Dokumen - Tips Spp2 Siemens TXP HW Manual

TXP
Hardware Course
TXP-HW
For Software Releases 7. 5 and Later

January, 2003
Siemens Westinghouse Power Corporation

TXP-HW Course
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Copying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment of
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Content: 1 System Architecture
Process control system
TXP
Hardware Configuration/ 2 OM 650 /Exercise 1
Maintenance Course
3 AS 620B /Exercise 2
Course Code:
4 AS 620T / Exercise 3
TXP - HW
5 SIMATIC H1 Plant Bus /Exercise 4&5
6 Ethernet Terminal Bus /Exercise 6
7 Reading I&C Drawings
8 Loading Procedures / Exercise 7

SIEMENS Westinghouse
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9 Preventative Maintenance /Exercise 8
10 Troubleshooting /Exercise 9
11 Glossary of Terms
Since the equipment explained in this manual has a variety of uses, the user and those
responsible for applying this equipment must satisfy themselves as to the acceptability of
each application and use of the equipment. Under no circumstances will Siemens
Westinghouse Power Corporation be responsible or liable for any damage, including
indirect or consequential losses resulting from the use, misuse, or application of this
equipment.
The text, illustrations, charts and examples included in this manual are intended solely to
explain the use and application of the TXP control system. Due to the many variables
associated with specific use or applications, Siemens Westinghouse Power Corporation
cannot assume responsibility or liability for actual use based upon the data provided in
this manual.
No patent liability is assumed by Siemens Westinghouse Power Corporation with

respect to the use of circuits, information, equipment, or software described in this
manual.
No part of this manual may be reproduced, stored in a retrieval system, or transmitted in

any form or by any means, including electronic, mechanical, photocopying or otherwise,
without the prior express written permission of Siemens Westinghouse Power
Corporation.
This document is the property of and contains Proprietary Information owned by

Siemens Westinghouse Power Corporation and/or its subcontractors and suppliers. It is
transmitted in confidence and trust, and the user agrees to treat this document in strict
accordance with the terms and conditions of the agreement under which it was provided.
This manual is printed in the USA and is subject to change without notice.
Siemens Westinghouse Power Corporation
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System Architecture
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System Architecture
TXP – Overview
The TXP process control system provides all I&C facilities that are necessary for
automating, handling, monitoring, and archiving processes specifically for power 1
plants.
The tasks of the TXP process control system are distributed to different
subsystems:
q OM 650
Operating and Monitoring system. This is the process control and

information system for operator-process communication and
visualization.
q AS 620
Automation System. This is the system used for process

automation.
q ES 680
Engineering System. This system is employed for configuration and

commissioning.
q SINEC H1
SIEMENS Network Communication. Communication system.
q DS 670
Diagnostic System. Optional component for detailed system

diagnostics.
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OT1 OT2 OT3 OT4 OT5

Terminal bus
DS PU1 PU2 SU ES
Plant bus
AS1 AS2 AS3 AS4
OM 650 process control and information system
The OM 650 process control and information system is the interface between the
system and the operator in the control room. This window to the process enables
the process to be centrally monitored and controlled. In addition, the system
provides all functions that are required for logging the process and for archiving
the data.
AS 620 Automation System Overview
The AS 620 subsystem performs the automation tasks of the industrial

processes. The AS 620 acquires measured values and states from the process,
performs open and closed-loop control functions, and transfers the resulting
manipulated variable values, correction values, and commands to the process.
The other subsystems employ the AS 620 subsystem as the interface to the
process. The AS 620 transfers the commands from the OM 650 operator
communication and visualization system to the process, reads information from
the process that is required by OM 650, ES 680, or the DS 670 diagnostic
system and transfers this information to the upstream operator communication
and visualization level.
According to the different requirements that result from industrial measurement
and control activities safety relevant tasks (such as boiler protection), and high-
speed control tasks (at the turbine unit for example), various variants of the AS
620 automation system are available.
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AS 620 B
Basic system for general automation tasks, system and unit protection, closed-
loop control.
Central structure or distributed arrangement using buses are both possible.
FUM B variant: In a central structure, FUM modules (function modules) are used 1
for connecting the sensors and actuators of the process.
SIM B variant: SIM modules (signal modules) enable a distributed structure to

be set up (locally, in vicinity to the process). A bus connects the SIM modules
with the central system components.
AS 620 F
Fail-safe for protection and control tasks that require TÜV approval (e.g. burner
control).
Single and fault-tolerant structures are both possible, including the variants with
the fail-safe automation processor (APF) and the fail-safe programmable
controller (AGF).
FUM F variant: Configuration with the fail-safe APF automation processor and
the related FUM F modules (fail-safe function modules).
SIM F variant: Configuration with the AGF programmable logic controller. This
variant employs the SIMATIC S5 95 F programmable logic controller with SIM F
modules.
AS 620 T
Turbine controller and other high-speed control tasks at the turbine unit.
Auxiliaries connection
Signal exchange with SIMATIC S5 units or other manufacturer’s components,
such as, Allen-Bradley PLCs for example. The SIMATIC units contain the
implementation of a complete automation task that is not configured via ES 680.
Combinations:
Combining two or more system variants is possible. The components of the
different variants must then be connected to the same component of the AP
automation processor. Any combination of the above mentioned system variants
is possible, except mixing FUM F and SIM F (AGF) components at the same
automation processor.
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ES 680 engineering system
The ES 680 engineering system is the central configuration system of TXP. ES

680 is used for configuring the AS 620 automation system, the OM 650 process
control and information system, the SINEC H1 FO bus system, and the
necessary hardware. ES 680 provides a configuration package for each target
system. ES 680 centrally administers all configuration data, which means data is
entered only once.
The configuration of the AS functions and processing functions in OM 650 are
based on control system flow charts. A control system flowchart editor in the ES
680 permits interactive entry of these control system flow charts.
The configuration principle of the ES 680 is based on consistent forward
configuration. Initial configuration and modifications are exclusively performed
through the configuration system with subsequent automatic code generation.
This guarantees real time documentation of the system hardware and all AS,
OM, and SINEC functions, and permits modifications to be centrally controlled.
SINEC H1 bus system
The network structure of the SINEC H1 bus system enables communication

between the individual sub-systems of TXP. The bus system complies with
international standards and consequently offers the prerequisites of open
communication.
DS 670 diagnostic system
The optional DS 670 diagnostic system is the tool that is used for monitoring and
detecting malfunctions in the I&C components of TXP.
In the event of a malfunction, the DS 670 swiftly points the user to the source of
the fault and informs about the cause and possible elimination of the fault.
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OM 650 & Exercise 1
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OM 650
The OM 650 sub-system is made up of all or some combination thereof of the
following components:
PU Processing Unit
SU Server Unit
OT Operating Terminal
CU Compact Unit
2
All of these components are made up of Pentium II computers running SCO
UNIX and for the OT and CU components a graphics server is needed if more
than 1 monitor is desired. Otherwise, an integrated graphics card for connecting
a single monitor can be used instead of the graphics server. The following
connectable devices are also available:
MOD Magnetic Optical Disk

DAT Digital Audio Tape
MMT MultiMedia-Terminal
Monitor
Large-area display
Printer
Keyboard
Mouse
UNIX Computer
The UNIX computer accommodates the main memory, disk drives and modules
required for operating the particular OM component, and is optionally equipped
with an installed MOD (for SU and CU only) for the external storage of archived
data. An external MOD can also be connected, which allows reading in older
archived data from MOD storage media.
To bridge brief supply voltage failures and properly organize automatic shutdown
in the event of long-term supply voltage failure, the UNIX computer is supplied
with voltage via a UPS and informed of the mains voltage failure via a serial port.
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The following devices can be connected to the UNIX computer:
• Up to two printers or one printer and one plotter

• Up to two audible alarms and keys for acknowledgment of the audible alarm
With an integrated graphics card the following devices can be connected to the
UNIX computer:
• 1 monitor
• 1 keyboard
• 1 mouse
For servicing purposes the following devices can be connected (does not apply
to variants with an integrated graphics card):
• 1 monitor and
• 1 keyboard
An external DAT streamer can be connected for loading and saving the system
software.
Figure 1 shows the rear panel of the UNIX computer with a listing of the
individual connection ports. Figure 2 lists component specific interface
assignments of the UNIX computer.
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Fig.1: Generally applicable interface assignment of the UNIX computer
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Component specific slot assignment
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Explanations
Explanations of the component texts:
1k Single-channel option with graphics

4k 4-channel option
nMT Single- to 4-channel option with graphics server
red Redundant option
ME OM/ME system
Explanation of the slot assignment nomenclature:
2940 Adaptec 2940 U2W, SCSI--3--Controller Ultrawide

U2W
3COM Etherlink XL PCI 3C900--Combo (3COM), LAN card
Combo
(BNC) Connector to the mMT graphics server, Licensing of the ES
functionality e.g. for CU/ME and CU—ES Redundancy coupling
for CU (substitute for terminal bus); Substitute for plant/ terminal
bus if not present
CP 1413 CP 1413 for connection to the plant bus
No. 1
CP 1413 Second CP 1413 for connection to the plant bus
No 2
Radio clock radio clock module (Hopf)
Audible alarm 1 1st signal module
Audible alarm 2 2nd signal module
Intel Intel-Ether Express-Pro/10+ Combo PCI (Intel 10 MB), LAN
card
Combo for connection to the terminal bus
(AUI)
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N-AT NAT module for connection to the CS275 bus

Chase Research For connecting the capacitive 21” touchscreen monitors Ilyama
PCI--Fast 4 S10M/MT via Micro Touch Controller SMT3V, (stock no. 14--
701),
(RJ45) RS 232 port with 9--pin connection and Siemens label. To be
used with release version 7 or higher.
(1) If the plug--in slot in all PU/OT--OMME systems of a plant is
used by audible alarm 1, the radio clock must be inserted into
the SU--OM/ME slot. 2
MultiMedia-Terminal
The MULTIMEDIA-TERMINAL MMT-X was designed to control large, modular

OVERVIEW display walls. Its multi-screen capability allows you to control
displays of nearly any size and layout. The display area is one logically
connected display. It is able to digitally control monitors based on modern
technologies such as Single LCD, DLP™ and Poly-Silicon LCD with the highest
display quality. High contrast and absolute immunity to electromagnetic
interference distinguishes this type of control. CRT monitors and projectors can
also be controlled by the MULTIMEDIA-TERMINAL MMT-X using the optional
analog output.
The hardware and software of the MULTIMEDIA-TERMINAL MMT-X is based on
world-wide accepted standards, so that the investment is protected. The
MULTIMEDIA-TERMINAL MMT-X offers the following exceptional capabilities:
• High performance graphics output using the most modern processor and
chip technologies
• Supports current LAN and WAN interfaces
• Graphic and video outputs in high color quality
• Video in a window, up and down scaleable
• Unlimited, overlapping and freely moveable video and graphics windows
The graphics server is used for multi--channel mode as an extension of the OT

and CU, PU/ OT. It is suitable for the connection of 1 to 4 monitors, 1 to 4 large-
area display units or a 2x2 display wall.
The mMT--X is available with a video card for the connection of a display wall or
large--area display units as an option. The video input card allows you to connect
a video source such as a video recorder, camera, etc. to the graphics server. It
supports the recording standards S--Video (S--VHS, Y/ C) and Composite (VHS,
FBAS, CVBS, Y). The video card has three 4--pin female Mini--DIN connectors
for the connection of up to three S--Video or 6 Composite video sources.
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Fig.3: Interface assignment of the mMT-X for large-area display units or a display wall
Fig.4: Monitor port assignment of the mMT-X
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Programming Device PG 740PII
Fig.5: Interface assignment of the PG 740PII
The PG740PII programmer is the hardware basis for the CT675 hand-held
operating device.
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The Cable Connectors Used
The following cables are used for the OM components:
• Data cable (for connecting the graphics server to the UNIX computer)
• Monitor cable for the graphics server
• Monitor cable for the UNIX computer (for servicing purposes only)
• Monitor cable for the UNIX computer if a graphics card is used, single--
channel operation
• AUI connection cable (3Com (network card) or CP1413)
• NAT cable
• Antenna cable (coax) for the radio clock card
• Parallel printer cable
• Serial printer cable
• Mouse and keyboard cable extension for the graphics server
• UPS data cable (black)
• UPS power cable
Connection between the Mouse and Keyboard and the UNIX Computer
(Single Channel)
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Monitor Connection with a Single-Channel Graphics Card
Connection between Printer and the Parallel Port of the PC
Connection between Printer and the Serial Port of the PC
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Connection between the Mouse and Keyboard and the mMT-X
Connection of 4 Monitors to a 4-channel mMT-X
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Connection between the PC and the Terminal Bus
Connection between the PC and the Plant Bus
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Connection between the Graphics Server and the PC using a thin Ethernet
(coaxial) cable.
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Connection of the External DAT-Streamer to the PC
Caution
When connecting the external DAT-Streamer or the external MO drive to the PC
or WS both devices must be switched off. Otherwise the devices might be
damaged and their functionality would no longer be ensured.
Note: The SCSI address of the DAT streamer needs to be set to SCSI id 2
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Automatic Restart after Power Outage

In case of a mains voltage failure, the PC and the graphics server, if applicable,
are powered by the connected UPS. If the supply voltage does not return within
2 minutes the UPS will initiate a PC shutdown (approx. 3 minutes). During the
shutdown the mouse and keyboard are inoperable.
There are 2 status conditions possible during shutdown:

• If the voltage returns during shutdown, the PC automatically starts up after
completion of the shutdown.
• If the voltage does not return during shutdown the component is switched off
by the UPS, i.e. the UPS battery is no longer discharged.
After return of the voltage, the OM component (PC and graphics server)
automatically restarts. After the completion of the restart, the basic startup
display appears on each screen of the graphics server. The mouse and
keyboard are again inoperable.
Primergy 170
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Sinec Pro M7
Primergy 351/752
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TXP-HW
Test/Exercise 1
G What are the 4 sub-systems of TXP?
G What is the name of the communications system that ties them together?
G How many variants of the AS 620 system exist, and what are their different
uses?
G What I/O modules are used for a central configuration of AS 620?
G What I/O modules are used for a distributed configuration of AS 620?
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G What are the 3 different types of OM 650 components?
G What one component combines all OM 650 components?
G What operating system runs on OM 650 computers?
G Look at the back of your OM 650 computer and identify the following
components:
G Keyboard and Mouse ports

G SCSI bus connector
G Video card
G Graphics server communications card (if applicable)
G Plant bus card (CP 1413)
G What device(s) is (are) connected to the SCSI bus connector?
G What is the MMT used for?
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G What kind of cable is used to connect the MultiMedia-Terminal to the UNIX

computer?
2
G What kind of cable(s) is (are) used to connect the UNIX computer to the Plant
Bus?
G What is the primary use of the DAT streamer?
G What is the MOD drive used for?
G In a 4-channel MultiMedia-Terminal configuration, which CRT port is the left-

most monitor connected to?
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AS 620B & Exercise 2
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AS 620B Automation System
Automation Processor (AP)
The AP is the central component of the AS 620 B and AS 620 F automation

systems. It is based on the SIMATIC S5 CPU 948R. All subordinate AS 620
components are linked with the plant bus (and thus with the OM 650 system) via
the AP.
System and unit protection functions are processed in the AP. In addition to the
base operations, a large spectrum of power plant related open and closed-loop
control blocks are available for this purpose. The user employs these blocks on
the graphical ES 680 tool to create the user program that executes in the AP. 3
The AS 620 T employs a special automation processor, the APT (SIMADYN D),
to solve high-speed control tasks at the turbine unit. The APT communicates with
the TXP systems on the OM 650 level via an AP.
The AP also plays an important role in the connection of auxiliaries
(programmable logic controllers). These PLC systems also always communicate
via an AP with the OM 650 level.
The hardware of the automation processor is based on a SIMATIC S5 155U
central controller (CC). Figure 1 shows the basic structure and a possible slot
allocation of the central unit used as an AP. The slot numbers appear on the
annotation strip of the central unit rack. The actual installation of interface
modules and communications processors in the individual slots depends on the
plant-related structure and on the variant of the automation system.
Figure 1: Standard slot assignment of the AP
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003 011 019 027 035 043 051 059 067 075 083 091 099 107 115 123 131 139 147 155 163
Power supply
CPU 948R
IM304/324R
IM304 * * * *
IM611/651
IM308
CP1430
CP5431
CP530
CP581
DEDA
* IM304 is only allowed in this slot as EG connection to the IM314R
Figure 1.1: Possible module installations when used as an AP
CPU 948R
The CPU 948R and 948RL can be used in S5-135U/155H central controllers and
is available in the following versions:
CPU version Internal user memory (RAM)

CPU 948RL 128 Kbyte
CPU 948R-1 640 Kbyte
CPU 948R-2 1664 Kbyte
All three versions of the CPU 948 are programmed in STEP 5 (LAD, CSF, STL,
SCL) and process all STEP 5 operations at a very high speed. They are also
equipped with a high-speed floating-point arithmetic facility.
The following program processing levels are possible:
Cyclic
Time-controlled (9 different time grids, clock-controlled, delayed interrupt)
Interrupt-driven over the S5 bus
’Soft STOP’
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The CPU 948’s electronics, including RAM, are on two PCBs (Printed Circuit
Boards), have Eurocard format, and are bolted to one another. They must never
be separated.
The module’s front plate has a width of 2 2/3 standard slots, or 40 mm and takes
up two slots in the central controller rack. Figure 2 shows the front panel layout of
the CPU 948:
Fig. 2: Front panel indicators of CPU 948
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Principle of Operation
In a redundant system, identical user programs run in both sub-units. The sub-
units are ”event-synchronized”; that is, only those events that could produce
different internal ”states” in the two controllers cause them to be synchronized.
The internal ”state” is determined by the states of the memory areas used, such
as process image, flags, counters, timers, and data blocks.
On startup or restart, the S5-155H assumes one of the operating states shown
below:
Solo mode:
The master sub-unit alone scans the user program and controls the
process; the standby sub-unit is inactive.
Activating the standby:

The master sub-unit passes the current data to the standby.
Error search mode:

