1.-Introduction To Microsystem Fabrication and Integration

Máster Universitario en Ingeniería de Sistemas
Electrónicos y Aplicaciones - MISEA
Microsystems and Nanoelectronics

SESSION 1: Introduction to Microsystems Fabrication and Integration
MISEA http://www.uc3m.es/misea
U C 3 M Microsystems and Nanoelectronics 1
Session 1. Introduction to Microsystem Design and
Fabrication
A. Introduction to Microsystems.
B. Introduction to Microsystem Fabrication.
C. Integration and Packaging.
D. New Materials and Fabrication Processes.
Microsystems vs. MEMS
• Usually both terms described the same type of components.

• Microsystems is more used in Europe, while MEMS (Microelectromechanical
Systems) is the American name, and increasingly in use in Europe (more
catchy).
What are the actual characteristics of Microsystems?
• Small size (obviously).

• Involve both electronic and non-electronic (mechanical, optical, thermal, …)
components. Different “Energy Domains” present.
• Fabrication using integrate circuit (IC) batch processing techniques allowing
for monolithic integration as well as mass fabrication.
• They are typically “systems” in the true sense, as they integrate different
components and subsystems to achieve the required functionality.

MEMS are everywhere nowadays
MEMS are everywhere nowadays
Microsystems vs. Macroscopic electromechanical sensors
• Advantages: higher sensitivity, lower noise, lower power consumption, …

• Different fabrication Approach: MICROMACHINING
• New format of Devices and Products: DISRUPTIVE NEW ELECTRONIC
COMPONENTS.
Miniaturization. Scaling Laws.
• Scaling laws are used to evaluate how different physical phenomena behave
at different sizes. Not always smaller is better.
• Use of characteristic length scale for the different devices.
How Small is Micro?
• Technological limits (micromachining techniques).

• Physical limits (nanotechnology).
Microsystem Architecture (Example)
Microsystem Components. Transducers and Energy Domains
• TRANSDUCER: Device that transforms signals or power from one energy

domain to another (one form of energy into another). The term transducer can
therefore be used to include both sensors and actuators and is the most
generic and widely used term in Microsystems.
Energy domains and examples of associated magnitudes

Mechanical Thermal Radiative Chemical Magnetic Electrical
force, temperature, electromagnetic wave, concentration, field intensity, voltage, current,
pressure, entropy, intensity, phase, composition, flux density, charge,
velocity, heat, wavelength, polarization, reaction rate magnetic resistance,
acceleration, heat flow reflectance, refractive moment, capacitance,
position index, transmittance permeability polarization
Microsystem Components. Sensors and Actuators
• SENSOR: Device that measures information from a surrounding environment

and provides an electrical output signal in response to the parameter it
measured.
• Sensitivity
• Linearity
• Accuracy
• Precision
• Resolution
• Noise (Thermal, Shot, Flicker)
• Dynamic Range
• Bandwidth
• Stability (drift)
• Reliability (Harsh Environments)
• ……….
Microsystem Components. Sensors and Actuators
• ACTUATOR: Device that converts an electrical signal into an action. It can

create a force to manipulate itself, other mechanical devices, or the
surrounding environment to perform some useful function.
• Torque and force output capacity

• Range of motion
• Dynamic response (speed and bandwidth)
• Linearity
• Power Consumption
• Stability (Environmental constrains)
• ……..
Historical overview
2012-2019 MEMS (Microsystems) Market forecast as April 2014 (US $M)
2012-2019 MEMS (Microsystems) Market forecast as April 2014 (US $M)
Microsystem Fabrication
• Technologies used to prototype and manufacture microsystem devices.
• Microsystem Fabrication represent a paradigm shift from traditional

machining and manufacturing
Use of Integrated Circuit technologies to fabricate “moving”

Parts. Evolution from the IC industry
• The Micromachining “tool box” (portfolio of microsystem fabrication

techniques) is rapidly expanding.
IMPOSSIBLE EVEN TO “REVIEW” ALL OF THEM
Integrated Circuit Technology
• Use of Silicon wafers and

several processes to
obtain integrated circuits
• Use of the same processes

and techniques to develop
microsystems
Integrated Circuit Technology
Overview of Frequently used IC processes for microfabrication
• Additive Processes:
• Metal Evaporation
• Metal Sputtering
• Chemical Vapor Deposition (CVD) of organic and inorganic materials.
• Plasma Assisted CVD
• Thermal oxidation
• Plating
• Subtractive Processes:
• Plasma Etching
• Reactive ion Etching (RIE)
• Deep Reactive Ion Etching (DRIE)
• Wet Chemical etching of Silicon and thin films
• Patterning:
• Deposition of Photoresist
• Photolithography
• Material Modification:
• Ion implantation
• Diffusion Doping
• Thermal Annealing
• Mechanical Steps:
• Polishing
• Wafer bonding
• Wafer dicing
• Wire bonding
• Chip packaging
• Thin film deposition: Incorporation of functional materials (conductors

