03

Correct Use of Tantalum Chip Capacitors

Be sure to read this before using NEC TOKIN Tantalum Capacitors.

[Notes]
● Be sure to read "Notes on Using The Solid Tantalum Capacitor" (p25 - p33) and "Cautions" (p35)
before commencing circuit design or using the capacitor.
● Confirm the usage conditions and rated performance of the capacitor before use.
● Ninety percent of the failure that occurs in this capacitor is caused by an increase in leakage
current or short-circuiting. It is therefore important to make sufficient allowances for redundant
wiring in the circuit design.

[Quality Grades]
NEC TOKIN devices are classified into the following quality grades in accordance with their application
(for details of the applications, see p35). The quality grade of all devices in this document is "standard";
the devices in this document cannot be used for "special" or "specific" quality grade applications.
Customers who intend to use a product or products in this document for applications other than those
specified under the "standard" quality grade must contact an NEC TOKIN sales representative in advance
(see the reverse side of the cover for contact details).

● Standard: This quality grade is intended for applications in which failure or malfunction of the
device is highly unlikely to cause harm to persons or damage to property, or be the source of any
negative effects or problems in the wider community.
● Special: This quality grade is intended for special applications that have common requirements,
such specific industrial fields. Devices with a "special" quality grade are designed, manufactured,
and tested using a more stringent quality assurance program than that used for "standard" grade
devices. There is a high possibility that failure or malfunction of the device when being used for
applications in this category will cause harm to persons or damage to property, or create negative
effects or problems in the wider community.
● Specific: Devices with a "specific" quality grade are designed, manufactured, and tested using a
quality assurance program that is designated by the customer or that is created in accordance
with the customer's specifications. There is an extremely high possibility that failure or malfunction
of the device when being used for applications in this category will cause harm to persons or
damage to property, or create serious problems in the wider community. Customers who use
NEC TOKIN's products for these "specific" applications must conclude an individual quality
agreement and/or development agreement with NEC TOKIN. A quality assurance program
designated by the customer must also be determined in advance.
NEC TOKIN offers the latest technology
<Tantalum Capacitors> <Conductive Polymer Tantalum Capacitors>
“NeoCapacitors”

NEC has been manufacturing solid electrolyte
tantalum capacitors for more than 30 years. As
a result of NEC’s active research and develop-
ment programs, NEC capacitors offer the de-
signer the latest technology plus outstanding
performance. NEC capacitors are used exten-
sively in industrial, commercial, entertainment,
and medical electronic equipment.
NEC has obtained ISO 9001 and QS9000 certifi-
cates of registration for capacitors.
NEC, in response to the wave of the worldwide
environment protection consciousness, devel-
oped E/SV series by eliminating lead from the
terminals.
The low-ESR conductive polymer tantalum ca-
pacitors are expected to meet an important
market need; they are suited for DC/DC convert-
ers, video cameras, personal handy phones,
etc.
The business of manufacturing and sale of ca-
pacitors was divided and transfered to Tokin, as
of April 1, 2002. Then Tokin changed its corpo-
rate name to “NEC TOKIN Corporation,” which
has charge of electronic components business
within the NEC Group.

TABLE OF CONTENTS

Tantalum Capacitors ................................................................................................................. 4

E/SV Series Tantalum Chip Capacitors (Lead-free Type) .............................................. 5
SV/Z Series Tantalum Chip Capacitors (Low-ESR Type) ............................................. 12

Conductive Polymer Tantalum Capacitors (NeoCapacitors)

PS/L Series NeoCapacitors ........................................................................................... 17
Tape and Reel Specifications ........................................................................................ 23

Notes on Using the Solid Tantalum Capacitors ............................................................ 25

Notes on Using the Chip Tantalum Capacitors, excluding NeoCapacitors ................. 28
Notes on Using NeoCapacitors ..................................................................................... 31

3
TANTALUM CAPACITORS
Description
NEC TOKIN’s tantulum capacitors offer the designer ad-
vanced technological design and excellent performance
c h a r a c t e r i s t i c s fo r f i l t e r i n g , by p a s s i n g , c o u p l i n g ,
decoupling, blocking, and R C timing circuits. They are
used extensively in industrial, commercial, enter tain-
ment, and medical electronic equipment.
The tantalum capacitor is inherently very reliable and
there is significant evidence that this reliability improves
with age−perhaps indefinitely. Capacitance loss with age
and other problems often associated with liquid electro-
lytes are nonexistent in solid electrolyte tantalums.
A process used to fur ther improve the reliability of
tantalums is to burn them in at elevated voltages at 85°C
for extended periods of time, thus eliminating high leak-
age and other undesirable characteristics. This process
is done because solid electrolyte tantalum capacitors do
not conform to the exponential distribution of time or-
dered failures, but instead exhibit a constantly decreas-
ing failure rate.
If you specify NEC TOKIN tantalums, you can feel confi-
dent that you are getting the best available quality, reli-
ability, and price.

TANTALUM CHIP CAPACITORS

Conventional Type (Manganese Dioxide Type)

Operating DC Rated Capacitance DC Leakage

Series Temperature Voltage Capacitance Tolerance Current Tangent of Features
Range (˚C) Range (V) Range ( µ F) (%) (µ A) Loss Angle

2.5 Vdc to 10 Vdc(2) Lead-free

0.01 CV(1) or 0.5
: 0.08 to 0.24
E/SV −55 to +125 2.5 to 35 0.47 to 680 ±20 whichever is
greater 16 Vdc to 35 Vdc
: 0.06, 0.10
( Standard
Miniaturized )
Ultra miniaturized
0.01 CV(1) or 0.5
SV/Z −55 to +125 4 to 10 10 to 330 ±20 whichever is 0.08 to 0.14 (3 )
Low ESR
greater

NeoCapacitor (Conductive Polymer Type)

0.1 CV (1) or 3,
PS/L −55 to +105 4 to 10 2.2 to 470 ±20 whichever is 0.09 to 0.50 (4 )
Ultra-low ESR
greater

Notes 1. Product of capacitance in µF and voltage in V.

2. Refer to Standard Ratings on page 9, 10, 11
3. Refer to Standard Ratings on page 16
4. Refer to Standard Ratings on pages 21, 22

4
 TANTALUM CAPACITORS

E/SV Series Tantalum Chip Capacitors

■ FEATURES
● Lead-freeType.
● Offer
a range of small, high-capacity models.
● Succeed to the latest technology plus outstaning peformance.

■ DIMENSIONS [mm]

L W1
[J, P, A2, A cases]
H
Z Z

W2

L W1
[B3, B2 cases]
H

Z Z

W2 W2

B2 case B3 case

L W1 Y W1
[C2, C, V, D cases]
H

Z Z C, D cases C2, V cases

W2

(Unit: mm)
Case
EIA code L W1 W2 H Z Y
Code
J – 1.6 ± 0.1 0.8 ± 0.1 0.6 ± 0.1 0.8 ± 0.1 0.3 ± 0.15 –
P 2012 2.0 ± 0.2 1.25 ± 0.2 0.9 ± 0.1 1.1 ± 0.1 0.5 ± 0.1 –
A2 (U) 3216L 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.1 ± 0.1 0.8 ± 0.2 –
A 3216 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.6 ± 0.2 0.8 ± 0.2 –
B3 (W) 3528L 3.5 ± 0.2 2.8 ± 0.2 2.2 ± 0.1 1.1 ± 0.1 0.8 ± 0.2 –
B2 (S) 3528 3.5 ± 0.2 2.8 ± 0.2 2.2 ± 0.1 1.9 ± 0.2 0.8 ± 0.2 –
C2 – 6.0 ± 0.2 3.2 ± 0.2 2.2 ± 0.1 1.4 ± 0.1 1.3 ± 0.2 –
C 6032 6.0 ± 0.2 3.2 ± 0.2 2.2 ± 0.1 2.5 ± 0.2 1.3 ± 0.2 0.4 C
V – 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 1.9 ± 0.1 1.3 ± 0.2 –
D 7343 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 2.8 ± 0.2 1.3 ± 0.2 0.5 C

5
■ STANDARD C-V VALUE REFERENCE BY CASE CODE
UR
2.5 V 4V 6.3 V 10 V 16 V 20 V 25 V 35 V
µF
0.47 P A2 A A
0.68 P A2 A A
1.0 P J, P A2 A2, A A2, A
1.5 P J, P A A2 A
2.2 J J, P A2, A A2, A A B2
3.3 P J P, A2 A2, A A, B3 A B2
4.7 J, P, A P, A2, A A2, A A, B3, B2 B2 C
6.8 J J, P, A2 A A, B3 B2 C
10 J J, P J, P, A2, A A2, A, B2 A, B3, B2 B2 C D
15 P A2, A B3 B2 C D
22 P, A2 P, A2, A A2, A, B3, B2 A, B3, B2 B2, C C2, C, D D
33 P A2, A A, B3 B2 C2, C D
47 P, A2, A A, B3 A, B3, B2, C B2, C2, C C, D D
68 A B3 B2 C D
100 B3, B2 A, B3, B2 B2, C2, C C, D D
150 B2 B2 C D
220 B2 B2, C C, D, V D
330 C C, V D
470 C, D D D
680 D

■ PART NUMBER SYSTEM

[Bulk] [Tape and Reel]
ESV P 0J 106 M TE ESVP0J106M 8 R

Capacitance tolerance Packing Orientation

M : ±20% R : Cathode on the Side
K : ±10% of Sproket Hole

Capacitance (pF) Tape width

First two digits represent significant figures. 8 : 8 mm (J, P, A2, A, B3, B2 case)
Third digit specifies number of zeros to follow. 12 : 12 mm (C2, C, D, V case)

DC rated voltage in volts Part number of Bulk

0E : 2.5 V, 0G : 4 V, 0J : 6.3 V, 1A : 10 V,
1C : 16 V, 1D : 20 V, 1E : 25 V, 1V : 35 V Tape and Reel

Case code

E/SV Series

6
 E/SV Series

■ MARKINGS
The standard marking shows capacitance, DC rated voltage, and polarity.

