REPORT OF INPLANT TRAINING UNDERGONE IN

NOKIA SIMENS NETWORKS.

BETWEEN 11-01-2011 TO 14-01-2011.

Submitted By:

C. Puhalarasan.

A. Sam Jacob Stanly

G. Sridharan.

Of

Arignar Anna Institute of Science and Technology

Pennalur, Sriperumbudur – 602105.

 Basic Layout of Base Transceving Station.

Ware House:

It is the place where the all the goods where the all the equipments which are all
imported from all the places are stored. It is arranged in the order of the their corresponding
Serial numbers.

Functions of Ware House:

 Material supply.
 Inbound material (Good Receipt).
 Arranging in pathway.
 SAP- Service Application Protocol is a kind of software which is used to analyse the
types of goods and where it is going to be moved.
 Final function of the ware house is picking line to issue.
Surface Mount Technology(SMT):

Types of Technologies:

SMp DIALECTExpanded FormSMDSurface Mount Devices (active, passive and

electromechanical components)SMTSurface Mount Technology (assembling and
montage technology)SMASurface Mount Assembly (module assembled with
SMT)SMCSurface Mount Components (components for SMT)SMPSurface Mount
Packages (SMD case forms)SMESurface Mount Equipment (SMT assembling
machines)SOSmall Outline (4 to 28 pins)VSOVery Small Outline (40 pins)SOPSmall
Outline Package (case)SODSmall Outline DiodeSOTSmall Outline
TransistorSOICSmall Outline Integrated CircuitCCChip CarrierLCCLeadless Chip
CarrierPLCCPlastic Leadless Chip CarrierLCCCLeadless Ceramic Chip
CarrierMELFMetal Electrode Face BondingMINI MELFMini Metal Electrode Face
BondingMICRO MELFMicro Metal Electrode Face Bonding.

Surface mount components on a flash drive's circuit board. The small rectangular chips with numbers are
resistors, while the unmarked small rectangular chips are capacitors. The visible capacitors and resistors are
predominantly a combination of 0805 and 0603 package sizes, while the smallest chip capacitors are 0402
size.

Surface mount technology (SMT) is a method for constructing electronic circuits in

which the components (SMC, or Surface Mounted Components) are mounted directly
onto the surface of printed circuit boards (PCBs). Electronic devices so made are
called surface mount devices or SMDs. In the industry it has largely replaced
the through-hole technology construction method of fitting components with wire leads
into holes in the circuit board.

An SMT component is usually smaller than its through-hole counterpart because it has
either smaller leads or no leads at all. It may have short pins or leads of various styles,
flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the
component.

Placing components By Surface Mount Technology(SMT):

Assembly line of SMT placement machines

These types machines are generally known as NXT machines. These types
machines are fully automated one. In nxt machines all the rolls of capacitors, resistors,
are all placed in the fixing gauge of the machines. Depending upon the requirements
the rolls are fixed at the fixing gauge.

Paste Printing:

The PCB means that printed circuit board is sent through the opening end of the nxt
machines. On tha machines board are generally soldered throught the surface mount
technology. The solder is applied at the front and back sides of the pc boards. The
solder paste generally consists of the molten Tin(Sn), and flux combinations. They are
all to be kept in the cooling state after soldering because they will definittely melt at the
room temperature. So the entire industry will be kept at the Conditioned Air
temperature(AC).

Surface mount devices (SMD's) are mounted onto a printed circuit board (PCB) by
soldering their external interconnection features (such as leads, bumps, or balls) to their
corresponding mounting sites on the PCB. This is achieved by depositing a material
known as solder paste on the PCB's device interconnection points, positioning the
surface mount devices on the board, and subjecting the board to a process known
as solder reflow to melt the solder and complete the board mount process.
                     
Solder pastes are specially blended pastes that consist of a flux medium containing
graded solder powder particles.  The process of depositing solder paste on the board is
known as Solder Paste Printing.

Solder paste, which serves primarily as the attachment medium between the device

interconnection features and the PCB itself, is deposited (usually by printing) on the
attachment sites in the PCB.  The device interconnections are then accurately
positioned over the deposited solder paste, which is then melted (or reflowed) at a high
temperature to effect the soldering of the devices to the PCB with a well-formed,
contiguous fillet. After this solder reflow, the solder is allowed to cool down again to
solidify and attain the mechanical properties necessary to keep the devices firmly
mounted on the PCB.

