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D Output Swing includes Both Supply Rails D Low Input Offset Voltage
D Low Noise . . . 12 nV/√Hz Typ at f = 1 kHz 950 µV Max at TA = 25°C (TLC2262A)
D Low Input Bias Current . . . 1 pA Typ D Macromodel Included
D Fully Specified for Both Single-Supply and D Performance Upgrade for the TS27M2/M4
Split-Supply Operation and TLC27M2/M4
D Low Power . . . 500 µA Max D Available in Q-Temp Automotive
D Common-Mode Input Voltage Range
HighRel Automotive Applications
Configuration Control/Print Support
Includes Negative Rail
Qualification to Automotive Standards
nv//HzHz
output performance for increased dynamic range RS = 20 Ω
in single- or split-supply applications. The TA = 25°C
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VDD+
1OUT
D, P, OR PW PACKAGE
NC
NC
NC
(TOP VIEW)
1OUT 1 8 VDD + 3 2 1 20 19
NC 4 18 NC
1IN – 2 7 2OUT
1IN – 5 17 2OUT
1IN + 3 6 2IN –
NC 6 16 NC
VDD – /GND 4 5 2IN +
1IN + 7 15 2IN –
NC 8 14 NC
9 10 11 12 13
VDD– /GND
2IN+
NC
NC
NC
NC – No internal connection
1OUT 1 8 VDD + NC 1 10 NC
1IN – 2 7 2OUT 1OUT 2 9 VCC +
1IN + 3 6 2IN – 1IN – 3 8 2OUT
VDD – /GND 4 5 2IN + 1IN + 4 7 2IN –
VCC – /GND 5 6 2IN +
NC – No internal connection
TLC2264C, TLC2264AC
TLC2264I, TLC2264AI TLC2264M, TLC2264AM . . . FK PACKAGE
TLC2264Q, TLC2264AQ (TOP VIEW)
D, N, OR PW PACKAGE TLC2264M, TLC2264AM . . . J OR W PACKAGE
1OUT
4OUT
1IN –
4IN –
(TOP VIEW) (TOP VIEW)
NC
3IN –
2OUT
NC
3OUT
NC – No internal connection
IN +
OUT
C1
IN – R5
Q1 Q4
D1
Q2 Q5 Q7 Q8 Q10 Q11
R3 R4 R1 R2
VDD – / GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD + (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Supply voltage, VDD – (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 8 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 16 V
Input voltage, VI (any input, see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD– – 0.3 V to VDD+
Input current, II (each input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Total current into VDD + . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Total current out of VDD – . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Duration of short-circuit current at (or below) 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, N, P, and PW packages . . . . . . . 260°C
J, JG, U, and W packages . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VDD+ and VDD – .
2. Differential voltages are at IN+ with respect to IN –. Excessive current flows if input is brought below VDD – – 0.3 V.
3. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded.
VIC = 2
2.5
5VV, IOL = 4 mA 25°C
Full range
0.7 1
1.2
25°C 80 170
2 5 V,
VIC = 2.5 V RL = 50 kه
AVD Large-signal
g g differential voltage
g amplification Full range 55 V/mV
VO = 1 V to 4 V
RL = 1 MΩ‡ 25°C 550
ri(d) Differential input resistance 25°C 1012 Ω
ri(c) Common-mode input resistance 25°C 1012 Ω
ci(c) Common-mode input capacitance f = 10 kHz, P package 25°C 8 pF
zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 240 Ω
VIC = 0 to 2.7 V,, VO = 2.5 V,, 25°C 70 83
CMRR Common mode rejection ratio
Common-mode dB
RS = 50 Ω Full range 70
VDD = 4.4 V to 16 V,, 25°C 80 95
kSVR Supply voltage rejection ratio (∆VDD/∆VIO)
Supply-voltage dB
VIC = VDD /2, No load Full range 80
25°C 400 500
IDD Supply current VO = 2
2.5
5VV, No load µA
Full range 500
† Full range is 0°C to 70°C.
