Professional Documents
Culture Documents
By Vaibhav M.
Enroll No. 171E021
May 8, 2020
Que 1) Explain the nontransferred and transferred mode of plasma arc.
What are the advantages of each?
Ans. The plasma arc welding is method wherever a coalescence is gener-
ated with the temperature which is developed from a special setup between a
tungsten alloy electrode and the water-cooled nozzle (Non transferred ARC
) or between a tungsten alloy electrode and the job (transferred ARC). In
this type of winding, there are three types of gas supplies being utilized
namely plasma gas, shielding gas, and a back-purge gas. Plasma gas sup-
plies throughout the nozzle turn into ionized. The shielding gas supplies
throughout the external nozzle and protects the join from the environment.
Back-Purge gas is mainly used when particular materials are being used.
Advantages of PAW
• Power consumption is low
• Welding speed is high, so it can simply utilize to join thick and hard
workpieces.
• The arc arrangement doesn’t affect by the distance among tool as well
as the workpiece.
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• By using this method, the more steady arc can be produced.
Disadvantages of PAW
• Radiation is more.
Applications of PAW
Que 2) Make a comparison between LBM and EBM processes on the basis
of their applications and limitations.
Ans. Electron Beam Machining – Advantages and Limitations
EBM provides very high drilling rates when small holes with large aspect
ratio are to be drilled. Moreover it can machine almost any material irre-
spective of their mechanical properties. As it applies no mechanical cutting
force, work holding and fixturing cost is very less. Further for the same
reason fragile and brittle materials can also be processed. The heat affected
zone in EBM is rather less due to shorter pulses. EBM can provide holes of
any shape by combining beam deflection using electromagnetic coils and the
CNC table with high accuracy. However, EBM has its own share of limita-
tions. The primary limitations are the high capital cost of the equipment and
necessary regular maintenance applicable for any equipment using vacuum
system. Moreover in EBM there is significant amount of non-productive
pump down period for attaining desired vacuum. However this can be re-
duced to some extent using vacuum load locks. Though heat affected zone
is rather less in EBM but recast layer formation cannot be avoided.
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Applications
• Drill fine gas orifices less than 0.002 mm in space nuclear reactors,
• Thermal process – not suitable for heat sensitive materials like alu-
minium glass fibre laminate.
Applications
• Welding
• Cladding
• Alloying
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Que 3) Describe the mechanism of material removal of EBM process with
suitable diagram.
Ans. Working:
• Now this high intense electron beam passes through magnetic lenses.
There are a series of lenses which take care of only convergent electron
passes through it. It absorb all divergent electron and low energy
electron. It provides a high quality electron beam.
• This electron beam now passes through electromagnetic lens and de-
flecting coil. It focus the electron beam at a spot.
• The high intense electron beam impinges on the work piece where
kinetic energy of electrons convert into thermal energy.
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Que 4) Discuss the factors that influence the quality of cut in PAM.
Ans. Operating Parameters
Quality of cut and metal removal rate are largely dependent upon proper
attention to operating variables. Several factors contribute to the quality
and speed of cuts made by the plasma arc process, including cutting-tip
nozzle selection, power level, gas type and mixture, gas flow rate, traverse
speed, standoff distance, thickness of material, type of materials, impinge-
ment angle, and equipment design.
• Nozzle size: The highest quality plasma cut is usually obtained when
maximum thermal intensity is used. To achieve this, the smallest, or
next to the smallest, nozzle size that is capable of operating at a power
level suitable for the speed and thickness involved is used. Nozzle size
for cutting usually ranges from 0.80 to 6.30 mm in diameter.
• Power: Direct current up to 200 kW and 50-1000 A is employed in
plasma arc cutting operations.
• Gas mixture composition: A proportion of 10
• Gas flow rate: For any particular nozzle size, an increase in plasma
gas (primary) flow permits an increase in current. This increases the
power density of the flame and permits greater speed with less taper
on the kerf walls. Primary gas flow rates usually range between 0.40-
5.60 m3 /hr. Secondary gasses are pressurized to flow at up to 11.3
m3 /hr.
• Standoff distance: Due to the columnar shape of the plasma jet, a wide
range of tip-to-workpiece spacing is allowable. This permits machine
cutting along warped or irregular surfaces. General consideration in-
clude:
– Better quality cuts usually result from a short standoff distance
since arc divergence is less and the thermal intensity of the arc is
greater.
– Excessively close standoff distance can promote arcing due to the
accumulation of slag drops on the tip.
– Increased power input is necessary when the standoff distance is
great.
