ASM-AM Basic Die Bonding Process & Quality

Basic Die Bonding Process & Quality
Typical Die Bonding Sequence

Epoxy dispensed
on L/F Die is bonded onto L/F
L/F L/F index to bond position
x x
Wafer Die is picked up
Pad
Collet Collet lower

at home down to pick
position Collet lower down
position
to bond position
Epoxy
dispensed Die is picked up
from
syringe
Mylar
delaminate
from die
Vacuum to Vacuum to
hold substrate Die ready, Ejector pin back hold substrate
Vacuum apply Ejector pin up
to home
Typical Die Bonding Sequence
B/A lower to pick level Ejector rises up and B/A

and position lift up the die by vacuum
B/A swings to bond

level and position for
bonding
Die Attach Process Elements
Dispensing
Materials: Epoxy, Substrate, Control system, Tools e.g.
nozzle, pin..
Process: selection of methodolgy, parameter setting for
different materials and quality requirements
Pick and Place
Materials: Die, Mylar & frame, Ejector pin & cap, Collet
Process: selection of tools and bonding platform
Bonding Quality
Aspects: Die placement, Rotation, Tilting, Bond Line
Thickness….
Dispensing
Background Information of Epoxy
Function of epoxy
Adheres the die on substrate
Commonly-used epoxy
Typical Property
Epoxy Type
Ablestik QMI Hitachi Sumitomo
Property Ablebond 841-LMISR4 QMI 509 Hitachi 4730 Sumitomo CRM-1575C
Filler Silver Silver Silver Silica
Viscosity 8000 cps@25C 9000 cps@25C 89 Pa.s@25C 22 Pa.s@25C
Thixotropic Index 5.6 3.5 5.1 2.8
Work Life 18 hours@25C 48 hours@25C N/A 48 hours@25C
Conductivity Conductive Conductive Conductive Non-conductive
Recommended Cure Cycle 1 hour@175C 15mins@150C 60sec@200C 3mins@150C
Die Shear Strength 3500psi@25C 36 kgf@25C 11.39 Mpa@200C 15.7RT@200C
(for 80 sq. mils) (for 300 sq. mils) (for 80 sq. mils)
Dispensing
Background Information of Epoxy
Paste
Die Attach in Plastic Packages
Adhesive Properties
Handling Properties
Rheology
Cure Condition
Assembly Properties
Bleed
Outgassing
Adhesion
Reliability Properties
Voids
Thermal / Electrical Conductivity
Ionic Contamination
Stress
Why handling is important
Dispensing
Substrate
Common substrates used
PCB
Leadframe
BGA
Ceramic
Considerations
Wetting properties
Pad to die ratio
Dispensing Methodology
Time-Pressure-Vacuum System
Volumetric Dispensing
Rotating Disc
A process of the application of compressed air
in a preset period for the fluid dispensing
Apply Vacuum for removing the
compressed air Vacuum
Maintain the pressure Pressure
Prevent dripping & suck back
Syringe with epoxy

Draw Backs
Air compressibility
Difficulty in regulating the dispensing consistently
Internal pressure (Pi) changes with epoxy level
Different epoxy level changes air volume inside the
syringe
Time for vacuum suction and compress air refilling is
changing
Ease of dripping & sucking-in of air bubbles
Process Principle
Positive Displacement System Syringe
(Piston Pump)
Apply compressed air
Pull up the piston to feed
epoxy into the chamber Piston
Switch the valve port
Piston is pushed to
dispense epoxy
Chamber
Valve
Advantages
True positive displacement dispensing
No dripping
Inconsistency comes from piston position error and
epoxy compressibility only
High accuracy
Draw Backs
Slow epoxy feed-in rate
Complicated design and longer time & costly
maintenance
Rotating Disc
Disc holding Stamping pin
epoxy rotated move in X & Z
with a Epoxy disc

rotation
stationary
spreader
Level of epoxy
thickness in
disc can be
adjusted
Dispensing
Application & Tools
ShowerHead
Dispensing
A process for
dispensing the
epoxy onto the
leadframe with a
fixed dispensing
pattern according to
the shower head
size
Adopted to certain
range of die size (30
x 30 ~ 150 x 150
mils)
Dispensing
Application & Tools
Shower Head
Nomenclature of
shower head
Holes
Hole diameter
Needle length
2-point stamping 4-point stamping

