Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

General Description Features

The AP3502 is a 340kHz fixed frequency, current • Input Voltage Range: 4.5V to 18V
mode, PWM synchronous buck (step-down) DC-DC • Fixed 340kHz Frequency
converter, capable of driving a 2A load with high • High Efficiency: up to 95%
efficiency, excellent line and load regulation. The • Output Current: 2A
device integrates N-channel power MOSFET • Current Mode Control
switches with low on-resistance. Current mode • Built-in Over Current Protection
control provides fast transient response and • Built-in Thermal Shutdown Function
cycle-by-cycle current limit. • Built-in UVLO Function
• Built-in Over Voltage Protection
The AP3502 employs complete protection to ensure • Programmable Soft-start
system security, including output Over Voltage
Protection, input Under Voltage LockOut,
programmable soft-start, and Over Temperature Applications
Protection.
• LCD TV
This IC is available in SOIC-8 package. • Set Top Box
• Portable DVD
• Digital Photo Frame

SOIC-8

Figure 1. Package Type of AP3502

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

1
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Pin Configuration

M Package
(SOIC-8)

BS 1 8 SS

IN 2 7 EN

SW 3 6 COMP

GND 4 5 FB

Figure 2. Pin Configuration of AP3502 (Top View)

Pin Description
Pin Number Pin Name Function
Bootstrap pin. A bootstrap capacitor is connected between the BS pin
1 BS and SW pin. The voltage across the bootstrap capacitor drives the
internal high-side power MOSFET
2 Supply power input pin. A capacitor should be connected between the
IN
IN pin and GND pin to keep the input voltage constant
3 Power switch output pin. This pin is connected to the inductor and
SW
bootstrap capacitor
4 GND Ground pin
Feedback pin. This pin is connected to an external resistor divider to
program the system output voltage. When the FB pin voltage exceeds
5 FB 1.1V, the over voltage protection is triggered. When the FB pin
voltage is below 0.3V, the oscillator frequency is lowered to realize
short circuit protection
Compensation pin. This pin is the output of the transconductance
error amplifier and the input to the current comparator. It is used to
6 COMP compensate the control loop. Connect a series RC network from this
pin to GND. In some cases, an additional capacitor from this pin to
GND pin is required
Control input pin. EN is a digital input that turns the regulator on or
7 EN off. Drive EN high/low to turn on/off the regulator. Pull up with
100kΩ resistor for automatic startup
Soft-start control input pin. SS controls the soft-start period. Connect
8 a capacitor from SS to GND to set the soft-start period. A 0.1µF
SS
capacitor sets the soft-start period to 15ms. To disable the soft-start
feature, leave SS unconnected

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

2
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Functional Block Diagram

2
IN
SHUTDOWN
1.5V COMPARATOR
VA
INTERNAL
REGULATOR VB CURRENT
SLOP SENSE VA
COMP
AMPLIFIER +
0.3V
OSCILLATOR
SCP
90 k/340k 1
BS
M1
CLK
S Q

LOCK R Q 3
7 COMPARATOR PWM
SW
EN COMPARATOR
M2

2.5V
VB
1.1V 4
GND
6 A
8
SS EA

5 0. 925V 6

FB COMP

Figure 3. Functional Block Diagram of AP3502

Ordering Information
AP3502 -

Circuit Type G1: Green

Package
M: SOIC-8 TR: Tape & Reel
Blank: Tube

Temperature
Package Part Number Marking ID Packing Type
Range
AP3502M-G1 3502M-G1 Tube
SOIC-8 -40 to 85°C
AP3502MTR-G1 3502M-G1 Tape & Reel

BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and green.

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

3
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Absolute Maximum Ratings (Note 1)

Parameter Symbol Value Unit

IN Pin Voltage VIN -0.3 to 20 V
EN Pin Voltage VEN -0.3 to VIN V
SW Pin Voltage VSW 21 V
BS Pin Voltage VBS -0.3 to VSW+6 V
FB Pin Voltage VFB -0.3 to 6 V
COMP Pin Voltage VCOMP -0.3 to 6 V
SS Pin Voltage VSS -0.3 to 6 V
Thermal Resistance θJA 105 ºC/W
Operating Junction Temperature TJ 150 ºC
Storage Temperature TSTG -65 to 150 ºC
Lead Temperature (Soldering, 10sec) TLEAD 260 ºC
ESD (Human Body Model) VHBM 2000 V
ESD (Machine Model) VMM 200 V

Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Input Voltage VIN 4.5 18 V
Operating Ambient Temperature TA -40 85 ºC

