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• Nonlocal spin valve (adapted from Johnson and Silsbee's IV. APPLICATIONS
work with metals)
A. Spin Transistor
• Ballistic spin filtering
The basic idea of spin transistor, as proposed by Suprio Datt
Because external magnetic fields (and stray fields from and Biswajit Das, is to control the spin the spin orientation by
magnetic contacts) can cause large Hall effects and applying a gate voltage, as shown in fig.3. A spin –FET, as
magnetoresistance in semiconductors (which mimic spin- depicted below, consists of ferromagnetic electrodes and
valve effects), the only conclusive evidence of spin transport semiconductor channels that contain a layer of electrons and a
in semiconductors is demonstration of spin precession and de- gate electrode attached to the semiconductor. The source and
phasing in a magnetic field non-collinear to the injected spin drain electrodes are ferromagnetic (FM) metals. The spin-
orientation, called the Hanle effect polarised electrons are injected from the FM source electrode
(FMs), and after entering the semiconductor channels they
begin to rotate. The rotation can be controlled by an applied
III. MATERIAL SELECTION FOR SPINTRONICS electric field through the gate electrode. If the spin orientation
of the electron channels is aligned to FM drain (FMd)
There are two major criteria for selecting the most electrode, electrons are able to flow into the FM drain
promising materials for semiconductor spintronics. First, the electrode. However, if the spin orientation is flipped in the
ferromagnetism should be retained to practical temperatures electron layer electrons cannot enter the drain electrode. In
(i.e. >300 K). Second, it would be a major advantage if there this way, with the gate electrode the orientation of the electron
were already an existing technology base for the material in spin can be controlled.
other applications. Most of the work in the past has focused on
(Ga, Mn)As and (In, Mn)As. There are indeed major markets
for their host materials in infra-red light-emitting diodes and B. Spin (Magnetic) BJT
lasers and high speed digital electronics (GaAs) and magnetic In a magnetic transistor, magnetised ferromagnetic layers
sensors (InAs). In samples carefully grown single phase by replace the role of n and p type semiconductors. Much like in
molecular beam epitaxy (MBE), the highest Curie a spin-valve, substantial current can flow through parallel
temperatures reported are 110 K for (Ga, Mn)As and 35 K for magnetised ferromagnetic layers. However if say, in a three
(In, Mn)As. For ternary alloys such as (In0.5Ga0.5)0.93Mn layer structure, the middle layer is antiparallel to the two side
0.07As, the Curie temperature is also as low as 110 K. layers; the current flow would be quite restricted, resulting in a
high overall resistance. If two outside layers are pinned and
A tremendous amount of research on these materials the middle layer allowed to be switched by an external
systems has led to some surprising results, such as the very magnetic field, a magnetic transistor could be made, with on
long spin lifetimes and coherence times in GaAs and the and off configurations depending on the orientation of the
ability to achieve spin transfer through a hetero-interface, middle magnetised layer. Magnetic (spin) transistors are good
either of semiconductor–semiconductor or metal- candidates for logic (spin logic).
semiconductor. One of the most effective methods for
investigating spin-polarised transport is by monitoring the
C. Spin Valve with Giant Magneto Resistance
polarised electroluminescence output from a quantum well
light-emitting diode into which the spin current is injected. Spintronic device that currently has wide commercial
Quantum selection rules relating the initial carrier spin application is the spin valve. Most modern hard disk drives
polarisation and the subsequent polarised optical output can employ spin- valves to read each magnetic bit connected on
provide a quantitative measure of the injection efficiency. the spinning platters inside A spin-valve is essentially a spin
“switch” that can be turned on and off by external magnetic
There are a number of essential requirements for achieving fields. Basically it is composed of two ferromagnetic layers
practical spintronic devices in addition to the efficient separated by a very thin non-ferromagnetic layer. When these
electrical injection of spin-polarised carriers. These include the two layers are parallel, electrons can pass through both easily,
ability to transport the carriers with high transmission and when they are anti-parallel, few electrons will penetrate
efficiency within the host semiconductor or conducting oxide, both layers. The principles governing spin-valve operation are
the ability to detect or collect the spin-polarised carriers and to purely quantum mechanical.
be able to control the transport through external means such as
biasing of a gate contact on a transistor structure. The D. Spin LEDs
observation of spin current induced switching in magnetic
Recently, efficient spin injection has been successfully
hetero-structures is an important step in realising practical
demonstrated in all semiconductor tunnel diode structures by
devices. Similarly, spin orbit interaction in a semiconductor
using a spin- polarised DMS as the injector in one case, and
quantum well could be controlled by applying a gate voltage.
using a paramagnetic semiconductor under high magnetic field
Combined with the expected low power capability of
as a spin filter in the other. In such a case, spin-polarised holes
spintronic devices, this should lead to extremely high packing
and unpolarised electronics are injected from either side and
densities for memory elements.
recombine in a quantum well. The polarisation of the injected
holes can be left-circularly polarises light in the
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electroluminescence spectra. Among such devices the simplest but by magnetic storage elements.