[J case] (ex. 4.7 µ F / 6.3 V) [J case Marking Code]

UR
2.5 V 4V 6.3 V 10 V 16 V
µF
J 1.0
A
C

1.5
Marking Code J

A
2.2
(DC Rated Voltage
3.3

J
and Capacitance)
4.7 J
Polarity 6.8 G

J
J
10 e

G
[P case] (ex. 1 µ F / 10 V)
[P case Marking Code]
UR
2.5 V 4V 6.3 V 10 V 16 V
µF
A A
0.47 CS
Marking Code 0.68 CW
(DC Rated Voltage 1 AA CA
and Capacitance) 1.5 JE AE
2.2 AJ
Polarity 3.3 GN AN
4.7 JS AS
6.8 JW
[A2, A cases] (ex. 10 µ F / 6.3 V) 10 GA JA
15 GE
22 eJ GJ
J106 33 eN
47 eS

Capacitance (pF)

DC Rated Voltage Code [P, A2, A, cases DC Rated Voltage code]

Polarity Code e G J A C D E V
Rated
2.5 V 4V 6.3 V 10 V 16 V 20 V 25 V 35V
Voltage

[B3, B2 cases] (ex. 47 µ F / 6.3 V)

[B3, B2, C2, C, V, D cases Production date code]

47 Capacitance ( µ F) Y M Jan. Feb. Mar. Apr. May Jun. Jul. Aug. Sep. Oct. Nov. Dec.
2001 A B C D E F G H J K L M
6T Production Date Code 2002 N P Q R S T U V W X Y Z
2003 a b c d e f g h j k l m
2004 n p q r s t u v w x y z
DC Rated Voltage
Note: Production date code will repeat beginning in 2005.
Polarity

[C2, C, V, D cases] (ex. 220 µ F / 6.3 V)

Polarity

220 Capacitance ( µ F)

6T Production Date Code

DC Rated Voltage

7
■ PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE

Operating Temperature –55 to +125˚C

Rated Voltage 2.5 V 4V 6.3 V 10 V 16 V 20 V 25 V 35 V

Working Voltage at 125˚C 1.6 V 2.5 V 4V 6.3 V 10 V 13 V 16 V 22 V

Surge Voltage at 85˚C 3.3 V 5.2 V 8V 13 V 20 V 26 V 33 V 46 V

Capacitance Range : 0.47 µ F to 680 µ F

(at 20˚C, 120 Hz) Tolerance : ±20% (±10%)

Not to exceed –20% (P, J cace) or –12% at –55˚C,

Capacitance Change
+20% (P, J cace) or +12% at 85˚C,
with Temperature
+20% (P, J cace) or +15% at 125˚C

DC Leakage Current 0.01C • V (µ A) or 0.5 µ A, Whichever is Greater

Tangent of Loss Angle Refer to Standard Ratings

Capacitance Cange : Refer to Standard Ratings

Damp Heat
Tangent of Loss Angle : 150% of Initial Requirements
(90 to 95%RH at 40˚C, 56 days (1344hrs.))
DC Leakage Current : Initial Requirements

Capacitance Cange : Refer to Standard Ratings

Endurance
Tangent of Loss Angle : Initial Requirements
(at 85˚C, DC Rated Voltage, 2000hrs.)
DC Leakage Current : 200% (P, J case) or 125% of Initial Requirements

Resistance to Soldering Heat Capacitance Cange : Refer to Standard Ratings

(solder reflow at 260˚C, 10 s Tangent of Loss Angle : Initial Requirements
or solder dip at 260˚C, 5 s) DC Leakage Current : Initial Requirements

8
 E/SV Series

■ STANDARD RATINGS
Tangent of Loss Angle Capacitance Change
DC Leakage
Rating Part Capacitance Case at Damp Heat
Current +20˚C
(V) Number (µF) Code –55˚C +125˚C at Resistance to at Endurance
(µA) +85˚C
Soldering Heat
ESVJ0E106M 10 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP0E226M 22 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVA20E226M 22 A2 0.5 0.12 0.20 0.14 ±12% ±12%
ESVP0E336M 33 P 0.8 0.20 0.30 0.30 ±20% ±20%
ESVP0E476M 47 P 1.1 0.30 0.60 0.40 ±20% ±20%
ESVA20E476M 47 A2 1.1 0.12 0.22 0.14 ±12% ±12%
ESVA0E476M 47 A 1.1 0.12 0.22 0.16 ±12% ±12%
2.5 ESVA0E686M 68 A 1.7 0.18 0.34 0.20 ±12% ±12%
ESVB30E107M 100 B3 2.5 0.18 0.34 0.20 ±15% ±15%
ESVB20E107M 100 B2 2.5 0.08 0.14 0.10 ±12% ±12%
ESVB20E157M 150 B2 3.7 0.16 0.30 0.18 ±12% ±12%
ESVB20E227M 220 B2 5.5 0.18 0.34 0.20 ±12% ±12%
ESVC0E337M 330 C 8.2 0.16 0.34 0.18 ±12% ±12%
ESVC0E477M 470 C 11.7 0.18 0.34 0.20 ±12% ±12%
ESVD0E477M 470 D 11.7 0.14 0.18 0.16 ±12% ±12%
ESVP0G335M 3.3 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVJ0G685M 6.8 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVJ0G106M 10 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP0G106M 10 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP0G156M 15 P 0.6 0.20 0.30 0.30 ±20% ±20%
ESVP0G226M 22 P 0.8 0.20 0.30 0.30 ±20% ±20%
ESVA20G226M 22 A2 0.8 0.12 0.22 0.16 ±12% ±12%
ESVA0G226M 22 A 0.8 0.08 0.12 0.10 ±12% ±12%
ESVA20G336M 33 A2 1.3 0.08 0.14 0.10 ±12% ±12%
ESVA0G336M 33 A 1.3 0.10 0.14 0.12 ±12% ±12%
ESVA0G476M 47 A 1.8 0.12 0.22 0.14 ±12% ±12%
4 ESVB30G476M 47 B3 1.8 0.12 0.18 0.15 ±15% ±15%
ESVB30G686M 68 B3 2.7 0.15 0.28 0.17 ±15% ±15%
ESVA0G107M 100 A 4.0 0.30 0.60 0.40 ±20% ±20%
ESVB30G107M 100 B3 4.0 0.20 0.38 0.22 ±15% ±15%
ESVB20G107M 100 B2 4.0 0.12 0.22 0.14 ±12% ±12%
ESVB20G157M 150 B2 6.0 0.18 0.34 0.20 ±12% ±12%
ESVB20G227M 220 B2 8.8 0.18 0.34 0.20 ±12% ±12%
ESVC0G227M 220 C 8.8 0.12 0.22 0.14 ±12% ±12%
ESVC0G337M 330 C 13.2 0.14 0.26 0.16 ±12% ±12%
ESVV0G337M 330 V 13.2 0.12 0.18 0.14 ±12% ±12%
ESVD0G477M 470 D 18.8 0.16 0.30 0.18 ±12% ±12%
ESVD0G687M 680 D 27.2 0.24 0.46 0.26 ±12% ±12%
ESVP0J155M 1.5 P 0.5 0.10 0.15 0.15 ±20% ±20%
ESVJ0J225M 2.2 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVJ0J335M 3.3 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVJ0J475M 4.7 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP0J475M 4.7 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVA0J475M 4.7 A 0.5 0.08 0.12 0.10 ± 5% ±10%
ESVJ0J685M 6.8 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP0J685M 6.8 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVA20J685M 6.8 A2 0.5 0.08 0.12 0.10 ±12% ±12%
ESVJ0J106M 10 J 0.63 0. 20 0.38 0.22 ±20% ±20%
6.3 ESVP0J106M 10 P 0.6 0.20 0.30 0.30 ±20% ±20%
ESVA20J106M 10 A2 0.6 0.08 0.12 0.10 ±12% ±12%
ESVA0J106M 10 A 0.6 0.08 0.12 0.10 ±12% ±12%
ESVA20J156M 15 A2 0.9 0.12 0.22 0.14 ±12% ±12%
ESVA0J156M 15 A 0.9 0.08 0.12 0.10 ±12% ±12%
ESVA20J226M 22 A2 1.3 0.12 0.22 0.14 ±12% ±12%
ESVA0J226M 22 A 1.3 0.10 0.14 0.12 ±12% ±12%
ESVB30J226M 22 B3 1.3 0.08 0.12 0.10 ±15% ±15%
ESVB20J226M 22 B2 1.3 0.08 0.12 0.10 ± 5% ±10%
ESVA0J336M 33 A 2.0 0.12 0.22 0.14 ±12% ±12%
ESVB30J336M 33 B3 2.0 0.12 0.18 0.15 ±15% ±15%

