REJECTION

B and T Industrial Technology REPORT

2021 - 001
CUSTOMER PROFILE TYPE OF MODULE /PCB BOARD
Company Name MIRDC Board Description MAIN BOARD CPU
Address TAGUIG CITY Model No.
Name of Requestor Serial No.
Department JO No.
Purchase Order No. Quantity

PROBLEM DESCRIPTION: COMMUNICATION ERROR AND NO OUTPUT

TECHNICAL METHODOLOGY
ACTION ITEM STATUS

Activity 01:
1. Performed visual checking of all components on the PCB mother Board.
 Burn power mosfet transistor

Activity 02:
1. Checked all components on the Power supply section using Huntron Tracker
Analyzer and Digital Fluke Tester.
S  Found out defective components are;
C  Change value of Resistor
O  Leaked signature of Electrolytic capacitor
 Leaked signature of Power Mosfet transistor
P  Resistive signature of Rectifier diode
E  Resistive signature of Regulator transistor
2. Checked all components on the Communication board section using Huntron
O Tracker Analyzer and Digital Fluke Tester. - All defective
F  Found out the all defective components. components are already
 Resistive signature of Driver IC. replaced with new and
 Leaked signature of communication display IC. good condition.
W  Resistive signature of Logic gates IC.
O  Leaked signature of Capacitor.
R  Open signature of Relay.
K Activity 03:
1. Installed the Unit on machine for the verification testing. - Unrepairable
 Still No good…

Recommendation: Buy new Main board CPU

WARRANTY:

REMARKS: Unrepairable Beyond capability to repair

MDT Technical Christian Manabat 03/22/21

Representative: Signature Over Printed Name / Date

Customer End-user
Representative: Signature Over Printed Name / Date