‡ Referenced to 2.5 V
NOTE 4: Typical values are based on the input offset voltage shift observed through 500 hours of operating life test at TA = 150°C extrapolated
to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
AV = – 1, To 0.1%
0 1% 64
6.4
Step = 0.5 V to 2.5 V,,
ts Settling time 25°C µs
RL = 50 kه,
CL = 100 pF‡ To 0 01%
0.01% 14 1
14.1
VIC = 0
0, IO = 4 mA 25°C
Full range
–4
– 3.8
– 4.3
25°C 80 200
RL = 50 kΩ
AVD Large-signal differential voltage amplification VO = ± 4 V Full range 55 V/mV
RL = 1 MΩ 25°C 1000
ri(d) Differential input resistance 25°C 1012 Ω
ri(c) Common-mode input resistance 25°C 1012 Ω
ci(c) Common-mode input capacitance f = 10 kHz, P package 25°C 8 pF
zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 220 Ω
VIC = – 5 V to 2.7 V,, 25°C 75 88
Common mode rejection ratio
CMRR Common-mode dB
VO = 0 V, RS = 50 Ω Full range 75
VDD ± = 2.2 V to ± 8 V,, 25°C 80 95
kSVR Supply voltage rejection ratio (∆VDD ± /∆VIO)
Supply-voltage dB
VIC = 0, No load Full range 80
25°C 425 500
IDD Supply current VO = 0 V
V, No load µA
Full range 500
† Full range is 0°C to 70°C.
NOTE 4: Typical values are based on the input offset voltage shift observed through 500 hours of operating life test at TA = 150°C extrapolated
to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
f = 10 kHz,, RL = 50 kΩ
Gain bandwidth product
Gain-bandwidth 25°C 0 73
0.73 MHz
CL = 100 pF
VO(PP) = 4.6 V, AV = 1,
BOM Maximum output-swing
output swing bandwidth 25°C 85 kHz
RL = 50 kΩ, CL = 100 pF
AV = – 1, To 0.1%
0 1% 71
7.1
Step = – 2.3 V to 2.3 V,,
ts Settling time 25°C µs
RL = 50 kΩ,
CL = 100 pF To 0.01%
0 01% 16 5
16.5
VIC = 2
2.5
5VV, IOL = 4 mA 25°C
Full range
0.7 1
1.2
25°C 80 170
VIC = 2.5
2 5 V,
V RL = 50 kه
AVD Large-signal
g g differential voltage
g amplification Full range 55 V/mV
VO = 1 V to 4 V
RL = 1 MΩ‡ 25°C 550
ri(d) Differential input resistance 25°C 1012 Ω
ri(c) Common-mode input resistance 25°C 1012 Ω
ci(c) Common-mode input capacitance f = 10 kHz, N package 25°C 8 pF
zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 240 Ω
VIC = 0 to 2.7 V,, VO = 2.5 V,, 25°C 70 83
CMRR Common mode rejection ratio
Common-mode dB
RS = 50 Ω Full range 70
VDD = 4.4 V to 16 V, 25°C 80 95
kSVR Supply voltage rejection ratio (∆VDD /∆VIO)
Supply-voltage dB
VIC = VDD /2, No load Full range 80
25°C 0.8 1
IDD Supply current (four amplifiers) VO = 2
2.5
5VV, No load mA
Full range 1
† Full range is 0°C to 70°C.
‡ Referenced to 2.5 V
NOTE 4. Typical values are based on the input offset voltage shift observed through 500 hours of operating life test at TA = 150°C extrapolated
to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
VIC = 0
0, IO = 4 mA 25°C
Full range
–4
– 3.8
– 4.3
25°C 80 200
RL = 50 kΩ
AVD Large-signal differential voltage amplification VO = ± 4 V Full range 55 V/mV
RL = 1 MΩ 25°C 1000
ri(d) Differential input resistance 25°C 1012 Ω
ri(c) Common-mode input resistance 25°C 1012 Ω
ci(c) Common-mode input capacitance f = 10 kHz, N package 25°C 8 pF
zo Closed-loop output impedance f = 100 kHz, AV = 10 25°C 220 Ω
VIC = – 5 V to 2.7 V, 25°C 75 88
Common mode rejection ratio
CMRR Common-mode dB
VO = 0, RS = 50 Ω Full range 75
VDD ± = ± 2.2 V to ± 8 V, 25°C 80 95
kSVR Supply voltage rejection ratio (∆VDD ± /∆VIO)
Supply-voltage dB
VIC = 0, No load Full range 80
25°C 0.85 1
IDD Supply current (four amplifiers) VO = 0
0, No load mA
Full range 1
† Full range is 0°C to 70°C.
NOTE 4: Typical values are based on the input offset voltage shift observed through 500 hours of operating life test at TA = 150°C extrapolated
to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
f = 10 kHz,, RL = 50 kΩ,,
Gain bandwidth product
Gain-bandwidth 25°C 0 73
0.73 MHz
CL = 100 pF
VO(PP) = 4.6 V,, AV = 1,,
BOM Maximum output-swing
output swing bandwidth 25°C 70 kHz
RL = 50 kΩ, CL = 100 pF
AV = – 1, 0 1%
To 0.1% 71
7.1
Step = – 2.3 V to 2.3 V,,
ts Settling time 25°C µs
RL = 50 kΩ,
CL = 100 pF To 0
0.01%
01% 16 5
16.5
Phase margin at
φm 25°C 56° 56°
unity gain RL = 50 kΩ‡, CL = 100 pF‡
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C.
