Vista II Series Gas Chromatograph: Service Manual

SERVICE MANUAL
Vista II Series
Gas Chromatograph
2000-SVC C1: July 1999
ABB Analytical
Analytical
ABB Process Analytics
NOTICE
Material contained within this manual is proprietary information of

and is to be used only for the purpose of understanding
and operating this product.
Specifications subject to change without notice.
©1999, ABB Process Analytics
Valco Instruments Co. Inc., drawings and text reprinted

with permission of VICI, Houston, TX, USA
For further information or assistance contact:

843 North Jefferson Street
P.O. Box 831
Lewisburg, WV 24901
General Information: Telephone: (304) 647-4358

Fax: (304) 645-4236
Aftermarket Spares: Telephone (304) 647-1736

Fax (304) 647-1837
Please include Sales Order Number, Tag Number,

Analyzer Part Number and Serial Number
LIST OF EFFECTIVE PAGES—Vista II Service Manual
Date of issue for each version of this manual:
A1 January 1998
B1 March 1998
C1 July 1999
Revision status of each page in this manual:
Page No. Revision Status
All pages C1
The revision status is noted at the bottom of each page of this manual.
2000-SVC, C1 i
ABB Process Analytics Inc.

P.O. Box 831
Lewisburg, WV 24901
General Information: Telephone (304) 647-4358

Fax (304) 645-4236

Fax (304) 647-1837

ii 2000-SVC, C1
TABLE OF CONTENTS
Section Title Page
GLOSSARY ......................................................................................................................... G-1
SECTION 1. INTRODUCTION
1.1 EQUIPMENT DESCRIPTION ............................................................................................... 1-1

1.2 EQUIPMENT IDENTIFICATION ............................................................................................ 1-2
1.2.1 Hardware Configuration Identification ............................................................................ 1-2
1.2.2 Software Configuration Identification .............................................................................. 1-2
1.3 AIR PURGE SYSTEMS ........................................................................................................ 1-3
1.4 EMC CERTIFICATION .......................................................................................................... 1-3
1.4.1 Introduction .................................................................................................................... 1-3
1.4.2 Design Concepts ........................................................................................................... 1-3
1.4.3 Zone or Area Change in Installations ............................................................................. 1-4
1.4.4 Cable Installation ........................................................................................................... 1-4
1.4.5 Junction Box and Enclosure Installation ......................................................................... 1-4
1.4.6 Utility Services ............................................................................................................... 1-4
1.4.7 Operating Conditions ..................................................................................................... 1-4
1.5 VISTA II WITH FLAME PHOTOMETRIC DETECTOR ........................................................... 1-6
1.6 SYSTEM VARIATIONS ......................................................................................................... 1-6
SECTION 2. TROUBLESHOOTING
2.1 TROUBLESHOOTING GUIDELINES .................................................................................... 2-1

2.2 BASELINE PROBLEMS ........................................................................................................ 2-1
2.2.1 Baseline or Signal Offset (TCD) ..................................................................................... 2-1
2.2.2 Cyclic Short Term Drift ................................................................................................... 2-2
2.2.3 Continuous Upward or Downward Drift .......................................................................... 2-3
2.2.4 Baseline Continuous Noise ............................................................................................ 2-3
2.2.5 Baseline or Signal Offset—Flame Ignited (FID) ............................................................. 2-4
2.2.6 Baseline Signal Random Noise—Flame Ignited (FID) .................................................... 2-4
2.3 ANALYSIS PROBLEMS ........................................................................................................ 2-5
2.3.1 No Peaks ....................................................................................................................... 2-5
2.3.2 Double Sampling ............................................................................................................ 2-7
2.3.3 Additional Peaks of Unknown Origin (Mystery Peaks) ................................................... 2-7
2.3.4 Variable Sample Size ..................................................................................................... 2-8
2.3.5 Variable Retention Times ............................................................................................... 2-8
2.3.6 Individual Peak Missing on Report ................................................................................. 2-9
2.3.7 Peak Inversion ............................................................................................................... 2-9
2.3.8 Chromatogram Oversized or Off Scale ........................................................................ 2-10
2.3.9 Reduced Detector Sensitivity ....................................................................................... 2-10
2.3.10 Peak Discrimination ..................................................................................................... 2-11
2.3.11 Premature Termination of Analysis ............................................................................... 2-11
2.4 TEMPERATURE CONTROL HARDWARE PROBLEMS ..................................................... 2-12
2.4.1 Temperature Probe Open ............................................................................................ 2-12
2.4.2 Temperature Probe Shorted ......................................................................................... 2-13
2.4.3 Isothermal Oven Heater Thermocouple Faulty ............................................................. 2-14
2.4.4 Temperature Control Micro #2 ...................................................................................... 2-14
2.4.5 Loss of Air .................................................................................................................... 2-15
2.4.6 Triac Failure ................................................................................................................. 2-15
2000-SVC, C1 iii
TABLE OF CONTENTS (continued)
Section Title Page
2.4.7 T-Rating Disagreement ................................................................................................ 2-16

2.4.8 Exclusion Jumper Disagreement ................................................................................. 2-16
2.4.9 Oven Temperature is Greater Than T-Rating ................................................................ 2-17
2.4.10 Reasonableness .......................................................................................................... 2-17
2.4.11 AC Zero Crossing Loss ................................................................................................ 2-18
2.4.12 Over Temp Trial Test Fail .............................................................................................. 2-19
2.4.13 Controller Housing Internal Temperature Greater Than 80° C ...................................... 2-19
2.4.14 Set Point Unacceptable ................................................................................................ 2-20
2.4.15 Reconfiguration Failure ................................................................................................ 2-20
2.4.16 Out of Control .............................................................................................................. 2-21
2.4.17 Open or Shorted Heater .............................................................................................. 2-22
2.4.18 Blown Fuse, Heater Output Board ............................................................................... 2-22
2.4.19 Low Oven Temperature ................................................................................................ 2-22
2.4.20 High Oven Temperature ............................................................................................... 2-23
2.4.21 Programmed Oven Temperature not Cooling or Slow to Cool ...................................... 2-23
2.5 OUTPUT PROBLEMS ........................................................................................................ 2-23
2.5.1 Printer Not Generating Report ..................................................................................... 2-23
2.5.2 Trend Output Not Functioning Correctly ....................................................................... 2-24
2.5.3 Digital PCB Malfunction ............................................................................................... 2-24
2.5.4 No Recorder Output ..................................................................................................... 2-24
2.5.5 No Vista Workstation Communication .......................................................................... 2-24
2.5.6 No Analyzer Key Pad Response .................................................................................. 2-24
2.5.7 LOCOM PCB Symptoms and Possible Causes ........................................................... 2-25
2.5.8 FID “Flame Out” LED On ............................................................................................. 2-26
2.5.9 Flame Ionization Detector (FID) Flame Will Not Ignite .................................................. 2-26
2.5.10 Low Carrier Pressure Hardware Alarm ........................................................................ 2-26
2.5.11 Low Sample Flow Hardware Alarm .............................................................................. 2-27
2.5.12 Loss of Purge Air ......................................................................................................... 2-27
2.5.13 Stream Not Selected .................................................................................................... 2-28
2.5.14 Analyzer Will Not Power Up (X-Purge) ......................................................................... 2-29
2.6 ELECTRONIC PRESSURE CONTROL TROUBLESHOOTING .......................................... 2-30
2.7 CONTROLLER PROBLEMS ............................................................................................... 2-30
2.7.1 Input Power .................................................................................................................. 2-30
2.7.2 Power Distribution, Standard System ........................................................................... 2-31
2.7.3 Power Distribution, Model 2007 Fuel Sulfur Analyzer ................................................... 3-32
2.7.4 Poor Display Contrast .................................................................................................. 2-33
2.8 ALARMS ............................................................................................................................. 2-34
2.8.1 Sensors Active ............................................................................................................. 2-35
2.8.2 Sensors Held ............................................................................................................... 2-36
2.8.3 Component High .......................................................................................................... 2-36
2.8.4 Component Low ........................................................................................................... 2-36
2.8.5 Clock Error ................................................................................................................... 2-36
2.8.6 TCF Error ..................................................................................................................... 2-37
2.8.7 Post Analysis Error ...................................................................................................... 2-38
2.8.8 Communications Error ................................................................................................. 2-38
2.8.9 Pressure Board ............................................................................................................ 2-40
2.8.10 Temperature Board ...................................................................................................... 2-41
2.8.11 Raw Chromatogram Storage ....................................................................................... 2-43
iv 2000-SVC, C1
Section Title Page
SECTION 3. TEST PROCEDURES
3.1 TP 1: CARRIER, MAKEUP, AND UTILITY GAS SUPPLIES ................................................. 3-1

3.2 TP 2: CARRIER AND MAKEUP GAS FLOW ADJUSTMENTS ............................................ 3-1
3.3 TP 3: SAMPLE VALVE LEAKING/COLUMN FLOODING ..................................................... 3-2
3.4 TP 4: CARRIER OR MAKEUP GAS REGULATOR .............................................................. 3-3
3.5 TP 5: DETECTOR BALANCE .............................................................................................. 3-3
3.6 TP 6: FILAMENT TEST ........................................................................................................ 3-4
3.7 TP 7: TCD ELECTRONICS .................................................................................................. 3-5
3.8 TP 8: COLUMN TRAIN PROBLEMS .................................................................................... 3-6
3.9 TP 9: BASELINE CYCLIC TEMPERATURE CONTROLLER (TCD) ..................................... 3-7
3.10 TP 10: BASELINE CYCLIC CARRIER REGULATOR ........................................................... 3-7
3.11 TP 11: BASELINE CYCLIC FLOW CONTROLLER .............................................................. 3-7
3.12 TP 12: COMMON USAGE OF GASES ................................................................................ 3-8
3.13 TP 13: UTILITY GAS CONTAMINATION PROCEDURE ...................................................... 3-8
3.14 TP 14: BURNER AIR CATALYTIC CLEANUP UNIT ............................................................. 3-8
3.15 TP 15: COAXIAL CABLE ...................................................................................................... 3-8
3.16 TP 16: FID REDUCED SENSITIVITY ................................................................................... 3-9
3.17 TP 17: FID WILL NOT LIGHT ............................................................................................. 3-10
3.18 TP 18: VERIFICATION FID FLAME IS IGNITED ................................................................ 3-11
3.19 TP 19: SAMPLE VALVE ACTUATION AIR .......................................................................... 3-11
3.20 TP 20: DOUBLE SAMPLING .............................................................................................. 3-12
3.21 TP 21: VARIABLE SAMPLE SIZE ...................................................................................... 3-13
3.22 TP 22: OPEN TEMPERATURE SENSOR .......................................................................... 3-14
3.23 TP 23: SHORTED TEMPERATURE SENSOR ................................................................... 3-15
3.24 TP 24: LOSS OF OVEN AIR .............................................................................................. 3-16
3.25 TP 25: ISOTHERMAL OVEN OVERTEMP SENSOR OPEN .............................................. 3-17
3.26 TP 26: ZONE INPUT SENSOR OPEN ............................................................................... 3-18
3.27 TP 27: OPEN OR SHORTED HEATER ............................................................................... 3-18
3.28 TP 28: OPEN FUSE TO AC CONDITIONING BOARD ....................................................... 3-19
3.29 TP 29: FID POLARIZING VOLTAGE TEST ......................................................................... 3-20
3.30 TP 30: “FLAME OUT” LED REMAINS ON AFTER FID FLAME IGNITION ......................... 3-21
3.31 TP 31: CHECKING TEMPERATURE TABLE VALUES ....................................................... 3-23
3.32 TP 32: PLUGGED JET OR BREATHER ............................................................................. 3-28
3.33 TP 33: PEAK DISCRIMINATION ........................................................................................ 3-29
3.34 TP 34: CHECKING METHOD TABLE CONFIGURATION .................................................. 3-30
3.35 TP 35: VENT BACK PRESSURE ....................................................................................... 3-35
3.36 TP 36: PRINTER TEST ...................................................................................................... 3-35
3.37 TP 37: RESIDUAL SAMPLE ............................................................................................... 3-35
3.38 TP 38: TREND OUTPUT .................................................................................................... 3-36
3.39 TP 39: DIGITAL I/O PCB .................................................................................................... 3-37
3.40 TP 40: VISTA WORKSTATION COMMUNICATION TEST .................................................. 3-38
3.41 TP 41: LOW CARRIER PRESSURE .................................................................................. 3-39
3.42 TP 42: LOW SAMPLE FLOW HARDWARE ALARM .......................................................... 3-39
3.43 TP 43: PROGRAMMED TEMPERATURE OVEN COOL DOWN ........................................ 3-40
3.44 TP 44: STREAM SWITCHING ........................................................................................... 3-42
SECTION 4. REPAIR
4.1 REPLACING HEATERS ........................................................................................................ 4-1

4.1.1 Isothermal Temperature Oven Heater ............................................................................ 4-1
2000-SVC, C1 v
Section Title Page
4.1.2 Sample Valve Heater ..................................................................................................... 4-2

4.2 SAMPLE VALVE REPAIR ...................................................................................................... 4-3
4.2.1 Disassembly .................................................................................................................. 4-4
4.2.2 Reassembly Procedure .................................................................................................. 4-5
4.3 COLUMN INSTALLATION OR REPLACEMENT ................................................................... 4-6
4.3.1 Column Removal ........................................................................................................... 4-6
4.3.2 Packed Column Installation ............................................................................................ 4-7
4.3.3 Capillary Column Installation .......................................................................................... 4-7
4.3.4 Cutting Capillary Columns ............................................................................................. 4-8
4.4 FID REPAIR .......................................................................................................................... 4-8
4.4.1 FID Cell Access ............................................................................................................. 4-9
4.4.2 Replacing the Breather ................................................................................................ 4-10
4.4.3 Replacing the Thermocouple Assembly ....................................................................... 4-11
4.4.4 Accessing the Polarizer and Ignitor Detector Elements ................................................ 4-12
4.4.5 Replacing the Polarizer ................................................................................................ 4-12
4.4.6 Replacing the Ignitor Assembly .................................................................................... 4-13
4.4.7 Closing the Detector After Replacing the Polarizer or Ignitor ........................................ 4-14
4.4.8 Cleaning the FID Jet .................................................................................................... 4-15
4.4.9 Cleaning the Collector .................................................................................................. 4-16
4.4.10 Replacing the FID Cable Assembly .............................................................................. 4-16
4.5 FILAMENT TCD REPAIR .................................................................................................... 4-17
4.5.1 T/C Detector Access .................................................................................................... 4-18
4.5.2 Removing the Filaments .............................................................................................. 4-18
4.5.3 Installing the Filaments ................................................................................................ 4-19
4.5.4 Filament Checkout ....................................................................................................... 4-20
4.5.5 Connecting the Filaments ............................................................................................ 4-20
4.5.6 Leak Test ..................................................................................................................... 4-21
4.5.7 Potting the Filaments (CENELEC and CSA only) ......................................................... 4-21
4.6 THERMISTOR TCD REPAIR .............................................................................................. 4-22
4.6.1 T/C Detector Access .................................................................................................... 4-23
4.6.2 Removing the Thermistors ........................................................................................... 4-23
4.6.3 Installing the Thermistors ............................................................................................. 4-24
4.6.4 Thermistor Checkout ................................................................................................... 4-24
4.6.5 Connecting the Thermistors ......................................................................................... 4-25
4.6.6 Leak Check .................................................................................................................. 4-26
4.7 FPD REPAIR ....................................................................................................................... 4-26
4.7.1 Replacing the Photomultiplier Assembly ...................................................................... 4-26
4.7.2 Replacing the Photomultiplier Assembly O-Ring .......................................................... 4-28
4.7.3 Replacing the Burner Block ......................................................................................... 4-28
4.7.4 Replacing the Burner Block O-Rings ........................................................................... 4-29
4.8 REPAIRING METHANIZER/AIR CLEANUP ASSEMBLY .................................................... 4-29
4.8.1 Removing the Methanizer/Air Cleanup Assembly ........................................................ 4-30
4.8.2 Removing the Catalytic Tubes ...................................................................................... 4-32
4.8.3 Installing the Catalytic Tubes ........................................................................................ 4-32
4.8.4 Packing the Housing .................................................................................................... 4-33
4.8.5 Installing the Methanizer/Air Cleanup Assembly .......................................................... 4-33
4.8.6 Air Cleanup Testing ...................................................................................................... 4-34
4.8.7 Air Cleanup Final Preparation ...................................................................................... 4-35
4.9 REPAIRING THE CARRIER GAS PANEL (ANALOG) ......................................................... 4-35
4.9.1 Removing the Carrier Gas Panel ................................................................................. 4-35
4.9.2 Replacing a Regulator ................................................................................................. 4-37
vi 2000-SVC, C1
Section Title Page
4.9.3 Replacing a Gauge ...................................................................................................... 4-37

