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Appendix 1: Coefcient of (Linear) Thermal

Expansion for Selected Materials (COE or CTE)

Coefficient of (linear) thermal expansion, α, for selected (continued)


materials (COE or CTE) (units are ×10−6 °C−1 (i.e. ppm/°C)) Indium–lead 33.0
Lead (95 %) tin solder 28.0
Tin–lead solder 60/40 25.0
A. Pure metals
Magnesium, AZ31B 26.0
Aluminium 25
Ni-clad Molybdenum 5–6
Chromium 6
Steel, 1020 12.0
Cobalt 12
Stainless steel (18-8) 17.0
Copper 17
Tungsten/copper (90/10) 6.5
Gold 14
Aluminium MMC with SiC particles 6–14
Iron 12 (80–50 % reinforcement)
Lead 29 C. Insulators and substrate materials (for electronic systems)a
Magnesium 25 E glass 5.5
Molybdenum 5 S glass 2.6
Nickel 13 Glass–ceramic >3.0
Platinum 9 Silicon 2.6
Silver 19 Diamond 0.9
Tantalum 7 Aluminium nitride 4.5
Tin 20 Silicon nitride 3.7
Titanium 9 Quartz, fused silica 0.5
Tungsten 5 Kevlar 49 –5
Zinc 35 Beryllia 6–9
B. Alloys and MMCs Cubic boron nitride
Alloy 42 4.4 x–y 3.7
Aluminium (40 % silicon) 13.5 z 7.2
Aluminium, AA 6061 23.6 E glass/epoxy
Aluminium, AA 3003 23.2 x–y 14–17
Aluminium, AA 2017 22.9 z 80–280
Boron aluminium (20 %) 12.7 E glass/polyimide
Brass 18.0 x–y 12–16
Copper/invar/copper 20/60/20 thick 5.8 z 40–80
Copper/molybdenum/copper 20/60/20 7.0 E glass/PTFE
thick
x–y 24
Graphite/aluminium 4–6
z 260
Invar 36 1.6
Kevlar/epoxy
Invar 42 4.5
x–y 5–7
Inconel 600 13.0
z 70
Kovar (Fe–Ni–Co) 5.0
Kevlar/polyimide
(continued)
(continued)

© Springer International Publishing Switzerland 2016 557


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
558 Appendix 1: Coefficient of (Linear) Thermal Expansion for Selected Materials (COE or CTE)

(continued) (continued)
x–y 3.4–6.7 Si3N4 (α-phase) 2.9
z 83 Si3N4 (β-phase) 2.3
Quartz/polyimide Spinel (MgAl2O4) 7.6
x–y 5–8 Soda–lime–silicate glass 9.2 (used in lightbulbs)
z 68.4 Borosilicate glass 4.6 (used with Kovar)
Quartz/bismaleimide Silica (96 % pure) 0.8
x–y, 35 % resin 6.2 Silica (99.9 % pure) 0.55
z 35 % resin 41 Zerodur Class 2 0.1
Alumina (90 %) TF substrate 7.0 Zerdur Class 0 Extreme 0.007
Alumina (ceramic chip carrier) 5.9–7.4 E. Polymers (unorientated)
Epoxy (70 % silica) plastic packaging 20–23 Polyethylene 100–200
Mulite co-fired 4.2 Polypropylene 58–100
Gallium arsenide 5.7 Polystyrene 60–80
Silicon carbide 3.6 Polytetrafluoroethylene 100
Carbon fibre 60 %–epoxy −1.1 Polycarbonate 66
D. Other ceramics Nylon (6/6) 80
A12O3 6.5–8.8 Cellulose acetate 80–160
BeO 9 Polymethylmethacrylate 50–90
MgO 13.5 Epoxy 45–90
SiC 4.8 Phenolformaldehyde 60–80
Silicon 2.6 Silicones 20–40
(continued) a
For temperature range −55 to +100 °C
Appendix 2: Properties of Printed Circuit Laminates

Material Thermal Mechanical


Conductivity CTE CTE Max. use Glass Tensile Yield Elongation
W/M-K X, Y Dir. Z. Dir Temperature transition strength strength %
ppm/°C ppm//° °C Temperature °C MPa MPa
C
Polymer composites
Polyimide glass 0.35 12–16 40–60 215–280 250–260 345 –
Epoxy glassa 0.16–0.2 14–18 180 130–160 125–135 276 –
Modified epoxyb – 14–16 – – 140–150 – –
PTFEe glass, 0.1–0.26 20 – 230–260 – – –
non-woven
PTFEe glass, 419–837 10–25 – 248 – 38–52 –
woven
Epoxy aramid 0.12 6–8 66 – 125 68–103 – –
Epoxy quartz – 6–13 62 – 125 – –
Polyimide aramid 0.28 5–8 83 – 250 – –
Polyimide quartz 0.35 6–12 35 – 188–250 207 –
Epoxy—cordierite 0.9–1.3 3.3–3.8 – – – – – –
Modified epoxy – 5.5–5.6 100 – 137 – –
aramid
PTFEe quartz – 7.5–9.4 88 – 19d – –
Polyimide 4.3–11.8 45–50 – 260–315 – – – 6–7
Metal composites
Cu/Invar/Cu 15–18c 5.3–5.5 16 – N/A 310–414 170–270 36
(20/60/20)
Cu/Invar/Cu 14c 4.4 – – N/A 380–480 240–340
(12.5/75/12.5)
Cu/Mo/Cu 90–174 2.6 – – N/A – –
Ni/Mo/Ni 129.8c 5.2–6 5.2–6 – N/A 621 552 50
Published with permission from the IPC, 2215 Sanders Road, Northbrook, Illinois, USA. (Table from IPC-D-279 Design Guidelines for Reliable
Surface Mount Technology Printed Circuit Board Assemblies, July 1996)
a
FR-4, G-10
b
Polyfunctional FR-4
c
Z-direction
d
Polymorphic p
e
PTFE=Polytetrafluoroethylene

© Springer International Publishing Switzerland 2016 559


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
Appendix 3: Reagents for Microetching
Metals and Alloys

A wide variety of techniques may be used for the identifi- Each chemical must be stored and handled according to the
cation of grain structures, phases, and other constituents in manufacturer’s recommendations. All chemicals are poten-
metals and alloys. Metallographers are often able to predict tially dangerous and it is assumed that the person mixing,
the chemical composition and processing history of a pouring, or etching is thoroughly familiar with their use. If
metallic sample by selectively etching its polished surface there is any uncertainty about their use, toxicity, or means of
and comparing the microstructure to those of reference disposal, the user’s Chemical and Safety Department should
samples in conjunction with published phase diagrams. be contacted.
The following chemical reagents (etch compositions) are The concentrations of acids are given in terms of specific
recommended by the author for the etching of metals and gravity (s.g.), or as a percentage (%) of the fully concen-
alloys commonly encountered during the metallurgical trated value.
assessment of electrical and structural spacecraft materials.

© Springer International Publishing Switzerland 2016 561


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
No. Reagent composition Remarks
562

Metal
Aluminium and its alloys
1 Hydrofluoric acid (40 %) 0.5 ml 15 s immersion is recommended. Particles of all common microconstituents are outlined. Colour indications
Hydrochloric acid (1.19) 1.5 ml
Nitric acid (1.4) 2.5 ml
Water 95.5 ml Mg2Si and CaSi2 Blue to brown
α (AlFeSi) and (AlFeMn) Darkened
β (AlCuFe) Light brown
(Keller’s etch) MgZn2, NiAl3, (AlCuFeMn), Al2Cu Mg and Al6CuMg Brown to black
α (AlCuFe) and (AlCuMn) Blackened
Al3Mg2 Heavily outlined and pitted
The colours of other constituents are little altered. Not good for high Si alloys
Desmut in 50 % nitric acid if necessary
2 Sodium hydroxide 1g Specimens are etched by swabbing for 10 s. All usual constituents are heavily outlined, except for Al3Mg2
Water 99 ml (which may be lightly outlined) and (AlCrFe) which is both unattacked and uncoloured. Colour indications
FeAl3 and NiAl3 Slightly darkened
(AlCuMg) Light brown
α (AlFeSi) Dull brown
α (AlFeSi) Rough and attacked; slightly darkened
MnAl6 and (AlFeMn) Coloured brown to blue (uneven attack)
MnAl4 Tends to be darkened
The colours of other constituents are only slightly altered
Beryllium
3 Hydrofluoric acid (40 %) 10 ml Etch by immersion for 10–30 s to outline grain boundaries and microconstituents
Ethyl alcohol 90 ml
4 Water 95 ml Be alloys may be etched in the reagent (1–15 s)
Sulphuric acid (1.84) 5 ml
Note: during the preparation of beryllium samples, do not breathe dust, as this is extremely toxic. Cutting operations must be done under controlled conditions, preferably in a glove box. See text for the removal of
mechanical twins. Polishing cloth will be contaminated with beryllia and needs to be disposed of according to local health and safety requirements. Metallographers should wear rubber gloves and avoid contact with
etchants
Chromium
5 Hydrochloric acid (concentrated) Shows striations in electrodeposits
Copper, copper alloys, brass, bronze, etc.
6 Ammonium hydroxide 50 ml Used for copper, many copper-rich alloys
Water 50 ml Gives a grain boundary etch, and also tends to darken the α solid solution, leaving the β solid solution lighter. The
Hydrogen peroxide (30 vol.) 20 ml hydrogen peroxide content may be varied. Less is required the lower the copper content
7 Ferric chloride, various strengths and compositions Used as a general reagent for copper, brass, bronze, nickel–silver, aluminium–bronze, and other copper-rich alloys. It
To 100 parts of water are added darkens the β constituent in brasses and gives grain contrast following ammoniacal or chromic acid etches. The most
suitable composition should be found by trial and error in specific cases. This reagent generally emphasizes scratches
Hydrochloric acid (1.19) Ferric chloride (g)
in imperfectly prepared specimens, and tends to roughen the surface. For sensitive work it is frequently a great
20 1 advantage to replace the water in the reagent by a 50:50 water–alcohol mixture or by pure alcohol
10 5
50 5
Appendix 3: Reagents for Microetching Metals and Alloys

(continued)
(continued)
No. Reagent composition Remarks
8 Potassium dichromate 2g Used for copper, and copper alloys with beryllium, manganese, and silicon. Also suitable for nickel–silver, bronzes,
Water 100 ml and chromium–copper alloys. This reagent should be followed by a ferric chloride etch to give added contrast
Sodium chloride (saturated) 4 ml
Sulphuric acid (s.g. 1.84) 8 ml
Gold
9 Hydrochloric acid (concentrated) 60 ml Use under a hood, immerse for a few seconds
Nitric acid (concentrated) (Aqua Regia) 40 ml
10 Potassium cyanide, 10 % in water 10 ml Used for gold and its alloys. A fresh solution, warmed if necessary, must be used for each operation. The etching time
Ammonium persulphate, 10 % in water 10 ml varies from 0.5 to 3 min. The attack may be speeded up by the addition of 2 % of potassium iodide, but this is liable
to give staining effects
11 Tincture of iodine, 50 % solution in aqueous potassium iodide Used for gold alloys. With silver-gold alloys a silver iodide film may form. This may be removed by immersion in
potassium cyanide solution
Indium and indium alloys
12 Hydrochloric acid (1.19) 20 ml General etchant, use by immersion for a few seconds. [For very detailed studies of indium–gold reaction layers, see
Picric acid 4g Millares and Peraggi (1992)]
Ethyl alcohol 400 ml
Appendix 3: Reagents for Microetching Metals and Alloys

Iron and steel


13 Nitric acid (1.40) 1.5–5 ml to 100 ml Ferrite g.b.’s in low-carbon steels. Darkens pearlite and gives contrast with ferrite or cementite network. Etches
Ethanol (Nital etch) martensite and its decomposition products in many steels. Better than Picral for low-alloy steels and for ferritic grain
boundaries 5–30 s depending on steel
14 Picric acid 1g Attacks prior austenite boundaries
Hydrochloric acid (Vilella’s reagent) 5 ml Good for ferritic steels
15 Nitric acid (1.40) 10 ml Immerse up to 30 s. Good for high-chromium steels, austenitic stainless steel, etc.
Hydrochloric acid (1.19) 20 ml Do not keep, discard when yellow, if left this reagent can ‘explode’
Glycerol 30 ml
16 Ferric chloride 2g In tool steels attacks ferrite and martensite, outlines carbides, leaves austenite unattacked
Hydrochloric acid (1.19) 5 ml
Water (Kalling’s reagent) 30 ml Immerse 1–5 min
Molybdenum
17 (a) Potass, hydroxide Water 10 g to 100 ml Mix equal amounts of (a) and (b) as needed Grain boundary etch
(b) Pot. ferricyanide Water 10 g to 100 ml
18 Ammonia (0.88) 50 ml Boil for up to 10 min General etch
Hydrogen perioxide (3 %) 50 ml
Water 50 ml
Nickel and its alloys
19 Nitric acid (1.40) 10 ml Pure nickel, and nickel–chromium alloys. Grain boundaries etched
Hydrochloric acid (1.19) 20 ml
Glycerol 30 ml
20 Nitric acid (1.40) 10 ml Used for pure nickel, cupro-nickel, Monel metal, and nickel–silver
Acetic acid 10 ml
Acetone 10 ml
(continued)
563
(continued)
564

No. Reagent composition Remarks


21 Hydrochloric acid (1.19) 300 ml Stand in fume cupboard for 24 h; use diluted 50:50 with water. Good for Nilo K etc. Can be kept as stock solution
Nitric acid (1.40) 100 ml
Ferric chloride 25 g
Cupric chloride 25 g
(‘Green special etch’, also known as Pinder’s etch)
Platinum group of metals (e.g. Pt, Pd, Rh, Ru, Ir, Os)
– Use Aqua Regia—see Etchant No. 9 (may need to be warmed) Grain contrasting
22 Potasssium ferricyanide 3.5 g Several minutes immersion Most alloys, for general etching of grain boundaries
Sodium hydroxide 1g
Water 150 ml
Silver
23 Ammonium hydroxide 50 ml Recommended for silver, silver–nickel, and silver–palladium alloys. Also useful for the examination of silver-
Hydrogen peroxide (3 %) 10–30 ml soldered joints
24 Sulphuric acid (10 % in water) to which a few crystals of chromic acid CrO3 This reagent reveals the grain structure of silver and silver rich-alloys
have been added (2 g)
Tin and its alloys
25 Nitric acid (1.40) 2 % in alcohol Micro etch with high contrast, which blackens lead and darkens tin to light brown after prolonged immersion
26 Silver nitrate 5g Micro etch recommended for lead-rich alloys. Darkens primary and eutectic lead and produces a very high grain
Water 100 ml contrast
Titanium and its alloys
27 Hydrofluoric acid (40 %) 1–3 ml 3–10 s Most useful general etch, especially for Ti6A14V alloy
Plastic mounts must be thoroughly washed to remove all hydrofluoric acid as redisudal acid will etch and damage
glass microscope lens
Nitric acid (1.40) 2–6 ml
Water (Kroll’s reagent) to 100 ml
28 Potassium hydroxide (40 %) 10 ml 3–20 s Useful for α/β alloys, α is attacked or stained. β unattacked
Hydrogen peroxide (30 %) 5 ml
Water (can be varied to suit alloy) 20 ml
Marinol blue—50 % Benzalconium chloride 10–15 ml Stain etch to show alpha-stabilized layer
solution
29 Glycerol 40 ml The specimen must be dry, and swab etching gives best control; time of etching varies; continue until specimen turns
Methylated spirit 40 ml light-brown
Hydrofluoric acid (40%) 5–10 ml
Tungsten
30 Sodium hydroxide, 10% in water 10 ml This reagent is used cold and, on immersion of the specimen for approximately 10 s, develops grain boundaries
Potassium ferricyanide, 10% in water 10 ml (Murakami’s reagent)
31 Hydrogen peroxide, 3 % in water This reagent develops grain boundaries, but only after some 30–90 s in the boiling reagent
Appendix 3: Reagents for Microetching Metals and Alloys
Appendix 4: Conversion Table for Mechanical
Properties

Conversion table for mechanical properties (N/mm2(MPa) to hbar, (continued)


tonf/in2, lbf/in2and kgf/mm2)
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2 180 18 11.7 26,100 18.4
5 0.5 0.3 700 0.5 185 18.5 12.0 26,800 18.9
10 1 0.6 1500 1.0 190 19 12.3 27,600 19.4
15 1.5 1.0 2200 1.5 195 19.5 12.6 28,300 19.9
20 2 1.3 2900 2.0 200 20 12.9 29,000 20.4
25 2.5 1.6 3600 2.5 205 20.5 13.3 29,700 20.9
30 3 1.9 4400 3.1 210 21 13.6 30,500 21.4
35 3.5 2.3 5100 3.6 215 21.5 13.9 31,200 21.9
40 4 2.6 5800 4.1 220 22 14.2 31,900 22.4
45 4.5 2.9 6500 4.6 225 22.5 14.6 32,600 22.9
50 5 3.2 7300 5.1 230 23 14.9 33,400 23.5
55 5.5 3.6 8000 5.6 235 23.5 15.2 34,100 24.0
60 6 3.9 8700 6.1 240 24 15.5 34,800 24.5
65 6.5 4.2 9400 6.6 245 24.5 15.9 35,500 25.0
70 7 4.5 10,200 7.1 250 25 16.2 36,300 25.5
75 7.5 4.9 10,900 7.6 255 25.5 16.5 37,000 26.0
80 8 5.2 11,600 8.2 260 26 16.8 37,700 26.5
85 8.5 5.5 12,300 8.7 265 26.5 17.2 38,400 27.0
90 9 5.8 13,100 9.2 270 27 17.5 39,200 27.5
95 9.5 6.2 13,800 9.7 275 27.5 17.8 39,900 28.0
100 10 6.5 14,500 10.2 280 28 18.1 40,600 28.6
105 10.5 6.8 15,200 10.7 285 28.5 18.5 41,300 29.1
110 11 7.1 16,000 11.2 290 29 18.8 42,100 29.6
115 11.5 7.4 16,700 11.7 295 29.5 19.1 42,800 30.1
120 12 7.8 17,400 12.2 300 30 19.4 43,500 30.6
125 12.5 8.1 18,100 12.7 305 30.5 19.7 44,200 31.1
130 13 8.4 18,900 13.3 310 31 20.1 45,000 31.6
135 13.5 8.7 19,600 13.8 315 31.5 20.4 45,700 32.1
140 14 9.1 20,300 14.3 320 32 20.7 46,400 32.6
145 14.5 9.4 21,000 14.8 325 32.5 21.0 47,100 33.1
150 15 9.7 21,800 15.3 330 33 21.4 47,900 33.7
155 15.5 10.0 22,500 15.8 335 33.5 21.7 48,600 34.2
160 16 10.4 23,200 16.3 340 34 22.0 49,300 34.7
165 16.5 10.7 23,900 16.8 345 34.5 22.3 50,000 35.2
170 17 11.0 24,700 17.3 350 35 22.7 50,800 35.7
175 17.5 11.3 25,400 17.8 355 35.5 23.0 51,500 36.2
(continued) (continued)

© Springer International Publishing Switzerland 2016 565


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
566 Appendix 4: Conversion Table for Mechanical Properties

(continued) (continued)
2 2 2 2
N/mm hbar tonf/in. lbf/in. kgf/mm N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
360 36 23.3 52,200 36.7 485 48.5 31.4 70,300 49.5
365 36.5 23.6 52,900 37.2 490 49 31.7 71,100 50.0
370 37 24.0 53,700 37.7 495 49.5 32.1 71,800 50.5
375 37.5 24.3 54,400 38.2 500 50 32.4 72,500 51.0
380 38 24.6 55,100 38.7 505 50.5 32.7 73,200 51.5
385 38.5 24.9 55,800 39.3 510 51 33.0 74,000 52.0
390 39 25.3 56,600 39.8 515 51.5 33.3 74,700 52.5
395 39.5 25.6 57,300 40.3 520 52 33.7 75,400 53.0
400 40 25.9 58,000 40.8 525 52.5 34.0 76,100 53.5
405 40.5 26.2 58,700 41.3 530 53 34.3 76,900 54.0
410 41 26.5 59,500 41.8 535 53.5 34.6 77,600 54.6
415 41.5 26.9 60,200 42.3 540 54 35.0 78,300 55.1
420 42 27.2 60,900 42.8 545 54.5 35.3 79,000 55.6
425 42.5 27.5 61,600 43.3 550 55 35.6 79,800 56.1
430 43 27.8 62,400 43.8 555 55.5 35.9 80,500 56.6
435 43.5 28.2 63,100 44.4 560 56 36.3 81,200 57.1
440 44 28.5 63,800 44.9 565 56.5 36.6 81,900 57.6
445 44.5 28.8 64,500 45.4 570 57 36.9 82,700 58.1
450 45 29.1 65,300 45.9 575 57.5 37.2 83,400 58.6
455 45.5 29.5 66,000 46.4 580 58 37.6 84,100 59.1
460 46 29.8 66,700 46.9 585 58.5 37.9 84,800 59.7
465 46.5 30.1 67,400 47.4 590 59 38.2 85,600 60.2
470 47 30.4 68,200 47.9 595 59.5 38.5 86,300 60.7
475 47.5 30.8 68,900 48.4 600 60 38.8 87,000 61.2
480 48 31.1 69,600 48.9
(continued)
Appendix 5: Aluminium Alloy Temper Designations

The compositions and temper conditions of aluminium 9 the minimum ultimate tensile strength exceeds that
alloys are designated by the Aluminium Association (AA) of the fully hard by at least 10 MPa.
and are recognized internationally. Further information can The second digit indicates the degree of hardening and
be obtained from the AA. is a number from 1 to 9.
The Basic Temper Designations are as follows: (c) Third digit
A third digit may be used to denote a further charac-
F As fabricated
teristic or variation.
O Annealed
H Strained hardened
Spacecraft aluminium alloys are generally subdivisions
T Thermally treated to produce stable tempers other
of the T temper, as shown below
than F, O, H
A more precise description of the T tempers is as follows,
but whenever possible the original material specification
The Subdivisions of H temper are as follows: should be consulted, as some deviations exist:
T1 Cooled from an elevated temperature-shaping
(a) First digit
process and naturally aged to a substantially
H1 strain hardened only
stable condition
H2 strain hardened and partially annealed
T2 Cooled from an elevated temperature-shaping
H3 strain hardened and stabilized
process, cold-worked, and naturally aged to a
(b) Second digit
substantially stable condition
1 1/8 hard
T3 Solution heat-treated, cold-worked, and natu-
2 quarter hard
rally aged to a substantially stable condition
3 3/8 hard
T351 Solution heat-treated and stress-relieved by
4 half hard
stretching to produce a permanent set of 2 %
5 5/8 hard
nominal but not less than 1.5 % nor more than
6 three quarters hard
3 %. Product shall receive no further straight-
7 7/8 hard
ening after stretching
8 fully hard

© Springer International Publishing Switzerland 2016 567


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
568 Appendix 5: Aluminium Alloy Temper Designations

T3510 Solution heat-treated and stress-relieved by T451 Rolled or cold-finished, stress-relieved by


stretching to produce a nominal permanent set stretching to produce a nominal permanent set of
of 1.5 %, but not less than 1 % nor more than 1.5 % but not less than 1 % nor more than 3 %
3 %. Extrusions shall receive no straightening Product shall receive no further operations after
after stretching stretching unless specifically authorized by
T3511 Solution heat-treated and stress-relieved by purchaser
stretching to produce a nominal permanent set T4510 Solution heat-treated and stress-relieved by
of 1–1.5 %, but not less than 1 % nor more than stretching to produce a permanent set of 1.5 %
3 %. Extrusions may receive minor straighten- nominal, but not less than 1 % nor more than
ing, after stretching, of an amount necessary to 3 %. Material shall receive no further straight-
meet the tolerances ening after stretching
T352 Solution heat-treated and stress-relieved by T4511 Solution heat-treated and stress-relieved by
compression to produce a permanent set of 1.5– stretching to produce a permanent set of 1.5 %
5 %. During compression, primary focus shall nominal, but not less than 1 % nor more than
be applied in the axial direction 3 %. Material may receive minor straightening
T36 Solution heat-treated and cold-worked by after stretching
reduction of approximately 6 % T5 Cooled from an elevated temperature-shaping
T361 Solution heat-treated and cold-reduced approx- process and then artificially aged (wrought
imately 6 % in thickness products). Stress-relieved (castings)
T4 Solution heat-treated and naturally aged to a T51 Precipitation heat-treated (castings)
substantially stable condition T6 Solution and precipitation heat-treated
T42 Material purchased in any temper and subse- T61 Solution heat-treated and precipitation
quently solution heat-treated and naturally aged heat-treated. Quenching from the solution tem-
to a substantially stable condition by the user perature shall be into water at 80–85 °C
Appendix 5: Aluminium Alloy Temper Designations 569

T611 Solution and precipitation heat-treated, low T7352 Solution heat-treated and stress-relieved by
residual stresses compression to produce a permanent set of not
Material may, after quenching from the solution less than 1 % nor more than 5 %, and
heat-treatment temperature, receive minor precipitation heat-treated. The method and
straightening in an amount necessary to meet direction of compression shall be as agreed upon
tolerances specified on the drawing by purchaser and vendor
T62 Solution heat-treated and then artificially aged T736 See T74
by the user T73651 Solution heat-treated and stress-relieved by
T651 Solution heat-treated and stress-relieved by stretching to produce a nominal set of 2 % but
stretching to produce a permanent set of 2 % no less than 1.5 % nor more than 3 %, and
nominal but not less than 1.5 % nor more than precipitation heat-treated
3 %, and artificially aged. Product shall receive T736511 Solution heat-treated and stress-relieved by
no further straightening after stretching stretching to produce a nominal permanent set
T6510 Solution heat-treated and stress-relieved by of 1.5 % but not less than 1 % nor more than
stretching to produce a permanent set of 1.5 % 3 %, and precipitation heat-treated. Material
nominal, but not less than 1 % nor more than may receive minor straightening after stretching,
3 % and artificially aged. Material shall receive to meet required dimensional tolerances
no further straightening after stretching T73652 Solution heat-treated and stress-relieved by
T6511 Solution heat-treated and stress-relieved by compression to produce a permanent set of not
stretching to produce a permanent set of 1.5 % less than 1 % nor more than 5 %, and
nominal, but not less than 1 % nor more than precipitation heat-treated. The method and
3 %, and artificially aged. Material may receive direction of compression shall be as agreed upon
minor straightening after stretching by purchaser and vendor
T652 Solution heat-treated and stress-relieved by T74 (Previously T73 or T736.) Solution heat-treated
compression to produce a permanent set of 1.5– and artificially aged to resist stress-corrosion
5 %, and precipitation heat-treated. During cracking
compression, primary focus shall be applied in T7451 Solution heat-treated and stress-relieved by
the axial direction and on individual rings stretching to produce a nominal permanent set
approximately final dimensions of 2 % but not less than 1.5 % nor more than
T66 Solution and precipitation heat-treated 3 %, and precipitation heat-treated. Plate shall
T7 Solution heat-treated and overaged/stabilized receive no further straightening operations after
T71 Solution and precipitation heat-treated (castings) stretching
T72 Solution heat-treated and then artificially over- T7452 Solution heat-treated and stress-relieved by
aged by the user compressing to produce a permanent set of 1–
T73 See T74 5 % and overaged
T7351 Solution heat-treated and stress-relieved by T76 Solution heat-treated and artificially aged suffi-
stretching to produce a nominal permanent set cient to produce improved resistance to
of 2 % but not less than 1.5 % nor more than exfoliation
3 %, and precipitation heat-treated. Plate shall T761 Solution heat-treated and precipitation
receive no further straightening operations after heat-treated. The T7 tempers require closer
stretching control on ageing practice variables such as
T73510 Solution heat-treated and stress-relieved by time, temperature, heating-up rates, etc
stretching to produce nominal permanent set of T7651 Solution heat-treated and stress-relieved by
1.5 % but not less than 1 % nor more than 3 %, stretching to produce a permanent set of 2 %
and precipitation heat-treated. Material shall nominal but not less than 1.5 % nor more than
receive no further straightening after stretching 3 %, and artificially aged sufficient to produce
T7311 Solution heat-treated and stress-relieved by improved resistance to exfoliation and
stretching to produce nominal permanent set of stress-corrosion cracking. Plate shall receive no
1.5 %, but not less than 1 % nor more than 3 %, further straightening after stretching
and precipitation heat-treated. Material may T76511 Solution heat-treated and stress-relieved by
receive minor straightening, after stretching, an stretching to produce a nominal permanent set
amount necessary to meet required dimensional of 1.5 %, but not less than 1 % nor more than
tolerances 3 %, and precipitation treated. Material may
570 Appendix 5: Aluminium Alloy Temper Designations

receive minor straightening, after stretching, of of 1.5 % but not less than 1 % nor more than
an amount necessary to meet required dimen- 3 %, and precipitation heat-treated
sional tolerances T852 Solution heat-treated and stress-relieved by
T77 Solution-treated and stabilized compression, to produce a permanent set of 1–
T8 Solution heat-treated, cold-worked, and then 5 %, and precipitation heat-treated
artificially aged T86 Solution heat-treated, cold-worked by a reduc-
T81 Solution heat-treated, cold-worked by the flat- tion of approximately 6 %, and then artificially
tening operation, and then artificially aged aged
T851 Solution heat-treated and stress-relieved by T861 Solution heat-treated, cold-reduced approxi-
stretching to produce a permanent set of 2 % mately 6 % in thickness, and precipitation
nominal but not less than 1.5 % nor more than heat-treated
3 %, and artificially aged. Plate shall receive no T9 Solution heat-treated, artificially aged, and then
further straightening after stretching cold-worked
T8511 Solution heat-treated and stress-relieved by T10 Cooled from an elevated temperature-shaping
stretching to produce a nominal permanent set process, cold-worked, and then artificially aged
Appendix 6: Metal Alloy Comparison Tables

Introduction It is for the user to decide from the composition whether


the related specifications are sufficiently similar to permit the
Marshall Space Flight Center document MSFC-SPEC-522A, British, French or German alloy to be regarded as a suitable
entitled ‘Design criteria for controlling stress corrosion substitute for the American alloy. In all critical applications
cracking’, contains a list of alloys. Each alloy bears a five- the individual alloy specifications must be consulted as
digit classification number, which is made up as follows: precise compositions, tolerance in composition, the present
The first digit denotes the class: of trace elements, etc. can be important. No attempt has been
made to relate materials on the basis of form, but reference to
1. Steels the specification numbers will give guidance in this matter.
2. Nickel alloys In the case of the steels and the aluminium alloys, the list
3. Aluminium alloys must be used in conjunction with the notes appended at the
4. Copper alloys end of the relevant section.
5. Titanium alloys Following the list, there is an index that enables the five-
6. Magnesium alloys digit table numbers to be related to the unified numbering
7. Miscellaneous system (UNS) of the Society of Automotive Engineers
(SAE) and the American Society for Testing Materials
The second digit denotes the subclass. (ASTM). The UNS numbers are prefixed by letter symbols
The last three digits are a serial number within the that have the following meaning:
subclass.
A Aluminium and aluminium alloys
The list contained in the following pages is based on the
C Copper and copper alloys
list described above, which forms as it were the framework.
G AISI and SAE carbon steels
Into this framework have been intercalated those British,
J Cast steels (except tool steels)
French and German alloy specifications that most closely
K Miscellaneous nonferrous metals and alloys
correspond to their American counterparts. If an American
N Nickel and nickel alloys
specification is not followed by such a European specifica-
R Reactive and refractory metals and alloys
tion, that means that diligent searching has failed to reveal an
S Heat- and corrosion-resistant (stainless) steels
equivalent.
T Tool steels, wrought and cast

© Springer International Publishing Switzerland 2016 571


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
572 Appendix 6: Metal Alloy Comparison Tables

Alloy equivalents—steels
Composition
Country Designation C Si Mn P S Other
Carbon steels
11001 USA AISI/SAE 1005 (UNS G10050) <.06 *1 <.35 <.04 <.05 –
UK BS970 015A03 <.06 *1 <.3 <.05 <.05 –
F AFNOR FD5 .04–.07 – .2–.4 .02 .025 –
F AFNOR FD4 .04–.07 <.1 .2–.4 .025 .03 –
G DIN 17140 D6-2 Wk. 1.0314 <.06 *2 <.4 <.04 <.04 N < .007 *3
G DIN 17140 D5-1 Wk. 1.0312 <.06 *2 <.4 <.05 <.05 –
11002 USA AISI/SAE 1006 (UNS G10060) <.08 *1 .25–.4 <.04 <.05 –
UK BS970 030A04 <.08 *1 .2–.4 <.05 <.05 –
G DIN 17140 D7-1 Wk. 1.0311 <.08 *2 <.45 <.06 <.05 –
G DIN 17140 D8-2 Wk. 1.0313 <.08 *2 <.45 <.045 <.04 N < .007 *3
11003 USA AISI/SAE 1008 (UNS G10080) <.1 *1 .3–.5 <.04 <.05 –
UK BS970 040A04 <.08 *1 .3–.5 <.05 <.05 –
F AFNOR FdTu4 <.09 – .25–.5 – – N < .006
F AFNOR FdTu2 <.08 – .35–.6 – N < .014 Mn/S > 10
F AFNOR FdTu10 <.1 – .25–.5 – – N < .01
F AFNOR FdTu11 <.1 <.1 .25–.5 – –
F AFNOR Fd2 .04–.1 – .2–.45 – – N < .007
F AFNOR Fd12 .04–.1 – .2–.5 – – N < .007
G Ust4, US14 Wk. 1.0336 <.09 *2 .25–.5 <.03 <.03 N < .007
G DIN 1623; 1624; 5512; st2, st12 Wk. <.1 *2 .2–.45 <.033 <.035 N < .007 *3
1.0330
G DIN 1623. B11; 001624; st3, st13 Wk. <.1 *2 .2–.4 <.025 <.023 N < .007
1.0333
G DIN 17115; Ust35-2; Wk. 1.0207 .06–.14 *2 .4–.6 <.04 <.04 N < .007 *3—Also
AISI 1010
G DIN 17115; Rst35-2; Wk. 1.0208 .06–.12 .03–25 .4–.6 <.04 <.04 Also AISI 1010
G DIN 17111; UQst 36-2; Wk. 1.0204 .08–.13 *2 1.25–.45 <.04 <.04 N < .007 *3—Also
AISI 1010
G DIN 17111; Rst 36-2; Wk. 1.0205 <.13 <.4 25–.5 <.05 <.5 N < .007 *3-Also AISI
1010
11004 USA AISI/SAE 1010 (UNS G10100) .08–.13 *1 .3–.6 <.04 <.05 –
UK BS970 040A10 .08–.13 *1 .3–.5 <.05 <.05 –
UK BS970 045A10 .08–.13 *1 .3–.6 <.05 <.05 –
F AFNOR Xc9 .06–.12 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck10 Wk. 1.1121 .07–.13 .15–.35 .3–.6 <.035 <.035 –
G DIN 17210; 1652 c9 Wk. 1.0301 .07–.13 .15–.33 .3–.6 <.045 <.043 –
11005 USA AISI/SAE 1011 (UNS G10110) .08–.13 *1 .6–.9 <.04 <.05 –
UK BS970 060A10 .08–.13 *1 .5–.7 <.05 <.05 –
11006 USA AISI/SAE 1012 (UNS G10120) .1–.15 – .3–.6 <.04 <.05 –
UK BS970 040A12 .1–.15 *1 .3–.5 <.05 <.05 –
F AFNOR XC 12 .1–.16 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck10Wk. 1.1121 .07–.13 .15–.35 .3–.6 <.035 <.035 –
G DIN 17210; 1652 c9 Wk. 1.0301 .07–.13 .15–.35 .3–.6 <.045 <.045 –
11007 USA AISI/SAE 1015 (UNS G10150) .13–.18 *1 .3–.6 <.04 <.05 –
UK BS970 040A15 .13–.18 *1 .3–.5 <.05 <.05 –
UK BS970 050A15 .13–.18 *1 .4–.6 <.05 <.05 –
F AFNOR XC12 .1–.16 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck15 Wk. 1.1141 .12–.18 .15–.35 .3–.6 <.035 <.035 –
11008 USA AISI/SAE 1016 (UNS G10160) .13–18 *1 .6–.9 <.04 <.05 –
UK BS970 080A15 .13–.18 *1 .7–.9 <.05 <.05 –
G DIN 17111; Rst 44.2 Wk. 1.0419 <.18 <.45 <.8 <.05 <.05 N < .007
11009 USA AISI/SAE 1017 (UNS G10170) .15–.2 *1 .3–.6 <.04 <.05 –
UK BS970 040A17 .15–.2 *1 .3–.5 <.05 <.05 –
F AFNOR XC18 .16–.22 <.25 .4–.65 – – –
G DIN 17210; 1652 Ck15 Wk. 1.1141 .12–.18 .15–.35 .3–.6 <.035 <.035 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 573

(continued)
Composition
Country Designation C Si Mn P S Other
11010 USA AISI/SAE 1018 (UNS G10180) .15–.2 *1 .6–.9 <.04 <.05 –
UK BS970 080A17 .15–.2 *1 .7–.9 <.05 <.05 –
G DIN 17172; st43.7 Wk. 1.0484 <.22 <.4 .5–1.1 <.04 <.045 –
11011 USA AISI/SAE 1019 (UNS G10190) .15–.2 *1 .7–1.0 <.04 <.05 –
UK BS970 080A17 .15–.2 *1 .7–.9 <.05 <.05 –
G DIN 17172; St43.7 VVk.1.0484 <.22 <.4 .5–1.1 <.04 <.045 –
11012 USA AISI/SAE 1020 (UNS G10200) .18–.23 *1 3–.6 <.04 <.05 –
UK BS970 040A20 .18–.23 *1 .3–.5 <.05 <.05 –
F AFNOR CC20 .15–.25 .1–.4 .4–.7 <.04 <.04 –
G DIN 17200; 17242; 17243; 1652. C22 .18 .25 .15–.35 .3–.6 <.045 <.045 –
Wk. 1.0402
11013 USA AISI/SAE 1021 (UNS G10210) .18–.23 *1 .6–.9 <.04 <.05 –
UK BS970 080A20 .18–.23 *1 .7–.9 <.05 <.05 ––
G DIN 17172; St47.7 Wk. 1.0409 <.22 .2–.45 .7–1.3 <.04 <.035 N < .009
11014 USA AISI/SAE 1022 (UNS G10220) .18–.23 *1 .7–1.0 <.04 <.05 –
UK BS970 080A20 .18–.23 *1 .7–.9 <.05 <.05 –
G DIN 17172; St47.7 Wk. 1.0409 <.22 .2–.45 .7–1.3 <.04 <.035 –
11015 USA AISI/SAE 1023 (UNS G10230) .2–.25 *1 .3–.6 <.04 <.05 –
UK BS970 040A22 .2–.25 *1 .3–.5 <.05 <.05 –
F AFNOR XC18S .15–.22 <.25 .4–.65 <.04 <.035 –
G DIN 17200; 1652. Ck22 Wk. 1.1151 .18–.25 .15–.35 .3–6 <.035 <.035 Cr < .5
11016 USA AISI/SAE 1025 (UNS G10250) .22–.28 *1 .3–.6 <.04 <.05 –
UK BS970 060A25 .23–.28 *1 .5–.7 <.05 <.05 –
F AFNOR XC25 .23–.29 .1–.4 .4–.7 – – –
G Ck25 Wk. 1.1158 .22–.29 .15–.4 .4–.7 <.035 <.035 –
11017 USA AISI/SAE 1026 (UNS G10260) .22–.28 *1 .6–.9 <.04 <.05 –
UK BS970 080A25 .23–.28 *1 .7–.9 <.05 <.05 –
11018 USA AISI/SAE 1029 (UNS G10290) .25–.31 *1 .6–.9 <.04 <.05 –
UK BS970 080A27 .25–.30 *1 .7–.9 <.05 <.05 –
11019 USA AISI/SAE 1030 (UNS G10300) .28–.34 *1 .6–.9 <.04 <.05 –
UK BS970 080A30 .28–.33 *1 .7–.6 <.05 <.05 –
11020 USA AISI/SAE 1035 (UNS G10350) .32–.38 *1 .6–.9 <.04 <.05 –
UK BS970 080A35 .33–.38 *1 .7–.9 <.05 <.05 –
F AFNOR XC32 .3–.35 .1–.4 .5–.8 – –– –
G DIN 17200; 17240; 0017242. Ck35 .32–.39 .15–.35 .5–.8 <.035 <.035 –
Wk. 1.1181
11021 USA AISI/SAE 1037 (UNS G10370) .32–.38 *1 .7–1.0 <.04 <.05 –
UK BS970 080A35 .33–.38 *1 .7–.9 <.05 <.05 –
F AFNOR XC35 .32–.38 .1–.4 .5–.8 <.04 <.035 –
G DIN 17200; 17240; 0017242 Ck35 .32–.39 .15–.35 .5–.8 <.035 <.035 –
Wk. 1.1181
11022 USA AISI/SAE 1038 (UNS G10380) .35–.42 *1 .6–.9 <.04 <.05 –
UK BS970 080A37 .35–.4 *1 .7–.9 <.05 <.05 –
F AFNOR XC38 .35–.4 .1–.4 .5–.8 <.035 <.035 –
G Ck38 Wk. 1.1176 .35–.4 .35–.5 .5–.7 <.035 <.035 N < .007, *3
11023 USA AISI/SAE 1039 (UNS G10390) .37–.44 *1 .7–1.0 <.04 <.05 –
UK BS970 080A40 .38–.43 *1 .7–.9 <.05 <.05 –
F AFNOR XC42 .4–.45 .1–.4 .5–.8 <.035 <.035 –
G Ck42A1 Wk. 1.1190 .39–.44 .25–.4 .75–.9 <.035 <.035 N < .007 *3
11024 USA AISI/SAE 1040 (UNS G10400) .37–.44 *1 .6–.9 <.04 <.05 –
UK B 970 060A40 .38–.43 *1 .5–.7 <.05 <.05 –
G Ck40 Wk. 1.1186 .37–.43 .15–.35 .5–.8 <.035 <.035 N < .007 *3
11025 USA AISI/SAE 1042 (UNS G10420) .4–.47 *1 .6–.9 <.04 <.05 –
UK BS970 060A42 .4–.45 *1 .5–.7 <.05 <.05 –
F AFNOR XC42 .4–.45 .1–.4 .5–.8 <.035 <.035 –
G Ck42A1 Wk. 1.1190 .39–.44 .25–.4 .75–.9 <.035 <.035 N < .007 *3
(continued)
574 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation C Si Mn P S Other
11026 USA AISI/SAE 1043 (UNS G10430) .4–.47 *1 .7–1.0 <.04 <.05 –
UK BS970 080A42 .4–.45 *1 .7–.9 <.05 <.05 –
G DIN 17200; 17242; 1652. C45 Wk. .42–.45 .15–.35 .5–.8 <.045 <.045 –
1.0503
11027 USA AISI/SAE 1045 (UNS G10450) .43–.50 *1 .6–.90 <.04 <.05 –
UK BS970 080M46 .42–.50 *1 .6–1.0 <.05 <.05 –
F AFNOR XC45 .42–.48 .1–.35 .5–.8 <.035 <.035 –
G DIN 17200; 1652; 0017242 Ck45 Wk. .42–.5 .15–.35 .5–.8 <.035 <.035 N < .007 *3
1.1191
G DIN 17200 Cm45 Wk. 1.1201 .42–.5 .15–.35 .5–.8 <.035 .020–.035 –
CEN EN 10083-1 2C45 (C45E) 1.1191 Near equivalent to
BS970 070M55
11028 USA AISI/SAE 1046 (UNS G10460) .43–.5 *1 .7–1.0 <.04 <.04 –
UK BS970 080A47 .45–.5 *1 .7–.9 <.05 <.05 –
11029 USA AISI/SAE 1049 (UNS G10490) .46–.53 *1 .6–.9 <.04 <.05 –
UK BS970 080M50 .45–.55 *1 .6–1.0 <.05 <.05 –
F AFNOR XC50 .46–.52 .15–.35 .5–.8 <.035 <.035 –
G CK50 Wk. 1.1206 .47–.55 .15–.35 .6–.9 <.035 <.035 –
CEN EN 10083-1 2C50 (C50E) 1.1206 Near equivalent to
BS970 080M50
11030 USA AISI/SAE 1050 (UNS G10500) (*4) .48–.55 *1 .6–.9 <.04 <.05 –
UK BS970 080A52 .5–.55 *1 .7–.9 <.05 <.05 –
11031 USA AISI/SAE 1053 (UNS G10530) .48–.55 *1 .7–1.0 <.04 <.05 –
UK BS970 080A52 .5–.55 *1 .7–.9 <.05 <.05 –
11032 USA AISI/SAE 1055 (UNS G10550) (*4) .5–.6 *1 .6–.9 <.04 <.05 –
UK BS970 070M55 .5–.6 *1 .5–.9 <.05 <.05 –
F AFNOR XC55 .52–.6 .1–.4 .5–.8 <.035 <.035 –
G DIN 17200 Cm55 Wk. 1.1209 .52–.6 .15–.35 .6–.9 <.035 .020–.035 –
CEN EN 10083-1 2C55 (C55E) 1.1203 Near equivalent to
BS970 070M55
11033 USA AISI/SAE 1060 (UNS G10600) (*4) .55–.65 *1 .6–.9 <.04 <.05 –
UK BS970 080A57 55–.6 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC60 .57–.65 .15–.35 .4–.7 <.035 <.035 –
G DIN 17200 Cm60 Wk. 1.1223 .57–.65 .15–.35 .6–.9 <.035 .02–.035 –
G DIN 17200; 1652; 0017222 Ck60 Wk. .57–.65 .15–.35 .6–.9 <.035 <.035 –
1.1221
G DIN 17200; 1652; 17222 C60 Wk. .57–.65 .15–.35 .6–.9 <.045 <.045 –
1.0601
11034 USA AISI/SAE 1064 (UNS G10640) (*4) .6–.7 *1 .5–.8 <.04 <.05 –
UK BS970 060A62 .6–.65 .1–.4 .5–.7 <.05 <.05 –
UK BS970 060A67 .65–.7 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC65 .6–.69 .1–.4 .5–.8 <.035 <.055 –
G DIN 17223 Federstahldraht FD (VD) .6–.7 <.25 .5–.9 <.03 <.03 (<.02) –
Wk. 1.1230
G Ck65 .65 .3 .75 <.035 <.035 –
11035 USA AISI/SAE 1065 (UNS G10650) (*4) .6–.7 *1 .6–.9 <.04 <.05 –
UK BS970 080A62 .6–.65 .1–.4 .7–.9 <.05 <.05 –
UK BS970 080A67 .65–.1 .1–.4 .7–.9 <.05 <.05 –
11036 USA AISI/SAE 1069 (UNS G10690) .66–.75 *1 .4–.7 <.04 <.05 –
UK BS970 060A72 .7–.75 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC68 .65–.73 .15–.35 .4–.7 <.035 <.035 –
G DIN 0017222 Ck67 Wk. 1.1231 .65–.72 15–.35 .6–.9 <.035 <.035 –
11037 USA AISI/SAE 1070 (UNS G10700) .65–.75 *1 .6–.9 <.04 <.05 –
UK BS970 080A72 .7–.75 .1–.4 .7–.9 <.05 <.05 –
G DIN001 7222 Ck67 Wk. 1.1 231 .65–.72 .15–.35 .6–.9 <.035 <.035 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 575

(continued)
Composition
Country Designation C Si Mn P S Other
11038 USA AISI/SAE 1074 (UNS G10740) .7–.8 *1 .5–.8 <.04 <.05 –
UK BS970 070A78 .75–.82 .1–.4 .6–.8 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G DIN0017222 Ck75Wk. 1.1248 .7–.8 .15–.35 .6–.8 <.035 <.033 N < .007 *3
11039 USA AISI/SAE 1075 (UNS G10750) .7–.8 *1 .4–.7 <.04 <.05 –
UK BS970 060A78 .75–.82 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G Wk. 1.1246 .7–.77 <.2 .4–.6 <.025 <.025 –
11040 USA AISI/SAE 1078 (UNS G10780) .72–.85 *1 .3–.6 <.04 <.05 –
UK BS970 060A78 .75–.82 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G Wk. 1.1246 .7–.77 <.2 4–.6 <.025 <.025 –
11041 USA AISI/SAE 1080 (UNS G10800) .75–.88 *1 .6–.9 <.04 <.05 –
UK BS970 080A83 .7–.9 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC80 .75–.85 .1–.4 .5–.8 <.035 <.035 Cr < 2
G DIN 0017222 Ck75 .7–.8 .15–.35 .6–.8 <.035 <.035 N < .007 *3
G Ck80 .8 .35 .75 <.035 <.035 –
11042 USA AISI/SAE 1084 (UNS G10840) .8–.93 *1 .6–.9 <.04 <.05 –
UK BS970 080A86 .83–.9 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC85 .8 .2–.4 .4–.7 <.03 <.025 –
G DIN 0017222.Ck85 Wk. 1.1269 .8–.9 .15–.35 .45–.65 <.035 <.035 N < .007 *3
11043 USA AISI/SAE 1085 (UNS G10850) .8–.93 *1 .7-1.0 <.04 <.05 –
UK BS970 080A86 .83–.9 .1–.4 .7–.9 <.05 < –
G 90Mn4 Wk. 1.1273 .85–.95 .25–.5 .9–1.1 <.035 <.035 –
11044 USA AISI/SAE 1086 (UNS G10860) .8–.93 *1 .3–.5 <.04 <.05 –
UK BS970 050A86 .83–.9 .1–.4 .4–.6 <.05 <.05 –
F AFNOR XC90 .85–.95 .15–.3 .3–.5 <.03 <.025 –
G Mk83 Wk. 1.1262 .8–.84 .1–.25 .35–.55 <.03 <.03 N < .007 *3
G Mk82 Wk. 1.1261 .8–.84 .1–.25 .25–.45 <.025 <.025 –
11045 USA AISI/SAE 1090 (UNS G10900) .85–.98 *1 .6–.9 <.04 <.05 –
UK BS970 060A96 .93–1.0 .1–.4 .5–.7 <.05 <.05 –
11046 USA AISI/SAE 1095 (UNS G10950) .9–1.03 *1 .3–.5 <.04 <.05 –
UK BS970 060A99 .95–1.05 .1–.4 .5–.7 <.05 <.05 –
F AFNOR Xc90 .95–1.05 .15–.3 .2–.45 <.03 <.025 –
G Mk97 .9–1.05 .15–.25 .3–.5 .045–.055 .060–.070 N < .007 *3
Higher manganese steels
12001 USA AISI 1513 (UNS G15130) .1–.16 *1 1.1–1.4 <.04 <.05 –
F AFNOR 12M5 .1–.15 <.4 .9–1.4 <.04 <.035 –
12002 USA AISI 1518 (UNS G15180) .15–.21 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M19 .15–.23 *1 1.0–1.4 <.05 <.05 –
F AFNOR 20M5 .16–.22 .1–.4 1.1–1.4 <.035 <.035 –
G 20Mn6 Wk. 1.1169 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12003 USA AISI 1522 (UNS G15220) .18–.24 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M19 .15–.23 *1 1.0–1.4 <.05 <.05 –
F AFNOR 20M5 .16–.22 .1–.4 1.1–1.4 <.035 <.035 –
F AFNOR 18M5 .16–.22 .1–.4 1.1–1.5 <.04 .18–.23 –
G 20Mn6 Wk. 1.1169 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12004 USA AISI 1524 SAE 1024 (UNS G15240) .19–.25 *1 1.35– <.04 <.05 –
1.65
UK BS970 150M19 .15–.23 *1 1.35–1.7 <.05 <.05 –
G 20Mn6 Wk. 1.1168 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12005 USA AISI 1525 (UNS G15250) .23–.29 *1 .8–1.1 <.04 <.05 –
UK BS970 080A25 .23–.28 *1 .7–.9 <.05 <.05 –
(continued)
576 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation C Si Mn P S Other
12006 USA AISI 1526 (UNS G15260) .22–.29 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M28 .24–.32 *1 1.0–1.4 <.05 <.05 –
G 9S-24 Mn4 Wk. 1.1136 .20–.28 .3–.6 .9–1.2 <.035 <.035 –
12007 USA AISI 1527 SAE 1027 (UNS G15270) .22–.29 *1 1.2–1.5 <.04 <.05 –
UK BS970 150M28 .24–.32 *1 1.3–1.7 <.05 <.05 –
G DIN 17200 Wk. 1.1170 .25–.32 .15–.4 1.3–1.65 <.035 <.035 –
12008 USA AISI 1536 SAE 1036 (UNS G15360) .3–.37 *1 1.2–1.5 <.04 <.05 –
UK BS970 120M36 .32–.4 *1 1.0–1.4 <.05 <.05 –
UK BS970 150M36 .32–.4 *1 1.3–1.7 <.05 <.05 –
F AFNOR 35 M5 .32–.38 .1–.4 1.1–1.4 <.035 <.035 –
G 36Mn5, GS-36Mn5 Wk. 1.1167 .32–.4 .15–.35 1.2–1.5 <.035 <.035 –
12009 USA AISI 1541 SAE 1041 (UNS G15410) .36–.44 *1 1.35– <.04 <.05 –
1.65
F AFNOR 40Mn .36–.44 .1–.4 1.0–1.35 <.04 <.035 –
G 36Mn5, GS-36 Mn5, Wk. 1.1167 .32–.4 .15–.35 1.2–1.5 <.035 <.035 –
12010 USA AISI 1547 SAE 1047 (UNS G15470) .43–.51 *1 1.35– <.04 <.05 –
1.65
F AFNOR 45 M5 .39–.48 .1–.4 1.2–1.5 <.04 <.035 –
12011 USA AISI 1548 SAE 1048 (UNS G15480) .44–.52 *1 1.1–1.4 <.04 <.05 –
F AFNOR 45 M5 .39–.48 .1–.4 1.2–1.5 <.04 <.035 –
12012 USA AISI 1551 SAE 1051 (UNS G15510) .46–.56 *1 .85–1.15 <.04 <.05 –
UK BS970 080M50 .45–.55 *1 .6–1.0 <.05 <.05 –
CEN EN 10083-1 2C50 (C50E) 1.1206 Near equivalent to
BS970 080M50
12013 USA AISI 1552 SAE 1052 (UNS G15520) .47–.55 *1 1.2–1.5 <.04 <.05 –
F AFNOR 55 M5 .5–.6 .1–.4 1.2–1.5 <.05 <.035 –
12014 USA AISI 1561 SAE 1061 (UNS G15610) .55–.65 *1 .75–1.05 <.04 <.05 –
UK BS970 080A57 .55–.60 *1 .7–.9 <.05 <.05 –
G Ck60 Wk. 1.221 .57–.65 .15–.35 .6–.9 <.035 <.035 –
12015 USA AISI 1566 SAE 1066 (UNS G15660) .6–.71 *1 .85–1.15 <.04 <.05 –
UK BS970 080A67 .65–.7 *1 .7–.9 <.05 <.05 –
12016 USA AISI 1572 SAE 1072 (UNS G15720) .65–.76 *1 1.0–1.3 <.04 <.05 –