‡ Referenced to 2.5 V
Phase margin at
φm 25°C 57° 57°
unity gain RL = 50 kΩ, CL = 100 pF
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C.
Phase margin at
φm 25°C 56° 56°
unity gain RL = 50 kΩ‡, CL = 100 pF‡
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C.
‡ Referenced to 2.5 V
Phase margin at
φm 25°C 57° 57°
unity gain RL = 50 kΩ, CL = 100 pF
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C.
Phase margin at
φm 25°C 56° 56°
unity gain RL = 50 kΩ‡, CL = 100 pF‡
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C for Q suffix, – 55°C to 125°C for M suffix.
‡ Referenced to 2.5 V
Phase margin at
φm 25°C 57° 57°
unity gain RL = 50 kΩ, CL = 100 pF
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C for Q suffix, – 55°C to 125°C for M suffix.
VIC = 2
2.5
5VV, IOL = 4 mA 25°C
Full range
0.8 1
1.2
0.7 1
1.2
25°C 80 100 80 170
Large-signal
Large signal differential VIC = 2
2.5
5VV, RL = 50 kه
AVD Full range 50 50 V/mV
voltage am lification
amplification VO = 1 V to 4 V
RL = 1 MΩ‡ 25°C 550 550
Differential input
ri(d) 25°C 1012 1012 Ω
resistance
Common-mode input
ri(c) 25°C 1012 1012 Ω
resistance
Common-mode input
ci(c) f = 10 kHz, N package 25°C 8 8 pF
capacitance
Closed-loop output
zo f = 100 kHz, AV = 10 25°C 240 240 Ω
impedance
Common-mode rejection
j VIC = 0 to 2.7 V, VO = 2.5 V, 25°C 70 83 70 83
CMRR dB
ratio RS = 50 Ω Full range 70 70
Supply-voltage rejection
kSVR 25°C 80 95 80 95 dB
ratio (∆VDD /∆VIO) VDD = 4.4 V to 16 V,
Supplyy current 25°C 0.8 1 0.8 1
IDD VO = 2
2.5
5VV, No load mA
(four amplifiers) Full range 1 1
† Full range is – 40°C to 125°C for Q suffix, – 55°C to 125°C for M suffix.
‡ Referenced to 2.5 V
NOTE 4: Typical values are based on the input offset voltage shift observed through 500 hours of operating life test at TA = 150°C extrapolated
to TA = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
Phase margin at
φm 25°C 56° 56°
unity gain RL = 50 kΩ‡, CL = 100 pF‡
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C for Q suffix, – 55°C to 125°C for M suffix.
‡ Referenced to 2.5 V
Phase margin at
φm 25°C 57° 57°
unity gain RL = 50 kΩ, CL = 100 pF
Gain margin 25°C 11 11 dB
† Full range is – 40°C to 125°C for Q suffix, – 55°C to 125°C for M suffix.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Distribution 2–5
VIO Input offset voltage
vs Common-mode input voltage 6, 7
αVIO Input offset voltage temperature coefficient Distribution 8 – 11
IIB/IIO Input bias and input offset currents vs Free-air temperature 12
vs Supply voltage 13
VI Input voltage range
vs Free-air temperature 14
VOH High-level output voltage vs High-level output current 15
VOL Low-level output voltage vs Low-level output current 16, 17
VOM + Maximum positive output voltage vs Output current 18
VOM – Maximum negative output voltage vs Output current 19
VO(PP) Maximum peak-to-peak output voltage vs Frequency 20
vs Supply voltage 21
IOS Short-circuit output current
vs Free-air temperature 22
VO Output voltage vs Differential input voltage 23, 24
Differential gain vs Load resistance 25
vs Frequency 26, 27
AVD Large-signal differential voltage amplification
vs Free-air temperature 28, 29
zo Output impedance vs Frequency 30, 31