9
 Tangent of Loss Angle Capacitance Change
DC Leakage
Rating Part Capacitance Case at Damp Heat
Current +20˚C
(V) Number (µF) Code –55˚C +125˚C at Resistance to at Endurance
(µA) +85˚C
Soldering Heat
ESVA0J476M 47 A 3.0 0.12 0.22 0.14 ±12% ±12%
ESVB30J476M 47 B3 2.9 0.12 0.18 0.15 ±15% ±15%
ESVB20J476M 47 B2 2.9 0.08 0.12 0.10 ± 5% ±10%
ESVC0J476M 47 C 2.9 0.08 0.12 0.10 ± 5% ±10%
ESVB20J686M 68 B2 4.2 0.10 0.18 0.12 ±12% ±12%
ESVB20J107M 100 B2 6.3 0.12 0.22 0.14 ±12% ±12%
ESVC20J107M 100 C2 6.3 0.10 0.18 0.12 ±12% ±12%
6.3
ESVC0J107M 100 C 6.3 0.10 0.14 0.12 ±12% ±12%
ESVC0J157M 150 C 9.4 0.10 0.18 0.12 ±12% ±12%
ESVC0J227M 220 C 13.8 0.14 0.26 0.16 ±12% ±12%
ESVV0J227M 220 V 13.8 0.12 0.18 0.14 ±12% ±12%
ESVD0J227M 220 D 13.8 0.12 0.18 0.14 ±12% ±12%
ESVD0J337M 330 D 20.7 0.14 0.26 0.16 ±12% ±12%
ESVD0J477M 470 D 29.7 0.20 0.38 0.22 ±20% ±20%
ESVP1A105M 1.0 P 0.5 0.10 0.15 0.15 ±20% ±20%
ESVJ1A155M 1.5 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP1A155M 1.5 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVJ1A225M 2.2 J 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP1A225M 2.2 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVP1A335M 3.3 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVA21A335M 3.3 A2 0.5 0.08 0.12 0.10 ±12% ±12%
ESVP1A475M 4.7 P 0.5 0.20 0.30 0.30 ±20% ±20%
ESVA21A475M 4.7 A2 0.5 0.08 0.12 0.10 ±12% ±12%
ESVA1A475M 4.7 A 0.5 0.08 0.12 0.10 ±12% ±12%
ESVA1A685M 6.8 A 0.6 0.08 0.12 0.10 ±12% ±12%
ESVA21A106M 10 A2 1.0 0.08 0.12 0.10 ±12% ±12%
ESVA1A106M 10 A 1.0 0.08 0.12 0.10 ±12% ±12%
10 ESVB21A106M 10 B2 1.0 0.08 0.12 0.10 ± 5% ±10%
ESVB31A156M 15 B3 1.5 0.12 0.18 0.15 ±15% ±15%
ESVA1A226M 22 A 2.2 0.12 0.22 0.14 ±12% ±12%
ESVB31A226M 22 B3 2.2 0.08 0.12 0.10 ±15% ±15%
ESVB21A226M 22 B2 2.2 0.08 0.12 0.10 ± 5% ±10%
ESVB21A336M 33 B2 3.3 0.08 0.12 0.10 ± 5% ±10%
ESVB21A476M 47 B2 4.7 0.08 0.12 0.10 ±12% ±12%
ESVC21A476M 47 C2 4.7 0.08 0.12 0.10 ±12% ±12%
ESVC1A476M 47 C 4.7 0.08 0.12 0.10 ± 5% ±10%
ESVC1A686M 68 C 6.8 0.08 0.12 0.10 ±12% ±12%
ESVC1A107M 100 C 10.0 0.10 0.18 0.12 ±12% ±12%
ESVD1A107M 100 D 10.0 0.08 0.18 0.10 ± 5% ±10%
ESVD1A157M 150 D 15.0 0.10 0.18 0.12 ±12% ±12%
ESVD1A227M 220 D 22.0 0.12 0.22 0.14 ±12% ±12%
ESVP1C474M 0.47 P 0.5 0.10 0.15 0.15 ±20% ±20%
ESVP1C684M 0.68 P 0.5 0.10 0.15 0.15 ±20% ±20%
ESVJ1C105M 1.0 J 0.5 0.10 0.30 0.15 ±20% ±20%
ESVP1C105M 1.0 P 0.5 0.10 0.15 0.15 ±20% ±20%
ESVA1C155M 1.5 A 0.5 0.04 0.08 0.06 ± 5% ±10%
ESVA21C225M 2.2 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1C225M 2.2 A 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA21C335M 3.3 A2 0.5 0.08 0.14 0.10 ±12% ±12%
ESVA1C335M 3.3 A 0.5 0.06 0.10 0.08 ±12% ±12%
16 ESVA21C475M 4.7 A2 0.7 0.08 0.14 0.10 ±12% ±12%
ESVA1C475M 4.7 A 0.7 0.06 0.10 0.08 ±12% ±12%
ESVA1C685M 6.8 A 1.0 0.06 0.10 0.08 ±12% ±12%
ESVB31C685M 6.8 B3 1.0 0.06 0.10 0.08 ±15% ±15%
ESVA1C106M 10 A 1.6 0.08 0.12 0.10 ±12% ±12%
ESVB31C106M 10 B3 1.6 0.08 0.14 0.10 ±15% ±15%
ESVB21C106M 10 B2 1.6 0.06 0.10 0.08 ± 5% ±10%
ESVB21C156M 15 B2 2.4 0.06 0.10 0.08 ± 5% ±10%
ESVB21C226M 22 B2 3.5 0.06 0.10 0.08 ± 5% ±10%
ESVC1C226M 22 C 3.5 0.06 0.10 0.08 ± 5% ±10%

10
 E/SV Series

Tangent of Loss Angle Capacitance Change

DC Leakage
Rating Part Capacitance Case at Damp Heat
Current +20˚C
(V) Number (µF) Code –55˚C +125˚C at Resistance to at Endurance
(µA) +85˚C
Soldering Heat
ESVC21C336M 33 C2 5.2 0.06 0.10 0.08 ±12% ±12%
ESVC1C336M 33 C 5.2 0.06 0.10 0.08 ± 5% ±10%
ESVC1C476M 47 C 7.5 0.06 0.10 0.08 ±12% ±12%
16
ESVD1C476M 47 D 7.5 0.06 0.10 0.08 ± 5% ±10%
ESVD1C686M 68 D 10.8 0.06 0.10 0.08 ± 5% ±10%
ESVD1C107M 100 D 16.0 0.10 0.18 0.10 ±12% ±12%
ESVA21D474M 0.47 A2 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA21D684M 0.68 A2 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA21D105M 1.0 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA21D155M 1.5 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA21D225M 2.2 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1D225M 2.2 A 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1D335M 3.3 A 0.6 0.06 0.10 0.08 ±12% ±12%
ESVB31D335M 3.3 B3 0.6 0.06 0.10 0.08 ±15% ±15%
ESVA1D475M 4.7 A 0.9 0.06 0.10 0.08 ±12% ±12%
20 ESVB31D475M 4.7 B3 0.9 0.06 0.10 0.08 ±15% ±15%
ESVB21D475M 4.7 B2 0.9 0.06 0.10 0.08 ± 5% ±10%
ESVB21D685M 6.8 B2 1.3 0.06 0.10 0.08 ± 5% ±10%
ESVB21D106M 10 B2 2.0 0.06 0.10 0.08 ± 5% ±10%
ESVC1D156M 15 C 3.0 0.06 0.10 0.08 ± 5% ±10%
ESVC21D226M 22 C2 4.4 0.06 0.10 0.08 ±12% ±12%
ESVC1D226M 22 C 4.4 0.06 0.10 0.08 ± 5% ±10%
ESVD1D226M 22 D 4.4 0.06 0.10 0.08 ± 5% ±10%
ESVD1D336M 33 D 6.6 0.06 0.10 0.08 ± 5% ±10%
ESVD1D476M 47 D 9.4 0.06 0.10 0.08 ± 5% ±10%
ESVA1E474M 0.47 A 0.5 0.04 0.08 0.06 ± 5% ±10%
ESVA1E684M 0.68 A 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA21E105M 1.0 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1E105M 1.0 A 0.5 0.06 0.10 0.08 ± 5% ±10%
25 ESVA1E225M 2.2 A 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1E335M 3.3 A 0.8 0.06 0.10 0.08 ±12% ±12%
ESVB21E475M 4.7 B2 1.1 0.06 0.10 0.08 ± 5% ±10%
ESVC1E106M 10 C 2.5 0.06 0.10 0.08 ± 5% ±10%
ESVD1E226M 22 D 5.5 0.06 0.10 0.08 ± 5% ±10%
ESVA1V474M 0.47 A 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA1V684M 0.68 A 0.5 0.06 0.10 0.08 ± 5% ±10%
ESVA21V105M 1.0 A2 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1V105M 1.0 A 0.5 0.06 0.10 0.08 ±12% ±12%
ESVA1V155M 1.5 A 0.5 0.06 0.10 0.08 ±12% ±12%
35 ESVB21V225M 2.2 B2 0.7 0.06 0.10 0.08 ± 5% ±10%
ESVB21V335M 3.3 B2 1.1 0.06 0.10 0.08 ± 5% ±10%
ESVC1V475M 4.7 C 1.6 0.06 0.10 0.08 ± 5% ±10%
ESVC1V685M 6.8 C 2.3 0.06 0.10 0.08 ± 5% ±10%
ESVD1V106M 10 D 3.5 0.06 0.10 0.08 ± 5% ±10%
ESVD1V156M 15 D 5.2 0.06 0.10 0.08 ± 5% ±10%

