A1126

Chopper-Stabilized Omnipolar Hall-Effect Switch

FEATURES AND BENEFITS DESCRIPTION

• AEC-Q100 automotive qualified The A1126 integrated circuit is an omnipolar, ultrasensitive
• Omnipolar operation Hall-effect switch with a digital output. This device has an
• Low switchpoint drift integrated regulator permitting operation to 24 V.
• Superior temperature stability
This device is especially suited for operation through extended
• Insensitive to physical stress
temperature ranges, up to 150°C. Superior high-temperature
• Reverse-battery protection
performance is made possible through a dynamic offset
• Robust EMC capability
cancellation technique, which reduces the residual offset
• Robust ESD protection
voltage normally caused by device overmolding, temperature
excursions, and thermal stress.
PACKAGES: The A1126 Hall-effect switch includes the following on a
Not to scale
single silicon chip: voltage regulator, Hall-voltage generator,
small-signal amplifier, chopper stabilization, Schmitt trigger,
and a short-circuit-protected open-drain output. Advanced
BiCMOS wafer fabrication processing is used to take advantage
of low-voltage requirements, component matching, very low
NOT FOR
input-offset errors, and small component geometries.
NEW DESIGN
The omnipolar operation of the A1126 allows activation with
either a north or a south polarity field of sufficient strength. In
3-pin SOT23W the absence of a magnetic field, the output is off. This patented
(suffix LH) magnetic-polarity-independence feature makes this device
3-pin SIP, 3-pin SIP, an excellent replacement for reed switches, with improved
matrix HD style chopper style ease of manufacturing, because the A1126 does not require
(suffix UA) (suffix UA)

Continued on the next page…

Functional Block Diagram

VCC VOUT

Regulator To all subcircuits

Omnipolar
Dynamic Offset Cancellation

Control
Switchpoints

Signal Current
Amplifier
Recovery Limit

GND

A1126-DS, Rev. 3 October 28, 2016

A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

DESCRIPTION (CONTINUED)
manufacturers to orient their magnets. These devices allow simple a miniature low-profile surface-mount package, while package
on/off switching in industrial, consumer, and automotive applications. UA is a three-lead ultra-mini SIP for through-hole mounting. Each
package is lead (Pb) free, with 100% matte-tin-plated leadframe.
The A1126 is rated for operation between the ambient temperatures
–40°C to 150°C. The available package styles provide magnetically
optimized solutions for most applications. Package LH is an SOT23W,

SELECTION GUIDE
Part Number Packing [1] Package
A1126LLHLT-T [2] 3,000 pieces per reel 3-pin SOT-23W surface mount
A1126LLHLX-T 10,000 pieces per reel 3-pin SOT-23W surface mount
A1126LUA-T [3] 500 pieces per bag 3-pin ultramini SIP through-hole mount
1 Contact Allegro™ for additional packing options
2 Available
through authorized Allegro distributors only.
3 The chopper-style UA package is not for new design; the matrix HD style UA package is recommended for new designs.

ABSOLUTE MAXIMUM RATINGS

Characteristic Symbol Notes Rating Unit
Forward Supply Voltage VCC 28 V
Reverse Supply Voltage VRCC –18 V
Output Off Voltage VOUT 28 V
Reverse Supply Current IRCC –2 mA
Continuous Output Current IOUT Internally limited –
Operating Ambient Temperature TA L temperature range –40 to 150 °C
Maximum Junction Temperature TJ(max) 165 °C
Storage Temperature Tstg –65 to 170 °C

Pinout Diagrams
3 Terminal List Table
Number
Name Function
LH UA
VCC 1 1 Connects power supply to chip

