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15-disk DAE (DAE6S) technical specifications


Model - VNX5300
Storage Type - VNX for Block (SAN)
Document ID - 1459941440415

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1459941440415
Content Creation Date April 6, 2016
EMC® Block VNX5300

Technical Specifications and Operating Limits

This document lists the technical specifications and operating limits for a Block VNX5300.
The system consists of:
l A disk processor enclosure (DPE)
l One or more optional disk-array enclosures (DAEs)
l Two standby power supplies (SPSs)
This document lists only the technical specifications and operating limits for the DPE and
SPS. The technical specifications and operating limits for the DAE are in the technical
specifications document for the DAE.
For a descriptions of the system's components, refer to the hardware and operational
overview information for the system.
Topics include:
l DPE technical specifications...................................................................................... 2
l SPS technical specifications...................................................................................... 6
l System operating limits............................................................................................. 7
l Shipping and storage requirements........................................................................... 9
DPE technical specifications
Technical specifications include system power requirements, size , drive, and cabling
information.

Power requirements
The input current, power (VA), and dissipation per enclosure listed in this document are
based on measurements of fully configured enclosures under worst-case operating
conditions. Use the operating maximum values to plan the configuration of your storage
system. These values represent either:
l values for a single power supply line cord, or
l the sum of the values shared by the line cords of the combined power supplies in the
same enclosure, with the division between the line cords and supplies at the current
sharing ratio (approximately 50% each).
A failure of one of the combined power supplies per enclosure results in the remaining
power supply supporting the full load. You must use a rackmount cabinet or rack with
appropriate power distribution, and have main branch AC distribution that can handle
these values for each enclosure in the cabinet.
EMC provides a power and weight calculator at http://powercalculator.EMC.com. Use this
calculator to refine the power and heat values in Table 1 on page 2, to more-closely
match the hardware configuration for your system.

Note

The power calculator only supports products with an input voltage range of 200-240V AC.

Table 1 VNX5300 DPE AC power specifications

Requirement Description
AC line voltage 100 to 240 V AC ± 10%, 47–63 Hz, single phase

AC line current (operating 5.84 A max at 100V AC, 2.99 A max at 200V AC (15-drive DPE)
maximum)
6.18 A max at 100V AC, 3.16 A max at 200V AC (25-drive DPE)

Power consumption (operating 599 VA (574 W) max (15-drive DPE)


maximum)
631 VA (608 W) max (25-drive DPE)

Power factor 0.98 min at 100V AC full load,0.95 min at 200V AC full load

Heat dissipation (operating 2.07 x 106 J/hr, (1,959 Btu/hr) max (15-drive DPE)
maximum)
2.19 x 106 J/hr, (2,075 Btu/hr) max (25-drive DPE)

In-rush current 15 A max for ½ line cycle, per line cord at 240V AC

8 A max for ½ line cycle, per line cord at 120V AC

Startup surge current 27 A rms max for 50 ms, at any line voltage

AC protection 7.8 A Normal-blow (non-time delay) fuse on each power


supply, both phases

AC inlet type IEC320-C14 appliance coupler, per power zone

2 EMC Block VNX5300


Technical Specifications and Operating Limits

Table 1 VNX5300 DPE AC power specifications (continued)

Requirement Description
Ride-through time 30 ms min

Current sharing ± 15% of full load, between power supplies

Note

l Ratings assume a fully loaded DPE that includes 2 power supplies, 4 I/O Modules (Type
Limited), and disk drives.
l All power figures shown represent max normal operating numbers with the chassis running in
a normal ambient temperature environment. The chassis power numbers given may increase
5% when running in a higher ambient temperature environment.

Dimensions and weight


Table 2 VNX5300 DPE hardware dimensions and weights

Component Dimensions Vertical size Weight (see note)


15-drive DPE Height: 13.34 cm (5.25 in)

Width: 44.5 cm (17.5 in) 3 NEMA units 43.7 kg (96.34 lb)

Depth: 61 cm (24 in)

25-drive DPE Height: 13.34 cm (5.25 in)

Width: 44.5 cm (17.5 in) 3 NEMA units 33.3 kg (73.41 lb)

Depth: 54 cm (21.25 in)

Note: Weights do not include mounting rails. Allow 2.3-4.5 kg (5-10 lb) for a rail set. The weights
listed in this table do not describe enclosures with solid state disk drives with Flash memory
(called Flash or SSD drives). These Flash drive modules weigh 20.8 ounces (1.3 lb) each.