4.9.4 Installing the Carrier Gas Panel ................................................................................... 4-38
4.10 REPLACING THE ELECTRONIC PRESSURE CONTROL (EPC) PANEL .......................... 4-38
4.10.1 Removing the EPC Panel ............................................................................................ 4-38
4.10.2 Installing the EPC Panel .............................................................................................. 4-39
4.11 CALIBRATING THE ELECTRONIC PRESSURE CONTROLLER ....................................... 4-39
4.12 REPAIRING PURGE AIR PANEL COMPONENTS ............................................................. 4-42
4.12.1 Removing the Purge Air Panel ..................................................................................... 4-42
4.12.2 Replacing a Regulator ................................................................................................. 4-42
4.12.3 Replacing a Gauge ...................................................................................................... 4-42
4.12.4 Installing the Purge Air Panel ....................................................................................... 4-43
4.13 SETTING JUMPERS .......................................................................................................... 4-43
4.13.1 Backplane PCB ............................................................................................................ 4-43
4.13.2 DTC Backplane PCB ................................................................................................... 4-44
4.13.3 DTC Zone PCB ............................................................................................................ 4-46
4.13.4 VAC Conditioning PCB ................................................................................................. 4-46
4.13.5 Front Panel PCB .......................................................................................................... 4-47
4.13.6 FID Amplifier PCB ........................................................................................................ 4-47
4.13.7 Filament TCD Amplifier PCB ........................................................................................ 4-48
4.13.8 Thermistor TCD Amplifier Interface PCB ...................................................................... 4-49
4.13.9 EPC Multibus PCB ....................................................................................................... 4-50
4.13.10 EPC Control PCB ........................................................................................................ 4-51
4.13.11 Chroma I/O PCB .......................................................................................................... 4-51
4.13.12 Power Supply PCB ....................................................................................................... 4-52
4.14 VALCO DIAPHRAGM VALVE REPAIR ................................................................................ 4-52
4.14.1 Removing the Valve ..................................................................................................... 4-52
4.14.2 Repairing the Valve ...................................................................................................... 4-53
4.14.3 Reinstalling the Valve ................................................................................................... 4-54
4.15 VistaNET DEBUG MONITOR ............................................................................................. 4-54
4.15.1 Purpose ....................................................................................................................... 4-54
4.15.2 Making the Connections .............................................................................................. 4-54
4.15.3 Startup ......................................................................................................................... 4-55
4.15.4 Information Display ...................................................................................................... 4-56
4.15.5 Menu Items .................................................................................................................. 4-56
4.15.6 Statistical Display ......................................................................................................... 4-59
SECTION 5. REPLACEMENT PARTS
5.1 ORDERING INFORMATION ................................................................................................. 5-1

5.2 GC CONTROLLER ............................................................................................................... 5-2
5.2.1 Back of Front Panel ........................................................................................................ 5-2
5.2.2 GCC Chassis ................................................................................................................. 5-2
5.2.3 Card Cage ..................................................................................................................... 5-3
5.2.4 Components on Right Side Door ................................................................................... 5-4
5.3 PURGE AIR PANEL .............................................................................................................. 5-4
5.4 ELECTRONIC PRESSURE CONTROL PANEL (DIGITAL) ................................................... 5-5
5.5 CARRIER GAS PANEL ......................................................................................................... 5-5
5.6 ISOTHERMAL OVEN COMPONENTS ................................................................................. 5-6
5.6.1 Liquid Sample Valve ....................................................................................................... 5-7
5.6.2 Flame Ionization Detector (FID) ..................................................................................... 5-7
5.6.3 Filament Type Thermal Conductivity Detector ................................................................ 5-8
2000-SVC, C1 vii
Section Title Page
5.6.4 Thermistor Type Thermal Conductivity Detector ............................................................ 5-8

5.6.5 M2CP Valve ................................................................................................................... 5-9
5.6.6 Model 781 Methanizer/Air Clean Up System .................................................................. 5-9
5.6.7 Model 805 Methanizer/Air Clean Up System ................................................................ 5-10
5.6.8 Valco Diaphragm Valve ................................................................................................ 5-10
5.7 FLAME PHOTOMETRIC DETECTOR (FPD) ...................................................................... 5-11
5.7.1 Transformer and Photomultiplier Components ............................................................. 5-11
5.7.2 Burner Block Components ........................................................................................... 5-12
5.8 TEMPERATURE PROGRAMMED OVEN ........................................................................... 5-12
5.8.1 Flame Ionization Detector with Heater Blcok ............................................................... 5-13
5.8.2 Filament Type TC Detector with Heater Block .............................................................. 5-14
SECTION 6. DRAWINGS
6.1 USE OF DRAWINGS ............................................................................................................ 6-1

6.2 LIST OF DRAWINGS AND DIAGRAMS ................................................................................ 6-1
viii 2000-SVC, C1
LIST OF ILLUSTRATIONS
Figure Title Page
1-1 Typical Vista II Series Gas Chromatograph ........................................................................... 1-1

1-2 Typical Nameplate ................................................................................................................. 1-2
1-3 Background Screen ............................................................................................................... 1-3
1-4 EMC Certification Installation Criteria .................................................................................... 1-5
1-5 Vista II GC with Flame Photometric Detector ........................................................................ 1-6
2-1 Example of Baseline Offset ................................................................................................... 2-1

2-2 Cyclic Short Term Drift .......................................................................................................... 2-2
2-3 Continuous Upward Drift ....................................................................................................... 2-3
2-4 Baseline Noise ...................................................................................................................... 2-3
2-5 Baseline Offset ...................................................................................................................... 2-4
2-6 Baseline Random Noise ........................................................................................................ 2-4
2-7 No Peaks .............................................................................................................................. 2-5
2-8 Double Sampling ................................................................................................................... 2-7
2-9 Mystery Peaks ...................................................................................................................... 2-7
2-10 Variable Sample Size ............................................................................................................ 2-8
2-11 Variable Retention Time ........................................................................................................ 2-8
2-12 Peak Inversion....................................................................................................................... 2-9
2-13 Chromatogram Off Scale .................................................................................................... 2-10
2-14 Backplane Board Showing Jumper Connections ................................................................. 2-12
2-15 EPC Pressure Control Assembly ........................................................................................ 2-30
2-16 Motherboard Layout ............................................................................................................ 2-30
2-17 Input Power Distribution (Standard System) ........................................................................ 2-31
2-18 Input Power Distribution (Model 2007) ................................................................................. 2-32
2-19 Location of Contrast Adjustment ......................................................................................... 2-33
2-20 Alarms Screen .................................................................................................................... 2-34
3-1 DTC Backplane PCB ........................................................................................................... 3-16

3-2 FID Amplifier Showing C6 Location ..................................................................................... 3-22
3-3 Background Screen ............................................................................................................. 3-23
3-4 Manual Control Mode Screen .............................................................................................. 3-24
3-5 Pressure and Temperature Control Screen ......................................................................... 3-24
3-6 Temperature Configuration Table Screen ............................................................................ 3-25
3-7 Manual Temperature Control Mode Screen ......................................................................... 3-26
3-8 Commands Screen ............................................................................................................. 3-27
3-9 Method Table Screen .......................................................................................................... 3-27
3-10 Temperature Control Screen ............................................................................................... 3-28
3-11 Background Screen ............................................................................................................. 3-30
3-12 Commands Screen ............................................................................................................. 3-31
3-13 Method Table Screen .......................................................................................................... 3-31
4-1 Analyzer Oven Compartment ................................................................................................ 4-1

4-2 Liquid Sample Valve .............................................................................................................. 4-3
4-3 Flame Ionization Detector ..................................................................................................... 4-9
4-4 FID Cable Assembly ........................................................................................................... 4-17
4-5 Filament TC Detector .......................................................................................................... 4-17
4-6 Thermistor TC Detector ....................................................................................................... 4-22
4-7 Photomultiplier Assembly End View .................................................................................... 4-27
4-8 Photomultiplier Tube Showing O-Ring ................................................................................. 4-28
4-9 Burner Block ....................................................................................................................... 4-28
2000-SVC, C1 ix
LIST OF ILLUSTRATIONS (continued)
Figure Title Page
4-10 Burner Block, Showing O-Rings .......................................................................................... 4-29

4-11 Methanizer/Air Cleanup Assembly ...................................................................................... 4-31
4-12 Carrier Gas Panel from Right Side ...................................................................................... 4-35
4-13 Front Right Side of Oven ..................................................................................................... 4-36
4-14 Control Housing Access Area, Right Side of Analyzer ........................................................ 4-36
4-15 EPC Panel Cable Lock Nut ................................................................................................. 4-39
4-16 Location of Zone Fittings ..................................................................................................... 4-40
4-17 Pressure and Temperature Control Screen ......................................................................... 4-40
4-18 Manual Pressure Control Mode Screen .............................................................................. 4-41
4-19 Purge Air Panel Fasteners .................................................................................................. 4-42
4-20 Backplane PCB Jumper Locations ...................................................................................... 4-43
4-21 DTC Backplane PCB Switch and Jumper Locations ........................................................... 4-45
4-22 DTC Zone Board Jumper Location ...................................................................................... 4-46
4-23 VAC Conditioning Board Jumper Locations ......................................................................... 4-47
4-24 Front Panel PCB Adjustment and Jumper Locations ........................................................... 4-47
4-25 FID Amplifier PCB Jumper Locations .................................................................................. 4-48
4-26 Filament TCD Amplifier PCB Jumper Locations .................................................................. 4-48
4-27 Thermistor Amplifier Interface PCB Jumper Locations ........................................................ 4-49
4-28 EPC Multibus PCB Jumper Location ................................................................................... 4-50
4-29 EPC Control PCB Jumper Location ..................................................................................... 4-51
4-30 Chroma I/O PCB Jumpers .................................................................................................. 4-51
4-31 Power Supply PCB Jumpers ............................................................................................... 4-52
4-32 Valco 10-Port Diaphragm Valve ........................................................................................... 4-52
4-33 Cap Orientation ................................................................................................................... 4-53
4-34 Exploded View of Valco Diaphragm Valve ............................................................................ 4-53
4-35 Communications Board Debug Connection ......................................................................... 4-55
4-36 Main Menu .......................................................................................................................... 4-55
4-37 Typical Dump Memory Screen ............................................................................................ 4-56
4-38 Typical Show Registers Screen ........................................................................................... 4-57
4-39 Typical Dump History Screen .............................................................................................. 4-58
5-1 Back of Front Panel ............................................................................................................... 5-2

5-2 Chassis Components ............................................................................................................ 5-3
5-3 Card Cage Components ....................................................................................................... 5-3
5-4 Right Side Door of GCC ........................................................................................................ 5-4
5-5 Purge Air Panel ..................................................................................................................... 5-4
5-6 Electronic Pressure Control Panel ......................................................................................... 5-5
5-7 Carrier Gas Panel ................................................................................................................. 5-5
5-8 Isothermal Oven Components............................................................................................... 5-6
5-9 Liquid Sample Valve .............................................................................................................. 5-7
5-10 FID Components ................................................................................................................... 5-7
5-11 Filament Type TCD Components ........................................................................................... 5-8
5-12 Thermistor Type TCD Components ....................................................................................... 5-8
5-13 M2CP Valve Components ..................................................................................................... 5-9
5-14 Model 781 Methanizer/Air Cleanup System .......................................................................... 5-9
5-15 Model 805 Methanizer/Air Cleanup System ........................................................................ 5-10
5-16 Valco Diaphragm Valve ....................................................................................................... 5-10
5-17 Vista II Showing FPD Components ..................................................................................... 5-11
5-18 Burner Block Components .................................................................................................. 5-12
5-19 Temperature Programmed Oven ......................................................................................... 5-13
x 2000-SVC, C1
LIST OF ILLUSTRATIONS (continued)
Figure Title Page
5-20 FID with Heater Block ......................................................................................................... 5-13

5-21 Filament Type TCD with Heater Block ................................................................................. 5-14
6-1 Overall System Block Diagram .............................................................................................. 6-2

6-2 Analytical Section Block Diagram .......................................................................................... 6-3
6-3 Control Section Block Diagram .............................................................................................. 6-4
2000-SVC, C1 xi

P.O. Box 831
Lewisburg, WV 24901

Fax (304) 645-4236

Fax (304) 647-1837

xii 2000-SVC, C1
GLOSSARY
A/D converter device that converts an analog signal to a digital value
analyzer Vista II Series gas chromatograph
ASCII American Standard Code for Information Interchange
Auto Zero procedure bringing the detector signal as close to electrical zero as
possible
baseline analog reference point from which peak height or peak area is
measured on a chromatogram; the detector signal level at which no
components are detected
benchmark sample known to be a definite concentration; used to compare an

analyzer's present performance to its past performance
calibration run analysis that involves injecting a standard sample consisting of specific
components whose concentrations and elution sequences are known
CE Mark certification process and marking which denote that analyzer complies
with applicable new approach directives within the European Union
CENELEC Comite’ Europeen de Normalisation Electrotechnique; the European

electronics organization that determines standards and testing to ensure
safe operation of electrical instrumentation in hazardous areas
Chroma I/O Chromatographic Input/Output PCB; provides the interface between the
analog domain of the gas chromatographic analyzer and the digital
domain of the controller
components peaks, parameters or ratios that are being measured or calculated from
a chromatographic analysis
concentration the amount of a specific substance within a sample
CPU Central Processing Unit; controls analyzer, collects and manipulates

data
cursor keys front panel control keys marked with directional arrows
DCS Distributed Control System
Data Package application-specific engineering information (such as component tables,

function tables, chromatograms, and temperature, pressure and flow
settings) shipped with each instrument
default values assigned parameters the controller will assume unless the operator
redefines the values
detector random electronic signals picked up by a sensing device in the absence

background of valid measurable input (see “noise”)
noise
2000-SVC, C1 G-1
Digital I/O Digital Input/Output PCB; enables the use of additional stream valves
and/or alarm sensors
DIP switch PCB switch that is used to set values through hardware instead of
software
drift variances from the baseline or the norm; generally associated with
uncontrolled or unwanted changes in pressure or temperature
DTC Digital Temperature Controller
EIA Electronic Instrument Association
elution time amount of time from the start of analysis that it takes to fully detect a
peak
Engineering Data see Data Package

