[MUSIC] Hi and welcome back.

In today's module, we're going to go

over temperature effects in unit one and specifically we're going
to talk about the CTE or the Coefficient of Thermal Expansion. So the learning
objective or outcome for this module is to understand
how important the CTE, or coefficient of thermal expansion
is in material selection and design. If you've never solved
a CTE problem before this lecture is on the applications of
CTEs and I'm going to assume that you've already been introduced to
the coefficient of thermal expansion. So if the equation,
strain is equal to the CTE times delta T is not familiar to you
then you should go ahead and go on back to the mechanics of
materials lectures by Dr. Whiteman and check out his lectures
on the CTE here on this slide. So we're going to start off
with a case study of a design. Here we have a microelectronic package,
so this is a small package that will eventually be attached either
in a series or to a board and together, they'll be some
type of computing for, it could be a plane, or
a car ,or a satellite. They're used all over in mechanical and
electrical designs. So in this microelectronic
package we have a housing, which is essentially going to
hold all the components together. And then we have a substrate, and on top
of that substrate there will be a number of electrical components such as
resistors, and transistors and capacitors, and also chips, or
semi-conductor chips, also called a die. And so there's some really interesting
design problems that happen here. And actually, a lot of mechanical
engineers will go into this field. So this specific package is a design
that you might see in space flight. We have a silicon semiconductor chip. It's
mounted on top of an alumina
substrate that will typically have gold metallization on top of it,
so a thin film metallization. And then that is attached
to the 6061 housing. And for space flight devices,
they have to go through a thermal cycle where the device is put at
a really cold temperature and then goes up to a really high temperature. And this
device might see something
like -40C to 120C in thermal cycle. And so the question is an experienced
engineer will look at this design and they'll immediately see an issue. They will
immediately have a concern and
my question is what is this concern? And that's what today's lecture is all about.
So the coefficient of thermal
expansion is essentially it measures how the material will behave as
temperature increases or decreases. So for example, most metals will expand
and contract based on expanding in heat and contracting at cold and
Alpha is a measurement of that. So the notation for the coefficient
of thermal expansion is Alpha. The units are 1/K or 1/C or 1/F. And the general
equation is that
your strain, either in the x, y or z direction, is equal to Alpha Delta T. So
epsilon is equal to alpha delta T, where delta T is your
change in temperature. Just a reminder that your strain
is equal to your change in length over your initial length. So really, your
equation ends at being
the total amount of expansion that delta change in length that you'll see over the
initial length is equal to Alpha delta T. So here are some values of
the coefficient of thermal expansion for a number of materials and
what you can see here is that for most metals,
they expand a relatively large amount. They have numbers that are in the 20s or
in the high 10s. Ceramics tend not to expand very much
their numbers are generally lower. And then Polymers tend to expand the most. So
some of the polymers will
be well up into the hundreds. So if we look at the materials
we were seeing in the design, we had aluminum, alumina,
which is the ceramic substrate, so alumina is not aluminum it's
a ceramic Al2 O3, I think. And then we have silicon. And so if we were to go ahead
and, look at these numbers what we would see, is that the silicon chip is right
at around, has a CTE of about 2.6. The alumina substrate, or
just I'm going to call it the substrate has a CTE of 7.6 and
the housing has CTE of 23.6. And what this means is that
they are going to contract and expand at different rates. When they go at hot
they'll expand out and when they go down to cold
they'll contract less. And so the aluminum is going to want to
expand almost three times as much as the substrate and the substrate is going to
want to expand
almost three times as much as the silicon. So there's this expansion and
contraction that's going to occur and if these materials are fused together
there's going to be some problems. So let's take a look and
see what these problems will look like. So just a reminder, we're going to look
at a lot of different temperatures. So a lot of different CTE calculations
have to be done on an assembly, both to make sure they can withstand
the temperature of assembly and testing. And sometimes the testing temperatures
are manufacturability tests and sometimes the testing temperatures are to simulate
the actual design environment
that the component will see. And then it will also have to go
through temp in transportation and storage and then on operation. And so all of
these tie into what
temperatures you choose to measure when you look at a CTE problem. So let's go back
to our
microelectronics problem. Here we're going to simplify it because
it's going to get a little complicated. This problem's difficult to run and
just hand calc so we're going to use an ANSYS
model to look at it. And so we've simplified it down to
just the 6061 aluminum housing, which we have here. And then the substrate on top.
