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Process Improvement -

Identifying Opportunities for Process Improvement at Lamination & Slitting

What Happens What is expected Who’s What is expected


Responsible at Who’s Responsible
At lamination At Slitting
lamination at Slitting
 Joining substrate  During this  Lamination  At slitting, the  Slitting operator
rolls, a few length procedure the operator material without
(Typically 20M) of affected por- adhesive should be
material will pass tion is sup- removed guided by
when the nip posed to be the flagging done at
roller and the appropriately lamination (indicating
coating rollers are flagged. the location within the
not engaged. Preferably a reel)
noticeable
 This material will  All (any other)
tape should
be without defective material
be used while
adhesive thus it should be removed
making joints.
will not bonding as flagged at
 Flagging de-
occur/form. lamination
tails should
 Flagging may expressly
also be done to communicate
indicate set up to the next
material or any process
other type of owner
defect

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