Infineon® Basic LED Driver

TLD1124EL
1 Channel High Side Current Source

Data Sheet
Rev. 1.0, 2013-08-08

Automotive
 TLD1124EL

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Electrical Characteristics Internal Supply / DEN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 IN_SET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 Output Current Adjustment via RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Smart Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7 ST Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.1 Diagnosis Selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2 Diagnosis Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.3 Disable Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8 Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1 Open Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2 Short Circuit to GND detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.3 Electrical Characteristics IN_SET Pin and Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9 Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.1.1 Over Load Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.1.2 Reverse Battery Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.2 Electrical Characteristics Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.1 Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
11 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
12 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Data Sheet 2 Rev. 1.0, 2013-08-08

1 Channel High Side Current Source TLD1124EL
Basic LED Driver

1 Overview
Features
• 1 Channel device with integrated output stage (current source),
optimized to drive LEDs
• Output current up to 360mA
• Low current consumption
• PWM-operation supported via VS-pin
• Output current adjustable via external low power resistor and
possibility to connect PTC resistor for LED protection during over
temperature conditions PG-SSOP14
• Reverse polarity protection
• Overload protection
• Undervoltage detection
• Open load and short circuit to GND diagnosis
• Wide temperature range: -40 °C < Tj < 150 °C
• PG-SSOP14 package with exposed heatslug
• Green Product (RoHS compliant)
• AEC Qualified

Description
The Basic LED Driver TLD1124EL is a one channel high side driver IC with integrated output stage. It is designed
to control LEDs with a current up to 360 mA. In typical automotive applications the device is capable to drive i.e.
3 red LEDs with a current up to 180 mA, which is limited by thermal cooling aspects. The output current is
controlled practically independent of load and supply voltage changes.

Table 1 Product Summary

Operating voltage VS(nom) 5.5 V… 40 V
Maximum voltage VS(max) 40 V
VOUT(max)
Nominal output (load) current IOUT(nom) 180 mA when using a supply voltage range of 8V
- 18V (e.g. Automotive car battery). Currents up
to IOUT(max) possible in applications with low
thermal resistance RthJA
Maximum output (load) current IOUT(max) 360 mA; depending on thermal resistance RthJA
Output current accuracy at RSET = 12 kΩ kLT 2250 ± 7%

Type Package Marking

TLD1124EL PG-SSOP14 TLD1124EL

Data Sheet 3 Rev. 1.0, 2013-08-08

 TLD1124EL

Overview

Protective functions
- ESD protection
- Under voltage lock out
- Over Load protection
- Over Temperature protection
- Reverse Polarity protection

Diagnostic functions
- Diagnosis enable function
- OL detection
- SC to Vs (indicated by OL diagnosis)
- SC to GND detection

Applications
Designed for exterior LED lighting applications such as tail/brake light, turn indicator, position light, side marker,...
The device is also well suited for interior LED lighting applications such as ambient lighting, interior illumination
and dash board lighting.

Data Sheet 4 Rev. 1.0, 2013-08-08

 TLD1124EL

Block Diagram

2 Block Diagram

VS
Internal
supply

DEN Diagnosis Output

enable control

Thermal
protection OUT

IN_SET Current
adjust
Status

TLD1124EL ST GND

Figure 1 Basic Block Diagram

Data Sheet 5 Rev. 1.0, 2013-08-08

 TLD1124EL

Pin Configuration

3 Pin Configuration

3.1 Pin Assignment

VS 1 14 NC

VS 2 TLD1124EL 13 NC

DEN 3 12 OUT

NC 4 EP 11 NC

NC 5 10 ST

IN_SET 6 9 GND

NC 7 8 NC

Figure 2 Pin Configuration

Data Sheet 6 Rev. 1.0, 2013-08-08

 TLD1124EL

Pin Configuration

3.2 Pin Definitions and Functions

Pin Symbol Input/ Function

Output
1, 2 VS – Supply Voltage; battery supply, connect a decoupling capacitor (100 nF -
1 µF) to GND
3 DEN I Diagnosis enable pin
4 NC – Pin not connected
5 NC – Pin not connected
6 IN_SET I/O Input / SET pin; Connect a low power resistor to adjust the output current
7 NC – Pin not connected
8 NC – Pin not connected
1)
9 GND – Ground
10 ST I/O Status pin
11 NC – Pin not connected
12 OUT O Output
13 NC – Pin not connected
14 NC – Pin not connected
1)
Exposed GND – Exposed Pad; connect to GND in application
Pad
1) Connect all GND-pins together.