The master sub-unit scans the user program and controls the process; the
standby sub-unit executes the self-test.
Redundant mode:
The master sub-unit controls the process; the standby sub-unit runs in
parallel (”updated” mode), and is ready to take over at any time.
After both sub-units have been started up, they are synchronized to ensure a
bump-less transfer in the event of a fault. The synchronization procedure used in
the S5-155H is known as ”event-driven synchronization”, which means that the
sub-units are synchronized whenever an event occurs which could result in the
two sub-units having different internal states; for example different process
images, flags, timers or communications data. Synchronization is done at so-
called “synchronization points” which are at the end of each ground cycle.
Each sub-unit reads it’s one-sided inputs (if applicable). The ’switched’ inputs are
read only by the master, who then updates the input image for both sub-units and
generates a unified input image.
At the end of each ground cycle, the entire process output image (PIQ) in both
CPU 948Rs is immediately compared by the IM 324R card. The PIQ (switched
PIQ by the master, one-sided PIQ by each processor) is output. The self-test is
then run.
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Following the self-test, the process image input (PII) is read in again. The PII is
exchanged and unified and the ground cycle is re-called.
In each sub-unit, a check is made at every synchronization point to make sure

the other sub-unit is functioning. Depending on the result of the check, a switch
over from the standby to the master controller is performed and the message
”Standby failure” output.
The synchronization procedure is timed at each synchronization point by means

of a watchdog timer set to 30 ms. A check is also made at each synchronization
point to make sure that both sub-units are executing the same statement
(comparison of OP codes). If they are not, the standby controller stops and a 3
”synchronization error” is reported.
Switchover from standby to master takes place in the following instances:
1. Failure of the master CC (BASP, NAU or STOP switch)
2. Initial error search of both sub-unit CPUs unsuccessful (see ”Error search
mode”)
3. First failure of a master controller’s IM 314R when the standby controller has
access to a larger number of IM 314R interface modules than the master
4. First failure of a master controller’s I/O bus (i.e. a wire break) or failure of an
IM 304 when the standby controller has access to a larger number of IM 314R
interface modules than the master
5. First failure of a switched I/O module
In cases 3 to 5 the new standby CPU does not stop, but continues functioning as
a standby controller.
The functional sequence of a switchover from standby to master is as follows:
The standby controller checks the operational status of the master controller at
each synchronization point. Failure of a master is detected at the hardware level
by evaluating the S5 bus signals BASP and NAU in the IM 324R parallel
interface module. The standby CPU’s operating system detects the failure of the
master controller at the next synchronization point, and branches to a routine
which executes the following functions:
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· Switches over the I/O buses of all IM 314R modules

· Switches all two-channel I/Os to single-channel operation
· Switches the operating system to Solo mode; that is, no sub-unit
synchronization
With regards to the I/Os allocated to the failed sub-unit, the following occurs:
· PIQ and PII are set to zero

· No ’ADF’ error is reported when this PIQ/PII is accessed
· Timeout is reported in the event of direct access to one of these I/Os
Self-Test Strategy
A redundant system’s highest priority is fault detection and fault localization. This
is required in order to control the fault. The S5-155H’s self-test routines run in
both CPUs. They detect and localize hardware failures in a minimal amount of
time. To localize a fault, it is necessary to only find out which modules are faulty
and to replace them.
Which self-test routines execute depends on the operating status of the system:
· Self-test in the Restart routine
The entire self-test is run when a central controller is restarted. If a fault is

detected at this stage, the CPU stops. Because the self-test takes longer
than one minute, it is skipped on a warm restart of the master controller.
During execution of the self-test in the Restart routine, the RUN and
STOP LEDs on the front plate show a steady light. A complete self-test is
run in all Restart modes.
· Self-test in cyclic mode
Each time the ground cycle is processed (once per cycle), part of the self-
test is executed in small slices (2 ms test slices). The self-test therefore
runs, transparent of the other software, or in the background, until a
hardware failure is detected.
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Tested System Components
Important system components such as CPU, memory, I/Os and communications

links are continually tested and monitored. Following is a brief description of each
of these tests:
· CPU test
Includes testing of STEP 5 operations, timers, CMOS clock, interrupt

mask and the scan time monitor
· Firmware/RAM test 3
Comparison of the RAM in both sub-units and a checksum test of the OB,
SB, PB, FB, FX blocks and of the constants DB/DX. Also a RAM test for
all variable DB/DX
· I/O bus test with IM 314R
Tests for short-circuits and breaks in the 721 I/O bus cable to the IM 314R
· I/O bus test for page addressing
Page addressing is tested in cyclic mode once in every complete test run
and also once on each restart. The test detects the following faults:
· A CP/IP reacts to (acknowledges) not only its own interface
number, but also to the other 255 interface numbers
· An acknowledgement is issued by an unassigned interface
number
· IM 304R/IM 324R parallel interface test
The parallel interface’s dual-port RAM is tested on both sub-units A and

B to locate any short-circuits or cable/wire breaks
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Self-Test in Error Search Mode
When an error is detected which, because it was found during a RAM

comparison test, could not be allocated to a specific sub-unit, the standby
controller enters the Error Search mode. This mode is also entered when a
discrepancy is found when comparing the output images of the two sub-units. In
Error Search mode, the self-test is not executed in slices, but rather in its
entirety, which takes approximately 10 to 30 seconds. Following is an example to
illustrate the functional sequence in Error Search Mode:
At the end of each ground cycle the two sub-units exchange and compare the
entire process output image (PIQ). If a discrepancy is found during this cyclic
PIQ comparison test, the memory locations in the PIQ are tested for ”stuck at 0”
and ”stuck at 1” errors. If such an error is found, only the malfunctioning sub-unit
stops.
If the error cannot be localized, the 155H responds by placing the standby
controller into the ”Error Search” mode and putting master controller into ”Solo”
mode.
If the self-test locates a fault in the standby controller, the standby stops.
Otherwise, the standby controller is activated and a standby-master switchover
initiated. The PLC now runs in “Redundant” mode. Should another comparison
error be found, the new standby controller enters the ”Error Search” mode while
the new master continues in ”Solo” mode.
If the self-test locates an error in the new standby controller, which is now in
Error Search mode, the standby controller stops and reports an error. If the self-
test cannot locate an error in this sub-unit either, the sub-unit stops with a
”Non-locatable error” if the second comparison error occurred within the same
test cycle.
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Mode Selector Switch
The mode selector switch has two positions:
RUN
When the mode selector switch is set to ’RUN’ and the green LED is on, the CPU
is processing the user program.
STOP
The CPU goes to ’soft STOP’ when the user switches from
’RUN’ to ’STOP’. The red ”STOP” LED goes on.
3
Reset Switch
The restart functions ”Overall reset”, ”Cold restart” and ”Cold restart with
memory” can be initiated via the mode selector switch and the reset switch:
Function Switch position Description

OVERALL RESET Down An overall reset reinitializes
the internal RAM (meaning
any data currently in RAM are
erased and the contents of the
memory card, if any, are
copied to internal RAM). A
complete self-test is then
executed.
RESET (Cold restart) Up A cold restart, or RESET,
resets all flags, timers,
counters and the process
image. OB 20 is then called,
and user program processing
begins again.
Cold restart with memory Middle User program processing
begins again, but all flags,
timers, counters and the
process image retain their
current states.
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Status LEDs
The ”STOP” LED signals a ’soft STOP’, the ”SYS FAULT” LED a ’hard
STOP’. In ’soft STOP’ mode, the CPU can cyclically scan the user program but
the digital outputs remain disabled. In ’hard STOP’ mode, no program can run;
the CPU is at a ’standstill’. This state can only be exited by cycling the power.
Overview of Status LEDs
LED
RUN STOP SYS- Mode
FAULT
RUN or Restart mode
On Off Off The CPU is in RUN mode and is master
Flashes Off Off The CPU is in RUN mode and is the standby
On Flashes Off The CPU is master; the parallel link has failed
On On On Appears briefly when the controller is switched on
On On Off The CPU executes the self-test on startup
Off Off Off The CPU is in the RESTART mode or PROGRAM TEST
‘Soft STOP’ mode
Off On Off The CPU is in ‘soft stop’ mode.
After cycling the power on when the mode selector switch is at STOP and no
errors occurred during initialization.
A restart is possible.
Off Flashes Off The CPU is in ‘soft stop’ mode.
at high An Overall reset was requested via mode selector switch/reset switch or by the
fre- operating system. A restart is possible only after performing an overall reset or
quency after eliminating the problem and then performing an overall reset.
Off Flashes Off The CPU is in ‘soft stop’ mode.
at low · An error was detected during cyclic program processing. The CPU is at
fre- STOP because no appropriate error handling routine was programmed.
quency When the mode selector switch is moved from RUN to STOP, the LED will
once again show a steady light as long as the error does not re-occur.
· When error conditions exist, for example, selection of an illegal Restart
mode.
· When a STOP operation was encountered in the user program.
· In the event of a PROGRAM TEST programmer function for this CPU.
· Some programming errors and controller faults also set the ‘ADF’, ‘QVZ’,
or ‘ZYK’ LEDs.
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‘Hard STOP’ mode
Off Off On The CPU is in ‘hard STOP’ mode.

· When error free execution of the system program is no longer possible, the
CPU enters the ‘hard STOP’ mode
· Reasons for a ‘hard STOP’:
· Timeout (QVZ) or parity error (PARE) in system RAM
· ISTACK overflow
· STEP 5 operation “STW”
· A ‘hard STOP’ can only be exited by cycling the power on the controller.
‘Activate standby’ mode
Flashes Flashes Off The CPU is the standby, and the mode is ‘Activate standby’.
3
Overview of Error LEDs
LED Description
QVZ A module addressed by the program no longer acknowledges, although/because:

(timeout) · It either acknowledged in the process image on a CPU cold restart and was entered as
available
· Or was entered in the address list and was recognized as being available on a cold restart
· Or was addressed in direct access mode
· Or no access is possible to the data handling blocks on the module.
Possible causes:
· Module failure; failure of the expansion unit
· Module was removed during operation, while the CPU was at STOP or when controller was
switched off and there was no subsequent cold restart
· Failure of the enable voltage L+
A timeout occurred while user memory was being accessed
ADF The user program referenced an address in the process image which was not entered in DX1
On
ZYK The watchdog timer used for scan time monitoring responded and cyclic program processing was
On interrupted
BASP Command output is disabled; the digital outputs are set directly to the safe state (0)
On
INIT This LED briefly shows a steady light during the initialization procedure which follows POWER ON,
On and during operation in the event of a system fault
Interface Error LEDs SI1 and SI2
LED SI2 is always off unless there is a CPU fault. LED SI1 will be ON if no
communication is possible which is an internal error. It will be OFF if both
interfaces are initialized and ready.
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Communications Processor (CP 1430)
The CP 1430 communications processor is used to connect the AP to the Plant

Bus and will be discussed in detail in the chapter on the SIMATIC H1 Plant Bus.
Interface Module IM 324R
The IM 324R interface module is used in conjunction with the IM 304 interface
module in the accompanying AP rack for redundancy. The figure below illustrates
how the redundancy link and the expansion unit are interconnected:
Fig. 3: Redundant AP > AP connection
The IM 324R module is inserted in the main central controller rack and
determines which controller is the master. See figure 1.1 above for slot
assignments for the IM 324R.
The IM 304 > IM 314R connections from master to expansion and standby to
expansion are used to access the I/O from the field. The IM308 modules connect
to the ET200 stations to establish this link to the field I/O.
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EG - A EG - B
Figure 4 shows the basic structure and a possible slot allocation of the expansion
rack:
Fig. 4: EG 185 U expansion unit slot assignments
Fig. 4.1: Possible module installations when used as EG
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EU902 FUM Rack
The function modules (FUM) of the individual control level are installed in the
EU902 racks. Each rack can accommodate upto 19 function modules and upto 2
IM614 interface modules. To ensure high availability, each function module has
two bus interfaces that are independent of each other. Each bus interface is
connected with a separate IM614 interface module via a separate rack bus.
The EU902 rack with the function modules connects to the AP via the IM304 and
IM 614 interface modules. One IM614 module of the rack connects to AP (A),
and the second to AP(B). This produces a continuous redundant bus connection
from the AP down to the function modules.
While the IM614 interface module in slot 155 is connected with AP(A), the IM614
in slot 163 is connected with AP(B).
Upto 4 IM614 interface modules in series connection may be combined to form a

bus chain that is connected to the AP via an IM304 module. The maximum
distance between the AP and the last IM614 of the bus chain is 100 meters.
Typical EU902 Rack configuration:
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Below is a typical connection layout for the EU902 rack to the Basic Automation
Processor.
IM614 Interface module
The IM614 interface module is used in the As620 B automation processor for
connecting the function modules (FUM’s) to the AP automation processor. The
interface module is installed in each EU902 rack, and handles the entire data
traffic with the function modules in the rack
Two IM614 interface modules may be installed in each EU902 rack. This
provides a consistant redundancy of the I/O bus, from the automation processor
down to the function modules.
The major functions of the IM614 and IM304 interface modules are coupling the
higher order level (AP) with the FUM racks (EU902).
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Figure below shows front view of IM614 Interface module
The Function Module (FUM) of the Individual Control Level
The function module (FUM) of the individual control level form the interface
between the process control system and the process. Functionality and
connections of the FUM modules have been designed such that they satisfy the
specific requirements of the power plant technology. The major tasks of the
function modules include:
· Acquiring, conditioning, processing, distributing and monitoring signals and

sensor supply
· Processing stand-alone automation tasks for individual closed- and open
loop control systems.
· Time stamp of 1ms resolution
· Monitoring function for simple and precise diagnosis in the event of failure.
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Each module has its own microprocessor, a module related power supply, and
two independent bus interfaces that connect to the redundant cabinet bus
system. The system automatically selects the second bus system when the first
one fails. The defective module may then be located and replaced during
operation.
The figure below shows the basic structure of such a FUM module:
The connections to the analog and binary sensors on field level, and to the power
section of switching and actuating elements (switchgear), are established via the
function related part.
If necessary, manual intervention from conventional control locations (CCR) may

be performed via modules of the individual control level. In this case the
information is output via conventional indicators and signaling fields.
Besides various monitoring and diagnosis functions, the individual control levels
also acquires signal transitions of binary and/or the change of analog signal by
selectable value. The system adds a time stamp of 1ms resolution, and handles
these events as data with time (DMZ).
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FUM 210
The FUM 210 may be used for sensor conditioning of binary signals or drive
control functions depending upon the configuration chosen. Below is a summary
of the functions of the FUM 210 module.
The FUM 210 is inserted into the EU902 rack and its inputs are wire rapped onto
the back of the module
Sensor conditioning for binary signals with FUM 210
· Acquiring of 28 binary signals
· Output of 24v DC / 120mA for sensor supply
· Sensor monitoring for open circuit and short circuit to ground
· Signal simulation with software
· Redundant design is possible
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Drive control with FUM 210
· Control of upto 8 individual drives, 5 motors/solenoid valves/switchgear, 4

servo drives, 3 reversing drives.
The module has the following functions, depending on the application,
· Acquiring the drive check-back messages (travel limit and torque limit
switches).
· Interpreting switchgear messages (undervoltage, switchgear fault, and motor

temp high).
· Monitoring C&I functions (Module fault, run time faults).
· Simulation via software
· Redundant design possible
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The illustration below shows the front view of a FUM 210 module
The card has fuse access, identification label and an error indication lamp on the
front of the card. All the inputs are fed to the back of the module from wire rapped
terminals.
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Connecting the ET 200M stations
The ET 200M stations connect to the AP via the IM 308-C and IM 153 interface
modules. A SINEC L2-DP bus chain with up to thirty two (32) IM 153 (ET 200M
stations) modules may be connected to each IM 308 (bus master) in the central
unit (CU) or expansion unit (EU). Up to ten IM 308 modules (10 chains) may be
connected to each AP. The total number of ET 200M stations is limited to 32.
The following maximum distances to the AP may not be exceeded in a
distributed structure.
3
Maximum length of a chain (L2-DP bus length):
- With copper conductor at a baud rate of 1,500 bits/s 200 meters

- With glass optical leads 1,400 meters
There are 3 types of connections possible with ET200 stations:
Directly, un-switched
Here, the IM 308 interface modules are installed in the AP’s central
controller. If the AP fails, all chains directly connected to this AP including
the ET 200M stations concerned and the SIM modules installed there are
no longer available.
Switched
Here, the IM 308 modules are installed in the expansion unit of the
redundant AP. The chains are connected with the master AP. If the master
AP fails, the standby AP immediately takes over mastership, and the ET
200M chains communicate with the new master AP.
Redundant (beginning from release 6)
The IM 308-C interface modules are present once on each bus chain and
AP subsystem. The bus medium is redundant. The ET 200M stations have
2 bus medium connections. Unlike the switched option, the availability of
the redundant option will not be impaired if an IM 308-C or a bus medium
fails. A mixture of redundant and non-redundant bus chains in one AP is
possible.
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IM 308 > IM 153 Interface Modules
The IM 308 C interface modules are used as the bus master on the PROFIBUS
(a.k.a. L2 bus) to establish a link to the IM 153 modules of the ET 200M family of
I/O modules. The figure below illustrates a typical configuration followed by a
table of connecting cables:
See item number of connecting cable in Table 5.1
Fig. 5: Typical ET 200M configuration
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Item Connection IM <--> or bus Order No. Application/Comment

No. component
1 Connecting cable 6ES5 721--0xxx0 *) Redundancy link
IM 324R <----> IM 304 AP (A) <--> AP (B)
2 Connecting cable 6ES5 721--0xxx0 *) Link ZG <--> EG with
IM 304 <----> IM 314R switched I/O
3 SINEC L2--DP two--wire cable 6XV1 830--0AH10 Cable without connectors
IM 308--B/C <----> ET 200M/U/B 6ES7972--0BA20-- Bus connector
0XA0
4 Connecting cable 6DS5 712--8yy00 ET 200M tiers one below the
IM 316 <----> IM 316 other in a multi--tier structure
5 Glass optical lead 6XV1 820--5Bxxx *) Link of Optical Link Modules
FIBER OPTIC CABLE standard cable, (OLM) for the connection of 3
can be subdivided, prefabricated with 4 ET 200M stations
BFOC connectors
6 CUPOFLEX twin cable PVC UL 5DX8031--8AAxx *) Link of Optical Link Modules
3.6 mm BFOC (OLM) for the connection of
ET 200M stations, maximum
length 65 m
7 OLM/S4 for PROFIBUS 6GK1 502--4AB10 Optical Link Modules (OLM)
Optical Link Module with glass optical for the connection of ET
lead, for standard length with signaling 200M via glass optical leads
contact, 4 channel version
8 OLM/P4 for PROFIBUS 6GK1 502--4AA10 Optical Link Modules (OLM)
Optical Link Module with plastic optical for the connection of ET
lead, 4 channel version with signaling 200M via plastic optical
contact including 4 BFOC connectors leads
Fig. 5.1: Connecting cables
Bus terminating connector for SINEC L2-DP
The L2 bus connector is used as a bus terminating connector. The bus

connectors at the IM 308 card and the last ET 200M station must have the
terminating resistor installed in order for the bus to function properly.
Basic Structure of the ET 200M Stations
The ET 200M distributed I/O device is a DP slave within the distributed I/O
system ET 200. For TXP, it consists of the following components:
q Slave interface module IM 153
q Up to 8 Signal modules (SIM)
q Up to 124 bytes for outputs and 124 bytes for inputs
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Slave interface modules and signal modules are installed on a profile rail. If
active bus modules are used, the modules can be plugged in and removed
during online operation.
The IM 153 slave interface module connects the SIM modules to the PROFIBUS
and the automation processor. Up to 32 ET 200M stations can be connected to a
bus chain. If 2 IM 153 slave interface modules are used a redundant connection
to the Profibus is possible.
Fig. 6: ET 200M station
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The IM 153 module has a back plane connector for connecting active head
station bus modules (Figure 7), which hold the SIM I/O modules.
Fig. 7: Installing a SIM module on a bus module of an ET 200M station
Each ET 200M station can be equipped with SIM modules up to an addressing

volume of 124 input bytes and 124 output bytes.
Each chain permits up to thirty two ET 200M stations to be connected with two
wire cables via SINEC L2--DP in a daisy-chain fashion (see Fig. 8).
Fig. 8: Daisy-chain connection of ET 200M stations
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The Signal Modules (SIM)
The following modules from the SIMATIC S7 ET 200M distributed I/O system are
used in AS 620 B:
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Concise Description of the Signal Modules in ET200M
Input Modules for Binary Signals SIM 321

