XDM SPEC A01 8 2 3 8 2 4 en PDF

XDM®
Version 8.2.3/8.2.4
System Specifications
417006-2009-013-A01
XDM System Specifications
V8.2.3/8.2.4
Catalog No: X38696
May 2011
2 nd Edition
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Contents
Overview................................................................................... 1-1
XDM® – Intelligent and Scalable Optical Networking Platforms ...................... 1-1
Unparalleled Capabilities .................................................................................. 1-2
XDM Platforms ................................................................................................. 1-4
Physical Description ............................................................... 2-1

XDM Shelf Configurations ................................................................................ 2-2
XDM-50 Card and Module Layout .................................................................. 2-32
MXC50 and ECU50 Cards ............................................................................. 2-33
XDM-100 Card and Module Layout ................................................................ 2-35
MXC and ECU Cards ..................................................................................... 2-37
MXC300 and ECU300 Cards ......................................................................... 2-41
MXC900 and ECU900 Cards ......................................................................... 2-46
XDM-40 Card Layout ...................................................................................... 2-48
XDM-400 Card Layout .................................................................................... 2-49
XDM-450 Card Layout .................................................................................... 2-50
XDM-500 Card Layout .................................................................................... 2-51
XDM-1000 Card Layout .................................................................................. 2-52
XDM-2000 Card Layout .................................................................................. 2-54
XDM-3000 Card Layout .................................................................................. 2-55
Control, Matrix, and I/O Cards for Large XDM Shelves ................................. 2-57
XDM-50 Specifications ............................................................ 3-1

Cross-Connect Specifications .......................................................................... 3-2
Traffic Protection .............................................................................................. 3-2
Redundancy ..................................................................................................... 3-2
Synchronization ................................................................................................ 3-2
Jitter and Wander ............................................................................................. 3-2
I/O Interfaces .................................................................................................... 3-3
Management .................................................................................................... 3-4
SDH Interfaces ................................................................................................. 3-5
Data Modules ................................................................................................... 3-8
Physical Specifications ................................................................................... 3-11
Environmental Conditions .............................................................................. 3-12
EMC ............................................................................................................... 3-13
Safety ............................................................................................................. 3-13
Reliability ........................................................................................................ 3-13
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Contents XDM System Specifications
XDM-100 Specifications .......................................................... 4-1

Redundancy ..................................................................................................... 4-3
I/O Interfaces .................................................................................................... 4-4
Management .................................................................................................... 4-5
SDH/SONET Interfaces.................................................................................... 4-6
Data Modules ................................................................................................. 4-13
Optical Amplifier Modules for TPU/OCU ........................................................ 4-19
GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for
Transponders/Combiners ............................................................................... 4-20
STM-1 SFP Optical supervisory channel transceivers for OSC1_2 ............... 4-21
CWDM Modules ............................................................................................. 4-21
EMC ............................................................................................................... 4-27
Safety ............................................................................................................. 4-27
Reliability ........................................................................................................ 4-28
XDM-300/900 Specifications ................................................... 5-1

Redundancy ..................................................................................................... 5-2
I/O Interfaces .................................................................................................... 5-3
Management .................................................................................................... 5-5
SDH/SONET Interfaces.................................................................................... 5-6
Data Modules ................................................................................................. 5-14
Optical Amplifier Modules for TPU/OCU ........................................................ 5-19
CWDM Modules ............................................................................................. 5-20
EMC ............................................................................................................... 5-26
Safety ............................................................................................................. 5-26
Reliability ........................................................................................................ 5-26
XDM-40, 400, 450, 500, 1000, 2000, and 3000

Specifications .......................................................................... 6-1
Electrical, Optical, and Mixed Basecard Information ........................................ 6-2
XDM Shelf Capacities ...................................................................................... 6-5
PDH/Async and SDH/SONET Interface Specifications .................................... 6-8
SDH/SONET Interfaces.................................................................................. 6-10
XDM MPLS/Ethernet Card Summary ............................................................. 6-22
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XDM System Specifications Contents
Data Cards ..................................................................................................... 6-22

Optical Components ....................................................................................... 6-32
C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for
DWDM)........................................................................................................... 6-62
CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) ...... 6-65
EMC ............................................................................................................... 6-73
Safety ............................................................................................................. 6-73
Reliability ........................................................................................................ 6-74
Management Specifications ........................................................................... 6-74
Other Specifications ....................................................................................... 6-75
Standards and References .................................................... A-1

Overview .......................................................................................................... A-1
Broadband Forum ............................................................................................ A-1
Environmental Standards ................................................................................. A-2
ETSI: European Telecommunications Standards Institute ............................... A-2
IEC: International Electrotechnical Commission .............................................. A-3
IEEE: Institute of Electrical and Electronic Engineers ...................................... A-4
IETF: Internet Engineering Task Force ............................................................ A-5
ISO: International Organization for Standardization ......................................... A-7
ITU-T: International Telecommunication Union ................................................ A-7
MEF: Metro Ethernet Forum ........................................................................... A-11
NIST: National Institute of Standards and Technology .................................. A-12
North American Standards ............................................................................. A-12
OMG: Object Management Group ................................................................. A-13
TMF: TeleManagement Forum ....................................................................... A-13
Web Protocol Standards ................................................................................ A-13
Index .......................................................................................... I-1
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List of Figures
Figure 1-1: Multiservice metropolitan optical network .................................................... 1-3
Figure 1-2: XDM shelves................................................................................................ 1-6
Figure 2-1: Basic XDM-50 shelf ..................................................................................... 2-2
Figure 2-2: XDM-50 with TPU (I/O protection) ............................................................... 2-3
Figure 2-3: Basic XDM-100 shelf ................................................................................... 2-4
Figure 2-4: XDM-100 with TPU (I/O protection) ............................................................. 2-5
Figure 2-5: XDM-100 nonredundant configuration ........................................................ 2-5
Figure 2-6: XDM-100H with one TPU/OCU shelf........................................................... 2-6
Figure 2-7: Basic XDM-300 shelf, horizontal installation ............................................... 2-7
Figure 2-8: Basic XDM-300 shelf, vertical Installation ................................................... 2-7
Figure 2-9: XDM-300 with TPU on top ........................................................................... 2-8
Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf ....................... 2-8
Figure 2-11: XDM-300 with two TPUs and an OCU ...................................................... 2-9
Figure 2-12: Basic XDM-900 shelf, horizontal installation ........................................... 2-10
Figure 2-13: Basic XDM-900 shelf, vertical Installation ............................................... 2-11
Figure 2-14: XDM-900 with TPU on top ....................................................................... 2-12
Figure 2-15: XDM-900 with TPUs on top and at the bottom ........................................ 2-13
Figure 2-16: XDM-900 with two TPUs and an OCU .................................................... 2-14
Figure 2-17: XDM-40 shelf layout ................................................................................ 2-15
Figure 2-18: XDM-400 shelf open view........................................................................ 2-15
Figure 2-19: XDM-450 platform.................................................................................... 2-16
Figure 2-20: XDM-500 shelf open view........................................................................ 2-17
Figure 2-21: XDM-1000 standard shelf open view ...................................................... 2-18
Figure 2-22: XDM-2000 open view .............................................................................. 2-19
Figure 2-23: XDM-3000 front view ............................................................................... 2-20
Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-22
Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI
recommended ETSI rack ............................................................................................. 2-23
Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-24
Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended
ETSI rack...................................................................................................................... 2-25
Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack ...................... 2-26
Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack ........................ 2-27
Figure 2-30: Two XDM-2000 shelves installed in a 2200 mm ECI recommended
ETSI rack...................................................................................................................... 2-28
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List of Figures XDM System Specifications
Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI

Figure 2-32: XDM-1000 and XDM-100H shelves installed in a 2200 mm ECI
Figure 2-34: XDM-50 slot allocation ............................................................................. 2-32
Figure 2-35: XDM-100 slot allocation ........................................................................... 2-35
Figure 2-38: XDM-40 card layout ................................................................................. 2-49
Figure 2-39: XDM-400 typical card layout.................................................................... 2-49
Figure 2-40: XDM-450 slot layout ................................................................................ 2-50
Figure 2-41: XDM-500 standard card layout ................................................................ 2-51
Figure 2-42: XDM-1000 standard card layout .............................................................. 2-53
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List of Tables
Table 3-1: STM-1 bidirectional transceivers ........................................................... 3-6
Table 4-3: STM-16 bidirectional transceivers ....................................................... 4-11
Table 5-4: GbE bidirectional transceivers ............................................................. 5-18
Table 6-1: STM-1 transceivers ............................................................................. 6-12
Table 6-2: STM-1 bidirectional transceivers ......................................................... 6-13
Table 6-3: STM-4 transceivers ............................................................................. 6-14
Table 6-4: STM-4 bidirectional transceivers ......................................................... 6-15
Table 6-5: STM-16 transceivers ........................................................................... 6-17
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List of Tables XDM System Specifications
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1
Overview
In this chapter:
XDM® – Intelligent and Scalable Optical Networking Platforms .................. 1-1
Unparalleled Capabilities ................................................................................ 1-2
XDM Platforms ............................................................................................... 1-4
XDM® – Intelligent and Scalable

Optical Networking Platforms
The telecommunications landscape is becoming more and more competitive.
Carriers and operators are demanding networking equipment that can do more
for less money. Today's networking equipment must be flexible, upgradeable,
and highly intelligent. It must be able to successfully integrate with equipment
produced by other manufacturers according to accepted industry standards.
Above all, today's networking equipment must be scalable, easy to operate and
maintain, and cost effective.
At ECI, we specifically addressed these issues when we designed the XDM
platforms. The XDM offers carriers unprecedented capacity, cost-savings, and
ease of integration, placing it at the forefront of the optical networking
revolution.
The XDM offers a series of outstanding advantages, including:
 Data-services – the XDM facilitates migration from voice-oriented to
data-oriented networks, combining the cost-effectiveness and universality
of Ethernet with the Quality of Service (QoS), scalability, and resilience of
SDH/SONET.
 Optical DWDM capabilities – the XDM implements low-cost all-optical
networks by offering sublambda grooming of multiple low-rate services
(including SDH/SONET, IP, ATM, and GbE) onto a single wavelength.
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Overview XDM System Specifications
 Versatility and interoperability – the XDM coexists in perfect harmony

with equipment from other vendors by enabling the free flow of
management information between network elements. Its management
software facilitates smooth integration with other high-level management
systems.
 Readiness for future architectures – thanks to its inherently modular
build-as-you-grow™ architecture, the XDM gives carriers the ability to
meet all of tomorrow's networking environments, be they ring, star, or
mesh.
The innovative design of the XDM meets all the requirements of modern
transmission networks in a single shelf, consolidating key networking
technologies in a modular infrastructure to create the world's most
accommodating and scalable single-shelf platform. XDM operators can choose
to use only the features required based on current demands, and add functions
and services as requirements grow. This results in flexible and scalable
platforms that provide dynamic multiservice provisioning while reducing both
capital expenditures (CAPEX) and operating expenses (OPEX).
Unparalleled Capabilities
Typical metro networks span distances anywhere from 10 km to 300 km,
serving large bandwidth-hungry areas. Equipment serving these networks must
therefore be able to interconnect a wide range of protocols, from business
customers in the access layer to service providers in the backbone.
As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly
integrates multiple network types, traffic types and technologies, including:
 SDH/SONET
 Bitrates ranging from E1 all the way up to STM-64/OC-192
 Large nonblocking matrix for full connectivity
 Variety of port densities that can fit into any network layer from the
network termination unit all the way up to the central office
 Optical
 High density of lambdas (40 to 80) in the C band
 Ability to add/drop any lambda at any site
 Ability to provide metro solutions without amplification
 Long-haul solutions up to 1500 km
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XDM System Specifications Overview
 Data
 Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet
services, from 10BaseT all the way up to GbE
 Ability to route data over SDH/SONET or DWDM
 Additional cards can be added as needed, to reduce cost and protect
against over-expansion
 Cellular
 Aggregates ATM traffic to optimize bandwidth utilization
 Unifies 2G and 3G networks
As a digital cross connect, the XDM offers VC-12 granularity (STS-1 for
SONET) within a 60 Gbps fabric. Several cross connect types are available,
including broadband, wideband, and integrated broadband/wideband, all of
which comply with applicable standards.
The XDM does all of this while maintaining high levels of performance and
reliability. Moreover, the inherent DWDM capabilities of the XDM provide
operators with an intelligent infrastructure offering virtually unlimited
expansion paths.
The multilayer multiservice functionality of the XDM enables you to:
 Migrate from today's ring topologies to mesh architectures, segment by
segment
 Add and activate bandwidth as requirements change
 Provide on-demand services across multiple network layers
Figure 1-1: Multiservice metropolitan optical network

XDM Platforms
The XDM family of integrated optical platforms consolidates key networking
technologies in a modular infrastructure that integrates all the transport
functions of a complete Point of Presence (POP) in a single shelf-sized
element. Cards can be interchanged between the various platforms, ensuring a
flexible build-as-you-grow architecture for transporting all types of traffic,
including voice, ATM, IP, and data.
These technical specifications address the following XDM shelf configurations:
 XDM®-50 – The Do-It-All MSPP for Up-and-Coming Networks – ultra
compact platform, designed to provide a swift response to evolving
network requirements. It brings greater levels of flexibility to metropolitan
and cellular networks, and is emerging as a solid solution for these focused
and highly cost-sensitive markets.
 XDM®-100 – Miniature MSPP for Metro-Access and Cellular
Networks – an intelligent integrated system that offers operators a
cost-effective flexible approach to maximizing bandwidth utilization, while
delivering both enhanced data services and traditional voice services.
 XDM®-300 – Flexible MSPP for Metro Aggregation Applications –
designed for metro aggregation applications and cellular Radio Access
Network (RAN) infrastructure. The platform is optimized for cost- and
physical size-effective implementation of MADM-64 and MADM-16
network elements.
 XDM®-900 – MSPP for High-Capacity Central Exchange Applications
– designed for high-capacity central exchange applications, the XDM-900
is optimized for the metro-core and features unprecedented port densities.
As a digital cross connect, the XDM-900 forms a fully protected mesh core.
As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-900 provides connectivity between central office legacy
switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs
over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently
grooming traffic from edge rings.
 XDM®-40 – Modular C/DWDM and OTN Platform for Metro-Access
and CPE Applications – enables service providers to build end-to-end
flexible standards-based OTN solutions that address the growing demand
for business data transport. It gives service providers the flexibility to take
full advantage of their existing networks, while providing a smooth and
fully supported migration to IP over optics.

XDM System Specifications Overview
 XDM®-400 – Aggregator for Metro-Edge Networks – an innovative

product optimized for optical metro-access and cellular applications. When
equipped with high-power long-haul optical devices, it provides an
excellent solution for regional applications spanning distances of up to
1500 km.
 XDM®-450 – Standalone Computer Control Panel (CCP) shelf for
optics overlay – provides an efficient cost-effective way to add optical
capacity to your network configuration and serves as an add-on to host
additional OMs such as amplifiers and ROADMs. The XDM-450 is
especially valuable for use with the XDM-300, XDM-1000, XDM-2000,
XDM-3000, and ECI's CESR 9000 platforms, enabling a smooth DWDM
upgrade path and supporting alien lambda extensions.
 XDM®-500 – Data-Aware Access Gateway – designed for medium
interface capacities and street-cabinet installations, the XDM-500 is a
compact optical platform optimized for the metro-edge. It provides
traditional broadband services and highly advanced data services like
adaptive-rate Gigabit Ethernet, sophisticated Layer 2 Ethernet, POS, and
lambda. It can be used either as a simple ADM or as an edge
multi-ADM/TM shared between several rings, providing distributed cross
connectivity and concentration of low-rate services.
 XDM®-1000 – MSPP for High-Capacity Central Exchange
Applications – designed for high-capacity central exchange applications,
the XDM-1000 is optimized for the metro-core and features unprecedented
port densities.
As a digital cross connect, the XDM-1000 forms a fully protected mesh
core. As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-1000 provides connectivity between central office legacy
switches over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs
over native Fast Ethernet, Gigabit Ethernet, or POS, while efficiently
grooming traffic from edge rings.
 XDM®-2000 – Multifunctional Intelligent Optical Switch – designed for
the metro and metro-regional core, the XDM-2000 is optimized for pure
DWDM and hybrid optical applications. This is a highly dense DWDM
platform that provides intelligent sublambda grooming and optimum
wavelength utilization.
As the most flexible optical switch on the market today, the XDM-2000
transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and
integrates the most advanced optical units with a variety of interfaces and a
sophisticated high-capacity matrix in one small low-cost package.

 XDM®-3000 – High Capacity Metro-Core MSPP – the 240 Gbps

capacity is ideal for regional metro-core networks. The XDM-3000 is
designed for ever-expanding optical transport traffic demands, with
network migration to n x 10G interfaces increasing the bulk bandwidth
requirements for core platforms. The high capacity of the XDM-3000
relieves metro-core network bottlenecks while enabling network expansion
and improved BW efficiency through the use of 10 Gbps cards to maximize
utilization of available slots.
As a multi-ADM, the XDM-3000 provides multi-ring closure,
simultaneously closing STM-16/STM-64 core MSSPRing and multiple
edge SNCP rings, and providing improved protection and restoration
capabilities. The XDM-3000 can also be used as a cost-effective DXC for
heavy traffic sites, forming a fully protected mesh core. The large amount
of low-order traffic handled by this platform enables full connectivity for
TDM networks.
Figure 1-2: XDM shelves

2
Physical Description
In this chapter:
XDM Shelf Configurations ............................................................................. 2-2
XDM-50 Card and Module Layout ............................................................... 2-32
MXC50 and ECU50 Cards ............................................................................ 2-33
XDM-100 Card and Module Layout ............................................................. 2-35
MXC and ECU Cards .................................................................................... 2-37
MXC300 and ECU300 Cards ........................................................................ 2-41
MXC900 and ECU900 Cards ........................................................................ 2-46
XDM-40 Card Layout ................................................................................... 2-48
XDM-400 Card Layout ................................................................................. 2-49
XDM-450 Card Layout ................................................................................. 2-50
XDM-500 Card Layout ................................................................................. 2-51
XDM-1000 Card Layout ............................................................................... 2-52
XDM-2000 Card Layout ............................................................................... 2-54
XDM-3000 Card Layout ............................................................................... 2-55
Control, Matrix, and I/O Cards for Large XDM Shelves .............................. 2-57

Physical Description XDM System Specifications
XDM Shelf Configurations

This section describes the XDM shelf configurations and slot assignments.
XDM-50 Shelf Layout

The XDM-50 is available in two configurations:
 Basic XDM-50 shelf with 21 protected E1 interfaces
 XDM-50 with I/O protection
Basic XDM-50 shelf

The basic XDM-50 shelf is housed in a 231 mm deep, 443 mm wide, and 129
mm high equipment cage. The lower part of the shelf consists of the card cage
and accommodates the MXC50 (Main Cross connect and Control) cards (main
and protection), the ECU50 (External Connection Unit), the CCP50_2
(Common Connection Panel), and the INF50 (Input Filter) cards. The upper
part of the shelf consists of the module cage that houses up to four I/O
modules. Various types of interface modules supporting PDH, SDH, and data
services are available.
The FCU50 fan control unit at the right side of the shelf provides cooling air to
the system.
Electrical connections are located directly in the tributary modules, except for
the CCP50_2, which provides electrical connection to the PDB_21 (PDH
Daughter Board) residing in the MXC50.
To support system redundancy, the XDM-50 contains two INF50 units with
connectors for two input power sources.
Figure 2-1: Basic XDM-50 shelf

XDM System Specifications Physical Description
XDM-50 with I/O protection

A Tributary Protection Unit (TPU) is mounted on top of the basic XDM-50
shelf to provide I/O protection to the I/O modules. The TPU adds only 75 mm
to the basic shelf height, allowing it to remain ultra compact in size. It has five
slots, four allocated for Tributary Protection Modules (TPMs) and one for a
Tributary Control (TC) or Tributary Control and Fan (TCF) module.
Each TPM is connected to both operating and protection I/O modules in the
shelf, in a 1:1 or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the TC (or TCF) switches the traffic from the active to
the protection I/O module.
Figure 2-2: XDM-50 with TPU (I/O protection)
XDM-100 Shelf Layout

The XDM-100 is available in four configurations:
 Basic XDM-100 shelf
 XDM-100 with I/O protection
 Nonredundant XDM-100
 Hybrid XDM-100H

Basic XDM-100 shelf

mm high equipment cage. The lower part of the shelf consists of the card cage
and accommodates the MXC-100 cards (main and protection) and the ECU.
The upper part of the shelf consists of the module cage that houses up to eight
I/O modules. Various types of interface modules supporting PDH, SDH, and
data services are available. The FCU fan control unit at the right side of the
shelf provides cooling air to the system.
All electrical connections are located directly in the tributary modules;
therefore, the XDM-100 does not need additional electrical interface
connections.
To support system redundancy, each MXC card contains an integrated xINF
(XDM Input Filter) unit with connectors for two input power sources.
Figure 2-3: Basic XDM-100 shelf

XDM-100 with I/O protection

A TPU is mounted on top of the basic XDM-100 shelf to provide I/O
protection to the I/O modules. The TPU adds only 75 mm to the basic shelf
height, allowing the XDM-100 to remain compact in size. It has five slots, four
allocated for TPMs and one for a TC module.
shelf in a 1:1, 1:2, or 1:3 configuration. If a failure is detected in one of the
operating I/O modules, the TC switches the traffic from the active to the
protection I/O module.
Figure 2-4: XDM-100 with TPU (I/O protection)
Nonredundant XDM-100
NOTE: The nonredundant XDM-100 configuration is not

recommended for data applications.
The nonredundant XDM-100 has the same physical dimensions as the basic
shelf. It differs only by the single MXC-100 card that it has in slot MXC A,
compared with two cards in the basic shelf. Slot MXC B of the nonredundant
configuration accommodates a bridging unit, MXC-BR. No redundancy is
provided for the MXC-100 functions.
Figure 2-5: XDM-100 nonredundant configuration

XDM-100H
The XDM-100H combines the SDH/SONET and data capabilities of the
XDM-100 with the optical CWDM capabilities. This is provided by the
software cost option incorporated within the NVM card in each of the
MXC-100 cards.
The XDM-100H consists of the basic XDM-100 shelf, and if required, one or
two TPU/OCU shelves. The I/O module cage can accept any mix of the
XDM-100 I/O modules and CWDM I/O modules.
The TPU/OCU shelf is identical in its physical dimensions and number of slots
(five) to the TPU. Four of the slots can house any mix of TPMs and CWDM
optical networking modules (mux/demux, OADM, and splitter/coupler); the
fifth slot always accommodates a TC module.
Figure 2-6: XDM-100H with one TPU/OCU shelf

The XDM-300 is available in following configurations:
 Expanded XDM-300 with I/O protection as follows:
 A TPU mounted on top of the basic shelf.
 A TPU mounted at the bottom of the basic shelf.
 Two TPUs mounted, one on top and one at the bottom of the basic
shelf.
 Expanded XDM-300 with enhanced CWDM networking capabilities. An
OCU is mounted on top of the basic shelf, or on the expanded shelf (with a
TPU).

Basic XDM-300 shelf

mm high equipment cage. The upper part of the shelf consists of a module cage
(upper module cage) and houses up to eight I/O modules. In the middle of the
shelf is a card cage that accommodate the MXC300 cards (main and
protection), the External Connection Unit (ECU300), and up to two I/O cards.
The lower part of the shelf consists of an additional module cage (lower
module cage) that can be equipped with up to eight I/O modules.
I/O protection is not supported in this option.
The XDM-300 shelf can be installed in a horizontal or vertical position.
Figure 2-7: Basic XDM-300 shelf, horizontal installation
Figure 2-8: Basic XDM-300 shelf, vertical Installation

Expanded XDM-300 with I/O Protection

TPUs can be attached to the XDM-300 shelf to protect installed I/O modules.
operating I/O modules, the active MXC300 via the TC module in the TPU
switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
 A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
 A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
 Two TPUs mounted one on top and one at the bottom of the basic shelf;
provide protection to I/O modules in both the upper and lower module
cages.
Figure 2-9: XDM-300 with TPU on top
Figure 2-10: XDM-300 with TPUs on top and at the bottom of the shelf

Expanded XDM-300 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-300 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the

XDM-300 shelf.
Figure 2-11: XDM-300 with two TPUs and an OCU


The XDM-300 is available in following configurations:
 Expanded XDM-900 with I/O protection as follows:
 A TPU mounted on top of the basic shelf.
 A TPU mounted at the bottom of the basic shelf.
 Two TPUs mounted, one on top and one at the bottom of the basic
shelf.
 Expanded XDM-900 with enhanced CWDM networking capabilities. An
OCU is mounted on top of the basic shelf, or on the expanded shelf (with a
TPU).
Basic XDM-900 shelf

mm high equipment cage. The upper part of the shelf consists of a module cage
(upper module cage) and houses up to eight I/O modules. In the middle of the
shelf is a card cage that accommodate the MXC900 cards (main and
protection), the External Connection Unit (ECU900), and up to two I/O cards.
The lower part of the shelf consists of an additional module cage (lower
module cage) that can be equipped with up to eight I/O modules.
I/O protection is not supported in this option.
The XDM-900 shelf can be installed in a horizontal or vertical position.
Figure 2-12: Basic XDM-900 shelf, horizontal installation

Figure 2-13: Basic XDM-900 shelf, vertical Installation

Expanded XDM-900 with I/O Protection

TPUs can be attached to the XDM-900 shelf to protect installed I/O modules.
operating I/O modules, the active MXC900 via the TC module in the TPU
switches the traffic from the active I/O module to the protection module.
Several protection configurations are possible:
 A TPU mounted on top of the basic shelf, protects I/O modules residing in
the upper module cage.
 A TPU mounted at the bottom of the basic shelf, protects I/O modules
installed in the lower module cage.
 Two TPUs mounted one on top and one at the bottom of the basic shelf;
provide protection to I/O modules in both the upper and lower module
cages.
Figure 2-14: XDM-900 with TPU on top

Figure 2-15: XDM-900 with TPUs on top and at the bottom

Expanded XDM-900 with CWDM Networking

Capabilities
An OCU can be mounted on top of a basic XDM-900 shelf or on top of an
expanded shelf to add enhanced CWDM networking capabilities to the
platform.
NOTE: An OCU is not supported at the bottom of the

XDM-900 shelf.
Figure 2-16: XDM-900 with two TPUs and an OCU

XDM-40 Shelf Layout

The compact XDM-40 shelf is located in a 285 mm deep, 447 mm wide, and
256 mm high equipment cage. The cards cage houses two I/O slots for optical
cards (transponders, combiners, and/or optical amplifiers). The upper cage
houses two slots for the DWDM/amplifier modules. The shelf also includes an
xMCP_B, MECP, two xINF40s, and an xFCU40 that includes three separate
fans to support system redundancy.
Figure 2-17: XDM-40 shelf layout

The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and
500 mm high equipment cage. It consists of a single-row cage housing I/O,
matrix, processor, and common cards in the middle and right side of the shelf.
The electrical interface connection modules are housed in two slots on the left
side of the shelf. The shelf also contains two xINF4 (XDM-400 Input Filter)
units and an xFCU4 (XDM-400 Fan Control Unit) that consists of five separate
fans that provide system redundancy.
Figure 2-18: XDM-400 shelf open view


The standard XDM-450 is located in a 275 mm deep, 492 mm wide, and
374 mm high shelf with a single cards cage section. The shelf consists of a
single-row cage housing the DWDM, processor, and common cards. The shelf
also has two xINF and an xFCU unit.
Figure 2-19: XDM-450 platform


The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage. The shelf consists of a single-row cage housing
the I/O, matrix, processor, and common cards in two slot areas on either side of
the shelf. The electrical interface connection modules and DWDM/OADM
modules are housed in the central slot area. The shelf also has two xINF and
three xFCU units.
Figure 2-20: XDM-500 shelf open view


The standard XDM-1000 is located in a 285 mm deep, 450 mm wide, and 1100
mm high shelf with a modules cage and a cards cage section. The cards cage
houses the I/O, matrix, processor, and common cards. The modules cage
houses the electrical interface connection modules and DWDM/OADM
modules. The shelf also has two xINFs and three xFCUs.
Figure 2-21: XDM-1000 standard shelf open view


The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm
high equipment cage. The shelf consists of a single-row cage that houses
optical cards (transponders, mux/demux, optical amplifiers), and
xMCP/xMCP_B and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular
XDM-1000 shelf in the same rack.
Figure 2-22: XDM-2000 open view


The XDM-3000 is located in a 350 mm deep, 492 mm wide, and 1550 mm
high shelf. The XDM-3000 consists of an I/O card cage arranged in four
sections, together with additional power, communication, and control units.
Figure 2-23: XDM-3000 front view

Rack Layouts and Expansion Shelves

XDM shelves can be installed in both standard and ECI recommended ETSI
racks, as well as in 19" and 23" racks. They can also be installed in 19" 7' and
23" 7' bay racks, except for the XDM-50, XDM-100, and XDM-300 that
cannot be installed in 19" 7'bay racks.
The recommended ETSI rack offered by ECI is specially designed for
installation of telecommunication equipment and a wide range of equipment
accessories. To facilitate cable routing, the rack has removable rear and side
panels which enable tidy leading and efficient maintenance of all rack cables.
Two plastic conduits on the rack's front rails support routing of up to 200
optical fibers. It also has open top and bottom frames to facilitate easy routing
of cables from suspension floors and/or ceiling ladders. The front door can be
mounted for right or left opening.
The XDM-50, XDM-100, or XDM-300 can be installed in either 2200 mm or
2600 mm standard or ECI recommended ETSI racks.
NOTE: Installations of XDM-50, XDM-100, or XDM-300 in

19" racks must be approved by ECI's Transport Networks
Division – Mechanical Department.

Figure 2-24: Three XDM-50 shelves in a 2600 mm ECI recommended ETSI rack

Figure 2-25: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI recommended

ETSI rack

Figure 2-26: Two XDM-300 shelves in a 2600 mm ECI recommended ETSI rack
The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack.

Two XDM-1000 shelves can be installed in a 2600 mm rack, whereas a
2200 mm rack can accommodate only a single XDM-1000 shelf.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a
2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf
can be installed in a 2600 mm rack.
The installation of XDM-500, XDM-1000, and XDM-2000 in 19" or 23" racks
is supported as well.

In addition, a 600 mm deep rack can house XDM shelves in a back-to-back

configuration, thus doubling the capacity of the rack.
Figure 2-27: XDM-1000 and XDM-500 shelves in a 2600 mm ECI recommended

ETSI rack

Figure 2-28: Two XDM-500 shelves installed in a 2200 mm ETSI rack

Figure 2-29: Two XDM-40 shelves installed in a 2200 mm ETSI rack


ETSI rack


ETSI rack


recommended ETSI rack


recommended ETSI rack

XDM-50 Card and Module Layout

Basic XDM-50 Shelf
The basic XDM-50 cage contains slots for I/O interface modules and dedicated
slots for the MXC50, CCP50, INF50, and ECU50. The cage's design and
mechanical practice conform to international mechanical standards and
specifications.
The modules and cards are distributed as follows:
 Four (4) slots, I1 to I4, optimally allocated for I/O interface modules.
 Two (2) slots, A and B respectively, allocated for the MXC50s (main and
protection). Each MXC50 has three slots (A1, A2, A3 and B1, B2, B3) to
accommodate SDH aggregate SFP transceivers.
 One (1) slot allocated for the CCP50_2.
 Two (2) slots allocated for INF50 cards.
 One (1) slot allocated for the ECU50.
The CCP50_2 provides the physical connection to 21 E1 interfaces in the
PDB2_21 residing in the MXC50.
Two INF50 filter cards, with inputs for two sources, support system DC
redundancy.
The ECU50 is located beneath the MXC50s. Its front panel features several
interface connectors for management, external timing, alarms, orderwire and
overhead (future release). It also includes colored alarm severity LED
indicators.
Figure 2-34: XDM-50 slot allocation

Expanded XDM-50 Shelf with I/O Protection

A TPU can be mounted on top of the basic XDM-50 shelf to add protection of
electrical I/O modules. The modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot, double-slot, or
triple-slot modules are supported)
 One (1) slot allocated for the TC or TCF
Each TPM is connected to the operating and protection modules of the
XDM-50 shelf respectively. If a failure is detected in one of the operating I/O
modules, the XDM-50 control system sends control signals to the appropriate
TPM relays to switch traffic from the operating I/O module to the protection
module. Several types of TPMs for 1:1 or 1:3 protection schemes are
supported.
The TC or TCF is connected to the DC and control buses of the MXC50 cards
via the TPU backplane. It controls the switching of traffic from the main to
protection I/O module by relays in the corresponding TPM. In addition, the
TCF has three fans that provide cooling air to the modules installed in the TPU
(optional).
MXC50 and ECU50 Cards

The MXC50 and ECU50 were designed to facilitate simple installation and
maintenance. They feature:
 Easy routing of external management interfaces
 Hot insertion of cards and modules to support quick and
non-traffic-affecting maintenance and repair
MXC50
The MXC50 performs the shelf's cross-connect, timing, and multiplexing
functions, including:
 Multiplexer control and traffic processing.
 SDH traffic cross-connect. The switch handles aggregate and tributary
interface traffic with a capacity of 128 x STM-1 (64 x STM-1 in use)
equivalents.
 Timing and synchronization.
 Routing and handling of 16 DCC channels.
The XDM-50 supports several types of cross connects in compliance with
applicable ITU-T and Telcordia standards. These include broadband,
wideband, and integrated broadband/wideband cross connects.

