MCM12 ASM

AUTOMATIC MULTI-CHIP
MODULE BONDER

ASM
ASM provides
provides you you thethe latest
latest multi-chip
multi-chip modules
modules
packaging
packaging solution – MCM12 for the high precision die
solution – MCM12 for the high precision die
bonding,
bonding, flip-chip
flip-chip bonding
bonding withwith upup toto 12-inch
12-inch wafer
wafer
handling
handling capability
capability and
and SMD
SMD bonding.
bonding. ItIt isis highly
highly flexible
flexible
in
in handling
handling wide
wide range
range of of die
die sizes
sizes and and substrates.
substrates.
Package
Package conversion
conversion can can be be carried
carried outout easily.
easily. The
The
MCM12
MCM12 isis equipped
equipped with
with reliable,
reliable, large
large areaarea bonding
bonding //
dispensing
dispensing system,
system, automatic
automatic collets
collets and
and ejecting
ejecting tools
tools
changing
changing system, patented gantry design, and high
system, patented gantry design, and high speed
speed
Eagle
Eagle PRS
PRS inspection
inspection system.
system.

◆ Supporting various bonding processes ◆ Suitable for various materials handling

 Direct die bonding  Automatic input magazine handling system
 High precision die bonding  Chip tray handling capability
 Flux dispensing / dipping flip chip bonding  Up to 14 tools changing system
 SMD bonding  Wide range of die sizes handling with multiple ejecting
 Wafer to wafer bonding carousel system
 Thin die bonding  Multiple epoxy type handling capability with auxiliary
 And more…… dispensing station, and more……

Excellent Flexibilities

After dispensing

After die bonding

One stop solution for various die sizes handling Chip tray handling capability Flux dipping process

Flip chip bonding capability Up to 14 tools changing system Epoxy stamping process

* All performance is package and materials dependent

 Specifications
System Capability* Automatic Inputting / Outputting System
Magazine size
Direct die bonding
Length
XY placement ± 1 mil (± 25 μm) @ 3 sigma
Standard 60 – 280 mm
Die rotation ± 1 @ 3 sigma
Option 110 – 340 mm
Cycle time 900ms (with auxiliary dispensing station)
Width
Standard 15 – 120 mm
Flip chip bonding
Option 30 – 220 mm
XY placement ± 0.4 mil (± 10 μm) @ 3 sigma
Height
Die rotation ± 0.05 @ 3 sigma
Standard 70 – 190 mm
Cycle time 1 s (without dipping)
Option 70 – 250 mm
1.4 s (with dipping)
Stacking loading system
Material Handling System Stacking height Up to 95 mm

Wafer size Up to 12” wafer (standard) Bond Head System

6” / 8” wafer (option)
Die size Bonding collet Surface pick type
Die attach 6 x 6 – 2,000 x 2,000 mil Bond force
(0.15 x 0.15 – 50 x 50 mm) Direct die attach Up to 400 gf (standard)
Flip chip 32 x 32 – 2,000 x 2,000 mil Up to 3,000 gf (option)
0.80 x 0.80 – 50 x 50 mm Flip chip (option) Up to 800 gf (standard)
Die thickness 4 – 200 mil (0.1 – 5 mm) Up to 2 kgf or 5 kgf (option)

Substrate type BGA, boat, ceramic, flex substrate, FR4, Multiple Chip Ejecting Carrousel System
leadframe, wafer
No. of ejecting tools Up to 5
Substrate size Ejecting pin height Up to 1.4 mm (programmable)
Length 110 – 330 mm
Width 25 – 210 mm
Thickness Up to 3 mm
Automatic Tools Changing System
No. of picking tools Up to 6 (standard)
Option Up to 14 (option)
Tray type Waffle pak / gel pak
Tray size 2” / 3” / 4”
Die thickness 4 – 200 mil (0.1 – 5 mm)
Pattern Recognition System
PR System 256 grey levels
SMD modules Angle tolerance  10
Standard Up to 5
Option Up to 6 Facilities Required
Tape width 8 mm
Roll diameter Up to 7” Voltage 100 – 240 VAC
Components size 0.5 – limit of 8 mm tape Frequency 50/60 Hz (pre-set at factory)
Components thickness Up to 0.254 mm Compressed air Min. 4 bar
Air consumption 250 LPM x 2
Substrate size for automatic stack loading system Power consumption 2,500 W
Length 60 – 260 mm
Width 12.5 – 75 mm Dimensions and Weight (Basic Bonder)
Thickness Up to 3 mm
LxWxH 1,120 x 1,460 x 1,398 mm
Net weight 3,740 lb (1,700 kg)

Technical details are subject to change without prior notice

* All performance is package dependent

ASM
For further information, please contact our regional offices
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