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To cite this article: Lirong Zheng , Pingxiong Yang , W-Ping Xu , Chenglu Lin , Wenbiao
Wu & Masanori Okuyama (1998) Pulsed laser deposition of pyroelectric pclt thin
films using a ceramic/metal target, Integrated Ferroelectrics, 20:1-4, 73-78, DOI:
10.1080/10584589808238770
Article views: 6
In this paper, we report the preparation and characteristics of Ca and La doped PbTi03
(PCLT) thin film on Pt/Ti/SiO*/Si substrate by laser ablating a ceramic/metal target. The
deposited film is polycrystalline and exhibits good ferroelectric hysteresis loop, low
leakage, and good pyroelectric properties. The pyroelectric coefficient of the film is high
as 8.81 x lo-* C/cm*K and the effective dielectric constant of the film is about 352. So the
figure of merit of the film is high as 0.78~10-'~Ccm/J,indicating that PCLT is a
promising material for pyroelectric application.
INTRODUCTION
*Corresponding author.
13
74 L. ZHENG et al.
electric applications.
In this paper, we report the deposition of Ca and La doped lead
titanate (PCLT) thin film on Pt-coated silicon by laser ablating a
ceramic/metal target. Well crystallized polycrystalline film was
successfully obtained on Pt/Ti/Si02/Si substrate. The film shows a
large pyroelectric coefficient y of 8.81 x lo-' C/cm2K and a relatively
low dielectric constant E, of 352. Good ferroelectric hysteresis loop is
also obtained in this film.
EXPERIMENTAL
The deposition process was carried out using an ArF pulsed excimer
laser as we described in Ref. [5]. The energy fluency of the laser was
set to 2J/cm2 and the frequency of the pulse was 3Hz. In order to
compensate the loss of Pb content in the film, a ceramic/metal target,
which consists of PCLT ceramic target with composition of 80/10/10
and a lead metal wafer (as shown in Fig. l), is used. So far, the laser
can irradiate partially on the ceramic target and partially on the lead
wafer to provide sufficient Pb content in the film. During deposition,
high pure oxygen was introduced into the chamber and the pressure
of the chamber was maintained at 30Pa. The substrates used in this
experiment were Pt( 1 11)/Ti/Si02/Si (Pt-coated silicon) which was
prepared by electron-beam evaporation in a ultra high vacuum
system at room temperature. The substrate temperature for PCLT
deposition was set to 400-470°C. In order to crystallize the film
into pure perovskite phase, post-annealing of 600°C for 15min
was performed.
PYROELECTRIC PCLT THIN FILMS 15
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FIGURE 1 Schematic diagram of the ceramic/metal target used for PCLT deposi-
tion.
15 20 25 30 35 40 45 50 55
2 6 (deg.)
FIGURE 2 XRD patterns for 400°C-deposited PCLT film (a) before and (b) after
annealing, and for 470°C-deposited PCLT film (c) before and (d) after annealing.
16 L. ZHENG ef al.
X: 2Vldiv t
I I I
CONCLUSIONS
3 0 , ~
0
a2 20-
a"
10 -
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- 4B' PCLT(80/1O/lO)
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0- I 1
References