Data Sheet 7 Rev. 1.0, 2013-08-08

 TLD1124EL

General Product Characteristics

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Absolute Maximum Ratings 1)

Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin for input pins (I), positive
currents flowing out of the I/O and output pins (O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Max.
Voltages
4.1.1 Supply voltage VS -16 40 V –
4.1.2 Diagnosis enable voltage DEN VDEN -16 40 V –
4.1.3 Diagn. enable voltage DEN related to VS VDEN(VS) VS - 40 VS + 16 V –
4.1.4 Diagn. enable voltage DEN related to VDEN - -16 40 V –
VOUT VOUT
VDEN - VOUT
4.1.5 Output voltage VOUT -1 40 V –
4.1.6 Power stage voltage VPS -16 40 V –
VPS = VS - VOUT
4.1.7 IN_SET voltage VIN_SET -0.3 6 V –
4.1.8 Status voltage VST -0.3 6 V –
Currents
4.1.9 IN_SET current IIN_SET – 2 mA –
– 8 Diagnosis output
4.1.10 Output current IOUT – 390 mA –
Temperatures
4.1.11 Junction temperature Tj -40 150 °C –
4.1.12 Storage temperature Tstg -55 150 °C –
ESD Susceptibility
4.1.13 ESD resistivity to GND VESD -2 2 kV Human Body
Model (100 pF via
1.5 kΩ)2)
4.1.14 ESD resistivity all pins to GND VESD -500 500 V CDM3)
4.1.15 ESD resistivity corner pins to GND VESD -750 750 V CDM3)
1) Not subject to production test, specified by design
2) ESD susceptibility, Human Body Model “HBM” according to ANSI/ESDA/JEDEC JS-001-2011
3) ESD susceptibility, Charged Device Model “CDM” according to JESD22-C101E

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.

Data Sheet 8 Rev. 1.0, 2013-08-08

 TLD1124EL

General Product Characteristics

4.2 Functional Range

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Max.
4.2.16 Supply voltage range for VS(nom) 5.5 40 V –
normal operation
4.2.17 Power on reset threshold VS(POR) – 5 V RSET = 12 kΩ
IOUT = 80% IOUT(nom)
VOUT = 2.5 V
4.2.18 Junction temperature Tj -40 150 °C –

Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.

4.3 Thermal Resistance

Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
1) 2)
4.3.1 Junction to Case RthJC – 8 10 K/W
1) 3)
4.3.2 Junction to Ambient 1s0p board RthJA1 K/W
– 61 – Ta = 85 °C
– 56 – Ta = 135 °C
1) 4)
4.3.3 Junction to Ambient 2s2p board RthJA2 K/W
– 45 – Ta = 85 °C
– 43 – Ta = 135 °C
1) Not subject to production test, specified by design. Based on simulation results.
2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to
ambient temperature). Ta = 85°C, Total power dissipation 1.5 W.
3) The RthJA values are according to Jedec JESD51-3 at natural convection on 1s0p FR4 board. The product (chip + package)
was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 70µm Cu, 300 mm2 cooling area. Total power dissipation 1.5 W
distributed statically and homogenously over power stage.
4) The RthJA values are according to Jedec JESD51-5,-7 at natural convection on 2s2p FR4 board. The product (chip +
package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 2 inner copper layers (outside 2 x 70 µm Cu, inner 2 x
35µm Cu). Where applicable, a thermal via array under the exposed pad contacted the first inner copper layer. Total power
dissipation 1.5 W distributed statically and homogenously over power stage.

