CONDUCTION

The composite wall of an oven consists of three materials, two of which are of known thermal

conductivity, kA = 20W/m·K and kC = 50W/m·K, and known thickness, LA = 0.30m and LC =

0.15m. The third material, B, which is sandwiched between materials A and C, is of known

thickness, LB = 0.15m, but unknown thermal conductivity kB. Under steady-state operating

conditions, measurements of temperature are shown in figure above. The inside convection

coefficient h is known to be 25 W/m2·K.

(a) Provide equivalent thermal circuit network from T∞ inside the oven, to outer oven surface

temperature Ts,o. Also provide thermal resistance equation for each element.

(b) Express the heat flux, q” due to conduction for the three materials A, B and C, in term of

available values of k, L and T.

(c) Find the heat flux, q” due to convection inside the oven.

(d) Find the value of kB.

CONVECTION

Computer chips generate heat during operation, and their failure rate increases with
temperature. In the figure above, a chip is cooled by a flow of air at 20°C and atmospheric
pressure. The maximum allowable chip surface temperature is 65°C and the air velocity is 3.4
m/s. Determine:

(a) Reynolds number, Re and the flow regime for the air.

(b) Prandtl number, Pr.

(c) Nusselt number, Nu.

(d) Convection coefficient, h.

(e) Heat that can be removed, q through convection.