seems to be the concept of a light emitting diode (LED) with
one of the contact layers made ferromagnetic by incorporation The elements are formed from two ferromagnetic plates,
of transition metal impurities, a so called spin LED. each of which can hold a magnetic field, separated by a thin
insulating layer. One of the two plates is a permanent magnet
set to a particular polarity; the other's field will change to
E. Magnetic Random Access Memory [MRAM]
match that of an external field. A memory device is built from
You hit the power button on your television and it instantly a grid of such "cells". Reading is accomplished by measuring
comes to life. But do the same thing with your computer and the electrical resistance of the cell. A particular cell is
you have to wait a few minutes while it goes through its boot (typically) selected by powering an associated transistor which
up sequence. Why can't we have a computer that turns on as switches current from a supply line through the cell to ground.
instantly as a television or radio? IBM, in cooperation with Due to the magnetic tunnel effect, the electrical resistance of
Everspin, has launched a Solid State Drive adopting a new the cell changes due to the orientation of the fields in the two
architecture with magnetoresistive RAM (MRAM) write plates. By measuring the resulting current, the resistance
caches instead of capacitor-backed DRAM, that will inside any particular cell can be determined, and from this the
potentially eliminate the boot-up process. Magnetic random polarity of the writable plate. Typically if the two plates have
access memory (MRAM) has the potential to store more data, the same polarity this is considered to mean "0", while if the
access that data faster and use less power than current memory two plates are of opposite polarity the resistance will be higher
technologies. The key to MRAM is that, as its name suggests, and this means "1". On comparison with existing memory
it uses magnetism rather than electrical power to store data. technologies, MRAM is faster than SRAM, have a higher
This is a major leap from dynamic RAM (DRAM), the most storage density than DRAM, the power requirement is less
common type of memory in use today, which requires a than that of DRAM and it is faster than FLASH. MRAM is the
continuous supply of electricity and is terribly inefficient. Memory of the future. If the researches turn up, it will replace
Twenty-five years ago, DRAM overtook ferrite core memory both Volatile and Non Volatile Primary memories.
in the race to rule the PC memory market. Now it looks like
ferromagnetic technology could be making a comeback, with MRAM (Magnetoresistive Random Access Memory) uses
IBM Corp. and Infineon Technologies charging a joint team of electron spin to store data. Memory cells are integrated on an
80 engineers and scientists with the task of making magnetic integrated circuit chip, and the function of the resulting device
RAM (MRAM). is like a semiconductor static RAM (SRAM) chip, with
potentially higher density and the added feature that the data
All modern hard disks are equipped with two different are nonvolatile, that is data are retained with power off.
heads, one for writing and the other for reading. The principle Typical “classic” or “conventional” MRAM uses spin-
of the writing head is quite simple, i.e., generation of a dependent tunnel junction memory cells and magnetic row and
magnetic field as electricity passes through the head. The head column write lines as illustrated.
focuses this magnetic field generated to the area on the disk
surface where the bit is to be written. Conceptually the The spin-dependent tunnel junction produces a large change
technique for reading is the reverse of that of writing, i.e., in resistance depending on the predominant electron spin in a
using electromagnetic induction and it was the technique used storage layer. The tunnel barrier is as thin as a few atomic
in earlier hard disks. But as the storage density increased, it layers--so thin that electrons can “tunnel” through the
became very difficult to read a bit from the disk surface as normally insulating material, causing a resistance change.
there was the interference of magnetic fields from the Row and column magnetic write lines allow data to be written
neighbouring bits. to a selected cell in a two-dimensional array:
A small electrical current is kept flowing through the Data are written by small electrical currents in the write
reading head. When a bit passes 21 under the head, due to the lines that create a magnetic fields, which flip electron spins in
presence of the magnetic field associated with the bit, the the spin-dependent tunnel junction storage layer, thus
electrical resistance of head changes which alters the current changing the junction’s resistance. Data is read by the
flowing through it. This change in the current flow is so tunnelling current or resistance through the tunnel junction.
significant that it can be easily detected. Next generation MRAM could reduce cell size and power
consumption. Potential next-generation designs include
Magnetoresistive Random Access Memory (MRAM) is a SpinMomentum Transfer, Magneto-Thermal MRAM, and
non-volatile computer memory (NVRAM) technology, which Vertical Transport MRAM. Spin-Momentum Transfer (also
has been under development since the 1990s. Continued “Spin-Transfer,” “Spin Injection,” or “Spin Torque Transfer”)
increases in density of existing memory technologies -- MRAM is based on changing the spin of storage electrons
notably Flash RAM and DRAM -- kept MRAM in a niche role directly with an electrical current rather than an induced
in the market, but its proponents believe that the advantages magnetic field. This method has the potential to significantly
are so overwhelming that MRAM will eventually become reduce MRAM write currents, especially with lithographic
dominant. Unlike conventional RAM chip technologies, in feature sizes less than 100 nanometers. M-T MRAM uses a
MRAM data is not stored as electric charge or current flows, combination of magnetic fields and ultra-fast heating from
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electrical current pulses to reduce the energy required to write 6. W. H. Butler, X.-G. Zhang, T. C. Schulthess and J. M. MacLaren, Phys.
