Professional Documents
Culture Documents
Tom.Hausherr@PCBLibraries.com
www.PCBLibraries.com
Updated 2013.06.28
Market & Standards Confusion
The electronics industry is split down the middle, Metric units
Vs. Inch units. CAD vendors, PCB Fabrication and most American
government contractors default to the Imperial Unit System,
while private enterprise companies use the Metric Unit system.
Terms & Definitions – Footprint Vs. Land Pattern
Footprint, mid 1980’s OrCAD Capture for PCB library part
Land Pattern, March 1987 IPC-SM-782, however the IPC-T-
50 definition of “Footprint” is “See Land Pattern”. But
the new IPC-T-50 says a Footprint is component pattern
Terms & Definitions – Pad Vs. Land (all CAD vendors use Pad)
Terms & Definitions – Chip Component names, Metric units Vs.
Inch units (1206 or 3216, 0805 or 2012, 0603 or 1608)
IC Pad (Land) Shape – Rectangle, Oblong & Rounded Rectangle
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Challenges For Library Automation
IPC claims there are over 2 million man hours of duplication of effort
in PCB library creation. A component manufacturer creates a new
package and thousands of PCB designers create a library part.
IPC-SM-782 contained component package and land pattern data,
but no component manufacturer in the industry used it
EIA-PDP-100 contained component package dimensions but no
component manufacturer used it
JEDEC produces standards for component packages but component
manufacturer’s deviate from the standard to make unique packages
The electronics industry needs a PCB library solution that eliminates
duplication and mingles standards with User Preferences
A global PCB library solution will introduce true electronic product
development automation in engineering, design and manufacturing
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Challenges For Library Automation
Companies use various CAD tools and various versions of CAD
tools and the PCB library is usually not backward compatible
due to new features. Some companies even use obsolete CAD
tools like P-CAD, OrCAD Layout and Protel.
CAD vendors are consistently upgrading their tools and the
format is constantly changing. Writing translators for each CAD
tool version is challenging.
CAD vendors do not support importing a neutral library format
and they protect their data via Binary code or Encrypted data.
Component manufacturer’s cannot be responsible for creating
PCB libraries that support over 30 different CAD tool versions.
Component manufacturer’s are creating unique component
packages that require complex footprints (land patterns)
There are a multitude of footprint construction options
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1,800+ Footprint Variations For One Package
PCB Footprint CAD Tool Formats x 30 = 1,800+
UNITS
∞
TOLERANCE
… … … Rectangular
Pad Shape Pad Oblong
Shape PadD-Shape
Shape … … … … … … … … …
Pad Shape Pad Shape Pad Shape
ROTATION
30 CAD tools X 2 units = 60 x 5 tiers = 300 X 3 pad shapes = 900 X 2 Rotations = 1,800+ variations
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Footprint (Land Pattern) Preferences
X
Density Level A Density Level B Density Level C
Very Robust General Purpose Minimal Solder Joint
Solder Joint Solder Joint High Density Applications
May be used for hand soldering
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Custom Footprint Patterns
From the 1960’s through the 80’s the primary PCB design
grid system used Imperial units.
Physical design units were in tenth Inch, but every PCB
layout used 0.001” as the base unit of measure and
everything was rounded in 1 mil increments.
In the 1990’s the world standards organizations banded
together to agree that the metric unit system was
superior for solving PCB design development.