ECU50 and ECU50R

The ECU50 is the alarms and maintenance card. It is available in two versions:
ECU50 and ECU50R. The functions of both cards are similar; the main
difference is that the ECU50R does not support OW. The ECU50 provides a
variety of interfaces and indicators, as follows:
 RS-232 serial interface for a craft terminal
 Ethernet RJ45 interface for Lightsoft® and EMS-XDM®
 Alarm severity outputs (Critical, Major, Minor, Warning) and external
alarm outputs and inputs (D-type SCSI connector)
 External synchronization inputs/outputs (T3/T4)
 Alarms and status display
 Analog orderwire (OW) circuit, providing point-to-point or conference
engineering orderwire voice connection for technical staff use (future
release)
 Pushbuttons for LED tests, forced laser activation during ALS, alarms
cutoff (ACO), and OW circuit (future release)
 NET SEL switch (A/B)
 Optional USB interface (future use, for craft terminal)

XDM-100 Card and Module

Layout
Basic XDM-100 Shelf
The basic XDM-100 cage contains slots for I/O interface modules, and
dedicated slots for the MXC cards and the ECU. The cage's design and
mechanical practice conform to international mechanical standards and
specifications.
The modules and cards are distributed as follows:
 Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules.
 Two (2) slots, A and B respectively, allocated for the MXC cards (main and
protection). Each MXC has two slots (A1 and A2 and B1 and B2) to
accommodate SDH/SONET aggregate modules.
 One (1) slot allocated for the ECU.
The ECU is located beneath the MXC cards. Its front panel features several
interface connectors for management, external timing, alarms, orderwire, and
overhead (future release). It also includes colored alarm severity LED
indicators and selectors, and a display for selecting specific modules and ports
for monitoring purposes.

Expanded XDM-100 Shelf with I/O

Protection
A TPU can be mounted on top of the basic XDM-100 shelf to add protection of
electrical I/O modules. The modules are distributed as follows:
 Four (4) slots flexibly allocated for TPMs (single-slot or double-slot
modules are supported)
 One (1) slot allocated for the TC or TCF module
module. Several types of TPMs for 1:1, 1:2, or 1:3 protection schemes are
supported.
The TC or TCF is connected to the DC and control buses of the MXC cards via
the TPU backplane. It controls the switching of traffic from the main to
TCF has four fans that provide cooling air to the modules installed in the TPU
(optional).
Nonredundant XDM-100 Shelf

The XDM-100 is also available in a nonredundant configuration. This shelf is
equipped with only one MXC. The second position of the MXC houses an
MXC-BG card that bridges the buses of the second slot to the I/O modules.
Redundancy for power supply, timing and synchronization, cross-connect, and
all other MXC functions is not supported in this configuration. However, since
the MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic
protection mechanisms are supported.

XDM-100H Shelf
The XDM-100H platform is based on the basic XDM-100 shelf, with a
software cost option that supports installation of any mix of the XDM-100 I/O
modules with optical I/O modules in the module cage. In addition, one or two
TPU/OCU shelves can be mounted on top of the basic shelf to support any mix
of TPM and CWDM optical networking modules.
The XDM-100H consists of the following units:
 Basic XDM-100 shelf that includes the ECU or ECU-F, two MXC-100
cards, the I/O module cage with eight slots, and the FCU. Each MXC-100
card houses an NVM module which contains the licensed option software.
The eight slots of the I/O module cage support installation of XDM-100 I/O
modules, as well as CWDM I/O modules (transponders and combiners).
 TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf. It
contains five (5) slots: four (4) for supporting any mix of mux/demux,
OADM, splitter/coupler, and TPM modules, and one (1) for a TC module.
One or two TPU/OCUs can be mounted on the basic XDM-100 shelf.
MXC and ECU Cards

The MXC and ECU were designed to facilitate simple installation and
 Electrical interface connectors that are integrated into the I/O modules,
saving the need for separate electrical interface modules
 Monitoring system for acceptance test purposes

MXC
Two types of MXC cards are available:
 MXC-100 – used in XDM-100. It has two slots for housing aggregate
modules in XDM-100. Two MXC-100 cards are usually installed in the
XDM-100, providing 1+1 protection.
 MXC-100B – supported only for XDM-100. Features enhanced
cross-connect and timing functionality, and also supports OW.
The basic and expanded versions of the XDM-100 shelf accommodate two
identical MXC cards. By default, the MXC-A is the main card and MXC-B is
the protection card.
Both cards perform the following functions simultaneously in a 1+1 protection
configuration:
 Communication and control
 Alarm and maintenance
 Cross-connect
 Timing and synchronization
 Distribution of power supply to all modules
 Routing and handling of 32 DCC channels
 Support for OW in conjunction with ECU100B (only MXC-100B)
In addition, the MXC accommodates the NVM compact flash memory card and
houses SDH/SONET aggregate modules (SAMs).
The additional MXC card provides 1+1 protection to the cross-connect matrix
and full 1:1 protection to all other functions, since the standby MXC has an
identical database to the active MXC.
In case of a hardware failure in the active MXC or in its traffic
interconnections, the I/O interface modules switch to the protection MXC
within 50 ms. Similarly, in case of a hardware failure in the TiMing Unit
(TMU) of the operational MXC card, the backup TMU takes over the timing
control with no disruption in traffic. The operational MXC card is configured
by LightSoft, ECI's Optical Network Division's multidimensional network
manager.

ECU
The ECU connects management, alarms, overhead access, and orderwire
interfaces to the active MXC card. This card also provides the physical
connections for these interfaces.
Two types of ECU cards are available:
 ECU-F – supports full functionality, is usually used in the XDM-100
 ECU – supports reduced functionality and can also be used in XDM-100
installations
The ECU-F supports the following management and alarm interfaces and
functions:
 Ethernet interface to LightSoft and EMS-XDM
 Ethernet hub for multiple NE connections
 Serial RS-232 interface for craft terminal
 USB interface
 Synchronization inputs and outputs (T3/T4)
 Alarm severity outputs (Critical, Major, Minor, Warning)
 External alarm outputs and inputs
 Alarm Cut Off (ACO)
 Operation and alarm LEDs
 Selection and display of traffic interfaces for monitoring purposes
 Monitor interface for STM-1/OC-3 ports
 Laser activation during ALS, for maintenance purposes
 Multiplexer reset
 Holdup capacitors
 Lamp test activation
The ECU supports all functions provided by the ECU-F except for Ethernet
expansion to hub, monitoring points, holdup capacitors, and alarms in/out.


Layout
Basic XDM-300 Shelf
The basic XDM-300 shelf is 443 mm wide, 246 mm deep and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU300. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
 ECU300 or ECU300-F
 Two MXC300 cards (main and protect)
 Up to two quad I/O cards
NOTE: The slots of the quad I/O cards can be adapted to

accommodate one SIM16_1 I/O module each instead of the
I/O cards by using a mechanical adapter.
The upper and lower parts of the shelf consist of a module cage with eight
horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or
data) single slot modules, totaling a maximum of 16 modules.


Protection
In an expanded XDM-300 shelf with I/O protection, one or two TPUs are
mounted on the top and/or at the bottom of the basic shelf, including a TC or
TCF module and TPMs. An OCU with CWDM networking modules can be
mounted on top of a basic or expanded shelf.
The TPU modules are distributed as follows:
supported.
The TC or TCF is connected to the DC and control buses of the MXC300 cards
(optional).


MXC300
The XDM-300 is a redundant platform, and two MXC300 cards must always
be installed in slots MXC-A and MXC-B of the XDM-300 shelf.
The MXC300 performs the following functions:
 Communications and control (by CPU):
 Routing and handling of 64 DCC channels
 Control of all shelf cards and modules
 Management interface
 Support of the 256 Mb NonVolatile compact flash Memory (NVM)
card
 Alarms and maintenance
 Control of TPU/OCU shelves
 2.5 Gbps capacity for all I/O module slots, and 10 Gbps for I/O card
slots
 SDH-related functions:
 SDH timing and synchronization
 SDH cross connect 4/3/1
 60 Gbps HO/LO nonblocking matrix
 Support for CWDM I/O modules (transponders and combiners) in all I/O
module slots
 DC voltage supply:
 One 48 V DC power input that supplies voltages for all cards and
modules
 Input Filtering (INF) function for the entire shelf
 Voltage and control for Fan Control Unit (VFCU)

ECU300
Two types of ECU300 cards are available:
 ECU300-F – supports full functionality
 ECU300 – supports reduced functionality
ECU300F
The ECU300-F supports:
 Management interfaces:
 Management (LightSoft and EMS-XDM) interface (Ethernet)
 Ethernet hub for the connection of multiple NEs
 Serial (RS-232) interface for craft terminal
 Alarm interfaces and indications, including:
 Alarm severity outputs (Critical, Major, Minor, Warning)
 External alarm outputs and inputs to client or xRAP-B/xRAP-100
 ACO
 LEDs for display of operation and alarms
 Traffic monitoring, including:
 Selection and display of the traffic interface channel currently being
monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
 Monitor interface for STM-1 ports
 Activations, including:
 Laser activation during ALS for maintenance purposes
 LEDs test for the entire shelf
 Hold-up capacitors

ECU300
The ECU300 card is suitable for sites that do not require alarms dry-contacts,
output system monitoring, and Ethernet hub for management. It supports:
 Management interfaces, including:
 External alarm outputs and inputs to client or xRAP-B/xRAP-100
 ACO
 LEDs for the display of operation and alarms

Layout
Basic XDM-900 Shelf
The basic XDM-900 shelf is 443 mm wide, 246 mm deep and 350 mm high.
When the optional TPUs or OCU are attached to the shelf, each of these
expansion shelves adds 75 mm to the height of the basic shelf.
The rightmost slot of the shelf houses the FCU900. The middle part of the shelf
consists of the cards cage with five horizontal slots which accommodate:
 ECU900 or ECU900-F
 Two MXC900 cards (main and protect)
 Two ACP900 modules each in an MXC900
 Up to two quad I/O cards
NOTE: The slots of the quad I/O cards can be adapted to

accommodate one SIM16_1 I/O module each instead of the
I/O cards by using a mechanical adapter.

The upper and lower parts of the shelf consist of a module cage with eight
horizontal slots. Each module cage can house up to eight I/O (PDH, SDH, or
data) single slot modules, totaling a maximum of 16 modules.

Protection
In an expanded XDM-900 shelf with I/O protection, one or two TPUs are
mounted on the top and/or at the bottom of the basic shelf, including a TC or
TCF module and TPMs. An OCU with CWDM networking modules can be
mounted on top of a basic or expanded shelf.
The TPU modules are distributed as follows:
supported.
The TC or TCF is connected to the DC and control buses of the MX900 cards
(optional).


MXC900
The XDM-900 is a redundant platform, and two MXC900 cards must always
be installed in slots MXC-A and MXC-B of the XDM-40 shelf.
The MXC900 performs the following functions:
 Communications and control (by CPU):
 Routing and handling of 128 DCC channels
 Control of all shelf cards and modules
 Management interface
 Support of the 256 Mb NonVolatile compact flash Memory (NVM)
card
 Alarms and maintenance
 Control of TPU/OCU shelves
 5 Gbps capacity for all I/O module slots, and 20 Gbps for quad I/O card
slots
 SDH/SONET-related functions:
 SDH/SONET timing and synchronization
 SDH/SONET cross connect 4/3/1
 120 Gbps HO/LO nonblocking matrix
 Accommodates the ACP-900 module and provides power supply,
communication, and control
 Support for CWDM I/O modules (transponders and combiners) in all I/O
module slots
 DC voltage supply:
 One 48 VDC power input that supplies voltages for all cards and
modules
 Input Filtering (INF) function for the entire shelf
 Voltage and control for Fan Control Unit (VFCU)

ECU900
Two types of ECU900 cards are available:
 ECU900-F – supports full functionality
 ECU900 – supports reduced functionality
ECU900F
The ECU900F supports:
 Management interfaces:
 External alarm outputs and inputs to client or xRAP-100
 ACO
 LEDs for display of operation and alarms
 Traffic monitoring, including:
 Selection and display of the traffic interface channel currently being
monitored for all I/O module (I1 to I16) slots, as well as, quad I/O card
(I17 and I18) slots
 Monitor interface for STM-1 ports
 Hold-up capacitors

ECU900
The ECU900 card is suitable for sites that do not require alarms dry-contacts,
output system monitoring, and Ethernet hub for management. It supports:
 Management interfaces, including:
 External alarm outputs and inputs to client or xRAP-100
 ACO
 LEDs for the display of operation and alarms
XDM-40 Card Layout

The XDM-40 standard shelf consists of a modules cage housing DWDM and
amplification modules, a cards cage housing the I/O cards and common cards,
the xFCU40, and the power supply for the fan unit (PSFU).
Modules cage
 Two (2) slots (M1 and M2) allocated to DWDM/OADM, optical booster,
and accessories modules
 Two (2) xINF40s designed for power supply redundancy
 One (1) ECM to facilitate routing of external management interfaces,
connecting the management, OHA, and OW interfaces to the active
xMCP_B
Cards cage
 Two (2) slots (I1 and I2) flexibly allocated to I/O optical transponders,
combiners, and/or amplifiers
 One (1) slot (C1) allocated to the xMCP_B card
 One (1) slot (C3) allocated to the MECP card, for user and management
interfaces
 PSFU and xFCU40 that consists of three separate fans to support cooling
system redundancy

Hot insertion of cards and modules is allowed to supports quick maintenance

and repair activities without affecting traffic.
Figure 2-38: XDM-40 card layout
XDM-400 Card Layout

The XDM-400 shelf consists of a single cage containing slots for five I/O
cards, and dedicated slots for the XIO (cross-connect and I/O matrix),
processor and common cards in the middle and right side of the shelf. The
electrical interface connection modules are housed in two slots on the left side
of the shelf. The XDM-400 cage design and mechanical practice conform to
international mechanical standards and specifications. The cards are distributed
as follows:
 Five (5) slots, IS1 to IS5, optimally allocated for I/O cards
 Two (2) slots, MS1 and MS2, allocated for electrical interface connection
modules
 Two (2) slots, X1 and X2, allocated for XIO-192 cards
 Two (2) slots, C1 and C2, allocated for xMCP cards
An external connection module, the MECP, is located above the xMCP. It
connects the management, overhead access (OHA), and orderwire interfaces to
the active xMCP.
Figure 2-39: XDM-400 typical card layout

XDM-450 Card Layout

The XDM-450 shelf consists of a single cage containing slots for nine DWDM
modules and dedicated slots for the processor, management and other common
cards. The XDM-450 standard shelf is arranged as follows.
 Nine CCP slots (M1 to M9) flexibly allocated to DWDM modules such as
ROADMs, Mux/DeMuxes, and amplifiers.
 One slot (C0) allocated to the xECM-450 card, for user and management
interfaces.
 One slot (C1) allocated to the xMCP-B2G card.
 One slot for optional OSC Mux/DeMux module with integrated C/T filter
(ACC4OSC5).
 Two xINF-450 modules designed for power supply redundancy.
 xFCU-450 fan unit to support cooling system redundancy.
The XDM-450 standard card layout is illustrated in the following figure.
Figure 2-40: XDM-450 slot layout

XDM-500 Card Layout

The XDM-500 shelf consists of a single cage containing slots for six I/O cards,
four connection modules, and dedicated slots for the matrix, processor, and
common cards. The XDM-500 cage design and mechanical practice conform to
international mechanical standards and specifications. The cards are distributed
as follows:
 Six (6) slots, IC1 to IC6, flexibly allocated for I/O cards and/or
transponders (depending on the configuration)
 Four (4) slots, MC1 to MC4, allocated for electric interface connection
modules or DWDM/OADM modules
 Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards
 Two (2) slots, C1 and C2, allocated for the xMCP cards
An external connection module, the MECP, is located above the
xMCP/xMCP_B cards for connecting the management, overhead access, and
orderwire interfaces to the active xMCP/xMCP_B.
Figure 2-41: XDM-500 standard card layout

XDM-1000 Card Layout

The standard XDM-1000 consists of a modules cage housing the connection
modules, a cards cage housing the I/O and common cards, input filters, and fan
control units. The XDM-1000 standard card layout is illustrated in XDM-1000
standard card layout (page 2-53) and is allocated as described in the following
paragraphs.
Modules Cage
 Eleven (11) slots, M1 to M11, allocated for electric interface connection
modules or DWDM/OADM, optical booster, optical preamp modules
 Two xINFs
Cards Cage
 Twelve (12) slots, I1 to I12, flexibly allocated for I/O cards and/or
transponders (depending on the configuration)
 Two (2) slots, X1 and X2, allocated for the HLXC or XIO matrix cards
 Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards
An external connection module, the MECP, is located in the cards cage of the
XDM-1000 above the xMCP/xMCP_B cards. It is used to connect the
management, overhead access, and orderwire interfaces to the active
xMCP/xMCP_B card.
The modules cage contains 11 double-slot connection modules. Electrical I/O
cards installed in the cards cage interface with the XDM-1000 via connection
modules installed in the modules cage. The modules are extractable, thus
allowing a flexible assignment of physical I/O ports.

Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and
do not require connection modules in the modules cage. The free modules cage
slots in optical systems can therefore be allocated to DWDM or OADM
multiplexing and amplification modules.


The XDM-2000 consists of a single cage whose slots can be allocated as
follows:
 Twelve (12) slots, I1 to I12, allocated for transponders and other optical
modules
 Two (2) slots, X1 and X2, allocated for mux/demux or matrix cards
(depending on the system configuration)
 Two (2) slots, C1 and C2, allocated for the xMCP/xMCP_B cards
The external connection module, the MECP, is located in the upper section of
the cage.
The cage design and mechanical practice of the XDM-2000 conform to
international mechanical standards and specifications.


The XDM-3000 consists of an I/O card cage arranged in four sections, together
with additional power, communication, and control units, as follows:
 24 slots (I1 to I24) flexibly allocated to I/O cards and/or amplifiers,
depending on the configuration. I/O card options include combinations of
up to 24 SIO1&4B, SIO164, DIOB, and/or MCS5/10 cards. Single channel
OFA2 or OFA_M amplifiers can be used for long distance applications.
 Two slots (X1 and X2) allocated to HLXC1536 matrix cards.
 Two slots (A1 and A2) allocated to ACP3000 ASON cards.
 Two slots (C1 and C2) allocated to the xMCP-B2G cards.
 One slot (C0) allocated to the MECP card, for user and management
interfaces.
 One ECB3000 that provides external connections for the MECP card.
 Two INF3000s designed for power supply redundancy.
 Two FCU3000 fan units with ten fans each.

The XDM-3000 card layout is illustrated in the following figure.

Control, Matrix, and I/O Cards

for Large XDM Shelves
NOTE: HLXC and XIO matrix cards are offered in several
versions for large XDM shelves. The generic names HLXC
and XIO are used in the following sections to describe the
cards functionality when the information applies to all
versions.
XDM shelves have been designed to facilitate simple installation and easy
maintenance. They incorporate the following layout features:
 The connection modules in the modules cage (XDM-400, XDM-500, and
XDM-1000) are located as close as possible to the I/O cards in the cards
cage
 The HLXC-L, HLXC-R, or XIO matrix cards are located near the sidewall
of the shelf to facilitate the routing of traffic buses to the I/O cards
 The xMCP/xMCP_B control cards are located such that they simplify the
identification of any control problem issues
 The MECP is located above the xMCP/xMCP_B to facilitate the routing of
the external management interfaces
HLXC192/384/768/1536
Three versions of HLXC matrix cards are offered for XDM large shelves. They
differ in their switching capacity as follows:
 HLXC192 – supports 192 x 192 STM-1 streams
 HLXC1536 - supports 1536 x 1536 STM-1 streams
NOTE: HLXC384 and HLXC768 are not supported in

XDM-500.
NOTE: HLX1536 is supported in XDM-3000 only.

The XDM-500, XDM-1000, XDM-2000, and XDM-3000 contain two identical

HLXC cards. Both cards perform the cross-connect and node synchronization
functions simultaneously in a 1+1 protection configuration. In case of a
hardware failure in the operational HLXC or in its traffic interconnections, the
I/O interface cards switch to the backup HLXC within 50 ms. Similarly, in case
of a hardware failure in the TMU of the operational HLXC, the backup TMU
takes over the timing control with no traffic disruption. The operational HLXC
is determined by the LightSoft network manager.
XIO192/384F
XIO cards combine the functionality of an HLXC card with that of SDH I/O
cards.
Two versions of XIO cards are offered for XDM large shelves. They differ in
their switching capacity and SDH supported ports:
 XIO192 – switching of 192 x 192 STM-1 streams. Supports 1 x
STM-16/OCU-48 interface, 4 x STM-1/OC-3 interfaces, or 1 x
STM-4/OCU-12 interface.
 XIO384F – switching of 384 x 384 STM-1 streams. Supports 1 x
STM-64/OC-192 interface or 4 x STM-16/OC-48 interfaces.
NOTE: XIO384F is not supported in XDM-400.
NOTE: XIO cards are not supported in XDM-3000.
The XDM can optionally contain two identical XIO cards (in the XDM-400,
the XIO is the only dedicated matrix card). XIO cards consist of a matrix unit
and SDH/SONET interfaces on the same basecard. Like the HLXC, XIO cards
perform the cross-connect and node synchronization functions simultaneously
in a 1+1 protection configuration. Upon detection of a hardware failure in the
XIO or in its traffic interconnections, I/O cards switch to the backup XIO card
within 50 ms. If required, the backup TMU takes over timing control from the
operational XIO with no traffic disruption.

xMCP/xMCP_B
The xMCP/xMCP_B performs the communications, control, alarm, and
maintenance functions for the XDM. An additional xMCP/xMCP_B may
optionally provide full capability 1:1 protection since the standby
xMCP/xMCP_B has an identical database to the active xMCP/xMCP_B. Upon
a failure of the active xMCP/xMCP_B, the standby xMCP/xMCP_B becomes
the active control unit.
The xMCP/xMCP_B is also responsible for communicating with external
network elements and management stations. It communicates with other
SDH/SONET NEs via the DCC channel embedded in each SIO link. In
addition, the xMCP/xMCP_B provides multiple access to all overhead bytes in
all incoming SDH/SONET lines. It provides 64 kbps and N x 64 kbps trail
capability for transporting management data, external DCC channels or for
external DCN purposes.
MECP
The MECP connects the management, overhead access, and orderwire
interfaces to the active xMCP/xMCP_B. The physical management
connections are provided by the ECB located above the MECP.
The MECP supports standard OW as well as a special voice channel over the
DCC when using VoIP and a special router. This feature enables external calls
from outside the network to a particular site. In addition, the MECP generates
system alarms and activates indicators, for example, software downloads,
restarts, configurations, and so on.
In pure optical networks and inline amplifier sites, one of two special MECP
versions is supplied to support the optical supervisory channel operating at
1510 nm or 1310 nm.
ECB, xECB4, or ECB3000

The ECB provides the physical interface between the XDM and external
management and clock devices. This card is also available in special two
versions, xECB4 for the XDM-400, and ECB3000 for the XDM-3000.
ECM40
The ECM40 provides the physical connections to the XDM-40 alarms,
provisioning (LCT), and OW interfaces. This unit is a dedicated module, used
only in the XDM-40.


3
XDM-50 Specifications
In this chapter:
Traffic Protection............................................................................................. 3-2
Redundancy ..................................................................................................... 3-2
Synchronization ............................................................................................... 3-2
I/O Interfaces ................................................................................................... 3-3
Management .................................................................................................... 3-4
SDH Interfaces ................................................................................................ 3-5
Data Modules................................................................................................... 3-8
Physical Specifications .................................................................................. 3-11
Environmental Conditions ............................................................................. 3-12
EMC .............................................................................................................. 3-13
Safety ............................................................................................................. 3-13
Reliability ...................................................................................................... 3-13

XDM-50 Specifications XDM System Specifications
Cross-Connect Specifications
Cross-Connect Levels
SDH cross-connect levels ........................................................... VC-4nc, VC-4, VC-3, VC-12
Cross-Connect Capacity
SDH switch core options ...................... 128 x STM-1 (64 x STM-1 in use) with cross-connect
....................................................................................................................... capability of 4/3/1
Traffic Protection
Applicable specifications ................. ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP I/N LO, HO ................................................................................................. within 30 ms
MSP 1+1 ................................................................................................................ within 50 ms
Redundancy
Control and synchronization systems.................................................................. 1+1 duplicated
Switching matrix, power system, internal buses, external buses ........................1+1 duplicated
I/O electrical modules protection .................................................................... 1:1, 1:2, and 1:3
Synchronization
There are four timing references available from multiple SDH/PDH timing sources:
 From any 2 MHz/2 Mbps tributary interface
 From any SDH line
 External SDH 2 MHz/2 Mbps timing outputs (two per shelf)
 G.813 internal clock
Synchronization Status Marker (SSM) support is also provided.
Jitter and Wander

Applicable specifications .......................................................................... ITU-T G.823, G.825

XDM System Specifications XDM-50 Specifications
I/O Interfaces
2 Mbps (E1)
Physical level .............................................................................................. G.703, Paragraph 6
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance ................................................................... 120 Ω balanced/75 Ω 1 unbalanced
Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
Line impedance ............................................................................................... 75 Ω unbalanced
45 Mbps (DS-3)
Frame .................................................................................................. Unframed, ANSI T1.107
Line code ........................................................................................................................... B3ZS
STM-1 Electrical
Physical level ............................................................................................ G.703, Paragraph 12
Bitrate ..................................................................................................... 155.52 Mbps ±20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1 Optical
Physical level ..................................................................................................... G.957, Table 2
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps ±4.6 ppm
Transmission range ................................................................................................... S3, L3, L5
1
Through external DDF.

STM-4 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps ±4.6 ppm
Management
Applicable specifications ......................................................... G.784, G.774, M.3010, M.3100
LightSoft (network manager) server and client for managing all ECI
.............................................................................................. equipment on SUN workstation(s)
EMS-XDM (XDM element manager) ...................................................... on SUN workstation
LCT-XDM local craft terminal ........................................................................................ on PC
EMS-XDM and LightSoft can work on the same SUN workstation.
Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to LightSoft or other
TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP (Rack Alarm
Panel).
Alarms and Performance

Performance concept ............................................................................................. G.821, G.826
Alarm concept ................................................................................................................... G.783
Alarm types .................... LED indicators, dry contacts, audible alarms (per subrack), external
............................................................................................................. alarm inputs and outputs
Alarm classes ......................................................................... Critical, Major, Minor, Warning

SDH Interfaces
STM-1 (155.52 Mbps ±4.6 ppm) I/O Module
SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5
APPLICATION CODE 2 S-1.1 L-1.1 L-1.2
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580
Source type MLM 3 SLM SLM
Max. RMS width (nm) 7.7 - -
Min. side mode suppression ratio (dB) - 30 30
Min. mean launched power (dBm) -15 -5 -5
Max. mean launched power (dBm) -8 0 0
Min. extinction ratio (dB) 8.2 10 10
Min. sensitivity (BER of 1*10-12) EOL dBm) -28 -34 -34
Min. overload (dBm) -8 -10 -10
Max. receiver reflectance (dB) - - -25
Max. dispersion [ps/nm] 96 - -
Min. optical return loss of cable (dB) - - -20
Max. discrete reflectance (dB) - - -25
Max. optical path penalty (dB) 1 1 1
NOTE: When selecting bidirectional transceivers, pay

attention that they must operate in complementary pairs. For
example: OTR1-S3BD can work only vis-a-vis OTR1-S5BD;
OTR4-L3BD can work only vis-a-vis OTR4-L5BD, and so
on. The transceivers in the following table are arranged in
complementary pairs.
2
Application code is in reference to ITU-T Recommendation G.691.
3
MultiLongitudinal Mode (MLM) source type laser can also operate with single mode fibers for S-1.1 interfaces in
reference to ITU-T Recommendation G.957.

Table 3-1: STM-1 bidirectional transceivers

SFP transceiver name OTR1-S3BD OTR1-S5BD OTR1-L3BD OTR1-L5BD
Application code 4 BD 3 5 BD 5 6 L3BD L5BD
Operating wavelength (nm) 1260-1360 1480-1580 1280-1360 1480-1580
TRANSMITTER
Source type MLM MLM MLM SLM

Max. RMS width (nm) 7 3 4 1
Min. side mode suppression ratio (dB) - - - 30
Min. mean launched power (dBm) -14 -14 -5 -5
Max. mean launched power (dBm) -8 -8 0 0
Min. extinction ratio (dB) 10 10 10 10
RECEIVER 7
Min. sensitivity (BER of 1 * 10-12) -32 -32 -32 -32

EOL (dBm)
Min. overload (dBm) -8 -8 0 0
Max. receiver reflectance (dB) - - - -
OPTICAL PATH BETWEEN S & R
Max. dispersion (ps/nm) - - - -

Min. optical return loss of cable (dB) -20 -20 - -
Max. discrete reflectance (dB) - - - -
Max. optical path penalty (dB) 1 1 1 1
STM-4 (622 Mbps ±4.6 ppm) I/O Module

TRANSMITTER
Max. RMS width (nm) 4/2.5 - -
Max. -20 dB width (nm) - 1 <1
Max. mean launched power (dBm) -8 +2 +2
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -28 -28
4
5
BD 3: STM-1 single-fiber bidirectional SFP module with a 1310 nm TX wavelength.
6
7
Receiver units of SFPs (excluding bidirectional SFPs) are a wide-band type.
8
9


Max. receiver reflectance (dB) - -14 -27
Min. optical return loss of cable (dB) - 20 24
Max. discrete reflectance (dB) - -25 -27


SFP transceiver name OTR4_S3BD OTR4_S5BD OTR4_L3BD OTR4_L5BD
10
Application code S3BD S5BD L3BD L5BD

TRANSMITTER
Source type MLM SLM MLM SLM

Min. side mode suppression ratio (dB) - 30 - 30

Max. mean launched power (dBm) -8 -8 +2 +2
Min. extinction ratio (dB) 8.2 8.2 10 10

RECEIVER 11

EOL (dBm)
Min. overload (dBm) -8 -8 -8 -8
Max. dispersion (ps/nm) - - -
Min. optical return loss of cable (dB) - - - -

10
11

Data Modules
DIOM Specifications
Module DIOM_04 DIOM_08 DIOM_40
Service interfaces 4 x 10/100/ 8 x 10/100BaseT 4 x optical FE/GbE
1000BaseT with SFP
Size 1 slot 1 slot 1 slot
Data handling Layer 1 Layer 1 Layer 1
Network interfaces 4 x EoS 8 x EoS 4 x EoS
Total EoS bandwidth Up to 16 x VC-4 Up to 8 x VC-4 Up to 16 x VC-4

per module in slots I1 Up to 48 x VC-3 Up to 24 x VC-3 Up to 48 x VC-3
to I4 (2.5Gbps) Up to 252 x VC-12 Up to 252 x VC-12 Up to 252 x VC-12
Total bandwidth per 1 to 16 x VC-4 1 to 8 x VC-4 1 to 16 x VC-4
EoS port in slots I1 to 1 to 48 x VC-3 1 to 24 x VC-3 1 to 48 x VC-3
I4 1 to 63 x VC-12 1 to 63 x VC-12 1 to 63 x VC-12
Encapsulation mode GFP-F GFP-F GFP-F
Differential delay 256 ms for VC-3/4 256 ms for VC-3/4 256 ms for VC-3/4
compensation 128 ms for VC-12 128 ms for VC-12 128 ms for VC-12
Maximum frame 10240 bytes 10240 bytes 10240 bytes
length
Interfaces ........................ 10/100/1000BaseT, 100BaseFX (single mode and multimode fiber),

...................................................... 1000BaseSX, 1000BaseLX, 1000BaseZX, 1000BaseT SFP
Protection ..................................................... IOP 1:1 for both EoS ports and optical user ports
Standards compliance............................................IEEE 802.3z, G.707, G.783, G.7041 (GFP),
........................................................................................................................... G.7042 (LCAS)
LCAS ............................................. Enabled or Disabled (VCAT mode), configurable per port
Flow control ................................................................................. hitless following IEEE 802.3
Failure forwarding...................................................................................................... CSF, TSF

EISMB Specifications
Module EISMB_04 12 EISMB_40 13
Service interfaces 2 x 10/100/1000BaseT + 2 x optical FE/GbE +
2 x 10/100BaseT 2 x optical FE with SFP
Size 1 slot 1 slot
Data handling Layer 2 Layer 2
Network interfaces 2 x GE EoS + 2 x GE EoS +
6 x FE EoS 6 x FE EoS
Total EoS bandwidth per module in Up to 16 x VC-4 Up to 16 x VC-4
slots I3, I4 Up to 48 x VC-3 Up to 48 x VC-3
Up to 252 x VC-12 Up to 252 x VC-12
Total bandwidth per EoS port in 1 to 16 x VC-4 1 to 16 x VC-4
slots I3, I4 1 to 48 x VC-3 1 to 48 x VC-3
1 to 63 x VC-12 1 to 63 x VC-12
Encapsulation mode GFP-F GFP-F
Differential delay compensation 256 ms for VC-3/4 256 ms for VC-3/4
128 ms for VC-12 128 ms for VC-12
Maximum frame length 9600 bytes 9600 bytes
Interfaces .............................................................................. 10/100/1000BaseT, 10/100BaseT,

.......................... 100BaseFX (single mode and multimode fiber), 1000BaseSX, 1000BaseLX,
.................................................................................................... 1000BaseZX, 1000BaseT SFP
Switch capacity ............................................................................................................ 6.4 Gbps
MAC address memory ....................................................................................................... 3500
Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
................................... IEEE 802.1ad, IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ...................................................................... up to 4 modules in slots I1, I2, I5, I6
Untagged frame handling ........................................ block, forward, attach CTAG and forward
12
The EISMB can be installed only in slots I3, I4.
13
The EISMB can be installed only in slots I3, I4.

