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QW-461 Positions
QW-470 ETCHING PROCESS AND REAGENTS
QW-471 General
Etching solutions suitable for carbon and low alloy steels, together with directions for their
use, are suggested in QW-472.1 through QW-472.4.
Hydrochloric (muriatic) acid and water, equal parts, by volume. The solution should
be kept at or near the boiling temperature during the etching process. The specimens
are to be immersed in the solution for a sufficient period of time to reveal all lack of
soundness that might exist at their cross‐sectional surfaces.
One part of ammonium persulfate to nine parts of water, by weight. The solution
should be used at room temperature, and should be applied by vigorously rubbing the
surface to be etched with a piece of cotton saturated with the solution. The etching
process should be continued until there is a clear definition of the structure in the
weld.
One part of powdered iodine (solid form), two parts of powdered potassium iodide,
and ten parts of water, all by weight. The solution should be used at room
temperature, and brushed on the surface to be etched until there is a clear definition or
outline of the weld.
One part of nitric acid and three parts of water, by volume. The solution may be used
at room temperature and applied to the surface to be etched with a glass stirring rod.
The specimens may also be placed in a boiling solution of the acid, but the work
should be done in a well‐ventilated room. The etching process should be continued for
a sufficient period of time to reveal all lack of soundness that might exist at the cross‐
sectional surfaces of the weld.