Data Sheet 9 Rev. 1.0, 2013-08-08

 TLD1124EL

DEN Pin

5 DEN Pin
The DEN pin is a single function pin:

DEN
Output Control

IDEN VDEN

Figure 3 Block Diagram DEN pin

This pin is used to activate or deactivate the device internal diagnosis functions. The diagnostic functions are
described in Chapter 6.2, Chapter 7 and Chapter 8. The diagnosis is activated, if the voltage applied at the DEN
pin VDEN is higher than VDEN(act). The diagnosis is disabled for voltages below VDEN(dis).
A possibility to use the DEN pin is via a Zener diode, which is connected between VS and DEN pin. A circuit
example is shown in the application information section Chapter 10.
The diagnosis is activated, if the following condition is fulfilled:

V S ≥ VDEN ( act ) + VZD (1)

The current consumption on the DEN pin has to be considered for the total device current consumption. The
current is specified in Pos. 5.1.8. The typical current consumption IDEN(H) as a function of the supply voltage VS for
a Zener diode voltage of VZD = 6 V is shown in the following diagram.

Typical IDEN=f(VS) with (VS-VDEN)=6V

160

140

120

100
IDEN [µA]

80 Tj=-40°C
Tj=25°C
60
Tj=150°C

40

20

0
0 2 4 6 8 10 12 14 16 18
VS [V]

Figure 4 Typical IDEN(H) current for a Zener diode voltage of 6V

The device and channel turn on is independent of the VDEN-voltage. After applying a supply voltage the device is
activated after the power on reset time tPOR.

Data Sheet 10 Rev. 1.0, 2013-08-08

 TLD1124EL

DEN Pin

VS

IOU T tPOR

100%

80%

Figure 5 Power on reset

The DEN voltage VDEN does not influence the disable function via the ST pin. If VDEN < VDEN(dis) the device can still
be disabled via the ST pin, if VST > VST(H). For details, please refer to Chapter 7.3.

5.1 Electrical Characteristics Internal Supply / DEN Pin

Electrical Characteristics Internal Supply / DEN pin

Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSET = 12 kΩ all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
5.1.1 Current consumption, IS(on) – – 1.9 mA 1)
IIN_SET = 0 µA
active mode Tj < 105 °C
VS = 18 V
VOUT = 3.6V
5.1.2 Current consumption, IS(dis,ST) – – 1.7 mA 1)
VS = 18 V
device disabled via ST Tj < 105 °C
VST = 5 V
1)
5.1.3 Current consumption, IS(dis,IN_SET) – – 1.7 mA VS = 18 V
device disabled via IN_SET Tj < 105 °C
VIN_SET = 5 V
1)
5.1.4 Current consumption, IS(fault,STu) – – 2.1 mA VS = 18 V
active mode in fault Tj < 105 °C
detection condition with ST- RSET = 12 kΩ
pin unconnected VOUT = 18 V or 0 V
1)
5.1.5 Current consumption, IS(fault,STG) – – 6.2 mA VS = 18 V
active mode in fault Tj < 105 °C
detection condition with ST- RSET = 12 kΩ
pin connected to GND VOUT = 18 V or 0 V
VST = 0 V

Data Sheet 11 Rev. 1.0, 2013-08-08

 TLD1124EL

DEN Pin

Electrical Characteristics Internal Supply / DEN pin (cont’d)

Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSET = 12 kΩ all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
5.1.6 Power-on reset delay time 2) tPOR – – 25 µs 3)
VS = 0 → 13.5 V
VOUT(nom) = 3.6 ± 0.3V
IOUT = 80% IOUT(nom)
5.1.7 Required supply voltage for VS(CC) – – 5.5 V VOUT = 3.6 V
current control IOUT ≥ 90% IOUT(nom)
5.1.8 DEN high input current IDEN(H) mA Tj < 105 °C
– – 0.1 VS = 13.5 V, VDEN = 5.5 V
– – 0.1 VS = 18 V, VDEN = 5.5 V
– – 0.2 VS = 18 V, VDEN = 12 V
– – 0.4 VS = VDEN = 18 V
5.1.9 DEN activation threshold VDEN(act) 2.45 – 3.2 V VS = 8...18 V
(diagnosis enabled above
VDEN(act))
5.1.10 DEN deactivation threshold VDEN(dis) 1.5 – 2.3 V VS = 8...18 V
(diagnosis disabled below
VDEN(dis))
1) The total device current consumption is the sum of the currents IS and IDEN(H), please refer to Pos. 5.1.8
2) See also Figure 4
3) Not subject to production test, specified by design

