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  • Solder Joint Strength Test

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    Venkateswaran venkateswaran
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    This document provides test methods for lead-free solders, specifically outlining a method for conducting a 45 pull test of solder joints on quad flat packages (QFP) leads. The 45 pull test involves applying force at a 45 degree angle to test the strength of the solder joint between a QFP lead and the printed circuit board. The document standardizes how to properly perform this test to evaluate the reliability of lead-free solder connections.

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    This document provides test methods for lead-free solders, specifically outlining a method for conducting a 45 pull test of solder joints on quad flat packages (QFP) leads. The 45 pull test involves applying force at a 45 degree angle to test the strength of the solder joint between a QFP lead and the printed circuit board. The document standardizes how to properly perform this test to evaluate the reliability of lead-free solder connections.

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    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    21 views1 page

    Solder Joint Strength Test

    Uploaded by

    Venkateswaran venkateswaran
    This document provides test methods for lead-free solders, specifically outlining a method for conducting a 45 pull test of solder joints on quad flat packages (QFP) leads. The 45 pull test involves applying force at a 45 degree angle to test the strength of the solder joint between a QFP lead and the printed circuit board. The document standardizes how to properly perform this test to evaluate the reliability of lead-free solder connections.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 1

    JIS Z3198-6 (2003) [Test methods for lead-free solders – Part 6:Method for 45 pull test of solder joints

    on QFP lead] (corresponding part only)

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