Accepted Manuscript

Physical and chemical characterization and recycling potential of desktop

computer waste, without screen

Claudia Adriana Kohl, Luciana Paulo Gomes

PII: S0959-6526(18)30551-1

DOI: 10.1016/j.jclepro.2018.02.221

Reference: JCLP 12168

To appear in: Journal of Cleaner Production

Received Date: 19 March 2017

Revised Date: 19 December 2017

Accepted Date: 20 February 2018

Please cite this article as: Claudia Adriana Kohl, Luciana Paulo Gomes, Physical and chemical
characterization and recycling potential of desktop computer waste, without screen, Journal of
Cleaner Production (2018), doi: 10.1016/j.jclepro.2018.02.221

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 ACCEPTED MANUSCRIPT

Physical and chemical characterization and recycling potential of desktop computer

waste, without screen

Abstract
Environmentally appropriate and efficient recycling of several materials contained in
waste electrical and electronic equipment (WEEE) requires knowledge and the
identification of materials and chemical elements forming this kind of waste. Therefore,
this study presents the physical and chemical characterization of desktop computer waste
and the potential recycling rates of these materials. Differently from other studies, which
investigated recycling and chemical composition only of motherboards (the component
that contains precious metals), here were evaluate all components, namely floppy disk
drives, CD drives, IDE cables, HDs, coolers, motherboards, power supply units, lids,
casings, and other parts. This study was carried out in three steps: (i) the physical
characterization included the manual dismantling of these components, and grouping the
materials under seven categories (plastics, non-ferrous metals, ferrous metals, materials
with substances of interest, hazardous materials, wires and cables, and other materials);
(ii) potential recycling rates were calculated according to the European Directive
2102/19/EU; (iii) chemical characterization of components based on X-ray fluorescence
spectroscopy. The results showed that the potential recycling rate of the waste analyzed
was 96.66%, which represents the amount of material that can be recycled in the samples
investigated. The results also show that, besides motherboards, other components also are
potentially recyclable. Noble, precious, and critical metals as well as and rare earth
elements were detected in IDE cables, power supply units, hard disks, floppy disk drives,
and motherboards. Parts with high levels of aluminum, copper, and zinc were also
observed. Recycling of WEEE is important both economically and environmentally, since
PC components, since these elements may be recycled in processes that use less energy,
preventing the extraction of natural raw materials and minimizing environmental impact.

Keywords: physical and chemical characterization; WEEE; recycling of computers.

1 Introduction
In light of the growing global waste generation figures, several countries have
engaged in discussions on the creation and enforcing of laws and directives towards
enhancing the effectiveness of waste treatment systems and adopting proper management
actions. Passed in 2010, a specific Brazilian law (Brasil, 2010a) created the National Solid
Waste Policy (PNRS), whose objectives include mainly the non-generation or the
reduction, reuse, recycling, and treatment of solid waste as well as its final disposal in an
environmentally proper way. However, the PNRS also covers incentives to the recycling
industry with a view to using raw materials and inputs obtained from recycled materials.
Though the legislation deals with solid waste as a whole, waste electrical and electronic
equipment (WEEE) was given especial attention, since the PNRS demands the
implementation of an integrated management system based on reverse logistics
(BRASIL, 2010a).
At global level, European Directive 2012/19/UE addresses exclusively WEEE,
outlining instructions to prevent generation and to devise strategies for the reuse and
recycling of this class of waste, in addition to other methods to improve its value. When

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the reuse of WEEE and its components is not possible, value chain optimization should
be the most appropriate action to take (European Union, 2012). The objectives of this
optimization process vary with the class of electronic device. For example, 70% of
materials, components, and substances of class 3 devices (computer and
telecommunication items), which include desktop computers, have to be recycled after
14 August 2015 (European Union, 2012). Interestingly, together with class 4 equipment
(consumer equipment and photovoltaic panels), class 3 devices have the highest amounts
of precious metals of all classes of equipment covered by European Directive 2012/19/EU
(Brogaard and Christensen, 2012).
It has been estimated that 41.8 million tons of WEEE were generated in 2014 and
that this number may reach 50 million tons by 2018 (Baldé et al., 2015). With increasing
amounts generated every year on a global scale, WEEE stand as some of the most severe
current environmental problems (Huang et al., 2009). Additionally, WEEE are among the
most complex waste streams, requiring specific management efforts (Modak et al., 2015).
The popularization of information technology has prompted computer (PC) sales.
In 2013 approximately 2 billion PCs were in use worldwide (Varin and Roinat, 2008). In
Brazil, the number of PCs has reached 152 million units, and it is projected to rise to 208
million (that is, one per inhabitant) in 2017 (Meirelles, 2015). In this context, Schluep et
al. (2009) have reported the trend towards increasing PC waste figures until 2020, mainly
in developing countries, where these products have not as yet reached the same level of
popularity as observed in developed economies. Araújo et al. (2012) estimated that 0.56
kg/inhabitant are produced a year in Brazil. Based on the capacity to adapt waste pre-
treatment and final disposal technologies, Brazil enjoys an interesting WEEE recycling
capacity at large scale, compared with other developing nations (Schluep et al., 2009).
Pre-treatment includes the disassembling of PCs and the separation of parts,
modules, and components (Araújo, 2013). These elements should be carefully sorted so
as to be recovered appropriately by specialized agents (Varin and Roinat, 2008). Manual
disassembling during pre-treatment guarantees the correct recycling of WEEE (Buchert
et al., 2012). Not requiring high technologies, manual sorting has some advantages over
mechanical separation, such as the low operational costs in addition to the possibility to
release components more easily (Wang et al., 2012).
Secondary treatment includes metallurgical, chemical, and physical processes as
well as energy recovery operations (Araújo, 2013). The main objective of these
procedures is to recycle metals and plastics present in WEEE (Cui and Zhang, 2008).
In turn, the main methods currently used to recover metals in WEEE include
pyrometallurgical, hydrometallurgical, and biometallurgical operations (Cui and Zhang,
2008). As hydrometallurgical and pyrometallurgical have gained an important position in
precious metal recovery at industrial scale, pyrometallurgy is used to recycle non-ferrous
metals, besides precious ones (Veit et al., 2014).
Plastics are recycled according to four main approaches, namely (i) primary (re-
extrusion), (ii) secondary (mechanical recycling), (iii) tertiary (chemical recycling),
and(iv) quaternary recycling (energy recovery). Primary and secondary recycling are
widely used, while tertiary and quaternary systems are considered to be sustainable
solutions (Al Salem et al., 2009). Raw material recycling by pyrolysis is seen as the most
promising route to treat WEEE plastics that contain flame retardants (Yang et al., 2013).
However, this process has the disadvantage of producing toxic gases (Moltó et al., 2011).
Several studies have looked into recycling of cables and wires as a means to