The following modules can be used:
To read in the binary signals, the function block FB70 (BINAUF) or FB72
(BINEIN) is called up in the AP for each channel. If form C contacts are
connected, the FB70 (BINAUF) is required in the AP for each form C contact
system. Each form C contact system occupies two input channels. The NO
contact is on the odd channel (e.g. K1, K3, ...). The channel no. of the form C
contact system is specified by the channel--no. of the odd channel (e.g. K1, K3,
...).
The modules can also be used for the DCM function blocks FB163
(MOTVENTR), FB164 (STELANTR) and FB165 (REGELANR).
No provisions have been made for the installation of AC 120V modules in TXP
cabinets.
The following connection diagrams of the digital input modules always refer to
individual contacts. The following figure shows the type of form C contact
circuitry.
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SIM 321-1BH01 Module, DI 16 * DC 24 V
Order No.: 6ES7 321 - 1BH01-0AA0
Features:
· 16 inputs, electrically isolated in groups of 8
· Rated input voltage DC 24 V
· Suited for switches and 2-/3-/4-wire proximity switches (BEROs)
Connections of the module SIM 321--1BH01, DI 16 * DC 24 V
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SIM 321-7BH00 Module, DI 16 * DC 24 V with Sensor Power Supply /

Diagnosis
Order No. 6ES7 321 - 7BH00--0AB0
Features:
· Suited for switches and 2-/3-/4-wire proximity switches (BEROs)
· 2 short--circuit proof sensor power supplies, each supplying 8 channels
· External redundant feeding of the sensor power supply is optional
· Status indicators “Sensor voltage (Vs) O.K:”
· Common fault indicator (SF)
· Settable input delays 0,1 / 0, 5 / 3 / 15 / 20 ms; presetting: 3ms
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Connections of the module SIM 321-7BH00, DI 16* DC24V with sensor power supply/diagnostics
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SIM 321-1EH01 Module, DI 16 * AC 120 V
Order No.: 6ES7 321 - 1EH01-0AA0
Features:
· 16 Inputs, electrically isolated in groups of 4
· Rated input voltage AC 120 V
· Suited for switches and 2-/3-/4-wire proximity switches
Connections of the module SIM 321--1EH01, DI 16 * AC 120 V
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SIM 321-1BL00 Module, DI 32 * DC 24 V
Order No.: 6ES7 321 - 1BL00-0AA0
Features:
· Suited for switches and 2- /3- /4-wire proximity switches (BEROs) 3
Connections of the module SIM 321-1BL00, DI 32 * DC 24 V
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Output Module for Binary Signals SIM 322
The following modules can be used:
The associated function blocks in the AP are: FB71 ( BINAUS ) per channel or
binary outputs for the FB163 (MOTVENTR) FB164 (STELANTR) and FB165
(REGELANR).
No provisions for the use of AC 230 V modules in TXP cabinets have been
made.
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SIM 322-1HF01 Module, DO 8 * Rel. AC 230 V
Order No.: 6ES7 322 - 1HF01-0AA0
Features:
· 8 outputs, electrically isolated in groups of 2
· Load voltage DC 24 V to120 V, AC 48 V to 230 V
· Suited for AC/DC solenoid valves, contactors, motor starters, low power
motors and alarm lamps 3
Connections of the module SIM 322-1HF01; DO 8 * REL. AC 230 V
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SIM 322-1BH01 Module, DO 16 * DC 24 V / 0,5 A
Order No.: 6ES7 322 - 1BH01-0AA0
Features:
· Output current 0.5 A
· Rated load voltage DC 24 V
· Suited for solenoid valves, DC contactors and alarm lamps
Connections of the SIM 322-1BH01 module
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SIM 322-1HH00 Module, DO 16 * Rel. AC 120 V
Order No.: 6ES7 322 - 1HH00-0AA0
Features:
· Load voltage DC 24 V to 120 V, AC 48 V to 120 V
· Suited for AC/DC solenoid valves, contactors, motor starters, low power
motors and alarm lamps 3
Connections of the module SIM 322-1HH00; DO 16 * Rel. AC 120 V
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SIM 322-1BL00 Module, DO 32 * DC 24 V / 0,5 A
Features:
· Output current 0,5 A
· Rated load voltage DC 24 V
· Suited for solenoid valves, DC contactors and alarm lamps
Connections of the module SIM 322-1BL00; DO 32 * DC 24 V / 0,5 A
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SIM 323-1BL00 Module, DI 16 / DO 16 * DC 24 V /0,5 A
Features:
· Rated input voltage DC 24 V 3
· Load voltage DC 24 V
· Suited for switches and 2- /3- /4-wire proximity switches (BEROs), solenoid
valves,
· DC contactors and alarm lamps
· This module is optionally used for the following functions:
· To input 8 form C contacts or 16 single contacts each with contact supply
· To input and output 16 each binary signals
· To read in control commands and output lamp signals for desk tiles in
conventional control rooms and operator stations
· Drive control module for 4 motors/solenoid valves (FB153) or 2 reversing
actuators (FB156)
The output channel with the same channel no. as the input channel for the form
C contacts is used for the contact supply of single contacts.
The function block FB70 is called up to read in input signals in the AP for each
system (contact supply and individual contact or contact supply and form C
contact).
You are free to mix form C and single contacts. Binary contacts which are not
used for the contact sup-ply can be used for signal output.
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Example of a circuit with single contacts with sensor power supply
Connections of the module SIM 323-1BL00; DI 16 / DO 16 input and output of binary signals
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Analog input module SIM 331
Associated function blocks in the AP:
FB73 (ANAEIN ), FB74 (ANAAUS ), FB76 (ANATHERM ) and FB77 (ANAWID ): 3

Input ranges: 0...20 mA
4...20 mA
+--20mA
Thermocouples type J,K
Resistance thermometer Pt100
Connecting Voltage and Current Sensors, Resistance-Type-Thermometers

and Thermocouples
The abbreviations and mnemonics used in Fig. 9 through Fig. 12 have the
following meanings:
· IC + : Constant-current lead (positive)
· IC - : Constant-current lead (negative)
· M +: Measuring lead (positive)
· M -: Measuring lead (negative)
· COMP+ : Compensating terminal (positive)
· COMP - : Compensating terminal (negative)
· MANA : Reference potential of the analog measuring circuit
· M : Ground terminal
· L +: Terminal for 24 V DC supply voltage
To reduce electrical interference, you should use twisted-pair shielded cables for
the analog signals. The shield of the analog signal cables should be grounded at
both cable ends.
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Connecting Current Sensors as 2-Wire and 4-Wire Transducers

The 2-wire transducer receives its short-circuit-proof power supply via the analog
input. This transducer then converts the measured variable into a current. Four-
wire transducers have separate power supplies.
Two-wire transducers must be isolated sensors.
Fig. 9 shows you how to connect current sensors as 2-wire transducers to an

isolated analog input module.
Fig. 9: Connecting 2-wire transducers to an isolated analog input module
Fig. 10 shows you how to connect current sensors as 4-wire transducers to an

isolated analog input module.
Fig. 10: Connecting 4-wire transducers to an isolated analog input module
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Fig. 11 shows you how to connect resistance-type thermometers to an isolated

analog input module.
3
Fig. 11: Connecting resistance-type thermometers to an isolated analog input module
Thermocouples
If you connect thermocouples direct to the inputs of the module or via

compensating leads, you can use internal temperature compensation. Each
channel group can use a thermocouple type supported by the analog module
independently of the other channel groups.
Fig. 12: Connection of thermocouples with internal compensation to an isolated analog input module
When you input signals from 4-wire transducers, thermocouples or resistance--

type thermometers, the not used inputs of the respective channel group must be
short-circuited and connected to the MANA terminal. If not used, the Comp input
must be jumpered.
Not used analog inputs should be deactivated via parameterization. This

shortens the cycle time of the module.
2-wire transducers need the connection of MANA to M. Not used channels need
no connection because of the existing shunt to MANA.
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SIM 331-7KB01 Module, AI 2 * 12 bit
Order No.: 6ES7 331 - 7KB01-0AB0
Features:
· 2 inputs in a channel group
· Measured value resolution (depending on the integration time selected)
· 9 bit + sign
· 12 bit + sign
· 14 bit + sign
· Measurement type selectable for each channel group:
· Current
· Resistor
· Temperature
· Optional measurement range selection for each channel group
· Electrically isolated from the CPU
· Electrically isolated from the load voltage (not with 2--wire transducer)
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Connections of the module SIM 331-7KB01; AI 2 * 12 bit for process signals
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Connections of the module SIM 331-7KB01; AI 2 * 12 bit
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SIM 331-7KF01 Module, AI 8 * 12 bit
Order No.: 6ES7 331 - 7KF01-0AB0
Features:
· 8 inputs in 4 channel groups
· Measured value resolution selectable for each group (depending on the

integration time selected)
· 9 bit + sign
· 12 bit + sign 3
· 14 bit + sign
· Current
· Resistor
· Temperature
· Free selection of measurement range for each channel group
· Electrically isolated from the load voltage (not with 2-wire transducer)
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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for current and voltage measurement
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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for resistance thermometers
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SIM 331-7NF00 Module, AI 8 * 12 bit
Order No.: 6ES7 331 - 7NF00-0AB0
Features:
· 8 inputs in 4 channel groups
· Measured value resolution selectable for each group (depending on the

integration time selected )
· 15 bit + sign

· Current
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Connections of the module SIM 331-7NF00; AI 8 * 12 bit for resistance thermometers
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Analog Output Module SM 332, AO 4 * 12 Bit
Order No.: 6ES7 332 - 5HD01-0AB0
Features:
· 4 outputs in 4 channel groups
· The outputs are selectable by channels as

· Voltage output
· Current output
· Resolution 12
· Electrically isolated from the CPU and load voltage
The associated FB in the AP is the FB75 (ANAAUS). The setting of the function
block parameter “Analog input range” is independent from the HW setting of the
SIM332 selected to 0...20mA.
Connections of the module SIM 332; AO 4 * 12 bit.
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TXP-HW
Test/Exercise 2
G During normal redundant operation (functioning master and standby) what is
the status of the CPU 948R’s RUN and STOP LEDs…..
G On the Master?
3
G On the Standby?
G What 2 Interface Modules are connected to make up the redundancy link

between the CPU 948Rs?
G What Interface Module is used to connect the ET 200 stations?
G What is the maximum number of IM 153 modules that can be connected to an

AP?
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TXP-HW Course
G What bus is used to connect the ET 200M stations to the TXP Automation
Processor?
G What is the maximum number of input and output bytes per ET 200M station?
G If a single IM 308C chain has 6 stations connected to it which L2 connectors

in the chain need to be terminated?
G Draw a diagram of a redundant AS 620 B system depicting all Interface

Modules down to the ET 200M stations and all necessary connections
G What are the 5 different uses of the SIM 323 module?
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TXP-HW Course
G What SIM module would be used to connect 8 24 VDC single contact inputs?
G What SIM module would be used to connect 4 type K thermocouples?
G Turn off the power to your AS 620 and remove the I/O cards from the ET 200
station
G Remove and reinstall one of the bus units
G Reassemble the ET 200 station observing the coding keys on the terminating
connectors
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G Turn the power back on and observe the CPU 948 LEDs on startup
G What sequence did the LEDs go through?
G What is the status of the LEDs after complete startup?
G What does this indicate?
G Perform a “Cold RESET” on the CPU 948
G How is this accomplished?
G Is the user program running in the CPU afterwards?
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AS 620T & Exercise 3
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AS 620 T Hardware Overview
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Rack Layout
Ø Either 12 or 24 slot racks (SR12 or SR24)

Ø Power Supply w/back-up battery
Ø Outputs for “Power Supply OK” & “Fan OK”
Ø 2 back plane buses: L and C
Ø PM6/PM5 (Processor Module)
Ø EM11 (I/O Board)
Ø CS12 (Fiber Optic Coupling)
Ø CS22 (Fiber Optic Coupling)
Ø CS7 (Carrier Module)
Ø SS52 (Interface Board)
Ø CSH11 (Communication Board)
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L & C Bus
Ø Features
Ø The L bus (local bus) is dedicated to processor and I/O tasks
Ø The C bus (communication bus) is dedicated to communications tasks
C bus connection
L bus connection
4
CS7 plug in for SSx cards

. Note: The CS7 has C
and L bus connection.
SS connection
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PM6 Processor
Ø Central Processing Unit for general open and closed-loop control tasks with high computational
requirements
Ø Features
Ø 8 on-board digital inputs
Ø 64/128 MHz, 32/64 bit RISC processor
Ø 8 Mbyte DRAM (16Mb version)
Ø 256 Kbyte SDRAM
Ø Cache: 16 Kbyte program, 16 Kbyte data
Ø Clock pulse (external/internal):
Ø 32 MHz for local periphery
Ø 64 MHz for DRAM accesses
Ø Program memory module
Ø MS5 - 2 MB flash EPROM, 8 KB EEPROM
Ø MS55 - 2 MB RAM, 8 KB EEPROM
Ø MS51 - 4 MB Flash EPROM, 8 KB EEPROM
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TXP-HW Course
PM6 (Display Codes)
The following display codes are displayed in the LED window of the
processor:
Display Operating and error status

1..8 Configured number of the CPU 4
A Display caused by the user software (configuring)
Initialization phase. Indivudual initialization steps are displayed with
- increasing numbers during run - up phase.
. 5V available; no program is being executed
Initialization error due to erroneous or incorrectly inserted modules for
the actual software which has been configured: flashing "0" -> Error on
this module; steady "0" -> Error on other modules or error when
0 loading system software
Monitoring error (e.g. missing, discharged buffer battery, overload on
b binary outputs)
C Erroneous configured communications or connection
E Operating system alarms, generally, time overrun
Fatal system error due to hardware or software problems which
resulted in a program crash: flashing "H" -> fault/error on this module;
H steady "H" -> Fault/error on another module
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PM6 (Front panel and indications)
S1 Button
• Used to delete error displays

• Used with function block ASI as a binary input signal for trip resets
Program memory module
• MS5 - 2 MB flash EPROM, 8 KB EEPROM

• Used for storing user program
X1
• Serial interface RS-232
X5
• Binary Inputs BI1 - BI8
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EM11 I/O Board
Features
• digitize analog inputs with A/D or V/F/D converters
• binary I/O {in steam turbine governors only)
• 16 display LEDs
• Output analog voltage signals
LEDs
• H10/H20 4
• H10 byte with Red LEDs (H11-H18)
• H20 byte with Yellow LEDs (H21-H28)
X5
• for incremental encoding
X6
• Digitize analog voltage signals
• 4 A/D channels
• 4 V/F/D channels
• Digital/Analog conversion (2 channels)
X7
• 16 binary inputs.
• 4 binary outputs for signal states of X5
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CS12 (Fiber Optic Coupling – Master)
Features
• Master FO communications link between 2 racks for redundancy

• Can only be used on sub-racks with L and C buses Availability
• Can be used with expansion slots (ICS1 & ICS2) to control up to 8
slave racks
X5
• Receiver
X6
• Transmitter
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TXP-HW Course
CS22 Fiber (Optic Coupling - Slave)
Features
• Slave FO communications link between 2 racks for redundancy

• Can only be used on sub-racks with L and C bus
4
X5
• Receiver
X6
• Transmitter
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TXP-HW Course
CS7 (Carrier Module)
Features
• Relieves processor board of communications tasks
• Can accommodate up to 3 interface modules
• Occupies 2 slots
• H10/H11 • H20/H21
• amber and green LED • amber and green LED
• X10/X11 • X20/X21
• double test socket • double test socket
• Slot X1 • Slot X2
• Interface module slot • Interface module slot
• H30/H31
• amber and green LED
• X30/X31
• double test socket
• Slot X3
• Interface module slot
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SS52 (Interface board – PROFIBUS)
Features
• Interface board for PROFIBUS protocol (SINEC L2)
X5
• DB9 RS485 interface
4
LED LED
H10/H20/H30 H11/H21/H31 Function
dark dark processor not initialized
dark lit no data basis in the ring
dark flickers without data basis
flashing dark initialization erroneous
initialization completed No bus
lit dark connection
lit lit "in the ring"
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TXP-HW Course
CSH11 (Support Board)
Features
• Plant Bus connection for communications with AS 620 B & OM 650

systems
Front Panel Connectors
• Red and Green LEDs

• Switch ADM,Run,STP
• ADM allows resetting CSH11 via reset button
• Run > STP interrupts communication
• STP > Run establishes communication
• Reset button
• X5
• SINEC NML Programmer port
• X6
• Plant Bus connector cable port
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TXP-HW Course
CSH11 (Support Board)
LED LED 4
Red (STP) Green (Run) Function
dark lit Run with data basis
dark flashing NSAP address
lit dark Stop
lit flashing Interrupt
Waiting for synchronization with

lit lit the monitor process in the host
Internal intermediate status of
dark dark the CP
flashing dark Fatal CP error
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Rack OK
Power Supply OK Fan OK
24 V RK OK
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Master Rack Feedback
EM1
Ribbon to Rack
Outputs a 1 if master; 0 if
slave
Outputs a 1 if master; 0 if
EM1
Rack slave
Binary input
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Processor Commmunictaions Using CS12 to

CS22 FO Coupling
Transmit/Recieve
Rack "A" Rack "B"
Receive/Transmit
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AddFEM Unit Interface
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AddFEM LED’s
There are 3 groups of LEDs
Each group has 4 LEDs
There are 2 types of LEDs:
Error LEDs are red and on the left side
Status LEDs are green or yellow and are located on the right side
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AddFEM Light Explanation
AddFEM Light Information Key
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AddFEM Connections
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Connections X4 & X5: Pin assignments for

Analog inputs and Outputs
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Connectors X6 and X7: Pin Assignments for

Digital Inputs and Outputs
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COM PROFIBUS
COM Profibus is used for:
Configuring the communication port
Setting up the network
Setting up the AddFEM I/O
Setting station addresses
Figure above shows the COM Profibus configuration screen as shown on

the PG740
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COM Profibus GSD File
The GSD file shows a graphical representation of the Profibus network.

