Summer 2020

EEE 3107 / EEE 301

Electrical Properties of
Materials

Dr. Sadid Muneer

Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU

 Hall Measurement

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.17 Page 145
 Ex 2.17, 2.18
The Hall coefficient and conductivity of copper at 300 K have been measured to be
-0.55 × 10-10 m3A-1s-1 and 5.9 × 107 Ω-1m-1 respectively. Calculate the concentration
of conduction electron and Hall mobility in copper.

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
 Thermal Conduction in Metal

• Heat transported by conduction electron.

• Hot side:
o Amplitude of the atomic vibration is
large.
o Hence, average kinetic energy of electron
is large.
o Random motion of electron is large
• Cold side:
o Energetic electron transfer extra energy
to atomic vibration by colliding.
Principles of Electronic Materials
and Devices (3E), by S. O. Kasap

4
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.19 Page 149
 Thermal Conduction in Metal
Fourier’s law of heat conduction:
The rate of heat flow is proportional to:
• Negative of temperature gradient.
• Cross sectional area.

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

5
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.20 Page 149
 Thermal Conduction in Metal
Fourier’s law of heat conduction:
The rate of heat flow is proportional to:
• Negative of temperature gradient.
• Cross sectional area.

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

6
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.20 Page 149
 Similarity between Thermal and Electrical Conduction

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
 Relation between Thermal and Electrical Conduction

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

8
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.21 Page 150
 Relation between Thermal and Electrical Conduction

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

9
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.22 Page 151
 Electrical and Thermal Resistance

A
V

Principles of Electronic Materials

and Devices (3E), by S. O. Kasap

10
Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
Figure 2.24 Page 153
 Thermal Resistance: Problem

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
 Thermal Resistance: Problem

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
 Heat Conduction in non-metal

• No free electrons in nonmetals

• Atoms and bond ≈ Balls connected with springs
• KEavg ∞ Temperature
• Heat propagates as vibrational wave (phonon).
• Strong bond ≈ higher thermal conductivity, ex:
diamond has κ = 1000 W m-1 K-1.
https://gfycat.com/gifs
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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU
 Thanks!

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Copyright: Dr. Sadid Muneer, Assistant Professor, Dept. of EEE, UIU