DPE or DAE disk drive type


Serial Attached SCSI (SAS) and Flash (solid state disk drives with flash memory, or SSD )
disk drives are 12-volt, and support the SAS interface. Firmware and drive carriers are
unique to EMC. The VNX Series Disk and FLARE OE Matrix on EMC Online Support lists the
supported drives.

Dimensions and weight 3


Optical cabling to a switch or server
Optical cables connect the small form-factor pluggable (SFP) modules on the storage
processors (SPs) to an external Fibre Channel or 10 Gb Ethernet environment. EMC
strongly recommends the use of OM3 50 μm cables for all optical connections.

Table 3 Optical cables

Cable type Operating Length


speed
50 μm 1.0625 Gb 2 m (6.6 ft) minimum to 500 m (1,650 ft) maximum

2.125 Gb 2 m (6.6 ft) minimum to 300 m (990 ft) maximum

4 Gb 2 m (6.6 ft) minimum to 150 m (492 ft) maximum

OM3: 1 m (3.3 ft) minimum to 150 m (492 ft) maximum


8 Gb
OM2: 1 m (3.3 ft) minimum to 50 m (165 ft) maximum

OM3: 1 m (3.3 ft) minimum to 300 m (990 ft ) maximum


10 Gb
OM2: 1 m (3.3 ft) minimum to 82 m (270 ft) maximum

62.5 μm 1.0625 Gb 2 m (6.6 ft) minimum to 300 m (985 ft) maximum

2.125 Gb 2 m (6.6 ft) minimum to 150 m (492 ft) maximum

4 Gb 2 m (6.6 ft) minimum to 70 m (231 ft) maximum

Note: All cables are multi-mode, dual LC with a bend radius of 3 cm (1.2 in) minimum.

The maximum length listed in the table above for the 50 μm or 62.5 μm optical cables
includes two connections or splices between the source and the destination.

NOTICE

EMC does not recommend mixing 62.5 μm and 50 μm optical cables in the same link. In
certain situations you can add a 50 μm adapter cable to the end of an already installed
62.5 μm cable plant. Contact your service representative for details.

Twinaxial cabling for 10 Gigabit Ethernet environments


Active twinaxial copper cables include small form factor pluggable (SFP) modules at
either end. They connect Fibre Channel over Ethernet (FCoE) modules to FCoE switches, or
10 GbE / iSCSI modules to an external iSCSI environment.
The twinaxial cables are shielded, quad-construction style, 100Ω differential; the SFP
connectors comply with SFF-8431 and SFF-8472 standards. Transmit and receive ends
include active components to facilitate 10 GbE transmission. EMC offers various lengths
from 1 meter to 15 meters; wire gauges range from 24 to 30 with cable length.

Network cabling
Storage systems with 1 GbE iSCSI data ports use standard Ethernet LAN cables from the
LAN (iSCSI data) ports (RJ45 connectors) on each SPData Mover to the external network
environment. For distances up to 100 meters, Category 5E cables are the commonly used
gigabit Ethernet standard; the system also supports CAT 5 and CAT 6 cables. EMC
recommends CAT 6 LAN cables whenever possible.

4 EMC Block VNX5300


Technical Specifications and Operating Limits

SP-to-DAE copper cabling


The expansion port interface to and between DAEs is copper cabling. The 100 Ω cables
are keyed at either end, and available in 1- 10-meter lengths. Keys are defined in the
T10–SAS 2.1 specification.
Cabling options are dependent on configuration and available SLICs. Options may
include one or both of the following:
l Mini-SAS to mini-SAS.
l Mini-SAS HD to mini-SAS.

SP-to-SPS interface cabling


The SP-to-SPS interface meets the following specifications:

Parameter Value or description


Interface Serial RS-232

Baud rate 9600 baud, 8 bit

Parity None

Connection Shielded mini DB-9 to RJ-45

SP-to-DAE copper cabling 5


SPS technical specifications
SPS technical specifications include power requirements and size.