Package
EPC Electronic Pressure Control (digital pressure control)
EPROM Erasable, Programmable, Read Only Memory; program software that

can be erased and reprogrammed a limited number of times
E2PROM Electrically Erasable Programmable Read Only Memory; used for the
safe storage of tables (sometimes written E2PROM or EEPROM)
FID Flame Ionization Detector
field highlighted area on CRT screen where data entry and modification are
allowed; data entry is ended (terminated) by filling the field with
characters or by pressing ENTER or any soft key or cursor key
forced gating technique of chromatographic data collection in which the controller

collects the detector signal during a specified period of time (i.e., gate
ON to gate OFF)
Gate On/Off time-coded function command which turns on and off the collection of
data from the detector
GC Gas Chromatagraph
GCC Gas Chromatographic Controller
Help key front panel control key used to access information pertaining to the
current screen display content
highway address numbers from one to 32 that uniquely identify remote GCC’s
HL High Limits, entered into a component table; when the component's

measured and calculated value exceeds the HL value, an alarm is
generated
host link serial communications link which allows the transmitting of analysis
results to the host computer
G-2 2000-SVC, C1
integer whole number that does not contain decimal points
I/O Input/Output
LCD Liquid Crystal Display
LED Light Emitting Diode
LL Low Limits, entered into a component table; when the component's

measured and calculated value falls below the LL value, an alarm is
generated
LO COMM Local Communication Module PCB; optional PCB in the GCC that
makes the analyzer communications network possible (sometimes
written LOCOM)
LSV Liquid Sample Valve; also called MLIV
method table operator-entered data specifying the name, retention time, key
designation, response factor, low and high limits, and calibration
concentrations of the various elements of an analysis; also specifies
when, how, and under what conditions the method of data collection is
to proceed
microprocessor semiconductor circuit containing the central processing unit functions
noise any unwanted signal superimposed upon a useful signal which tends to
obscure the desired information
numeric field field that accepts number entries
“Panic” key nickname for the F1 soft key; pressing this key will return the screen
display to the Background screen without changing any current values in
memory; may need to be pressed several times consecutively,
depending on where the current screen is in relation to the Background
screen
PCB Printed Circuit Board
peak area method of measurement in which total peak area beneath the peak
envelope is used to calculate the concentration
peak height method of measurement in which peak maximum is used to calculate

peak concentration
Post Analysis portion of the controller program that calculates the value for the
routine components from the collected data, after completion of the analysis
Postan abbreviation for the post analysis routine
PROM Programmable Read Only Memory
PSFC Process Supercritical Fluid Analyzer
psia pounds per square inch absolute
2000-SVC, C1 G-3
psig pounds per square inch gauge
RAM Random Access Memory; contains current operating conditions
ROM Read Only Memory; contains the executable program
redundant means by which a remote GCC can be connected to one or two central
highways devices by two separate, but equivalent, data highways
resolution smallest change that can be distinguished by an A/D converter or

produced by an A/D converter
response factor numeric value determined by calibration; used in calculating

concentration
retention time time, from start of analysis, that a peak maximum elutes from the
column
RFI Radio Frequency Interference
RS-232 voltage based electrical communications protocol, short range; common

term EIA RS-232 serial data interchange format
RVP Reid Vapor Pressure
selection field horizontal screen display; Right and Left cursor keys move through
options displayed on screen; select a field by exiting it with Up or Down
cursor key
slope detect method of chromatographic data collection in which controller

automatically ascertains the presence of a peak and collects data
accordingly
S.O. Sales Order (Customer Order)
Soft Keys four front panel control keys directly under the screen, (F1, F2, F3, F4)
stream purging procedure allowing the next stream sample to be analyzed to flow
continuously through the sample loop of the injection valve in
preparation for the next sample injection and analysis cycle
stream step TCF command that permits the next stream sample to purge the sample
loop during the remainder of the present cycle
TCF Time-Coded Function; entry in method table that defines what action is
to be performed (e.g. Valve ON) at what time in the analysis
text field field that accepts data entered with all non-terminating keys
trend output analog signal related to concentration of specified component
V/L Vapor/Liquid ratio
VN VistaNET; analytical network that links analyzers, DCS, and support

people using the data
G-4 2000-SVC, C1
VNSA VistaNET Name Service Administrator; PC software that serves as the
address book for the VistaNET
VWS Vista Workstation
watchdog timer hardware circuit alarm that indicates when the software fails to cycle
through its entire task structure within a set period of time
2000-SVC, C1 G-5
CAUTION
Beginning in January 1996, all analyzers bearing the CE Mark imprint on their nameplates have
EMC shielding that meets the requirements for CE Mark. When working with one of these analyz-
ers, you must handle it carefully to avoid damaging the shielding. If any shielding becomes dam-
aged or is removed from the analyzer, new shielding must be installed to maintain the CE mark
certification.
ABB Process Analytics has designed “Total Envelope Protection” into its analyzers. The basic
enclosure itself (which is fabricated from sheet steel with all seams welded), when properly
“grounded” or “earthed”, becomes the first barrier of protection from emissions that could radiate
from the unit. In addition, the enclosure also provides a high level of immunity from electromag-
netic interference (EMI) which could affect the performance of the analyzer.
In order for the analyzers produced by ABB Process Analytics to maintain their tested integrity, the
installation methods employed are of equal importance. The grounded enclosure produces a
Faraday Shield around the electronic components, detection systems, and other sensitive compo-
nents which could generate EMI or be affected by EMI. An extension of this Faraday shield must
be carried throughout the installation scheme.
G-6 2000-SVC, C1
SECTION 1. INTRODUCTION
1.1 EQUIPMENT DESCRIPTION
This manual, which provides troubleshooting and repair information, applies to all
versions of the Vista II Series Gas Chromatograph. For complete information on the
analyzer, use this manual together with “Operator's Manual for the Vista II Series
Gas Chromatograph,” manual number 2000-OPS (referred to in this manual as the
Operator's Manual).
The Vista II Series Gas Chromatograph separates and measures the individual
components of gas or liquid samples. It automatically samples and analyzes
process streams, using the analyzer's Gas Chromatographic Controller (GCC) to
control analytical functions.
The analyzer (see Figure 1-1) may be mounted on a wall, a rack, or a floor stand. It
includes an insulated, air-heated Oven Compartment, a Gas Chromatographic
Controller (GCC), a Purge Air Panel, and a Pressure Control Panel.
Gas
Chromatographic
Controller
(GCC)
HARD
FAUL
WARE
A B C DE F G H I J
T
K L MN OP Q R S T
SOFT
FAUL U VWX Y Z +-SPA
CE
BK
SP SHI
FT
: ; . , * / < > ( )
WARE
T
1 2 3 4 5 6 7 8 9 0
F F F F FLAME
EN
TE
RECO
0-
RDER
OUT HE 10 V
1 2 3 4 R LP
Pressure
Purge Air Control
Panel Panel
Oven
Compartment
Nameplate
(on side
or front)
Figure 1-1. TYPICAL VISTA II SERIES GAS CHROMATOGRAPH
2000-SVC, C1 1-1
The Oven Compartment houses an isothermal oven which contains the analytical
columns, the detectors, and the sample valves.
The GCC contains the card cage with PCBs, the Digital Temperature Controller
(DTC), and one or more of the following detector amplifiers: flame ionization (FID),
thermal conductivity (TCD), and flame photometric (FPD). The front panel has a
liquid crystal display (LCD), keyboard, and controller board. The FPD assembly
itself is located in a special cabinet mounted on the left side of the analyzer (see
Subsection 1.5).
Below the GCC are the Purge Air Panel and the Pressure Control Panel. The Purge
Air Panel contains the heater air and purge air gauges and regulators. The
Pressure Control Panel contains the Electronic Pressure Controller (EPC) or a
group of mechanical regulators and gauges. When the EPC is installed the
Pressure Control Panel has a blank front panel.
Each analyzer has a temperature code (T-Rating) listed on the nameplate. This T-
Rating indicates the temperature classification of the area in which the analyzer
has been designed to operate. T-Ratings and area classifications for analyzer
locations are determined and supplied by the customer.
1.2 EQUIPMENT IDENTIFICATION
When you communicate with ABB Process Analytics about this analyzer, please
identify the hardware and software configurations, as shown in the following
paragraphs.
1.2.1 Hardware Configuration Identification
The nameplate, located on the right side of the Oven Compartment, lists the
hardware configuration information (see Figures 1-1 and 1-2).
ABB PROCESS ANALYTICS INC.

LEWISBURG WEST VIRGINIA 24901
Made In U.S.A. Model No.
Sales
Order No.
SERIES 2000 MODEL
S.O. NO.
CLASS I: GROUP : DIV.
TEMPERATURE CODE:
T-Rating
Figure 1-2. TYPICAL NAMEPLATE
The hardware configuration consists of the model number, sales order number, and
T-Rating.
1.2.2 Software Configuration Identification
The software configuration appears at the top of the Background screen just below
“Process Analytics GCC.” In Figure 1-3 the software configuration is 2020-9A.
1-2 2000-SVC, C1
** B A C K G R O U N D **
Process Analytics GCC Remote 01
2020-9A (C) 1997
**************
*** Alarm *** 16-Jan-1997 THU 08:16:01
**************
Analysis Time :00114 Peaks Found : 00
Cycle Time :00000 State : Idle
Current Stream :01 Key Component:

Purging Stream :01 none
entered
Exit Manual Cur Report,

to Control Basic I/O & Alarms
Commands Options
F1 F2 F3 F4
Figure 1-3. BACKGROUND SCREEN
1.3 AIR PURGE SYSTEMS
If the analyzer will be in a Class I hazardous location, an air purging system must be
installed to reduce the risk of explosion. Class I locations are those in which
flammable gases or vapors are or may be present in the air in quantities sufficient to
produce explosive or ignitable mixtures.
1.4 EMC CERTIFICATION
1.4.1 Introduction
The EMC directive (one of the new approach directives required by CE Mark) refers
to both electromagnetic “emissions” and electromagnetic “immunity.”
Electromagnetic emissions from electronic devices cause electromagnetic
interference (EMI) to the radio frequency spectrum which can disrupt emergency
communications, radio and television broadcasts, and interfere with the operation of
other electronically-controlled devices. Electromagnetic immunity refers to an
electronic device’s ability to handle interference from a wide variety of sources, such
as radiated, conducted, surges, etc.
All process analyzers manufactured by ABB Process Analytics, intended for

shipment into the European Union, have been tested and certified as complying
with the EMC directive, and further marked with the “CE Mark.”
1.4.2 Design Concepts
It is the intent of Process Analytics to design into its analyzers the concept of “Total
Envelope Protection.” The basic enclosure itself, which is fabricated from sheet
2000-SVC, C1 1-3
steel with all seams welded, when properly “grounded” or “earthed,” becomes the
protection for emissions that could radiate from the unit. In addition, the enclosure
also provides a high level of immunity from electromagnetic interference (EMI)
which could affect the performance of the analyzer.
In order for the analyzers produced by Process Analytics to maintain their tested
integrity, the installation methods employed are of equal importance. The grounded
enclosure produces a “Faraday Shield” around the electronic components, detection
systems and other sensitive components which could generate EMI or be affected
by EMI. An extension of this Faraday shield must be maintained throughout the
installation scheme.
1.4.3 Zone or Area Change in Installations
When wiring from an Analyzer changes from one zone to another, the concept of
the “Total Envelope” or Faraday Shield must be maintained. Provisions must be
made for terminating the cable in the “zero-length shielding” fashion as shown in
Details A-A and C-C of Figure 1-4.
1.4.4 Cable Installation
In order to extend the Faraday shield beyond the analyzer, it is necessary to install
all power wiring, signal/control wiring and communication wiring in rigid metal
conduit or by using braided armored cable/braided armored shielded cable (see
Detail C-C of Figure 1-4). The wiring system employed must be grounded (earthed)
to the case at the point of entry of the analyzer (zero-length shielding) and to the
case at the point of entry of the equipment on the other end (zero-length shielding).
All entry connectors, Myers Scru-tite® hubs, conduit bushings, cable glands, etc.,
must make metal to metal contact with the analyzer’s enclosure. In addition, the
grounding at the point of entry, proper routing and termination of the shield and/or
drain wire are also important.
1.4.5 Junction Box and Enclosure Installation
Where wiring must be terminated in a junction box or similar type of enclosure, the
enclosure must be metallic and properly grounded (earthed) as shown in Details A-
A and B-B of Figure 1-4. The conduits/cables must be grounded at the point of
entry, and wiring practices continued in the same manner as noted above in
paragraph 1.4.3.
1.4.6 Utility Services
All utility services connected to the analyzer (instrument air, carrier gas, etc.) as well
as sample inlets/vents shall be grounded at the point of entry into the envelope of
the analyzer. For the most part these connections will be provided in this manner at
the factory; however, if additional connections are made at time of installation, this
practice must be followed.
1.4.7 Operating Conditions
In normal operation the analyzer has its doors and access covers closed. Any
openings could present a safety hazard, as well as provide an avenue for EMI into
or out of the analyzer.
1-4 2000-SVC, C1
2000-SVC, C1
ZONE 1 AREA PHYSICAL BARRIER ZONE 2 OR NON-HAZARDOUS AREA

SEE DETAIL "B-B"
ALARM, SIGNAL OR HIGHWAY
WIRING SHIELDED IN ALARM, SIGNAL OR HIGHWAY
BRAIDED ARMOR CABLE OR WIRING (SHIELDED) ON
SHIELDED CABLE IN BRAIDED ARMORED CABLE
RIGID METAL CONDUIT OR SHIELDED CABLE IN
RIGID METAL CONDUIT
Figure 1-4. EMC CERTIFICATION INSTALLATION CRITERIA
MODEL 3200 SERIES

APPROVED APPROVED Ex e GLAND
GLAND OR GLAND OR
APPROVED INCREASED
SAFETY JUNCTION BOX OR OTHER CONTROLLER OR
ANALYZER STOPPING
BOX
STOPPING
BOX
OR OTHER TYPE
"METAL" ENCLOSURE
APPROVED
GLAND
MODEL 3250 VISTA
WORKSTATION
SHIELD
TERMINATED IN
ARMOR TERMINATED "ZERO-LENGTH"
IN "ZERO-LENGTH" FASHION
FASHION SEE DETAIL "C-C"
SEE DETAIL "C-C"
DETAIL "A-A"
ADAPTER (OPTIONAL) APPROVED INSTRUMENT CABLE (SHIELDED) ENCLOSURE

TERMINATED IN "ZERO-LENGTH" SHIELD (STEEL)
FASHION
ARMORED CABLE (STEEL REDUCER,

WIRE BRAID) PLUS 3/4-NPT x M20
COLLECTIVE SHIELD
TERMINATED IN "E1Xe/E1X" CABLE M20 ADAPTER LOCKNUT, HUB
"ZERO-LENGTH" SHIELD GLAND OR OTHER NUT, CAPTIVE
APPROVED GLAND INNER SHEATH
FASHION AS SHOWN IN NUT, ARMOR
DETAIL "C-C" (MUST GROUND BRAIDED SHIE
SHIELD IN A NUT, SEALING
"ZERO-LENGTH" OUTER SHEATH DRAI
FASHION) (OPT
APPROVED INCREASED
SAFETY JUNCTION BOX BRAIDED INSULAT
OR OTHER TYPE ARMORED CONDUC
"METAL" ENCLOSURE CABLE WASHER,
THRUST INSULATOR
SEAL,
"E1FX" (TYPE Ex d) GLAND FOIL SHIEL
OUTER SHEATH
SEAL, INNER
FERRULE SHEATH
RIGID CONDUIT, PIPE OR OTHER
APPROVED BARRIER FEED-THRU STEEL WIRE BRAID IS SCREW-TITE HUB
APPROVED FITTING GROUNDED (EARTHED)
TO THE "E1FX" (Ex d) BRAIDED SHIELD OR OPTIONAL D
METAL-TO-METAL
GLAND AT POINT-OF-ENTRY SHALL BE PROPERLY TERMINATE
CONTACT BETWEEN HUB
ZONE 1 AREA GENERAL PURPOSE OR FORMING A "ZERO-LENGTH" ANALYZER AT THE PROPER TERM
AND STEEL ENCLOSURE
NON-HAZARDOUS AREA EMI SHIELD OR IN A METAL ELECTRICAL JUNC
OR ENCLOSURE. LENGTH OF EXP
PHYSICAL BARRIER SHIELD OR DRAIN WIRE SHALL BE
DETAIL "C-C" AS SHORT AS POSSIBLE.
DETAIL "B-B"
E1FX (Ex d) GLAND ASSEMBLY/CABLE ENTRY
1-5
1.5 VISTA II WITH FLAME PHOTOMETRIC DETECTOR
When a Vista II Series Gas Chromatograph has a flame photometric detector

