Professional Documents
Culture Documents
STD3NK80Z-1, STD3NK80ZT4, STF3NK80Z, STP3NK80Z
STD3NK80Z-1, STD3NK80ZT4, STF3NK80Z, STP3NK80Z
STF3NK80Z, STP3NK80Z
N-channel 800 V, 3.8 Ω typ., 2.5 A SuperMESH™
Power MOSFETs in IPAK, DPAK, TO-220FP, TO-220 packages
Datasheet - production data
Features
Order code VDS RDS(on) max. ID
STD3NK80Z-1 800 V 4.5 Ω 2.5 A
STD3NK80ZT4 800 V 4.5 Ω 2.5 A
STF3NK80Z 800 V 4.5 Ω 2.5 A
STP3NK80Z 800 V 4.5 Ω 2.5 A
Description
These high voltage devices are Zener-protected
N-channel Power MOSFETs developed using the
SuperMESH™ technology by
STMicroelectronics, an optimization of the
well-established PowerMESH™. In addition to a
significant reduction in on-resistance, these
devices are designed to ensure a high level of
dv/dt capability for the most demanding
applications. Such series complements ST's full
range of high voltage MOSFETs including the
revolutionary MDmesh™ products.
Table 1: Device summary
Order code Marking Package Packaging
STD3NK80Z-1 D3NK80Z IPAK Tube
STD3NK80ZT4 D3NK80Z DPAK Tape and reel
STF3NK80Z F3NK80Z TO-220FP Tube
STP3NK80Z P3NK80Z TO-220 Tube
Contents
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
2.1 Electrical characteristics (curves) ...................................................... 6
3 Test circuits ..................................................................................... 9
4 Package information ..................................................................... 10
4.1 IPAK (TO-251) type A package information .................................... 10
4.2 DPAK package information ............................................................. 12
4.2.1 DPAK (TO-252) type A package information ................................... 12
4.2.2 DPAK (TO-252) type C2 package information ................................. 15
4.2.3 DPAK (TO-252) type E package information ................................... 18
4.2.4 DPAK (TO-252) packing information ................................................ 20
4.3 TO-220FP package information ...................................................... 22
4.4 TO-220 package information ........................................................... 24
4.4.1 TO-220 type A package information ................................................. 24
4.4.2 TO-220 type H package information ................................................ 26
1 Electrical ratings
Table 2: Absolute maximum ratings
Value
Notes:
(1)This value is limited by package.
(2)Pulse width is limited by safe operating area.
(3)I
SD ≤ 2.5 A, di/dt ≤ 200 A/μs, VDS(peak) < V(BR)DSS, VDD = 640 V
Notes:
(1)When mounted on FR-4 board of 1 inch², 2 oz Cu.
2 Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 5: On /off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
Drain-source breakdown
V(BR)DSS VGS = 0 V, ID = 1 mA 800 V
voltage
VGS = 0 V, VDS = 800 V 1 µA
Zero gate voltage drain
IDSS VGS = 0 V, VDS = 800 V,
current 50 µA
TC = 125 °C(1)
IGSS Gate-body leakage current VDS = 0 V, VGS = ±20 V ±10 µA
VGS(th) Gate threshold voltage VDS = VGS, ID = 50 µA 3 3.75 4.5 V
Static drain-source
RDS(on) VGS = 10 V, ID = 1.25 A 3.8 4.5 Ω
on- resistance
Notes:
(1)Defined by design, not subject to production test.
Table 6: Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance - 485 - pF
VGS = 0 V, VDS = 25 V,
Coss Output capacitance - 57 - pF
f = 1 MHz
Crss Reverse transfer capacitance - 11 - pF
Coss eq(1) Equivalent output capacitance VGS = 0 V, VDS = 0 to 640 V - 22 - pF
Qg Total gate charge VDD = 640 V, ID = 2.5 A, - 19 - nC
Qgs Gate-source charge VGS = 0 to 10 V - 3.2 - nC
(see Figure 17: "Test circuit
Qgd Gate-drain charge for gate charge behavior") - 10.8 - nC
Notes:
(1)C is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS
oss eq
increases from 0 to 80%
Notes:
(1)Pulsed: pulse duration = 300 μs, duty cycle 1.5%.
(2)Pulse width is limited by safe operating area.
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection, thus eliminating the need for additional external componentry.
δ = 0.2
δ = 0.1
10-1
ZZthth == kk R
Rthj-C
thj-C
δδ == ttp // Ƭ
Ƭ
p
δ = 0.05
δ = 0.02
δ = 0.01 tp
SINGLE PULSE ƬƬ
10-2
10-5 10-4 10-3 10-2 10-1 tp(s)
Figure 4: Safe operating area for TO-220FP Figure 5: Thermal impedance for TO-220FP
Figure 10: Capacitance variations Figure 11: Normalized gate threshold voltage
vs. temperature
Figure 12: Normalized on-resistance vs. Figure 13: Source-drain diode forward
temperature characteristics
3 Test circuits
Figure 16: Test circuit for resistive load Figure 17: Test circuit for gate charge
switching times behavior
Figure 18: Test circuit for inductive load Figure 19: Unclamped inductive load test
switching and diode recovery times circuit
Figure 20: Unclamped inductive waveform Figure 21: Switching time waveform
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
0068772_C2_22
FP_0068772_22
Figure 28: DPAK (TO-252) type E recommended footprint (dimensions are in mm)
7012510_Rev_12_B
0015988_H_21
5 Revision history
Table 18: Document revision history
Date Revision Changes
09-Sep-2004 3 Complete document
10-Aug-2006 4 New template, no content change
26-Feb-2009 5 Updated mechanical data
07-Sep-2009 6 VESD(G-S) value has been corrected
Updated Section 1: "Electrical ratings", Section 2: "Electrical
06-Apr-2017 7 characteristics" and Section 4: "Package information".
Minor text changes
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
Authorized Distributor
STMicroelectronics:
STD3NK80ZT4 STF3NK80Z STP3NK80Z STD3NK80Z-1