Professional Documents
Culture Documents
Abstract—GDI (Gate Diffusion Input) is a new technique of low III. CMOS 8T Full Adder Design
power digital circuit design is proposed. This technique allows
minimization of area and power consumption of digital circuits. The logic diagram of full adder is shown in fig. 1 and it
In this design XOR gate is designed using 3 transistors and consists 2 XOR gates and one 2:1 Mux. In this paper the
CMOS full adder is designed based on two 3T XOR and one CMOS XOR gate is designed using 3 transistors based on
2T Mux. Using 8 transistors the full adder is designed in this
paper and voltage scaling also done by reducing supply voltage. GDI technique is shown in fig. 2. When any one of the input
In this proposed full adder, the power consumption 4.604μW is is high, the output will become high. For example in the fig. 2
achieved and the total area is 144μm2 . the inputs a = 1, b = 0 and output will become 1.
Index Terms—Low Power, Area, Full adder GDI, 3T XOR, The 2T based 2:1 Multiplexer is shown in figure 3. When
2T MUX, CMOS, 120nm Technology, Logic Gates, Microwind 2, select line sel = 0, the output will select ‘a’ and when select
DSCH 2.
I. Introduction
With Increasing demand for reliable battery life of digital
devices is also demanding for low power consumption digital
devices. It has become the major focussed work for designers
to design such digital devices in order to meet the requirements
of the latest advancements of the technology as these devices
mostly include phones, laptops, sensor nodes [1].
Significant parameters for designing any integrated cir-
cuit are area and power dissipation. Whenever technology
scales from μm to nm, the Vth of transistors is also mini-
mized this leads to sub threshold leakage current to increase
Fig. 1. Simplified Full adder using Mux.
exponentially.
Pd = αcv2 f (1)
978-1-7281-5284-4/20/$31.00 2020
c IEEE
Authorized licensed use limited to: Cornell University Library. Downloaded on September 26,2020 at 10:43:24 UTC from IEEE Xplore. Restrictions apply.
193
adder when all the 3 inputs are high, the outputs sum = 1 and
carry = 1.
The fig. 5 shows the 3T XOR 3D process. To create IC 3D
process, it takes many process steps including initial substrate,
Fig. 5. 3T XOR 3D process. diffusion formation, and oxide growth.
IV. Results
line sel = 1, the output will sect ‘b’. The 2:1 Multiplexer is
designed using 2 transistors based on GDI technique is shown In the figure 9, the BSIM4 model is used to analyze the
in fig. 3. Ids versus Vds characteristics. The width of the transistor is
10μm and length is 0.120μm.
The proposed 8 transistor full adder using GDI technique
is shown in fig. 4. In this full adder 2 XOR gates and one Area Analysis: the proposed full adder layout width is 20μm
2:1 Mux is used to design full adder. The fig. 4 shows full and length is 7μm. The total area is 144μm2 .
Authorized licensed use limited to: Cornell University Library. Downloaded on September 26,2020 at 10:43:24 UTC from IEEE Xplore. Restrictions apply.
194
TABLE II
Performance Comparison with Existing Work
V. Conclusion
In this design XOR gate is designed using 3 transistors
and CMOS full adder is designed based on two 3T XOR and
one 2T Mux. Using 8 transistors the full adder is designed in
this paper and voltage scaling also done by reducing supply
voltage. In this proposed full adder, the power consumption
4.604μW is achieved and the total area is 144μm2 .
Authorized licensed use limited to: Cornell University Library. Downloaded on September 26,2020 at 10:43:24 UTC from IEEE Xplore. Restrictions apply.