Radiography of S The radiography of semiconductors is somewhat different than applications discussed previously. With semiconductors, two major areas are of concem after the electrical acceptance tests have been completed: inconsistent internal construction and internal foreign material. Specific discontinuities associated with semiconductors include: * Loose particles, solder balls, flakes, weld splash and wire. * Loose or discontinuous connecting leads between internal elements and external terminals. * Extraneous matter, excessive solder or weld extrusions. * Inclusions or voids in seals or around lead connections or insufficient sealing material. Inadequate clearance. Foreign ‘material within (@m semiconductor. ODDQDDD0000000000 Rationale: Universally used as the NDT method Precautions: Internal wires in semiconductors are very fine and may be constructed from materials of different density, such as copper, Siver, gold and aluminum. 7 iguration and intemal ductors limit NDT Semiconductors that ha may require more than one technique due to the density of the copper. Fine crack in plastic casing material 55