IPC started to publish all literature in metric units and by
1999, JEDEC and most component suppliers complied
with the new International System (SI) measurements
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Standards Organizations For PCB Libraries
Due to the mixing of Inch & Metric PCB design units, PCB real-
estate was not optimized when working with a snap grid for
routing traces
CAD vendor’s invented Shape Based routing technology to
optimize trace routing
Due to the number of grid cells that need to be calculated,
going off-grid or “gridless” uses an enormous amount of
computer CPU and memory resources. The auto-router has
hundreds of thousands of additional grid options for
computation. Exception: Mentor Expedition
A Gridless working environment in the majority of CAD tools is
difficult to manually edit or clean up trace routing
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PCB Grid System Impact
There are 3 snap grid options for the base unit of measure that
everything in a PCB design layout should be rounded to:
0.01 mm (High Res), 0.05 mm (Low Res) or 1 mil increments
CAD Library Construction
Part & Test Point Placement
Via Sizes
Mounting Holes
Board Outline
Via Fanout
Trace Widths
Routing Grid
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BGA Library Construction Collapsing Ball
Most BGA ball features are in 0.05 mm increments
Nominal Ball Land Pattern Nominal Land
Reduction Land Variation
Diameter Density Level Diameter
0.75 25% A 0.55 0.60 - 0.50
0.65 25% A 0.50 0.55 - 0.45
0.60 25% A 0.45 0.50 - 0.40
0.55 25% A 0.40 0.45 - 0.35
0.50 20% B 0.40 0.45 - 0.35
0.45 20% B 0.35 0.40 - 0.30
0.40 20% B 0.30 0.35 - 0.25
0.35 20% B 0.30 0.35 - 0.25
0.30 20% B 0.25 0.25 - 0.20
0.25 20% B 0.20 0.20 - 0.17
0.20 15% C 0.17 0.20 - 0.14
0.17 15% C 0.15 0.18 - 0.12
0.15 15% C 0.13 0.15 - 0.10
1.27 VIA63-30-85 0.635 0.30 0.85 0.00 None None None 0.125 2
1.00 VIA50-25-70 0.55 0.25 0.70 0.00 None None None 0.10 2
0.80 VIA50-25-70 0.50 0.25 0.70 0.00 None None None 0.10 1
0.75 VIA40-15-60 0.40 0.15 0.60 0.00 None None None 0.10 1
0.65 Via-in-Pad 0.45 0.15 0.55 0.65 0.45 0.55 0.10 0.075 1
0.50 Via-in-Pad 0.275 0.125 0.40 0.50 0.30 0.40 0.10 0.05 1
0.40 Via-in-Pad 0.25 0.125 0.35 0.25 0.25 0.35 0.075 0.05 1
Via-in-Pad Technology
• BGA Ball Size: 0.25 (10)
• BGA Land Dia: 0.25 (10)
• Hole Size: 0.125 (5) 8:1 aspect
• Thermal Relief Required
• Plane Clearance: 0.35 (14)
• Solder Mask: 1:1 scale
Trace/Space Data
• Trace Width: 0.05 (2)
• Trace/Trace Space: 0.05 (2)
• Trace/Via Space: 0.05 (2)
• Trace/BGA Land: 0.05 (2)
• Routing Grid: 0.05 (2)
• Part Place Grid: 0.5 (20)
0.065 mm 0.11 mm
Annular Ring
0.35 mm
Plane
0.23 mm Clearance
Via Land
0.1 mm
0.28 mm Micro Via
Solder Mask Hole
0.05 mm
0.06 mm
0.17 mm
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0.4 mm Pitch BGA
0.025 mm 0.05 mm
BGA Land
0.1 mm Micro Via Cu Foil
Layer 1
Prepreg
Layer 2
Prepreg