and insulators) on a wafer through additive deposition process
• Direct transfer of material using metal evaporation or metal sputtering.
• Thin film deposition: Incorporation of functional materials (conductors

and insulators) on a wafer through additive deposition process
• Chemical Vapor deposition (CVD) and related techniques. Two or more

active species arrive at the vicinity of the wafer surface and under
favorable conditions (heating, plasma,…) they react to produce a solid
phase absorbed onto the wafer. The byproducts are removed by the
surrounding media.
• Thermal oxidation of silicon: Silicon dioxide (SiO2) is an important

insulating layer for microelectronics and microsystems. Several methods
are used, the most important being reacting silicon wafers with oxygen at
high temperature.
• Photolithography: Use of photo-sensitive chemical (photoresists) and

proper illumination through a mask to produce fine features on wafer
surfaces.
• Wet Etching: We identify etching as the process to remove materials:

metal, dielectrics, semiconductors, polymers and functional materials.
When we use a chemical to remove the material we talk about wet
etching. The etching may be isotropic of anisotropic. Masking materials
are used to selectively remove the material on the desired locations
• Plasma Etching (Dry Etching): Accelerated ions are launched to the

(grounded) wafer. Both chemical and physical processes my be present.
In general, physical etching is more directional and anisotropic. Chemical
etching is isotropic and material selective.
• Reactive Ion Etching (RIE). Another dry etching technique where the
wafer is connected to and electrode under AC excitation . Deep Reactive
ion etching (DRIE) process is a special class or RIE allowing deep
trenches and vertical, smooth sidewalls.
• Doping: Process of planting dopant atoms into the host semiconductor

lattice in order to change the electrical characteristics of the host material.
• The doping procedure is always performed on top surfaces of the wafer and
the implanted ions are subsequently diffused under high temperature.
• In this sense, high temperature encountered by a wafer during a process,
even after the doping process, can cause dopant redistribution and
changes in electrical characteristics.
• Wafer Dicing: A wafer contains

many dies (components) that
have to be broken into separate
pieces before packaging.
• Wafer Bonding: A very versatile

technique that allows wafers with
disparate materials, surface profiles and
functional characteristics to be joined
to form unique structures.
Example of Microelectronics fabrication process flow
Silicon-based Micromachining Processes
• Microsystems were first developed on silicon wafers due to the

availability of very mature processing techniques.
• Bulk Micromachining: Involve selectively removing the bulk (silicon

substrate) , material in order to form certain three-dimensional features
on mechanical elements, such as beams and membranes.
• Surface Micromachining: Free-standing, mechanical elements can be

created by removing and underlying place-holding thin film layer, instead
of the substrate underneath. This space layer is called the sacrificial
layer, and it is the primary characteristic of a surface micromachining
process.
• Bulk Micromachining
• Bulk Micromachining
• Surface Micromachining
• Surface Micromachining
C. Integration and Packaging
Integration and Integration Options
• Integration: Act of combining the mechanical and electrical

functionalities (associated to different elements).
• In the purest definition of Microsystems, the circuits and the
mechanical elements would be co-fabricated monolithically on the
same silicon die, but in practice there are several options
• Wafer-level Integration: Micromechanical components and integrated

circuits are either placed on the same wafer (monolithic) or integrated
through die attachment (wafer bonding).
• Elements placed side by side (e.g. Analog Devices Accelerometers)
• Top-bottom (e.g. digital micro mirror arrays)
Wafer-level integration
• Chip-level Integration: Micromechanical and circuit dies are made

separately. The dies are inserted into the same package and connected
electrically using wire-bonding. This is also called multiple-chip-module
(MCM) approach.
• Board-level Integration: In this scheme micromechanical packages and

circuit packages are connected on the circuit board.
• Chip-level Integration:
• Board-level Integration:
Packaging
• Act of placing loose (diced) chips into human or machine tractable

modules that can be directly assembled on circuit boards and into
systems.
• Generally, packaging involves dicing, die assembly encapsulation and

testing and it is a crucial technological issue.
• Encapsulation refers to the act of placing the devices into hermetically

stable and safe environment (package) as Microsystems and electronic
devices cannot work in open (atmosphere) environments.
NEVER OVERLOOK THE IMPORTANCE ON INTEGRATION AND PACKAGING

WHEN DESIGNING MICROSYSTEMS (30-90% OF THE FINAL COST)
D. New Materials and Fabrication Processes
New Materials: Polymers and compound semiconductors.
• Polymers materials are being incorporated into microsystems because of

their unique materials properties (biocompatibility, optical transparency),
processing techniques and low cost compared to silicon.
• Examples of polymers already used for microsystems include Polyimide,