11
 SV/Z Series Tantalum Chip Capacitors
(Low–ESR Type)
■ FEATURES
● Low-ESR Type.
● Fordecoupling with CPU, for absorbing the noise.
● Same Dimension as E/SV series

■ DIMENSIONS [mm]

L W1
[A case]
H
Z Z

W2

L W1
[B2 case]
H

Z Z

W2

L W1 Y W1
[C, V, D cases]
H

Z Z C, D cases V case

W2

(Unit: mm)
Case
EIA code L W1 W2 H Z Y
Code
A 3216 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.6 ± 0.2 0.8 ± 0.2 –
B2 3528 3.5 ± 0.2 2.8 ± 0.2 2.2 ± 0.1 1.9 ± 0.2 0.8 ± 0.2 –
C 6032 6.0 ± 0.2 3.2 ± 0.2 2.2 ± 0.1 2.5 ± 0.2 1.3 ± 0.2 0.4 C
V 7343L 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 1.9 ± 0.1 1.3 ± 0.2 –
D 7343 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 2.8 ± 0.2 1.3 ± 0.2 0.5 C

12
 SV/Z Series

■ STANDARD C-V VALUE REFERENCE BY CASE CODE

UR
4V 6.3 V 10 V 16 V 20 V 25 V 35 V
µF
C C
6.8
600 600
A B2 D
10
800 600 300
D D
15
250 300
B2 D
22
800 200
D
33
200
C D D2, D
47
300 150 150
D
68
150
C, D C, V, D D
100
150, 150 125, 150, 100 100
C, D V, D
150
125, 100 150, 100
D V, D D
220
100 150, 100 100
V, D D
330
150, 100 100

Number : ESR (mΩ)

■ PART NUMBER SYSTEM

[Bulk] [Tape and Reel]
SVZ D 1C 107 M TE SVZD1C107M 12 R
Capacitance Tolerance Packing Orientation
M: ±20% R : Cathode on the Side
of Sproket Hole
Capacitance (pF)
First two digits represent significant figures. Tape width
Third digit specifies number of zeros to follow. 8 : 8 mm (A, B2 case)
12 : 12 mm (C, V, D cases)
DC rated voltage in volts
0G : 4 V, 0J : 6.3 V, 1A : 10 V, 1C : 16 V Part number of Bulk
1D : 20 V, 1E : 25 V, 1V : 35 V Tape and Reel
Case code
SV/Z Series

13
■ MARKINGS
The standard marking shows capacitance, DC rated voltage, and polarity.

[A case] (ex. 10 µ F / 6.3 V)

J106

Capacitance Code (pF)

DC Rated Voltage Code

Polarity

[B2 case] (ex. 22 µ F / 6.3 V)

22 Capacitance ( µ F)

6T Production Date Code

DC Rated Voltage

Polarity

[C, V, D case] (ex. 220 µ F / 10 V)

Polarity

220 Capacitance ( µ F)

10T Production Date Code

DC Rated Voltage

[DC Rated Voltage code]

Code G J A C D E V
Rated
4V 6.3 V 10 V 16 V 20 V 25 V 35V
Voltage

[B2, C, V, D cases production date code]

Y M Jan. Feb. Mar. Apr. May Jun. Jul. Aug. Sep. Oct. Nov. Dec.
2001 A B C D E F G H J K L M
2002 N P Q R S T U V W X Y Z
2003 a b c d e f g h j k l m
2004 n p q r s t u v w x y z
Note: Production date code will repeat beginning in 2005.

14
 SV/Z Series

■ PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE

Operating Temperature –55 to +125˚C

Rated Voltage 4V 6.3 V 10 V 16 V 20 V 25 V 35 V

Working Voltage at 125˚C 2.5 V 4V 6.3 V 10 V 13 V 16 V 22 V

Surge Voltage at 85˚C 5.2 V 8V 13 V 20 V 26 V 33 V 46 V

Capacitance Range : 6.8 µ F to 330 µ F

(at 20˚C, 120 Hz) Tolerance : ±20%

Not to exceed –12% at –55˚C,

Capacitance Change
+12% at 85˚C,
with Temperature
+15% at 125˚C

DC Leakage Current 0.01C • V (µ A) or 0.5 µ A, Whichever is Greater

Tangent of Loss Angle Refer to Standard Ratings

Equivalent Series Resistance

Refer to Standard Ratings
(at 20˚C, 100 kHz)

Capacitance Cange : Refer to Standard Ratings

Damp Heat
Tangent of Loss Angle : 150% of Initial Requirements
(90 to 95%RH at 40˚C, 56 days (1344hrs.))
DC Leakage Current : Initial Requirements

Capacitance Cange : Refer to Standard Ratings

Endurance
Tangent of Loss Angle : Initial Requirements
(at 85˚C, DC Rated Voltage, 2000hrs.)
DC Leakage Current : 125% of Initial Requirements

Resistance to Soldering Heat Capacitance Cange : Refer to Standard Ratings

(solder reflow at 260˚C, 10 s Tangent of Loss Angle : Initial Requirements
or solder dip at 260˚C, 5 s) DC Leakage Current : Initial Requirements

15
■ STANDARD RATINGS
Tangent of Loss Angle Capacitance Change
DC Leakage
Rating Part Capacitance Case ESR at Damp Heat
Current +20˚C
(V) Number (µF) Code –55˚C +125˚C mΩ at Resistance to at Endurance
(µA) +85˚C
Soldering Heat
SVZD0G227M 220 D 8.8 0.08 0.18 0.10 100 ± 5% ±10%
4 SVZV0G337M 330 V 13.2 0.12 0.18 0.14 150 ±12% ±12%
SVZD0G337M 330 D 13.2 0.14 0.18 0.16 100 ±12% ±12%
SVZA0J106M 10 A 0.6 0.08 0.12 0.10 800 ±12% ±12%
SVZB20J226M 22 B2 1.3 0.08 0.12 0.10 800 ± 5% ±10%
SVZC0J107M 100 C 6.3 0.10 0.18 0.12 150 ±12% ±12%
SVZD0J107M 100 D 6.3 0.08 0.12 0.10 150 ± 5% ±10%
6.3
SVZC0J157M 150 C 9.4 0.10 0.18 0.12 125 ±12% ±12%
SVZD0J157M 150 D 9.4 0.08 0.18 0.10 100 ± 5% ±10%
SVZV0J227M 220 V 13.8 0.12 0.18 0.14 150 ±12% ±12%
SVZD0J227M 220 D 13.8 0.12 0.18 0.14 100 ±12% ±12%
SVZD0J337M 330 D 20.7 0.14 0.26 0.16 100 ±12% ±12%
SVZB21A106M 10 B2 1.0 0.08 0.12 0.10 600 ± 5% ±10%
SVZC1A476M 47 C 4.7 0.08 0.12 0.10 300 ± 5% ±10%
SVZC1A107M 100 C 10.0 0.10 0.18 0.12 125 ±12% ±12%
10
SVZV1A107M 100 V 10.0 0.08 0.18 0.10 150 ±12% ±12%
SVZD1A107M 100 D 10.0 0.08 0.18 0.10 100 ± 5% ±10%
SVZV1A157M 150 V 15.0 0.08 0.14 0.10 150 ±12% ±12%
SVZD1A157M 150 D 15.0 0.10 0.18 0.12 100 ±12% ±12%
SVZD1A227M 220 D 22.0 0.12 0.22 0.14 100 ±12% ±12%
SVZD1C476M 47 D 7.5 0.06 0.10 0.08 150 ± 5% ±10%
16 SVZD1C686M 68 D 10.8 0.06 0.10 0.08 150 ± 5% ±10%
SVZD1C107M 100 D 16.0 0.08 0.18 0.10 100 ±12% ±12%
SVZD1D336M 33 D 6.6 0.06 0.10 0.08 200 ± 5% ±10%
20
SVZD1D476M 47 D 9.4 0.06 0.10 0.08 150 ± 5% ±10%
SVZC1E685M 6.8 C 1.7 0.06 0.10 0.08 600 ± 5% ±10%
25 SVZD1E156M 15 D 3.7 0.06 0.10 0.08 250 ± 5% ±10%
SVZD1E226M 22 D 5.5 0.06 0.10 0.08 200 ± 5% ±10%
SVZC1V685M 6.8 C 2.3 0.06 0.10 0.08 600 ± 5% ±10%
35 SVZD1V106M 10 D 3.5 0.06 0.10 0.08 300 ± 5% ±10%
SVZD1V156M 15 D 5.2 0.06 0.10 0.08 300 ± 5% ±10%

16
 PS/L Series

PS/L Series NeoCapacitors

CONDUCTIVE POLYMER TANTALUM CAPACITORS
■ FEATURES
● Ultra-Low ESR
● Same Dimension as E/SV series

■ DIMENSIONS [mm]