Layer 3
Capped to
Create Conductive
Target Land Fill
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Plated (Conductive Fill) Micro Vias
MICROFILL™ EVF Copper Via Fill
Next Generation of Pattern Viafill Plating Technology
http://www.dowelectronicmaterials.com/
0.1 mm Drill
0.4 mm Pitch
0.25 mm Land
0.1 mm Drill
0.25 mm Land
0.2 mm Space
Advanced
routing
solutions for a
11 X 12 - 0.4 mm
pitch BGA
Route outside
row on layer 1
Trace Width 0.75
Via-in-Pad Technology
• BGA Ball Size: 0.30 (12)
• BGA Land Dia: 0.275 (11)
• Hole Size: 0.15 (6)
• Thermal Relief Required
• Plane Clearance: 0.425 (17)
• Solder Mask: 1:1 scale
Trace/Space Data
• Trace Width: 0.075 (3)
• Trace/Trace Space: 0.075 (3)
• Trace/Via Space: 0.075 (3)
• Trace/BGA Land: 0.075 (3)
• Routing Grid: 0.05 (2)
• Part Place Grid: 0.5 (20)
BGA Component
0.15 mm BGA Ball
0.1 mm Paste Mask
Solder Mask
1 mm PCB Thickness
0.15 mm Via-in-Land
Via-in-Pad Technology
• BGA Ball Size: 0.4 (16)
• BGA Land Dia: 0.4 (16)
• Hole Size: 0.15 (6)
• Plane Clearance: 0.5 (20)
• Solder Mask: 1:1 scale
Trace/Space Data
• Trace Width: 0.1 (4)
• Trace/Trace Space: 0.1 (4)
• Trace/Via Space: 0.1 (4)
• Trace/BGA Land: 0.75 (3)
• Routing Grid: 0.05 (2)
• Part Place Grid: 1 (40)
Via-in-Pad Technology
• BGA Ball Size: 0.4 (16)
• BGA Land Dia: 0.425 (17)
• Hole Size: 0.2 (8)
• Plane Clearance: 0.575 (23)
• Solder Mask: 1:1 scale
Trace/Space Data
• Trace Width: 0.075 (3)
• Trace/Trace Space: 0.075 (3)
• Trace/Via Space: 0.075 (3)
• Routing Grid: 0.05 (2)
• Via Grid: 0.65 (26)
• Part Place Grid: 1 (40)
BGA
BGA Data
• BGA Ball Dia: 0.5 (20)
• BGA Land Size: 0.45 (17)
Via Data
• Pad Size: 0.5 (20)
• Hole Size: 0.25 (10)
• Anti-Pad: 0.7 (28)
Trace/Space Data
• Trace Width: 0.1 (4)
• Trace/Trace Space: 0.1 (4)
• Trace/Via Space: 0.125 (5
• Routing Grid: 0.1 (4)
• Via Grid: 0.2 (8)
• Part Place Grid: 1 (40)
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0.8 mm Pitch BGA
BGA Data
• BGA Ball Dia: 0.5 (20)
• BGA Land Size: 0.45 (17)
Via Data
• Pad Size: 0.45 (18)
• Hole Size: 0.2 (8)
• Anti-Pad: 0.65 (26)
Trace/Space Data
• Trace Width: 0.125 (5)
• Trace/Trace Space: 0.125
• Trace/Via Space: 0.1 (4)
• Routing Grid: 0.05 (2)
• Via Grid: 0.2 (8)
• Part Place Grid: 1 (40)
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1.0 mm Pitch BGA
Via Data
• Pad Size: 0.50 (20)
• Hole Size: 0.25 (10)
• Plane Clearance: 0.70 (28)
• BGA Land Size: 0.5 (20)
Trace/Space Data
• Trace Width: 0.1 (4)
• Trace/Trace Space: 0.1 (4)
• Trace/Via Space: 0.1 (4)
• Routing Grid: 0.1 (4)
• Via Grid: 0.5 (20)
• Part Place Grid: 0.5 (20)
Via Data
• Pad Size: 0.375 (15)
• Hole Size: 0.175 (7)
• Plane Clearance: 0.625 (25)
• BGA Land Size: 0.5 (20)
Trace/Space Data
• Trace Width: 0.125 (5)
• Trace/Trace Space: 0.125 (5)
• Trace/Via Space: 0.125 (5)
• Routing Grid: 0.05 (2)
• Via Grid: 0.5 (20)
• Part Place Grid: 0.5 (20)
Via Data
• Land: 0.50 (20)
• Hole: 0.25 (10)
