HITFET=BTS 149

Smart Lowside Power Switch

Features Product Summary
• Logic Level Input Drain source voltage VDS 60 V
• Input Protection (ESD) On-state resistance RDS(on) 18 mΩ
•=Thermal shutdown with latch Current limit I D(lim) 30 A
• Overload protection Nominal load current I D(ISO) 19 A
• Short circuit protection Clamping energy EAS 6000 mJ
• Overvoltage protection
• Current limitation
• Status feedback with external input resistor
• Analog driving possible

Application
• All kinds of resistive, inductive and capacitive loads in switching or
linear applications
• µC compatible power switch for 12 V and 24 V DC applications
• Replaces electromechanical relays and discrete circuits

General Description
N channel vertical power FET in Smart SIPMOS  chip on chip tech-
nology. Fully protected by embedded protected functions.

V bb

LOAD M

D rain
2
O ve rvoltag e
dv /d t C u rre n t
1 p rotection
IN lim ita tio n lim ita tio n

O ve r-
O v erloa d Shho rt circ
c ircu
ESD te m pe rature S ort uitit
pro te ctio n pprotection
ro te ctio n
p ro te ctio n

S o u rce 3

H IT F E T

Page 1 2004-02-02
 BTS 149

Maximum Ratings at Tj = 25 °C unless otherwise specified

Parameter Symbol Value Unit
Drain source voltage VDS 60 V
Drain source voltage for short circuit protection VDS(SC) 32
Continuous input current 1) IIN mA
-0.2V ≤ VIN ≤ 10V no limit
VIN < -0.2V or VIN > 10V | IIN | ≤ 2
Operating temperature Tj - 40 ... +150 °C
Storage temperature Tstg - 55 ... +150
Power dissipation Ptot 178 W
TC = 25 °C
Unclamped single pulse inductive energy EAS 6000 mJ
ID(ISO) = 19 A
Electrostatic discharge voltage (Human Body Model) VESD 3000 V
according to MIL STD 883D, method 3015.7 and
EOS/ESD assn. standard S5.1 - 1993
Load dump protection VLoadDump2) = VA + VS VLD
VIN=low or high; VA =13.5 V
td = 400 ms, RI = 2 Ω, ID =0,5*19A 110
td = 400 ms, RI = 2 Ω, ID = 19A 92
DIN humidity category, DIN 40 040 E
IEC climatic category; DIN IEC 68-1 40/150/56

Thermal resistance
junction - case: RthJC 0.7 K/W
junction - ambient: RthJA 75
SMD version, device on PCB: 3) RthJA 45

1In case of thermal shutdown a minimum sensor holding current of 500 µA has to be guaranteed (see also page 3).
2V
Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
3 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70µm thick) copper area for Drain connection.
PCB mounted vertical without blown air.

Page 2 2004-02-02
 BTS 149

Electrical Characteristics
Parameter Symbol Values Unit
at Tj=25°C, unless otherwise specified min. typ. max.
Characteristics
Drain source clamp voltage VDS(AZ) 60 - 73 V
Tj = - 40 ...+ 150°C, ID = 10 mA
Off state drain current IDSS - - 25 µA
VDS = 32 V, Tj = -40...+150 °C, VIN = 0 V
Input threshold voltage VIN(th) 1.3 1.7 2.2 V
ID = 3,9 mA
Input current - normal operation, ID<ID(lim): IIN(1) - - 100 µA
VIN = 10 V
Input current - current limitation mode, ID=ID(lim): IIN(2) - 400 1000
VIN = 10 V
Input current - after thermal shutdown, ID=0 A: IIN(3) 1500 3000 6000
VIN = 10 V
Input holding current after thermal shutdown 1) IIN(H)
Tj = 25 °C 500 - -
Tj = 150 °C 300 - -
On-state resistance RDS(on) mΩ
VIN = 5 V, ID = 19 A, Tj = 25 °C - 18 22
VIN = 5 V, ID = 19 A, Tj = 150 °C - 30 44
On-state resistance RDS(on)
VIN = 10 V, I D = 19 A, Tj = 25 °C - 14 18
VIN = 10 V, I D = 19 A, Tj = 150 °C - 25 36
Nominal load current (ISO 10483) ID(ISO) 19 A
VIN = 10 V, VDS = 0.5 V, TC = 85 °C

1If the input current is limited by external components, low drain currents can flow and heat the device.
Auto restart behaviour can occur.