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separate metals (usually copper) from plastics in these materials. For example, Araújo et
al. (2008) evaluated the recycling of cables using unit operations adopted in ore
processing. Also, Souza and Tenório (2010) examined hydrometallurgical process to
recover metals from used batteries, while Provazi et al. (2012) investigated solvent
extraction processes as a way to recover metallic elements in these batteries.
Importantly, recycling of the variety of materials present in PC waste emerges as
an opportunity to recover raw materials using environmentally friendly methods. In this
sense, the increase in metal waste prices observed recently is due to the scarcity of raw
materials, a consequence of the rising demand (Varin and Roinat, 2008). So, added to the
fact that recycling has become an economically interesting alternative (Varin and Roinat,
2008; Tansken, 2013), scarcity of some metals may become a limiting factor in the
production of electronic equipment in the future (Hirschier et al., 2007). A study
commissioned by the US Department of Energy (DOE) evaluated supply and demand
scenarios of 16 chemical elements whose availability has dropped to critical levels,
including the rare earth elements: lanthanum (La), cerium (Ce), praseodymium (Pr) ,
samarium (Sm), yttrium (Y), neodymium (Nd), europium (Eu), terbium (Tb), and
dysprosium (Dy), apart from indium (In), gallium (Ga), tellurium (Te), cobalt (Co),
lithium (Li), nickel (Ni), and manganese (Mn). The results indicated that the imminent
scarcity of these essential raw materials may, in the medium term (between 2015 and
2025), interrupt the evolution of several clean energy technologies (Bauer et al., 2011).
Recycling of materials containing rare earth elements is not established at industrial scale
worldwide due to the fact that recovery rate of these elements is below 1%. In this sense,
it is important to define temporary storage sites for wastes containing these raw materials
for subsequent recycling in the near future (Buchert et al., 2012).
Another important aspect about PC waste is the presence of several chemical
elements. Although the plastics present in WEEE account for 30% of this kind of waste
(Taurino et al, 2010; UNEP, 2005) and contain organic materials that may be used to
produce fuels or chemical raw materials after proper treatment (Yang et al., 2013), this
material also contains brominated flame retardants (BFRs). Forming a large class of
chemical substances with individual chemical and structural properties (Monchamp,
2000; Silva, 2014), flame retardants represent approximately 15% of the mass of plastics
present in desktop PCs (Crowe et al., 2003).
More specifically, antinomy (Sb) is sold as antinomy trioxide (Sb2O3). As a non-
halogenated compound that is also the only antinomy substance used as flame retardant
(Silva, 2014), Sb2O3 is employed as encapsulation agent of chips in printed circuit boards
(PCBs) and in video units (Monchamp, 2000). In turn, Ni applications include batteries,
PC cases, cathode ray tubes (CRT), and PCBs (Kiddee et al., 2013). Cadmium (Cd) and
Li are conventionally used in PCs. In the past, nickel-cadmium batteries represented less
than 1% of the batteries used in PCs; however, environmental concerns induced the
replacement of these by lithium ion batteries (Monchamp, 2000).
Lead (Pb) is used in welding operations, lead-acid batteries, CRT monitors, in
addition to cables and PCBs (Kiddee et al., 2013). In a PC, Pb accounts for 6.3% of its
weight, most of which is found in the monitor. The second largest source of Pb in a PC
are the welds used to connect chips and components of PCBs. The metal is also used as a
stabilizer to plastics in some polyvinyl chloride (PVC) applications (Monchamp, 2000).
Although chromium (Cr) may be found in PC linings, such applications are rare
(Markley, 2001). Similarly to hexavalent Cr, Pb, mercury (Hg), Cd, polybrominated
biphenyls (PBBs), and polybrominated diphenyl ethers (PBDEs) are considered

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hazardous components in electronic equipment. In this sense, European Directive

2011/65/EU defines rules restricting the use of these substances in such equipment, with
some exceptions (European Union, 2011).
Used to reduce flammability of PCBs, plastics, keyboards, and cables, BFRs are
halogen compounds containing bromide that, together with their chlorinated counterparts
(chlorinated flame retardants, CFRs) represent the most used class of flame retardants
used in several industrial sectors (Markley, 2001; Kiddee et al., 2013).
Although Markley (2001) and Crowe et al. (2003) have claimed that PCs contain
polychlorinated biphenyls (PCBs), Monchamp (2000) and OECD (2003) point to the
misinterpretations in specialized literature as to the use of PCBs in PCs, drawing attention
to the fact that these compounds are not detected in PC waste. One explanation for this
may lie in the fact that PCBs have been banned in most countries, including Brazil, where
applications of these compounds were prohibited by specific legislation in 1981 (Brasil,
2010b). Similar discrepancies have been observed concerning Pb, which, according to
Crowe et al. (2003) are present in PCs, though Monchamp also warns about conflicting
findings published in the literature.
In this scenario, the present study presents the physical and chemical
characterization of central processing units (CPUs) and describes the calculation of the
potential recycling rate (PRR) of PC waste. The appropriate disposal of WEEE requires
specific, in-depth knowledge, and the results of the present study may be useful in the
development of environmentally friendly management approaches to dispose of this class
of waste.

2 Materials and methods

A pre-treatment unit dedicated to PC waste was established in the Laboratory of
Environmental Sanitation, Civil Engineering Post-Graduation Program, University of
Vale do Rio dos Sinos (UNISINOS), in the city of São Leopoldo, Rio Grande do Sul
(RS), Brazil. We analyzed the amount of WEEE disposed of by the University in 2013.
Of the 903 WEEE discarded in that year, 77.6% were desktop PCs, 34% of which were
horizontal IBM advanced technology extended (ATX) 5th generation PCs equipped with
a Pentium 4 processor and manufactured in October 2002. Five CPUs were selected, since
they represented mots WEEE disposed by the University in 2013. These CPUs were
weighed, and the weight variation coefficient was calculated as a means to assess sample
homogeneity.

2.1 Physical characterization of PC waste

The physical characterization of PC waste was carried out by visual inspection of
each CPU, as commonly conducted in WEEE pre-treatment units. Initially, each CPU
was measured (height, length, and width) using a metallic measuring tape. Then, weight
was obtained using 50 kg scales with a 10 g precision range (MP-50, Balmak).
Next, each CPU was disassembled manually, removing, sorting, and weighing
eight components: (1) floppy disk drives, (2) CD drives, (3) integrated drive electronics
(IDE) cables, (4) hard disks (HD), (5) coolers, (6) motherboards, (7) power supply units
(PSUs), and (8) lids, cases and other parts. Each component was sorted, weighed, and
disassembled. This stage was carried out according to Varin and Roinat (2008). Total
disassembling time was recorded for all CPUs used.

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Concerning PCBs of components, the parts that came off more easily were
removed and then boards were placed on a hot plate at 300ºC (Quimis) until welds melted,
within roughly 10 min. Then, welded elements were manually removed using appropriate
tools. Since PCBs release toxic compounds when heated (Moltó et al., 2001), this stage
was carried out in a fume hood. All operations were carried out using appropriate personal
safety equipment, including heat-resistant gloves.
After, each component was disassembled according to seven classes of materials:
(1) plastics, (2) non-ferrous metals, (3) ferrous metals, (4) materials containing substances
of interest as defined by Kasper et al. (2011), Veit et al. (2006), and Yamane et al. (2011)
(including PCBs and components such as microprocessors and respective sockets,
memories, aluminum (Al) electrolytic capacitators, and electronic components), (5)
hazardous materials as defined by specific Brazilian legislation (Brasil, 2008).
Importantly, after sorting these materials were weighed (MP-50, Balmak, and FA-2204-
BI, Bioprecisa). The classification of ferrous and non-ferrous metals was confirmed based
on chemical analysis. Metals were sorted considering the concentration present in the
component inspected.
Then a mass balance of each plastic type in CPUs was carried out, for each unit
individually. Plastic types were sorted following the specific official Brazilian standard
(ABNT, 2008) and sorted into two groups, identified and unidentified plastics, which
were weighed. Next, identified plastics were sorted for type and weighed.

