.9s)
10.1 0.7 Off SOL1
10.8 0.4 VW to RP
11.2 End of reset

Appendix 3 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Solid Waste
Time Interval Action Remarks
0.0 0.9 No operation
0.9 1.2 Reset to home
2.1 1.0 No operation
3.1 2.0 Shaking
5.1 14.9 No operation
20.0 End of reset

- Sipper
Time Interval Action Remarks
0.0 0.0 Close SV7
0.0 0.0 Close SV2
0.0 0.0 Close SV3
0.0 0.0 Outside home (M) (0.4s) No operation when the unit is not
in the home position
0.0 0.1 Move to home (Z) (0.9s) No operation when the unit is
in the home position
0.1 0.0 Open SV4
0.1 0.3 Outside home (S) (0.5s) No operation when the unit is not
in the home position
0.4 0.2 Move to home (M) (1.2s)
0.6 0.3 Move to home (S) (4.2s)
0.9 0.4 Outside SIP (X) no operation when the unit isn’t in
the SIP
1.3 2.5 Move to SIP (X)
3.8 0.3 SIP to WA (X)
4.1 0.0 Open SV7
4.1 0.2 Move down to WA (Z)
4.3 0.8 No operation
5.1 0.0 Close SV7
5.1 0.2 Move up to home (Z) (0.9s)
5.3 0.7 Close SV4
6.0 End of reset

V 1.6 – April 1999 3 Appendix 3


RD/Hitachi Elecsys 2010 Service Manual

(4) Initialization

- R. Disk

Time Interval Action Remarks


Reset: Refer to the table in Reset

- Cap Open/Close mechanism


Time Interval Action Remarks
Reset: Refer to the table in Reset

- Beads Mixer
Time Interval Action Remarks
Reset: Refer to the table in Reset

- BCR

Time Interval Action Remarks


Reset: Refer to the table in Reset

- S. Disk

Time Interval Action Remarks


Reset: Refer to the table in Reset

- Pipetter

Time Interval Action Remarks


Reset: Refer to the table in Reset
Priming
0.0 0.0 Open SV1
0.0 4.3 Aspirate 420ml
4.3 4.4 Discharge 420ml
8.7 2.1 Aspirate 200ml
10.8 2.2 Discharge 200ml
13.0 2.1 Aspirate 200ml
15.1 2.2 Discharge 200ml
17.3 2.2 No operation
19.5 0.5 Close SV1
20.0 End of priming

- Tip/Vessel Carrier

Time Interval Action Remarks


Reset: Refer to the table in Reset

Appendix 4 1 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Solid Waste
Time Interval Action Remarks
Reset: Refer to the table in Reset

- Sipper
Time Interval Action Remarks
Reset: Refer to the table in Reset
Priming
0.0 0.1 Close SV3
0.1 0.1 Open SV4
0.2 19.6 Open SV2
19.8 0.1 Close SV2
19.9 0.1 Close SV4
20.0 End of priming

V 1.6 – April 1999 2 Appendix 4


RD/Hitachi Elecsys 2010 Service Manual

(5) Finalization

- Pipetter
Time Interval Action Remarks
Priming : Refer to the table in Initialization

- Tip/Vessel Carrier
Time Interval Action Remarks
Moving to STP
0.0 0.3 RPY to STPY
0.3 End of moving to STP

- Sipper
Time Interval Action Remarks
Sipper long priming
0.0 0.1 Close SV3
0.1 0.1 Open SV4
0.2 179.6 Open SV2
179.8 0.1 Close SV2
179.9 0.1 Close SV4
180.0 0.1 Open SV3
180.1 59.7 Open SV2
239.8 0.1 Close SV2
239.9 0.1 Close SV3
240.0 End of sipper long priming
Water substitution
0.0 0.1 Close SV3
0.1 0.0 Open SV4
0.1 1.4 Reset to home (S)
1.5 0.1 Close SV4
1.6 0.0 Open SV3
1.6 0.4 Move from WA to AB (X)
2.0 0.5 Aspirate air 20ml at 50ml/s
2.5 0.8 Move down to AB (Z)
3.3 5.1 Aspirate AB 500ml at 100ml/s
8.4 0.7 Move up from AB (Z) (0.8s)
9.1 0.5 Aspirate air 20ml at 50ml/s
9.6 0.4 Move from AB to WA (X)
10.0 0.3 Open SV7
10.3 1.1 Aspirate water 100ml at 100ml/s
11.4 0.1 Close SV3
11.5 0.1 Close SV7
11.6 0.0 Open SV4
11.6 1.4 Reset to home (S)
13.0 0.1 Close SV4
13.1 End of water substitution