Free cutting steels


Composition
Country Designation C Si Mn P S Other
13001 USA AISI/SAE 1108 (UNS G11080) .08–.13 *1 .5–.8 <.04 .08–.13 –
G DIN 17111, U7S10, Wk. 1.0700 <.l *2 .4–.7 <.08 .08–.12 N < .007
G 10320 Wk. 1.0721 .07–.13 .1–.4 .5–.9 <.06 .15–.25 –
13002 USA AISI/SAE 1109 (UNS G11090) .08–.13 *1 .6–.9 <.04 .08–.13 –
13003 USA AISI/SAE 1110 (UNS G11100) .08–.13 *1 .3–.6 <.04 .08–.13 –
The changes in manganese range at this carbon level are not reflected in European specifications
F AFNOR 12MF (approximate equivalent) .09–.15 .1–.4 .9–1.2 <.06 .12–.24 –
13004 USA AISI/SAE 1116 (UNS G11160) .14–.2 *1 1.1–1.4 <.04 .16–.23 –
UK BS970 220M07 <.15 *1 .9–1.3 <.07 .2–.3 –
G 9S20 Wk. 1.0711 <.13 <.05 .6–1.2 <.1 .18–.25 –
13005 USA AISI/SAE 1117 (UNS G11170) .14–.2 *1 1.0–1.3 <.04 .08–.13 –
F AFNOR13MF .1–16 .1–.4 .8–1.1 <.04 .09–.13 –
G 9SMN 28 Wk. 1.0715 <.14 <.05 .9–1.3 <.1 .24–.32 –
UK BS970 230M07 <.15 *1 .9–1.3 <.07 .25–.35 –
13006 USA AISI/SAE 1118 (UNS G11180) .14–.2 *1 1.3–1.6 <.04 .08–13 –
13007 USA AISI/SAE 1119 (UNS G11190) .14–.2 *1 1.0–1.3 <.04 .24–.33 –
13008 USA AISI/SAE 1132 (UNS G11320) .27–.34 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 216M28 .24–.32 *1 1.1–1.5 <.06 .12–.2 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 577

(continued)
Composition
Country Designation C Si Mn P S Other
13009 USA AISI/SAE 1137 (UNS G11370) .32–.39 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 225M36 .32–.4 <.25 1.3–1.7 <06 .12–.2 –
F AFNOR 35 M6 .33–39 .1–.4 1.3–1.7 <.04 .09–.13 –
G Wk. 1.0726 .32–39 .1–.4 .5–.9 <.06 .15–.25 –
13010 USA AISI/SAE 1139 (UNS G11390) .35–.43 *1 1.35–1.65 <.04 .13–.2 –
13011 USA AISI/SAE 1140 (UNS G11400) .37–.44 *1 .7–1.0 <.04 .08–.13 –
13012 USA AISI/SAE 1141 (UNS G11410) .37–.45 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 212A37 .35–.40 *1 1.0–1.3 <.06 .12–.2 –
13013 USA AISI/SAE 1144 (UNS G11440) .4–.48 *1 1.35–1.65 <.04 .24–.33 –
13014 USA AISI/SAE 1145 (UNS G11450) .42–.49 *1 .7–1.0 <.04 .04–.07 –
13015 USA AISI/SAE 1146 (UNS G11460) .42–.49 *1 .7–1.0 <.04 .08–13 –
UK BS970 212M44 .4–.48 *1 1.0–1.4 <.06 .12–.2 –
UK BS970 225M44 .4–.48 *1 1.3–1.7 <.06 .2–.3 –
F AFNOR 45 MF6 .41 .48 .1 .4 1.3–1.7 <.04 .24 .32 –
G 45S20 Wk. 1.0727 .42–.5 .1–.4 .5–.9 <.06 .15–.25 –
13016 USA AISI 12L 13 (UNS G12134) <.13 *1 .7–1.0 .07–.12 .24–.33 Pb .15–.35
13017 USA AISI/SAE 12L 14 (UNS G12144) <.15 *1 .85–1.15 .04–.09 .26–.35 Pb .15–.35
F AFNOR 10 Pb2 .05–.15 <.3 .3–.6 <.04 <.04 Pb .15–.30
G 9SMn Pb28 <.14 <.05 .9–1.3 <.1 .24–.32 Pb .15–.30
G 10 SPb 20 .07–13 .1–.4 .5 .9 <.06 .15–.25 Pb .15–.30
G 9SMn Pb 36 <.15 <.05 1.0–1.5 <.1 .32–.40 Pb .15–.30
Note Where USA grades are closely graded they have been grouped together with groups of approximating European specifications

Low alloy steels: Manganese—Molybdenum


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14001 USA AISI/SAE 4012 (UNS .09–.14 .2–.35 .75–1.0 <.035 <.04 – .15–.25 – –
G40120)
G 15Mn Mo53 Wk. 1.5418 (*5) <.2 .3–.5 1.1–1.4 <.04 <.04 – .35 – –
14002 USA AISI/SAE 4023 (UNS .2–.25 .2–.35 .7–.9 <.035 <.04 – .2-3 – –
G40230)
F AFNOR 18MD4.05 (*5) <.22 .1–.4 .9–1.5 <.035 <.035 <.3 .35–.6 – V < .04
G 20Mo3 Wk. 1.5416 .16–.24 .15–.35 .5–.8 <.04 <.04 – .25–.35 – –
14003 USA AISI/SAE 4024 (UNS .2–.25 .2–.35 .7–.9 <.035 .035–.05 – .2–.3 – –
G40240)
F/G See AISI 4023
14004 USA AISI/SAE 4027 (UNS .25–.3 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
G40270)
14005 USA AISI/SAE 4028 (UNS .25–.3 .2–.35 .7–.9 <.035 .035–.05 – .2–.3 – –
G40280)
G 15Mo3 Wk. 1.5415 (*5) .12–.2 .1–.35 .4–.8 <.04 <.04 <.3 .2–.35 – –
G 22Mo4 Wk. 1.5419 (*5) .18–.25 .2–.4 .4–.7 <.035 <.033 <.3 .3–4 – –
14006 USA AISI/SAE 4032 (UNS .3–.35 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
G40320)
14007 USA AISI/SAE 4037 (UNS .35–.40 .2–.35 .7–.9 <.035 <.04 – .2–3 – –
G40370)
UK BS970 605M30 (*5) .26–.34 1–.35 1.3–1.7 <.04 <.05 – .22–.32 – –
UK BS970 605M36 (*5) .32–.4 .1–.35 1.3–1.7 <.04 <.05 – .22–.32 – –
G GS-35Mn Mo5 Wk. 1.5411 .32–.38 .3–.5 1.0–1.4 <.035 <.035 – .15–.25 – –
14008 USA AISI/SAE 4042 (UNS .4–.45 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
G40420)
14009 USA AISI/SAE 4047 (UNS .45–.5 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
G40470)
UK BS970 608M38 (*5) .32–.4 .1–.35 1.3–1.7 <.04 <.05 – .4–.55 – –
G GS-40Mn Mo43 (*5) .36–.43 .3–.5 .9–1.2 <.035 <.05 – .25–.35 – –
578 Appendix 6: Metal Alloy Comparison Tables

Low alloy steels: Chromium–Molybdenum


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14010 USA AISI/SAE 4118 .18–.23 .2–.35 .7–.9 <.035 <.04 .4–.6 .08–.15 – –
(UNS G41180)
14011 USA AISI/SAE 4130 .28–.33 .2–.35 .4–.6 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41300)
14012 USA AISI/SAE 4135 .33–.38 .2–.35 .7–.9 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41350)
F AFNOR 15CD3.5 .14–.18 <.35 .3–.6 <.04 <.035 .85–1.15 .15–.3 – –
F AFNOR12CD 4 .08–.14 .14–.4 .5–.8 <.04 <.035 .85–1.15 .15–.3 – –
F AFNOR 15CD4.05 <.2 .1–.4 .4–.85 <.035 <.035 .75–1.23 .4–.6 – V < .04
F AFNOR 18CD4(S) *6 .16–.22 .1–.4 .6–.9 <.035 <.035 .85–1.15 .15–.3 – –
F AFNOR 30CD 4 *6 .28–.34 .1–.4 .6–.8 <.035 <.035 .85–1.15 .15–.3 – –
F AFNOR 35CD 4 *6 .33–.39 .1–.4 .6–.9 <.035 <.035 .85–1.13 .15–.3 – –
G DIN 17155; 17175: .1–.18 .1–.35 .4–.7 <.04 <.04 .8–1.15 .4–.65 – –
0017243. 13Cr Mo4.4
Wk. 1.7335
G 15Cr Mo5 .13–.17 .15–.35 .8–1.0 <.035 <.035 1.0–1.3 .2–.3 – –
G 20Cr Mo5 .18–.23 .15–.35 .9–1.2 <.035 <.035 1.1–1.4 .2–.3 – –
G DIN 17200: 001654. .22–.29 .15–.4 .5–.8 <.035 <.035 .9–1.2 .15–.3 – –
(GS)25Cr Mo4 Wk.
1.7218
G DIN 17200: 001654. .3–.37 .15–.4 .5–.8 <.035 <.033 .9–1.2 .15–.3 – –
(GS)34Cr Mo4 Wk.
1.7220
14013 USA AISI/SAE 4137 .35–.4 .2–.35 .7–.9 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41370)
14014 USA AISI/SAE 4140 .38–.43 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41400)
UK BS970 708A37 .35–.4 .1–.35 .7–1.0 <.04 <.05 .9–1.2 .15–.25 – –
UK BS970 708M40 .36–.44 .1–.35 .7–1.0 <.04 <.05 .9–1.2 .15–.25 – –
F AFNOR 40CD 4 .39–.46 .2–.50 .5–.8 <.03 <.025 .95–1.3 .15–.3 – –
F AFNOR 42CD4 .39–.46 .1–.4 .6–.9 <.035 <.035 .85–1.15 .15–.3 – –
G DIN 17200; 001654. .38–.5 .3–.5 .5–.8 <.035 <.035 .8–1.2 .2–.3 – –
GS42CrMo4Wk.
1.7225
G DIN 17200. .3–.37 .15–.4 .5–.8 <.035 .02–.035 .9–1.2 .15–.3 – –
34CrMoS4
CEN EN 10083-1 42CrMo4 1.17225
Near equivalent to BS970 708M40
14015 USA AISI/SAE 4142 .4–.45 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41420)
14016 USA AISI/SAE 4145 .43–.48 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41450)
14017 USA AISI/SAE 4147 .45–.50 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41470)
UK BS970 708 H42 .39–.46 .1–.35 .65–1.05 <.04 <.05 .8–1.25 .15–.25 – –
F AFNOR 42CD 4 .39–.46 .1–.4 .6–.9 <.035 .035 .85–1.15 .15–.3 – –
G DIN 17200, 42Cr Mo .38–.45 .15–.4 .5–.8 <.035 .02–.035 .9–1.2 15–.3 – –
S4 Wk. 1.7227
14018 USA AISI/SAE 4150 .48–.53 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
(UNS G41500)
14019 USA AISI/SAE 4161 .56–.64 .2–.35 .75–1.0 <.035 <.04 .7–.9 .25–.35 – –
(UNS G41610)
G DIN 17200. 50Cr .46–.54 .15–.4 .5–.8 <.035 <.035 .9–1.2 .15–.25 – –
Mo4 Wk. 1.7228
G GS-58 Cr Mn Mo443 .54–.62 .3–.5 .6–1.2 <.035 <.033 .8–1.2 .2–.3 – –
Wk. 1.7266
Appendix 6: Metal Alloy Comparison Tables 579

Low alloy steels: Nickel–Chromium–Molybdenum


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14020 USA AISI/SAE 4320 .17–.22 .2–.35 .45–.65 <.035 <.04 .4–.6 .2–.3 1.65–2.0 –
(UNS G43200)
F AFNOR 20 NCD 7 .16–.22 .2–.33 .45–.65 <.03 <.023 .2–.6 .2–.3 1.65–2.0 Cu < 35
14021 USA AISI/SAE 4340 .38–.43 .2–.35 .6–.8 <.035 <.04 .7–.9 .2–.3 1.65–2.0 –
(UNS G43400)
G DIN 0017242. 40 Ni Cr Mo .37–.44 <.4 .7–.9 <.02 <.015 .7–.95 .3–.4 1.65–2.0 –
73 Wk. 1.6562
14022 USA AISI/SAE 4718 .16–.21 – .7–.9 – – .35–.55 .3–.4 .9–1.2 –
(UNS G47180)
F AFNOR 18NCD4 .16–.22 .2–.35 .5–.8 <.03 <.025 .35–.55 .15–.3 .9–1.2 Cu < .35
14023 USA AISI/SAE 4720 .17–.22 .2–.35 .5–.7 <.035 <.04 .35–.55 .15–.25 .9–1.2 –
(UNS G47200)
See AISI 4718 (UNS G47180)
Table No. 14022
14024 USA AISI/SAE 8115 .13–.18 .2–.35 .7–.9 <.035 <.04 .3–.5 .08–.15 .2–.4 –
(UNS G81150)
UK BS970 805A15 .13–.18 1–.35 .7–.9 <.04 <.05 .4–.6 .15–.25 .4–.7 –
14025 USA AISI/SAE 8615 .13–.18 .2–.35 .7–.9 <.035 <.04 .4–.6 .15–.25 .4–.7 –
(UNS G86150)
14026 USA AISI/SAE 8617 .15–.2
(UNS G86170)
14027 USA AISI/SAE 8620 .18–.23
(UNS G86200)
14028 USA AISI/SAE 8622 .2–.25 Other elements as AISI/SAE 8615
(UNS G86220)
14029 USA AISI/SAE 8625 .23–.28
(UNS G86250)
14030 USA AISI/SAE 8627 .25–. 3
(UNS G86270)
14031 USA AISI/SAE 8630 .28–. 33
(UNS G86300)
UK BS970 805A17 .15–.2 .1–.35 .7–.9 <.04 <.05 .4–.6 .15–.25 .4–.7 –
UK BS970 805A20 .18–.23
UK BS970 805A22 .2–.25 Other elements as BS970 805A17
UK BS970 805A24 .22–.21
F AFNOR15NCD2 .13–.18 .1–.4 .7–.9 <.04 <.035 .4–.6 .15–.25 .4–.7 –
F AFNOR 20NCD2 .18–.23 .1–.4 .7–.9 <.03 <.025 .4–.6 .15–.25 .4–.7 Cu < .35
F AFNOR 30NCD2 .3–.35 .1–.4 .7–.9 <.04 <.035 .4–.6 .15–.3 .5–.8 –
G DIN001654. 21 Ni Cr Mo2 .17 .23 .15–.4 .6–.9 <.035 <.035 .35–.65 .15–.25 .4–.7 –
Wk. 1.6523
G 21 Ni Cr Mo22 Wk. 1.6543 .18–.23 .2–.35 .7–.90 <.035 <.035 .4–.6 .2–3 .4–.7 –
G 30 Ni Cr Mo22 Wk. 1.6545 .27–. .34 15–.34 .7–1.0 <.035 <.035 .4–.6 .15–.3 .4–.7 –
14032 USA AISI/SAE 8637 .35–.4 .2–.35 75–1.0 <.035 <.04 4–.6 .15–.25 4–.7 –
(UNS G86370)
14033 USA AISI/SAE 8640 (UNS .38–.43
G86400)
14034 USA AISI/SAE 8642 (UNS .4–.45
G86420)
14035 USA AISI/SAE 8645 (UNS .43–.48
G86450) *7
14036 USA AISI/SAE 8650 (UNS .48–.53 Other elements as AISI 8637
G86500)
14037 USA AISI/SAE 8655 (UNS .51–.59
G86550)
14038 USA AISI/SAE 8660 (UNS .56–. 64
G86600)
UK BS970 805A60 .55–. 65 .1–.35 .7–1.0 <.04 <.05 .4–.6 .15–.25 .4–.7 –
F AFNOR 35 NCD2 .32–.40 .1–.4 .7–1.0 <.04 <.035 .4–.6 .15–.3 .4–.7 –
F AFNOR 40 NCD2 .37–.40 .1–.4 .6–.9 <.04 <.035 .4–.6 .15–.3 .4–.7 –
F AFNOR 40 NCD2TS .38–.44 .1–.4 .7–1.0 <.035 <.03 .4–.6 .15–.3 .4–.7 –
G 40Ni Cr Mo22 Wk. 1.6546 .37–.44 .15–.34 .7–1.0 <.035 <.035 .4–.6 .15–.3 .4–.7 –
580 Appendix 6: Metal Alloy Comparison Tables

Low alloy steels: Nickel–Molybdenum


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14039 USA AISI/SAE 4615 (UNS G46150) .13–.18 .2–.35 .45–.65 <.035 <.04 – .2–.3 1.65.–2.0 –
14040 USA AISI/SAE 4617 (UNS G46170) .15–.2
14041 USA AISI/SAE 4620 (UNS G46200) .17–.22 Other elements as AISI 4615
UK BS970 665A17 .15–.2 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –
UK BS970 665A19 .17–.22 Other elements as BS970 665A17
14042 USA AISI 4621 (UNS G46210) .18–.23 .2–.35 .7–.9 <.035 <.04 – .2–.3 1.65–2.0 –
UK BS970 665M20 .17–.23 .1–.35 .35–.75 <.04 <.05 – .2–3 1.5–2.0 –
14043 USA AISI/SAE 4626 (UNS G46260) .24–.29 .2–.35 .45–.65 <.035 <.04 – .15–.25 .7–1.0 –
UK BS970 665A22 *5 .2–.25 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –
UK BS970 665A24 *5 .22–.27 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –

Low alloy steels: Chromium


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14044 USA AISI/SAE 5115 (UNS G51150) .13–.18 .2–.35 .7–.9 <.035 <.04 .7–9 – – –
14045 USA AISI/SAE 5120 (UNS G51200) .17–.22 Other elements as AISI 5115
UK BS970 523A14 *5 .12–.17 .1–.35 .3–.5 <.04 <.05 .3–5 – – –
UK BS970 527A19 .17–.22 .1–.35 .7–.9 <.04 <.05 .7–9 – – –
F AFNOR 18C4 .16–.21 .1–.4 .6–.8 <.04 <.035 .85–1.15 – – –
G DIN 17210:001654. 15Cr3 Wk. 1.7015 .12–.18 .15–.4 .4–.6 <035 <035 .4–7 – – –
G 20Cr MnS33 Wk. 1.7121 .17–.23 .2–.35 .6–1.0 <.04 <.02 .6–1.0 – – –
14046 USA AISI/SAE 5130 (UNS G51300) .28–.33 .2–.35 .7–.9 <.035 <.04 .8–1.1 – – –
14047 USA AISI/SAE 5132 (UNS G51320) .30–.35 .2–.35 .6–.8 <.035 <.04 .75–1.0 – – –
UK BS970 530A30 .28–.33 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
UK BS970 530A32 .30–.35 .1–35 .6–.8 <.04 <.05 .9–1.2 – – –
F AFNOR 28 C4 .25–3 <.4 .6–.9 <.04 <.035 .85–1.15 – – –
F AFNOR 32 C4 .3–.35 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
G DIN 17200:001654.34Cr4Wk. 1.17033 .3–.37 .15–.4 .6–.9 <.035 <.035 9–1.2 – – –
14048 USA AISI/SAE 5135 (UNS G51350) .33–.38 .2–.35 .6–.8 <.035 <.04 .8–1.05 – – –
14049 USA AISI/SAE 5140 (UNS G51400) .38–.43 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
UK BS970 530A36 .34–.39 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
UK BS970 530A40 .38–.43 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
F AFNOR 38 C4 .35–.4 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
F AFNOR 42 C4 .39–.45 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
G DIN 17200:001654. 34Cr4 Wk. 1.7034 .30–37 15–.4 .6–.9 <.035 <.035 .9–1.2 – – –
G DIN 17200:001654. 37Cr4 Wk. 1.7035 .34–.41 .15–.4 .6–.9 <.035 <.035 .9–1.2 – – –
14050 USA AISI/SAE 5145 (UNS G51450) .43–.49 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14051 USA AISI/SAE 5147 (UNS G51470) .46–.51 .2–.35 .7–.95 <.035 <.04 .85–1.15 – – –
F AFNOR 42C4TS .38–.44 .1–.4 .6–.9 <.025 <.03 .85–1.15 – <.3 –
F AFNOR 45 C4 .41–.48 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
14052 USA AISI/SAE 5150 (UNS G51500) .48–.53 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14053 USA AISI/SAE 5155 (UNS G51550) .51–.59 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14054 USA AISI/SAE 5160 (UNS G51600) .56–.64 .2–.35 .75–1.0 <.035 <.04 .7–.9 – – –
UK BS970 526M60 .55–.65 .1–.35 .5–.8 <.04 <.05 .5–.8 – – –
F AFNOR 50 C4 .46–.54 .1–.4 .6–.9 <.04 <.035 .8–1.15 – – –
14055 USA AISI E51100. SAE 51100 (UNS .98–1.1 .2–.35 .25–.45 <.025 <.025 .9–1.15 – – –
G51986)
14056 USA AISI E52100. SAE 52100 (UNS .98–1.1 .2–.35 .25–.45 <.025 <.025 1.3–1.6 – – –
G52986)
UK BS970 534A99 .95–1.1 .1–.35 .25–.4 <.04 <.05 1.2–1.6 – – –
F AFNOR 100 C6 .95–1.1 .15–.35 .2–.4 <.03 <.025 1.35–1.6 – – –
G DIN 0017230:LW. 100Cr6 Wk. 1.3505 95–1.1 .15–.35 .25–.4 <.03 <.025 1.35–1.6 – – –
G 100Cr6 Wk. 1.2067 .95–1.05 .15–.35 .25–.4 <.035 <.033 1.4–1.7 – – –
Appendix 6: Metal Alloy Comparison Tables 581

Low alloy steels: Chromium–Vanadium


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14057 USA AISI 6118 (UNS G61180) .16–.21 .2–.35 .5–.7 <.035 <.04 .5–.7 – – V .1–.15
G 21 CrV4 Wk. 1.7510 .18–.24 1–.2 .8–1.0 <.035 <.035 .9–1.2 – – V .07–. 12
14058 USA AISI/SAE 6150 (UNS G61500) .48–.53 .2–.35 .7–.9 <.035 <.04 .8–1.1 – – V > .15
UK BS970 735A50 .46–.54 1–.35 .6–.9 <.04 <.05 .8–1.1 – – V > .15
F Y50 CV4 .5 .3 .8 – – 1.0 – – V .15
G DIN 17200; 17221; 17225 (GS)50Cr .47–. 55 .15–.4 .7–1.0 <.035 <.035 .9–1.2 – – V. 1–.2
V40 Wk. 1.8159
CEN EN 10083-1 51 CrV4 1.8159 Near
equivalent to BS970 735A50

Austenitic stainless steels


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15001 USA AISI 201 (UNS S20100) <.15 <1.0 5.5–7.5 <.06 <.03 16.0–18.0 – 3.5–5.5 –
15002 USA AISI 202 (UNS S20200) <.15 <1.0 7.5–10.0 <.06 <.03 17.0–19.0 – 4.0–6.0 N < .25
UK BS970 284S16 <.07 <1.0 7.0–10.0 <06 <.03 16.5–18.5 – 4.0–6.5 N .15–.25
G X8 Cr Mn Ni 189Wk. 1.4371 <1 <1.0 7.5–9.5 <.045 <.03 17.0–19.0 – 4.5–6.5 N .1–.2
15003 USA AISI 301 (UNS S30100) <.15 <1.0 <2.0 <.045 <.03 16.0–18.0 – 6.0–8.0 –
UK BS970 301S21 <.15 .2–1.0 .5–2.0 <.045 <.03 16.0–18.0 – 6.0–8.0 –
F AFNOR Z12CN17-08 .08–15 <1.0 <2.0 <.04 <.03 16.0–18.0 – 6.5–8.5 –
G DIN 17440:0017442. <.07 <1.0 <2.0 <.045 <.03 17.0–20.0 – 8.5–10.0 –
X5 Cr Ni 18.9 Wk. 1.4301
15004 USA AISI 302 (UNS S30200) <.15 <1.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–10.0 –
UK BS970 302S25 <12 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 –
UK BS970 302S17 <.08 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 9.0–11.0 –
F AFNOR Z10CN 18-09 <.12 <1.0 <2.0 <.04 <.03 17.0–19.0 – 8.0–10.0 –
F AFNOR Z12CN 18-10 <.15 .2–.4 .2–.4 <.04 <.03 17.0–19.0 – 8.0–10.0 –
G X12Cr Ni 18 8 Wk. 1.4300 <.12 <.1.0 <2.0 <.045 <.03 17.0–19.0 – 8.5–10.0 –
15005 USA AISI 302 B (UNS S30215) <.15 2.0–3.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–10.0 –
15006 USA AISI 303 (UNS S30300) <.15 <1.0 <2.0 <.2 >.15 17.0–19.0 – 8.0–10.0 –
UK BS970 303S21 <.12 .2–1.0 1.0–2.0 <.045 .15–.3 17.0–19.0 – 8.0–11.0 –
F AFNOR Z10 CNF 18-09 <12 <1.0 <2.0 <.06 >.15 17.0–19.0 – 8.0–10.0 –
G DIN 17440:0017442. X12 Cr <.15 <1.0 <2.0 <.045 .15–.35 17.0–19.0 – 8.0–10.0 –
Ni S18 8 Wk. 1.4305
15007 USA AISI 303 SE <.15 <1.0 <2.0 <.2 <.06 17.0–19.0 – 8.0–10.0 Se > .15
(UNS S30323)
UK BS970 303S41 <.12 .2–1.0 1.0–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 Se > .15–.3
15008 USA AISI 304 (UNS S30400) <.08 <1.0 <2.0 <.045 <.03 18.0–20.0 – 8.0–10.5 –
UK BS970 304S15 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 8.0–11.0 –
UK BS970 304S16 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 9.0–11.0 –
F AFNOR Z6CN 18-09 <.07 <1.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 –
G X5 Cr Ni 18 9 Wk. 1.4301 <.07 <1.0 <2.0 <.045 <.03 17.0–20.0 – 8.5–10.0 –
15009 USA AISI 304 L (UNS S30403) <.03 <1.0 <2.0 <.045 <.03 18.0–20.0 – 8.0–12.0 –
UK BS970 304S12 <.03 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 9.0–12.0 –
F AFNOR Z2 CN 18-10 <.03 <1.0 <2.0 <.04 <.03 17.0–19.0 – 9.0–11.0 –
FG X2 Cr Ni 18 9 Wk. 1.4306 <.03 <1.0 <2.0 <.045 <.03 17.0–20.0 – 10.0–12.5 –
15010 USA AISI 305 (UNS S30500) <.12 <1.0 <2.0 <.045 <.03 17.0–19.0 – 10.5–13.0 –
UK BS970 305S19 <.1 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 11.0–13.0 –
F AFNOR Z8 CN 18-12 <.1 <1.0 <2.0 <.04 <.03 17.0–19.0 – 11.0–13.0 –
G DIN 17445 G-X10 Cr Ni 18 8 <.12 <2.0 <1.5 <.045 <03 17.0–19.5 – 18.0–10.0 –
Wk. 1.4312
(continued)
582 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15011 USA AISI 308 (UNS S30800) .08 <1.0 <2.0 <.045 <.03 19.0–21.0 – 10.0–12.0 –
15012 USA AISI 309 (UNS S30900) <.2 <1.0 <2.0 <.0.45 <.03 22.0–24.0 – 12.0–15.0 –
UK BS970 309S24 <.15 .2–1.0 .5–2.0 <.045 <.03 22.0–25.0 – 13.0–16.0 –
F AFNOR Z12 CNS 25-13 <.2 1.0–2.0 <2.0 <.04 <.03 20.0–23.0 – 12.0–14.0 –
G G-XI5 Cr Ni 25-12 Wk. 1.4830 1–2 <1.5 <2.0 <.045 <.03 24.0–26.0 – 12.0–14.0 –
15013 USA AISI 310 (UNS S31000) <.25 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–22.0 –
UK BS970 310S24 <.15 .2–1.0 .5–2.0 <.045 <.03 23.0–26.0 – 19.0–22.0 –
F AFNOR Z12 CN 25-20 <.15 <1.0 2.0 <.04 <.03 23.0–26.0 – 18.0–21.0 –
G G-X15 Cr Ni 25-20 Wk. .1–.2 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–21.0 –
1.4840
15014 USA AISI 310S (UNS S31008) <.08 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–22.0 –
G X5 Cr Ni 25 21 Wk. 1.4335 <.07 <1.0 <2.0 <.045 <.03 19.0–22.0 – 19.0–22.0 –
15C15 USA AISI 314 (UNS S31400) <.25 1.5–3.0 <2.0 <.045 <.03 23.0–26.0 – 19.0–22.0 –
15016 USA AISI 316 (UNS S31600) <.08 <1.0 <2.0 <.045 <.03 16.0–18.0 2.0–3.0 10.0–14.0 –
UK BS970 315S16 <.07 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 1.25–1.75 9.0–11.0 –
UK BS970 316S16 <.07 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 2.25–3.0 10.0 13.0 –
F AFNOR Z6 CND 17-11 <.07 <1.0 <2.0 <.04 <.03 16.0–18.0 2.0–2.5 10.0–12.0 –
G DIN 17440; 17445; 17224. X5 <.07 <1.0 <2.0 <.045 <.03 16.5–18.5 2.0–2.5 10.5–13.5 –
Cr Ni Mo 18–10 Wk. 1.4401
15017 USA AISI 316 L (UNS S31603) <.03 <1.0 <2.0 <.045 <.03 16.0–18.0 2.0–3.0 10.0–14.0 –
UK BS970 316S12 <.03 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 2.25–3.0 11.0–14.0 –
F AFNOR Z2 CND 17-12 <.03 <1.0 <2.0 <.04 <.03 16.0–18.0 2.0–2.5 11.0–13.0 –
G DIN 17440; 17442:001654 X2 <.03 <1.0 <2.0 <.045 <.03 16.5–18.5 2.0–2.5 11.0–14.0 –
Cr Ni Mo 18-10 Wk. 1.44041
15018 USA AISI 317 (UNS S31700) <.08 <1.0 <2.0 <.045 <.03 18.0–20.0 3.0–4.0 11.0–15.0 –
UK BS970 317S16 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.5 3.0–4.0 12.0–15.0 –
F AFNOR Z2 CND 19-15 <.03 <1.0 <2.0 <.04 <.03 18.0–20.0 13.0–4.0 14.0–16.0 –
G DIN 17440 X2 Cr Ni Mo 18-16 <.025 <1.0 <.02 <.025 <.02 17.0–19.0 3.0–4.0 15.0–17.0 –
Wk. 1.4438
15019 USA AISI 321 (UNS S32100) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Ti > 5 × C
UK BS970 321S12 <.08 .2–1.0 .5–2.0 <.045 .03 17.0–19.0 – 9.0–12.0 Ti 5 × C − .7
UK BS970 321S20 <.12 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 Ti 5 × C − .9
F AFNOR Z6 CN 18-10 .05–.1 <1.0 <2.0 <.03 <.03 16.0–20.0 – 8.0–10.0 Ti
F AFNOR Z6 CNT 18-11 <.08 <1.0 <2.0 <.04 <.03 17.0–19.0 – 10.0–12.0 Ti 5 × C − .6
G DIN 17440:43720 X10 Cr Ni <.1 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–11.5 Ti > 5 × C
Ti 18-9 Wk. 1.4541
15020 USA AISI 347 (UNS S34700) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Nb + Ta > 10 × C
UK BS970 347S17 <.08 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Nb 10 × C − 1.0
F AFNOR Z6 CN Nb 18-11 <.08 <1.0 <2.0 <2.0 <.03 17.0–19.0 – 10.0–12.0 Nb + Ta
10 × C − 1.0
G DIN 17440 X10 Cr Ni Nb 18-9 <.1 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–11.5 Nb > 8 × C
Wk. 1.4550
15021 USA AISI 348 (UNS S34800) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0 .13.0
Nb + Ta > 10 × CTa < .1
Co < .2
15022 USA AISI 384 (UNS S38400) <.08 <1.0 <2.0 <.045 <.03 15.0–17.0 – 17.0–19.0 –
Appendix 6: Metal Alloy Comparison Tables 583

Ferritic and martensitic stainless steels


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15023 USA AISI 403 (UNS S40300) <.15 <.5 <1.0 <.04 <.03 11.5–13.0 – – –
UK BS970 403S17 <.08 <.8 <1.0 <.04 <.03 12.0–14.0 – <.5 –
UK BS970 410S21 .09–. <.8 <1.0 <.04 <.03 11.5–13.5 – <1.0 –
15
F AFNOR Z10 C13 <.12 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
G X7 Crl4; G-X7 Cr 13 Wk. <.08 <1.0 <1.0 <.045 <03 13.0–15.0 – – –
1.4001
G DIN 17440; 001654 (G-) .08–. <1.0 <1.0 <.045 <.03 12.0–14.0 – – –
X10 Cr 13 Wk. 1.4006 12
15024 USA AISI 405 (UNS S40500) <.08 <1.0 <1.0 <.04 <.03 11.5–14.5 – – AI .1–.3
UK BS970 405S17 <.08 <.8 <1.0 <.04 <.03 12.0–14.0 – <.5 AI .1–.3
F AFNOR Z6 CA 13 <.08 <1.0 <1.0 <.04 <.03 11.5–13.5 – <.5 AI .1–.3
G DIN 17440 X7 Cr AI 13. Wk. <.08 <1.0 <1.0 <.045 <.03 12.0–14.0 – – AI .1–.3
1.4002
15025 USA AISI 410 (UNS S41000) <.15 <1.0 <1.0 <.04 <.03 11.5–13.5 – – –
UK BS970 410S21 .09–. <.8 <1.0 <.04 <.03 11.5–13.5 – <1.0 –
15
F AFNOR Z10C-13 <.12 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
F AFNOR Z12C-13 .08–.15 <1.0 .04 <.04 <.03 11.5–13.5 – <.5 –
G DIN 17440:0017442 X15 .12–.17 <1.0 <1.0 <.045 <.03 12.0–14.0 – – –
Cr 13 Wk. 1.4024
15026 USA AISI 414 (UNS S41400) <.15 <1.0 <1.0 <.04 <.03 11.5–13.5 – 1.25– –
2.50
15027 USA AISI 416 (UNS S41600) <.15 <1.0 <1.25 <.06 >.15 12.0–14.0 <.6 – –
UK BS970 416S21 .09–.15 <1.0 <1.5 <.06 .15–.3 11.5–13.5 <.6 <1.0 –
F AFNOR Z12 CF 13 <.15 <1.0 <1.5 <.06 >.15 12.0–14.0 <.6 <.5 –
G X 12 Cr S 13 Wk. 1.4005 <.15 <1.0 <1.0 <.045 .15–.25 12.0–13.0 – – –
15028 USA AISI 416 SE (UNS S41623) <.15 <1.0 <1.25 <.06 <.06 12.0–14.0 – – Se > .15
UK BS970 416S41 .09–. <1.0 <1.5 <.06 <.06 11.5–13.5 <.6 <1.0 Se
15 .15–.35
15029 USA AISI 420 (UNS S42000) >.15 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
UK BS970 420S29 .14–.2 <.8 <1.0 <.04 <.03 11.5–13.5 >.6 >1.0 –
UK BS970 420S37 .2–.28 <.8 <1.0 <.04 <.03 12.0–14.0 – <1.0 –
F AFNOR Z20 C13 .15–.24 <1.0 <1.0 <.04 <.03 12.0–14.0 – <1.0 –
G DIN 17440; 17224:0017442 .17–.22 <1.0 <1.0 <.045 <.03 12.0–14.0 – – –
X20 Cr 13 Wk. 1.402
15030 USA AISI 420 F (UNS S42020) >.15 <1.0 <1.25 <.06 >.15 12.0–14.0 <.6 – –
15031 USA AISI 429 (UNS S42900) <.12 <1.0 <1.0 <.04 <.03 14.0–16.0 – – –
15032 USA AISI 430 (UNS S43000) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 – – –
UK BS970 430S15 <1 <.8 <1.0 <.04 <.03 16.0–18.0 – <.5 –
F AFNOR Z15 CN 16-02 <.18 .2–.4 2–.4 <.04 <.03 15.0–17.0 – 1.0–2.0 –
G DIN 17440; 001654 X8 Cr <.1 <1.0 <1.0 <.045 <.03 15.5–17.5 – – –
17 Wk. 1.4016
15033 USA AISI 430 F (UNS S43020) <.12 <1.0 <1.25 <.06 >.15 16.0–18.0 <.6 – –
15034 USA AISI 430 F SE (UNS <.12 <1.0 <1.25 <.06 <.06 16.0–18.0 – – Se > .15
S43023)
15035 USA AISI 431 (UNS S43100) <.2 <1.0 <1.0 <.04 <.03 15.0–17.0 – 1.25– –
2.5
UK BS970 431S29 .12–.2 <.8 <1.0 <.04 <.03 15.0–18.0 – 2.0–3.0 –
F AFNOR Z15 CN17-03 <.18 .2–.4 .2–.4 <.04 <.03 15.0–17.0 – 1.0–2.0 –
G DIN 17440;001654 X22 Cr .15–.23 <1.0 <1.0 <.045 <.03 16.0–18.0 – 1.5–2.5 –
Ni 17 Wk. 1.4057
(continued)
584 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15036 USA AISI 434 (UNS S43400) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 .75– – –
1.25
UK BS970 434S19 <.1 <.8 <1.0 <.04 <.03 16.0–18.0 .9–1.3 <.5 –
F AFNOR Z8CD 17-01 <.1 <1.0 <1.0 <.04 <.03 16.0–18.0 .9–1.3 <.5 –
G DIN 17440 X6 Cr Mo 17 <.07 <1.0 <1.0 <.045 <.03 16.0–18.0 .9–1.2 – –
Wk. 1.4113
15037 USA AISI 436 (UNS S43600) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 .75– – Nb+Ta
1.25 5×C–.7
15038 USA AISI 440 A (UNS S44002) .6–.75 <1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
F AFNOR Z50 CD 14 .5–.6 <1.0 <1.0 <.04 <.03 13.0–15.0 .5–.6 – –
G X65 Cr Mo 14 Wk. 1.4109 .6–.75 <1.0 <1.0 <.045 <.03 13.0–15.0 .5–.6 – –
G X55 Cr Mo 14 Wk. 1.4110 .5–.6 <1.0 <1.0 <.045 <.03 13.0–15.0 .5–.6 – –
15039 USA AISI 440 B (UNS S44003) .75–. <1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
95
15040 USA AISI 440 C (UNS S44004) .95–1.2 <1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
F AFNOR Z100CD17
G DIN 0017230 X105 Cr Mo .95–1.2 <1.0 <1.0 <.045 <.03 16.0–18.0 .4–.8 – –
17
15041 USA AISI 442 (UNS S44200) <.2 <1.0 <1.0 <.04 <.03 18.0–23.0 – – –
UK BS970 442S19 <.1 <.8 <1.0 <.04 <.03 18.0–22.0 – <.5
15042 USA AISI 446 (UNS S44600) <.2 <1.0 <1.5 <.04 <.03 23.0–27.0 – N < .25 –
F AFNOR Z10 C24 <.12 <1.5 <1.0 <.04 <.03 23.0–26.0 – – –
G X20 Cr 25 Wk. 1.3810 <.25 .5–2.0 <.5 – – 24.0–26.0 – – –
G X8 Cr 28 Wk. 1.4083 <.1 <1.0 <1.0 <.045 <.03 27.0–29.0 – – –
15043 USA AISI 501 (UNS S50100) >.1 <1.0 <1.0 <.04 <.03 4.0–6.0 .4–.65 – –
UK BS1504 Grade 1504-625 <.15 <.5 .3–.7 <.045 <.045 4.0–6.0 .45–.65 <.4 Cu < 4
G GS-12 Cr Mo 19 5 Wk. 1. .08–.15 .3–.5 .4–7 <.035 <.035 4.5–5.5 .45–.55 – –
7363
15044 USA AISI 502 (UNS S50200) <.1 <1.0 <1.0 <.04 <.03 4.0–6.0 .4–.65 – –
UK BS1504 Grade 1504–625 <.15 <.5 .3–.7 <.045 <.045 4.0–6.0 .45–.65 <.4 Cu < .4
G GS-12 Cr Mo 19 5 Wk. .08–.15 .3–.5 .4–.7 <.035 <.035 4.5–5.5 .45–.55 – –
1.7363

Specially named steels


Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16001 USA Music Wire ASTM .7–1.0 .1–.3 .2–.6 <.025 <.03 – – – –
A228
(UNS K08500)
See AISI 1078; 1086; 1095—(UNS G10780; UNS G 10860; UNS G 10950 Table Nos: 11040; 11044: 11046)
16002 USA HY80—ASTM A543 <.18 .18–.37 <.4 <.02 <.02 1.0–1.5 .45–.60 2.25–3.25 V < .03
(UNS J42015 (HY80))
*8
USA HY130- <.12 – .6–.9 – – .4–.7 .3–.65 4.75–5.25 V .05–.10
USA HY140—Designation no
longer in use
These steels are made in
Europe to the USA
analyses
(continued)
Appendix 6: Metal Alloy Comparison Tables 585

(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16003 USA Carpenter 20 Cb Stainless (UNS N08020 (20Cb-3)) Now replaced by
20Cb-3 below
USA Carpenter 20 Cb-3 <06 <1.0 <2.0 <.035 <.035 19.0–21.0 2.0–3.0 32.5–35.0 Cu 3.0–4.0 Nb
+ Ta 8×C < 1.0
16004 USA Allegheny Ludlum— .08 .4 1.4 – – 15 1.25 26 Ti 2.15 Al .2
A286 (UNS K66286) .004
USA Bofors—A286 .06 – – – – 15 1.3 25 Ti 2.15 AI.2
.004
F AFNOR Z6NCT25-15
G DIN0017225 X5 Ni Cr Ti <.08 <1.0 1.0– <.03 <.03 13.5–16.0 1.0–1.5 24.0–27.0 Al < .35 Ti 1.9–
26 15 Wk. 1.4980 2.0 2.3 B
.003–.010V.1
–.5
G LN 1.4944.4
EUR AECMA FE PA92HT
16005 USA Allegheny Ludlum .08 .4 1.0 – – 16.5 2.7 4.3 N .1
AM350 (UNS S35000)
16006 USA Allegheny Ludlum .15 .4 1.0 – – 15.5 2.75 4.25 N .1
AM355 (UNS S35500)
16007 USA Carpenter. Custom 455 .03 – .25 – – 11.75 – 9.0 Ti 1.2 Cu 2.2
(UNS S45500) Nb+ Ta 0.3
16008 USA 15-5 PH (UNS S15500) .04 – .8 – – 15.0 – 4.6 Cu 3.3 Nb .27
16009 USA PH 14–8 Mo .04 – .6 – – 15.1 2.2 8.3 AI 1.2 + N
(UNS S14800)
16010 USA PH 15–7 Mo .07 – – – – 15 2.2 7 AI 1.1
(UNS S15700)
16011 USA PH 17–7 (UNS S17700) .07 – – – – 17 – 7 AI 1.1
16012 USA SAE H11 Tool Steel .3–.4 .8–1.2 .2–.4 – – 4.75–5.50 1.25–1.75 – V .3–.5
(UNS T20811)
USA H11 MOD (UNS K74015)—Replaced by UNS T20811
USA Vascojet 1000
UK BS4659 BH11 .32–.42 .85– <.4 – – 4.75–5.25 1.25–1.75 – V .3–.5
1.15
F E-40CDV20
G (G-) X38 Cr Mo V 5 1 .36–.42 .9–1.2 .3–.5 <.03 <.03 4.8–5.8 1.4 – –
Wk. 1.2343
G Wk. 1.7784
EUR AECMA FE-PM13S .37–.43 – .3 – – 4.75–5.25 1.3 – V .5
16013 USA 17/4 PH—ASTM A 579- <.07 <1.0 <1.0 <.025 <.025 15.5–17.5 – 3.0–5.0 Cu 3.0–5.0 Nb
AIS1630 (UNS J92200) .15–45
Grade 61
16014 USA PH 13-8 Mo (UNS S .03 – <.1 – – 12.8 2.2 8.2 AI 1.1
13800)
16015 USA Maraging ASTM 579 <.03 <.1 <.1 <.01 <.01 – 3.0–3.5 17.0–19.0 Ti .15–.25 Co
Grade 71 Yield 200 ksi 8.0–9.0 AI .05–
(UNS K92820) 15
Ca .06 Zr .02 B
.003
16016 USA Maraging ASTM 579 <.03 <.1 <.1 <.01 <.01 – 4.6–5.2 17.0–19.0 Ti .3–.5 Co
Grade 72 Yield 250 ksi 7.5–8.3 AI
(UNS K92940) .05–.15
Ca .06 Zr .02 B
.003
16017 USA Maraging ASTM 579 <.03 <.1 <.1 <.01 <.01 – 4.6–5.2 18.0–19.0 Ti .5–.8 Co
Grade 73 Yield 275 ksi 8.5–9.5 AI
(UNS K93160) .05–.15
Ca .06 Zr .02 B
.003
(continued)
586 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16018 USA ARMCO 21-6-9 <.08 <1.0 8.0– <.06 <.03 19.0–21.5 – 5.5–7.5 N .15–.4
(UNS S21900) 10.0
UK BS970 284S16 <.07 <1.0 7.0– <.06 <.03 16.5–18.5 – 4.0–6.5 N .15–25
10.0
G X8 Cr Mn Ni 18 9Wk. <.1 <1.0 7.5– <.045 <.03 17.0–19.0 – 4.5–6.5 N .1–.2
1.4371 9.5
16019 USA ALMAR 362 (UNS .03 .2 .3 <.015 <.015 14.5 – 6.5 Ti .8 Nominal
S36200) comp.
16020 USA Nitronic 33 <.08 <1.0 11.5– <.06 <.03 17.0–19.0 – 2.25–3.75 N .2–.4
14.5
USA Nitronic 32 <.1 .5 12 <.06 <.03 18 – 1.6 N .34
USA Nitronic 60 (UNS <.1 3.5–4.5 7.0– <.06 <.03 16–18 – 8.0–9.0 N .08–.18
S21800) 9.0
16021 USA Kovar (low expansion <.04 <.2 <.5 <.2 <.2 29 Co 17.0 Fe
alloy) Balance.
Nominal comp.
UK Nilo K 29 Co 17.0 Fe
Balance.
Nominal comp.
F Dilver P0 29 Co 21.8 Fe
Balance.
Nominal comp.
F Dilver P1 29 Co 18.0 Fe
Balance.
Nominal comp.
G Dilaton 29/18 <.05 <.2 <1.0 – – – – 28–30 Co 17.0–19.0
Wk. 1.3981 Fe Bal.
Nominal comp.
16022 USA Invar .1 .2 .5 36 Nominal comp.
USA Invar 36 36 Nominal comp.
UK Nilo 36 36 Nominal comp.
16023 USA Invar 42 42 Nominal comp.
UK Nilo 42 42 Nominal comp.
Notes for steel tables
<: less than, x–y range
>: greater than, x approx
*1: Silicon content depends on whether the steel is rimming, balanced or killed. For killed steel Si < 0.4. For AISI up to but excluding 1015 Si < 0.1. Ranges depend on sheet
making practice
*2: Traces
*3: For electric steel N < 0.012
*4: Spring Steel
*5: Only very approximate equivalent
*6: Can be alloyed with lead
*7: Can have boron content of 0.0005 % minimum. Number then carries a B
*8: Pressure vessel plate steels. Special conditions may be required. Vacuum treatment, special testing, impact testing, nondestructive testing

European CEN Designations for Steels other materials. However, it will be some years before this
process is completed and fully implemented.
European EN specifications for metal alloys are currently The European designation system for steels is set out in
being generated and adopted. These will progressively the specification EN10027 and in the ECISS information
supersede the various national standards for steels, as with circular DD214:1993 ECISS/IC10:1992. The EN designa-
tions for steels will consist of three parts:
Appendix 6: Metal Alloy Comparison Tables 587

• European Standard number, e.g. “EN 10083-1”. In principal, EN steel numbers can be inferred for steels
• ‘Steel Name’ (grade)—Symbolic letters and numbers by using the existing Werkstoff numbers, however there is
expressing the application and principal characteristics, no guarantee that such numbers have currently been either
e.g. “2C50 (C50E)”. agreed or adopted by any particular country. New specifi-
• ‘Steel Number’—a 5 digit designation based on the cations, once adopted, will be issued by each national
existing German Werkstoff (Wk.) number, with a further standards organisation, and any existing, competing speci-
two digits held in reserve, e.g. “1.1206”. fications will be withdrawn.
The implementation of the new standards recognises
The examples given above make up the complete EN three levels of equivalence between EN designations and
designation: EN 10083-1 2C50 (C50E) 1.1206; See existing national grades of steel: ‘Close Equivalent’, ‘Near
table 11029. Within the alloy tables, the ‘Steel Name’ part Equivalent’ and ‘Approximate Equivalent’. The new EN
has been underlined (e.g. EN 10083-1 2C50 (C50E) 1.1206) designations included in the above tables are all near
to indicate the separate the parts of the designation. equivalents of BS970-1 steel grades.
Alloy equivalent—Nickel based alloys
588

Composition (Ni—balance unless otherwise stated)