2.2 Calculation of the potential recycling rates of CPU waste

Values of Potential recycling rates (PRR) were calculated according to the
European Directive 2012/19/UE (European Union, 2012). Initially, PRR was calculated
for the seven groups of materials integrating CPUs. Then, PRR was obtained for the eight
components and then for a CPU considered as a whole. The calculations are based on the
ratio of the weight of recyclable material to the weight of the total CPU.

2.3 Characterization of the chemical elements present in CPU waste

After sorting and calculation of PRRs of CPU waste, parts were stored according
to specific Brazilian standard (ABNT, 2004) upon analysis.
The chemical elements present in 185 parts categorized into the eight component
classes described above was carried out. More specifically, elements present in
motherboards were analyzed according to Veit (2005). Motherboards of each CPU were
ground individually in a 7.5-HP horizontal mill (MGHS 7.5, Seibt) with two extractor
blades and three rotating blades and equipped with an 870-rpm, 380-V, and 60-Hz engine.
The mill feed nozzle measured 205 mm x 275 mm, and the capacity of the equipment was
360 kg. Ten grams of each motherboard sample were used in this analysis. The other
PCBs of each CPU were pooled and milled together, from which another 10-g sample
was collected and analyzed as described below.
Qualitative chemical composition of CPU waste samples (10 g) was analyzed in
an X-ray fluorescence spectrometer (EDX 720, Shimadzu) by dispersive energy in the
Na11 – U92 spectrum range. Elements were sorted into three groups: main (over 50% of
the sample), secondary (accounting for between 50% and 5% of the sample), and trace
elements (below 5%).

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Grain size distribution of ground motherboards was carried out in a mechanical

shaker (4879, Solotest) with 12 screen openings (#6, #12, #20, #30, #40, #50, #70, #100,
#140, #200, #270, and #300 mesh). Retained fractions were weighed in analytical balance
(Bioprecisa).
The chemical elements of the 13 kinds of plastics sorted from the five CPUs used
were also analyzed by X-ray fluorescence spectroscopy, as described for the
motherboards and other PCBs.

3 Results and discussion

In total, 52.81 kg CPU waste were analyzed. CPUs were of identical size (H =
13.5 cm, W = 42.5 cm, L = 41.5 cm). Mean weight of CPUs was 10.56 kg, and the
coefficient of variation on weight basis (1.6%) indicates the homogeneity of samples.

3.1 Mass balance of CPUs

Mean weigh of components is shown in Table 1. Components (1), (2), (3), (4) and
(5) represented 18.29% of a CPU waste. In turn, together components (6), (7), and (8)
accounted for 81.70% of a CPU waste. Mean disassembly time was 9 h.

Table 1: Mean weight and percent content of each component in CPU waste.
Weight Mean weight of eight components of CPUs (kg)
(kg)
(1) (2) (7)
CPU (3) (6) (8)
CPU as (4) (5) Power (8) (8)
Floppy CD Mother Other
received IDE Cooler supply
disk drive dri HD board Lid Case parts
cables unit
ve
1 10.65 0.41 0.89 0.13 0.61 0.06 1.09 1.28 2.38 2.68 1.12
2 10.35 0.40 0.75 0.14 0.42 0.06 1.09 1.27 2.40 2.66 1.16
3 10.51 0.40 0.88 0.13 0.43 0.06 1.09 1.28 2.38 2.70 1.16
4 10.50 0.40 0.89 0.14 0.37 0.06 1.11 1.27 2.41 2.69 1.16
5 10.80 0.41 0.88 0.14 0.54 0.06 1.12 1.27 2.48 2.70 1.20
Mean 10.56 0.40 0.86 0.14 0.47 0.06 1.10 1.27 2.41 2.69 1.16
8.12
Percent content 3.83% 1.29% 4.49% 0.57% 10.41% 12.06% 22.82% 25.43% 10.98%
%

3.1.1 Mass balance of materials from each component

Table 2 shows the mean weight of materials forming components and the percent
composition of each material in the weight of a given component.

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Table 2: Mean weight of groups of materials of components and percent content of each
material in a component’s weight.
Mean weight of materials of each component (kg)
(1) (2) (3) (4) (5) (6) (7)
Mean
Plástics Ferrous
Components Non- Materials Hazardous Wires Other component
metals
ferrous with materials and materials weight (kg)
metals substances of cables
interest
(1) Floppy disk drives 0.011 0.009 0.356 0.011 0 0 0.017 0.404
Percent content 2.62% 2.28% 88.12% 2.72% 0% 0% 4.26%
(2) CD drives 0.195 0.021 0.551 0.074 0 0 0.017 0.858
Percent content 22.77% 2.40% 64.27% 8.62% 0% 0% 1.93%
(3) Cabos IDE 0.036 0.010 0 0 0 0.090 0 0.136
Percent content 26.47% 7.35% 0% 0% 0% 66.18% 0%
(4) HDs 0.010 0.318 0.114 0.014 0 0 0.018 0.474
Percent content 2.07% 67.09% 24.05% 3.00% 0% 0% 3.80%
(5) Coolers 0.028 0.003 0.013 0.002 0 0.004 0.010 0.060
Percent content 47.33% 4.67% 21.00% 3.00% 0% 6.67% 17.33%
(6) Placas-mãe 0.158 0.482 0.081 0.351 0.003 0.002 0.023 1.100
Percent content 14.36% 43.82% 7.33% 31.93% 0.27% 0.18% 2.11%
(7) Power supply units 0.050 0.123 0.522 0.179 0 0.170 0.230 1.274
Percent content 3.92% 9.65% 40.97% 14.03% 0% 13.34% 18.07%
(8) Lids, cases, and 0.240 5.866 0.062 0 0 0.052 0.037 6.256
other parts
3.83% 93.77% 0.98% 0% 0% 0.82% 0.59%
Percent content
Total weight (kg) 10.562
(1) Floppy disk drives. Ferrous metal was the most representative material (88.12%). Mean dismantling
time was 1 h.
(2) CD drives: Ferrous metal was the most representative material (64.27%). Mean dismantling time was
1 h 30 min.
(3) IDE cables: Wires and cables were the most representative materials (66.18%). Mean dismantling time
was 2 h 20 min.
(4) HD drives: Non-ferrous metal was the most representative material (67.09%). Mean dismantling time
was 20 min.
(5) Coolers: Plastic was the most representative material (47.33%). Mean dismantling time was 20 min.
(6) Motherboards: Plastic was the most representative material (43.23%). Mean dismantling time was 2 h
45 min.
(7) Power supply units: Ferrous metal was the most representative material (49.97%). Mean dismantling
time was 2 h.
(8) Lids, cases, and other parts: Non-ferrous metal was the most representative material (93.77%). Mean
dismantling time was 50 min.

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3.2 Mass balance of CPU materials

The mass balance of the seven material groups is shown in Table 3.

