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Vu Xuan Hien
I INTRODUCTION TO GAS SENSOR
V CONCLUSIONS
Accumulation
zone
KNU 2015/05/21
• Cuprous oxide is a p-type semiconductor with a direct bandgap of ~2.17 eV.
• Cu2O has been applied in many fields, like catalysis, lithium-ion battery-anode materials,
photo-electrodes, low-cost solar cells and sensors.
• Cu2O thin film can be deposited by sputtering.
• Tailoring the morphology of Cu2O by sputtering is a big issue.
?
Apply For Gas Sensing Applications
SnO applications Rutile structure Litharge structure
SnO2 applications
a=0.473nm, c=0.318nm, c/a=0.67 a=0.38nm, c=0.48nm, c/a=1.27
Ruby glass Gas sensor
Touchscreen
Sn
Coating layer
β-SnO α-SnO
(Eg = 2.5 ~ 3.0 eV) SnO2 (Eg = 2.5 ~ 3.0 eV)
Vis UV
(Eg = 3.6 eV)
0.38nm
Target-Substrate Distance 80 mm
Separating electrode
28
Cu2O (110) Cu2O (110) Cu2O (110)
32
CuO (110)
36
Cu2O (111) Cu2O (111) Cu2O (111)
Au (111) Au (111) Au (111)
40
Cu2O (200) Cu2O (200)
Cu2O (200) Cu (111) Cu (111)
44
Au (200) Au (200) Au (200)
48
Cu (200) Cu (200)
52
56
(c) Cu2O thin-film sensor
60
2 (degree, CuK)
Cu2O (220) Cu2O (220) Cu2O (220)
(b) Cu2O submicron-rod sensor
(a) Cu2O submicron-tree sensor
64
Au (220) Au (220) Au (220)
68
72
(c)
80
• TMelt-Cu = 1085 oC
• TMelt-Cu nanoparticles with
oxide shells (10–70 nm in
diameter, oxide thickness >2
o
nm) ~ 274 C
• Growth mechanism:
VLS (vapor-liquid-solid)
VSS (vapor-solid-solid)
VQS (vapor-quasiliquid-solid)
• Growth rate of Cu2O
nanorods: 50 nm/s
➢ Possible growth
mechanism:
VLS + VQS
(a)
Transportation (e) (f)
Route Oxide Layers
1 µm
2 nm
(b)
Growth
Zone
20 nm Ripple Oxide
20 nm Layers (e) 5 nm
100 nm
(c) (d) (g) (h)
50 nm
Random
Growth (020)
0.21 nm
(110)
Transition (200)
Location
22 00 nn m
m
(220)
Axial
Growth 22 nn m
m 2 nm 5 1/nm
1 0 0 nm
2048 2048
T = 300oC 10 ppm H2S
1024 (a) 10 ppm H2S 1024 v = 200 sccm
Response (S = Ra/Rg)
Cu2O thin film Cu2O thin film
128 128
64 T = 200oC 64 10 ppm H2S
v = 200 sccm
32 H2S off 32
16 10 ppm H2S 16 H2S off
8 8
10 ppm H2S
4 4
H2S on H2S on
2 2
10 ppm H2S
1 1 (b)
0 5 10 15 20 25 30 35 40 45 50 55 60 0 5 10 15 20 25 30 35 40 45 50 55 60
Time (min) Time (min)
16384
65536
Dry air
Dry air 32768 T = 300oC
8192 T = 300oC Target
Target 10 ppm NO2 v = 200 sccm gas on 10 ppm NO2 v = 200 sccm
16384
gas on 100 ppm NH3
4096 100 ppm NH3 8192
Resistance (ohm)
SnO (112)
Base Pressure 3×10-6 Torr
Target-Substrate Distance 70 mm
10 20 30 40 50 60 70 80 90
2*theta (degree)
60 C1s
O1s
Sn3d5
40
20
0 5 10 15 20 25 30 35
Sputtering time (minute)
Approx. thickness (nm)
0 20 40 60 80 100
100 (a)
80
Atomic Concentration (%)
60 C1s
O1s
Sn3d5
40
20
0 5 10 15 20 25 30 35
Sputtering time (minute)
954
952
950
948 200ppm
Resistance (ohm)
NH3
946
Air
944
942 100ppm
NH3
940
938 50ppm
NH3
936
0 10 20 30 40 50
Time (minute)
1.02
150oC
1.01
200oC
1.00
0.98
0.97
NH3 (200ppm) + Air Air
0.96
0 10 20 30 40 50 60 70 80 90
Time (minute)
1 1 1 1
= + + ⋯+
𝑅𝑠𝑒𝑛𝑠𝑜𝑟 𝑅𝑆𝑛𝑂2 𝑅𝑆𝑛𝑂1 𝑅𝑆𝑛𝑂𝑛
✓ The extremely thin layers of SnO2 (less than 6 nm) was found on
the surface of the thin film.
Chamber
Stainless steel
Temperature: RT
Humidity: ~25%
Hot Plate
Temperature: 25 oC
(a) (b)
(002)
Intensity(a.u.)
(001)
(004)
(211)
20 25 30 35 40 45 50 55 60 65 70 75 80
2 (degree, CuK)
6,2E-08
6,0E-08 100 oC 150 oC 200 oC
5,8E-08
5,6E-08
5,4E-08
(β)
5,2E-08
5,0E-08
(δ)
4,8E-08
4,6E-08
(γ) (δ)
Current (A)
3,7E-08
3,6E-08
3,5E-08
(α) (β)
3,5E-08
3,4E-08
3,4E-08
3,3E-08
1,1E-08
(α) (γ)
1,1E-08
Time (min)
6E-08
On On On On
S1 R
5E-08
S2
Photo Current (A)
4E-08
3E-08
2E-08
1E-08
20 ppm H2S Dry air
Current (A)
4.6E-08 ppm
H2S
4.6E-08
4.4E-08 10
ppm
4.4E-08 H2S
4.2E-08 15
(a) ppm (b)
H2S
4.2E-08 4.0E-08
20
H2S Dry H2S Dry H2S Dry H2S Dry H2S Dry H2S Dry ppm
on air on air on air on air on air on air H2S
3.8E-08
4.0E-08
0 20 40 60 80 100 120 140 160 180 200 220 240 260 0 30 60 90 120 150 180 210
Time (min) Time (min)
4.0E-08 (b)
3.8E-08
1.2E-08
(c)
1.0E-08
[Blue] SO 2 NO2 H2 S NH3
8.0E-09
[H2S] Green Red Dark