There are two major process for printing solder paste onto PCB's, namely,  mesh
screen stencil printing and metal stencil printing.  When surface mount technology first
emerged in the early 80's, mesh screen printing was employed to deposit the required
solder paste on the boards. Metal stencil printing was subsequently developed to
replace mesh screen printing, which can not be used for smaller, finer-pitched SMD's. 
Mesh screen printing is still being used today because it remains to be the cheapest
method, but it is applicable only to the larger SMD's that it can handle.

Printing solder paste on a

PCB can be a complex task

In both methods, squeegees are generally used to physically deposit and distribute the

solder paste evenly across the stencil.  By properly rolling the squeegee over the
stencil, the solder paste passes through the stencil apertures and gets deposited on
designated areas on the PCB. The stencil is then lifted, leaving behind the intended
solder paste pattern on the PCB. There is, by the way, a new technique for depositing
solder paste without using a squeegee.  Known as direct printing, this technique
employs a piston-driven printing head that presses the solder paste directly through the
apertures of the stencil and onto the board.

A large variety of solder paste printing squeegees that differ in designs and material
exists in the market. For metal stencil printing, thin metal squeegees are commonly
used.  On the other hand, mesh screen printing often employs thick rubber plates.  At
any rate, squeegees are generally designed to have a very smooth and non-
stickingsurface with a sharp printing edge.

During solder paste printing, the PCB must be held by its support in a locked
position that's perfectly parallel to the stencil. The squeegee angle is usually between
45-60 degrees. A vision system is also necessary to ensure accurate printing of solder
paste on the 'solder lands' of the PCB. Modern printing equipment offer many options -
computer control, vision or laser print control, environment control, automatic PCB
support set-up, and even stencil cleaning.

Critical parameters for high-quality solder paste printing include print speed, print
pressure, separation speed/distance (or the speed/distance at which the PCB and the
stencil are separated), and printer alignment. It goes without saying that excellent
operator training is also imperative since solder printing is a very sensitive and delicate
process.
  
The environment in which solder paste printing is done is also important.  Defects
such as solder bridging and poor wetting can be caused by dust particles or
microscopic fibers in the air that end up on the PCB or stencil. Quick drying of the
solder paste, on the other hand, can be caused by high ambient temperature or the
presence of air draft that accelerates solvent evaporation. The viscosity of the solder
paste will also be difficult to keep under control in an environment with fluctuating
ambient temperature and humidity.  

Where components are to be placed, the printed circuit board has flat, usually  tin-
lead, silver, or gold plated copper pads without holes, called solder pads.Solder paste,
a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads
with a stainless steel or nickel stencil using a screen printing process. After screen
printing, the boards then proceed to the pick-and-place machines, where they are
placed on a conveyor belt. The components to be placed on the boards are usually
delivered to the production line in either paper/plastic tapes wound on reels or plastic
tubes. Some large integrated circuits are delivered in static-free trays. Numerical
control pick-and-place machines remove the parts from the tapes, tubes or trays and
place them on the PCB.
The boards are then conveyed into the reflow soldering oven. They first enter a pre-
heat zone, where the temperature of the board and all the components is gradually,
uniformly raised. The boards then enter a zone where the temperature is high enough to
melt the solder particles in the solder paste, bonding the component leads to the pads
on the circuit board. The surface tension of the molten solder helps keep the
components in place, and if the solder pad geometries are correctly designed, surface
tension automatically aligns the components on their pads. There are a number of
techniques for reflowing solder. One is to use infrared lamps; this is called infrared
reflow. Another is to use a hot gas convection. Another technology which is becoming
popular again is special fluorocarbon liquids with high boiling points which use a method
called vapor phase reflow. Due to environmental concerns, this method was falling out
of favor until lead-free legislation was introduced which requires tighter controls on
soldering. Currently, at the end of 2008, convection soldering is the most popular reflow
technology using either standard air or nitrogen gas. Each method has its advantages
and disadvantages. With infrared reflow, the board designer must lay the board out so
that short components don't fall into the shadows of tall components. Component
location is less restricted if the designer knows that vapor phase reflow or convection
soldering will be used in production. Following reflow soldering, certain irregular or heat-
sensitive components may be installed and soldered by hand, or in large scale
automation, by focused infrared beam (FIB) or localized convection equipment.