Table 3: Mean weight of groups of materials and percent content of each material in total
mean weight of waste.
Mean weight per type of material (kg)
Total (1) (2) (3) (4) (5) (6) (7)
CPU Plastics
CPU weight Non- Ferrous Materials Hazardous Wires Other
ferrous metals with materials and materials
(kg) metals substances cables
of interest
1 10.65 0.699 6.804 1.829 0.638 0.003 0.314 0.363
2 10.35 0.711 6.825 1.503 0.637 0.003 0.306 0.365
3 10.51 0.695 6.824 1.713 0.626 0.003 0.316 0.333
4 10.50 0.767 6.779 1.663 0.624 0.003 0.326 0.338
5 10.80 0.767 6.926 1.783 0.630 0.003 0.326 0.365
Mean 10.56 0.728 6.832 1.698 0.631 0.003 0.318 0.353
Percent content 6.89% 64.68% 16.08% 5.97% 0.03% 3.01% 3.34%

Hischier et al. (2007) manually dismantled one desktop CPU (11.30 kg) of the
same make and year as those of the CPUs used in the present study, obtaining 0.26 kg,
0.46 kg, 6.99 kg, 4.01 kg, 0.003 kg, 0.321 kg, and 2.26 kg for classes (1), (2), (3), (4), (5),
(6), and (7), respectively. Non-ferrous content was 0.46 kg and 6.99 kg in the study by
Hischier et al. (2007) and in the present investigation, respectively. This difference may
be explained in light of the analyses carried out in each study to identify main elements.
Other materials accounted for 0.353 kg, indicating an 84.4% drop when compared with
the value obtained in the study cited (2.26 kg). This shows that the dismantling method
used in the present study was more elaborate and therefore afforded to better sort
materials.

3.2.1 Mass balance of plastics in CPUs

Table 4 presents the mass of plastics present in the samples analyzed.

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Table 4: Mean weight of plastics. Percent content of this material in total weight of CPUs
and percent content of these materials in total plastics weight.
Total Mean weight of plastics in CPUs
CPU
CPUs weight Total plastics weight Identified plastics Unidentified
plastics

(kg) (kg) (%) (kg) (%) (kg) (%)

1 10.65 0.699 6.56% 0.290 2.72% 0.409 3.84%
2 10.35 0.711 6.87% 0.330 3.19% 0.380 3.67%
3 10.51 0.695 6.61% 0.290 2.76% 0.405 3.85%
4 10.50 0.767 7.30% 0.380 3.62% 0.387 3.69%
5 10.80 0.767 7.10% 0.350 3.24% 0.417 3.86%
Mean 10.56 0.728 6.89% 0.328 3.11% 0.400 3.78%
Percent content 45.14% 54.86%

In another study, Martinho et al. (2012) concluded that plastic contents in CPUs
is higher than 10% of the unit’s total weight.
Table 5 shows the weight of identified plastics. Martinho et al. (2012) reported an
average content of 44% of ABS plastics in computers. ABS/PC content was 22%, which
makes it the second most common plastic in CPUs. The other plastics detected in the
study by Martinho et al. (2012) (PS, HIPS, SB, PPO, PC, PVC, PA, PBT, PE, PCPT, and
PO) were not observed in the CPUs analyzed in the present study.

Table 5: Mean weight of identified plastics. Percent content of these plastics in total
weight of CPUs and percent content of these in the total weight of identified plastics.
Total Mean weight of plastics per type of plastic
identified ABS ABS/PC
CPUs Content Content ABS/PB Content PS/PPE Content
plastics plastics in CPUs Palstics in CPUs T plastics in CPUs plastics in CPUs
(kg) (kg) (%) (%) (kg) (%) (%) (kg) (%) (%) (kg) (%) (%)

1 0.290 0.170 1.60% 0.040 0.38% 0.000 0.00% 0.080 0.75%

2 0.330 0.150 1.45% 0.070 0.68% 0.110 1.06% 0.000 0.00%
3 0.290 0.170 1.62% 0.040 0.38% 0.000 0.00% 0.080 0.76%
4 0.380 0.160 1.52% 0.120 1.14% 0.100 0.95% 0.000 0.00%
5 0.350 0.220 2.04% 0.050 0.46% 0.000 0.00% 0.080 0.74%
Mean 0.328 0.174 1.64% 0.064 0.61% 0.042 0.40% 0.048 0.45%
Percent content 52.96% 19.56% 12.97% 14.51%

Considering the types of plastics present in a typical desktop computer, the most
common are acrylonitrile butadiene styrene (ABS) (57%), polyphenylene oxide (PPO)
(36%), high impact polystyrene (HIPS) (5%), and acrylonitrile butadiene

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styrene/polycarbonate (ABS/PC) (2%). Polyvinyl chloride (PVC) represents only 6% of

this value (Markley, 2001). In the present study, PPO, PSAI, and PVC were not identified,
which affords to conclude that these plastics are present in keyboards or CRT video
monitors.
Concerning the plastics forming the CPUs, the most representative ones were
those that could not be classified. The identification and standardization of plastics
contained in WEEE are essential in the definition of disposal and recycling strategies. In
addition, these measures increase the commercial value of these byproducts. It was
observed that, in the year the CPUs analyzed were manufactured (2002), there was
already some concern about the identification of plastics, which facilitates the
management of this kind of waste.

3.3 Potential recycling rate of materials, components, and CPUs

Groups (1), (2), (3), (4), (5), and (6) were considered recyclable (table 6). These
groups of materials meet the requirements prescribed in the European Directive
2012/19/UE, in terms of the rate of 70% stipulated for recycling and of 80% of value
chain optimization.
Group (7) was considered non-recyclable, since these elements are produced using
mixed materials, like adhesive nameplates, foams, latex, rubbers, mixed waste (plastics
and metals), among others. This group did not meet the requirements prescribed in
European Directive 2012/19/EU concerning the 70% recycling rate for materials (Table
6|).

Table 6: Potential recycling rate of the seven groups of materials of CPU waste.
Mean Content in Total percent PRR of each
Group of materials CPUs (%) content PRR (%) group (%)
total weight (kg)
(1) Plastics 0.728 6.89 6.89 100
(2) Non-ferrous metals 6.832 64.68 64.68 100
(3) Ferrous metals 1.698 16.08 16.08 100
(4) Materials with substances of
0.631 5.97 5.97 100
interest
(5) Hazardous materials 0.003 0.03 0.03 100
(6) Wires and cables 0.318 3.00 3.00 100
(7) Other materials 0.353 3.34 0.00 0
Total 10.562 100.00 96.66

The PRR obtained (96.66%, Table 7) represents the amount of materials that may
be recycled in the samples studied. The lowest PRR of a component was 81.96% (Table
8). Therefore, all CPUs and respective components meet the European Directive
2012/19/EU for PRR.

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Table 7: Potential recycling rate (individual and total) of CPUs.

Total mean weight Recyclable material Non-recyclable PRR
CPU
(kg) (kg) material (kg) (%)
1 10.650 10.287 0.363 96.59
2 10.350 9.985 0.365 96.47
3 10.510 10.177 0.333 96.83
4 10.500 10.162 0.338 96.78
5 10.800 10.435 0.365 96.62
Mean 10.562 10.209 0.499 96.66

Table 8: Potential recycling rate of eight CPU components.