Dispensing Application & Tools
EpoxyDrum
Stamping
A process for
dispensing the
epoxy onto the
leadframe with a
dispensed epoxy
dot according to the
stamping pin size
Adopted to small
die only (7 x 7 ~ 20 x
20 mils)
Dispensing Application & Tools
Stamping pin
Nomenclature of stamping pin
pin tip radius
pin tip length
Tip radius
Tip Stamping pin tip

length
Dispensing
Application & Tools
Writing
A process for
dispensing the
epoxy onto the
leadframe with a
selectable
dispensing pattern
according to the die
size
Adopted to wide
range of die size (30
x 30 ~ 1000 x 1000
mils)
I.D. 0.33mm I.D. 0.21mm
I.D. 0.51mm
Dispensing
Application & Tools
Writing pin
Nomenclature of writing
pin
writing pin length
outer diameter
inner diameter
Cross Double-Y-Horizontal Double-Y-Horizontal

Effect of usage of Dispensing Method
(Advantages & Disadvantages of Different Dispensing Method)
Advantages of different dispensing method
Higher Dispensing speed Consistent dispensed pattern Ease of BLT & die tilt control Programmable dispensed pattern Small dot dispensing
Epoxy Writing Die size dependent Good Good Able Unable
Epoxy Drum Stamping Able Acceptable Acceptable Unable Able
Shower Head Dispensing Able Not Good Not Good Unable Unable
Disadvantages of different dispensing method
Ease of tailing occurrence Epoxy contamination Needle Blockage Void

Epoxy Writing Most stable No Accpetable Most stable
Epoxy Drum Stamping Easy to occur Yes No No
Shower Head Dispensing Acceptable (viscosity dependent) No Easy to occur Easy to occur
Effect of usage of Dispensing Method
Common problems
Dripping
Tailing
Inconsistency
Void
Area
Void
Photo taken by X-ray
Dispensing
nozzle, pin..
Pick and Place
Bonding Quality
Thickness….
Pick & Place
Die Picking Tools - Collet
Pick-up tools - Collet
In contact with die surface;
apply vacuum and pick up
die from Mylar
Selection depends on die
features e.g. size, adhesion
method
Hi-temp Collet
Tungstein Carbide Collet Rubber Collet

4-sided Collet 2-sided Collet
Pick & Place
Die Picking Tools - Collet
Different configuration of collet
rubber collet
commonly-used, for normal die bonding
2-sided & 4 sided collet
for die with a special surface coating
eliminate the possible contamination by the contact
between die and collet
hi-temp collet
for eutectic bonding
able to sustain the high temperature of leadframe
tungstein carbide collet
for small die bonding (size range 20 mils below)
aim to prevent the suck-back phenomenon after bonding
longer lifetime
Pick & Place
Die Picking Tools - Cap / Chuck / Pin
Cap
Act as platform
for holding the
die
Holes for vacuum
Ejector Cap
Chuck
Holding the pin
Pin
Eject the die from
the Mylar
Ejector Assembly
Ejector Chuck & Pin
Pick & Place
Die Picking Tools – Cap / Chuck
Ejecting tools selection
It is base on die dimension
die width x die length
Definition of die dimension Schematic diagram of chuck