Data Sheet 12 Rev. 1.0, 2013-08-08

 TLD1124EL

IN_SET Pin

6 IN_SET Pin
The IN_SET pin is a multiple function pin for output current definition, input and diagnostics:

Logic

IN_SET high impedance

IIN_SET

VIN_SET VIN_SET(OL/SC)

GND

Figure 6 Block Diagram IN_SET pin

6.1 Output Current Adjustment via RSET

The current adjustment can be done by placing a low power resistor (RSET) at the IN_SET pin to ground. The
dimensioning of the resistor can be done using the formula below:

k-
R SET = ---------- (2)
I OUT
The gain factor k (RSET * output current) is specified in Pos. 9.2.4 and Pos. 9.2.5. The current through the RSET is
defined by the resistor itself and the reference voltage VIN_SET(ref), which is applied to the IN_SET during supplied
device.

6.2 Smart Input Pin

The IN_SET pin can be connected via RSET to the open-drain output of a µC or to an external NMOS transistor as
described in Figure 7 This signal can be used to turn off the output stage of the IC. A minimum IN_SET current
of IIN_SET(act) is required to turn on the output stage. This feature is implemented to prevent glimming of LEDs
caused by leakage currents on the IN_SET pin, see Figure 10 for details. In addition, the IN_SET pin offers the
diagnostic feedback information, if the status pin is connected to GND and VDEN > VDEN(act) (refer to Chapter 5).
Another diagnostic possibility is shown in Figure 8, where the diagnosis information is provided via the ST pin
(refer to Chapter 7 and Chapter 8) to a micro controller In case of a fault event with the ST pin connected to GND
the IN_SET voltage is increased to VIN_SET(OL/SC) Pos. 8.3.2. Therefore, the device has two voltage domains at the
IN_SET-pin, which is shown in Figure 11.

Data Sheet 13 Rev. 1.0, 2013-08-08

 TLD1124EL

IN_SET Pin

Microcontroller
(e.g. XC866)

RSET/2 RSET/2 Current

OUT IN_SET adjust

Status
Basic LED Driver ST GND
IN
VDDP = 5 V

Figure 7 Schematics IN_SET interface to µC, diagnosis via IN_SET pin

Microcontroller
(e.g. XC866)

RSET Current
OUT IN_SET adjust

Status
Basic LED Driver
ST GND
IN
VDDP = 5 V optional

Figure 8 Schematics IN_SET interface to µC, diagnosis via ST pin

The resulting switching times are shown in Figure 9:

IIN_ SET

tON (IN_ SET ) tOFF(IN _ SET) t

IOU T

100%
80%

20%

Figure 9 Switching times via IN_SET

Data Sheet 14 Rev. 1.0, 2013-08-08

 TLD1124EL

IN_SET Pin

IOUT [mA]

k = IOUTx * VIN_SET(ref) / IIN_SETx

IOUTx

IIN_SET(ACT) IIN_SETx IIN_SET [µA]

Figure 10 IOUT versus IINSET

V IN_ SET
VIN _SET( OL /SC)m ax

Diagnostic voltage range

V IN_ SET(OL /SC) m in

VIN _SET (ref ) m ax

Normal operation and high temperature current
reduction range

Figure 11 Voltage domains for IN_SET pin, if ST pin is connected to GND

Data Sheet 15 Rev. 1.0, 2013-08-08

 TLD1124EL

ST Pin

7 ST Pin
The ST pin is a multiple function pin.

IST(OL/SC)

VST(OL/SC)
No fault Fault
Output Control
ST

No fault Fault
VST

IST(PD)