EISM Specifications
Module EISM_226 14
Service interfaces 6 x 10/100BaseT +
2 x FE/GbE
Size 2 slots
Data handling Layer 2
Network interfaces 2 x EoS
Total bandwidth per EoS port 1 to 7 x VC-4
1 to 21 x VC-3
Encapsulation mode GFP-F
LCAS mode LCAS and non-LCAS
Differential delay compensation 3.8 ms
Maximum frame length 9600 bytes
Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX,
........................................................................................................ 1000BaseLX, 1000BaseZX
MAC address memory ...................................................................................................... 3,500
Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Untagged frame handling .................................................................................... block, forward
Client Transceivers for EISM Cards

OTGBE_SX 15 OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM
Transmitter type GbE/FC/ GbE/FC/ GbE/FC/ FE, short-reach FE, short-reach
FICON 16 FICON 17 long-reach FICON 18 very laser, 1310 laser, 1310 nm,
short-reach laser, laser, 1310 nm, single long-reach laser, multimode single mode
850 nm, multimode mode 1550 nm, single
mode
Data rate (nominal) 1.250 1.250 1.250 0.125 0.125
(Gbps)
Average Max. -3 -3 5 -8 5
launch
Min. -9.5 -11 0 -15 0
power (dBm)
Min. transmitter 9 9 9 10 10
extinction ratio (dB)
14
The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4.
15
The EISM occupies two slots and may be installed in slot pairs I1-I2 or I3-I4.
16
For EISM applications, GbE interfaces only.
17
18

OTGBE_SX 15 OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM

Data format 8 B/10 B 8 B/10 B 8 B/10 B N/A N/A
Average Min. -20 -22 -22 -28 -22
receiver
Typical -21 -25.5 -- -30 --
sensitivity
(dBm)
Max. receiver overload 0 0 0 -14 -8
(dBm)
Typical Rx LOS level -24 -29 -25 < -29 < -28
(dBm)
Connector LC LC LC LC LC
Fiber lengths 550 m 10 km 80 km 550 m 10 km
(50/62.5 µm MMF) (9 µm SMF) (9 µm SMF) (50/62.5 µm (9 µm SMF)
MMF)
Electrical GbE SFP (ETGbE)

ETGBE Notes
Data rate 1000 Mbps IEEE 802.3 compatible
Connector RJ-45
Cable type CAT 5 STP (Shielded Twisted Pair)
Cable length 100m
Physical Specifications
Dimensions (H x W x D)
XDM-50 .............................................................. 129 x 443 x 231 mm (5.08 x 17.44 x 9.09 in)
SIM-1/4, PIM-2/345.................................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
EISMB, DIOM .......................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
EISM, PIM2_63 ...................................................... 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
CCP50_2 ............................................................................. 58.5 x 79 x 251 (2.3 x 3.11 x 9.88)
INF50 ................................................................................... 41 x 79 x 252 (1.61 x 3.11 x 9.92)
TPM-xx_1/TPM-xx_3 .............................................. 72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TC, TCF .................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC50.................................................................. 29 x 300 x 250 mm (1.14 x 11.81 x 9.84 in)
ECU50 ................................................................................ 28 x 230 x 255 (1.1 x 9.05 x 10.04)
TPU ...................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
xRAP (optional) ................................................ 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 (optional) ........................................... 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
miniRAP (optional) ................................................. 90 x 445 x 150 mm (3.54 x 17.53 x 5.9 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)

...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-50 shelf ........................................................................................... 4 kg (8.82 lbs)
Basic XDM-50 fully populated ....................................................................... 12 kg (26.46 lbs)
Power
Applicable specifications ........................................................ ETSI 300 132-2; FTZ 19 PFL 1
Input voltage ............................................................................................ -40 V dc to -75 V dc
Nominal power source ....................................................................................... -48 V or -60 V
Power consumption .............................................................. Typical 150 W, maximum 250 W
Main Equipment Power Consumption

For the XDM-50 main equipment power consumption refer to XDM-100 Product Line Main
Equipment Power Consumption (page 4-24) in section XDM-100 Specifications (page 4-1).
Power Dissipation
Power dissipation .................................................... Typical 515 Btu/hr, maximum 855 Btu/hr
Environmental Conditions
Operation
Applicable specification .................................................................. ETS 300 019-1-3 Class 3.2
Temperature range ............................................................................................. -5 ºC to +55 ºC
Relative humidity ..................................................................................................... 5% to 90%
NOTE: Extended temperature range of -5 ºC to +65 ºC is

supported for specific outdoor configurations.
Storage (packed)
Applicable specification ................................................................. ETS 300 019-1-1 Class 1.2
Temperature range ........................................................................................... -25 ºC to +55 ºC
Relative humidity ................................................................................................. 10% to 100%

Handling and Transportation

Temperature range .......................................................................................... -40 ºC to +70 ºC
Relative humidity ...................................................................................................... up to 95%
EMC
Applicable specifications ............................................................................... EN 300 386/2000
Applicable directive ....................................................................... EMC directive 89/336 EEC
Safety
Applicable specifications .................................................................................. EN 60950/2000
Applicable CE directive .................................................................... LVD directive 73/23/EEC
Laser Safety
Applicable specification ....................................................... EN 60825-1&2 (AS/NZS 2211.2)
CE Compliance
The XDM-50 complies with CE standards.
Reliability
Life
Expected lifetime of the XDM platforms ...................................................................... 15 years
Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network ................................................................................ better than 99.999%


4
XDM-100 Specifications
In this chapter:
Redundancy ..................................................................................................... 4-3
I/O Interfaces ................................................................................................... 4-4
Management .................................................................................................... 4-5
SDH/SONET Interfaces .................................................................................. 4-6
Data Modules................................................................................................. 4-13
Optical Amplifier Modules for TPU/OCU .................................................... 4-19
GbE/FC/2 Gbps FC/FICON Optical SFP Transceivers for
Transponders/Combiners ............................................................................... 4-20
STM-1 SFP Optical supervisory channel transceivers for OSC1_2 .............. 4-21
CWDM Modules ........................................................................................... 4-21
EMC .............................................................................................................. 4-27
Safety ............................................................................................................. 4-27
Reliability ...................................................................................................... 4-28

SONET cross-connect levels.............................................................................. STS-nc, STS-1
SDH switch core options .......................... 192 x STM-1 with cross-connect capability of 4/3/1
SONET switch core options ..................................................................................... 192 x OC-3
XDM-100 Shelf Capacity

XDM-100 shelf slot capacities differ as a function of the type of matrix cards
(MXC-100, MXC-100B, or combination of MXC-100, and MXC-BR) used.
Although the MXC-100 and the MXC-100B have identical cross-connect
capabilities, the bandwidth allocation capacity per I/O slot for the MXC-100 is
different than that of the MXC-100B, or MXC-100 and a MXC-BR.
NOTE: The following is applicable:

 Mix of MXC-100 and MXC-100B on the same shelf is not
supported
 The MXC-BR is supported only for SDH applications
The following table describes the MXC-100, MXC-100B, and MXC-BR

bandwidth allocation capacity per slot for the XDM-100.
MXC type Slot # Capacity per slot Total XDM-100 capacity
19
MXC-100 (x 2) I1, I2, I5, I6 2.5 Gbps 25 Gbps
I3, I4, I7, I8 1.25 Gbps
A1, A2, B1, B2 2.5 Gbps
20
MXC-100B (x 2) I1 to I8 2.5 Gbps 30 Gbps
A1, A2, B1, B2 2.5 Gbps
21
MXC-100 (x 1) I1 to I8 1.25 Gbps 15 Gbps
MXC-BR 22 (x 1) A1, A2 2.5 Gbps
19
Mix of MXC-100 and MXC-100B on the same shelf is not supported.
20
Mix of MXC-100 and MXC-100B on the same shelf is not supported.
21
This configuration is supported only for SDH applications.
22
This configuration is supported only for SDH applications.

Traffic Protection
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................. within 50 ms
OCH 1+1 optical protection ..................................................................................... within 5 ms
Redundancy
Synchronization
There are several timing references available from multiple SDH/SONET
and/or PDH/Async timing sources:
 From any 1.5 Mbps tributary interface
 From any SDH/SONET line
 External SONET 1.5 Mbps timing outputs (two per shelf)

Jitter and Wander

I/O Interfaces
2 Mbps (E1)
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance .................................................................. 120 Ω balanced/75 Ω 23 unbalanced
Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
45 Mbps (DS-3)
Line code ........................................................................................................................... B3ZS
52 Mbps (STS-1)
Physical level ..................................................................................................... GR-253-CORE
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
23
Through an external DDF.

STM-1 Electrical
Bitrate ..................................................................................................... 155.52 Mbps ±20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps ±4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps ±4.6 ppm
Transmission range ............................................................................................ S3, L3, L5, V5
STM-16/OC-48 Optical
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................. 2488.32 Mbps ±4.6 ppm
Transmission range ......................................... I3, S3, L3, L5, C/DWDM (G.694.2 and G.695)
Management
LightSoft (network manager) server and client for managing all ECI equipment
............................................................................................................... on SUN workstation(s)


TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.

Alarm concept ................................................................................................................... G.783
SDH/SONET Interfaces
STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O
Modules
-12
Min. sensitivity (BER of 1*10 ) EOL dBm) -28 -34 -34
24
25



26 27 28
Application code BD 3 BD 5 L3BD L5BD
TRANSMITTER

RECEIVER 29
Min. sensitivity (BER of 1 * 10-12) EOL -32 -32 -32 -32

(dBm)

26
27
28
29

STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O

Modules
SFP TRANSCEIVER NAME OTR4_S3 OTR4_L3 OTR4_L5 OTR4_V5
APPLICATION CODE 30 S-4.1 L-4.1 L-4.2 V5
Operating wavelength (nm) 1274-1356 1280-1335 1480-1580 1550
TRANSMITTER
Source type MLM 31 SLM SLM SLM

Max. RMS width (nm) 4/2.5 - - -
Max. -20 dB width (nm) - 1 <1 1
Min. side mode suppression ratio (dB) - 30 30 30
Min. mean launched power (dBm) -15 -3 -3 0
Max. mean launched power (dBm) -8 +2 +2 4
Min. extinction ratio (dB) 8.2 10 10 10
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -28 -28 -34
Max. receiver reflectance (dB) - -14 -27 -27
Max. dispersion [ps/nm] 74 - - -

Min. optical return loss of cable (dB) - 20 24 -
Max. discrete reflectance (dB) - -25 -27 -

30
31


Application code 32 S3BD S5BD L3BD L5BD

TRANSMITTER

Min. side mode suppression ratio - 30 - 30
(dB)

RECEIVER 33

EOL (dBm)
Min. optical return loss of cable - - - -

(dB)
32
33

STM-16/OC-48 (2488.32 Mbps ±4.6 ppm)

I/O Modules
SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5 OTR25_AVxx 34 OTR25_ABxx 35
36
APPLICATION CODE I-16 S-16.1 L-16.1 L-16.2 DW100S1D2/5(C) DW100L-1D2/5(C)F
DW100S1A2/5(C) DW100C-1A2/5(C)F
G.698.1/.2
Operating wavelength (nm) 1260-1360 1260-1360 1280-1335 1500-1580 1530-1565 1530-1565
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM
Max. -20 dB width (nm) 2 1 1 <1 0.4 0.4
Max. RMS width (nm) - - - - - -
Min. side mode suppression - 30 30 30 30 30
(dB)
Min. mean launched power -10 -5 -2 -2 0 0
(dBm)
Max. mean launched power -3 0 +3 +3 4 4
(dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28 -28 -28
1*10-12) EOL (dBm)
Min. overload (dBm) 0 0 -9 -9 -9 -9
Max. receiver reflectance -27 -27 -27 -27 -27 -27
(dB)
Max. dispersion [ps/nm] - - - 1600 2400 3600
(120km G.652 (180 km G.652)
Min. optical return loss of -24 -24 -24 -24 -24 -24
cable (dB)
Max. discrete reflectance -27 -27 -27 -27 -27 -27
(dB)
Max. optical path penalty <1 1 1 2 <3 <2
dB)

34
xx designates the transceiver's wavelength in nm.
35
36


37
TRANSMITTER
Source type SLM SLM SLM SLM
Min. side mode suppression ratio 30 30 30 30
(dB)
Min. mean launched power -5 -5 -2 -2
(dBm)
Max. mean launched power +2 +2 +5 +5
(dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2
38
RECEIVER
Min. sensitivity (BER of 1 * -18 -18 -27 -27
10-12) EOL (dBm)
Min. overload (dBm) 0 0 -9 -9
(dB)
37
38

2.5 Gbps Optical CWDM SFP Transceivers

CWDM DWDM
SFP TRANSCEIVER NAME OTC25_1PSxx OTC25_1ALxx OTR25_AVxx 41 OTR25_ABxx 42
39 40
APPLICATION CODE 43 DW100S1D2/5(C) DW100L-1D2/5(C)F

DW100S1A2/5(C) DW100C-1A2/5(C)F
G.698.1/.2
TRANSMITTER
Max. -20 dB width (nm) 1 1 0.4 0.4
Max. RMS width (nm) - - - -
Min. side mode suppression (dB) 30 30 30 30
Min. mean launched power (dBm) 0 0 0 0
Max. mean launched power (dBm) +5 +5 4 4
RECEIVER
Min. sensitivity (BER of 1*10-12) -21.5 -28 -28 -28
EOL (dBm) (-23 GbE) (-32 GbE)
Min. overload (dBm) 0 -7 -9 -9
Max. receiver reflectance (dB) -27 -27 -27 -27
Max. dispersion [ps/nm] 800 1600 2400 3600
(40 km G.652) (80 km G.652) (120 km G.652) (180 km G.652)
Min. optical return loss of cable (dB) 24 24 -24 -24
Max. discrete reflectance (dB) -27 -27 -27 -27
Max. optical path penalty (dB) 1.5 2.5 <3 <2
39
40
41
42
43

Data Modules
DIOM Specifications
Service interfaces 4 x 10/100/1000BaseT 8 x 10/100BaseT 4 x optical FX/GbE
with SFP
per module in slots 1, Up to 48 x VC-3 Up to 24 x VC-3 Up to 48 x VC-3
2, 5, 6 (2.5Gbps) Up to 252 x VC-12 Up to 252 x VC-12 Up to 252 x VC-12
EoS port in slots 1, 2, 1 to 48 x VC-3 1 to 24 x VC-3 1 to 48 x VC-3
5, 6 1 to 63 x VC-12 1 to 63 x VC-12 1 to 63 x VC-12
length

........................................................................................................................... G.7042 (LCAS)

Module EISMB_04 EISMB_40
Service interfaces 2 x 10/100/1000BaseT + 2 x optical FX/GbE +
2 x 10/100BaseT 2 x optical FX with SFP
Size 1 slot 1 slot
6 x FX EoS 6 x FX EoS
Total EoS bandwidth per module Up to 16 x VC-4 Up to 16 x VC-4
Total bandwidth per EoS port 1 to 16 x VC-4 1 to 16 x VC-4
1 to 48 x VC-3 1 to 48 x VC-3
1 to 63 x VC-12 1 to 63 x VC-12

.................................................................................................... 1000BaseZX, 1000BaseT SFP
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ..................................................... up to 4 modules in any slots (with MXC-100B)

MCSM Specifications
Module MCSM
8 x optical FX/GbE with SFP
Size 2 slots
Maximum modules per shelf Up to 2 with MXC-100B
One only with MXC-100
Data handling Layer 2 (Ethernet/MPLS)
Network interfaces 16 x EoS/MoT

Total EoS bandwidth per module Up to 32 x VC-4
Up to 96 x VC-3
Up to 252 x VC-12
1 to 48 x VC-3
1 to 63 x VC-12
NG-SDH standards GFP-F, VCAT, LCAS
Differential delay compensation 256 ms for VC-3/4
128 ms for VC-12
Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber),

.................................................................................. 1000BaseSX, 1000BaseLX, 1000BaseZX
Total EoS/MoT capacity ................................................................................................. 5 Gbps
Switch capacity ............................................................................................................. 20 Gbps
MAC address memory ....................................................................................... 128,000 entries
Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached,
..................................................................................... Ethernet UNI/NNI LAG and EoS LAG,
.............................................................................................................................. G.8032 (ERP)
................................................................... Fast IOP – MCSM 1+1 hot standby card protection
MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
.......................................................................................... P2MP (Multicast drop and continue)
IGMP snooping and static MAC ................................................................................................

Hard QoS: ........................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS
.............................................. Classification based on port, CVLAN, CVLAN-P bits, SVLAN,
................................................. SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU,
......................................................... and Wildcard (all VLANs that are not explicitly defined).
.............................................. Untagged frame handling with port-based VLAN (attach/detach
............................................................................ CVLAN and/or SVLAN to untagged frames)
..........................................Eight Classes of Service (CoS), Classification rules, CoS mapping,
.................................................... 2 rate policing, 3 colors marking, Admission Control (CAC)
....................................... WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing
........................................................................................................... / Weighted Round Robin)
MAC and VLANs:4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation,
..................................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with
.......................................................................................................... 128k MAC address entries
E2E OAM: ...........................Tunnel OAM with Connectivity Verification per ITU-T Y.1711,
.................................................................................................................. Link OAM (802.3ah)
.................................................................................................... Service OAM 802.1ag (CFM)
Security: ............................. VSI (Virtual Switch Instance) VPN segregation, VLAN filtering,
............................................................................... FIB quota, BSC (Broadcast Storm Control)
Management: ....................... Point-and-click fast service creation, Management layers/Planes:
....................................................... Data, TDM, optic, Supporting CAC for MPLS Tunnel and
................................................... Service provisioning, Enhanced protection by SRLG (Shared
.......................................................................................................... Risk Link Group) schemes
Services:
Triple Play............................................ DTV/IPTV, HDTV, Gaming, VoD, VoIP, and HSI
Business connectivity............................................................... VPWS, VPLS, and H-VPLS
Mobile aggregation ......................... 3G Ethernet-based services, including VoIP, HSDPA,
..................................... IPTV and video streaming, MP3 streaming, VoD, video and voice
........................................................................................................................... conferences
Wholesale/CoC ............................................................ Ethernet bandwidth and leased lines
Standards compliance:
IEEE ................................................. 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q, 802.1w,
................................................................................. 802.3-2005, 802.3ad, 802.3x, 802.1ag
MEF .......................... MEF 4, MEF 6, MEF 7, MEF9, MEF 10, MEF 11, MEF 12 MEF14
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
.................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
IETF ........................................... RFC 3031, RFC 3032, RFC 3270, RFC 3443, RFC 4448,
..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702,
...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412

EISM Specifications
Module 44 EISM_208 EISM_244 EISM_226
Service interfaces 8 x 10/100BaseT 4 x 10/100BaseT + 6 x 10/100BaseT +
2 x FX/GbE + 2 x FX/GbE
2 x FX
Size 2 slots 2 slots 2 slots
EoS port 1 to 21 x VC-3 1 to 21 x VC-3 1 to 21 x VC-3
LCAS mode LCAS and non-LCAS LCAS and non-LCAS LCAS and non-LCAS
Differential delay 3.8 ms 3.8 ms 3.8 ms
compensation
length
Interfaces .......... 10/100BaseT, 100BaseFX (single mode and multimode fiber), 1000BaseSX,
........................................................................................................ 1000BaseLX, 1000BaseZX
MAC address memory ...................................................................................................... 3,500
Protection ............................. IOP 1:1 for both Ethernet over SDH ports and optical user ports
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Untagged frame handling .................................................................................... block, forward
44
The EISM occupies two slots and can be installed in slot pairs I1-I2, I3-I4, I5-I6, I7-I8.

Client Transceivers for MCSM, EISM Cards

Card 45 OTGBE_SX OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM
Transmitter type GbE GbE long-reach GbE very FX, short-reach FX, short-reach
short-reach laser, 1310 nm, long-reach laser, 1310 laser, 1310 nm,
laser, 850 nm, single mode laser, 1550 nm, multimode single mode
multimode single mode
(Gbps)
launch
Min. -9.5 -11 0 -15 0
power
(dBm)
Data format 8B/10B 8B/10B 8B/10B N/A N/A
Average Min. -20 -22 -22 -28 -22
receiver
Typical -21 -25.5 -- -30 --
sensitivity
(dBm)
(dBm)
(dBm)
(50/62.5 µm (9 µm SMF) (9 µm SMF) (50/62.5 µm (9 µm SMF)
MMF) MMF)

ETGBE Notes
Connector RJ-45
Cable type CAT 5 STP (Shielded Twisted Pair)
Cable length 100m
45
The EISM occupies two slots and may be installed in slot pairs I1-I2, I5-I6.

Optical Amplifier Modules for

TPU/OCU
The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is
a single channel preamplifier (Channel 35 in the C band).
MO_DC0_BAS MO_PAS_DCM80
Input power (dBm) -12–+4 -38 – -18
Output power (dBm) 14.5-16 -16 – -14
Spectrum (nm) Channel 35
46
Gain tilt (Ch. 21-36) (dB) <3 N/A
Gain tilt (Ch. 21-60) (dB) < 7 47 N/A
Passband width, < 0.5 dB loss (GHz) N/A N/A
Passband width, < 1.0 dB loss (GHz) N/A N/A

Noise figure (dB) <7 <6
Polarization-dependent gain (dB) < 0.5 < 0.5
Polarization mode dispersion (ps) < 0.1 < 0.3
Return loss (dB) < 40 < 40
Power consumption (Watt) <7 <7
48
Monitor port tap fraction (%) 4-6 0.5 – 2
Automatic Laser Shutdown (ALS) 100 ms
46
Measured peak-to-peak.
47
48
Over the entire C band.

GbE/FC/2 Gbps FC/FICON

Optical SFP Transceivers for
Transponders/Combiners
OTGBE_SX OTGBE_LX OTGBE_ZX
Transmitter type GbE/FC/2 Gbps GbE/FC/2 Gbps GbE/FC/2 Gbps
FC/FICON short FC/FICON long FC/FICON very long
reach laser, 850 nm, reach laser, 1310 reach laser, 1550 nm,
multimode nm, single mode single mode
Bitrate (Gbps) 1.250 1.250 1.250
Mean launch power Max. -3 -3 5
(dBm) Min. -9.5 -11 0
Min. transmitter extinction ratio 9 9 9
(dB)
Data format 8 B/10 B 8 B/10 B 8 B/10 B
Average receiver Min. -20 -22 -22
sensitivity (dBm) Typical -21 -25.5 --
Max. receiver overload (dBm) 0 0 0
Typical Rx LOS level (dBm) -24 -29 -25
Connector LC LC LC
Fiber lengths 550 m (50/62.5 µm 10 km (9 µm SMF) 80 km (9 µm SMF)
MMF)

STM-1 SFP Optical supervisory

channel transceivers for OSC1_2
Optical Supervisory Channel
OTR1_L3 OTR1_X3
Source type SLM SLM
Operating output wavelength (nm) 1263-1360 1270-1360
Spacing (nm) NA NA
Minimum side mode suppression ratio (dB) 30 30
Mean launched power (min.) (dBm) -5 0
Mean launched power (max.) (dBm) 0 +5
Min. extinction ratio (dB) 10 10
Sensitivity (BER of 1*10-10) (dBm) -34 -37
Min. overload (dBm) -9 -8
Max. dispersion (ps/nm) - -
Max. optical path penalty (dB) 1 1
CWDM Modules
Mux/Demux Modules
Module 49 MO-CMD4C MO_CMD8 MO_CMD4C-E MO_CMD4SL
Insertion loss mux + < 4.2 < 5.5 < 4.9 < 7.3
demux (dB) 50
Return loss (dB) < 40 < 40 < 40 < 40
Directivity (dB) < 45 < 45 < 45 < 45
OADM Modules
Module type 51 Insertion loss 52
Through Drop Add
53
MO_COADM1AB_xx < 3.9 dB < 2.6 dB < 2.2 dB
54
MO_COADM2AB_xx < 4.4 dB < 3.2 dB < 3.2 dB
49
Module specifications are also applicable to XDM-100H.
50
Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2dB.
51
52
53
xx designates the channel dropped by the OADM.
54
xx designates the group of two channels dropped by the OADM.

Splitter/Coupler Modules
Module type 55 Insertion loss
MO_4CP4SPMM50 4 dB
MO_4CP4SPMM62 4 dB
MO_4CP4SPSM 4 dB
CWDM Frequencies and Wavelengths (ITU-T

Rec. G.694.2 for CWDM)
Nominal central wavelengths (nm) for 4-channel 8-channel
spacing of 20 nm system system
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 
55

XDM-100 ............................................................ 200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in)
SIM-1/4/16, PIM-2/345............................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
SAM-4/16.................................................................. 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
EISM, PIM2_63 ...................................................... 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-100/MXC-100B .......................................... 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
TPU ....................................................................... 75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-100 shelf .................................................................................... 7.6 kg (16.76 lbs)
Basic XDM-100 fully populated .................................................................. 20.2 kg (44.53 lbs)
Power
Power consumption .............................................................. Typical 300 W, maximum 420 W
Power Dissipation
Power dissipation .......................................... Typical 1024.5 Btu/hr, maximum 1434.4 Btu/hr

XDM-100 Product Line Main Equipment

Power Consumption
The following table lists the power requirements of the main equipment
components. Determine the expected power requirement of the equipment
installed in the shelf, and compare it with the shelf capabilities.
Type Component Power requirements
Common cards MXC-100 47 W
MXC-100B 47 W
MXC-BR 0W
MXC50 42 W
MXC-300 88.5 W
MXC-900 210 W
ECU 6.7 W
ECU-F 18.3 W
ECU50 68 W
ECU50_R 10 W
ECU300 6.7 W
ECU300_F 18 W
ECU900 6.7 W
ECU900_F 18 W
INF50 14 W
OHU 5W
TPU 0W
TC 2.5 W
TCF 7W
FCU-100-9F 21.6 W
FCU50 52 W
FCU300 79.2 W
FCU900 79.2 W
PDH modules PIM2_21 11 W
PIM2_42 14.3 W
PIM2_63 16 W
PIM2_63B 16 W
PIM2_63S 16 W
PIM345_3 11 W
CCP50_2 2W


SDH modules SAM1_4E 10 W
SAM1_4O 10 W
SAM1_4OB 10 W
SAM4_2 17 W
SAM16_1 19.7 W
SAM16_1B 30 W
SIM1_4E 12 W
SIM1_4O 12 W
SIM1_4OB 12 W
SIM1_8 12.8 W
SIM4_2 17 W
SIM4_4 30 W
SIM4_8 47 W
SIM16_1 26 W
SIM16_2 37 W
SIM16_4 63.3 W
SIM16_8 110 W
SIM64_XFP 73.6 W
SIM64_1 60 W
SIM64_2 137 W
Protection modules TPM2_1 5W
TPM2_3 5W
TPM2_42_2 5W
TPM2_63_2 5W
TPMH_1 5W
Data modules EISMB_804 32 W
EISMB_840 35 W
DIOM_04 22 W
DIOM_08 24 W
DIOM_40 31.2 W
MCSM 75 W
Control module ACP100 12 W
ACP900 12 W


Optical modules MO_CMD4C 1.8 W
MO_CMD8 4.8 W
MO_CMD4C_E 4.8 W
MO_CMD4SL 4.8 W
MO_COADM1AB-Gxx 4.8 W
MO_COADM2AB-xx 4.2 W
MO_4CP4SPSM 4.2 W
MO_4CP4SPMM50 4.2 W
MO_4CP4SPMM62U5 4.8 W
CCMB25_2D 34 W
CRPT25_2C 4.5 W
CTRP25_2C 10 W
OSC1_2 12 W
Optical amplifiers MO_DC0_BAS 7W
MO_PAS_DCM80 4.9 W
Optical transceivers OTR1_YY 1W
OTR4_YY 1W
OTR25_YY 1W
OTC25_PSxx 1.5 W
OTC25_ALxx 1.5 W
Data transceivers OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OMS16-4T 8W
MO_DW16MDB-AVAV 4.8 W
MO_DW16MDB-ST 4.8 W
MO_DW16MDR-ST 10 W
MO_DW16MDRE-ST 10 W
MO_DW40MC-S 10 W
MO_DW40MC-A 10 W
MO_DW40MC-G 10 W
MO_DW40DC-A 10 W
MO_DW40DC-G 10 W

Operation
Temperature range .............................................................................................. -5 ºC to +55 ºC
NOTE: Extended temperature range of -5 ºC to +65 ºC is

supported for specific outdoor configurations.
Storage (packed)
Temperature range ............................................................................................ -25 ºC to +55 ºC

EMC
Safety
Laser Safety

NEBS Compliance
The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
Reliability
Life
Availability

5
XDM-300/900 Specifications
In this chapter:
Redundancy ..................................................................................................... 5-2
I/O Interfaces ................................................................................................... 5-3
Management .................................................................................................... 5-5
SDH/SONET Interfaces .................................................................................. 5-6
Data Modules................................................................................................. 5-14
Optical Amplifier Modules for TPU/OCU .................................................... 5-19
CWDM Modules ........................................................................................... 5-20
EMC .............................................................................................................. 5-26
Safety ............................................................................................................. 5-26
Reliability ...................................................................................................... 5-26

XDM-300/900 Specifications XDM System Specifications
MXC300 Cross-Connect Capacity

SONET switch core options ......................................................................... 384 x OC-3/STS-1
MXC900 Cross-Connect Capacity

SONET switch core options ......................................................................... 768 x OC-3/STS-1
Traffic Protection
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................. within 50 ms
Redundancy

XDM System Specifications XDM-300/900 Specifications
Synchronization
There are several timing references available from multiple SDH/SONET
and/or PDH/Async timing sources:
 From any 1.5 Mbps tributary interface
 From any SDH/SONET line
 External SONET 1.5 Mbps timing outputs (two per shelf)
Jitter and Wander

I/O Interfaces
2 Mbps (E1)
Frame ......................................................................................................................... Unframed
Line code .......................................................................................................................... HDB3
Line impedance .................................................................. 120 Ω balanced/75 56 Ω unbalanced
Bitrate ........................................................................................................ 2048 Kbps ± 50 ppm
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
56
Through an external DDF.

45 Mbps (DS-3)
Line code ........................................................................................................................... B3ZS
52 Mbps (STS-1)
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
STM-1 Electrical
Bitrate ..................................................................................................... 155.52 Mbps ±20 ppm
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI
STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................... 155.52 Mbps ±4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Bitrate ......................................................................................................... 622 Mbps ±4.6 ppm
Transmission range ............................................................................................ S3, L3, L5, V5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate .................................................................................................. 2488.32 Mbps ±4.6 ppm
Transmission range ............................................. I3, S3, L3, L5, CDWM (G.694.2 and G.695)

Physical level .......................................................................................... G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, C/DWDM (G.694.1) bitrate ... 9953.28 Mbps ±4.6 ppm
Management
LightSoft (network manager) server and client for managing all ECI equipment ....................

TMN; RS-232 to LCT-XDM; OverHead Access (OHA); orderwire; RAP.