Pick & Place
Die Picking Tools - Pin
Ejector Pin Notation
Ejector pin is notated by the dimension of pin
tip radius
Examples
R5 ejector pin ( for both sharp & round pin)
tip radius = 0.125 mm = 5 mils
R3 ejector pin
R8 ejector pin
Pick & Place
Die Picking Tools - Pin
Selection of ejecting tools (con’t)
sharp pin & round pin
It is mainly purposed for small die (range below 20 mils)
contact surface area between die and pin relatively small
compared to round tip
prevent failure of pick-up
Sharp pin Round pin
round pin
It is mainly purposed for die with size greater than 20 mils
able to prevent die crack since the tip is round and
pressure exerting on die back will not be too large
may cause failure of pick-up
Pick & Place
Wafer Handling
Different type of wafer ring / frame / wafer
cassette
Wafer cassette
Disco
K&S
Wafer ring
D company K company
Disco
K&S
Teflon
Pick & Place
Wafer Tape Material
Different type of wafer tape
Blue Mylar
material Tape
Mylar tape
UV tape
Waffle pack
Colourless
UV Tape
Pick & Place
Wafer Tape Material
Factorsdetermine the degree of uniformity
of wafer tape
Die size
Large die size have a better tackiness
Surface finish of the wafer back
Smooth surface of wafer back have higher tackiness
Duration of die adhesion to wafer tape
The longer the die are on the tape, the more they
adhere
Pick & Place
Wafer Tape Material
Factorsdetermine the degree of uniformity
of wafer tape
Exposure to UV light
The longer the exposure to UV light, the less they
adhere
Storage condition
It should be stored in a moderate condition
temp : 10-25 C
humidity : 60-70%
Tape mounting process
amount of tension should be even in both X & Y
direction
Dispensing
nozzle, pin..
Pick and Place
Bonding Quality
Thickness….
Die Bonding Quality Issues
Die Placement
Die rotation
Tilted die
Epoxy build-up (fillet height)
Epoxy coverage
Bondline Thickness
Die shear
Other common errors
Lost die
Cracked die
Damage on die surface
Skip bond unit
Misorientated die
Epoxy spread
Epoxy outside bond area
Excessive Epoxy
Epoxy tailing
Epoxy void
Common Problems & Possible Causes
Die Placement
Good Placement Error Placement in

X-Y direction
Die Bonding Quality Specification
Bond Placement
Die placement
Position shifted from
the target bond Actual die bonded
Reference Y axis
position position
∆Y
Condition of reject:
(AD898 as example)
∆X & ∆Y is out of the Reference X axis
range ± 1 mil at Cp ≥ 1
in X or Y direction
∆X Target bonding position
Inspection method:
Measurement using
Profile projector with
200X
Die Placement - con’t
Too high bond level
Error adjustment in 3-point alignment
Too small BH Table Pick Delay
Too small Bond Delay
Non-leveled bond anvil block
Die Rotation
Good Rotation Error Rotation

Die Rotation
Rotated die
Angle rotated
reference to the Reference Y axis
target bond position

Condition of reject: φ
(AD898 as example)
Angle φ is out of the Reference X axis
range ± 0.5° at Cp ≥
1.33 when viewed
from above
Inspection Method:
φ = Angle of rotation viewed
Measurement using from above
Profile projector
with 200X
Rotation - con’t
Error adjustment in bondarm 90 degree motion
Collet vacuum is not enough
Too high bond level
Coverage
Good Coverage Inadequate Coverage Excessive Coverage

Epoxy Coverage
Epoxy spread
Condition of reject: (AD898 as L
example)
Epoxy is spread out of 10
Die
mils measured from the die
perimeter.
Inspection Method:
Measurement using Profile Epoxy
projector with 100X Epoxy Spread
Epoxy coverage
Epoxy coverage area after
die bonded reference to the
die area
Condition of reject: (AD898 as Die
example) Epoxy not
cover
Epoxy coverage is less than all the
100% of die perimeter. perimeter
Inspection Method:
Visual inspection using Epoxy Coverage
Microscope (30X)
Coverage - con’t
Inadequate coverage
Too high bond level
Too short bond delay
Too low bond anvil block level
Excessive coverage
Too low bond level
Too long bond delay
Too high anvil block level
Bondline Thickness & Fillet Height
Good BLT
Good BLT
Inadequate BLT Excessive BLT

Epoxy Build-up
Epoxy build-up
Also called Fillet
Height
This is the epoxy
quantity build up T
Die
onto the die

h
Condition of reject: b
(AD898 as example)
h > (1/2 T + b)
Inspection Method: T = Die thickness
h = Epoxy build-up
Visual inspection b = Bondline thickness
using Microscope
(30X)
Bondline Thickness
Example of BLT Result
Bondline thickness Die size: 25 mil x 25 mil
Thickness of the Die thickness: 9 mil
Epoxy -- measured Leadframe: SOT 23-3L
from the LF to the

bottom of die
b out of the range 1
± 0.5 mil
Inspection Method:
Die
Measurement using
Hisomet b
microscope (200X)
Epoxy
b = Bondline thickness under the die

before curing
Bondline Thickness - con’t
Inadequate BLT
Too high bond level
Too short bond delay
Too low bond anvil block
Excessive BLT
Too low bond level
Too long bond delay
Too high anvil block level
Die Tilt
Die Tilt
No Die Tilt Die Tilt