If the circuit board is double sided then this printing, placement, reflow process may
be repeated using either solder paste or glue to hold the components in place. If glue is
used then the parts must be soldered later using a wave soldering process.

After soldering, the boards may be washed to remove flux residues and any stray
solder balls that could short out closely spaced component leads. Rosin flux is removed
with fluorocarbon solvents, high flash point hydrocarbon solvents, or low flash solvents
e.g. limonene (derived from orange peels) which require extra rinsing or drying cycles.
Water soluble fluxes are removed with deionized waterand detergent, followed by an air
blast to quickly remove residual water. However, most electronic assemblies are made
using a "No-Clean" process where the flux residues are designed to be left on the circuit
board [Benign]. This saves the cost of cleaning, speeds up the whole process, and
reduces waste.

Finally, the boards are visually inspected for missing or misaligned components and
solder bridging. If needed, they are sent to a rework station where a human operator
corrects any errors. They are then sent to the testing stations (in-circuit testing and/or
functional testing) to verify that they operate correctly .
Main advantages

The main advantages of SMT over the older through-hole technique are:

 Smaller components. Smallest is currently 0.4 x 0.2 mm. (.01" x .005" - 01005)
 Much higher number of components and many more connections per
component.
 Fewer holes need to be drilled through abrasive boards.
 Simpler automated assembly.
 Small errors in component placement are corrected automatically (the surface
tension of the molten solder pulls the component into alignment with the solder
pads).
 Components can be placed on both sides of the circuit board.
 Lower resistance and inductance at the connection (leading to better
performance for high frequency parts).
 Better mechanical performance under shake and vibration conditions.
 SMT parts generally cost less than through-hole parts.
 Fewer unwanted RF signal effects in SMT parts when compared to leaded parts,
yielding better predictability of component characteristics.
 Faster assembly. Some placement machines are capable of placing more than
136,000 components per hour.

Pick and Paste Machines:

  During this part of the assembly process, the board with the added
solder paste is then passed into the pick and place process. Here a machine
loaded with reels of components picks the components from the reels or
other dispensers and places them onto the correct position on the board.

The components placed onto the board are held in place by the tension of the solder paste.
This is sufficient to keep them in place provided that the boar is not jolted.

In some assembly processes, the pick and place machines add small dots of
glue to secure the components to the board. However this is normally done
only if the board is to be wave soldered. The disadvantage of the process is
that any repair is made far more difficult by the presence of the glue,
although some glues are designed to degrade during the soldering process.

The position and component information required to programme the pick

and place machine is derived from the printed circuit board design
information. This enables the pick and place programming to be considerably
simplified.

Manual Insertion:
 In the Process of Manual Insertion the Components what are all the components left
which can be placed by the method of the manual insertion. The components which are
all larger to fix such as the Step down transformer, coil windings, cases to the capacitor
and resistor, heat sinks are placed by the process of the manual insertion .

Reflow Over:

IT Is a process in which a solder paste (a sticky mixture of powdered solder and flux)

is used to temporarily attach one or several electrical components to their contact pads,
after which the entire assembly is subjected to controlled heat, which melts the solder,
permanently connecting the joint. Heating may be accomplished by passing the
assembly through a reflow oven or under an infrared lamp or by soldering individual
joints with a hot air pencil.

Reflow soldering is the most common method of attaching surface mount components

to a circuit board. The goal of the reflow process is to melt the solder and heat the
adjoining surfaces, without overheating and damaging the electrical components. In the
conventional reflow soldering process, there are usually four stages, called "zones",
each having a distinct thermal profile: preheat, thermal soak (often shortened to
just soak), reflow, and cooling.