Figure 12 Block Diagram ST pin

7.1 Diagnosis Selector

If the voltage at the DEN pin VDEN is higher than VDEN(act), the diagnosis is activated. For details, please refer to
Chapter 5. If the status pin is unconnected or connected to GND via a high ohmic resistor (VST to be below VST(L)),
the ST pin acts as diagnosis output pin. In normal operation (device is activated) the ST pin is pulled to GND via
the internal pull down current IST(PD). In case of an open load or short circuit to GND condition the ST pin is switched
to VST(OL/SC) after the open load or short circuit detection filter time (Pos. 8.3.9, Pos. 8.3.12).
If the device is operated in PWM operation via the VS pin the ST pin should be connected to GND via a high ohmic
resistor (e.g. 470kΩ) to ensure proper device behavior during fast rising VS slope.
If the ST pin is shorted to GND the diagnostic feedback is performed via the IN_SET-pin, which is shown in
Chapter 6.2 and Chapter 8.

7.2 Diagnosis Output

If the status pin is unconnected or connected to GND via a high ohmic resistor (VST to be below VST(L)), it acts as
a diagnostic output, if the voltage at the DEN pin is above VDEN(act). In case of a fault condition the ST pin rises its
voltage to VST(OL/SC) (Pos. 8.3.7). Details are shown in Chapter 8.

7.3 Disable Input

If an external voltage higher than VST(H) (Pos. 8.3.5) is applied to the ST pin, the device is switched off. This
function is working independently of the voltage at the DEN pin. Even if the diagnosis is disabled via
VDEN < VDEN(dis) the disable function of the ST pin is working. This function is used for applications, where multiple
drivers should be used for one light function. It is possible to combine the drivers’ fault diagnosis via the ST pins.
If a single LED chain fails, the entire light function is switched off. In this scenario e.g. the diagnostic circuit on the
body control module can easily distinguish between the two cases (normal load or load fault), because nearly no
current is flowing into the LED module during the fault scenario - the drivers consume a current of IS(fault,STu)
(Pos. 5.1.4) or IS(dis,ST) (Pos. 5.1.2).

Data Sheet 16 Rev. 1.0, 2013-08-08

 TLD1124EL

ST Pin

As soon as one LED chain fails, the ST-pin of this device is switched to VST(OL/SC). The other devices used for the
same light function can be connected together via the ST pins. This leads to a switch off of all devices connected
together. Application examples are shown in Chapter 10.

V ST

tON (ST) tOFF( ST) t

IOU T

100%
80%

20%

Figure 13 Switching times via ST Pin

Data Sheet 17 Rev. 1.0, 2013-08-08

 TLD1124EL

Load Diagnosis

8 Load Diagnosis
The diagnosis function is enabled, if the voltage at the DEN pin VDEN is above VDEN(act) as described in Chapter 5.

8.1 Open Load

An open load diagnosis feature is integrated in the TLD1124EL driver IC. If there is an open load on the output,
the output is turned off. The potential on the IN_SET pin rises up to VIN_SET(OL/SC). This high voltage can be used
as input signal for an µC as shown in Figure 8. The open load status is not latched, as soon as the open load
condition is no longer present, the output stage will be turned on again. An open load condition is detected, if the
voltage drop over the output stage VPS is below the threshold according Pos. 8.3.10 and a filter time of tOL is
passed.

V IN_ SET
VIN _SET( OL /SC)

VIN_ SET( ref )

tOL tIN _SET (re se t) t

VOU T

VS
V S – VPS(OL )

VF

open load open load

occurs disappears

t
Figure 14 IN_SET behavior during open load condition with ST pin connected to GND and VDEN > VDEN(act)

Data Sheet 18 Rev. 1.0, 2013-08-08

 TLD1124EL

Load Diagnosis

VIN _SET

VIN _SET( ref )

t
VST
V ST( OL /SC)

tOL tIN_ SET(re se t) t

VOU T
VS
VS – VPS( OL)

VF

open load open load

occurs disappears
t
Figure 15 IN_SET and ST behavior during open load condition (ST unconnected) and VDEN > VDEN(act)

8.2 Short Circuit to GND detection

The TLD1124EL has an integrated SC to GND detection. If the output stage is turned on and the voltage at the
output falls below VOUT(SC) the potential on the IN_SET pin is increased up to VIN_SET(OL/SC) after tSC, if the ST pin
is connected to GND. If the ST is open or connected to GND via a high ohmic resistor the fault is indicated on the
ST pin according to Chapter 7 after tSC. More details are shown in Figure 17. This condition is not latched. For
detecting a normal condition after a short circuit detection an output current according to IOUT(SC) is driven by the
channel.