Total mean weight Recyclable Non-recyclable PRR
Components
(kg) material (kg) material (kg) (%)
(1) Floppy disk drives 0.404 0.387 0.017 95.74
(2) CD drives 0.858 0.841 0.017 98.07
(3) IDE cables 0.136 0.136 0.000 100.00
(4) HDs 0.474 0.456 0.018 96.20
(5) Coolers 0.060 0.050 0.010 82.67
(6) Motherboards 1.100 1.077 0.023 97.89
(7) Power supply units 1.274 1.044 0.230 81.93
(8) Lids, cases, other parts 6.256 6.219 0.037 99.41
Mean 10.562 10.209 0.353 96.66

3.4 Characterization of the chemical elements of CPU waste

In total, 47 chemical elements were detected, of which 35 are classified as metals
(34 non-ferrous and one ferrous metal (Fe)), four are semi-metals (silicon (Si),
germanium (Ge), antimony (Sb), polonium (Po)) and eight are non-metals (phosphor (P),
sulfur (S), selenium (Se), and the halogens fluorine (F), chlorine (Cl), brome (Br), iodine
(I), astatine (At)). Non-ferrous metals observed were aluminum (Al), cobalt (Co), chrome
(Cr), copper (Cu), gallium (Ga), manganese (Mn), molybdenum (Mo), niobium (Nb),
nickel (Ni), lead (Pb), rhenium (Re), tin (Sn), tantalum (Ta), titanium (Ti), vanadium (V),
tungsten (W), zinc (Zn), zirconium (Zr), the alkaline metals cesium (Cs), potassium (K),
rubidium (Rb), the alkaline earth metals barium (Ba), calcium (Ca), strontium (Sr), the
precious metals silver (Ag), gold (Au), iridium (Ir), osmium (Os) and the rare earth
elements actinium (Ac), neodymium (Nd), scandium (Sc), terbium (Tb), thulium (Tm),
and ytterbium (Yb)).
Of the 47 elements identified, 13 were main elements, 19 were secondary
elements, and 45 were present at trace levels. An element may be a main element in one
component and a trace element in another.
Pedersen et al. (1996) investigated the chemical composition of a typical ATX

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desktop computer (CPU, monitor, and keyboard) weighing 31.8 kg. The analysis revealed
the presence of 24.9% Si, 23% plastics, 20.5% Fe, 14.2% Al, 7% Cu, 6.3% Pb, 2.2% Zn,
1.0% Sn, and 0.85% Ni. In turn, Ba and Mn contents were 0.03%, while Ag, Be, Co, Ta,
and Ti levels were 0.01%. Elements like As, Au, Bi, Cd, Cr, Ga, Ge, Hg, In, Ru, Sb, and
Se were present at levels between 0.0095% and 0.001%, while elements Eu, Nb, Pd, Pt,
Rh, Tb, V, and Y were present at trace levels under 0.0003%. The elements As, Be, Bi,
Cd, Eu, Hg, In, Pd, Pt, Rh, Ru, and Y were detected in PCBs, connectors, cables, and the
monitor, but were not detected in the CPUs analyzed in the present study.

3.4.1 Characterization of chemical elements of each component

The chemical elements detected in the chemical analyses carried out in the various
parts of the components are shown in Table 9.

Table 9: Chemical elements detected in the several parts of the eight components.
Main Secondary elements Trace elements
Components elements (>5% x <50%)
(<5%)
( >50%)
(1) Floppy disk drives Br, Fe, Cu Ca, S, Si, Zn Ca, Co, Cu, Fe, Ni, Mn, S, Si, Ti, Zn
Ac, Ag, At, Br, Ca, Co, Cu, Cr, Fe, Ga,
Al, Br, Cu, Fe,
(2) CD drives Ca, Cl, Ni, S, Si, Sn, Sb, Zn Ge, Ir, K, Mn, Ni, P, Pb, Po, S, Sb, Sr,
Si, Ti
Sn, Si, Ta, Ti, Zn, Zr
Au, Br, Ca, Cu, Fe, I, Ni, Os, Pb, Rb, S,
(3) IDE cables Br, Cl, Cu Ca, Ni, Pb, S, Si, Sn, Zn
Sb, Se, Si, Sn, Sr, Ti, Zn
Ac, Ba, Ca, Co, Cr, Cu, F, Fe, Ge, K,
Al, Br, Fe, Ni,
(4) HDs Ca, Cu, Cr, Fe, Ni, P, S, Si, Zn Mn, Mo, Nd, Ni, Pb, S, Se, Si, Sn, Ta,
Cu, Si
Ti, V, Zn, Zr, W
Ca, Co, Cu, Fe, Ni, Os, Pb, S, Sb, Si,
(5) Coolers Br, Cl, Cu Ca, S, Si
Sn, Sr, Ti, Zn
Ag, Au, Ba, Br, Ca, Co, Cr, Cs, Cu, Fe,
Al, Br, Ca, Cu,
Au, Ba, Br, Ca, Cl, Cr, Cu, Fe, Ga, I, Ir, K, Mn, Mo, Ni, Nb, Nd, Os,
(6) Motherboards Fe, Ni, Sb, Si,
Ni, P, Pb, S, Sb, Si, Sn, Zn Pb, Rb, S, Sb, Sc, Si, Sn, Sr, Ta, Tb, Ti,
Sn, Zn
V, Zn, W, Yb
Al, Br, Ca, Cl, Ag, Ba, Br, Ca, Cu, Co, Cr, Fe, Ga, I, K,
Ba, Br, Ca, Cl, Cu, Fe, Ni, Pb,
(7) Power supply units Cu, Fe, Pb, Si, Mn, Ni, Pb, Re, S, Sb, Si, Sn, Sr, Ta,
S, Sb, Si, Sn, Ti, Zn
Sn Tb, Ti, Zn, Zr
(8) Cases, lids, and other Br, Cl, Fe, Ti, Br, Ca, Cl, Fe, Nd, P, S, Sb, Si, Ba, Br, Ca, Cr, Cu, Fe, Mn, Nb, Ni, Os,
parts Zn Ti, V Pb, S, Sb, Si, Sn, Sr, Ti, Tm, V, Zn

Floppy disk drives are manufactured essentially using ferrous metals (Table 10).
These components have two PCBs measuring 51 cm2 and 27.5 cm2 that have to be
removed and given appropriate treatment. Annex VII of European Directive 2012/19/EU
prescribes that PCBs over 10 cm2, batteries, plastics containing flame retardants, and
electric cables have to be removed from electronic equipment independently of the hazard
level they pose (European Union, 2012).

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Table 10: Chemical elements detected in floppy disk drives.

Main Trace elements
Name of parts in floppy disk Secondary elements
Part elements
drives (>5% x <50%) (<5%)
( >50 %)
P1 Wire Cu Ca, Co* -
P2 Plate Fe Zn Mn*, Ni*, Si
P3 Lide Fe Zn Mn*, Ni*, Si
P4 Body Fe Zn Mn*, Ni*, Si
P5 PCB Br, Ca Cu, Si Fe, Pb, Ni*, S, Sn, Sr, Ti, Zn
P6 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni, S, Ti, Zn
Legend: (*) critical element.