Rev. B 63, 054416 (2001): J. Mathon and A. Umersky, Phys. Rev. B 63,
data 220403R ,2001.
7. S. Yuasa, A. Fukushima, T. Nagahama, K. Ando and Y. Suzuki, Jpn. J.
V. CONCLUSION Appl. Phys. 43, L588 (2004): S. S. Parkin, C. Kaiser, A. Panchula, P. M.
Rice, B. Hughes, M. Samant and S.-H. Yang, Nat. Mater.3, 862 ,2004
To continue the rapid pace of discoveries, considerable 8. H. Kimura, M. Ibuki, and T. Hanyu,, “Int. Tech. Conf. on Circuits/
advances in our basic understanding of spin interactions in the Systems, Computers and Communications”, Paper No. 8C3L3-1/8C3L-3
solid state along with developments in materials science, ,Matsushima, Japan, July 5-8, 2004.
9. J. M. Kikkawa and D. D. Awschalom, Phys. Rev. Lett. 80, 4313 ,1998.
lithography, miniaturisation of optoelectronic elements, and 10. M. E. Flatte and G. Vignale, Appl. Phys. Lett. 78, 1273 ,2001.
device fabrication are necessary. The progress toward 11. Igor Zutig, J. Fabian, and S. Das Sarma, Phys. Rev. Lett. 88, 066603 ,
understanding and implementing the spin degree of freedom in 2002.
12. H. Ohno, Science 281, 951 (1998): A. H. MacDonald, P. Schiffer and N.
metallic multilayers and, more recently, in semiconductors is Samarth, Nat. Mater. 4, 195 ,2005.
gaining momentum as more researchers begin to address the 13. M. Yamanouchi, D.Chiba, F.Matsukura, and H.Ohno, Nature 428, 539 ,
relevant challenges from markedly different viewpoints. This 2004.
paper presents a summary of Spintronics (spin based 14. M. Yamanouchi, D.Chiba, F.Matsukura, T.Dietl and H.Ohno, to appear
in Phys. Rev. Lett. 2006.
electronics), which is a new upcoming technology for the next 15. H. Munekata, H. Ohno, S. von Molnar, A. Segmuller, L.L. Chang, L.
generation of microelectronic/nano-electronic devices with Esaki, Phys. Rev. Lett. 63 ,1989.
scaling apparently approaching its fundamental limits. 16. H.J. Zhu, M. Ramsteiner, H. Kostial, M. Wassermeier, H.P. Schononherr,
K.H. Ploog, Phys. Rev. Lett. 87 ,2001.
17. M. Kohda, Y. Ohno, K. Takamura, F. Matsukura, H. Ohno, Jpn. J. Appl.
ACKNOWLEDGEMENT Phys. 40 2001.
18. M. Ziese and M. J. Thornton (eds.), “Spin Electronics”, SpringerVerlag,
The authors would like to acknowledge the support of Berlin, 2001.
Indian Institute of Technology Bombay and all those who have 19. Stuart S.P. Parkin “Spintronic Materials and Devices: Past, present and
contributed directly or indirectly are thanked. future!” IEEE, 2004.
20. Semion Saikin, Min Shen and Ming-C Cheng,” Study of SpinPolarized
Transport Properties for Spin-FET Design Optimization”,IEEE,vol.3, no.
REFERENCES 1 March 2004.
1. S. Von Molnar, et al., ‘‘World Technology (WTEC) Study on Spin 21. Simon Kos. Marina Hruska, Scott A. crooker, Avadh Saxena and Darryl
Electronics: Highlights of Recent US Research and Development L. smith, “Modeling Spin- Polarized Electron Transport in
Activities’’, 2001, http://www.wtec.org/spin_US_summary.pdf Semiconductors for Spintronics applications”IEEE,2007
2. [S. A.Wolf and D. Treger, “Spintronics: A new paradigm for electronics 22. Michael E. Flatté “Spintronics “IEEE TRANSACTIONS ON
for the new millennium “ , IEEE Trans. Magnet., 36:2748–2751, 2000. ELECTRON DEVICES, VOL. 54, NO. 5, MAY 2007
3. Walser, M ; Reichl C ; Wegsheider and Salis, “Direct Mapping of the 23. Hideo Ohno, “Spintronics - From Materials through Devices to Circuits”
formulation of a persistent Spin Helix” , 2012. IEEE, 2006.
4. Junji Haruyama, “Graphene and Graphene Nanomesh Spintronics”, 4 24. Sang Ho Lim, “Spintronic Materials & Devices” IEEE, 2006
December 2013 www.mdpi.com/journal/electronics 25. S. H. Vosko, L. Wilk, and M. Nusair, “Accurate spin-dependent electron
5. T. Miyazaki and N. Tezuka, J. Magn. Magn. Mater. 139, L231 (1995): J. liquid correlation energies for local spin density calculations: A critical
S. Moodera, L. R. Kinder, T. M. Wong, and R. Meservey, Phys. Rev. analysis,” Can. J. Phys., vol. 58, pp. 1200–1211, 1980.
Lett. 74 , 3273 ,1995.