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A mechanism of stress corrosion cracking (SCC) is outlined in which anodic dissolution at film rupture
sites relieves strain hardening and reduces the fracture stress at the crack tip. Experimental evidence
is cited to suggest that relief of strain hardening occurs by interaction of subsurface dislocations with
divacancies generated by the anodic dissolution. A transgranular crack propagates by accumulation of
divacancies on prismatic planes which then separate by cleavage under plane strain conditions at the
crack tip. At appropriate metallurgical and chemical conditions, anodic dissolution and/or divacancy
migration may be enhanced at grain boundaries, leading to an intergranular failure mode. Evidence
is also available to indicate that cyclic loading relieves strain hardening, Relief of strain hardening by
combined cyclic loading and corrosion accounts for the higher incidence of corrosion fatigue cracking
(CFC) without the requirement of any critical dissolved species. Data on fatigue of stainless steel at
elevated temperature in both vacuum and air provide additional support for the proposed mechanism.
- ~....~ ! rate for both copper and iron. An example of their data is
20
shown in Figure 3, where an applied anodic current clearly
7 9 "--- . . . . . . . . ~ " "~ "f'~'" ~m
increased the creep rate, which then decreased to the origi-
nal rate when the current was stopped. In a similar way,
0[- I 1 , , , i, Smialowski and Kostanski ~zand Petit and Desjardins l~ have
0.1 0.2 0.3 0.4 0.5 06
observed that creep rate of austenitic stainless steel is in-
TIME, minutes
creased by corrosion in boiling MgC12 solutions. Anodic
Fig. 1--Anodic current transient on a straining steel electrode, liquid dissolution resulting from corrosion presumably increases
anhydrousammoniawith variousadditivesJ creep in these instances.
E strain I
P O L A R I Z A T I O N CURVES AT
f
STEADY STATE
Ecorr - ~ iiapp ~|~I
A N O D I C P O L A R I Z A T I O N CURVES
DURING PLASTIC STRAINING
POLARIZATION DIAGRAMS FOR: (A) RAPID STRAINING UNDER FREE CORROSION CONTROL,
(8) NORMAL SLOW STRAINING DURING STRESS CRACKING, (C) RAPID STRA~NTNG WITH
POTENTIAL M A I N T A I N E D P O T E N T I O S T A T I C A L L Y AT FREE CORROSION POTENTIAL E(x.,
4.30
4.25
g oo~' c u r r e n t off
o
u.i
4.20
Fig. 4 - - S c h e m a t i c mechanism of dissolution from kink and ledge sites on
a crystal surface.
)() .~
4.15 ~
,~r c u r r e n t on
qT~l l J I i 1 I l I 1 I 20~
40 50 60 70 80 90 110 120 100 130 140 150
S t r e s s at s t a r t of c y c l i c l o a d i n g 3 4 8 M N / r n 2
Time, minutes
Prior s t r a i n 0.12
Fig. 3 - - E f f e c t of anodic dissolution on creep in pure copper. 9
0 016
Figure 4, follows the treatment of Pickering and Wagner. 14 Fig. 5 - - E f f e c t of cyclic load on creep of C-Mn steel. ~
Anodic metal dissolution may be considered analogous to
metal evaporation. The most energetically favorable path is constant strain rate testing, a critical controlled strain rate is
from a kink site at position 1 until eventually the atom imposed on a tensile specimen until it fractures. The exact
reaches an adsorbed site and leaves the surface. However, value of the critical strain rate to cause SCC depends on the
any anodic overvoltage (excess driving force) will favor alloy but is usually about 10 6 s 1 for iron, aluminum, and
dissolution directly from ledge sites (e.g., position nos. 2 copper base alloys. Above the critical strain rate, film for-
to 8) which are more prevalent than kink sites. For example, mation cannot keep pace with film rupture due to the rapid
a ledge-site atom at position no. 5 can migrate directly to an mechanical strain, and the test specimen fails by ordinary
adsorbed position as shown in Figure 4. If a subsurface cup-and-cone ductile rupture. Below the critical strain rate,
atom jumps into the vacant ledge site at position no. 5, the film formation rate may be sufficiently rapid that the
a vacant lattice site is created just below the surface. film is not continuously ruptured, and ductile failure is again
A considerable supersaturation of subsurface vacancies can observed. However, in some instances, repassivation rates
be created by such a mechanism, favoring formation may be very slow and SCC still prevails even at very low
of divacancies which have sufficient mobility to affect strain rates, as in Figure 6.
mechanical behavior. Mechanisms whereby divacancies A typical example of results from slow strain rate testing
may affect mechanical properties are discussed later in this is shown in Figure 6 Is for Type 316 stainless steel exposed
paper. to hot concentrated MgCI2 solutions. In glycerine at the
same temperature, the load vs deformation plot shows a
C. Creep Due to Cyclic Load large deformation at failure with the expected ductile frac-
Evans and Parkins ~5 have recently observed that cyclic ture. Exposure to the corrosive solution during slow strain-
loading in air extends ambient temperature plastic defor- ing produces low ductility SCC.18
mation in manganese steel beyond the primary creep stage It is important to note in Figure 6 that brittle SCC is
observed under constant load. Figure 5 shows that after accompanied by a lower stress to cause any given strain.
primary creep had exhausted under constant load, the strain The yield strength is unaffected, but the subsequent strain
(creep) rates increased markedly when a cyclic load was hardening before failure is diminished by the concurrent
superimposed. Others j6 previously observed attenuation of effects of corrosion during SCC. Consider a tensile bar,
work hardening and consequent accelerated ambient tem- subjected to slow constant strain rate, as being composed
perature creep under cyclic deformation in copper, alumi- entirely of numerous contiguous axial elements of equal
num, and cadmium. These workers 16 attribute accelerated cross sectional area. Under uniform stress, each element
creep to bulk generation of vacancies which promote dis- bears the same portion of the total load. The bar specimen
location climb and consequent relief of strain hardening. is under strain control during constant strain rate testing.
That is, strain is the independent variable, and the stress
D. SCC Due to Strain changes to accommodate the imposed strain. If at some time
any element(s) deforms more rapidly with less required
In recent years continuous slow tensile strain has been load, less total load and apparent engineering stress is re-
found to have a highly accelerating influence on SCC. Iv In quired to maintain uniform strain in the bar.
0 1 2 3 4 5 6 7 8 9 10
l, Deformation (ram)
Fig. 6 - - Slow strain rate test results on Type 304 stainless steel in boiling
MgCI2 solution, t8
6 ~Oe~
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