Table 4 1U SPS power specifications

Parameter Value
AC line voltage 100 to 240 V AC ± 10%, single-phase, 47 to 63 Hz

AC line current, internal and 0.10 A max at 100 V AC, internal power consumption (up to 10 A
pass-through max at 100 V AC, pass-through to AC outlets)

0.05 A max at 200 V AC, internal power consumption (up to 6 A


max at 200 V AC, pass-through to AC outlets)

Internal power consumption 70 VA (40W) pk in hi-charge mode, 10 VA (6 W) in float charge


mode

Power factor N/A for pass-through load; internal 10 VA load is 0.60 power
factor

Heat dissipation 21.6 x 103 J/hr, (20 Btu/hr) steady state

In-rush current 9 A max for ½ line cycle, per SPS at 240 V AC

AC protection 15 A fuse, both phases

AC inlet type IEC320-C14 appliance coupler with switch

AC outlet type IEC320-C13 appliance coupler, quantity two

Charge times 190 minutes max

AC failure detect time 10 ms max

Transfer time 25 ms max

Table 5 1U SPS hardware dimensions and weights

Dimensions Vertical size Weight (see note)


Height: 4.02 cm (1.58 in)

Mounting tray width: 42.1 cm (16.5 in) 1 NEMA unit 10.8 kg (23.5 lb)

Depth: 60.33 cm (23.75 in)

Note: Weights do not include mounting rails. Allow 2.3-4.5 kg (5-10 lb) for a rail set.

6 EMC Block VNX5300


Technical Specifications and Operating Limits

System operating limits


The ambient temperature specification is measured at the front bezel inlet. The site must
have air conditioning of the correct size and placement to maintain the specified ambient
temperature range and offset the heat dissipation listed below.

Table 6 System operating limits

Requirement Description
Ambient temperature 10°C to 40°C (50°F to 104°F)

Temperature gradient 10°C/hr (18°F/hr)

Relative humidity (extremes) 20% to 80% noncondensing

Relative humidity (recommended) 40% to 55% noncondensing

Elevation -16 to 3,048 m (-50 to 10,000 ft)

Note

The allowable relative humidity level is 20 to 80% noncondensing. However, the recommended
operating environment range is 40 to 55%. To minimize the risk of hardware corrosion and
degradation, we recommend lower temperatures and humidity for data centers with gaseous
contamination such as high sulfur content. In general, the humidity fluctuations within the data
center should be minimized. We also recommend that the data center be positively pressured
and have air curtains on entry ways to prevent outside air contaminants and humidity from
entering the facility. For facilities below 40% relative humidity, we recommend grounding straps
when contacting the equipment to avoid the risk of Electrostatic discharge (ESD), which can harm
electronic equipment.

NOTICE

For systems mounted in a cabinet, the operating limits listed above must not be
exceeded inside the closed cabinet. Equipment mounted directly above or below an
enclosure must not restrict the front-to-rear airflow of the storage system. Cabinet doors
must not impede the front-to-rear airflow. The cabinet must exhaust air at a rate that is
equal to or greater than the sum of the exhaust rates of all the equipment mounted in the
cabinet.

Environmental recovery
If the system exceeds the maximum ambient temperature by approximately 10°C (18°F),
the SPs begin an orderly shutdown that saves cached data, and then shut themselves
down. Link control cards (LCCs) in each DAE power down their disks but remain powered
on. If the system detects that the temperature has dropped to an acceptable level, it
restores power to the SPs and the LCCs restore power to their disk drives.

Air quality requirements


EMC products are designed to be consistent with the requirements of the American
Society of Heating, Refrigeration and Air Conditioning Engineers (ASHRAE) Environmental

