Professional Documents
Culture Documents
Lect 1 Intro - 2020 PDF
Lect 1 Intro - 2020 PDF
Physics of Microfabrication:
Front End Processing
3
579 and you
Research: electronic/optoelectronic
materials and devices, solar cells,
MEMS, circuit design, nanotubes,
nanowires etc.
4
Local industry
5
Si ICs (chips): an Intel processor
6
Si chips: an Intel six-core processor
Integrated circuits (IC) =chip One die
Source: https://en.wikichip.org/wiki/intel/microarchitectures/coffee_lake 7
Interconnects and MOSFETs
~109 MOSFETs
Metal-oxide-semiconductor-field-effect-transistor
8
Important device -- MOSFET
Poly Si
or metal
spacer spacer
Metal Metal
contact contact
Oxide/dielectric materials
30nm
Si
9
Cross Section Transmission Electron Micrograph
of a Si MOSFET
Gate oxide
Gate length
11
MOS structure: planar MOSFET vs. FinFET
https://semiengineering.com/racing-to-
107nm/
12
We Will Learn About
Distance (nm)
-100 0 100
σxx (dynes/cm2)
100
Distance (nm)
0
Si
350 – 450 MPa
-100
T. Ghani, et al.,
IEDM 2003 (Intel)
SUPREM IV Simulation
MOS Fabrication
Stress simulation
Diffusion
13
Syllabus
14
Grading and projects
Grading:
40% homework
25% midterm exam
35% final term project
The final grade will also take into account non-numerical assessments of
your command of the material. In addition, attendance and in-class
participation will be factored into the final letter grade when it falls near
a grade boundary.
15
Text and references
◼ Journals/Conference Proceedings:
IEEE Transactions on Electron Devices (published monthly)
Applied Physics Letters
Journal of Applied Physics
IEEE IEDM Conference Proceedings, published each December
16
Goals and Outcomes
17
Semiconductor industry
overview
60 years of semiconductor industry
1960s
23
24
25
6.8%
72%
26
27
28
Technology nodes
Technology node is commonly represented by the critical dimension of a MOSFET
Gate
100000length of a MOSFET is the critical dimension. 10
Fab Cost ($M)
Linewidth (nm)
10000
Linewidth (um)
Fab Cost ($M)
1000
100
0.1
10
29
A typical R&D cleanroom
http://www.ihp-microelectronics.com/126.0.html 30
Vidoe: inside an Intel cleanroom facility
Unit process,
Integration,
Device
Material scientists
TCAD engineers
Circuit designers
TCAD=technology CAD
System design,
verification etc.
Intel Micron Flash Technologies, dry etch area Multiple levels of
FOUP= Front Opening Unified Pod simulations.
Source: http://www.legitreviews.com/article/1179/2/
31
Industry cleanroom fabrication facility
32
Semicondutor basics
Semiconductors
Source: http://media.web.britannica.com/eb-media/07/207-004-2B66F205.gif
34
Why semiconductor materials?
35
Major semiconductor materials in periodic
table
Dominant materials: Si
36
Major semiconductors
InP, InAs,
InSb
AlGaAs,
GaAsP
Dominant materials: Si
Si based devices occupy 93% of semiconductor market in 2004
GaAs, AlAs – important for optical devices
37
Uniqueness and advantages of Si
◼ abundance
2ndrichest element on earth -- 25.7% earth crust by
weight
High quality single crystal
38
Si: covalent bonds
39
Si diamond lattice structure
a=5.43 angstrom
40
CMOS operation and digital
circuits
Video: how transistors work
http://www.youtube.com/watch?v=QO5FgM7MLGg
&feature=related
MOSFETs
SiGe SiGe
~30
nm
Source: Intel Technology Journal v.12, 2008 “45nm High-k+Metal Gate Strain-Enhanced
Transistors” by C. Auth et al.
• MOSFETs are made from: Si, poly-Si, SiO2, Si3N4, SiGe, and metals.
• Stress enhances device performance.
• Stress is introduced by SiGe pockets.
43
Mainstream MOSFETs structure and
materials
1)
3)
2)
Poly-Si
4) Body terminal
p-channel MOSFET
• Body – Si
• Gate - Polycrystalline Si (traditional), TiN
(state-of-the-art)
• Source & Drain – highly doped SiGe or Si
Metal Metal
contact contact
Oxide/dielectric materials
30nm
Si
45
Important materials/elements in a
MOSFET
◼ Substrate: Si
◼ Metals for contact and interconnects: Cu,
Ti etc.
◼ Insulators: SiO2, Si3N4,
◼ Doping elements: B, In, As, P, Sb
Source and drains are heavily doped to work
like to conductors
46
p-n junction (diode)
47
48
Low V High V
Electron channel
High V Low V
p p p hole channel p
n
n
50
nMOS Operation
1
n+ n+
S D
p bulk Si
51
pMOS Transistor
p+ p+
n bulk Si
52
Transistors as Switches
d d d
nMOS g OFF
ON
s s s
d d d
pMOS g OFF
ON
s s s
53
CMOS Inverter
A Y VDD
0
1
A Y
CL
A Y
GND
54
CMOS Inverter
A Y VDD
0
1 0 OFF
A=1 Y=0
ON
A Y
GND
55
CMOS Inverter
A Y VDD
0 1
1 0 ON
A=0 Y=1
OFF
A Y
GND
56
CMOS NAND Gate
A B Y
0 0
0 1 Y
1 0 A
1 1
B
Y = A• B = A + B
57
CMOS NAND Gate
A B Y
0 0 1 ON ON
0 1 Y=1
A=0
1 0 OFF
1 1 B=0
OFF
58
CMOS NAND Gate
A B Y
0 0 1 OFF ON
0 1 1 Y=1
A=0
1 0 OFF
1 1 B=1
ON
59
CMOS NAND Gate
A B Y
0 0 1 ON OFF
0 1 1 Y=1
A=1
1 0 1 ON
1 1 B=0
OFF
60
CMOS NAND Gate
A B Y
0 0 1 OFF OFF
0 1 1 Y=0
A=1
1 0 1 ON
1 1 0 B=1
ON
61
Assignment this week – due next Friday
lecture time
1. Find a video or a paper or an article to share on MOSFETs such as
new structures, technologies, applications, fabrication schemes.
Resources:
IEDM – a conference with most recent research results, useful to find
magazine articles about IEDM.
TechInsights.com (previously chipworks) – a reverse engineering company,
which publishes tear-down reports of most recent IC and MOSFETs etc.
2. Give me the link and a summary of what you learn and what you don’t
understand and want to find out. 1-2 page long. Tables and bullets are
easier to read. Please do some research first on what you don’t
understand and then we can discuss in class.
62
Summary and Reading
◼ Summary:
Introduction of semiconductor industry
Importance of MOSFET
MOSFET structure and operation basics
Qualitative description of a complete CMOS process.
◼ Reading:
Plummer chapter 1
63