V 1.6 – April 1999 1 Appendix 5


RD/Hitachi Elecsys 2010 Service Manual

(6) R. Scan

- R. Disk
Time Interval Action Remarks
R. disk BC reading
0.0 1.5 Move to BC reading position
1.5 2.0 No operation
3.5
The following action is repeated
18 times
0.0 3.5 BC reading (CCW)
3.5 3.5 No operation (decoding)
7.0 The following action is omitted
if no retry is carried out
7.0 3.5 Move back to BC reading position
10.5 1.5 No operation
12.0 3.5 BC reading (CCW)
15.5 3.5 No operation (decoding)
19.0 End of R. disk BC reading

- BCR

Time Interval Action Remarks


R. Disk BC reading
0.0 3.5 No operation
3.5
The following action is repeated
18 times
0.0 4.0 Trigger on
4.0 0.0 Trigger off
4.0 3.0 No operation (data transmission)
7.0 The following action is omitted
if no retry is carried out
7.0 3.5 no operation
10.5 1.5 no operation
12.0 4.0 Trigger on (retry)
16.0 0.0 Trigger off
16.0 3.0 No operation (data transmission)
19.0 End of R. disk BC reading

Appendix 5 2 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(7) Tip/Vessel Carrier

l At first, the Tip/Vessel Carrier checks whether a Tip/Vessel is present at the left back corner of a magazine.
l If it does not find a Tip/Vessel in that position, then it checks the memorized position where a Tip/Vessel was
present the last time. If no Tip/Vessel is found there either, then it checks the next position.
l If no Tip/Vessel is found during these three checks, no Tip/Vessel is registered on the magazine, and the
Tip/Vessel carrier checks the next magazine.

Time Interval Action Remarks


Checking the first pick up position on the Tip/Vessel magazine
The action below is repeated in the order TM1,TM2,TM3,VM1,VM2,VM3.
0.0 0.8 RP to TM1,1 TM2: FRP to TM11,1
TM3: FRP to TM21,1
VM1: FRP to VM1,1
VM2: FRP to VM11,1
VM3: FRP to VM21,1
0.8 0.2 On SOL1
1.0 0.4 Move down to TM or VM
1.4 0.2 Off SOL1
1.6 0.4 Move up from TM or VM
2.0 0.4 No operation
2.4 0.4 Move down to TM or VM
2.8 0.2 On SOL1
3.0 0.4 Move up from TM or VM
3.4 0.0 Off SOL1
3.4 0.9 TM1,1 to TB1 TM2: FTM11,1 toTB1
TM3: FTM21,1 to TB1
VM1: FVM1,1 to VB
VM2: FVM11,1 to VB
VM3: FVM21,1 to VB
4.3 0.8 TB1 to RP or VB to RP

5.1 The action below is omitted


if a tip is found in TM1,1
5.1 0.8 RP to TMY,X or VMY,X

5.9 0.2 On SOL1


6.1 0.4 Move down to TM or VM
6.5 0.2 Off SOL1
6.7 0.4 Move up from TM or VM
7.1 0.4 No operation
7.5 0.4 Move down to TM or VM
7.9 0.2 On SOL1
8.1 0.4 Move up from TM or VM
8.5 0.0 Off SOL1
8.5 0.9 TMY,X to TB1 or VMY,X to VB

9.4 0.8 TB1 to RP or VB to RP

10.2 The action below is omitted


if a tip is found in TMY,X‚
10.2 0.8 RP to TMY,X+1 or VMY,X+1

11.0 0.2 On SOL1


11.2 0.4 Move down to TM or VM
11.6 0.2 Off SOL1

V 1.6 – April 1999 3 Appendix 5


RD/Hitachi Elecsys 2010 Service Manual

11.8 0.4 Move up from TM or VM


12.2 0.4 No operation
12.6 0.4 Move down to TM or VM
13.0 0.2 On SOL1
13.2 0.4 Move up from TM or VM
13.6 0.0 Off SOL1
13.6 0.9 TMY,X+1 to TB1 or VMY,X+1 to
VB
14.5 0.8 TB1 to RP or VB to RP

