1. (i) Though Silicon carbide is a wide band gap material, Silicon carbide Schottky diodes are becoming popular over Silicon diodes. Why? (ii) Among Gallium Nitride and Silicon carbide, which do you think is more viable solution for high voltage power devices and Why? Also compare their benefits and limitations. [2½+2½] 2. Describe the switching principle of SiC Cascode device. What is the usefulness of 4th terminal in this device? Using neat waveforms comment on the switching speed and Electromagnetic interference when the device acts as (a) Normally-On device (b) Normally-Off device [2+1+2] 3. How the THD standards are governed by the stiffness of the line. Discuss in detail the operating principle of Single phase Buck-Boost Power factor correction circuit (PFC). Why second harmonics components are observed in this converter and how it could be mitigated. [1+2+2] 4. Describe the working of bridgeless boost PFC. Why input voltage and inductor current sensing is difficult in this converter? What modification is required in the topology to overcome this problem? [2+2+1] 5. Justify the transfer function of a Boost converter is of (a) First order under discontinuous conduction mode (b) Second order under continuous conduction mode Also explain their impact on the stability of the converter. [2+2+1] 6. For a three phase controlled rectifier shown in Figure below, prove that the displacement power factor is given by
where, α is the firing angle and
u is the commutation interval 7. For a 24-pulse rectifier, show that primary side line current cancels certain order of harmonics. Using THD versus load current characteristic, explain their impact on input current THD - with and without line inductance. [3+2] 8. Explain the connection and phasor diagram for ∆/Z-2 phase shifting Transformer. Prove that the turns ratio on the primary side (N1) and secondary side (N2, N3) can be expressed as