• Plane Clearance: 0.70 (28)
• BGA Land Size: 0.5 (20)
Trace/Space Data
• Trace Width: 0.2 (8)
• Trace/Trace Space: 0.2 (8)
• Trace/Via Space: 0.15 (6)
• Routing Grid: 0.1 (4)
• Via Grid: 0.5 (20)
• Part Place Grid: 0.5 (20)
0.11 mm
0.08 mm
0.70 mm
Plane
Clearance
0.50 mm
Via Land
0.25 mm
Via Hole
0.12 mm
0.20 mm Note: Vias are on a
0.50 mm 1 mm snap grid
0.20 mm 0.70 mm
Plane
0.095 mm Clearance
Global Feature Min
Clearance 0.1 mm
0.50 mm
Trace / Via Snap Via Land
Grid 0.05 mm
0.25 mm
0.105 mm Gap Via Hole
0.1025 mm
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1.0 mm Pitch BGA Via and Trace Sizes
Via Data
Land: 0.635 (25)
Hole: 0.30 (12)
Plane Clearance: 0.85 (33)
BGA Land Size: 0.6 (24)
Trace/Space Data
Trace Width: 0.127 (5)
Trace/Trace Space: 0.127 (5)
Trace/Via Space: 0.127 (5)
Routing Grid: 0.127 (5)
Via Grid: 0.635 (25)
Part Place Grid 1: 1.27 (50)
Part Place Grid 2: 0.635 (25)
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Metric Pitch BGA Snap Grids
Cross-sectional view of
land with solder ball
joint illustrating the
solder wetting down
the edge of the land
when there is solder
mask relief away from
the land edge
Gull Wing lead package dimensions for SOP, QFP, SOD &
SOT are in 0.05 mm increments
Pin pitches are in 0.05 mm increments
All Land Pattern data is in 0.01 or 0.05 mm increments
Land (Pad) Length and Width
Land (Pad) Snap Grid
All 2D Line Widths
Polarity Markings
2D Line Snap Grid
Ref Des Height & Width
Local Fiducials
Flat Side Convex Side Concave Side Corner Concave Inward L Flat Bottom
QFN’s
PQFN’s
Maximum Radius =
10 Mil (0.25 mm)
_u=“UNITS” _f=“FAMILY”
Millimeter = 0 CapacitorNP = 0 (non-polarized)
Micrometers = 1 CapacitorP = 1 (polarized) Chip Component Family
Inch = 2 CapacitorWR = 2 (wire rectangular)
Mil = 3 Diode = 3
Current = 4 Fuse = 4
IC = 5
Inductor = 6
InductorP = 7 (precision inductor)
LED = 8
Resistor = 9
Transistor = 10
Note: All Plated & Non-plated Through-hole Padstack Values are in 1 Mil increments
Note: All Plated & Non-plated Through-hole Padstack Values are in 0.01 Millimeter increments
Note: Component manufacturer’s often provide hole size recommendations but not pad sizes
6 (0.15) Min.
Ground Plane
Core Shifted Layer 2 (0.05) Min.
Prepreg 4 (0.1)
10 (0.25) Trace Width
Core 8 (0.2)
Voltage Plane
20 (0.5)
Note: All Plated & Non-plated Through-hole Padstack Values are in 1 Mil increments
Note: All Plated & Non-plated Through-hole Padstack Values are in 0.05 Millimeter increments
ISO (metric) Nut, Screw & Washer Hardware Sizes Mil Units
Screw Size Pan Hex Flat Washer Lock
Dia x Thread Head Nut Washer ID Washer
M2 x 0.4 157 182 209 87 173
M2.5 x 0.45 197 227 268 107 200
M3 x 0.5 236 250 287 126 244
M3.5 x 0.6 276 273 330 150 272
ISO (metric) Hardware w/Plated & Non-plated Though Hole Padstack Data – Loose Fit – Mil Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
M2 x 0.4 Pan Head 190 90 170 170 170 170 130 None