L W1
[J, P, A2, A cases]
H
Z Z

W2

L W1
[B3, B2 cases]
H

Z Z

W2 W2

B2 case B3 case

L W1 Y W1
[C, V, D cases]
H

Z Z C, D cases V case

W2

(Unit: mm)
Case
EIA code L W1 W2 H Z Y
Code
J – 1.6 ± 0.1 0.8 ± 0.1 0.6 ± 0.1 0.8 ± 0.1 0.3 ± 0.15 –
P 2012 2.0 ± 0.2 1.25 ± 0.2 0.9 ± 0.1 1.1 ± 0.1 0.5 ± 0.1 –
A2 (U) 3216L 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.1 ± 0.1 0.8 ± 0.2 –
A 3216 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.6 ± 0.2 0.8 ± 0.2 –
B3 (W) 3528L 3.5 ± 0.2 2.8 ± 0.2 2.2 ± 0.1 1.1 ± 0.1 0.8 ± 0.2 –
B2 (S) 3528 3.5 ± 0.2 2.8 ± 0.2 2.2 ± 0.1 1.9 ± 0.2 0.8 ± 0.2 –
C 6032 6.0 ± 0.2 3.2 ± 0.2 2.2 ± 0.1 2.5 ± 0.2 1.3 ± 0.2 0.4 C
V 7343L 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 1.9 ± 0.1 1.3 ± 0.2 –
D 7343 7.3 ± 0.2 4.3 ± 0.2 2.4 ± 0.1 2.8 ± 0.2 1.3 ± 0.2 0.5 C

17
■ STANDARD C-V VALUE REFERENCE BY CASE CODE
UR
2.5 V 4V 6.3 V 10 V 16 V
µF
2.2 J J
3.3 J, P A A
4.7 J, P A2, A B2
6.8 P, A A, B2 B2
10 P, A P, A2, A A, B2
15 A, B2 B2, C
22 B2 A, B3, B2 B3, B2, C
33 A B3, B2 B2, C
47 A, B3 B3, B2, C B2, C, V, D D
68 C B2, C V, D
100 B2 B2, C V, D
150 B2, C C, V, D D
220 B2 C, V, D D D
330 V D D
470 D
680 D D

■ PART NUMBER SYSTEM

[Bulk] [Tape and Reel]
PSL D 0J 337 M (25) TE PSLD0J337M 12 R
Special numbering for ESR Packing Orientation
ex. (25) shows 25 mΩ R : Cathode on the Side
of Sproket Hole
Capacitance Tolerance
M: ±20% Tape width
8 : 8 mm (J, P, A2, A, B3, B2 case)
Capacitance (pF)
12 : 12 mm (C, V, D cases)
First two digits represent significant figures.
Third digit specifies number of zeros to follow. Part number of Bulk
Tape and Reel
DC rated voltage in volts
0E: 2.5 V, 0G : 4 V, 0J : 6.3 V, 1A : 10 V, 1C: 16 V
Case code
PS/L Series

18
 PS/L Series

[J case] (ex. 4.7 µ F / 6.3 V) [J case Marking Code]

UR 4V 6.3 V 10 V
J µF
J
2.2

A
3.3

J
Marking Code
(DC Rated Voltage 4.7 J
and Capacitance)
6.8
Polarity 10

[P case] (ex. 10 µ F / 4 V) [P case Marking Code]

UR 4V 6.3 V 10 V
AG µF
3.3 NJ
Marking Code 4.7 SJ
(DC Rated Voltage 6.8 WJ
and Capacitance)
10 AG AJ
Polarity

[A2, A cases] (ex. 10 µ F / 6.3 V) [A2, A, B3, B2, C, V, D cases Marking Code]
UR 2.5 V 4V 6.3 V 10 V 16 V
µF
FjA7 e N j A C
Marking Code 3.3 N6 AN6 CN6
(DC Rated Voltage 4.7 S6 AS6 CS6
and Capacitance) 6.8 W6 AW6 CW6
Production Date Code 10 A7 NA7 jA7 AA7
15 W7 jE7 AE7
Polarity
22 J7 NJ7 jJ7 AJ7
33 N7 NN7 jN7 AN7
[B3, B2 cases] (ex. 15 µF / 6.3 V) 47 S7 NS7 jS7 AS7 CS7
68 W7 NW7 jW7 AW7
100 A8 NA8 jA8 AA8
NE R Production Date Code
150 E8 NE8 jE8 AE8
NE for NeoCapacitor
jE7 220 J8 eJ8 NJ8 jJ8 AJ8
330 N8 eN8 NN8 jN8
Marking Code 470 S8 NS8
(DC Rated Voltage
680 W8 eW8 NW8
and Capacitance)
Polarity

[C, D cases] (ex. 150 µ F / 6.3 V)

Polarity

NE R Production Date Code [A2, A, B3, B2, C, V, D cases production date code]
NE for NeoCapacitor M Jan. Feb. Mar. Apr. May Jun. Jul. Aug. Sep. Oct. Nov. Dec.
jE8 Y
2001 A B C D E F G H J K L M
Marking Code 2002 N P Q R S T U V W X Y Z
(DC Rated Voltage 2003 a b c d e f g h j k l m
and Capacitance) 2004 n p q r s t u v w x y z
Note: Production date code will repeat beginning in 2005.

19
■ PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE

Operating Temperature –55 to +105˚C

Rated Voltage 2.5 V 4V 6.3 V 10 V 16 V

Working Voltage at 105˚C 2V 3.3 V 5V 8V 12.8 V

Surge Voltage at 85˚C 3.3 V 5.2 V 8V 13 V 20 V

Capacitance Range : 2.2 µ F to 470 µ F

(at 20˚C, 120 Hz) Tolerance : ±20%

Capacitance Change Not to exceed –20% at –55˚C,

with Temperature +15% at 105˚C

DC Leakage Current 0.1C • V (µ A) or 3 µ A (J case 10 µ A), Whichever is Greater

Tangent of Loss Angle Refer to Standard Ratings

Equivalent Series Resistance

Refer to Standard Ratings
(at 20˚C, 100 kHz)

Capacitance Cange : +30% to –20%

Damp Heat
Tangent of Loss Angle : 150% of Initial Requirements
(90 to 95%RH at 40˚C, 56 days (1344hrs.))
DC Leakage Current : Initial Requirements

Capacitance Cange : ±20%

Endurrance
Tangent of Loss Angle : 150% of Initial Requirements
(at 85˚C, DC Rated Voltage, 1000hrs.)
DC Leakage Current : Initial Requirements

Capacitance Cange : ±20%

Resistance to Soldering Heat
Tangent of Loss Angle : 130% of Initial Requirements
(solder reflow at 240˚C, 10 s)
DC Leakage Current : Initial Requirements

