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Functional Materials Letters

Vol. 8, No. 1 (2015) 1550010 (4 pages)


© World Scientific Publishing Company
DOI: 10.1142/S1793604715500101

Resistive switching effect of Ag/MoS2/FTO device

Bai Sun*,†, Wenxi Zhao*,†, Yonghong Liu* and Peng Chen*,‡


*School of Physics Science and Technology
Southwest University, Chongqing 400715, P. R. China
†Institute
for Clean Energy & Advanced Materials (ICEAM)
Southwest University Chongqing 400715, P. R. China

pchen@swu.edu.cn

Received 18 August 2014; Accepted 26 August 2014; Published 22 September 2014


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The electric-pulse-driven resistance change of metal/oxides/metal structure, which is called resistive switching effect, is a fasci-
by UNIVERSITY OF SYDNEY on 03/15/15. For personal use only.

nating phenomenon for the development of next generation non-volatile memory. In this work, an outstanding bipolar resistive
switching behavior of Ag/MoS2/fluorine-doped tin oxide (FTO) device is demonstrated. The device can maintain superior re-
versible stability over 100 cycles with an OFF/ON-state resistance ratio of about 103 at room temperature.

Keywords: MoS2; resistive switching; hydrothermal synthesis; multifunctional materials; memory device.

The resistive switching phenomena at simple metal/oxide/ switching properties of MoS2 film have not been reported
metal structure have attracted great attention due to the yet. Herein we report a reversible bipolar resistive switching
potential uses in high-density memory devices.1,2 So far, the effect of Ag/MoS2/FTO device.
resistive switching behavior has been observed in many oxide In this work, MoS2 powder was prepared by a hydrothermal
materials, including binary transition metal oxides,3,4 process. In a typical procedure, 2.5 mmol of Na2MoO4  2H2 O
perovskite materials,5,6 chalcogenides,7 sulfides,8 amorphous and 5 mmol of CH4N2S were dissolved in 35 mL of distilled
silicon,9 organic materials10 and ferroelectric materials.11,12 water, and then 3.5 mL concentrated hydrochloric acid were
In the past few years, the electronic properties of MoS2 added into the reaction solution under violent stirring. The
have been investigated extensively. Moreover, MoS2 has a solution was transferred into a 50 mL Teflon-lined stainless
distinct layered structure, in which each Mo layer is sand- autoclave and sealed tightly, which was kept at 260 ○ C for
wiched between two sulfur layers.13 Bulk MoS2 has wide 48 h. The resulting products were filtered off, washed with
applications in solid lubricant,14 catalyst15 and energy stor- distilled water and absolute ethanol for several times, and
age.16 Since the hexagonal layered structure of MoS2 is dried in vacuum at 60 ○ C for 12 h for characterization.
similar to that of the graphite,17 mechanical exfoliation has Crystal structure of MoS2 powder was characterized at
been successfully applied to isolate monolayer MoS2.18,19 room temperature by X-ray diffraction (XRD) with CuKα
Monolayer MoS2 has also been grown on a Cu substrate.20 radiation. Surface morphologies of MoS2 powder and the
The success in isolating monolayer MoS2 renders the fabri- fabricated device were characterized using scanning electron
cation of one-dimensional MoS2 nanostructures.21,22 Unlike microscope (SEM). The microstructure of the MoS2 powder
the graphene which is a zero-gap semimetal or bulk MoS2 was observed by transmission electron microscopy (TEM)
which is a semiconductor with an indirect gap, the monolayer (JEM-2100).
MoS2 has been shown to be a semiconductor with a direct The preparation process of Ag/MoS2/FTO device is as
bandgap.23 The direct bandgap character opens the possi- follows: (1) FTO substrates were cleaned prior ultrasonic to
bility for application of the monolayer MoS2 as transistors.24 use by acetone, ethanol and deionized water. (2) The as-
Moreover, Xu et al. have reported the resistive switching prepared MoS2 powder was ground for 2 h. (3) The MoS2
memories in MoS2 nanosphere assemblies.25 Therefore, powder was dissolved in toluene solution to prepare precur-
MoS2 would be a useful material for future nanodevices. sor gel, then spin coated on the FTO substrate, the spin-
Although there are many works on various applications coating process was done at 5000 rpm for 10 s and used for
and properties of MoS2 in previous reports, the resistive deposition of films. (4) These samples were subsequently

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B. Sun et al.