vs Frequency 32
CMRR Common-mode rejection ratio
vs Free-air temperature 33
vs Frequency 34, 35
kSVR Supply-voltage rejection ratio
vs Free-air temperature 36
vs Supply voltage 37, 38
IDD Supply current
vs Free-air temperature 39, 40
vs Load capacitance 41
SR Slew rate
vs Free-air temperature 42
Inverting large-signal pulse response 43, 44
Voltage-follower large-signal pulse response 45, 46
VO
Inverting small-signal pulse response 47, 48
Voltage-follower small-signal pulse response 49, 50
Vn Equivalent input noise voltage vs Frequency 51, 52
Noise voltage (referred to input) Over a 10-second period 53
Integrated noise voltage vs Frequency 54
THD + N Total harmonic distortion plus noise vs Frequency 55
vs Supply voltage 56
Gain-bandwidth product
vs Free-air temperature 57
vs Frequency 26, 27
φm Phase margin
vs Load capacitance 58
Gain margin vs Load capacitance 59
B1 Unity-gain bandwidth vs Load capacitance 60
Overestimation of phase margin vs Load capacitance 61
TYPICAL CHARACTERISTICS
Percentage of Amplifiers – %
15 15
10 10
5 5
0 0
– 1.6 – 0.8 0 0.8 1.6 – 1.6 – 0.8 0 0.8 1.6
VIO – Input Offset Voltage – mV VIO – Input Offset Voltage – mV
Figure 2 Figure 3
12 12
8 8
4 4
0 0
– 1.6 – 0.8 0 0.8 1.6 – 1.6 – 0.8 0 0.8 1.6
VIO – Input Offset Voltage – mV VIO – Input Offset Voltage – mV
Figure 4 Figure 5
TYPICAL CHARACTERISTICS
0 0
ÁÁÁ ÁÁ
ÁÁÁ ÁÁ
– 0.5 – 0.5
VVIO
VVIO
–1
ÁÁ –1
–1 0 1 2 3 4 5 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5
VIC – Common-Mode Input Voltage – V VIC – Common-Mode Input Voltage – V
† For curves where VDD = 5 V, all loads are referenced to 2.5 V.
Figure 6 Figure 7
Percentage of Amplifiers – %
20 20
15 15
10 10
5 5
0 0
–5 –4 –3 –2 –1 0 1 2 3 4 5 –5 –4 –3 –2 –1 0 1 2 3 4 5
αVIO – Temperature Coefficient – µV / °C αVIO – Temperature Coefficient – µV / °C
Figure 8 Figure 9
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
Percentage of Amplifiers – %
TA = 25°C to 125°C TA = 25°C
25 25 to 125°C
20 20
15 15
10 10
5 5
0 0
–5 –4 –3 –2 –1 0 1 2 3 4 5 –5 –4 –3 –2 –1 0 1 2 3 4 5
αVIO – Temperature Coefficient of αVIO – Temperature Coefficient of
Input Offset Voltage – µV / °C Input Offset Voltage – µV / °C
Figure 10 Figure 11
450 10
VDD± = ± 2.5 V RS = 50 Ω
400 VIC = 0 V 8
TA = 25°C
VO = 0
350 RS = 50 Ω 6
VII – Input Voltage Range – V
4
300
IIB 2
250
0 | VIO | ≤ 5 mV
200
–2
150
–4
100
V
–6
IB and IIO
ÁÁ
50 –8
ÁÁ
IIO
0 – 10
IIIB
25 45 65 85 105 125 2 3 4 5 6 7 8
TA – Free-Air Temperature – °C | VDD ± | – Supply Voltage – V
Figure 12 Figure 13
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
3 4
TA = 125°C
TA = – 55°C
2 | VIO | ≤ 5 mV
3
TA = 25°C
ÁÁ
1
2
ÁÁ ÁÁ
TA = – 40°C
V
ÁÁ VOH
0 1
V
–1
0
– 75 – 55 – 35 – 15 5 25 45 65 85 105 125 0 500 1000 1500 2000 2500 3000 3500
TA – Free-Air Temperature – °C | IOH| – High-Level Output Current – µA
Figure 14 Figure 15
1
VIC = 1.25 V TA = 125°C
VIC = 0
1
0.8
0.8
TA = 25°C
0.6
VIC = 2.5 V 0.6
TA = – 40°C
0.4 TA = – 55°C
ÁÁ ÁÁ
0.4
ÁÁ ÁÁ
VOL
VOL
ÁÁ
0.2
V
0.2
0 0
0 1 2 3 4 5 0 1 2 3 4 5 6
IOL – Low-Level Output Current – mA IOL – Low-Level Output Current – mA
Figure 16 Figure 17
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
VDD± = ± 5 V
VIC = 0
5 –4
TA = – 55°C TA = 125°C