Alarm concept ................................................................................................................... G.783

STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O
Modules
Min. sensitivity (BER of 1*10-12) EOL dBm) -28 -34 -34

57
58


TRANSMITTER

RECEIVER 62

EOL (dBm)

59
60
61
62


Modules
SFP TRANSCEIVER NAME OTR4_S3 OTR4_L3 OTR4_L5 OTR_V5
APPLICATION CODE 63 S-4.1 L-4.1 L-4.2 V5
Operating wavelength (nm) 1274-1356 1280-1335 1480-1580 1550
TRANSMITTER
Source type MLM 64 SLM SLM SLM

Max. RMS width (nm) 4/2.5 - - -
Max. -20 dB width (nm) - 1 <1 1
Min. side mode suppression ratio (dB) - 30 30 30
Min. mean launched power (dBm) -15 -3 -3 0
Max. mean launched power (dBm) -8 +2 +2 4
RECEIVER
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -28 -28 -34
Max. receiver reflectance (dB) - -14 -27 -27
Max. dispersion [ps/nm] 74 - - -

Min. optical return loss of cable (dB) - 20 24 -
Max. discrete reflectance (dB) - -25 -27 -

63
64


TRANSMITTER
Min. side mode suppression - 30 - 30
ratio (dB)
(dBm)
Max. mean launched power -8 -8 +2 +2
(dBm)
66
RECEIVER
10-12) EOL (dBm)
Min. optical return loss of - - - -

cable (dB)
65
66

STM-16/OC-48 (2488.32 Mbps ±4.6 ppm)

I/O Modules
SFP TRANSCEIVER NAME OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
APPLICATION CODE 67 I-16 S-16.1 L-16.1 L-16.2
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1
Min. side mode suppression - 30 30 30
(dB)
(dBm)
Max. mean launched power -3 0 +3 +3
(dBm)
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28
1*10-12) EOL (dBm)
Max. dispersion [ps/nm] - - - 1600
Min. optical return loss of -24 -24 -24 -24
cable (dB)
Max. optical path penalty dB) <1 1 1 2

67


68
TRANSMITTER
Min. side mode suppression 30 30 30 30
ratio (dB)
(dBm)
Max. mean launched power +2 +2 +5 +5
(dBm)
69
RECEIVER
10-12) EOL (dBm)
(dB)
68
69

2.5 Gbps Optical C/DWDM SFP Transceivers

CWDM DWDM
SFP TRANSCEIVER NAME OTC25_1PSxx 70 OTC25_1ALxx 71 OTR25_AVxx 72 OTR25_ABxx 73
74
APPLICATION CODE DW100S1D2/5(C) DW100L-1D2/5(C)F
DW100S1A2/5(C) DW100C-1A2/5(C)F
G.698.1/.2
TRANSMITTER
Max. -20 dB width (nm) 1 1 0.4 0.4
Min. side mode suppression (dB) 30 30 30 30
Min. mean launched power (dBm) 0 0 0 0
Max. mean launched power (dBm) +5 +5 4 4
RECEIVER
Min. sensitivity (BER of 1*10-12) -21.5 (-23 GbE) -28(-32 GbE) -28 -28
EOL (dBm)
Min. overload (dBm) 0 -7 -9 -9
Max. dispersion [ps/nm] 800 1600 2400 3600
(40 km G.652) (80 km G.652) (120 km G.652) (180 km G.652)
Min. optical return loss of cable (dB) 24 24 -24 -24
Max. optical path penalty (dB) 1.5 2.5 <3 <2
70
71
72
73
74

10 Gbps Optical XFP Transceivers

OTR10_ASx
Transceiver OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ALxx OTX10_AT
x
I-64.1
S-64.2b L-64.2a
Application code P1I1_2D1 1L1-2D2F
P1S1_2D2b P1L1-2D2
VSR2000_2R1
Source type SLM SLM SLM SLM SLM SLM
Modulation External External External
Operating output 1528.38-1564.
1290-1330 1529-1560 1530-1565 1529-1560 1529-1560
wavelength (nm) 68
Central frequency 192.1 + 0.1m 192.1 + 0.1m 191.7+0.05m
-- -- --
(THz) m=0 to 40 m=0 to 40 m=0 to 88
Maximum central
frequency deviation -- -- -- ±12.5 ±12.5 ±2.5
(GHz)
Spacing (GHz) -- -- -- 50
Direct max. -20 dB
<1 <1 <1 <1 <1 < 0.5
width (nm)
Min. side mode
30 30 30 30 30 35
suppression ratio (dB)
Min. mean launched -6 -1 0
-1 -1
power (dBm)
Max. mean launched -1 +2 +4
+3 +3
power (dBm)
Min. extinction ratio 6 8.2 9
9 9 9
(dB)
Maximum attenuation
4 11 22 NA --
(dB)
Minimum attenuation
0 3 11 NA --
(dB)
Max. dispersion (ps/nm) 6.6 800 1600 1600 1440
Minimum optical return
24 24 24 -- --
loss (dB)
Maximum discrete
-27 -27 -27 -27 -27
reflectance
Maximum DGD (ps) 30 30 30 --
Sensitivity (BER of
-11 -14 -24 -24 -24
1*10-12) (dBm)
Min. overload (dBm) -1 -1 -7 -8 -7
Maximum optical path
1 2 2 2 2.5
penalty
OCH switching time
<3 <3 <3 NA NA
(ms)

Data Modules
DIOM Specifications
Service interfaces 4 x 10/100/1000BaseT 8 x 10/100BaseT 4 x optical FX/GbE
with SFP
length

........................................................................................................................... G.7042 (LCAS)

Module EISMB_04 EISMB_40
Service interfaces 2 x 10/100/1000BaseT + 2 x optical FX/GbE +
2 x 10/100BaseT 2 x optical FX with SFP
Size 1 slot 1 slot
6 x FX EoS 6 x FX EoS
Total EoS bandwidth per module Up to 16 x VC-4 Up to 16 x VC-4
Total bandwidth per EoS port 1 to 16 x VC-4 1 to 16 x VC-4
1 to 48 x VC-3 1 to 48 x VC-3
1 to 63 x VC-12 1 to 63 x VC-12

.................................................................................................... 1000BaseZX, 1000BaseT SFP
.......................................................................... G.707, G.783, G.7041 (GFP), G.7042 (LCAS)
Slot support ...................................... up to 8 modules in the right-most slots only I3, I4, I7, I8,
.................................................................. I11, I12, I15, I16

MCSM Specifications
Module MCSM
8 x optical FX/GbE with SFP
Size 2 slots
Data handling Layer 2 (Ethernet/MPLS)
Network interfaces 16 x EoS/MoT

Total EoS bandwidth per module Up to 32 x VC-4
Up to 96 x VC-3
Up to 252 x VC-12
1 to 48 x VC-3
1 to 63 x VC-12
NG-SDH standards GFP-F, VCAT, LCAS
Differential delay compensation 256 ms for VC-3/4
128 ms for VC-12
Interfaces ................................. 10/100BaseT, 100BaseFX (single mode and multimode fiber),

Protection ........................................ <50ms FRR link and node, <50ms Dual homed/attached,
.............................................................................................................................. G.8032 (ERP)
................................................................... Fast IOP – MCSM 1+1 hot standby card protection
MPLS-based services ... VPWS (Martini encapsulation), VPLS (Full mesh and star), H-VPLS
IGMP snooping and static MAC
Hard QoS:
....................................... 8000 policed flows per card supporting CIR, CBS and EIR, EBS
......................................... Classification based on port, CVLAN, CVLAN-Pbits, SVLAN,
........................................... SVLAN-Pbits (802.1p priority bits), Untagged Frame, BPDU,
................................................... and Wildcard (all VLANs that are not explicitly defined).
........................................ Untagged frame handling with port-based VLAN (attach/detach
...................................................................... CVLAN and/or SVLAN to untagged frames)
Eight Classes of Service (CoS), Classification rules, CoS mapping,
.............................................. 2 rate policing, 3 colors marking, Admission Control (CAC)
................................. WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing
..................................................................................................... / Weighted Round Robin)

MAC and VLANs:

........................ 4093 x 4093 VLANs with 16k VLAN mapping rules, SVLAN translation,
............................... S-VLAN configurable Ether-type, FDB (Forwarding Data Base) with
.................................................................................................... 128k MAC address entries
E2E OAM:
........................................Tunnel OAM with Connectivity Verification per ITU-T Y.1711,
............................................................................................................ Link OAM (802.3ah)
.............................................................................................. Service OAM 802.1ag (CFM)
Security:
...................................... VSI (Virtual Switch Instance) VPN segregation, VLAN filtering,
......................................................................... FIB quota, BSC (Broadcast Storm Control)
Management:
....................................... Point-and-click fast service creation, Management layers/Planes:
................................................. Data, TDM, optic, Supporting CAC for MPLS Tunnel and
............................................. Service provisioning, Enhanced protection by SRLG (Shared
.................................................................................................... Risk Link Group) schemes
Services:
........................................................................................................................... conferences
IEEE ............................................................... 802.1ad, 802.3ah (Link OAM), 802.1D/P/Q,
.................................................................... 802.1w, 802.3-2005, 802.3ad, 802.3x, 802.1ag
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
.................................................................. G.8012/Y.1308, Y.1710, Y.171, G.783, G.8032
..................................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702,
...................................................... RFC 4090, RFC 3916, RFC 3985, RFC 4125, RFC 412

Client Transceivers for MCSM, EISMB_840

Cards
OTGBE_SX OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM
Transmitter type GbE GbE long-reach GbE very FX, short-reach FX, short-reach
short-reach laser, 1310 nm, long-reach laser, 1310 laser, 1310 nm,
laser, 850 nm, single mode laser, 1550 nm, multimode single mode
multimode single mode
(Gbps)
launch
Min. -9.5 -11 0 -15 0
power
(dBm)
Data format 8B/10B 8B/10B 8B/10B N/A N/A
Average Min. -20 -22 -22 -28 -22
receiver
Typical -21 -25.5 -- -30 --
sensitivity
(dBm)
(dBm)
(dBm)
(50/62.5 µm (9 µm SMF) (9 µm SMF) (50/62.5 µm (9 µm SMF)
MMF) MMF)
Table 5-4: GbE bidirectional transceivers

OTGBE_S3BD OTGBE_S5BD OTGBE_L3BD OTGBE_L5BD
Transmitter type Bidirectional SFP, Bidirectional SFP, Bidirectional SFP, Bidirectional SFP,
1310 nm 1490 nm 1310 nm e 1490 nm
Data rate (nominal) (MBaud) 1250 1250 1250 1250
Average launch power (dBm) -3 Max. -3 +2 +2
-10 Min. -10 -5 -5
Min. transmitter extinction ratio >9 >9 >9 >9
(dB)
Data format 8B/10B 8B/10B 8B/10B 8B/10B
Average receiver sensitivity < -21 < -21 < -23 < -23
(dBm)
Typical Rx LOS level (dBm) < -22 < -22 < -24 < -24
Connector LC LC LC LC
Fiber lengths 10 km 10 km 40 km 40 km
(9 µm SMF) (9 µm SMF) (9 µm SMF) (9 µm SMF)


ETGBE Notes
Connector RJ-45
Cable type CAT 5
Cable length 100m
Optical Amplifier Modules for

TPU/OCU
The MO_DC0_BAS is an optical booster for the C band. MO_PAS_DCM80 is a single
channel preamplifier (Channel 35 in the C band).
MO_DC0_BAS (Booster) MO_PAS_DCM80
Input power (dBm) -12 – +4 -38 – -18
75
Output power (dBm) 14.5-16 -16 – -14
Spectrum (nm) Channel 35
Gain tilt (Ch. 21-36) (dB) < 3 76 N/A
77
Gain tilt (Ch. 21-60) (dB) <7 N/A
Passband width, < 0.5 dB loss
N/A N/A
(GHz)
Passband width, < 1.0 dB loss
N/A N/A
(GHz)
Noise figure (dB) <7 <6
Polarization-dependent gain (dB) < 0.5 < 0.5
Polarization mode dispersion (ps) < 0.1 < 0.3
Power consumption (Watt) <7 <7
78
Monitor port tap fraction (%) 4-6 0.5 - 2
Automatic Laser Shutdown (ALS) 100 ms --
75
For 10 G links, add a 3 dB attenuator to the output ports.
76
77
78
Over the entire C band.

CWDM Modules
Mux/Demux Modules for XDM-300/900
See Section Mux/Demux Modules (page 4-21) for detailed specifications.
OADM Modules for XDM-300/900

See Section OADM Modules (page 4-21) for detailed specifications.
Splitter/Coupler Modules for XDM-300/900

See Section Splitter/Coupler Modules (page 4-22) for detailed specifications.
CWDM Frequencies and Wavelengths (ITU-T

Rec. G.694.2 for CWDM)
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 

XDM-300/XDM-900 .......................................... 350 x 443 x 246 mm (13.8 x 17.44 x 9.68 in)
SIM-1/4/8/16, PIM-2/345 ......................................... 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
PIM2_63/B, MCSM ................................................ 32 x 195 x 213 mm (1.26 x 7.68 x 8.38 in)
SIM16_4/SIM64_XFP/SIM64_2 ........................................ 34 x 381 x 203 mm (1.34 x 15 x 8)
TCF/TC ..................................................................... 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC-300 .............................................................. 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
MXC900................................................................ 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
ECU300 ...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8)
ECU900 ...................................................................................... 27 x 381 x 203 (1.06 x 15 x 8)
TPU/OCU.............................................................. 75 x 443 x 246 mm (2.95 x 17.44 x 9.68 in)
xRAP-D (optional) .............................................. 133 x 445 x 285 mm (5.24 x 17.53 x 7.29 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
Basic XDM-300 fully populated ..................................................................... 30 kg (66.08 lbs)
Basic XDM-900 fully populated ..................................................................... 30 kg (66.08 lbs)
Power
XDM-300 power consumption .......................................... Typical 800 W, maximum 1100 W
XDM-900 power consumption ........................................ Typical 1000 W, maximum 1400 W

Power Dissipation
XDM-300 power dissipation ............................... Typical 2732 Btu/hr, maximum 3757 Btu/hr
XDM-900 power dissipation ............................... Typical 3414 Btu/hr, maximum 4780 Btu/hr

Power Consumption
Common cards MXC-100 47 W
MXC-100B 47 W
MXC-BR 0W
MXC50 42 W
MXC-300 88.5 W
MXC-900 210 W
ECU 6.7 W
ECU-F 18.3 W
ECU50 68 W
ECU50_R 10 W
ECU300 6.7 W
ECU300_F 18 W
ECU900 6.7 W
ECU900_F 18 W
INF50 14 W
OHU 5W
TPU 0W
TC 2.5 W
TCF 7W
FCU-100-9F 21.6 W
FCU50 52 W
FCU300 79.2 W
FCU900 79.2 W


PDH modules PIM2_21 11 W
PIM2_42 14.3 W
PIM2_63 16 W
PIM2_63B 16 W
PIM2_63S 16 W
PIM345_3 11 W
CCP50_2 2W
SDH modules SAM1_4E 10 W
SAM1_4O 10 W
SAM1_4OB 10 W
SAM4_2 17 W
SAM16_1 19.7 W
SAM16_1B 30 W
SIM1_4E 12 W
SIM1_4O 12 W
SIM1_4OB 12 W
SIM1_8 12.8 W
SIM4_2 17 W
SIM4_4 30 W
SIM4_8 47 W
SIM16_1 26 W
SIM16_2 37 W
SIM16_4 63.3 W
SIM16_8 110 W
SIM64_XFP 73.6 W
SIM64_1 60 W
SIM64_2 137 W
Protection modules TPM2_1 5W
TPM2_3 5W
TPM2_42_2 5W
TPM2_63_2 5W
TPMH_1 5W


Data modules EISMB_804 32 W
EISMB_840 35 W
DIOM_04 22 W
DIOM_08 24 W
DIOM_40 31.2 W
MCSM 75 W
Control module ACP100 12 W
ACP900 12 W
Optical modules MO_CMD4C 1.8 W
MO_CMD8 4.8 W
MO_CMD4C_E 4.8 W
MO_CMD4SL 4.8 W
MO_COADM1AB-Gxx 4.8 W
MO_COADM2AB-xx 4.2 W
MO_4CP4SPSM 4.2 W
MO_4CP4SPMM50 4.2 W
MO_4CP4SPMM62U5 4.8 W
CCMB25_2D 34 W
CRPT25_2C 4.5 W
CTRP25_2C 10 W
OSC1_2 12 W
Optical amplifiers MO_DC0_BAS 7W
MO_PAS_DCM80 4.9 W
Optical transceivers OTR1_YY 1W
OTR4_YY 1W
OTR25_YY 1W
OTC25_PSxx 1.5 W
OTC25_ALxx 1.5 W


Data transceivers OTFE_SM 1W
OTFE_MM 1W
OTGBE_LX 1W
OTGBE_SX 1W
OTGBE_ZX 1W
ETGBE 1W
OMS16-4T 8W
MO_DW16MDB-AVAV 4.8 W
MO_DW16MDB-ST 4.8 W
MO_DW16MDR-ST 10 W
MO_DW16MDRE-ST 10 W
MO_DW40MC-S 10 W
MO_DW40MC-A 10 W
MO_DW40MC-G 10 W
MO_DW40DC-A 10 W
MO_DW40DC-G 10 W
Operation
Temperature range .............................................................................................. -5 ºC to +55 ºC
Storage (packed)
Temperature range ............................................................................................ -25 ºC to +55 ºC


EMC
Safety
Laser Safety
NEBS Compliance
The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
Reliability
Life
Availability

6
XDM-40, 400, 450, 500, 1000,
2000, and 3000 Specifications
In this chapter:
Electrical, Optical, and Mixed Basecard Information ..................................... 6-2
XDM Shelf Capacities ..................................................................................... 6-5
PDH/Async and SDH/SONET Interface Specifications ................................. 6-8
SDH/SONET Interfaces ................................................................................ 6-10
XDM MPLS/Ethernet Card Summary........................................................... 6-22
Data Cards ..................................................................................................... 6-22
Optical Components ...................................................................................... 6-32
C Band Channel Frequencies and Wavelengths (ITU-T Rec. G.694.1 for
DWDM) ......................................................................................................... 6-62
CWDM Frequencies and Wavelengths (ITU-T Rec. G.694.2 for CWDM) .. 6-65
EMC .............................................................................................................. 6-73
Safety ............................................................................................................. 6-73
Reliability ...................................................................................................... 6-74
Management Specifications ........................................................................... 6-74
Other Specifications ...................................................................................... 6-75

XDM-40, 400, 450, 500, 1000, 2000, XDM System Specifications
and 3000 Specifications
Electrical, Optical, and Mixed

Basecard Information
Card Ports/Bitrate
Electrical
PIO2_84 84 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced
interfaces
PIO2_21 21 x E1 (2 Mbps) PDH/Async basecard for balanced and unbalanced
interfaces
PIO345/PIO345M 79 16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces
Optical
SIO16/SIO16M 80 2 x STM-16/OC-48 (2.488 Gbps) interfaces
81
SIO64/SIO64M/MF 1 x STM-64/OC-192 (10 Gbps) interface
82
SIO164 1 x STM-64/OC-192 (10 Gbps) interface or
4 x STM-16/OC-48 (2.488 Gbps) interfaces
XIO192 1 x STM-16/OC-48 (2.488 Gbps) + 1 x STM-4/OC-12 or
4 x STM-1/OC-3 interfaces
XIO348F 83 1 x STM-64/OC-192 (10 Gbps) interface or
4 x STM-16/OC-48 (2.488 Gbps) interfaces
Mixed
SIO1&4/SIO1&4M 84 Supports various electrical (e) and/or optical (o) interfaces as follows:
SIO1&4B  16 x STM-1o/OC-3/OC-3c
 16 x STM-1e/STS-3e
 4 x STM-4/OC-12
NOTE: For full interface support per card and shelf, please
contact ECI's Product Management or your local ECI
representative.
79
The suffix M denotes SONET support; it also denotes MS-SPRing/BLSR support for SDH/SONET. The MF suffix
denotes FEC 7% support according to ITU-T Recommendation G.709.
80
81
denotes FEC 7% support according to ITU-T Recommendation G.709. Cards are not supported in XDM-400.
Optical STM-16 transceivers MSA for 2 and 20 km are not supported for SIO64MF.
82
Cards are not supported in XDM-400.
83
84

XDM System Specifications XDM-40, 400, 450, 500, 1000, 2000,
Electrical Interface Connection Modules

Electrical I/O cards are assigned an interface connection module. This module
serves as the I/O card electrical line transceiver and is connected to the I/O
cards via the XDM backplane. For example, when eleven PIO2_84 I/O cards
are installed in the XDM-1000 cards cage, eleven M2_84xx connection
modules should be installed in the modules cage. In this case, if hardware
protection is required, one PIO2_84 I/O card can be configured as the
protection card, and the corresponding protection connection module M2_84P
I/O is installed in the appropriate slot of the XDM-1000 modules cage.
I/O slot 12 is always configured as a pure optical slot without a modules cage
module.
Connection Module Data for Electrical I/O

Cards
I/O card Bitrate I/O ports Module Interface type Function/Description
(Mbps)
SIO1&4 155 16 M1_16BT SDH/SONET Connection module
electrical
M1_16DIN SDH/SONET Connection module
electrical
M1_16P 85 - Connection module with
protection
8 M1_8BT SDH/SONET Connection module
electrical
M1_8DIN SDH/SONET Connection module
electrical
PIO345 34/45/52 16 M345_16BT PDH/Async Connection module
M345_16DI PDH/Async Connection module
M345_16P 86 PDH/Async Connection module with
protection
8 M345_8BT PDH/Async Connection module
M345_8DI PDH/Async Connection module
M345_8BN PDH/Async Connection module
85
Protection modules are not supported in XDM-400.
86
Protection modules are not supported in XDM-400.

I/O card Bitrate I/O ports Module Interface type Function/Description

(Mbps)
PIO2_84 2.048 84 M2_84B PDH Balanced (120 Ω) connection
module
M2_84BR PDH Low-cost, balanced (120 Ω)
connection module, without
protection
M2_84U PDH Unbalanced (75 Ω)
connection module
M2_84UR PDH Low-cost, unbalanced (75 Ω)
connection module, without
protection
M2_84P 87 PDH Connection module with
protection
PIO2_21 2.048 21 M2_21B PDH Balanced (120 Ω) connection
module
M2_21U PDH Unbalanced (75 Ω)
connection module
M2_84P 88 PDH Connection module with
protection
Optical transceivers for I/O cards

Optical I/O cards use a slide-in optical transceiver, which is directly plugged
into the card for signal interfacing.
I/O ports
Connector Modules per
I/O card Optical module per optical Ports per I/O card
type I/O card
module
SIO1&4 OM01_4 LC 4 4 16 x STM-1/OC-3
OM04_1 SC/LC 1 4 4 x STM-4/OC-12
SIO16 OM16_1 SC/LC 1 2 2 x STM-16/OC-48
89
SIO64 OM64_1 LC 1 1 1 x STM-64/OC-192/OTU2
SIO164 90 OMSC16_4 LC 4 1 4 x STM-16/OC-48/OTU1
OMTX10_EF LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10 LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10_S LC 1 1 1 x STM-64/OC-192/OTU2
XIO192 OM01_4 LC 4 1 4 x STM-1/OC-3
OM04_1 SC/LC 1 1 1 x STM-4/OC-12
OM16_1 SC/LC 1 1 1 x STM-16/OC-48
XIO384F 91 OMSC16_4 LC 4 1 4 x STM-16/OC-48/OTU1
OMTX10_EF LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10 LC 1 1 1 x STM-64/OC-192/OTU2
OMTX10_S LC 1 1 1 x STM-64/OC-192/OTU2
87
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
88
Protection module M2_84P can be used to protect PIO2_84. Protection modules are not supported in XDM-400.
89
90
91

Optical SFP transceivers for I/O cards

New optical I/O cards use a high flexibility concept, consisting of slide-in
optical modules. Each module has slots for up to four SFP transceivers.
I/O card Optical Connector I/O ports per Modules per Ports per I/O card
module type optical I/O card
module
SIO1&4 OMS01_4 92 LC 1 to 4 4 16 x STM-1/OC-3
93
OMS04_1 LC 1 4 4 x STM-4/OC-12
SIO16 OM16_1SFP 94 LC 1 2 2 x STM-16/OC-48/OTU1
SIO164 OMSC16_4 LC 4 1 4 x STM-16/OC-96/OTU2
XDM Shelf Capacities

XDM shelf slot capacities differ as a function of the type of matrix cards
(HLXC or XIO) used. Although the XIO and the HLXC have identical
cross-connect capabilities, the bandwidth allocation capacity per I/O slot for
the XIO is different than that of the HLXC. The HLXC has uniform capacity
distribution per slot, regardless of the XDM shelf in which it is installed. In
contrast, XIO capacity varies, depending on the XDM shelf type in use.
XDM Shelf Capacities with HLXC

The following table describes the HLXC bandwidth allocation capacity (in VC-4s) per slot
for each XDM shelf type.
XDM-500 slot # XDM-1000/ XDM-500 XDM-1000 XDM-1000/2000 XDM-1000/2000
2000 slot # slot capacity slot capacity slot capacity slot capacity
(HLXC192) (HLXC192) (HLXC384) (HLXC768)
I/C2 I/O1 32 16 32 64
(5 Gbps) (2.5 Gbps) (5 Gbps) (10 Gbps)
I/C3 I/O2 32 16 32 64
I/C4 I/O3 32 16 32 64
I/C5 I/O4 32 16 32 64
I/C1 I/O5 32 16 32 64
I/C6 I/O6 32 16 32 64
I/O7 16 32 64
(2.5 Gbps) (5 Gbps) (10 Gbps)
I/O8 16 32 64
92
SFP SDH/SONET transceivers starting system version V 5.0, DWDM SFPs release V6.2.
93
94

XDM-500 slot # XDM-1000/ XDM-500 XDM-1000 XDM-1000/2000 XDM-1000/2000

2000 slot # slot capacity slot capacity slot capacity slot capacity
(HLXC192) (HLXC192) (HLXC384) (HLXC768)
I/O9 16 32 64
I/O10 16 32 64
I/O11 16 32 64
I/012 16 32 64
Total capacity 192 192 384 768
XDM Shelf Capacities with XIO

The following table describes the XIO bandwidth allocation capacity (in VC-4s) per slot for
each XDM shelf type.
95
XDM-400 XDM-500 XDM-1000/ XDM-400 slot XDM-500 XDM-500 XDM-1000 XDM-1000/ XDM-1000/
96
slot # slot # 2000 slot # capacity slot slot slot 2000 slot 2000 slot
(XIO192) capacity capacity capacity capacity capacity
(XIO192) (XIO384F) (XIO192) (XIO384F (XIO384F
97 98
ConfigA) ConfigB)
IS2 IC2 I/O1 32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 0
IS3 IC3 I/O2 32 (5 Gbps) 32 (5 Gbps) 64 (10 32 (5 Gbps) 32 (5 Gbps) 0
Gbps)
IC4 I/O3 16 (2.5 Gbps) 32 (5 Gbps) 64 (10 16 32 (5 Gbps) 64 (10
Gbps) (2.5 Gbps) Gbps)
IS4 IC5 I/O4 16 (2.5 Gbps) 32 (5 Gbps) 32 (5 Gbps) 16 32 (5 Gbps) 64 (10
(2.5 Gbps) Gbps)
IS1 IC1 I/O5 16 (2.5 Gbps) 8 32 (5 Gbps) 16 16 16
(1.25 Gbps) (2.5 Gbps) (2.5 Gbps) (2.5 Gbps)
IS5 IC6 I/O6 8 32 (5 Gbps) 16 16 16
(1.25 Gbps) (2.5 Gbps) (2.5 Gbps) (2.5 Gbps)
I/O7 4 16 16
(622 Mbps) (2.5 Gbps) (2.5 Gbps)
I/O8 4 16 16
(622 Mbps) (2.5 Gbps) (2.5 Gbps)
I/O9 4 (622 16 16
Mbps) (2.5 Gbps) (2.5 Gbps)
95
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using the XIO384F with an
STM-64 interface frees six slots in the XDM-500 for PIO and SIO cards.
96
The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well as an ADM-16 with
many PIO interfaces. This is an excellent option for systems with a large number of E1 interfaces.
97
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a multi-ADM-16 with eight
drop slots available for SDH/SONET, PDH, and Ethernet services.
98
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution for a double ADM64
with eight drop slots available for SDH/SONET, PDH, and Ethernet services. Two slots are available for optical
transponders and/or combiners for hybrid applications.

95
XDM-400 XDM-500 XDM-1000/ XDM-400 slot XDM-500 XDM-500 XDM-1000 XDM-1000/ XDM-1000/
96
slot # slot # 2000 slot # capacity slot slot slot 2000 slot 2000 slot
(XIO192) capacity capacity capacity capacity capacity
(XIO192) (XIO384F) (XIO192) (XIO384F (XIO384F
97 98
ConfigA) ConfigB)
I/O10 4 16 16
(622 Mbps) (2.5 Gbps) (2.5 Gbps)
I/O11 16 16
(2.5 Gbps) (2.5 Gbps)
I/012 16 16
(2.5 Gbps) (2.5 Gbps)
XIO-L XIO-L XIO-L 20 20 64 20 64 64
(10 Gbps)
XIO-R XIO-R XIO-R 20 20 64 20 64 64
(10 Gbps)
OHA OHA OHA 8 8 -- 8 -- --
Total capacity 192 192 384 192 384 384
The bandwidth capacities in the XDM-500 are suitable for cost-effective ADM-64s. Using
the XIO384F with an STM-64 interface frees six slots in the XDM-500 for PIO and SIO
cards.
The bandwidth capacities in the XDM-1000 are suitable for cost-effective ADM-64s as well
as an ADM-16 with many PIO interfaces. This is an excellent option for systems with a
large number of E1 interfaces.
The bandwidth capacities in this configuration of the XDM-1000/2000 are suitable for a
multi-ADM-16 with eight drop slots available for SDH/SONET, PDH, and Ethernet
services.
The bandwidth capacities in this configuration of the XDM-1000/2000 are a good solution
for a double ADM-64 with eight drop slots available for SDH/SONET, PDH, and Ethernet
services. Two slots are available for optical transponders and/or combiners for hybrid
applications.

PDH/Async and SDH/SONET

Interface Specifications
2 Mbps (E1)
Frame ...................................................................................... Unframed, G.704, I.431 (ISDN)
Line code .......................................................................................................................... HDB3
Line impedance ..................................................................... 120 Ω balanced/75 Ω unbalanced
34 Mbps (E3)
Frame ................................................................................................................................ G.751
Line code .......................................................................................................................... HDB3
45 Mbps (DS-3)
Frame ................................................................................................................................ G.751
Line code ........................................................................................................................... B3ZS
52 Mpbs (STS-1)
Frame ................................................................................................................................ G.253
Line code ............................................................................................................................. CMI
STM-1 Electrical
Frame ................................................................................................................................ G.707
Line code ............................................................................................................................. CMI

STM-1/OC-3 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul bitrate ................................................................. 155.52 Mbps ±4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul bitrate ................... 622 Mbps ±4.6 ppm
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul,
DWDM (G.694.1 and G.957) bitrate .................................................. 2488.32 Mbps ±4.6 ppm
Physical level .......................................................................................... G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, DWDM (G.694.1) bitrate ...... 9953.28 Mbps ±4.6 ppm

STM-1/OC-3 (155.52 Mbps ±4.6 ppm) I/O
Modules
CARD NAME OM01_4I3 99 OM01_4S3 OM01_4L5
100
APPLICATION CODE S-1.1 L-1.2
TRANSMITTER
Source type MLM SLM SLM
Max. RMS width (nm) - 7.7 -
Max. -20 dB width (nm) - - 1
Min. side mode suppression ratio (dB) - - > 30
Max. mean launched power (dBm) -14 -8 0
Min. extinction ratio (dB) 10 8.2 10
RECEIVER
Min. overload (dBm) - -8 -10
Max. dispersion (ps/nm) - 96 -
99
MLM transceiver for 2 km with multimode fibers.
100

MECP_OSC cards
MECP_OC5OW MECP_OC5UOW 101
CARD NAME MECP_OSC5
[MECP_OC5XOW]

Signal Rate 155 Mbps 155 Mbps 2 Mbps
TRANSMITTER
Source type SLM SLM SLM

Max. RMS width (nm) - - -
Max. -20 dB width (nm) 1 1 1
Min. side mode suppression ratio (dB) > 30 > 30 > 30
Min. mean launched power (dBm) 0 0 +1
Max. mean launched power (dBm) +2 +5 +5
Min. extinction ratio (dB) 10 10 10
RECEIVER
Min. sensitivity (BER of 1*10-10) EOL (dBm) -34 -35 [-40] -54
Max. receiver reflectance (dB) -25 - -
OPTICAL PATH BETWEEN S AND R

Min. optical return loss of cable (dB) -20 -20 -
Max. discrete reflectance (dB) -25 -25 -25
101
No interoperability possible between MECP_OC5UOW and the other MECP_OSC modules.