20
 PS/L Series

■ STANDARD RATINGS
Tangent of Loss Angle Permissible Capacitance Change
DC Leakage
Rating Part Capacitance Case ESR Ripple at Damp Heat
Current
(V) Number (µF) Code +20˚C –55˚C +105˚C mΩ Current at Resistance to at Endurance
(µA)
mA rms. Soldering Heat
PSLB20E227M 220 B2 55 0.08 0.08 0.12 45 1374 ±20% ±20%
PSLV0E337M 330 V 82.5 0.10 0.10 0.15 25 2236 ±20% ±20%
2.5
PSLV0E337M(15) 330 V 82.5 0.10 0.10 0.15 15 2887 ±20% ±20%
PSLD0E687M 680 D 170 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLP0G106M 10 P 4.0 0.06 0.06 0.09 500 224 ±20% ±20%
PSLA0G106M 10 A 4.0 0.06 0.06 0.09 500 387 ±20% ±20%
PSLB20G226M 22 B2 8.8 0.08 0.08 0.12 300 532 ±20% ±20%
PSLA0G336M 33 A 13.2 0.06 0.06 0.09 500 387 ±20% ±20%
PSLA0G476M 47 A 18.8 0.06 0.06 0.09 200 612 ±20% ±20%
PSLB30G476M 47 B3 18.8 0.08 0.10 0.12 80 968 ±20% ±20%
PSLC0G686M 68 C 27.2 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLB20G107M 100 B2 40.0 0.08 0.08 0.12 70 1102 ±20% ±20%
PSLB20G107M(45) 100 B2 40.0 0.08 0.08 0.12 45 1374 ±20% ±20%
PSLB20G157M 150 B2 60.0 0.08 0.08 0.12 45 1374 ±20% ±20%
PSLC0G157M 150 C 60.0 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLC0G227M 220 C 88.0 0.09 0.09 0.14 55 1414 ±20% ±20%
PSLV0G227M 220 V 88.0 0.10 0.10 0.15 45 1667 ±20% ±20%
PSLV0G227M(25) 220 V 88.0 0.10 0.10 0.15 25 2236 ±20% ±20%
4
PSLV0G227M(18) 220 V 88.0 0.10 0.10 0.15 18 2635 ±20% ±20%
PSLV0G227M(15) 220 V 88.0 0.10 0.10 0.15 15 2887 ±20% ±20%
PSLD0G227M 220 D 88.0 0.10 0.10 0.15 55 1651 ±20% ±20%
PSLD0G227M(40) 220 D 88.0 0.10 0.10 0.15 40 1936 ±20% ±20%
PSLD0G227M(25) 220 D 88.0 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLD0G227M(15) 220 D 88.0 0.10 0.10 0.15 15 3162 ±20% ±20%
PSLD0G337M 330 D 132 0.10 0.10 0.15 40 1936 ±20% ±20%
PSLD0G337M(25) 330 D 132 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLD0G337M(15) 330 D 132 0.10 0.10 0.15 15 3162 ±20% ±20%
PSLD0G477M 470 D 188 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLD0G477M(18) 470 D 188 0.10 0.10 0.15 18 2887 ±20% ±20%
PSLD0G477M(15) 470 D 188 0.10 0.10 0.15 15 3126 ±20% ±20%
PSLD0G477M(12) 470 D 188 0.10 0.10 0.15 12 3536 ±20% ±20%
PSLD0G687M 680 D 272 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLJ0J225M 2.2 J 10.0 0.04 0.04 0.06 600 129 ±20% ±20%
PSLJ0J335M 3.3 J 10.0 0.04 0.04 0.06 600 129 ±20% ±20%
PSLP0J335M 3.3 P 3.0 0.06 0.06 0.09 500 224 ±20% ±20%
PSLJ0J475M 4.7 J 10.0 0.04 0.04 0.06 600 129 ±20% ±20%
PSLP0J475M 4.7 P 3.0 0.06 0.06 0.09 500 224 ±20% ±20%
PSLP0J685M 6.8 P 4.2 0.06 0.06 0.09 500 224 ±20% ±20%
PSLA0J685M 6.8 A 4.2 0.06 0.06 0.09 800 306 ±20% ±20%
PSLP0J106M 10 P 6.3 0.06 0.06 0.09 500 224 ±20% ±20%
PSLA20J106M 10 A2 6.3 0.06 0.06 0.09 500 346 ±20% ±20%
PSLA0J106M 10 A 6.3 0.06 0.06 0.09 500 387 ±20% ±20%
PSLA0J156M 15 A 9.4 0.06 0.06 0.09 500 387 ±20% ±20%
PSLB20J156M 15 B2 9.4 0.08 0.08 0.12 300 532 ±20% ±20%
PSLA0J226M 22 A 13.8 0.06 0.06 0.09 500 387 ±20% ±20%
6.3
PSLB30J226M 22 B3 13.8 0.08 0.10 0.12 80 968 ±20% ±20%
PSLB20J226M 22 B2 13.8 0.08 0.08 0.12 300 532 ±20% ±20%
PSLB30J336M 33 B3 20.7 0.08 0.10 0.12 80 968 ±20% ±20%
PSLB20J336M 33 B2 20.7 0.08 0.08 0.12 300 532 ±20% ±20%
PSLB30J476M 47 B3 29.6 0.08 0.08 0.12 80 968 ±20% ±20%
PSLB20J476M 47 B2 29.6 0.08 0.08 0.12 200 652 ±20% ±20%
PSLB20J476M(70) 47 B2 29.6 0.08 0.08 0.12 70 1102 ±20% ±20%
PSLC0J476M 47 C 29.6 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLB20J686M 68 B2 42.8 0.08 0.08 0.12 200 652 ±20% ±20%
PSLB20J686M(70) 68 B2 42.8 0.08 0.08 0.12 70 1102 ±20% ±20%
PSLC0J686M 68 C 42.8 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLD0J337M 330 D 207.9 0.10 0.10 0.15 40 1936 ±20% ±20%
PSLD0J337M(25) 330 D 207.9 0.10 0.10 0.15 25 2449 ±20% ±20%

21
 Tangent of Loss Angle Permissible Capacitance Change
DC Leakage
Rating Part Capacitance Case ESR Ripple at Damp Heat
Current
(V) Number (µF) Code +20˚C –55˚C +105˚C mΩ Current at Resistance to at Endurance
(µA)
mA rms. Soldering Heat
PSLJ1A225M 2.2 J 10 0.04 0.04 0.06 600 129 ±20% ±20%
PSLA1A335M 3.3 A 3.3 0.06 0.06 0.09 800 306 ±20% ±20%
PSLA21A475M 4.7 A2 4.7 0.06 0.06 0.09 500 346 ±20% ±20%
PSLA1A475M 4.7 A 4.7 0.06 0.06 0.09 800 306 ±20% ±20%
PSLA1A685M 6.8 A 6.8 0.06 0.06 0.09 800 306 ±20% ±20%
PSLB21A685M 6.8 B2 6.8 0.08 0.08 0.12 500 412 ±20% ±20%
PSLA1A106M 10 A 10.0 0.06 0.06 0.09 300 500 ±20% ±20%
PSLB21A106M 10 B2 10.0 0.08 0.08 0.12 300 532 ±20% ±20%
PSLB21A156 15 B2 15.0 0.08 0.08 0.12 300 532 ±20% ±20%
PSLC1A156M 15 C 15.0 0.09 0.09 0.14 200 742 ±20% ±20%
PSLB31A226 22 B3 22.0 0.08 0.08 0.12 80 968 ±20% ±20%
PSLB21A226 22 B2 22.0 0.08 0.08 0.12 300 532 ±20% ±20%
PSLC1A226M 22 C 22.0 0.09 0.09 0.14 150 856 ±20% ±20%
PSLB21A336 33 B2 33.0 0.08 0.08 0.12 200 652 ±20% ±20%
10
PSLC1A336M 33 C 33.0 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLB21A476M 47 B2 47.0 0.08 0.08 0.12 70 1102 ±20% ±20%
PSLC1A476M 47 C 47.0 0.09 0.09 0.14 100 1049 ±20% ±20%
PSLV1A476M 47 V 47.0 0.10 0.10 0.15 60 1443 ±20% ±20%
PSLD1A476M 47 D 47.0 0.10 0.10 0.15 100 1225 ±20% ±20%
PSLV1A686M 68 V 68.0 0.10 0.10 0.15 60 1443 ±20% ±20%
PSLD1A686M 68 D 68.0 0.10 0.10 0.15 100 1225 ±20% ±20%
PSLV1A107M 100 V 100 0.10 0.10 0.15 45 1667 ±20% ±20%
PSLD1A107M 100 D 100 0.10 0.10 0.15 55 1651 ±20% ±20%
PSLD1A157M 150 D 150 0.10 0.10 0.15 55 1651 ±20% ±20%
PSLD1A157M(40) 150 D 150 0.10 0.10 0.15 40 1936 ±20% ±20%
PSLD1A227M 220 D 220 0.10 0.10 0.15 40 1936 ±20% ±20%
PSLD1A227M(25) 220 D 220 0.10 0.10 0.15 25 2449 ±20% ±20%
PSLA1C335M 3.3 A 5.20 0.06 0.06 0.09 800 306 ±20% ±20%
PSLB21C475M 4.7 B2 7.50 0.08 0.08 0.12 600 376 ±20% ±20%
16
PSLB21C685M 6.8 B2 10.80 0.08 0.08 0.12 600 376 ±20% ±20%
PSLD1C476M 47 D 75.20 0.10 0.10 0.15 70 1464 ±20% ±20%

22
 Tape and Reel Specification for Chips

TAPE AND REEL SPECIFICATIONS

Plastic Tape Carrier

Sprocket hole
Emboss
D0

E
A0

W
B0
t D1
P1 P2 P0
K

Feed direction

Unit: mm
Case Code A0 ± 0.2 B0 ± 0.2 K ± 0.2

J 1.0 1.8 1.1

P 1.4 2.2 1.4

A2 (U) 1.9 3.5 1.4

A 1.9 3.5 1.9

B3 3.2 3.8 1.4

B2 (S) 3.3 3.8 2.1

C2 3.7 6.4 1.7

C 3.7 6.4 3.0

V 4.6 7.7 2.4

D 4.8 7.7 3.3

Case
W ± 0.3 F ± 0.05 E ± 0.1 P 1 ± 0.1 P 2 ± 0.05 P 0 ± 0.1 D0 +0.1
0 D1 min. t
Code
J –
P –
A2 (U)
8 3.5 4 0.2
A
φ 1.0
B3 (W)
1.75 2 4 φ 1.5
B2 (S)
C2
0.3
C
2.6 5.5 8 φ 1.5
V 0.4
D 0.3

23
 REEL

W1

N
C
A
R

W2

Unit: mm

Tape Width A±2 N Min. C ± 0.5 D ± 0.5 B ± 0.5 W1 W 2 Max. R

8 mm 9.0 ± 0.3 11.4 ± 1.0

φ180 φ 50 φ13 φ 21 2 1
12 mm 13.0 ± 0.3 15.4 ± 1.0

8 mm 9.5 ± 0.5 14.5 Max.

φ330 φ 80 φ13 φ 21 2 1
12 mm 13.5 ± 0.5 18.5 Max.

Case Code φ180 Reel φ 330 Reel

J 4000 −

P 3000 −

A2 (U) 3000 10,000

A 2000 9000

B3 (W) 3000 −

B2 (S) 2000 5000

C2 1000 −

V 1000 3000

C, D 500 2500

[Quantity Per Reel]

24
 Tape and Reel Specification for Chips

NOTES ON USING THE SOLID TANTALUM CAPACITORS

About 90% of the failure mode of the solid tantalum capacitor is short-circuit.
Please take surplus for the operating condition.

1. Circuit Design

(1) Reliability
The reliability of the solid tantalum capacitor is heavily influenced by environmental conditions such as tempera-
ture, humidity, shock, vibration, mechanical stresses, and electric stresses, including applied voltage, current,
ripple current, transient current and voltage, and frequency. When using solid tantalum capacitors, therefore,
provide enough margin so that the reliability of the capacitors is maintained.