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

4
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Electrical Characteristics
TA=25ºC, VIN=VEN=12V, VOUT=3.3V, unless otherwise specified.
Parameter Symbol Conditions Min Typ Max Unit
SUPPLY VOLTAGE (IN PIN)
Input Voltage VIN 4.5 18 V
Quiescent Current IQ VFB=1V,VEN=3V 1.2 1.4 mA
Shutdown Supply Current ISHDN VEN=0V 0.1 10 µA
UNDER VOLTAGE LOCKOUT
Input UVLO Threshold VUVLO VIN Rising 3.65 4.00 4.25 V
Input UVLO Hysteresis VHYS 200 mV
ENABLE (EN PIN)
EN Shutdown Threshold Voltage 1.1 1.5 2 V
EN Shutdown Threshold Voltage Hysteresis
350 mV
(Note 2)
EN Lockout Threshold Voltage 2.2 2.5 2.7 V
EN Lockout Hysteresis 210 mV
VOLTAGE REFERENCE (FB PIN)
Feedback Voltage VFB 0.907 0.925 0.943 V
Feedback Over Voltage Threshold VFBOV 1.1 V
Feedback Bias Current IFB VFB=1V -0.1 0.1 µA
MOSFET
High-side Switch On-resistance(Note 3) RDSONH ISW=0.2A/0.7A 100 mΩ
Low-side Switch On-resistance(Note 3) RDSONL ISW=-0.2A/-0.7A 100 mΩ
CURRENT LIMIT
High-side Switch Leakage Current ILEAKH VIN=18V,VEN=VSW=0V 0.1 10 µA
High-side Switch Current Limit ILIMH 2.7 3.5 A
Low-side Switch Current Limit ILIML From Drain to Source 1.4 A
SWITCHING REGULATOR
Oscillator Frequency fOSC1 280 340 400 kHz
Short Circuit Oscillator Frequency fOSC2 90 kHz
Max. Duty Cycle DMAX VFB=0.85V 90 %
Min. Duty Cycle DMIN VFB=1V 0 %
ERROR AMPLIFIER
Error Amplifier Voltage Gain (Note 2) AEA 400 V/V
Error Amplifier Transconductance GEA 800 µA/V
COMP to Current Sense Transconductance GCS 3.5 A/V
THERMAL SHUTDOWN
Thermal Shutdown (Note 2) TOTSD 160 ºC
Thermal Shutdown Hysteresis (Note 2) THYS 30 ºC
SOFT START (SS PIN)
Soft-start Time (Note 2) tSS CSS=0.1µF 15 ms
Soft-start Current VSS=0V 6 µA
Note 2: Not tested, guaranteed by design.
VSW1 - VSW2
Note 3: RDSON= .
ISW1 - ISW2

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

5
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Typical Performance Characteristics

TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.

100 1.4

90
1.3

80

Quiescent Current (mA)

1.2
Efficiency (%)

70

60
1.1

o
50 VOUT=3.3V, L=10µH, TA=25 C
VIN=5V
1.0
40
VIN=12V

30 0.9
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 -50 -25 0 25 50 75 100 125 150
o
Output Current (A) Case Temperature ( C)

Figure 4. Efficiency vs. Output Current Figure 5. Quiescent Current vs. Case Temperature

1.2
3.6

1.1
3.5
Feedback Voltage (V)

1.0
3.4
Output Voltage (V)

0.9
3.3

0.8 3.2

0.7 3.1

0.6 3.0
-50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
o
Case Temperature ( C) Output Current (A)

Figure 6. Feedback Voltage vs. Case Temperature Figure 7. Output Voltage vs. Output Current

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

6
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Typical Performance Characteristics (Continued)

TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.

200 160

180
High-side Switch On-resistance (mΩ)

Low-side Switch On-resistance (mΩ)

140
160

120
140

120 100

100
80
80

60
60

40 40
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
o o
Case Temperature ( C) Case Temperature ( C)

Figure 8. High-side Switch On-resistance Figure 9. Low-side Switch On-resistance

vs. Case Temperature vs. Case Temperature

VIN_AC
200mV/div
VOUT_AC VOUT_AC
20mV/div 100mV/div

IL
1A/div IOUT
VSW 1A/div
10V/div

Time 2µs/div Time 200µs/div

Figure 10. Output Ripple (IOUT=2A) Figure 11. Load Transient (IOUT =1A to 2A)

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

7
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Typical Performance Characteristics (Continued)

TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted.