STM-1/OC-3 SFP Optical Transceivers for

OMS01_4
Table 6-1: STM-1 transceivers
102
SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5 OTR1_X5 OTR1_VL5
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580 1500-1520 1500-1520
Source type MLM 104 SLM SLM SLM SLM
Max. RMS width (nm) 7.7 - - - -
Min. side mode suppression ratio (dB) - 30 30 > 30 > 30
Min. mean launched power (dBm) -15 -5 -5 0 +1
Max. mean launched power (dBm) -8 0 0 +5 +5
Min. extinction ratio (dB) 8.2 10 10 10 10
Min. sensitivity (BER of 1*10-12) EOL (dBm) -28 -34 -34 -35 -42
Min. overload (dBm) -8 -10 -10 -8 -5
Max. receiver reflectance (dB) - - -25 - -
Max. dispersion [ps/nm] 96 - - - -
Min. optical return loss of cable (dB) - - -20 -20 -
Max. discrete reflectance (dB) - - -25 -25 -25
Max. optical path penalty (dB) 1 1 1 1 1

102
New optical SFP transceivers for existing SIO1&4B basecard.
103
104


TRANSMITTER
RECEIVER 108
Min. sensitivity (BER of 1 * 10-12) EOL (dBm) -32 -32 -32 -32

Modules
APPLICATION CODE 110 S-4.1 L-4.2
TRANSMITTER
Source type MLM SLM SLM
Max. RMS width (nm) - 4 1
Max. -20 dB width (nm) - - 1
Min. side mode suppression ratio (dB) - - > 30
Max. mean launched power (dBm) -14 -8 +2
Min. extinction ratio (dB) 10 8.2 10
105
106
107
108
109
MLM transceiver for 2 km with multimode fibers.
110


APPLICATION CODE 110 S-4.1 L-4.2
RECEIVER
Min. sensitivity (BER of
-31 -28 -28
1*10-12) EOL (dBm)
Min. overload (dBm) - -8 -8
Max. dispersion (ps/nm) - 74 -
STM-4/OC-12 SFP Optical Transceivers for

OMS04_1
SFP TRANSCEIVER NAME 111 OTR4_S3 OTR4_L3 OTR4_L5
TRANSMITTER
RECEIVER
111
New optical SFP transceivers for existing SIO1&4B basecard.
112
113



114
TRANSMITTER
Min. side mode suppression ratio (dB) - 30 - 30
RECEIVER 115
Min. sensitivity (BER of 1 * 10-12) EOL (dBm) -28 -28 -28 -28

114
115

STM-16/OC-48 (2488.32 Mbps ±4.6 ppm)

I/O Modules
CARD NAME OM16_ OM16_ OM16_ OM16_ OM16_ OM16_ OM16_
1AX5xx 1AV5xx 1AB5xx 1AX5 1AL5 1PS3 1PI3
116
APPLICATION CODE X-16.2 V-16.2 U-16.2 X-16.2 L-16.2 S-16.1 I-16
Operating wavelength 1530- 1530- 1530- 1530- 1530- 1260- 1260-136
(nm) 1560 1565 1565 1560 1565 1360 0
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM SLM
Max. -20 dB width (nm) 1 1 1 1 1 1 2
Max. RMS width (nm) - - - - - - -
Min. side mode 30 30 30 30 30 30 -
suppression (dB)
Min. mean launched +5.5 +1 +0 +5.5 +0 -5 -10
power (dBm)
Max. mean launched +7.5 +3 +2 +7.5 +3 0 -3
power (dBm)
Min. extinction ratio 8.2 8.2 8.2 8.2 8.2 8.2 8.2
(dB)
RECEIVER
Photodiode type APD APD APD APD APD Pin Pin
Min. sensitivity -28 -28 -28 -28 -28 -18 -16
(BER of 1*10-12)
EOL (dBm)
Min. overload (dBm) -7 -7 -7 -7 -7 0 0
Max. receiver reflectance -27 -27 -27 -27 -27 -27 -27
(dB)
Max. dispersion (ps/nm) 1800 1800 3000 117 2160 1800 - 118 - 119
Min. optical return loss -24 -24 -24 -24 -24 -24 -24
of cable (dB)
Max. discrete reflectance -27 -27 -27 -27 -27 -27 -27
(dB)
Max. optical path penalty < 2 <2 <2 <3 <2 <2 <1
(dB)
116
117
To reach distances of 150 km, OM16_1AB5 should be connected to a booster.
118
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.
119
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.

SDH/SONET STM-16/OC-48 SFP Optical

Transceivers for OM16_1SFP and OMSC16_4
SFP TRANSCEIVER NAME 120 OTR16_I3 121 OTR16_S3 122 OTR16_L3 123 OTR16_L5 124
125
APPLICATION CODE I-16 S-16.1 L-16.1 L-16.2
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1
Min. side mode suppression (dB) - 30 30 30
Max. mean launched power (dBm) -3 0 +3 +3
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28
1*10-12) EOL (dBm)
Max. dispersion [ps/nm] - - - 1600
Min. optical return loss of cable -24 -24 -24 -24
(dB)
Max. optical path penalty (dB) <1 1 1 2

120
New optical SFP transceivers for existing SIO16 basecard.
121
All OTR SFP transceivers can be used with SIO164 or XIO384F cards, utilizing the OMSC16_4 module (up to 4
SFP transceivers per module).
122
123
124
125


TRANSMITTER
Min. side mode suppression ratio (dB) 30 30 30 30
Max. mean launched power (dBm) +2 +2 +5 +5
RECEIVER 127
Min. sensitivity (BER of 1 * 10-12) EOL -18 -18 -27 -27

(dBm)

126
127

CWDM and DWDM STM-16/OC-48/OTU1

SFP Optical Transceivers for OM16_1SFP
and OMSC16_4
CWDM DWDM
SFP TRANSCEIVER OTC25_PSx OTC25_1A OTR25_AVx OTR25_ABxx OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
NAME 128 x Lxx x 129 130 131 132
APPLICATION CODE 133 S-C8S1-1D2/ S-C8L1-1D DW100L- DW100L- I-16 S-16.1 L-16.1 L-16.2
5 2/5 -1D2/5(C)F -1D2/5(C)F
G.695 G.695 DW100C- DW100C-
-1A2/5(C)F -1A2/5(C)F
G.698.1/.2 G.698.1/.2
Operating wavelength 1464-1618 1464-1618 1530-1565 1530-1565 1260-1360 1260-1360 1280-133 1500-158
(nm) 5 0
TRANSMITTER
Source type SLM SLM SLM SLM SLM SLM SLM SLM
Max. -20 dB width 1 1 0.4 0.4 2 1 1 <1
(nm)
Max. RMS width (nm) - - - - - - - -
Min. side mode 30 30 30 30 - 30 30 30
suppression (dB)
Min. mean launched 0 0 0 0 -10 -5 -2 -2
power (dBm)
Max. mean launched +5 +5 4 4 -3 0 +3 +3
power (dBm)
Min. extinction ratio 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
(dB)
RECEIVER
Min. sensitivity (BER -21.5 -28 -28 -28 -16 -18 -27 -28
of 1*10-12) (-23 GbE) (-32 GbE)
EOL (dBm)
Min. overload (dBm) 0 -7 -9 -9 0 0 -9 -9
Max. receiver -27 -27 -27 -27 -27 -27 -27 -27
reflectance (dB)
Max. dispersion 800 1600 2400 3600 - - -24 1600
[ps/nm] (40 km (80 km (120 km (180 km
G.652) G.652) G.652) G.652)
Min. optical return loss 24 24 -24 -24 -24 -24 -27 -24
of cable (dB)
128
New optical SFP transceivers for existing SIO16 basecard.
129
130
131
132
133

CWDM DWDM
SFP TRANSCEIVER OTC25_PSx OTC25_1A OTR25_AVx OTR25_ABxx OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
NAME 128 x Lxx x 129 130 131 132
Max. discrete -27 -27 -27 -27 -27 -27 1 -27

reflectance (dB)
Max. optical path 1.5 2.5 <3 <2 <1 1 2
penalty (dB)
SDH/SONET STM-64/OC-192 (9953.28 Mbps

±4.6 ppm) I/O Modules
134
CARD NAME OM64_ OM64_ OM10_ OM10_ OM10_ OM10_
1ALSxx 1ASSxx 1PSSxx 1PLSxx 1PSS3 1PIS3
OM10_1AL OM10_1AS
135 136
Sxx Sxx
137 138 139 140 141 142 143
APPLICATION CODE L-64.2a S-64.2a I-64.2 L-64.2b S-64.1 I-64.1
Operating wavelength (nm) 1530-1565 1530-1565 1530-1565 1530-1565 1285-1330 1285-1330
TRANSMITTER
Source type EML EML EML EML EML EML
Min. mean launched power
0 -2 -2 -2 -4 -6
(dBm)
Max. mean launched power
+2 +3 +3 +3 +1 -1
(dBm)
Min. extinction ratio (dB) 9.0 8.2 8.2 10 6 6
RECEIVER
Photodiode type APD APD PIN PIN PIN PIN
Min. sensitivity
-23 144 -19 145 -14 -14 -15 -11
(BER of 1*10-12) EOL (dBm)
Min. overload (dBm) -8 -8 -1 -1 -1 -1
Max. optical path penalty (dB) <2 <2 <2 <2 <1 <1
Max. receiver reflectance (dB) -27 -27 -27 -27 -27 -27
Max. attenuation range (dB) 21 15 10 10 10 4
Min. attenuation range (dB) 10 10 3 3 1 0
Max. chromatic dispersion
1600 147 800 800 1600 148 40 7
(ps/nm) 146
134
Not supported in XDM-400.
135
OM10 is supported, in all three SIO64 types.
136
OM10 is supported, in all three SIO64 types.
137
138
OM64/OM10 optics are also available for DWDM applications as per the standard ITU-T G.694.1 grid (n = 1-40).
139
140
141
142
143
144
When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm
instead of -23 dBm).
145
When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -25 dBm
instead of -23 dBm).

SDH/SONET STM-64/OC-192 XFP Optical

Transceivers
XFP TRANSCEIVER NAME OTR64_I3 OTR64_S5 OTR64_L5 OTR10_ASxx OTR10_ALxx
149
APPLICATION CODE I-64.1 S-64.2b L-64.2a 1L1-2D2F
P1I1_2D1 P1S1_2D2 P1L1-2D2
VSR2000_2R1 b

TRANSMITTER
Source type SLM SLM SLM SLM SLM
NA NA 192.1 + 0.1m 192.1 + 0.1m
Central frequency (THz) NA
m=0 to 40 m=0 to 40
Maximum central frequency NA NA
NA ±12.5 ±12.5
deviation (GHz)
Max. -20 dB width (nm) <1 <1 <1 <1 <1
Min. side mode suppression 30 30 30 30 30
(dB)
Min. mean launched power -6 -1 0 -1 -1
(dBm)
Max. mean launched power -1 +2 +4 +3 +3
(dBm)
Min. extinction ratio (dB) 6 8.2 9 8.2 9
RECEIVER
Min. sensitivity (BER of -11 -14 -24 -24 -24
1*10-12)
EOL (dBm)
Max. receiver reflectance (dB) -27 -27 -27 -27 -27
Max. dispersion [ps/nm] 6.6 800 1600 800 1600
Min. optical return loss of 24 24 24 2 2
cable (dB)
Max. discrete reflectance (dB) -27 -27 -27 -27 -27
146
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx
sensitivity (EOL) minus max. optical path penalty (dB).
147
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended
up to 76 km.
148
The limitation for the long-range STM-64/OC-192 laser is 68 km. When adding FEC, the range can be extended
up to 76 km.
149

OW Unit Specifications
The OW unit supports omnibus conference call with two separate configurable networks (A
and B). Any user within the network can select another user in its network by direct dialing
(DTMF).
Tx/Rx level .......................................................................... 7 dBm, 600 Ω, (per CCITT G.711)
Speech coding and bit rate .......................................................................... PCM A-law 8 Kbps
Number of VF channels ................................................................................................ 10 to 12
Band pass .......................................................................................................... 300 to 3400 Hz
Subscriber side input/output level ....................................... 7 dBm, 600 Ω, (per CCITT G.711)
Idle channel noise................................................................................................. (-) 75 dBmOp
Number of data channels ...................................................................................... 3 (E1, E2, F1)
Interface connectors type ........................................................................ Tel JACK 6P4C RCA
Data rates....................................................................................................................... 64 Kbps
XDM MPLS/Ethernet Card

Summary
The following table identifies the MPLS/Ethernet components and the platforms within
which specific modules are used. The different modules are listed by interface categories,
where the modules within a category generally share the same functionality. Specific details
may vary from module to module.
Interface XDM-400 XDM-500 XDM-1000 XDM-2000 XDM-3000

Ethernet over SDH/SONET Layer 1
DIOB -- √ √ √ √
Ethernet/MPLS Layer 1 and 2
MCS5 (only in 5 and 10 Gbps slots) -- √ √ √ √
MCS10 (only in 10 Gbps slots) -- √ √ √ √
MCS30_X10G (only in 10 Gbps slots) -- √ √ √ √
Data Cards
Data Network Bandwidth per EoS
Card 150 Service interfaces
handling interfaces interface
DIOB 8 x FX/GbE (optical) 151 + Layer 1 24 x EoS 153 (1 to 16) x VC-4
[8 x 10/100BaseT + (1 to 48) x VC-3
8 x 10/100/1000BaseT] 152 (1 to 63) x VC-12
150
All data cards are not supported in XDM-40.
151
Optical ports on base cards, SFP for GbE or FX.
152
Electrical ports located on ME_16 module in the CCP.

Data Network Bandwidth per EoS

Card 150 Service interfaces
handling interfaces interface
MCS5 154 4 x FX/GbE (optical) 155 + Layer 2 32 x EoS/MoT (1 to 16) x VC-4 157
4 x FX (optical) + (Ethernet/M (1 to 48) x VC-3 158
[12 x 10/100BaseT + PLS) (1 to 63) x VC-12 159
4 x 10/100/1000BaseT] 156
MCS10 160 8 x FX/GbE (optical) 161 + Layer 2 32 x EoS/MoT (1 to 16) x VC-4 163
[8 x 10/100BaseT + (Ethernet/M (1 to 48) x VC-3 164
8 x 10/100/1000BaseT] 162 PLS) (1 to 63) x VC-12 165
MCS30_X10G 1 x 10GbE (optical) + Layer 2 32 x EoS/MoT (1 to 64) x VC-4

166
10 x FX/GbE (optical) 167 (Ethernet/M (1 to 192) x VC-3
PLS) (1 to 64) x VC-12
ATS 168 2 x VC-4 + 126 x E1 ATM 2 x VC-4 + 2 x VC-4 + 125 x E1
125 x E1
DIOB Specifications
........................................................................................................................... G.7042 (LCAS)
EoS capacity with VC-4 or VC-3 granularity .............................................. up to 2.5 or 5 Gbps
EoS capacity with VC-12 granularity .......................................................... up to 512 x VC-12
153
EoS – Ethernet over SDH/SONET.
154
Can be accommodated in 5 Gbps, or 10 Gbps slots only, with 5 Gbps EoS capacity.
155
156
157
Maximum EoS/MoT capacity per card: 5 Gbps (32xVC-4 or 96xVC-3) and per EoS port when using LAG.
158
159
Maximum n x VC-12 per card: 512 x VC-12.
160
Can be accommodated in 10 Gbps slots only.
161
162
163
164
165
Maximum n x VC-12 per card: 512 x VC-12.
166
Can be accommodated in 10 Gbps slots only.
167
Supported starting V8.2
168
ATS resources can be software-allocated to service or network interfaces as required

MCS5 Specifications
Ethernet Ring Protection (ERP) ...... <50ms FRR link and node, <50ms Dual homed/attached,
, G.8032 (ERP) ............................................................ Ethernet UNI/NNI LAG and EoS LAG,
.................................................................... Fast IOP – MCS5 1+1 hot standby card protection
MPLS-based servicesVPWS (Martini encapsulation), VPLS (Full mesh and star), Hierarchical
................................. VPLS (H-VPLS) with multiple Split Horizon Groups and VPLS Spokes
......................................................................................... P2MP (Multicast drop and continue),
...................................................................................................................................... H-VPLS
................................................................................................. IGMP snooping and static MAC
Hard QoS:
...................... SVLAN-Pbits (802.1p priority bits), DHCP field, Untagged Frame, BPDU,
.......................................... 8 Classes of Service (CoS), Classification rules, CoS mapping,
........................... 2 rate policing, 3 colors marking, Connection Admission Control (CAC)
...............................WRED, Shaping, Scheduling (WFQ/WRR – Weighted Fair Queuing /
....................................................................................................... Weighted Round Robin)
MAC and VLANs:
...................... 4093 x 4093 VLANs with 16K VLAN mapping rules, S-VLAN translation,
........................................ S-VLAN configurable Ether-type, FDB (Forwarding Data Base)
E2E OAM:
........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification,
...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace,
........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring
Security:
Management:
Services:


........................................................................................................................... conferences
IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag
............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
.............................................................................. G.8011.1/Y.1307.1, G.8011.2/Y.1307.2,
................................................... G.8012/Y.1308, Y.1710, Y.1711, G.783, G.8032/Y.1344
................................ RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090, RFC 3916,
........................................................................................................... RFC 3985, RFC 4125
MCS10 Specifications
Total EoS/MoT capacity ............................................................................................... 10 Gbps
.............................................................................................................................. G.8032 (ERP)
.................................................................. Fast IOP – MCS10 1+1 hot standby card protection
MPLS-based services ............................................................... VPWS (Martini encapsulation),
.................................................................................... VPLS (Full mesh and star), Hierarchical
.......................................................................................... VPLS (H-VPLS) with multiple Split
........................................................................................... Horizon Groups and VPLS Spokes,
Hard QoS:
....................................Eight Classes of Service (CoS), Classification rules, CoS mapping,


MAC and VLANs:
....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation,
E2E OAM:
........................................... Tunnel OAM (ITU-T Y.1711) with Connectivity Verification,
...................... Service OAM (802.1ag) with Continuity Check, Loopback and Link Trace,
........................... Link OAM (802.3ah), Link Loss Carry Forward (LLCF), Port Mirroring
Security:
Management:
Services:
Business connectivity................................................................ VPWS and VPLS, H-VPLS
........................................................................................................................... conferences
IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag
............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308,
.............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344
................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
......................................................................................... RFC 3916, RFC 3985, RFC 4125
MCS30_X10G Specifications
Interfaces .................................................................. 10GBase-SR (850nm MM), 10GBase-LR
................................ (1310nm SM), 10GBase-ER (1550nm SM), 10GBase-ER (1550nm SM),
....................................................................................... 10GBase-ER (15XXnm DWDM, SM)
Total EoS/MoT capacity ............................................................................................... 10 Gbps

.............................................................................................................................. G.8032 (ERP)
...................................................... Fast IOP – MCS30_X10G 1+1 hot standby card protection
MPLS-based services ............................................................... VPWS (Martini encapsulation),
.................................................................................... VPLS (Full mesh and star), Hierarchical
.......................................................................................... VPLS (H-VPLS) with multiple Split
........................................................................................... Horizon Groups and VPLS Spokes,
Hard QoS:
....................................Eight Classes of Service (CoS), Classification rules, CoS mapping,
MAC and VLANs:
....................... 4093 x 4093 VLANs with 16K VLAN mapping rules, SVLAN translation,
E2E OAM:
Security:
Management:
Services:
Business connectivity...................................................................... VPWS, VPLS, H-VPLS
........................................................................................................................... conferences

IEEE ........................................................................ 802.1D/P/Q, 802.1w, 802.1ad, 802.1ag

............................................................ 802.3-2005, 802.3ad, 802.3ah (Link OAM), 802.3x
ITU-T ........................................ G.707, G.7041, G.7042, G.8010/Y.1306, G.8011/Y.1307,
................................................... G.8011.1/Y.1307.1, G.8011.2/Y.1307.2, G.8012/Y.1308,
.............................................................................. Y.1710, Y.1711, G.783, G.8032/Y.1344
................................................... RFC 4379, RFC 3812, RFC 3813, RFC 2702, RFC 4090,
......................................................................................... RFC 3916, RFC 3985, RFC 4125
ATS Specifications
Bandwidth ............................................................................................................. 622.08 Mbps
Simultaneous IMA support ....................... 84 IMA groups per card with 1 to 32 E1 links each
ATM service classes .................................................................. CBR, rt-VBR, nrt-VBR, UBR
ATM signaling ............ UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0
IMA ............................................................................................................... IMA 1.0, IMA 1.1
OAM ....................................................................................................................... ITU-T I.610
Traffic management ........................................................................................... ATMF TM 4.1

Data Client Transceivers for DIOB, MCS5,

MCS10, MCS30_X10G
OTGBE_SX OTGBE_LX OTGBE_ZX OTFE_MM OTFE_SM OTGBE_S OTGBE_S OTGBE_L OTGBE_L
3BD 5BD 3BD 5BD
Transmitter GbE GbE GbE very FX, FX, Bidirection Bidirection Bidirection Bidirection
type short-reach long-reach long-reach short-reach short-reach al SFP, al SFP, al SFP, al
laser, 850 laser, 1310 laser, 1550 laser, 1310 laser, 1310 1310 nm 1490 nm 1310 nm SFP,
nm, nm, single nm, single multi-mode nm, single 1490 nm
multi-mode mode mode mode
Data rate 1250 1250 1250 125 125 1250 1250 1250 1250
(nominal)
(Mbaud)
Average -3 Max. -3 5 -8 5 -3 Max. -3 +2 +2
launch
-9.5 Min. -11 0 -15 0 -10 Min. -10 -5 -5
power
(dBm)
Min. 9 9 9 10 10 >9 >9 >9 >9
transmitter
extinction
ratio (dB)
Data format 8B/10B 8B/10B 8B/10B N/A N/A 8B/10B 8B/10B 8B/10B 8B/10B
Average -20 Min. -22 -- -28 -22 < -21 < -21 < -23 < -23
receiver
-21 Typical -25.5 -22 -30 -- < -22 < -22 < -24 < -24
sensitivity
(dBm)
Max. 0 0 0 -14 -8 0 0 -3 -3
receiver
overload
(dBm)
Typical Rx -24 -29 -25 < -29 <-28 -35 -35 -33 -33
LOS level
(dBm)
Connector LC LC LC LC LC LC LC LC LC
Fiber lengths 550 m 10 km 80 km 550 m 10 km 10 km 10 km 40 km 40 km
(50/62.5 (9 µm SMF) (9 µm SMF) (50/62.5 µm (9 µm (9 µm (9 µm (9 µm (9 µm
µm MMF) MMF) SMF) SMF) SMF) SMF) SMF)

Data Client XFP Transceivers for

MCS30_X10G
Transceiver OTR103_ER OTR103_ZR OTR103_SR OTR103_LR
Application code S-64.2b L-64.2a 10GBASE-SR 10GBASE-LR
P1S1_2D2b P1L1-2D2
10GBASE-ER
Source type SLM SLM MLM SLM
Modulation External External Direct Direct
Operating output wavelength (nm) 1529-1560 1530-1565 840-860 1290-1330
Direct max. -20 dB width (nm) <1 <1 NA <1
Min. side mode suppression ratio (dB) 30 30 NA 30
Min. mean launched power (dBm) -1 0 -4 -8.2
Max. mean launched power (dBm) +2 +4 -1 +0.5
Maximum attenuation (dB) 11 22 4 4
Minimum attenuation (dB) 3 11 0 0
Max. dispersion (ps/nm) 800 1600 NA 6.6
Minimum optical return loss (dB) 24 24 12 12
Maximum discrete reflectance -27 -27 -27 -27
Maximum DGD (ps) 30 30 30 30
Sensitivity (BER of 1*10 ) (dBm)
-12
-14 -24 -11 -12.6
Stressed (-7.5)
Maximum optical path penalty 2 2 3.9 1
(Transmitter
and dispersion
penalty)
OCH switching time (ms) <3 <3 <3 <3

Data Line XFP Transceivers for MCS30_X10G

Transceiver OTR10_ALxx OTR10_ASxx
Application code 1L1-2D2F
Source type SLM SLM
Modulation External, NRZ
Transmitter
192.1 + 0.1m 192.1 + 0.1m
Central frequency (THz)
m=0 to 40 m=0 to 40
Maximum central frequency deviation (GHz) ±12.5 ±12.5
Max. -20 dB width (nm) <1 <1
Min. side mode suppression ratio (dB) 30 30
Min. mean launched power (dBm) 0 -1
Max. mean launched power (dBm) 4 +3
Min. extinction ratio (dB) 9 8.2
Receiver
Optical Path
Maximum discrete reflectance -27 -27
Maximum DGD (ps) 30
Max. dispersion (ps/nm) 1600 800
Maximum optical path penalty 2 2
OCH switching time (ms) <3

Optical Components
The XDM optical layer can service pure optical networks as well as converged
networks that integrate WDM with data and SDH/SONET services in the same
platform. To take full advantage of the XDM platform, a variety of optical
cards and modules are used for both the modules cage and the cards cage of the
various shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used
for the cross-connect matrix cards).
DWDM Mux/Demux Cards and Modules
DWDM cards (cards cage of XDM-1000 and

XDM-2000 shelves)
Width
Card Function/Description
(slots)
16/32-channel DWDM mux/demux cards (slots X1, X2)
DW16VMDRE-AG 1 Variable mux AWG, demux diffraction grating, 16
red channels, expandable to 32 channels
DWDM modules (CCP cage of

XDM-1000/XDM-450)
Conn. Width
Module Function/Description
type (slots)
Flat Top mux/demux for
cascading applications for manual
ROADM like operation
MO_DW16MDR-BB-AVAV LC 2 Mux AWG, demux AWG, 16 red channels,
nonexpandable
MO_DW16MDRE-BB-AVAV LC 2 Mux AWG, demux AWG, 16 red channels,
expandable to 32 channels
MO_DW16MDB-BB-AVAV LC 2 Mux AWG, demux AWG, 16 blue channels,
expandable to 32 channels
MO_DW40MC-BB-AV LC 2 Mux AWG, 40 channels, C band
MO_DW40DC-BB-AV LC 2 Demux AWG, 40 channels, C band

Mux (CCP Flat Top) specifications

Type 16-channel 32-channel 40-channel
Insertion loss (dB): AWG < 6.5 < 9.5 < 6.5
Adjacent isolation (dB): AWG < -27 < -27 < -27
Cumulative isolation (dB): AWG < -24 < -24 < -24
PDL (dB) AWG <0.2 <0.2 <0.2

PMD (ps) AWG <0.5 <0.5 <0.5
Insertion Loss Uniformity (dB) <1 <2 <1.8
Return loss (dB) < -40 < -40 < -40
Demux (CCP Flat Top) specifications

Type 16-channel 32-channel 40-channel
Insertion loss (dB): AWG < 6.5 <8 < 6.5
Adjacent isolation (dB): AWG < -27 < -27 < -27
Cumulative isolation (dB): AWG < -24 N/A < -24

PDL (dB) AWG <0.2 <0.2 <0.2
PMD (ps) AWG <0.5 <0.5 <0.5
Insertion Loss Uniformity (dB) <1 <2 <1.8
Return loss (dB) < -40 < -40 < -40

ROADM Cards
ROADM modules for XDM-1000/XDM-450

(CCP cage)
Conn. Width Function/
Module
type (Slots) Description
ROADM modules
MO_ROADM8A LC 2 Multi-degree optical
add/drop of any combination of channels (100GHz
spacing) to 9 ports. WSS in add position.
MO_ROADM8A_50 LC 2 Multi-degree optical
spacing) to 9 ports. WSS in add position.
MO_ROADM8D LC 2 Multi-degree optical
spacing) to 9 ports. WSS in drop position.
MO_ROADM40 LC 3 100GHz spacing 2D PLC ROADM with forty Add/Drop
ports in East/West configuration. Any channel can be
dropped or passed through via management. Add/Drop
channels are automatically equalized. Can be used as
VMUX for OTM sites.
MO_ROADM2A LC 1 100GHz spacing 2D WSS ROADM with Add/Drop ports
in East/West configuration. Requires external 40 Ch. Mux
and DeMux. Can be used as VMUX for OTM sites.
MO_ROADM2A_50 LC 1 50GHz spacing 2D WSS ROADM with Add/Drop ports in
East/West configuration. Requires external 80 Ch. Mux
and DeMux. Can be used as VMUX for OTM sites.
MO_ROADM8A – 100 GHz spacing –Multi

Degree configuration
Basecard type ROADM8
Through Drop Local Add
MO_ROADM8A (dB) Add module 7.5 NA 7.5
MO_ROADM8A (dB) Drop module 11.5 11.5 9.5 NA
MO_ROADM8A (dB) multi-degree Add 19 -
+ Drop module
Adjacent isolation (dB): <-40
PDL (dB) At 0 dB Atten <0.5
At 15 dB Atten <1.3
PMD at 0 dB attenuation (ps) <1

MO_ROADM8A_50 – 50 GHz spacing –Multi

Degree configuration
Basecard type ROADM8A_50
Through Drop Local Add
MO_ROADM8A_50 (dB) Add module 6.5 NA 6.5 6.5
MO_ROADM8A_50 (dB) Drop module 11.5 11.5 9.3 NA
MO_ROADM8A_50 (dB) multi-degree 18 -
Add + Drop module
Adjacent isolation (dB): <40
PDL (dB) At 0 dB Atten <0.5
At 15 dB Atten <0.8
PMD at 0 dB attenuation (ps) <0.5
MO_ROADM8D – 100 GHz spacing –

Multi-Degree configuration
Through Drop Add
MO_ROADM8D (dB) Drop module 7 7 NA
MO_ROADM8D (dB) Add module 14 NA 14
MO_ROADM8D (dB) multi-degree Add + Drop module 21
Adjacent isolation (dB):- <-40
Cumulative isolation (dB): <-38
PDL (dB) <0.45
PMD (ps) <0.2
MO_ROADM40 2D ROADM 100 GHz spacing

with equalization
Through Drop Add
MO_ROADM40 (dB) Drop module 4.2 10.6 -
MO_ROADM40 (dB) Add module 8.5 - 6.6
169
MO_ROADM40 (dB) protected Add + Drop module 12.7 10.6 6.6
MO_ROADM40 used as VMUX 10.6 - Demux 6.6 - Mux
Cumulative isolation (dB): <-20
PDL (dB) <1
PMD (ps) <0.5
169
For protected sites using two East/West cards, the through insertion loss should be doubled.