System operating limits 7


Standard Handbook and the most current revision of Thermal Guidelines for Data
Processing Environments, Second Edition, ASHRAE 2009b.
EMC cabinets are best suited for Class 1 datacom environments, which consist of tightly
controlled environmental parameters, including temperature, dew point, relative
humidity and air quality. These facilities house mission-critical equipment and are
typically fault-tolerant, including the air conditioners.
The data center should maintain a cleanliness level as identified in ISO 14664-1, class 8
for particulate dust and pollution control. The air entering the data center should be
filtered with a MERV 11 filter or better. The air within the data center should be
continuously filtered with a MERV 8 or better filtration system. In addition, efforts should
be maintained to prevent conductive particles, such as zinc whiskers, from entering the
facility.
The allowable relative humidity level is 20 to 80% non condensing, however, the
recommended operating environment range is 40 to 55%. For data centers with gaseous
contamination, such as high sulfur content, lower temperatures and humidity are
recommended to minimize the risk of hardware corrosion and degradation. In general,
the humidity fluctuations within the data center should be minimized. It is also
recommended that the data center be positively pressured and have air curtains on entry
ways to prevent outside air contaminants and humidity from entering the facility.
For facilities below 40% relative humidity, it is recommended to use grounding straps
when contacting the equipment to avoid the risk of Electrostatic discharge (ESD), which
can harm electronic equipment.
As part of an ongoing monitoring process for the corrosiveness of the environment, it is
recommended to place copper and silver coupons (per ISA 71.04-1985, Section 6.1
Reactivity), in airstreams representative of those in the data center. The monthly
reactivity rate of the coupons should be less than 300 Angstroms. When monitored
reactivity rate is exceeded, the coupon should be analyzed for material species and a
corrective mitigation process put in place.
Storage time (unpowered) recommendation: do not exceed 6 consecutive months of
unpowered storage.

Fire suppressant disclaimer


Always install fire prevention equipment in the computer room as an added safety
measure. A fire suppression system is the responsibility of the customer. When selecting
appropriate fire suppression equipment and agents for their data center, choose
carefully. Your insurance underwriter, local fire marshal, and local building inspector are
all parties that you should consult during the selection a fire suppression system that
provides the correct level of coverage and protection.
EMC designs and manufactures equipment to internal and external standards that
require certain environments for reliable operation. EMC does not make compatibility
claims of any kind nor does EMC provide recommendations on fire suppression systems.
EMC does recommend that you do not position storage equipment directly in the path of
high pressure gas discharge streams or loud fire sirens so as to minimize the forces and
vibration adverse to system integrity.

Note

The previous information is provided on an “as is” basis and provides no


representations, warranties, guarantees or obligations on the part of EMC Corporation.
This information does not modify the scope of any warranty set forth in the terms and
conditions of the basic purchasing agreement between the customer and EMC
Corporation.

8 EMC Block VNX5300


Technical Specifications and Operating Limits

Shock and Vibration


EMC products have been tested to withstand the shock and random vibration levels. The
levels apply to all three axes and should be measured with an accelerometer on the
equipment enclosures within the cabinet and shall not exceed:

Platform condition Response measurement level


Non operational shock 10 G’s, 7 ms duration

Operational shock 3 G’s, 11 ms duration

Non operational random vibration .40 Grms, 5-500 Hz, 30 minutes

Operational random vibration .21 Grms, 5-500 Hz, 10 minutes

Systems mounted on an approved EMC package have completed transportation testing to


withstand the following shock and vibrations in the vertical direction only and shall not
exceed:

Packaged system condition Response measurement level


Transportation shock 10 G’s, 12ms duration

Transportation random vibration 1.15 Grms, 1 hour


Frequency range 1-200 Hz

Shipping and storage requirements


NOTICE

Systems and components must not experience changes in temperature and humidity that
are likely to cause condensation to form on or in that system or component. Do not
exceed the shipping and storage temperature gradient of 45°F/hr (25°C/hr).

Table 7 Shipping and storage requirements

Requirement Description
Ambient temperature -40° F to 149°F (-40°C to 65°C)

Temperature gradient 45°F/hr (25°C/hr)

Relative humidity 10% to 90% noncondensing

Elevation -50 to 35,000 ft (-16 to 10,600 m)

Storage time (unpowered) Recommendation Do not exceed 6 consecutive months of


unpowered storage.

Shock and Vibration 9


Copyright © 2012-2015 EMC Corporation. All rights reserved. Published in USA.

EMC believes the information in this publication is accurate as of its publication date. The information is subject to change without
notice.

The information in this publication is provided as is. EMC Corporation makes no representations or warranties of any kind with
respect to the information in this publication, and specifically disclaims implied warranties of merchantability or fitness for a
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All other trademarks used herein are the property of their respective owners.

For the most up-to-date regulatory document for your product line, go to EMC Online Support (https://support.emc.com).

10 EMC Block VNX5300

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