M2 x 0.4 Flat Washer 236 90 216 216 216 216 130 None
M2.5 x 0.45 Pan Head 232 112 212 212 212 212 152 None
M2.5 x 0.45 Flat Washer 300 112 280 280 280 280 152 None
M3 x 0.5 Pan Head 276 138 256 256 256 256 178 None
M3 x 0.5 Flat Washer 323 138 303 303 303 303 178 None
M3.5 x 0.6 Pan Head 311 154 291 291 291 291 194 None
M3.5 x 0.6 Flat Washer 362 154 342 342 342 342 194 None
ISO (metric) Hardware w/Plated & Non-plated Though Hole Padstack Data – Loose Fit – Metric Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
M2 x 0.4 Pan Head 4.80 2.30 4.30 4.30 4.30 4.30 3.30 None
M2 x 0.4 Flat Washer 6.00 2.30 5.50 5.50 5.50 5.50 3.30 None
M2.5 x 0.45 Pan Head 5.90 2.85 5.40 5.40 5.40 5.40 3.85 None
M2.5 x 0.45 Flat Washer 7.60 2.85 7.10 7.10 7.10 7.10 3.85 None
M3 x 0.5 Pan Head 7.00 3.50 6.50 6.50 6.50 6.50 4.50 None
M3 x 0.5 Flat Washer 8.20 3.50 7.70 7.70 7.70 7.70 4.50 None
M3.5 x 0.6 Pan Head 7.90 3.90 7.40 7.40 7.40 7.40 4.90 None
M3.5 x 0.6 Flat Washer 9.20 3.90 8.70 8.70 8.70 8.70 4.90 None
ISO (metric) Nut, Screw & Washer Hardware Sizes Mil Units
Screw Size Pan Hex Flat Washer Lock
Dia x Thread Head Nut Washer ID Washer
M2 x 0.4 157 182 209 87 173
M2.5 x 0.45 197 227 268 107 200
M3 x 0.5 236 250 287 126 244
M3.5 x 0.6 276 273 330 150 272
ISO (metric) Hardware w/Plated & Non-plated Though Hole Padstack Data – Tight Fit – Mil Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
M2 x 0.4 Pan Head 190 82 170 170 170 170 122 None
M2 x 0.4 Flat Washer 236 82 216 216 216 216 122 None
M2.5 x 0.45 Pan Head 232 104 212 212 212 212 144 None
M2.5 x 0.45 Flat Washer 300 104 280 280 280 280 144 None
M3 x 0.5 Pan Head 276 130 256 256 256 256 170 None
M3 x 0.5 Flat Washer 323 130 303 303 303 303 170 None
M3.5 x 0.6 Pan Head 311 146 291 291 291 291 186 None
M3.5 x 0.6 Flat Washer 362 146 342 342 342 342 186 None
ISO (metric) Hardware w/Plated & Non-plated Though Hole Padstack Data – Tight Fit – Metric Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
M2 x 0.4 Pan Head 4.60 2.10 4.30 4.30 4.30 4.30 3.10 None
M2 x 0.4 Flat Washer 5.80 2.10 5.50 5.50 5.50 5.50 3.10 None
M2.5 x 0.45 Pan Head 5.70 2.65 5.40 5.40 5.40 5.40 3.65 None
M2.5 x 0.45 Flat Washer 7.40 2.65 7.10 7.10 7.10 7.10 3.65 None
M3 x 0.5 Pan Head 6.80 3.30 6.50 6.50 6.50 6.50 4.30 None
M3 x 0.5 Flat Washer 8.00 3.30 7.70 7.70 7.70 7.70 4.30 None
M3.5 x 0.6 Pan Head 7.70 3.70 7.40 7.40 7.40 7.40 4.70 None
M3.5 x 0.6 Flat Washer 9.00 3.70 8.70 8.70 8.70 8.70 4.70 None
ANSI Hardware w/Plated & Non-plated Though Hole Padstack Data – Loose Fit – Mil Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
#2 - 48 Pan Head 197 96 177 177 177 177 136 None
#2 - 48 Flat Washer 292 96 272 272 272 272 136 None
#4 - 40 Pan Head 260 146 240 240 240 240 186 None
#4 - 40 Flat Washer 418 146 398 398 398 398 186 None
#6 - 32 Pan Head 308 154 287 287 287 287 194 None
#6 - 32 Flat Washer 492 154 472 472 472 472 194 None
