CHAPTER 1: INTRODUCTION TO TYPES OF ATOMIC BONDS

MATERIAL SCIENCE
1. STRONG PRIMARY BONDS
MATERIALS may be defined as substance
→ Ionic bond
of which something is composed or made.
Materials are obtained from earth crust → Covalent bond
and atmosphere
→ Metallic bond
EXAMPLES
2. WEAK SECONDARY BONDS
→ Silicon and Iron cons tute 27.72 and
→ Fluctuating Dipoles (Van Der Waal)
5.00 percentage of weight of earth’s crust
respectively → Permanent Dipoles (Hydrogen)

→ Nitrogen and Oxygen cons tute 78.08
and 20.95 percentage of dry air by volume
respectively
MATERIALS SCIENCE is the search for basic
knowledge about the internal structure,
properties and processing of materials and
the understanding of how materials
behave like they do, and why they differ in
properties
IONIC FORCE FOR ION PAIR
• Nucleus of one ion attracts electron of
another ion
• The electron clouds of ion repulse each
other when they are sufficiently close
• These two forces will balance each other
when the equilibrium interionic distance,
a0, is reached and a bond is formed

THE IMPORTANCE OF MATERIALS • The attraction repulsion force developed

SCIENCE during ionic bonding

→ To be able to select a material for a given • Note that net force is zero when the bond
use based on considerations of cost and is formed
performance

→ To understand the limits of materials

and the change of their properties with
use.

→ To be able to create a new material that

will have some desirable properties

MATERIALS SCIENCE AND ENGINEERING

ELECTRIC DIPOLE MOMENT is the product

of one of the electric charges and the
distance between them
STRONG PRIMARY BONDS: Bonding with other atoms, the potential energy of each bonding
atom is lowered resulting in a more stable state.
IONIC BONDING
Ionic or electrovalent bond
formed when an atom
transfer one or more
electron to another atom.
Ionic bonding is due to
electrostatic force of
attraction between cations
and anions. Electrons are
transferred from
electropositive to
electronegative atoms
Example: NaCl, CsCl, MgS,
KBr, KCl
It can form between
metallic and non-metallic
elements.
The bond is non-directional
COVALENT BONDING METALLIC BONDING
Covalent bonding is when Metallic bonding occurred in
the two atoms are bonded by solid metal through the
sharing of their valence sharing of valence electron
electron (at least one by delocalized attraction
electron is contributed by between the molecules. The
each atom to the bond). The valence electron moves
covalent bonding can be freely within the electron
represented by electron dots sea and become associated
or bond-line which can be with several atoms’ cores.
single or double (covalent
sharing of two pairs of
valence electrons).
Example: CH4, H2, F2, CO2, Example: aluminium,
CF4, Cl2, HNO3, HF lithium, sodium, potassium,
magnesium, calcium.
It can form between non- It can form between
metallic and non-metallic metallic and metallic
elements. elements.
The bond is directional that The bond is non-directional
is, it is between specific which means they move
atoms and may exist only in freely in the space between
the direction between one the metal ions.
atom and another that
participates in the electron
sharing
Extra Information: Extra Information:
• Metals can’t form
covalently bonded
structures because their
atoms do not have enough
electrons in the outermost
shell
• Each metal atom gives up
its valence electrons to
form positive ions.
IONIC BONDING

COVALENT BONDING

METALLIC BONDING
WEAK SECONDARY BONDS
Fluctuating Dipoles
(VAN DER WAAL BONDING)
Van Der Waal bonding is the secondary
outeratomic bond between adjacent
molecular dipoles, which may be permanent
or induced. It is also a type of weak
secondary bonding result from the attractive
force between electric dipole, which may be
induced or permanent. Fluctuating Dipole
bonds is the very weak electric dipole bonds
due to asymmetric distribution of electron
densities.
Example: Noble Gas (Helium, Neon, Argon,
Krypton, Xenon, Radon)
Permanent Dipoles
(HYDROGEN BONDING)
Hydrogen bonding is the Dipole-dipole
Interaction between polar bonds containing
hydrogen atom (found exist between some
molecule that have hydrogen as one of the
constituents) or polar bond containing
hydrogen atom interaction electronegative
atom. Permanent Dipole bonds is the weak
intermolecular bonds due to attraction
between the ends of permanent dipoles.
Example: H2O, NH3, HF
METALS, METALLOIDS AND NONMETALS

BONDING FORCES AND ENERGIES – INTERATOMIC FORCES

• The magnitude of each interatomic forces (FA and FR) depends on the separation or
interatomic distance (r)
CALCULATION FOR COULUMBIC FORCE

EXAMPLE 1

Calculate the Coulombic attractive force between a pair of potassium (K+) and oxygen (O2-)
ions that just touch each other. The ionic radius for potassium is 0.32 nm and that of oxygen
is 0.46 nm.