(FPD), a housing attached to the left side of the analyzer contains the detector the
Electrometer PCB, and the high-voltage transformer that provides the spark to ignite
the FPD (see Figure 1-5).
Transformer
0 0
FPD Electrometer
Detector
Figure 1-5. VISTA II GC WITH FLAME PHOTOMETRIC DETECTOR
1.6 SYSTEM VARIATIONS
This manual supports the 2000 basic analyzer. An appendix to the Operator's
Manual presents service material for special applications such as 2002 (simulated
distillation), 2003 (PNA), 2005 (temperature programmed GC), 2007 (fuel sulfur),
2008 (olefins), and 2030 (sparging sample conditioning system).
1-6 2000-SVC, C1
SECTION 2. TROUBLESHOOTING
2.1 TROUBLESHOOTING GUIDELINES
This section provides troubleshooting information by category. Included in this

information are symptoms, causes, and suggested tests for further fault isolation.
These tests are described in Section 3, listed by Test Procedure (TP) number. The
major troubleshooting categories are:
baseline problems
analysis problems
temperature control problems
output problems
2.2 BASELINE PROBLEMS
2.2.1 Baseline or Signal Offset (TCD)
Symptom: Baseline (detector signal) is continually offset to the positive or the

negative with no short term drift up or down scale (see Figure 2-1). This is indicated
on the graphic display, output recorder, and the detector signal.
AMOUNT OF
OFFSET
BASELINE BASELINE
TIME TIME
NORMAL OFFSET
Figure 2-1. EXAMPLE OF BASELINE OFFSET
Background: A thermal conductivity detector (TCD) contains a measurement and

reference filament detector configured in an electronic bridge circuit. With no
sample eluting the column, both measurement and reference filaments are
responding to carrier gas only. Therefore, the resistance of both the measurement
and reference filaments should be within one ohm of one another (cold) and the
detector in balance.
Causes:
1. Temperatures incorrect. Perform Test Procedure 31 (Checking Temperature

Table Values), steps 1 to 3 , and 8 to 12 to verify or change temperature
settings.
2. No carrier gases applied to analyzer. Perform Test Procedure 1 (Carrier,

Makeup, and Utility Gas Supplies).
3. Large difference in reference and column carrier flow rate (example: reference
1 cc/min, column 20 cc/min). Perform Test Procedure 2 (Carrier and Makeup
Gas Flow Adjustments).
2000-SVC, C1 2-1
4. Column broken or connection in column train disconnected, restricted or
leaking. Perform Test Procedure 1 (Carrier, Makeup, and Utility Gas Supplies)
and Test Procedure 2 (Carrier and Makeup Gas Flow Adjustments). If there is
no carrier gas flow or the carrier gas flow is restricted, perform Test Procedure
8 (Column Train Problems).
5. Defective carrier regulator. Perform Test Procedure 1 (Carrier, Makeup, and

Utility Gas Supplies), Test Procedure 2 (Carrier and Makeup Gas Flow
Adjustments), and Test Procedure 4 (Carrier or Makeup Gas Regulator), as
applicable.
6. Column flooded with liquid sample. Perform Test Procedure 3 (Sample Valve
Leaking/Column Flooding).
7. Detector balance adjustment needed. Perform Test Procedure 5 (Detector

Balance).
8. A continuous presence of sample at the detector due to sample valve leakage.

Perform Test Procedure 3 (Sample Valve Leaking/Column Flooding).
9. Filament failure. Perform Test Procedure 6 (Filament Test).
10. Electronics failure in the TC circuits. Perform Test Procedure 7 (TCD

Electronics).
2.2.2 Cyclic Short Term Drift
Symptom: Baseline (detector signal) is experienceing a cyclic short term drift (see
Figure 2-2) indicated by detector signal, graphics display, or strip chart recorder (if
used). If cyclic behavior is only present on strip chart recorder, verify recorder is
functioning properly and that the recorder connecting wires are properly shielded.
Ensure shield is connected to ground at only one end.
BASELINE BASELINE
TIME TIME
NORMAL CYCLIC DRIFT
Figure 2-2. CYCLIC SHORT TERM DRIFT
At the extreme, the signal may indicate a cyclic behavior with the period of each
cycle ranging from a few seconds to several minutes.
Causes:
1. Short term drift, especially cyclic operation, could be due to temperature out of
control at the TC detector or isothermal oven, “dirty” carrier, or defective flow
controller. Perform Test Procedure 31 (Checking Temperature Table Values),
2-2 2000-SVC, C1
steps 1 to 3, 8 and 9; Test Procedure 9 (Baseline Cyclic Temperature
Controller); Test Procedure 10 (Baseline Cyclic Carrier Regulator); or Test
Procedure 11 (Baseline Cyclic Flow Controller), as applicable.
2. Another possible cause is cell vent back pressure changing. Disconnect vents
to check. Perform Test Procedure 35 (Vent Back Pressure).
2.2.3 Continuous Upward or Downward Drift
Symptom: Baseline (detector signal) is slowly drifting upward or downward (see

Figure 2-3) as indicated by the detector signal, graphics display, or strip chart
recorder (if used).
BASELINE BASELINE
TIME TIME
NORMAL UPWARD DRIFT
Figure 2-3. CONTINUOUS UPWARD DRIFT
Cause: This drift characteristic is generally related to detector response. Most

common causes are temperature zone temperature drift, column flooding or
contamination by a sample containing heavy hydrocarbons, leaking sample valve.
Temperature zone drift normally occurs during temperature zone warm up. Column
bleed is less pronounced in capillary columns than packed columns.
Perform Test Procedure 7 (TCD Electronics); Test Procedure 3 (Sample Valve

Leaking/Column Flooding); or Test Procedure 31 (Checking Temperature Table
Values), steps 1 to 3, 8, and 9.
Another possible cause could be detector filament deterioration.
2.2.4 Baseline Continuous Noise
Symptom: Baseline (detector signal) with no sample injection appears as noise

similar in appearance to “grass” on a two dimensional drawing on the graphics
display or strip chart recorder (if used), as shown in Figure 2-4. If it is present only
on the strip chart recorder, verify the recorder is functioning properly and that the
recorder connecting wires are properly shielded. Ensure recorder wire shield is
connected to ground at only one end.
NORMAL NOISE
Figure 2-4. BASELINE NOISE
2000-SVC, C1 2-3
Cause: Baseline or detector noise can result from contaminated carrier, makeup
gas, tubing or regulators. This type of contamination is much less pronounced with
a TCD than for an FID. Other causes include defective filaments (TCD), detector
wiring, or electrical noise in the detector electronics or power supplies.
Perform Test Procedure 12 (Common Usage of Gases); Test Procedure13 (Utility

Gas Contamination Procedure); Test Procedure 14 (Burner Air Catalytic Cleanup
Unit), Test Procedure 7 (TCD Electronics), and Test Procedure 15 (Coaxial Cable),
as applicable.
2.2.5 Baseline or Signal Offset—Flame Ignited (FID)
Symptom: Baseline (detector signal) is continually offset to the positive or the

negative with no short term drift up or down scale (see Figure 2-5). This is indicated
on the output recorder.
AMOUNT OF
OFFSET
BASELINE BASELINE
TIME TIME
NORMAL OFFSET
Figure 2-5. BASELINE OFFSET
Cause: Baseline offset problems in an FID can be caused by the following:
1. Incorrect temperatures. Perform Test Procedure 31 (Checking Temperature

Table Values), steps 1 to 3, 8, and 9. Inspect temperature settings and adjust if
necessary.
2. Column flooded with liquid sample. Perform Test Procedure 3 (Sample Valve
Leaking/Column Flooding).
3. Detector balance adjustment needed. Perform Test Procedure 5 (Detector

Balance).
4. A continuous presence of sample at the detector due to sample valve leakage.

Perform Test Procedure 3 (Sample Valve Leaking/Column Flooding).
5. Electronics circuit failure. Replace FID Amplifier Assembly.
2.2.6 Baseline Signal Random Baseline Noise—Flame Ignited (FID)
Symptom: Baseline characterized by random noise and or spikes (see Figure 2-6).
NORMAL NOISE
Figure 2-6. BASELINE RANDOM NOISE
2-4 2000-SVC, C1
Cause: FID noise is generally the result of electrical noise or contamination.
1. Electrical noise is usually isolated to a defective FID amplifier, defective coaxial

cable or faulty electrical connections.
a. Electrical noise from the FID amplifier could result from a noisy power
supply or defective component of the PCB.
b. Loose electrical connections can cause electrical signals to be sporadic.
c. Since the FID amplifier input impedances are extremely high, low noise
coaxial cable connects the detector and the FID amplifier. Defective
coaxial cables or poor electrical connections are often sources of noise.
2. Contamination can enter through the burner air, burner fuel, or carrier.
Secondary sources are contaminated air, fuel, carrier lines, or regulators.
a. Hydrocarbon contaminates in carrier gas, hydrogen fuel or air can cause

the FID to produce an output signal as they are burned.
b. The gases may be pure, but contaminated tubing or hardware

components in the analyzer or cylinder regulator(s) contaminate the
makeup gases as they pass through them. The FID detects theses
contaminants, resulting in a noisy baseline.
c. An FID is generally equipped with a catalytic air cleanup unit to remove

hydrocarbon impurities from the burner air. If the air cleanup unit fails,
the impurities in the burner air can appear as detector noise.
d. If water accumulates in the FID vent, the detector effluent flow can
bubble through the accumulated water. This in effect back-pressures the
FID, causing the flame intensity to fluctuate. This can appear as a noisy
baseline as well.
Perform Test Procedure 12 (Common Usage of Gases), Test Procedure 14 (Burner

Air Catalytic Cleanup Unit), or Test Procedure 15 (Coaxial Cable), as applicable.
Replace or clean the FID (see FID Repair in Section 4).
2.3 ANALYSIS PROBLEMS
2.3.1 No Peaks
Symptom: No peaks are indicated on strip chart recorder, graphic display, or

detector signal (see Figure 2-7).
Missing Peaks
BASELINE BASELINE
TIME TIME
NORMAL OFFSET
Figure 2-7. NO PEAKS
2000-SVC, C1 2-5
Cause: This generally indicates that either no sample was injected, or the injected
sample is not being detected or processed.
No peak detection could be caused by any one of the following:
1. Chroma not selected on manual control screen (affects recorder output only).
2. No sample flowing to the sample valve. Verify sample is flowing to the sample
valve.
3. No carrier gas supplied to the analyzer. Perform Test Procedure 1 (Carrier,

Makeup, and Utility Gas Supplies) and Test Procedure 2 (Carrier and Makeup
Gas Flow Adjustments).
4. No air to the sample valve actuator. Perform Test Procedure 19 (Sample Valve
Actuation Air).
5. Baseline offset extreme. See Baseline Offset: Subsection 2.2.1 for TCD or
Subsection 2.2.5 for FID.
6. Column broken or connection in the column train disconnected. Perform Test

Procedure 8 (Column Train Problems).
7. TCD Failure. Perform Test Procedure 5 (Detector Balance) and Test Procedure
6 (Filament Test), as applicable.
8. FID Failure. Perform Test Procedure 5 (Detector Balance), Test Procedure 18

(Verification FID Flame Is Ignited), and Test Procedure 16 (FID Reduced
Sensitivity), as applicable.
9. Low Zone Temperatures. See Subsections 2.2.3 through 2.4.22 and Test
Procedures 22 through 28.
10. Active stream is stream 9 (no inject occurs on stream 9). Change to correct
active stream.
11. Check Method Table for correct entries. Perform Test Procedure 34 (Checking
Method Table Configuration).
12. Sample Valve Failure. Perform Test Procedure 1 (Carrier, Makeup, and Utility
Gas Supplies) and Test Procedure 2 (Carrier and Makeup Gas Glow
Adjustments), as applicable. Also see Subsections 2.2.1 and 2.2.5. Repair
sample valve (see Sample Valve Repair in Section 4). Check for correct stem
volume and length.
13. Actuation solenoid valve vent is plugged or obstructed. Check and remove any
obstruction.
14. Solenoid not moving. Replace solenoid valve, driver card, or Chroma I/O
board.
2-6 2000-SVC, C1
2.3.2 Double Sampling
Symptom: The chromatogram peaks appear to have double apexes (see Figure
2-8). The trailing peak apex is generally smaller than the leading due to the first
having the greater sample size.
TIME TIME
NORMAL DOUBLE SAMPLING
Figure 2-8. DOUBLE SAMPLING
Cause: Double sampling problems are isolated to the sample valve. Generally the
first injection occurs when the valve is turned on (valve stem inserted into the
injection chamber). The second injection is made when the valve is turned off (the
valve stem is withdrawn from the injection chamber). Perform Test Procedure 20
(Double Sampling).
2.3.3 Additional Peaks of Unknown Origin (Mystery Peaks)
Symptom: Chromatograph displays extra peaks or a noted difference in composite

chromatograph appearance from that of the calibration (see Figure 2-9).
Unknown
TIME TIME
NORMAL MYSTERY PEAKS
Figure 2-9. MYSTERY PEAKS
Cause: If only present on calibration sample and not on process, verify that the
correct calibration and proto fuel sample is being analyzed. Possibly a new
calibration blend has been installed that contains a blending error. Perhaps the
wrong calibration sample has been selected or incorrect analysis is attached to it.
If mystery peaks are present on all process or calibration samples, the analyzer is
experiencing a sampling problem. The sample valve seals may be leaking. The
sample valve may be double sampling (see Subsection 2.3.2). The sample stem
may be scratched or deformed. Peaks may also be originating from a previous
analysis cycle.
Check to ensure correct process stream is aligned with sample system.
Perform Test Procedure 20 (Double Sampling), and Test Procedure 37 (Residual

Sample), as applicable.
2000-SVC, C1 2-7
2.3.4 Variable Sample Size
Variable sample size can cause a nonrepeatibility of peak concentrations if the peak
area is varying (see Figure 2-10).
TIME TIME
ANALYSIS #1 ANALYSIS #2
Figure 2-10. VARIABLE SAMPLE SIZE
Symptom: Chromatogram area or height appears to change with each consecutive

injection.
Failure: The liquid sample volume is not consistent between consecutive injections.
This can be related to sample flow, defective sample valve hardware, leaks in
column train, or sample bubbling.
Cause: Leaking sample valve seal can result in random bubbling of carrier into the
sample chamber causing the sample size to vary. If the sample chamber pressure
is such that the temperature is above the bubble point of the sample, the sample will
bubble in the sample chamber, causing an inconsistent liquid fill of the sample loop.
This results in a continuously variable sample size. A defective sample valve stem
or leaking seal(s) can also cause nonrepeatability.
Perform Test Procedure 21 (Variable Sample Size). If necessary, replace the

sample valve seals and stem (see Sample Valve Repair in Section 4).
2.3.5 Variable Retention Times
Variable retention times can result in nonrepeatability (see Figure 2-11).
t0 t 30 t0 t 27 t0 t 34
TIME TIME TIME
Figure 2-11. VARIABLE RETENTION TIME
Symptom: Retention times of calibration and individually gated process

components change with each consecutive cycle.
Parameters that affect retention times include the following:
1. Varying Carrier flow rate. Perform Test Procedure 2 (Carrier and Makeup Gas
Flow Adjustments).
2-8 2000-SVC, C1
2. Varying Isothermal Oven Temperature. Perform Test Procedure 31 (Checking
Temperature Table Values).
3. Defective flow controller. Perform Test Procedure 11 (Baseline Cyclic Flow