dried at 120 ○ C in vacuum for overnight. (5) The Ag elec- The composition of MoS2 film is confirmed by elemental
trodes were prepared by vacuum deposition. Finally, the analysis carried out from energy-dispersive X-ray (EDX)
current–voltage (I–V ) curve was tested using the electro- spectra. The EDX data in Fig. 3(a) confirms that the com-
chemical workstation (CHI) at room temperature. position of MoS2 film consists only Mo and S without
SEM image of the as-prepared MoS2 powder is shown any other impurities, which indicate that we have not mixed
in Fig. 1(a). It is obvious that the MoS2 powder consists any impurity element in the preparation process. In addition,
of MoS2 ribbons. The TEM image of MoS2 powder is dis- the inset of Fig. 3(a) shows S/Mo atomic ratios obtained
played in the inset of Fig. 1(a), in which the MoS2 powder by EDX. The S/Mo atomic ratio is 1.93, which indicates
presents sheet structure. From the high-resolution transmis- there is a small amount of S defects for the as-prepared
sion electron microscopy (HRTEM) image of MoS2 powder device.
in Fig. 1(b), we can see that the lattice spacing between The crystalline structure of the MoS2 film was charac-
two planes is  0.23 nm, corresponding to the (103) planes terized by XRD patterns. Figure 3(b) exhibits the XRD of
of MoS2. The inset of Fig. 1(b) exhibits the selected area MoS2 film. We can see there are only the peaks of MoS2,
electron diffraction (SAED) pattern of the MoS2 powder. which further reveals the overall crystallinity and purity of
Figure 2(a) presents the schematic representation of the the as-synthesized device. All peaks can be determined as
device, where the MoS2 film was spin-coated on the FTO hexagonal MoS2 crystal (JCPDS No. 85-1519). Therefore,
Funct. Mater. Lett. 2015.08. Downloaded from www.worldscientific.com

substrate. The top SEM image of as-prepared device is shown the film contains only pure MoS2.
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in Fig. 2(b), where the electrodes of Ag with the largest area In the test of resistive switching characteristics of Ag/
of  1 mm2 were deposited onto the surface of MoS2 film. MoS2/FTO device, we employed the experimental test circuit

(a) (b)

Fig. 1. (a) The SEM image of the MoS2 powder; the inset shows TEM morphology of MoS2 powder. (b) The HRTEM image of MoS2 powder; the inset
exhibits SAED pattern of MoS2 powder.

(a) (b)

Fig. 2. (a) The schematic representation of the Ag/MoS2/FTO device. (b) The SEM image of as-prepared device.

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Resistive switching effect of Ag/MoS2/FTO device

(a) (b)

Fig. 3. (a) The EDX spectrum of as-prepared MoS2 film, the inset shows S/Mo atomic ratios obtained by EDX. (b) The XRD of MoS2 film at room
temperature.
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shown in Fig. 4(a). Figure 4(b) displays the current–voltage device. The arrows in the figure denote the sweeping direc-
(I–V ) curves of Ag/MoS2/FTO device in linear scale, which tion of voltage.
exhibits an asymmetric behavior with significant hysteresis, Figure 4(c) shows a corresponding I–V curve of Ag/
which shows the resistive switching effect of Ag/MoS2/FTO MoS2/FTO device in logarithmic scale. We can see that a

(a) (b)

(c) (d)

Fig. 4. (a) The schematic representation of test circuit. (b) The current–voltage (I–V ) characteristic curve in linear scale of Ag/MoS2/FTO structure. (c) The
corresponding I–V characteristic curves in logarithmic scale. (d) The resistance-cycles curve with a positive bias voltage of 0.2 V.

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B. Sun et al.

sudden current increase occurs at about 0.45 V (VSet ), indi- Ag/MoS2/FTO device hold a great promise for next-gener-
cating a resistive switching from the high resistance state ation non-volatile memory applications.
(HRS or \OFF") to the low resistance state (LRS or \ON"),
which was called the \Set" process. When the applied volt-
age sweeps from zero to negative voltage of about 0.45 V
Acknowledgments
(VReset ), the device can return to the HRS, which was called This work was supported by the National Nature Science
the \Reset" process. In addition, it is worth noting that the Foundation of China (Grant No. 51372209).
threshold voltages in the device are less than 0.5 V, which is
an outstanding advantage for practical memory applications
in an expansive condition.26,27 References
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