SU-8, Liquid Crystal Polymer, PDMS, Teflon and Parylene. They are
mainly used in microfluidics applications.
• Other inorganic materials are also being used for microsystems. SiC
(silicon Carbide) has found applications in several applications in harsh
environments. Also GaAs has been used.
New Materials: Example
• Use of PDMS (Polydimethylsiloxane) for microfluidic channel fabrication.
New Fabrication Processes
• New processes for microsystems are appearing everyday: laser-assisted

etching, local electrochemical deposition, high aspect ratio DRIE, Focus
Ion Beam (FIB) etching, X-ray etching, micro milling, ink jet printing,…..
• A very promising technique nowadays under investigation is the 3D

printing of microsystems (additive manufacturing technologies). Such
3D printing of polymers and metals have a large impact in many sectors,
and could lead to the possibility of design and fabricate micro- and nano-
systems, sensors and photonic components in low volumes at affordable
costs.
New Fabrication Processes: 3D Printing
• Both additive and subtractive processes supported

• Different materials
• Microlenses array
New Fabrication Processes: 3D Printing
• Complex 3D structures
SUMMARY
• Microsystems (MEMS) are now part of many electronic devices and their
growth rate (per year) is in double digits, finding applications in many
areas and increasing presence in the most important markets.
• Microsystem Fabrication has been traditionally based on Integrated

Circuit technology (Silicon based), adopting the standard technological
process for the development of (micro) mechanical components.
• Integration and Packaging of microsystems are fundamental steps on

MEMs fabrication.
• This is a rapidly evolving technological field with new materials and

processes appearing everyday, and new disruptive processes and
component are clearly envisaged in the new future.
RERERENCES AND BIBLIOGRAPHY
• Foundations of MEMS (Second Edition). Chang Liu. Prentice Hall (2012)
• Microsystem Design. Stephen D. Senturia. Springer (2001)
• Practical MEMS. Ville Kaajakari. Small Gear Publishing (2009)
• Micro Electro Mechanical System Design. James J. Allen. CRC (2005)
• http://www.memscentral.com
• http://compliantmechanisms.byu.edu/content/introduction-
microelectromechanical-systems-mems
• http://www.lboro.ac.uk/microsites/mechman/research/ipm-
ktn/pdf/Technology_review/an-introduction-to-mems.pdf
• http://www.memsjournal.com

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Máster Universitario en Ingeniería de Sistemas

Electrónicos y Aplicaciones - MISEA

Microsystems and Nanoelectronics

Microsystems vs. MEMS

• Usually both terms described the same type of components.

What are the actual characteristics of Microsystems?

• Small size (obviously).

components and subsystems to achieve the required functionality.

MEMS are everywhere nowadays

MEMS are everywhere nowadays

Microsystems vs. Macroscopic electromechanical sensors

• Advantages: higher sensitivity, lower noise, lower power consumption, …

Miniaturization. Scaling Laws.

How Small is Micro?

• Technological limits (micromachining techniques).

Microsystem Architecture (Example)

Microsystem Components. Transducers and Energy Domains

• TRANSDUCER: Device that transforms signals or power from one energy

Energy domains and examples of associated magnitudes

Microsystem Components. Sensors and Actuators

• SENSOR: Device that measures information from a surrounding environment

Microsystem Components. Sensors and Actuators

• ACTUATOR: Device that converts an electrical signal into an action. It can

• Torque and force output capacity

2012-2019 MEMS (Microsystems) Market forecast as April 2014 (US $M)

2012-2019 MEMS (Microsystems) Market forecast as April 2014 (US $M)

• Technologies used to prototype and manufacture microsystem devices.

• Microsystem Fabrication represent a paradigm shift from traditional

Use of Integrated Circuit technologies to fabricate “moving”

• The Micromachining “tool box” (portfolio of microsystem fabrication

IMPOSSIBLE EVEN TO “REVIEW” ALL OF THEM

Integrated Circuit Technology

• Use of Silicon wafers and

• Use of the same processes

Integrated Circuit Technology

Overview of Frequently used IC processes for microfabrication

Overview of Frequently used IC processes for microfabrication

Overview of Frequently used IC processes for microfabrication

• Thin film deposition: Incorporation of functional materials (conductors

• Direct transfer of material using metal evaporation or metal sputtering.

Overview of Frequently used IC processes for microfabrication

• Thin film deposition: Incorporation of functional materials (conductors

• Chemical Vapor deposition (CVD) and related techniques. Two or more

Overview of Frequently used IC processes for microfabrication

• Thermal oxidation of silicon: Silicon dioxide (SiO2) is an important

Overview of Frequently used IC processes for microfabrication

• Photolithography: Use of photo-sensitive chemical (photoresists) and

Overview of Frequently used IC processes for microfabrication

• Wet Etching: We identify etching as the process to remove materials:

Overview of Frequently used IC processes for microfabrication

• Plasma Etching (Dry Etching): Accelerated ions are launched to the

Overview of Frequently used IC processes for microfabrication

• Doping: Process of planting dopant atoms into the host semiconductor

Overview of Frequently used IC processes for microfabrication

• Wafer Dicing: A wafer contains

• Wafer Bonding: A very versatile

Example of Microelectronics fabrication process flow

Silicon-based Micromachining Processes

• Microsystems were first developed on silicon wafers due to the

• Bulk Micromachining: Involve selectively removing the bulk (silicon

• Surface Micromachining: Free-standing, mechanical elements can be

Silicon-based Micromachining Processes

Silicon-based Micromachining Processes