4 – 4.2 TA = 25°C
TA = 125°C
3 – 4.4
TA = – 40°C
TA = 25°C TA = – 55°C
2 – 4.6
ÁÁ TA = – 40°C
ÁÁ
ÁÁ ÁÁ
1 – 4.8
ÁÁ ÁÁ VOM –
VVOM
VOM
ÁÁ
0 –5
0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 6
| IO | – Output Current – µA IO – Output Current – mA
Figure 18 Figure 19
10 12
RL = 10 kΩ
9 VDD± = ± 5 V
I OS – Short-Circuit Output Current – mA
TA = 25°C 10
8 VID = – 100 mV
8
7
6 VO = 0
6 TA = 25°C
VDD = 5 V 4
5
4
2
3
0
2 VID = 100 mV
ÁÁ
IOS
–2
VO(PP)
ÁÁ
ÁÁ
0 –4
103 104 105 106 2 3 4 5 6 7 8
| VDD ± | – Supply Voltage – V
f – Frequency – Hz
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
Figure 20 Figure 21
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
TYPICAL CHARACTERISTICS
11 VIC = 2.5 V
4 TA = 25°C
10
VO – Output Voltage – V
VID = – 100 mV
9
8 3
7
1
2
0
–1
–2 VID = 100 mV 1
IIOS
–3
–4 0
– 75 – 50 – 25 0 25 50 75 100 125 – 1000 – 750 – 500 – 250 0 250 500 750 1000
TA – Free-Air Temperature – °C VID – Differential Input Voltage – µV
Figure 22 Figure 23
1
VDD = 5 V
102
–1
10
–3
–5 1
– 1000 – 750 – 500 – 250 0 250 500 750 1000 103 104 105 106
VID – Differential Input Voltage – µV RL – Load Resistance – kΩ
Figure 24 Figure 25
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
m – Phase Margin
40 90°
Phase Margin
20 45°
ÁÁ
Gain
φom
0
ÁÁ
0°
AVD
ÁÁ – 20 – 45°
– 40 – 90°
10 3 10 4 10 5 10 6 10 7
f – Frequency – Hz
† For curves where VDD = 5 V, all loads are referenced to 2.5 V.
Figure 26
m – Phase Margin
40 90°
Phase Margin
20 45°
Gain
ÁÁ
φom
0 0°
ÁÁ
AVD
ÁÁ – 20 – 45°
– 40 – 90°
10 3 10 4 10 5 10 6 10 7
f – Frequency – Hz
Figure 27
TYPICAL CHARACTERISTICS
RL = 50 kΩ
RL = 50 kΩ
102 102
ÁÁ RL = 10 kΩ
ÁÁ
ÁÁ ÁÁ
AVD
AVD
RL = 10 kΩ
101 101
– 75 – 50 – 25 0 25 50 75 100 125 – 75 – 50 – 25 0 25 50 75 100 125
TA – Free-Air Temperature – °C TA – Free-Air Temperature – °C
Figure 28 Figure 29
100
z o – Output Impedance – 0
100
z o – Output Impedance – 0
AV = 100
AV = 100
10 10
AV = 10
AV = 10
zo
zo
1 1
AV = 1
AV = 1
0.1 0.1
102 103 104 105 106 102 103 104 105 106
f – Frequency – Hz f – Frequency – Hz
Figure 30 Figure 31
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
VDD± = ± 5 V VDD± = ± 5 V
80 88
VDD = 5 V
60 86
40 84
VDD = 5 V
20 82
0 80
101 102 103 104 105 106 – 75 – 50 –25 0 25 50 75 100 125
f – Frequency – Hz TA – Free-Air Temperature – °C
Figure 32 Figure 33
TA = 25°C TA = 25°C
80 80
kSVR + kSVR +
60 60
kSVR – kSVR –
40 40
20 20
ÁÁ ÁÁ
ÁÁ ÁÁ
0
KSVR
0
KSVR
ÁÁ – 20
101 102 103 104
f – Frequency – Hz
105 106 ÁÁ – 20
101 102 103 104 105 106
f – Frequency – Hz
Figure 34 Figure 35
TYPICAL CHARACTERISTICS
TLC2262
SUPPLY-VOLTAGE REJECTION RATIO† SUPPLY CURRENT †
vs vs
FREE-AIR TEMPERATURE SUPPLY VOLTAGE
110 600
VDD ± = ± 2.2 V to ± 8 V VO = 0
SVR – Supply-Voltage Rejection Ratio – dB
No Load
VO = 0
500
TA = – 55°C
µA
I DD – Supply Current – uA
105
400
TA = 25°C
TA = 125°C
TA = 40°C
100 300
ÁÁ 200
ÁÁ IDD
ÁÁ
95
ÁÁ
100
KSVR
ÁÁ
k
90 0
– 75 – 50 – 25 0 25 50 75 100 125 0 1 2 3 4 5 6 7 8
TA – Free-Air Temperature – °C | VDD ± | – Supply Voltage – V
Figure 36 Figure 37
TLC2264 TLC2262
SUPPLY CURRENT † SUPPLY CURRENT †‡
vs vs
SUPPLY VOLTAGE FREE-AIR TEMPERATURE
1200 600
VO = 0
No Load
1000 500 VDD± = ± 5 V
TA = – 55°C VO = 0
µA
µA
I DD – Supply Current – uA
