Standard Advanced

Inner Outer Inner Outer

TPH
Preferred aspect ratio 8:1 12:1
Minimum finished hole size 0.2mm 0.15mm
Preferred pad over hole size (internal) 300um 200um
Preferred pad over hole size (external) 300um 200um
Tolerance +/- 0.1mm +/-0.05mm
TPH in pad (Epoxy Filled)
Preferred aspect ratio 8:1 12:1
Minimum finished hole size 0.25mm 0.2mm
Maximum finished hole size 0.6mm 0.8mm
Preferred pad over hole size (internal) 300um 200um
Preferred pad over hole size (external) 300um 200um
% Cost above TPH (Ball park) 15%
Blind via
Preferred aspect ratio 8:1 12:1
Preferred min dielectric thickness 0.6mm 0.4mm
Preferred max dielectric thickness 1.6mm 2.0mm
Minimum finished hole size 0.2mm 0.15mm
Maximum finished hole size 0.4mm 0.6mm
Preferred pad over hole size (internal) 300um 200um
Preferred pad over hole size (external) 300um 200um
% Cost above TPH (Ball park) 25%
Buried via
Preferred aspect ratio 8:1 12:1
Preferred min dielectric thickness 0.6mm 0.4mm
Preferred max dielectric thickness 1.6mm 2.0mm
Minimum finished hole size 0.2mm 0.15mm
Maximum finished hole size 0.4mm 0.6mm
Preferred pad over hole size (internal) 300um 200um
Preferred pad over hole size (external) 300um 200um
% Cost above TPH (Ball park) 25%
Microvia
Minimum size (Laser) 125um 75um
Aspect Ration 0.5:1 0.75:1

Unplated holes
Hole edge to copper 200um 150um 165um 125um
Hole edge to board edge 250um 200um 200um 175um
Hole edge to hole edge 0.3mm 0.2mm
Tolerance +/-0.05mm +/-0.05mm
Minimum hole size 0.5mm 0.4mm
Maximum hole size 6.35mm 6.5mm

Slots Inner Outer Inner Outer

Width range 0.8mm - 3.2mm 0.6mm - 4mm
Track & Gap
0.5 oz copper
Minimum trace 50um 50um
Minimum gap 75um 50um

1 oz copper
Minimum trace 75um 100um 75um 75um
Minimum gap 100um 100um 75um 75um

2 oz copper
Minimum trace 125um 100um 125um 100um
Minimum gap 150um 150um 125um 125um

Maximum Copper weight 4oz 6oz 6oz 8oz

Maximum layer count 24 32
Maximum Board size 355mm x 508mm 431mm x 558mm
Max Board thickness 1.6mm 6.5mm

Features

Min soldermask web NI-Au 100um/125um 75um/100um

Min soldermask web HASL & Ag 100um/125um 75um/100um
Min soldermask clearance to Cu 50um 25um
Red,Blue,Black,White,Y
Soldermask colour Green
ellow
Preferred min hole to hole (edge to edge) 0.3mm 0.2mm
Preferred package to board edge n/a n/a
Preferred hole edge to board edge 250um 200um 200um 175um
Preferred copper to board edge (plane) 200um 150um 165um 125um
Preferred copper to board edge (trace) 200um 150um 165um 125um
Minimum Foil size 17um 9um

Other

Preferred Format (Gerber, ODB++, IPC) ODB++

Gerber / Xgerber / DXF
Supported formats (as above)
/ ODB++
Drill increment value (I.e 0.05mm) 0.05mm (CNC Mech) 0.05mm (CNC Mech)
Impedance tolerance +/-10% +/-8%

Scoring

Angle 45° 30°

Aspect Ratio 1/3rd deep top/bottom
Postional tolerance +/-0.2mm +/-0.1mm
Panel thickness 1.6mm 0.8mm

Routing

Cutter Diameter 2mm 0.8mm

Positional tolerance +/-0.2mm +/-0.1mm
Chamfers 45° 20°

Laser routing

Laser diameter 25um

Positional tolerance +/- 0.1mm +/-0.05mm

Milling

Cutter Diameter 2mm 0.8mm

Depth tolerance +/-0.15mm +/-0.1mm
Positional tolerance +/-0.2mm +/-0.1mm
Cavities 6mm x 3mm 3mm x 1mm

Finish - Thickness range

Ni 4-8um / Au 0.08 - Ni 2-6um / Au 0.06 -
Nickel Gold
0.12um 0.1um
SnPB HASL 30-50um 15-25um
Pb free HASL 30-50um 15-25um
Electrolytic Nickel 4-8um 2-6um
Ni 4-8um / Au 0.08 - Ni 2-6um / Au 0.06 -
Immersion NIAu
0.12um 0.1um
Electrolytic Gold 2-4um 1-5um
OSP 0.02-0.05um n/a
Immersion Tin 0.6-1.5um 0.8-1.2um
Immersion Silver 0.07 - 0.25um 0.05 - 0.1um
Ni 3-5um / Pd 0.2-
Nickel Palldium Gold 0.5um / Au 0.04-
0.06um

Silkscreen