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Douglas DeVoto
National Renewable Energy Laboratory
Douglas.DeVoto@nrel.gov
303.275.4256
Device
Encapsulant
Interconnect
Die Attach
Substrate
Attach Metalized Substrate
Base Plate
35%
Sintered Silver
30%
Sn63Pb37 Solder 1,500 Cycles
25%
Delamination
20%
15%
10%
5%
0%
0 500 1,000 1,500 2,000 2,500
Number of Cycles 2,500 Cycles
10
(mm/cycle)
-10
-0.40 -0.35 -0.30 -0.25
XZ-Inelastic shear strain K0 KC
KII, Stress Intensity Factor
V= da/dN, crack growth rate (mm/cycle)
K = stress intensity factor
DOE APEEM FY15 Kickoff Meeting 5
FY14 Accomplishments
• Identified threshold at which stress intensity factor is
sufficient to cause delamination initiation
o Measured delamination rate of FY13 sintered-silver samples
o Modeled stress intensity factor with finite element analysis (FEA)
V-K Curve
V= da/dN, Crack Growth Rate
(mm/cycle)
K0 KC
35% 7
2 1
25% 5
Delamination
20% 4
Quadrant 1
3 4
15% 3 Quadrant 2
3 Quadrant 3
10% 2
5% 1 2 Quadrant 4
1
0% 0
0 1,000 2,000 3,000 0 1,000 2,000
Number of Cycles Number of Cycles
Invar Copper
Oct Nov Dec Jan Feb Mar Apr May Jun Jul Aug Sep
Go/
No-Go
200
100 CTE 1
0 CTE 2
-100
0 10 20 30
Time (min)
Proposed Sample
Evaluate low- and no-pressure Optimize pad geometries for a Recommend industry standard
sintered-silver materials large-area bond pad practices for plating
10
5
0
Poor Ag Plating