I DD – Supply Current – uA
800 400
TA = 25°C
TA = 125°C VDD = 5 V
TA = 40°C VO = 2.5 V
600 300
ÁÁ ÁÁ
ÁÁ ÁÁ
400 200
IDD
IDD
ÁÁ 200 ÁÁ 100
0 0
0 1 2 3 4 5 6 7 8 – 75 – 50 – 25 0 25 50 75 100 125
| VDD ± | – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 38 Figure 39
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
TLC2264
SUPPLY CURRENT †‡ SLEW RATE‡
vs vs
FREE-AIR TEMPERATURE LOAD CAPACITANCE
1200 1
VDD = 5 V
AV = – 1
1000 VDD ± = ± 5 V TA = 25°C
VO = 0 0.8
µA
I DD – Supply Current – uA
SR –
µs
v/us
800
SR – Slew Rate – V/
0.6
VDD = 5 V
VO = 2.5 V
600 SR +
ÁÁ
0.4
400
ÁÁ
IDD
0.2
200
0 0
– 75 – 50 – 25 0 25 50 75 100 125 101 102 103 104
TA – Free-Air Temperature – °C CL – Load Capacitance – pF
Figure 40 Figure 41
SLEW RATE†‡
vs INVERTING LARGE-SIGNAL PULSE
FREE-AIR TEMPERATURE RESPONSE‡
1.2 5
VDD = 5 V
RL = 50 kΩ
1 CL = 100 pF
4 A = –1
V
TA = 25°C
VO – Output Voltage – V
SR – Slew Rate – v/uss
SR –
V/ µ
0.8
3
0.6 SR +
2
0.4
VO
VDD = 5 V
RL = 50 kΩ 1
0.2
CL = 100 pF
AV = 1
0 0
– 75 – 50 – 25 0 25 50 75 100 125 0 2 4 6 8 10 12 14 16 18 20
TA – Free-Air Temperature – °C t – Time – µs
Figure 42 Figure 43
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
VO – Output Voltage – V
TA = 25°C
VO – Output Voltage – V
1 3
–1 2
VO
VO
–2
–3 1
–4
–5 0
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
t – Time – µs t – Time – µs
Figure 44 Figure 45
VO – Output Voltage – V
1 2.55
–1 2.5
VO
–2
VO
–3 2.45
–4
–5 2.4
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
t – Time – µs t – Time – µs
Figure 46 Figure 47
TYPICAL CHARACTERISTICS
50 TA = 25°C TA = 25°C
VO – Output Voltage – V
2.55
2.5
VO
VO
– 50
2.45
– 100 2.4
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
t – Time – µs t – Time – µs
Figure 48 Figure 49
RL = 50 kΩ RS = 20 Ω
CL = 100 pF TA = 25°C
V n – Equivalent Input Noise Voltage – nV/
50
AV = 1
50 TA = 25°C
VO – Output Voltage – V
40
0 30
20
VO
– 50
10
VN
– 100 0
0 2 4 6 8 10 12 14 16 18 20 101 102 103 104
t – Time – µs f – Frequency – Hz
Figure 50 Figure 51
TYPICAL CHARACTERISTICS
RS = 20 Ω 750
50 TA = 25°C
500
Noise Voltage – nV
40 250
0
30
– 250
20
– 500
10 VDD = 5 V
– 750 f = 0.1 Hz to 10 Hz
VN
TA = 25°C
0 – 1000
0 2 4 6 8 10
101 102 103 104
t – Time – s
f – Frequency – Hz
Figure 52 Figure 53
100 0.1
Calculated Using Ideal Pass-Band Filter
Low Frequency = 1 Hz
AV = 100
TA = 25°C
Integrated Noise Voltage – µ V
10
0.01
AV = 10
1
AV = 1
VDD = 5 V
RL = 50 kΩ
TA = 25°C
0.1 0.001
100 101 102 103 104 105 101 102 103 104 105
f – Frequency – Hz f – Frequency – Hz
Figure 54 Figure 55
TYPICAL CHARACTERISTICS
860
800
820
600
780
740 400
0 1 2 3 4 5 6 7 8 – 75 – 50 – 25 0 25 50 75 100 125
| VDD ± | – Supply Voltage – V TA – Free-Air Temperature – °C
Figure 56 Figure 57
60°
15
Rnull = 100 Ω Rnull = 100 Ω
m – Phase Margin
Gain Margin – dB
Rnull = 50 Ω
45°
10
Rnull = 50 Ω
30°
φom
Rnull = 20 Ω
50 kΩ 5 Rnull = 20 Ω
15° VDD +
Rnull = 10 Ω
50 kΩ Rnull
VI –
+ CL Rnull = 10 Ω Rnull = 0
VDD – Rnull = 0 0
0°
101 10 2 10 3 10 4 101 10 2 10 3 10 4
CL – Load Capacitance – pF CL – Load Capacitance – pF
Figure 58 Figure 59
† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡ For curves where VDD = 5 V, all loads are referenced to 2.5 V.