15.3 End of checking the position

- Sipper
Time Interval Action Remarks
Checking the volume in the system reagent bottles
0.0 0.4 Wash to AB1 (X)
0.4 2.0 Move down to AB1 (Z)
2.4 0.1 No operation
2.5 0.8 Move up from AB1 (Z)
3.3 0.3 AB1 to CC1 (X)
3.6 2.0 Move down to CC1 (Z)
5.6 0.1 No operation
5.7 0.8 Move up from CC1 (Z)
6.5 0.4 CC1 to wash (X)
6.9 0.0 Open SV7
6.9 0.2 Move down to wash (Z)
7.1 0.5 Wash probe
7.6 0.0 Close SV7
7.6 0.2 Move up from wash (Z)
7.8 0.4 Wash to AB2 (X)
8.2 2.0 Move down to AB2 (Z)

10.2 0.1 No operation


10.3 0.8 Move up from AB2(Z)
11.1 0.3 AB2 to CC2 (X)
11.4 2.0 Move down to CC2 (Z)
13.4 0.1 No operation
13.5 0.8 Move up from CC2 (Z)
14.3 0.4 CC2 to wash (X)
14.7 0.0 Open SV7
14.7 0.2 Move down to wash (Z)
14.9 0.5 Wash probe
15.4 0.0 Close SV7
15.4 0.2 Move up from wash (Z)
15.6 End of checking the volume

Appendix 5 4 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

(8)S. Scan

- BCR
Time Interval Action Remarks
S. disk BC reading
0.0 1.1 R. disk to S. disk
1.1
The following action is repeated
30 times
0.0 1.0 Trigger on
1.0 0.0 Trigger off
1.0 2.6 No operation (data transmission)
3.6 The following action is omitted
if no retry is carried out
3.6 1.0 Trigger on (retry)
4.6 0.0 Trigger off
4.6 2.6 No operation (data transmission)
7.2 0.4 No operation
7.6 the end of repetition

0.0 1.3 S. disk to R.disk


1.3 End of S. disk BC reading

- S. Disk

Time Interval Action Remarks


S. disk BC reading
0.0 0.5 Move to BC reading position
0.5 0.6 No operation
1.1
The following action is repeated
30 times
0.0 0.1 No operation
0.1 0.5 BC reading (CCW)
0.6 3.0 No operation (decoding)
3.6 The following action is omitted
if no retry is carried out
3.6 0.5 BC reading (CW retry)
4.1 3.0 No operation (decoding)
7.1 0.5 Move to the next sample (CCW)
7.6 End of S. disk BC reading

V 1.6 – April 1999 5 Appendix 5


RD/Hitachi Elecsys 2010 Service Manual

(9) Preoperation

- R. Disk
Time Interval Action Remarks
Reset: Refer to the table in Reset
Waiting until priming is over
R. disk BC reading: Refer to the table in R. scan
Beads mixing
0.0 1.3 Moving pitch from a Cap/Open The following action is repeated
position to the another C/O position for as many times as the number
of RackPacks on the R. disk
1.3 2.7 No operation
4.0 0.7 Cap/Open to beads mixing
4.7 19.0 No operation
23.7 0.7 Beads mixing to Cap/Open
24.4 2.7 No operation
27.1 End of beads mixing

- Cap Open/Close mechanism

Time Interval Action Remarks


Reset: Refer to the table in Reset
Waiting until priming is over
Waiting until R. disk BC reading is over
Beads mixing
0.0 1.3 No operation The following action is repeated
for as many times as the number
of RackPacks on the R. disk
1.3 0.5 Home to beads capping (F/B)
1.8 0.5 Home to capping (U/D)
2.3 0.2 Capping to opening (F/B)
2.5 0.5 Capping to upper (U/D)
3.0 0.2 Opening to capping (F/B)
3.2 0.2 Upper to home (U/D)
3.4 0.5 Beads capping to home (F/B)
3.9 0.1 No operation
4.0 0.7 No operation
4.7 19.0 No operation
23.7 0.7 No operation
24.4 0.6 Home to beads open (F/B)
25.0 0.5 Home to close (U/D)
25.5 0.5 Close to home (U/D)
26.0 0.6 Beads open to home (F/B)
26.6 0.5 No operation
27.1 End of beads mixing