VOUT 2 3 Output from circuit

GND 3 2 Ground
1 2 1 2 3

LH Package UA Package
3-Pin SOT23W 3-Pin SIP

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

OPERATING CHARACTERISTICS: Valid through TA  and VCC ranges, TJ < TJ(max), CBYP = 0.1 µF, unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Unit [1]
ELECTRICAL CHARACTERISTICS
Supply Voltage VCC Operating, TJ < 165°C 3 – 24 V
Output Leakage Current IOUTOFF VOUT = 24 V, B < BRPS – – 10 µA
Output On Voltage VOUT(SAT) IOUT = 20 mA, B > BOP – 185 500 mV
Output Current Limit IOM B > BOP 30 – 60 mA
Power-On Time [2][3] tPO – – 25 µs
Chopping Frequency fC – 800 – kHz
Output Rise Time [3][4] tr RLOAD = 820 Ω, CS = 20 pF – 0.2 2 µs
Output Fall Time [3][4] tf RLOAD = 820 Ω, CS = 20 pF – 0.1 2 µs
ICC(ON) B > BOP , VCC = 12 V – – 4 mA
Supply Current
ICC(OFF) B < BRP , VCC = 12 V – – 4 mA
Supply Zener Clamp Voltage VZ ICC = 6.5 mA; TA = 25°C 28 – – V
Supply Zener Current IZSUPPLY VS = 28 V – – 6.5 mA
MAGNETIC CHARACTERISTICS
BOPS South pole adjacent to branded face 15 38 55 G
Operate Point
BOPN North pole adjacent to branded face –55 –38 –15 G
BRPS South pole adjacent to branded face 5 20 50 G
Release Point
BRPN North pole adjacent to branded face –50 –20 –5 G
Hysteresis BHYS | BOPS – BRPS |, | BOPN – BRPN | 5 – 30 G

11 G (gauss) = 0.1 mT (millitesla).

2B < BRP (min) – 10 G , B > BOP (max) + 10 G.
3 Guaranteed by device design and characterization.
4 C = oscilloscope probe capacitance.
S

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Characteristic Performance

Average Supply Current (On) versus Temperature Average Supply Current (On) versus Supply Voltage
4.0 4.0
Supply Current, ICC(ON) (mA)

Supply Current, ICC(ON) (mA)

3.5 3.5
TA = 150°C
VCC = 24 V TA = –40°C
3.0 3.0

2.5 2.5
VCC = 3.0 V TA = 25°C
2.0 2.0

1.5 1.5

1.0 1.0

0.5 0.5

0 0
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

Average Supply Current (Off) versus Temperature Average Supply Current (Off) versus Supply Voltage
4.0 4.0
Supply Current, ICC(OFF) (mA)

Supply Current, ICC(OFF) (mA)

3.5 3.5

3.0 3.0
TA = 150°C
VCC = 24 V TA = –40°C
2.5 2.5

2.0 2.0
VCC = 3.0 V
TA = 25°C
1.5 1.5

1.0 1.0

0.5 0.5

0 0
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Average Operate Point (South) versus Temperature Average Operate Point (South) versus Supply Voltage
55 55

50 50
Applied Flux Density (G)

Applied Flux Density (G)

Operate Point (BOP)

Operate Point (BOP)

45 45

40 40
TA = –40°C TA = 150°C
35 35
VCC = 3.0 V
30 30
VCC = 24 V TA = 25°C
25 25

20 20

15 15
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

Average Release Point (South) versus Temperature Average Release Point (South) versus Supply Voltage
50 50

45 45
Applied Flux Density (G)

Applied Flux Density (G)

40 40
Release Point (BRP)

Release Point (BRP)

35 35

30 30

25 25 TA = 150°C
TA = –40°C
VCC = 3.0 V
20 20

15 VCC = 24 V 15
TA = 25°C
10 10

5 5
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Average Operate Point (North) versus Temperature Average Operate Point (North) versus Supply Voltage
–15 –15

–20 –20
Applied Flux Density (G)

Applied Flux Density (G)

Operate Point (BOP)

Operate Point (BOP)