MO_ROADM2A - 100 GHz spacing - 2D

ROADM with Equalization
Basecard type MO_ROADM2A
Through Local Drop Local Add
MO_ROADM2A (dB) Add module 8.7 N/A 9.2
MO_ROADM2A (dB) Drop module 9.0 3.0 N/A
MO_ROADM2A (dB) two degree Add + Drop module 14.5
Add module integrated channel isolation (dB): 35
PDL (dB) At 0 dB Atten 0.5
At 15 dB Atten 0.85
PMD at 0 dB attenuation (ps) 0.5
MO_ROADM2A_50 - 50 GHz spacing - 2D

ROADM with Equalization
Basecard type ROADM2A_50
Through Local Local Add
Drop
MO_ROADM2A_50 (dB) Add module 8.7 N/A 9.2
MO_ROADM2A_50 (dB) Drop module 6.0 5.0 N/A
Add module integrated channel isolation (dB): 11.5
Adjacent isolation (dB): 35
PDL (dB) At 0 dB Atten 0.5
At 15 dB Atten 0.85
DGD at 0 dB attenuation (ps) 0.5
DWDM OADM Cards and Modules
DWDM OADM cards (cards cage)

Card Width Function/Description XDM-2000 XDM-1000 XDM-500
(slots)
Active OADM basecards for I/O slots
OADM4EW 1 Basecard for 1 active OADM √ √ √
filter; east/west configuration
OADM4EW_SW 1 Basecard for 1 active OADM √ √ √
filter; east/west configuration
with 2x2 switch OADM (Ready
Site)

DWDM OADM plug-in filters for OADM cards

OM_AD4RQEWxx 4-channel 100 GHz OADM filter with built-in equalization for
east/west configuration, 4 skip 0, 10 bands in C-band
OM_AD4RQEW_xx 4skip0 OADM for I/O

slots
Insertion Loss
Module type
Through Drop Add
170
OADM4EW (dB) <1.8 <3.3 <4.7
OADM4EW_SW 171 (dB) <3.2 <4.0 <5.1
Non-adjacent isolation (dB): <-40
PDL (dB) <0.1
PMD (ps) <0.2
4-channel active OADM basecard only (no

filters), 2 x 2 switch through I/O slots
Type of OADM site Basecard + 2x2 switches
E/W unprotected 2.6
E/W protected both base cards with 2x 2 switches 5.2
DWDM components (CCP cage of

XDM-40/XDM-450/XDM-500/XDM-1000)
Module Conn. type Function/Description
Basecard for CWDM mux/demux/OADM modules
MO_CW2 NA Basecard for up to two 4/8-channel CWDM
mux/demux/OADM modules; occupies one slot
4 Channel DWDM OADM module
OM_OADM4GEW_xx LC 4-channel, 100 GHz DWDM OADM filter, 4skipe0, 10
channels in C-band
170
171

OM_OADM4GEW_xx 4 skip 0 OADM for CCP

slots
Module type Insertion Loss
Through Drop Add
OM_OADM4GEW (dB) < 1.1 < 3.1 < 3.1
Non-adjacent isolation (dB):: <-40
PDL (dB) <0.1
PMD (ps) <0.2
CWDM Mux/Demux/OADM Components
CWDM components (CCP cage)

Module Conn. Function/Description
type
Basecard for CWDM mux/demux/OADM modules
MO_CW2 NA Basecard for up to two 4/8-channel CWDM
mux/demux/OADM modules; occupies one slot
4/8-Channel CWDM mux/demux modules
OM_CWMD4C LC 4-channel CWDM mux/demux for 1511 nm,
1531 nm, 1551 nm, 157 nm, with built-in 1310
nm OSC filter
OM_CWM8C LC 8-channel CWDM mux for 1471 nm, 1491 nm,
1511 nm, 1531 nm, 1551 nm, 1571 nm, 1591 nm,
1611 nm with built-in 1310 nm OSC filter
OM_CWD8C LC 8-channel CWDM demux for 1471, 1491, 1511,
1531, 1551, 1571,1591, 1611 nm with built-in
1310 nm OSC filter
OM_CWMD4C_E LC Upgradeable 4-channel CWDM mux/demux for
1511 nm, 1531 nm, 1551 nm, 1571 nm with
built-in 1310 nm OSC filter
OM_CWMD4SL LC 4-channel expansion CWDM mux/demux for
1471 nm, 1491 nm, 1591 nm, 1611 nm without
OSC filter
1/2-Channel CWDM OADM modules
OM_OADMC1AB_xx LC 1-channel OADM for channel 1xx1nm, with
built-in 1310 nm OSC filter
OM_OADMC2AB_xxyy/Gzz LC 2-channel OADM for channels 1xx1+
1yy1nm/1zz1 + 1(z+2)(z+2)1nm, with built-in
1310 nm OSC filter

Mux/demux specifications
OM-CWMD4C OM_CWM8C & OM_CWMD4C-E OM_CWMD4SL
OM_CWD8C
Insertion loss mux + < 4.2 < 5.5 < 4.9 < 7.3
demux (dB) 172
Return loss (dB) < 40 < 40 < 40 < 40
Directivity (dB) < 45 < 45 < 45 < 45
OADM specifications
173
Insertion loss
Module type Through Drop Add
OM_OADMC1AB_xx 174 < 3.9dB < 2.6dB < 2.2dB
OM_OADMC2AB_xxyy/Gzz 175 < 4.4dB < 3.2dB < 3.2dB
Transponders
TRP25_2 basecards
Card No. of Function/Description
slots
TRP25_2C 1 Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to 2.7
Gbps). Provides PM (for SDH/SONET, SONET, GbE),
OCH/UPSR 1+1 protection, and outband FEC.
TRP25_2CT 1 Add/Drop bidirectional transponder with tunable laser (add) and
noncolored laser (drop) with 3R (50 Mbps to 2.7 Gbps). Provides
PM (for SDH/SONET, SONET, GbE), OCH/UPSR 1+1
protection, and outband FEC.
TRP25_2CTR 1 Bidirectional regenerator with two tunable lasers with 3R (50
Mbps to 2.7 Gbps). Provides PM (for SDH/SONET, SONET,
GbE), OCH/UPSR 1+1 protection, and outband FEC.
172
173
174
xx designates the channel dropped by the OADM.
175
xx designates the group of two channels dropped by the OADM.

Optical transmitters and receivers for

TRP25_2
Module Description/Function
2.5 Gbps optical transmitters and receivers for TRP25_2
OMT25_Bxx 2.5 Gbps colored transmitter type B
OMT25_S3 2.5 Gbps 1310 nm short-haul transmitter type S3
OMT25_T Optical module tunable transmitter for C band
OMR25C_A Type A (APD) continuous receiver
OMR25C_P Type P (PIN diode) continuous receiver
CHTR_B basecard Configurations

slots
CMBR25_2 1 Basecard for two SFP data (GbE/FC/FICON) modules and 2.7 Gbps
line with G.709 FEC
TRP25_4 1 Basecard for 2 x 2.7 Gbps transponders with G.709 FEC
CMTR25 1 Multi rate combiner (STM-1/4, FC1/2, GbE) to 2.7 Gbps line with
G.709 FEC, or Dense transponder for 4 x 2.7 Gbps transponder with
G.709 FEC
CMBR10_T 1 Basecard for 4xSTM16 OTN combiner with G.709 FEC/EFEC
TRP10_2B 1 Basecard for 10.7 Gbps transponders with G.709 FEC/EFEC
TRP10_LAN 1 Basecard for 10.3 Gbps 10GbE LAN transponders with G.709
FEC/EFEC
CHTR_B basecard modules and transceivers

CMBR25 modules
OMCD25_2 2.7 Gbps Client/line card with G.709 FEC for two SFP data
(GbE/FC/FICON) modules
CMTR25 modules
OMTR27_2 Line and client module for STM16/OTU1 services. CWDM and/or DWDM.
Supports on-board protection. Two modules fit on each CHTR_B base card
OMCM25_4 Line and client module for up to four services of STM1/4, FICON, FC100,
FC200, GbE to 2.7G combiner''''. CWDM and/or DWDM. Supports
on-board protection. Two modules fit on CHTR_B base card
2.7 Gbps optical cards for TRP25_4
OMTR27 2.7 Gbps Client/line card with G.709 FEC for STM-16 SFP transceiver
2.7 Gbps line transceivers for CMBR25 & TRP25_4
OTX27_AT Tunable 2.7 Gbps transceiver, transmitter type B (with G.709 FEC) and
APD receiver

2.7 Gbps line transceivers for CMTR25
OTC25_PSxx 2.7 Gbps CWDM transceiver (with or without outband FEC), short haul
with PIN receiver
OTC25_ALxx 2.7 Gbps CWDM transceiver (with or without outband FEC), long haul
with APD receiver
OTR25_AVxx DWDM SFP: 2.5/2.7G transceiver 2400 ps/nm, channel xx, LC connectors
OTR25_ABxx DWDM SFP: 2.5/2.7G transceiver 3240 ps/nm, channel xx, LC connectors
10Gbps client side cards/transceivers for CMBR10, CMBR10_T, CMBR10_8D,
TRP10_2B/LAN
OMS16_4T Client card for four SFP STM-16 modules with timing transparency for all
clients for CMBR10_T
OMSC16_4 Client card for four SFP STM-16 modules for CMBR10
OMTX10_S Client card for STM-64/OC-192 XFP transceivers for TRP10_2B
OMTX10_LAN Client card for XFP 10 GBE LAN transceivers for TRP10_LAN
OMCD_8 Line and client card for 8 x GbE/FC/FICON to 10.7G combiner for
CMBR10_8D
OTR103_SR 10G LAN 10GBASE-SR transceiver module, 850nm MM fiber, PIN
receiver, 300m
OTR103_LR 10G LAN 10GBASE-LR transceiver module, 1310nm , PIN receiver,
10Km
OTR103_ER 10G LAN 10GBASE-ER transceiver module, 1550nm , PIN receiver,
40Km
OTR103_ZR 10G LAN 10GBASE-ZR transceiver module, 1550nm , APD receiver,
80Km
OTR64_I3 STM-64/OC-192 client transceiver XFP, 1310nm short reach, 2km
OTR64_S5 STM-64/OC-192 client transceiver XFP, 1550nm short reach, 40km
OTR64_L5 STM-64/OC-192 client transceiver XFP, 1550nm long reach, 80km
10.7 Gbps line cards/transceivers for CMBR10, CMBR10_D, TRP10_2B/LAN
OMTX10 10.7 Gbps line card with G.709 FEC
OMTX10_S 10.7 Gbps Line card for XFP transceivers
OMTX10_EF 10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx 10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and
APD receiver
OTX10_AT Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709
FEC/EFEC) and APD receiver
OTX10_ATR Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709
FEC/EFEC) and APD receiver, RZ modulation.
Client SFP transceivers for CMBR25, CMBR10 & TRP25_4, CMTR25
OTGBE_SX Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode
fiber
OTGBE_S3BD Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Short Range (10km)

OTGBE_L3BD Bi-directional GbE SFP with 1310nm TX/1490nm Rx. Long Range (40km)
OTGBE_L5BD Bi-directional GbE SFP with 1490nm TX/1310nm Rx. Long Range (40km)
OTR16_I3 STM-16/OC-48 transceiver, intra-office 1310 nm
OTR16_S3 STM-16/OC-48 transceiver, short-haul 1310 nm
OTR16_L3 STM-16/OC-48 transceiver, long-haul 1310 nm
OTC25_PSxx 2.7 Gbps CWDM transceiver (with or without outband FEC), short haul
with PIN receiver
OTC25_ALxx 2.7 Gbps CWDM transceiver (with or without outband FEC), long haul
with APD receiver
10.7 Gbps line XFP transceivers for OMTX10_S
OTR10_ASxx 40 Km DWDM color XFP
OTR10_ALxx 80 Km DWDM color XFP
AoC basecard configurations

slots
AoC 1 Basecard for multirate combiner or ADM on Card (requires two cards)
supporting 8 SFP ports of GbE, FC1/2, FICON, STM-16, OTU1
AoC basecard modules and transceivers

10.7 Gbps line cards/transceivers for AoC
OMTX10 10.7 Gbps line card with G.709 FEC
OMTX10_S 10.7 Gbps Line card for XFP transceivers
OMTX10_EF 10.7 Gbps line card with G.709 FEC/EFEC
OTX10_ALxx 10.7 Gbps transceiver, colored transmitter type L (with G.709 FEC) and APD
receiver
OTX10_AT Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709
FEC/EFEC) and APD receiver
OTX10_ATR Full C band tunable 10.7 Gbps transceiver, transmitter type L (with G.709
FEC/EFEC) and APD receiver, RZ modulation.
Client SFP transceivers for AoC
OTGBE_SX Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
OTGBE_LX Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
OTGBE_ZX Optical GbE/FC/FICON transceiver, very long reach, 1550 nm single-mode
fiber

OTR16_I3 STM-16/OC-48 transceiver, intra-office 1310 nm
OTR16_S3 STM-16/OC-48 transceiver, short-haul 1310 nm
OTC25_PSxx 2.7 Gbps CWDM transceiver (with or without outband FEC), short haul with
PIN receiver
OTC25_ALxx 2.7 Gbps CWDM transceiver (with or without outband FEC), long haul with
APD receiver
TRP10_4 basecard configurations

slots
TRP10_4M 1 Multi-service dual 10G Transponder card for 10G LAN,
STM-64/OC-192 and FC10 services. Optimized for metro DWDM
Networks - 2 x XFP client and 2 x XFP line
TRP10_4R 1 Multi-service dual 10G Transponder card for 10G LAN,
STM-64/OC-192 and FC10 services. Optimized for LH DWDM
Networks, 2 x XFP client and 2 x XFP-EL line
TRP40_2B and CMBR40B configurations

slots
TRP40_2B 2 40G DWDM tunable transponder card for STM-256/OC-768
services
CMBR40B 2 Multi-service 40G DWDM tunable combiner card for up to 4 XFP
clients for OTU2/10G LAN, STM-64/OC-192 services
TRP10_4 basecard transceivers

10Gbps client side cards/transceivers for TRP10_4M and 4R
OTR103_SR 10G LAN 10GBASE-SR/FC10 transceiver module, 850nm MM fiber, PIN
receiver, 300m
OTR103_LR 10G LAN 10GBASE-LR/FC10 transceiver module, 1310nm , PIN receiver,
10Km
OTR103_ER 10G LAN 10GBASE-ER/FC10 transceiver module, 1550nm , PIN receiver,
40Km
OTR103_ZR 10 LAN 10GBASE-ZR/FC10 transceiver module, 1550nm , APD receiver,
80Km
OTR64_I3 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1310nm short reach,
2km

OTR64_S5 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm short reach,
40km
OTR64_L5 STM-64/OC-192/10G LAN/FC10 client transceiver XFP, 1550nm long reach,
80km
Line/Client transceivers for TRP10_4M
OTC10_PSxx 40 Km CWDM XFP
OTC10_ALxx 80 Km CWDM XFP
OTR10_ASxx 40 Km DWDM color XFP
OTR10_ALxx 80 Km DWDM color XFP
OTR10_AT 80 Km DWDM 80 ch. tunable XFP
Line transceivers for TRP10_4R
OTR10_ELT 80 Km DWDM 80 channels tunable XFP-EL
OMCM25_4 STM-1/OC-3 SFP Optical

Transceivers
SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5 OTR1_S3BD 176 OTR1_S5BD 177
178
APPLICATION CODE S-1.1 L-1.1 L-1.2
Operating wavelength (nm) 1261-1360 1263-1360 1480-1580 Tx: 1260-1360 Tx: 1480-1580
Rx: 1480-1580 Rx: 1260-1360
TRANSMITTER
Source type MLM 179 SLM SLM SLM SLM
Min. side mode suppression - 30 30 - -
ratio (dB)
Min. mean launched power -15 -5 -5 -14 -14
(dBm)
Max. mean launched power -8 0 0 -8 -8
(dBm)
Min. extinction ratio (dB) 8.2 10 10 10 10
RECEIVER
1*10-12) EOL (dBm)
Min. overload (dBm) -8 -10 -10 -8 -8
Max. receiver reflectance (dB) - - -25 - -
176
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to
OTR1_S3BD parameters.
177
The OTR1_S3BD can only operate opposite the OTR1_S5BD, and vice versa. Total link budget is according to
OTR1_S3BD parameters.
178
179

SFP TRANSCEIVER NAME OTR1_S3 OTR1_L3 OTR1_L5 OTR1_S3BD 176 OTR1_S5BD 177
178
APPLICATION CODE S-1.1 L-1.1 L-1.2
Min. optical return loss of cable - - -20 - -

(dB)
Max. discrete reflectance (dB) - - -25 - -

Transceivers
TRANSMITTER
RECEIVER
180
181

OMCM25_4 & AoC GbE/FC1 SFP

Transceivers
OTGBE_SX OTGBE_LX OTGBE_ZX OTGBE_S3 OTGBE_S5 OTGBE_L3 OTGBE_L5
BD BD BD BD
Transmitter GbE/FC/FIC GbE/FC/FIC GbE/FC/FIC Bidirection Bidirection Bidirection Bidirection
type ON ON ON very al SFP, al SFP, al SFP, al SFP,
short-reach long-reach long-reach 1310 nm 1490 nm 1310 nm e 1490 nm
laser, 850 laser, 1310 laser, 1550
nm, nm, single nm, single
multimode mode mode
Data rate 1250 1250 1250 1250 1250 1250 1250
(nominal)
(MBaud)
Average -3 Max. -3 5 -3 Max. -3 +2 +2
launch power
-9.5 Min. -11 0 -10 Min. -10 -5 -5
(dBm)
Min. 9 9 9 >9 >9 >9 >9
transmitter
extinction
ratio (dB)
Data format 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B 8B/10B
Average -20 Min. -22 -- < -21 < -21 < -23 < -23
receiver
-21 Typical -25.5 -22 < -22 < -22 < -24 < -24
sensitivity
(dBm)
Max. receiver 0 0 0 0 0 -3 -3
overload
(dBm)
Typical Rx -24 -29 -25 -35 -35 -33 -33
LOS level
(dBm)
Connector LC LC LC LC LC LC LC
Fiber lengths 550 m 10 km 80 km 10 km 10 km 40 km 40 km
(50/62.5 µm (9 µm SMF) (9 µm SMF) (9 µm (9 µm (9 µm (9 µm
MMF) SMF) SMF) SMF) SMF)
OMCM25_4 & AoC FC2G client SFPs

SFP TRANSCEIVER NAME OTR16_MM OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
APPLICATION CODE 182 FC-200- I-16 S-16.1 L-16.1 L-16.2
M5/6-SN-1
TRANSMITTER
Source type MM SLM SLM SLM SLM
Max. -20 dB width (nm) - 2 1 1 <1
Min. side mode suppression (dB) - - 30 30 30
Min. mean launched power (dBm) -9.5 -10 -5 -2 -2
Max. mean launched power (dBm) -2.5 -3 0 +3 +3
182

SFP TRANSCEIVER NAME OTR16_MM OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5

Min. extinction ratio (dB) 9 8.2 8.2 8.2 8.2
RECEIVER
1*10-12) EOL (dBm)
Min. overload (dBm) 0 0 0 -9 -9
Max. receiver reflectance (dB) -27 -27 -27 -27 -27
Max. dispersion [ps/nm] - - - - 1600
Min. optical return loss of cable -24 -24 -24 -24 -24
(dB)
Max. discrete reflectance (dB) -27 -27 -27 -27 -27
Max. optical path penalty (dB) - <1 1 1 2
10 Gbps Optical Client XFP Transceivers for

Transponders and CMBR40B
Transceiver OTR64_I3 OTR64_S5/ OTR64_L5/ OTR103_SR OTR103_LR
OTR103_ER OTR103_ZR
Application code I-64.1 S-64.2b L-64.2a 10GBASE-SR 10GBASE-LR
P1I1_2D1 P1S1_2D2b P1L1-2D2 1200-SM-LL-L
VSR2000_2R1 10GBASE-ER
1200-SM-LL-I 1200-SM-LL-V
Source type SLM SLM SLM MLM SLM

Modulation External External External Direct Direct
Operating output 1290-1330 1529-1560 1530-1565 840-860 1290-1330
wavelength (nm)
Direct max. -20 dB width <1 <1 <1 NA <1
(nm)
Min. side mode suppression 30 30 30 NA 30
ratio (dB)
Min. mean launched power -6 -1 0 -4 -8.2
(dBm)
Max. mean launched power -1 +2 +4 -1 +0.5
(dBm)
Min. extinction ratio (dB) 6 8.2 9 3 6
Maximum attenuation (dB) 4 11 22 4 4
Minimum attenuation (dB) 0 3 11 0 0
Max. dispersion (ps/nm) 6.6 800 1600 NA 6.6
Minimum optical return loss 24 24 24 12 12
(dB)
Maximum discrete -27 -27 -27 -27 -27
reflectance
Maximum DGD (ps) 30 30 30 30 30
Sensitivity (BER of 1*10 ) -11
-12
-14 -24 -11 -12.6
(dBm) Stressed (-7.5)

Transceiver OTR64_I3 OTR64_S5/ OTR64_L5/ OTR103_SR OTR103_LR

OTR103_ER OTR103_ZR

Maximum optical path 1 2 2 3.9 1
penalty (Transmitter
and dispersion
penalty)
OCH switching time (ms) <3 <3 <3 <3 <3
AoC/OMTR27_2 STM-16/OTU1 client

CWDM DWDM
SFP TRANSCEIVER NAME OTR16_I OTR16_ OTR16_ OTR16_ OTC25_1P OTC25_1A OTR25_Av OTR25_ABxx
3 S3 L3 L5 Sxx Lxx xx
APPLICATION CODE 183 I-16 S-16.1 L-16.1 L-16.2 DW100S1 DW100L-
D2/5(C) -1D2/5(C)F
DW100S1 DW100C-
A2/5(C) -1A2/5(C)F
G.698.1/.2
Operating wavelength (nm) 1260-13 1260-13 1280-13 1500-15 1464-1618 1464-1618 15300-156 1530-1565
60 60 35 80 5
TRANSMITTER
Max. -20 dB width (nm) 2 1 1 <1 1 1 0.4 0.4
Max. RMS width (nm) - - - - - - - -
Min. side mode suppression - 30 30 30 30 30 30 30
(dB)
Min. mean launched power -10 -5 -2 -2 0 0 0 0
(dBm)
Max. mean launched power -3 0 +3 +3 +5 +5 4 4
(dBm)
Min. extinction ratio (dB) 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
RECEIVER
Min. sensitivity (BER of -16 -18 -27 -28 -21.5 -28 -28 -28
1*10-12) EOL (dBm) (-23 GbE) (-32 GbE)
Min. overload (dBm) 0 0 -9 -9 0 -7 -9 -9
Max. receiver reflectance (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. dispersion [ps/nm] - - - 1600 800 1600 2400 3600
(40 km (80 km (120 km (180 km
G.652) G.652) G.652) G.652)
Min. optical return loss of -24 -24 -24 -24 24 24 -24 -24
cable (dB)
Max. discrete reflectance (dB) -27 -27 -27 -27 -27 -27 -27 -27
Max. optical path penalty (dB) <1 1 1 2 1.5 2.5 <3 <2
183

TRP10_4 CWDM OTU2 Line/Client

STM-64/10G LAN/FC10/OTU2 XFP Optical
Transceivers and CMBR40B Client
Transceivers
184 185
Transceiver OTC10_PSxx OTC10_ALxx
Application code
Source type SLM SLM
Modulation NRZ NRZ
Transmitter
1471 + 20m 1471 + 20m
Central wavelength (nm)
m=0 to 7 m=0 to 7
Maximum central frequency
±6.5 ±6.5
deviation (nm)
Min. side mode suppression ratio
30 30
(dB)
Min. mean launched power (dBm) 0 0
Max. mean launched power (dBm) 4 4
Min. extinction ratio (dB) 8.2 8.2
Receiver
S-band, C-band -16 S-band, C-band -23
Sensitivity (BER of 1*10-12) (dBm)
L- band -15 L- band -21
Optical Path
Maximum discrete reflectance

Maximum DGD (ps)
OCH switching time (ms)
184
CWDM client in TRP10_4/CMBR40 also supports 10GbE LAN and STM-64.
185

TRP10_4R OTU2/OTU2e/OTU2f Optical

Transceivers
Transceiver OTR10_ELT OTR10_AT 186
Application code
Source type SLM SLM
Modulation External, NRZ External, NRZ
Transmitter
Central frequency (THz) 192.1 + 0.1m 192.05 + 0.05m
m=0 to 39 m=0 to 79
Maximum central frequency deviation ±12.5 ±2.5
(GHz)
Max. -20 dB width (nm) <1

Receiver
Optical Path
Maximum DGD (ps) 30 30
186
Not supported in CMBR40.

TRP10_4 OTU2/OTU2e Line, STM-64/10G

LAN/FC10 Client, AoC, CMBR10,
TRP10_LAN, TRP10_2B, OTU2 XFP Line
Transceivers and CMBR40B Client
Transceivers
187 188
Transceiver OTR10_ALxx OTR10_ASxx
Source type SLM SLM
Modulation External, NRZ
Transmitter
m=0 to 40 m=0 to 40
Maximum central frequency deviation (GHz) ±12.5 ±12.5
Min. extinction ratio (dB) 9 8.2
Receiver
Optical Path
Maximum DGD (ps) 30 30
187
188

AoC, CMBR10, TRP10_LAN, TRP10_2B, OTU2

Line Transceivers
Transceiver OTX10_AT OTX10_ATR
Source type SLM SLM
m=0 to 79 m=0 to 79
Maximum central frequency deviation (GHz) ±2.5 ±5
Modulation External, NRZ External, RZ
Spacing (GHz) 50 50
Min. mean launched power (dBm) +4 +1
Max. mean launched power (dBm) +6 +4
Sensitivity (BER of 1*10 ) (dBm)
-12
-25 -24
OCH switching time (ms) <3 <3

STM-16/OTU1 Optical SFP Line Transceivers

for OMTR27_2 & OMCM25_4
CWDM line transceivers DWDM line transceivers Continuous client transceivers 189
190
OTC25_1PSxx OTC25_1ALxx OTR25_AVx OTR25_AB OTR16_I3 OTR16_S3 OTR16_L3 OTR16_L5
G.695 G.695 191 x xx
Application code S-C8S1-1D2/5 S-C8L1-1D2/5 DW100S- DW100L- P1I_1D1 P1S1_1D1 P1L1_1D1 L-16.2
1D2/5(C) -1D2/5(C)F
DW100S- DW100C-
1A2/5(C) -1A2/5(C)F
G.698.1/.2
Operating output 1464-1618 1464-1618 1530-1565 1530-1565 1285-1330 1285-1330 1280-1335 1500-1580
wavelength (nm)
Spacing (nm) 20 20 100 100 NA NA NA NA
Minimum side mode 30 30 30 30 30 30 30 30
suppression ratio
(dB)
Mean launched 0 0 0 0 -9.5 -5 -2 -2
power (min.) (dBm)
Mean launched +5 +5 4 4 -3 0 +3 +3
power (max.) (dBm)
Min. extinction ratio 8.2 8.2 8.2 8.2 8.2 8.2 8.2 8.2
(dB)
Sensitivity (BER of -21.5 -28 -28 -28 -18 -18 -27 -28
1*10-12) (dBm) (-23 GbE) (-32 GbE) (-22 GbE) (-22 GbE) (-30 GbE) (-30 GbE)
Max. dispersion 800 1600 2400 3600 - - - 1600
(ps/nm) (40 km G.652) (80 km G.652) (120 km (180 km
G.652 G.652)
Max. optical path 1.5 2.5 <3 <2 <3 <1 1 2
penalty (dB)
OCH switching time <3 <3 <3 <3 <3 <3 <3 <3
(ms)
189
Continuous transceiver (50 Mbps to 2.7 Gbps) including STM16 and OTU1.
190
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.
191
Continuous transceiver (100 Mbps to 2.7 Gbps), xx designates the transceiver's wavelength in nm.

TRP25_2 2.5 Gbps optical

transmitters/receivers for transponders,
and transceivers for combiners
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers.
OMT25_T
+
OMR25C_A/
[OTX27_AT] 192
Source type SLM
Operating output wavelength (nm) 1529-1560
Modulation EA 193
Spacing (GHz) 100
Max. dispersion (ps/nm) 3400
(200 km)
[>18000/1000 km]
Min. side mode suppression ratio (dB) 30
Min. mean launched power (dBm) +. 05 [+5.5]
Max. mean launched power (dBm) +5 [+7]
Min. extinction ratio (dB) 8.2
Sensitivity (BER of 1*10-12) (dBm) 194 -30
Min. overload (dBm) -8
OCH switching time (msec) <3
TRP40_2B, CMBR40B Line Transceiver

Transceiver
Application code P1S1-3C2
P1S1-3C3
P1S1-3C5
Source type SLM
Central frequency (THz) 192.05 + 0.05m
m=0 to 79
Maximum central frequency deviation (GHz) ±2.5
Modulation RZ-DQPSK
Spacing (GHz) 50
192
Data between square brackets corresponds to transceiver [OTX27_AT].
193
EA: External Absorption.
194
Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.

Transceiver
Min. mean launched power (dBm) +2
Max. mean launched power (dBm) +4
Min. extinction ratio (dB) 13
Sensitivity (BER of 1*10-12) (dBm) -18
Min. overload (dBm) -7
Maximum optical path penalty 2
TRP40_2B Client Transceiver

Transceiver
Application code VSR2000-3R2
VSR2000-3R3
VSR2000-3R5
Source type SLM
Modulation External
Direct max. -20 dB width (nm) <1
Min. mean launched power (dBm) 0
Max. mean launched power (dBm) +3
Min. extinction ratio (dB) 8.2
Maximum attenuation (dB) 4
Minimum attenuation (dB) 0
Minimum optical return loss (dB) 24
Maximum discrete reflectance -27
Maximum DGD (ps) 7.5
Sensitivity (BER of 1*10-12) (dBm) -6
Min. overload (dBm) +3
Maximum optical path penalty 2

Optical Amplifiers
Card/Module Width Function/Description
(slots)
IO Cards cage
OFA2_I29I29C 1 Two inline amplifiers with a gain of 29 dB for the C band in a
single-slot card
OFA2_I29C 1 One inline amplifier with a gain of 29 dB for the C band in a
single-slot card
OFA2_I23I23C 1 Two inline amplifiers with a gain of 23 dB for the C band in a
single-slot card
OFA2_I23C 1 One inline amplifier with a gain of 23 dB for the C band in a
single-slot card
OFA2_I23I29C 1 Two inline amplifiers with a gain of 23 dB and 29 dB for the C
band in a single-slot card
OFA_RM 2 High-power 500 mW RAMAN amplifier for long spans, reverse
pumped configurations
OFA_HRM 2 High-power 700 mW RAMAN amplifier for long spans, in
reverse pumped configurations
CCP Module cage
MO_BAC 1 Optical booster for the C band
MO_PAC 1 Optical preamplifier for the C band
MO_BAS 1 Single-channel optical booster for the C band
MO_PAS 1 Single-channel optical preamplifier for the C band
MO_OFA_PHBC 1 High-power dynamic booster and pre-amplifier in E/W
configuration for extended long-haul metro applications.
Optimized for ROADM sites.
MO_OFA_HBC 1 High-power dynamic booster for extended long-haul metro
applications.
MO_OFA_PC 1 15 dBm dynamic gain pre-amp amplifier. CCP Card
MO_OFA_FBC 1 20 dBm fixed gain booster
MO_OFA_M 1 High-power dynamic multistage amplifier for extended
long-haul and metro applications
MO_OFA_MH 1 High power (23 dBm) regional amplifier for high capacity
applications
MO_OFA_MHe 1 High power (23 dBm) regional amplifier for high capacity
applications, E/W configuration
MO_OFA_FHBC 1 High power (21 dBm) fixed gain booster amplifier with built-in
output OSC filter
Rack Mounted
Height
RM_OFA_VHB 2 RU Very High-power fixed booster for long single span applications
RM_OFA_HBR 2 RU High-power 1 W RAMAN amplifier for long span, in reverse
pumped configuration
RM_OFA_FBR 2 RU High-power 1 W RAMAN amplifier for long span, in forward
pumped configuration

OFAs for single channel and DWDM

applications
OFA2_I23C/ OFA2_I29C/
OFA2_I23I23C OFA2_I29I29C
(Inline) 195 (Inline) 196
Max. total power (dBm) +16 +16

Gain (dB) Typ. 21 197 Typ. 27 198
Spectrum (nm) 1529-1561 1529-1561
Gain flatness (dB) < ±1 < ±1
199
Noise figure (dB) <6 < 6 200
In/out isolation (dB) > 40 > 40
Power consumption (Watt) 13 13
(for OFA2_ (for OFA2_I29C)
I23C)
Power consumption of two amplifiers (Watt) 21 21
(for OFA2_ (for OFA2_
I23I23C) I29I29C)
RAMAN and very high power EDFA

amplifiers
OFA_RM 201 OFA_HRM 202 RM_OFA_HBR/FBR RM_OFA_VHB
Max. total power (dBm) +27 +28.5 +30 +30

Gain (dB) 6-15 203 10-20 204 10-20 205 14-24
Spectrum (nm) 1529-1561 1529-1561 1529-1564 1536-1562
Gain flatness (dB) < ±0.6 < ±0.65 < ±1 < ±0.75
Noise figure (dB) < -0.5 < -1.5 <0 <9
In/out isolation (dB) > 40 > 40 > 40 > 45
Return loss (dB) < 40 < 40 < 40 < 40
195
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
196
Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully functional OADM site.
197
Rating does not include the attenuation introduced by the built-in VOA.
198
Rating does not include the attenuation introduced by the built-in VOA.
199
Does not include the effect introduced by the built-in VOA.
200
Does not include the effect introduced by the built-in VOA.
201
202
203
Depends on type of fiber. Actual gain is heavily dependent on splice quality and actual attenuation of fiber and
can be drastically affected.
204
205

CCP cage OFAs DWDM applications
MO_OFA_FBC MO_OFA_PHBC/ MO_OFA_PHBC MO_OFA_MH MO_OFA_M MO_OFA_FHBC MO_OFA_MHe