VEN VEN
2V/div 2V/div
VSS VSS
2V/div 2V/div
VOUT VOUT
2V/div 2V/div
IL IL
1A/div 1A/div

Time 10ms/div Time 200µs/div

Figure 12. Enable Turn on Characteristic Figure 13. Enable Turn off Characteristic
(VIN=12V, VEN=3.3V, VOUT=3.3V, IL=2A) (VIN=12V, VEN=3.3V, VOUT=3.3V, IL=2A)

VOUT
2V/div
VOUT
2V/div

IL
2A/div IL
2A/div

Time 40µs/div Time 40µs/div

Figure 14. Short Circuit Protection (IOUT=0A) Figure 15. Short Circuit Recovery (IOUT=0A)

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

8
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Typical Application

Input Voltage=12V

R4
C11
100k
10µF/25V

1 8
BS SS

AP3502
C5
2 7 0.1µF
C4 IN EN
L 10µH 10nF C6
Output Voltage=3.3V Optional
3 6
SW COMP
C3 R3
4 5 4.7nF 13k
GND FB
R2 10k
C21 C22
22µF/25V 22µF/25V
D1 R1
Optional 26.1k

Figure 16. Typical Application of AP3502

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

9
 Data Sheet

340kHz, 2A Synchronous DC-DC Buck Converter AP3502

Mechanical Dimensions

SOIC-8 Unit: mm(inch)

4.700(0.185) 0.320(0.013)
5.100(0.201) 1.350(0.053)
7° 1.750(0.069)
8°

7° 8°
0.675(0.027)
D
0.725(0.029) 5.800(0.228)
1.270(0.050) 6.200(0.244)
TYP
D
20:1
0.100(0.004) 0.800(0.031)
R0.150(0.006)

0.300(0.012)
0.200(0.008)

0°
8°
1.000(0.039)
3.800(0.150)
4.000(0.157)

0.190(0.007) 1°
0.330(0.013) 0.250(0.010) 5°
0.510(0.020)
0.900(0.035) R0.150(0.006)
0.450(0.017)
0.800(0.031)

Note: Eject hole, oriented hole and mold mark is optional.

May. 2012 Rev. 1. 9 BCD Semiconductor Manufacturing Limited

10
 BCD Semiconductor Manufacturing Limited

http://www.bcdsemi.com

IMPORTANT NOTICE
IMPORTANT NOTICE

BCD Semiconductor
BCD Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products oror specifi-
specifi-
cations herein.
cations herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular purpose,
particular purpose, nor
nor does
does BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of any
of any its
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey anyany license
license under
under its
its patent
patent rights
rights or
or
other rights
other rights nor
nor the
the rights
rights of
of others.
others.

MAIN SITE
MAIN SITE
- Headquarters
BCD Semiconductor Manufacturing Limited - Wafer
BCD FabSemiconductor Manufacturing Limited
BCD Semiconductor
- Wafer Fab Manufacturing Limited Shanghai SIM-BCD
- IC Design GroupSemiconductor Manufacturing Co., Ltd.
No. 1600, Zi
Shanghai Xing Road,
SIM-BCD Shanghai ZiZhu
Semiconductor Science-basedLimited
Manufacturing Industrial Park, 200241, China 800 Yi Shan Road,
Advanced Shanghai
Analog 200233,
Circuits China Corporation
(Shanghai)
Tel:
800,+86-21-24162266, Fax: +86-21-24162277
Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491,YiFax:
8F, Zone B, 900, Shan+86-21-5450 0008200233, China
Road, Shanghai
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL Taiwan Office USA Office
Shanghai
Shenzhen SIM-BCD
Office Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan
Semiconductor
Office (Taiwan) Company Limited BCD Office
USA Semiconductor Corp.
Unit A Room
Shanghai 1203, Skyworth
SIM-BCD Bldg., Gaoxin
Semiconductor Ave.1.S., Nanshan
Manufacturing Co., Ltd.District,
Shenzhen Shenzhen,
Office 4F, 298-1,
BCDRui Guang Road,(Taiwan)
Semiconductor Nei-Hu District,
Company Taipei,
Limited 30920Semiconductor
BCD Huntwood Ave.Corporation
Hayward,
China
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Taiwan4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, CA 94544,
30920 USA Ave. Hayward,
Huntwood
Tel:
Room +86-755-8826
E, 5F, Noble 7951 Tel: +886-2-2656
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan 2808 Tel :94544,
CA +1-510-324-2988
U.S.A
Fax: +86-755-88267951
Tel: +86-755-8826 7865 Fax: +886-2-2656 28062808
Tel: +886-2-2656 Fax:: +1-510-324-2988
Tel +1-510-324-2788
Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 Fax: +1-510-324-2788