It will show the DP master and all of the AddFEM slaves along with all the station addresses.
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COM PROFIBUS: Parameterization of the

Operating Mode for AddFEM
Parameterization is done via menu selections from within the COM Profibus
software:
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Analog Inputs/Outputs for AddFEM
Analog Inputs 1-6 can be parameterized as current or voltage

Analog Inputs 7-12 can be parameterized as only current
Analog Outputs 1-4 can be parameterized as current +/- 30 Ma

Analog Outputs 5-8 can be parameterized as current +/- 20 Ma
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Analog Input Filters for AddFEM
Filters can be used to suppress unwanted signals on the Analog inputs
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AddFEM Connections to Profibus
If a connector has only one wire, it should always be connected to the connector with
the arrow pointing into the connector housing
Other end of bus
The terminating resistors should only be turned on at the two ends of each run
When connectors are “piggy backed” all rules for terminating resistors are reversed
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TXP-HW Course
AddFEM General Troubleshooting
Symptom:
No communication to an AddFEM module, but there is communication
on other AddFEM modules
Solution:
Check that terminating resistors are correctly set on all connectors,
and check that Profibus cables are correctly terminated in the
connectors 4
Symptom:
If EXTF light is active
Solution:
Check that all current loops are complete, and check that there are no
short circuits on both analog and digital I/Os
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Fast I/O Redundancy: 501CT Concept
Redundant AP connections
One AddFEM module failure initiates a trip
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Example of CT Redundancy (1)
In this example, the Governor System is in fault free operation; Green is used
to show the master; Orange is used to show the slave
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If the connection to the third AddFEM module on bus A is removed...
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The AddFEM module 3 will switch from A bus master to B bus master
This changes the status bits sent back to the Simadyn Processor
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Simadyn racks A and B receive status that AddFEM module 3 switched for A to B
Simadyn rack A switches from Master to Slave, and Simadyn rack B from Slave to
Master
The Governor software sends a life bit that tells whether it is the Master or Slave (this
is a special Hex Code) to the AddFEM modules...
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TXP-HW Course
The AddFEM modules receive the Hex Code and switch to bus B
The AddFEM modules always select the bus channel that is the system Master,
unless that channel is faulty
If either of the Simadyn racks do not switch, or either of the AddFEM modules do
not switch, the turbine is tripped due to double failure
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TXP-HW
Test/Exercise 3
G Where is the user program stored for the AS620T processor?
G What are the different uses of the L and C busses?
G What I/O module is used for direct access to the processor (no L or C bus
connection)?
G What is the EM11 card used for?
G What 2 modules make up the redundancy link between the 2 processors?
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TXP-HW Course
G What card is used to connect the AS620T to the Plant Bus?
G How is data sent from the AS620T to the OM650 PU?
G What is the AddFEM Module used for?
G Which tool is used to set up the AddFEM unit?
G On a separate sheet of paper draw a diagram of a complete redundant

AS620T including all input and output modules
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SIMATIC H1 Plant Bus

& Exercise 4/5
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SIMATIC H1 Plant Bus
Access Mechanism
All busses in TXP use the Carrier Sense Multiple Access Collision Detection
(CSMA/CD) access mechanism. Both the electrical and optical versions of the
Industrial Ethernet CSMA/CD bus are based on the baseband transmission
procedure whereby the information to be transferred is directly superimposed
onto the transmission medium, which means no high-frequency carrier signal
modulation is used. The CSMA/CD access mechanism allows one transmission
channel to be shared by all connected stations.
The CSMA/CD access mechanism is described in the Ethernet specification

IEEE 802.3 (1st edition 1985) and its extension (2nd edition 1989). This
internationally used standard initially only covered electrical coaxial CSMA/CD
busses. Then CSMA/CD busses with new transmission media such as Fiber
Optic and twisted-pair cabling were developed and used.
5
The bus components required are based on the extended IEEE 802.3 standard
and allow different types of CSMA/CD busses to be used.
The SIMATIC NET Industrial Ethernet is based on the Open System

Interconnection (OSI) reference model of the International Standardization
Organization (ISO). Figure 1 illustrates the 7 layers of the OSI model:
5-7 See section on communication protocols

4 Transport Reliable data Connection/ ISO
transmission disconnection transport
Acknowledgement
Segmentation TCP/IP
3 Network Communication Addressing of other ISO network
between busses busses
2 Data Link Access mechanism CSMA/CD Data Link
to the transmission mechanism
medium Checksum
calculation
1 Physical Physical Coaxial/FO cabling Physical
specification of the
transmission
medium
Fig. 1: OSI 7 layer reference model
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In the SIMATIC NET Industrial Ethernet the layers 1 (physical layer) and 2a
(media access control) conform to the IEEE 802.3 standard. These layers specify
the physical features of the transmission medium and the access mechanism of
the stations to the transmission medium.
Carrier Sense and Multiple Access
On a CSMA/CD bus, all nodes connected to the bus check, or sense, what is
being sent on the bus. Each node at any time has the right to access the
transmission medium provided that the bus is not being used by another node. In
other words, “listen while talking”.
Carrier Sense
Every node checks the bus for a carrier. Transmission is only attempted if
the transmission medium is not being used by another node.
Multiple Access
Each node controls its own bus access independent of other nodes.
As soon as a node starts transmitting data on the bus the transmission medium
is blocked for all other nodes. The nodes sense the data on the bus and are able
to receive but cannot send data themselves.
If a station wants to send data while data is being transmitted by another station
it waits until the packet currently being sent has been received. After a GAP time
of 9.6 microseconds it can start sending data. Figure 2 depicts Carrier Sense:
Fig. 2: Carrier Sense
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TXP-HW Course
Collision Detection
If several nodes are waiting to send data packets on the bus the possibility exists
that two or more stations transmit their data simultaneously to the transmission
medium since they found the medium to be available at approximately the same
time.
As the data packets of these nodes are sent simultaneously a so-called collision
occurs on the transmission medium. The colliding data packets are destroyed
and lost. Once a transmitting node detects a collision, it stops sending data
immediately. Data packets that were lost must be re-transmitted after a collision.
Figure 3 illustrates collision detection:
Fig. 3: Collision Detection
The node that first detects the collision sends a jam signal, which makes it easy
for other stations to also detect the collision, and then stops its own transmission
procedure.
A node must still be transmitting data in order to be able to detect a collision

with its own signal. IEEE 802.3 defines a maximum propagation time of 25.6 µs
for a signal to travel from one end of the bus to the other and back. In order to
allow the sender to detect a collision with a signal from a node which is the
maximum permissible distance away, the minimum transmission time must be
51.2 µs (= twice the single-direction signal propagation time).
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Data traffic between two stations can also include data packets that would be
too short to fill the minimum transmission time, such as, acknowledge packets.
These packets would be supplemented up to the required minimum length of 64
bytes:
(64 bytes = (512 bits x 100ns) =51.2 µs)
This procedure is called padding.
Fig. 4: Collision after the maximum propagation time
Retransmission after a collision
In order to prevent all nodes waiting to transmit data from sending data at the
same time after a collision the stations delay retransmission for some random
length of time within a specific time interval.
The maximum number of retransmission attempts is 16. After the waiting period
the nodes attempt to transfer the data again. The node with the shortest waiting
period is the first to transfer while the others retry after different waiting periods.
After the 16th collision, no further retransmission attempt is made and a signal is
issued to the next higher protocol layer.
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The CSMA/CD access mechanism for access to the transmission medium is

always the same no matter whether the bus uses electrical, optical or mixed
cabling. The only differences between these busses are the physical
representation of the data signals on the transmission medium as electrical or
light signals and the transmission media and bus components used.
Designation Value
Bit time at 10 Mbps 100 ns
Minimum packet length 512 bits (64 bytes) = 51.2 µs
Maximum packet length 12,144 bits (1,518 bytes)
Maximum transmission time Approximately 1.214 ms
GAP time 9.6 µs
Jam signal 32 bits
Maximum number of retransmission attempts 16
after a collision
th th
Maximum waiting period up to the 10 – 16 52.4 ms
retransmission attempts
Maximum theoretical bus length Approximately 4,520 m
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TXP-HW Course
Communication Protocols for the Plant Bus
Communication on the plant bus is based on the ISO/OSI 7-layer model for open
communication. The layer model is a widely used and accepted architectural
scheme that allows communication in a varied device environment. The layers
result from the specification and grouping of the different communication
functions, each of which plays an important role in implementing communication.
Each layer serves the layer above and uses the services of the layer below, if
they exist.
Communication protocols describe the rules, structures and procedures that

have to be applied during communication among bus participants. They are
specified in binding documents, such as ISO, IEEE, and ANSI, or widely used
standards, such as, RFCs of the Department Of Defense.
In order for two bus participants to be able to intercommunicate the

corresponding protocol stack must be implemented and the protocol parameters
to be used must be specified (the OSI layers used, addresses, number and type
of connections, data lengths, etc.). Figure 5 is a graphical representation of the
OSI 7-layer model:
Fig. 5: The ISO/OSI 7-layer model
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The Protocols Used
The table below shows the protocols used for communication between the
various systems connected to the plant bus in TXP:
Protocol AS 620 – AS 620 – AS 620 – AS 620 – AS 620 – AS 620 - As 620 – SIMATIC

layer OM 650 AS 620 DS 670 ES 680 Std. S5 SIMADYN CP 581 NET
according (ancillary real-time
to ISO/OSI plant sys.) transm.
7
6 APRED APRED APRED AS511 APRED AP (STF) APRED
5 Empty
4 ISO ISO ISO ISO ISO ISO ISO
transport transport transport transport transport transport transport
3 ISO ISO ISO ISO ISO ISO ISO
network network network network network network network
2 ISO Data Link
1 IEEE 802.3
5
AP (STF) Automation Protocol/SINEC Technological Functions: higher
protocol functions based on the AP protocol from Siemens
(OSI layers 5 through 7, no redundancy functions)
APRED Siemens implementation of the OSI layers 5 through 7

(redundancy protocol, based on the AP protocol)
AS511 SIMATIC S5-specific protocol for remote programming and

remote diagnosis of SIMATIC S5 devices
SIMATIC NETSiemens Network Architecture: SIEMENS implementation of the

ISO/OSI model for industrial communication
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Star Couplers
In TXP, star couplers are the center of the Industrial Ethernet bus. The various
transmission media are coupled to the star couplers via plug-in type interface
cards. The figure below shows a typical Fiber Optics Industrial Ethernet bus with
star couplers:
Fig. 12: Industrial Ethernet bus with star couplers
TXP uses several types of star couplers: undivided AC, divided AC, undivided
24V DC, and divided 24V DC. Of course, the undivided types are used where
there is no redundancy requirements and the divided types for redundant
configurations.
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TXP-HW Course
Each type of star coupler comes with two power packs:
• The power packs of all star couplers operate with shared load
• Each power pack is able to provide the star coupler with power if the other
power pack fails
• All power packs can be removed and inserted under voltage (hot swapping).
For availability reasons, the redundant voltage supplies to the star couplers must
be connected to separate supply voltages.
The figure below shows the front and rear views of a 24V DC divided star
coupler, which contains two star couplers each provided with a plug-in power
pack on the left-hand side. Both power packs operate with shared load and they
both have a green LED to indicate power ON.
Fig. 13: Front view
Fig. 13.1: Rear view
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Star Coupler Equipment
Star couplers are equipped with interface cards, management cards or

supervisory modules as required. The plug-in slots that are not assigned must be
covered by dummy plates to ensure optimal shielding and convection.
Fig. 14: Slot assignments of star coupler
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- Power packs:
The power packs can only be plugged into the provided plug-in slots
- Interface cards:
The plug-in slots for the various types of interface cards are freely
selectable.
- Management cards or supervisory modules:
Each star coupler provides a specific plug-in slot (the divided star coupler
provides two) for the insertion of a management card or supervisory
module. If no management card/supervisory module is required the plug-
in slot can also be used to plug in an interface card.
The power packs, interface cards, management cards and supervisory modules
can also be inserted and removed during operation while the star coupler is
under voltage.
5
Two star couplers are always connected via a Fiber Optic path. Each star coupler
must contain an optical interface card for this path. The following optical
interface cards are available:
• OYDE-S....
• ECFL2
• ECFL4
Figure 14 depicts the basic principle of star coupler connections:
Fig. 14: Basic principle of star coupler connections
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Polarity of FO Cables
FO paths always require two fibers: one for the transmission and one for the
receive direction. The following principle applies if two devices are connected via
FO cables:
From To
Device 1 transmission port Device 2 receive port
Device 1 receive port Device 2 transmission port
The receive and transmission ports on the FO interface cards and optical
transceivers are identified as follows:
Reversal of the polarity of the transmission and receive direction is indicated by a

flashing red CD-LED on the interface card front panel (low light).
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Virtual Ring Theory
The single-fault tolerance implemented in the TXP bus system is based on the
virtual ring principle whereby the star couplers are connected to a ring via FO
paths. At one point in this ring the FO connection between two star couplers is
operated in the redundant mode. During fault-free operation this path is open
and thus provides the line topology required for operating a CSMA/CD bus. All
the other paths are normal FO paths and are not redundant.
The redundant mode of a FO path can be implemented using various interface

cards. Figure 15 shows the virtual ring concept during normal operation:
Fig. 15: Virtual-ring (normal operation)
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The monitoring logic on the interface card, whose port is set in the redundant
mode, monitors the virtual-ring for interruptions. The redundant path that had
been open up to the time the interruption occurred is then closed and
communication is possible in both directions to the location of the interruption.
Figure 16 shows the virtual-ring concept during abnormal operation:
Fig. 16: Virtual ring (redundant path is activated)
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Practical set-up
The redundant FO path is selected during the planning phase and implemented
during setup. The required settings on the pair of interface cards, which
terminate both sides of the redundant path, depend on the type of interface card
used. In the figure below, the redundant path is implemented using a pair of
OYDE cards. (Some of the OYDE cards in this example are inserted into
management plug-in slots that can also be used for interface cards if no
management is required).
Fig. 17: Redundant path with a pair of OYDEs.
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Interface Cards and Management Modules for Star Couplers
TXP uses the following interface cards, management cards, and supervisory
modules for star couplers:
Interface cards:
Twisted-pair ports
ECTP3
AUI ports
ECAUI
Multi-mode FO ports
OYDE-S µC
ECFL2
ECFL4
Management cards/supervisory modules:
MIKE
HSSM or HSSM2
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ECTP3
The multi-port twisted-pair interface card ECTP3 allows three terminating devices
with twisted-pair (TP) interface or TP transceivers to be connected to the
Industrial Ethernet bus via TP cable segments. Participants connected to the card
and which have faults are separated from the bus.
The interface card ECTP3 can be inserted and removed online. The card is not
provided with a fuse. Figure 18 shows the front panel of the ECTP3 card followed
by a table listing the meaning of the LEDs:
Fig. 18: The ECTP3 front panel
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LED response
Meaning of the LED No Error Error Remarks
LED color
Card-level
indicator
DA (Data) Yellow Briefly lit Data is sent to the basic system bus
by one of the three ports
P/MGMT (Power/ Green/ Yellow steady Supply voltage for the star coupler is
Management) Yellow light present
P/MGMT (Power/ Green steady Management is active
Management) light
DIS (Disable) Yellow Steady light Card is separated from the system
bus
Port-level
indicators
LS (Link Status) Green Steady light Link status of the port is OK, the
connection to the participant is
established
LS (Link Status) Not lit Link Status of the port is not OK
CD/DIS (Collision Red/ Red, briefly lit Collision has occurred
Detection/Disable Yellow
CD/DIS (Collision Red steady Port is segmented
Detection/Disable light
CD/DIS (Collision Yellow steady Port was blocked in the send and
Detection/Disable light receive direction
DA (Data) Yellow Briefly lit Data is received at the port
MDI (port 1 only) Yellow Not applicable to TXP
Fig. 18.1: Meaning of ECTP3 front panel LEDs
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ECAUI
The twin transceiver card ECAUI allows two terminating devices to be connected
via AUI port. Faulty terminating devices are separated from the bus system.
The ECAUI interface card can be inserted and removed online. The card is not
provided with a fuse. Figure 19 shows the front panel of the ECAUI card followed
Fig. 19: The ECAUI front panel
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LED response
LED color
Card-level
indicator
P/MGMT Green/ Green steady Supply voltage is present,
(Power/ Yellow light management is active
Management)
P/MGMT Yellow steady Management card is not inserted
(Power/ light
Management)
P/MGMT Yellow steady Connection to the management card
(Power/ light is interrupted
Management)
DA (Data) Yellow Briefly lit Data is sent to the basic devices
system bus
bus by management
Port-level
indicators
P1, P2 Green Steady light Supply voltage of the terminating
(Power1, Power2) device connected is present
P1, P2 Not lit No AUI cable connected to the port
(Power1, Power2)
CD/DIS (Collision Red steady Port was blocked in the send or
CD/DIS (Collision Yellow steady Port was deactivated by management
DA (Data) Yellow Briefly lit Data is received at the port
SQE Test Yellow Not lit SQE test is switched off for this port
Fig. 19.1: Meaning of ECAUI front panel LEDs
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OYDE-S µC
The FO interface card OYDE-S µC allows a star coupler or an optical transceiver