Country Designation C Co Cr Mo V W Al Cu Nb Ta Ti Fe Other
21001 USA/UK Hastelloy C (UNS N10002 <.08 <2.5 14.5–16.5 15–17 <.35 3.0–4.5 – – – – – 4.0–7.0 Si < 1.0 Mn < 1.0
G Wk 2.4537 <.02 2.5 15.5 16 0.35 3.7 6 Ni balance. Nominal
comp.
G Wk 2.4602 16 17 4 6 Ni balance. Nominal
comp.
21002 USA/UK Hastelloy X (UNS N06002) .05–.15 .5–2.5 20.5–23.0 8.0–10.0 – .2–1.0 – – – – – 17–20 Si < 1.0 Mn < 1.0
G Wk. 2.4613
21003 USA/UK Incoloy 800 (UNS N08800) <.1 – 19.0–23.0 – – – .15–.6 – – – .15–.6 Bal. Ni 30.0–35.0
G X10 NiCrAITi 3220 .07 21 * * Ni 31.0 nominal comp.
UK Wk. 1.4876 BS 3072 NA <.1 – 19.0–23.0 – – – .15–.6 <.75 – – .15–.6 Bal. Ni + Co 30.0–35.0
15
21004 USA/UK Incoloy 901 (UNS N09901) <.1 – 11.0–14.0 5–7 – – <.35 <.5 – – 2.35–3.1 Bal. Ni 40.0–40.5 Mn < 1.0
Si < .6 B .01–.02
21005 USA/UK Incoloy 903 (UNS N19903) – 13.0–17.0 – – – – .3–1.5 – 2.4–3.5 – 1.0–1.25 Bal. Ni 36.0–40.0
21006 USA/UK Incoloy 907 (UNS N19907) 13.0 4.7 1.5 Bal. Ni 38.0 nominal comp.
21007 USA/UK Incoloy 909 (UNS N19909) .1 13.0 4.7 1.5 Bal. Ni 38.0 nominal comp.
21008 USA/UK Inconel 600 (UNS N06600) <.15 – 14.0–17.0 – – – – <.5 – – – 6.0–10.0 Ni > 72.0
UK BS3072 NA14 <.15 – 14.0–17.0 – – – – <.5 – – – 6.0–10.0 Ni + Co > 72.0
Mn < 1.0 Si < .5
G Wk. 2.4816 .05 16 10 Nominal comp.
21009 USA/UK Inconel 625 (UNS N06625) <.1 – 20.0–23.0 8.0–10.0 – – <.4 – 3.15–4.15 <.4 <5.0 Ni balance
21010 USA/UK Inconel 718 (UNS N07718) <.08 <1.0 17.0–21.0 2.8–3.0 – – .2–.8 – 4.75–5.5 .65–1.15 Bal. Si < .35 Mn < .35 Ni
50.0–55.0
F/AECMA NI-P100HT
G Wk. 2.4666
CEN EN 2403PR (NI-P100HT Solution treated and precipitation treated precision castings—provisional spec.)
EN 2404PR (NI-P100HT Solution treated and precipitation treated bars—provisional spec.)
EN 2405PR (NI-P100HT Solution treated and precipitation treated forgings—provisional spec.)
EN 2407PR (NI-P100HT Solution treated and precipitation treated sheet and strip, a ≤ 3 mm—provisional spec.)
EN 2408PR (NI-P100HT Solution treated and precipitation treated plates, a ≤ 3 mm—provisional spec.)
EN 2952PR (NI-P100HT Solution treated and cold worked bar for hot upset forging for fasteners, 3 mm ≤ d ≤ 30 mm—provisional spec.)
EN 2961 PR (NI-P100HT Cold worked and solution treated bar for machining for fasteners, 3 mm ≤ d ≤ 50 mm—provisional spec.)
EN 3666PR (NI-P100 Cold worked—RM ≥ 1500 MPa—bar for machining, 3 mm ≤ d ≤ 50 mm—provisional spec.)
(continued)
Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition (Ni—balance unless otherwise stated)
Country Designation C Co Cr Mo V W Al Cu Nb Ta Ti Fe Other
21011 USA/UK Inconel X750 (UNS <.08 – 14.0–17.0 – – – .4–1.0 – .7–1.2 2.25–2.75 5.0–9.0 Si < .5 Mn < 1.0 Ni
N07750) Balance
21012 USA/UK Monel K500 (UNS <.25 – – – – – 2.9 Bal. – – .35–.85 <2.0 Si < .5 Mn < 1.5 Ni
N05500) 63.0–70.0
G Wk. 2.4360 31.0 2.0 Ni balance. Nominal
comp.
G Wk. 2.4374 3.0 30.0 .8 1.5 Ni balance. Nominal
comp.
G Wk. 2.4375 .25 3.0 30.0 1.0 2.0 Ni balance. Nominal
comp.
Appendix 6: Metal Alloy Comparison Tables

21013 USA/UK NI-SPAN C902 (UNS <.06 – 4.9–5.75 – – – .3–.8 – – – 2.2–2.75 Bal. Ni 41.0–43.5 Mn < .8
N09902) Si < 1.0
21014 USA/UK RENE 41 (UNS N07041) <.12 10.0–12.0 18.0–20.0 9.0–10.5 – – 1.4–1.8 – – – 3.0–3.3 <5.0 Si < .5 Mn < .1 B
.003–.010
21015 USA/UK UNITEMP 212 .08 – 16.0 – – – .15 – .5 – 4.0 Bal. Si .15 Mn .05 B .06 Zr
.05 Ni 25.0
21016 USA/UK WASPALLOY (UNS .03–.1 12.0–15.0 18.0–20.0 3.5–5.0 – – 1.2–1.6 – – – 2.75–3.25 <2.0 B .003–.010 Zr .02–.12
N07001)
F/AECMA NI-P101HT
CEN EN 2193PR (NI-P101 HT Solution treated and precipitation treated bars—provisional spec.)
EN 2194PR (NI-P101 HT Solution treated and precipitation treated forgings—provisional spec.)
EN 2195PR (NI-P101HT Solution treated and precipitation treated sheet and strip, a ≤ 3 mm—provisional spec.)
EN 2406PR (NI-P101 HT Solution treated and precipitation treated bars for forged bolts, d ≤ 25 mm—provisional spec.)
EN 2959PR (NI-P101 HT Solution treated and cold worked bar for hot upset forging for fasteners, 3 mm ≤ d ≤ 30 mm—provisional spec.)
EN 2960PR (NI-P101 HT Cold worked and solution treated bar for machining for fasteners, 3 mm ≤ d ≤ 50 mm—provisional spec.)
Notes for Nickel alloys
Trade Names—Usually nominal compositions only available. Some alloys are balance iron, some balance nickel
589
Alloy equivalents—Aluminium alloys (wrought)
590

Composition (max. unless otherwise stated) Others


Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31001 USA AA 1050 (UNS A91050) .25 .4 .05 .05 .05 – .05 .03 .03 – 99.5 (1050A: Zn < .07)
UK AA 1050A (was BS 1B) .3 .4 .05 .03 – – .1 – – – 99.5 *35
UK BS 5L36 (AA 1050A) .3 .4 .05 .05 – – .10 – 0.03 – 99.5
F NF A-5 (AA 1050A) .3 .4 .05 .05 .03 .03 .1 .05 – – Rem.
G DIN 1712 AI99.5 (AA 1050A) Wk. 99.5
3.0255
CEN EN 2072 (1050A-H14 sheet and
strip);
EN 2073PR (1050A-H14 tube for structures, 5 mm < d < 100 mm—provisional spec.)
EN 2114PR (1050A-H14 wire for solid rivets, d ≤ 10 mm—provisional spec.)
31002 USA AA 1060 (UNS A91060) .25 .35 .05 .03 .03 – .05 .03 .03 – 99.6
31003 USA AA 1100 (UNS A91100) 1.0 (Si+Fe) .05–.2 .05 – – .1 – .05 .15 99.0 *31
UK AA 1100 1.0 (Si+Fe) .05–.2 .05 – – .1 – .05 .15 99.0 *31
CEN EN 3996PR (1100-H14 sheet and strip, 0.3 mm ≤ a ≤ 6 mm—provisional spec.)
31004 USA AA 1145 (UNS A91145) .55 (Si+Fe) .05 .05 – – – – .03 – 99.45
UK AA 1145 .55 (Si+Fe) .05 .05 – – – – .03 – 99.45
31005 USA AA 1175 (UNS A91175) .15 (Si+Fe) .1 – – – .03 – .02 – 99.75 *32
UK AA 1080A (was BS 1A) .15 .15 .02 .03 – – .06 – – – 99.8 *33
F NF A8 (AA 1080A) .15 .15 .03 .03 .01 .02 .06 .05 – .2 Rem.
G DIN 1712 AI99.7 Wk. 3.0275 .20 .25 .03 – – – .07 .05 .02 .3 Rem.
G DIN 1712 AI99.8 (AA 1080A) Wk. .15 .15 .02 – – – .06 .03 .01 .2 Rem.
3.0285
31006 USA AA 1200 (UNS A91200) 1.0 (Si+Fe) .05 .05 – – .1 .05 .05 .15 99.0
UK AA 1200 (was BS 1C) 1.0 (Si+Fe) .05 .05 – – .1 .05 .05 .15 99.0
UK BS 6L16; BS 6L17; BS 4L34 .5 .7 .1 .1 – – .1 – .05 – 99.0
F NF A-4 .5 .8 .1 .1 .05 .05 .1 .05 – – Rem.
G DIN 1712 AI99 Wk. 3.0205 .5 .6 .07 – – – .08 .05 .04 1.0 Rem.
31007 USA AA 1230 (UNS A91230) .7 (Si+Fe) .1 .03 – – .1 – .05 – 99.3
UK AA 1230 .7 (Si+Fe) .1 .03 – – .1 – .05 – 99.3
31008 USA AA 1235 (UNS A91235) .65 (Si+Fe) .05 – – – – – .05 – 99.35
UK AA 1235 .65 (Si+Fe) .05 – – – – – .05 – 99.35
31009 USA AA 1345 (UNS A91345) .3 .4 .1 – – – – – .03 – 99.45
UK, F, G: See Table 31001 (AA 1050)
31010 USA AA 1350 (UNS A91350) .1 .4 .05 .01 – .01 .05 +V .02 .03 .1 99.5 Ga < .03 B < .05
UK AA 1350 (was BS 1 E); BS2897 .1 .4 .05 .01 – .01 .05 +V .02 .03 .1 99.5 Ga < .03 B < .05
F A 5L, A 5B 99.5
G DIN 1712 AI99.5 Wk. 3.0255 .3 .4 .05 – – – .07 .05 .03 .5 Rem.
G DIN 1712 AI99.5 Wk. 3.0257
31011 USA 1420 .05 4.5–6.0 Li 1.9–2.3 Zr .08–.15 Nominal comp.
31012 USA 1430 1.4–1.8 2.3–3.0 Li 1.5–1.9 Zr .08–.14 Nominal comp.
31013 USA 1440 1.2–1.9 .6–1.1 Li 2.1–2.6 Zr .1–.2 Nominal comp.
31014 USA 1460 2.6–3.3 .05 Li 2.0–2.5 Zr < .15 Sc < .14 Nominal comp.
31015 USA AA 2011 (UNS A92011) .4 .7 5.0–6.0 – – – .3 – .05 .15 Rem. *37
UK AA2011 (was BS FC1); BS4300/5; .4 .7 5.0–6.0 – – – .3 – .05 .15 Rem. *37
EN 515; EN 573-3; EN 573-4
F A-U5PbBi 5.5 Rem. Nominal comp.
G DIN 1725 Al Cu Bi Pb. Wk. 3.1655 .4 .7 5.0–6.0 – – – .3 – .05 .15 Rem. *37
31016 USA AA 2014 (UNS A92014) .5–1.2 .7 3.9–5.0 .4–1.2 .2–.8 .1 .25 .15 .05 .15 Rem. *310*31
Appendix 6: Metal Alloy Comparison Tables

(continued)
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
UK AA 2104A (was BS H15); BS .5–.9 .5 3.9–5.0 .4–1.2 .2–.8 .1 .2 +Zr .2 – – Rem. Ni .2, Pb .05, Sn .05
L102; BS L103;
BS L105; BS L156-L159; BS L163-L168;
BS 2L77;
BS 2L87; BS 2L93; BS 3L63; BS
7L37; DTD 5010A;
DTD 5030A; DTD5040A
F NFA-U4SG .5–1.2 .7 3.9–4.9 .4–1.2 .2–.8 .1 .25 .2 – – Rem.
G DIN 1725 Al Cu Si Mn. Wk. 3.1255 .5–1.2 .7 3.9–5.0 .4–1.2 .2–.8 .1 .25 .15 .05 .15 Rem.
CEN EN 2087PR (2014A-T6/T62 clad sheet and strip—provisional spec.)
EN 2088PR (2014A-T4/T42 clad sheet and strip—provisional spec.)
EN 2089 (2014A-T6 sheet and strip)
EN 2100 (2014A-T4511 bar and drawn profiles)
Appendix 6: Metal Alloy Comparison Tables

EN 2323PR (2014A-T651 bar ≤ 200 mm—provisional spec)


EN 2324PR (2014A-T6 bar and section ≤ 150 mm—provisional spec.)
EN 2325PR (2014A-T6 bar ≤ 100 mm—provisional spec.)
EN 2384 (2014A-T6511 bar and drawn profiles)
EN 2387PR (2014A-T6 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2395 (2014A-T4/T42 sheet and strip)
EN 2634PR (2014A-T4511 bars and sections 1.2 mm ≤ a/d ≤ 200 mm, peripheral coarse grain control—provisional spec.)
EN 2635PR (2014A-T6511 bars and sections 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2639PR (2014A-T6 extruded bars and sections 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2710PR (2014A-T4510 bar and section, 1.2 mm ≤ a/d ≤ 200 mm, peripheral coarse grain control—provisional spec.)
EN 2711 PR (2014A-T6510 bar and section, 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 3346PR (2014A-T3 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
31017 USA AA 2017 (UNS A92017) .2–.8 .7 3.5–4.3 .4–1.0 .4–.8 .1 .25 .15 .05 .15 Rem. *310
UK AA 2017 .2–.8 .7 3.5–4.3 .4–1.0 .4–.8 .1 .25 .15 .05 .15 Rem. *310
F NF A-U49 .3–.8 .7 3.5–4.7 .3–.8 .4–1.0 .1 .25 .2 – – Rem.
G DIN 1725 Al Cu Mg 1. Wk. 3.1325 .6 .5 3.5–4.3 .3–1.0 .4–1.0 .1 .5 .2 .05 .2 Rem.
CEN EN 2116PR (2017A-H13 wire for solid rivets, d ≤ 10 mm—provisional spec.)
EN 2393PR (2017A-T4 drawn tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2509PR (2017A-T42 drawn tube for structures—provisional spec.)
EN 2640PR (2017A-T4 extruded bars and sections 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2655PR (2017A-T42 extruded bars and sections 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2691 PR (2017A-T3 sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
EN 2692PR (2017A-T3 clad sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
EN 2705PR (2017A-T44 drawn tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
(continued)
591
(continued)
592

Composition (max. unless otherwise stated) Others


Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31018 USA AA 2024 (UNS A92024) .5 .5 3.8–4.9 .3–.9 1.2–1.8 .1 .25 .15 .05 .15 Rem. *310
UK AA 2024 .5 .5 3.8–4.9 .3–.9 1.2–1.8 .1 .25 .15 .05 .15 Rem. *310
UK BS 2L97; DTD 5100A; BS .5 .5 3.8–4.9 .3–.9 1.2–1.8 .1 .2 +Zr .2 – – Rem. Ni .05, Pb .05, Sn .05
AMD2433 (was 2L98)
F NF A-U4G1 .5 .5 3.8–4.5 .3–.9 1.2–1.8 .1 .25 .2 – – Rem.
G DIN 1725 Al Cu Mg 2. Wk. 3.1355 .4 .4 4.0–4.8 .3–.9 1.2–1.8 .1 .25 .2 .05 .2 Rem.
ISO ISO Al Cu 4 Mg 1
CEN EN 2090PR (2024-T3 clad sheet and strip, 0.4 mm < a < 6 mm—provisional spec.)
EN 2091 PR (2024-T4 clad sheet and strip, 0.4 mm < a < 6 mm—provisional spec.)
EN 2318 (2024-T3511 bar and drawn profiles, a > 1.2 mm / d < 150 mm)
EN 2320PR (2024-T3 drawn bar, a ≤ 75 mm—provisional spec.)
EN 2321 PR (2024-T4 bar and section, a ≤ 150 mm—provisional spec.)
EN 2319PR (2024-T3510 drawn bar, a ≤ 75 mm—provisional spec.)
EN 2388PR (2024-T351 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2419PR (2024-T351 plate, 6 mm ≤ a ≤ 80 mm—provisional spec.)
EN 251OPR (2024-T42 drawn tube for structures—provisional spec.)
EN 2633 (2024-T3511 bar and drawn profiles, a > 1.2 mm / d < 150 mm, peripheral coarse grain control)
EN 2638PR (2024-T3 extruded bars and sections, 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2701 PR (2024-T3 drawn tube, 6 mm ≤ d/a ≤ 12.5—provisional spec.)
EN 2703PR (2024-T42 clad sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
EN 2704PR (2024-T3511 drawn bar, a ≤ 75 mm—provisional spec.)
EN 2709PR (2024-T3510 bar and section, 1.2 mm ≤ a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 2806PR (2024-T42 extruded sections, 1.2 mm ≤ a ≤ 100 mm, peripheral coarse grain control—provisional spec.)
EN 2814PR (2024-T3511 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 3347PR (2024-T8511 extruded bars and sections, a/d ≤ 150 mm, peripheral coarse grain control—provisional spec.)
EN 3348PR (2024-T62 plate, 6 mm ≤ a/d ≤ 50 mm—provisional spec.)
EN 3474PR (2024-T81 sheet and strip, 0.25 mm ≤ a/d ≤ 6 mm—provisional spec.)
EN 3550PR (2024-T8511 extruded barsand sections, a/d ≤ 150 mm—provisional spec.)
EN 3657PR (2024-T3510 drawn bar for machining, d ≤ 75 mm—provisional spec.)
EN 3997PR (2024-T3 sheet and strip, 0.4 mm ≤ a/d ≤ 6 mm—provisional spec.)
EN 3998PR (2024-T42 sheet and strip, 0.4 mm ≤ a/d ≤ 6 mm—provisional spec.)
EN 4101 PR (2024-T4 sheet and strip, 0.4 mm ≤ a/d ≤ 6 mm—provisional spec.)
31019 USA AA 2048 (UNS A92048) .15 .2 2.8–3.8 .2–.6 1.2–1.8 – .25 – – –
UK AA 2048 .15 .2 2.8–3.8 .2–6 1.2–1.8 – .25 – – –
31020 USA AA 2090 2.5–2.75 017–.02 Li 2.1–2.2 Zr .11–.12 Nominal comp.
USA 2090 (proprietory) 2.4–3.0 .25 Li 1.9–2.6 Zr .08–.15 Nominal comp.
UK AA 2090 2.5–2.75 .017–.02 Li 2.1–2.2 Zr .11–.12 Nominal comp.
31021 USA AA 2091 .2 .3 1.8–2.5 1.1–1.9 Li 1.7–2.3 Zr < .1 Nominal comp.
UK AA 2091 .2 .3 1.8–2.5 1.1–1.9 Li 1.7–2.3 Zr < .1 Nominal comp.
31022 USA Weldalite 049 (AA 2095) 4.0–6.3 .4 Li 1.3 Zr .14 Ag .4 Nominal comp.
31023 USA AA 2124 (UNS A92124) .2 .3 3.8–4.9 .3–.9 1.2–1.8 .1 .25 .15 .05 .15 Rem. *310
UK AA 2124 .2 .3 3.8–4.9 .3–.9 1.2–1.8 .1 .25 .15 .05 .15 Rem. *310
CEN EN 2422PR (2124–T351 plate, 25 mm ≤ a < 120 mm—provisional spec.);
(continued)
Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31024 USA AA 2195 3.7–4.3 .25–8 Li .8–1.2 Zr .08–.16 Nominal comp.
31025 USA AA 2214 .8 4.5 .6 Nominal comp.
UK AA 2214 .8 4.5 .6 Nominal comp.
CEN EN 2124PR (2214-T651 plate, 6 mm ≤ a ≤ 140 mm)
EN 2382PR (2214-T6 forgings, ≤ 100 mm)
EN 2383PR (2214-T4 forgings, ≤ 100 mm)
EN 2485PR (2214-F Extruded or cast forging stock)
EN 2697PR (2214-T6 extruded bar and section, 1.2 ≤ a/d ≤ 100 mm, peripheral coarse grain control—provisional spec)
31026 USA AA 2219 (UNS A92219) .2 .3 5.8–6.8 .2–.4 .02 – .1 .02–.1 .05 .15 Rem. *311
UK AA 2219 .2 .3 5.8–6.8 .2–.4 .02 – .1 .02–.1 .05 .15 Rem. *311
UK DTD 5004A .25 .35 5.7–6.5 .2–.35 .15 – .1 +Zr .2 – – Rem. *312
F NF A-U6MT .2 .3 5.5–6.5 .2–.3 – – – .05–.15 – – Rem.
Appendix 6: Metal Alloy Comparison Tables

CEN EN 4099PR (2219-T62 clad sheet. and strip, 0.5 mm ≤ a ≤ 6 mm—provisional spec.)
EN 4100PR (2219-T62 sheet and strip, 0.5 mm ≤ a ≤ 6 mm—provisional spec)
EN 4102PR (2219-T81 clad sheet. and strip, 0.5 mm ≤ a ≤ 6 mm—provisional spec.)
31027 USA AA 2419 .015 .18 5.8–6.8 .2–.4 .02 – .10 .02–.1 .05 .15 Rem. *321
UK AA 2419 .015 .18 5.8–6.8 .2–4 .02 – .10 .02–.1 .05 .15 Rem. *321
31028 USA AA 2618 .1–.25 .9–1.3 1.9–2.7 – 1.3–1.8 – .1 .04–.1 .05 .15 Rem. *322
UK AA 2618A (was H16) .1–.25 .9–1.4 1.8–2.7 .25 1.2–1.8 – .15 .04–.2 .05 .15 Rem. Ni .8–1.4
UK BS 1472; Hid RR58 .25 .9–1.4 1.8–2.7 .2 1.2–1.8 – .2 .2 – – Rem. *322
UK DTD717A; 731B; 745A; 5084A; 5014A .25 .9–1.4 1.8–2.7 .2 1.2–1.8 – .1 +Zr .2 – – Rem. Pb, Sn .05, Ni .8–1.4
F A-U2GN .25 .7–1.4 1.8–2.7 .2 1.2–1.8 – .15 – – – Rem. *325
CEN EN 2085PR (2618A-T6 forgings, ≤150 mm)
EN 2086PR (2618A-T851 [AL-P11-T851] forged bars and labs, ≤150 mm)
EN 2123PR (2618A-T851 plates, 6 mm ≤ a ≤ 140 mm)
EN 2256PR (2618A-T852 [AL-P11-T852] forged bars and slabs, ≤150 mm)
EN 2486PR (2618A-F extruded or cast forging stock)
EN 3552PR (2618A-T6 clad sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
EN 3553PR (2618A-T6511 extruded bar and section, 1 2 mm ≤ ≤ 100 mm—provisional spec.)
31029 USA AA 3003 (UNS A93003) .6 .7 .05–.2 1.0–1.5 – – .1 – .03 .15 Rem. *31
UK AA 3003 (was BS 1470 NS3) .6 .7 .1 .8–1.5 .1 – .2 .2 – – Rem.
F NF A-MI .6 .7 .2 1.0–1.5 .05 – .1 .5 – – Rem.
G DIN 1725 Al Mn Wk. 3.0515 .5 .6 .1 .9–1.4 0–.3 .05 .2 .1 .05 .15 Rem.
31030 USA AA 3004 (UNS A93004) .3 .7 .25 1.0–1.5 .8–1.3 – .25 – 05 .15 Rem. *31
UK AA 3004 .3 .7 .25 1.0–1.5 .8–1.3 – .25 – 05 .15 Rem. *31
F NF A .3 .7 .25 1.0–1.5 .8–1.3 – .25 .5 – – Rem.
31031 USA AA 3005 (UNS A93005) .6 .7 .3 1.0–1.5 .2–.6 .1 .25 .1 .05 .15 Rem.
UK AA 3005 .6 .7 .3 1.0–1.5 .2–.6 .1 .25 .1 .05 .15 Rem.
31032 USA AA 3103 (UNS A93103) .5 .7 .1 .9–1.5 .3 .1 .2 +Zr .1 .05 .15 Rem.
UK AA 3103 .5 .7 .1 .9–1.5 .3 .1 .2 +Zr .1 .05 .15 Rem.
CEN EN 4004PR (3103-H16 sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
31033 USA AA 3105 (UNS A93105) .6 .7 .3 .3–.8 .2–.8 .2 .4 .1 .05 .15 Rem.
UK AA 3105; ALCAN E4S .6 .7 .3 .3–.8 .2–.8 .2 .4 .1 .05 .15 Rem.
UK BS N31 (old designation) .25 .7 .25 .4–1.1 .3–.6 .1 .2 .2 – – Rem.
G DIN 1725 Al Mn 0.5 Mg 0.5 Wk.
3.0505
(continued)
593
(continued)
594

Composition (max. unless otherwise stated) Others


Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31034 USA AA 4032 (UNS A94032) 11.0–13.5 1.0 .5–1.3 – .8–1.3 .1 .25 – .05 .15 Rem. *313
UK AA 4032 11.0–13.5 1.0 .5–1.3 – .8–1.3 .1 .25 – .05 .15 Rem. *313
UK ALCAN GB38S 10.5–13.0 .6 .7–1.3 .2 .8–1.5 – .1 .2 – – Rem. *314
F NF A-S12UN 10.5–12.5 – .7–1.3 – .8–1.5 – – .15 – – Rem. *314
31035 USA AA 5005 (UNS A95005) .3 .7 .2 .2 .5–1.1 .1 .25 – .05 .15 Rem.
UK AA 5005 .3 .7 .2 .2 .5–1.1 .1 .25 – .05 .15 Rem.
UK BS N41 (old designation) .4 .7 .2 .5 .5–1.2 .1 .2 .2 – – Rem.
F NF A-G0.6 .4 .7 .2 .2 .5–1.1 .1 .2 .5 – – Rem.
G DIN 1725 Al Mg 1. Wk. 3.3315 .3 .4 .05 .2 .8–1.2 .1 .2 .1 .05 .15 Rem.
31036 USA AA 5050 (UNS A95050) .4 .7 .2 .1 1.1–1.8 .1 .25 – .05 .15 Rem. *31
UK AA 5050 .4 .7 .2 .1 1.1–1.8 .1 .25 – .05 .15 Rem. *31
F NF A-G1 .4 .7 .2 .7 1.0–1.8 .1 .25 .05 – – Rem.
31037 USA AA 5052 (UNS A95052) .45 (Si+Fe) .1 .1 2.2–2.8 .15–.35 .1 .05 – .15 Rem. *31
USA AMS 4015E; AMS 4016E; AMS
4017E;
AMS 4069; AMS 4070F; AMS 2.5 .25 Nominal comp.
4071F; AMS 4114B
UK AA 5052 .45 (Si+Fe) .1 .1 2.2–2.8 .15–.35 .1 .05 – .15 Rem. *31
ISO ISO Al Mg2
CEN EN 4005PR (5052-O sheet and strip, 0.3 mm ≤ a ≤ 6 mm—provisional spec.)
31038 USA AA 5056 (UNS A95056) .3 .4 .1 .05–.2 4.5–5.6 .05–.2 .1 – .05 .15 Rem. *31
UK AA 5056A; BS 3L58 .4 .5 .1 .1–.6 4.5–5.6 .2 .2 .2 .05 .15 Rem. Mn + Cr .1–.6
UK BS N6 (old designation) .3 .5 .1 .5 4.5–5.3 .25 .2 .2 Rem. Mn + Cr .1–.5
F A-G5 M (AA 5056A) .4 .4 .05 .55 4.3–5.5 .3 .2 .1 .05 .15 Rem.
G DIN 1725 Al Mg 5. (AA 5056A) .4 .4 .05 .55 4.3–5.5 .3 .2 .1 .05 .15 Rem.
Wk. 3.3555
CEN EN 2117PR (5056A-H32 wire for solid rivets, d ≤ 10 mm—provisional spec.)
EN 2628PR (5056A-O wire for solid rivets, d ≤ 10 mm—provisional spec.)
31039 USA AA 5083 (UNS A95083) .4 .4 .1 .4–1.0 4.0–4.9 .05–.25 .25 .15 .05 .15 Rem.
UK AA 5083 .4 .4 .1 .4–1.0 4.0–4.9 .05–.25 .25 .15 .05 .15 Rem.
UK BS N8 .4 .4 .1 .5–1.0 4.0–4.9 .25 2 .15 – – Rem.
F A-G4.5MC .7 4.4 .1 Nominal comp.
G DIN 1725 Al Mg 4.5 Mn Wk. 3.3547 .4 .4 .1 .6–1.0 4.0–4.9 .05–.25 .2 .1 .05 .15 Rem.
31040 USA AA 5086 (UNS A95086) .4 .5 .1 .2–.7 3.5–4.5 .05–.25 .25 .15 .05 .15 Rem.
UK AA 5086 .4 .5 .1 .2–.7 3.5–4.5 .05–.25 .25 .15 .05 .15 Rem.
CEN EN 2508PR (5086-H111 drawn tube for sturctures—provisional spec.)
EN 2693 (5086-H 111 sheet and strip)
EN 2699PR (5086-H111 drawn bar, 6 mm ≤ d ≤ 50 mm—provisional spec.)
31041 USA AA 5154 (UNS A95154) .45 (Si+Fe) .1 .1 3.1–3.9 .15–.35 .2 .2 .05 .15 Rem. *31
UK AA5154A (was BS N5) .5 .5 .1 .5 3.1–3.9 .25 .2 .2 .05 .15 Rem. Mn + Cr .1–.5 *31
G DIN 1725 Al Mg 3. Wk. 3.3535 .4 .4 .05 .5 2.6–34 .3 .2 .1 .05 .15 Rem.
31042 USA AA 5251 (UNS A95050) .4 .5 .15 .1–.5 1.7–2.4 .15 .15 .15 .05 .15 Rem.
UK AA 5251; BS 5L44; BS 3L80; BS .4 .5 .15 .1–.5 1.7–2.4 .15 .15 .15 .05 .15 Rem.
3L81
UK BS N4 (old designation) .5 .5 .1 .5 1.7–2.4 .25 .2 .2 Mn + Cr .5 Rem.
F A-G2 M 2 Nominal comp.
G DIN 1725 Al Mg 2. Mn 0.3 Wk. .3 .4 .05 .3 1.7–2.4 .3 .2 .1 .05 .15 Rem.
3.3525
Appendix 6: Metal Alloy Comparison Tables

(continued)
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31043 USA AA 5252 (UNS A95252) .08 .1 .1 .1 2.2–2.8 – – – .03 .1 Rem.
UK AA 5252 .08 .1 .1 .1 2.2–2.8 – – – .03 .1 Rem.
F NF AG-G3 3.0 nom High purity base
31044 USA AA 5254 (UNS A95254) .45 (Si+Fe) .05 .01 3.1–3.9 .15–.35 .2 .05 .05 15 Rem.
UK AA 5154A (was BS N5) .5 .5 .1 .5 3.1–3.9 .25 .2 .2 .05 .15 Rem. Mn + Cr .1–.5 *31
G DIN 1725 Al Mg3. Wk. 3.3535 .4 .4 .05 .5 2.6–3.4 .3 .2 .1 .05 .15 Rem.
31045 USA AA 5356 (UNS A95356) .5 (Si+Fe) .1 .05–.2 4.5–5.5 .05–.2 .1 .06–.2 .05 .15 Rem. *31
UK AA 5356 .5 (Si+Fe) .1 .05–.2 4.5–5.5 .05–.2 .1 .06–.2 .05 .15 Rem. *31
UK AA 5056A; BS 3L58 .4 .5 .1 1–.6 4.5–5.6 .2 .2 .2 .05 .15 Rem. Mn + Cr .1–.6
UK BS N6 (old designation) .3 .5 .1 .5 4.5–5.3 .25 .2 .2 Mn + Cr .1–.5 Rem.
F A-G5 M .4 .4 .05 .55 4.3–5.5 .3 .2 .1 .05 .15 Rem.
G DIN 1725 Al Mg 5. Wk. 3.3555 .4 .4 .05 .55 4.3–5.5 .3 .2 .1 .05 .15 Rem.
Appendix 6: Metal Alloy Comparison Tables

31046 USA AA 5454 (UNS A95454) .4 (Si+Fe) .1 .5–1.0 2.4–3.0 .05–.2 .25 .2 .05 .15 Rem.
UK AA 5454 (was BS N51); EN 515; EN .4 (Si+Fe) .1 .5–1.0 2.4–3.0 .05–.2 .25 .2 .05 .15 Rem.
573-3;
EN 573-4
F A-G2.5MC .7 2.7 .1 Nominal comp.
F A-G3 .4 .5 .1 .1–.6 2.6–3.8 .4 .2 .2 – – Rem.
G DIN 1725 Al Mg 2.7 Wk. 3.3537 .45 2.7 Nominal comp.
G DIN 1725 Al Mg 3. Wk. 3.3585 .4 .4 .05 .5 2.6–3.4 .3 .2 .1 .05 .15 Rem.
31047 USA AA 5456 (UNS A95456) .4 (Si+Fe) .1 .5–1.0 4.7–5.5 .05–.2 .25 .2 .05 .15 Rem.
UK BS N61 .4 (Si+Fe) .1 .6–1.0 5.0–5.5 .05–.2 .2 .05–.2 – – Rem.
F NF A-G5 .4 .5 .1 .2–1.0 4.5–5.5 .4 .2 .2 – – Rem.
G DIN 1725 Al Mg 5. Wk. 3.3555 .4 .4 .05 .55 4.3–5.5 .3 .2 .1 .05 .15 Rem.
31048 USA AA 5457 (UNS A95457) .08 .1 .2 .15–.45 .8–1.2 – .03 – .03 .1 Rem.
UK AA 5457 (UNS A95457) .08 .1 .2 .15–.45 .8–1.2 – .03 – .03 .1 Rem.
F A9-G1 and see AA 5005 1.0 Nominal comp.
31049 USA AA 5652 (UNS A95652) .4 (Si+Fe) .04 .01 2.2–2.8 .15–.35 .1 – .05 .15 Rem. *31
UK AA 5652 .4 (Si+Fe) .04 .01 2.2–2.8 .15–.35 .1 – .05 .15 Rem. *31
31050 USA AA 5657 (UNS A95657) .08 .1 .1 .03 .6–1.0 – .03 – .02 .05 Rem. *31
UK AA 5657 .08 .1 .1 .03 .6–1.0 .03 – .02 .05 Rem. *31
UK BS BTRS2 (old designation) 1.0 Nominal comp.
31051 USA AA 6003 (UNS A96003) .35–1.0 .6 .1 .8 .8–1.5 .35 .2 .1 .05 .15 Rem.
UK AA 6003 .35–1.0 .6 .1 .8 .8–1.5 .35 .2 .1 .05 .15 Rem.
F NF AS–GM .6–1.5 .5 .1 .1–1.0 .6–1.5 .3 .25 .2 – – Rem.
G DIN 1725 Al Mg Si 1 .75–1.3 .5 .1 .4–1.0 .6–1.2 .3 .2 .1 .05 .15 Rem.
31052 USA AA 6005 (UNS A96005) .6–.9 .35 .1 .1 .4–.6 .1 .1 .1 .05 .15 Rem. k
UK AA 6005 .6–.9 .35 .1 .1 .4–.6 .1 .1 .1 .05 .15 Rem.
31053 USA AA 6053 (UNS A96053) *315 35 .1 – 1.1–1.4 .15–.35 .1 – .05 .15 Rem.
UK AA 6053 *315 .35 .1 – 1.1–1.4 .15–.35 .1 – .05 .15 Rem.
See also AA 6003
(continued)
595
(continued)
596

Composition (max. unless otherwise stated) Others


Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31054 USA AA 6061 (UNS A96061) .4–.8 .7 .15–.4 .15 .8–1.2 .04–.35 .25 .15 .05 .15 Rem.
USA AMS4025D; AMS4026D; AMS numbers for various forms and conditions of AA 6061 alloy
AMS4027E; AMS4043
AMS4053; AMS4079; AMS4080E;
AMS4081A
AMS4082E; AMS4083D;
AMS4115; AMS4116A
AMS4117A; AMS4127B;
AMS4146; AMS4150C; AMS4160;
AMS4161
UK AA 6061; BS L117; BS L118 .4–.8 .7 .15–.4 .15 .8–1.2 .04–.35 .25 .15 .05 .15 Rem.
UK BS H20 .4–.8 .7 .15–.4 .2–.8 .8–1.2 * .2 .2 Rem. *Either Mn or Cr .04–.35
F A-GSUC .6 .2 1.0 .15 Nominal Camp.
G DIN 1725 Al Mg Si 1 Cu Wk. 3.3211
CEN EN 2391 PR (6061-T4 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2392PR (6061-T6 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec)
EN 2629PR (6061—provisional spec.)
EN 2694 (6061-T6/T62 sheet and strip)
EN 2700PR (6061-T6 drawn bar, 6 mm ≤ d ≤ 75 mm, peripheral coarse grain control—provisional spec.)
EN 2702PR (6061-T6 extruded bar and section, 1.2 mm ≤ a/d ≤ 150 mm—provisional spec)
EN 2813PR (6061-T6 tube for hydraulics, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 3341 PR (6061-T4 sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
EN 3342PR (6061-T4 drawn bar and section, 10 mm ≤ d ≤ 150 mm—provisional spec.)
EN 3702PR (6061-T4 tube for hydraulics, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
31055 USA AA 6063 (UNS A96063) .2–.6 .35 .1 .1 .45–.9 .1 .1 .1 .05 .15 Rem.
UK AA 6063; DTD 372B .2–.6 .35 .1 .1 .45–.9 .1 .1 .1 .05 .15 Rem.
UK H9 (old designation) .3–.7 .4 .1 .1 .4–.9 .1 .2 .2 – – Rem.
F NF A-GS (NFA.57.350) .8 .8 Nominal comp.
G DIN 1725 Al Mg Si 0.5 Wk. 3.3206 .35–.8 .3 .05 .1 .4–.8 .05 .2 .1 .05 .15 Rem.
ISO ISO Al Mg Si – –
31056 USA AA 6066 (UNS A96066) .9–1.8 .5 .7–1.2 .6–1.1 .8–1.4 .4 .25 .2 .05 .15 Rem.
UK AA 6066 .9–1.8 .5 .7–1.2 .6–1.1 .8–1.4 .4 .25 .2 .05 .15 Rem.
UK ALCAN 623; BS 2L84 .8–1.3 .7 1.0–2.0 1.0 .5–1.2 – .2 .3 – – Rem. Ni .2 *316
31057 USA AA 6070 (UNS A96070) 1.0–1.7 .5 .15–.4 .4–1.0 .5–1.2 .1 .25 .15 .05 .15 Rem.
UK AA 6070 1.0–1.7 .5 .15–.4 .4–1.0 .5–1.2 .1 .25 .15 .05 .15 Rem.
UK ALCAN 623; BS 2L84 .8–1.3 .7 1.0–2.0 1.0 .5–1.2 – .2 .3 – – Rem. Ni .2 *316
31058 USA AA 6081
CEN EN 2695 (6081-T6 sheet and strip);
31059 USA AA 6082 (UNS A96082) .7–1.3 .5 .1 .4–1.0 .6–1.2 .25 .2 .1 .05 .15 Rem.
UK AA 6082 (was H30) .7–1.3 .5 .1 .4–1.0 .6–1.2 .25 .2 .1 .05 .15 Rem.
ISO ISO AISi1 MgMn
CEN EN 2326 (6082-T6 <200 mm bar and drawn profiles)
EN 2636 (6082-T6 <200 mm bar and drawn profiles, peripheral coarse grain control)
EN 2389PR (6082-T4 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2390PR (6082-T6 tube for structures, 0.6 mm ≤ a ≤ 12.5 mm—provisional spec.)
EN 2420PR (6082-T6 bars—provisional spec.)
EN 2421 PR (6082-T4 wire for rivets—provisional spec.)
EN 4006PR (6082-T4/T42 sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)
Appendix 6: Metal Alloy Comparison Tables

EN 4007PR (6082-T6/T62 sheet and strip, 0.4 mm ≤ a ≤ 6 mm—provisional spec.)


(continued)
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31060 USA AA 6101 (UNS A96101) .3–.7 .5 .1 .03 .35–.8 .03 .1 – .03 .1 Rem. B .06
UK AA6101A; BS2898:6101A .3–.7 .4 .05 – .4–.9 – – – .03 .1 Rem.
UK BS 91E .3–.7 .5 .04 – .4–.9 – – – – – Rem.
G DIN 1725 E-AI Mg Si Wk. 3.2305 .5–.6 .1–.3 .02 – .3–.5 – .1 – .03 .1 Rem. *317
31061 USA AA 6151 (UNS A96151) .6–1.2 1.0 .35 .2 .45–.8 .15–.35 .25 .15 .05 .15 Rem.
UK AA 6151 .6–1.2 1.0 .35 .2 .45–.8 .15–35 .25 .15 .05 .15 Rem.
See AA 6101
31062 USA AA 6162 (UNS A96162) .4–.8 .5 .2 .1 .1–1.1 .1 .25 .1 .05 .15 Rem.
UK AA 6162 .4–.8 .5 .2 .1 .1–1.1 .1 .25 .1 .05 .15 Rem.
See AA 6101
31063 USA AA 6201 (UNS A96201) .5–.9 .5 .1 .03 .6–.9 .03 .1 – .03 .1 Rem.
UK AA 6201 .5–.9 .5 .1 .03 .6–.9 .03 .1 – .03 .1 Rem.
Appendix 6: Metal Alloy Comparison Tables

See AA 6101
31064 USA AA 6253 (UNS A96253) *315 .5 .1 – 1.0–1.5 .15–.35 1.6–2.4 – .05 .15 Rem.
UK AA 6253 *315 .5 .1 – 1.0–1.5 .15–.35 1.6–2.4 – .05 .15 Rem.
31065 USA AA 6262 (UNS A96262) .4–.8 .7 .15–.4 .15 .8–1.2 .04–.14 .25 .15 .05 .15 Rem. *318
UK AA 6262 .4–.8 .7 .15–.4 .15 .8–1.2 .04–.14 .25 .15 .05 .15 Rem. *318
31066 USA AA 6351 (UNS A96351) .07–1.3 .5 .1 .4–.8 .4–.8 – .2 .2 .05 .25 Rem.
UK AA 6351 .07–1.3 .5 .1 .4–.8 .4–.8 – .2 .2 .05 .25 Rem.
31067 USA AA 6463 (UNS A96463) .2–.6 .15 .2 .05 .45–.9 – – – .05 .15 Rem.
UK AA 6463; E6; EN 515; EN 573–3; .2–.6 .15 .2 .05 .45–.9 – – – .05 .15 Rem.
EN 573-4
UK BS BTR6 .2–.5 .15 .2 .05 .4–.8 – – .05 – – Rem.
31068 USA AA 6951 (UNS A96951) .2–.5 .8 .15–.4 .1 .4–.8 .2 – .05 .15 Rem.
31069 USA AA 7001 (UNS A97001) .35 .4 1.6–2.6 .2 2.6–3.4 .18–.35 6.8–8.0 .2 .05 .15 Rem.
UK AA 7001 .35 .4 1.6–2.6 .2 2.6–3.4 .18–.35 6.8–8.0 .2 .05 .15 Rem.
F NF A-Z8GU 1.6 2.7 .2 8.0 Nominal comp.
31070 USA AA 7009 (UNS A97009)
UK AA 7009
CEN EN 2093 (7009-T74 Forgings >20 mm and <150 mm)
EN 2094 (7009-T74 Die Forgings >3 mm and <150 mm)
EN 2381 (7009-T7452 Forgings >40 mm and <150 mm)
EN 2385 (7009-T74511 bar and drawn profiles)
EN 2487PR (7009-F extruded or casr forging stock—provisional spec.)
EN 2630 (7009-T74511 bar and drawn profiles, a ≤ 125 mm, peripheral coarse grain control)
EN 2706PR (7009-T736510 bar and section, 1.2 mm ≤ a/d ≤ 125 mm, peripheral coarse grain control—provisional spec.)
(continued)
597
(continued)
598

Composition (max. unless otherwise stated) Others


Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31071 USA AA 7010 1.7 2.4 6.3 Nominal comp.
UK AA 7010 1.7 2.4 6.3 Nominal comp.
UK DTD 5120 .12 .15 1.5–2 .1 2.1–2.6 .05 5.7–6.7 – .05 .15 Rem. *323
UK DTD 5130A .1 .15 1.5–2 .3 2.2–2.7 .05 5.7–6.7 – .05 .15 Rem. *323
UK DTD 5636 .12 .15 1.5–2 .1 2.1–2.6 .05 5.7–6.7 .06 .05 .15 Zr .1–.16
CEN EN 2681 PR (7010-T736 die forgings, a ≤ 150 mm—provisional spec.)
EN 2682PR (7010-T73652 forgings, 50 mm ≤ a ≤ 150 mm—provisional spec.)
EN 2683PR (7010-T7651 forgings, 80 mm ≤ a ≤ 160 mm—provisional spec.)
EN 2684PR (7010-T7651 plate, 6 mm ≤ a ≤ 140 mm—provisional spec.)
EN 2685PR (7010-T7652 forgings, 80 mm ≤ a ≤ 160 mm—provisional spec.)
EN 2686PR (7010-T73651 hand forgings, 50 mm ≤ a ≤ 150 mm—provisional spec.)
EN 2687PR (7010-T73651 plate, 6 mm ≤ a ≤ 150 mm—provisional spec.)
EN 3337PR (7010-T74511 extruded bars and sections a/d ≤ 130 mm, peripheral coarse grain control—provisional spec)
EN 3339PR (7010-T76 die forgings, a ≤ 200 mm—provisional spec.)
EN 3343PR (7010-T76511 extruded bars and sections 1 mm ≤ a/d ≤ 130 mm, peripheral coarse grain control—provisional spec)
EN 3554PR (7010-T7652 hand forgings, a ≤ 200 mm—provisional spec.)
31072 USA AA 7020 .35 .4 .2 .05–.5 1.0–1.4 .1– 35 4.0–5.0 – .05 .15 Rem. *324
UK AA 7020; BS4300/14 /15; EN 515; .35 .4 .2 .05–.5 1.0–1.4 .1–.35 4.0–5.0 – .05 .15 Rem. *324
EN 573-3; EN 573-4
UK BS H17 .4 .4 .25 .2–.7 1.0–1.5 .25 3.8–4.8 .1 – – Rem. Zr .25, Mn + Cr .7
F A-Z5G (NFA.57-702) .3 .8 .15–.35 .4 .4–.65 .35 4.5–5.5 .15–.25 .05 .15 Rem.
G DIN 1725 Al Zn 4.5 Mg 1 Wk. .5 .5 .1 1–.5 1–1.4 .2 4–5 .2 .05 .15 Rem.
3.4335
CEN EN 2807PR (7020-T6 extruded sections 1.2 mm ≤ a ≤ 100 mm, peripheral coarse grain control—provisional spec.)
31073 USA AA 7039 (UNS A97039) .3 .4 .1 .1–.4 2.3–3.3 .15–.25 3.5–4.5 .1 .05 .15 Rem.
UK AA 7039 .3 .4 .1 .1–.4 2.3–3.3 .15–.25 3.5–4.5 .1 .05 .15 Rem.
31074 USA AA 7049 (UNS A97049) .25 .35 1.2–1.9 .2 2.0–2.9 .1–.22 7.2–8.2 .1 .1 .15 Rem.
UK AA 7049 .25 .35 1.2–1.9 .2 2.0–2.9 .1–.22 7.2–8.2 .1 .1 .15 Rem.
31075 USA AA 7050 (UNS A97050) .12 .15 2.0–2.6 .1 1.9–2.6 .04 5.7–6.7 .06 .05 .15 Rem. Zr.08–.15
UK AA 7050 .12 .15 2.0–2.6 .1 1.9–2.6 .04 5.7–6.7 .06 .05 .15 Rem. Zr.08–.15
CEN EN 2688PR (7050-T736 die forgings, a ≤ 150 mm—provisional spec.)
EN 2689PR (7050-T73651 plate, 6 mm ≤ a ≤ 150 mm—provisional spec.)
EN 2690PR (7050-T73652 hand forgings, a ≤ 125 mm—provisional spec.)
EN 3334PR (7050-T651 plate, 6 mm ≤ a ≤ 60 mm—provisional spec)
EN 3338PR (7050-T74511 extruded bars and sections a/d ≤ 130 mm, peripheral coarse grain control—provisional spec.)
EN 3340PR (7050-T76 die forgings, a ≤ 200 mm—provisional spec.)
EN 3344PR (7050-T76511 extruded bars and sections a/d ≤ 130 mm, peripheral coarse grain control—provisional spec.)
(continued)
Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al min. Notes
31076 USA AA 7075 (UNS A97075) .4 .5 1.2-2.0 .3 2.1–2.9 .18–.35 5.1–6.1 .2 .05 .15 Rem. Zr + Ti .25
UK AA 7075 .4 .5 1.2–2.0 .3 2.1–2.9 .18–.35 5.1–6.1 .2 .05 .15 Rem. Zr + Ti .25
UK DTD5074A (now DTD5121) 1.6 2.5 .16 6.2 Nominal comp.
UK DTD5121 (part superceded by .4 .5 1.2–2.0 .3 2.1–2.9 .1–.25 5.1–6.4 +Zr .2 – – Rem. Ni, Pb and Sn < .05
L170); DTD5110
UK BS L160; BS L161; BS L162; BS .4 .5 1.2–2.0 .3 2.1–2.9 .18–.28 5.1–6.1 .2 .05 .15 Rem. Zr + Ti .25
L170
F NF A-Z5GU .4 .5 1.2–2.0 .1–.9 2.0–3.5 .35 5.0–6.5 .2 – – Rem.
G DIN 1725 Al Zn Mg Cu 1.5 Wk. .5 .7 1.2–2.0 .3 2.1–2.9 .18–.35 5.1–6.1 .2 .05 .15 Rem.
3.4365
CEN EN 2092 (7075-T6/T62 .4–6 mm sheet and strip)
EN 2126 (7075-T651 6–80 mm sheet)
EN 2127 (7075-T73511 <100 mm bar and drawn profiles)
Appendix 6: Metal Alloy Comparison Tables

EN 2128 (7075-T7351 6–75 mm drawn bars)


EN 2315PR (7075-T73510/T73511 bars and sections ≤ 100 mm—provisional spec.)
EN 2316PR (7075-T73 bars and sections ≤ 100 mm—provisional spec.)
EN 2317PR (7075-T73 drawn bars ≤ 75 mm—provisional spec.)
EN 2380PR (7075-T73 forgings ≤ 125 mm—provisional spec.)
EN 2386PR (7075-T7352 hand forgings ≤ 150 mm—provisional spec.)
EN 2394PR (7075-T6511 bars and sections ≤ 125 mm—provisional spec.)
EN 2488PR (7075-F extruded or cast forging stock—provisional spec.)
EN 2511 PR (7075-T7351 plate, 6 mm ≤ a ≤ 100 mm—provisional spec.)
EN 2631 PR (7075-T6511 bars and sections 1.2 mm ≤ a/d ≤ 125 mm, peripheral coarse grain control—provisional spec.)
EN 2632 (7075-T73511 <100 mm bar and drawn profiles, <100 mm, controlled grain size)
EN 2637PR (7075-T73 extruded bars and sections 1.2 mm ≤ a/d ≤ 100 mm, peripheral coarse grain control—provisional spec)
EN 2696 (7075-T6/T62 .4-6 mm sheet and strip)
EN 2698PR (7075-T6510 extruded bar and section, 1.2 mm ≤ a/d ≤ 100 mm—provisional spec.)
EN 2707PR (7075-T6510 bar and section, 1.2 mm ≤ a/d ≤ 125 mm, peripheral coarse grain control—provisional spec.)
EN 2708PR (7075-T73510 bar and section, 1.2 mm ≤ a/d ≤ 100 mm, peripheral coarse grain control—provisional spec.)
EN 2804PR (7075-T7651 plate, 6 mm ≤ a ≤ 25 mm—provisional spec.)
EN 3555PR (7075-T79510 extruded bar and section, 1.2 mm ≤ a/d ≤ 100 mm, coarse grain control—provisional spec.)
31077 USA AA 7079 (UNS A97079) .3 .4 .4–.8 .1–.3 2.9-3.7 .1–.25 3.8–4.8 .1 .05 .15 Rem.
UK AA 7079 .3 .4 .4–.8 .1–.3 2.9–3.7 .1–.25 3.8–4.8 .1 .05 .15 Rem.
UK BS H17 .4 .4 .25 2–.7 1.0–1.5 .25 3.8–4.8 .1 – – Rem. Zr .25, Mn + Cr .7 *319
G DIN 1725 Al Zn Mg Cu 0.5 Wk. .5 .5 .5–1.0 .1–.4 2.6–3.6 .1–.3 4.3–5.2 .2 .05 .15 Rem.
3.4345
31078 USA AA 7175 (UNS A97175) .15 .2 1.2–2.0 .1 2.1–2.9 .18–.28 5.1–6.1 .1 .05 .15 Rem.
UK AA 7175 .15 .2 1.2–2.0 .1 2.1–2.9 .18–.28 5.1–6.1 .1 .05 .15 Rem.
CEN EN 2512PR (7175-T7351 plate, 6 mm ≤ 100 mm—provisional spec.);
31079 USA AA 7178 (UNS A97178) .4 .5 1.6–2.4 .3 2.4–3.1 .18–.35 6.3–7.3 .2 .05 .15 Rem.
UK AA 7178 .4 .5 1.6–2.4 .3 2.4–3.1 .18–.35 6.3–7.3 .2 .05 .15 Rem.
F NF A-Z5GU .4 .5 1.2–2.0 1–.9 2.0–3.5 .35 .5.0–6.5 .2 – – Rem.
31080 USA AA 8090 .2 .3 1.0–1.6 .6–1.3 Li 2.1–2.7 Zr < .16 Nominal comp.
UK AA 8090 .2 .3 1.0–1.6 .6–1.3 Li 2.1–2.7 Zr < .16 Nominal comp.
31081 USA AA 8091 .3 .5 1.8–2.2 .5–1.2 Li 2.4–2.8 Zr < .16 Nominal comp.
UK AA 8091 .3 .5 1.8–2.2 .5–1.2 Li 2.4–2.8 Zr < .16 Nominal comp.
599
600 Appendix 6: Metal Alloy Comparison Tables

Alloy equivalents—Aluminium alloys (cast)


Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al Notes
min.
32001 USA AA 295.0 (UNS .7–1.5 1.0 4.0–5.0 .35 .03 – – .35 .25 .05 .15 –
A02950)
32002 USA AA B295.0 2.0–3.0 1.2 4.0–5.0 .35 .05 – .35 .5 .25 – .35 –
UK AA 295.0 .7–1.5 1.0 4.0–5.0 .35 .03 – – .35 .25 .05 .15 –
UK BS LM 11 .25 .25 4.0–5.0 .1 .1 – .1 .1 .3 – – Sn .05 Pb .05
UK BS L154; BS L155 1.0–1.5 .25 3.8–4.5 .1 .1 – .1 .1 .05–.25 .05 .15 Sn .05 Pb .05
F NF A-USG7 .3 .35 4.2–5.0 .1 .15–.33 – .05 .1 .3 – – Pb .05
G DIN 1725 Al Cu .18 .2 4.2–4.9 .05 .15–.3 – – .07 .15–.3 .03 .1 –
4 Ti Mg. Wk. 3.1371
32003 USA AA 319.0 (UNS 5.5–6.3 1.0 3.0–4.0 .5 .1 – .35 1.0 .25 – .5 –
A03190)
32004 USA AAA319.0 5.5–6.5 1.0 3.0–4.0 .3 .1 – .35 3.0 .25 – .5 –
UK AA 319.0 5.5–6.3 1.0 3.0–4.0 .5 .1 – .35 1.0 .25 – .5 –
UK BS LM4 4.0–6.0 .8 2.0–4.0 .2–.6 .2 – .3 .5 .2 – – Sn .1 Pb .1
UK BS LM22 4.0–6.0 .7 2.8–3.8 .3–.6 .05 – .15 .15 .2 – – Sn .05 Pb .1
F NF A-S5U; NF A- 5.0 3.2 Nominal comp.
S5U3
G DIN 1725 Al Si 6 5.0–7.5 1.0 3.0–5.0 .1–.3 .1–.3 – .3 2.0 .15 .03 .15 –
Cu 4. Wk. 3.2151
ISO ISO AI-Si5Cu3
32005 USA AA 333.0 (UNS 8.0–10.0 1.0 3.0–4.0 .5 05–.5 – .5 1.0 .25 – .5 –
A03330)
32006 USA AA A333.0 8.0–10.0 1.0 3.0–4.0 .5 .05–.3 – .5 3.0 .25 – .5 –
UK AA 333.0 8.0–10.0 1.0 3.0–4.0 .5 05–.5 – .5 1.0 .25 – .5 –
UK BS LM24 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 .2 – – Sn .2 Pb .3
F A-S9U3Y4 8.2 3.5 Nominal comp.
F A-S10U4 9.0–11.0 1.3 3.0–4.0 .3 .5 – .5 .8 .2 – – Sn .1
Fe + Zn− +
Mg + Ni + Sn
2.5
G DIN 1725 Al Si 8 Cu 7.5–9.5 .8 2.0–3.5 .2–.5 .3 – .3 1.2 .15 .05 .15 Sn .1
3. Wk. 3.2161
ISO ISO AI-Si8Cu3Fe
32007 USA AA 355.0 (UNS 4.5–5.5 .6 1.0–1.5 .5 .4–.6 .25 – .35 .25 .05 .15 –
A03550)
32008 USA AA C355.0 (UNS 4.5–5.5 .2 1.0–1.5 .1 .4–.6 – – .1 .2 .05 .15 –
A33550)
UK BS LM16 4.5–5.5 .6 1.0–1.5 .5 .4–.6 – .25 .1 .2 – – Sn .1 Pb .1
UK AA 355.0 4.5–5.5 .6 1.0–1.5 .5 .4–.6 .25 – .35 .25 .05 .15 –
F A-S4UG
G Alloy No. 234 5.0–6.0 .7 1.0–1.5 .5 .3–.6 – .3 .5 .15 .05 .15 Sn .1 Pb .2 *320
ISO ISO Al-Si5Cu1 Mg
32009 USA AA 356.0 (UNS 6.5–7.5 .6 .25 .35 .2–.4 – – .35 .25 .05 .15 –
A03560)
32010 USA AA A356.0 6.5–7.5 .2 .2 .1 .2–.4 – – .1 .2 .05 .15 –
UK BS LM25 6.5–7.5 .5 .1 .3 .2–.45 – .1 .1 .05–.2 – – Sn .05 Pb .1
UK BS 2L99 6.5–7.5 .2 .1 .1 .2–.45 – .1 .1 .2 – – Sn .05 Pb .05
UK BS L173; BS L174 6.5–7.5 .2 .2 .1 .25–.45 – – .1 .04–.25 – – Be .07 max.
UK AA 356.0 6.5–7.5 .6 .25 .35 .2–.4 – – .35 .25 .05 .15 –
F NF A-S7G
G DIN 1725 Al Si 6.5–7.5 .18 .05 .05 .2–.4 – – .07 .15 .03 .1 –
7 Mg Wk. 3.2371
ISO ISO AI-Si7 Mg
(continued)
Appendix 6: Metal Alloy Comparison Tables 601

(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al Notes
min.
32011 USA AA 357.0 (UNS 6.5–7.5 .15 .05 .03 .45–.6 – – .05 .2 .05 .15 –
A03570)
UK AA 357.0 6.5–7.5 .15 .05 .03 .45–.6 – – .05 .2 .05 .15 –
UK BS L169 6.5–7.5 .2 .1 .1 .5–.75 – .05 .1 .1–.2 .05 .15 Pb .05 Sn .05 Be
.07
F A-S7G 7.0 .3 Nominal comp.
G DIN 1725 Al Si 6.5–7.5 .18 .05 .05 2–.4 – – .07 .15 .03 .1 –
7 Mg Wk. 3.2371
32012 USA AA B358.0 (Tens 7.6–8.6 .3 .2 .2 .4–.6 .2 – .2 .1–.2 .05 .15 Be .1–.3
50)
32013 USA AA 359.0 (UNS 8.5–9.5 .2 .2 .1 .5–.7 – – .1 .2 .05 .15 –
A03590)
32014 USA AA 380.0 (UNS 7.5–9.5 2.0 3.0–4.0 .5 .1 – .5 3.0 – – .5 Sn .35
A03800)
32015 USA AA A380.0 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 – – .5 Sn .35
UK BS LM24 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 .2 – – Sn .2 Pb .35
F A-S9U3Y4 8.2 3.5 Nominal comp.
F A-S10U4 9.0–11.0 1.3 3.0–4.0 .3 .5 – .5 .8 .2 – – Sn .1 Fe+Zn-
+Mg+Ni+Sn 2.5
G DIN 1725 Al Si 8 Cu 7.5–9.5 .8 2.0–3.5 .2–.5 .3 – .3 1.2 .15 .05 .15 Sn .1
3. Wk. 3.2161
ISO ISO Al-Si8Cu3Fe
32016 USA AA 514.0 (UNS .35 .5 .15 .35 3.5–4.5 – – .15 .25 .05 .15 –
A05140)
UK AA 514.0 .35 .5 . .15 .35 3.5–4.5 – – .15 .25 .05 .15 –
UK BS LM5 .3 .6 .1 .3–.7 3.0–6.0 – .1 .1 .2 – – Sn .05 Pb .05
F NF A-G3T .4 .5 .1 .5 2.5–3.5 .15 .05 .2 .2 – – Sn .05 Pb .05
F NF A-G6 .4 4.5 Nominal comp.
G DIN 1725 Al Mg 3 1.3 .6 .3 .6 2.0–4.0 – – .3 .2 .05 .15 –
G DIN 1725 Al Mg 5 1.0 .2 5.0 Nominal comp.
ISO ISO AI-Mg5Si1; ISO
Al-Mg6
32017 USA AA 518.0 (UNS .35 1.8 .25 .35 7.5–8.5 – .15 .15 – – .25 Sn .15
A05180)
UK AA 518.0 .35 1.8 .25 .35 7.5–8.5 – .15 .15 – – .25 Sn .15
G DIN 1725 Al Mg 9 .5 .05 .2–.5 7.0–10.0 .1 .15 .05 .15 Nominal comp.
Wk. 3.3292
32018 USA AA 520.0 (UNS .25 .3 .25 .15 9.5–10.6 – – .15 .25 .05 .15 –
A05200)
UK AA 520.0 .25 .3 .25 .15 9.5–10.6 – – .15 .25 .05 .15 –
UK BS LM10; Hid 90 .25 .35 .1 .1 9.5–11.0 – .1 .1 .2 – – Sn .05 Pb .05
F NF A-G10 .5 1.3 .2 .6 8.5–11.0 – .1 .4 .2 – 2.0 Sn .1
F NF A-G10Y4 10.2 Nominal comp.
G DIN 1725 Al Mg 10 .3 .3 .05 .3 9.0–11.0 – .1 – .15 .05 .15 Sn .05 Pb .05
Wk. 3.3591
32019 USA AA 535.0 (UNS .15 .15 .05 .1–25 6.2–7.5 – – – .1 –.25 .05 .15 Be .003–.007 B
A05350) .002
UK AA 535.0 15 .15 .05 .1–.25 6.2–7.5 – – – .1–25 .05 .15 Be .003–.007 B
.002
UK DTD 5018A .25 .35 .2 1–.3 7.4–7.9 – .1 .9–1.4 .25 – Sn .05 Pb .05
G DIN 1725 Al Mg 9 .5 .05 .2–5 7.0–10.0 .1 .15 .05 .15 Nominal comp.
Wk. 3.3292
32020 USA AA 707.0 (UNS .2 .8 .2 .4–.6 1.8–2.4 .2–.4 – 4.0–4.5 .25 .05 .15 –
A07070)
UK AA 707.0 .2 .8 .2 .4–.6 1.8–2.4 .2–.4 – 4.0–4.5 .25 .05 .15 –
(continued)
602 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Al Notes
min.
32021 USA AAA712.0 (UNS .15 .5 .35–65 .05 .6–.8 – – 6.0–7.0 .25 .05 .15 –
A07120)
32022 USA AAC712.0 .3 .7– .35–65 .05 .25–.45 – – 6.0–7.0 .2 .05 .15 –
1.4
UK AA 712.0 .15 .5 .35–.65 .05 .6–.8 – – 6.0–7.0 .25 .05 .15 –
UK BS LM31; DTD .25 .5 .1 .1 .5–.75 .4–.6 .1 4.8–5.7 .05–.25 .05 .15 Sn .05 Pb .05
5008B
F A-Z5G .3 .8 .15–.35 .4 .4–.65 .15–.35 .05 4.5–5.5 .15–.25 – – Sn .05 Pb .05
F NF A-Z5G .6 .5 5.2 Nominal comp.
Notes for wrought and cast aluminium alloys
*31: .0008 max. Be for welding electrodes and filler wire
*32: .03 max. Ga
*33: Cu + Si + Fe + Mn + Zr .2 max
*34: Cu + Si + Fe + Mn + Zr 1.0 max
*35: Cu + Si + Fe + Mn + Zr 0.5 max
*36: .05 B max
*37: .2–.6 Bi; .2–.6 Pb
*38: .2–.7 Pb; .05 max. Sn; .2–.7 Bi; .05 max. Sb
*39: .2–.6 Pb; .2–.6 Bi
*310: .2 max. Zr + Ti
*311: .05–.15V; .1–.25 Zr
*312: .1 max Ni; .05 max. Sn; .05 max. Pb
*313: .5–1.3 Ni
*314: .05 max. Sn; .05 max. Pb; .7–1.3 Ni
*315: 45–65 % of Mg
*316: .05 max Sn; .05 max Pb; .05 max Sb
*317: Cr + Mn + Ti + V .03 max
*318: .4–.7 Bi; .4–.7 Pb
*319: Not closely equivalent, Mg lower than AA 7079
*320: Fe + Mn 1.1 max
*321: .1–.25 Zr; .05–.15V
*322: .9–1.2 Ni
*323: .11–.17 Zr
*324: Ti + Zr .08–.25, Zr .08–.2
*325: .8–1.4 Ni + .25 Zr
Appendix 6: Metal Alloy Comparison Tables 603

European CEN Specifications for • Chemical composition specifications for wrought alu-
Aluminium Alloys minium alloys are now contained in a single CEN spec-
ification: EN 573—Aluminium and aluminium alloys—
European EN specifications for metal alloys are currently Chemical composition and form of wrought products.
being generated and adopted. These will progressively • Temper designations for wrought aluminium alloys are
supersede the various national standards for aluminium also contained in a single CEN specification: EN 515—
alloys, as with other materials. However, it will be some Aluminium and aluminium alloys—Wrought products
years before this process is completed and fully imple- temper designations.
mented. EN designations specific to particular alloys, forms • In addition EN 485 now contains conditions for delivery,
and conditions have been included in the above alloy tables properties and tolerances for wrought aluminium alloy
(many of these are still at the provisional stage). However, products.
there are several EN specifications which cover the basic
characteristics of aluminium alloys: Similar specifications will be issued in the future to cover
cast aluminium alloys.

Alloy equivalents—Copper Alloys


Composition
Country Designation Zn Sn Pb Be Fe Al Other
41001 USA CDA 110 (UNS C11000) – – – – – – Cu + Ag > 99.9
UK C101 (CW 003A) – – <.005 – – – Cu + Ag > 99.9
F NF Cu a1 A53-100 – – – – – – Cu 99.9 oxygen free. Nominal comp.
G DIN 1708 E-Cu57 Wk. – – – – – – Cu 99.95, Ag 0.03, O .005–.040 nominal comp.
2.0060
41002 USA CDA 170 (UNS C17000) – – – 1.6–1.79 – – Cu > 99.5 Co + Ni > .2 Co + Fe + Ni < .6
UK CB101 (CW101C) – – – 1.7–1 9 – – Ni + Co .05–.4 Other < .5
G CuBe1.7Wk. 2.1245
41003 USA CDA 172 (UNS C17200) – – – 1.8–2.0 – – Cu > 99.5 Co + Ni > .2 Co + Fe + Ni < .6
G Cu Co Be Wk. 2.1285 Co + Fe + Ni < .6
41004 USA CDA194 (UNS C19400) .05–.2 – <.03 – 2.1–2.6 – P .015–.15 Cu 97.0–97.8 others < .15
ASTM B465
41005 USA CDA 195 (UNS C19500) <2 .1–1.0 <.02 – 1.0–2.0 <.02 P .01–.35 Co .3–1.3
41006 USA CDA 230 (UNS C23000) Balance – <.05 – <.03 – Cu 84.0–86.0
ASTM B36: B43: B111:
B134: B135:
B359: B395: B543: B587
UK CZ102 (CW502L) Balance – <.l – <.1 – Cu 84.0–86.0 other < .4
G DIN 17660 DIN 17670 Balance <.05 <.05 – <.05 <.02 Cu 84.0–86.0 Mn < .05 Ni < .2 Sb < .01 other .05
Wk. 2.0240 total other (except Ni) .3
F NFU-Z15 15 Nominal comp.
41007 USA CDA 260 (UNS C26000) Balance – <.07 – <.05 – Cu 68.5–71.5
UK CZ106 (CW505L) Balance – <.05 – <.05 – Cu 68.5–71.5 other < .3
F UZ-30
G DIN 17660 Cu Zu 30 Wk. Balance <.05 <.05 – <.05 <.02 Cu 69.0–71.0 Ni < .2 Sb < .01 other .05 total other
2.0265 (except Ni) .3
41008 USA CDA 353 (UNS C35300) Balance – 1.3–2.3 – <1 – Cu 59.0–64.5
UK CZ119 (CW601 N) Balance – 1.0–2.5 – – – Cu 61.0–64.0
G DIN 17660 CuZu 36 Pb Balance <.1 .7–2.5 – <.2 <.05 Cu 62.0 –64.0 Mn < .1 Ni < .3 5b < .01 others total .1.
1.5 Wk. 2.0331 Any other except Ni < .5
41009 USA CDA 422 (UNS C42200) Balance .8–1.4 <.05 – <.05 – Cu 86.0–89.0 P < .35
ASTM B591
41010 USA CDA 443 (UNS C44300) Balance .9–1.2 <.07 – <.06 – Cu 70.0–73.0 As .01–.1
ASTM B111: B171:
B359: B395:
B432: B543
(continued)
604 Appendix 6: Metal Alloy Comparison Tables

(continued)
Composition
Country Designation Zn Sn Pb Be Fe Al Other
G DIN 17660 CuZn 28 Sn .9–1.3 <.07 – <.07 – Cu 70.0–72.5 As .02–.035 Mn < .1 Ni < .1 P < .01
Wk. 2.0470 As + P < .035 other total < .1
41011 USA CDA 510 (UNS C51000) <.3 4.2–5.8 <.05 – <1 – Cu + Sn + P > 99.5 P 03–.35
ASTM B100: B103:
BI39: BI59
UK PB102 (CW451 K) – 4.5–6.0 <.02 – – – P .02–.4 others < .2
F NF U-E5P – – – – – – –
G DIN 17662 CuSn 6 Wk. <.3 5.5–7.5 <.05 – <.1 – P .01–.4 Ni < .3 other < .2
2.1020

Alloy equivalents—Copper Alloys


Composition
Country Designation Zn Sn Pb Be Fe Al Other
41012 USA CDA 521 (UNS C52100) ASTM <.2 7.0–9.0 <.05 – <1 – Cu + Sn + P > 99.5 P 03–.35
139:159
UK PB103 (CW452 K) – 6.0–7.5 <.02 – – – P .02–.4 others < .2
UK PB104 (CW459 K) – 7.5–9.0 <.02 – – – P .02–.4 others < .2
F NF U-E7P
G DIN 17662 Cu Sn 8 Wk. 2.1030 <.3 7.5–9.0 <.05 – <.1 – P .01–.4 Ni < .3 other together < .2
41013 USA CDA 619 (UNS C61900) <.8 <.6 <.02 – 3.0–4.5 8.5–10.0 Cu + Ag 83.6–88.5
Cu + Fe + AI > 99.5
ASTM B129: B150: B283
UK CA103 <.4 <1 <.05 – Fe + Ni < 4.0 8.8–10.0 Mn < .5 Mg < .05 total impurities
not Mn < .5
F NF U-A8
G DIN 17665 Cu Al 8 Wk. 2.0920 <.5 – <.02 – <.5 7.0–9.0 Mn < .8 Ni < .8 Si < .2 other
total < .3
41014 USA CDA 687 (UNS C68700) Balance – <.07 – <.06 1.8–2.5 Cu + Ag 76.0–79.0 As .02–.06
ASTM B111: SB359: SB395:
SB543
UK CZ110 (CW702R) Balance – <.07 – <.06 1.8–2.3 Cu 76.0–78.0 As .02–.06
G DIN 17660 Cu Zn 20 Al Wk. 2.0460 Balance – <.07 – <.07 1.8–2.3 Cu 76.0–79.0 As .02–.035 Mn < .1
Ni < .1 P < .01 As + P < .035 other
together < .1
41015 USA CDA688 (UNS C68800) ASTM 21.3–24.1 – <.05 – <.05 3.0–3.8 Co .25–.55
B592
41016 USA CDA 706 (UNS C70600) <1.0 – <.05 – 1.0–1.8 – Ni 9.0–11.0 Mn < 1.0
Cu + Ag > 86.5
Cu + Fe + Ni > 99.5
ASTM B111: B122: B151: B171:
B359: B395: B402:B432: B466:
B467: B543: B552
UK CN102 (CW352H) – – <.01 – 1.0–2.0 – Ni 10.0–11.0 Mn .5 1.0 S < .05
total impurities < .3 C < .05
F NF Cu Ni 10 Fe Mn – – – – * – Ni 10.0 + Fe + Mn, nominal comp.
G DIN 17664 Cu Ni 10 Fe Wk. 2.0872 <.5 – <.03 – 1.0–1.8 – Ni 9.0–11.0 Mn 0.5–1.0 S < .05
total other < .1
41017 USA CDA 725 (UNS C72500) <.5 1.8–2.8 <.05 – <.6 – Ni 8.5–10.5 Mn < .2
Cu + Ni + Sn + Co > 99.8
41018 USA CDA 762 (UNS C76200) ASTM Balance – <.1 – <.25 – Ni 11.0–13.5 Mn < .5 Cu 57.0–61.0
B122
UK NS104 (CW403 J) Balance – <.04 – <.25 – Ni 11.0–13.0 Mn .05–.3 Cu 60.0-
65.0 total Impurities < .5
G DIN 17663 Cn Ni 12Zn 24 Balance <.2 <.05 – <.3 – Ni 11.0 13.0 Mn < .5 Cu 63.0–66.0
other together < .1
(continued)
Appendix 6: Metal Alloy Comparison Tables 605

(continued)
Composition
Country Designation Zn Sn Pb Be Fe Al Other
41019 USA CDA 766 (UNS C76600) FEDQQ- Balance – <.1 – <.25 – Ni 11.0–13.5 Mn < .5 Cu 55.0–58.0
C-585
41020 USA CDA 770 (UNS C77000) Balance – <.l – <.25 – Ni 16.5–19.5 Mn < .5 Cn 53.5–56.5
ASTM B122: B151: B206
UK NS107 (CW410 J) Balance – <.03 – <.3 – Ni 17.0–19.0 Mn .05–.35 Cu
54.0–56.0
G DIN 17663 Cu Ni 18 Zn 27 Wk. Balance <.2 <.03 – <.3 – Ni 17.0–19.0 Mn < .7 Cu 60.0–63.0
2.0740
41021 USA CDA 782 (UNS C78200) Balance – 1.5–2.5 – <.35 – Ni 7.0–9.0 Mn < .5 Cu 63.0–67.0
UK NS101 (CW402 J) Balance – 1.0–2.5 – <.4 – Ni 9.0–11.0 Mn .2–.5 Cu 44.0–47.0
G DIN 17663 Cu Ni 10Zn 42 Pb Balance <.3 .5–2.0 – <.5 – Ni 9.0–11.0 Mn < .5 Cu 45.0–48.0
others total < .1

Alloy equivalents—Magnesium Alloys


Composition
Country Designation Al Zn Mn Other
61001 USA M1A ASTM B107, B275; SAE 51, 522, 533 – – >1.2 Si < .1 Cu < .05 Ni < .01 Ca < .3
(UNS M15100) other < .3
UK 1428:7378 – – – –
G W3501 DIN 1729 Wk. 3.5200 <.05 <.03 1.2–2.0 Si < 1 Cu < 05 Fe < .005 others < .1
61002 USA LA141 ASTM B270; MIL SPEC M-46130 <.05 – 1.5 Cu < .05 Fe < .005 Li 12.0–15.0
(UNS M14142) Ni < .005 Si .5–.6 Na < .005
61003 USA AZ31B ASTM B107, B273; FED QQ-M-31, 2.3–3.5 .6–1.4 >.2 Si < .1 Cu < .03 Ni < .005 Fe < .003
M-40, M44, WW-T-825 (UNS M11311) Ca < .04 other < .3
UK BS 3370-MAG-S-111; BS 3373-MAG-E-111; 2.5–3.5 .6–1.4 .15–.7 Ca < .3 Si < .3 Cu .05 Ni < .005
DTD 742 Fe < .005
G DIN 1729 Mg Al 3 Zn Wk. 3.5312 2.5–3.5 .5–1.5 .15–.4 Si < .1 Cu < .1 Fe < .003 Ni < .005
Ca < .04 other < .1
61004 USA ZK60A ASTM B91, B107, B275; FED QQ- – 4.8–6.2 – Zr > .45 others < .3
M-31, M-40, WW-T-825 (UNS M16600)
USA ZK61A ASTM B403 6.0 Zr .8 nominal comp.
UK BS 3373-MAG-E-161 5.0 Zr .6 nominal comp.
UK DTD 5041A 5.5 Zr .7 nominal comp.
F G-Z 5 Zr <.02 3.5–5.5 <.15 Zr .4–1.0 Cu < .03 Si < .01
Fe < .01 N < 001
G Dl N 1729 Mg Zn 6Zr Wk. 3.5161 4.8–6.2 Zr .45–.8 others < .3
61005 USA AZ61A ASTM B91, B107, B275; FED QQ- 5.8–7.2 .4–1.5 .15 Si < .1 Cu < .05 Ni < .005 Fe < .005
M-31, M40, WW-T-825 (UNS M11610) other < .3
UK DTD 259A 5.5–8.5 <1.5 .2–.4 Si < .1 Cu < .1 Ni < .005 Fe < .03
F G-A 7 Z1 6.5–8.5 .5–1.5 >.12 Si < .3 Cu < .05 Ni < .005 Fe < .007
others < .3
G DIN 1729 Mg AI6Zn Wk. 3.5612 5.5–7.0 .5–1.5 .15–.4 Si < .1 Cu < .1 Ni < .005 Fe < .03
others < .1
61006 USA AZ80A ASTM B91, B107, B275; FED.QQ- 7.8–9.2 .2–.8 >.12 Si < .1 Cu < .05 Ni < .005 Fe < .005
M-31, M-40 (UNS M11800) other < .3
UK BS 2L121; BS 2L122 7.5–9.0 .3–1.0 .15–.4 Si < .3 Cu < .15 Ni < .01 Fe < .05
Sn < .1 Cu + Si + Fe + Ni < .4
F G-A 7 Z1 See
AZ61A
G DIN 1729 Mg Al 8 Zn Wk. 3.5812 7.8–9.2 .2–.8 .12–.3 Si < .1 Cu < .05 Ni < .003 other < .3
61007 USA LAZ933—Ballette Mem. Institute 3.0 3.0 – Li 9.0, nominal comp.
61008 USA ZK21A 2.3 Zr .45 nominal comp.
UK BS 3373-MAG-E-151, BS 3374-MAG-P-151, 3.0 Zr .6 nominal comp.
ZW3
61009 UK RZ5—Magnesium Elektron 4.0 Zr .7 rare earth 1.2 nominal comp.
606 Appendix 6: Metal Alloy Comparison Tables

Alloy equivalents—Miscellaneous Alloys


Country Designation Composition
71001 USA Beryllium S-100C QMV Grade. Brush BeO 1.2, Be 98.5
Beryllium Corp.
71002 USA Beryllium S-200C QMV Grade. Brush BeO 2.0, Be 98.0
Beryllium Corp.
Beryllium SR-200 QMV Grade. Brush BeO 2.0, Be 98.0 Hot rolled sheet
Beryllium Corp.
71003 USA Beryllium S-300C QMV Grade. Brush BeO 3.0, Be 97.4
Beryllium Corp.
71004 USA MP35N Multiphase (UNS R30035) C < .025, Cr 19–21.0, Mo 9–10.5, Ni 33–37, Fe < 1.0, Mn < .15, P < .015, S < .01, Si < .15,
Ti < 1.0, Co balance
71005 USA HS25; L-605; Haynes 25 C .05–.15, Cr 19.0–21.0, Ni 9.0–11.0, W 14.0–16.0, Fe < 3.0, Co balance
UK BS 3531/1-4 C .1, Cr 20, Ni 10, W 15, Co balance. Nominal comp.
G Co Cr20 W 15 Ni Wk. 2.4967 C .05–.13, Cr 19.0–21.0, Ni 9.0–11.0, W 14.0–16.0, Fe < 3.0, Si < 1.0, Mn 1.0–2.0, P < .045,
S < .03, Co balance
71006 USA HS188—Haynes Alloy (UNS R30188) C .05–.15, Cr 20–24, Ni 20–24, W 13–16, Fe < 3.0, Mn < 1.25, La .03–.15, Si .2–.5, Co
balance.

References for Alloy Equivalents ICS: 49—Aéronautique et Espace

‘Work Programme 1995’


BSI Catalogue 1995/96. CEN—European Committee for Standardization, Brussels.
British Standards Institution ISBN: 92-9097-432-X
‘Iron and Steel Specifications’, 8th Edition. MIL-HDBK-5 J: Metallic Materials and Elements for
British Iron and Steel Producers Association, December Aerospace Vehicle Structures, Vols. 1 and 2.
1994. Department of Defense, USA. 2003
‘Unified Numbering System’, 4th Edition. ‘Metallic Materials Specification Handbook’, 4th Edition
SAE/ASTM 1986 Robert B. Ross
Chapman & Hall, 1992, ISBN: 0-412-36940-0
Stahlschüssel, 1977.
‘Properties of Aluminium and its Alloys’ ‘Smithells Metals Reference Book’, 8th Edition.
Aluminium Federation, 2002 2002, Butterworth-Heinemann
‘Buyers Guide to progress on European Standards’ ECSS Q-ST-70-71: Data for the Selection of Space
Aluminium Federation, UK. February 1996 Materials.
AFNOR Catalogue, 1996
ICS: 77—Métallurgie
Appendix 6: Metal Alloy Comparison Tables 607

Alloy equivalents—Titanium Alloys


Composition
Country Designation Al V Cr Other
51001 USA CP Ti (UNS R52250) ASTM B265 C 0.1: H 0.01: Fe 0.2, Commercial
purity Titanium
UK BS TA1: IMI 115: Ti 115: H 0.012: Fe 0.2, Commercial purity
Titanium
F AFNOR T35
G Wk. 3.7024
51002 USA 3AI-2.5V (UNS R56320) 2.5–3.5 2.0–3.0 – C < .05: H < .013: Fe < .25: N < .02
AMS 4943.4944 ASTM B337 O < .12 Ti Balance
51003 USA 6AI-4V (UNS R56401) 5.5–6.75 3.5–4.5 – C < .1: H < .015: Fe < .4: N < .05
O < .2 Ti Balance
AMS 4906: 4911: 4934, 4935:
4954:4965:4967
ASTM B265, B348: B367: B381:
AWS A5-16
MIL. SPEC. F83142: T9046: T9047:
T81556: T81915
UK BS TA56: 2TA10: 2TA13: 2TA28: 5.5–6.75 3.5–4.5 – H < .025: Fe < .3: O + N < .25 Ti
Balance
IMI318: Ti 318A
UK DTD5163: 5173: 5303: 5313: 5323 6.1 4.0 – H < .012 nominal comp.
F TA6V 6.0 4.0 – Nominal comp.
G Ti Al 6V 4 Wk. 3.7164 6.0 4.0 – Nominal comp.
AECMA TI-P63
CEN EN 2517PR (TI-P63 alloy: annealed—sheet, strip and plate, a ≤ 100 mm—provisional spec.)
EN 2530PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bars, d ≤ 100 mm—provisional spec.)
EN 2531 PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—forgings, d ≤ 100 mm—provisional spec.)
EN 3310PR (TI-P63 alloy: not heat treated—reference heat treatment—annealed—grade 2 forging stocks, d ≤ 360 mm
—provisional spec.)
EN 3311 PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bar for machining, d ≤ 150 mm—provisional
spec.)
EN 3312PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—forgings, d ≤ 150 mm—provisional spec.)
EN 3313PR (TI-P63 alloy: not heat treated- reference heat treatment—solution treated and aged—grade 2 forging
stocks, d ≤ 360 mm—provisional spec.)
EN 3314PR (TI-P63 alloy: solution treated and aged—RM > = 1070 MPa—bar for machining, d ≤ 50 mm—provisional
spec.)
EN 3315PR (TI-P63 alloy: solution treated and aged—RM > = 1070 MPa—forgings, d < = 50 mm—provisional spec.)
EN 3456PR (TI-P63 alloy: annealed—920 MPa ≤ RM ≤ 1180 MPa—sheet and strip, a ≤ 6 mm—provisional spec.)
EN 3457PR (TI-P63 alloy: not heat treated—reference heat treatment—solution treated and aged—grade 2 forging
stock for fasteners, d ≤ 25 mm—provisional spec.)
EN 3458PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bar and wire for machined fasteners, d ≤ 25 mm
—provisional spec.)
EN 3464PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—plate, 6 mm ≤ a ≤ 100 mm—provisional spec.)
51004 USA 13V-11Cr-3AI (UNS R58010) 2.5–4.0 12.5–14.5 10–12 Fe < 0.35: C 0.05–0.1
AMS4917:4959
AWS A5 MIL SPEC. F-83142: T-
9046: T-9047: T-81588
51005 UK IMI 685 6.0 Zr 5.0: Mo 0.5: Si 0.5, nominal comp.
51006 UK IMI 829 5.5 Sn 3.5: Zr 3.0: Nb 1.0: Mo 0.3: Si
0.3, nominal comp.
608 Appendix 6: Metal Alloy Comparison Tables

UNS No. Table No. (continued)


Carbon steels and alloy steels UNS No. Table No.
G10050 11001 G11170 13005
G10060 11002 G11180 13006
G10080 11003 G11190 13007
G10100 11004 G11320 13008
G10110 11005 G11370 13009
G10120 11006 G11390 13010
G10150 11007 G11400 13011
G10160 11008 G11410 13012
G10170 11009 G11440 13013
G10180 11010 G11450 13014
G10190 11011 G11460 13015
G10200 11012 G12134 13016
G10210 11013 G12144 13017
G10220 11014 G15130 12001
G10230 11015 G15180 12002
G10250 11016 G15220 12003
G10260 11017 G15240 12004
G10290 11018 G15250 12005
G10300 11019 G15260 12006
G10350 11020 G15270 12007
G10370 11021 G15360 12008
G10380 11022 G15410 12009
G10390 11023 G15470 12010
G10400 11024 G15480 12011
G10420 11025 G15510 12012
G10430 11026 G15520 12013
G10450 11027 G15610 12014
G10460 11028 G15660 12015
G10490 11029 G15720 12016
G10500 11030 Low alloy steels
G10530 11031 G40120 14001
G10550 11032 G40230 14002
G10600 11033 G40240 14003
G10640 11034 G40270 14004
G10650 11035 G40280 14005
G10690 11036 G40320 14006
G10700 11037 G40370 14007
G10740 11038 G40420 14008
G10750 11039 G40470 14009
G10780 11040 G41180 14010
G10800 11041 G41300 14011
G10840 11042 G41350 14012
G10850 11043 G41370 14013
G10860 11044 G41400 14014
G10900 11045 G41420 14015
G10950 11046 G41450 14016
G11080 13001 G41470 14017
G11090 13002 G41500 14018
G11100 13003 G41610 14019
G11160 13004 G43200 14020
(continued) (continued)
Appendix 6: Metal Alloy Comparison Tables 609

(continued) (continued)
UNS No. Table No. UNS No. Table No.
G43400 14021 S30900 15012
G46150 14039 S31000 15013
G46170 14040 S31008 15014
G46200 14041 S31400 15015
G46210 14042 S31600 15016
G46260 14043 S31603 15017
G47180 14022 S31700 15018
G47200 14023 S32100 15019
G51150 14044 S34700 15020
G51200 14045 S34800 15021
G51300 14046 S38400 15022
G51320 14047 S40300 15023
G51350 14048 S40500 15024
G51400 14049 S41000 15025
G51450 14050 S41400 15026
G51470 14051 S41600 15027
G51500 14052 S41623 15028
G51550 14053 S42000 15029
G51600 14054 S42020 15030
G51986 14055 S42900 15031
G52986 14056 S43000 15032
G61180 14057 S43020 15033
G61500 14058 S43023 15034
G81150 14024 S43100 15035
G86150 14025 S43400 15036
G86170 14026 S43600 15037
G86200 14027 S44002 15038
G86220 14028 S44003 15039
G86250 14029 S44004 15040
G86270 14030 S44200 15041
G86300 14031 S44600 15042
G86370 14032 S50100 15043
G86400 14033 S50200 15044
G86420 14034 Named steels
G86450 14035 J42015 16002
G86500 14036 J92200 16013
G86550 14037 K08500 16001
G86600 14038 K66286 16004
Stainless steels K92820 16015
S20100 15001 K92940 16016
S20200 15002 K93160 16017
S30100 15003 N08020 16003
S30200 15004 S13800 16014
S30215 15005 S14800 16009
S30300 15006 S15500 16008
S30323 15007 S15700 16010
S30400 15008 S17700 16011
S30403 15009 S21900 16018
S30500 15010 S35000 16005
S30800 15011 S35500 16006
(continued) (continued)
610 Appendix 6: Metal Alloy Comparison Tables

(continued) (continued)
UNS No. Table No. UNS No. Table No.
S36200 16019 A95154 31041
S45500 16007 A95252 31043
T20811 16012 A95254 31044
Nickel alloys A95356 31045
N05500 21012 A95454 31046
N06002 21002 A95456 31047
N06600 21008 A95457 31048
N06625 21009 A95652 31049
N07001 21016 A95657 31050
N07041 21014 A96003 31051
N07718 21010 A96005 31052
N07750 21011 A96053 31053
N08800 21003 A96061 31054
N09901 21004 A96063 31055
N09902 21013 A96066 31056
N10002 21001 A96070 31057
N19903 21005 A96082 31059
N19907 21006 A96101 31060
N19909 21007 A96151 31061
Aluminium alloys (wrought) A96162 31062
A91050 31001 A96201 31063
A91060 31002 A96253 31064
A91100 31003 A96262 31065
A91145 31004 A96351 31066
A91175 31005 A96463 31067
A91200 31006 A96951 31068
A91230 31007 A97001 31069
A91235 31008 A97009 31070
A91345 31009 A97039 31073
A91350 31010 A97049 31074
A92011 31015 A97050 31075
A92014 31016 A97075 31076
A92017 31017 A97079 31077
A92024 31018 A97175 31078
A92048 31019 A97178 31079
A92124 31023 Aluminium alloys (cast)
A92219 31026 A02950 32001
A93003 31029 A03190 32003
A93004 31030 A03330 32005
A93005 31031 A03550 32007
A93103 31032 A03560 32009
A93105 31033 A03570 32011
A94032 31034 A03590 32013
A95005 31035 A03800 32014
A95050 31036 A05140 32016
A95050 31042 A05180 32017
A95052 31037 A05200 32018
A95056 31038 A05350 32019
A95083 31039 A07070 32020
A95086 31040 A07120 32021
(continued) (continued)
Appendix 6: Metal Alloy Comparison Tables 611

(continued) (continued)
UNS No. Table No. UNS No. Table No.
A33550 32008 C76200 41018
Copper alloys C76600 41019
C11000 41001 C77000 41020
C17000 41002 C78200 41021
C17200 41003 Titanium alloys
C19400 41004 R52250 51001
C19500 41005 R56320 51002
C23000 41006 R56401 51003
C26000 41007 R58010 51004
C35300 41008 Magnesium alloys
C42200 41009 M11311 61003
C44300 41010 M11610 61005
C51000 41011 M11800 61006
C52100 41012 M14142 61002
C61900 41013 M15100 61001
C68700 41014 M16600 61004
C68800 41015 Miscellaneous alloys
C70600 41016 R30035 71004
C72500 41017 R30188 71006
(continued)
Appendix 7: Variation of Standard Free Energy
of Formation of Oxides with Temperature

These are graphs showing how free energy values vary with and Fe3O4 are more stable than NiO, and that the oxide
temperature. The network is based on work by Ellingham Fe2O4 are more stable than NiO, and that the oxide Fe2O3 is
and Richardson in the 1940s and 1950s and is still very the least stable of all.
useful today (see for instance Ellingham, H.J.T. (1944) Reduced pressures will enhance most reducing reactions
J. Soc. Chem. Ind., 63, 125–133). The diagram indicates at as will increasing the ratio of hydrogen or carbon monoxide
any temperature what is thermodynamically possible for present in a gaseous mixture—these effects can also be
metallurgical reactions that are based on either thermal estimated from intersection points. The techniques are
reduction processes or thermal oxidation processes. described in books such as Metallurgical Thermochemistry,
At the point of intersection of any two curves the standard 6th Edition, (1993) by O. Kubaschewski, C. Alcock and P.
free energy for the chemical reaction is zero and this is the J. Spencer, (Pergamon, Oxford) and Free Energy of For-
point of equilibrium. The diagram can be used to show mation of Binary Compounds (1971), by T.B. Reed (MIT
approximately whether reduction or oxidation will take Press, London).
place. It is important to note that the Ellingham diagrams relate
As an example, below a temperature of about 1600 °C, to the equilibrium conditions—they take no account of the
pure magnesium is expected to reduce aluminium oxide. At kinetics of any oxidation or reduction reaction.
temperatures higher than 1600 °C, when the curve for For alloys, it is worth noting that the most easily oxidized
magnesium oxide is above that of aluminium oxide, one constituent should be considered when consulting the dia-
would expect that pure aluminium would reduce magnesium gram. It is usual to discount elements that have a concen-
oxide to metallic magnesium. The approximate temperatures tration less than about 1 % as they are not able to form
when gases such as carbon monoxide might reduce metal continuous surface films.
oxides can, in a similar way, be deduced from the various A recent, short but very useful article—Ellingham dia-
points of graph intersections. grams, their Use and Misuse—takes account of several case
It is possible to determine the partial pressure of oxygen examples where diagrams can be used for trouble shooting
in equilibrium at a given temperature with the couples Fe/ during processes such as heat treatment, brazing and bright
FeO, Fe/Fe3O4, Ni/NiO, and the like. The diagrams shows annealing (Stratton 2013).
that up to very high temperatures (>1500 °C) the oxides FeO

© Springer International Publishing Switzerland 2016 613


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
614 Appendix 7: Variation of Standard Free Energy of Formation of Oxides with Temperature

Based on a diagram supplied by the British Iron and Steel Research Association
Appendix 8: Simplied Procedure
for the Management of Materials, Processes
and Mechanical Parts—Possible Guidelines
for a Cubesat or Small University Spacecraft

Flow Chart for M,P and MP Lists

Company Structure Exists

Responsible for company Product Assurance:

Responsible for Materials and Process, Plus Mechanical Parts (eg Materials Manager):

Responsible for Design and Verification:


Selection

Evaluation:
Critical
Verification of Processes
Yes Reject
Criticality Evaluation Validation of Materials
Analysis Necessary Qualification of Mechanical Parts New Selection

No
No
Non - Critical
Reject New Test or
Evaluation:
Request for
Verification by Test Results
Accept Deviation
Similarity
Yes
Accept

Accept

Add Material, Process or Mechanical Part to:


DML, DPL, DMPL

Declared Material List Declared Process List Declared Mech. Parts List

© Springer International Publishing Switzerland 2016 615


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
616 Appendix 8: Simplified Procedure for the Management of Materials, Processes and Mechanical Parts …

Processing parameter (e.g. heat-treatment for metals


Management of Lists (see Flow Chart)
and mix ratio/curing time/temp for organic)
Use and end location
1. List should be initiated and maintained during the life of
Any test date (reference to reports, literature, etc.)
the project by the Material and Processes (M&P)
Last column is for Approval by M&P specialist and
Manager.
projeet manager who gives final approval.
2. Inputs mainly from Design Manager (e.g. engineering
(d) All acronyms need to be defined
drawings).
(e) Items with a limited life such as two part adhesives,
3. Lists need to be reviewed at PDR (they will be incom-
paints, etc. must be identified under processing
plete but may identity critical items) and again at CDR.
parameter.
4. SuitabiIity of the items on the 3 Iists should be assessed
by an independent material and process specialist.
5. Technical criteria for the selection of material will
include:
Evaluation, Procurement, Inspection,
(a) Effect of temperature and thermal cycling
Traceability, and Storage
(b) Effect of vacuum (outgassing of organic materials and
sublimation of metaIs such as cadmium (forbidden))
Evaluation
(c) Effect of radiation (not generally an issue except for
Some materials may need to be evaluated for outgassing.
solar cell cover glasses, white paints)
(d) Corrosion and galvanic compatibility (i.e. high Procurement
strength aIuminium alloys need a chemical conver- Some materials have long lead times (versus the project
sion coating that enabIes resistace to surface corro- schedule); these need to be identified before PDR.
sion prior to launch and electrical grounding between Inspection
electronic boxes and structure). Inspection is needed at “in-coming” to ensure suitability,
check materials are “in-life”, damage to surface, castings
Note:PDR—preliminary design review (usually an in- may need to be x-rayed etc.
depth assessment, by an interdependent team of discipline
experts and managers, that the design and materials/pro- Traceability
cesses are realistic); CDR—critical design review (to ensure When possible each material and batch should have a
the spacecraft's designed hardware is ready for launch). unique reference number.
Storage
Good controls needed regarding: humidity, cleanliness,
Lay-Out of Lists (see also Appendices 10 refrigeration for certain items, health and safety (regarding
and 11 for examples) toxic materials), flammable materials.

(a) These can be formatted prior to PDR and Materials are


grouped according to Table 7.A.1
(b) All lists need issue status for configuration control Mechanical Parts and Process Controls
(c) Columns will provide—Unique Item number
Material designation (e.g. commercial or recognisable • The DPL and DMPL will need to be designed in a similar
identification) manner to the DML.
International code, e.g. AISI, AA, CDA, etc. (for • Exact requirements for DPL and DMPL should be agreed
instance as listed in Appendix 6) with the M and P specialist.
Manufacturers name • The DMPL needs to list all mechanisms—each should be
Surface finish assessed by the M and P specialist (e.g. that lubricating
Appendix 8: Simplified Procedure for the Management of Materials, Processes and Mechanical Parts … 617

Table 7.A.1 Material group numbers


Group Description Processes—Controls and Possible
number Assessment for Quality
1 Aluminium and aluminium alloys
2 Copper and copper alloys It would be beneficial to review all spacecraft systems and
3 Nickel and nickel alloys sub-systems with a mind to check if suitable controls are
4 Titanium and titanium alloys being made, and whether some minimal verification of
5 Steels unusual processes should be Verified:
6 Stainless steels
7 Filler metals: welding, brazing soldering – Structure, mechanical assembly or welding process,
8 Miscellaneous metallic materials simple corrosion protection
9 Optical materials – Black boxes, manufacture, painting, grounding
10 Adhesives, coatings, vamishes – Harness, crimping to ECSS standard?, wire type (silver
11 Adhesives tapes or tin-plated?)
12 Paints an inks – General welding (are materials suitable), bonding,
13 Lubricants painting
14 Potting compounds, sealants, foams – Pcb assembly methods, repair, controls (ECSS standard?)
15 Reinforced plastics (including PCBs) – Make an attempt to list processes and critical ones may
16 Rubbers and elastomers need laboratory testing on in-line samples.
17 Thermoplastics [e.g non-adhesive tapes and folls
(MLI)]
18 Thermoset plastics (including PCBs)
19 Materials aspects of wires and cables
Need for Access to Space Materials
20 Miscellaneous non-metallic materials, e.g ceramics
Laboratory to Assess Quality
From ECSS Q-ST-70B
and Suitability for Use in Vacuum

greases and oils to not outgas and contaminate optical – Microsectioning of welded and crimped joints*
systems, that rotating parts in vacuum do not cold-weld – Tensile testing of welds and crimps*
etc.). – NDT occasionally for welds*
• The DPL should also be reviewed and possibly com- – Outgassing tests to ECSS standard (can be done at ded-
piled by the M and P specialist to ascertain if each icated European labs), needed for a few organic materials
process can be considered “non- critical” or “critical” (glues, paints, etc.) in vicinity of optical systems (line of
based on previous usage, reliability, inspect ability, sight to consider condensation). Some laboratories
possibility to re-work in case of human or material offering testing for outgassing are mentioned on page 40.
errors (Table 7.A.1).
*Note—could use local university or industry
Appendix 9: Materials and Processes Standards
Related to Space (Released by ECSS, JAXA and
NASA) as of 2015

ECSS-Q-ST-70-02C Thermal vacuum outgassing test for


the screening of space materials
ECSS-Q-ST-10-04C Critical-item control ECSS-Q-ST-70-03C Black-anodizing of metals with inor-
ECSS-Q-ST-10-09C Nonconformance control system ganic dyes
ECSS-Q-ST-20C Rev.1 Quality assurance ECSS-Q-ST-70-04C Thermal testing for the evaluation of
ECSS-Q-ST-20- Quality and safety assurance for space test space materials, processes, mechanical parts and assemblies
centres ECSS-Q-ST-70-05C Detection of organic contamination
ECSS-Q-ST-20-08C Storage, handling and transportation surfaces by infrared spectroscopy
of spacecraft hardware ECSS-Q-ST-70-06C Particle and UV radiation testing for
ECSS-Q-ST-20-10C Off-the-shelf items utilization in space space materials
systems ECSS-Q-ST-70-07C Verification and approval of automatic
ECSS-Q-ST-30 C Dependability machine wave soldering
ECSS-Q-ST-30-02C Failure modes, effects (and criticality) ECSS-Q-ST-70-08C Manual soldering of high-reliability
analysis (FMEA/FMECA) electrical connections
ECSS-Q-ST-30-09C Availability analysis ECSS-Q-ST-70-09C Measurements of thermo-optical
ECSS-Q-ST-30-11C Rev.1 Derating—EEE components properties of thermal control materials
ECSS-Q-ST-40C Safety ECSS-Q-ST-70-10C Qualification of printed circuit boards
ECSS-Q-ST-40-02C Hazard analysis ECSS-Q-ST-70-11C Procurement of printed circuit boards
ECSS-Q-ST-40-12C Fault tree analysis—Adoption notice ECSS-Q-ST-70-12C Design rules for printed circuit boards
ECSS/IEC 61025 ECSS-Q-ST-70-13C Rev.1 Measurements of the peel and
ECSS-Q-ST-60 C Rev.2 Electrical, electronic and elec- pull-off strength of coatings and finishes using pressure-
tromechanical (EEE) components sensitive tapes
ECSS-Q-ST-60-02C ASIC and FPGA development ECSS-Q-ST-70-18C Preparation, assembly and mounting
ECSS-Q-ST-60-05C Rev.1 Generic procurement require- of RF coaxial cables
ments for hybrids ECSS-Q-ST-70-20C Determination of the susceptibility of
ECSS-Q-ST-60-12C Design, selection, procurement and silver-plated copper wire and cable to "red-plague"
use of die form monolithic microwave integrated circuits corrosion
(MMICs) ECSS-Q-ST-70-21C Flammability testing for the screening
ECSS-Q-ST-60-13C Commercial electrical, electronic and of space materials
electromechanical (EEE) components ECSS-Q-ST-70-22C Control of limited shelf-life materials
ECSS-Q-ST-60-14C Re-lifing procedure—EEE ECSS-Q-ST-70-26C Crimping of high-reliability electrical
components connections
ECSS-Q-ST-60-15C Radiation hardness assurance—EEE ECSS-Q-ST-70-28C Repair and modification of printed
components circuit board assemblies for space use
ECSS-Q-ST-70C Rev.1 Materials, mechanical parts and ECSS-Q-ST-70-29C Determination of offgassing products
processes from materials and assembled articles to be used in a
ECSS-Q-ST-70-01C Cleanliness and contamination control manned space vehicle crew compartment

© Springer International Publishing Switzerland 2016 619


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
620 Appendix 9: Materials and Processes Standards Related to Space (Released by ECSS, JAXA and NASA) as of 2015

ECSS-Q-ST-70-30C Wire wrapping of high-reliability NASA-HDBK-8739.23 NASA complex electronics hand-


electrical connections book for assurance professionals
ECSS-Q-ST-70-31C Application of paints and coatings on NASA-STD-4003 ELECTRICAL BONDING FOR NASA
space hardware LAUNCH VEHICLES, SPACECRAFT, PAYLOADS,
ECSS-Q-ST-70-36C Material selection for controlling AND FLIGHT EQUIPMENT
stress-corrosion cracking NASA-STD-5001 structural design and test factors of safety
ECSS-Q-ST-70-37C Determination of the susceptibility of for spaceflight hardware
metals to stress-corrosion cracking NASA-STD-5002 Load analyses of spacecraft and payloads
ECSS-Q-ST-70-38C High-reliability soldering for surface- NASA-STD-5005 Standard for the design and fabrication of
mount and mixed technology ground support equipment
ECSS-Q-ST-70-45C Mechanical testing of metallic NASA-STD-5006 General fusion welding requirements for
materials aerospace materials used in flight hardware
ECSS-Q-ST-70-46C Rev.1 Requirements for manufacturing NASA-STD-5008 Protective coating of carbon steel, stain-
and procurement of threaded fasteners less steel, and aluminum on launch structures, facilities, and
ECSS-Q-ST-70-50C Particles contamination monitoring for ground support equipment
spacecraft systems and cleanrooms NASA-STD-5009 Nondestructive evaluation requirements
ECSS-Q-ST-70-53C Materials and hardware compatibility for fracture critical metallic components
tests for sterilization processes NASA-STD-5019 Fracture control requirements for space-
ECSS-Q-ST-70-55C Microbial examination of flight hard- flight hardware
ware and cleanrooms NASA-STD-5020 Requirements for threaded fastening
ECSS-Q-ST-70-56C Vapour phase bioburden reduction for systems in spaceflight hardware
flight hardware NASA-STD-6001 Flammability, offgassing, and compati-
ECSS-Q-ST-70-57C Dry heat bioburden reduction for flight bility requirements and test procedures
hardware NASA-STD-6008 NASA Fastener procurement, receiving
ECSS-Q-ST-70-58C Bioburden control of cleanrooms inspection, and storage practices for spaceflight hardware
ECSS-Q-ST-70-71C Materials, processes and their data NASA-STD-6012 Corrosion protection for space flight
selection hardware
ECSS-Q-ST-80C Software product assurance NASA-STD-6016 Standard materials and processes
ISO 24113: Space systems—Space debris mitigation requirements for spacecraft
requirements NASA-STD-8719.14 Process for limiting orbital debris
JAXA-QTS-2120 Wire, Electric, Fluorine Resin/Polyimide NASA-STD-8719.9 Standard for lifting devices and
Insulated equipment
JAXA-QTS-2140 Printed Wiring Boards, Rigid-Flexible NASA-STD-8739.1 Workmanship standard for polymeric
NASA-HDBK-5010 FRACTURE CONTROL IMPLE- application on electronic assemblies
MENTATION HANDBOOK FOR PAYLOADS, NASA-STD-8739.4 Crimping, interconnecting cables, har-
EXPERIMENTS, AND SIMILAR HARDWARE nesses, and wiring
NASA-HDBK-6024 Spacecraft polymers atomic oxygen NASA-STD-8739.5 Fiber optic terminations, cable assem-
durability handbook blies, and installation
NASA-HDBK-6025 Guidelines for the specification and NASA-STD-8739.6 Implementation requirements for nasa
certification of titanium alloys for NASA flight applications workmanship standards (includes requirements for soldered
NASA-HDBK-8719.14 Handbook for limiting orbital electrical and electronic assemblies per IPC J-STD-001
debris ES)
Appendix 10: Examples of Declared
Process Lists (DPL)

The Processes selected and used on any spacecraft will need reports are generated: on critical processes are “verification
to be approved by the end customer. They are compiled by tested”.1
the “Prime Contractor”. Critical processes are usually eval- Common practice is to tabulate all processes according to
uated by Testing “technology samples” for which laboratory the following “Group Numbers”:

Group Description
number
1 Adhesive bonding
2 Composite manufacture
3 Encapsulation/moulding
4 Painting/coating
5 Cleaning
6 Welding/brazing
7 Crimping/stripping/wire wrapping
8 Soldering
9 Surface treatments
10 Plating
11 Machining
12 Forming
13 Heat treatment
14 Special fabrication: processes developed
specifically for the programme
15 Marking
16 Miscellaneous processes
17 Inspection procedures

1
Critical processes are often specified by the end customer and will
depend on the service life and operational condition of individual
spacecraft (e.g. “manned space vehicles” may have more critical
processes). Often the process is considered critical if there are major
difficulties or uncertainties in the manufacturing, assembly, inspection
and testing. The process will also be considered critical if it has proven
to be difficult to perform by trained operators, and if it has raised
problems in the past that have not been resolved.