Pre – Heat Zone:

Maximum slope is a temperature/time relationship that measures how fast the

temperature on the printed circuit board changes. The preheat zone is often the
lengthiest of the zones and often establishes the ramp-rate. [1] The ramp–up rate is
usually somewhere between 1.0 °C and 3.0 °C per second, often falling between 2.0 °C
and 3.0 °C (4 °F to 5 °F) per second. If the rate exceeds the maximum slope, potential
damage to components from thermal shock or cracking can occur. Solder paste can
also have a spattering effect. The preheat section is where the solvent in the paste
begins to evaporate, and if the rise rate (or temperature level) is too low, evaporation of
flux volatiles is incomplete.

Thermal Soak Zone:

The second section, thermal soak, is typically a 60 to 120 second exposure for
removal of solder paste volatiles and activation of the fluxes (see flux), where the flux
components begin oxide reduction on component leads and pads. Too high or too low a
temperature can lead to solder spattering or balling as well as oxidation of the paste, the
attachment pads and the component terminations. Similarly, fluxes may not fully
activate if the temperature is too low. At the end of the soak zone a thermal
equilibrium of the entire assembly is desired just before the reflow zone. A soak profile
is suggested to decrease any delta T between components of varying sizes or if the
PCB assebly is very large. A soak profile is also recommended to diminish voiding in
area array type packages

Reflow Zone:

The third section, the reflow zone, is also referred to as the “time above reflow” or
“time above liquidus” (TAL), and is the part of the process where the maximum
temperature is reached. An important consideration is peak temperature, which is the
maximum allowable temperature of the entire process. A common peak temperature is
20-40°C above liquidus. This limit is determined by the component on the assembly with
the lowest tolerance for high temperatures (The component most susceptible to thermal
damage). A standard guideline is to subtract 5 °C from the maximum temperature that
the most vulnerable component can sustain to arrive at the maximum temperature for
process. It is important to monitor the process temperature to keep it from exceeding
this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the
internal dies of SMT components as well as foster intermetallic growth. Conversely, a
temperature that isn’t hot enough may prevent the paste from reflowing adequately.

Time above liquidus (TAL), or time above reflow, measures how long the solder is a
liquid. The flux reduces surface tension at the juncture of the metals to accomplish
metallurgical bonding, allowing the individual solder powder spheres to combine. If the
profile time exceeds the manufacturer’s specification, the result may be premature flux
activation or consumption, effectively “drying” the paste before formation of the solder
joint. An insufficient time/temperature relationship causes a decrease in the flux’s
cleaning action, resulting in poor wetting, inadequate removal of the solvent and flux,
and possibly defective solder joints. Experts usually recommend the shortest TAL
possible, however, most pastes specify a minimum TAL of 30 seconds, although there
appears to be no clear reason for that specific time. One possibility is that there are
places on the PCB that are not measured during profiling, and therefore, setting the
minimum allowable time to 30 seconds reduces the chances of an unmeasured area not
reflowing. A high minimum reflow time also provides a margin of safety against oven
temperature changes. The wetting time ideally stays below 60 seconds above liquidus.
Additional time above liquidus may cause excessive intermetallic growth, which can
lead to joint brittleness. The board and components may also be damaged at extended
times over liquidus, and most components have a well-defined time limit for how long
they may be exposed to temperatures over a given maximum. Too little time above
liquidus may trap solvents and flux and create the potential for cold or dull joints as well
as solder voids.

Cooling Zone:

The last zone is a cooling zone to gradually cool the processed board and solidify
the solder joints. Proper cooling inhibits excess intermetallic formation or thermal shock
to the components. Typical temperatures in the cooling zone range from 30–100 °C
(86–212 °F). A fast cooling rate is chosen to create a fine grain structture that is most
mechanically sound. Unlike the maximum ramp-up rate, the ramp–down rate is often
ignored. It may be that the ramp rate is less critical above certain temperatures,
however, the maximum allowable slope for any component should apply whether the
component is heating up or cooling down. A cooling rate of 4°C/s is commonly
suggested. It is a parameter to consider when analyzing process results.