(Booster) MO_OFA_HBC MO_OFA_PC
(Booster) (Pre-amp)
Max. total power +20 +20 +15 +23 +20 +21 +23
(dBm)
Gain (dB) 10 to 25 10 to 25 12-27 17-41 17-39 10-23 17-40
Spectrum (nm) 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561 1529-1561
Gain flatness (dB) < ±0.75 < ±0.6 < ±0.6 < ±0.75 < ±0.75 < ±0.5 < ±0.5
Noise figure (dB) < 6.5 Gain 25 <9 <6 <7 < 6.5 < 6.5 Gain 23 < 6.3 Gain >30
< 14 Gain >17 Gain >17 Gain >19 Gain >26 Gain >25 < 12.5 Gain >17 < 6.9 Gain >26
< 21 Gain 10 < 19.5 Gain 10 < 13.5 Gain >17
In/out isolation > 30 > 40 > 40 > 40 > 40 > 40 > 40
(dB)
Return loss (dB) > 45 < 40 < 40 < 40 < 40 < 45 < 45
CCP cage OFAs for single-channel

applications
MO_BAS MO_PAS MO_BAC MO_PAC

(Booster) (Preamplifier) (Booster) (Preamplifier)
Max. total power +15 +12 +17 +12
(dBm)
Gain (dB) Up to 16 Up to 30 Up to 18 Up to 32
Spectrum (nm) 1529-1561 1529-1561 1529-1561 1529-1561
Output power < ±1 < 5.5 at Pin –38 dBm < ±1 < ±1
deviation (dB) < 2.5 at Pin –26 dBm
< 1.0 at Pin –14 dBm
Noise figure (dB) < 6.5 < 5.5 <9 < 5.5
In/out isolation (dB) > 40 > 40 > 40 > 40
Return loss (dB) < 40 < 40 < 40 < 40

Optical Auxiliary Cards and Modules

Card/Module Function/Description
Cards cage cards
AUX-2I Auxiliary basecard installed in a single I/O slot. Each basecard
accommodates any two of the modules listed below.
AUX-2X Auxiliary basecard installed in either the X1 or X2 slot. Each
basecard accommodates any two of the modules listed below.
Modules
OM_4SP50 Four 50/50 splitters
OM_2COSC5 2 x C band/OSC filters (mux + demux) for the 1510 nm
supervisory channel
OM_2COSC5_RB 2 x C band/OSC filters (mux + demux) for the 1510 nm
supervisory channel, and 2 x red/blue filters
OM_2COSC5_SP95 2 x C band/OSC filters (mux + demux) for the 1510 nm
supervisory channel, and 2 x 95/5 splitters
OM_2LCOSC5 2 x C/L/T filters (mux + demux) for the 1510 nm supervisory
channel, including provision for the L band
OM_2SP95 2 x 95/5 splitters
OM_2RB 2 x red/blue filters
OM_2VOA 2 x controlled variable optical attenuators for OADM-V
implementation
OM_2COSC3 2 x C band/OSC filters (mux + demux) for the 1310 nm
supervisory channel
OM_2COSC3_RB 2 x C band/OSC filters (mux + demux) for the 1310 nm
supervisory channel, and 2 x red/blue filters
OM_2COSC3_SP95 2 x C band/OSC filters (mux + demux) for the 1310 nm
supervisory channel, and 2 x 95/5 splitters
CCP module cage modules (single slot)
MO_ACC6CP Six couplers
MO_ACC6SP50 Six 50/50 splitters
MO_ACC6SP95 Six 95/5 splitters
206
MO_ACC4COSC5 Four C/T filters
MO_ACC6CPSP Six 50/50 splitters + six 50/50 couplers, Single-mode fiber
MO_ACC6CPSP5 Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 50 μm
MO_ACC6CPSP6 Six 50/50 splitters + six 50/50 couplers, multi-mode fiber 62.5 μm
207
MO_ACC4CLOSC5 Four C/L/T filters
MO_ACC4COSC3 Four supervisory 1310 nm modules
MO_ACC4RB Four red/blue filters
206
207

Optical Auxiliary Cards for XDM-450

Card/Module Function/Description
ACC4COSC5 Four C/T filters
DCF/DCM Units
Unit Function/Description
DCF-40-LF Dispersion compensation fiber for 160 ps/nm (40km LEAF)
DCF-40-TW Dispersion compensation fiber for 180 ps/nm (40km TrueWave)
MO_DCM-Lxx Single-channel dispersion compensation module for 700 ps/nm for
channel "xx" for modules cage
MO_DCM-Vxx Single-channel dispersion compensation module for 1400 ps/nm for
MO_DCM-Xxx Single-channel dispersion compensation module for 1600 ps/nm for

Rack Mounted Single Channel DCM Units

Unit Function/Description
RM_DCM2 Rack-mounted tray for up to two single-channel dispersion compensation
modules as detailed below
DCM-Lxx Single-channel dispersion compensation module for 700 ps/nm for
channel "xx" for rack-mounted tray
DCM-Vxx Single-channel dispersion compensation module for 1400 ps/nm for
DCM-Xxx Single-channel dispersion compensation module for 1600 ps/nm for

Auxiliary Cards and Miscellaneous Accessory

Modules
Module type Insertion loss (dB)
OM_ACC4SP50/ MO_ACC6SP50 4
OM_ACC2SP95/ MO_ACC4SP95 0.65
OM_2RB/ MO_ACC4RB Mux Red 0.7 Blue 1.2
Demux Red 1.2 Blue 0.7
OM_2COSC3/ MO_ACC4COSC3 Mux/demux C band 1.2 OSC 1310 nm 1.2
OM_2COSC5/ MO_ACC4COSC5 Mux C band 0.6 OSC 1510 nm 0.9
Demux C band 0.9 OSC 1510 nm 1.7
OM_2LCOSC5/MO_ACC4CLOSC5 Mux/demux C band 1.1 L band 1.6 OSC 1510 nm 2.0
DCF-40-LF 4.8
DCF-80-LF 6.5
DCF-120-LF 8.2
DCF-40-TW 3
DCF-80-TW 4
DCF-120-TW 5
MO_DCM_L_xx/ DCM_L_xx 3.5
MO_DCM_V_xx/ DCM_V_xx
MO_DCM_X_xx/ DCM_X_xx
Other Optical Cards

slots
OPM 1 Optical performance monitoring card for four fiber monitoring points
OMSP 1 Optical MS protection card
OPM card specifications

Wavelength range ............................................................................................... 1529-1562 nm
Power range............................................................................................................ -50 to +5 dB
OSNR range ............................................................................................................... 0 to 30 dB
OMSP card specifications

Insertion loss through two cards ..................................................................................... < 3 dB
Switching time ................................................................................................................ < 4 ms

C Band Channel Frequencies and

Wavelengths (ITU-T Rec.
G.694.1 for DWDM)
ITU-T Sub-band Channel Channel 200 GHz 100 GHz channel 50 GHz channel spacing
channel center center channel spacing
number frequency wavelength spacing
(THz) (nm)
Blue Red 8- 16- 16- 32- 40- 40- 80-
ch. ch. ch. ch. ch. ch. ch. interleaved
20.5 √ 192.05 1561.01 √
21 √ 192.10 1560.61 √ √ √ √ √ √ √
21.5 √ 192.15 1560.20 √
22 √ 192.20 1559.79 √ √ √ √ √
22.5 √ 192.25 1559.39 √
23 √ 192.30 1558.98 √ √ √ √ √ √ √
23.5 √ 192.35 1558.58 √
24 √ 192.40 1558.17 √ √ √ √ √
24.5 √ 192.45 1557.77 √
25 √ 192.50 1557.36 √ √ √ √ √ √ √
25.5 √ 192.55 1556.96 √
26 √ 192.60 1556.55 √ √ √ √ √
26.5 √ 192.65 1556.15 √
27 √ 192.70 1555.75 √ √ √ √ √ √ √
27.5 √ 192.75 1555.34 √
28 √ 192.80 1554.94 √ √ √ √ √
28.5 √ 192.85 1554.54 √
29 √ 192.90 1554.13 √ √ √ √ √ √ √
29.5 √ 192.95 1553.73 √
30 √ 193.00 1553.33 √ √ √ √ √
30.5 √ 193.05 1552.93 √
31 √ 193.10 1552.52 √ √ √ √ √ √ √
31.5 √ 193.15 1552.12 √
32 √ 193.20 1551.72 √ √ √ √ √
32.5 √ 193.25 1551.32 √
33 √ 193.30 1550.92 √ √ √ √ √ √ √
33.5 √ 193.35 1550.52 √
34 √ 193.40 1550.12 √ √ √ √ √

(THz) (nm)
Blue Red 8- 16- 16- 32- 40- 40- 80-
34.5 √ 193.45 1549.72 √
35 √ 193.50 1549.32 √ √ √ √ √ √ √
35.5 √ 193.55 1548.91 √
36 √ 193.60 1548.51 √ √ √ √ √
36.5 193.65 1548.11 √
37 193.70 1547.72 √ √ √ √
37.5 193.75 1547.32 √
38 193.80 1546.92 √ √ √
38.5 193.85 1546.52 √
39 193.90 1546.12 √ √ √ √
39.5 193.95 1545.72 √
40 194.00 1545.32 √ √ √
40.5 194.05 1544.92 √
41 194.10 1544.53 √ √ √ √
41.5 194.15 1544.13 √
42 194.20 1543.73 √ √ √
42.5 194.25 1543.33 √
43 194.30 1542.94 √ √ √ √
43.5 194.35 1542.54 √
44 194.40 1542.14 √ √ √
44.5 194.45 1541.75 √
45 √ 194.50 1541.35 √ √ √ √ √
45.5 √ 194.55 1540.95 √
46 √ 194.60 1540.56 √ √ √ √
46.5 √ 194.65 1540.16 √
47 √ 194.70 1539.77 √ √ √ √ √
47.5 √ 194.75 1539.37 √
48 √ 194.80 1538.98 √ √ √ √
48.5 √ 194.85 1538.58 √
49 √ 194.90 1538.19 √ √ √ √ √
49.5 √ 194.95 1537.79 √
50 √ 195.00 1537.40 √ √ √ √
50.5 √ 195.05 1537.00 √
51 √ 195.10 1536.61 √ √ √ √ √

(THz) (nm)
Blue Red 8- 16- 16- 32- 40- 40- 80-
51.5 √ 195.15 1536.22 √
52 √ 195.20 1535.82 √ √ √ √
52.5 √ 195.25 1535.43 √
53 √ 195.30 1535.04 √ √ √ √
53.5 √ 195.35 1534.64 √
54 √ 195.40 1534.25 √ √ √ √
54.5 √ 195.45 1533.86 √
55 √ 195.50 1533.47 √ √ √ √
55.5 √ 195.55 1533.07 √
56 √ 195.60 1532.68 √ √ √ √
56.5 √ 195.65 1532.29 √
57 √ 195.70 1531.90 √ √ √ √
57.5 √ 195.75 1531.51 √
58 √ 195.80 1531.12 √ √ √ √
58.5 √ 195.85 1530.72 √
59 √ 195.90 1530.33 √ √ √ √
59.5 √ 195.95 1529.94 √
60 √ 196.00 1529.55 √ √ √ √

CWDM Frequencies and

Wavelengths (ITU-T Rec.
G.694.2 for CWDM)
1471 
1491 
1511  
1531  
1551  
1571  
1591 
1611 
XDM-40 .......................................................... 256 x 447 x 285 mm (10.08 x 17.60 x 11.22 in)
XDM-400 ........................................................ 500 x 450 x 285 mm (19.68 x 17.72 x 11.22 in)
XDM-450 ........................................................ 374 x 492 x 275 mm (14.72 x 19.37 x 10.82 in)
XDM-500 ........................................................ 725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in)
XDM-1000 .................................................... 1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in)
XDM-2000 ...................................................... 775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in)
XDM-3000 ......................................................... 1550 x 450 x 285 mm (61 x 17.72 x 11.22 in)
MECP ...................................................................... 120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in)
xMCP .................................................................... 265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in)
HLXC192/384/768, XIO, SIO, PIO, DIO, ACP1000, ATS and cards cage mux/demux,
OADM, transponder, OFA, OPM, DIOB,
MCS5, MCS10 ...................................................... 415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in)
Modules cage connection modules (electrical), mux/demux, OADM, OFA
............................................................................... 265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in)
HLXC1536 .......................................................... 550 x 48 x 255 mm (21.65 x 1.89 x 10.04 in)
ACP3000 ................................................................ 116.5 x 38 x 220 mm (4.59 x 1.5 x 8.66 in)


PRAP (optional) .................................................. 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
XDM-400 heat buffer....................................... 44.5 x 412 x 285 mm (1.75 x 16.22 x 11.22 in)
Heat buffer ........................................................ 125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in)
Racks ........................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
...................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
Weight
XDM-40 ......................................................................................................... 7.5 kg (16.54 lbs)
XDM-40 fully populated ................................................................................. 16 kg (35.28 lbs)
XDM-400 ........................................................................................................ 17 kg (37.48 lbs)
XDM-400 fully populated ............................................................................... 35 kg (77.16 lbs)
XDM-450 .......................................................................................................... 11.8 kg (26 lbs)
XDM-450 fully populated ............................................................................... 19 kg (41.85 lbs)
XDM-500 ........................................................................................................ 20 kg (44.09 lbs)
XDM-500 fully populated ............................................................................. 50 kg (110.23 lbs)
XDM-1000 ...................................................................................................... 25 kg (55.12 lbs)
XDM-1000 fully populated ........................................................................... 70 kg (154.32 lbs)
XDM-2000 ...................................................................................................... 20 kg (44.09 lbs)
XDM-2000 fully populated ........................................................................... 50 kg (110.23 lbs)
XDM-3000 .................................................................................................... 50 kg (110.23 lbs)
XDM-3000 fully populated .............................................................................. 180 kg (284 lbs)
Floor Loading
Floor loading of fully equipped rack ....................................................................... 7.35 kn/m2
Power
Power requirements
Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1
Input voltage ......................................................................................... -40 V DC to -75 V DC
Nominal power source .................................................................. -60 V or -48 V BTNR 2511

Power Supply Lines Surge Voltage

Applicable specification .............................................................................. EN61000-4-5:1996
Line to line maximum surge voltage ............................................................................... 2000 V
Line to ground maximum surge voltage ......................................................................... 4000 V
Power consumption
XDM-40 ................................................................................ Typical 380 W, maximum 450 W
XDM-400 .............................................................................. Typical 500 W, maximum 800 W
XDM-1000 .................................................................... Typical 1200 W, maximum 1800 W 208
XDM-2000 ........................................................................ Typical 1200 W, maximum 2000 W
XDM-3000 ........................................................................ Typical 3300 W, maximum 4300 W
208
Depending on shelf revision.

Main equipment power consumption

NOTE: The listed power requirements do not include the

power required by modules that may be installed on the card.

Common cards xMCP 40 W
xMCP-B 20 W
MECP 15 W
MECP_OSC 20 W
HLXC192/HLXC384 90 W
HLXC768 140 W
HLXC1536 670 W
XIO192 68 W
XIO384F 127 W (without optical module)
xFCU 14 W
xFCU-H 35 W
FCU3000 350 W
xFCU450 50 W
xINF450 50 W
xINF/xINF-H 8W
INF3000 64 W
PDH cards PIO2_84 45 W
PIO2_84F 33 W
M2_84 (all versions) 3W
PIO345_16 (all versions) 80 W
M345P_16P 10 W
M345_16 3W
M345_8 2W


STM1 and STM4 cards SIO1&4 48 W
SIO1&4B 86 W
OMS01_4 4W
OM01_4 4W
OMS04_1 1W
OM04_1 1W
M1_8 5W
M1_16 5W
M1_16P 3W
STM16 cards SIO16_2 60 W
SIO16_2B 83 W
SIO16_4B 96 W
OM16_1SFP Per specs
OMSC16_4 10 W
OM16_1 20 W
STM64 cards SIO64_1, SIO64_1M 125 W
SIO64_1-MF 135 W
SIO64B 106 W
SIO164 80 W
SIO164 OMSC16_4 83 W
SIO164 OMTX10 82 W
OMTX10_EF 15.5 W
OM10_1 10 W
OM64_1, OM10_1xx 18 W
DIO DIO (all versions) 57 W
DIO1_40R 64 W
DMGE_2 7W
OMGE_1SX 1W
DM16_1 4W
DOM16_I3 1W
MCS MCS5 100 W
MCS10 115 W
MCS30_X10G 125 W
ATS ATS 48 W
Control cards ACP1000 13.5 W
ACP3000 20 W


Transponders and TRP25_2C 40 W
combiners
AoC 83 W
TRP10_4R/M 60 W
TRP40_2B 115 W
CMBR40 110 W
CHTR base card and CHTR_B 54 W
modules
OMCD_8 24 W
OMD25_2 17 W
OMTR27 12 W
OMTR27_2 5W
OMCM25_4 16 W
OMTX10 8W
OMTX10_EF 13 W
OMTX10_S 7W
OMTX10_LAN 10 W
OMS16_4T 16 W
Optical amplifier cards OFA_2 single 12 W
OFA_2 dual 20W
OFA_RM 17 W
OFA_HRM 21 W
MO_BAC 15 W
MO_PAC 15 W
MO_BAS 15 W
MO_PAS 15 W
MO_OFA_PHBC 20 W
MO_OFA_PC 12 W
MO_OFA_HBC 12 W
MO_OFA_FBC 14 W
MO_OFA_M 20 W
MO_OFA_MH 25 W
MO_OFA_MHe 27 W
MO_OFA_FHBC 15 W
Rack mounted power RM_OFA_HBR 90 W
amplifiers
RM_OFA_FBR 90 W
RM_OFA_VHB 80 W


ROADM MO_ROADM8/E/I/D 15.5 W
MO_ROADM8A 25 W
MO_ROADM8A_50 25 W
MO_ROADM2A 24 W
MO_ROADM2A_50 24 W
MO_ROADM40/E 40 W
CCP OADM modules MO_CW2 4.5 W
OM_CWM8C 4.8W
OM_CWD8C 5.8 W
OM_CWMD4C 4.8 W
OM_CWMD4CE 4.8 W
OM_CWMD4SL 4.8 W
OM_COADM1AB 4.8 W
OM_COADM2AB 4.8 W
OM_OADM4GEW 5W
I/O OADM modules OADM4_EW 5W
OM_AD4RQEWxx 5W
Optical DWDM cards for DW16MVDRE 15 W
X1/X2 slots
DWDM modules MO_DW16MDR-AVAV 10 W
MO_DW16MDRE-AVAV 10 W
MO_DW16MDB-AVAV 10 W
MO_DW16MDR-SAV 4.8 W
MO_DW16MDRE-SAV 4.8 W
MO_DW16MDB-SAV 4.8 W
MO_DW40MC-S 1W
MO_DW40MC-A 4.8 W
MO_DW40DC-A 4.8 W
MO_DW40VMD/E/I 47 W
AUX cards AUX_2IO 15 W
AUX_2X 15 W
Each Plug-in 1W
OPM OPM 15 W
OMSP OMSP 10 W


Accessory module Each MO_ACC 1W
Miscellaneous and OTX10_ALxx 15 W
Pluggable modules
OTR103_SR/LR/ER, 3.5 W
OTR64_PI3/PS5/AL5
OTX10_AT 15 W
OTR10_ELT 7W
OTR10_ALxx/ASxx 3.5 W
OTC10_ALxx/PSxx 3.5 W
OTR25_AVxx/ABxx 2W
OTC25_ALxx/PSxx 1.5 W
OTR10_AT 3.5 W
OTR1_S3/L3/L5 1W
OTR4_S3/L3/L5 1W
OTR16_I3/S3/L3/L5 1W
OTGBE_SX/LX/ZX 1W
OTX27_AT 4W
Heat dissipation
XDM-400 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr
XDM-500 ............................................................. Typical 2720 Btu/hr, maximum 3400 Btu/hr
XDM-1000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr
XDM-2000 ........................................................... Typical 4094 Btu/hr, maximum 5115 Btu/hr
XDM-3000 ....................................................... Typical 11253 Btu/hr, maximum 14663 Btu/hr

Operation
Applicable specification ................................................................ ETS 300 019-1-3 Class 3.1E
Temperature range ............................................................................................. -5 ºC to +45 ºC
Storage (packed)
Handling and transportation

Temperature range .......................................................................................... -40 ºC to +70 ºC
EMC
Applicable specifications ................... EMC directive 89/336, (including EN 300 386-2: 1997,
.......................................................................... Class B, emission and immunity requirements)
Safety
Applicable specificationsEN 60950 edition 2 (including A1/1992, A2/1993, A3/1995, A4/1996); EN 41003
CE safety ........................................................................................... LVD directive 73/23/EEC
Laser Safety
Applicable specification ...................... EN 60825-1&2 (including A1/1997) (AS/NZS 2211.2)
NEBS Compliance
The XDM platform complies with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 with
Revision 1, February 1999 (Level 3).

Reliability
Life
Availability
Management Specifications
LightSoft server and client for managing all ECI equipment
EMS-XDM ................................................................................................. on SUN workstation

TMN; RS-232 to LCT-XDM; OverHead Access (OHA) and external alarms; orderwire;
RAP.

Alarm concept ................................................................................................................... G.783
Alarm types .................................. LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes .......................................................................... Critical, Major, Minor, Warning

Other Specifications
Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12
SDH/SONET switch core options192/384/768 x STM-1 with cross-connect capability of 4/3/2/1
SONET switch core options ............................................................................. 576/1152 STS-1
Traffic Protection
SNCP I/N LO, HO, UPSR ..................................................................................... within 30 ms
MSP/APS 1+1 ........................................................................................................ within 50 ms
MS-SPRing/BLSR ................................................................................................ within 50 ms
OCH ......................................................................................................................... within 5 ms
Optical line protection .............................................................................................. within 5 ms
Redundancy
I/O electrical modules protection .................................................................... 1: N (N=1 to 10)

Synchronization
The XDM supports four timing references, which can be selected from multiple
timing sources, including:
 From any PDH/Async tributary interface
 From any SDH/SONET line 209
 External 2 MHz and 2 Mbps/1.5 Mbps timing outputs (two T3 ports per
shelf)
 G.813 internal clock.
Jitter and Wander

209
The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate
lines and transmits it over SDH/SONET lines.

A
Standards and References
In this appendix:
Overview ........................................................................................................ A-1
Broadband Forum ........................................................................................... A-1
Environmental Standards ................................................................................ A-2
ETSI: European Telecommunications Standards Institute ............................. A-2
IEC: International Electrotechnical Commission ........................................... A-3
IEEE: Institute of Electrical and Electronic Engineers................................... A-4
IETF: Internet Engineering Task Force .......................................................... A-5
ISO: International Organization for Standardization ...................................... A-7
ITU-T: International Telecommunication Union ........................................... A-7
MEF: Metro Ethernet Forum ........................................................................ A-11
NIST: National Institute of Standards and Technology................................ A-12
North American Standards ........................................................................... A-12
OMG: Object Management Group ............................................................... A-13
TMF: TeleManagement Forum .................................................................... A-13
Web Protocol Standards ............................................................................... A-13
Overview
The following is a list of standards and reference documents that relate to the
XDM platform families. The standards are listed alphabetically by groups.
Broadband Forum
 Af-phy-0064.000 – ATM Forum E1 Physical Layer Interface.
 Af-phy-0086.000 – ATM Forum IMA V1.0.
 Af-phy-0086.001 – ATM Forum IMA V1.1.
 Af-phy-00121.00 – ATM Forum Traffic Management Specifications V4.1.
417006-2009-013-A01 ECI Telecom Ltd. Proprietary A-1

Standards and References XDM System Specifications
Environmental Standards
 EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using
Products.
 OHSAS 18001: Occupational Health and Safety Management Systems -
Requirements.
 REACh Directive 2005/32/EC: Registration, Evaluation, Authorization,
and Restriction of Chemicals.
 RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment.
 WEEE Directive 2002/96/EC: Waste from Electrical and Electronic
Equipment.
ETSI: European
Telecommunications Standards
Institute
 EN 300 019-1-1 Class 1.2: Environmental Engineering (EE);
Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.
Conditions; Transportation.
 EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE);
Conditions; Stationary use at weather-protected locations.
Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.
 EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface
at the Input to Telecommunications Equipment.
 EN 300-166: Physical and electrical characteristics of hierarchical digital
interfaces for equipment using the 2 048 kbit/s based plesiochronous or
synchronous digital hierarchies.
A-2 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

XDM System Specifications Standards and References
 EN 300 386: Electromagnetic compatibility and Radio spectrum Matters

(ERM); Telecommunication network equipment; Electromagnetic
Compatibility (EMC) requirements.
 EN 300-417-2-1: Transmission and Multiplexing (TM); Generic
requirements of transport functionality of equipment.
 EN 300-417-5-1: Generic requirements of transport functionality of
equipment.
 EN 300-462-5-1: Transmission and Multiplexing (TM); Generic
requirements for synchronization networks.
 EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal
equipment interface.
 EN 301-164: SDH leased lines connection characteristics.
 EN 301-165: SDH leased lines Network and Terminal interface
presentation.
 EN 55022: Radio Disturbance Characteristics of Information Technology
Equipment.
 ETR 114: Functional Architecture of SDH Transport Networks.
 ETR 275: Considerations on Transmission Delay and Transmission Delay
value for components on connections supporting speech communication
over evolving digital networks.
 FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.
 FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for
Synchronous Multiplex Hierarchy.
IEC: International
Electrotechnical Commission
 IEC 68: Environmental Testing.
 IEC 917: Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
 IEC 3309: Information Technology – Telecommunications and Information
Exchange between Systems – High-Level Data Link Control (HDLC)
Procedures – Frame Structure.
 IEC 9314-3: Information Processing Systems - Fiber Distributed Data
Interface (FDDI) Multiplex.
 IEC 9595, Information Technology: Open Systems Interconnection,
Common Management Information Services.

 IEC 9596, Information Technology: Open Systems Interconnection,

Common Management Information Protocol.
 IEC 13239: Information technology — Telecommunications and
information exchange between systems — High-level data link control
(HDLC) procedures.
 IEC 17025: General Requirements for Competence of Testing and
Calibration Laboratories.
 IEC 60825-1: Safety of Laser Products – Part 1: Equipment Classification
and Requirements.
 IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products – Part 2: Safety
of Optical Fiber Communication System (OFCS).
 IEC/EN/UL 60950-1: Information Technology Equipment - Safety -
General Requirements.
 IS 1249-1: Safety of Laser products: Equipment classification requirements
and users guide.
IEEE: Institute of Electrical and

Electronic Engineers
 IEEE 802.1ad: Virtual Bridged Local Area Networks—Revision—
Amendment 4: Provider Bridges.
 IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5:
Connectivity Fault Management.
 IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE
802.1t and IEEE 802.1w).
 IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.
 IEEE 802.1Q: Virtual Bridged Local Area Networks—Revision.
 IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.
 IEEE 802.3: Carrier Sense Multiple Access with Collision Detection
(CSMA/CD) Access Method and Physical Layer Specifications.
 IEEE 802.3ad: Link Aggregation.
 IEEE 802.3ah: Ethernet in the First Mile (Link OAM).
 IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.

IETF: Internet Engineering Task

Force
 RFC 1493: Definition of Managed Objects for Bridges.
 RFC 1643: Ethernet-like Interfaces.
 RFC 1662: PPP in HDLC-Life Framing.
 RFC 1757: Remote Network Monitoring Management Information Base.
 RFC 1823: LDAP Application Program Interface (API).
 RFC 1901: Introduction to Community-based SNMPv2.
 RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater
Devices using SMIv2.
 RFC 2251: Lightweight Directory Access Protocol (v3) [specification of
the LDAP on-the-wire protocol].
 RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax
Definitions.
 RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String
Representation of Distinguished Names.
 RFC 2254: The String Representation of LDAP Search Filters.
 RFC 2255: The LDAP URL Format.
 RFC 2256: A Summary of the X.500(96) User Schema for use with
LDAPv3.
 RFC 2401: Security Architecture for the Internet Protocol.
 RFC 2409: Internet Key Exchange Protocol (IKE).
 RFC 2474: Definition of the Differentiated Services Field (DS Field) in the
IPv4 and IPv6 Headers.
 RFC 2597: Assured Forwarding PHB Group.
 RFC 2615: PPP over SONET/SDH.
 RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface
Types.
 RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.
 RFC 2702: Requirements for Traffic Engineering Over MPLS.
 RFC 2737: Entity MIB (Version 2).
 RFC 2819: Remote Network Monitoring Management Information Base.
 RFC 2829: Authentication Methods for LDAP.

 RFC 2830: Lightweight Directory Access Protocol (v3): Extension for

Transport Layer Security.
 RFC 2863: Interfaces Group MIB.
 RFC 3014: Notification Log MIB.
 RFC 3031: Multiprotocol Label Switching Architecture.
 RFC 3032: MPLS Label Stack Encoding.
 RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).
 RFC 3270: Multi-Protocol Label Switching (MPLS) Support of
Differentiated Services.
 RFC 3377: Lightweight Directory Access Protocol (v3): Technical
Specification.
 RFC 3411: SNMP Framework MIB.
 RFC 3414: SNMP User-Based SM MIB.
 RFC 3415: SNMP Vies-Based ACM MIB.
 RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label
Switching (MPLS) Networks.
 RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering
(TE) Management Information Base (MIB).
 RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router
(LSR) Management Information Base (MIB).
 RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge
(PWE3).
 RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.
 RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.
 RFC 4125: Maximum Allocation Bandwidth Constraints Model for
Diffserv-aware MPLS Traffic Engineering.
 RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model
for Diffserv-aware MPLS Traffic Engineering & Performance
Comparisons.
 RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane
Failures.
 RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS
Networks.
 RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry:
"EXP" Field Renamed to "Traffic Class" Field.

 IETF Drafts:
 draft-ietf-l2vpn-vpls-ldp.
 draft-ietf-l2vpn-vpls-mcast-reqts.
 draft-ietf-magma-snoop.
 draft-ietf-mpls-rsvp-te-p2mp.
 draft-ietf-mpls-tp-nm-framework.
 draft-ietf-mpls-tp-nm-req.
 draft-ietf-pwe3-ethernet-encap.
 draft-martini-l2circuit-encap-mpls.
 draft-sajassi-l2vpn-vpls-multicast-congruency.
 draft-vasseur-mpls-backup-computation.
ISO: International Organization

for Standardization
 A2LA: Accredited Laboratory for Electrical and Mechanical Testing.
 ISO 9001: Quality Management System – Requirements.
 ISO 14001: Environmental Management Systems – Requirements With
Guidance for Use.
 ISO 27001: Information Security Management Systems – Requirements.
 TL 9000, QuEST Forum: Quality Management System – Requirements &
Measurements Handbooks for the Telecom Industry.
ITU-T: International
Telecommunication Union
 G.650: Definition and Test Methods for the Relevant Parameters of
Single-Mode Fibers.
 G.651: Characteristics of a 50/125 µm Multimode Graded Index Optical
Fiber Cable.
 G.652: Characteristics of a Single-Mode Optical Fiber Cable.
 G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber
Cable.
 G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber
Cable.

 G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode

Optical Fiber Cable.
 G.661: Definition and Test Methods for the Relevant Generic Parameters of
Optical Amplifier Devices and Subsystems.
 G.662: Generic Characteristics of Optical Fiber Amplifier Devices and
Subsystems.
 G.663: Application Related Aspects of Optical Fiber Amplifier Devices
and Subsystems.
 G.664: Optical Safety Procedures and Requirements for Optical Transport
Systems.
 G.671: Transmission Characteristics of Passive Optical Components.
 G.691: Optical Interfaces for Single Channel SDH Systems with Optical
Amplifiers and STM-64 Systems (Draft).
 G.692: Optical Interfaces for Multi-Channel Systems with Optical
Amplifiers.
 G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.
 G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.
 G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing
Applications.
 G.703: Physical/Electrical Characteristics of Hierarchical Digital
Interfaces.
 G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and
44 736 kbps Hierarchical Levels.
 G.706: Frame Alignment and CRC Procedures Relating to Basic Frame
Structure Defined in Rec G.704.
 G.707: Network Node Interface for the Synchronous Digital Hierarchy.
 G.709: Interfaces for the Optical Transport Network (OTN).
 G.752: Characteristics of digital multiplex equipments based on a second
order bit rate of 6312 kbit/s and using positive justification.
 G.772: Protected Monitoring Points Provided on Digital Transmission
Systems.
 G.774 & G774.n: SDH Information Model.
 G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote
Defect Indication (RDI) defect detection and clearance criteria for PDH
signals.
 G.781: Synchronization Layer Functions.
 G.783: Characteristics of SDH Equipment Functional Blocks.
 G.784: Synchronous Digital Hierarchy (SDH) Management.

 G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.

 G.803: Architectures of Transport Networks based on the Synchronous
Digital Hierarchy.
 G.805: Generic Functional Architecture of Transport Networks.
 G.806: Characteristics of Transport Equipment –Description Methodology
and Generic Functionality.
 G.809: Functional Architecture of Connectionless Layer Networks.
 G.811: Timing Characteristics of Primary Reference Clocks.
 G.812: Timing Requirements of Slave Clocks Suitable for Use as Node
Clocks in Synchronization Networks.
 G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).
 G.823: The Control of Jitter and Wander within Digital Networks Based on
the 2048 kbit/s Hierarchy.
 G.825: The Control of Jitter and Wander within Digital Networks Based on
the SDH (Draft).
 G.8251: The Control of Jitter and Wander within the Optical Transport
Network (OTN).
 G.826: Error Performance Parameters and Objectives for International,
Constant Bit Rate Digital Paths at or above the Primary Rate.
 G.828: Error Performance Parameters and Objectives for International,
Constant Bit Rate Synchronous Digital Paths.
 G.829: Error Performance Events for SDH Multiplex and Regenerator
Sections.
 G.831: Management Capabilities of Transport Networks Based on the
Synchronous Digital Hierarchy (SDH).
 G.841: Types and Characteristics of SDH Network Protection
Architectures.
 G.842: Inter-Working of SDH Protection Architectures.
 G.872: Architecture of Optical Transport Networks.
 G.874: Management Aspects of the Optical Transport Network Element.
 G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management
Information Model for the Network Element View.
 G.957: Optical Interfaces for Equipment and Systems relating to the
Synchronous Digital Hierarchy.
 G.959.1: Optical Transport Network Physical Layer Interfaces.
 G.975: Forward Error Correction for Submarine Systems.
 G.985: 100 Mbit/s point-to-point Ethernet based optical access system.