© Springer International Publishing Switzerland 2016 621


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
622

Appendix 10.A.1
Outerspace company Declared process list DOC.NO.: DPL/PIT/3401/OSC
Spacecraft: PITCAIRNSAT 1 Group 1 adhesive bonding Issue: 3
Subsystem: Date: 10/04/14
Equipment: Page: 16
Item Process Specification R Description/Identification Use Location code User Assoc. C Approval Customer
E code DML R Status C comments and
V Items I approval
T
1.07.00 Preparation of VESPEL and PON H- 8 Bonding LLMKTRA IOLACADM 18.018.00 N PSU: A
PON DELRIN surfaces prior to A011 processes ROSETTA
bond
1.018.00 Bonding by conductive resins HR-012.INT 1 CURE: 15 min at 120 °C Shielding of LLMKHPA 10.013.00 N PSU: A
ZTN with EPOTEX H20 E SSPA structure METRO 6
1.019.00 Screw locking with Screw 1 CURE: 48 h at RT or 3 h at LLMKHPA 10.009.00 N PSU: A
ZTN SOLITHANE 113 locking 65 °C METRO 6
HR-013/INT
1.021.01 Bonding with SOLITHANE HR-411/INT 1 CURE: 48 h at RT or 3 h at Components KSPA 10.009.00 N PSU: A
ZTN 113 65 °C bonding METRO 6
1.025.00 Bonding with ECCOSIL HR-410/INT 2 CURE: 18 h at RT or 3 h at RF Absorber LLMKHPA 10.069.03 N PSU: A
ZTN 4952 65 °C bonding 12.012.00 METRO 6
16.006.02
1.026.00 Bonding with EA 9321 PLUS SP 4413 TC LLMCHRM IOLACHRM 10.002.03 A
ON EA 9210 PRIMER SP 4414 APSAPA
1.030.00 Preparation of BS L 312 SP 8841 CURE: 1 Hr at 120 °C Inserts and LLMCHRM IOLACHRM 10.015.05 A
ON bonding of M
honeycomb
1.031.00 Bonding with FOAM 410-1 M-O-993 8 CURE: 0.5 h at 120 °C + 1 h Splicing STR IOLACADM 10.027.01 N PSU: A
CAT 180 °C honeycomb part LLMCADM HELIOS ISO
ARIANE 5
1.094.00 Locking of nuts and screws PIV/20/2014 3 Permenent and non- APSIAPC N A
PIN permanent locking of screws
and nuts
Appendix 10: Examples of Declared Process Lists (DPL)
Appendix 10.A.2
Outerspace company Declared process list DOC. NO.: DPL/PIT/3401/OSC
Spacecraft: PITCAIRNSAT 1 Group 6 welding/brazing Issue: 3
Subsystem: Date: 10/04/14
Equipment: Page: 61
Item Process Specification R Description/ Use Location User Assoc. C Approval Customer
number E identification code code DML R Status C comments
contractor V items I and
T approval
Appendix 10: Examples of Declared Process Lists (DPL)

6.018.00 Vacuum PPC PIC 101 1 Joining metal/or Thruster IPPEIT 7.038.00 C Awaiting O
PNT brazing metallised ceramic 20.051.03 vacuum O
components 3.011.03 hermeticity
6.001.36 testing and
6.013.15 DPA
3.036.00
6.020.00 Filling tube SPECWELD Laser welding Tube on top DOME PWSBTA 3.015.01 N RPT OSC A
TOT welding 491 3.015.03 4448 N
6.021.00 Cell closure M.T.U. TIG Welding Terminal to DOME PWSBTA 3.001.01 N RPT OSC A
TOT welding 11997 3.001.02 4521 N
21.017.01
6.022.00 Brazing with TBD Hard bazing of Cu- IPPEIT 6.008.03 N O
FOB VH 950 wire of 2.0040/anode 7.036.02 N
screw 1.4944
6.023.00 Microwelding FOP Plasmajet IPPEIT 2.001.32 N A
FOB 99-22/13 microwelding of 19.019.03 N
HF-RF-CABLE/Cu
wire
623
624

Appendix 10.A.3
Outerspace company Declared process list DOC.NO.: DPL/PIT/3401/OSC
Spacecraft: PITCAIRNSAT 1 Group 9 space conversion treatment Issue: 3
Subsystem: Date: 10/04/14
Equipment: Page: 99
Item number Process Specification R Description/identification Use Location code User Assoc. C Approval Customer
contractor identification E code DML R Status C comments and
V Items I approval
T
9.012.00 Anodising of 33448/22/4 A Protection RCPROMD FREPFKIF 4.001.43 N RPT: A
XYZ TA6V titanium FREPFKOF FREPFBOF 21.004.19 XYZ/BOT/FT.236
alloy FREPFKTF RREPRKIF 21.007.30 PSU: TDF
RREPRKPD 21.008.51 8 TVSAT 8
TLC 8
POS Anodising of 33448/22/4 A Protection FREPFKLA FREPFICA 4.001.43 N PSU: ECS INTE-V1 A
TA6V titanium FREPFISC FREPRSIR 21.004.19 GIOTTO ERS-1 N
alloy FREPAIT 21.007.30
21.008.51
9.013.00 Surface passivation 62410/99/1 Passivation of silver Protection RCPROMD FREPFKIF 1.029.03 N RPT: BAB/QT/ A
XYZ FREPFKOF FREPFBOF 3.005.18 81.044
FREPFKIF RREPRKIF 4.007.01 PSU: TVSAT 2
RREPRKPD SPLAB
TLC 8
POS Surface passivation 44291/20/1 Passivation of silver Protection FREPFKLA FREPFICA 3.002.11 N RPT: BAB/QT/ AN
FREPFISC FREPRSIR 1.029.02 81.044
1.029.03 PSU: INTE.V1
1.040.00 ERS-1
1.029.04 EURECA
EUTE.2
9.014.00 Anodising DTD 942 Surface treatment on Ti Surface FREPFCFK 21.004.21 N MARS-2 AN
MOM alloys protection on
fixings
9.015.00 Anodising of LIN.914.2. A Support and RREPRICA RREPRKPA 1.017.04 N CLUST-2 AN
LIN aluminium ALLOY rev.1 cooling plate RREPRIKC
9.018.00 Hard anodising 49326/20/1 B Treatment of aluminium Insulation FREPFKLA FREPFICA 1.002.34 N PSU: INTE.V1 AN
POS and aluminium alloy FREPFISC FREPRSIR 1.007.15 GIOTTO
1.029.05 EURECA TLC 2
9.020.00 Chromate 40441/20/2 B Treatment of aluminium Protection FREPFKLA FREPFICA 1.002.35 N RPT: R:
POS conversion coating and aluminium alloy FREPFISC FREPRSIR 1.002.38 XYZ/BOT/FT
1.007.16 PSU: ECS
FREPAIT
1.007.19 INTE.V1
1.029.06 ISS TDF 8
1.040.02
Appendix 10: Examples of Declared Process Lists (DPL)
Appendix 11: Examples of Declared
Materials Lists (DMLs)

The materials selected and used on any spacecraft will need flammability, etc. The Material Group numbers have been
to be approved by the end customer. They are compiled by detailed in Appendix 8.
the “Prime Contractor”. The contents of the DMLs will depend on the end cus-
Critical materials are tested and “Validated”. Dependent tomer’s requirements, these may follow ECSS-Q-ST-70 or
upon the criticality of the spacecraft, tests may include: can be relaxed in view of the specific contractual require-
outgassing-under-vacuum, stress corrosion testing, ments. Further description is given in Sect. 4.2.1.

© Springer International Publishing Switzerland 2016 625


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
626

Appendix 11.A.1
Outerspace company Declared material list DOC. NO.: DML/PIT/3466/OSC
Spacecraft: PITCAIRNSAT 1 Group 2 copper and copper alloys Issue: 3
Subsystem: Date: 10/04/14
Equipment: Page: 49
Item Commercial Chemical nature and Procurement Summary of processing Use and location code ENVIR. Size Approval Customers
identification type of product for information parameters code comments
applied condition supplies Use Code R A T Status C and approval
specification
2.021.01 Brass 40Zn Cu 60/Zn 40 QQ-B-626 TIN plating 8AB 00526 Mechanical parts RREPRKIC GS V 3 V1 PSU: BSAT D No pure tin
FOK AAAA FREPFIKC 4 permitted
FREPFKIC
RCPFRGU
2.022.00 Brass 38zn Cu Zn 38, 2Pb 734.662.E Gold plating 4 µm Mechanical parts: RREPRKIC GS V 3 V0 PSU: ECS BSAT A
FOK 2Pb VAR. TUN.SCREW Copper underplating bonding stud FREPFIKC 4 EUR
NRS 5 µm terminal, screw lock FREPFKIC
VAR. TERMINAL 770-82608-AASG RCPFRGU
NRS
2.022.01 Brass CZ121 Cu58, ZN 38-39, Pb 3-4 Aluminium Silver plating Center conductor FREPFCFK GS V 3 W1 PSU: SPOT A
MOM ROD supplies BS 2874 Solder Low pass filter FREPSDIP 4 N
CDP 7.10E Probe and tube PREPRINF
CDP 7.03
2.022.02 Brass 38Zn Cu Zn 38, 2Pb 734.662.E Sn plating deleted Ag Mechanical parts RREPRKIC GS V 3 V0 PSU: ECS BSAT A Tin no longer
FOK 2Pb VAR. TN.SCREW plating Bonding stud, FREPFIKC 4 EUR N used
NRS 8AB 00526 AAAA terminal, screw lock FREPFKIC
VAR. TERMINAL RCPFRGU
NRS
2.023.00 Copper Cu Sn6 DIN 1756 Pretinning Piece, Parts RREPRKPA GS V 3 W1 PSU: A
LIN CDA 510 ROD GZ.1991.209.1 FREPFKPA 4 TELECOM HISPAS.
INT.V11 EUTELS
ECSS-Q-ST-70-36
2.024.00 Copper AVIOMETAL Electrolytic surface Electrical IPPPSCU GS V 3 W2 PSU: GIOTTO ERS A
SINT 131N22 coating Sn and reflowed connections 4 PINSAT M
MIL-T-107-27 1
IP 5009
2.026.00 Copper Cu65 % zn35 % TELKRON Plated with Cu EYELET PCDICU GS V 3 W2 PSU: ISO AN
LIN CDA 260 CRS-EPT-6016 5 µm + Sn/Pb PCDPKDU 4
2.027.00 Brass Grommet with Spur Atlanta hardware INSERT MLI grounding IOLAIKCM GS V 3 W3 A
FON MS 20230 grommet plain N
Appendix 11: Examples of Declared Materials Lists (DMLs)
Appendix 11.A.2
Outerspace company Declared material list DOC: NO.: DML/PIT/3466/OSC
Spacecraft: PITCAIRNSAT 1 Group 6 stainless steels Issue: 3
Subsystem: Date: 10/04/14
Equipment: Page: 88
Item Commercial Chemical nature and type of Procurement information Summary of Use and location code ENVIR. Size Approval Customers
identification product for appl. condition supplies specification processing Code comments and
parameters Use Code R A T Status C approval
6.034.00 SS 2343-08 TINGSTAD A/S Lock wire IPPFVV GS E 3 W1 A
FIN F9967.1 4 N
6.035.00 AISI 304L LEE JEVA Passivated FLO restrictor in IPPPSME GS V 3 W1 RPT 3991- A
SMM 09-TSL MIL-S-5002 107 series valve 4 02099-DPQ N
6.036.00 AISI 348 Stainless steel sheet Various Formed Cathode, main IPPEIT GS V 4 SCC I A
CPP PPC 823-170-95911 Spot welded flange NASA NASA- N
Appendix 11: Examples of Declared Materials Lists (DMLs)

PPC 823-170-95981 HDBK-527


10119
6.036.01 AISI 348 Stainless steel ROT Machined Structural parts IPPEIT GS V 4 W1 SCC I A
CPP PPC 8213-170-95921 Spot welded NASA NASA- N
HDBK-527
10119
6.037.00 Nitriding BS S106D Plasma nitride Gear SADM GS V 3 W2 ? O More data required
BET steel 4 h at 555 °C 4 N
ESP4443
6.038.00 Maraging Bar DTD 5212 Plasma nitride Pinion SADM GS V 3 W1 ? O More data required
BET steel 4 h at 485 °C 4 N
ESP4443
6.039.00 Corrosion Sheet BS S527 Washer SADM GS V 3 W1 A
BET resisting steel 4 N
6.040.00 Stainless BS S80 PASSIVE SADM GS V 3 W2 A
BET steel PS 2089 4 N
6.041.00 AISI 304 X8 Cr Ni 19/10 MULTI SOURCE USE AS IS Ball for sealing IPPFCU GS V 3 W1 PSU: A
XIL AMS-5513/AMS 5639 4 OLYMPUS
HIPPAR
METEO
6.042.00 AISI 1017 Nickel plated Electical stop APSAPA GS V 2 W2 A
ON 5 to 20 µm Tooth 4 N
627
628

Appendix 11.A.3
Outerspace company Declared material list DOC. NO.: DML/PIT/3466/OSC
Spacecraft: PITCAIRNSAT 1 Group 10 adhesive, coatings, varnishes Page: 151
Issue: 3
Subsystem:
Date: 10/04/14
Equipment:
Item Commercial Chemical nature and Procurement Summary of Use and location code ENVIR. Size Approval Customers
identification type of product for information processing Code comments
Appl. condition supplies parameters Use Code R A T Status C and approval
specification
10.014.03 EPO-TEK H 74 EPOX resin A/B Epoxy technol. MIX: 100 pp/ Bonding loops and RREPRIWF GS V 3 W1 PSU: O ECS A
MOM two component CDP 9.39 3 pp supports into housing/ FREPFCFK 4 TTL
electric. conductive CURE: 2 h at bonding ferrites FREPSDIP NASA: NASA RP
100 °C TTCSBDN 1124
CDP 7.08
10.015.03 REDUX 312L Epoxy resin film CIBA GEIGY CURE: Skins to core bonding LLMKTRA GS V 1 W3 RFA: W
CAT 1+D-N-15 90 min at GL 3 RFW/KANT-01/CAS
1+D-N-200 120 °C ECSS-Q-ST-70-01
1+D-P-70 TVS 14
10.015.04 REDUX 312UL+ Epoxy resin film CIBA GEIGY CURE: Skins to core SKDRKANA GS V 1 W2 RFA WM
CAT REDUX 1+D-N-15 60 min at STR GL 3 RFW/KANT-01/CAS
120 °C ECSS-Q-ST-70-01
1+D-P-70 TVS 14
10.015.05 REDUX 312L Epoxy resin film CIBA GEIGY Insert plate LLMCHRM GS V 3 V2 RPT: LT 33 A
ON DSN. 0016 IOLACHRM
10.015.06 REDUX 312/P112 Epoxy adhesive film CIBA GEIGY CURING: Structural bonding in IOLACADM GS V 3 W3 RPT: BOT REP.002 A
CAT 1+D-N-15E 1 h/120 °C sandwich LLMCADM PSU: HELIOS, ISO N
1+D-E-159 1+D-P-70 manufacturing ARIANE6
TVS 14
10.015.07 REDUX 312/5 Epoxy resin film CIBA CEIGY Bonding UPSGT GS E 3 V2 RPT LT 33 A
ON NT 16101/AQEN ECSS-Q-ST-70-01
NT 16102/AQEN TVS 14
10.015.08 REDUX 312L Epoxy resin film CIBA CEIGY CURE: Bonding of panels SAW GL V 2 A4 RPT ESA I 668 A
KOF TH5. 917/4/5/6 90 min at 4 PSU: ARA IRAS N
120 °C OLYMPUS
TH24. 3006 ULYSSES
TVS 14
10.015.09 REDUX312L/112 Epoxy resin plus CIBA CEIGY CURE: 1 h at Beam APSAPA GS V 2 W2 RFA W
ON primer film Data sheet/GENES 120 °C 4 RFW/GOT-APA/01 N
0021-1184/1179 PSU: EUT
TVS 14
Appendix 11: Examples of Declared Materials Lists (DMLs)
Glossary

The majority of terms have been compiled from documents issued by ESA, IOM, ISO, NASA and TMS.

Acicular alpha A product of nucleation and growth from Annealing A generic term denoting a treatment, consisting
beta to the lower-temperature allotrope alpha phase. It may of heating to, and holding at, a suitable temperature followed
have a needlelike appearance in a photomicrograph and may by cooling at a suitable rate. It is used primarily to soften
have needle, lenticular, or flattened bar morphology in three metallic materials, but also to simultaneously produce
dimensions. Its typical aspect ratio is about 10:1 desired changes in other properties or in microstructure. The
purpose of such changes may be, but is not confined to:
Activation The changing of a passive surface of a metal to a
improvement of machinability, facilitation of cold work;
chemically active state. (Contrast with passivation.)
improvement of mechanical or electrical properties, and/or
Age hardening Hardening by ageing, usually after rapid increase in stability of dimensions. When the term is used
cooling or cold working. (See also ageing.) without qualification, full annealing is implied. When
applied only for the relief of stress, the process is properly
Ageing A change in the properties of certain metals and
called stress relieving or stress-relief annealing
alloys that occurs with time at ambient or moderately ele-
vated temperatures after working or a heat treatment (natural Assembly A functional subdivision of a component, con-
or artificial ageing) or after a cold-working operation (strain sisting of parts or subassemblies that perform functions
ageing). The change in properties is often, but not always, necessary for the operation of the component as a whole.
due to a phase change (precipitation), but it never involves a Examples: regulator assembly, power amplifier assembly,
change in chemical composition of the metal or alloy gyro assembly, etc
Alloy A substance having metallic properties and being Assurance All the planned and systematic activities
composed of two or more chemical elements of which at implemented, and demonstrated as needed, to provide ade-
least one is a metal quate confidence that an entity will fulfil its requirements
Alpha–beta structure A microstructure containing α and β Axial lead Lead wire extending from a component or
as the principal phases at a specific temperature module body along its longitudinal axis
Alpha case The oxygen-, nitrogen-, or carbon-enriched, α- AWG American wire gauge
stabilized surface resulting from elevated temperature
Basketweave Alpha platelets with or without interleaved β
exposure
platelets that occur in colonies in a Widmanstätten structure
Analysis The determination of the essential qualities, per-
Batch That quantity of material that was subjected to unit
formance, and limitations of an item by cognitive or com-
chemical processing or physical mixing, or both, designed to
putational methods
produce a product of substantially uniform characteristics
Anomaly Any deviation from the expected situation
Bifurcated (split) terminal A terminal with a slot or split
Assurance All the planned and systematic activities opening in which conductors are placed before soldering
implemented, and demonstrated as needed, to provide ade-
Billet (1) A solid, semi-finished round or square product
quate confidence that an entity will fulfil its requirements
that has been hot-worked by forging, rolling, or extrusion;

© Springer International Publishing Switzerland 2016 629


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
630 Glossary

usually smaller than a bloom. (2) A general term for wrought Chemical vapour deposition (CVD) The precipitation of a
starting stock used in making forgings or extrusions metal from a gaseous compound onto a solid or particulate
substrate
Blister Undesirable rounded elevation of the surface of a
polymer, whose boundaries may be more or less sharply Coarse grains Grains larger than normal for the particular
defined wrought metal or alloy or of a size that produces a surface
roughening known as orange peel or alligator skin in
Body-centred cubic lattice structure A unit cell which
wrought alloys
consists of atoms arranged at cube corners with one atom at
the centre of the cube Cold flow Movement of insulation (e.g. Teflon) caused by
pressure
Brazeability The capacity of a metal to be brazed under the
fabrication conditions imposed into a specific suitably Cold solder connection A solder connection exhibiting
designed structure and to perform satisfactorily in the poor wetting and a greyish, porous appearance due to
intended service insufficient heat, inadequate cleaning before to soldering, or
excessive impurities in the solder
Brazing A group of processes that join solid materials
together by heating them to a suitable temperature and by Cold working Deforming metal plastically under condi-
using a filler metal having a liquidus above about 450 °C tions of temperature and strain rate that induce strain hard-
(840 °F) and below the solidus of the base materials. The ening. Usually, but not necessarily, conducted at room
filler metal is distributed between the closely fitted surfaces temperature. (Contrast with hot working.)
of the joint by capillary attraction
Cold-worked structure A microstructure resulting from
Bridging A build-up of solder or conformal coating plastic deformation of a metal or alloy below its recrystal-
between parts, components leads, and/or base substrate lization temperature
forming an elevated path (see ‘Fillet’)
Colophony A natural resin obtained as the residue after
Brittle Permitting little or no plastic (permanent) deforma- removal of turpentine from the oleoresin of the pine tree,
tion prior to fracture consisting mainly of abietic acid and related resin acids, the
remainder being resin acid esters
Brittle fracture Separation of a solid accompanied by little
or no macroscopic plastic deformation. Typically, brittle Component A functional subdivision of a system, generally
fracture occurs by rapid crack propagation with less a self-contained combination of assemblies performing a
expenditure of energy than for ductile fracture function necessary for the system’s operation. Examples:
power supply, transmitter, gyro package, etc
Cable Two or more insulated conductors, solid or stranded,
of equal length, contained in a common covering; or two or Conductor A lead, solid or stranded, or printed wiring path
more insulated conductors, of equal length, twisted or serving as an electrical connection
moulded together without common covering; or one insu-
Configuration Functional and physical characteristics of a
lated conductor with a metallic covering shield or outer
product as defined in technical documents and achieved in
conductor (shielded cable or coaxial cable)
the product (ISO 10007:1995)
Cast or casting Top fabricate an item by pouring molten
Conformal coating A thin electrically nonconductive pro-
metal into a shaped cavity and permitting the metal to
tective coating that conforms to the configuration of the
solidify. A cast can relate to the item or may be a synonym
covered assembly
for heat, that is an identifiable chemistry lot
Contact angle The angle enclosed between half-planes,
Catalyst A substance that changes the rate of a chemical
tangent to a liquid surface and a solid–liquid interface at their
reaction without undergoing permanent change in its com-
intersection. In particular, the contact angle of liquid solder in
position; a substance that markedly speeds up the cure of a
contact with a solid metal surface. An approximate value for
compound when added in minor quantity as compared to the
this may be determined by shadow projection or other means,
amount of primary reactants
by measuring after the solder has solidified. Note that the
Certification The act of verifying and documenting that contact angle is always the angle inside the liquid
personnel have completed required training and have
Contaminant An impurity or foreign substance present in a
demonstrated specified proficiency and have met other
material that affects one or more properties of the material.
specified requirements
Glossary 631

A contaminant may be either ionic or nonionic. An ionic, or the set of information describing the essential characteristics
polar, compound forms free ions when dissolved in water, of a product
making the water a more conductive path. A nonionic sub-
Dewetting The condition in a soldered area in which the
stance does not form free ions, nor increases the water’s
liquid solder has not adhered intimately, but has receded,
conductivity. Ionic contaminants are usually processing
characterized by an abrupt boundary between solder and
residue such as flux activators, finger prints, and etching or
conductor, or solder and terminal/termination area leaving
plating salts
irregularly shaped mounds of solder separated by areas
Contractor Supplier in a contractual situation (ISO covered with a thin-solder film
8402:1994)
Diffusion welding (DFW) A high-temperature, solid-state
Corrective action Action taken to eliminate the causes of welding process that permanently joins faying surfaces by
an existing nonconformity, defect, or other undesirable sit- the simultaneous application of pressure and heat. The pro-
uation in order to prevent recurrence (ISO 8402: 1994) cess does not involve macroscopic deformation, melting, nor
relative motion of parts. A solid filler metal (diffusion aid)
Corrosion The deterioration of a metal by a chemical or
may or may not be inserted between the faying surfaces
electrochemical reaction with its environment
Disturbed solder joint Unsatisfactory connection resulting
Corrosion fatigue Cracking produced by the combined
from relative motion between the conductor and termination
action of repeated or fluctuating stress and a corrosive
during solidification of the solder
environment at lower stress levels or fewer cycles than
would be required in the absence of a corrosive environment Dross Oxide and other contaminants that form on the sur-
face of molten solder
Creep Time-dependent strain occurring under stress. The
creep strain occurring at a diminishing rate is called primary, Ductility The ability of a material to deform plastically
or transient, creep; that occurring at a minimum and almost before fracturing. Measured by elongation or reduction of
constant rate, secondary, or steady-rate creep; that occurring area in a tension test, by height of cupping in a cupping test,
at an accelerating rate, tertiary creep or by the radius or angle of bend in a bend test. (Contrast
with brittleness; see also plastic deformation.)
Crevice corrosion A type of concentration cell corrosion;
corrosion caused by the concentration or depletion of dis- Electron beam welding (EBW) A welding process which
solved salts, metal ions, oxygen, or other gases, and such, in produces coalescence of metals with the heat obtained from
crevices or pockets remote from the principal fluid stream, a concentrated beam composed primarily of high-velocity
with a resultant building up of differential cells that ulti- electrons impinging upon the surfaces to be joined
mately cause deep pitting. Localized corrosion of a metal
Elongated grain A grain with one principal axis signifi-
surface at, or immediately adjacent to, an area that is shiel-
cantly longer than either of the other two
ded from full exposure to the environment because of close
proximity between the metal and the surface of another Elongation A term used in mechanical testing to describe
material the amount of extension of a test-piece when stressed. In
tensile testing, the increase in the gauge length, measured
Critical item Any item that introduces risk which could be
after fracture of the specimen within the gauge length, usually
unacceptable to the project and requires specific attention or
expressed as a percentage of the original gauge length
control in addition to that given to items not so categorized
Embrittlement The severe loss of ductility and/or tough-
Cure A chemical reaction that hardens and changes the
ness of a material, usually a metal or alloy
physical properties of a material
Encapsulating compound An electrically nonconductive
Deformation A change in the form of a body due to stress,
compound used to completely enclose and fill in voids
thermal change, change in moisture, or other causes. Mea-
between electrical components or parts
sured in units of length
Environment Conditions in which an item exists or is
Delamination A separation between plies within a base
operated
material or any planar separation within a multilayer printed
circuit board (PCB) Equiaxed structure A polygonal or spheroidal
microstructural feature having approximately equal dimen-
Design (1) Set of information which defines the essential
sions in all directions. In alpha–beta titanium alloys, such a
characteristics of a product. (2) The process used to generate
632 Glossary

term commonly refers to a microstructure in which most of Flux A chemically active compound which, when heated,
the minority phase appears spheroidal removes minor surface oxidation
Equilibrium A dynamic condition of physical, chemical, Foil Among many definitions is: a flat-rolled product
mechanical, or atomic balance, where the condition appears 0.127 mm (0.005 in.), or less, in thickness, regardless of
to be one of rest rather than change width. (Any flat-rolled product thicker than this dimension is
not considered foil.) Only thickness, not width, is a factor in
Equipment An item designed and built to accomplish a
determining foil
specified purpose, which can be disassembled and retain its
capabilities after reassembly Forging (1) Plastically deforming metal, usually hot, into
desired shapes with compressive force, with or without dies.
Eutectic alloy An alloy of two or more metals that has one
(2) Reshaping a billet or ingot by hammering. (3) The process
distinct melting point. Eutectic solder is a tin–lead alloy
of placing a powder in a container, removing the air from the
containing 63 %Sn and 37 %Pb which melts at 183 °C
container, and sealing it. This is followed by conventional
Excessive solder joint Unsatisfactory solder connection forging of the powder and container to the desired shape
wherein the solder obscures the configuration of the
Fracture (1) The irregular surface produced when a piece
connection
of metal is broken. (2) To separate a metal or alloy into two
Face-centred cubic lattice structure A unit cell which or more pieces by an applied load
consists of atoms arranged at cube corners with one atom at
Friction welding A solid-state process in which materials
the centre of each cube face
are welded by the heat obtained from rubbing together sur-
Failure The termination of the ability of an item to perform faces that are held against each other under pressure
a required function
Glass meniscus The glass fillet of a lead seal which occurs
Fatigue The phenomenon leading to fracture under repeated where an external lead leaves the package body
or fluctuating stresses having a maximum value less than the
Grounding The connection of two or more areas to the
tensile strength of the material. Fatigue fractures are pro-
same potential difference. The space environment can result
gressive, beginning as minute cracks that grow under the
in high potential voltage and destructive arcing, most sub-
action of the fluctuating stress
systems are grounded to the structure, but the grounding of
Fatigue failure Failure that occurs when a specimen electronic units is complex and can use a ‘floating ground’
undergoing fatigue completely fractures into two parts, or concept
has softened, or been otherwise significantly reduced in
Ground segment The hardware and software required to
stiffness by thermal heating or cracking. Fatigue failure
launch and control a space vehicle, usually the launcher
generally occurs at loads which, if applied statically, would
produce little perceptible effect. Fatigue failures are pro- Hardness A measure of the resistance of a material to
gressive, beginning as minute cracks that grow under the surface indentation or abrasion; may be thought of as a
action of the fluctuating stress function of the stress required to produce some specified
type of surface deformation. There is no absolute scale for
Fault mode The observable effect of the mechanism
hardness; therefore, to express hardness quantitatively, each
through which the failure occurs, e.g. short, open, fracture,
type of test has its own scale of arbitrarily defined hardness.
excessive wear
Indentation hardness may be measured by Brinell, Knoop,
Fillet A smooth concave build-up of material between two Rockwell, Scleroscope, and Vickers hardness tests
surfaces, e.g. a fillet of solder between a component lead and
HAZ See heat-affected zone
a solder pad or terminal, or a fillet of conformal coating
material between a component and printed circuit board Heat-affected zone That portion of the base metal which
(PCB) has not been melted, but whose mechanical properties or
microstructure have been altered by the heat of welding,
Filler metal The metal to be added in making a welding,
brazing, soldering, or cutting
brazed, or soldered joint
Heat treatment Heating and cooling a solid metal or alloy
Flake Powder of an essentially two-dimensional nature
in such a way as to obtain desired conditions or properties.
Flatpack A part with two straight rows of leads that are Heating for the sole purpose of hot working is excluded from
parallel to the part body the meaning of this definition
Glossary 633

Hermetic seal A seal which protects an enclosed circuit metal, or metal alloy lattice. Common examples are oxygen,
from corrosion by preventing the entry of such contaminants nitrogen, hydrogen, and carbon
as water vapour
Interstitial solid solution A type of solid solution that
HIP See hot isostatic pressing sometimes forms in alloy systems having two elements of
widely different atomic sizes. Elements of small atomic size,
Hot isostatic pressing (1) A process for simultaneously
such as carbon, hydrogen, oxygen, and nitrogen, often dis-
heating and forming a powder metallurgy compact in which
solved in solid metals to form this solid solution. The space
metal powder, contained in a sealed flexible mould, is sub-
lattice is similar to that of the pure metal, and the atoms of
jected to equal pressure from all directions at a temperature
carbon, hydrogen, oxygen, and nitrogen occupy the spaces
high enough for sintering to take place. (2) A process similar
or interstices between the metal atoms
to the one explained in (1), but applied to castings in order to
close internal porosity Item Anything which can be individually described and
considered
Hot working Deforming metal plastically at such a tem-
perature and strain rate that recrystallization takes place Lap joint Joining or fusing of two overlapping metal sur-
simultaneously with the deformation, thus avoiding any faces with solder without use of any other mechanical
strain hardening attachment or support
HV See Vickers hardness number Liquidus In a constitution or equilibrium diagram, the locus
of points representing the temperatures at which the various
Hydride phase For instance, the phase TiHx formed in
compositions in the system begin to freeze on cooling or
titanium when the hydrogen content exceeds the solubility
finish melting on heating. (See also solidus.)
limit, generally locally due to some special circumstance
Longitudinal direction Usually, the direction parallel to
Hydrogen embrittlement A condition of low ductility in
the direction of working in wrought alloys or the direction of
metals resulting from the absorption of hydrogen
crystal growth in directionally solidified or single-crystal
Immersion cleaning Cleaning where the work is immersed cast alloys. Commonly, it corresponds to the direction par-
in a liquid solution. Impurities, Undesirable elements or allel to the direction of maximum elongation in a worked
compounds in a material material. (See also normal direction and transverse
direction.)
Inclusion A particle of foreign material in a metallic matrix.
The particle is usually a compound (such as an oxide, sul- Machinability The relative ease of machining a metal
phide, or silicate), but may be of any substance that is for-
Machining Removing material from a metal part, usually
eign to (and essentially insoluble in) the matrix
using a cutting tool, and usually using a power-driven
Ingot A casting of simple shape, suitable for hot working or machine
remelting
Macrostructure The structure of metals as revealed by
Inspection An activity such as measuring, examining, macroscopic examination of a specimen. The examination
testing, or gauging one or more characteristics of an entity may be carried out using an as-polished or a polished and
and comparing the results with specified requirements in etched specimen
order to establish whether conformity is achieved for each
Martensite (1) The alpha product resulting from cooling
characteristic (ISO 8402:1994)
from the beta phase region at rates too high to permit
Insufficient solder connection A solder connection char- transformation by nucleation and growth. Martensite is sat-
acterized by incomplete coverage of one or more of the urated with beta stabilizer. Also called martensitic alpha. (2)
metal surfaces being joined or by incomplete solder fillets A generic term for micro-structures formed by diffusionless
phase transformation in which the parent and product phases
Integrated-circuit component An individually packaged
have a specific crystallographic relationship. Martensite is
functional circuit formed by depositing an active or passive
characterized by an acicular pattern in the microstructure in
electronic element on to a substrate
ferrous and nonferrous alloys. The amount of high-temper-
Intermetallic compound A phase in an alloy system hav- ature phase that transforms to martensite upon cooling
ing a restricted solid solubility range. Nearly all are brittle depends to a large extent on the lowest temperature attained,
and of stoichiometric composition there being a distinct starting temperature (Ms) and a tem-
Interstitial element An element with a relatively small perature at which the transformation is essentially complete
atom which can assume a position in the interstices of a (Mf), which is the martensite finish temperature
634 Glossary

Maintainability The ability of an item under given condi- Overageing Ageing under conditions of time and temper-
tions of use, to be retained in, or restored to, a state in which ature greater than those required to obtain maximum change
it can perform a required function, when maintenance is in a certain property. (See ageing.)
performed under given conditions and using stated proce-
Overheated joint An unsatisfactory solder joint, charac-
dures and resources (IEC 50:1992)
terized by rough solder surface; dull, chalky, grainy, porous
Material A raw or semi-finished substance or compound, of or pitted
specified characteristics, which is processed to form a part of
Oxidation (1) A reaction in which there is an increase in
a finished product
valence resulting from a loss of electrons. (Contrast with
Matrix The constituent which forms the continuous or reduction.) (2) A corrosion reaction in which the corroded
dominant phase of a two-phase microstructure metal forms an oxide; usually applied to reaction with a gas
containing elemental oxygen, such as air
Measling/measles A condition existing in the base laminate
of printed-circuit board in the form of discrete white spots or Part An element of a component, assembly, or subassembly
‘crosses’ below the surface of the base laminate, reflecting a that is not normally subjected to further subdivision or dis-
separation of fibres in the glass cloth at the weave intersec- assembly without destruction of designed use
tion. During soldering, may be caused by excessive heat,
Passivation The changing of a chemically active surface of
mechanical stresses, or chemical attack
a metal to a much less reactive state
Mechanical part A piece of hardware which is not elec-
Performance Those generally quantified aspects of an item
trical, electronic, or electromechanical, and which performs
observed or measured from its operation or function
a simple (elementary) function or part of a function in such a
way that it can be evaluated as a whole against expected Pickling Removal of the oxide film on a casting by a
performance requirements and cannot be disassembled chemical process; pickling is sometimes used solely to show
without destroying this capability up defects
Mechanical properties The properties of a material that Physical properties Properties of a metal or alloy that are
reveal its elastic and inelastic (plastic) behaviour when force relatively insensitive to structure and can be measured without
is applied, thereby indicating its suitability for mechanical the application of force; for example, density, electrical con-
(load-bearing) applications. Examples are elongation, fatigue ductivity, coefficient of thermal expansion, magnetic perme-
limit, hardness, modulus of elasticity, tensile strength, and ability, heat capacity, and lattice parameter. Does not include
yield strength chemical reactivity. (Compare with mechanical properties.)
Melting point The temperature at which a pure metal, Plastic deformation The permanent (inelastic) distortion of
compound, or eutectic changes from solid to liquid; the metals under applied stresses
temperature at which the liquid and the solid are in
Plate A flat-rolled metal product of some minimum thick-
equilibrium
ness and width—at times less than 610 mm (24 in). (It is
Mission The specific task, duty, or function defined to be relatively thick when compared with sheet.)
accomplished by a system
Plated-through hole A plated-through hole is one formed
Modulus of elasticity A measure of rigidity or stiffness of a by a deposition of metal on the inside surface of a through
metal; the ratio of stress, below the proportional limit, to the hole. Also known as a supported hole. The configuration is
corresponding strain used to provide additional mechanical strength to the sol-
dered termination or to provide an electrical interconnection
Nonconformance Nonfulfilment of a specified requirement
on a multilayer PCB
(ISO 8402:1994—definition of Nonconformity)
Potting compound An electrically nonconductive com-
Nonwetting A condition whereby a surface has contacted
pound used to partially encapsulate or for a filler between
molten solder, but the solder has not adhered to all of the
parts, conductors, or assemblies
surface; basis metal remains exposed
ppm Parts per million
ODS Oxide dispersion strengthening
Precipitation (1) Separation of a new phase from solid or
Outgassing The release of volatile parts from a substance
liquid solution, usually with changing conditions of time,
when placed in a vacuum environment
temperature, and stress. (2) The removing of a metal from a
Glossary 635

solution caused by the addition of a reagent by displacement. Quality assurance All the planned and systematic activities
(3) The removal of a metal from a gas by displacement implemented within the quality system and demonstrated as
needed, to provide adequate confidence that an entity will
Precipitation hardening Hardening caused by the precip-
fulfil requirements for quality
itation of a constituent from a supersaturated solid solution
Quality control Operational techniques and activities that
Preform An initially pressed compact to be subjected to
are used to fulfil requirements for quality
repressing or forging
Quenching Rapid cooling. When applicable, the fol-
Preheat An early stage in the sintering procedure when, in a
lowing more specific terms should be used: direct
continuous furnace, lubricant or binder burnoff occurs
quenching, fog quenching, hot quenching, interrupted
without atmosphere protection prior to actual sintering in the
quenching, selective quenching, spray quenching, and
protective atmosphere of the high heat chamber
time quenching
Pressure vessel A container which stores pressurized fluids
Ram direction he side that points in the direction of the
and: (a) contains stored energy of 19,310 joules or greater,
spacecraft’s motion. In low earth orbit, it is the side
based on the adiabatic expansion of a perfect gas; or (b)
impacting/ramming into the rarefied atmosphere that con-
contains a gas or liquid which may result in a hazardous
tains reactive atomic oxygen (AO, or ATOX)
event if released (c) will experience a design limit pressure
greater than 0.69 MPa. Recrystallization (1) Formation of new, strain-free grain
structure from the structure existing in cold-worked metal.
Printed circuit board (PCB) A product resulting from the
(2) A change from one crystal structure to another, such as
process of selectively etching unwanted copper from one or
that occurring upon heating or cooling through critical
both surfaces of a copper-clad insulating substrate to form a
temperature
desired circuity pattern which is subsequently solder- or
gold-plated. Holes may, or may not, be drilled in the board, Reducing atmosphere A chemically active protective
depending on the intended technique for attaching atmosphere which at elevated temperature will reduce metal
components oxides to their metallic state. (Reducing atmosphere is a
relative term and such an atmosphere may be reducing to
Procedure Specified way to perform an activity
one oxide but not to another oxide.)
Process Set of interrelated resources and activities which
Reduction in area (1) Commonly, the difference, expressed
transform inputs into outputs
as a percentage of original area, between the original cross-
Product The result of activities or processes and may sectional area of a tensile test specimen and the minimum
include service, hardware, processed materials, software, or cross-sectional area measured after complete separation. (2)
a combination thereof The difference, expressed as a percentage of original area,
between original cross-sectional area and that after straining
Product assurance A discipline devoted to the study,
the specimen
planning, and implementation of activities intended to
ensure that the design, controls, methods, and techniques in Reliability The probability that an item can perform a
a project result in a satisfactory level of quality in a product required function under given conditions for a given time
interval
Project A unique set of coordinated activities, with definite
starting and finishing points, undertaken by an individual or Rem Remainder
organization to meet specific objectives within defined
Repair Operations performed on a nonconforming article to
schedule, cost, and performance parameters (BS 6079)
place it in usable condition. Repair is distinguished from
Qualification The process of determining that the product, as rework in that alternate processes rather reprocessing are
designed, is capable of meeting all its specified performance employed
requirements in its operational environment with margins
Residual stress Stress remaining in a structure or member
appropriate for the technologies used and the intended
as a result of thermal or mechanical treatment or both.
application
Stress arises in fusion welding primarily because the weld
Quality The totality of characteristics of an entity that bear metal contracts on cooling from the solidus to room
on its ability to satisfy stated and implied needs temperature
636 Glossary

Resistance brazing Brazing by resistance heating, the joint compositions finish freezing on cooling or begin to melt on
being part of the electrical circuit heating. (See also liquidus.)
Rework The reprocessing of an article or material that will Solution heat treatment A heat treatment in which an alloy
make it conform to drawings, specifications, and contract is heated to a suitable temperature, held at that temperature
long enough to cause one or more constituents to enter into
Risk A quantitative measure of the magnitude of a potential
solid solution, then cooled rapidly enough to hold these
loss and the probability of incurring that loss
constituents in solution
Safety A state in which the risk of harm (to persons) or
Specification Document stating requirements
damage is limited to an acceptable level
Spot welding Welding of lapped parts in which fusion is
Scaling (1) Forming a thick layer of oxidation products on
confined to a relatively small circular area. It is generally
metals at high temperature. (2) Depositing water-insoluble
resistance welding, but may also be gas tungsten-arc, gas
constituents on a metal surface, as in cooling tubes and water
metal-arc, or submerged-arc welding
boilers
Stress The intensity of the internally distributed forces or
SCC Stress-corrosion cracking
components of forces that resist a change in the volume or
Sheet A flat-rolled metal product of some maximum shape of a material that is or has been subjected to external
thickness and minimum width arbitrarily dependent on the forces. Stress is expressed in force per unit area and is cal-
type of metal. It is thinner than plate and has a width-to- culated on the basis of the original dimensions of the cross-
thickness ratio greater than about 50 section of the specimen. Stress can be either direct (tension
or compression) or shear. Usually expressed in megapascals
Shield A metallic sheath surrounding one or more wires,
(MPa)
cables, cable assemblies, or a combination of wires and
cables that is used to prevent or reduce the transmission of Stress-corrosion cracking Failure of metals by cracking
electromagnetic energy to or from the enclosed conductors. under combined action of corrosion and stress, residual or
The shield also includes an insulating jacket that may cover applied. In brazing, the term applies to the cracking of
the metallic sheath stressed base metal due to the presence of a liquid filler metal
Solder A nonferrous, fusible metallic alloy used to join Stress relief Related to electronic assemblies: the formed
metallic surfaces portion of a conductor that provides sufficient length to
minimize stress between terminations
Solderability The property of a surface that allows it to be
wetted by a molten solder Stress-relief heat treatment Uniform heating of a structure
or a portion thereof to a sufficient temperature to relieve the
Solder connection An electrical/mechanical connection
major portion of the residual stresses, followed by uniform
that employs solder for the joining of two or more metal
cooling
surfaces
Stress relieving Heating to a suitable temperature, holding
Solder mask Coating material used to mask or protect
long enough to reduce residual stress, and then cooling slowly
selected areas of a pattern from the action of an etchant,
enough to minimize the development of new residual stresses
solder, or plating
Striation A fatigue fracture feature often observed in elec-
Solder spike A cone-shaped peak or sharp point of solder
tron micrographs that indicates the position of the crack front
usually formed by the premature cooling and solidification
after each succeeding cycle of stress. The distance between
of solder on removal of the heat source
striations indicates the advance of the crack front across that
Solidification The change in state from liquid to solid on crystal during one stress cycle, and a line normal to the
cooling through the melting temperature or melting range striation indicates the direction of local crack propagation
Solid solution A solid crystalline phase containing two or Substrate The layer of metal underlying a coating,
more chemical species in concentrations that may vary regardless of whether the layer is base metal
between limits imposed by phase equilibrium
Subsystem Set of interdependent elements constituted to
Solid solution strengthening A mechanism for strength- achieve a given objective by performing a specified function,
ening the alloy by dissolved elements in solid solution but which does not, on its own, satisfy the customer’s need
Solidus In a constitution or equilibrium diagram, the locus Supplier An organization that provides a product to the
of points representing the temperatures at which various customer
Glossary 637

Surface hardening A generic term covering several pro- Verification Confirmation by examination and provision of
cesses applicable to a suitable ferrous alloy that produces, by objective evidence that specified requirements have been
quench hardening only, a surface layer that is harder or more fulfilled
wear resistant than the core
Vickers hardness number (HV) A number related to the
Surface mounting The electrical connection of components applied load and the surface area of the permanent impres-
to the surface of a conductive pattern that does not utilize sion made by a square-based pyramidal diamond indenter
part holes having included face angles of 136°
Technology Readiness Level (TRL) Levels 1–9 used to Viscosity A measure of the resistance of a fluid to flow
define the maturity of a technical concept, from basic prin-
Waiver Written authorization to use or release a product
ciple to mission proven
which does not conform to the specified requirements
Temper In nonferrous alloys the hardness and strength
Wake The side opposite to the Ram side of a spacecraft. It
produced by mechanical or thermal treatment, or both, and
faces away from the spacecraft’s motion
characterized by a certain structure, mechanical properties,
or reduction in area during cold working Wave soldering A process wherein printed circuit boards
are brought in contact with the surface of continuously
Tensile strength In tensile testing, the ratio of maximum
flowing and circulating solder
load to original cross-sectional area. Also called ultimate
strength Weave exposure A surface condition of a printed-circuit-
board laminate in which the unbroken woven-glass cloth is
Test A formal process of exercising or putting to trial a
not uniformly covered by resin
system or item by manual or automatic means to identify
differences between specified, expected, and actual results Weldability A specific or relative measure of the ability of
a material to be welded under a given set of conditions.
Thermal shunt A device with good heat-dissipation char-
Implicit in this definition is the ability of the completed
acteristics used to conduct heat away from an article being
weldment to fulfil all service designed into the part
soldered
Wetting Flow and adhesion of a liquid to a solid surface,
Tinning The coating of a surface with a uniform layer of
characterized by smooth, even edges, and a low dihedral
solder
angle
Traceability Ability to trace the history, application, or
Wicking A flow of molten solder or cleaning solution by
location of an entity by means of recorded identifications
capillary action. Occurs when joining stranded wire; solder
Transverse direction Literally ‘across’. Usually signifying is drawn within the strands, but may not be visible on outer
a direction or plane perpendicular to the direction of work- surface of strands. Wicking may also occur within the stress-
ing. In rolled plate or sheet, the direction across the width is relief bend of a component lead
often called long transverse, and the direction through the
Widmanstätten structure A structure characterized by a
thickness, short transverse
geometrical pattern resulting from the formation of a new
Ultimate strength The maximum stress (tensile, compres- phase along certain crystallographic planes of the parent
sive, or shear) a material can sustain without fracture, solid solution. The orientation of the lattice in the new
determined by dividing maximum load by the original cross- phase is related crystallographically to the orientation of
sectional area of the specimen. Also known as nominal the lattice in the parent phase. The structure was origi-
strength or maximum strength nally observed in meteorites, but is readily produced in
many alloys, such as titanium, by appropriate heat
Unaided eye Normal Snellen 20/20 vision, including eye
treatment
glasses required to correct defective vision to 20/20 equiv-
alent. Does not include microscopes, eye loupes, or any Wire A thin, flexible, continuous length of metal, usually of
other magnifying device circular cross-section, and usually produced by drawing
through a die
Vacuum melting Melting in a vacuum to prevent contam-
ination from air, as well as to remove gases already dis- Workmanship The physical characteristics relating to the
solved in the metal; the solidification may also be carried out level of quality introduced by the manufacturing and
in a vacuum or at low pressure assembly activities
638 Glossary

Wrought A metal or alloy which has been deformed plas- exhibit a yield point. If there is a decrease in stress after
tically one or more times and which exhibits little or no yielding, a distinction may be made between upper and
evidence of cast structure lower yield points
Yield point The first stress in a material, usually less than Yield strength The stress at which a material exhibits a
the maximum attainable stress, at which an increase in strain specified deviation from proportionality of stress and strain.
occurs without an increase in stress. Only certain metals An offset of 0.2 % is used for many metals
References

Adams, D. M. (1994). Failure investigation into HST solar array drive ASTM D3359. (2010). Standard test methods for measuring adhesion
electronics. ESTEC Metallurgy Report No. 2038 (confidential). by tape test.
Adile, E., & Dunn, B. D. (1999). Effecto della geometria del raccordo ASTM E595. (2007). Standard test method for total mass loss and
di lega saldante sul comportamento a fatica meccanica di saldature CVCM from outgassing in a vacuum environment.
di component elettronici a montaggio superficiale. Rivista Italiana ASTM E835-94A. (1994). Standard method for determining residual
della Saldatura,4, 401–412. stresses by the hole-drilling strain gage method.
Adler, I. (1988). The analysis of extraterrestrial materials. In Chemical ASTM E2089. (2014). Standard practices for ground laboratory atomic
analysis (Vol. 81). New York: Wiley. oxygen interaction evaluation of materials for space applications.
Akinade, K., et al. (1995). Lead-free solder pastes evaluation. Soldering Athimoolam, M., & Moorthy, T. V. (2012). Polymer nanocomposite
and SMT Journal,20, 50–53. materials and shape memory applications—A review. Procedia
Allen, J. S., & Jubb, J. E. M. (1991). Dispute resolution—The Engineering,38, 3399–3408.
increasing role of the expert. Welding and Metal Fabrication Autumn, K., et al. (2000). Adhesive force of a single gecko foot-hair.
Journal, 81–84. Nature,405, 681–685.
Ambat, R., et al. (2009). Solder flux residues and electrochemical Babel, H. W., et al. (1994). Understanding and controlling the
migration failures of electronic devices. In Proceedings of Eurocorr degradation of silicone on exposed spacecraft surfaces. In Proceed-
2009 (pp. 1–14), paper 8141, Nice, France, September 2009. ings of the 6th International Symposium on Materials in Space
AMS 4942C. (1984). Titanium tubing, seamless. Society of Automo- Environment, ESTEC (pp. 19–26). ESA SP-368.
tive Engineers. Bacquias, G. (1982). La formation des ‘whiskers’ en bain d’etain acide
AMS International. (1991). Practical applications of residual stress brillant sur un support en maillechort. Oberfläche-Surface,23,
technology. In Conference Proceedings, Indianapolis, USA, May 194–196.
15–17. Ballinger, I. A., & Sims, D. (2003). Development of an EPDM
Anderson, P., & Wiktorowicz, R. (1995). Ozone emissions during arc elastomeric material for use in hydrazine propulsion systems. In
welding. Welding and Metal Fabrication Journal, 385–388. 39th AIAA Propulsion Conference, Huntsville, AL, July 21. AIAA
Anderson, M. J., et al. (1995). A post-flight tribological assessment of 2003-4611.
the Hubble Space Telescope solar array mechanism. In Proceedings Banks, B. (2003). Atomic oxygen effects on spacecraft materials,
of the 6th European Space Mechanisms and Tribology Symposium NASA TM-2003-212484.
(pp. 203–210). Zurich, October 4–6 (ESA SP-304). Banks, D. R., et al. (1990). Sn–Pb–In solder corrosion with water
Anon. (1981). Keys to improved brazing technology. Industrial soluble flux. In ASM 3rd International Electronic Materials and
Heating Journal, 31. Processing Conference (pp. 359–364). San Francisco, CA, August
Anon. (1994). EURECA, the European retrievable carrier, ESA WPP- 20–23.
069. Banks, S. (1995). Reflow soldering to gold. In Electronic packaging
Anon. (1995). Feasibility study of power generation system with shape and production (pp. 69–72).
memory alloys. New Energy Development Organisation, Tokyo, Barber, A. H., Lu, D., & Pugno, N. M. (2015). Extreme strength
NEDO-P-9324 (in Japanese). observed in limpet teeth. Journal of the Royal Society Interface,12,
Anon. (2011). Easy lead—Industry and innovations. Materials World: 20141326.
4–5. Barbier, P., & Le Floch, C. (1985). Holography—The NDT of
ANS (American National Standard). (1996). Requirements for soldered composite structures. In Proceedings of the Third European
electrical and electronic assemblies, J-STD-001B. Symposium on Spacecraft Materials in Space Environment,
Anthony, P. L., & Brown, O. M. (1965). Red plague corrosion. Noordwijk, ESA SP-232 (pp. 161–165).
Materials Protection,4(3), 8–18. Barbier, C., et al. (1992). ATOX—The ESTEC atomic oxygen
Arblaster, J. W. (1996). Thermodynamic properties of the platinum simulation facility. Preparing for the Future,2(2), 12–14.
metals. Platinum Metals Review,40, 62–63. Baumgartner, R. I., & Elvin, J. D. (1995) Lifting body—An innovative
Ashworth, M., & Dunn, B. D. (2015). An investigation into tin whisker concept (pp. 95–3531). AIAA publication.
growth over a 32-year period (to be published). Beal, J. D., et al. (2006). Forming of titanium and titanium alloys (Vol.
Asma, C. O., et al. (2010). Infrared thermography measurements on 14B, pp. 656–669). ASM Handbook.
ablative thermal protection systems for interplanetary space Bergendahl, C. G., & Dunn, B. D. (1984). Evaluation of test equipment
vehicles, QIRT Symposium, paper 007, Quebec, Canada, July 27– for the detection of contamination on electronic circuits. ESA STM-
30. 234.