Appendix 5 6 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Beads Mixer
Time Interval Action Remarks
Reset : Refer to the table in Reset
Waiting until priming is over
Waiting until R. disk BC reading is over
Beads mixing
0.0 1.3 No operation The following action is repeated
for as many times as the number
of RackPacks on the R. disk
1.3 0.7 Wash to mixing (R)
2.0 1.0 Move down to mixing (U/D)
3.0 15.0 On mixing rod
18.0 0.0 Off mixing rod
18.0 1.7 Move up from mixing 1 (U/D)
19.7 0.6 Move up from mixing 2 (U/D)
20.3 0.7 Mixing to wash (R)
21.0 1.0 Move down to wash (U/D)
22.0 2.0 On mixing rod
24.0 0.0 Off mixing rod
24.0 0.7 Move up from wash (U/D)(2.6s)
24.7 0.7 On SV6
25.4 1.2 Off SV6
26.6 0.5 No operation
27.1 End of beads mixing

- BCR

Time Interval Action Remarks


Reset: Refer to the table in Reset
Waiting until priming is over
R. disk BC reading: Refer to the table in R. scan
S. disk BC reading: Refer to the table in S. scan

- S. Disk

Time Interval Action Remarks


Reset : Refer to the table in Reset
Waiting until priming is over
Waiting until R. disk BC reading is over
S. disk BC reading : Refer to the table in S. scan

V 1.6 – April 1999 7 Appendix 5


RD/Hitachi Elecsys 2010 Service Manual

- Pipetter
Time Interval Action Remarks
Reset : Refer to the table in Reset
Priming : Refer to the table in Initialization
Removing the tips on buffer positions
0.0 0.3 Wash to TB1 (X) The following action is omitted
for 3.7s if no tip is found on the
TB1 position
0.3 0.5 Move down for pick up (Z)
0.8 0.5 Move up for pick up (Z)
1.3 0.3 TB1 to wash (X)
1.6 0.5 Wash to TW (X) The following action is omitted
for 3.7s if no tip is found on the
TB2 position
2.1 0.5 Move down for discard tip (Z)
2.6 0.2 TW to discarding position (X)
2.8 0.5 Move up for discard tip 1 (Z)
3.3 0.4 Move up for discard tip 2 (Z)
3.7 0.4 Discarding position to wash (X)
4.1 0.3 Wash to TB2 (X)
4.4 0.5 Move down for pick up (Z)
4.9 0.5 Move up for pick up (Z)
5.4 0.3 TB2 to wash (X)
5.7 End of removing the tips
Wasting the mixture in the vessels on the incubator
0.0 0.3 Wash to TB1 (X) The following action is omitted
for 1.3s when a tip is found when
removing the tips
0.3 0.5 Move down for pick up (Z)
0.8 0.5 Move up for pick up (Z)
1.3 0.3 TB1 to wash (X)
1.6
0.0 0.4 Wash to VB, DB1 or DB2 (X)
0.4 0.5 No operation
0.9 0.1 Aspirate air (10ml) (S)
1.0 0.3 Move down for aspirating from VB,
DB1 or DB2
1.3 0.0 Move down during aspiration (Z)
1.3 1.5 Aspirate (S)
2.8 0.3 Move up for aspirating from VB, DB1
or DB2 (Z)
3.1 0.4 VB, DB1 or DB2 to wash (X)
3.5 2.1 Discharge (S) (3.2s)
5.6 1.0 Open SV5
6.6 0.1 Close SV5
6.7
0.0 0.5 Wash to TW (X) This action is carried out after
all the positions on the incubator
have been checked
0.5 0.5 Move down for discard tip (Z)
1.0 0.2 TW to discarding position (X)
1.2 0.5 Move up for discard tip 1 (Z)
1.7 0.4 Move up for discard tip 2 (Z)
2.1 0.4 Discarding position to wash (X)
2.5 End of wasting the mixture