 G.7041: Generic Framing Procedure (GFP).

 G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual
Concatenated Signals.
 G.7713: Distributed Connection Management.
 G.7713.2: RSVP-TE Implementation.
 G.7714: Generalized Automatic Discovery Techniques.
 G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.
 G.7715: ASON Routing.
 G.7715.1: Based on PNNI, OSPF or IS_IS.
 G.8010/Y.1306: Architecture of Ethernet Layer Networks.
 G.8011/Y.1307: Ethernet Services Framework.
 G.8011.1/Y.1307.1: Ethernet Private Line Service.
 G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.
 G.8012/Y.1308: Ethernet UNI and Ethernet NNI.
 G.8261/Y. 1361: Timing and synchronization aspects in packet network.
 G.8262/Y. 1362: Timing characteristics of synchronous Ethernet
equipment slave clock (EEC).
 I.356: ATM Layer Cell Transfer Performance.
 I.361: ATM Layer Specification.
 I.371: Traffic Control and Congestion Control.
 I.610: ATM Operation and Maintenance Principles.
 M.3010: Principles for a Telecommunications Management Network.
 M.3013: Considerations for a Telecommunications Management Network.
 M.3100: Generic Network Information Model.
 M.3180: Catalogue of TMN Management Information.
 M.3200: TMN Management Services and Telecommunications Managed
Areas: Overview.
 M.3300: TMN F Interface Requirements.
 M.3400: TMN Management Functions.
 Q.821: Alarm Surveillance.
 Q.822: Performance Monitoring.
 X.217: Open Systems Interconnection, Service Definition for the
Association Control Service Element.
 X.219: Remote Operations - Model, Notation and Service Definition.

 X.227: Open Systems Interconnection, Connection-Oriented Protocol for

the Association Control Service Element - Protocol Specification.
 X.229: Remote Operations: Protocol Specification.
 X.710: Open Systems Interconnection, Common Management Information
Service.
 X.720: Open Systems Interconnection, Structure of Management
Information - Management Information Model.
 X.721 Information Technology: Open Systems Interconnection, Structure
of Management Information - Definition of Management Information.
 X.722: Open Systems Interconnection, Structure of Management
Information - Guidelines for the Definition of Managed Objects.
 X.731: Open Systems Interconnection, Systems Management - State
Management Function.
 X.733: Open Systems Interconnection, Systems Management - Alarm
Reporting Function.
 X.743: Open Systems Interconnection, Systems Management - Time
 X.744: Open Systems Interconnection, Systems Management - Software
 Y.1311: Network-based VPNs - Generic architecture and service
requirements.
 Y.1710: Requirements for Operation & Maintenance functionality for
MPLS networks.
 Y.1711: Operation & Maintenance mechanism for MPLS networks.
MEF: Metro Ethernet Forum

 MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic
Framework.
 MEF6 Metro Ethernet Services Definitions.
 MEF7 EMS-NMS Information Model.
 MEF9 Test Suite for Ethernet Services at the UNI.
 MEF10 Ethernet Service Attributes.
 MEF11 User Network Interface (UNI) Requirements and Framework.
 MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet
Services Layer.
 MEF14 Test Suite for Ethernet Traffic Management.

NIST: National Institute of

Standards and Technology
 FIPS PUB 197: Advanced Encryption Standard (AES).
 FIPS PUB 140-2: Security Requirements for Cryptographic Modules.
North American Standards

 ANSI FC–F1-2: Fiber Channel Physical Interface REV 10.
 ANSI T1.102: Digital hierarchy electrical interface.
 ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description
including Multiplex Structure, Rates, and Formats.
 ANSI X3.296: Single-Byte Command code sets CONnection (SBCON)
architecture.
 FCC CFR Title 47 Part 15: Radio Emission.
 FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)
 NEBS GR1089 and GR63 (temperature aspect)
 NEBS Level 3 support for N.A. platforms.
 Rural Utility Service (RUS) Certification.
 Telcordia GR-63-CORE: Network Equipment Building System (NEBS)
Requirements: Physical Protection.
 Telcordia GR-253-CORE: Synchronous Optical Network (SONET)
Transport Systems: Common Generic Criteria.
 Telcordia GR-383-CORE: COMMON LANGUAGE® Equipment Codes
(CLEI™ Codes) – Generic Requirements for Bar Code Labels.
 Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment
Cabinets.
 Telcordia GR-499-CORE: Transport System Generic Requirements
(TSGR): Common Requirements.
 Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical
Safety – Generic Criteria for Network Telecommunications Equipment.
 Telcordia GR-1209-CORE: Generic Requirements for Passive Optical
Components.
 Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring
Equipment Generic Criteria.
 Telcordia GD-1244-CORE: Clock for the synchronization network:
Common generic criteria.

 Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber

Amplifiers and Proprietary Dense Wavelength-Division Multiplexed
Systems.
 Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path
Switched Ring (UPSR) Equipment Generic Criteria.
 Telcordia GD-2979-CORE: Common Generic Requirements for Optical
Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers
(OTMs).
OMG: Object Management Group

 Notification Service Specification V 1.0.
 The Common Object Request Broker: Architecture and Specification V 2.6.
TMF: TeleManagement Forum

 TMF 513: MTNM Business Agreement Release 3.5.
 TMF 518: Framework Document Delivery Package (DDP) Business
Agreement (BA) V1.1.
 TMF 518: Resource Provisioning DDP BA V1.0.
 TMF 608: Multi Technology Network Management Information
Agreement V 2.1 and V 3.5.
 TMF 814: Multi Technology Network Management Solution Set V 2.1 and
V 3.5.
 TMF 854: The MTOSI XML Solution Set Package Release 1.1.
Web Protocol Standards

W3C: World Wide Web Consortium
 SOAP 1.1: Simple Object Access Protocol.
 WSDL 1.1: Web Services Description Language.
WS-I: Web Services Interoperability Organization

 WS-I Basic Profile 1.1: Web Services Interoperability.


Index
ATM • 1-2, 1-4
1
ATS Specifications • 6-28
10 Gbps Optical Client XFP Transceivers Auxiliary Cards and Miscellaneous
for Transponders and CMBR40B • 6- Accessory Modules • 6-61
47 Auxiliary Cards and Miscellaneous
10 Gbps Optical XFP Transceivers • 5-13 Accessory Modules Specifications •
2 6-61
Availability • 3-14, 4-28, 5-26, 6-74
2 Mbps (E1) • 3-3, 4-4, 5-3, 6-8
2.5 Gbps Optical C/DWDM SFP B
Transceivers • 5-12 Basic XDM-100 shelf • 2-4
2.5 Gbps Optical CWDM SFP Basic XDM-100 Shelf • 2-35
Transceivers • 4-12 Basic XDM-300 shelf • 2-7
3 Basic XDM-300 Shelf • 2-40
34 Mbps (E3) • 3-3, 4-4, 5-3, 6-8 Basic XDM-50 shelf • 2-2
Basic XDM-50 Shelf • 2-32
4 Basic XDM-900 shelf • 2-10
45 Mbps (DS-3) • 3-3, 4-4, 5-4, 6-8 Basic XDM-900 Shelf • 2-44
4-channel active OADM basecard only Broadband Forum • A-1
(no filters), 2 x 2 switch through I/O
slots • 6-37 C
5 C Band Channel Frequencies and
Wavelengths (ITU-T Rec. G.694.1 for
52 Mbps (STS-1) • 4-4, 5-4 DWDM) • 6-62
52 Mpbs (STS-1) • 6-8 C/DWDM and OTN Platform for
A Metro-access and CPE
ApplicationsSee XDM-40 • 1-4
ADM • 1-4 Cards • 2-33, 2-37, 2-41, 2-48, 2-49, 2-
Aggregator for Metro-Edge NetworksSee 51, 2-52, 2-54, 2-57, 2-58, 2-59
XDM-400 • 1-4 control, matrix and I/O • 2-57
Alarms and Performance • 3-4, 4-6, 5-5, ECB/xECB4 • 2-59
6-74 ECM40 • 2-59
AoC basecard configurations • 6-42 ECU • 2-37
AoC basecard modules and transceivers • ECU50 • 2-33, 2-41
6-42
HLXC • 2-57
AoC, CMBR10, TRP10_LAN,
TRP10_2B, OTU2 Line Transceivers HLXC192/384/768 • 2-57
• 6-52 I/O • 2-51, 2-52
AoC/OMTR27_2 STM-16/OTU1 client • MECP • 2-48, 2-59
6-48 MXC • 2-37
417006-2009-013-A01 ECI Telecom Ltd. Proprietary I-1

Index XDM System Specifications
MXC50 • 2-33, 2-41 Cross-Connect Specifications • 3-2, 4-2,

PSFU • 2-48 5-2
xFCU40 • 2-48 CWDM and DWDM STM-16/OC-
XIO • 2-57, 2-58 48/OTU1 SFP Optical Transceivers
for OM16_1SFP and OMSC16_4 • 6-
XIO192 • 2-49
19
XIO192/384F • 2-58
CWDM components (CCP cage) • 6-38
xMCP • 2-49
CWDM Frequencies and Wavelengths
xMCP/xMCP_B • 2-51, 2-52, 2-54, 2- (ITU-T Rec. G.694.2 for CWDM) •
59 4-22, 5-20, 6-65
xMCP_B • 2-48 CWDM Modules • 4-21, 5-20
Cards Cage • 2-52 CWDM Mux/Demux/OADM
CCP cage OFAs DWDM applications • 6- Components • 6-38
58
CCP cage OFAs for single-channel D
applications • 6-58 Data Cards • 6-23
CCP50 • 2-32 Data Cards Specifications • 6-23
CCP50_2 • 2-2 Data Client Transceivers for DIOB,
CDWD Modules Specifications • 4-19, 5- MCS5, MCS10, MCS30_X10G • 6-
19 29
CE Compliance • 3-14 Data Client XFP Transceivers for
CHTR_B basecard Configurations • 6-40 MCS30_X10G • 6-30
CHTR_B basecard modules and Data Line XFP Transceivers for
transceivers • 6-40 MCS30_X10G • 6-31
Client Transceivers for EISM Cards • 3- Data Modules • 3-8, 4-13, 5-14
11 Data Modules Specifications • 3-8, 4-13,
Client Transceivers for MCSM, EISM 5-14
Cards • 4-18 Data-Aware Access GatewaySee XDM-
Client Transceivers for MCSM, 500 • 1-4
EISMB_840 Cards • 5-18 DCF/DCM Units • 6-60
Compact CWDM Platform for Metro- DCF/DCM Units Specifications • 6-60
access NetworksSee XDM-200 • 1-4 Demux (CCP Flat Top) specifications • 6-
Connection Module Data for Electrical 33
I/O Cards • 6-3 Dimensions (H x W x D) • 3-12, 4-23, 5-
Control, Matrix, and I/O Cards for Large 21, 6-65
XDM Shelves • 2-57 DIOB Specifications • 6-23
Cross-Connect Capacity • 3-2, 4-2, 6-75 DIOM Specifications • 3-8, 4-13, 5-14
Cross-connect Capacity Specifications • DWDM • 1-4
6-75 DWDM cards (cards cage of XDM-1000
Cross-Connect Levels • 3-2, 4-2, 5-2, 6- and XDM-2000 shelves) • 6-32
75 DWDM components (CCP cage of XDM-
Cross-connect Levels Specifications • 6- 40/XDM-450/XDM-500/
75 XDM-1000) • 6-37
Cross-connect Specifications • 3-2, 4-2, DWDM modules (CCP cage of XDM-
5-2 1000/XDM-450) • 6-32
I-2 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

XDM System Specifications Index
DWDM Mux/Demux Cards and Modules Expanded XDM-300 with CWDM

• 6-32 Networking Capabilities • 2-9
DWDM OADM cards (cards cage) • 6-36 Expanded XDM-300 with I/O Protection
DWDM OADM Cards and Modules • 6- • 2-8
36 Expanded XDM-50 Shelf with I/O
DWDM OADM plug-in filters for Protection • 2-33
OADM cards • 6-37 Expanded XDM-900 Shelf with I/O
Protection • 2-45
E
Expanded XDM-900 with CWDM
ECB, xECB4, or ECB3000 • 2-59 Networking Capabilities • 2-14
ECB/xECB4 • 2-59 Expanded XDM-900 with I/O Protection
ECM40 • 2-59 • 2-12
ECU • 2-4, 2-37, 2-39 Expansion Shelves • 2-21
ECU300 • 2-43, 2-44 F
ECU300F • 2-43
FCU • 2-4
ECU50 • 2-2, 2-32, 2-33, 2-41
FCU40 • 2-15
ECU50 and ECU50R • 2-34
FCU50 • 2-2
ECU900 • 2-47, 2-48
Floor Loading • 6-66
ECU900F • 2-47
EISM Specifications • 3-10, 4-17 G
EISMB Specifications • 3-9, 4-14, 5-15 GbE/FC/2 Gbps FC/FICON Optical SFP
Electrical GbE SFP (ETGbE) • 3-11, 4- Transceivers for
18, 5-19 Transponders/Combiners • 4-20
Electrical Interface Connection Modules •
H
6-3
Electrical, Optical and Mixed Basecard Handling and transportation • 6-73
Information Specifications • 6-2 Handling and Transportation • 3-13, 4-27,
Electrical, Optical, and Mixed Basecard 5-25
Information • 6-2 Heat dissipation • 6-72
EMC • 3-13, 4-27, 5-26, 6-73 HLXC192/384/768 • 2-57
EMC Specifications • 3-13, 4-27, 5-26, 6- HLXC192/384/768/1536 • 2-57
73
I
Environmental Conditions • 3-13, 4-27,
5-25, 6-73 I/O Interfaces • 3-3, 4-4, 5-3
Environmental Conditions Specifications I/O Interfaces Specifications • 3-3, 4-4, 5-
• 3-13, 4-27, 5-25, 6-73 3
Environmental Standards • A-2 I/O Protection Options • 2-8
ETSI IEC
European Telecommunications International Electrotechnical
Standards Institute • A-2 Commission • A-3
Expanded XDM-100 Shelf with I/O IEEE
Protection • 2-36 Institute of Electrical and Electronic
Expanded XDM-300 Shelf with I/O Engineers • A-4
Protection • 2-41 IETF

Internet Engineering Task Force • A-5 MO_ROADM40 2D ROADM 100 GHz

INF50 • 2-2, 2-32 spacing with equalization • 6-35
ISO MO_ROADM8A – 100 GHz spacing –
International Organization for Multi Degree configuration • 6-34
Standardization • A-7 MO_ROADM8A_50 – 50 GHz spacing –
ITU-T Multi Degree configuration • 6-35
International Telecommunication MO_ROADM8D – 100 GHz spacing –
Union • A-7 Multi-Degree configuration • 6-35
Modules Cage • 2-52
J MSPP • 1-2
Jitter and Wander • 3-2, 4-4, 5-3, 6-76 MSPP for High Capacity Central
Jitter and Wander Specifications • 3-2, 4- Exchange ApplicationsSee XDM-
4, 5-3, 6-76 1000 • 1-4
Multifunctional Intelligent Optical
L
SwitchSee XDM-2000 • 1-4
Laser Safety • 3-14, 4-27, 5-26, 6-73 Mux (CCP Flat Top) specifications • 6-33
Life • 3-14, 4-28, 5-26, 6-74 Mux/Demux Modules • 4-21
M Mux/Demux Modules for XDM-300/900
• 5-20
Main equipment power consumption • 6-
Mux/demux specifications • 6-39
68
MXC • 2-37, 2-38
Main Equipment Power Consumption • 3-
13 MXC and ECU Cards • 2-37
Management • 3-4, 4-5, 5-5 MXC-100 • 2-4
Management and Alarm Interfaces • 3-4, MXC300 • 2-42
4-6, 5-5, 6-74 MXC300 and ECU300 Cards • 2-41
Management Specifications • 3-4, 4-5, 5- MXC300 Cross-Connect Capacity • 5-2
5, 6-74 MXC50 • 2-2, 2-32, 2-33, 2-41
MCS10 Specifications • 6-25 MXC50 and ECU50 Cards • 2-33
MCS30_X10G Specifications • 6-27 MXC900 • 2-46
MCS5 Specifications • 6-24 MXC900 and ECU900 Cards • 2-46
MCSM Specifications • 4-15, 5-16 MXC900 Cross-Connect Capacity • 5-2
MECP • 2-15, 2-19, 2-48, 2-59 MXC-BG • 2-36
MECP_OSC cards • 6-11 N
MEF
NEBS Compliance • 4-28, 5-26, 6-73
Metro Ethernet Forum • A-11
NIST
Miniature MSPP for Metro-access and
Cellular NetworksSee XDM-100 • 1- National Institute of Standards and
4 Technology • A-12
MO_ROADM2A - 100 GHz spacing - 2D Nonredundant XDM-100 • 2-5
ROADM with Equalization • 6-36 Nonredundant XDM-100 Shelf • 2-36
MO_ROADM2A_50 - 50 GHz spacing - North American Standards • A-12
2D ROADM with Equalization • 6-36 NVM • 2-6

O OW Unit Specifications • 6-22

OADM Modules • 4-21 P
OADM Modules for XDM-300/900 • 5- PDH/Async and SDH/SONET Interface
20 Specifications • 6-8
OADM specifications • 6-39 Physical Description • 2-1
OFAs for single channel and DWDM Physical Specifications • 3-12, 4-23, 5-21,
applications • 6-57 6-65
OM_AD4RQEW_xx 4skip0 OADM for Power • 3-12, 4-23, 5-21, 6-66
I/O slots • 6-37
Power consumption • 6-67
OM_OADM4GEW_xx 4 skip 0 OADM
Power Dissipation • 3-13, 4-23, 5-22
for CCP slots • 6-38
Power requirements • 6-66
OMCM25_4 & AoC GbE/FC1 SFP
Transceivers • 6-46 Power Supply Lines Surge Voltage • 6-67
OMCM25_4 FC2G client SFPs • 6-46 PSFU • 2-48
OMCM25_4 STM-1/OC-3 SFP Optical Q
Transceivers • 6-44
QoS • 1-1
Transceivers • 6-45 R
OMG Rack Layouts • 2-21
Object Management Group • A-13 Rack Layouts and Expansion Shelves • 2-
OMSP card specifications • 6-61 21
Operation • 3-13, 4-27, 5-25, 6-73 Rack Mounted Single Channel DCM
OPM card specifications • 6-61 Units • 6-60
Optical Amplifier Modules for TPU/OCU RAMAN and very high power EDFA
• 4-19, 5-19 amplifiers • 6-57
Optical Amplifiers • 6-56 Redundancy • 3-2, 4-3, 5-2, 6-75
Optical Amplifiers Specifications • 6-56 Redundancy Specifications • 3-2, 4-3, 5-
Optical Auxiliary Cards and Modules • 6- 2, 6-75
59 Reliability • 3-14, 4-28, 5-26, 6-74
Optical Auxiliary Cards and Modules Reliability Specifications • 3-14, 4-28, 5-
Specifications • 6-59 26, 6-74
Optical Auxiliary Cards for XDM-450 • ROADM Cards • 6-34
6-60 ROADM modules for XDM-1000/XDM-
Optical Components • 6-32 450 (CCP cage) • 6-34
Optical Components Specifications • 6-32 S
Optical SFP transceivers for I/O cards •
6-5 Safety • 3-14, 4-27, 5-26, 6-73
Optical transceivers for I/O cards • 6-4 Safety Specifications • 3-14, 4-27, 5-26,
6-73
Optical transmitters and receivers for
TRP25_2 • 6-40 SDH Interfaces • 3-5
Other Optical Cards • 6-61 SDH/SONET Interfaces • 4-6, 5-6, 6-10
Other Specifications • 6-75 SDH/SONET Interfaces Specifications •
4-6, 5-6, 6-10
Overview • 1-1, A-1

SDH/SONET STM-16/OC-48 SFP optical auxiliary cards and modules •

Optical Transceivers for OM16_1SFP 6-59
and OMSC16_4 • 6-17 optical components • 6-32
SDH/SONET STM-64/OC-192 (9953.28 PDH/Async and SDH/SONET
Mbps ±4.6 ppm) I/O Modules • 6-20 interface • 6-8
SDH/SONET STM-64/OC-192 XFP physical • 3-12, 4-23, 5-21, 6-65
Optical Transceivers • 6-21 redundancy • 3-2, 4-3, 5-2, 6-75
Shelf Layouts • 2-2, 2-3, 2-6, 2-15, 2-17, reliability • 3-14, 4-28, 5-26, 6-74
2-18, 2-19
safety • 3-14, 4-27, 5-26, 6-73
XDM-100 • 2-3, 2-6
SDH/SONET interfaces • 4-6, 5-6, 6-
XDM-1000 • 2-18 10
XDM-2000 • 2-19 synchronization • 3-2, 4-3, 5-3, 6-76
XDM-40 • 2-15 traffic protection • 3-2, 4-3, 5-2, 6-75
XDM-400 • 2-15 XDM shelf capacities • 6-5
XDM-50 • 2-2 XDM-1000 product line • 6-2
XDM-500 • 2-17 Splitter/Coupler Modules • 4-22
Specifications • 3-2, 3-3, 3-4, 3-8, 3-12, Splitter/Coupler Modules for XDM-
3-13, 3-14, 4-2, 4-3, 4-4, 4-5, 4-6, 4- 300/900 • 5-20
13, 4-19, 4-23, 4-27, 4-28, 5-2, 5-3, 5-
Standards and References • A-1
5, 5-6, 5-14, 5-19, 5-21, 5-25, 5-26, 6-
2, 6-5, 6-8, 6-10, 6-23, 6-32, 6-56, 6- STM-1 (155.52 Mbps ±4.6 ppm) I/O
59, 6-60, 6-61, 6-65, 6-73, 6-74, 6-75, Module • 3-5
6-76 STM-1 Electrical • 3-3, 4-5, 5-4, 6-8
auxiliary cards • 6-61 STM-1 Optical • 3-3
cross-connect • 3-2, 4-2, 5-2 STM-1 SFP Optical supervisory channel
cross-connect capacity • 6-75 transceivers for OSC1_2 • 4-21
cross-connect levels • 6-75 STM-1/OC-3 (155.52 Mbps ±4.6 ppm)
I/O Modules • 4-6, 5-6, 6-10
CWDM modules • 4-19, 5-19
STM-1/OC-3 Optical • 4-5, 5-4, 6-9
data cards • 6-23
STM-1/OC-3 SFP Optical Transceivers
data modules • 3-8, 4-13, 5-14
for OMS01_4 • 6-12
DCF/DCM units • 6-60
STM-16/OC-48 (2488.32 Mbps ±4.6
DWDM cards • 6-32 ppm) I/O Modules • 4-10, 5-10, 6-16
electrical, optical and mixed basecard STM-16/OC-48 Optical • 4-5, 5-4, 6-9
information • 6-2
STM-16/OTU1 Optical SFP Line
EMC • 3-13, 4-27, 5-26, 6-73 Transceivers for OMTR27_2 &
environmental conditions • 3-13, 4- OMCM25_4 • 6-53
27, 5-25, 6-73 STM-4 (622 Mbps ±4.6 ppm) I/O Module
I/O interfaces • 3-3, 4-4, 5-3 • 3-6
jitter and wander • 3-2, 4-4, 5-3, 6-76 STM-4 Optical • 3-4
management • 3-4, 4-5, 5-5, 6-74 STM-4/OC-12 (622 Mbps ±4.6 ppm) I/O
miscellaneous accessory modules • 6- Modules • 4-8, 5-8, 6-13
61 STM-4/OC-12 Optical • 4-5, 5-4, 6-9
optical amplifiers • 6-56 STM-4/OC-12 SFP Optical Transceivers
for OMS04_1 • 6-14

STM-64/OC-192 Optical • 5-5, 6-9 Weight • 3-12, 4-23, 5-21, 6-66

Storage (packed) • 3-13, 4-27, 5-25, 6-73 X
Synchronization • 3-2, 4-3, 5-3, 6-76
Synchronization Specifications • 3-2, 4-3, XDM • 1-2, 1-4, 2-57
5-3, 6-76 capabilities • 1-2
cellular capabilities • 1-2
T
control, matrix and I/O cards • 2-57
The Do-It-All MSPP for Up-and-Coming data capabilities • 1-2
NetworksSee XDM-50 • 1-4 optical capabilities • 1-2
TM • 1-4 platforms • 1-4
TMF SDH/SONET capabilities • 1-2
TeleManagement Forum • A-13 XDM MPLS/Ethernet Card Summary • 6-
Traffic Protection • 3-2, 4-3, 5-2, 6-75 22
Traffic Protection Specifications • 3-2, 4- XDM Platforms • 1-4
3, 5-2, 6-75 XDM Shelf Capacities • 6-5
Transponders • 6-39 XDM Shelf Capacities Specifications • 6-
TRP10_4 basecard configurations • 6-43 5
TRP10_4 basecard transceivers • 6-43 XDM Shelf Capacities with HLXC • 6-5
TRP10_4 CWDM OTU2 Line/Client XDM Shelf Capacities with XIO • 6-6
STM-64/10G LAN/FC10/OTU2 XFP XDM Shelf Configurations • 2-2
Optical Transceivers and CMBR40B
XDM® – Intelligent and Scalable Optical
Client Transceivers • 6-49
Networking Platforms • 1-1
TRP10_4 OTU2/OTU2e Line, STM-
XDM-100 • 1-4, 2-3, 2-4, 2-5, 2-6, 2-35,
64/10G LAN/FC10 Client, AoC,
2-36, 2-37, 2-40
CMBR10, TRP10_LAN, TRP10_2B,
OTU2 XFP Line Transceivers and basic shelf • 2-4, 2-35, 2-40
CMBR40B Client Transceivers • 6-51 cards and modules • 2-35
TRP10_4R OTU2/OTU2e/OTU2f expanded shelf • 2-36
Optical Transceivers • 6-50 I/O protection • 2-5
TRP25_2 2.5 Gbps optical nonredundant • 2-5
transmitters/receivers for nonredundant shelf • 2-36
transponders, and transceivers for NVM • 2-6
combiners • 6-54 shelf layout • 2-3
TRP25_2 basecards • 6-39 slot allocation • 2-35
TRP40_2B and CMBR40B XDM-100H • 2-6
configurations • 6-43
XDM-100H shelf • 2-37
TRP40_2B Client Transceiver • 6-55
XDM-100 Card and Module Layout • 2-
TRP40_2B, CMBR40B Line Transceiver 35
• 6-54
U Power Consumption • 4-24, 5-22
Unparalleled Capabilities • 1-2 XDM-100 Shelf Capacity • 4-2
XDM-100 Shelf Layout • 2-3
W XDM-100 Specifications • 4-1
Web Protocol Standards • A-13 XDM-100 with I/O protection • 2-5

XDM-1000 • 1-4, 2-18, 2-52 basic shelf • 2-32

card layout • 2-52 cards and modules • 2-32
cards and modules • 2-52 expanded shelf • 2-33
shelf layout • 2-18 shelf layout • 2-2
XDM-1000 Card Layout • 2-52 slot allocation • 2-32
XDM-1000 Product Line • 6-2 XDM-50 Card and Module Layout • 2-32
specifications • 6-2 XDM-50 Shelf Layout • 2-2
XDM-1000 Shelf Layout • 2-18 XDM-50 Specifications • 3-1
XDM-100H • 2-6 XDM-50 with I/O protection • 2-3
XDM-100H Shelf • 2-37 XDM-500 • 1-4, 2-17, 2-51
XDM-200 • 1-4 card layout • 2-51
XDM-2000 • 1-4, 2-19, 2-54 cards and modules • 2-51
cards and modules • 2-54 shelf layout • 2-17
shelf layout • 2-19 XDM-500 Card Layout • 2-51
XDM-2000 Card Layout • 2-54 XDM-500 Shelf Layout • 2-17
XDM-2000 Shelf Layout • 2-19 XDM-900 Card and Module Layout • 2-
XDM-300 Card and Module Layout • 2- 44
40 XDM-900 Shelf Layout • 2-10
XDM-300 Shelf Layout • 2-6 xFCU • 2-17, 2-18
XDM-300/900 Specifications • 5-1 xFCU4 • 2-15
XDM-3000 • 1-4, 2-20, 2-57 xFCU40 • 2-48
shelf layout • 2-20 xINF • 2-17, 2-18
XDM-3000 card layout • 2-55 xINF4 • 2-15
XDM-3000 Card Layout • 2-55 xINF40 • 2-15
XDM-3000 Shelf Layout • 2-20 XIO192 • 2-49
XDM-40 • 1-4, 2-15, 2-48 XIO192/384F • 2-58
card layout • 2-48 xMCP • 2-49
cards and modules • 2-48 xMCP/xMCP_B • 2-19, 2-51, 2-59
shelf layout • 2-15 xMCP_B • 2-15, 2-48
XDM-40 Card Layout • 2-48
XDM-40, 400, 450, 500, 1000, 2000, and
3000 Specifications • 6-1
XDM-400 • 1-4, 2-15, 2-49
card layout • 2-49
cards and modules • 2-49
shelf layout • 2-15
XDM-50 • 1-4, 2-2, 2-32, 2-33

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XDM®

© Copyright by ECI, 2008-2011. All rights reserved worldwide.

Physical Description ............................................................... 2-1

XDM-50 Specifications ............................................................ 3-1

417006-2009-013-A01 ECI Telecom Ltd. Proprietary i

XDM-100 Specifications .......................................................... 4-1

XDM-300/900 Specifications ................................................... 5-1

XDM-40, 400, 450, 500, 1000, 2000, and 3000

ii ECI Telecom Ltd. Proprietary 417006-2009-013-A01

Data Cards ..................................................................................................... 6-22

Standards and References .................................................... A-1

Index .......................................................................................... I-1

417006-2009-013-A01 ECI Telecom Ltd. Proprietary iii

iv ECI Telecom Ltd. Proprietary 417006-2009-013-A01

417006-2009-013-A01 ECI Telecom Ltd. Proprietary v

Figure 2-31: Two XDM-1000 shelves installed in a 2600 mm ECI

vi ECI Telecom Ltd. Proprietary 417006-2009-013-A01

417006-2009-013-A01 ECI Telecom Ltd. Proprietary vii

viii ECI Telecom Ltd. Proprietary 417006-2009-013-A01

XDM® – Intelligent and Scalable

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 1-1

 Versatility and interoperability – the XDM coexists in perfect harmony

1-2 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

Figure 1-1: Multiservice metropolitan optical network

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 1-3

1-4 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

 XDM®-400 – Aggregator for Metro-Edge Networks – an innovative

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 1-5

 XDM®-3000 – High Capacity Metro-Core MSPP – the 240 Gbps

Figure 1-2: XDM shelves

1-6 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 2-1

XDM Shelf Configurations

XDM-50 Shelf Layout

Basic XDM-50 shelf

Figure 2-1: Basic XDM-50 shelf

2-2 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

XDM-50 with I/O protection

Figure 2-2: XDM-50 with TPU (I/O protection)

XDM-100 Shelf Layout

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 2-3

Basic XDM-100 shelf

Figure 2-3: Basic XDM-100 shelf

2-4 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

XDM-100 with I/O protection

Figure 2-4: XDM-100 with TPU (I/O protection)

NOTE: The nonredundant XDM-100 configuration is not

Figure 2-5: XDM-100 nonredundant configuration

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 2-5

Figure 2-6: XDM-100H with one TPU/OCU shelf

XDM-300 Shelf Layout

2-6 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

Basic XDM-300 shelf

Figure 2-7: Basic XDM-300 shelf, horizontal installation

Figure 2-8: Basic XDM-300 shelf, vertical Installation

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 2-7

Expanded XDM-300 with I/O Protection

Figure 2-9: XDM-300 with TPU on top

2-8 ECI Telecom Ltd. Proprietary 417006-2009-013-A01

Expanded XDM-300 with CWDM Networking

NOTE: An OCU is not supported at the bottom of the

Figure 2-11: XDM-300 with two TPUs and an OCU

417006-2009-013-A01 ECI Telecom Ltd. Proprietary 2-9