–25 –25
TA = 25°C
–30 –30
VCC = 24 V
–35 –35
VCC = 3.0 V TA = –40°C TA = 150°C
–40 –40

–45 –45

–50 –50

–55 –55
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

Average Release Point (North) versus Temperature Average Release Point (North) versus Supply Voltage
–5 –5

–10 –10
Applied Flux Density (G)

Applied Flux Density (G)

TA = –40°C
–15 –15
Release Point (BRP)

Release Point (BRP)

VCC = 24 V
–20 –20 TA = 25°C
VCC = 3.0 V
–25 –25
TA = 150°C
–30 –30

–35 –35

–40 –40

–45 –45

–50 –50
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Average Hysteresis (South) versus Temperature Average Hysteresis (South) versus Supply Voltage
30 30
Switchpoint Hysteresis (BHYS)

Switchpoint Hysteresis (BHYS)

Applied Flux Density (G)

Applied Flux Density (G)

25 25

20 20

TA = –40°C TA = 25°C
15 15
VCC = 3.0 V

VCC = 24 V
10 10
TA = 150°C

5 5
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

Average Hysteresis (North) versus Temperature Average Hysteresis (North) versus Supply Voltage
30 30
Switchpoint Hysteresis (BHYS)

Switchpoint Hysteresis (BHYS)

Applied Flux Density (G)

Applied Flux Density (G)

25 25

20 20

TA = –40°C
15 VCC = 24 V 15

VCC = 3.0 V TA = 25°C TA = 150°C

10 10

5 5
-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25

Ambient Temperature, TA (°C) Supply Voltage, VCC (V)

Average Output Saturation Voltage versus Temperature

IOUT = 20 mA, VCC = 12 V, B > BOP
500
450
Output Saturation Voltage

400
VOUT(SAT), (mV)

350
300
250
200
150
100
50
0
-60 -40 -20 0 20 40 60 80 100 120 140 160

Ambient Temperature, TA (°C)

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic Symbol Test Conditions* Value Units
Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each side con-
Package Thermal Resistance RθJA 110 °C/W
nected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W

*Additional thermal information available on Allegro Web site.

Power Derating Curve

25
24 VCC(max)
23
22
Maximum Allowable VCC (V)

21
20
19
18
17
16
15
14
13
12
2-layer PCB, Package LH
11 (RθJA = 110 ºC/W)
10
9 1-layer PCB, Package UA
8 (RθJA = 165 ºC/W)
7
6 1-layer PCB, Package LH
5 (RθJA = 228 ºC/W)
4 VCC(min)
3
2
20 40 60 80 100 120 140 160 180

Temperature (ºC)

Power Dissipation versus Ambient Temperature

1900
1800
1700
1600
1500
1400
1300
Power Dissipation, PD (m W)

1200 2-
l
1100 (R aye
θJ rP
A = C
1000 11 B, P
1-la 0 º ac
900 y C/ ka
(R er PC W
) ge L
800 θJA = B H
165 , Pac
700 ºC/ k a
W) ge U
600 A
500 1-lay
400 er P
(R CB,
300 θJA =
228 Packag
ºC/W e LH
200 )
100
0
20 40 60 80 100 120 140 160 180
Temperature (°C)

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

FUNCTIONAL DESCRIPTION

The output of these devices switches low (turns on) when a
magnetic field perpendicular to the Hall sensor chip exceeds the
operate point threshold, BOPx . After turn-on, the output voltage
is VOUT(SAT) . The output transistor is capable of sinking current
up to the short circuit current limit, IOM , which is a minimum
of 30 mA. When the magnetic field is reduced below the release
point, BRPx , the device output goes high (turns off). The differ-
ence in the magnetic operate and release points is the hysteresis,
BHYS , of the device. This built-in hysteresis allows clean switch-
ing of the output even in the presence of external mechanical
vibration and electrical noise.
In the case of omnipolar switch devices, removal of the magnetic
field results in the device output high (off).
Powering-on the device in the hysteresis range (less than BOPx
and greater than BRPx ) will allow an indeterminate output state.
The correct state is attained after the first excursion beyond BOPx
or BRPx .