Voltage and temperature are important pa-

rameters when estimating the reliability (field 1.0
100 0.9
failure rate). 7
0.8
The field failure rate of a solid tantalum ca- 4

Multiple of failure rate (F)

0.7
pacitor can be calculated by the following ex- 80 The figure indicates an
2

10−1 0.6

Working voltage/rated voltage

pression if emphasis is placed only on the operation example under
the following conditions: 7
voltage and temperature: 0.5
70 Ambient temperature: 25°C 4

Working voltage ratio: 0.3

Ambient temperature (°C)

2
0.4
Where the multiple of the
λ = λ 0(V/V 0) 3 × 2 (T–T )/10
0
failure rate is F = 4 × 10−4 10−2
7
60 Therefore, estimated failure 0.3
Where rate λ is: 4

λ = 2 × 10−5 × 4 × 10−4 = 8 (FIT) 2

λ: estimated failure rate in actual working Note: Where λ0 = 2%/1000 h 10−3
50
condition 7
0.2
4
temperature: T; voltage: V
λ 0: failure rate under rated load (See table 40
2

below.) 10−4
7
temperature: T 0; voltage: V 0 4
30
2
0.1
Failure rate level λ 0 of each series 10−5
20
Series Failure rate level T F V

PS/L 1%/1000 h This figure graphically indicates (V/V 0) × 2 in the 3 (T−T 0)/10

expression λ = λ0 (V/V0)3 × 2(T−T )/10. By using this figure, the 0

E/SV 1%/1000 h
estimated failure rate can be easily calculated.
R (standard) 1%/1000 h Connect the desired temperature and voltage ratio with a straight
R (extended) 1%/1000 h line (from the left most vertical axis in the figure to the right most
axis) in the figure. The multiple of the failure rate can be obtained at
SV/S 1%/1000 h the intersection of the line drawn and the middle vertical axis in the
SV/Z 1%/1000 h figure.
Therefore,
λ = λ0 × F
<Test conditions> Where
Temperature : 85°C F: multiple of failure rate at given temperature and ratio of working
Voltage: rated voltage voltage to rated voltage.
RS: 3 Ω

25
2. Ripple Voltage
(1) Keep the sum of the DC voltage and peak value of the ripple voltage within the rated voltage.
(2) If a ripple voltage is applied to the capacitor, the peak value of the ripple voltage must be kept within the
values shown in the following figures:

Chips
100 100
Permissible ripple voltage Vr.m.s.

Permissible ripple voltage Vr.m.s.

Case : P, A2, A, B, B2 Case : C, D2, V, D
50 V @25°C 50 V @25°C
35 V 35 V
10 25 V 10 25 V
20 V 20 V
at 25 °C

at 25 °C
16 V 16 V
10 V 10 V
6.3 V 6.3 V
4V
1 2.54 V
V 1 2.5 V

0.1 0.1
0.1 1 10 100 0.1 1 10 100
Frequency (kHz) Frequency (kHz)
Voltage (V)

Rated Voltage
Working Voltage
Voltage
DC Voltage

Ripple

Time (seconds)

Calculate the permissible ripple voltage at a temperature higher than that

specified in these figures by using the following expressions:
V r.m.s. (at 50°C) = 0.7 × V r.m.s. (at 25°C)
V r.m.s. (at 85°C) = 0.5 × V r.m.s. (at 25°C)
V r.m.s. (at 125°C) = 0.3 × V r.m.s. (at 25°C)

(3) Keep the negative peak value of the ripple voltage within the permissible reverse voltage value specified in
the following section, Reverse Voltage.

3. Reverse Voltage
(1) Because the solid tantalum capacitor is of polar type,
do not apply a reverse voltage to it. If reverse voltage
cannot be avoided, it must be applied for a shor t time 6.3 V 22 µ F 1k ≅
Leakage current ( µ A)

0.020 A
and must not exceed the following values: 0.018
0.016 V
25°C ...... 10% max. of rated voltage or 3 Vdc, which- 0.014
ever is smaller 0.012
16 V 4.7 µ F
0.010
85°C ...... 5% max. of rated voltage 0.008
125°C ...... 1% max. of rated voltage Reverse 0.006
voltage
35 V 1 µ F
0.004
0.002
−8 −6 −4 −2 0
(2) The figure on the right shows the relationship between +10 +20 +30 +40
current and reverse voltage. 35 V 1 µ F
Leakage current ( µ A)

500 Forward
voltage
1000
16 V 4.7 µ F
1kΩ 1500
A
2000
V
2500
6.3 V 22 µ F

26
4. Applied Voltage
(1) For general applications, apply 70% or less of the rated voltage to the capacitor.
(2) When the capacitor is used in a power line or a low-impedance circuit, keep the applied voltage within 30%
(50% max.) of the rated voltage to avoid the adverse influence of inrush current.
(3) Derated voltage at 85°C or more.
When using a Chip-type capacitor at a temperature of 85°C or higher, calculate reduced voltage U T from
the following expression. Note, however, that the ambient temperature must not exceed 125°C.

The rated voltage ratio is as shown in the figure on the right.

U R −U C
UT = V0 (T−85)
40 100

Rated voltage (%)

Where Approx.
UR: rated voltage (V) 63%
50
UC: derated voltage at 125°C
T: ambient temperature (°C)

0
85 125
Ambient temperature (°C)

5. Current (Series Resistance)

As shown in the figure on the right, reliability is
increased by inser ting a series resistance of at
Note: Where series protective
least 3Ω/V into circuits where current flow is mo- 10 resistance of 3 Ω/V is 1
Multiple of failure rate

mentary (switching circuits, charge/discharge cir-

cuits, etc). If the capacitor is in a low-impedance
circuit, the voltage applied to the capacitor should
10
be less than 1/2 to 1/3 of the DC rated voltage.

0.1

0.1 1 10 100
Series resistance (Ω/V)
10 1 0.1 0.01
Current value (A)

6. In the Case of Short-Circuit

(1) Manganese oxide tantalum capacitor (conventional tantalum capacitor) is heated and may generate fire and be burned
depending upon its excess current, time and other factors.
(2) Conductive polymer tantalum capacitor (NeoCapacitor) is heated and may generate smoke emission depending upon
its excess current, time and other factors.

( Conductive polymer used for electrolyte is superior in insulanting the damaged portion to
manganese oxide (used in conventional tantalum capacitor). )
When designing the circuit, provide as much margin as possible to maintain capacitor reliability.

27
 NOTES ON USING THE CHIP TANTALUM CAPACITORS, EXCLUDING NeoCapacitors
1. Mounting

(1) Direct Soldering

Keep the following points in mind when soldering the capacitor by means of jet soldering or dip soldering:

(a) Temporarily fixing resin

Because chip tantalum capacitors are larger and subject to more force than chip multilayer ceramic capacitors
or chip resistors, more resin is required to temporarily secure the solid tantalum capacitors. However, if too
much resin is used, the resin adhering to the patterns on a printed circuit board may adversely affect the
solderability.

(b) Pattern design

a c a

(mm)
Case a b c
P 2.2 1.4 0.7
A2 (U), A 2.9 1.7 1.2
B3 (W), B2 (S) 3.0 2.8 1.6
B 3.3 1.9 2.4
C 4.1 2.3 2.4
D2 5.4 2.9 2.4
D 5.2 2.9 3.7

The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.

(c) Temperature and time

Keep the peak temperature and time within the following values:
Solder temperature ................... 260°C max.
Time ............................................ 5 seconds max. (10 seconds max. for SVH)
Whenever possible, perform preheating (at 150°C max.) for a smooth temperature profile. To maintain reli-
ability, mount the capacitor at low temperature and in a short time.

(d) Component layout

If many types of chip components are mounted on a printed circuit board that is to be soldered by means of
jet soldering, solderability may not be uniform over the entire board, depending on the layout and density of
the components on the board (also take into consideration generation of flux gas).

(e) Flux
Use resin-based flux. Do not use flux with strong acidity.

28
(2) Reflow Soldering
Keep the following points in mind when soldering the capacitor in a soldering oven or with a hot plate:

(a) Pattern design (in accordance with IEC1188)

(mm)
Case G Max. Z Min. X Min.
J 0.7 2.5 1.0
P 0.5 2.6 1.2
A2 (U), A 1.1 3.8 1.5
B3 (W), B2 (S) 1.4 4.1 2.7
B 2.6 5.6 2.9
C 2.9 6.9 2.7
D2 (T) 2.7 6.7 2.9
D 4.1 8.2 2.9

The above dimensions are recommended. Note that if the pattern is too big, the component may not be
mounted in place.

(b) Temperature and time

Keep the peak temperature and time within the following values:
Solder temperature ................... 260°C max.
Time ............................................ 10 seconds max.
Whenever possible, perfor m preheating (at 150°C max.) for a smooth temperature profile. To maintain
reliability, mount the capacitor at low temperature and in a shor t time. The peak temperature and time
shown above are applicable when the capacitor is to be soldered in a soldering oven or with a hot plate.
When the capacitor is soldered by means of infrared reflow soldering, the internal temperature of the ca-
pacitor may rise beyond the surface temperature.

(3) Using a Soldering Iron

When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is
very difficult. However, it is recommended that the following temperature and time be observed to maintain the
reliability of the capacitor:
Iron temperature .......................... 300°C max.
Time .............................................. 3 seconds max.
Iron power .................................... 30 W max.