to be connected to the Industrial Ethernet bus.
The interface card OYDE-S µC can be inserted and removed under voltage. The
cards are not provided with a fuse. Figure 20 shows the front panel of the OYDE-
S card followed by a table listing the meaning of the LEDs:
Fig. 20: The OYDE-S front panel
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LED response
LED color
Card-level
indicator
P (Power) Green Steady light Supply voltage is present
P (Power) Flashing light Redundant mode (card is in standby
mode)
CD (Collision Red Briefly lit Collision has occurred
Detection)
CD (Collision Steady light Jabber control is active or partitioning
Detection)
CD (Collision Flashing light Low light (cable interrupted)
Detection)
CD (Collision Flashing light Low light and partitioning
Detection) light/dark
DA (Data) Yellow Irregularly lit Data is received via FO cable
Fig. 20.1: Meaning of OYDE-S front panel LEDs
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ECFL2
The FO interface card ECFL2 allows one more star coupler and a bus participant,
or two bus participants to be connected to the Industrial Ethernet bus.
The ECFL2 interface card can be inserted and removed online. The card is not
provided with a fuse. Figure 21 shows the front panel of the ECFL2 card followed
Fig. 21: The ECFL2 front panel
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LED response
LED color
Card-level
indicator
P/MGMT Green/ Green steady Supply voltage from the star coupler
(Power/ Yellow light present, management is active
Management)
(Power/ light
Management)
Management)
DA (Data) Yellow Irregularly lit Data is sent to the star coupler
system bus
bus by management
Port-level
indicators
LS (Link Status) Green Steady light Normal mode: the FO connection of
this port is okay and active
Redundant mode: the FO connection
of this port is okay, the port is active
LS (Link Status) Flashing light Redundant mode: the FO connection
of this port is okay, the port is in the
stand-by mode
LS (Link Status) Not lit The FO connection is not in order
DA (Data) Yellow Irregularly lit Data is received at the port
Fig. 21.1: Meaning of ECFL2 front panel LEDs
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ECFL4
The ECFL4 FO interface card allows a star coupler and additionally three bus
participants, or up to four bus participants to be connected to the Industrial
Ethernet bus. The ECFL4 interface card can be inserted and removed online. The
card is not provided with a fuse. Figure 22 shows the front panel of the ECFL4
card followed by a table listing the meaning of the LEDs:
Fig. 22: The ECFL4 front panel
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LED response
LED color
Card-level
indicator
P/MGMT Green/ Green steady Supply voltage from the star coupler
(Power/ Yellow light present, management is active
Management)
(Power/ light
Management)
Management)
DA (Data) Yellow Irregularly lit Data is sent to the star coupler
system bus
bus by management
Port-level
indicators
LS (Link Status) Green Steady light Normal mode: the FO connection of
this port is okay and active
Redundant mode: the FO connection
of this port is okay, the port is active
LS (Link Status) Flashing light Redundant mode: the FO connection
of this port is okay, the port is in the
stand-by mode
LS (Link Status) Not lit The FO connection is not in order
DA (Data) Yellow Irregularly lit Data is received at the port
Fig. 22.1: Meaning of ECFL4 front panel LEDs
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The Management Card MIKE
The management card MIKE is used in TXP in conjunction with the diagnostic
system DS670 for star coupler and LAN diagnosis. MIKE provides all information
required for evaluation in the DS670.
TXP uses the flash variant of MIKE, i.e. the MIKE operating system is already
stored in the EPROM. Figure 23 shows the front panel of the MIKE card. A
detailed listing of the LEDs is in the “Bus System” manual.
Fig. 23: The MIKE front panel
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The Star Coupler Supervisory Modules HSSM and HSSM2
The supervisory modules HSSM (Hub Status Supervisor Module) and HSSM2
provide defined fault alarms and warnings from the star coupler as hardware
signals. These signals can be incorporated into the existing TXP alarm strategy
via the automation cabinets.
Either module can be used as an alternative to MIKE management card, but just
as for the MIKE they must be inserted into the far right plug-in slot in the
undivided and in the far right plug-in slots in each half of the divided star
coupler.
Either module can be inserted and removed online (after insertion a self-test
must be activated). The cards are not provided with fuses. Figure 24 shows the
front panel of the HSSM module and the pin-out of the front panel connector
followed by a table listing the meaning of the LEDs:
Fig. 24: HSSM front panel and pin-out of connector
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LED response
LED color
Card-level
indicator
HUB OK (star Green Steady light Star coupler common alarm, OK
coupler OK)
HUB OK (star Not lit Star coupler common alarm, not OK
coupler OK)
HSSM OK Green Steady light Supervisory module is ready for
operation
HSSM OK Flashing light HSSM hardware fault
HSSM OK Not lit Supervisory module being initialized
or self-test is active
ERROR Red Steady light Interface cards signal fault or self-test
Interface is active
ERROR Fan Red Steady light Fan fault (irrelevant to the ASGE..) or
self-test is active
LOAD 1-40 Yellow Lit Current mains load in %
LOAD 1-40 Steady light Self-test is active 5
Fig. 24.1: Meaning of HSSM front panel LEDs
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Compact star couplers OLM ( Optical Link Module )
As far as availability and transmission reliability are concerned, the OLMs have
the same features as star couplers:
• Use of redundant optical paths
• 2 separate feed-ins for the voltage supply
• Diagnosis via LEDs
• Alarm contact for fault signaling ( same as the supervisory module

HSSM for star couplers )
Interfaces:
• Two optical ports for connection to other modules (analogous to

the star coupler)
• Three industrial twisted-pair ports (ITP) to connect terminating

devices
The optical ports can be used for the interconnection of several OLMs to form a
redundant optical ring, or OLMs can be incorporated into an existing redundant
optical ring containing star couplers.
The industrial twisted-pair ports are used to connect, via ITP cable, up to three
terminating devices which have an ITP port, or terminating devices which have
an AUI interface and twisted-pair transceiver TPTR.
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Fig. 13.2 Front and side view of an OLM
Fig. 13.3 Bottom and top view
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Fig. 13.4 Meaning of the LEDs
DIP switch Position Meaning

LA1 ON Alarm link status port 1 (ITP) is OK activated
OFF Alarm link status port 1 (ITP) is not OK deactivated
R5 ON Port 5 is in the redundant mode
OFF Port 5 is in the normal mode
Fig. 13.5 DIP switch block mounted in the OLM housing
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Optical Switch Modules (OSM) and Electrical Switch Modules (ESM)
The Optical Switch Modules(OSM) and the Electrical Switch Modules (ESM)
permit switched networks with speed upto 100 Mbit/s. By segmentation the load
in existing network can be separated which increases performance. Redundancy
is incorporated in the OSM and ESM modules, enabling the design of redundant
Industrial Ethernet ring structures.
The design of an optical ring requires OSMs with 2 FO ports. ESM’s also permit
the design of rings with copper cables (ITP standard cable). These electrical
rings are designed with 2 twisted-pair ports. The data rate in the ring is 100
Mbit/s and up to 50 OSMs or ESMs per ring may be used. In addition to the 2-
ring ports, the OSM and ESM have 6 more ports to which terminal devices and
network segments can be connected. These ports are available either as 6x ITP
or 6x RJ45 interface.
5
As with the star couplers (HSSM) monitoring of the modules can be done via a
signaling contact and interrogation via the DS670 is also permitted, as with the
Mike card. Furthermore, OSM and ESM are prepared for the integration in
network management systems on the basis of SNMP (Simple Network
Management Protocol) and web-based management.
Fig 13.6 Front view of an OSM Module
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Fast Ethernet
The benefit of Fast Ethernet is that it has all the features of the classic Ethernet
standard with a data rate increased by a factor of 10 to 100Mbps. The data
format, the CSMA/CD protocol and the glass fiber-optic cables and cat 5 twisted
pair cables are identical in both systems, but if you wish to utilize the full potential
of high speed performance with glass fiber link switched technology must be
used.
The table below shows typical properties for a 6 port ITP OSM, which would
utilize the 2 FO ports to make a redundant ring connection.
Properties of the OSM ITP62

Electrical ports 6 x 10/100 Mbps auto-negotiation ports
with ITP connection (sub-D 9 pin
female)
Optical Ports 2 x 100 Mpbs FO ports (full duplex)
BFOC female connector
Maximum distance between two OSM’s 3000m (multimode graded-index fiber)
Maximum ring span with 50 OSM’s 150 km
Switching Method
Switching Increases the Transmission Capacity and Span of a Network
The limited capacity due to the baseband transmission method and the limited
span due to the CSMA/CD protocol means that an Ethernet network in a large
plant with a large volume of traffic often reaches its limitation, we call this the
“meltdown point”. Using switching technology, network’s limits can be extended
considerably.
Basics of switching.
Networks operating at the physical layer such as star couplers, OLM’s and ESM’s
pass on received data transparently. This means that all data received at a port
are output again to all other ports regardless of the content. This obviously slows
down the network and is less efficient. Network components with a switching
function froward data from sender to receiver directly based on the source and
destination address information.
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Address Filtering
By analyzing the data traffic, a switch automatically learns which Data Terminal
Equipment (DTE) is obtainable by checking its ports, this method is known as
“tech-in-mode”. To enable it to carry out this function it enters the destination
address in an address table which is maintained for each port. Therefore only
data entered for DTE’s in other subnets are switched from the input port to the
appropriate output port of the switch. The switch is capable of handling several
such data flows at the same time provided they do not have the same port as
their destination.
Filtering of the data traffic based on the source and destination address, means
that data will only be transmitted on the path on which they will reach the
receiver. This means that the entire network is used for more efficiently.
As well as having the ability to learn address’s that are attached to the OSM/ESM
it also has the capability of monitoring the age of the addresses it has learnt.
5
Address entries that exceed a certain age (aging time on the OSM/ESM is 40
seconds) are deleted. If a packet is received by an OSM/ESM for which there is
no address entry, the OSM/ESM will distribute it to all ports.
Redundant Ring Structure
As with star couplers and OLM’s a redundant ring structure can be implemented
with the OSM/ESM. Like the star coupler a redundant path is configured in the
system, but in OSM’s and ESM’s it is known as a redundancy manager (RM). So
with the aid of one OSM functioning as the RM, both ends of an optical bus made
up of OSM’s are connected together using the ports 7 and 8.
The RM monitors the OSM bus connected to it, close the bus if it detects an
interruption and therefore reestablishes a functioning bus configuration. A
maximum of 50 OSM’s are permitted in an optical ring. This allows a
reconfiguration time of less than 0.3s to be achieved. The RM mode is activated
on the OSM by a DIP switch which is located on the upper casing of the OSM
module. The DIP switch is titled RM and has a selection for ON or OFF.
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Example of a redundant ring structure is shown below:
AP
OSM in
RM-mode
PU
Plant Bus
From the above example you can see that one OSM has been designated the
redundant manger (RM). Under normal operation the information will be routed
via the shortest path from sender to reciever. If however the normal route were
disrupted the OSM in RM mode will detect the distirbance and will dynamically
re-route the information. An example of this is shown on the next page.
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OSM in RM mode redirects the data in the case of a distirbance or break in the
normal path:
AP
OSM in
RM-mode
Data Flow
PU
Plant Bus
Redirected data
The OSM is capable of reconfiguring a redundant path within 0.3 seconds.
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RM – Redundancy Manager (green LED)
Status Meaning
The OSM/ESM is the operating in the redundancy manager
Lit mode. The ring is operating free of errors, in other words
the redundancy manager does not allow traffic through but
monitors the ring.
Note: One OSM must operate in the redundancy manager

mode (and only one) in each OSM/ESM ring.
Not lit The OSM/ESM is not in the redundancy manager mode
The OSM/ESM is in the redundancy manager mode and has
Flashing detected a break on the ring. The OSM/ESM makes the
connection between the two ring ports so that a functional
bus configuration is reestablished
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Communication Processors
In TXP the bus participants are connected to the terminal and plant busses via
their own interface modules which are also termed communication processors.
The Plant bus communications processors are shown in the following table:
System Communication processor

AS 620 CP 1430
OM 650 CP 1413
ES 680 CP 1413
DS 670 CP 1413
The CP1430 Communication Processor
The CP1430 communication processor connects the TXP automation system

AS620 to the Industrial Ethernet bus. Figure 25 shows the CP 1430 card:
5
Fig. 25: CP 1430
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The CP 1430 can be directly plugged into the AS 620 central rack. For redundant
configurations a CP 1430 is inserted into each rack. The structure of the card is
as follows:
• It has a single width European format and no fan

• Bus connection is via a 15-pin Sub-D socket with automatic changeover
between the AUI interface and the Industrial twisted-pair interface (combined
interface)
• The programming interface is located on the front panel
• Run/stop switch and operating status LEDs are available on the front panel
The functions of the CP 1430 are listed below:
• To handle the message transmission including layer 7 of the ISO model,

freeing the automation system from the communication tasks
• Time synchronization (can be configured as time master for the bus)
• To support test and diagnostic functions
• Integrated AUI and industrial twisted-pair interface
• Connection parameters configured using the ES680
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The CP1413 Communication Processor
The CP1413 communication processor allows the TXP operation and monitoring
system OM650, the engineering system ES680 and the diagnostic system DS670
to be connected to the plant bus. Figure 26 shows the CP 1413 card:
Fig. 26: CP 1413
Structure
The card has the short PC-AT format and is connected to the Industrial Ethernet
bus via AUI interface. The card has a built-in 15V-voltage supply to feed the
electrical or optical transceiver via the AUI interface. Several CP1413 modules
can be operated side by side in a computer.
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Functions
• To handle the transport and user-oriented protocol layers 1 through 7 of the

ISO 7 layer model
• To handle redundant communications
• SIMATIC NET TF user interface
• Configuration of the connection parameters using ES680
• Data transfer between the host computer and the CP1413 via UNIX interface
module drivers
• Communication with the plant bus via the SINEC technological functions
(STF)
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TXP-HW
Test/Exercise 4
q What 2 layers of the SIMATIC NET Industrial Ethernet conform to the IEEE
802.3 standard?
q What is the difference between a token ring network and a CSMA/CD

network?
q What happens to a data packet after a collision?
q How does a bus participant respond to a data collision?
q What 4 protocols did Siemens create for use on the Plant Bus?
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q Which of these protocols is used for AS <-> OM communications?
q Which TXP component does not evaluate synchronous time on the plant bus?
q Which card on the Plant bus is used for time master when no bus clock is
present?
q Which 2 TXP components communicate with one another using the AP (STF)
protocol?
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TXP-HW
Test/Exercise 5
q What transmission medium is required for the redundant path on the Plant
Bus?
q How is a “virtual ring” established in the bus system of TXP?
q What types of star coupler modules are used for the redundancy path in the
virtual ring?
q Which star coupler modules can be swapped on-line?
q With which TXP component is the MIKE management card used and for what
purpose?
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q What is the main purpose of the Hub Status Supervisor Module?
q What bus speeds may be optained by using OSM modules?
q How does the operation of an OSM differ from that of a star coupler?
q How is redundancy in the virtual ring set up with OSM’s?
q What is the communications processor in the AS 620 called?
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q What is the communications processor in the ES 680 called?
q Locate the CP 1413 cards on the back of your OM computer and the ES 680
workstation
5
q On a separate piece of paper draw a sketch of a typical Plant Bus including
all possible participants (when applicable list the appropriate communications
card(s))
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Ethernet Terminal Bus 6

& Exercise 6
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Terminal Bus
TXP separates communications tasks between two busses: terminal bus and
plant bus. The previous chapter described the tasks of the plant bus. This
chapter will cover the tasks of the terminal bus. The figure below shows the
components within TXP that are attached to the terminal bus:
OT1 OT2 OT3 OT4 OT5

Terminal bus
DS PU1 PU2 SU ES
Plant bus
6
AS1 AS2 AS3 AS4
Fig. 1: Terminal bus and Plant bus components
The OM 650 components that are attached to the terminal bus are Operating
Terminals (OT), Processing Units (PU), and Server Units (SU). The ES
(engineering system) and DS (diagnostic system) are also connected to the
terminal bus.
Like the plant bus, the terminal bus at the hardware level is an Ethernet bus
using the same access mechanism as the plant bus: CSMA/CD. The protocols
used at the terminal bus level come from the TCP/IP suite of protocols.
Therefore, the terminal bus is the same type of bus that is commonly used in
office networks and The Internet.
TCP/IP Basics
In the 1960’s, the United States government agency DARPA (Defense Advanced
Research Projects Agency) funded research on how to connect computers in
order to exchange data among them. The purpose of this research was to build
command and control functions in case of a nuclear “incident.”
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The idea was to be able to move data across the network even if parts of the
network became disrupted. For example, if a network link were taken out by
enemy attack, the traffic on that link would automatically be rerouted to a different
link. This reliable scheme is called dynamic rerouting and is useful to modern day
networks that aren’t affected by nuclear attacks, such as, if a network link is cut
in a power plant the data is still able to reach it’s destination via a different route.
Several California Universities did additional research while a Massachusetts firm

built the first test network, called ARPANET (Advanced Research Projects
Agency NETwork), which connected academic and military research centers.
In the mid 1970s, the network had grown enough that DARPA began to
investigate the possibility of building and connecting additional networks. The
need for more network capacity drove research into technologies such as
Ethernet and token ring, as well as satellite and radio communications.
As ARPANET grew larger and larger it became increasingly harder to manage,

so it was split into two separate networks called MILNET (for military
installations) and a new ARPANET for civilian sites. Since both networks still
needed to be connected the Internet Protocol connected the two by routing traffic
from one network to the other.
DARPA funded the development of a whole set of protocols for communication

on the ARPANET, which is now known as the suite of protocols named for two of
it’s parts: TCP/IP, which stands for Transmission Control Protocol / Internet
Protocol. The protocols were designed to support multiple connected networks.
Even though there were only two networks to begin with, IP was from the
beginning capable of connecting thousands of networks. This capability is one of
the reasons TCP/IP is still so popular today.
When the UNIX operating system was being developed at the University of
California at Berkeley, they added TCP/IP into their software distribution kit,
which spawned a rapid growth spurt of TCP/IP, especially in academic
environments. In the early 1980s, the Secretary of Defense mandated that all
computers connected to the ARPANET had to use TCP/IP.
Because of a technical limitation, the ARPANET was limited to 256 computers

and as a result several other networks sprouted up to handle the traffic:
• CSNET, the Computer Science Network
• HEPNET, the High Energy Physics Network
• NSFNET, the National Science Foundation Network
• JNET, the Japanese Computer Network
All of these networks were, and are today, interconnected by means of the
TCP/IP protocol suite.
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One of the biggest strengths of TCP/IP is that it is independent of all the available
alternatives. Following is a list of advantages:
• It’s independent of the network topology (ring, star, etc.)
• It’s independent of the transmission medium (wire, satellite, etc.)
• It’s independent of specific vendors
• It’s independent of the operating system and computer hardware (UNIX,
Windows NT, etc.)
TCP/IP ties networks and The Internet together, regardless of the hardware and
software used to build those networks. It is commonly thought that TCP/IP is only
for linking UNIX computers because it has been included in UNIX for so long, but
this is not true. TCP/IP runs on and connects just about everything. There are
other network protocols, such as IBM’s and Novell’s, but no protocol connects as
many different hardware and software platforms as TCP/IP.
The Protocols of TCP/IP
The protocols of TCP/IP stack up in layers, also, similar to the OSI Reference
Model, but TCP/IP has fewer layers. The table below lists the layers associated
with TCP/IP and the protocols that are used in each layer:
6
TCP/IP layer OSI layer TCP/IP Protocols
- Physical -
- Data link -
Internet Internet IP, IPNG, ICMP, ARP, RARP
Transport Transport TCP, UDP
Application Session, Presentation, RPC, SMTP, FTP, TFTP
Application
The physical and data link layers are not directly related to TCP/IP because it is
software that is independent of the underlying hardware. The internet and
transport layers are analogous to the OSI’s same layers. The application layer
combines the session, presentation, and application layers of the OSI model.
List of TCP/IP Protocols