V+
VS
Switch to High

Switch to High
Switch to Low

Switch to Low
VOUT

VOUT(SAT)
0
B– 0 B+
BOPN

BRPN

BOPS
BRPS

BHYS BHYS

Figure 1. Switching behavior of omnipolar switches. On the horizontal axis, the

B+ direction indicates increasing south polarity magnetic field strength, and the
B– direction indicates increasing north polarity. This behavior can be exhibited
when using a circuit such as that shown in figure 2.

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

APPLICATION INFORMATION

V+
VCC RLOAD
A1126
CBYPASS VOUT
0.1 µF

GND

Figure 2. Typical Application Circuit

Chopper Stabilization Technique

When using Hall-effect technology, a limiting factor for
switchpoint accuracy is the small signal voltage developed across
the Hall element. This voltage is disproportionally small relative
to the offset that can be produced at the output of the Hall sensor
chip. This makes it difficult to process the signal while main-
taining an accurate, reliable output over the specified operating
temperature and voltage ranges. Chopper stabilization is a unique
approach used to minimize Hall offset on the chip. The Allegro
technique, namely Dynamic Quadrature Offset Cancellation,
removes key sources of the output drift induced by thermal and
mechanical stresses. This offset reduction technique is based on
a signal modulation-demodulation process. The undesired offset
signal is separated from the magnetic field-induced signal in the
frequency domain, through modulation. The subsequent demodu-
lation acts as a modulation process for the offset, causing the
magnetic field-induced signal to recover its original spectrum at
baseband, while the DC offset becomes a high-frequency signal.
The magnetic-sourced signal then can pass through a low-pass
filter, while the modulated DC offset is suppressed. The chop-
per stabilization technique uses a 400 kHz high frequency clock.
For demodulation process, a sample-and-hold technique is used,
where the sampling is performed at twice the chopper frequency.
This high-frequency operation allows a greater sampling rate,
which results in higher accuracy and faster signal-processing
capability. This approach desensitizes the chip to the effects
of thermal and mechanical stresses, and produces devices that
have extremely stable quiescent Hall output voltages and precise
recoverability after temperature cycling. This technique is made
possible through the use of a BiCMOS process, which allows the
use of low-offset, low-noise amplifiers in combination with high-
density logic integration and sample-and-hold circuits.

Regulator

Clock/Logic
Low-Pass
Hall Element Filter
Sample and
Hold

Amp

Figure 3. Concept of Chopper Stabilization Technique

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Power Derating

The device must be operated below the maximum junction Example: Reliability for VCC at TA = 150°C, package UA, using a
temperature of the device, TJ(max) . Under certain combina- single-layer PCB.
tions of peak conditions, reliable operation may require derating
Observe the worst-case ratings for the device, specifically:
supplied power or improving the heat dissipation properties of
RθJA = 165°C/W, TJ(max)   = 165°C, VCC(max)  = 24 V, and
the application. This section presents a procedure for correlating
ICC(max)   = 4 mA.
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.) Calculate the maximum allowable power level, PD(max) . First,
invert equation 3:
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate ΔTmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
heat from the junction (die), through all paths to the ambient air.
This provides the allowable increase to TJ resulting from internal
Its primary component is the Effective Thermal Conductivity,
power dissipation. Then, invert equation 2:
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RθJC, is PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 165°C/W =  91 mW
relatively small component of RθJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by Finally, invert equation 1 with respect to voltage:
overmolding.   VCC(est) = PD(max) ÷  ICC(max)  = 91 mW ÷ 4 mA =  23 V
The effect of varying power levels (Power Dissipation, PD), can The result indicates that, at TA, the application and device can
be estimated. The following formulas represent the fundamental dissipate adequate amounts of heat at voltages ≤VCC(est) .
relationships used to estimate TJ, at PD.  Compare VCC(est) to VCC(max) . If VCC(est) ≤ VCC(max) , then
reliable operation between VCC(est) and VCC(max) requires
PD = VIN × IIN (1) enhanced RθJA. If VCC(est) ≥ VCC(max) , then operation
ΔT = PD × RθJA (2) between VCC(est) and VCC(max) is reliable under these condi-
tions.
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
VIN = 12 V, IIN = 4 mA, and RθJA = 140°C/W, then:

PD = VIN × IIN = 12 V × 4 mA = 48 mW
 

ΔT = PD × RθJA = 48 mW × 140°C/W = 7°C

 TJ = TA + ΔT = 25°C + 7°C = 32°C

A worst-case estimate, PD(max) , represents the maximum allow-
able power level, without exceeding TJ(max) , at a selected RθJA
and TA.

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Package LH, 3-Pin SOT23W

+0.12
2.98 –0.08

1.49 D
4°±4°
3 A
+0.020
0.180–0.053

0.96 D

+0.10 +0.19 2.40

2.90 –0.20 1.91 –0.06
0.70
D
0.25 MIN

1.00

1 2

0.55 REF 0.25 BSC 0.95

Seating Plane
Gauge Plane B PCB Layout Reference View

8X 10° REF Branded Face

1.00 ±0.13
NNN

+0.10 1
0.05 –0.05
0.95 BSC C Standard Branding Reference View
0.40 ±0.10
N = Last three digits of device part number
For Reference Only; not for tooling use (reference DWG-2840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Active Area Depth, 0.28 mm REF
B Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
C Branding scale and appearance at supplier discretion

D Hall element, not to scale

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Package UA, 3-Pin SIP, Matrix Style

+0.08
4.09 –0.05

45°
B

E C
2.04
1.52 ±0.05

10°
E 1.44 Mold Ejector
E
+0.08 Pin Indent
3.02 –0.05

Branded 45°
Face
0.79 REF
A NNN
1.02
MAX

1
1 2 3 D Standard Branding Reference View
= Supplier emblem
N = Last three digits of device part number

14.99 ±0.25 +0.03

0.41 –0.06
For Reference Only; not for tooling use (reference DWG-9065)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.05
0.43 –0.07
A Dambar removal protrusion (6X)
B Gate and tie bar burr area
C Active Area Depth, 0.50 mm REF
D Branding scale and appearance at supplier discretion
E Hall element (not to scale)

1.27 NOM

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Package UA, 3-Pin SIP, Chopper Style

+0.08
4.09 –0.05

45°
B
C
E
2.04
1.52 ±0.05

1.44 E
Mold Ejector
+0.08 Pin Indent NNN
3.02 –0.05
E
Branded 45°
Face 1
2.16 D Standard Branding Reference View
MAX
= Supplier emblem
0.79 REF N = Last three digits of device part number

NOT FOR
A
0.51
REF

NEW DESIGN
1 2 3

For Reference Only; not for tooling use (reference DWG-9049)

Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
+0.03 Exact case and lead configuration at supplier discretion within limits shown
0.41 –0.06
15.75 ±0.51

A Dambar removal protrusion (6X)

B Gate burr area
C Active Area Depth, 0.50 mm REF
D Branding scale and appearance at supplier discretion
E Hall element, not to scale

+0.05 1.27 NOM

0.43 –0.07

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A1126 Chopper-Stabilized Omnipolar Hall-Effect Switch

Revision History
Number Date
1 September 16, 2013
2 September 21, 2015
3 October 28, 2016
Description
Update UA package drawing
Added AEC-Q100 qualification under Features and Benefits
Chopper-style UA package designated as not for new design

Copyright ©2018, Allegro MicroSystems, LLC

Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.

For the latest version of this document, visit our website:

www.allegromicro.com

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