© Springer International Publishing Switzerland 2016 639


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
640 References

Bernard, D. (2007). A practical guide to X-ray inspection criteria and Brooker, M. J., et al. (2001). Applying FSW to the Ariane 5 main motor
common defect analysis. Nordson-Dage Publication. thrust frame. ESA SP-468 (pp. 507–511).
Bernard, D., & Blish, R. C. (2005). Considerations for minimizing Brown, B. F. (1972). Stress-corrosion cracking in high-strength steels,
radiation doses to components during X-ray inspection. In Pro- and in titanium and aluminium alloys. U.S: Naval Research
ceedings ofthe 7th Electronic Packaging Technology Conference Laboratory.
(EPIC), Singapore, December 7–9. Brown, B. F. (1977). Stress corrosion cracking control measures, NBS
Bernard, D., & Golubovic, D. (2012). 3D board level X-ray inspection Monograph 156, Ch. 5 (pp. 35–41).
via limited angle computer tomography. In SMTA International Bruno, G., Dunn, B. D., et al. (2000). Neutron diffraction measure-
Conference, Orlando, FL, USA, October 14–28. ments for the determination of residual stress in Ti6Al4V welded
Berthoud, L. (1994). Micro-impacts on Eureca solar panels. In 6th plates. Material Science Forum,347–349, 674–690.
International Symposium on Materials in a Space Environment, Bruno, G., & Dunn, B. D. (2004). Surface and bulk residual stress in
Noordwijk, 239–248 (ESA SP 368). Ti6Al4V welded aerospace tanks. Transactions of the ASME,126,
Bester, M. H. (1968). Metallurgical aspects of soldering to gold. 284–292.
Internepcon (pp. 211–231). Brusciotti, F., et al. (2014). MAGNOLYA: Advanced environmentally
Beurs, J., et al. (1987). TEM-in situ deformation of beryllium single friendly chemical surface treatments for cast magnesium helicopter
crystals. Acta Metallurgical,35(9), 2277–2289. transmission alloys preservation. In Eurocorr 2014, Poster, Pisa,
Billot, M., et al. (1982). Ensuring solderability in electronic compo- Italy, September 8–12.
nents for space applications. Tin and Its Uses,131, 1–3. Bruzzone, P. (1987). Electrical properties of low MP alloys at 4.2 K.
Black, J. R. (1969). Electromigration failure modes. Proceedings of the Cryogenics,27, 433–436.
IEEE,57, 1587–1594. Buckley, D. H. (1981). Surface effects in adhesion, friction, wear and
Blackman, B. R. K., et al. (2012). The fracture behaviour of adhesively- lubrication. Amsterdam: Elsevier.
bonded composite joints: Effects of rate of test and mode of loading. Buis, A., & Schijve, J. (1992). SCC of Al–Li 2090-T83 in artificial
International Journal of Solids and Structures,49(13), 1434–1452. seawater. Corrosion,48(11), 898–909.
Blawert, C., & Srinivasan, P. B. (2010). Plasma electrolytic oxidation Bullettti, A., Dunn, B. D., et al. (2012). Investigation of resistivity
treatment of magnesium alloys. In H. Dong (Ed.), Surface Engi- variation of PCB laminates due to aging. IEEE Transactions on
neering of Light Alloys. Cambridge, UK: Woodhead Publishing Ltd. Components, Packaging, and Manufacturing Technology,2, 2001–
Blech, I. A., et al. (1975). Whisker growth in aluminium thin films. 2012.
Journal of Crystal Growth,32, 161–169. Bulwith, R. A. (1986). The rough of grainy solder phenomenon.
Borom, M. C., & Pask, J. A. (1966). Role of adherence oxides in the Printed Circuit Assembly,1(1), 14–23.
development of chemical bonding in glass seals. Journal of the Burnette, T., & Koschmeider, T. (2003). Solder joint failure analysis—
American Ceramic Society,49, 1. Dye penetrant technique. Advanced Packaging, 12, 25–27.
Bosma, S. J., et al. (1978). Evaluation of grounding systems. ESA STM Burrell, M. C., & Keane, J. J. (1988). Characterization of copper/
204, ESA STM 212 and ESA STM 213. enamel interfacial reactions during aging. Surface and Interface
Bosma, J. (2009). Powerhouse for Quality. ESA Bulletin, May 3–11. Analysis,11, 487–496.
Bouilly, J.-M., et al. (2006). Ablative TPS for entry in Mars Bushmire, D. W. (1977). Resistance increases in gold aluminium
atmosphere. In 4th International Planetary Probe Workshop, interconnects with time and temperature. IEEE Transactions on
Pasadena, CA, USA, June 27–30. Parts, Hybrids and Packaging,PHP-13(2), 152–156.
Bouilly, J.-M., et al. (2013). Aerofast: Development of innovative Bussu, G. (2009). Stress-corrosion cracking (Ch 12, materials and
thermal protections. In 7th European Workshop on TPS and Hot safety). In G. E. Musgrave (Ed.), Safety Design for Space Systems.
Structures, Noordwijk, The Netherlands, April 8–10. Oxford, UK: Elsevier Ltd.
Bousfield, B. (1988). A systematic approach to sample preparation. Bussu, G., & Dunn, B. D. (2002). ESA approach to the prevention of
Metals and Materials,4(12), 758–761. stress corrosion cracking in spacecraft hardware. In Joint ESA-
Bousfield, B. (1992). Surface preparation and microscopy of materials. NASA Space Flight Safety Conference. ESA-Estec, Noordwijk, The
Chichester, UK: Wiley. Netherlands.
Bousfield, B. (1997). The metallography of deformation by material Buttery, M., et al. (2011). Modern self-lubricating composites for space
removal. Praktische Metallographie,34(1), 2–22. applications: PGM-HT and Sintimid 15 M. In 14th European Space
Boustedt, K., & Hedemalm, P. (1995). The Nordic flip-chip project. In Mechanisms and Tribology Symposium (ESMATS 2011). Con-
Proceedings of the 1995 International Flip Chip, Ball grid, TAB and stance, Germany, September 28–30.
advanced packaging Symposium (pp. 294–299), San Jose, Ca., USA. Cable, N. (1988). Use of pyrotechnics on spacecraft. ESA Bulletin,54,
Boving, H. J., & Hintermann, H. E. (1987). Properties and perfor- 66–71.
mances of chemical-vapour-deposited TiC-coated ball-bearing Cahn, R. W., & Haasen, P. (1996). Physical metallurgy. Netherlands:
components. Thin Solid Films,153, 253–266. Elsevier Science B.V. (see Chapter 29).
Bradley, E. (2007). Lead-free electronics: iNEMI projects lead to Calle, L. M. (2014). NASA’s corrosion lab at KSC: Anticipating,
successful manufacturing, pub. Hoboken, USA: Wiley. managing, and preventing corrosion. In International Workshop on
Brandes, E. A. (1992). Smithells metals reference book (7th ed.). Environmental and Alternate Energy. Kennedy Space Centre,
Oxford, UK: Butterworth-Heinemann. October 21–24.
Brewer, D. H. (1970). Solders for thick gold plate. Welding Research Calow, C. A. (1974). Are metal matrix composites viable? Practical
Sup (pp. 465–470). metallic composites 3. Spring Meeting, Institution of Metallurgists.
Briscoe, H. M. (1982). Proceedings of the international symposium on Campbell, J. E. (1980). Alloys for structural applications at subzero
spacecraft materials in space environment (pp. 27–34). ESA SP-178. temperatures. Metals Handbook (9th ed., Vol. 3, pp. 721–772). ASM.
Brizuela, M., et al. (2009). Tribolab: An experiment on space tribology, Capineri, L., Dunn, B. D., et al. (2003). Partial discharge testing of
in orbit data at the IIS. In Proceedings of the 13th European Space solder fillets on PCBs in a partial vacuum: new experimental results.
Mechanisms and Tribology Symposium (ESMATS 2009). Vienna, IEEE Transactions on Electronics Packaging Manufacturing,26,
Austria, September 23–25. 294–305.
References 641

Case, R. K., et al. (1984). Beryllium—The lightweight contender. Coope, T. S., et al. (2014). Repeated self-healing of microvascular
Machine Design, 56, 58–61. carbon fibre reinforced polymer composites. Smart Materials and
Ceccanti, F., et al. (2010). 3-D printing technology for a Moon outpost Structures, 23(11), 115002.
exploiting lunar soil. 61st International Astronautical Congress Corocher, G., et al. (2009). Evaluation of different test techniques to
(pp. 1–9). Prague, CZ (IAC-10-D3.3.5). assess the effect of environmental exposure on the assembly of
Chaffin, R. J. (1981). Migration of silver from silver-loaded polyimide MCGA packages for printed circuit boards. 11th ISMSE Interna-
adhesive chip bonds. In IEEE Transactions on C.H.M. Technology tional Symposium, Aix-en-Provence, France, September 15–18.
(Vol. 4, No. 2, pp. 214–216). June. Cornec, L., & Clariou, J.-P. (1994). Carbon–magnesium MMC for
Chaillot, A., et al. (2014). ENEPIG finish: An alternative solution for light-weight aerospace structures. In Proceedings of the Interna-
printed circuit boards. In Electronic Materials and Processes tional Symposium on Advanced Materials, ESTEC, Noordwijk
Workshop (EMPS-5). Estec, Noordwijk, The Netherlands, May (pp. 563–567). ESA WPP-070.
20–24. Craig, B. (1994). Lead-free solder: An update. Electronic Production,
Charrier, I., Dunn, B. D., et al. (2003). Moisture pick-up and minimum 21–25.
drying conditions of epoxy and polyimide-glass printed circuit Craven, E. (1993). Solderability—The effect on quality manufacturing.
boards. In Brasage/Soldering, International Conference. Brest, Electronic Production, 33–35.
France, October 8–10. Damskey, R. G. (1988). A satellite structure—Manager’s look at
Chelladurai, T., et al. (1995). Acoustic emission response of 18 % Ni beryllium. The Beryllium Users’ Symposium,Europe.
maraging steel weldment with inserted cracks of varying depth to Danford, M. D. (1994). The corrosion protection of several aluminium
thickness ratio. Materials Evaluation,53(6), 742–746. alloys by chromic acid and sulphuric acid anodizing. NASA
Chen, Y., et al. (2014). A comprehensive investigation of the galvanic Technical Paper 3490.
corrosion induced Ag-Al bond degradation in microelectronic de Salazar, Gomez, et al. (1988). Diffusion bonding of aluminium
packaging using argon ion milling, SEM, dual beam FIB-SEM, alloys using silver coatings. Practice Metals,25, 532–542.
STEM-EDS and TOF-SIMS. 40th ISTFA, Houston, TX, USA, de Rooij, A. (1985). The degradation of metal surfaces by atomic
November 9–13. oxygen. In Proceedings of 3rd European Symposium on Spacecraft
Chenard, S. (1990). Space: Dirty and dangerous? Space Markets,5, Materials in Space Environment (p. 99). ESA SP-232, October.
253–256. de Rooij, A. (1989). Bimetallic compatible couples. ESA Jnl.,13, 199–
Choi, S. J., et al. (1996). A Nitinol-based solar array deployment 209.
mechanism. In 30th Aerospace Mechanisms Symposium, Hampton, de Rooij, A. (1989b). An approach to long term prediction of the
Va. (103–118). NASA Conf. Pub. No. 3328. May. atomic oxygen effect on materials (to be published).
Chollet, L., et al. (1985). Journal of Mater Energy System,6(4), 293–299. de Rooij, A. (1995a). Atomic oxygen effects on HST-SA1 metals. In
Chudnovsky, B. H. (2002). Degradation of power contacts in industrial Hubble Space Telescope Solar Array Workshop (pp. 341–353),
atmospheres: silver corrosion and whiskers. In Proceedings of the Noordwijk, May.
48th IEEE Holm Conference on Electrical Contacts, Orlando, USA. de Rooij, A. (1995b). Space exposure of HST-SA1 tagboards. Hubble
Chuvilin, A., et al. (2014). Using TEM to simulate and understand the Space Telescope Solar Array Workshop, ESTEC (pp. 449–462).
formation of defects in graphine. In Microscopy and Analysis, ESA WPP-77.
November/December 7–10. de Rooij, A., & Collins, D. C. (1995). SLAM investigations on HST-
Cleave, J. F., & Morton, J. R. (1989). The effects of impurity levels of SA1 solar cell welds. In Hubble Space Telescope Workshop—
lithium on aluminium casting alloys. The Foundryman,82, 549–592. Results from Post-flight Investigations, ESTEC, Noordwijk, May
Clemens, H., & Schretter, P. (1996). Microstructure and properties of 30–31. ESA WPP-77.
Gamma-TiAl based alloys. Practical Metallogarphy Journal,33(1), de Rooij, A. (2010). Exposure of silver to atomic oxygen. In
17–35. EUROCORR 2010, Moscow, Russia, September 13–17.
Clements, H., et al. (1996). Intermetallic gamma titanium aluminides— De Rooij, N., et al. (2009). MEMS for Space. IEEE Transducers
Potential candidates for spacecraft structures. ESA Conference on Conference (pp. 17–24). Denver, CO, USA, June 21–25.
Spacecraft Structures, Materials and Mechanical Testing, Noord- Dauphin, J. (1984). Selection and control of materials for space
wijk, March 27–29. applications. ESA Journal,8(1), 53.
Coelho, A. (2009). Comeback for cork. Materials World, 17, 24. Dauphin, J. (1986). Space materials in Europe. In Proceedings of the
Cohen, A. (1995). Copper and copper alloy wires, cables and SAMPE Conference (pp. 276–290), Las Vegas.
conductors. ASTM Standardization News, 23–27. Dauphin, J. (1987). In J. de Bossu (ed.), Atomic oxygen—A low orbit
Cole, L. S., et al. (2004). Some recent trends in corrosion science and plague. Looking ahead for materials and processes (pp. 345–367).
their application to conservation. In Proceedings of Metal (National Amsterdam: Elsevier Science Publishers B.V.
Museum of Australia, Canberra), October 2–16. Dauphin, J. (1992). Touchstone for success: The materials and
Cole, P. T., & Thomas, N. (1989). Ariane IV Spelda-Flight proving by processes laboratory, ESA BR-52.
acoustic emission. In Proceedings of AECM-3 (pp. 144–150). Paris, Dauphin, J. (1993). Radiation effects in materials. Radiation Physics
July 17–21. and Chemistry,43, 47–56.
Colla, V., et al. (2014). Monitoring concepts for a 3-D printer applied to Dauphin, J., Dunn, B. D., Judd, M. D., & Levadou, F. (1991). Materials
build a human outpost on the Moon. In UKSim-AMSS 16th for space application. Metals and Materials, 422–430.
International Conference on Computer Modelling and Simulation David, L. (1995). Radarsat built to resist debris bumps. Space News.
(pp. 205–210). David, L. (1996). Incredible shrinking spacecraft. Aerospace America,
Comiskey, J. M. (1979). Materials that make wire for spacecraft use. In 20–24.
Aerospace Corporation,Proceedings of Symposium on Wire Appli- Davy, J. G., & Skold, R. (1985). Computer-aided solderability testing
cations in Spacecraft, December. for receiving inspection. Circuit World, 34–41.
Cooke, R. W. (2010). Red plague control plan (RPCP), the control of DeBold, T. A., & Kosa, T. (2004). Pasivating stainless stell parts.
cuprous/cupric oxide corrosion. http://ntrs.nasa.gov/archive/nasa/- NASA Technical Briefs, 51–52.
casi.ntrs.nasa.gov/20100009723.pdf. Degisher, H. P., & Simancik, F. (1995). Recyclable foamed aluminium
as an alternative to composites. In H. Warlimont (Ed.),
642 References

Environmental Aspects in Materials Research (pp. 137–140). DGM Dunn, B. D. (1982a). Evaluation of various solar cell-to-interconnector
Informations gesellschaft. welds by means of scanning laser acoustic microscopy and
Delahais, M. L. L. (1985). Materials and processes in scientific metallography. ESA STM-225, August.
spacecraft. In Proceedings of the 3rd European Symposium in Dunn, B. D. (1982b). Evaluation of various solar cell to interconnector
Spacecraft Materials in Space Environment. ESA SP-232, October welds by SLAM and metallography. ESA STM-225.
5–7. Dunn, B. D. (1984). The corrosion properties of Spacelab structural
Deloo, P., et al. (1995). HST Solar Array 1 Dynamic Performance. HST alloy aluminium 2219-T851, ESA STR-212.
Solar Array Workshop (pp. 89–100). ESTEC, ESA WPP-77, May Dunn, B. D. (1987). A laboratory study of tin whisker growth. ESA
30–31. STR-223.
De Marco, M., et al. (2015a). Introduzione ai modi di frattura ed Dunn, B. D. (1988). Mechanical and electrical characteristics of tin
all’analisi fracttografica. Parte 1. Rev. It. Della Saldatura, 1, 95–106. whiskers. ESA Journal,11 and 12, 1–17.
De Marco, M., et al. (2015b). Introduzione ai modi di frattura ed Dunn, B. D. (2001). Innovative Materials and Processes. Space
all’analisi fracttografica. Parte 2. Rev. It. Della Saldatura, 2, 229–242. Technology Innovation Workshop (pp. 21–134). Copenhagen.
Dittes, M., et al. (2003). The effect of temperature cycling on tin ESA WPP-197, September 6–7.
whisker formation. In Proceedings of the Electronics Packaging Dunn, B. D. (1993). Metallurgical evaluation of steam aged LCCC
Technology Conference (pp. 183–188). devices following solderability testing. Soldering and SMT,15,
Didziulis, S. V. (1994). Detergent cleaning of bearings for spacecraft 26–32.
applications. In Non-Ozone Depleting Chemical Cleaning and Dunn, B. D. (2008). Workmanship standards and their application on
Lubrication of Space System Mechanical Components for Multi- ESA projects. Soldering and SMT Journal,20(4), 37–44.
Year Operations, EPA Workshop, Denver, Co, September 26–27. Dunn, B. D. (2008). ESA-approved skills training schools—Electronic
Dohle, G. R., et al. (1996). A new bonding technique for microwave assembly techniques, ESA-STR-258, November.
devices. IEEE Transactions on Components Hybrids and Manu- Dunn, B. D. (2012). Guidelines for a creating a lead-free control plan.
facturing Technology,19(1), 57–63. ESA STM-281, October.
Dorsey, J. T., et al. (2012). An efficient and versatile means for Dunn, B. D., & Bergendahl, C. G. (1987). An evaluation of the solvent
assembling and manufacturing systems in space. In AIAA Space extraction method for the detection of ionic contamination on
Conference and Exposition, Pasadena, CA, USA, September 11–13. substrates supporting large surface mounted devices. Brazing and
Downs, K. S., & Hamstad, M. A. (1995). High sensor density A.E. Soldering Journal, 20–27, 32.
monitoring of graphite/epoxy pressure vessels. In The American Dunn, B. D., & Chandler, C. (1980). The corrosive effect of soldering
Society for Nondestructive Testing, Proceedings of AECM-4 fluxes and handling on some electronic materials. Welding
(pp. 13–22). Sundsvall, July 10–14. Journal,59, 289–307.
Doyle, D. P., et al. (1963). A rapid method for determining the Dunn, B. D., & Collins, D. S. (1978). Materials investigation for a
corrosivity of the atmosphere at any location. Nature,200(4912), failed spacecraft antenna. ESA Journal,2, 223–235.
1167–1168. Dunn, B. D., & Desplat, P. (1994). Evaluation of conformal coatings
Doyle, E., & Hubbard, P. (2010). Innovation in nitriding. International for future spacecraft applications. ESA SP-1173, August.
Heat Treatment and Surface Engineering,4(1), 33–39. Dunn, B. D., & Nicholas, D. (1998). Elemental distribution of parts and
Dricot, F., et al. (1994). Programme for the evaluation of materials used materials making up an electronic box. Circuit World,24(2), 21–23.
in low Earth orbit and manned spacecrafts. In 6th International Dunn, B. D., & Mozdzen, G. (2014). Tin oxide coverage on tin whisker
Symposium on Materials in a Space Environment (pp. 293–297). surfaces, measurements and implications for electronic circuits.
Noordwijk, (ESA SP-368). Soldering and SMT Jnl.,26(3), 139–146.
Drolshagen, G. (1994). Eureca meteoroid/debris analysis. In Eureca Dunn, B. D., & Papenburg, H. (1986). Material investigation into the
Technical Report (pp. 507–512). ESA WPP-069. deactivation of catalyst particles for hydrazine decomposition. In
Drolshagen, G., et al. (1996). Optical survey of micrometeoroid and Proceedings of the Fifteenth Inernational Symposium on Space
space debris impact features on Eureca. Planetary Space Science,44 Technology and Science, Tokyo.
(4), 317–340. Dunn, B. D., & Stanyon, R. (1997). An Inspection of Spacelab
Drogoul, S. (2005). From the failure to the success—The return to Hardware. ESA STR-241, September.
flight of the Ariane 5 ECA launcher. In 56th International Dunn, B. D., & Steinz, J. A. (1974). Contamination and heating effects
Astronautical Congress, Session D2.2, IAC-05-D2.2.08, Fukuoka, of a hydrazine thruster intended for use on-board the scientific
Japan. geostationary satellite. ESRO (ESA) TM-152, April.
Dunkerton, S., Dunn, B. D., & Fernie, W. B. (2001). Welding and Dunn, B. D., et al. (1983). Evaluation of the temperatures attained by
joining in a space environment. Revista Italiana della Saldatura, electronic components during various manual soldering operations.
Anno LIII,5, 615–627. Brazing and Soldering Journal,5, 45–53.
Dunn, B. D. (1973). European team visit TRW Systems to learn Dunn, B. D., et al. (1984). Corrosion of silver plated copper conductors.
techniques for the future. TRW Sentinel (p. 6), November 9. ESA Journal,8, 307–335.
Dunn, B. D. (1975). The properties of near-eutectic tin/lead solder Durin, C., et al. (1993). System results from FRECOPA. In 3rd Post
alloys tested between +70 and −60 °C and the use of such alloys in Retrieval Conference (pp. 1153–1165). Williamsburg, November
spacecraft electronics, ESA TM-162, September. 8–12, NASA Pub. 3275 part 3.
Dunn, B. D. (1977). Metallurgical evaluation of tin–lead finishes on Dzhanibekov, V. A., et al. (1991). Welding equipment for space
PCBs. Transactions of the Institute of Metal Finishing,55, 86–92. applications. In Proceedings of the “Welding in Space and the
Dunn, B. D. (1978). Examination of new types of solder-splices. ESA Construction of Space Vehicles by Welding”, sponsored by
TM-210, September. American Welding Society, USA and E O Paton Welding Institute,
Dunn, B. D. (1979). The resistance of space quality solder joints to Ukraine, September 1991.
thermal fatigue. Circuit World part 1 5(4), 11–17; part 2 6(1), 16–27. Ecord. G. M. (1972). Apollo Experience report—Pressure vessels.
Dunn, B. D. (1980). The Fusing of tin–lead plating on high quality NASA TN-D-6975, September.
printed circuit boards. Transactions of the Institute of Metal ECSS-Q-ST-70. (2014). Materials, mechanical parts and process—
Finishing,58, 26–28. Space product assurance requirements.
References 643

Ehmann, D. (1994). Space structures of high precision. Dornier Post,1, Felton, L. E., et al. (1991). Cu-Sn precipitates in solder joints. Scripta
15–17. Metallurgica et Materialia,25, 2329–2333.
Elking, M. J., & Hughes, H. E. (1969). Prevention of stress corrosion Feng, W., et al. (2013). Electro-migration model parameters sensitivity
failure in semiconductor leads. Bell Telephone Report in: Physics of analysis based on Monte Carlo method. Chemical Engineering
Failure in Electronics, 5, 447–495. Transactions,33, 1093–1098.
Ellis, B. N. (1996). The correlation between short- and long-term SIR Fernie, J. A., & Sturgeon, A. (1992), Joining ceramic materials. Metals
testing. Circuit World,22(2), 49–50. and Materials, 212–217
Ellis, M. B. D. (1996). Fusion welding of aluminium-lithium alloys. Fink, M., & Dunn, B. D., et al. (2006). Characterisation of Teflon FEP
Welding and Metal Fabrication Journal. 55–60. (Hubble ST and LDEF) following long term exposure to LEO. In 11th
Ellis, M. B. D., & Gittos, M. F. (1995). Tungsten inert gas welding International Symposium on ISMSE, Collioure, France, June 19–23.
of titanium and its alloys. Welding and Metal Fabrication Journal, Fink, M., Dunn, B. D., et al. (2008). Measurement of mechanical
9–12. properties of electronic materials down to 4.2K. Cryogenics
Ely, J. K. (1942). Method of making electrical contact members. U.S. Journal,48, 497–510.
patent 2295338 of 8 September. Fink, M., Semerad, E., & Dunn, B. D., et al. (2009). Electrical
Engel, L., & Klingele, H. (1981). An Atlas of Metal Damage. London: resistivity of solders at low temperatures. In 11th International
Carl Hanser Verlag and Wolfe Publishing Ltd. Symposium on ISMSE, Aix-en-Provence, France, September 15–16.
Engelmaier, W. (1995). Fatigue life of leadless chip carrier solder joints Fink, M., et al. (2009). In Proceedings of the 13th European Space
during power cycling. In Solder Joint Reliability Workshop Notes, Mechanisms and Tribology Symposium, Vienna, September 23–25.
Engelmaier Associates Inc., Mendham, NJ, USA (see also IEEE Fletcher, P. (1978). Problems encountered with the use of semi-rigid
Transactions Components, Hybrids and Manufacturing Technol- co-axial cable in spacecraft electronics, ESA-STM-209, September.
ogy6(3), 232–237, 1983). Flin, E. D. (2005). Soldering in space holds surprises, Aerospace
Engemann, J. (1996). Chancen und moglichkeiten der plasmatechnolo- America, 24–25.
gie: eine bestandsaufnahme. Vakuum in Forschung und Praxis,1, Flom, Y. (2005). Brazing in space—Enabling the next frontier. In
25–30. TheAWS 35th International Brazing and Soldering Symposium,
EPA–US Environmental Protection Agency. (1994). Replacing solvent Dallas, TX, USA, April 26.
cleaning with aqueous cleaning, EPA-600/R-94-131. Flom, Y. (2006). Electron beam brazing of titanium for construction in
Erdman, N., Campbell, R., & Asahina, S. (2006). Argon beam cross space, NASA GSFC. In Proceedings of the 3rd International Brazing
sectioning. Advance Materials and Processes, 33–35. and Soldering Conference, San Antonio, TX, USA, April 24–26.
ECSS-E-ST-32-08. (2013). Space engineering: Materials, draft, Flury, W. (Eds.). (1993). First European conference on space debris.
December. ESA SD-01.
ECSS-Q-ST selected ECSS standards related to materials and processes Foster, C. L., et al. (1995). The solar array-induced disturbance of the
can be seen listed in Appendix 9. HST pointing system. NASA Technical Paper3556, May.
ESA PSS-01-401. (1994). EAS fracture control requirements. Fox, V. C., et al. (1999). The structure of tribologically improved
ESA PSS-01-701. (1994). Data for selection of space materials. Issue 1, MoS2—Metal composite coatings and their industrial applications.
rev. 3. Surface and Coatings Technology,116–119, 492–497.
ESA PSS-01-703 A method for black anodising aluminium with Fox, R. M., et al. (2010). Chemistry and technology of lubricants, Ch.
inorganic dyes. 13, Liquid lubricants for space applications. Heidelberg: Springer
ESA PSS-01-708. The manual soldering of high-reliability electronics. Publishing.
ESA PSS-01-721. Application and testing of Cuvertin 306, a black Frankel, H. E. (1969). Effect of vacuum on materials, ESRO TN-77.
paint for space use. Frear, D. R., & Vianco, P. T. (1994). Intermetallic growth rate and
ESA PSS-01-730. (1981). The wire-wrapping of high-reliability mechanical behaviour of low and high melting temperature solder
electrical connections. alloys. Metallurgical and Materials Transactions A,25, 1509–1523.
ESA PSS-01-736. (1981). Material selection for controlling stress- Frear, D. R., et al. (1993). The mechanics of solder alloy interconnects.
corrosion cracking of ESA spacecraft and associated equipment, May. New York: Van Nostrand Reinhold.
ESA PSS-01-737. (1982). Test method for determination of the stress- Gabe, D. R. (1978). Principles of metal surface treatment and
corrosion susceptibility of spacecraft structural alloys. protection. Oxford: Pergamon Press.
ESA PSS-01-738 (Issue 1). (1991). High-reliability soldering for Galleo, K. (1995). Assembly with conductive adhesives. IPC Technical
surface-mount and mixed technology printed. Review, 20–28.
ESA PSS-01-746. (1993). General requirements for threaded fasteners. Galvao, I., et al. (2011). Formation and distribution of brittle structures
E. S. K. (1995). Engineered ceramics. Paper from Elektroschmelzwerk in FSW of aluminium and copper: Influence of process parameters.
Kempten GmbH, Munich, Germany. Science and Technology of Welding and Joining,16(8), 681–689.
Evans, R. (1995). Fume extraction. Electronic Production, 14–16. Gamwell, W. R. (1995). NASA-wide fastener technical interchange
Eyre, T. S. (1991). Friction and wear control in industry. Metals and meeting. NASA Conference Publication 3308, July.
Materials, 143–148. Garner, H. R., et al. (1976). Whisker growth from decorative zinc deposits.
Fang, D., & Berkovits, A. (1995). Fatigue design model based on In Proceedings of the 9th World Congress on Metal Finishing.
damage mechanisms revealed by AE. Trans ASME,117, 200–208. Garrison, A., et al. (1995). How much rework is too much. Soldering
Favre, J.-P., & Raud, C. (1995). Acoustic emission to monitor crack and SMT Journal,19, 48–51.
accumulation in crossply CFRP under mechanical loading or thermal George, E., & Pecht, M. (2013). Tin whisker analysis of an automobile
cycling. In The American Society for Nondestructive Testing, engine control unit, microelectronics reliability. http://dx.doi.org/
Proceedings of AECM-4 (pp. 33–42). Sundsvall, July 10–14. 10.1016/j.microrel.2013.07.134.
Feest, A. (1994). Interfacial phenomena in metal-matrix composites. Gerlach, L. (1995). Co-ordinator. In Proceedings of the Hubble Space
Composites Journal,25(2), 75–86. Telescope Solar Array Workshop, ESA WPP-077.
Fellas, C. (1982). Anti-static coat for solar arrays. In Proceedings of the Ghate, P. B. (1982). Electromigration-induced failures. In IEEE 20th
3rd European Symposium on Photovoltaic Generators in Space, Annual Proceedings, Reliability Physics (pp. 292–299). San Diego,
Bath, UK (p. 305). March–April.
644 References

Ghaffarian, R. (2013). 3D X-ray CT for BGA/CGA workmanship defect Hagge, J. K., & Davis, G. J. (1984). Ageing, solder thickness, and
detection. NASA JPL Publication 12-21 12/12. solder alloy effects on circuit board solderability. IPC Technique
Ghidini, T., et al. (2008). Stress-corrosion cracking assessment in Review,25(9), 13–23.
spacecraft propulsion systems, Technology Evaluation for Envi- Hagge, J. K., & Davis, G. J. (1985). Ageing, solder thickness and solder
ronmental Risk Mitigation (TEERM) Workshop, San Diego, CA, effects on circuit board solderability. Circuit World,11(3), 8–15.
USA, November 18–20. Haines, J. E., et al. (1995). HST solar array drive electronics: In-flight
Gilbrech, J., et al. (2005). Cloud-aerosol LIDAR and IR Pathfinder history and servicing mission activities. In HST Solar Array
satellite observation (CALIPSO) spacecraft—Independent technical Workshop, ESTEC, (ESA WPP-77) (pp. 111–118).
assessment, NASA/TM-2005-213231/Version 2.0, March. Hall, W., & Williams, P. (2007). Processing waste pc boards for
Gobbi, S. L., & Zhang, L. (1994). Laser welding for lightweight material recovery. Circuit World,33, 43–50.
structures. In International Symposium on Advanced Materials for Halpin, J. C. (1985). Proceedings of the 31st Annual Technical Meeting
Lightweight Structures, ESA-ESTEC (pp. 107–113). 22–24 March. of the Meeting of the Institute of Environmental Sciences (pp. 206–
ESA WPP-070. 218). Las Vegas, April 30–May 2.
Goddard, D. M. (1984). Report on graphite/magnesium castings. Metal Hamacher, H., et al. (1995). Surface erosion in low Earth orbit. In
Progress, 49–52. ATOXSymposium on Scientific Results on the German Spacelab
Golberg, D., et al. (1995). High-temperature shape memory effect. Mission. D-2, Norderney: WPF publication.
Materials Letters,22, 241–248. Hammesfahr, A. E., et al. (1995). An X-ray mirror assembly based on
Goldberg, I. B., et al. (1990). Magnetic susceptibility of Inconel alloys carbon fibre technology. Space Technology,14(6), 391–397.
at cryogenic temperature. Advances in Cryogenic Engineering Hamstad, M. A. (1986). A review: Acoustic emission, a tool for
(Materials) Journal,36, 755–761. composite-material studies. Experimental Mechanics, March 7–13.
Goldmann, L. S., et al. (1977). Lead–indium for controlled-collapse Hannech, E. B., & Hall, C. R. (1992). Diffusion controlled reactions in
chip joining. In Electronic Components Conference (pp. 25–29). gold/solder system. Materials Science and Technology,8, 817–824.
Goldstein, J. I., et al. (1981). Scanning electron microscopy and X-ray Hansen, M. (1958). Constitution of binary alloys. New York: McGraw-
microanalysis. New York: Plenum Press. Hill.
Gonnet, L. (1995). Towards an ergonomic design of welding stations. Haq Qureshi, A., & Dayton, J. A. (1995). Insulation requirements of
Rivista Italiana della Saldatura,2, 177–183. high-voltage power systems in future spacecraft. NASA Technical
Goodhew, P. J. (1988). Modular MSc degrees: A way of keeping up Paper No.3520, June.
with materials and techniques. Metals and Materials,4(2), 112. Harris, P. G., et al. (1992). Stripping and replacement of damaged
Grady, M. M., & Wright, I. P. (1996). Space invaders. European solderable coatings. Soldering and SMT Journal,12, 21–26.
Microscopy and Analysis Journal 42, June 13–14. Harris, P. G. (1995). Conductive adhesives a critical review of progress
Grande, D. H., et al. (1988). Fibre–matrix bond strength studies. to date. Soldering and SMT Journal,20, 19–21.
Journal of Materials Science,23, 311–328. Haschiguchi, D., et al. (1992). Aluminium–beryllium alloys for
Grant, L. A. (1983) Beryllium sheet materials to satellite structure. In aerospace applications. In Proceedings of the International Sympo-
24th Annual AIAA SDM Conference, Lake Tahoe, May. sium Advanced Materials for Lightweight Structures (pp. 165–169).
Greenberg, M. A., et al. (2013). Inhomogenieties of the interface ESTEC, March 25–27, ESA SP-336.
produced by explosive welding. Physics of Metals and Metallog- Hashemzadeh, M. N. (2005). Study of tin whisker growth and their
raphy,113(2), 176–189. mechanical and electrical properties (PhD thesis, Linkopings
Gregoratti, L., et al. (2013). Large gecko mimetic tapes as new joining Universitty, Stockholm, 2005), September.
technology. In Proceedings of the 12th International Symposium on Hashimoto, K., et al. (1991). Flip chip interconnection technology for
Materials in Space Environment, Noordwijk, The Netherlands GLSI packages operated in liquid nitrogen. IEICE Transactions,
(ESA SP-705). E74, 2362–2368.
Grey, M. W. (1989). Inner layer or post cracking on multilayer printed Hassan, J., et al. (2014). Recent advancements in focused ion beam
circuit boards. Circuit World,15(2), 22–29. applications: A review. International Journal of Recent Scientific
Grilli, R., Dunn, B. D., et al. (2010). Locallised corrosion of Research,5, 123–127.
Aluminium 2219 alloy exposed to a 3.5 %NaCl solution. Corrosion Hauer, H. (1977). Properties of soft soldered joints on gold plated thin
Science,52, 2855–2866. film conductors. In International Conference on Thin Film Tech-
Grilli, R., Dunn, B. D., et al. (2010). Localized corrosion on 2219 nology (Vol. 60, pp. 185–190). NTG-Facher.
aluminium alloy coated with a titanium based conversion coating. Haupt, C. W. (1996). Residual stress measurement of titanium weld
Surface and Interface Analysis Journal,42(6–7), 610–615. certification rings. In 32nd AIAA Joint Propulsion Conference
Grinberg, N. M. (1982). The effect of a vacuum on fatigue crack (p. 10). Lake Buena Vista, FL, paper AIAAA-96-2750, July 1–3.
growth. International Journal of Fatigue, April 83–95. Hawkins, T.W., et al. (2010). Reduced toxicity, high performance
Griner, C. S. (1968). Redeposition of vacuum outgassed products. monopropellant at the US air force laboratory. In 4th International
NASA TM X-53 801, MSFC, November. Association for the Space Safety Conference, Huntsville, AL, May.
Gross, J. H. (2011). Mass spectroscopy. Heidelberg: Springer. Healy, T. J., et al. (1995). Key technologies being developed for RLV
Gruenbaum, P., & Dursch, H. (1993). Space environment effects on (pp. 1995–3608). AIAA paper.
solar cells: LDEF and other flight test. In 3rd Post Retrieval Hegin, B. V. (n.d). Electroplating and black anodisation of aluminium.
Conference (pp. 1167–1177). Williamsburg, November 8–12, Galvanische Industrie, Heerde, Holland (trade leaflet).
NASA Publication 3275 part 3. Hehemann, P. F. (1985). Stress corrosion cracking of stainless steels.
Gruhl, W. (1984). Stress corrosion cracking of high strength aluminium Metallurgy Transactions A,16A, 1909–1923.
alloys. Z. Metallkde,75, 819–826. Heiken, G. H., et al. (1974). Lunar deposits of possible pyroclastic
Gurklis, J. A. (1972). Non-traditional machining of beryllium. Metals origin. Geochimica Cosmochimica Acta,38, 1703–1718.
and Ceramics Information Center, Battelle, MCIC, January 3. Hemptenmacher, J., et al. (1994). Characteristics of SiC–Fibre/Ti6A14
Guyenne, T.-D. (1994). Compiler. In 6th International Symposium on V–Matrix composites by macro-indentation tests. Practical
Materials in a Space Environment, ESA SP-368. Metals,31(3), 110–119.
References 645

Hendrich, CH., et al. (2014). Influence of water content in an ADN- Jagt, van der, et al. (1991). Anti-wear/corrosion treatment for austenitic
based liquid monopropellant on performance characteristics. In steel: The Hardcor process. Materials & Design,12(1), 41–46.
Space propulsion, May 19–22. Germany: Cologne. IPC-7095A. (2004). Design and assembly process implementation for
Hepp, A. F., et al. (1999). Metal alloy propellants produced from lunar BGAs, October.
resources. In Symposium Materials in Space—Science, Technology IPC-D-279. (1996). Design guidelines for reliable surface mount
and Exploration (pp. 39–47). Boston, MA, USA, 29th November– technology printed board assemblies, July.
2nd December. IPC-SM-780. (1987). Advanced packaging and interconnection of
Heltzel, S. (2014). Latent short circuits failure in high-rel pcbs caused electronic components.
by lack of cleanliness of pcb processes and base materials, 5th IPC-SM-782. (1992). Surface mount land patterns (configuration and
EMPS Workshop, Estec, Noordwijk, The Netherlands, May 22. design rules).
Hinton, Y. L. (1995). Acoustic emission. ASTM Standardization News, IPC-TM-650. (2000). Electrochemical migration resistance test.
36–39. Irving, B. (1992). SCC: Welding’s No. 1 nemesis. Welding Journal,
Hipolite, W. (2015). NASA 3D prints copper rocket engine part. 3D 37–40.
Printing, April 22. Isakowitz, S. J. (1995). International reference guide to space launch
Heycock, C. T., & Neville, F. H. (1900). Philosophical Transactions of systems (2nd ed.). Waldorf, MD, USA: AIAA publication.
the Royal Society, 194A: 201 Jackson, B. C. (1987). Oxide coatings for bonding multilayer PCBs.
Hillman, D. D., & Chumbley, L. S. (2006). Characterization of tin Transactions IMF,65(8), 8–9.
oxidation products using sequential electrochemical reduction Jackson, C. R. (1973). Lead–indium solder alloy won’t embrittle in
analysis (SERA). Soldering and SMT Journal,8(3), 31–41. gold. Circuit Manufacturing, 40–41.
Hinch, S. W. (1988). Hand book of surface mount technology. Harlow, Jacobson, D. M., & Humpston, G. (1992). Diffusion soldering.
England: Longman Scientific and Technical publishers. Soldering and SMT Journal,10, 27–32.
Hirnyj, S., & Indacochea, J. E. (2008). Phase transformations in Jacobson, D., & Humpston, G. (1995). Depressing the melting point of
Ag70.5Cu26.5Ti3 filler alloy during brazing processes. Chemistry solders and brazes by eutectic alloys. GEC Journal of Research,12
Metals Alloys,1, 323–332. (2), 112–121.
Holt, T. (1995). New applications in high power laser welding. Welding Jacobson, D. M., & Sangha, S. (1996). Novel applications of diffusion
and Metal Fabrication Journal, 230–234. soldering. Soldering and SMT Journal,23, 12–15.
Homes-Siedle, A., & Adams, L. (1993). Handbook of radiation effects. Jaggers, C. H. (1993). Exposure of LDEF materials to A.O. In 3rd
Oxford, UK: Oxford University Press. Post-Retrieval Symposium (pp. 931–941). Williamsburg, November
Hornbogen, E., & Schemme, K. (1990). Prospects of superlight metals 8–12.
and their laser surface alloying with ceramic phases. In Proceedings Jalbert, M., et al. (1994). Risque saturnin des opérations de
of the First Thermal Structures Conference (pp. 99–109). Char- microsoudure en électronique. Archives des maladies profession-
lottesville, VA, November 14–16. nelles et de médecine du travail,55(8), 589–594.
Houlberg, K. (1988). Printed circuit boards for surface mounted Janu, P., et al. (2009). Electric propulsion pointing hold down and
devices. Unpublished report. release mechanism test results. In Proceedings of the 13th European
Hu, S. J., et al. (1995). Gold wire weakening in the thermosonic Space Mechanisms and Tribology Symposium (p. 8)., Vienna,
bonding of the first bond. IEEE Transactions, Components, Austria, September 23–25
Hybrids, Manufacturing Technology,18(1), 228–234. Jaworske, D. A. (2002). Solar selective coating for power application,
Huang, C.-Y., et al. (2011). Material characterization and failure NASA/TM-2002-211333.
analysis for microelectronics assembly processes. Available from: JAXA-QTS selected JAXA standards related to materials and processes
http://www.intechopen.com /books/wide-spectra-of-quality-con- can be seen listed in Appendix 9.
trol/material-characterization-and-failureanalysis-for-microelectron- Jellison, J. (1986). Evaluation of multilayer printed wiring boards by
ics-assembly-processes. metallographic techniques. NASA Reference Publication 1161.
Hummel, R. E. (1994). Electromigration and related IC failure Jenkins, P. P., & Landis, G. A. (1995). A rotating arm using shape-
mechanisms. International Materials Review,39, 97–113. memory alloy. In 29th Aerospace Mechanism Symposium, League
Hunt, C. (2009). Implementation and reliability issues with lead-free City, Texas (pp. 167–171). May 17–19.
solders. In SMTA International Conference and AIMS Workshop, JESD22-A121A. (2008). Measuring whisker growth on tin and tin
San Diego, CA, USA, October 4–8. alloy surface finishes, reaffirmed, May 2014.
Hunt, C. (2011). Reliability isues with lead-free, EMPS-2 Workshop, Jha, A. K., et al. (1996). Failure of AA 2024 aluminium alloy rivets.
Institut Du Soudure, Paris, France, May 4. Praktische Metallographie,33(5), 264–272.
Hunt, C., Dunn, B. D., et al. (2012). Increased shorting in tin whiskers due Jiang, B. L., & Wang, Y. M. (2010). Plasma electronic treatment of
to electric fields and contact pressure. In 6th International Symposium aluminium and titanium alloys. In H. Dong (Ed.), Surface engineering
on Tin Whiskers, Loughborough, UK, November 27–28. of light alloys. Cambridge, UK: Woodhead Publishing Ltd.
Hutchings, M., & Krawitz, A. D. (1992). Measurements of residual and Johnson, G. W. (1979). How metallography and SEM analysis can be
applied stress by neutron diffraction. In NATO ASI series E: Applied used in quality control for microelectronics. In Metallography as a
Science (Vol. 216). Dordrecht, The Netherlands: Kluwer. Quality Control Tool, Symposium of A.S.M. (pp. 261–278). July 8–9.
Hutchinson, B., et al. (2004). Whisker growth from tin coatings, IM- Johnson, M.R. (1989). The Galileo High Gain Antenna Deployment
2004-708. Stockholm: Swedish Institute for Metal Research. Anomaly. California Institute of Technology, Jet Propulsion Lab-
Hwang, J. S. (2014). Tin whiskers: capsulization. SMT Magazine, 16–29. oratory (JPL), Pasadena, CA.
Ilyushenko, R. V. (1993). Weldability of commercial aluminium– Johnson, R.E., et al. (1966). A case history of titanium stress corrosion
lithium alloys. Aluminium-Verlag,69(4), 364–370. in nitrogen tetroxide. American Society Metals
Iman, R. L., et al. (1995). Evaluation of low-residue soldering for military Johnson, R. E. (1973). Apollo experience report—The problem of stress
and commercial applicatons: Sandia National Labs Report, June. corrosion cracking. NASA TN D-7111, March.
IEC 60068-2-82. (2007). Environmental testing—Whisker test methods Johnston, R. L., et al. (1967). Stress corrosion cracking of Ti–6Al–4 V
for electronic and electric components. alloy in methanol. NASA TN D-3868, February.
646 References

Kallee, S. W., Nicholes, D., & Thomas W. (2001). Friction stir welding Korb, L. J., et al. (1985). A metallurgical analysis of the failure of two
—Invention, innovations and applications. In INALCO 8th Inter- APU’s of the spacecraft Columbia. In Space Technology Confer-
national Conference on Joints in Aluminium, Munich, Germany, ence Proceedings, Anaheim, USA, September 23–25, 5.1–5.34.
March 28–30. Kostic, A. D. (2011). Lead-free electronics reliability—And update,
Karavakis, K., & Bertling, S. (2004). Conductive anodic filament GEOINT Development Office, Aerospace Corporation, August.
(CAF). MEPTEC Report, Quarter 4, 24–27. Kleiman, J., Tagawa, M., & Kimoto, Y. (2013). Protection of materials
Kauffmann, B., & Wolf, D. (2013). Development of low fluoride and structures from the space environment. Heidelberg: Springer.
evolution fluoropolymer wiring materials for aerospace systems. In Kramer, P. A., et al. (1994). The effect of low gold concentrations on
Aerospace Electrical Interconnect Symposium, Tampa, FL, USA, the creep of eutectic tin-lead joints. Metallurgical and Materials
October. Transactions A,25, 1249–1257.
Kelly, M. A., et al. (1984). Using ESCA in failure analysis—Some Krishnadev, M. R. (1993). The structure and properties of magnesium–
recent developments. In Proceedings of ISTFA (pp. 35–39). Los matrix composites. JOM,45(8), 52–54.
Angeles. Krumbein, S. J. (1988). Metallic electromigration phenomena. IEEE
Kephart, A. R., & Hayden, S. Z. (1993). Benefits of thread rolling Transactions Components, Hybrids, Manufacturing Technology,
process to the stress corrosion cracking and fatigue resistance of CHMT-11, 5–15.
high strength fasteners. In 6th International Symposium on Envi- Kuchler, G. (1995). Assessment of flexible substrate integrity. In
ronmental Degradation of Materials in Nuclear Power Systems Hubble Space Telescope Solar-Array Workshop, ESTEC, Noord-
(pp. 1833–1847). San Diego, CA, August 3–5. wijk (pp. 253–256). ESA Pubn WPP-77, May 1995.
Kessowsky, R., et al. (1978). Corrosion of indium based solders. In Kugel, U., Verain, M., & Zarraga, F. M. (1995). Post-flight investi-
16th Annual Proceedings, IEEE Reliability Physics (pp. 200–205). gations of the Eureca Mechanisms. In Proceedings of Sixth
Keusseyan, R. L., & Dilday, J. L. (1993). Electric contact phenomena European Space Mechanisms Symposium (pp. 195–201). Zurich,
in conductive adhesive connections. In Proceedings of International (ESA SP-374).
Surface Mount Conference and Exposure (pp. 567–571). San Jose, Labruyère, G., & Urmston, P. (1995). ESA mechanisms requirements.
Surface Mount International. In Proceedings of 6th European Space Mechanism and Tribology
Ki, Young-Won. (1995). Gamma titanium aluminides: their status and Symposium, Zurich, (ESA SP-374), October 4–6
future. JOM,47(7), 39–41. Lamouroux, F., et al. (1994). Kinetics and mechanisms of oxidation of
Kim, K.-H., et al. (2011). Observation of high resolution microstruc- 2-D woven C/SiC composites: Experimental approach. Journal of
tures in thermal sprayed coatings and single deposited splats using American Ceramic Society,77(8), 2049–2057.
ion beam milling. Materials Transactions,52(3), 439–446. Lansdown, A. R., & Price, A. L. (1986). Materials to resist wear.
King, D. B., et al. (1976). Effects of inclusions on mechanical Oxford: Pergamon Press.
properties of Be. AFML-TR-76-33 Brush Wellman Inc., April. Laporte-Weywada, H. J, et al. (1993). CNES policy about launcher
King, R. L. (1988). Review, opportunities for advanced composites in space debris mitigation—Ariane V application. In Proceedings of
spacecraft. Advanced Composite Bulletin,2(1), 4–10. the First European Conference on Space Debris (pp. 585–589).
Kingsley, N. (2008). Liquid crystal polymer: Enabling next generation Darmstadt, Germany, April 5–7, ESA SD-01.
conformal and multilayer electronics. Microwave Journal, 51, 188– Larsson, A., & Wingborg, N. (2011). Green propellants based on
200. ammonium dinitramide (ADN). www.intechopen.com/download/
Klein, A. J. (1988). Specialty reinforcing fibres. Advanced Compos- pdf/13473.
ites,3(3), 32–44. Lau, J., & Rice, D. (1985). Solder joint fatigue in SMT: State of the art.
Kleinteich, T., et al. (2015). What’s inside a fishy suction cup? Solid State Technology, 91–104.
Microscopy and Analysis,17, S8–S10. Le May, I., & Deckker, E. (2009). Reducing the risk of failure by better
Klein Wassink, R. J. (1984). Soldering in electronics. Ayr, Scotland: training and education. Engineering Failure Analysis,16, 1153–1162.
Electrochemical Publications Ltd. Lea, C. (1988). Restrictions on the use of chlorofluorocarbons for
Klinkrad, H. (2006). Space debris: Models and risk analysis. Heidel- cleaning soldered PCBs. Circuit World,14(4), 4–12.
berg, Germany: Springer-Praxis Publishing. Lea, C. (1988). A scientific guide to surface mount technology. Ayr,
Kocker, H. H., & Stockel, D. (1979). Material transfer of composite Scotland: Electrochemical Publications.
contact materials. In IEEE Transactions on Components, Hybrids Lea, C. (1991). Evidence that visual inspection criteria for soldered
and Manufaturing Technoloby (pp. 15–19). CHMT-2. joints are no indication of reliability. Soldering and SMT Journal,9,
Kodama, S., et al. (2010). Development of stainless steel welding wire for 19–24.
galvanized steel sheet, Rivista Italiana della Saldatura4: 479–486. Lee, H. S., et al. (1994). Symptoms in peak expiratory flow rate among
Koh, D., et al. (1990). Dermatological hazards in the electronics female solderers. American Journal of Industrial Medicine,26,
industry. Contact Dermatitis,22, 1–7. 613–619.
Koh, D., et al. (1994). Skin disorders among hand solders in the Lee, S.-B., et al. (2006). Electrochemical migration characteristics of
electronics industry. Occupational Medicine,44(1), 24–28. eutectic SnPb solder alloy in printed circuit board. Thin Solid
Kohman, G. T., et al. (1955). Silver migration problem encountered in a Films,504, 294–297.
telephone exchange. Bell Systems Technology Journal,34, 1115– Lee, Shen, Y. (1990). Thermomechanical properties of polymeric
1147. materials and related stresses. SAMPE Quarterly, 48–51.
Konoza, A., et al. (2012). Analysis of the electronic assembly repair Leitao, C. M. A. (2013). Influence of base material plastic properties
process for lead-free parts under combined loading conditions. and process parameters on friction stir weldability (Dissertation for
IEEE Transactions Components Packaging Manufacturing Tech- PhD, Department of Mechanical Engineering, University of Coim-
nology,2(9), 1558–1567. bra, Portugal, 2013).
Koons, H. C., et al. (1980). Spacecraft charging—Results from the Lestrat, D., & Prel, Y. (1994). Evolution et choix technologiques pour
SCATHA satellite. Astronautics and Aeronautics,18(11), 44–47. les reservoirs des lanceurs Ariane. In Proceedings of the Interna-
Korb, G., & Dunn, B. D. (1996). Assessment of cleaning methods for space tional Symposium on Advanced Materials for Lightweight Struc-
mechanisms. ESTEC Metallurgy Report No. 2261 (confidential). tures, ESTEC (pp. 441–453). Noordwijk, March (ESA WPP-070).
References 647