Controller) and Test Procedure 2 (Carrier and Makeup Gas Flow Adjustments),
as applicable.
4. Leak(s) in column train. Perform Test Procedure 8 (Column Train Problems).
5. Variable back pressure on FID vent or TCD measurement vent. Perform Test
Procedure 35 (Vent Back Pressure).
6. Sample valve malfunction. Perform Test Procedure 12 (Common Usage of

Gases) and Test Procedure 19 (Sample Valve Actuation Air), as applicable.
See Sample Valve Repair in Section 4.
7. Contaminated Carrier or Makeup Gas. Perform Test Procedure 12 (Common

Usage of Gases), Test Procedure 13 (Utility Gas Contamination Procedure),
and Test Procedure 14 (Burner Air Catalytic Cleanup Unit), as applicable.
2.3.6 Individual Peak Missing on Report
Symptom: Chromatogram indicates all peaks are present; however, the data report
shows the peak to be nonexistent or unknown.
Cause: The gating in the method needs to be modified to ensure gating of the
missing peak in the report. This can be done by modifying the gate ON/OFF time in
the method table. Refer to the Operator’s Manual for detailed instructions.
2.3.7 Peak Inversion
Symptom: The peaks on the strip chart recorder are reversed or negative (see
Figure
2-12).
Baseline offset
adjusted up scale
NORMAL OFFSET
Figure 2-12. PEAK INVERSION
Cause: Negative peaks on the strip chart recorder could be due to reversed
recorder wiring at the analyzer or at the recorder. Some recorders are equipped
with polarity reversal. Ensure correct polarity setting on recorder. Other possible
causes include reversal of sense and reference tubing connections or filament
wiring if a TCD is used, or a grounded jet or missing jet voltage if a FID is used.
1. Check for reversed sense and reference filament wires.
2000-SVC, C1 2-9
2. Check for reversed sense and reference tubing connections to the detector.
3. Make necessary corrections.
4. Perform Test Procedure 29 (FID Polarizing Voltage Test).
2.3.8 Chromatogram Oversized or Off Scale
Symptom: The chromatogram or peak areas are excessively large. The condition
may be severe enough that all peaks are off scale on the highest attenuation (see
Figure
2-13). Chromatogram may go off scale at approximately the time of distillation on
and not return to scale until time of distillation off.
NORMAL PEAK OFFSCALE
Figure 2-13. CHROMATOGRAM OFF SCALE
Cause: The attenuation could be set too low, making the chromatogram or peaks
appear large (loss of polarizing voltage on FID). Another possible cause is the
wrong carrier gas is being used (e.g. nitrogen used instead of helium).
The peaks may in fact be too large and saturating the detector or column. The
splitter may be out of adjustment, or the liquid sample size may be too large.
Possibly the detector gain jumper at the detector electronics is not setup correctly.
The sample valve may be injecting an excessively large sample volume due to
deformation or a scratch in sample stem or worn seals.
WARNING
Sample will spill or leak out during this procedure. Consult MSDS
sheets on file at your location for safety requirements.
1. Perform Test Procedure 2 (Carrier and Makeup Gas Flow Adjustments).
2. Perform Test Procedure 31 (Checking Temperature Table Values), steps 1 and

2, to check or modify attenuation value.
3. Check detector gain jumper and modify if necessary.
4. Repair sample valve (see Sample Valve Repair in Section 4). Check sample
loop size.
2.3.9 Reduced Detector Sensitivity
Symptom: The chromatogram or peaks have reduced in size from that of a previous
analysis. This is also characterized as a reduction in detector sensitivity.
2-10 2000-SVC, C1
Cause: The attenuation could be set too high, making the chromatogram or peaks
appear small. Another possible cause is the wrong carrier gas is being used (e.g.
helium used instead of nitrogen).
The peaks may in fact be too small as a result of excessive sample splitting due to
the splitter being out of adjustment, or a small liquid sample volume injection. The
sample groove in the sample valve stem may be plugged or restricted. A
programming error in sample valve on/off timing may not allow adequate time for a
proper sample injection. Sample valve actuation malfunction can cause inadequate
sample injection. Possibly the detector gain jumper configuration at the detector
amplifier is not setup correctly. The sample valve may have a defective or wrong
stem installed. Low polarizing voltage, defective Detector Amplifier, or “dirty” FID
can also reduce sensitivity.
1. Perform Test Procedure 31 (Checking Temperature Table Values), steps 1 and

2, to check or modify the attenuation setting.
2. Perform Test Procedure 2 (Carrier and Makeup Gas Flow Adjustments) to

check carrier and splitter flow rates.
3. Perform Test Procedure 34 (Checking Method Table Configuration) to check

sample on/off time.
4. Perform Test Procedure 29 (“Flame Out” LED Remains On After FID Flame
Ignition) to check polarizing voltage.
5. Perform Test Procedure 16 (FID Reduced Sensitivity).
6. Check detector gain jumper and modify if necessary.
7. Repair sample valve (see Replacing the Valve Stem in Section 4).
8. Inspect sample valve stem to check for scratches, deformation and plugging.
Check loop size and stem length.
2.3.10 Peak Discrimination
Symptom: Discrimination is the non linear unequal dilution of hydrocarbons in the

column train. Typically the heavier components will tend to dilute more than the
lighter components.
Cause: Discrimination is usually the result of a leak or incorrectly adjusted sample

splitter. The leak or split might cause more of the heavier components to be
exhausted out the splitter vent or leak exit than the lighter components; thus,
disproportionate dilution. Perform Test Procedure 33 (Peak Discrimination) to test
for discrimination.
2.3.11 Premature Termination of Analysis
Vista II analyzers that are utilizing only one Vista Workstation (VWS) highway must
have the second highway jumpered on the backplane. If the input to highway 2 is
left unconnected, the communications controller may perceive electrical noise-
induced line changes as information. This extraneous “information” may cause the
analysis to stop occasionally at the end of an analysis method or exhibit other
unpredictable behavior.
2000-SVC, C1 2-11
To prevent this problem from occurring it is recommended that the positive input of
the unused highway be connected to the +5 volt supply. The recommended
connection locations are as follows:
1. Prepare a single conductor 20 AWG wire as a jumper.
2. Connect one end of the jumper wire to J102 pin 5 (see Figure 2-14). If there is
not a connector already installed, ABB P/N 3617698-6 may be used at J102.
3. Connect the other end of the jumper wire to J110 pin 1. If there is not a
connector already installed, ABB P/N 3617698-12 may be used at J110.
TB1
J110
1
1 2 3 4 5 6 J110
J1A 1
1 2 3 4 5 6
J1B
12
6
HIGHWAY #2
5
HIGHWAY #2
1 2 3 4 5 6
4
3
2
J102
1
J102
Figure 2-14. BACKPLANE BOARD SHOWING JUMPER LOCATIONS
2.4 TEMPERATURE CONTROL HARDWARE PROBLEMS
The following alarm indicators can be useful aids in determination of a hardware

failure in the temperature controller.
2.4.1 Temperature Probe Open
Symptom: No heat to a specific temperature zone. Actual temperature as indicated

in Manual Temperature Control Mode indicates > 500 deg for a specific zone.
2-12 2000-SVC, C1
Other zones’ actual temperature indicate low or ambient. At the temperature board
in electronics enclosure, all LED’s are off as the temperature control board shuts
down.
Any one of the following alarm messages or conditions could be present:
On Background Screen ***ALARM:*** (flashing)
On Manual Temperature Zone (#) (flashing)

Control Mode Screen *Temp Bd Alarm* (flashing)
On Alarm Screen Temperature Board:

*Zone Specific
*Analysis Shutdown
*** TEMP ZONE (#) Alarm ***
*Overtemp
*Reasonableness Test
*Probe Open/Shorted or TC Faulty
*High Temp
Failure: The failure is most likely isolated to the zone indicating a temperature > 500
deg. The temperature sensor(s) is a 400 ohm platinum thermocouple probe. As the
temperature of the probe increases, its resistance value increases. As the
temperature of the probe decreases, the resistance decreases. The maximum
temperature range measurable by the temperature controller is 500 degrees. An
indication greater than 500 degrees corresponds to a high resistance value at the
sensor input. The greatest resistance possible is an open circuit to the sensor input
or open probe or connection. The least resistance would be a shorted probe or
connection to the sensor input.
Cause: The sensor to the zone input has possibly opened, or is no longer connected
to the sensor input. Perform Test Procedure 22 (Open Temperature Sensor).
2.4.2 Temperature Probe Shorted
Symptom: No heat to a specific temperature zone. Actual temperature as indicated

in Manual Temperature Control Mode indicates less than -200 deg for a specific
zone. Other zones’ actual temperature indicate low or ambient. At the temperature
board in electronics enclosure, all LED’s are off as the temperature board shuts
down.
On Manual Temperature Zone (3) (flashing)


*Zone Specific
*Analysis Shutdown
*Low Temp
2000-SVC, C1 2-13
Failure: The failure is most likely isolated to the zone indicating a temperature less
than -200 deg. The temperature sensor(s) is a 400 ohm platinum thermocouple
probe. As the temperature of the probe increases, its resistance value increases.
As the temperature of the probe decreases, the resistance value decreases. The
maximum scaled temperature range measurable by the temperature controller is -
200 degrees. This corresponds to an extremely low resistance at the sensor input.
The least resistance possible is a short circuit to the sensor input or shorted probe
or connection.
Cause: The sensor to the zone input has possibly shorted. Perform Test Procedure
23 (Shorted Temperature Sensor).
2.4.3 Isothermal Oven Heater Thermocouple Faulty
Symptom: At the temperature board in electronics enclosure, all LED’s are off as
the temperature control board shuts down.
On Manual Temperature *Temp Bd Alarm* (flashing)

Control Mode Screen

Heater Barrel TC Faulty
*Analysis Shutdown
Failure: The isothermal oven heater temperature is greater than 500 degrees C.
Cause: The sensor input from the isothermal oven heater temperature monitor has
opened, or is no longer connected.
Perform Test Procedure 25 (Isothermal Oven Heater Sensor Open).
2.4.4 Temperature Control Micro #2
Symptom: Micro chip #2 monitors for over temperature conditions at the various
temperature zones. No heat being applied to a specific temperature zone. Actual
temperature as indicated in Manual Temperature Control Mode indicates > 500 deg
for a specific zone. At the temperature board in electronics enclosure, all LED’s are
off as the temperature control board shuts down.


*Zone Specific
*Analysis Shutdown
*Overtemp
2-14 2000-SVC, C1
Failure: The failure is most likely isolated to the zone indicating a temperature > 500
deg.
Cause: The sensor to the zone input for temperature monitoring has possibly
opened, or is no longer connected. Perform Test Procedure 26 (Zone Input Sensor
Open).
2.4.5 Loss of Air
Symptom: The isothermal oven (zone # 1) and programmed temperature oven (zone
#2) are not being heated. The actual temperature reduces and eventually
approaches ambient. These are the only temperature controllers that use air baths.

Control Mode Screen

*Loss of Air
Failure: Malfunction is related to application of oven air to air bath ovens. The air
bath heater(s) will overheat and burn out if air is not applied to the heaters while
power is applied. The air provides the heat to ovens by displacing heat from the
heaters. The presence or lack of oven air is sensed by a pressure switch. If air is
removed, the switch opens and power is removed from the air bath heaters. When
air is applied the switch closes allowing the temperature controller to apply heat to
the air bath heaters.
Cause: The oven air has been shut off or reduced below air pressure switch setting.
The oven loss of air pressure switch has failed, or connection problem exists.
Perform Test Procedure 24 (Loss of Oven Air).
2.4.6 Triac Failure
Symptom: The Actual temperature is indicating below set point for zone and alarm
indicating triac failure.


*Zone Specific
*Triac Failure
2000-SVC, C1 2-15
Cause: The output of the triac is connected to the zone heater(s). An optical
isolator connected parallel to the output senses the firing of the triac(s) as heat is
applied to the heater(s). This output is monitored by the temperature control board.
If the triac does not conduct when the gate signal is applied, the triac is diagnosed
as failed. Problem could be associated with triac monitoring optical isolators on
output board, or an open heater element.
CAUTION
Ensure that there are no hazardous or flammable gases present in the

immediate area of the analyzer. The purged electrical sections of the
analyzer will be declassified when purge is removed, and a danger
exists for fire, explosion, damage to property and injury or death to
plant personnel during the non purged time. Obtain proper permits
such as hot work, etc.
See X-Purge in Section 4 of the Operator’s Manual for the Override

function. Do not perform Override until you have read Section 4
completely and you understand and can perform the procedure
requirements.
Perform Test Procedure 27 (Open or Shorted Heater) to check for shorted heater.
Replace Heater Output Board.
2.4.7 T-Rating Disagreement
Symptom: The temperature board has shut down and all the LED’s are off. The
zone temperatures are reducing and will approach ambient. The T-Rating display is
alternating between the two jumper settings.

Control Mode Screen

*T-Rating Disagreement
*Analysis Shutdown
possible Zone specific
If the T-Rating is in question, refer to final documentation provided with the

chromatograph or contact ABB Process Analytics.
Remedy: The T-rating jumpers for Micro #1 and Micro #2 must be set up identically.
Determine the correct setting and configure the jumpers for both identically.
2.4.8 Exclusion Jumper Disagreement
Symptom: The temperature board has shut down and all the LED’s are off. The
zone temperatures are reducing and will approach ambient.
2-16 2000-SVC, C1

Control Mode Screen

*T-Rating Disagreement
*Analysis Shutdown
possible Zone specific
Failure: Zones not used for temperature control are excluded to prevent operation.
They are also set INACTive in the software.
Cause: The exclusion jumper is not set up correctly.
Remedy: Select correct exclusion Jumper configuration. If in doubt contact ABB

Process Analytics service department.
2.4.9 Oven Temperature is Greater Than T-Rating
Symptom: The temperature board has been shut down. If the trouble is in Micro #1
then all LED’s are Off on the Temperature Control board and the TC zone
temperature is greater than the T-Rating. If trouble is in Micro #2, then the top LED
is ON and the actual temperature is greater than the T-Rating.

Alarm Screen Temperature Board:

*Zone Specific
*Overtemp
*High Temp
Cause: The T-rating defines the maximum surface temperature allowed to prevent
the ignition of the flammable liquids and gases. The over-temperature limit prevents
the temperatures from reaching the T-rating limit. The over-temp must be less than
the T-rating limit to prevent the temperature from reaching the T-rating ignition
temperature.
Remedy: Reconfigure T-Rating or upper limit to correct setting. To modify the

temperature configuration table, refer to the Digital Temperature Controller in
Section 4 of the Operator’s Manual. Perform Test Procedure 31 (Checking
Temperature Table Values).
2.4.10 Reasonableness
Symptom: Alarm Condition.
2000-SVC, C1 2-17


*Zone Specific
Cause: Micros #1 and #2 disagree by more than 30 degrees Celsius. Micro #1

monitors and controls the temperature control board. Micro #2 monitors for over-
temperature conditions. The measurement of the two sensors must agree into order
to ensure proper over-temp protection.
Perform Test Procedure 31 (Checking Temperature Table Values), Test Procedure

22 (Open Temperature Sensor), Test Procedure 23 (Shorted Temperature Sensor),
Test Procedure 26 (Zone Input Sensor Open), and Test Procedure 27 (Open or
Shorted Heater), as applicable.
2.4.11 AC Zero Crossing Loss

Control Mode Screen

*No Zero Crossing
The heater output board monitors the AC input with a comparator circuit. This
determines the zero crossover point. This occurs when the magnitude of the AC
signal is zero. This point occurs in both the positive and negative directions. The
crossover point is used to coordinate application of power from the triac to the
heating element. Power is applied as the zero crossover point occurs preventing
unnecessary loading and surging on the temperature output circuitry.
CAUTION

plant personnel during the nonpurged time. Obtain proper permits

requirements.
2-18 2000-SVC, C1
Remedy: Replace Heater Output Control board.
2.4.12 Over Temp Trial Test Fail

Control Mode Screen

*Overtemp Test Fail*
possible zone specific Triac failures
Cause: Temperature control did not detect the over-temp condition when tested.
CAUTION


requirements.
Remedy: The over-temp micro has possibly failed, may require replacement of
temperature control board or output board.
2.4.13 Controller Housing Internal Temperature Greater Than 80° C
Symptom: The temperature board has shut down and all LED’s on temperature
controller board are off. Actual temperatures are reducing; approaching ambient.
Alarm condition present.