IP – Internet Protocol
IPNG – Internet Protocol Next Generation
ICMP – Internet Control Message Protocol
ARP – Address Resolution Protocol
RARP – Reverse Address Resolution Protocol
TCP - Transmission Control Protocol
UDP – User Datagram Protocol
RPC – Remote Procedure Call
SMPT – Simple Mail Transfer Protocol
FTP – File Transfer Protocol
TFTP – Trivial File Transfer Protocol
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The ISO / OSI seven layer model
Following is a brief description of each layer:
Layer 1: The physical layer
This layer is pure hardware, including cable, satellite, or other connection

medium, and the network interface card. This is where electrical signals
move around on the network.
Layer 2: The data link layer
This is another layer where hardware is involved. This is the layer that
splits data into packets to be sent across the connection medium. Ethernet
or token ring wiring gets handled at this layer. Once the data is on the
wire, the data link layer handles any interference by not allowing the data
to become garbled.
Layer 3: The network layer
This is the first place on the OSI model where a TCP/IP protocol fits into
the equation. IP is the TCP/IP protocol that works at this layer. This layer
gets packets from the data link layer and sends them to the correct
network address. If more than one possible route is available for your data
to travel, the network layer figures out the best route. Without this layer,
the data would never get to the right place.
Layer 4: The transport layer
Though the network layer routes data to its destination, it cannot

guarantee that the packets holding the data will arrive in the correct order
or that they won’t have picked up any errors during transmission. That’s
the transport layer’s job. TCP is one of the TCP/IP protocols that work at
the transport layer; UDP (User Datagram Protocol) is another one. The
transport layer makes sure that the packets have no errors and that all the
packets arrive and are in the correct order. Without this layer, the network
could not be trusted.
Layer 5: The session layer
The other protocols that make up TCP/IP sit here on Layer 5 and above.
This layer establishes and coordinates a session, which is the name for a
connection between two computers. Before two computers can move data
between them a session must be established.
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Layer 6: The presentation layer
The presentation layer works with the operating system and file system.
Here’s where files get converted from one format to another, if the
participants use different formats. Without the presentation layer, file
transfer would be restricted to computers with the same file format.
Layer 7: The application layer
This is the layer where our work is done, such as requesting to transfer a
file across the network. Without the application layer, no data to be sent or
messages could be created and the computer wouldn’t know what to do
with any data that gets sent to it.
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Terminal Bus Communications Processors
The TXP components that connect to the terminal bus are the ES 680
engineering system, the OM 650 SU server unit, the OM 650 PU processor unit,
the OM 650 OT operating terminal, and the DS 670 diagnostics system. The
communications processors used in these components are 3COM Etherlink III
cards. It is a standard “off-the-shelf” Network Interface Card (NIC) that plugs into
an ISA slot on the motherboard of all the PCs. In the case of the ES 680 it is built
into the motherboard. The figure below shows the 3COM Etherlink III card:
Fig. 2: 3COM Etherlink III module
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Data Exchange between TXP nodes over the Terminal Bus
As seen in figure 1 on page 1, all components of TXP are connected to the

terminal bus with the exception of the automation systems. There are several
communication paths over the terminal bus between the TXP nodes. Following is
a brief summary of those communication paths.
ES <-> SU
The ES is used to engineer all data for the DCS. When building up the logic for
the automation systems, there are many signal definitions created. These signal
definitions, or point descriptions, are gathered in a central database that is called
the BDM database. This database, after compilation, needs to be transferred
from the ES to the SU where it permanently resides. The terminal bus connection
between the ES and SU is used for this transfer.
ES <-> PU
All the alarm handling and any calculation logic are built up on the ES. After
compilation, this data needs to be transferred to the PU. The terminal bus
connection between the ES and PU is used for this transfer. 6
ES <-> OT
All graphics that are created on the ES, after compilation, need to be transferred
to the OTs. The terminal bus connection between the ES and OT is used for this
transfer.
ES <-> DS
The terminal bus connection between the ES and DS is used by the DS to

extract the engineering data it needs to build up its graphics for diagnosing the
entire DCS from the DS terminal.
There are no dynamic connections between the ES and other terminal bus
participants. It is only used to transfer data from the ES to the other participants.
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OT <-> SU
Whenever a graphic is called up on an OT screen, any text descriptions that are

attached to a tag are extracted from the BDM database on the SU.
Whenever a trend screen is called up on an OT screen, the dynamic data

contained in the trend is extracted from the Long Term Archive on the SU.
Whenever a log is built on the OT the data is extracted from the Long Term
Archive residing on the SU.
All of this data exchange is done over the terminal bus.
OT <-> PU
All TTDs, or events, in TXP are transferred from the automation systems they
were generated in to the PU assigned to that particular AS. When a graphic is
called up on an OT screen, all the dynamic data that appears on the screen
comes from this gathering of events in the PU via the terminal bus connection.
All alarm-handling functions are handled by the PU via function blocks for the
particular automation systems that contain the alarms. These alarms are shown
to the operator via the terminal bus connection between the OT and PU.
DS <-> PU, SU, OT
The DS extracts all diagnostic data from buffers in the PU, SU, and OT and
builds up its graphic displays using the terminal bus connection.
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TXP-HW
Test/Exercise 6
What does TCP/IP stand for?
Who initiated the development of the TCP/IP suite of protocols?
Which TXP components are connect to the Terminal Bus?

6
Which TXP components other than the ES 680 communicate with it via the
Terminal Bus?
Why does an OT have to communicate with an SU over the Terminal Bus?
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Why is an OT not connected to the Plant Bus?
If the SU and PU functionality’s were combined in one UNIX computer, would

this computer have:
A. Only a CP 1413
B. Only a 3COM Etherlink III
C. Both a CP 1413 and a 3COM Etherlink III
Locate the 3COM Etherlink III card on your OM computer
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Reading I&C Drawings
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Reading I&C Drawings

Introduction
Siemens Westinghouse will typically supply drawings as part of the project

deliverables. The drawings incorporate terminology and symbology that may be
unfamiliar to some users. This section will provide the student with some
information on how to read and understand these drawings.
KKS
Unless specified differently by the customer, all Siemens Westinghouse drawings

and documentation will incorporate the Kraftwerk KennzeichenSystem (KKS)
which is German for “Power Plant Identification System”. KKS tags are used to
represent drawings, equipment, and locations.
Pictured below is a typical description of a KKS drawing (Figure 1).
Figure 1. KKS Designation of Power Plant Drawing
KKS Designation of Equipment Mounting Location
In Figure 2 an example of a KKS structure for identification of mounting location

is shown. The prefix "+" is used to represent mounting location information. The
"." between CJP02 and DC015 is used to identify that DC015 is a module
location within the cabinet CJP02. This identifier is used in the I&C manuals.
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Identification of Mounting Location
+ 1 UBA01 CJP02 . DC015
Module location
Tier = DC
Slot = 015
Cabinet Number
TXP Cabinet 2
Location
Electrical Container 1
Unit 1
Mounting Location Identifier
Figure 2 - Identification of Mounting Location
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Figure 2 shows the overall structure of the KKS mounting location, but in most
cases the numbers used within the drawings are abbreviated in some form or
another. The following list provides some other examples of mounting locations
that are commonly used in the I&C manuals:
+CJP02 This type of number is normally used to identify the cabinet. It can
be found in the drawing title block or on the drawing itself. The
prefix "+” in this case represents the unit number in which this
drawing pertains.
+.DC015 This type of number is used to identify a module. The prefix "+” in
this case represents both the Unit and the cabinet number. The
cabinet number in these cases can be found in the title block of the
drawing.
+.XD007 This type of number is used to identify a Termi-point connection.

Below this number the letters A to H would be listed to show
connection points for the individual signal. The prefix "+" in this
case represents both the Unit and the cabinet number in which the
termi-point is physically located. The cabinet number in these cases
can be found in the title block of the drawing.
7
Types of Drawings
A typical TXP installation should come with (but not limited to) the following
drawings:
· Cabinet Assembly
· Power Distribution
· Wiring Diagrams (a.k.a. Elementaries)
· Control Room Layout
· Bus Layout and Terminations
· System Layout and Connections
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Cabinet Assembly Drawings
Cabinet assembly drawings typically show the cabinet profiles, location of equipment in
the cabinet, terminal block layout, and any special instructions required for the assembler
to build the cabinet.
Cabinets are typically organized in stations, sometimes referred to as racks or nests by

other vendors. A station may contain an I/O rack such as an ET200, or it may contain
equipment from another vendor. I/O stations generally have slots, where the individual
modules are installed.
Figure 3 is a typical drawing showing the cabinet and layout of the stations. Figure 4
depicts the individual stations in greater detail, indicating item number of parts and
individual module locations or slots.
Power Distribution Drawings
Power distribution drawings show the user how each individual module in the
station is powered. Power to cabinets can be distributed from a single cabinet or
distributed individually. The example in Figure 5 is a cabinet fed redundantly
from a single cabinet.
The first drawing in the set shows the feeds from the power distribution cabinet
wired into terminal blocks with a KKS label. Protection circuitry and alarms are
also shown on the drawing (Figure 5). Thereafter, there will be a drawing for
each individual station in the cabinet showing the power distribution wiring for
each SIM module and the field bus or L2 connection (Figure 6).
Wiring Diagrams or Elementaries
Wiring diagrams may be required to show (1) internal cabinet wiring and/or (2)
field-to-cabinet wiring, similar to an ISA loop sheet (Figure 7). These drawings
may also be generated from the TXP ES680 and are called MSR drawings.
Bus Connection Drawing
Bus connection drawings show the L2 or Profibus connections required for each
station from end to end. These should correspond to the L2 bus label shown on
the power distribution drawings. Figure 8 is an example of a typical bus
connection drawing.
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Intermediate
Module
Terminal
Field Cable
Cabinet Side Field Side
Figure 3. MSR (loop) Drawing
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Loading Procedures
& Exercise 7
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Loading Procedures
AS 620
CPU 948
If the “SYS FAULT” light on the CPU 948 is on, the card must be changed. To
change the CPU 948 card proceed as follows:
(There are no dip switch settings on the CPU 948)
Step Action required Result (LEDs on CPU)

1 Power down rack containing
desired CPU
2 Remove CPU
3 Insert new CPU with mode
selector switch set to STOP
4 Power on rack - Red STOP LED On
- Red INIT LED briefly On
- Red BASP On
5 Hold the RESET switch in the 1. Red STOP LED On
OVERALL RESET position Red BASP LED On
while switching the mode Green RUN LED On
selector switch from STOP to 2. Red STOP LED On
RUN then release the RESET Green RUN LED Off
switch BASP LED On
6 Hold the RESET switch in the CPU as master:
“RESET” position while 1. Red STOP LED On
switching the mode selector Green RUN LED On
switch from "STOP” to “RUN” 2. Green RUN LED On
Then release the reset switch. 3. Red BASP Off 8
CPU as standby
1. Red STOP LED On
Green RUN LED On
2. Red STOP LED Off
Green RUN LED Off
3. Red STOP LED blinks
Green RUN LED blinks
4. Green RUN LED On
5. Red STOP LED briefly On
6. Green RUN LED blinks
Red BASP LED Off
Note: If replacing a CPU in a redundant system, once the general reset is

finished the now reserve CPU will automatically backup from the master.
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The AP should be in run mode before a code transfer is attempted. This is

indicated by a steady green run light on the master and a flashing green run light
on the standby processor.
To load the program in the CPU proceed as follows:
From the main ES 680 menu click on Transfer then AP then Load AP (offline)
as below:
The following menu will appear:
Type in the desired AP number, the name of a protocol file (for later perusal), and
select User and system software, then click on OK.
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2Copying of this document, and giving it to others and use or communication of the contents, are forbidden without express authority. Offenders are liable to the payment of
TXP-HW Course
A check on the previously generated code will now be carried out, if the code is
suitable for transfer you will be prompted, as shown below, to confirm that you
really wish to load code to the AP offline.
Click on Yes to begin the loading of code offline to the selected AP. The ES680
will attempt to connect to the AP. An error message at this point will indicate that
an AP reset is required and then the transfer will need to be reattempted. Up to
three overall reset and general reset combinations may be required before the
AP is ready to accept the code, even if the indicating lights on the AP show a
running condition.
At this point the offline handler will take control of the AP and place it in stop.
First it will down load code to the master (A) then it will update the slave (B) CPU.
When the process is complete a pop-up window will appear stating that the down
load is complete. You will need to acknowledge this message by clicking on the
close button in the pop-up window.
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CP 1430
1. Change CP1430 (there are no jumpers to set on the CP 1430)

• Switch the rack off containing the desired 1430 card
• Pull the old CP1430 card
• Put in the new card
• Put the Run/Stop-switch into the “Run”-position
• Switch the rack on
2. Obtain MAC-addresses
• Launch FUP editor
• Open the YDH-drawing
• Click on the symbol of the CP1430 you want to change
• Open the module properties mask
• Read the MAC-addresses. Address 1 is for the primary rack, address 2 for the
standby rack
3. Initialize new CP1430

• Hook up the PG740 to the CP1430
• Start the S5-software
• In the main menu line: select: “Change->others”
• Select the directory COM1430, if not already selected
• Select SINEC NCM COMs in this directory
• Type in a file name where prompted (must begin with A; e.g. Atest)
• Select “CP-Functions” then “Stop” from the main menu line. The “Stop”-light at the
CP should go on
• Select “Edit” then “CP Init” from the main menu line. Editing of the fields should be
possible
• Enter the MAC-address and the Basis SSNR (232 for the primary rack (AP A),
236 for the standby rack (AP B)) and hit F7 (ok)
• If the CP 1430 is to be set up as the Clock Master, Select “Edit” then Clock Init”
from the main menu line.
• Set the Clock Master Field to Y for yes and hit F7 (ok).
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• Select “CP-Functions then Start” from the main menu line. Both the “RUN” and
“STOP” LEDs should be on indicating the CP is not synchronized with the CPU
• If the CP 1430 is Clock Master, Select “Utilities” then “Clock Functions”
• Press F2 to set time. Enter the current date and time (Winter time of the local time
zone must be set; date is in DDMMYY format)
Afterward, LAN code needs to be downloaded to the new CP. It can be done with
the Offline Load of the AP or separately. To accomplish this proceed as follows:
From the main ES 680 menu click on Transfer then LAN then AP as below:
Type in the desired AP number and a protocol file name (for later perusal, then
click on OK
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IM 324R
To change the IM 324R card proceed as follows:
• Power down rack containing IM 324R (primary rack)

• Remove old card
• Set jumper switches on new card (see figure below)
There is only one jumper setting that needs to be checked on this card:
Jumper 1-2 of X101 Inserted for AG S5-155H

All other jumpers In delivery state
• Insert new card

• Power rack on
There is no code to transfer to this card
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IM 304
The IM 304 card is used to connect the secondary rack to the primary rack for
redundancy, connecting both the primary and secondary racks to the expansion
rack or connected out to a EU902 FUM rack.
To change the IM 304 card proceed as follows:
• Power down rack containing IM 304

• Remove old card
X11 jumper (for cable connection with IM 324R or IM 314R)

-State upon delivery:
for up to 100 m cable length: Jumper 3-4
-For IM 304 - IM 324R connection only in an AG S5-155H: Jumper 1-2
X21/X22 switch (to enable interfaces for the connection with IM 324R or IM
314R)
-State upon delivery with disabled interfaces: X21 ”OFF” / X22 ”OFF
-For connection IM 304 with IM 324R (AG S5-155H): X21 ”ON” / X22 ”OFF”
-For connection IM 304 with IM 314R (EG 185U): X21 ”ON” / X22 ”ON”
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X14 jumper switch (defines the minimum number of inoperable interfaces for
the ’inoperable I/O’ message)
-State upon delivery for 1 inoperable interface Jumper 1-2
-for 2 inoperable interfaces Jumper 2-3
X15 jumper switch (defines onward routing of the ’inoperable I/O’ message)
-State upon delivery
-”Inoperable I/O” message is routed onwards Jumper 1--2
-”inoperable I/O” message is not routed onwards No jumper
• Insert new card

• Power rack on
Additional information for connection of IM304 to IM614 in EU902 FUM rack.
Jumper settings:
The connection of the function modules to the automation processor requires

jumpers on the IM304 interface madule and encoding switches in the EU 902
rack to be set.
• IM304 (interface to EU 902 FUM rack)
The length of the link between the IM304 and the last IM614 interface mdule
in the bus chain must be set on the x!! jumper soclet on the IM304 interface
module.
The X3 of the IM304 interface module must be de-activated via the associated
switch on the front panel if an IM 614 interface is connected ( switch position OFF
from X22)
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On the IM 304 module X11 defines the distance between IM 304 and IM 614
interface modules.
The figure above shows how to select the distance between the IM304 and
IM614 with the X11 jumpers on the IM304 module.
IM 314R
To change the IM 314R card proceed as follows:
• Power down rack containing IM 314R (expansion rack)

• Remove old card
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Jumper settings:
Jumper 1-2 of X5 Inserted

Jumper 1-2 of X7 Must be removed
Jumper 2-3 of X7 Inserted
Jumper of X10 Inserted
Jumper of X101 Inserted
S1 switch settings:
Contacts 1 ... 6 OFF, OFF, OFF, OFF, OFF, ON
• Insert new card

• Power rack on
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IM 308-C
To change the IM 308-C card proceed as follows:
• Power down rack containing IM 308-C

• Remove old card
Jumper X9 and X10 settings:
X9: the jumper must be set to position “1-2” for TXP

X10 Position “1-2” if the PROFIBUS-DP interface is operated as
grounded
Position “2-3” if the PROFIBUS-DP interface is operated as non-
grounded
• Insert new card
• Power rack on
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If a new Memory card needs to be programmed proceed as follows:
From the main ES 680 menu select Generators, then AP, then Create ET200
Memory Card for Field devices as shown below:
Type in the desired AP number then click on OK. The following window should
appear if the generation of data was successful:
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After completion of this compiler a file will exist for each IM 308-C card in the
chosen AP with the following naming convention: A0001_01.pbp. The A0001
denotes the AP number (1 in this case), the _01 denotes the line number of the
IM 308-C card (also 1 in this case). To view where the file is stored you need to
choose Edit, then View/Print from the ES680 menu bar as shown below:
Click on Code Generating from the next window, shown below.
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Select the desired AP number (ag0001 in this case)
then transfer and the ET200 datafile (A0001_01.pbp in this case) will be as
shown below:
This is the file location for the IM308-C memeory card
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To be able to program the memory card this file must be put on the PG 740 via a
floppy disk. To accomplish this proceed as follows:
• Open a UNIX shell (click on the desktop with the right mouse button, and
select X Terminal as shown below).
• Type ‘cd listen/as/agxxxx/transfer’ then enter (agxxxx will be the number of

the AP you are working with i.e ag0001 in this case). After you hit enter you
will come back to the prompt. Now type ‘ls –l’ to observe the filename you
want to transfer to the floppy disk. An example is shown below:
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• With a blank floppy disk in the drive type:

For ES 680 HP workstations: ‘copyIM308Cfiles <AS Number>’ then enter
(e.g. copyIM308Cfiles 1)
For SCO UNIX machines: ‘doscp <filename> a:’ then enter (the
filename is the name you listed in the step above) An example is shown
below:
• When finished remove floppy from drive and insert into PG 740 floppy drive
• On the PG 740 start the COM PROFIBUS software
• In the main menu click on File then Import then ASCII File
• Select the a drive and double click on the .pbp file
• A Result of Conversion window will appear stating ‘no error, no warning’
• Click on OK
• A window will appear showing the Overview of Master Systems, as shown
below.
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• Highlight the IM308-C card by clicking on it once, failing to do this will result in
not being able to export the file to the memory card in the steps below.
• With the new memory card inserted in the MEM CARD slot (right-hand side),
on the PG click on File then Export then Memory Card
• In the next screen change the user defined time to 0.20 seconds
• With the rack containing the IM308 C card powered down, Insert new memory
card into IM 308-C card
• Power the rack on and switch IM 308-C card to RUN
The table below lists the meanings of the mode selector switch on the IM 308-C
card:
Designation Function
Mode selector The mode selector switch is a three position switch:
switch
RN (RUN): normal operation; IM 308-C reads the inputs of the slaves and sets the
outputs
ST (STOP): IM 308-C does not exchange data with the slaves; it may, however,
receive the token (send authorization) from another master on the bus and pass
on the token (not applicable in TXP)
OFF: IM 308-C does not exchange data with the slaves and cannot receive token
from another master (not applicable in TXP) 8
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The table below lists the meaning of the BF LED on the IM 308-C:
BF Meaning Remedy
Off Data exchanged with all -
parameterized slaves
On Bus fault1 (physical fault) Check:
Whether there is a short circuit on the data
lines of the PROFIBUS
The parameters set with COM PROFIBUS
(different baud rates)
Flashes No exchange of data with at least Check whether the bus cable is connected to
one slave which is assigned to an IM the IM 308-C
308-C master Wait until the IM 308-C has powered up. If
LED does not cease flashing, check the DP
slaves or interpret the diagnostics report for
the DP slaves.
1 During power-up, the RN, OF, and IF LEDs light up along with the BF LED for approx. 0.5
seconds
The table below lists the meaning of the RN, OF, and IF LEDs on the IM 308-C:
RN OF IF Meaning Remedy
On On On IM 308-C is powering up (BF -
LED on also)
On Off Off Status in Run: -
IM 308-C reads the slave
inputs and sets the outputs.
Flashes Off Off IM 308-C parameterizes all -

slaves on the bus and checks
their address-ability
Status is Clear:
Afterwards, the IM 308-C
reads the inputs but sets all
outputs to “0”.
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ET200M
IM 153-2
To change an IM 153-2 module proceed as follows:

• If station is non-redundant, power down the ET 200 station, otherwise,
remove faulty module with the backup module in place
• Disconnect L+ and M leads to module 8
• Unplug the PROFIBUS connector from the front of the module
• Loosen screw on the bottom of the module and remove it
• Set DIP switch address (located on front of the module; see figure below)
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Bus address DIP switch
• Insert module onto DIN rail and tighten the fastening screw at the bottom
• Reconnect the L+ and M leads
• Plug the PROFIBUS connector back into module
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ET 200M I/O modules
All of the ET 200M I/O modules can be replaced online. Proceed as follows:
• Remove terminating strip on the front of the module by depressing the button
on top while pulling the terminal strip away (see figure below)
ET 200M I/O terminating connector
• Loosen screw on the bottom of the module and remove it

• Insert new module
• Tighten screw on the bottom of the module
• Plug in terminating connector
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H1 Star Coupler Cards
Following is a list of applicable star coupler cards and their respective jumper
settings. All Star Coupler cards can be changed online.
ECTP3
The figure below shows the ECTP3 PCB followed by a list of jumper settings:
Switch/jumper settings
The ECTP3 interface card can be used with the as-delivered status. The
following are the settings, which are relevant for TXP and should be used to
check the card settings.
Group disable
(separate the ECTP3 interface card from the star coupler system bus)
In TXP, the 6-fold switch unit DIP6 remains in the OFF position (Group
enabled, this is also the status upon delivery)
The switches 1-5 are irrelevant to TXP
MDI/MDI-X mode
All jumpers in the jumper unit must be plugged into the MDI-X side for
TXP (status upon delivery)
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ECAUI
The figure below shows the ECAUI PCB followed by a list of jumper settings:
Switch/jumper settings 8
Setting the SQE test
In TXP the SQE test (tests the collision detection circuit) must be switched
off. SW1, switch 1 and switch 2 must be set to "OFF" (this is the status
upon delivery).
Activating the port shutdown
The port-shutdown must be switched off in TXP. SW1, switch 3 and switch
4 must be set to "OFF" (this is the status upon delivery). Switch 5 of SW1
is irrelevant to TXP.
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OYDE-S µC
The figure below shows the OYDE -S PCB followed by a list of jumper settings:
Diagnosis LEDs on the PCB
The PCB LEDs are only visible if the plug-in slot to the right of the interface card
is not occupied. If the red front-panel CD-LED shows steady light the PCB LEDs
2-5 indicate a specific diagnosis of the present fault. The following table lists the
faults indicated by the LEDs:
LED no. Response Description

1 Red light Fragment extension is active
2 Red light Send and receive paths in the send direction
are blocked since data packet is too long
(jabber control is active)
3 Yellow light Segmentation due to more than 64 subsequent
collisions
4 Red light Receive path in the receive direction is blocked
since data packet is too long
All Off Separated on the management station’s
request
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Switch settings
The transmitter power, IDLE/low light, and operating mode are set via switch unit
SW1.
How to set the optical transmitter power
The optical transmitter power of the OYDE-S µC must be adapted to the length of
the FO cable used. It is set by the switches 1, 2, and 3 of SW 1. The transmitter
power can be set in three ratings.
OYDE-S µC interface cards interconnected via an FO path must be set to the
same optical transmitter power. The ratings are listed in the table below:
Transmitter Launchable Typical bridge- SW1, SW1, SW1,

power rating optical able distance switch 1 switch 2 switch 3
power
Rating 1 12 dBm Up to 2,000m On Off Off
Rating 2 18 dBm Up to 4,000m On On Off
(status upon
delivery
Rating 3 22 dBm Up to 4,500m On On On
IDLE/low light function
The IDLE/low light function is set using SW1, switch 4:
The switch setting required in TXP is "off" (this means, “low-light enabled“ and is
the status upon delivery). This setting must not be changed. 8
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Operating mode
The operating mode of the OYDE-S µC interface card is set using SW1, switches
5, 6, and 7 according to the following table:
Operating mode TXP setting if…. SW1, SW1, SW1, SW1,

switch 4 switch 5 switch 6 switch 7
Standard …a normal FO path
operating mode is to be operated via
(status upon this OYDE-S µC (i.e. Off Off Off Off
delivery) an FO path which
connects bus
participants or
another star coupler)
Redundant mode …a redundant FO
path is to be
operated via this Off Off Off On
OYDE-S µC (i.e. an
FO path between
two star couplers
which closes the
virtual ring)1
1
The OYDE-S µC modules located at both ends of a redundant FO path must
both be switched to the redundant mode.
Additional switches/jumpers
In addition to the switches described above no additional switches must be

operated and no additional jumpers inserted on the OYDE-S µC interface card.
The settings of the other switches/jumpers on the PCB must retain their status
supplied upon delivery and must not be changed.
Switch 8 of SW1 is irrelevant to TXP.
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ECFL2
The figure below shows the ECFL2 PCB followed by a list of jumper settings:
The table below lists the DIP2 switch settings:
Operating TXP settings if… Setting for port 1 Setting for port 2
mode
DIP2, DIP2, DIP2, DIP2,
Standard …a normal FO path is to 8
operating be operated via this
mode ECFL2 (i.e. an FO path On Off On Off
(status upon which connects a bus
delivery) participant or another star
coupler)
Redundant …a redundant FO path is
mode 2 to be operated via this
ECFL2 (i.e. an FO path On On On On
between two star couplers
which closes the virtual
ring)1
1
Only one port at one ECFL2 of the two connecting ports of the ECFL2
modules located at both ends of a redundant FO path must be switched to
redundant mode 2. The other ports remain in the standard operating mode.
Note The switch S5 of DIP2 and the entire DIP1 are irrelevant to TXP.
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ECFL4
The figure below shows the ECFL4 PCB followed by a list of jumper settings:
mode
Standard …a normal FO path is to
operating be operated via this port of
mode the ECFL4 (i.e. an FO path On Off On Off
(status which connects to another
upon bus participant or to
delivery) another star coupler)
mode 2 to be operated via this port
of the ECFL4 (i.e. an FO On On On On
path between two star
couplers which closes the
virtual ring)1
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mode
Standard …a normal FO path is to
operating be operated via this port of
mode the ECFL4 (i.e. an FO path On Off On Off
(status which connects to another
upon bus participant or to
delivery) another star coupler)
mode 2 to be operated via this port
of the ECFL4 (i.e. an FO On On On on
path between two star
couplers which closes the
virtual ring)1
1
Only one of the two ECFL4 modules located at both ends of a redundant FO
path must be switched to redundant mode 2.
Note The switch S5 of DIP2, DIP3, and the entire DIP1 are irrelevant to TXP.
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HSSM and MIKE cards
The HSSM and MIKE cards are for special applications only. Please refer to the
product manuals provided with the project.
Interface Module for PROFIBUS--DP (Optical Network Component)
If more than one station (up to 8) is involved, the PROFIBUS--DP bus system is
set up for example as a ring network. AP and ET 200 stations are connected via
Optical Link Modules (OLM) (see figure below). The OLM connects either to
copper core cables or to fiber--optic cables. IM 308--B/C modules and ET 200
stations are connected via copper core cables. Fiber--optic cables may be used
for the connections between the OLMs. These optical leads may be made from
plastic or glass. The maximum cable length is 1,400 me-ters for glass fiber--optic
and 25 meters for plastic leads (provided that the bus components are used that
are specified for PROFIBUS--DP (FO) in the IK 10 catalog /19/). Please refer to
the applicable documents /12/, /19/ for further information.
Connecting ET 200 stations via PROFIBUS--DP OLM
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TXP-HW
Test/Exercise 7
G Assemble your AS 620 system based on the YDR diagrams
G Configure the CP 1430 communications processor for your AS 620
G Configure the IM 308 card for your ET 200 station
8
G Install the CPU 948R processor in your AS 620
G Power up your AS 620 and load all necessary code
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Preventive Maintenance
& Exercise 8
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Preventative Maintenance
Maintenance of AS 620 Components
Replacing the Lithium Battery in the Central Rack ZG 155H
Warning
Lithium batteries can explode when incorrectly handled. If they are not properly disposed
of toxic substances may be released. So please note: Do not throw new or discharged
batteries into open flames and do not solder the cell body. Do not recharge the battery!
Only the replacement batteries from SIEMENS should be used. This will ensure that your
battery is short-circuit proof. The Lithium battery is subject to the regulation for dangerous
goods. When shipping batteries reuse the original packing material. Old batteries should
be returned to the manufacturer/recycler or properly disposed of as toxic waste. The
regulations for the transportation of dangerous goods must be observed.
To be carried out when?
- If necessary Þ battery failure Þ indicated by: "Fault" LED + OM alarm
Caution:
Be sure to use the correct polarity when installing the batteries!
The batteries can be replaced without data loss if the power supply unit is switched on.
The left LED is allocated to the left battery and the right LED to the right battery.
Procedure:
· Open the black battery lid located at the top of the module front panel
· Replace the empty battery
· Ensure correct polarity
· Close the battery door

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· Press the "Reset" key of the power supply module (the yellow "Fault" LED goes out)
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Replacing the fan in the ZG 155H

- Every 50,000 h and
- If necessary Þ fan failure Þ indicated by: LED "F 1 or "F2" or "F3"+ OM alarm
The fan can be replaced without data loss if the power supply unit is switched on.
Note:
The existing three fans work in 2-out-of-3 redundancy, which means that the failure of one
fan is tolerated. In which case the other two fans increase their load
Procedure:
· Open the two quick-release locks at the front of the row of fans by turning a screwdriver
in the anti-clockwise direction a quarter turn (see Figure below)
· Grasp the bottom cover plate with both hands, press it slightly down and completely
remove it from the row of fans
· Unlock the fan to be replaced by pressing the fan handle away from the casing using
your thumb
· Remove the fan to be replaced (the other two fans increase their load). Insert the new fan
until it latches into position (see Figure on next page). The associated red "F X" LED of
the fan automatically goes out
· Insert the bottom cover plate and press it upwards
· Tighten the quick-release locks by turning a screwdriver in clock-wise direction a quarter
turn
FAN 1 FAN 2 FAN 3
Fan insert for ZG 155 H, for item a please refer to another chapter
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FAN
Fan insert including fan
Replacing the dust filter in the ZG 155H

- Annually and
- If necessary Þ indicated by: the red LEDs "F1", "F2", "F3".
The dust filter can be replaced while the ZG is in operation
Procedure:
· Open the two quick-release locks at the front of the row of fans by turning a screwdriver
in the anti-clockwise direction a quarter turn (see Figure below)
· Grasp the bottom cover plate with both hands, press it slightly down and completely
remove it from the row of fans
· Flip the filter cassette downward and remove it by pulling it forward
· The filter frame is fastened to either the bottom cover plate or to the far edge of the
bottom cover plate by snap hinges and snaps. The filter mats are attached to the filter
frame. To remove the filter frame proceed as follows: 9
FILTER
FRAME
COVER
Filter frame in the fan insert
Training Center 3
TXP-HW Course
· The filter frame can then be removed from the snap hinges
· Install the new filter frame in the reverse order
· Put the bottom cover plate back in and press it upwards
· Tighten the quick-release locks by turning a screwdriver in the clock-wise direction a
quarter turn (see Figure above)
Power supply module 6ES5955 (for ZG/EG 155H)

Switch off the power supply before you remove or insert the module!
· In a redundant AP, replacement can be carried out while the AP is in operation.

This does not apply to single-channel couplings to SIM components (F SIM, B
SIM), ancillary plant systems and AS620 T (SIMADYN). In a non-redundant AP,
replacement leads to a failure of the AS functions.
· If the automation device (ZG or EG) has an IM 308 for coupling ET 200 stations,
the IM 308 must be switched to "STOP" prior to switching off the power supply!
Otherwise outputs on the ET 200 might stay set thus leading to hazardous plant
statuses! After switching on the power supply the IM 308 must be switched back
to "RUN"
Replace the module as follows:
· Switch off the voltage supply to that half of the sub-rack containing the defective
voltage supply module (make sure you switch off the correct miniature circuit
breaker!). Provide all cables connected to the front-panel connections with labels
or refer to the TELEPERM XP AS 620 system manual 6DP6200-1DA01, section
10 "Setting up, Installation" for the wiring
· Loosen the cables. Rotate the lower screw by 90° to unlatch the module and pull
the lug to remove the module from the central device
· Set the configuration switch located at the right-hand side of the power supply
module to the desired position on the new module. The meaning of the switch
positions is shown in the Figure on the next page
· Push the Lithium batteries in observing correct polarity
· Plug the new module into the plug-in slot of the defective module and properly
connect all cables to the front-panel connections according to your labels or as
described in the TELEPERM XP AS 620 system manual 6DP6200-1DA01,
register 10 "Setting up, Installation"
· Switch on the voltage supply of the central device (indicated on the CPU 948 by
the red "Stop" LED flashing and the red "BASP" LED steady lit
· Carry out a general reset on the CPU: Keep the "reset" switch in the "reset"
position while changing the operating mode switch from "RUN" to "STOP" and
back to "RUN" again
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· In redundant APs a restart is initiated followed by an automatic update from the

still intact redundant partner. After the update the green "RUN" LED starts
flashing. Basic initialization of the CP 1430 will have to be performed (a
programmer with COM 1430 is required) and then a LAN transfer from the
ES680. In non-redundant APs overall code from the ES 680 must also be
transferred into the AS
Configuration switches and their settings (default in bold letters) 9
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Maintenance of Bus Components
Note:
To clean the casing of bus components either use a vacuum cleaner or wipe it using a
soft, dry cloth. Do not use water or solutions. Fan and fan grilles shall be cleaned using a
vacuum cleaner only
The table below lists the regular maintenance activities for the bus components:
Device Affected Checks/maintenance Maintenance interval

Star coupler Ventilation slots at Ensure free air flow in and out, Once per year
the bottom and top vacuum off accumulated dust if
of the star coupler present
casing
Voltage supply Check the power supply cable for Once per year or
firm connection. Inspect the supply immediately after
cables for proper installation, installation work in the
tension relief or damage vicinity
Power packs Visually inspect the operation Once per year
LEDs of the power pack
Dummy plates Check for completeness and Once per year
proper installation
Star coupler Connections Check the LAN cables (FO cable, Once per year or
interface drop cable, and/or ITP cable) for immediately after
cards firm connection installation work in the
vicinity
Unused FO ports Check whether dummy plugs are Once per year
present on the unused FO ports
OLM Fastening Check the installation of the snap- Once per year
on top-hat profile rail and the
OLMs
24V voltage Check the terminal base, the cable Once per year or
supply fastening and the installation immediately after
installation work in the
vicinity
Connections Check the LAN cables (FO and Once per year or
ITP cable) for firm connection and immediately after
installation installation work in the
vicinity
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Maintenance of OM 650 and ES 680 Components
As discussed in earlier chapters all OM 650 components and the ES 680 are
computer-based components. Depending on the environment the computers are
in, dust can accumulate on the internal components of the computer. Periodic
removal of this dust should be a part of the preventive maintenance plan.
Documentation of the I&C system computers in a plant forms an integral part of

the I&C system maintenance. However, the computer hardware and software are
subject to upgrading and updating. All hardware and software changes must be
documented.
Siemens Westinghouse recommends that a profile of each TXP computer is kept
describing the status of the current equipment of the computers (see below).
Computer Profile
Plant: Administrator:
Phone:
Common Data
Computer type: Date of installation:
Host name: IP address:
LAN 1 address: LAN 2 address:
HW serial no.: Software ID:
HW equipment:
Hard drives: RAM: Tape device:
Software Installation 9
Function:
Operating system:
q Ingres release: license:
q ES 680 release: license:
q Dynavis X release: license:
Logins and Passwords

Login Password User
q root system administrator

q ingres ingres administrator
q txpom OM650 administrator
q txpes ES680 administrator
q <project login> Project administrator
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Proceed as follows to determine the values of the fields in the computer profile:
Host name
OM 650 PC (SU, PU, OT, etc.) ES 680 workstation

From UNIX shell type ‘hostname’ From UNIX shell type ‘hostname’
IP address

From UNIX shell type ‘ping <hostname>’ From UNIX shell type ‘/etc/ping <hostname>’
LAN address 1 and 2

Located in equipment documentation provided From UNIX shell type ‘/etc/lanscan’
with project or contact the Assembling Center
HW serial no.