CD drives are manufactured basically using ferrous metals (Table 11). These
drives have two PCBs measuring 154 cm2 and 42 cm2 that contain elements with
substances of interest. Capacitors (P1), which are made of Al, have to be removed, which
affords to conclude that capacitors present in PCBs are aluminum electrolytic elements.
These capacitors have high-purity aluminum (Imam, 2007). The presence of Cl indicates
the that CFRs were used in the production of this component. Pb and Sn are used to weld
components onto PCBs. These elements are present in PCBs waste (P9), which detach
when heated. The presence of Br indicates that BFRs were used in the production of this
component.
Table 11: Chemical elements detected in CD drives.
Name of parts in Main elements Secondary Trace elements
Part CD drives ( >50%) elements
(<5%)
(>5% x <50%)
Cr, Ag2*, Pb, Ni*, Cu, Fe, Mn*, Zn, At, Ac3*,
P1 Capacitors Al Cl
Ir2*, Po, Ca, P, Ga*, Ge, S, Sn, Si, Ti, Ta
P2 Copper wires Cu - Ca, Co*, S, Si
P3 Copper wires Cu - Ca, Co*, S, Si
P4 Copper wires Cu - Ca, Co*, S, Si
P5 Lid Fe Zn Mn*, Si
P6 Body Fe Zn Mn*, Si
P7 Inner part Fe Zn Mn*, Ca, Si
P8 Printed circuits Si Sb Pb, Cu, Zn, Br, Sn
P9 PCB rests Cu, Br Ni*, Zn, Si, Sn Pb, Fe, Ca, Sb, Sr, Ti, Zr
P10 PCB Br, Ca Cu, Si Fe, Pb, Ni*, S, Sn, Sr, Ti, Zn
P11 ABS/PBT Br - Cr, K, Ti
P11 PS/PPE Ti Zn -
Non-identified
P11 Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
plastic
Legend: (*) critical element, (2*) precious metal, (3*) rare earth.

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The parts used in the manufacture of IDE cables (Table 12) present substance of
interest in non-ferrous metals (P1, P2) and plastic cables (P3). The presence of Ca
indicates the use of calcium chloride (CaCl2), which is widely employed in plastics, while
presence of Cl indicates the that CFRs were used in the production of this component.

Table 12: Chemical elements detected in IDE cables.

Name of parts in IDE cables Main Secondary elements Trace elements
Part elements (>5% x <50%)
(<5%)
( >50%)
P1 Small metal part of connectors Cu Pb, Ni*, Zn, Si, Sn Pb, Br,Ca, Rb, Sn, Si, Au2*
P2 Long metal part of connectors Cu Pb, Ni*, Zn, Si, Sn Pb, Br, Ca, Rb, Sn, Si, Au2*
Pb, Sb, Cu, Fe, Zn, I, Os2*, Sr,
P3 Plastic cables Cl Ca
Sn, Si, Ti
P4 Non-identifiable plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
Legend: (*) critical element, (2*) precious metal.

The cases (P1, P6) in HD (Table 13) are manufactured basically using non-ferrous
metal. These were the components that presented the highest amount of Ni in internal
parts (P2, P3, P5, P8). PCBs measure 71.25 cm2 in area. Kara et al. (2010) reported that
over 30% of the ND used worldwide in 2008 was employed in the manufacture of HDs.

Table 13: Chemical elements detected in HDs.

Main elements Secondary elements Trace elements
Part Name of parts in HDs ( >50%) (>5% x <50%)
(<5%)
Cr, Ba, Pb, Ni*, Fe, Mn*, Ac3*,
P1 HD body Al, Si Cu, Zn
Ti, V, Zr
P2 Magnet body Ni* Fe, P Ac3*, Mo
P3 Magnet Ni* Fe, P Co, Se, Mn*, Mo
P4 HD reader Al - Cr, Cu, Fe, Mn*, Ac3*, Ge, Si, Zr
P5 Disk Ni* - Ca, Co*, Fe, F, Mo, Nd4*
P6 HD lid Al Si Cr, Ni*, Fe, Zn, K, S, Ti, Ta, W
P6 HD lid Fe Cr, Ni* Mn*, Mo, V
P7 Copper wire Cu S, Si -
P8 Round part Ni* P Cr, Fe, Mn*, Zn, Sn, W
P9 Shaft Al - Cr, Se, Ni*, Cu, Fe, Mn*, Zn
P10 PCB Br, Ca Cu, Si Fe, Pb, Ni*, S, Sn, Sr, Ti, Zn
P11 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
Legend: (*) critical element, (3*) rare earth, (4*) rare earth and critical element.

The main material used in the production of coolers is non-identified plastic (P3)
(Table 14). Sheathed wires (P2) have Cl in their composition, and it is known that CFRs
are used in the production of sheathed wires.
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Table 14: Chemical elements detected in coolers.

Main elements Secondary elements Trace elements
Part Name of parts in coolers ( >50%) (>5% x <50%)
(<5%)
P1 Copper wire Cu - Ca, Co*, Si
P2 Sheathed wire Cl Ca Pb, Sb, Cu, Fe, Os2*, Sr, Sn, Ti
P3 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
Legend: (*) critical element, (2*) precious metal.

Motherboards presented the highest number of chemical elements (Table 15) and
the highest abundance of substances of interest. Au was found in processor sockets (P5)
and processors (P2) in all samples. The presence of Br indicates that BFRs were used in
the production of this component. Kowalska et al. (2006) observed the presence of Br in
the PCBs analyzed by X-ray fluorescence and of BFRs in these components.
The capacitors (P6) analyzed presented Al as the main element, while presence of
Cl indicates the that CFRs were used in the production of this component. Some
capacitors were analyzed without the protective cover, which explains why Cl was not
detected. In these capacitors the element detected was Ag.
Yamane et al. (2011) analyzed ground PCBs of CPUs by inductively coupled
plasma mass spectrometry (ICP-MS). Only batteries and capacitors were removed. The
levels of Analytical Geometry, Al, au, Cu, Fe, Ni, Pb, Sn, and Zn were analyzed, with Cu
being the most common element. In this study Cu was the main element in P2, P5, P7,
P8, and P18 (Table 15). Also, Cu was the most common element in ground motherboards,
though precious metals, rare earth elements, and critical metals were not detected.
Pb and Sn are used to weld motherboard components, and were detected in
motherboard waste (P18) (Table 15). When comparing the results of ground
motherboards (Table 17) with motherboard waste, it is possible to see that part of the Pb-
Sn welds detached when heated. This agrees with Veit et al., (2005), who reported that
PCBs components are welded using a Pb-Sn alloy (37% - 63%) with low melting point
(~183ºC), which explains why they detach when heated. Motherboards measure 575.75
cm2 in area.
Motherboards are considered the most economically interesting component in PCs
due to the associated amount of metals (Oguchi et al., 2013; Yamane et al., 2011).
Precious metals detected in PCBs represent more than 80% of these components’ value,
despite the fact that the total amount of these metals in them is less than 1% of PCBs total
weight. Gold is the most important precious metal that may be recovered from
motherboards (Park and Fray, 2009). One metric ton of PC waste contains more gold than
17 metric tons of unprocessed gold ore (Bleiwas and Kelly, 2001), and mining may cause
irreversible environmental impacts, especially large craters opened using explosives, in
addition to changing ecological balance (Hilty, 2005).