Die Tilt
Die Tilt
Tilt up of the die
horizontal surface
(AD898 as example)
D > 0.6 mil D
Inspection Method:
Visual inspection
D = Difference between highest and
using Hisomet lowest corner of a die
Microscope (200X)
Die Tilt
Non-leveled bondarm
Uneven flatness of substrate & collet surface
Inadequate suck bond & bond delay
Dispensing position accuracy
Dispensing pattern
Measurement tools
Die Shear Force
Die Shear Force
The minimum force requirement Force
to shear a die
Depends on the die size area
Shear Strength
A force sufficient to shear the die
from its mounting or equal to Die
twice the minimum specified
shear strength shall be applied to
the die using appropriate
apparatus
AD898 as example
Die area < 6250 mils2 Die attach Acceptance criteria
Minimum die shear strength (Fm) media residue
= 0.4 gf/mils2 x Die area (A) mils2
, where A = length x width Less than 10 % Measured die shear strength
Die area ≥ 6250 mils2 (F) ≥ 2 x Fm
Fm = 2500gf
Between 10% Measured die shear strength
Acceptance Criteria and 50% (F) ≥ 1.25 x Fm
Device is accepted only when
the measured die shear strength Larger than 50% Measured die shear strength
force (F) with adhesion of die
attach media residue falls into (F) ≥ Fm
the following acceptance criteria:
Other Common Errors I
Cracked Die
Broken die
Condition of reject: Crack
Any kind of crack seen on surface
Side penetrating the inner portion of die
Inspection Method:
Visual inspection using Microscope (30X)
Damage on die surface

Caused mark on die surface Scratch found
on die surface
Any physical damage, such as scratch, found
on die surface caused by die bonder.
Inspection Method:
Mis-orientated die Die bottom

A bonded die is turned over.
A bonded die is put upside down.
Inspection Method:
Die is turned over Die is put upside down
Other Common Errors II
Lead
Epoxy outside bond area Epoxy on die
Epoxy on die / lead / pad Epoxy on lead
Condition of reject: Die
Epoxy is found outside Die

bond area Pad
Inspection Method:
Visual inspection using Epoxy on pad
Microscope (30X)
Die
Pad
Excessive Epoxy
Condition of reject: Epoxy Outside Bond Area
Excessive epoxy is
found on the bond area.
Epoxy
Inspection Method: Die
Visual inspection using

Microscope (30X)
Pad
Excessive Epoxy
Other Common Errors III
Epoxy tailing
Condition of reject: L
Vertical tailing :
h > (1/2 T + b) T Die h Die
Horizontal tailing : b
L > 4 mils
T = Die thickness
Inspection Method:
b = Bondline thickness
Microscope (30X) Epoxy Tailing
Double Die
Two dice are bonded at the
same bonding position with
one stack on the other one.
Inspection Method:
Microscope (30X)
Double Die
Other Common Errors IV
Skip bond unit
No die and epoxy is
No die and epoxy No die found on
found on a bond unit found on the bond the bond unit &
unit no mark
No die is present on
the epoxy and no
mark of die is Die
observed.
Inspection Method:
Visual inspection Epoxy
using Microscope
(30X)
Other Common Errors V
Lost die
No die is present on No die found but mark of die observed
the epoxy but a
mark of die is
observed.
Die
Inspection Method:
Visual inspection
using Microscope
Epoxy
(30X)

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Basic Die Bonding Process & Quality

Typical Die Bonding Sequence

Collet Collet lower

B/A lower to pick level Ejector rises up and B/A

B/A swings to bond

Syringe with epoxy

with a Epoxy disc

2-point stamping 4-point stamping

Tip Stamping pin tip

Cross Double-Y-Horizontal Double-Y-Horizontal

Ease of tailing occurrence Epoxy contamination Needle Blockage Void

Tungstein Carbide Collet Rubber Collet

Definition of die dimension Schematic diagram of chuck

Sharp pin Round pin

Good Placement Error Placement in

Good Rotation Error Rotation

target bond position

Good Coverage Inadequate Coverage Excessive Coverage

Inadequate BLT Excessive BLT

onto the die

from the LF to the

b = Bondline thickness under the die

No Die Tilt Die Tilt

Damage on die surface

Mis-orientated die Die bottom

Epoxy on die / lead / pad Epoxy on lead

Condition of reject: Die

Epoxy is found outside Die

Visual inspection using

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ASM-AM Basic Die Bonding Process & Quality

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