Appendix 5 8 V 1.6 – April 1999


RD/Hitachi Elecsys 2010 Service Manual

- Tip/Vessel Carrier
Time Interval Action Remarks
Reset : Refer to the table in Reset
Waiting until priming is over
Checking the first pick up position : Refer to the table in R. scan
Removing the vessels on the buffer position and incubator
0.0 3.2 Vessel check on VB
3.2 4.5 TMY,X to TB1 This action is omitted if a tip is
found when removing the tips

7.7 8.3/6.7 No operation The following action is omitted


for 16.0/14.4s if no vessel is
found on VB
16.0/14.4 4.3 VB to VW
20.3/18.7
0.0 3.3 Vessel check on DB1
3.3 6.7 No operation The following action is omitted
for 10.0s if no vessel is found on
DB1
10.0 4.4 DB1 to VW
14.4
0.0 3.3 Vessel check on DB2
3.3 6.7 No operation The following action is omitted
for 10.0s if no vessel is found on
DB2
10.0 4.4 DB2 to VW
14.4
0.0 3.7 SIP to VB Checking whether a tip is present
when picking up a vessel on SIP.
If no vessel is found, the
following action is omitted for
10.4s.
3.7 6.7 No operation
10.4 4.3 VB to VW
14.7
0.0 5.0 INCY,X to VB Checking whether a tip is present
when picking up a vessel on
incubator. If no vessel is found,
the following action is omitted
for 14.2s.
5.0 9.2 No operation
14.2 4.3 VB to VW
18.5
End of removing the vessels

- Solid Waste

Time Interval Action Remarks


Reset: Refer to the table in Reset

- Sipper

Time Interval Action Remarks


Reset: Refer to the table in Reset
Priming: Refer to the table in Initialization
Checking the volume in the system reagent bottles: Refer to the table in R. scan

V 1.6 – April 1999 9 Appendix 5


RD/Hitachi Elecsys 2010 Service Manual

Assay Timetable

AP No. Pretreatment i0 1st pipetting i1 2nd pipetting i2 Detection Assay Item


0 B, R1, R2, S i1 D
1 B, R1, S i1 R2 i2 D
2 R1, R2, S i1 B i2 D TSH
3 R1, S i1 B, R2 i2 D
4 DL, S i0 B, R1, R2, DS i1 D
5 DL, S i0 B, R1, DS i1 R2 i2 D
6 DL, S i0 R1, R2, DS i1 B i2 D
7 DL, S i0 R1, DS i1 B, R2 i2 D
8 DL,S : DL,DS i0 B, R1, R2, DS i1 D
9 DL,S : DL,DS i0 B, R1, DS i1 R2 i2 D
10 DL,S : DL,DS i0 R1, R2, DS i1 B i2 D
11 DL,S : DL,DS i0 R1, DS i1 B, R2 i2 D
12 PR, S i0 B, R1, R2 i1 D
13 PR, S i0 B, R1, i1 R2 i2 D
14 PR, S i0 R1, R2 i1 B i2 D
15 PR, S i0 R1 i1 B, R2 i2 D
16 RM, S i0 B, R1, R2, PS i1 D
17 RM, S i0 B, R1, PS i1 R2 i2 D
18 RM, S i0 R1, R2, PS i1 B i2 D
19 RM, S i0 R1, PS i1 B, R2 i2 D
20 RM,S : RM,PS i0 B, R1, R2, PS i1 D
21 RM,S : RM,PS i0 B, R1, PS i1 R2 i2 D
22 RM,S : RM,PS i0 R1, R2, PS i1 B i2 D
23 RM,S : RM,PS i0 R1, PS i1 B, R2 i2 D
24 R1, R1 i1 D' I. Cal
25 R1, R2 i1 D' I. Cal
26 R2, R2 i1 D' I. Cal

AP : assay protocol
B : bead R1 : reagent 1 R2 : reagent 2 S : sample DL : diluent
DS : diluted sample PR, RM : pretreatment solution PS : pretreated sample
i0, i1, i2 : incubation period
D : detection cycle with magnet drive D' : detection cycle without magnet drive

V 1.6 – April 1999 1 Appendix 6

You might also like