Page 3 2004-02-02
 BTS 149

Electrical Characteristics
Parameter Symbol Values Unit
at Tj=25°C, unless otherwise specified min. typ. max.
Characteristics
Initial peak short circuit current limit ID(SCp) - 130 - A
VIN = 10 V, VDS = 12 V
Current limit 1) ID(lim) 30 40 60
VIN = 10 V, VDS = 12 V, tm = 350 µs,
Tj = -40...+150 °C

Dynamic Characteristics
Turn-on time VIN to 90% ID : ton - 40 100 µs
RL = 1 Ω, VIN = 0 to 10 V, Vbb = 12 V
Turn-off time VIN to 10% ID : toff - 70 170
RL = 1 Ω, VIN = 10 to 0 V, Vbb = 12 V
Slew rate on 70 to 50% Vbb : -dVDS/dton - 1 3 V/µs
RL = 1 Ω, VIN = 0 to 10 V, Vbb = 12 V
Slew rate off 50 to 70% Vbb: dVDS/dtoff - 1 3
RL = 1 Ω, VIN = 10 to 0 V, Vbb = 12 V

Protection Functions
Thermal overload trip temperature Tjt 150 165 - °C
Unclamped single pulse inductive energy EAS mJ
ID = 19 A, Tj = 25 °C, Vbb = 32 V 6000 - -
ID = 19 A, Tj = 150 °C, Vbb = 32 V 1800 - -

Inverse Diode
Inverse diode forward voltage VSD - 1.1 - V
IF = 5*19A, tm = 300 µS, VIN = 0 V

1Device switched on into existing short circuit (see diagram Determination of I D(lim)). If the device is in on condition
and a short circuit occurs, these values might be exceeded for max. 50 µs.

Page 4 2004-02-02
 BTS 149

Block Diagramm

Terms Inductive and overvoltage output clamp

RL V D
Z

I IN 2
D
IN
1 ID VDS Vbb S
HITFET
3
S HITFET
VIN

Short circuit behaviour

Input circuit (ESD protection)
V IN

I D(SCp)
IN

I D(Lim)
ID
ESD-ZD I

Source

t0 tm t1 t2
ESD zener diodes are not designed
for DC current > 2 mA @ VIN >10V.
t0: Turn on into a short circuit
tm: Measurementpoint for ID(lim)
t1: Activation of the fast temperature sensor and
regulation of the drain current to a level where
the junction temperature remains constant.
t2: Thermal shutdown caused by the second
temperature sensor, achieved by an
integrating measurement.

Page 5 2004-02-02
 BTS 149

Maximum allowable power dissipation On-state resistance

Ptot = f(Tc ) RON = f(Tj ); ID=19A; VIN =10V

BTS 149
190 40

W
mΩ
160

30
140

RDS(on)
Ptot

120 25

100 20
max.
80
15

60
typ.
10
40

5
20

0 0
0 20 40 60 80 100 120 °C 160 -50 -25 0 25 50 75 100 °C 150

150 Tj

On-state resistance Typ. input threshold voltage

RON = f(Tj ); ID= 19A; V IN=5V VIN(th) = f(Tj); ID =3,9mA; VDS =12V

45 2.0

mΩ V

1.6
35
RDS(on)

1.4
VIN(th)

30
max.
1.2
25
1.0
20 typ.
0.8
15
0.6

10
0.4

5 0.2

0 0.0
-50 -25 0 25 50 75 100 °C 150 -50 -25 0 25 50 75 100 °C 150
Tj Tj

Page 6 2004-02-02
 BTS 149

Typ. transfer characteristics Typ. output characteristic

ID = f(VIN); VDS =12V; Tj =25°C ID = f(VDS); Tj =25°C
Parameter: VIN
40 50

A
10V
A
6V
30
5V

25 4V
ID

ID
30

20

20
15
Vin=3V

10
10

0 0
0 1 2 3 4 5 6 °C 8 0 1 2 3 V 5

Tj VDS
Transient thermal impedance
Z thJC = f (t p)
parameter : D = t p/T
0
10

K/W D=0.5

0.2
-1
10
0.1
ZthJC

0.05

0.02
-2
10
0.01
0.005

-3
10
0

-4
10 -7 -6 -5 -4 -3 -2 -1 0 2
10 10 10 10 10 10 10 10 s 10

tP

Page 7 2004-02-02
 BTS 149

Application examples:

Status signal of thermal shutdown by

monitoring input current

R St

IN D

µC V
IN
HITFET V
bb
S

∆V
V
IN

thermal shutdown

∆V = RST *IIN(3)

Page 8 2004-02-02
 BTS 149

Package Ordering Code Package Ordering Code

P-TO220-3-45 Q67060-S6503-A3 P-TO220-3-1 Q67060-S6503-A2
4.4
1.3
9.9 0.2
8 2.4
10.5

1)
9.2
3.6
1.5

1.5

0.75
0.5
1.05
2.54
GPT05164

1) shear and punch direction no burrs this surface

Page 9 2004-02-02
 BTS 149

Revision History : 2004-02-02

Previous version : 2000-05-19

Page Subjects (major changes since last revision)

4 ID(lim) from max=55A to max=60A

For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany
or the Infineon Technologies Companies and Representatives worldwide: see our webpage at
http://www.infineon.com
HITFET®, SIPMOS® are registered trademarks of Infineon Technologies AG.

Edition 2004-02-02
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 1999
All Rights Reserved.

Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(see address list).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.

Page 10 2004-02-02
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