AOI Machines:

Automated optical inspection (AOI) is an automated visual inspection of a wide

range of products, such as printed circuit boards (PCBs), LCDs, transistors, automotive
parts, lids and labels on product packages or agricultural products (seed corn or fruits).
In case of PCB-inspection, a camera autonomously scans the device under test (DUT)
for variety of surface feature defects such as scratches and stains, open circuits, short
circuits, thinning of the solder as well as missing components, incorrect components,
and incorrectly placed components. Agricultural inspections might check for variations in
part color, perhaps to find ripe fruit. AOI is a type of white box testing. It is commonly
used in the manufacturing process because it is a non-contact test method. AOI is able
to perform most of the visual checks performed previously by manual operators, and far
more swiftly and accurately. AOI systems are implemented at many stages through the
manufacturing process. They are used for inspecting parts that have limited and known
variations. For defect or flaw detection, the AOI system looks for differences from a
perfect part. There are systems capable of bare board inspection, Solder Paste
inspection (SPI), as well as inspecting the component placement prior to reflow, the
post-reflow component conditions, and post-reflow solder joints. These inspection
devices all have some common attributes that affect capability, accuracy, and reliability.

In this way AOI can be used to detect problems early in the production process.
Since faults cost more to fix later in the production process, it is essential to notice
problems early. For example, problems in the solder and assembly area of a PCB can
be seen early in the production process and information used to feedback quickly to
previous stages, avoiding the production of too many boards with the same problem.

Low costs and programming efforts make AOI a practical and powerful quality tool for
both prototypes and high-volume assembles. It is often paired with the testing provided
by boundary scan test, in-circuit test, x-ray test, and functional test. In many cases,
smaller circuit board designs are driving up the demand for AOI versus in-circuit test .

Inspection in surface-mount technology

The growing demand for Surface-mount technology equipment is reducing the need for

expensive rework and repair while increasing throughput. As PCB assembly
manufacturers aim for a zero-tolerance regime, the demand for pre-solder paste and
pre-reflow optical inspection equipment that detect faults such as poor quality solder
joints, tombstoning, and other post reflow defects is expected to rise significantly.
Technological improvements in AOI equipment have resulted in higher throughput,
repeatability, and reliability as well as increasing quality and production yields for the
PCB assembly manufacturers.

AOI's for a PCB board with components may inspect the following features:

 Area Defects
 Billboarding
 Component offset
 Component polarity
 Component presence/absence
 Component skew
 Excessive solder joints
 Flipped component
 Height Defects
 Insufficient paste around Leads
 Insufficient solder joints
 Lifted leads
 No-population tests
 Paste registration
 Severely damaged components
 Solder bridges
 Tombstoning
 Volume defects
 Wrong part

ICT Test:

In-circuit test (ICT) is an example of white box testing where an electrical probe

tests a populated printed circuit board (PCB), checking for shorts, opens, resistance,
capacitance, and other basic quantities which will show whether the assembly was
correctly fabricated. It may be performed with a bed of nails type test fixture and
specialist test equipment, or with a fixtureless in-circuit test setup.
A bed of nails tester is a traditional electronic test fixture which has numerous pins
inserted into holes in an Epoxy phenolic glass cloth laminated sheet (G-10) which are
aligned using tooling pins to make contact with test points on a printed circuit board and
are also connected to a measuring unit by wires. Named by analogy with a real-
world bed of nails, these devices contain an array of small, spring-loaded pogo pins;
each pogo pin makes contact with one node in the circuitry of the DUT (Device Under
Test). By pressing the DUT down against the bed of nails, reliable contact can be
quickly, simultaneously made with hundreds or even thousands of individual test points
within the circuitry of the DUT. The hold-down force may be provided manually or by
means of a vacuum pulling the DUT downwards onto the nails.

Devices that have been tested on a bed of nails tester may show evidence of this
after the fact: small dimples (from the sharp tips of the pogo pins) can often be seen on
many of the soldered connections of the PCB.

Typically, four to six weeks are needed for the manufacture and programming of such
a fixture. Fixture can either be vacuum or press-down. Vacuum fixtures give better
signal reading versus the press-down type. On the other hand, vacuum fixtures are
expensive because of their high manufacturing complexity. The bed of nails or fixture as
generally termed is used together with a in-circuit tester.