Control Mode Screen

*Ambient Limit Exceeded
Cause: The controller housing temperature is monitored to ensure that the

temperature does not exceed 80 degrees Celsius. This is done to protect the
associated heater electronics from high temperature operation. Excessive
2000-SVC, C1 2-19
temperatures could cause electronics failure and run away zone temperature
control.
CAUTION


requirements.
Install a temperature monitor and verify ambient temperature. Ensure air flow into
heater box.
2.4.14 Set Point Unacceptable


*Zone Specific
*Set Point Failed
To modify the temperature configuration table, refer to the Digital Temperature

Controller in Section 4 of the Operator’s Manual.
2.4.15 Reconfiguration Failure


*Zone Specific
*Reconfiguration Failed
2-20 2000-SVC, C1
Remedy: Perform the temperature board reconfiguration procedure. Be certain to
hold down the switch and respond by pressing “Y”.
To modify the temperature configuration table, refer to the Digital Temperature

Controller in Section 4 of the Operator's Manual.
2.4.16 Out of Control
CAUTION


requirements.
The temperature controllers must be stable with respect to tracking the set point.
Symptom: The actual temperature is not stabilizing at the set point temperature.
This alarm occurs when the zone temperature has remained outside the operational
band of the set point for more than 90 seconds.


*Zone Specific
*Out of Control
1. Check to ensure proper sufficient heater air flow
2. Perform Test Procedure 22 (Open Temperature Sensor), steps 1-3, to check

RTD for stability. If not stable replace RTD.
3. Replace Temperature Control board. Check for stability.
4. Replace Sensor Input board. Check for stability.
5. Replace Heater Output board. Check for stability.
2000-SVC, C1 2-21
2.4.17 Open or Shorted Heater
Symptom: No heat to a specific temperature zone. Actual temperature is ambient,

while set point is at normal setting. The analyzer may indicate out of control or low
temperature alarm.
Failure: The temperature controller and sensor input and heater output control
board are functioning normally. An open heater will not supply heat to the
temperature zone.
Cause: The heater to the temperature zone is possibly open. Perform Test
Procedure 27 (Open or Shorted Heater).
2.4.18 Blown Fuse, Heater Output Board
Symptom: No heat to any temperature zone.
Failure: All temperature zone outputs share a common fuse.
Cause: Open fuse causes power to be removed from zone heaters. The analyzer
may indicate an out of control or low temperature alarm. Perform Test Procedure
28 (Open Fuse to Output Board Heaters).
2.4.19 Low Oven Temperature
CAUTION


requirements.
Symptom: Oven temperature is below the specified set point value.
Cause: Low oven temperature can be caused by the following:
1. Low air pressure to analyzer ovens. Perform Test Procedure 1 (Carrier,

Makeup, and Utility Gas Supplies) and make necessary adjustment at analyzer
air regulator(s).
2. Loss of air pressure switch; wiring or connection is defective. Perform Test

Procedure 24 (Loss of Oven Air).
3. Defective temperature probe. Perform Test Procedure 22 (Open Temperature

Sensor), Test Procedure 23 (Shorted Temperature Sensor), Test Procedure 25
(Isothermal Oven Heater Sensor Open), Test Procedure 26 (Zone Input Sensor
Open), Test Procedure 27 (Open or Shorted Heater), and Test Procedure 28
(Open Fuse to Output Board Heaters), as applicable.
2-22 2000-SVC, C1
4. Heater orifice restricted by foreign matter. Check the heater orifice to ensure it
is not restricted or plugged.
2.4.20 High Oven Temperature
Symptom: Oven temperature is above the specified set point value.
Cause: High oven temperature can be caused by a runaway heater or defective

temperature probe. Perform Test Procedure 23 (Shorted Temperature Sensor), Test
Procedure 25 (Isothermal Oven Heater Sensor Open), Test Procedure 26 (Zone
Input Sensor Open), Test Procedure 27 (Open or Shorted Heater), and Test
Procedure 28 (Open Fuse to Output Board Heaters), as applicable.
2.4.21 Programmed Oven Temperature Not Cooling or Slow to Cool
Symptom: Programmed temperature oven ramps to final set point, but will not cool
to initial set point or is slow to cool to initial set point.
Cause: Cool down is initiated by the selection of temperature control table entry #2
in the method tables. If this instruction is missing or incorrect values are placed in
the temperature parameters, cool down will be effected and may not occur. Cool
down causes a cool down solenoid to increase the cool air flow from the vortex
cooler into the programmed temperature oven. If the cool down solenoid or vortex
cooler fails, cool down will not perform as expected. If the air flow to the vortex
cooler is inadequate, cool down will also be affected. A rate of 0.1 is needed to
activate the cool down solenoid in the temperature control table entry #2.
The following can cause problems with programmed temperature oven cool down.
1. An error has been made in programming the method table. Perform Test
Procedure 31 (Checking Temperature Table Values) to verify all control
parameters.
2. Air supply pressure is low. Verify correct air pressures. If necessary make
adjustment.
3. Vortex cooler not adjusted. Perform Test Procedure 43 (Programmed

Temperature Oven Cool Down).
4. Listen for cool down solenoid to operate and introduce increased vortex cooler
air flow. If this does not happen, Perform Test Procedure 43 (Programmed
Temperature Oven Cool Down).
2.5 OUTPUT PROBLEMS
2.5.1 Printer Not Generating Report
Symptom: No reports or other printer response.
Cause: The printer may be turned off or malfunctioning. The printer may have a
blown fuse or be unplugged from power. The printer may be in alarm condition such
as being out of paper. Wiring to printer may be disconnected or in error. Printer and
analyzer output driver may be not be compatible or mismatched (RS-232).
2000-SVC, C1 2-23
If no reports are generated the report option may be set to NONE. The post
analysis calculations may still be in progress. If no report is generated before next
analysis cycle begins, there is a problem. Perform Test Procedure 36 (Printer Test)
to verify correct printer setup.
2.5.2 Trend Output Not Functioning Correctly
Symptom: There is no trend output at recorder or input device, or the trend output
value is not correct.
Cause: No trend output to an external device such as a recorder or DCS can be

due to wiring, loss of loop power or, trend board failure. Incorrect trend output at the
peripheral device could be due to loop power, input shunt resistance, trend board
not scaled correctly, trend board malfunction, incorrect trend table. Perform Test
Procedure 38 (Trend Output) to test trend function.
2.5.3 Digital PCB Malfunction
Symptom: Valves do not switch and alarm digital output not functioning.
Cause: Wrong assignment of valve or alarm digital assignment in method or Vista

BASIC Program. Digital PCB malfunction or defect.
Verify digital assignment (see Digitial I/O Option in Section 4 of the Operator’s
Manual).
2.5.4 No Recorder Output
Symptom: Strip chart recorder does not record chromatogram.
Cause: The strip chart recorder may not be powered, or may be malfunctioning. A
fuse may be blown at the recorder. Other causes include defective recorder cable,
wiring error or loose connection. Possibly the wrong attenuation is selected at the
recorder or the shunt resistor is not correct. The Manual Control Screen may not
have the Chroma selection or the Chroma I/O board could be malfunctioning.
The problem may be due to defective or damaged analyzer terminal connection,

defective wiring or connection to the front jacks or side terminal strip, or to defective
electronics.
Perform Test Procedure 39 (Digital PCB) to test for recorder malfunction.
2.5.5 No Vista Workstation Communication
Symptom: No response to analyzer from Vista Workstation.
Cause: Possible communication failure due to electronics failure, control

parameters, cable or cabling connection.
Perform Test Procedure 40 (Vista Workstation Communication Test).
2.5.6 No Analyzer Key Pad Response
Symptom: Pressing key pad on analyzer front panel produces no response on CRT
or other analyzer output.
2-24 2000-SVC, C1
Cause: No response by key pad could indicate defective key pad or malfunction or
defect in key pad cabling from keypad to keypad assembly PCB. The CRT Control
PCB or associated wiring or connections may be defective. The controller software
may be locked up.
2.5.7 LOCOM PCB Symptoms and Possible Causes
Symptom: The CRT display indicates the message “CANNOT CONTACT

CONTROLLER” when attempting to communicate with a remote analyzer.
Cause: The remote analyzer switch address is incorrect. A remote analyzer cannot
be contacted if it is not powered or connected to the network. It is also imperative
that the network wiring be installed and wired correctly. Improper wiring may affect
several analyzers simultaneously.
To isolate the cause, perform the following:
1. Check remote analyzer address, power and wiring.
Symptom: No communication or response from a remote analyzer or from a

local analyzer front panel.
Cause: The remote analyzer front panel address switch is not set correctly or
the “LOCK OUT REMOTE” switch is set to On.
2. Check analyzer address switch setting.
Symptom: Only local chromatograms are accessible at the local panel recorder
output jacks. Remote chromatograms cannot be accessed.
Cause: This feature can only be accessed when using the network. The
jumper at JP5 located on the CRT controller may not be configured correctly.
3. Check and change if necessary Change Jumper JP5.
Symptom: The Remote Front Panel Mode menu cannot be exited.
Cause: The “NO Analyzer” switch is ON.
4. Place “NO ANALYZER” Switch in OFF position.
Symptom: No operation occurs when “EXECUTE” soft key is pressed in the

Remote Front Panel Mode.
Cause: The “TEST HIGHWAY” switch is On in one of the controllers connected

to the front panel network.
5. Check “TEST HIGHWAY” in analyzers on network and set switch in OFF

position.
Symptom: Two or more controllers are responding to a remote command.
Cause: LOCOM PCBs have identical address switch settings or defective

LOCOM PCB.
2000-SVC, C1 2-25
Check settings and correct. Then cycle power to the device in which the switch
was modified.
6. Replace LOCOM PCB (set-up address switch).
Symptom: Cannot contact or use remote networking feature.
Cause: Previous remote communication was not terminated.
7. Search for analyzer that is accessing another remote, or that is itself being
accessed, then terminate the access.
See Remote GC Operation Option in Section 4 of the Operator’s Manual.
2.5.8 FID “Flame Out” LED On
Symptom: FID flame LED indicates flame is out.
Cause: The FID flame can be extinguished by insufficient burner fuel, air or column
pressure surges, or plugged vent line (possibly moisture).
The FID flame may in fact be burning and the thermocouple or the associated flame
detection electronics may have failed to detect the flame on condition. The flameout
sensitivity for detection needs adjustment.
Perform Test Procedure 1 (Carrier, Makeup, and Utility Gas Supplies), Test
Procedure 2 (Carrier and Makeup Gas Flow Adjustments), Test Procedure 30
(“Flame Out” LED Remains On After FID Flame Ignition), and Test Procedure 35
(Vent Back Pressure), as applicable.
If, after repeated attempts to ignite the FID, it will not light, see Subsection 2.5.9.
2.5.9 Flame Ionization Detector (FID) Flame Will Not Ignite
Symptom: FID Flame out LED on, and continued attempts to light FID have failed.
Cause: Flame-out thermocouple and its electronics detect that flame is

extinguished. The cause could be lack of or insufficient burner fuel, air, or in some
cases carrier when hydrogen carrier is used. The Jet may be plugged or restricted,
preventing burner fuel from passing into the detector cell. The ignitor or ignitor
electronics may be defective. The vent line may be plugged.
Perform Test Procedure 18 (Verification FID Flame Is Ignited), Test Procedure 17

(FID Will Not Light), Test Procedure 32 (Plugged Jet or Breather), and Test
Procedure 35 (Vent Back Pressure), as applicable.
2.5.10 Low Carrier Pressure Hardware Alarm
Symptom: Low carrier gas alarm. If carrier is in short supply and not corrected,
carrier flow rates will reduce as the gas is depleted. Analyzer data will become
erroneous as carrier pressure drops below the analyzer requirement.
Causes: The following can be causes for low carrier pressure alarm.
2-26 2000-SVC, C1
1. Low carrier gas supply. Perform Test Procedure 1 (Carrier, Makeup, and Utility
Gas Supplies).
2. Defective or incorrectly adjusted carrier pressure switch. Perform Test

Procedure 41 (Low Carrier Pressure).
3. Inlet filter or restrictor for hydrogen is plugged.
2.5.11 Low Sample Flow Hardware Alarm
CAUTION
Ensure there are no hazardous or flammable gases present in the

Ensure adequate ventilation in analyzer shelter.

function. Do not perform Override until you read Section 4
requirements.
Symptom: Rotometer and pressure gauge indications are below normal. Bubbles
may be seen in analyzer effluent rotometer. Individual components, RVP and V/L
calculation values are not repeating.
Causes: The following can be causes for low sample flow alarm.
1. The sample booster pump is not operating or has failed. Check pump inlet and
discharge pressure and power.
2. Defective or incorrectly adjusted sample flow switch. Perform Test Procedure

42 (Low Sample Flow Hardware Alarm).
3. Sample flow alarm checked during sample shutoff portion of analysis.
2.5.12 Loss of Purge Air
CAUTION


requirements.
2000-SVC, C1 2-27
Symptom: If X purge system installed analyzer power will be removed and cannot
be restored until purge air is restored.
Causes: The following can be the causes of loss of purge.
1. Air supply to analyzer has been shut off. Perform Test Procedure 1 (Carrier,
2. The purged sections in the analyzer have developed leak(s). Leak check with
leak detector
3. Purge air switches are defective. Replace purge switches.
4. Insect infestation or plugging of purge, atmospheric reference vent(s). Inspect

and clear vent.
5. Tubing to and from pressure switches has disconnected or developed a leak.

Inspect and replace if necessary.
6. The purge orifice is obstructed or plugged. Remove obstruction or plugging.
2.5.13 Stream Not Selected
Symptom: The steam is not selected for analysis.
Cause: Possible causes include the following:
1. Stream of interest is inactive.
2. Stream is not assigned to the correct method table.
3. Stream is not included in the Random Steam Stepping Table.
4. Stream step instruction missing from method table. Perform Test Procedure 34
(Checking Method Table Configuration).
5. No activation air to actuator (pneumatic stream selection system). Perform Test

Procedure 19 (Sample Valve Actuation Air).
6. Defective wiring or wiring connection to solenoid valve.
7. Defective solenoid drive PCB.
8. Defective Chroma I/O Board. Perform Test Procedure 44 (Stream Switching).
2-28 2000-SVC, C1
2.5.14 Analyzer Will Not Power Up (X-Purge)
CAUTION


requirements.
Symptom: Analyzer will not power up.
Cause: Possible causes for analyzer not powering up are as follows:
1. If attempting to Override X-Purge, light intensity may not be sufficient to

energize Override, or cover to X-Purge electronics housing is not removed.
2. Power is disconnected. Check power distribution circuit breakers and local

disconnect switch. (Watch for lock-out tag-out).
3. No air or insufficient air supply at analyzer. An alarm should be present

indicating the purge failure.
4. Perform Test Procedure 1 (Carrier, Makeup, and Utility Gas Supplies).
5. X-purge time-out not complete.
6. Air leak in purged analyzer housing preventing X-purge time from completing.
See Subsection 2.5.12, Loss of Purge Air.
7. X-purge is locked out. Cycle power (10 seconds) to reset X-purge, and allow X-
purge sequence to initiate.
2000-SVC, C1 2-29
2.6 ELECTRONIC PRESSURE CONTROL TROUBLESHOOTING
The Pressure Control Assembly (see Figure 2-15) requires special tools and
equipment for repair. If you suspect a problem with this assembly please contact
your ABB Processs Analytics service representative.
ABB PROCESS ANALYTICS, INC.