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Table 15: Chemical elements detected in motherboards.

Main elements Secondary elements Trace elements
Part Name of parts in motherboards ( >50%) (>5% x <50%)
(<5%)
P1 Battery Ni* Cr, Fe Cs, Mn*, Mo, S
P2 Processor Cu Ba, Ni*, Si, Sn Au2*, Br, Fe, S, Sb, Sr
P3 Processor heat sink Ni* P Fe, Cs, Ta, Nd4*, Tb4*
P4 Rear metal part of processor Ni* Cu Co*, Zn, Si
P5 Processor socket Ca, Cu Au2*, Ni*, Si Fe, Rb, Sc3*, Sn, Sr, Ti, Zn
Ag2*, Ca, Cu, Fe, Ga*, Ni*, S,
P6 Capacitors Al Cl
Si, Sn, Sr, Ti, Zn, W, Yb3*
P7 Copper wires Cu - Ca
P8 Cooler copper wire Cu - Ca, Co*, Si
P9 Lid of part 3 Al - Cu, Fe, Ir2*, Ni*, Os, Ta
Pb, Sb, Cu, Fe, Os2*, Sr, Sn,
P10 Sheathed wire of cooler Cl Ca
Ti
Cr, Cu, Fe, Ga*, K, Ni*, S, Si,
P11 RAM heat sink Al -
Ti, Zn
P12 Attachment of part 3 Zn Fe Ca, Cr, Mn*
P13 Attachment of part 3 Zn - Cr, Cu, Fe, Mn*
P14 I/O shield Fe Cr, Ni* Cs, Cu, Mn*, Mo, Nb, V
P15 Printed circuits Si Br, Sb, Sn Ag2*, Cu, Fe, Pb
P16 Transistors Sb, Sn Pb, Fe, Br, Si Ba, Cu, Ni*, Ti, Zn
P17 Ground motherboard Br, Ca, Cu Ca, Cu, Si Fe, Pb, Ni*, S, Sr, Ti, Zn
P18 Motherborard remains Cu, Sn Ni*, Pb, Zn -
P19 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
Motheboard by grain size Ba, Br, Ca, Cu, Pb, Si, Ba, Cr, Fe, I, Mn*, Ni*, Pb, S,
- Br, Ca, Cu
distribution Sn Sn, Sr, Ti, Zn
Legend: (*) critical element, (2*) precious metal, (3*) rare earth, (4*) rare earth and critical element.

The comparison of the chemical composition of ground motherboards (Table 16)

and the analysis based on grain size (concerning the main and secondary elements) (Table
17) revealed that there were no significant differences. In the grain size separation, Cu,
Ca, and Br were also main elements, while Ba was a secondary element and a trace
element, and Cr, I, and Mn were trace elements (Table 17), which was not observed in
the analysis of ground motherboards (Table 16). Similarly, Sn was a secondary element
in six grain sizes and a trace element in grain size 0.420 mm, and Pb was a trace element
in all five ground motherboards and in seven grain sizes. Therefore, it is possible to
conclude that smaller grain sizes released the largest number of chemical elements, and
that the smaller the grain size, the easier elements like Pb, Sn, Zn, and Mn are released.

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Table 16: Chemical elements detected in ground motherboards.

Main elements Secondary elements Trace elements
CPUs Component ( >50%) (>5% x <50%)
(<5%)
1 Ground motherboards Br, Cu Ca, Si Fe, Pb, S, Sr, Zn
2 Ground motherboards Br, Cu Ca, Si Fe, Pb, Ni*, S, Sr, Ti
3 Ground motherboards Br, Ca Cu, Si Fe, Pb, Ti
4 Ground motherboards Br, Cu Ca, Si Fe, Pb, Sr, Ti
5 Ground motherboards Br, Ca Cu, Si Fe, Pb
Legend: (*) critical element.

Substances of interest such as precious metals, rare earth elements, and critical
elements are present in motherboard components (Table 15), not in the motherboard
itself, despite the fact that Cu is considered a valuable metal (Tables 16 and 17). After
removal of welded parts, motherboards can be used as a source of Cu, since this process
does not require grain size separation.

Table 17: Chemical elements detected in ground motherboards moídas per fraction.
Peneiras Main elements Secondary elements Trace elements
Component ( >50%) (>5% x <50%)
(Mesh) (<5%)
#6 Br, Cu Ca, Ba, Si Fe, S, Sr
#12 Br Ca, Cu, Si Ba, Fe, S, Sr
#20 Br Ca, Cu, Si Cr, Fe, Ni*, Sr, Ti
#30 Br, Cu Ca, Si, Sn Cr, Fe, I, Ni*, Sr, Ti
#40 Br, Cu Ca, Si Cr, Fe, I, Ni*, Pb, Sn, Sr

Ground #50 Br Ca, Cu, Si Cr, Fe, I, Ni*, Pb, Sr

motherboards #70 Br, Cu Ba, Ca, Si, Sn Fe, I, Ni*, Pb, Sr
#100 Br, Cu Ca, Si Ba, Cr, Fe, I, Ni*, Pb, Sn, Sr, Zn
#140 Br, Ca Ba, Cu, Si, Sn Cr, Fe, I, Ni*, Pb, Sr
#200 Br, Ca Ba, Cu, Si, Sn Cr, Fe, Ni*, Pb, Sr, Zn
#270 Br, Ca Cu, Si, Sn Ba, Cr, Fe, I, Ni*, Pb, Sr, Ti, Zn
#300 - Br, Ca, Cu, Pb, Si, Sn Ba, Cr, Fe, I, Mn*, Ni*, Sr, Ti, Zn
Legend: (*) critical element.

The cases (P1, P2, P3) (Table 18) of the power supply units are composed of
ferrous metal, and substances of interest were detected in the parts forming PCBs. Also,
PCBs contain parts with high levels of Al and Cu, in addition to small amounts of precious
metals such as Ga, Co, Tb, and Mn. This was the component presenting the largest amount
of sheathed wires (P4) in CPUs. The presence of Ca in these wires indicates the presence
of calcium carbonate (CaCO3), which is used in sheaths.

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Also, Br indicates the presence of BFRs and Cl indicates the presence of CFRs.
Similarly, Pb and Sn were detected in rests of PCBs (P16), indicating that part of the
welds was released during heating. PCBs of power supply units measure 181.25 cm2 in
area.

Table 18: Chemical elements detected in power supply units.

