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1.Description of Circuit Chart
1.1.GSM RF circuit
1.1.1.Receiving circuit
1.1.2.Transmitting circuit
1.2.Base band circuit
1.3.Bluetooth/FM/WIFI/GPS
2.Troubleshooting
2.1.Notes on Failure Handling
3.Fault repair
3.1.RF part failure
3.2.Base band failure
3.2.1.Startup process failure
3.2.2.Fail to download
3.2.3.Bluetooth/WIFI/GPS failure
3.2.4.Configuration defect
3.2.5.Unable to power on the phone
3.2.6.Ring tone Fault
3.2.7. LCD display fault
3.2.8.Failure to Charge
3.2.9.Failure to identify SIM card
3.2.10.Main Microphone fault
3.2.11.Keypad fault
3.2.12.Receiver fault
3.2.13.Vibrator fault
3.2.14.FM fault
3.2.15.No RF Signal
3.2.16.Failure to read T-flash card
3.2.17.Earphone Fault
1. Description of Circuit Chart
CTP and
SUB CON
TV IC
Back CAM
WiFi/GPS/ MEMORY1
BT/FM IC
MEMORY2
IC-CPU SUB CAM
RECEIVER
IC-PMU
SIM-card 1
LVDS
LCD CON IC-RFPA
GSM ANT
Charge and battery
AMBIENT light and
PROXIMITY Sensor
G-SENSOR
1.1.GSM RF circuit
1.1.1.Receiving circuit
The GSM or DCS signal received from a base station via antenna is input from
the U102 after pass the combining filter and RF Receiving filter to the U201 , U201
has a built-in LNA and frequency mixer. The signal is amplified by its related Low
Noise Amplifier (LNA). The amplified signal is sent to a down converter, where the
signal is mixed with local oscillation (LO) output from RX VCO to generate zero
intermediate frequency (ZIF) signals. The zero-IF signal passes through a filter and is
amplified by programmable gain amplifier (PGA), then the signal is output to I and Q
demodulator to generate I/Q base band signals. The demodulated I and Q base band
signals are output to the base band part for further processing.
1.1.2.Transmitting circuit
Notes:
The PCBA repairing is a very important procedure during the final production
of cellular phones. The speed and quality of repairing decides the yield and production
efficiency. The repair idea is very important for a good repairing technician. Make
sure not to heat a board right away once a phone reaches at hand.
Board
Board received
received
Replace
each
element Measure related
circuits or elements
with equipments
Confirm board
Left aside
failure and change
or handle
the board
by others
Main board
Main board OK
scrapped
3. Fault repair
3.1.RF part
The GSM or DCS signal received from a base station via antenna is input from
the U102 pin 26,The chipset has a built-in LNA and frequency mixer. The signal is
amplified by its related Low Noise Amplifier (LNA). The amplified signal is sent to a
down converter, where the signal is mixed with local oscillation (LO) output from RX
VCO to generate zero intermediate frequency (ZIF) signals. The zero-IF signal passes
through a filter and is amplified by programmable gain amplifier (PGA), then the
signal is output to I and Q demodulator to generate I/Q base band signals. The
demodulated I and Q base band signals are output to the base band part for further
processing.
Repair procedure:
(1) Test again and make sure that there is no misoperation. Observe the failure
carefully.
(2) Analyze the probable circuit related to the failure to minimize the failure detection
range.
(3) Perform visual detection to related circuits to find obvious failure cause, such as
missing or deviation.
(4) Measure/analyze/repair according to flowchart.
Repair procedure:
(1) Test again and make sure that there is no disoperation. Observe the failure
carefully.
(2) Analyze the probable circuit related to the failure to minimize the failure detection
range.
(3) Perform visual detection to related circuits to find obvious failure cause, such as
element missing or deviation.
(4) Measure/analyze/repair according to flowchart.
MTK uses relatively high integration and has limited peripheral independent
elements. Check whether there is any additional element, missing or wrong element
before hot air gun is used. If visual detection fails to find problem, use some
equipments to findfailure positions.
(1) Below 20MA: indicates that power starts working but the next action is not
performed. The cause can be incomplete soldering or damage in power
management, CPU or 26M circuit.
(2) 20~25MA: the cause can be: there is no download software; software functions
abnormally; or, CPU cannot read or execute software normally.