LEWISBURG, WV 24901 U.S.A.
ELECTRONIC PRESSURE CONTROL
D O(EPC)
N O T MODEL
O P E N801WHILE ENERGIZED
(NE PAS OUVRIR SOUS TENSION)
EQUIPMENT FOR HAZARDOUS LOCATIONS:
Class I; L.C.I.E.:
Group B,C,D 97.D6033
T E M P E R A T U 3R EEx
E C O Dd
in (0.49IIB
E : " T 62"+ H T6
VOLUME = 29.7 L)
"CAUTION"
TO PREVENT IGNITION OF HAZARDOUS ATMOSPHERES, DISCONNECT FROM THE
SUPPLY CIRCUIT BEFORE OPENING ENCLOSURE. KEEP TIGHTLY CLOSED WHEN
CIRCUITS ARE ALIVE. EACH TIME THE ENCLOSURE IS OPENED, THE FLAT
JOINTS (SURFACES) OF THIS ENCLOSURE AND COVER MUST BE THOROUGHLY
CLEANED BEFORE REPLACING COVER. METRIC SCREWS ARE USED TO SECURE
THE COVER.
"AVERTISSEMENT"
OUVRIR LE CIRCUIT AVANT D'ENLEVER LE COUVERCLE. GARDER LE
COUVERCLE BIEN FERME TANT QUE LES CIRCUITS SONT SOUS TENSION.
NETTOYER LES SURFACES DE CONTACT DU COUVERCLE AVANT DE LE REMETTRE
EN PLACE.
ELECTRICAL RATINGS: 115 VAC, 50/60 HZ, 1.2 AMPS
+5 VDC/+15 VDC/-15 VDC; 0.6 AMPS
TORQUE COVER BOLTS TO 16 IN-LBS (2 Nm)
MAXIMUM OPERATING AMBIENT TEMPERATURE = 50°C
EPC Housing with Cover Removed
Figure 2-15. EPC PRESSURE CONTROL ASSEMBLY
2.7 CONTROLLER PROBLEMS
2.7.1 Input Power
Input power is connected to one or more of the following locations on the

Motherboard in the Controller Housing (see Figure 2-16):
TB1
TB1
J1A
1234 5 6
J1A
J1B 1234 5 6
J1B
Figure 2-16. MOTHERBOARD LAYOUT
2-30 2000-SVC, C1
TB1, which is called VAC #1
J1A, which is called VAC #2
J1B, which is called VAC #3
Input power to the Vista II Series Gas Chromatograph is 115VAC. This may be
supplied directly as 115VAC or stepped down from a higher voltage. The input
voltage may be conditioned or supplied from an uninterruptible power supply (UPS).
Each of these choices, made at the time of sale, affects how the power is brought
into the analyzer.
2.7.2 Power Distribution, Standard System
The analyzer uses three power distribution circuits to route the power (see Figure
2-17):
VAC #1, which provides heater power

VAC #2, which powers the electronics through the Power Supply PCB
VAC #3, which power the detectors, solenoid drivers, and EPC
TB1
Hot
1
115 to 230 VAC
(Not Filtered Neut RFI VAC #1
2
or Conditioned) Filter (to heaters)
Gnd
3
Jumpers installed when

J1A does not have J1A
separate power source
1
3
Hot
4
115 to 230 VAC Neut
(Conditioned VAC #2
5
or UPS) (to electronics)
Gnd
6

J1B does not have J1B
6
4
Gnd
3
115VAC Neut VAC #3
(Autoformer) 2 (to solenoids
Hot and detectors)
1
Figure 2-17. INPUT POWER DISTRIBUTION (STANDARD SYSTEM)
2000-SVC, C1 2-31
If all power supplied to the analyzer comes from a single source it will be connected
to TB1. Instead of input cables there will be jumper plugs installed at J1A and J1B
to connect their distribution circuits to the input power source.
If unconditioned power is routed to TB1 and conditioned power to J1A, then J1B will
have a jumper plug to connect its distribution circuits to J1A.
If unconditioned power is routed to TB1 and an autoformer output is routed to J1B
(with J1A not being connected to source power), then J1A will have a jumper plug to
connect its distribution circuits to TB1.
When checking input power make sure to note the connections for source power to
determine how power is routed.
2.7.3 Power Distribution, Model 2007 Fuel Sulfur Analyzer
The Model 2007 Fuel Sulfur Analyzer utilizes the same power distribution circuits as
the standard Model 2000 analyzer. In addition the Model 2007 has an autoformer to
provide 40 VAC power to the furnace located in the oven section of the analyzer
(see Figure 2-18).
TB1
Hot
1
115 to 230 VAC
(Not Filtered Neut RFI VAC #1
2
or Conditioned) Filter (to heaters)
Gnd
3

J1A does not have J1A
1
3
Hot
4
115 to 230 VAC Neut
(Conditioned VAC #2
5
or UPS) (to electronics)
Gnd
6
J1B
Autoformer 5
4
Gnd
3
Neut VAC #3
2 (to solenoids
Hot and detectors)
1
40 VAC to
Temp Controller
(AC Conditioning PCB #2)
Figure 2-18. INPUT POWER DISTRIBUTION (MODEL 2007)
2-32 2000-SVC, C1
2.7.4 Poor Display Contrast
If the analyzer is ON but it is difficult to read the LCD display, you may need to
adjust the display.
1. Ensure the area is safe to open the analyzer.
2. Open the Controller Housing front door.
3. On the Front Panel PCB mounted on the door, locate the contrast adjustment.
It is on the front side of the board, at the bottom center (see Figure 2-19).
Front Panel
PCB
Contrast Display
Adjustment Panel
Figure 2-19. LOCATION OF CONTRAST ADJUSTMENT
4. Adjust the contrast potentiometer clockwise a quarter turn to increase the

contrast.
5. Verify the change in contrast by viewing the LCD display.
6. Repeat steps 4 and 5 as necessary to achieve the desired contrast.
7. Close and secure the Controller Housing front door.
2000-SVC, C1 2-33
2.8 ALARMS
The analyzer has different types and levels of alarms to help you resolve analyzer
problems. When an alarm signal appears on the Background Screen, press the F4
(Alarms) soft key to display the ALARMS screen with the alarm message (see
Figure 2-20).
****** ALARMS ******

****** ALARM ******
Post Analysis Error:
*Valve Manually Switched
Clear
Exit Alarms
and Exit
F1 F2 F3 F4
Figure 2-20. ALARMS SCREEN
When you finish with the alarm messages, press the F1 (Exit) soft key to return to
the Background screen without deleting the alarms, or press the F2 (Clear Alarms
and Exit) soft key to clear the alarms and return to the Background screen.
Alarm messages are of two primary types: main alarms and subordinate alarms.
Main alarms identify a major alarm category. These alarms appear on the alarm
screen at the left margin (e.g., “Post Analysis Error:” in Figure 2-20). The main
alarms are:
Sensors Active:
Sensors Held:
Component High:
Component Low:
Clock Error:
TCF Error:
Post Analysis Error:
Communications Error:
Pressure Board:
Temperature Board:
Raw Chromatogram Storage:
Start-up Hardware Problem Found
Power Failed
2-34 2000-SVC, C1
GCC is not Running an Analysis
Message From VWS:
Flame Out
Subordinate alarms appear below the main alarms, indented and preceded by an
asterisk (*) to show their subordinate status (e.g., “*Valve Manually Switched” in
Figure 2-20).
If a main alarm has subordinate alarms, the main alarm title will include a colon (:).
The following subsections list the main alarms that have subordinate alarms,
together with their associated subordinate alarms.
2.8.1 Sensors Active
When “Sensors Active:” appears as the main alarm, one or more sensor alarms
appears below the main alarm. “Sensors Active” appears when an alarm is active at
the time you look at the Alarms screen. Typical Sensors Active alarms and their
descriptions are:
NOTE
Sensor Alarms 1 to 5 are application-specific alarms. Descriptions of

their use are contained in the Data Package supplied with the
analyzer.
* Sensor 5 Alarm: [user entered name]

* Purge Air—activates when purge air is lost. After purge air is restored the
alarm resets.
* Carrier Gas—activates when carrier gas is lost. After carrier is restored the
alarm resets.
* Low Oven Temp—activates when oven temperature goes below the lower
setpoint. When temperature comes back within the setpoints, the alarm
resets.
* High Oven Temp—activates when oven temperature exceeds the upper

setpoint. When temperature comes back within the setpoints, the alarm
resets.
* Low Standard Sample—activates when standard sample is low or missing.

When the standard sample is restored, the alarm resets.
* Sample Flow—activates when sample flow is lost. When the sample flow is
restored, the alarm resets.
* Low Fuel/N2/Dilution—activates when fuel/N2/dilution is lost. When it is

restored the alarm resets.
2000-SVC, C1 2-35
2.8.2 Sensors Held
When “Sensors Held” appears as the main alarm, one or more sensor alarms
appears below the main alarm. “Sensors Held” appears when an alarm was active
at some time during the analysis, but before you looked at the Alarms screen.
Typical Sensors Held alarms are the same as those for Sensors Active. Sensors
Held alarms must be manually reset by entering the Alarms screen, after the
problem is corrected, and pressing the F2 (Clear Alarms and Exit) soft key.
2.8.3 Component High
When “Component High:” appears as the main alarm, one or more component
alarms appears below the main alarm. Typical Component High alarms and their
descriptions are:
* Component High High—activates when a component exceeds the "high high"

setpoint.
* Component High—activates when a component exceeds the "high" setpoint

but is within the "high high" setpoint.
* Retention Time High—activates when retention time exceeds the upper

setpoint.
* Response Factor High—activates when response factor exceeds the upper

setpoint.
2.8.4 Component Low
When “Component Low:” appears as the main alarm, one or more component
alarms appears below the main alarm. Typical Component Low alarms and their
descriptions are:
* Component Low Low—activates when a component is below the "low low"

setpoint.
* Component Low—activates when a component is below the "low" setpoint but

above the "low low" setpoint.
* Retention Time Low—activates when retention time is below the lower

setpoint.
* Response Factor Low—activates when response factor is below the lower

setpoint.
2.8.5 Clock Error
When “Clock Error:” appears as the main alarm, one or more clock alarms appears
below the main alarm. Typical clock alarms are:
* No Active Streams—activates when the status of all streams in the stream

table has been set to inactive. To clear this alarm set at least one
stream's status to active.
2-36 2000-SVC, C1
* Memory Shortage < 20%—activates when the GCC is short of memory. This
is usually caused by chromatogram storage. To clear this alarm return
all memory that is being used for chromatogram storage back to the
operating system and reduce the number of points being saved by
Chromatogram Storage function.
* Auto Zero + Over Range—activates when program is unable to autozero

because the signal is out of range high.
* Auto Zero - Over Range—activates when program is unable to autozero

because the signal is out of range low.
* Bad Base Projection Forward—activates when the beginning of a peak was

not defined in the analysis.
* Bad Base Projection Backward—activates when the end of a peak was not
defined in the analysis.
* A/D Buffer Overrun—activates when the analog-to-digital algorithm was

unable to perform a conversion based on the analog signal provided.
* A/D Conversion Error—activates when the analog-to-digital algorithm was

unable to perform a conversion.
2.8.6 TCF Error
When “TCF Error:” appears as the main alarm, one or more time-coded function
alarms appears below the main alarm. These alarms are cleared by correcting the
associated method entry designated by the alarm. Typical TCF alarms and their
descriptions are:
* Auto Zero During Noise—activates when auto zero is performed during noise
calculation.
* Auto Zero During Gate—activates when auto zero is performed during forced
gate.
* Auto Zero During Slope Detect—activates when auto zero is performed during
slope detection.
* Gated During Noise—activates when slope detection is turned on at the same

time that a noise calculation is being performed.
* Gated During Slope Detect—activates when slope detection is turned on at

the same time as a peak is being force gated.
* Gate Switched Off w/o Gate On—activates when a force gate is turned off
without the force gate being turned on.
* Noise During Gate—activates when noise calculation is being performed at

the same time as a force gate is turned on.
* Noise During Slope Detect—activates when noise calculation is being

performed at the same time as slope detection.
2000-SVC, C1 2-37
* Noise Off w/o Noise On—activates when noise calculation is turned off but
never turned on.
* Not Enough Noise Points—activates when Noise On and Noise Off are too
close together in time to collect sufficient noise points to perform a
calculation.
* Invalid Peak Width—activates when the peak setting in the TCF table is
greater than 64.
* Too Many Peaks in Analysis—activates when there are more than 254 peaks
in the analysis.
2.8.7 Post Analysis Error
When “Post Analysis Error:” appears as the main alarm, one or more post analysis
alarms appears below the main alarm. Typical post analysis alarms and their
descriptions are:
* Invalid Peak End—activates when the program is unable to define an end to a

peak in the analysis (the peak did not end on a baseline or a valley
point).
* Cal Fail: RF Out of Range—activates when calibration fails because the new
response factor for a peak was out of the limits specfied for the
component.
* Cal Fail: Missing Component—activates when no peak appeared ifor a

component in the calibration stream.
* Missing Component—activates when no peak was found that matches where

a component was defined in the method.
* Unknown Component—activates when a peak was detected in the analysis

and not defined in the method.
* Analyzer Was Not Calibrated—activates when an error occurs in the

calibration cycle and the response factors are not updated.
* Vista Basic Run-Time Error—activates when an error occurs in the Vista Basic
program when it runs.
* Valve Manually Switched—activates when a valve is switched from the Manual

Control screen during the analysis cycle.
2.8.8 Communications Error
When “Communications Error:” appears as the main alarm, one or more

communications alarms appears below the main alarm. Which set of subordinate
alarms appears depends on the communications link used in your system, Vista
Workstation (VWS) or VistaNET. Typical communication alarms and their
description are:
2-38 2000-SVC, C1
VistaNET Link
* Block not transmitted—activates when a VistaNET message is passed to the

Communication PCB and no acknowledgement is received.
* Block dropped—activates when VistaNET messages are being received from

the Communication PCB faster than they can be processed.
* No port to receive—activates when there is not a port in the SBC software

configured to receive the message.
* Time out—activates when a VistaNET message was not received or

transmitted in the time allowed.
* Unfinished multi-block—activates when an incomplete multiblock message is

received.
* Unsolicited reply—activates when a response message is received and there

is no reply pending.
* Unreachable destination—activates when a message that requires a response

has a return address that the GCC could not route the message to.
* Socket purged—activates when a VistaNET message is received in which

there is no waiting task.
VWS Link
* Channel 1 Timeout—activates when a VWS message was not received or