Printed on back of machine Printed on back of machine
HW equipment: Hard drives

Located in equipment documentation provided Located in equipment documentation provided
with project or contact the Assembling Center with project or contact the Assembling Center
HW equipment: RAM

Reboot machine: Reboot machine:
· logged in as root type: ‘init 6’ · logged in as root type: ‘shutdown –r –y 0’
Software Installation
OM 650/ ES 680 PC (SU, PU, OT, etc.) ES 680 workstation

· Operating system: SCO Open Server 5.0.4 · Operating system: HP-UX 10.20 w/patches
w/patches Ingres release: from an Hpterm · Ingres release: from an Hpterm type: ‘sql
type: ‘sql <database name>’ <database name>’
· Ingres license: Type ‘ingprenv’ write down · Ingres license: Type ‘ingprenv’ write down
II_AUTHORIZATION II_AUTHORIZATION
· ES 680 release: upper right-hand corner of · ES 680 release: upper right-hand corner of
main menu main menu
· ES 680 license: in file · ES 680 license: in file
/Install/txpes/sw/sw7.0.SCO/config/lizenz/STA /Install/txpes/sw/sw7.0.HP800/config/lizenz/ST
RTMENU ARTMENU
· DYNAVIS-X release: DYNAVIS-X Domain rel. · DYNAVIS-X release: DYNAVIS-X Domain rel.
in MMI editor protocol window in MMI editor protocol window
· DYNAVIS-X license: in file · DYNAVIS-X license: in file
/install/dyx/etc/DYNAVIS.LIC.<machine name> /install/dyx/etc/DYNAVIS.LIC.<machine name>
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Logins and Passwords

root: roots1 root: <machine model no.> (e.g. 715/80hp)
txpom: /1txpom ingres: ca123
txpes: /1txpes project admin: (given at turn-over)
In addition to a profile of every computer, backups should be made of data stored

on the individual component. Proceed as follows to make backups of pertinent
data:
OM 650 (SU, PU, OT, CU) Hard Drive Backup
Boot and root diskettes of SCO version 5 are available from the AC which allow
you to save or restore the entire hard disk content of a PC including version 3.
Note: The SCSI-ID 2 must be set before POWER ON of the external drive if it can be set at the
external DAT drive!
Due to the initializing procedure on the SCSI bus it may occur that the call-up is rejected up to
twice when addressing the DAT drive and a HW fault alarm is output! If the hardware is intact
the third attempt normally is successful.
Requirements:
· OM component with a DAT drive (DAT tape 120m)

(internal DAT or external DAT with SCSI address 2)
· Ensure that the OM component is shut down and switched off
To Generate a backup tape (OT, PU, SU, CU): 9
· Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot from
diskette
· On boot: Press the RETURN key => Starts booting
· Follow the dialog and then insert the ROOT diskette SCO R 5.0.4
· Om.Backup => Backup generated
· haltsys => Shut down the machine
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To load the backup tape (OT, PU, SU, CU):
· Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot from
diskette
· On boot: Press the RETURN key => Starts booting
· Follow the dialog and then insert the ROOT diskette SCO R 5.0.4
· Om.Restore => Restore is generated
· haltsys => Shut down the machine
ES 680 Database Backup
Command Sequence for Creating a Database Backup
· Log in as project administrator

· Exit out of TXP ES 680 software
· Type ‘esMonitor.sh stop’
· mkdir <backup directory> (e.g. /tmp/save; observe the free disk space!)
· cd <backup directory>
· unloaddb -c <project name>
· unload.ing
The backup so created can be saved on tape with the following commands:
· With the current directory one level above backup directory (e.g. if
backup directory is /tmp/save current directory must be /tmp)
· Type ‘tar cfv /dev/rStp0 <backup directory> (e.g. tar cfv /dev/rStp0
save)
Command sequence for loading a database backup
· Log in as project administrator

· Exit out of TXP ES680 software
· Read in the tape with the backup under the same path as used for reading
out (e.g. /tmp/save)
· With the current directory /tmp type ‘tar xfv /dev/rStp0’
· Type ‘esMonitor.sh stop’
· destroydb <database name>
· createdb -d<database name> <database name>
· cd <backup directory>
· reload.ing
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TXP-HW
Test/Exercise 8
G Locate the Lithium batteries on your 155 rack
G Remove and replace one of the fans in your 155 rack
G Fill in the necessary information on the computer profile sheet for both the
OM CU and ES workstation (if applicable)
G Perform a database back-up of the ES 680 database

9
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Trouble Shooting & Exercise 9
10
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Troubleshooting
Troubleshooting of AS 620 components
On occurrence of component faults the DS 670 provides information about the

fault location and the present fault in an optimal manner. If a DS 670 is not
present the lamp alarms and LEDs of the components described below can be
used to determine which necessary fault elimination measures are required.
Central rack (ZG) and Expansion rack (EG) 155H
Indicated by: Yellow ‘Fault’ LED on the power supply module is lit and OM Alarm
⇒ Replace the Lithium battery
Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are lit and OM Alarm
⇒ Replace the fan
Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are lit
⇒ Replace the dust filter
Indicated by: the RED LEDs ‘F1’, ‘F2’, or ‘F3’ are flashing
⇒ Replace the dust filter
Indicated by: the green ‘5V’ LED on the power supply module is not lit
⇒ Check the voltage supply. If it is O.K. replace the power supply module.
Indicated by: the green ‘24V’ LED on the power supply module is not lit
⇒ Check the voltage supply. If it is O.K. replace the power supply module.
Indicated by: Fan shutdown and none of the red LEDs ‘F1’ ,’F2’, and ‘F3’ on the
fan insert front are lit
⇒ Replace the fuse in the fan insert. 10
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CPU 948
Indicated by: the RED ‘SYS FAULT’ LED is lit

⇒ Replace the CPU 948
Indicated by: the RED ‘STOP’ LED is lit and the RUN/STOP switch is in the RUN
position
⇒ Check I&C ASD
⇒ De-energize the Central rack; wait for approx. 1 min.; Re-energize the rack;
execute a general reset and restart switches; CPU should go to RUN again
⇒ In all other cases please contact Siemens Westinghouse HOTLINE
IM 304
Indicated by: the RED ‘FAULT’ LED is lit since the connection to the partner
module is interrupted
⇒ Check the 721-connector cable. If it is okay replace the IM 304
IM 324R
Indicated by: the green ‘ON’ LED is not lit

⇒ Check the voltage supply of the Central rack, If it is okay replace the IM 324R
CP 1430
Indicated by: the RED ‘FAULT’ LED is lit

⇒ Replace the CP 1430
Indicated by: the green ‘Fault15V’ LED is not lit

⇒ Check the Central rack (source of the 15V voltage supply). If it is okay replace
the CP 1430
Indicated by: the RED ‘STOP’ LED is lit and the RUN/STOP switch is set to RUN
⇒ Determine the status using the PG 740 and COM 1430; Invoke COM 1430 ->
CP functions -> Status -> if status is STOP -> set to RUN
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IM 308
Indicated by: the RED ‘IF’ LED is lit

⇒ Replace the IM 308
Indicated by: the RED ‘BF’ LED is lit

⇒ The connection to the subordinate station has failed. Voltage failure of the
subordinate station
IM 314 R
Indicated by: the green ‘ON’ LED is not lit

⇒ Check the voltage supply of the expansion rack. Check 721-connector cable.
Troubleshooting of Bus components
The TXP bus system consists of:
• Transmission media (optical virtual ring, optical or copper cables in star

configuration)
• Active bus components (star couplers, OLMs, CPs, bridges)
• Software (drivers, CP databases, operating software for the bridge and MIKE)
• Time components
• Communications functions (protocol procedures)
Faults that occur within these component groups are signaled either directly or
indirectly. The tables below list possible fault causes and alarm locations:
10
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Cabling
Fault Possible cause Signaled via..

Interruption • Loose • Interface card LEDs1
connections/plugs • DS 670 (optional)
• Torn apart • ASD via HSSM (optional)
• Crush • ASD, indirectly
• Strain too high (connection failure)
• Wrong polarity
Fault due to failing to meet • Minimum bend radius • Interface card LEDs1
installation, commissioning, limit exceeded • DS 670 (optional)
operation, or planning • Excessive length
guidelines • Impermissible
extension
• Electromagnetic faults
• Equalizing currents on
the shield (insufficient
ground potential
equalization)
Star Couplers

Voltage supply failure • Power pack failure • Interface card LEDs1
• Failure of supply • DS 670 (optional)
voltages • ASD via HSSM (optional)
• Blown fuse • ASD, indirectly
(connection failure)
Fault due to failing to meet • Minimum bend radius • Interface card LEDs1
installation, commissioning, limit exceeded • DS 670 (optional)
operation, or planning • Excessive length • ASD, via HSSM (optional)
guidelines • Impermissible • ASD, indirectly
extension (connection failure)
• Electromagnetic faults • ASD, directly (blown fuse)
• Equalizing currents on
the shield (insufficient
ground potential
equalization)
Module failure • Back-panel bus failure • Interface card LEDs1
• DS 670 (optional)
• ASD, via HSSM (optional)
• ASD, indirectly
Fault due to failing to meet • Overheating • Interface card LEDs1
installation, commissioning, • DS 670 (optional)
operation, or planning • ASD, via HSSM (optional)
guidelines • ASD, indirectly
1
See chapter 4 of this manual for meaning of LEDs on individual cards
4 Training Center
TXP-HW Course
Optical Interface cards

Module failure • Failure of • Interface card LEDs1
send/receive section • DS 670 (optional)
of the optical ports • ASD via HSSM (optional)
• Reduced performance • ASD, indirectly
of the send/receive (connection failure)
section
• Partial/total failure of
the module logic
Fault due to failing to meet • Wrong switch setting • Interface card LEDs1
operation, or planning • ASD via HSSM (optional)
Electrical Interface cards

Module failure • Failure of • Interface card LEDs1
send/receive section • DS 670 (optional)
of the electrical ports • ASD via HSSM (optional)
• Partial/total failure of • ASD, indirectly
the module logic (connection failure)
Fault due to failing to meet • Wrong switch setting • Interface card LEDs1
operation, or planning • ASD via HSSM (optional)
Supervisory Module (HSSM)

Module failure • Partial/total failure of • HSSM LED
the module logic • ASD via HSSM (optional)
Fault due to failing to meet • Wrong switch setting • HSSM LED
installation, commissioning, • Faulty connection of • ASD via HSSM (optional)
operation, or planning the relay outputs
guidelines 10
Management card (MIKE)
Module failure • Partial/total failure of • MIKE LEDs
the module logic • DS 670 (optional)
Program fault • Program fault • MIKE LEDs
• DS 670 (optional)
Fault due to failing to meet • Faulty address setting • MIKE LEDs
installation, commissioning, • Faulty • DS 670 (optional)
operation, or planning parameterization
guidelines
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OLM (Optical Link Module)
• Fault • Possible cause • Signaled via

• Voltage supply failure • Failure of the supply • Module LEDs
voltages • ASD via alarm contact
• Blown fuse (optional)
• Power failure • ASD, indirectly
• ASD, directly
(blownfuse)
• Module failure • Send/receive section • Module LEDs
failure of the optical • ASD via alarm contact
ports (optional)
• Send/receive section • ASD, indirectly
failure of the electrical (connection failure)
ports
• Reduced performance
of the optical
send/receive section
the module logic
OSM (Optical Switch Module)
• Fault • Possible cause • Signaled via

• Voltage supply failure • Failure of the supply • Module LEDs
voltages • ASD via alarm contact
• Blown fuse (optional)
• Power failure • DS670 (optional (1))
• Telnet or browser
SMTP
• ASD, indirectly
• ASD, directly
(blownfuse)
• Module failure • Send/receive section • Module LEDs
failure of the optical • ASD via alarm contact
ports (optional)
• Send/receive section • DS670 (optional (1))
failure of the electrical • Telnet or browser
ports SMTP)
• Reduced performance • ASD, indirectly
of the optical (connection failure)
send/receive section
the module logic
6 Training Center
TXP-HW Course
Troubleshooting of OM 650 components
Each OM computer has an extensive collection of software troubleshooting tools

installed on them. All of these tools can be found under the login txpom in the
search path. Following is a few of the most commonly used tools that are used to
locate communications problems within the OM system:
PL – Indicating the Status of the OM Components and OM Managers
Syntax
PL [-t] [-1]
DESCRIPTION
The current statuses held by the infrastructure are indicated for the OM
components and the object managers. The indication is from the view of the local
OM component, i.e. the OM component on which PL has been invoked.
If option -1 is not provided, the representation is updated in a 6-seconds cycle.

To deselect cyclic output press the Del key
If option –t is selected the time synchronization status is displayed as shown in

the example below:
w01cu1 SyncState: OK
StLTK OmKomp Time StOMK MMI ASR MAC ARC BDM LZA NTB PRT
akt w01cu1 okay fue fue fue fue fue fue fue fue fue
In this example, w01cu1 is the hostname of the OM component. The Time

column indicates that the time synchronization is okay. The fue status of the
individual object managers denotes that all are running properly. If all object 10
managers are not fue please contact the HOTLINE for assistance.
pas – indicates starting

anf – indicates initialization
fue – indicates running Master
akt – indicates active standby
abg – indicates not working
Training Center 7
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rdb – Reading out the AS620B Component Status
Syntax
rdb
DESCRIPTION
For basic troubleshooting of AS communication problems, only use function 3

without checking with the HOTLINE first. Although the other functions are not
blocked they should only be used by HOTLINE personnel.
FUNCTION 3: This function is used to indicate the status of the

communication connections to the AS620B at a point in time
Example of function 3:
TXP system comprising four AS620B components in total: AS1 AS2 AS3 AS4.
The AS2 component is not available.
rdb <RETURN>
3 Function 3
3 3-second cycle
0 No storage in a file
Output:
AS Status TTD Anz. Update

index Tel No. GAanf ToSS
00 fc000710 1423 0 1
01 08000008 0 0 0
02 f4000710 4628 1 589
03 ec000710 2904 0 6
The status word fc000710 indicates all communications with the associated AS
are functioning correctly. If the status word does not show fc000710 the
HOTLINE should be contacted for assistance.
8 Training Center
TXP-HW Course
TXP-HW
Test/Exercise 9
G Power on your OM system and determine whether all of the Object Managers
are running properly. What program is used to accomplish this?
G Determine the status of the connection with the AS 620. What tool is used to
accomplish this?
G While monitoring the connection unplug the plant bus cable from the CP
1430. What did the status change to?
10
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Glossary of Terms
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Glossary of Terms:
Abbreviation Definition
AP Automation Processor
AS620B Automation System (Basic)

AS620F Automation System (Fail Safe)
AS620T Automation System (Turbine Controller)
ARC Short Term Archive
ASR Automation System Representative
AUI Attachment Unit Interface
BDM Text Data-base Manager
CPU Central Processing Unit
CSMA/CD Carrier Sense Multiple Access / Collision Detection
CU Compact Unit
DAT Digital Audio Tape
DS Diagnostic Station
DTE Data Terminal Equipment
ES Engineering Station
ESM Electrical Switching Module
F.O Fiber Optic 11
FTP File Transfer Protocol
FUM Function Module
GUI Graphical User Interface
ISO International Organizations for Standards
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ITP Industrial Twisted Pair
LAN Local Area Network
LZA Long Term Archive
MAC Media Access Control (Ethernet MAC Address)
MMI Man Machine Interface
MMT Multi Media Terminal
NIC Network Interface Card
NTB Notebook
OLM Optical link Module
OSM Optical Switching Module
OSI Open Systems Interconnection
OT Operating Terminal
PRT Log Function
PU Processor Unit
2 Training Center
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RAM Random Access Memory
ROM Read Only Memory
SCSI Small Computer System Interface
SCO Santa Cruz Operating System
SIM Signal Input Module
SU Server Unit
TCP/IP Transmission Control Protocol/ Internet Protocol
TFTP Trivial File Transfer Protocol
TTD Time Tagged Data
TSAP Transport Service Access Points
11
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TXP

For Software Releases 7. 5 and Later

Siemens Westinghouse Power Corporation

6 Ethernet Terminal Bus /Exercise 6

7 Reading I&C Drawings

8 Loading Procedures / Exercise 7

No patent liability is assumed by Siemens Westinghouse Power Corporation with

No part of this manual may be reproduced, stored in a retrieval system, or transmitted in

This document is the property of and contains Proprietary Information owned by

Siemens Westinghouse Power Corporation

1345 Ridgeland Parkway Suite 116

Operating and Monitoring system. This is the process control and

Automation System. This is the system used for process

Engineering System. This system is employed for configuration and

SIEMENS Network Communication. Communication system.

Diagnostic System. Optional component for detailed system

OT1 OT2 OT3 OT4 OT5

AS1 AS2 AS3 AS4

OM 650 process control and information system

AS 620 Automation System Overview

The AS 620 subsystem performs the automation tasks of the industrial

SIM B variant: SIM modules (signal modules) enable a distributed structure to

ES 680 engineering system

The ES 680 engineering system is the central configuration system of TXP. ES

SINEC H1 bus system

The network structure of the SINEC H1 bus system enables communication

DS 670 diagnostic system

OM 650 & Exercise 1

MOD Magnetic Optical Disk

The following devices can be connected to the UNIX computer:

• Up to two printers or one printer and one plotter

Fig.1: Generally applicable interface assignment of the UNIX computer

Component specific slot assignment

Explanations of the component texts:

1k Single-channel option with graphics

Explanation of the slot assignment nomenclature:

2940 Adaptec 2940 U2W, SCSI--3--Controller Ultrawide

N-AT NAT module for connection to the CS275 bus

The MULTIMEDIA-TERMINAL MMT-X was designed to control large, modular

The graphics server is used for multi--channel mode as an extension of the OT

Fig.4: Monitor port assignment of the mMT-X

Programming Device PG 740PII

Fig.5: Interface assignment of the PG 740PII

The Cable Connectors Used

The following cables are used for the OM components:

Monitor Connection with a Single-Channel Graphics Card

Connection between Printer and the Parallel Port of the PC

Connection between Printer and the Serial Port of the PC

Connection between the Mouse and Keyboard and the mMT-X

Connection of 4 Monitors to a 4-channel mMT-X

Connection between the PC and the Terminal Bus

Connection between the PC and the Plant Bus

Connection of the External DAT-Streamer to the PC

Automatic Restart after Power Outage

There are 2 status conditions possible during shutdown:

G What I/O modules are used for a central configuration of AS 620?

G What I/O modules are used for a distributed configuration of AS 620?

G What are the 3 different types of OM 650 components?

G What one component combines all OM 650 components?

G What operating system runs on OM 650 computers?

G Keyboard and Mouse ports

G What device(s) is (are) connected to the SCSI bus connector?

G What is the MMT used for?