Levine, A. S. (Eds.). (1993). Third post-retrieval symposium. NASA Maciolek, R. B., et al. (1978). Thermal aging characteristics of In–Pb
Conference Publication 3275, Part 3. solder bonds to gold. Honeywell Report.
Lewis, P. L., Kolody, M., & Curran, J. (2013). Alternative to nitric acid McCormick, J., & Zakraysek, L. (1979). A metallographic test for
passivation of stainless steel alloys. NASA Report, casi.nts.02809. glass-to-metal seals. In 17th Annual Proceedings of Reliability
Leyva, I. A., et al. (2011). Space Mission and Design Analysis, Physics, IEEE (pp. 44–50). San Francisco, April.
Chap. 18—Propulsion Systems, Air Force Research Lab., Edwards McCormack, S., & Meschter, S. (2009). Probabilistic assessment of
AFB., CA., USA. Report No. AFRL-RZ-ED-BK-2011-057. component lead-to-lead tin whisker bridging. In International Confer-
Li, H., & Zhang, J. (2014). Preparation of microarc oxidation ceramic ence on Soldering and Reliability, Toronto, Canada, May 20–22.
layer on Ti6Al4V titanium alloy and its oxidation resistance McCrone, W. C., & Delly, J. C. (1973). The particle atlas (2nd ed.,
property. International Heat Treatment and Surface Engineering,8 Vol. 1–3). Michigan, USA: Ann Arbor Science Publishers.
(2), 51–54. McCune, T. B., et al. (1970). Heat ageing evaluation of common coated
Li, X., & Dong, H. (2010). Ceramic conversion treatment of titanium- copper conductors. In 19th International Wire and Cable Sympo-
based alloys. In H. Dong (Ed.), Surface engineering of light alloys. sium, Atlantic City, N.J., December 2–4.
Cambridge, UK: Woodhead Publishing Ltd. McDonald, G. E. (1974). Refinement in black chrome for use as a solar
Liedke, V., & Dunn, B. D., et al. (2008). Cleaning of silicone selective coating. NASA TMX-3136, December.
contaminations: development of test methods and assessment of McDonnald Schetky, L. (1991). Shape memory alloy applications in
cleaning efficiency. In 11th ISMSE Symposium, Aix-en-Provence, space systems. Materials and Design,12(1), 29–32.
France, September. McDowell, M. E. (1993). Tin whiskers—A case study. In 1993 IEEE
Liejtens, J. (2015). Will the future of hirel components be pure SCOTS Aerospace Applications Conference (14th) (pp. 207–215). Steam-
or only SCOTTish, IAA-B10-1203. In Deutsches Zentrum fur Luft- board Springs, CO, USA, January 31–February 5.
und Raumfahrt 10th Symposium, Berlin, Germany, April 20–23. McKay, C. A. (1983). Causes and effects of solder contamination, part
Lin, C.-C., et al. (2012). High temperature brazing of molybdenum. 2, Electronics: 41–44.
Advanced Material Research Journal,586, 69–73. Maillat, M., et al. (1995). Adhesion of materials by impact contacts in
Liu, H., et al. (2014). Laser nanocrystallisation and corrosion behavior vacuum. In Proceedings of 6th European Space Mechanisms
of electroless Ni-W-P coating with high phosphorous content. Conference, (pp. 431–436). Zurich, Switzerland, (ESA SP-374).
Transactions IMF,92(4), 212–217. Mair, P. (2005). Assessment of EMF and biological effects in arc
Liu, J., et al. (1996). Development of flip-chip joining technology. welding applications. In International Institute of Welding Manu-
Circuit World,22(2), 19–24. facturing (pp. 1–10). IIW Document XII-1848-05.
Liu, X., & Lu, G.-Q. (2003). Effects of solder joint shape and height on Majid, W. A. (1988). Controlling SCC in mechanism components of
thermal fatigue lifetime. IEEE Transactions on Components and ground support equipment. In 22nd Aerospace Mechanisms Sym-
Packaging Technologies26(2): 445–465. posium (pp. 163–174). Hampton Virginia, May 4–6 (NASA
Lobley, G. R. (1990). Soldering problems on printed circuit boards. Conference Publication 2506).
Practice Metals,27, 627–631. Maliutina, I. N., et al. (2014). Structure and microhardness of Cu-Ta
Lucas, J. P., & Zhou, J. (1993) The effects of sorbed moisture on resin– joints produced by explosive welding. Rivista Italiana della
matrix composites. J.O.M., December issue, 37–40. Saldatura5: 839–848.
Lucas, W. (1995). Electromagnetic emission from TIG welding Malla, R. B., & Ghoshall, A. (1994). Thermally induced vibrations of
systems. Welding and Metal Fabrication,63(7), 261–265. structures in space. Progress in Astronautics and Aeronautics,168,
Luciano, G., & Galet, G. (1995). Space mechanism actuated by a shape 68–89.
memory alloy component. In Proceedings of the 6th European Marchaise, M., & Glodowski, K. A. (1991). Real-time microfocus
Space Mechanical and Tribology Symposium (pp. 221–225). radiography for electronic failure analysis. Materials Evaluation:
Zurich, October 4–6. ESA SP-374. 1481–1485.
Lumsden, J. B., & Allen, A. T. (1988). The stress corrosion cracking Marrocco, T., & Harvey, D. (2012). Cold Standard—The cold spray
behaviour of AlLi alloy 8090. Corrosion Science-Nace,44(8), 527– process. Materials World: 30–31.
532. Martell, S., & Adams, T. (1996). Virtual cross-sectioning of materials.
Lumsden, J. M., & Whittlesey, A. (1981). Automatic ARC welding of Materials World,3(7), 323–324.
propulsion system tubing in close proximity to sensitive electronic Martin, J. W. (1976). A new laboratory procedure for determining
devices. In AIAA/SAE/ASME 17th Joint Propulsion Conference, compatibility of positive expulsion elastomers with liquid propel-
Colorado Springs, July, (AIAA-81-1569). lants. In Symposium—Compatibility of Plastics (pp. 1–6). Indian
Lund, A. (2011). Principals and applications of ESR Spectroscopy. Head, Md., USA, paper III-E, April.
Heidelberg: Springer. Mason, M., & Eng, G. (2007). Understanding tin plasmas: a new
Lupton, D. F. (1990). Heraeus GmbH, private communication. approach to tin whisker plasma risk assessment. In IEEE IRPS,
Luzin, V., et al. (2010). Use of neutron diffraction for stress CALCE, University of Maryland, USA, April.
measurements in thin and thick thermal sprayed coatings. Interna- Materassi, M., Dunn, B. D., & Capinari, L. (2000). The influence of
tional Heat Treatment and Surface Engineering,4(1), 17–24. solder fillet geometry on the occurance of corona discharge during
Ma, H., et al. (2012). Effects of rework on the accelerated thermal operation between 400 and 900 V in partial vacuum. IEEE
cycling and shock performance of lead-free BGAs. IEEE Transac- Transactions on Electronics Packaging Manufacturing,23, 104–115.
tions on Components Packaging Manufacturing Technology,2(11), Matloff, G. L. (2013). The speed limit for graphine interstellar solar
1824–1830. proton sails. Journal of the British Interplanetary Society,66,
Ma, Y., et al. (2012). A large-scale fabrication of flower-lie sub- 377–380.
micrometer-sized tungsten whiskers via metal catalysis. Nanoscale Maurer, R. H., et al. (2008). Harsh environments: Space radiation
Research Letters,7(325), 1–7. environment, effects, and mitigation. John Hopkins APL Technical
Ma, H., & Lee, T.-K. (2013). Effects of board design variations on the Digest,28(1), 17–29.
reliability of lead-free solder joints. IEEE Transactions on Compo- Mayo, M. J., & Nix, W. D. (1989). Direct observation of superplastic
nents Packaging Manufacturing Technology,3(1), 71–78. flow mechanism in torsion. Acta Met,37(4), 1121–1134.
648 References

Maxwell, J. L., et al. (2013). High-temperature nano-composites for Mueller, R. P., et al. (2015). Additive construction using basalt regolith
nuclear thermal propulsion and in-space fabrication by HP-LCVD. fines, NASA KSC, casi.ntrs.nasa.gov/20150000305.pdf [cited
JBIS,66, 328–333. access June 2015].
Mc Brien, C. M., & Heltzel, S. (2013). Insulation resistance of dielectric Muller-Wiesner, A., et al. (1994). Materials and manufacturing
materials under environmental testing. In IPC APEX EXPO Confer- technologies for the tank and thruster components of the Ariane 5
ence Proceedings, San Diego, Ca, USA, February 19–21. SCA-system. In Ariane V structures and technologies, Cepadues-
Meaker, A. J., et al. (2006). Hydrogen peroxide—From bridesmaid to Editions. Toulouse: CNES publication.
bride. In 3rd ESA International Conference on Green Propellants Munns, I. (1995). Adhesive bond inspection using NDT. Materials
for Space Propulsion, Poitier, France, September. World,3(11), 527–529.
Medgyes, B., et al. (2011). In situ optical inspection of electrochemical Munson, T. (2006). White residues: are they or aren’t they? Circuit
migration during THB tests. The Journal of Materials Science: Assembly, page unknown, January.
Materials in Electronics,22, 694–700. Nabarro, F. R., & Jackson, P. J. (1958). Growth of crystal whiskers.
Meltsner, K. J. (1995). Understanding the INTERNET: A guide for Growth and perfection of crystals (pp. 11–101). New York: Wiley.
materials scientists and engineers. JOM,47(4), 9–13. Naisbitt, G. (2015). How clean is clean to be functionally good? EMPS-
Merstallinger, A., & Semerad, E. (1996). Test method to evaluate cold- 6 Workshop, DLR, Oberpfaffenhofen, Germany, April 15–16.
welding under static or impact loading. Unpublished ESTEC Nakasa, K., & Liu, J. (1993). The effect of stress on hydride formation
Metallurgy Report 2222 in Ti6A14V alloy. In Titanium (Vol. 92, 1st ed., pp. 619–627).
Merstallinger, A., & Semerad, E. (1996). Test method to evaluate the TMS publication.
sublimation of metals by weight loss. Unpublished ESTEC Metal- NASA NAS 5300.4 (3J). (1996a). Workmanship standard for staking
lurgy Report 2242. and conformal coating of printed wiring boards and electronic
Merstallinger, A., et al. (1995). Study on adhesion/cold-welding under assemblies, May.
cyclic load and high vacuum. In Proceedings of the 6th European NASA NAS 5300.4 (3M). (1996b). Workmanship standard for surface
Space Mechanisms Conference (pp. 293–298). Zurich, Switzerland, mount technology, May.
(ESA SP-374). NASA-STD selected NASA standards related to materials and
Merstallinger, A., et al. (1995). Wire bend test. Unpublished report. processes can be seen listed in Appendix 9.
Merstallinger, A., & Dunn, B. D., et al. (2009). Assessment of cold Nasta, M. A., et al. (1990). Contaminant particles in electronic solder
welding between separable contact surfaces due to impact and fluxes. Soldering and SMT Journal,4, 6–7.
fretting under vacuum, ESA STM-279, and, (2015) http://esamul- Nelson, H. G. (1988). Hydrogen and advanced aerospace materials.
timedia.esa.int/multimedia/publications/STM-279/. SAMPE Quarterly,20(1), 20–23.
Mertens, J., & Gessford, D. (1995). Implementation of alternative NEMA. (1972). High temperature insulated wire. Report on Copper
cleaning solvents. Precision Cleaning Journal,3(2), 45–50. Corrosion, NEMA Standards Publication, No. HP 2-1968 (reaf-
Mielke, E. W. (2002). Silver filled conductive epoxies, NASA Materials firmed by NEMA).
Engineering Branch, TIP No. 079, rev. October. Nemoto, N. (2007). Evaluation of tin whisker growth in vacuum
Mikaelian, T. (2001). Spacecraft charging and hazards to electronics thermal cycling condition. In 3rd International Symposium on Tin
in space, York University publication, May. Whiskers, Lyngby, Deenmark, June 23–24.
MIL-C-13924 Coating, oxide, black, for ferrous metals. Newman, R. C. (1990). Stress corrosion cracking: 1965–1990. British
MIL-Handbook-697A. (1974). Titanium and titanium alloys, June. Corrosion Journal,25, 259–269.
Millares, M., & Peraggi, B. (1992). Metallography of gold–indium Niefhof, J. (1995). An empirical model for electromigration. Solid-State
couples and electronic components soldered with indium alloys. Electronics,38, 1817–1827.
Praktische Metallographie,29, 555–563. Noller, E. W. (1996). Unique application of plastics and composite
Miller, N. H. (1906). The amounts of nitrogen as ammonia and nitric materials in the design of magnetometer instruments. In 41st
acid, and of chlorine in the rainwater collected at Rothamsted. International SAMPE Symposium and Exhibition (Vol. 1, pp. 841–
Journal of Agricultural Sciences,1, 280–303. 846). Anaheim, Ca, March 24–28.
Minges, M. L. (1989). Electronics materials handbook (Vol. 1). Metals Nordwall, B. D. (1986). Air force links radar problems to growths of tin
Park, OH, USA: ASM International. whiskers. Aviation Week and Space Technology30: 65–69.
Mohrbacher, H., et al. (1995). The influence of humidity on the fretting Norwood, L. B. (1985). How beryllium proved successful on the space
behaviour of PVD TiN coatings. Wear,180, 43–52. shuttle orbiter. Journal of Spacecraft and Rockets,22, 560–566.
Moliterni, L. (2010). Il saldatore “manual” utilizzato nella saldatura in Novikov, I., & Grushko, O. (1995). Hot cracking of Al-Cu-Li alloys.
elettronica. Rivista Italianadella Saldatura, Lugili/Agosto 4: 455–459. Materials Science and Technology,11, 926–932.
Moliterni, L. (2012). L’affidabilita degli assemblaggi elettronici. Rivista Nuez, D., & Tan, P. (2014). Failure localization of intermittent short
Italianadella Saldatura, Maggio/Giugno 3: 351–362. circuit failures caused by vertical CAF formation. In ISTFA
Morilla, D. J., et al. (2015). Tin whisker growth on surface mount Conference Proceedings, Houston, TX, USA, November 9–13.
devices: A study using standardized test conditions. In EMPS-6, Nurse, M. (1996). Caution remains on aluminium–lithium alloys. MBM
Wessling, Germany, April 15–16. (pp. 42–45). February.
Morris, J. W. (1996). The metallurgical control of electromigration. O’Clock, G. D., et al. (1987). Pb-Sn microstructure: potential reliability
JOM,48, 43–46. indicator for interconnects. IEEE Transactions Components,
Moser, M. (2002). Calculation of stresses produced in the tin-plated Hybrids, Manufacturing Technology,10, 82–88.
terminations of resistors during thermal cycling. Unpublished Estec Okuyama, F. (1974). Vapor-grown tungsten whiskers induced by
MGI report 3496. vacuum discharges. Journal of Applied Physics,45(10), 4239–4241.
Motz, J. M. (1988). Microsegregations—An easily unnoticed influenc- Pantazopoulos, G., & Vazdirvanidis, A. (2008). Characterization of the
ing variable in the structural description of cast materials. Practice microstructural aspects of machinable Alfa Beta phase brass
Metals,25, 285–293. (pp. 13–16). Microscopy and Analysis, September.
Mueller, R. P., et al. (2014). Space mining and planetary surface Paprocki, S. J. (1988). Metal matrix composites for space applications.
construction. In ASCE Earth and Space Conference, St. Louis, In Composite Technology, 5th Annual Conference on Materials
Missouri, USA, October 27–29. Technology (pp. 33–43). Carbondale, IL, April 14–15.
References 649

Parker, D. L. (1977). Special devices fabricated in heat shrinkable Piskoty, G., et al. (2009). Structural failures of rope-based systems.
plastics. In Proceedings of the Technical Program, Internepcon’77 Journal of Engineering Failure Analysis,16, 1929–1939.
(pp. 133–136). Brighton UK, October 18–20. Plumbridge, W. J. (2011). Tin pest in lead-containing solders.
Parker, D. S. (1991). Analysis of a failed helicopter main rotor blade Soldering and SMT Journal,22(1), 56–57.
grip. In International Conference on Failure Analysis (pp. 141– Poe, R. F., & Ruckner, M. A. (1993). Evaluation of pressurized vessels
145). Montreal, Canada, July 8–11 (published 1992 by ASM). following hypervelocity particle impact. In Proceedings of the First
Parquet, D. T., & Boggs, D. W. (1995). Alternatives to HASL. In European Conference on Space Debris (pp. 441–446). Darmstadt,
Electronic Packaging and Production (pp. 38–42). August. Germany, April 5–7, (ESA SD-01).
Pask, J. A. (1948). New techniques in glass-to-metal sealing. Pohl, D. (1996). Advances in scanning electron microscopy. Praktische
Proceedings of the IRE, Waves and Electrons Section,36, 286–289. Metallographie,33(5), 235–245.
Paton, B. E. (2003). Space: Technologies, Materials, Structures. In Polat, A., et al. (2008). Properties of alumina coating formed by
Welding and allied processes (Vol. 2). Ukraine: E. O. Paton Electric microarc oxidation technique on 6061 aluminium alloy. Praktische
Welding Institute. Published in English by Taylor and Francis Inc., Metallographie,12, 594–606.
New York, USA. Pollack, A. A. (1989). Acoustic emission inspection. In Metals
Patterson, R. F., & Mykytiuk, P. D. (1996). Solid-state, vapour phase, Handbook (Vol. 17, 9th ed., pp. 278–294). ASM International.
and aqueous cleaners for aerospace manufacturing operations. Pops, H. (1985). Copper rod requirements for magnetic wire. In
Sampe Journal,32(3), 40–49. Proceedings of the 17th Electrical/Electronics Insulation Confer-
Pearce, R. (1987). Superplasticity—An overview (pp. 1–1 to 1–24). ence (pp. 329–337). Boston, USA, September 30–October 3.
AGARD Lecture Series No. 154, August. Pradier, A. L., & Dosio, D. (1996). Technology development in
Pecht, M. G., et al. (1999). Moisture ingress into organic laminates. structures for reusable launch vehicles. In Reaching for the Skies
IEEE Transactions on Components and Packaging Technology,22, (Vol. 15, p. 7). ESA Publication.
104–110. Premat, G. (1977). Astudy of the outgassing of solder splices. ESA TM-
Pedley, M. D. (2009). Materials safety, Ch. 12 in book safety design for 158.
space systems. Amsterdam, The Netherlands: Elsevier Publishing. Pretsch, E. (2009). Structure determination of organic compounds.
Peel, C. J., & McDarmaid, D. S. (1989). The present status of the Heidelberg: Springer.
development and application of Al-Li alloys 8090 and 8091. Prymak, J. D., & Bergenthal, J. (1995). Capacitance monitoring while
Aerospace,16(5), 18–23. flex testing. IEEE Transactions on CPMT, Part A,18(1), 180–186.
Peng, X., et al. (2014). Conductivity improvement of silver flakes filled Puig, C. (2006). When space adheres to bonding—An interview.
ECAs via introducing silver-graphine nanocomposites. Journal of Qualite Espace,43, 57–63. Mars.
Materials Science: Materials in Electronics,25, 1149–1155. Puippe, J-Cl. (1999). Surface treatments on aluminium for space
Perami, R., et al. (1992). Applications of AE to the study of applications. Galvanotechnique,90(10), 3003–3009.
microfissure damage to composites used in the aeronautics and Puttlitz, J. K. (1990). Preparation, structure and fracture modes. IEEE
space industries. In The American Society for Nondestructive Transactions Parts, Hybrids, Packaging,13, 648–655.
Testing, Proceedings of AECM-4, (pp. 99–108), Seattle, July 27–31. Quinn, G. D. (2008). Fractography of brittle materials: Analysis
Pereira, A., Pimenta, G., & Dunn, B. D. (2008). Assessment of chemical of fractures in ceramics and glasses. Microscopy and Analysis:
conversion coatings for the protection of aluminium alloys, (A 21–24.
comparison of Alodine 1200 with Chromium Free Conversion Raiser, G. F., & Amir, D. (2005). Solder joint reliability improvement
Coatings), ESA-STM-276, February. using cold ball pull metrology. In Proceedings of InterPACK’05,
Peres, P., Semerad, E., & Dunn, B. D. (1994). Material characteristics San Francisco, CA, USA, July 17–22.
of SiC/MAS-L fibre re-inforced glass composites. In Proceedings of Raman, V., & Reiley, T. (1987). Cavitation and cracking of
6th International Symposium on Materials in Space Environmental superplastic Pb–Sn eutectic during high-temperature fatigue. Jour-
(pp. 309–314). Noordwijk, September 19–23, 1994, (ESA SP-368). nal of Materials Science Letters,6, 549–551.
Perez, F., & Eymard, P. (1985). Increasing use of composite structures Rameriz, P., & Adams, T. (2002). Acoustic imaging and screening of
on Ariane launchers (pp. 239–244). ESA SP-243. ceramic chip capacitors. Passive Component Industry: 16–20.
Pergola, P., et al. (2011). Low-thrust missions for expanding foam space Rampini, R., et al. (2009). Dynamic outgassing test: Revisited. In 11th
debris removal. In IEPC-2011-126, 32nd International Electric ISMSE Symposium, Aix-en-Provence, September 15–18, Poster.
Propulsion Conference, Wiesbaden, Germany, September 11–15. Ratchev, P., et al. (2005). A study of brittle to ductile fracture transitin
Peters, S. T., & Wesling, N. (1968). Corrosion of silver plated copper temperatures in bulk lead-free solders, EMPC, Brugge, Belgium,
conductors. In SAMPE 13th National Symposium. June 12–15.
Pettersson, C., et al. (2007). Corrosion testing of welds, a review of Ray, U., et al. (1995). Influence of temperature and humidity on the
methods. Rivista Italiana Saldatura,4, 529–553. wettabiality of immersion tin coated pwb’s. IEEE Transactions on
Pettit, R. B., & Sowell, R. R. (1976). Solar absorptance and emittance CPM Technology Part A,18(1), 153–161.
properties of several solar coatings. Journal of Vacuum Science and Raymond, L. (1988). Hydrogen embrittlement: Prevention and control.
Technology, 13(2). No: ASTM Special Technical Publication. 962.
Pinaud, G., et al. (2014). Aerofast: Development of cork TPS material Redahan, E. (2014). 3D printing—Material wise to grain size—A review
and a 3D comparative thermal/ablation analysis of an Apollo and a of the 3D printing and additive manufacturing industrial applications
biconic sled shape for an aerocapture mission. http://solarsystem.- summit (London 2013). In Materials World, January 10–12.
nasa.gov/docs/7_aerofast_paper.pdf (2015). Reed, R. P., & Clark, A. F. (1983). Materials at low temperature.
Pippin, H. G. (1995). Analysis of silverized teflon thermal control ASM.
material flow on LDEF. NASA Contractor Report 4663, July. Reid, P. (2009). PWB reliability—The next step. Circuit World,33(4),
Pippin, H. G., & Bourassa, R. J. (1995). Effects of space exposure on 51–59.
metals on LDEF. NASA Contractor Report 4662, June. Rendu, M., & Tawil, D. (1988). Improved protection of magnesium
Pirnnack, S. (2012). Lessons learned to avoid coax cable failure in alloys against synthetic aviation lubricants at elevated temperatures,
moving mechanical mechanisms. In Proceedings of the 41st Aero- paper 880869. In 24th Annual Aerospace/Airline Plating and Metal
space Mechanisms Symposium, NASA JPL, Pasadena, CA, USA. Finishing Forum, Phoenix, April.
650 References

Reuther, J. (2010). Orion thermal protection system, advanced Schatz, et al. (1979). Development and flight experience of the Voyager
development project. In 7th International Planetary Probe Work- propulsion system. In AIAA/SAE 15th Joint Propulsion Conference
shop, NASA Ames Research Centre, June 16. (pp. 1–13), Las Vegas, June.
Richards, B. P., & Footner, P. K. (1990). Failure mechanisms in active Schedler, A. (1988). Fibre composites in satellites. Cryogenics,28,
surface mount components. GEC Journal of Research,7(3), 146–156. 220–223.
Ries, W. (1996). The combined plasma cleaning facility. Product Scheel, W. (2004). Electronics assembly handbook (2nd ed.). Port Erin,
Finishing,49(1), 6–8. I.O.M, UK: Electrochemical Publications.
Roman, I., et al. (1992). Interfacial shear properties and acoustic Schelling, P., et al. (2005) Managing heat for electronics. Materials
emission behaviour of model aluminium and titanium matrix Today: 30–35.
composites. In The American Society for Nondestructive Testing, Schemme, K., & Wittkamp, I. (1993). Microstructure development and
Proceedings of AecM-4 (pp. 109–114), Seattle, July 27–31. examination of Mg–Li alloys. Praktische Metallographie,30(7),
Richards, B. P., & Footner, P. K. (1984). Morphological aspects of 334–343.
electromigration. GEC Journal of Research,2(3), 157–168. Schlesinger, M. (2010). Electroless deposition of nickel. In M.
Ring, K. (2010). Protection of electronic assemblies in condensing Schlesinger & M. Paunovic (Eds.), Modern electroplating. Chich-
atmospheres. EMPS-1, Portsmouth, UK, February 17. ester, UK: Wiley.
Roach, T. A. (1984). Aerospace high performance fasteners resist stress Schliekelmann, R. J. (1972). Holographic interference as a means for
corrosion cracking. Material Performance,239, 42–45. quality determination of adhesive bonded metal joints. In 8th
Robertson, I. M., & Teter, D. (1996). Microscopic studies on hydrogen Congress of the International Council of the Aeronautical Sciences,
effects on mechanical properties. JOM,48(11), 55–60. Paper No. 72-06.
Rogers, K., et al. (1999). Conductive filament formation in a pcb. Schmidt, E. W. (1984). Hydrazine and its derivatives. New York:
Circuit World,25, 6–9. Wiley.
Ross, C. A., & Evetts, J. E. (1987). A model for electromigration. Schoenbeck, J., & Dunn, B. D. (2004). Evaluation of a process for the
Scripta Metals,21, 1077–1082. repair of area array and other surface mounted packages, ESA
Ross, R. G. (1989). Magellan/Galileo solder joint failure analysis and STM-272, September.
recommendations. NASA-CR-186294, September. Schoenthaler, D. (1984). Accelerated ageing for solderability evalua-
Rothschild, B. F. (1981). Electroplating of solderable coatings. Metal tions. IPS-TR-464.
Progress: 25–29. Schoyer, H. F. R. (1996). ESA’s new solid propellant based on
Rowntree, R. A., & Todd, M. J. (1988). Tribology for spacecraft. hydrazinium nitroformate. Preparing for the Future,6(1), 6–7.
Chartered Mechanical Engineer Journal: 28–30. Schreib, R., et al. (1979). Flow anomalies in small hydrazine thrusters.
Rubinstein, M. (1978). High speed electroplating of gold. Gold In AIAA 15th Joint Propulsion Conference (pp. 1–7), Las Vegas,
Bulletin,11(1), 3–8. June.
Russell, C., et al. (2014). Welding technology takes flight with NASA. Schrunk, D., et al. (1999). The Moon—Resources, future development
Welding Journal,93(5), 38–44. and colonization. Chichester, UK: Wiley-Praxis.
Rustichelli, F., & Dunn, B. D. (1997). Assessment of residual stresses Schubert, Th, et al. (2008). Interfacial design of Cu-based composites
in AA 2219 weldments by neutron diffraction. To be published in prepared by powder metallurgy for heat sink applications. Materials
Materials Science and Engineering. Science and Engineering: A,475, 39–44.
Ryan, R. S., et al. (1995). Development problems and their solutions Schuerch, H. U. (1968). Certain properties and applications of Nitinol
for the Space Shuttle main engine. NASA Technical Paper 3533, NASA CR-1232.
May. Schweigart, H. (2007). Conformal coating issues: When reliability goes
Saber-Samandari, S., & Berndt, C. C. (2010). IFTHSE Global 21: Heat astray. Global SMT and Packaging, 3.
treatment and surface engineering in the twenty-first century. Scott, B. C. (1987). Zinc diffusion in tin coatings on brass. Transac-
International Heat Treatment and Surface Engineering,4(1), 7–13. tions on IMF,65, 90–98.
Said, A. F., et al. (2012). Automated void detection in solder balls in Scott, P. G. (1985). An investigation of alodine surface finish on three
the presence of vias and other artifacts. IEEE Transactions on CPM aluminium alloys. EWP No. 1435 (Unpublished).
Technology,2(11), 1890–1901. Sechi, Y., et al. (2009). Composition dependence of titanium in Ag-Cu-
Saltzman, M., et al. (2009). Problems encountered during the Ti alloy braze metals for laser brazing of boron nitride ceramics and
recertification of a solar array drive actuator. In 13th Space cemented carbides. Material Transactions,50(6), 1294–1299.
Mechanisms and tribology Symposium, Vienna, Austria, September Seghesio, J. L. (1986). Heurs et malheurs de la corrosion—le tore d’eau
23–24. d’Ariane. CNES Quality Espace,16(5), 29–32.
Sampson, B. (2007). Soldering on—Training focus. In Professional Selman, G. L., et al. (1974). Dispersion strengthened platinum.
Engineering (p. 48), April. Platinum Metals Review,18(2), 2–13.
Sandera, J. (1996). Investigation into the mode of degradation of Semerad, E., & Dunn, B. D. (1990). Evaluation of black anodised
crimped joints due to corrosive effects. Unpublished ESTEC beryllium (Unpublished report).
Metallurgy Report 2256. Semprimoschnig, C., & Eesbeek, M. (2007). Materials research at Estec
Saunders, C. G. (1988). Ion techniques in surface engineering. Metals —focus on self-healing materials for space applications. In STFC
and Materials,4(11), 678–682. Materials Workshop, London, October 10.
Saxer, W. (1977). Moeglichkeiten funktioneller Edelmetallueberzuege Sharkov, E. A. (2008). Breaking Ocean Waves - geometry, structure
anhand aktueller Beispiele aus der Praxis. Galvanotechnik, 68(11) and remote sensing. Heidelberg, Germany: Springer-Praxis.
(Black inorganic coating developed by Werner Fleuhmann AG, Sharma, A. K. (1989). Gold plating on aluminium alloys for space
Dueberdorf, Switzerland). applications. Transactions of the Institute of Metal Finishing,67,
Saxty, P. (1995). Ultrasonic soldering in the electronics industry. 87–88.
Metallurgica: 287. Shashkov, P. (2013). Aluminium nanoceramic substrates for thermal
Scala, E. P. (1996). A brief history of composites in the US. JOM,48 management in electronics. In Electronic Materials and Proceed-
(2), 45–48. ings For Space Workshop, (EMPS-4), Aalborg, Denmark.
References 651

Sheldahl Inc. (2004). Thermal control material and metallised films. Spedding, V., & Hargreaves, P. (1995). Materials on line. Materials
General Trade Literature and Specifications, and The Little Red World,3(10), 483–484.
Book. Sriveeraraghavan, S., et al. (1995). Chemical removal of solder and
Shibutani, T. (2009). Effect of grain size on pressure-induced tin solder electroplates. Metal Finishing: 34–36.
whisker formation. In 3rd International Tin Whisker Symposium, Stanley, J. K. (1968). Solutions to some stress corrosion cracking
Lyngby, Denmark, June 23–24. problems in aerospace situations. In Proceedings of 1st Interna-
Shiganov, N. V. (1973). Some special features of arc welding with a tional Aerospace and Marine Corrosion Technical Seminar,
hollow electrode in vacuum. Welding Production, 20(9), 30–33 NACE, LA, USA, July.
Shipley, E. A. (1988). Developments in ultra high tensile wire ropes. In Stoltz, R. E., & Stulen, R. H. (1979). Slid metal embrittlement of Ti–
Proceedings of Conference on the Hoisting of Men, Materials and 6A1–6V–2Sn by cadmium, silver and gold. Corrosion-NACE,35
Minerals (pp. 1295–1307), Toronto. (4), 165–169.
Shrestha, S., Merstallinger, A., Sickert D., & and Dunn, B.D. (2003). Strachan, W. (2000). Processes for manual solder assembly of high
Some preliminary evaluations of black coating on aluminium heat capacity boards (Unpublished).
AA2219 alloy produced by plasma electrolytic oxidation (PEO) Stratton, P. (2013). Ellingham diagrams—Their use and misuse.
process for space applications. In Proceedings of 9th International International Heat Treatment and Surface Engineering Journal,7
Symposium on Materials in a Space Environment (pp. 57–65), The (2), 70–73.
Netherlands, June 16-20. Sterjovski, Z., et al. (2010). The effect of voltage and metal transfer
Shrestha, S., et al. (2007). Recent developments in black finish coatings mode on particulate fume size. Rivista Italiana della Saldatura,6,
on aluminium by Keronite plasma electrolytic oxidation. Proceed- 765–780.
ings of the Global Power Train Congress, Engine, Transmission Sturgeon, A., & Dunn, B. D. (2006). Cold sprayed coatings for polymer
and Propulsion, Berlin,39–42, 207–215. composite structures. In Proceedings of 10th ISMSE Conference,
Shrestha, S., & Dunn, B. D. (2010). Plasma electrolytic oxidation and Collier, France, June 19–23 (ESA SP-616).
anodizing of aluminium alloys for spacecraft applications. In H. Suchentruck, R. (1986). Electroforming of complex parts. Transactions
Dong (Ed.), Surface engineering of light alloys. Cambridge, UK: IMF,64, 19–23.
Woodhead Publishing Ltd. Sun, J., et al. (2012). Kinetic study of the pyrolysis of waste pcbs
Shrestha, S., et al. (2015). Silk corrosion and stress corrosion cracking subject to conventional and microwave heating. Energies,5, 3295–
behavior of Plasma electrolytic oxidized Al-SiC metal matrix 3306.
composite, to be published. Surkov, Y. (1997). Exploration of terrestrial planets from spacecraft
Shumka, A., & Pietry, R. (1975). Migrated-gold resistive shorts in (2nd ed.). Chichester, UK: Wiley-Praxis.
microcircuits. In Proceedings of 13th IEEE International Reliability Suslov, D. I., et al. (2010). Convective and film cooled nozzle
Physics Conference (pp. 93–98), Las Vegas. extension for a high pressure rocket subscale combustion chamber,
Sicking, R. (2005). Brazing of aluminium heat exchangers. Welding AIAA 2010-1150. In 48th AIAA Aerospace Sciences Meeting
and Cutting Journal,4(3), 150–159. Including New Horizons Forum, Orlando, FL, USA, January 4–7.
Silverman, E. M. (1995). Space environmental effects on spacecraft: Tak, W, et al. (2009). SMA actuator based satellite separation device
LEO materials guide. NASA Contractor Report 4661 Part 1, using plastic deformation. In 13th European Space Mechnisms and
August. Tribology Symposium—ESMATS, Vienna, September 23–25 (ESA
Simpson, P. R., & Bowie, S. H. U. (1970). Quantitative optical and SP-670).
electron-probe studies of the opaque phases. Science,167, 619–621. Tamai, T. (1995). Effects of silicone vapour and humidity on contact
Sinclair, J. D., et al. (1985). Volatile components in rosin flux: reliability. In Proceedings of IEEE Holm Conference (pp. 252–259).
characterisation and reliability effects. In 35th IEEE Electronic Tamai, T., & Aramata, M. (1993). Safe levels of silicone contamination
Components Conference (pp. 144–150), Washington DC, May 20–22. for electrical contact. In Proceedings of IEEE Holm Conference on
Singh, J., et al. (2005). Welding in Space. Advanced Materials and Electrical Contact Phenomena (pp. 269–273), England
Processes Journal: 52–57. Teare, M. (1994). Manufacture of a multi-horn feed by electroforming.
Smith, C. A. (2007). Chemical characterization of materials in In International Symposium on Advanced Materials for Lightweight
electronic systems using infrared spectroscopy. Circuit World,33 Structures, ESA-ESTEC (pp. 305–309), March 22–24. ESA WPP-
(3), 38–47. 070.
Sogame, E., et al. (1990). Recent developments in the hydrazine related Teer, D. G. (2001). New solid lubricant coatings. Wear,251, 1068–
propulsion technology in NASDA. In Proceedings of 17th Inter- 1074.
national Symposium on Space Technology and Science (Vol. 1, Tegehall, P.-E. (1991). The impact of crevices beneath smds on the
pp. 107–112), Tokyo. cleaning efficiency. Soldering and SMT Journal,8, 46–52.
Sohn, J. E., & Ray, U. (1995). Weak organic acids and surface Tegehall, P.-E., & Dunn, B. D. (1992). Influence of flux residues and
insulation resistance. Circuit World,21(4), 22–25. conformal coating on the SIR properties of spacecraft pcb’s. ESA
Solari, G., & Repetto, M. P. (2014). IL comportamento delle structure Journal,16(3), 255–274.
metalliche saldate nei confronti delli’azione del vento. Rivista Tegehall, P.-E., & Dunn, B. D. (2001). Assessment of the reliability of
Italianadella Saldatura: 851–859. solder joints to ball and column grid array packages for space
Soli, L., & Dunn, B. D., et al. (2015). An electron beam brazing reflow applications, ESA-STM-266.
technique. Giorate Nazionali di Saldatura, GNS8, Genoa, Italy, Tegehall, P.-E., & Dunn, B. D. (2001a). Evaluation of thermally
May 28–29. conductive adhesives as staking compounds during the assembly of
Somiya, I., et al. (2013). Products with special electrical and magnetic spacecraft electronics. ESA STM-265, August.
properties, Ch. 7. In Handbook of advanced ceramics: Materials, Tegehall, P.-E., & Dunn, B. D. (2003). Impact of cracking beneath
applications, processing and properties. Amsterdam, The Nether- solder pads in PCB laminate on reliability of solder joints made to
lands: Elsevier Inc. ceramic ball grid array packages. ESA-STM-267.
Sood, B., et al. (2011). Whisker analysis of electronic throttle controls. Tegehall, P.-E., & Dunn, B. D. (2005). Impact of reworking ceramic
Circuit World,37(3), 4–9. AGAs on the integrity of PCB laminates. ESA STM-273, June.
652 References

Tegehall, P.-E., & Dunn, B. D. (2006) Evaluation of cleanliness test Tyler, D. (2015) Reliability of ball grid arrays converted from lead-free
methods for spacecraft PCB assemblies. ESA-STM-275. to tin-lead by robotic hot solder dipping, EMPS-6, Wessling,
Tegehall, P.-E., & Wetter, W. (2015). Impact of laminate cracks under Germany, April 15–16.
solder pads on the fatigue lives of BGA solder joints, Microelec- Vail, J. R., et al. (2011). Polytetrafluoroethylene fiber reinforced
tronics Reliability, article in press. polyetheretherketone composites. Wear,270, 737–741.
Thiel, C., et al. (1993). Functional activity of plasmid DNA after entry Vander Voort, G. F. (2008) Titanium—specimen preparation,
into the atmosphere of Earth investigated by new biomarker Advanced Material and Processes, February 25–27.
stability assay for ballistic spaceflight experiments. PLOS One, van Eesbeek, M., et al. (1994) Degradation of Teflon FEP due to VUV
November 26. and atomic oxygen exposure. In Proceedings of 6th International
Thiel, M., et al. (2003). The Rosetta Lander Anchoring System. In Symposium on Matls in Space Environment, ESTEC (pp. 165–173).
Proceedings of the 10th European Space Mechanisms and Tribol- ESA SP-368.
ogy Symposium (pp. 239–246), San Sebastian, Spain, September Vancso, J, et al. (2009) Whats new in atomic force microscopes for
24–26. polymers. Microscopy and Analysis, May 5–11.
Thoma, W. (1981). Product liability. In 2nd ESA Product Assurance Vaughn, R. L. (1985). Space shuttle—A triumph in manufacturing.
Symposium (pp. 31–33), ESA SP-163. Dearborn, USA: Society of Manufacturing Engineers.
Thomas, G., et al. (1993). The effect of pre- and post-weld heat VEGA. (2006) User’s Manual, Issue 3 rev.0, and ESA-BR-257 (2007).
treatments on the mechanical properties of EB welded Ti6A14V. Veit, H. M., et al. (2002). Using mechanical processing in recycling
Journal of Material Science,28, 4892–4899. printed wiring boards. JOM, June 45–50.
Thomas, G., & Dunn, B. D. (1999). Assessment of electrically Verbraak, C. A., TNO Metaalinstituut. Delft: Private Communication.
conductive adhesives (ECAs) for joining surface mount devices to Verderaime, V., & Vaughan, R. (1995) Aluminium U-groove weld
printed circuit boards. In 2nd IEEE Symposium on Polymeric enhancement based on experimental stress analysis. NASA Techni-
Electronic Packaging (PEP 99) (pp. 9–13), Gothenburg, Sweden, cal Paper3581.
October 24–28. Verdin, D., & Duck, M. J. (1985). Conductive coatings to minimise the
Thomas, R. W., & Calabrese, D. W. (1983). Phenomenological electrostatic charging of Kapton. 3rd European Symposium on
observations on electromigration. In 21st Annual Proceedings in Spacecraft Materials in Space Environment (pp. 125–131). ESA
Reliability Physics (pp. 1–9), Phoenix, Arizona, April 5–7. SP-232.
Thompson, D. H. (1961). A simple stress corrosion cracking test for Vine, M. K., & Price, W. B. (1992) A literature review of fretting in
copper alloys. Materials Research and Standards,1(2), 108–111. launch, re-entry and space environments. ESTEC Contractor Report
Thomson, P., et al. (1995). The use of shape memory alloys for passive from ESTL (TM-106).
structural damping. Smart. Materials and Structures,4, 36–42. Vitt, B. (1987). Black-cobalt coating for solar collectors. Philips
Tighe, A. et al (2010) Overview of results from the materials exposure Technical Review,43, 244–252.
and degradation experiment (MEDET) after 18 months in orbit on Voigtlander, B. (2015). Scanning Probe Microscopy. Heidelberg:
the ISS, ESA paper. Springer.
Tillmann, W., & Boretius, H. (2008). Properties of nickel-based joints Volkert, C., & Minor, A. M. (2007). Focused ion beam microscopy and
between diamond and steel for diamond grinding tools. Welding micromachining. MRS Bull,32, 389–395.
and Cutting,7(4), 228–234. Vranish, J. M., & Gorevan, S. (1995). Basic space payload fastener.
Toensmeier, P. A. (2009). Shape memory polymers reshape product 29th Aerospace Mechanisms Symposium, NASA JSC (pp. 152–157).
design. In Plastics engineering, April 2. NASA Conf. Publication 3293.
Towner, J. M., et al. (1984). Grain growth in Al alloy conductors as a Wagner, R. (1992). Metallized CFRP technology. Germany: Private
result of rapid annealing. Applied Physics Letters,44, 198–199. Communication, Dornier Space Systems.
Tondu, T., et al. (2011). Cesium droplet evaporation as contamination Walmsley, M. (2015). Ruggedised solder joint technology for leadless
route by cesium field effect electric propulsion. Journal of semiconductor packages. EMPS-6, Wessling, Germany, April 15–
Spacecraft and Rockets,48(3), 513–519. 16.
Troughton, M., et al. (2013). State of the art in welding thermoplastics Ward, P. (1994). Effects of bearing wash procedures in performance.
and in assessing thermoplastic welded joints. Rivista Italiana della Non-Ozone depleting Chemical Cleaning EPA Workshop, Denver,
Saldatura,6, 887–895. Co, September 26–27.
Tsuda, N. (2000). Electronic conduction in oxides (p. 243). Heidelberg, Ward, P. P. (1996). Plasma cleaning techniques and future applications
Germany: Springer. in environmentally conscious manufacturing. SAMPE Journal,32
Tsukada, M., et al. (2012). A new strategy for assessing off-gassing (1), 51–54.
from museum materials. AIC News,37(1), 1–7. Warwick, M. E., & Muckett, S. J. (1983). Observations on the growth
Tulsi, S. S. (1986). Properties of electroless nickel. Transactions of intermetallics on tin-coated substrates. Circuit World,9(4), 5–11.
IMF,64, 73–76. Watson, J. A., et al. (2002) A history of astronaut construction for large
Turlach, G. (1985). Improving fatigue strength of aerospace metal space structures at NASA LRC. In IEEE International Space
fasteners by surface work hardening. Surface Engineering,1(1), Station Conference. Nyact, NY, USA, March 9–16.
17–22. Webster, D. (1994). Aluminium–lithium, the next generation.
Turner, I., Dunn, B. D., & Barrnes, C. (2013). A study into the re- Advanced Materials and Processes,145(5), 18–24.
processing of pure tin termination finishes into tin-lead. Soldering Wedgewood, A. (1994). Measuring residual stress. Materials World,3
and SMT Journal,25(4), 218–228. (1), 5–7.
Turner, R. F. (1995). Chapter 9. In P. Fortescue & J. Stark (Eds.), Weirick, L. J. (1975). A metallurgical analysis of stress corrosion
Spacecraft systems engineering (2nd ed.). Chichester: Wiley. cracking of Kovar package leads. Solid State Technology,18(3), 25–
Turner, T. E., & Parsons, R. D. (1982). A new failure mechanism: A1– 30.
Si bond pad whisker growth. IEEE Transaction on Components, Wescon. (1965). Session 16B Papers (Western Electronic Show and
Hybrids and Manufacturing Technology,CHMT-5, 431–435. Convention, California, 1965), July.
References 653

Wetzer, J. M., & Wouters, P. (1993). The effect of insulator charging on Xu, H., et al. (2013). Wafer-level SLID bonding for MEMS encap-
breakdown and conditioning. IEEE Transactions,EI 28(4), 681–691. sulation. Advances in Manufacturing,1, 226–235.
Wetzer, J. M., & Wouters, P. (1994). High-voltage design of spacecraft Yao, W., & Basaran, C. (2014). Damage mechanics of electromigration
vacuum components. Paper from the High-voltage and EMC and thermomigration in lead-free solder alloys under alternating
Group, Eindhoven University of Technology, The Netherlands current: An experimental study. International Journal of Damage
Whalen, M. V. (1988). The compatibility of dispersion-strengthened Mechanics,23(2), 203–221.
platinum with propellants. Platinum Metals Rev,32(1), 2–10. Yao, Y., Zhou, Y., & He, L. (2013). Corrosion behavior of molybdate
Wickham, M., Hunt., Adams, D., & Dunn, B. D. (1999). An conversion coating on AZ31 magnesium alloy in NaCl solution.
investigation into ball grid array inspection techniques, ESA Anti-Corrosion Methods and Materials,60(6), 301–311.
STM-261. Yext, W. F., et al. (1983). Improved glass-to-metal sealing through
Wickham, M. et al. (2014). Whisker mitigation measurements using a furnace atmosphere control. IEEE Transactions on Components,
test vehicle based on a printed circuit assembly. 8th International Hybrids and Manufacturing Technology CHMT-6 (pp. 455–459),
Symposium on Tin Whiskers. Raleigh, NC, USA, October 29. December
Wild, R. N. (1975) Some fatigue properties of solders and solder joints. Ylikorpi, T., et al. (1995). Development of an actuator for CAPS on
INTER-NEPCON, Brighton, UK. IBM report No. 74Z000481, spacecraft Cassini. In Proceedings of 6th European Space Mecha-
October. nisms Conference (pp. 97–101). Zurich, Switzerland, (ESA SP-374).
Williams, D. N, et al. (1970). Hydrogen segregation in Ti–6A1–4V Yoder, D. D., et al. (1993). Technical article on plated through hole
weldments made with unalloyed titanium filler material. Welding fatigue life, Part 2. IPC Review,34(5), 20–27.
Journal Research Supplement, May 207–212. Yost, F. G. (1976). Indium soldering on gold. In Proceedings of
Wingborg, N., de Flon, J., Johnson, C., & Whitlow, W. (2008) Green International Microelectronics Symposium (p. 61).
Propellants Based on ADN. Space Propulsion 2008. Heraklion, Yost, F. G., et al. (1976). Layer growth in Au-Pb/In solder joints.
Crete, Greece. ESA, 3AF, SNPE, May 5–8, 2008. Metallurgical Transactions A,7A, 1141–1156.
Winkler, W. (1975). Conductive coating: problem of electrostatic Zhang, W., & Jin, H. (2009). Study of tungsten metallization surface
cleanliness. Acta Astronautica,2(7–8), 745–754. states for multilayer ceramics. In IEEE Proceedings of ICEPT-HDP
Wolfenden, R. T. (1996). Problems with solvent vapours in arc welding ’09 International Conference. Beijing, China, August 10–13.
fabrication environments. Welding and Metal Fabrication,64(4), Zhao, H., et al. (2013). Controlled atmosphere brazing of aluminium
136–139. heat exchangers. Welding Journal, February 44–46.
Wolff, R. H. (1963). Corrosion of plated metals after heating in Zimcik, D. G. (1987). Effect of long-term exposure to LEO space
vacuum. Plating Journal, 905–910, October. environment on spacecraft materials. Canadian Aeronautics and
Wright, C. (1977). The effect of solid-state reactions upon solder lap Space Journal,33(1), 4–10.
shear strength. IEEE PHP,13(3), 202–207. Zirker, L. R., et al. (2007). Weld tests conducted by the Idaho National
Wu, X. J., et al. (1994). The orientation dependence of fatigue crack Laboratory, INL/EXT-07-12289.
growth in 8090 A1–Li plate. Metallurgical and Materials Trans- Zou, L., Dunn, B. D., et al. (1999). An evaluation of the effect of ageing
actions A,25, 575–588. on the cleanability of solder flux residues. Soldering and SMT
Xu, H., et al. (2009). A re-examination of the mechanism of Journal,11, 27–35.
thermosonic copper ball bonding on aluminium metallised pads. Zwanenburg, R. (1995) The qualification test programme of the Envisat
Scripta Meterialia,61(2), 165–168. solar array mechanism. In Proceedings of 6th European Space
Xu, H., et al. (2010). The role of bonding duration in wire bond Mechanisms Conference (pp. 65–72), Zurich, Switzerland. ESA
formation: a study of footprints of thermosonic gold wire on SP-374..
aluminium pad. Microelectronics International,27(1), 11–16.
Index

Note: Bold page numbers are used for main references. An italic number refers to an illustration on the page.