29
2. Cleaning

Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many
cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and
ultrasonic cleaning, are available; cleaning methods may be used alone or two or more may be used in combination.
The temperature of the organic solvent may vary from room temperature to several 10°C, depending on the desired
effect. If cleaning is carried out with emphasis placed only on the cleaning effect, however, the marking on the
electronic component cleaned may be erased, the appearance of the component may be damaged, and, in the worst
case, the component may be functionally damaged. It is therefore recommended that the R series solid tantalum
capacitor be cleaned under the following conditions:

Recommended conditions of flux cleaning

(1) Cleaning solvent ............ Chlorosen, isopropyl alcohol
(2) Cleaning method ........... Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time ................. 5 minutes max.

Note. Ultrasonic cleaning

This cleaning method is extremelys effective for eliminating dust generated by mechanical processes, but may pose
problems depending on the condition. An experiment conducted by NEC TOKIN confirmed that the external terminals
of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. The cause of this phenom-
enon is metal fatigue of the capacitor terminals due to ultrasonic cleaning. To prevent the terminal from being cut,
decreasing the output power of the ultrasonic cleaning machine or shor tening the cleaning time may be effective.
However, it is difficult to specify the cleaning conditions because there are many factors involved, such as the
conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect
depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned, and
the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning be avoided
as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormalities occur as a result of the
cleaning. For further information, consult NEC TOKIN.

3. Other

(1) Do not subject the capacitor to excessive vibration and shock.

(2) −5 to +40°°C)
The solderability of the capacitor may be degraded by humidity. Store the capacitor at room temperature (−
and humidity (40 to 60% RH).
(3) Take care that no external force is applied to tape-packaged products (if the packaging material is deformed, the
capacitor may not be automatically mounted by a chip mounter).

30
 NOTES ON USING NeoCapacitors
1. Permissible Ripple Current
Permissible ripple current shall be derated as follows:

(1) Temperature Change

25˚C: Rating value
85˚C: 0.9 times rating value
105˚C: 0.4 times rating value

(2) Switching Frequency

100 kHz: rating value
500 kHz: 1.1 times rating value
1 MHz: 1.3 times rating value

2. Mounting
This capacitor is designed to be surface mounted by means of reflow soldering.
(The conditions under which the capacitor should be soldered with a soldering iron are explained in (2) Using
a Soldering Iron. Because the capacitor is not designed to be soldered by means of laser beam soldering, VPS,
or flow soldering, the conditions for these soldering methods are not explained in this document.

(1) Reflow Soldering

Keep the following points in mind when soldering the capacitor in a soldering oven with a hot plate:

(a) Pattern design (in accordance with IEC1188)

(mm)
Case G Max. Z Min. X Min.
J 0.7 2.5 1.0
P 0.5 2.6 1.2
A2 (U), A 1.1 3.8 1.5
B3 (W), B2 (S) 1.4 4.1 2.7
C 2.9 6.9 2.7
V, D 4.1 8.2 2.9

The above dimensions are recommended. Note that if the pattern is too big, the component may not be mounted
in place.

31
 (b) Temperature and time
Keep the peak temperature and time within the following recommended conditions.

Temperature (˚C)
280

260

240

220 Recommended
conditions

200
10 20

Time (seconds)

Whenever possible, perform preheating (at 150°C max.) for a smooth temperature profile. To maintain reliability, mount the
capacitor at low temperature and in a short time. The peak temperature and time shown above are applicable when the
capacitor is to be soldered in a soldering oven or with a hot plate. When the capacitor is soldered by means of infrared reflow
soldering, the internal temperature of the capacitor may rise beyond the surface temperature.

(2) Using a Soldering Iron

When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is
very difficult. However, it is recommended that the following temperature and time be observed to maintain the
reliability of the capacitor:

Iron temperature … 300°C max.

Time ………………… 3 seconds max.
Iron power ………… 30 W max.

3. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering.
Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor
cleaning, and ultrasonic cleaning, are available, whith may be used alone or in combination. The temperature of
the organic solvent may vary from room temperature to several 10°C, depending on the desired effect. If cleaning
is carried out with emphasis placed only on the cleaning effect, however, the marking on the electronic compo-
nent cleaned may be erased, the appearance of the component may be damaged, and, in the worst case, the
component may be functionally damaged. It is therefore recommended that the NeoCapacitor be cleaned under
the following conditions:

[Recommended conditions of flux cleaning]

(1) Cleaning solvent ............. Isopropyl alcohol
(2) Cleaning method ............ Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time .................. 5 minutes max.

Note: Ultrasonic cleaning

This cleaning method is extremely effective for eliminating dust generated by mechanical processes, but may
pose problems, depending on the condition. An experiment conducted by NEC TOKIN confirmed that the external
terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. The cause of
this phenomenon is metal fatigue of the capacitor terminals due to ultrasonic cleaning. To prevent the terminal
from being cut, decreasing the output power of the ultrasonic cleaning machine or decreasing the cleaning time
may be effective. However, it is difficult to specify safe cleaning conditions because there are many factors in-
volved, such as the conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath,
difference in cleaning effect depending on the location in the cleaning bath, the size and quantity of the printed
circuit boards to be cleaned, and the securing states of the components on the boards. It is therefore recom-
mended that ultrasonic cleaning be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormalities occur as a result of the
cleaning. For further information, contact NEC TOKIN.

32
4. Derating
Apply appropriate voltage to the capacitors according to the failure rate estimation. It is recommended that the applied
voltage be less than 80 % of the rated voltage.

5. Other
(1) Do not subject the capacitor to excessive vibration and shock.
(2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at room temperature (−5 to +40°C)
and humidity (40 to 60% RH).
(3) Take care that no external force is applied to tape-packaged products (if the packaging material is deformed, the capacitor
may not be automatically mounted by automatic insertion equipment).

33
34
The information in this document is based on documents issued in Feb. 2003 at the latest.
The information is subject to change without notice. For actual design-in, refer to the latest of
data sheets, etc., for the most up-to-date specifications of the device.

No part of this document may be copied or reproduced in any form or by any means without the
prior written consent of NEC TOKIN Corporation. NEC TOKIN Corporation assumes no respon-
sibility for any errors which may appear in this document.

NEC TOKIN Corporation does not assume any liability for infringement of patents, copyrights, or
other intellectual proper ty rights of third par ties by or arising from use of a device described
herein or any other liability arising from use of such device. No license, either express, implied,
or otherwise, is granted under any patents, copyrights, or other intellectual proper ty rights of
NEC TOKIN Corporation or others.

While NEC TOKIN Corporation has been making a continuous effort to enhance the reliability of
its electronic components, the possibility of defects cannot be eliminated entirely. To minimize
risks of damage or injury to persons or property arising from a defect in an NEC TOKIN elec-
tronic component, customers must incorporate sufficient safety measures in its design, such as
redundancy, fire-containment, and anti-failure features. NEC TOKIN devices are classified into
the following three quality grades:

"Standard," "Special," and "Specific." The Specific quality grade applies only to devices devel-
oped based on a customer-designated quality assurance program for a specific application. The
recommended applications of a device depend on its quality grade, as indicated below. Custom-
ers must check the quality grade of each device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement
equipment, audio and visual equipment, home electronic appliances, machine tools,
personal electronic equipment, and industrial robots
Special: Transpor tation equipment (automobiles, trains, ships, etc.), traffic control systems,
anti-disaster systems, anti-crime systems, safety equipment, and medical equip-
ment (not specifically designed for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control sys-
tems, life support systems, or medical equipment for life support, etc.
The quality grade of NEC TOKIN devices is "Standard" unless otherwise specified in NEC TOKIN's
data sheets or data books. If customers intend to use NEC TOKIN devices for applications other
than those specified for Standard quality grade, they should contact an NEC TOKIN sales repre-
sentative in advance.

(Note)
(1) "NEC TOKIN" as used in this statement means NEC TOKIN Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC TOKIN electronic component products" means any electronic component product de-
veloped or manufactured by or for NEC TOKIN (as defined above).

35
Grobal Sales Headquarters
5-8, Kita-Aoyama 2-chome, Minato-ku, Tokyo 107-8620, Japan
Phone:81-3-3402-6179 Fax:81-3-3402-6172
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Room 1508, Rui Jin Bldg., 205 Mao Ming Road (South), Shanghai 200020, P.R.China
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Phone:60-3-6201-0702 Fax:60-3-6201-0712
Bangkok Representative Office
No.1308, B.B.Bldg., 54 Asoke Road, Sukhumvit 21, Bangkok 10110, Thailand
Phone:66-2-260-7017 Fax:66-2-260-7016
NEC TOKIN Taiwan Co., Ltd.
Room 411, 4F, No.9, Lane 3, Ming Sheng W.Road, Taipei 104, Taiwan, R.O.C.
Phone:886-2-2521-3998 Fax:886-2-2521-3993
NEC TOKIN Europe GmbH
Hellersbergstrasse. 14, 41460 Neuss, Germany
Phone:49-2131-1866-0 Fax:49-2131-1866-18
UK Branch
ECC Berkshire House, 252-256 Kings Road, Reading, Berkshire, RG1 4HP, U.K
Phone:44-(0)-118-953-3722/3723 Fax:44-(0)-118-953-3724

© 2002 NEC TOKIN Corporation

For inquiry, Please call Sales Promotion Department (Japan)

Phone: 81-3-3402-6179 Fax: 81-3-3402-6172

http://www.nec-tokin.com
0324EDMN01VOL03E M0HP2
Printed in Japan