– Standoff distance can range from 6.5-76.2 mm
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Que 5) Explain the working principle of wire-EDM. Find the condition for
maximum power delivery to the discharging circuit in EDM.
Ans. CNC wire cut EDM machine puts impulse voltage between electrode
wire and workpiece through impulse source, controlled by servo system, to
get a certain gap, and realize impulse discharging in the working liquid be-
tween electrode wire and workpiece. Numerous tiny holes appears due to
erosion of impulse discharging, and therefore get the needed shape of work-
piece. Electrode wire is connecting to cathode of impulse power source, and
workpiece is connecting to anode of impulse power source. When workpiece
is approaching electrode wire in the insulating liquid and gap between them
getting small to a certain value, insulating liquid was broken through; very
shortly, discharging channel forms, and electrical discharging happens. And
release huge high temperature instantaneously, up to more than 10000 de-
gree centigrade, the eroded workpiece is cooling down swiftly in working
liquid and flushed away.
Part 2
Charging voltage and charging current:
Vo − Vct
ict = (1)
Rc
dVct
ict = C (2)
dt
where, Vo is the supply voltage, and Vct is the charged voltage of the con-
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denser at time t. Rc is charging resistance and C is capacitance of the
condenser.
so,
dVct 1
= dt (3)
Vo − Vct Rc C
Now, integrate both sides,
t
ln(Vo − Vct ) = − + K1 (4)
Rc C
where, K1 is a constant of integration. Use the boundary condition (Vct =
0att = 0) to evaluate K1 .It gives
K1 = lnVo (5)
The time required by the condenser to attain 0.638 times of its charging
voltage (= 0.638Vo ) is called “ time constant” (τ = Rc C). Substitute the
value Vct from Eq. 6 in Eq. 1 and simplify to get Eq. 7.
Vo −t/Rc c
ict = e (7)
Rc
The energy delivered to the discharging circuit at any time t is given by
Substituting the values of Vcl and icl from Eqs. 6 and 7 respectively in the
above equation, we get
Vo −t/Rc c
dEn = e Vo 1 − e−t/Rc c (8)
Rc
Integrate Eq. 8 to get
V2 τ
En = o −τ e−t/τ + e−2t/τ + K2 (9)
Rc 2
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where, t = Rc C. K2 is a constant, and can be evaluated by using the
boundary condition En = 0 at t = 0. Substitute the value of K2 in 9 to get
V 2 τ 1 1 −2x
En = o + e − ex (10)
Rc 2 2
Suppose the energy En is delivered to the discharging circuit For time τc = t
then the average power delivered Pavg is given by
En V 2 1 1 −2x
Pavg = = o + e − ex (11)
τc Rc x 2 2
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different points on the work surface can be subjected to ion-beam.
Accuracy
Practical etching rates vary up to 2000 A (2 x 10-4 mm) per min. The
accuracy of the etching process is considerably high mainly due to the small
amount of material removal. Tolerances in the vicinity of + 50 Å (+ 5 x
10-mm) are possible.
Applications of Ion-Beam Machining
It is applied mostly in micro-machining (etching) of electronic components
like computer parts, figuring optical surfaces and for the precision fabrica-
tion of fine wire dies in refractory materials. Typical materials that can
be etched include glass, alumina, quartz, crystals, silica, agates, porcelain,
cermets. and numerous metals and oxides.
Advantages
Disadvantages
• It is relatively expensive.
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Cleaning
The first step of the process is a cleaning of workpiece, this is required to
ensure that material will be removed uniformly from the surfaces to be pro-
cessed.
Masking
Masking is similar to masking action is any machining operation. This is
the action of selecting material that is to be removed and another that is
not to be removed. The material which is not to be removed is applied
with a protective coating called maskant. This is made of a materials are
neoprene, polyvinylchloride, polyethylene or any other polymer. Thinkers
of maskent is maintained upto 0.125 mm. The portion of workpiece having
no application of maskent is etched during the process of etching.
Etching
In this step the material is finally removed. The workpiece is immersed in
the enchant where the material of workpiece having no protective coating is
removed by the chemical action of enchant. Enchant is selected depending
on the workpiece material and rate of material removal; and surface finish
required. There is a necessity to ensure that maskant and enchant should
be chemically in active. Common enchants are H2 SO4 , F eCl3 , HN O3 . Se-
lection of enchant also affects MRR. As in CHM process, MRR is indicated
as penetration rates (mm/min).
Demasking
After the process is completed demasking is done. Demasking is an act of
removing maskent after machining.
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