#8 - 32 Pan Head 358 180 338 338 338 338 200 None
#8 - 32 Flat Washer 562 180 543 543 543 543 220 None
ANSI Hardware w/Plated & Non-plated Though Hole Padstack Data – Loose Fit – Metric Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
#2 - 48 Pan Head 5.00 2.45 4.50 4.50 4.50 4.50 3.45 None
#2 - 48 Flat Washer 7.40 2.45 6.90 6.90 6.90 6.90 3.45 None
#4 - 40 Pan Head 6.60 3.70 6.10 6.10 6.10 6.10 4.70 None
#4 - 40 Flat Washer 10.60 3.70 10.10 10.10 10.10 10.10 4.70 None
#6 - 32 Pan Head 7.80 3.90 7.30 7.30 7.30 7.30 4.90 None
#6 - 32 Flat Washer 12.50 3.90 12.00 12.00 12.00 12.00 4.90 None
#8 - 32 Pan Head 9.10 4.60 8.60 8.60 8.60 8.60 5.60 None
#8 - 32 Flat Washer 14.30 4.60 13.80 13.80 13.80 13.80 5.60 None
ANSI Hardware w/Plated & Non-plated Though Hole Padstack Data – Tight Fit - Mil Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
#2 - 48 Pan Head 190 88 170 170 170 170 128 None
#2 - 48 Flat Washer 284 88 104 104 104 104 128 None
#4 - 40 Pan Head 244 130 224 224 224 224 170 None
#4 - 40 Flat Washer 402 130 382 382 382 382 170 None
#6 - 32 Pan Head 296 142 276 276 276 276 182 None
#6 - 32 Flat Washer 480 142 460 460 460 460 182 None
#8 - 32 Pan Head 350 169 330 330 330 330 209 None
#8 - 32 Flat Washer 550 169 532 532 532 532 209 None
ANSI Hardware w/Plated & Non-plated Though Hole Padstack Data – Tight Fit - Metric Units
Pan Head Hardware on Placement Hole Top Inner Bottom Solder Plane Thermal
Screw Size PCB Courtyard Size Pad Pad Pad Mask Anti-Pad Relief
#2 - 48 Pan Head 4.80 2.25 4.30 4.30 4.30 4.30 3.25 None
#2 - 48 Flat Washer 7.20 2.25 6.70 6.70 6.70 6.70 3.25 None
#4 - 40 Pan Head 6.20 3.30 5.70 5.70 5.70 5.70 4.30 None
#4 - 40 Flat Washer 10.20 3.30 9.70 9.70 9.70 9.70 4.30 None
#6 - 32 Pan Head 7.50 3.60 7.00 7.00 7.00 7.00 4.60 None
#6 - 32 Flat Washer 12.20 3.60 11.7 11.70 11.70 11.70 4.60 None
#8 - 32 Pan Head 8.90 4.30 8.40 8.40 8.40 8.40 5.30 None
#8 - 32 Flat Washer 14.10 4.30 13.5 13.50 13.50 13.50 5.30 None
NOT OK
Courtyard
Assembly 3D IDF Outline IDF Model
REFDES
SOT223 SOT143
REFDES
Silkscreen w/Polarity
Courtyard
Assembly
REFDES
REFDES
Courtyard Assembly
REFDES
Non-polarized Polarized
Capacitor Capacitor Diode Resistor
REFDES
Least Density Level – 1.0 mm Height
Nominal Density Level – 1.2 mm Height
Most Density Level – 1.5 mm Height
These Chip assembly Ref Des are scaled down to fit inside assembly outlines
Local Fiducials have been used only on fine pitch QFP and BGA
Footprints (land patterns)
Fine pitch QFP = Less than 0.625 mm pin pitch
Fine pitch BGA = Less than 0.80 mm ball pitch
Future Local Fiducial sizes will be:
Level A (Most) = 40 mil (1.0 mm) with 80 mil (2.0 mm) solder mask & keep-out
Level B (Nominal) = 30 mil (0.75 mm) with 60 (1.5 mm) solder mask & keep-out
Level C (Least) = 20 mil (0.5 mm) with 40 mil (1.0 mm) solder mask & keep-out
0° Orientation
Rotate Counterclockwise
Rotate Counterclockwise
Rotate Counterclockwise