Name of part of power Main elements Secondary elements Trace elements
Part ( >50%) (>5% x <50%)
supply units (<5%)
P1 Cooler lid Fe Zn Cr, Ni*, Mn*, S, Si
P2 Power supply body Fe Zn Cr, Ni*, Mn*, S, Si
P3 Power supply lid Fe Zn Cr, Cu, Ni*, Mn*, S, Si
P4 Sheathed wires Cl Ca Cu, Fe, Zn, Sr, Si, Ti
P5 Cooler coppe wire Cu - Ca, S, Si
P6 Cogged part Al Si Cu, Fe, Zn Ca, Ga*, S, Ti
P7 L-shaped part Al - Cr, Pb, Ni*, Cu, Fe, Mn*, Zn, Re
P8 Large capacitors Al Cl Cu, Fe, Zn, Ca, Ga*, S, Si, Tb4*
P9 Small capacitors Al Cl Cu, Fe, Zn, K, Ca, S, Si, Ti, Ta
P10 Copper wires Cu - Br, Co*, S, Ti
P11 Ceramic capacitor Ca Ba, Pb, Br, Ti Ag2*, Cu, Fe, Zn, I, Sb, Sr, Zr
P12 Transistors Cu Ni*, Si Zn, Sb
P13 Transistors Cu Ni* Zn, Sb, Br, Ca, Si
P14 Printed circuits Si Cu, Br, Sb, Sn Ag2*, Pb, Fe, Zn
P15 Diode Si Br, Sb Zn, Sn
P16 Square capacitors Br Sb Ni*, Fe, Mn*, Zn
Cr, Ag2*, Ba, Ni*, Sd, Mn*, Zn,
P17 Rests of PCB Pb, Sn Fe, Cu, Ca
Br, Si, Ti, Zr
P18 PCB Br, Ca Cu, Si Fe, Pb, Ni*, S, Sn, Sr, Ti, Zn
P19 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
Legend: (*) critical element, (2*) precious metal, (4*) rare earth and critical element.

The components (P1, P2) as well as the bases of CD drives (P3) and of floppy disk
drives (P4) present Zn as the main element and therefore were classified as non-ferrous
metals (Table 19). Ca indicates the presence of CaCO3, which is used in paint coatings.
The presence of Cl in sheathed wires indicates the presence of CFRs. Ca points to
the presence of CaCO3, which is used in sheaths, and of calcium chloride (CaCl2), which
is used in the production of plastics.

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Table 19: Chemical elements detected in cases, lids, and other parts.
Name of parts of casings, lids, Main elements Secondary elements Trace elements
Part ( >50%) (>5% x <50%)
and other items (<5%)
P1 Casing lid Zn Fe, Ca Br, S, Sr, Ti
P2 Casing body Zn Fe Cr
P3 CD drive base Zn Fe Mn*
P4 Floppy disk drive base Zn Fe Mn*
P5 Body of loudspeaker Zn Fe, Cl Cr, S, Si
P6 Magnet of loudspeaker Fe Nd4*, V Cr, Zn, Ca, Nb, S
P7 Lid of the PCB slot Fe - Cu, Mn*, Sn, Si
P8 Casing mirror Fe - Mn*, Tm3*, Sn, Si
P9 Sheathed wire Cl Ca Cr, Pb, Sb, Cu, Os2*, Sr, Sn
P10 Sheathed wire Cl Ca Pb, Cu, Fe, Sn
P11 Sheathed wire Cl Ca Ba, Sb, Cu, Fe, Zn, Sr, Ti
P12 Non-identified plastics Br Ca, S, Si Cu, Fe, Ni*, S, Ti, Zn
P12 ABS plastics Br, Ti Br, Ca, Fe, Sb, S, Ti, Si, Ca, Cr, Fe, S, Si, Zn
P12 ABS/PC Ti P Cr, Fe, V
Legend: (*) critical element, (2*) precious metal, (3*) rare earth, (4*) rare earth and critical element.

3.4.2 Characterization of chemical elements present in plastics

In 10 of the 13 analyses carried out, Br was the main element (Table 13). This
indicates that flame retardants used in 77% of the plastics analyzed are BFRs. Taurino et
al. (2010) detected BFRs in plastics used in desktop computers.
The presence of Ti indicates the use of titanium dioxide (TiO2), which is widely
employed as pigment in plastics. Also, P is used as phosphate flame retardant in ABS/PC,
since this retardant is not corrosive or toxic, given that P is not a halogen.
Schlummer et al. (2007) reported the presence of Cl, Br, Cd, Cr, Hg, Sb, Sn, Ni,
As, Cu, and Pb in the chemical composition of WEEE. The elements Cl, Cd, Hg, As, Sn,
and Pb were not detected in the plastics analyzed in the present study (Table 20).

Table 20: Chemical elements detected in plastics.

Main elements Secondary elements Trace elements
Types of plastics ( >50%) (>5% x <50%)
(<5%)
ABS Br, Ti Sb, Fe, S, Ca, Ti, Si, Br Ca, Cr, Fe, S, Si, Zn
ABS/PBT Br - Cr, K, Ti
ABS/PC Ti P Cr, Fe, V
PS/PPE Ti Zn -
Non-identified Br S, Ca, Si Ni*, Cu, Fe, Zn, S, Ti
Legend: (*) critical element.

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Recycling processes for plastics containing brominated flame retardants.

However, some disadvantages have to be solved, since these processes increase recycling
costs associated with these materials. Plastics may also be used as a source of energy in
other production processes. This fate is considered to add value to WEEE, as discussed
in European Directive 2008/98/EC.
Also, Hg was not detected in any of the analyses carried out, confirming the
findings by Monchamp (2000), who pointed to some conflicting results in the literature,
and reported that Hg has been used in the manufacture of desktop PCs. Similarly, Cd was
not detected in the present study.

4. Conclusions and recommendations

The results obtained afford to conclude that the CPUs analyzed in the present
study have good recycling potential. In addition to being sources of metals like Fe, Zn,
Al, and Cu, these CPUs have commercially interesting components that contain Au, Ag,
rare earth elements, and critical metals.
The CPUs analyzed have 96.66% potential recyclability. This parameter
represents the amount of material with recycling potential in the samples analyzed. The
potential recycling rate was 95.74% for HDs, 100.0% for IDE cables, 96.20% for HDs,
82.67% for coolers, 97.89% for motherboards, 81.93% for power supply units, and
99.41% for lids, casings, and other parts. The parts presenting the highest economic value
were:
(1) Floppy disk drives: Cu and Co wires.
(2) CD drives: capacitors containing Ag and Ga; copper and cobalt wires.
(3) IDE cables: metal connectors with Au.
(4) HD: disk with Nd and Co; magnet with Co.
(5) Cooler: Cu and Co wires.
(6) Motherboard: processor with Au, processor socket with Au, Sc; capacitors with Ag,
Yb, and Ga; heat exchanger of the processor with Nd, Yb, heat exchanger of the RAM
memory with Ga; metal at the back of the processor with Co.
The parts of the components with rare earth elements should be removed and
appropriately stored for the time necessary and then recycled so as to recover these metals
in the most efficient method possible, when industrial scale recycling processes may be
used.
The physico-chemical characterization of WEEE is an important step in knowing
the composition of this kind of waste. Identifying plastics and metals contained in these
WEEEs is essential in the definition of disposal and recycling strategies and to improve
market value. Also, the identification of these materials is useful in the evaluation of
environmental hazards and human health risks.
The increasing volumes of WEEE is a severe environmental problem that requires
knowledge and control. The recycling of computers is a sustainable alternative to mitigate
the problems associated with the disposal of this kind of waste. Knowing more about
WEEE is a challenge, since more studies and technical knowledge are necessary to
identify the materials with some recycling potential. Few studies and data about CPU

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waste have been published. So, it is expected that the present study offer a contribution
to increase knowledge about this kind of waste.

Acknowledgements
The authors acknowledges the agency CNPq for financial support through grant
no. 01.12.0135.00. ref. 1860/10

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