(3) 30~90MA: if the software, 26M and 32K are all normal, the cause can be
incomplete soldering. Check U301 。
3.2.1.Startup process
When the Power-On button is pressed, PWRKEY will detect a low voltage.
The PMU MT6323 will turn on the LDOs which provide power-supply to base band
30ms later; then the RESET circuit of the PMU will generate the reset signal 200ms
later to make the base band chip run the power-on software.
Fail to startup
Press Startup to
High current
see current
YES
Check short
Check CPU Check power Solder/change circuit
N
work voltage supply circuit CPU according to
current
CPU:Solder/
change CPU
OK
3.2.2.Fail to download
Make sure that the download current of main board is normal and important
I/O interfaces including J1304、U501and U301 are normal.
Fail to
download
Check the
connection
of
mainboard YES
and
download
cable
YES
Check IO Re-weld
NO YES
connector connector
YES
YES
Re-weld
Check Crystal
26MHz NO oscillator and YES
clock Relevant
circuit
YES
Check
VDD/ NO Re-weld CPU YES
VCORE
YES
Re-weld
Check flash NO YES
FLASH
YES
OK
3.2.3. Bluetooth /WIFI /GPS failure
Bluetooth failure
Check
Check whether
power
work Voltage is N Y
normal supply
circuit
Solder/ change
U403
OK
3.2.4. configuration defect
For structural parts of the fault, please refer to phone the disassembly
procedures for the corresponding change
Failure to power on
Check battery
Remount
mounted
NO battery or
correctly&batte
replace battery
ry voltage>3.4V
YES
Check if
Check if LCD
Keyboard
is connected YES
backlight can be
correctly
lighted
NO
NO
Pay attention
Download
YES to retain the
software OK?
calibration data
NO
YES
YES OK
3.2.6. Ring tone Fault
No ringtone
YES
Check the
soldering
Re-weld
of NO YES
speaker
speaker.OK
?
YES
Replace
OK!Mark the
speaker and YES YES
failed speaker
test
NO
Check the
speaker Mark the
circuit no mainboard
NO YES
short circuit with analysis
or open result
circuit
YES
Replace
new
mainboard
OK
3.2.7. LCD display fault(TP same to LCD)
3.2.8. Failure to Charge
3.2.9. Failure to identify SIM card
3.2.10.Main Microphone fault
3.2.11. Keypad fault
Keypad do not
work correctly
Check:
Paste the DOME
dome is
YES orassemble Y
assembled
keymat again
correctly
N
NO
Is there any
dirty on Clean keypad
YES Y
keypad surface and test
surface?
N
NO
Is sidekey
soldered
Solder or replace
well? YES Y
sidekey
No short
circuit
NO
Replace N
new
mainboard
OK
3.2.12.Receiver fault
No voice in
receiver
Is receiver
Replace new
ok? No NO Y
receiver
broken wire
N
YES
Check
receiver
connector Weld receiver
YES Y
for connector
soldering
defect
N
NO
Check
Mark the
receiver
YES mainboard with Y
circuit for
analysis result
any fault
NO
Replace N
new
mainboard
OK
3.2.13.Vibrator fault
3.2.14.FM fault
3.2.15.No RF Signal
No RF signal
Is RF
antenna Re-assemble RF
NO Y
assembled antenna
correctly?
N
YES
Is the
phone set Return to normal
YES Y
into flying mode
mode?
N
NO
NO
Replace
new
mainboard
OK
3.2.16. Failure to read T-flash card
Fail to read T-
flash card
Is T-flash
card Re-insert T-flash
NO Y
inserted card
correctly?
N
YES
Check: the
T-flash NO Replace new card Y
card is OK?
N
YES
Check card
socket is
Clean socket or
clean and NO
replace socket
no physical
fault
YES
Mark the
Check card
mainboard with
circuit for YES
analysis result
any fault
NO
Replace
new
mainboard
OK
3.2.17.Failure to use earphone
Failure to use
earphone
Check :earp
hone is Replace new
NO Y
OK? No earphone
damage
N
YES
Check
earphone
connector Weld earphone
YES Y
for connector
soldering
defect
N
NO
Is there any
foreign
Clean or replace
matter in NO
connector
earphone
connector?
YES
NO
Replace
new
mainboard
OK
END