TYPICAL CHARACTERISTICS
12°
B1 – Unity-Gain Bandwidth – kHz
8°
600 Rnull = 50 Ω
6°
ÁÁ 4°
ÁÁ
400
Rnull = 10 Ω
Rnull = 20 Ω
2°
200 0
101 10 2 10 3 10 4 101 10 2 10 3 10 4
CL – Load Capacitance – pF CL – Load Capacitance – pF
Figure 60 Figure 61
† See application information
APPLICATION INFORMATION
ǒ Ǔ
calculate the improvement in phase margin, equation 1 can be used.
∆Θ m1 + tan–1 2 × π × UGBW × R
null
× C
L (1)
Where :
∆Θ m1 + improvement in phase margin
UGBW + unity-gain bandwidth frequency
R null + output series resistance
C L + load capacitance
The unity-gain bandwidth (UGBW) frequency decreases as the capacitive load increases (see Figure 60). To
use equation 1, UGBW must be approximated from Figure 60.
Using equation 1 alone overestimates the improvement in phase margin, as illustrated in Figure 61. The
overestimation is caused by the decrease in the frequency of the pole associated with the load, thus providing
additional phase shift and reducing the overall improvement in phase margin. The pole associated with the load
is reduced by the factor calculated in equation 2.
F + 1 ) gm1 × R (2)
null
Where :
F + factor reducing frequency of pole
g m + small-signal output transconductance (typically 4.83 × 10 – 3 mhos)
R null + output series resistance
For the TLC226x, the pole associated with the load is typically 7 MHz with 100-pF load capacitance. This value
varies inversely with CL: at CL = 10 pF, use 70 MHz, at CL = 1000 pF, use 700 kHz, and so on.
Reducing the pole associated with the load introduces phase shift, thereby reducing phase margin. This results
in an error in the increase in phase margin expected by considering the zero alone (equation 1). Equation 3
approximates the reduction in phase margin due to the movement of the pole associated with the load. The
result of this equation can be subtracted from the result of the equation in equation 1 to better approximate the
improvement in phase margin.
APPLICATION INFORMATION
ǒ Ǔ
driving large capacitive loads (continued)
ȱȧǒ Ǔȳȧ
Where :
∆Θ m2 + tan–1
Ȳ ȴ
UGBW
F × P2
– tan –1 UGBW
P2
(3)
Using these equations with Figure 60 and Figure 61 enables the designer to choose the appropriate output
series resistance to optimize the design of circuits driving large capacitive loads.