Data Sheet 19 Rev. 1.0, 2013-08-08

 TLD1124EL

Load Diagnosis

VIN _SET
VIN _SET( OL /SC)

VIN _SET (ref )

tSC tIN_ SET( re se t) t

VOU T

VF

VOUT (SC)

short circuit short circuit

occurs disappears
Figure 16 IN_SET behavior during short circuit to GND condition with ST connected to GND and VDEN >
VDEN(act)

V IN_ SET

V IN_ SET(ref )

t
V ST
VST (OL /SC)

tSC tIN _SET (re se t) t

V OU T

VF

V OUT (SC)

short circuit short circuit

occurs disappears
Figure 17 IN_SET and ST behavior during short circuit to GND condition (ST unconnected) and VDEN >
VDEN(act)

Data Sheet 20 Rev. 1.0, 2013-08-08

 TLD1124EL

Load Diagnosis

8.3 Electrical Characteristics IN_SET Pin and Load Diagnosis

Electrical Characteristics IN_SET pin and Load Diagnosis

Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSET = 12 kΩ, VDEN = 5.5 V, all voltages
with respect to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and
output pins (O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
1)
8.3.1 IN_SET reference VIN_SET(ref) 1.19 1.23 1.27 V VOUT = 3.6 V
voltage Tj = 25...115 °C
1)
8.3.2 IN_SET open load/short VIN_SET(OL/SC) 4 – 5.5 V VS > 8 V
circuit voltage Tj = 25...150 °C
VS = VOUT (OL) or VOUTx
= 0 V (SC)
1)
8.3.3 IN_SET open load/short IIN_SET(OL/SC) 1.5 – 7.4 mA VS > 8 V
circuit current Tj = 25...150 °C
VIN_SET = 4 V
VS = VOUT (OL) or VOUT =
0 V (SC)
8.3.4 ST device turn on VST(L) 0.8 – – V –
threshold (active low) in
case of voltage applied
from external (ST-pin
acting as input)
8.3.5 ST device turn off VST(H) – – 2.5 V –
threshold (active low) in
case of voltage applied
from external (ST-pin
acting as input)
8.3.6 ST pull down current IST(PD) – – 15 µA VST= 0.8 V
1)
8.3.7 ST open load/short VST(OL/SC) 4 – 5.5 V VS > 8 V
circuit voltage (ST-pin Tj = 25...150 °C
acting as diagnosis RST = 470 kΩ
output) VS = VOUT (OL) or VOUT =
0 V (SC)
1)
8.3.8 ST open load/short IST(OL/SC) 100 – 220 µA VS > 8 V
circuit current (ST-pin Tj = 25...150 °C
acting as diagnosis VST = 2.5 V
output) VS = VOUT (OL) or VOUT =
0 V (SC)
1)
8.3.9 OL detection filter time tOL 10 22 35 µs VS > 8 V
8.3.10 OL detection voltage VPS(OL) 0.2 – 0.4 V VS > 8 V
VPS(OL) = VS - VOUT
8.3.11 Short circuit to GND VOUT(SC) 0.8 – 1.4 V VS > 8 V
detection threshold
1)
8.3.12 SC detection filter time tSC 10 22 35 µs VS > 8 V
1)
8.3.13 IN_SET diagnosis reset tIN_SET(reset) – 5 20 µs VS > 8 V
time

Data Sheet 21 Rev. 1.0, 2013-08-08

 TLD1124EL

Load Diagnosis

Electrical Characteristics IN_SET pin and Load Diagnosis (cont’d)

Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSET = 12 kΩ, VDEN = 5.5 V, all voltages
with respect to ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and
output pins (O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
8.3.14 SC detection current in IOUT(SC,STu) 100 200 300 µA VS > 8 V
case of unconnected ST- VOUT= 0 V
pin
8.3.15 SC detection current in IOUT(SC,STG) 0.1 2 4.75 mA VS > 8 V
case of ST-pin shorted to VOUT= 0 V
GND VST = 0 V
8.3.16 IN_SET activation IIN_SET(act) 2 – 15 µA See Figure 10
current without turn on of
output stage
1) Not subject to production test, specified by design

Data Sheet 22 Rev. 1.0, 2013-08-08

 TLD1124EL

Power Stage

9 Power Stage
The output stage is realized as high side current source with a current of 360 mA. During off state the leakage
current at the output stage is minimized in order to prevent a slightly glowing LED.
The maximum current of the channel is limited by the power dissipation and used PCB cooling areas (which results
in the applications RthJA).
For an operating current control loop the supply and output voltages according to the following parameters have
to be considered:
• Required supply voltage for current control VS(CC), Pos. 5.1.7
• Voltage drop over output stage during current control VPS(CC), Pos. 9.2.6
• Required output voltage for current control VOUT(CC), Pos. 9.2.7

9.1 Protection
The device provides embedded protective functions, which are designed to prevent IC destruction under fault
conditions described in this data sheet. Fault conditions are considered as “outside” normal operating range.
Protective functions are neither designed for continuous nor for repetitive operation.

9.1.1 Over Load Behavior

An over load detection circuit is integrated in the Basic LED Driver IC. It is realized by a temperature monitoring
of the output stage (OUT).
As soon as the junction temperature exceeds the current reduction temperature threshold Tj(CRT) the output current
will be reduced by the device by reducing the IN_SET reference voltage VIN_SET(ref). This feature avoids LED’s
flickering during static output overload conditions. Furthermore, it protects LEDs against over temperature, which
are mounted thermally close to the device. If the device temperature still increases, the output current decreases
close to 0 A. As soon as the device cools down the output current rises again.

IOU T
V IN_ SET

Tj (C R T) Tj

Figure 18 Output current reduction at high temperature

Note: This high temperature output current reduction is realized by reducing the IN_SET reference voltage voltage
(Pos. 8.3.1). In case of very high power loss applied to the device and very high junction temperature the
output current may drop down to IOUT = 0 mA, after a slight cooling down the current increases again.

9.1.2 Reverse Battery Protection

The TLD1124EL has an integrated reverse battery protection feature. This feature protects the driver IC itself, but
also connected LEDs. The output reverse current is limited to IOUTx(rev) by the reverse battery protection.

Data Sheet 23 Rev. 1.0, 2013-08-08

 TLD1124EL

Power Stage

Note: Due to the reverse battery protection a reverse protection diode for the light module may be obsolete. In case
of high ISO-pulse requirements and only minor protecting components like capacitors a reverse protection
diode may be reasonable. The external protection circuit needs to be verified in the application.

9.2 Electrical Characteristics Power Stage

Electrical Characteristics Power Stage

Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUT = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
9.2.1 Output leakage current IOUT(leak) µA IIN_SET = 0 µA
VOUT = 2.5 V
Tj = 150 °C
1)
– – 21 Tj = 85 °C
– – 9
1)
9.2.2 Output leakage current in -IOUT(leak,B2B) – – 150 µA IIN_SET = 0 µA
boost over battery setup VOUT = VS = 40 V
1)
9.2.3 Reverse output current -IOUT(rev) – – 3 µA VS = -16 V
Output load: LED with
break down voltage
< - 0.6 V
1)
9.2.4 Output current accuracy kLT Tj = 25...115 °C
limited temperature range VS = 8...18 V
VPS = 2 V
2092 2250 2408 RSET = 12 kΩ
1800 2250 2700 RSET = 30 kΩ
1)
9.2.5 Output current accuracy kALL Tj = -40...115 °C
over temperature VS = 8...18 V
VPS = 2 V
1980 2250 2520 RSET = 6...12 kΩ
1710 2250 2790 RSET = 30 kΩ
1)
9.2.6 Voltage drop over power VPS(CC) 0.75 – – V VS = 13.5 V
stage during current control RSET = 12 kΩ IOUT ≥ 90%
VPS(CC) = VS - VOUT of (kLT(typ)/RSET)
1)
9.2.7 Required output voltage for VOUT(CC) 2.3 – – V VS = 13.5 V
current control RSET = 12 kΩ IOUT ≥ 90%
of (kLT(typ)/RSET)
9.2.8 Maximum output current IOUT(max) 360 – – mA RSET = 4.7 kΩ
The maximum output
current is limited by the
thermal conditions.
Please refer to
Pos. 4.3.1 - Pos. 4.3.3

