EMCH 354, Spring 2016, HW03 Due on: 03/17/2016 U of S Carolina

Draw a figure if necessary and show essential steps!!

Problem 1: In a hair dryer, air flow pumped

by a small fan is heated by a coiled electric
resistance wire in a circular duct as shown in
Fig. 1.

(a) If a dryer is designed to operate with an

electric power consumption of Pelec = 500 W
and to heat air from an ambient temperature of
Ti = 20 °C to a discharge temperature of To =
Figure 1 schematic of a hair dryer.
45 °C, at what volumetric flow rate should the
fan operate? Heat loss from the casing to the
ambient air and the surroundings may be neglected. If the duct has a diameter of D = 70
mm, what is the discharge velocity Vo of the air? The density and specific heat of the air
may be approximated as ρ = 1.10 kg/m3 and cp = 1007 J/kg∙K, respectively.
(b) Consider a dryer duct length of L = 150 mm and a surface emissivity of ε = 0.8. If the
coefficient associated with heat transfer by natural convection from the casing to the
ambient air is h = 4 W/m2∙K and the temperature of the air and the surroundings is T∞= Tsur
= 20 °C, confirm that the heat loss from the casing is, in fact, negligible. The casing may
be assumed to have an average surface temperature of Ts = 40 °C.

Problem 2: In the semiconductor industry, the thermal treatment of materials such as

annealing can be achieved by heating a silicon wafer according to a temperature-time
recipe and then maintaining a fixed elevated temperature for a prescribed period of time.
For the process tool arrangement shown as in Fig. 2, the wafer is in an evacuated chamber
whose walls are maintained at 27 °C and
within which heating lamps maintain a
radiant flux at its upper surface. The wafer
is 0.78 mm thick, has a thermal
conductivity of 30 W/m∙K, and an
emissivity that equals its absorptivity to
the radiant flux (ε = α = 0.65). For 𝑞𝑠" = 3.0
×105 W/m2, the temperature on its lower
surface is measured by a radiation Figure 2 annealing process in semiconductor industry
thermometer and found to have a value of
Tw,l = 997 °C.

To avoid warping the wafer and inducing slip planes in the crystal structure, the
temperature difference across the thickness of the wafer must be less than 2 °C. Is this
condition being met? If this condition cannot be met, how to improve the material thermal
treatment?

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Problem 4: A small sphere of reference-grade iron with a specific heat of 447 J/kg∙K and
a mass of 0.515 kg is suddenly immersed in a water–ice mixture. Fine thermocouple wires
suspend the sphere, and the temperature is observed to change from 15 to 14 °C in 6.35 s.
The experiment is repeated with a metallic sphere of the same diameter, but of unknown
composition with a mass of 1.263 kg. If the same observed temperature change occurs in
4.59 s, what is the specific heat of the unknown material?

Problem 5: An aluminum pin fin has a diameter of 4 mm and a length of 20 mm. Calculate the
heat dissipated when the base temperature is 600 K, the fluid temperature is 400 K, and the heat
transfer coefficient is 100 W/(m2K). Take k = 180 W/(m K).

Problem 6: Two air flows are separated by a 2 mm thick plastic wall. A 20.2 cm long, 1 cm
diameter aluminum rod transfers heat from one flow to the other as shown in Figure 3. The hot air
flow is at 70 ˚C, and the convective heat transfer coefficient to the rod is 48 W/(m2K); the cold air
flow is at 20 ˚C and is at a lower velocity, giving a heat transfer coefficient only 24 W/(m2K).
Determine the rate of heat transfer Q and the temperature of the midsection of the rod. Take k al =
190 W/(m K).

Figure 3

Problem 7: Consider a composite wall that includes

an 8-mm-thick hardwood siding, 40-mm by 130-mm
hardwood studs on 0.65-m centers with glass fiber
insulation (paper faced, 28 kg/m3), and a 12-mm
layer of gypsum (vermiculite) wall board.

What is the thermal resistance associated with a wall that is 2.5 m high by 6.5 m wide
(having 10 studs, each 2.5 m high)? Assume surfaces normal to the x-direction are
isothermal. PROPERTIES: Table A-3 (T ≈ 300K): Hardwood siding, kA = 0.094
W/m⋅K; Hardwood, kB = 0.16 W/m⋅K; Gypsum, kC = 0.17 W/m⋅K; Insulation (glass fiber
3
paper faced, 28 kg/m ), kD = 0.038 W/m⋅K.

Problem 8: At a given instant of time, the temperature distribution within an infinite

homogeneous body is given by the function
T(x, y, z)= x2- 2y2+z2-xy+2yz
Assuming constant properties and no internal heat generation, determine the regions
where the temperature changes with time.

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