This technique of testing PCB's is being slowly superseded by Boundary

Scan techniques (Silicon Test Nails), Automated Optical Inspection, and built-in self-
test, due to shrinking product sizes and lack of space on PCB's for test pads.
Example test sequence

 Discharging capacitors and especially electrolytic capacitors (for safety and

measurement stability, this test sequence must be done first before testing any other
items)
 Contact Test (To verify the test system is connected to the Unit Under Test(UUT)
Components Used in the BTS:

Flexi Edge system module ( ESMA, 3HU)

* Module for BTS functionalities for internal and external connections

* Support to 6 DTRX modules (upto 12 TRXs)

Five main functions of the module:

 BTS O&M: SW downloading and storing, configuration arrangement and
alarams and clock managements.
 BTS integerated transport abis transmission.
 BB switching: Communication between modules via ethernet Switch.
 BB power distribution: Single point for power intake and power distribution for
all modules.
 Bts internal and external synchronoziation.

Basic structure of Flexi edge module

Flexi Edge Dual duplexer Module: (ER*A,1HU)

 Dual duplexer (DDU) module together with dual TRX creates a logical sector
module
 Min 1 DDU per sector is needed
 DDU is attached to DTRX module
DDU Provides:
 Duplex functionality to combine TX and RX signals to same antena feader
 Multi coupling
 2 Antena connections for(1 or 2 sectors)

DDU contains:
 2 Duplexer filters
 2 low noise ampljfiers with high or low gain support for RX signals
 2 Bias TS with vswr measurement functionality
 TRX loop is controlled throught DDU
 Common TRX loop for all TRXs in same sectors
 Loop can be performed eitherTX to any 8 RX outputs

Versions of Midland:
 Midland 900
 Midland PA 900
 Midland 1800
 Midland PA 1800

Versions of Odessa:
 Odessa PA 900
 Odessa 1800
 Odessa PA 1800

Flexi Packet Radio(FPR):

Flexi pocket radio is the transmitting and receiving device which is used to transfer
the data from one bts to another bts without using the wires like fiber optic cables or
optical fibre. Its operating frequenc ranges from 18- 26 GHZ. It uses WCDMA- Wide
band code division multiple access. It contains 1 modem and Midland unit.

Modem Phoenix Schematic block contains:

  RJ45 socket for electrical giga bit Ethernet with 48V DC Power.
 I/P Physical interface and power distribution
 GBIT ethernet tranceiver
 Ethernet Switch
 BB-Modem FPGA
 Clock distribution
 UP Control Transceiver
 RAM/Flash/Sleep
 RF interface
 PSU interface
 Fault finding
 Modem/radio control with tcp terminal

Third Generation(3G) Unit:

Unit – I PA lines

 Testing of power amplifier is done through the tester it takes 1 min & 35 secs
 Soldering of joints is done in the Power amplifiers.
 Assembling of the cases to the power amplifiers is done by screwing the joints
of the power amplifiers.

Unit – II Core assembly area

 The Thermo jel is applied to reduce and absorb the heat.
 Filtering, fixing,, scanning are done in the trx boards.
 TRX module boards takes 7 min & 45 secs for testing.
 Trx boards will be scaned and the HX frames will be fixed with the 23screws.
 Fillters will be covered with the 18 screws.
 Fans and power amplifiers will be fixed with theirs cases with 18 screws.
 2 more screws are fixed at the fans for corner.
  Pressure of the case will be tested the normal level of the pressure will be
40Kpa.
 The entire unit will be tested with the unit tester & it takes time 14 min & 30
Secs.

Packing Unit:
 At first Wooden pallot will be kept at floor.
 The cotton box will kept on the wooden pallot the dimensions of the cotton box
contains 31×31×31 cm. And it contains 81 cm width.
 The cotton boxes will hold Midlands and Odissa of 18 nos, ESMA upto 10
nos, 3G spare parts upto 6 nos, 3G transports upto 54 nos, and one
accessories box it contains set of adaptors and cables, and silica jel 2
pockets.
 After packing the box will be packet and the ESD barrier back cover will fixed
the cotton box and the air present inside the cover will be removed by the air
remover and packed and lifted to the Inbound area by throught the battery
cars
 CONCLUSION:
It’s been previlage to do In - plant training In one of the World’s largest
Telecommunication Producer NOKIA SIMENS. It has helped in many ways to improve the
knowledge about the actual work done in the industries and to have hands on Great
experience.