Data Sheet 24 Rev. 1.0, 2013-08-08

 TLD1124EL

Power Stage

Electrical Characteristics Power Stage (cont’d)

Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUT = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
2)
9.2.9 ST turn on time tON(ST) – – 15 µs VS = 13.5 V
RSET = 12 kΩ
ST → L
IOUT = 80% of
(kLT(typ)/RSET)
2)
9.2.10 ST turn off time tOFF(ST) – – 10 µs VS = 13.5 V
RSET = 12 kΩ
ST → H
IOUT = 20% of
(kLT(typ)/RSET)
9.2.11 IN_SET turn on time tON(IN_SET) – – 15 µs VS = 13.5 V
IIN_SET = 0 → 100 µA
IOUT = 80% of
(kLT(typ)/RSET)
9.2.12 IN_SET turn off time tOFF(IN_SET) – – 10 µs VS = 13.5 V
IIN_SET = 100 → 0 µA
IOUT = 20% of
(kLT(typ)/RSET)
1)
9.2.13 Current reduction Tj(CRT) – 140 – °C IOUT = 95% of
temperature threshold (kLT(typ)/RSET)
1)
9.2.14 Output current during IOUT(CRT) 85% of – – A RSET = 12 kΩ
current reduction at high (kLT(typ)/ Tj = 150 °C
temperature RSET)
1) Not subject to production test, specified by design
2) see also Figure 13

Data Sheet 25 Rev. 1.0, 2013-08-08

 TLD1124EL

Application Information

10 Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.

VBATT C mo d=2.2µF
Light C VS=4.7nF

module VS

Internal
ISO-Pulse supply
protection circuit
depending on DEN Diagnosis Output
requirements
4.7nF**
enable control

Thermal
Microcontroller protection OUT
(e.g. XC866)
RSET
OUT IN_SET Current
adjust
Status

Basic LED Driver ST GND

IN
Eventually to other
Basic LED Driver
470kΩ*
CST =100pF**
* In case PWM via VS is performed.
** For EMI improvement, if required.

Figure 19 Application Diagram

Note: This is a very simplified example of an application circuit. In case of high ISO-pulse requirements a reverse
protection diode may be used for LED protection. The function must be verified in the real application.

10.1 Further Application Information

• For further information you may contact http://www.infineon.com/

Data Sheet 26 Rev. 1.0, 2013-08-08

 TLD1124EL

Package Outlines

11 Package Outlines

0.35 x 45˚
3.9 ±0.11) 0.1 C D
Stand Off

1.7 MAX.
0 ... 0.1

0.19 +0.06
(1.45)

8˚ MAX.
C 0.08 C
0.65 0.64 ±0.25

0.25 ±0.05 2) 6 ±0.2

0.15 M C A-B D 14x D 0.2 M D 8x

Bottom View
3 ±0.2
A

2.65 ±0.2
14 8 1 7

1 7 Exposed 14 8
B
Diepad
0.1 C A-B 2x
4.9 ±0.11)
Index Marking

1) Does not include plastic or metal protrusion of 0.15 max. per side
Dimensions in mm
2) Does not include dambar protrusion
PG-SSOP-14-1,-2,-3-PO V02

Figure 20 PG-SSOP14

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages.

Data Sheet 27 Rev. 1.0, 2013-08-08

 TLD1124EL

Revision History

12 Revision History

Revision Date Changes

1.0 2013-08-08 Inital revision of data sheet

Data Sheet 28 Rev. 1.0, 2013-08-08

Edition 2013-08-08
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.

Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.

Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).

Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
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