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M705-GRN360-KV Series
Lead-free Solder Paste
Senju ECO Solder Paste M705-GRN360-KV series has been development as
a result of many years experience working with customers using Lead-free
soldering in production. It features improved thermal properties required
for high-density applications with BGA’s and CSP’s devices.
Other benefits include;
• Very stable solder paste viscosity over a longer period
• Clear flux residues combined with excellent joint cosmetics
• Excellent wettability
• Reduced flux residue cracking and occurrence of side balling.
Reflow ability
The residue of M705-GRN360 series solder paste after reflow has a clear
colour showing no cracking or peeling of the flux residue.
Storage Stability
Long-term stability of the solder paste is a key factor for a stable
production, especially for irregular or low volume production requirements.
The shelf life of the solder paste is 6 months when kept unopened in a
refrigerated storage (0 - 10°C) But the below graph shows the solder paste
is very stable when kept at ambient temperature between 20 – 25C for up to
35days.
300
Kept Refrigerated 0 - 10C
Viscosity (10rpm/Malcom?
200
150
100
0 5 10 15 20 25 30 35 40
Storage time (days)
Solder Profile
TEMP (C)
Reflow zone
Slope 2-3C/sec
250
C
220
D
200
Soak zone
B
A
150
Slope 2 - 4 C/sec
100
Local Contact
Senju Manufacturing (Europe) Ltd