50 kΩ
VDD +
50 kΩ Rnull
VI –
+ CL
VDD – / GND
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice . The Boyle macromodel (see Note 5) and subcircuit in Figure 63 are generated using
the TLC226x typical electrical and operating characteristics at TA = 25°C. Using this information, output
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D Maximum positive output voltage swing D Unity-gain frequency
D Maximum negative output voltage swing D Common-mode rejection ratio
D Slew rate D Phase margin
D Quiescent power dissipation D DC output resistance
D Input bias current D AC output resistance
D Open-loop voltage amplification D Short-circuit output current limit
NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
99
DLN
3 EGND +
VCC +
9 92
FB
+ – 90 91
RSS ISS
RO2 + DLP + –
VB
RP HLIM VLP VLN
+ –
2 10 – – +
IN – VC R2
J1 J2 – C2
DP 6 7
IN + 53 +
1 11 VLIM
12 DC GCM GA
–
C1 8
RD1 RD2
60 RO1
+ DE
VAD 5
– 54
VCC –
4 – +
VE OUT
.SUBCKT TLC226x 1 2 3 4 5 RD1 60 11 21.22E3
C1 11 12 3.560E–12 RD2 60 12 21.22E3
C2 6 7 15.00E–12 R01 8 5 120
DC 5 53 DX R02 7 99 120
DE 54 5 DX RP 3 4 26.04E3
DLP 90 91 DX RSS 10 99 24.24E6
DLN 92 90 DX VAD 60 4 –.6
DP 4 3 DX VB 9 0 DC 0
EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5 VC 3 53 DC .65
FB 7 99 POLY (5) VB VC VE VLP VE 54 4 DC .65
+ VLN 0 21.04E6 –30E6 30E6 30E6 –30E6 VLIM 7 8 DC 0
GA 6 0 11 12 47.12E–6 VLP 91 0 DC 1.4
GCM 0 6 10 99 4.9E–9 VLN 0 92 DC 9.4
ISS 3 10 DC 8.250E–6 .MODEL DX D (IS=800.0E–18)
HLIM 90 0 VLIM 1K .MODEL JX PJF (IS=500.0E–15 BETA=281E–6
J1 11 2 10 JX + VTO= –.065)
J2 12 1 10 JX .ENDS
R2 6 9 100.0E3
www.ti.com 4-Feb-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
5962-9469201QHA ACTIVE CFP U 10 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 9469201QHA
& Green TLC2262M
5962-9469203QPA ACTIVE CDIP JG 8 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 9469203QPA
& Green TLC2262AM
5962-9469204Q2A ACTIVE LCCC FK 20 1 Non-RoHS POST-PLATE N / A for Pkg Type -55 to 125 5962-
& Green 9469204Q2A
TLC2264
AMFKB
5962-9469204QCA ACTIVE CDIP J 14 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-9469204QC
& Green A
TLC2264AMJB
TLC2262AID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2262AI
TLC2262AIDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2262AI
TLC2262AIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2262AI
TLC2262AIDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2262AI
TLC2262AIP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 TLC2262AI
TLC2262AIPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2262A
TLC2262AIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2262A
TLC2262AIPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2262A
TLC2262AMJG ACTIVE CDIP JG 8 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 TLC2262
& Green AMJG
TLC2262AMJGB ACTIVE CDIP JG 8 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 9469203QPA
& Green TLC2262AM
TLC2262AQD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 C2262A
TLC2262CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 2262C
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TLC2262CP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TLC2262CP
TLC2262CPE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TLC2262CP
TLC2262CPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2262
TLC2262CPWG4 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2262
TLC2262CPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2262
TLC2262CPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2262
TLC2262IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 2262I
TLC2262IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLC2262IP
TLC2262MUB ACTIVE CFP U 10 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 9469201QHA
& Green TLC2262M
TLC2262QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 C2262Q
TLC2262QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 C2262Q
TLC2262QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM C2262Q
TLC2264AID ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2264AI
TLC2264AIDG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2264AI
TLC2264AIDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2264AI
TLC2264AIN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 TLC2264AIN
TLC2264AIPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2264A
TLC2264AIPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2264A
TLC2264AIPWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 Y2264A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TLC2264AMFKB ACTIVE LCCC FK 20 1 Non-RoHS POST-PLATE N / A for Pkg Type -55 to 125 5962-
& Green 9469204Q2A
TLC2264
AMFKB
TLC2264AMJ ACTIVE CDIP J 14 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 TLC2264AMJ
& Green
TLC2264AMJB ACTIVE CDIP J 14 1 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-9469204QC
& Green A
TLC2264AMJB
TLC2264AQD ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2264AQ
TLC2264AQDRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM PJ2264A
TLC2264CDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 TLC2264C
TLC2264CN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TLC2264CN
TLC2264CPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2264
TLC2264CPWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 P2264
TLC2264IDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM TLC2264I
TLC2264IN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type TLC2264IN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 4-Feb-2021
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Nov-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Nov-2020
Pack Materials-Page 2
PACKAGE OUTLINE
U0010A SCALE 1.400
CFP - 2.03 mm max height
CERAMIC FLATPACK
10
8X .050 .005
.27 MAX
GLASS
+.019
5X .32 .01 .241 5X .32 .01
-.003
.005 .001
+.013
.067
-.012
.045
.026
4225582/A 01/2020
NOTES:
1. All linear dimensions are in inches. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
7 8
C SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
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EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A
1 14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
7 8
SYMM
METAL
4214771/A 05/2017
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PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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