Z Z e
F=−
4πԐ a

a = r + R = 0.32 nm + 0.46 nm = 0.78 × 10 m

Z Z e (1)(−2)(1.6 × 10 C)
F=− =−
4πԐ a C
4π 8.85 × 10 (0.78 × 10 m)
Nm
5.12 × 10 𝟏𝟎
F= = 𝟕. 𝟓𝟕 × 𝟏𝟎 𝐍
6.77 × 10

EXAMPLE 2

Calculate the columbic attractive force between a pair of Na+ and F- ions that just touch each
other. Assume the ionic radius of the sodium to be 0.095 nm and that of fluoride 0.136 nm.

kZ Z e
F=−
a
a = r + R = 0.095 nm + 0.136 nm = 0.231 × 10 m

Nm
kZ Z e (9 × 10 )(1)(−1)(1.6 × 10 C)
F=− =− C
a (0.231 × 10 m)

2.304 × 10
F= = 𝟒. 𝟑 × 𝟏𝟎 𝟗 𝐍
5.336 × 10
EXAMPLE 3

An attraction of Coulombic force exits between the ions of Cs+ and I- that touched each other
is 2.83 x 10-9 N. The ionic radius of the Cs+ ion is 0.165 nm. Calculate the ionic radius of the I-

kZ Z e
F=−
a
a = r + R = 0.165 nm + R nm

Nm
(9 × 10 )(1)(−1)(1.6 × 10 C)
2.83 × 10 N = − C
(0.165 nm + R nm)

2.304 × 10 Nm
0.165nm + R nm =
2.83 × 10 N

0.165nm + R nm = 2.85 × 10 m

2.85 × 10 m = 0.285 nm

R nm = 0.285 nm − 0.165 nm = 𝟎. 𝟏𝟐 𝐧𝐦

OR

Z Z e
F=−
4πԐ a

a = r + R = 0.165 nm + R nm

(1)(−1)(1.6 × 10 C)
2.83 × 10 N = −
C
4π 8.85 × 10 (0.165 nm + R nm)
Nm

2.56 × 10 C
0.165nm + R nm =
C
4π 8.85 × 10 (2.83 × 10 N)
Nm

2.56 × 10 𝐶
0.165nm + R nm =
C
3.147 × 10
m

0.165nm + R nm = 2.85 × 10 m

2.85 × 10 m = 0.285 nm

R nm = 0.285 nm − 0.165 nm = 𝟎. 𝟏𝟐 𝐧𝐦
TYPES OF MATERIALS

METALLIC • Inorganic materials that are composed of one or more metallic elements
MATERIALS and may also contain non-metallic elements.
• Inorganic and have crystalline structure (atoms are arranged in orderly
manner).
• Good thermal and electrical conductors.
• Relatively strong and ductile at room temperature and maintain good
strength at high temperature
• EXAMPLE
→ Iron, Copper, Aluminium, Titanium (metallic elements)
→ Carbon, Nitrogen, Oxygen (non-metallic elements)
→ Silicon Carbide, Iron Oxide (metallic combined with non-metallic
elements)
• METALS AND ALLOYS
→ Alloy is a combination of two or more metals or a metal and a nonmetal

POLYMERIC
(PLASTIC)
MATERIALS

• EXAMPLE: Nylon, Poly vinyl Chloride (PVC), Polyester.

CERAMIC • Metallic and non-metallic elements are chemically bonded together.
MATERIALS • Inorganic but can be either crystalline, non-crystalline or mixture of both.
• High hardness, high temperature strength but tend to be brittle.
• Lightweight, wear resistance, reduced friction and insulative properties.
• Very good insulator. Hence used for furnace lining for heat treating and
melting metals.
• Also used in space shuttle to insulate it during exit and re-entry into
atmosphere.
• Other applications : Abrasives, construction materials, utensils
• EXAMPLE: Porcelain, Glass, Silicon nitride, clay, glass, stone

COMPOSITE
MATERIALS

• High strength and stiffness-to-weight ratio

• TWO TYPES
→ Fibrous: Fibers in a matrix
→ Particulate: Particles in a matrix
→ Matrix can be metals, ceramic or polymer
• EXAMPLES
→ Fiber Glass (Reinforcing material in a polyester or epoxy matrix)
→ Concrete (Gravels or steel rods reinforced in cement and sand)
• APPLICATIONS: Aircraft wings and engine, construction.

ELECTRONIC • Not Major by volume but very important.

MATERIALS • Silicon is a common electronic material.
• Its electrical characteristics are changed by adding impurities.
• EXAMPLES: Silicon chips, transistors
• APPLICATIONS: Computers, Integrated Circuits, Satellites
DIFFERENCE BETWEEN CERAMIC, METALLIC AND POLYMERIC MATERIALS

Properties CERAMIC METALLIC POLYMERIC

Hardness Very High Low Very Low
Thermal expansion High Low Very Low
Wear Resistance High Low Low
Corrosion resistance High Low Low
Electrical conductivity Low High Low
Heat conductivity Low High Low

STRUCTURE OF ATOMS
EXTRA NOTES