And so what you can see is
the ANSYS model here and we have the big block at the bottom
is the aluminum housing and then we've put this tiny substrate on top. And we've
assumed that they're
essentially fused together by boundary conditions that have been created
between the substrate and the housing. And so now let's run the model and see what
happens at temperature
when we increase the temperature. So we're going to go up
to 120 degrees Celsius. And this is a model showing
the deformation that's occurring. So total deformation and its how much each point
is
deforming from its original place. And what we see down
here on the bottom is, each corner of the housing is
getting pushed out, which makes sense. And it's getting pushed out
about 0.006 inches, so this point is moving over 0.006 and
this point is moving over 0.006. And then what's interesting,
we can see on the substrate is just the bottom is getting pulled by
the aluminum which makes sense, right? So the substrate doesn't want to expand as
much as the aluminum does because its CTE is lower. But the aluminum is pulling
that substrate out and that's where we start to
see problems in the design. So here if we wanted to see
the deformation of the substrate here we flipped the substrate over so
this is the bottom and this is the top. And you can see the deformation
of the substrate. So the substrate's getting
pulled about 0.0002 inches here in both directions,
here and here. And so let's take a look, and now that
we've seen essentially the deformation that's happening,
we can take a look at the stresses. And what's not too surprising is
that we're seeing very high stresses on the aluminum housing
right around the substrate is where we see the highest
stresses right around Nine KSI. And then if we look over at the substrate,
remember it's still flipped upside down, so actually this surface is the one
that's fused to the housing. We can see there's, there's very high
stresses at the edges, where the substrate is getting pulled out, of 73
KSI which is significant. And then the stresses at the top where
the substrate isn't feeling that pull from the aluminium housing are pretty
minimal all the way down in general. And then what we see happening, so
these are the normal stresses and you can actually get fairly
close to this model for calculating the substrate using some
hand calcs, not perfectly close. But what's difficult to do in the hand
calcs is then to include the shear. So now we're looking at
the equivalent stresses, so this is, we'll learn about von Mises stresses
a little bit later in this class, but these are the stresses that account for
both the normal stresses and the shear stresses happening so
you can see they're a little bit higher. Again on the housing we are seeing
an equivalent stress of about 15 ksi and then on the substrate we are seeing
an equivalent stress of about 80 ksi. And when we look at the ultimate strength
of the substrate we can see that it's only 36 ksi, so our stress is well above the
strength of the substrate
which is always a bad sign, right? So this is actually a very common design. And we
can see here there's
a pretty big issue. So let's see how they fix it. So right now, we're in the danger
zone. Let's take a look at this design. So again, we have this chip mounted
to a substrate to the housing and the housing has a higher CTE so
it's expanding more than the substrate. The substrate has a higher CTE, so
it's expanding more than the chip. And instead of mounting them
directly together or fusing them or using, in some case special
solders to fuse these. What they do is they use an epoxy,
it's called 965-1L. There's a couple of
other epoxies that work. This one happens to be conductive so if you need a ground,
it's the one they typically use. And so
965-1L has a modulus of 5 gigapascals, and aluminum has a modulus of 70,
alumina has a modulus of 300, and silicon has a modulus
of 137 gigapascals. So what that means is the aluminum,
the alumina, and silicon are quite stiff
compare to the epoxy. And the epoxy can absorb
the differences in change. So it acts almost like a rubber band and
allows the aluminum to expand out but it allows the substrate to stay put. And it
allows the silicon chip to
stay put while the substrate expands out a little bit. So it absorbs those changes
in
deformation and provides a safe design. So that's one way engineers
fix a CTE mismatch problem. So that's it for today's lecture and
this ties up unit one. In unit two we'll talk a lot more about
stresses and static failure theories. And we'll get into what those von Mises or
equivalent stresses are that we
saw earlier in this lecture. See you next time. [MUSIC]