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A1
K
Description
A2
Dual center tap rectifier suited for switch mode
power supply and high frequency DC to DC
K
converters.
Packaged either in TO-220AB, TO-220FPAB and
D2PAK, this device is especially intended for use
A2
A2 K
in low voltage, high frequency inverters, free
A1
K A1 wheeling and polarity protection applications.
Table 1: Device summary
TO-220AB TO-220FPAB
Symbol Value
K K
IF(AV) Up to 2 x 10 A
VRRM 200 V
A2 Tj (max.) 175 °C
A2
A1 A1
VF (typ.) 0.78 V
D²PAK
trr (typ.) 21 ns
Features
Suited for SMPS
Low losses
Low forward and reverse recovery time
Low leakage current
High junction temperature
Insulated package: TO-220FPAB
insulating voltage: 2000 VRMS sine
ECOPACK®2 compliant component for
D²PAK on demand
1 Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IF(RMS) Forward rms current 30 A
TC = 150 °C Per diode 8
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse test: tp = 380 µs, δ < 2%
10 P = 3W 10 VF (V)
δ 0
0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Figure 3: Forward voltage drop versus forward Figure 4: Relative variation of thermal impedance
current (maximum values, per diode) junction to case versus pulse duration
(TO-220AB, D²PAK)
IF (A) Zth(j-c) /Rth(j-c)
100 1.0
90
80
70
60 Tj = 150 °C Single pulse
50
Tj = 25 °C
40
30
20
10
VF (V) t p(s)
0 0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1.E-03 1.E-02 1.E-01 1.E+00
Figure 5: Relative variation of thermal impedance Figure 6: Junction capacitance versus reverse
junction to case versus pulse duration voltage applied (typical values, per diode)
(TO-220FPAB) C(pF)
Zth(j-c) /Rth(j-c) 100
1.0 F=1MHz
VOSC=30mVRMS
Tj=25°C
Single pulse
0.1
VR(V)
t p(s) 10
0.0 0 50 100 150 200
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Figure 9: Peak reverse recovery current versus Figure 10: Relative variation of dynamic
dIF/dt (typical values, per diode) parameters versus junction temperature
IRM (A)
16
IF = 8 A 1.4
14 VR = 160 V IF = 8 A
1.2 VR = 160 V
Reference: Tj = 125 °C
12
Tj = 125 °C 1.0
10
IRM
0.8
8
0.6
6 Qrr
Tj = 25 °C 0.4
4
2 0.2
dIF/dt (A/µs) T j (°C)
0 0.0
10 100 1000 25 50 75 100 125 150
Figure 11: Thermal resistance junction to ambient versus copper surface under tab
R th (j-a) (°C/W )
80
D²PAK
70
Epoxy printed board FR4, copper thickness = 35 µm
60
50
40
30
20
10
SCu(cm²)
0
0 5 10 15 20 25 30 35 40
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL94,V0
Recommended torque value (TO-220AB and TO-220FPAB): 0.55 N.m
Maximum torque value (TO-220AB and TO-220FPAB): 0.70 N.m
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
Notes:
(1)Inch dimensions are for reference only.
3 Ordering information
Table 9: Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STTH1602CG-TR STTH1602CG D2PAK 1.38 g 1000 Tape and reel
STTH1602CT STTH1602CT TO-220AB 1.90 g 50 Tube
STTH1602CFP STTH1602CFP TO-220FPAB 1.70 g 50 Tube
4 Revision history
Table 10: Document revision history
Date Revision Changes
Feb-2004 1 First release
Updated ECOPACK statement.
23-Apr-2014 2 Reformatted to current standards.
Updated Section 2: Package mechanical data
Updated features, package silhouette and Table 1: "Device
summary".
11-Aug-2017 3
Updated Section 1: "Characteristics", Section 2: "Package
information" and Section 3: "Ordering information".
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