0–9 Al-2219 wrought product, 136


0.5 N thruster, 290 Alclad products, 134
2 m diameter L-band dish antenna after test, 298 Al–Li alloy plate, 143
3D printing (or Additive manufacturing), 12, 33 Al–Li alloys, 103
50In50Pb, 454 Al–Li cryogenic tank, 232
50In50Pb solder joints, 355 Alodine, 529, 545
6061, 179 Alodine 1200, 329
96Sn–4Ag solder alloy, 356 Alodine 1200 coating on Al-2024-T3, 135
Alodine finishes on common spacecraft aluminium alloys, 134
α and ɛ for common spacecraft surfaces, 267
A α/ɛ for a selection of surfaces and finishes, 267
AA 2017, 253 α/ε values, 23
AA 2024-T81 (bar, rod), 539 Alpha-case embrittlement, 323
AA 2219, 33, 51, 103, 217, 225, 325, 545 Alphasat, 8
AA 2219-T81, 539 Al–Si brazing filler metal, 181
AA 2618, 183 Alternate immersion test, 250
AA 7020, 325 Alulight®, 202
AA 8090-T8771, 249 Aluminides, 535
Ablation, 46 Aluminium alloy, 19
Ablative material, 34, 36, 37, 46, 262, 502, 524. See also Re-entry Aluminium alloy 2219, 98
Ablebond 8175A, 415 Aluminium alloy cooling loop, 129
Accredited laboratories, 105 Aluminium Alloys Designations, 567
Acicular alpha, 126 Aluminium alloy temper designations, 567
Acoustic emission, 89 Aluminium-Beryllium Alloys, 288
Acoustic emission sensors, 94 Aluminium honeycomb to face-skin, 304
Acoustic emission signals, 93 Aluminium-lithium alloy, 36, 83, 273
Acoustic microscope, 88 Aluminium metallization, 469
Acoustic microscopy, 85 Aluminium metal matrix composites, 229
Active metal process, 402 Aluminium on carbon fibre reinforced PEEK, 224
Active systems, 23 Aluminium-to-gold wire bond, 337
Additive layer manufacturing, 12 Aluminium whisker growth, 470
Adhesive, 50, 56, 125, 413, 507 Aluminized FEP Teflon, 322
Adhesive compounds, 533 AM-350, 318
Adhesive filler, 304 American Welding Society, 340
Adhesive film, 295 Ammonium di-nitramide, 328
Adhesive tape, 42, 188, 284 Ammonium perchlorate, 328
Adhesive tape residues, 208 Amorphous silica, 290
Adhesive wear, 26 Analysis of surfaces, 99
Aeroshell, 46 Anodized beryllium, 529, 532
AF-E-332, 43, 290, 294 Anodized film, 308
Ag–Cu eutectic, 402 Anodizing, 134
Ageing tests, 339 Antenna face-skin, 223
Airborne salt, 139 Apogee-boost motors, 167
AISI 304, 98 AQ 60 I, 526
AISI 440C, 296 Aqueous cleaning systems, 212
AISI E52100, 296 ARALDIT, 539
Al-2195, 274 Araldite AV 138, 42
Al-2219, 132, 133, 137, 237 ArallR, 45

© Springer International Publishing Switzerland 2016 655


B.D. Dunn, Materials and Processes, Springer Praxis Books,
DOI 10.1007/978-3-319-23362-8
656 Index

Area grid array (AGA), 122, 426 BETA cloth, 540


Area Grid Array packaging, 434 Bimetallic contacts, 18
Area Grid Array packages, 352 Bimetallic corrosion-related failures, 128
Argon ion milling, 70 Bi-stem deployment, 322
Argweld enclosure, 182 Bi-stem deployment booms, 322
Ariane IV, 31 Black anodized aluminium, 267
Ariane 5, 232, 328 Black anodizing, 270
Ariane 5 systems where white paint is applied, 238 Black arrow, 111
Ariane launchers, 325 Black chromium, 269
Ariane V, 32, 33 Black cobalt, 269
Ariane V ‘half-fairing’, 66 Black pad, 176, 358, 359
Asymptotic heating strategy, 150 Black patina, 360
Atmospheres for Brazing, 404 Black-anodized aluminium housing, 317
Atomic force microscope, 70 Black-anodized electrical connector, 308
Atomic oxygen, 168, 505, 522, 525, 540, 547, 554 Black-anodized finish, 311
Atomic oxygen on materials, 517 Black-anodized layer, 311
Atomic oxygen protective coatings, 505 Black-body calibration mechanism, 306, 307
Atomic oxygen testing, 97 Black-nickel plating, 269
Atomic oxygen with selected metals, 524 Blind bolt fasteners, 259
Au2Al, 335 Blow-hole, 160, 411
AuAl2, 334 Board distortion, 423
AU4GN, 30 Borosilicate glass, 35
Au80Sn20 braze alloy, 243 Brass turret terminal, 358
AuIn2, 348, 365, 366 Brass turret terminal pins, 359
AuSn4, 339, 360, 361 Braycoat, 539
Austenitic steels, 318 Brazeability, 400
Automatic electrical test equipments, 422 Braze alloy compositions, 400
Avcoat ablative material, 36 Braze alloy filler metals, 399
AZ31, 129, 306 Brazed joint, 341
AZ5GU, 30 Brazing, 51, 239, 245, 329, 399
Brazing alloy foil, 180
Brazing fluxes and their removal, 403
B Brazing furnace, 404
Bacteria, 68, 72 Brittle fracture, 247, 332
Bacterial and fungal growth, 42 Brittle-to-ductile fracture transition temps. in Pb-free and SnPb solders,
Baffle Cover Mechanism, 309 457
Baffle hinge, 311 Brominated flame retardants, 109
Bake-out times and temperatures for PCBs, 392 Brush alodined weld zones, 59
Balinite, 310 Brush debris, 506
Ball bonding, 332 Brush plating at NASA MSFC, 236
Barium-impregnated cathodes, 291 BS L93 alloy plate, 142
Barrier layer, 358 Burn-in procedures, 341
Beach marks, 271 Butt joint between copper and nickel, 206
Beagle 2, 48 Butt-welding process, 332
Bearing friction, 299
Bearing lifetimes, 304
Bearing materials, 148 C
Bearings coated with titanium carbide, 299 Cable cutter, 28
Bearings under vacuum, 299 Cadmium, 24, 108, 272, 327
Belleview spring fracture surface, 250 Cadmium fumes, 405
Belleville spring, 250 Cadmium plating, 255
Benzene-based solvents for cleaning, 210 Cadmium slivers, 313
Be-oxide layer, 530 CAF growth, 396
BepiColumbo, 25 Calomel electrode, 387
Berylliosis, 281 Capacitor, 352
Beryllium, 280, 283, 405 Capillary action, 341
Beryllium as a heat shield, 528 Capillary attraction, 399
Beryllium as-received parts, 285 Capillary gaps, 214
Beryllium foil, 286 Capillary management systems, 327
Beryllium foil with resulting mechanical properties and grain Capillary pump, 327
structures, 287 Capillary screens, 172
Beryllium machining, 281 Carbon fibres, 36, 45, 164, 166, 168, 172, 247, 518, 532
Beryllium S-200C, 20 Carbon fibre reinforced polymers, see CFRP
Beryllium sheet, 529 Coefficient of expansion, 557
Beryllium structures, 259 Carbon nanotubes (CNT), 44, 46
Beryllium thermal protection, 526 Carbon nanotube structure, 44
Index 657

Carbon–carbon composites, 170, 531 Cold welding of mechanisms, 304


Carbon–carbon decelerator, 526 Cold welding of stranded wires, 380
Carbon-epoxy, 36 Colinal, 269
Carbon fibre mesh, 44 Collected volatile condensable material, 40
Carbon–silicon carbide composites, 531 Colophony fumes, 398
Cassini, 526, 528 Column grid array interconnections, 440
Catalyst deactivation, 290 Column grid arrays, 426
Catalyst particles for hydrazine decomposition, 288 Combustion chamber, 33
Catalyst particles, 289, 290 Commercial off-the-shelf components (“COTS”), 63
Catalytic bed thruster motors, 512 Communication satellite systems, 7
Cathode emitter degradation, 291 Company cleaning plan, 210
Cathode emitter degraded by sintering of porous tungsten, 298 Comparison Tables (Alloys), 571
Cathode emitter surface, 293, 296 Compatibility of Liquid and Solid Propellants with Components and
Cavitation at the inclusion-to-matrix interface, 265 Subsystems, 326
Ceramic capacitors, 410 Compatibility testing, 210
Ceramic chip capacitor with internal voiding, 88 Compatible coupling, 17
Ceramic matrix composite fasteners, 535 Component cracking, 424
Ceramic matrix composites, 534 Component part selection, 66
Ceria doped micro-sheets, 28 Component part selection, and procurement, 61
Cesium, 24 Composite contact rivets, 165
CFRP, 11, 26, 36, 91, 166, 293, 505 Computer tomographic scan, 438
CFRP delaminations and fractures, 295 Computerized X-ray tomography, 88
CFRP face-skins with an aluminium honeycomb, 293 CONATHANE, 432
CFRP waveguides, 168 Condensation of outgassing products, 505
Charcoal black finish, 227 Condensation rates, 273
Chemglaze, 547 Condensed cadmium contaminant on surface of painted shroud, 275
CHEMGLAZE, 539 Condensed moisture, 129
Chemglaze Z306 black paint, 275 Condensed organic contamination, 259
Chemical analysis, 71 Conductive adhesives, 425
Chemical conversion, 329 Conductive Anodic Filament (CAF), 393, 394
Chemical conversion coating for magnesium alloys, 129 Conductive coatings, 238
Chemical conversion coatings, 134 Conductive silicone adhesive, 271
Chemical (elemental) content of a typical spacecraft electronic box, 112 Conductor track failure, 428
Chemical stripping, 496 Conformal coating, 393, 428, 432, 540
Chromate conversion coating, 129 Connector bodies, 313
Chromate conversion coating on cadmium-plated steel, 275 Connector-to-coax assemblies, 356
Chromate primers, 107 Contact devices, 164
Chromium and nickel sublimation, 276 Contaminant particles, 309, 549
Circuit design, 423 Contamination, 65
Circumferential in-place pipe welding, 196 Contamination of Invar moulding tool, 312
Cleaning efficiency, 391 Controlled atmosphere brazing, 181
Cleaning method, 275 Conversion table for mechanical properties, 565
Cleaning of flux-contaminated surfaces, 389 Co-planarity problems, 423
Cleaning of flux residues, 351 Copper comb patterns, 392
Cleaning of individual parts, 210 Copper-palladium alloy, 165
Cleaning of metallurgically joined assemblies, 212 Copper ribbon column fracture, 440
Cleaning processes associated with spacecraft mechanical systems, 207 Copper–silver eutectic preforms, 132
Cleaning silicone contaminated surfaces, 219 Copper sulphate test for ferrite, 138, 318
Cleanliness, 216, 218 Copper–tin intermetallic layer, 149
Clean-room practice, 313 Copper-to-enamel interface, 370
Cleavage cracks, 248 Copper-to-silver-plating interface, 358
Coatings and conversion coatings, 268 Cork, 37, 46–48, 524
Coatings for soldering applications, 357 Cork TPS tiles, 48
Coaxial cable assembly, 356 Corona, 27, 390, 442, 445, 504
Coefficient of expansion, 557 Corona discharge, 444
Coefficient of (linear) thermal expansion, 349, 401, 557 Corona effects, 371
Coil spring, 309 Corrosion adjacent to dip brazed fillet, 179
Coin or tap test, 83 Corrosion of stored spacecraft electronic components, 40
Cold-drawn springs, 318 Corrosion potential, 17
Cold pressure weld, 299 Corrosion potential of metals, 14
Cold sprayed coatings, 223 Corrosion prevention, 17
Cold-weld, 339, 549 Corrosion product, 541, 546
Cold weld database summary tables, 307 Corrosion testing, 75
Cold-welded particle, 309 Corrosion, 390, 540
Cold welding, 25, 26, 83, 120, 299, 305, 354, 381 Corrosion-resistant fastener materials, 253
Cold welding due to cyclic, impact loading, 306 Cosmetic defect, 119, 411
658 Index

Cosmetics of solder fillets, 410 Diamond grit metal matrix composite, 222
Cosmic ray detectors, 451 Diamond pyramid hardness impressions, 336
Counterfeit fasteners, 253 Diaphragm, 38, 288
Cracked barrel, 120 Dichloromethane, 211
Cracked ceramic chip capacitor due to vibration, 421 Dicronite, 310
Cracked leads on a thick-film carrier package, 174 Dielectric breakdown, 359
Cracking of glass-to-metal seals, 410 Dielectric properties, 392
Crack initiation, 349 Differential heating, 509
Crack propagation rate, 27 Diffusion bonding, 197, 203, 206
Cracks in CFRP, 300 Diffusion brazing, 399
Cracks in Inconel heater housing, 278 Diffusion of zinc, 359
Cranes, 63 Diffusion soldering/brazing, 408
Crimpability, 370 Diffusion soldering process, 409
Crimping tools, 339 Diffusion welding, 105
Crimp joint, 337 DIGESIL, 315
Crimp-termination characteristics, 343 Dimensional stability, 170
Critical design review, 22 Dip brazing of aluminium alloys, 179
Critical processes, 621 Dip brazing, 181, 399, 405
Cross section polisher, 337 Dipole connection, 362
Cross-section through a solar array, 190 Disassembly of orbiting space hardware by astronauts, 305
Cryocon®, 198 Disposable mandrels, 177
Cryofit®, 198, 201 Dissimilar FSW, 233
Cryogenic bearing, 229 DNA, 70
Cryogenic propellants, 29 Dog bone tensile sample, 47
Cryogenic temperatures, 369, 455 DOW 17, 129
Cryogenic temperature materials, 26, 43, 149, 220, 229, 318, 320, 329, Dry-heat ageing, 371
369, 379, 454, 490 Ductile dimple fracture, 249
Cryostats, 27 Ductile intermetallic compounds, 365
Crystallographic planes, 98 Dye penetrant, 442
C-SAM, 439 Dye penetrant testing, 58, 139, 208, 255, 323, 408
Cu2O, 370 Dye penetrant test method, 439
Cu3Sn, 361, 372, 376, 412 Dynamic outgassing testing, 97
Cu6Sn5, 330, 361, 364, 412, 413, 474
CuA12, 131
CuAl2, 133 E
CubeSat, 11, 45, 63, 615 Earth’s magnetic field, 508
Curie temperature, 318 EB brazed joints with Au80Sn20, 242
Custom 455, 146 Ebonol black, 269
CV 1140–0, 431 EB-welded 2219-T851, 141
CV 1144-0, 432 EB welding machine for reflow brazing, 239
ECCOBON, 539
ECCOFOAM, 539
D Eccoshield tape, 196
D6AC, 34 ECM failures, 394
DC93-500 space grade, 42 ECSS-Q-ST-70-02, 38
Debond and fracture of CFRP, 299 ECSS-Q-ST-70-38, 353
Debris, 509, 512 EG8050HC, 415
Declared Materials List (DML), 10, 58, 116, 262, 309, 625 Elastomer type AF-E-332, 288
Declared Process List (DPL), 58, 419, 621 Electrical bonds, 329
Defective solid rocket motor case, 28 Electrical conductive adhesives (ECAs), 413
Defects in titanium piece-parts, 323 Electrical feedthrough, 444
De-golding by immersion, 360 Electrical grounding, 17, 223, 235, 329
Delamination, 84, 303, 392 Electrical interconnections, 329
Delrin, 505 Electrical open-circuit, 320
Delta ferrite, 315 Electrical resistance testing at room and cryogenic temperature, 455
Dendrites, 395 Electrical resistance weld, 330, 331
Densimet, 306 Electrical resistivity, 339, 458
Deployable nitinol strut, 200 Electrochemical migration (ECM), 359, 360, 392, 393, 393, 462, 540
Dermatitis, 398 Electrode housing, 240
Design margins, 11 Electrode housing materials, 242
Destructive physical analysis, 57 Electro-etch cleaning, 237
Dewetted area of pad, 152 Electro-explosive devices, 264
Dewetting of pad, 153 Electroforming processes, 176
Dewetting on areas to be soldered, 150 Electroless nickel deposits, 173
Dewpoint, 405 Electroless nickel plating, 318
Diamond, 220 Electroless nickel plating of aluminium electronic housings, 175
Index 659

Electromagnetic emission, 196 Fibre-reinforced glass ceramics, 170


Electromagnetic emission from TIG welding equipment, 195 Fibre-reinforced plastic composites, 166
Electromigration, 468, 470 Fill and drain nozzle, 198
Electron beam weld, 132, 184 Fingerprint greases, 127
Electron beam welding, 51, 184, 185 Finishes for titanium and its alloys, 310
Electron-beam-welded titanium alloy, 185 First-aid equipment, 405
Electronic box, 62, 88, 110 Five-stage model for whisker growth, 483
Electronic circuitry, 329 Flammability, 42, 540
Electronic housings, 329 Flammability hazard, 370
Electronic package, 427 Flat-packs, 351
Electroplated nickel, 174 Flatwise tensile tests, 296
Electrostatic discharge, 418 Flawed primary mirror, 11, 60
Elemental analysis, 97 Flexible circuits, 159
Ellingham diagrams, 400, 613 Flexible second surface mirrors, 271
Emafil Technology, 370 Flexible waveguide, 121
Embrittlement of copper, 127 Flight harness materials, 550
Embrittlement of titanium alloys, 255 Floating grains, 349
Enamel-coated copper, 370 Fluorescent penetrant inspection, 262
Energy conversion element, 200 Fluorides, 405
Energy-dispersive x-ray analyser, 71 Fluorinated ethylene propylene, 159
Engineering drawing, 116 Fluorine attack, 375
Environmental conditions, 20 Flux residue, 384, 391, 546
Epotek E2116, 415 Flux types for engineering metals, 387
Epoxy smearing, 159 Flux-corrosion of silver-plated stranded wires, 383
Epoxy top-coat, 394 Foamed aluminium for damping, 202
ePTFE, 46 Focused ion beam (FIB) microscope, 70
ERS-1 spacecraft, 167 Fourier transformation infrared (FT-IR) spectrometers, 100
Etchants, 561 Four-point bending test, 76
Etching of metals, 561 Fracture at cryogenic temperatures, 454
Etching solutions for beryllium, 285 Fracture locations in coating, 237
Ethical issues, 104 Fracture mechanics testing, 76
Eureca, 520 Fracture surface of a circular metallized (Ti–Pd–Ag) contact pad, 271
European retrievable carrier (EURECA), 503 Fracture toughness, 83
Eutectic tin–lead solder alloy, 341 Fretting, 83
EVA joining/cutting activities, 50 Fretting test, 229
Evaluation of solderability, 372 Friction, 25
Evaporation rates, 272 Friction stir joining and welding, 12, 34, 36, 52, 189, 231, 234
Examination of fracture surfaces, 247 Friction stud welding, 234
Exhaust plume, 328 FTIR, 391
Expendable launch vehicles, 28 FT-IR analysis, 317
Explosively welded transition ring, 187 Fuel lines, 324
Explosive welding, 186 Fusion welding, 182
Futuristic ideas, 11

F
Failed ABM case, 264 G
Failed ball-bearing, 304 Galileo spacecraft, 308
Failed component lead, 384 Gallium–palladium–silver braze alloy, 403
Failed rhenium tube from electrothermal thruster, 283 Galvanic compatibility, 388
Failed spacecraft antenna, 293 Galvanic copper corrosion, 378
Failed video camera electronic circuit, 541 Galvanic corrosion, 386, 389
Failure investigation, 99 Galvanic corrosion of fasteners, 257
Failure mechanism associated with surface-mounted devices, 425 Gamma-ray detectors, 286
Failure mode analysis, 57 Gamma-rays, 83
Failure of RF cables connected by SMT, 428 Gamma-TiAl alloys, 196
Failure review board (FRB), 21, 102 Gapasil brazing alloy, 273
Failures due to board flatness problems, 422 Gas-tight joint, 120
Faraday shielding, 37 Gas-tightness, 339, 340
Fastener failure due to forging defect, 254 Gas-tightness test, 338
Fastener manufacturers, 253 GCMS, 40
Fastener specifications, 255 Gecko biomimetic adhesive tape, 45
Fasteners, 251, 533 Girth weld, 68
Fatigue life, 367 GlareR, 45
Fatigue striations, 248 Glass to metal seal, 467
Fatigue tests, 78 Glass-rich oxide whiskers, 467
Ferromagnetic materials, 317 Glossary, 629
660 Index

Gold, 110 Hillocks, 469, 470


Gold–aluminium system, 332 Hi-lok TM fasteners, 34
Gold-embrittled solder joint, 363 Hinged-tube, 198
Gold embrittlement, 360 Hipparcos, 308
Gold embrittlement of solder, 362 Holddown and release unit, 308
Gold in solidified solder, 361 Hold-down button, 554
Gold-plated conductor material, 363 Hold-down points, 229
Gold-plated dipoles, 361 Hole-drilling strain-gauge method, 94
Gold-plated surfaces, 360 Holographic interface bond tester, 294
Gold removal, 348 Holographic interface tester, 85
Gold-rich intermetallic phases, 334 Holographic interference inspection of failed antenna, 301
Gold-tin binary phase diagram, 242 Hot-air-levelled coatings, 160
Gold wires, 332 Hot-dipped galvanization, 139
Grain boundary embrittlement, 127 Hot oil fusing of tin–lead, 148
Grain boundary embrittlement in beryllium, 286 Hot plate method, 161
Grain growth, 332 Hot-pressed beryllium, 259
Grain growth and internal cavitation, 280 hot-pressure mounting of samples, 343
Graphine, 43, 44, 220 HST solar array, 506
Graphite fibre thermal strap assemblies, 221 Hubble Space Telescope, 11, 50, 60, 190, 321, 322, 505
Graphite lubricants, 258 Human activities on the Moon, 502
Graphitization treatment, 166 Human contaminants, 100
Greases, 311 Human error, 115
Green chromated, 274 Humid environment (moisture), 170
Green CuCl corrosion, 133 Huygens probe, 527
Greener spacecraft, 106 Hybrid packages, 415
Green plague, 375, 386, 542 Hydrazine, 327
Green propellant, 109, 327, 328 Hydrazine contamination levels, 295
Griffith cracks, 324 Hydrazine (N2H4), 30
Ground activities, 20 Hydrazine propulsion tank, 68
Ground handling, 65 Hydrazine tank, 288
Ground-handling facilities, 63 Hydrazine tank diaphragm, 294
Guianese Space Centre, 325 Hydrazinium nitroformate, 328
Hydrogen bake-out, 124
Hydrogen embrittlement, 122, 255
H Hydrogen embrittlement of spring steel, 123
Habitable structure, 12 Hydrogen embrittlement of steel fasteners, 255
Hairline cracks, 184 Hydrogen embrittlement relief, 176
Hard-anodised layer on AA7075 alloy, 225 Hydroxylammonium nitrate, 328
Hard anodizing of Al-7075 alloy, 225 Hygroscopic contaminants, 394
Hard anodizing treatments, 129
Hard chromium, 27
Hardness testing, 73 I
Harness, 319 Identification of leak paths, 279
Health Hazards in the Electronic Assembly Area, 398 Impact crater, 555
Heat Affected Zone (HAZ), 126, 184, 185 Impact feature, 520
Heat-affected zone of laser welds, 186 Impact records, 517
Heat exchanger, 546 Impact test facility, 84
Heat shield, 34 Impact testing, 310
Heat shield materials, 524, 531 Impact/fretting test equipment, 307
Heat transfer in vacuum, 221 Inconel 600, 265
Heater filament, 90 Inconel 718, 20, 27, 126, 147, 253, 319
Heater investigation, 277 INCONEL 718-PH, 539
Heater sublimation problem associated with thruster motor, 276 Inconel alloys, 318
Heat-shrinkable sleeves containing solder preforms, 381 Indium solder alloys, 363
Hemispherical emittance, εn, of the anodized, 531 Indium–lead soldered to various gold interfaces, 365
Hermes spaceplane, 532 Indium–tin oxide, 271
Hermetically sealed assemblies, 399 Industrial placements, 103
High-absorption surfaces, 269 Infrared Space Observatory, 27
High-definition radiography, 86 Infrared Space Observatory cryostat, 320
High-definition X-radiography, 276 Infrared spectroscopy, 101
High-performance fasteners, 262 Inorganic glasses, 507
High-precision bearings, 296 Inspection, 434
High-temperature brazing, 404 Inspection criteria for brazed joints, 407
High-temperature fasteners, 533 Inspection criteria, 406
High temperature rating, 370 Insulation materials, 369
High voltage interconnections, 442 Insulation stripper, 337
Index 661

Interference fit, 259, 337 Leaking detector, 286, 288


Intergranular cracking attributed to stress corrosion, 249 Leaking heaters, 276, 277
Intergranular cracks, 184 Leaking kerosene cans, 448
Intermetallic compounds, 361 Leaking lead glass seals, 468
Intermetallics, 331 Leaking lower seal joint, 61
International Space Station (ISS), 42, 236, 501, 536 Leaking tanks, 325
Invar, 314, 319 Leak tests, 317
Ion chromatography, 391 Liberator TM, 49
Ionic contamination levels, 391 Lifting gear, 63
IPC J-STD-001, 353 Lightening, 139
Iridium catalyst, 290 Lightning, 37
Iron–nickel–copper alloy, 318 Light pollution, 107
ISO 9001, 56 Limited shelf life, 56
Isopropyl alcohol (IPA), 212, 390 Limpet teeth, 45
Limpet tooth material tooth, 47
Liquid and gas chromatographic techniques, 97
J Liquid crystal polymers (LCPs), 48
James Webb Telescope, 229, 509 Liquid helium, 312
J-leads, 424, 425 Liquid helium cryostate, 319
Joining metals to thermoplastics, 12 Liquid helium temperature, 451
Jupiter space probe, 285 Liquid metal embrittlement (LME), 139
Liquid penetrant tests, 82
Liquid phase infiltration, 532
K Liquid propellants, 326
Kapton, 518, 523, 550 LISA Pathfinder mission, 239
Kapton films, 271 Lock-nuts, 261
Kapton thermal blanket, 548 Low Earth Orbit (LEO), 501, 518
Keronite coating, 227 Low-emissivity surfaces, 268
Keronite PEO, 225 Low-expansion materials, 163
Kevlar, 63, 516 Low-temperature magnetic properties, 319
Kevlar-49 reinforced plastic, 166, 169 Low-voltage applications, 340
Kirkendall voiding, 335 Lubricants, 42, 503
Kovar, 132, 174, 330, 363, 357, 423, 467 Lubricants suitable for use under high vacuum, 258
Kovar lead material, 173, 348 Lubricating oils with low outgassing properties, 209
Kovar leads, 383 Lubrication, 21
Lunar soil, 13

L
Laboratories, 56 M
Laboratory notebooks, 100 MAPSIL 213, 432
Laboratory records, 100 Macroscopic examination, 67
Laminar flow bench, 81 MAGE apogee boost motors, 90
Laminography, 88 MAGE motor, 169
Lap welds, 332 Magnesium, 20, 24
Large diameter stranded wires, 340 Magnesium alloys, 129
Laser annealing, 176 Magnesium–lithium alloys, 273
Laser beam welding, 185 Magnet, 318
Laser welding, 52 Magnetic cleanliness, 175
Laser-welded spacecraft axle shaft, 186 Magnetic coercivity, 175
Laser-welded Ti6A14V, 186 Magnetic field generated by a spacecraft, 317
Launch, 20 magnetic moment, 370
Launch and operations readiness review, 22 Magnetic permeability, 318, 319
Launch site exposure and corrosion, 138 Magnetic problems, 317
Launch vehicle connector, 311 Magnetic shield materia, 318
Launch vehicle release gear mechanism, 314 Magnetically clean, 62
LDEF, 503, 516, 517, 520 Magnetometers, 317
Leaching of silica, 291 MAGNOLYA chemical surface treatment, 130
Lead coatings, 505 Mandrel materials for electroforming, 176
Lead-free control plans, 494 Manganin wire, 379
Lead-free solder alloys, 341 Manned compartments, 535
Leadless ceramic chip carriers, 355, 360 Manned spacecraft, 432
Leadless chip carrier, 431 Manned volumes, 538
Leadless surface-mounted devices, 351 Manual tungsten inert gas (TIG) arc welding, 181
Leaking battery cell, 194 Manual welding, 182
Leaking cartridge, 265 Manufacturing processes, 116
Leaking ceramic-to-metal seal, 131 MAPSIL 213, 42, 431
662 Index

Maraging steels, 30 Micro-VCM test equipment, 41


Martensitic high-strength alloys, 138 Microwave horn, 176, 177
Martensitic stress induced transformation, 318 Microwelding, 182
Martensitic transformation, 202 Microweldments, 330
Material group numbers, 617 Migration of silver sulphide tarnish, 269
Material review boards, 408 Mir space station, 52, 537
Materials and processes, 58 MISSE, 503
Materials and processes standards related to space, 619 Model philosophy, 21
Materials engineer, 21 Modern assembly room, 341
Materials laboratory, 64 Modern bearings, 299
Materials making up soldered joints, 349 Modification, 409
Materials review board, 102 Moisture ingress, 392
Mean time before failure, 469 Moisture pick-up, 26
Mechanical electrical connections, 337 Molybdenum, 240, 277, 280, 462
Mechanical fastener tool, 50 Molybdenum disulphide, 25, 305, 506, 518
Mechanical finishes, 134 Molybdenum–titanium phase diagram, 244
Mechanical parts and process controls, 616 Molybdenum whiskers, 462, 464
Mechanical properties Mo–Mn metallization system, 360
AA 8090 and other Al-Li alloys, 102, 143 Mono-methyl hydrazine (MMH) and nitrogen tetroxide, 327
AA 2219 various heat treatments, 102, 141 Monopropellant hydrazine thrusters, 276
beryllium, 287 Monopropellants, 328
BS L93, 142 Moon rock, 502
electronic materials at different temperatures, 368, 451, 458 Moon-rock analyses, 501
fastener materials, 253 Moore’s law, 461
spring materials, 146 Morphology of wear particles generated from sliding contacts, 165
tin whiskers, 487 MoS2, 217
Mechanical properties conversion table, 565 MoSTTM, 257
Mechanical properties of near-eutectic tin–lead alloys, 451 Motor exhaust plume, 514
Mechanical shock, 422 Motor thrust frame, 34, 232
Mechanical testing, 73 Moulding tools, 312
Mechanical-type strippers, 338 Mounting of chip parts, 416
Mechanism and the grounding plane, 305 MP 35N, 147
MEDET instruments, 231 Multilayer board internal connections, 155
MEMS, 11 Multilayer boards with high heat capacity, 161
Metal alloy comparison tables, 571, 611 Multilayer ceramic capacitors, 351
Metal matrix composites for spacecraft pressure vessels, 172 Multi-layer insulation blankets, 28
Metal migration, 164 Multilayer PCB, 84
Metal oxide precipitation in glass seal., 467 Multiphase MP35 N, 253
Metal oxide whisker, 466 Mumetal, 318
Metallic contamination particles, 312 Mutually soluble in the solid state, 165
Metallic fragment, 314 Mylar films, 271
Metallic particle generation, 258
Metallic particles, 309
Metallographic control, 330 N
Metallographic examination, 343 Nano-ceramic technology, 222
Metallographic presentations, 102 Nanocomposites, 414
Metallography, 97 Nano-grained alumina, 220
Metallurgical joint, 358 Narloy-Z, 32, 33
Metallurgical laboratory practice, 69 Natural rosin, 391
Metallurgical reaction, 331 Neutron diffraction method, 94
Metal-matrix composite, 427, 161 Neutron radiographs, 92
Micro-arc oxidation, 224 Neutron radiography, 86
Microcracked electroless nickel, 173 Nextel ceramic cloth, 516
Microcracked thin-foil detector windows, 286 Ni3P, 176
Microcracking of diode lead surface, 173 Ni3Ta, 332, 333
Microfocus x-radiography, 91 Nichrome heater coil, 278
Micrographs of tin-plated strands, 375 Nickel alloys, 19
Micrometeoroid, 509, 512, 555 Nickel coatings on Ti6Al4V, 235
Micrometeoroid impact, 506, 518 Nickel finishes, 370
Microscopic examination, 67 Nickel phosphide (Ni3P), 174
Microspheres, 36 Nickel phosphide precipitates, 358
Microstructure of milled and stress-relief-treated beryllium, 284 Nickel ribbon, 331
Microstructure of solder alloys, 343 Nickel sulphide process, 308, 317
Microtome, 70, 292 Nickel–cadmium battery cell, 117, 131
Microtome section of life-tested cathode, 297 Nickel-clad conductive LCP fibres, 49
Micro-VCM test, 97 Nickel-plated copper braid, 49
Index 663

Nickel-to-copper brazed joint, 402 PEEK, 308


Nickel-to-nickel electrical resistance microwelds, 332 PEEK composite, 223
Nickel-to-nickel welded electronic circuits, 330 Peel strength versus ageing time, 368
Nickel-to-phosphorus ratio, 175 Phase diagram, 25
Nickel-to-titanium alloy brazed joint, 403 Philips Globule method, 371
Niobium, 535 Phosphorous-rich surface, 359
Nitinol, 197, 200, 201 Pinch-off for tube sealing, 317
Nitinol-deployed lattice mast, 199 Pinch-off seals, 317
Nitrided stainless steel, 138 Pinhole, 121, 129
Nitrogen tetroxide (N2O4), 30, 327 Pitting and leakage of an aluminium cooling channel, 131
Nomex cloth, 548 Pitting corrosion, 328
Non-captive nut, 356 Plagues, see Green, Purple, Red and White plagues
Non-conformance board, 102 Plasma cleaning technology, 212
Non-conformance reports, 544 Plasma electrolytic oxidation (PEO), 224, 225, 229
Nonconforming fasteners, 262 Plasma electrolytic oxidation treatment, 308
Noncoplanarity, 423 Plated finish on copper conductors, 369
Nondestructive testing, 82 Plated-through hole, 152, 410
Non-metallic materials, 38 Platinum grain growth, 281
Platinum group metals, 534
Platinum ribbon, 277
O Platinum ribbon grain boundary, 277
Oddy test method, 40 Polyacrylonitrile, 166
Odour, 540 Polybutaidene acrylonitrile, 30
Offgassing, 40 Polyglycidylazide, 328
Open circuit, 358, 390, 431 Polyvinyl chloride (PVC), 369
Open-circuit failures, 320 Polyxylene, 429
Optical fibres, 42 Porosity during a solderability test, 160
Optical materials, 42 Porosity in weld bead, 118
Optical microscopy, 67 Porous gold plating, 269
Optical properties (α/ɛ ratio) before and after testing, 268 Positive air pressure, 344
Optical solar reflectors (OSR), 270 Post-flight inspection, 190
Optical spectroscopy, 97 Post-flight materials, 501
Orbital test satellite (OTS), 7, 28 Post-flight observations, 501
Organic chemistry, 97 Post-flight tribological assessment of the Hubble Space Telescope solar
Organic fastener lubrication systems, 257 array mechanisms, 303
Organic materials, 503 Potting compounds, 42
O-ring, 61 Power cycling, 352
O-ring seals, 43 Power (I2R) loss, 370
Orion crew module pressure vessel, 274 Power system weldments, 189
Orion spacecraft, 36 Precipitation hardening, 138, 251, 252
OTS-2, 9 Precipitation-hardening stainless steels, 403
Outgassing, 38, 540 Preconditioning, 357
Outgassing data for flux residues, 390 Preferred materials for short-term evaluation, 539
Oven bake-outs, 423 Preliminary design review, 22
Over-ageing, 251 Pressure vessel steel, 93
Oxyacetylene gas welding, 182 Primer coating, 274
Ozone-depleting chemicals, 107 Printed circuit board assemblies, 559
Printed circuit boards, 148
Printed-circuit-board (PCB) evaluations, 79
P Problems associated with brazing, 399
Paints, 42 Process documents, 405
Parameters for bake out, 393 Process identification document, 420, 422
Particle radiation, 23 Process identification documentation, 418
Particle size, 72 Produce assurance applied to brazing operations, 405
Particles generated from spacecraft fasteners, 261 Product assurance management, 55
Particles of beryllium, 262 Project review boards, 21
Particulate contamination, 398 Propellant, 29
Parting compound, 314 Propellant Management Device (PMD), 172
Paschen-like curves, 446, 447 Propellant motors, 30
Passivation treatment, 138 Propellant tanks for the Ariane-5 launch vehicle., 205
Passive systems, 23 Propellant tanks manufactured from Ti6Al4V, 171
Passive thermal control systems, 266 Properties of fluxes, 396
Pathfinder mission, 200 Properties of printed circuit laminates, 559
Payload-support structures, 167 Properties of tin whiskers, 485
Pcb finishes, 148 Protection shields, 515
PCB laminates properties, 557 PTFE, 25, 43, 49, 175, 188, 211, 258, 305, 310, 315, 353, 356
664 Index

Pull-off strength of coatings, 238 Rosetta, 28


Pulsed laser to repair solar cell interconnection welds, 186 Rotary dip method, 153
Purple Plague, 334–336, 332 Rotating weld pin during FSW, 232
Pyrel foam, 552 RTV 560, 35, 533
Pyrex glass, 319 RTV 566 silicone, 42
Pyrotechnic, 92 Rubber diaphragm, 290
Pyrotechnic actuator device, 422 Rubbers, 42
Pyrotechnic cutter, 265

S
Q SADM off-load device, 202
Quad flat packages, 422 Salinity maps, 139
Qualification review, 22 Salt spray corrosion tests, 308
Quality assurance, 55, 66 Salt-spray cabinet, 80
Quality assurance controls for fasteners, 261 Sapphire crystals, 245
Quartz optical solar reflector, 271 SAX spacecraft, 187
Scanning electron microscope (SEM), 68, 71, 247
Scanning laser acoustic microscope (SLAM), 85, 87
R SCC evaluation, 140
Radiation effects, 507 Scotchcast, 431
Radiation testing, 63 SCOTCHCAST, 432
Radiation, 25, 62, 547 SCOTCH-WELD, 539
Radiography, 83 Screen out magnetic items, 318
Random vibration, 420 Sea coast corrosion, 82
Rapid protyping, 12 Sealing of glass and beryllium windows, 369
REACH, 42, 106 SEAMS introduced during rolling, 256
Re2O7, 278 Second phase precipitates, 251
Recovered mass loss, 40 Secondary ion mass spectrometry, 99
Recuperation of unsolderable PCBs and component leads, 413 Selection of materials and processes, 10
Recycling, 106, 108 Selective brush electroplating, 234
Recycling electronic waste, 110 Selective brush plating, 235
Red plague, 370, 375, 376, 377, 378 Self-healing materials, 45
Re-entry, 520, 536 Semi-rigid cables, 341
Re-entry vehicles, 170 Semi-rigid cable solder joint fracture due to gold embrittlement, 362
Reflow of capacitor solder, 158 Semi-rigid RF cables, 428
Refractory metals, 534 Shape-memory alloys, 197
Regolith, 12, 13, 502, 503 Shape memory polymers, 44
Reinforced carbon/carbon, 35 Sharp fillets, 444
Release triggers made of Nitinol, 199 Shell 405 catalyst, 289
Reliability and safety, 57, 66 Shielding gases, 127
Removal of silicone polymers, 314 Shock loading, 458
Removal of work-hardened layers, 285 Shock wave, 265
Repair, 409, 432 Short circuit, 313, 360, 395, 486
Repair and modification of assemblies, 341 Shuttle tile, 35, 533
Reprocessing pure tin terminations, 495 Silica glass microspheres, 46
Residual fluxes on spacecraft PCBs, 393 SiC fibres embedded in a matrix of Ti6A14V, 162
Residual stress, 93, 98 SiC monofilaments in an aluminium matrix, 171
Residual stress measurements, 477 SiC monofilaments within an AA 2014 matrix, 164
Residual Stresses in Weldments, 195 SILGEST, 315
Resistance measurements, 329 Silicide-coated fasteners, 536
Resistance pressure welding, 330 Silicon carbide fibre reinforced metal matrix composites, 37
Resistance spot welding, 116, 329 Silicon carbide fibre reinforced titanium alloy matrix, 39
Resistance to thermal cycling environment, 432 Silicone contaminants, 317
Resistance-welded silver–mesh interconnector, 191 Silicone contamination, 219, 310, 505
Resonance, 422 Silicone oil, 311, 418
Reusable tanks, 183 Silicone oil contaminant, 317
Rework, 409 Silicone products, 219, 311, 505
Rework and repair of AGAs, 441 Silver coatings, 360
Rework of soldered joints, 408 Silver finishes, 370
Rework on composition of joint, 412 Silver mesh, 525
Reworking of spacecraft assemblies, 410 Silver migration, 359
Rhenium, 278 Silver wire, 331
River patterns, 248 Silver-coated molybdenum interconnector weld, 193
Rivet compositions, 253 Silver-filled thermosetting epoxy resins, 413
Rocket motor nozzles, 170 Silver-graphine, 414
RoHS, 107, 494 Silver-loaded epoxy, 415
Index 665

Silver-plated conductors, 371 Space Shuttle External tanks, 231


Silver-plated solid copper wire, 337 Space tribology, 305
Silver-plated steel stiff-nuts, 261 Spalling, 270
Silver-plated wire, 339 Specimens made from beryllium, 281
Silver-plated wire strands after solderability testing, 373 Spectroscopic methods, 72
Sine vibration, 420 SPELDA, 94
Skin effects for RF transmissions, 370 Spliced wire joints, 551
Skin-flake, 100 Spot-welding, 179
Skin secretions, 100 Spring clip, 337
Slip rings, 23, 311 Spring materials, 144
SMT solder joint failure due to Conformal Coatings, 428 Stablecore®, 353
SMT verification sample, 430 Staking compounds, 422, 426
Sodium polysulfide test, 377 Standard free energy of formation of oxides with temperature, 613
Solamide 301 foam, 552 Standard reference electrode, 389
Solar absorbers, 267 Standards for soldering spacecraft electronics, 342
Solar absorptance, 270 Standards related to space, 619
Solar array, 358 Stand-off height, 351, 353, 391
Solar array deployment/retraction system, 322 Steam ageing, 371
Solar-Array Drive Mechanism (SADM), 199 Steel alloys, 19
Solar blankets, 547 Steel alloys generally considered suitable for spring manufacture, 146
Solar reflectors, 267 Steel wires, 320
Solder assembly facility, 344 Steel wire-to-nickel tube welding operatio, 320
Solder column, 426, 439, 441 Stress corrosion, 327
Solder copper wire joint failure, 364 Stress-corrosion crack in the tank wall, 326
Solder dipping, 497 Stress-corrosion cracking (SCC), 19, 139, 325, 384, 540
Solder fillet, 352, 443 Stress-corrosion failure, 249
Solder flux, 540 Stress corrosion of component lead material, 383
Solder flux vapour, 339 Stress-corrosion tests, 75
Solder joint repair, 540 Stress-induced deformations, 319
Solder paste, 436 Stress-raising defect, 254
Solder Sleeves, 551 Stress-relaxation by thermal gradients, 319
Solder sphere, 511 Stress-relief bend, 412
Solderability, 155, 371, 386 Structural panels made from high-temperature titanium alloys, 207
Soldered interconnections, 340 Students, 103
Soldering, 329, 340 Sublimation, 24, 272, 283, 508
Soldering fluxes, 380 Sublimation of aluminium alloys, 181
Soldering parameters, 341 Sublimation of and condensation of cadmium and zinc, 274
Solder-plated lead wire, 330 Sublimation of klystron cathode-heaters, 276
Solders, 108 Sublimation of Rhenium, 278
Sold propellants, 328 Sublimation rate against temperature for Nichrome, 280
Solid lubricants, 26 Sublimation tests, 273
Solid solution, 25 Subsurface structures, 283
Solid-state diffusion of platinum, 277 Sulphur hexafluoride (SF6), 317
solid-state interdiffusion, 333 Sun sensor experimental baffle, 230
Solithane, 509, 510 Sun-sensor, 63, 64, 209
SOLITHANE, 432 Superconducting at 4.2 K, 458
Solithane 113, 454 Superconductive SnPb solders, 457, 458
Solvent resistance, 432 Superplastic forming, 196, 203, 206
Sound absorption coefficient of different foamed aluminium, 203 Surface analysis, 96
Sources of Failure, 115 Surface colourations, 127
South Atlantic Anomaly, 508 Surface-corrosion residue, 216
Space-approved greases, 257 Surface-diffusion layers, 323
Spacecraft antennae, 312 Surface electrical grounding, 329
Spacecraft antenna face-skins, 167 Surface insulation resistance (SIR), 392, 395
Spacecraft charging, 27 Surface insulation resistance testing, 391
Spacecraft detectors, 187 Surface mount technology, 341, 419
Spacecraft failures, 61 Surface of an FR-4 PCB board laminate, 392
Space environment, 22, 23 Surface protection treatments for aluminium alloys, 134
Space environment effects, 504 Surface-tension tanks, 172
Spacelab, 27, 42, 339, 501 Sustained stresses, 145
Spacelab post-flight hardware, 542 SYLGARD 184, 432
Spacelab processing and integration, 543
Spacelab-1 located in the shuttle cargo bay, 544
Space launch vehicles, 28 T
Space radiation environment, 507 Tack-weld, 179
Space Shuttle, 319 Tantalum foil capacitors, 333
666 Index

Tantalum lead wire, 332 Tin-plated conductors, 371


Tantalum wire lead, 333 Tin-plated copper, 369
Tape testing (for coatings), 224, 234, 236, 237 Tin-plated wire, 339
Technology Readiness Levels (TRLs), 10 Tin-plated wire strands after solderability testing, 374
Technology samples, 419 Titanium, 20
Teflon FEP, 505 Titanium aluminide, 196, 531
Temperature cycling, 509 Titanium aluminides for high-temperature applications, 196
Temperature dependence of specific resistance, 456, 457 Titanium carbide surfaces, 305
Temperature gradients, 319 Titanium filler metal, 125
Temper conditions of aluminium alloys, 567 Titanium hydride embrittlement, 324
Tensile testing at 4.2 K, 451 Titanium hydride precipitates, 125
Test chamber, 8 Titanium hydrides, 323
Textiles, 38 Titanium MMCs, 37
Thermal control, 270 Titanium nitride, 259, 299
Thermal control paints and coatings, 268 Titanium nitride coatings, 303
Thermal cracking, 311 Toe, 34, 291, 302, 314
Thermal cycling on work-hardened beryllium, 284 Toolboxes, 552
Thermal cycling systems, 74 Toroidal water tanks, 325
Thermal fatigue, 271 Total mass loss, 40
Thermal fatigue cracking, 79 Toxicity, 42, 540
Thermal fatigue cracking of copper conductor, 429 Traceability, 56, 67, 101, 110, 255, 327, 379, 435, 495, 616
Thermal fatigue cracks, 349 Trained operators, 621
Thermal fatigue failures in printed-circuit-board, 78 Training and certification, 341, 415
Thermal fatigue on leadless components, 351 Training, 21, 82, 103, 115, 161, 208, 210, 323
Thermal fatigue on semi-rigid cable connections, 353 Transcrystalline fracture, 247
Thermal fatigue on solder-assembled leaded components, 344 Transistor circuit, 333
Thermal fatigue programme, 345 Transmission electron micrographs of beryllium foils, 289
Thermal history from microstructure, 262 Transmission electron microscope (TEM), 68, 250
Thermal management, 509 Travelling wave tubes, 274, 291, 318, 442, 464
Thermal management materials, 220 Trunnion, 27, 549
Thermal mismatch between SMD and substrate, 425 Tube-to-tube TIG welding, 324
Thermal protection system, 47, 536 Tungsten heater elements, 274
Thermal straps, 44 Tungsten whisker, 464, 466
Thermal strippers, 337 Tungsten-inert-gas (TIG)-welded, 125
Thermal–compression bonding technique, 332 Type I high modulus fibres, 166
Thermal-cycled solder joints, 509 Type II high strength fibres, 166
Thermally conductive adhesives, 426, 427
Thermally induced bending, 321
Thermally induced vibrations, 321 U
Thermo-compression, 334 Ultrasonic testing, 83
Thermoelectric generators, 28 ultrasonic vibration, 332
Thermomechanical test facility, 218 Ultrasonics and other mechanical agitation, 209
Thermo-optical properties, 529 Ultraviolet (UV) radiation, 505
Thermoplastics, 43 Unequal (asymmetric) solder fillets, 354
Thermosetting plastics, 43 University, 10, 22, 63, 103, 617
Thermosetting resins, 319 University Spacecraft, 615
Thermount, 353 URALANE, 432
Thick-film hybrid, 425, 426 Urban miners, 110
Threaded fasteners, 252
Thread-rolling work-hardening, 252
Throw-away modules, 105 V
Thruster chamber, 132 Vacuum, 22, 40, 49, 135, 258, 272, 380, 508, 551, 617. See also
Ti–6A1–4V system and schematic representation of microstructures, outgassing and sublimation
264 Vacuum test chambers, 274
Ti6A14V, 323, 403 Vapour-deposited aluminium, 259
Ti6Al4V superplastically formed propellant tank, 204 Vapour deposition, 134
TiC coatings on steel, 299 Vapour phase machines, 435
TiC-coated 440C steel ball, 305 Vapour pressure curves, 272
TIG-welded 2219-T851, 141 VectranTM, 49
TIG-welded aluminium–lithium alloy plates, 188 Vega, 36
Tin oxide, 489 Velcro tape, 553
Tin pest, 448 Verification programme, 420
Tin plague, 448 Verification testing, 419
Tin whisker growths, 472 Vespal valve seat, 312
Tin whiskers, 490 Vespel, 28, 43, 229, 307
Tin–lead coating procedure, 150 Vibrations caused by thermal distortions, 322
Index 667

Video camera electronics, 541 Welding parameters, 118


Visual criteria, 406 Welding rods, 126
Visual inspections, 421 Weld in nickel alloy pressurized housing., 118
VITON B, 540 Weld nugget, 330, 332
Void formation, 337 Weld penetration, 132
Voids and blow-holes in solder fillets, 410 Weld porosity, 127
Volatile organic compounds, 109 Weld profiles for tube welds, 119
Volatile oxides, 534 Weld sputter particles, 68
VPPA welding, 217 Weld strike, 196
Vulcain engine, 33, 318 Wettability of solder, 412
Vulcain-2 engine, 34 Whisker bridging, 499
Whisker growths, 461
Whisker nucleation and growth, 499
W Whiskers
Warp or twist, 423 aluminium, 468
Waspaloy, 534 C-ring experiment, 482, 485
Water tank, 326 metal oxide, 466
waveguide–flange assembly, 407 mitigation, 498
Waveguides, 176 molybdenum, 462
Waveguide switch, 124 precautions, 491
Waveguide-to-Flange Joints, 406 silver sulphide, 463
Wave soldering, 161 tin, 472–490
Wear, 25 tungsten, 464, 465
Wear of ball bearings, 296 White paints (α/ɛ less than 0.2), 267
WEEE, 107 White plague, 375
Weld bead width and the degree of permitted meander, 119 White residues, 432, 433
Weld decay, 328 Wire ropes, 63, 64
Welded battery cells, 193 Wires and cables, 62, 369
Welded cryogenic tank, 183 Wire strands, 339
Welded galvanized steel, 139 Wire-to-barrel interface, 341
welded joint, 341 Wire-wrapped joints, 338
Welded lead wire interconnections, 329 Wire wrapping, 337
Welded plate, 98 Wire-wrapping pins, 338
Welded solar arrays, 189 Workmanship, 417, 434
Welding, 329 Workmanship drawings, 339
all methods of welding, 181 Workmanship standards, 116, 119, 342
butt, 206, 332 Workmanship standards for resistance spot welds, 117
‘cold’, see cold welding Workmanship standards related to Area Grid Arrays, 122
diffusion, 105 Worn out cathode pellet, 296
Diffusion, 105
EB, see electron beam welding
electromagnetic emission, 196 X
explosive, 186 X-radiation, 185
friction, see friction stir and stud welding X-ray diffraction, 94
laser, 52, 186 X-ray inspection, 436
manual, 181 X-ray laminography, 434
pulsed laser, 186 X-ray radiography, 86
resistance pressure, 330 X-rays, 83, 185
resistance spot, 116, 329
thermoplastics, 188
Welding and joining in a space environment, 49 Z
Welding in space, 52, 53 Zinc, 24, 272
Welding methods and controls, 181 Zinc diffusion, 359, 387
Welding of aluminium–lithium alloys, 187 Zinc emissions, 405
Welding of apogee boost motors, 123 zinc oxide, 359
Welding of commercially pure titanium, 125 Zinc-plated-steel support structure, 108
Welding of thermoplastics, 188

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