This report provides a comprehensive analysis of the Nokia Networks 4G AirScale

Digital Baseband Unit (BBU). The configuration of the 4G AirScale is:

AMIA Subrack
ASIA Common Plug In Unit
ABIA Capacity Plug In Unit
Features

System Functional Description

System Level Block Diagrams
High Level Mechanical Analysis
Heat Sink
High Level PCB Analysis
Component Diagrams
Semiconductor/component locations on PCB
High Level Bill of Materials
Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
Passive/other components (Transformers, Power inductors, Power capacitors,
power/datacom/optical connectors)
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Excludes analysis of low power passive chip resistors, capacitors, and inductors
Important Note: There is NO component pricing contained within the report.