* Channel 2 Timeout—activates when a VWS message was not received or

* Undefined Message Channel 1—activates when the GCC receives a

message from the VWS that the GCC cannot interpret (often caused by
a VWS failure).
* Undefined Message Channel 2—activates when the GCC receives a

message from the VWS that the GCC cannot interpret (often caused by
a VWS failure).
* Checksum Error Channel 1—activates when the GCC receives a message

that is corrupted (often cause by an on-line or VWS failure).
* Checksum Error Channel 2—activates when the GCC receives a message

that is corrupted (often cause by an on-line or VWS failure).
* Transmit Failure Channel 1—activates when the GCC sends a message to the
VWS but does not receive acknowledgement.
* Transmit Failure Channel 2—activates when the GCC sends a message to the
VWS but does not receive acknowledgement.
2000-SVC, C1 2-39
* Primary/Backup Switched—activates when GCC reverses its primary and
backup data links because of timing discrepancy with the VWS. This
only signifies a failure when there is also another communication alarm.
* NAK From DACS—activates when a "No Acknowledgement" message is

received.
2.8.9 Pressure Board
When “Pressure Board:” appears as the main alarm, one or more pressure alarms
appears below the main alarm. Pressure alarms are of two types, overall alarms
and zone-specific alarms, with the zone-specific alarms subordinate to the overall
alarms. Typical overall pressure alarms and their descriptions are:
* ROM Checksum—activates when the EPC Multibus PCB has failed.
* Communications—activates when communications between the SBC PCB

and the EPC Multibus PCB have failed.
* Zone Specific—activates when one of the zone specific alarms is activated.
If the “*Zone Specific” subordinate alarm appears, at least two additional lines
appear below that. The first line identifies which zone produced the alarm and the
second line identifies the specific alarm condition. Typical zone specific alarms and
their descriptions are:
* Zone Checksum—activates when there is an EEPROM problem.
* Out of Control—activates when the ramp rate settings exceed an acceptable

range or the analyzer is unable to maintain set point.
* Zero Failed—activates when the Zero pressure is not present, or the switch
has not been depressed.
* Set Point Failed—activates when Zone is inactive; zone is SWITCH zone and
switch not depressed or set point is greater than the configured pressure
range.
* Ramp Rate Failed—activates when the ramp rate settings exceed an

acceptable range.
* Reconfiguration Failed—activates when switch not depressed.
* High Alarm—activates when the maximum pressure limit set in configuration

is too low.
* Low Alarm—activates when the minimum pressure limit set in configuration is

too high.
NOTE
If either of the next two alarms occurs, information can be displayed

and/or the analysis can be aborted, per the Pressure Check Table
option selections.
* Pressure Check Table
2-40 2000-SVC, C1
* Entry 01, DILUTER > 600 psig (example)
2.8.10 Temperature Board
When “Temperature Board:” appears as the main alarm, one or more temperature
alarms appears below the main alarm. Temperature alarms are of two types, overall
alarms and zone-specific alarms, with the zone-specific alarms subordinate to the
overall alarms. Typical overall temperature alarms and their descriptions are:
* ROM Checksum—activates when the DTC Backplane PCB has failed.
* No Zero Crossing—activates when there is loss of four or more consecutive

AC line cycles.
* Zone Specific—activates when one of the zone specific alarms is activated.
* Loss of Air—activates when there is temporary loss of air to Zones 1 and 2

heaters. The analysis cycle aborts. When this alarm occurs, power will
be removed from the heaters of air-operated zones for as long as the
loss or air condition exists. When air pressure is restored, power is
restored to the heaters.
NOTE
If one of the following alarms occurs, the analyzer will stop and power
will be removed from all heaters. To resume operation, you must turn
power OFF and back ON, and then restart the analysis.
* Overtemp Test—activates when the overtemp micro fails. It may signify a

zone triac failure.
* Communications—activates when communications between the SBC PCB

and the DTC Backplane PCB have failed.
* Overtemp Triac—activates when Micro 1 control triac fails during

overtemperature test.
* Ambient Limit Exceeded—activates when the internal ambient temperature of

80° C is exceeded.
* Heater Barrel TC Faulty—activates when the heater barrel thermocouple is

faulty.
* T-Rating Disagreement—activates when Micro 1 and Micro 2 T-Rating jumpers

do not agree.
* Analysis Shutdown—activates when the Temperature Board alarm has

signaled the SBC with information that will be used to determine
whether to abort the analysis.
If the “*Zone Specific” subordinate alarm appears, at least two additional lines
appear below that. The first line identifies which zone produced the alarm and the
second line identifies the specific alarm condition. Typical zone specific alarms and
their descriptions are:
2000-SVC, C1 2-41
* Reasonableness Test—activates when probe and thermocouple disagree by
more than 100° C.
* Triac Failure—activates when a control triac misfires consistently.
* Zone Checksum—activates when there is a EEPROM problem.
* Out of Control—activates when the ramp rate settings exceed an acceptable

range or the analyzer is unable to maintain set point.
* Zero Failed—activates when Zero resistance is not 400 ohms, or the switch is
not depressed (Zero is not required in the field).
* Span Failed—activates when Span resistance is not 1000 ohms, or the switch
is not depressed (Span is not required in the field).
* Set Point Failed—activates when Zone is inactive; zone is SWITCH zone and
switch not depressed or set point is greater than T-Rating.
* Ramp Rate Failed—activates when the ramp rate settings exceed an

acceptable range (50° C per minute).
* Reconfiguration Failed—activates when switch not depressed.
* High Alarm—activates when the maximum temperature limit set in

configuration is too low.
* Low Alarm—activates when the minimum temperature limit set in

configuration is too high.
NOTE
If either of the next two alarms occurs, information can be displayed

and/or the analysis can be aborted, per the Pressure Check Table
option selections.
* Temperature Check Table

* Entry 02, PROG OVEN > 320 deg C (example)
NOTE
If one of the following alarms occurs, the analyzer will stop and power
will be removed from all heaters. To resume system operation, turn
the power OFF and back ON, and then restart the analysis.
* Overtemp—activates when the zone temperature has exceeded the displayed

T-rating.
* Probe Open/Shorted or TC Faulty—activates when there is a defect in the

zone sensor or interconnect.
2-42 2000-SVC, C1
2.8.11 Raw Chromatogram Storage
When “Raw Chromatogram Storage:” appears as the main alarm, one or more
chromatogram alarms appears below the main alarm. Typical chromatogram alarms
and their descriptions are:
* Memory Below 20%—activates when the memory pool used for

chromatogram storage is below 20%.
* No Memory Left—activates when chromatogram storage has used all

available memory.
* Current Analysis Save Aborted—activates when the GCC is unable to save

the last chromatogram.
* Could Not Save Analysis—activates when the GCC is unable to save the last
chromatogram.
2000-SVC, C1 2-43

P.O. Box 831
Lewisburg, WV 24901

Fax (304) 645-4236

Fax (304) 647-1837

2-44 2000-SVC, C1
SECTION 3. TEST PROCEDURES
3.1 TP 1: CARRIER, MAKEUP AND UTILITY GAS SUPPLIES
If you suspect a gas supply (flame, fuel, air) problem, perform the following test.
1. Stop Analysis at end of current analysis, and make no sample injection until
procedure is completed.
2. Check gas supply pressures at the analyzer pressure gauges or EPC screens.
Pressure indications should indicate normal operational values as indicated on
the application data sheets or last valid record.
3. If values are low, check gas supply at source gauges. Verify gas cylinder
valve(s) are open and that gas cylinder regulator(s) are adjusted for the correct
outlet pressure. Verify isolation valves which supply carrier or makeup gases to
the analyzer are open. Verify the cylinder gas supply is not depleted. Make
necessary adjustments and replace empty gas cylinders with full ones.
4. Check the inlet filter or restrictor to ensure it is not plugged.
NOTE
Gas pressures include all carrier, hydrogen FID fuel, burner air and
utility air supplies.
3.2 TP 2: CARRIER AND MAKEUP GAS FLOW ADJUSTMENTS
CAUTION
When the carrier supply is turned on, if there is no pressure indicated

on the carrier gauge, do not increase carrier flow. Leak check every
connection outside the analyzer on the entire carrier flow path.
1. Stop Analysis at the end of the current analysis and make no injection until
2. (FID ONLY) Extinguish flame by removing burner air and fuel.
3. Refer to the application data sheets supplied with your analyzer and verify
correct reference and column carrier flow rates, correct hydrogen fuel and
burner air flow rates (if FID), correct splitter adjustment, and correct air pressure
adjustments.
4. Make necessary adjustments and balance detector using Test Procedure 5

(Detector Balance).
2000-SVC, C1 3-1
3.3 TP 3: SAMPLE VALVE LEAKING/COLUMN FLOODING
WARNING
CAUTION

immediate area of the analyzer. The purged electronics sections of
the analyzer will be declassified when purge is removed, and a danger
exists for fire , explosion damage or injury to property and injury or
death to plant personnel during the nonpurged time. Obtain proper
permits such as hot work, etc.
1. Stop Analysis at the end of the current analysis, and make no sample injections
until procedure is completed.
2. Isolate sample valve from the sample system using sample system isolation
valves.
3. Take necessary environmental and personal safety precautions. Slowly

disconnect sample inlet line and outlet lines at the sample valve and relieve
sample pressure. Do not disconnect line until all pressure has relieved.
Connect a short piece of stainless steel tubing to the sample valve outlet to a
suitable approved waste collection container.
4. Using stainless steel tubing connect a source of 25 psig nitrogen directly to the
sample valve inlet fitting (bottom). Purge all sample from the sample valve into
the waste container via the short piece of tubing previously connected. When
nitrogen purging is complete, (30 seconds), shut off nitrogen purge gas.
5. Raise the oven temperature to final set-point +20% and hold. Perform Test
Procedure 31 (Checking Temperature Table Values), steps 1 to 3, 8 and 9, and
observe the oven temperature (column).
NOTE
Steps 6 and 7 are optional. The existing column can be removed and
another installed prior to performing step 5.
6. Observe baseline for two times the normal cycle time. If baseline offset is
reduced, the sample valve is most likely leaking.
7. If little or no correction in baseline is seen, replace the column. If no column is

available, leave overnight in this state. If the problem is due to column flooding,
great improvement or elimination of offset should be apparent the next morning.
If the column was flooded, repair the sample valve prior to applying sample to
the sample valve or making an injection.
3-2 2000-SVC, C1
3.4 TP 4: CARRIER OR MAKEUP GAS REGULATOR
CAUTION
When the carrier supply is turned on, if there is no pressure indicated

on the carrier gauge, do not increase carrier flow. Leak check every
connection outside the analyzer on the entire carrier flow path.
1. Stop Analysis at the end of current analysis, and make no sample injection until
the procedure is completed.
2. Ensure carrier or makeup gas is applied to the analyzer by performing Test

Procedure 1 (Carrier, Makeup, and Utility Gas Supplies).
3. No carrier or makeup gas pressure is indicated on analyzer gauges (regulator

failed closed), large leak from regulator inlet to supply, gauge has failed, or
tubing is restricted or plugged.
4. Leak check every connection outside the analyzer on the entire carrier flow
path. Perform step 5 only after step 4 has been completed and all leaks are
repaired.
5. Loosen inlet fitting nut and check for presence of carrier or makeup gas using a
leak detector solution.
6. If carrier or makeup gas is present, repair or replace the analyzer carrier or

makeup gas regulator. If carrier or makeup gas is not present, continue
checking for the presence of carrier or makeup gas working back toward the
gas supply. Loosen each fitting one-at-a-time. Check each fitting for the
presence of gas using a leak detector. Once carrier or makeup gas is detected,
the trouble is isolated between the present and last connection checked. Make
necessary repairs. Tighten all fittings and check for leaks.
7. Adjust carrier or makeup gas pressure for pressure indicated on the analyzer
carrier pressure gauge. If pressure adjusts to the correct value, stop this test
and perform Test Procedure 2 (Carrier and Makeup Gas Flow Adjustments) and
Test Procedure 5 (Detector Balance).
8. If carrier or makeup pressure cannot be adjusted, repair or replace regulator.
3.5 TP 5: DETECTOR BALANCE
1. Stop Analysis at the end of the current analysis and make no injection until
2. On the Background screen press the F2 (Manual Control) soft key.
3. On the Manual Control Mode screen press the F2 (Detector and Graphics) soft
key.
4. On the Chroma Board screen press the F3 (Manually Zero Baseline) soft key.
The Detector Reading should change to a value of 2.00 mV ±0.05 mV.
2000-SVC, C1 3-3
5. On the Chroma Board screen note the Hardware Zero, Software Zero, and
Detector Reading values.
6. Open the Controller front door and locate the Detector Amplifier on the left side
wall of the Controller.
7. Adjust the TCD Adjust potentiometer (located on the Detector Amplifier) until
the Detector Reading is equal to the sum of the Hardware Zero and Software
Zero values noted in step 5.
8. Press the F3 (Manually Zero Baseline) soft key and recheck the readings. The
detector is adequately zeroed when the Hardware Zero percentage is less than
10%.
9. Close and tighten the Controller front door.
3.6 TP 6: FILAMENT TEST
CAUTION


requirements.
1. Stop Analysis at the end of the current analysis cycle, and make no sample
injection until procedure is completed.
2. Remove power from analyzer.
3. Shut off carrier to analyzer.
wall.
5. Remove the six thumb nuts, cover, and plastic shield from the Detector
Amplifier. Then locate TB16 .
6. Disconnect the wires on TB 16 terminals 2 (red) and 8 (white).
7. Connect ohmmeter leads between TB16 terminal 7 and the white wire removed
from terminal 8, and measure the resistance of the measure filament.
8. Connect ohmmeter leads between TB16 terminal 1 and the red wire removed
from terminal 2, and measure the resistance of the reference filament. The
measured values of the two filaments should be within one ohm of each other.
3-4 2000-SVC, C1
9. If the filaments are not within one ohm of each other, replace the filaments. See
“Filament Replacement” in Section 4.
10. Check filament to ground resistance with an ohmmeter. It should indicate an

open circuit.
11. If filament resistance is within tolerance, proceed to Test Procedure 7 (TCD

Electronics).
12. Check all connections, then replace the Detector Amplifier plastic shield, cover,
and thumb nuts.
14. Apply air and carrier to analyzer.
15. Apply power.
16. When analyzer temperature stabilizes, perform Test Procedure 5 (Detector

Balance).
3.7 TP 7: TCD ELECTRONICS
1. Perform steps 1 through 5 of Test Procedure 6 (Filament Test), observing

Cautions.
2. Remove power.
wall of the Controller. Remove the six thumb nuts, cover, and plastic shield
from the Detector Amplifer.
4. Note the wire colors on Detector Amplifier TB16 terminals 1 (orange), 2 (red), 7
(black), and 8 (white). Remove filament wires from TB16 terminals 1, 2, 7 and
8, and substitute a pair of filaments that are mounted in a “dummy” detector cell
body.
5. Apply power to analyzer.
6. Perform Test Procedure 5 (Detector Balance).
7. If detector balances and noise is eliminated, the electronics is functioning

normally. The trouble is associated with filaments, filament wiring, filament
wiring connections, carrier flow or contaminated sample train associated with
sample valve. Perform Test Procedure 6 (Filament Test), Test Procedure 2
(Carrier and Makeup Gas Flow Adjustments), Test Procedure 3 (Sample Valve
Leaking/Column Flooded), and Test Procedure 8 (Column Train Problems), as
applicable. Then proceed to step 15.
8. If the detector does not balance or has excessive noise, locate the respective
detector signal connector, J13A or J13B, on the mother board.
9. Remove power from analyzer. Disconnect the cable assembly from J13A or
J13B.
2000-SVC, C1 3-5
10. Short between connector pins 1 and 2. Apply power and perform Test
Procedure 5 (Detector Balance).
11. The detector reading should indicate approximately 2.0 mV (stable).
12. Perform the Chroma I/O Test.
13. If the Chroma I/O Test fails, remove power and replace the Chroma I/O PCB.
14. If the detector does not balance or noise remains, remove power and replace
the Detector Amplifier. Take care to copy the jumper configuration of the
original Detector Amplifier.
15. Apply power and perform Test Procedure 5 (Detector Balance).
16. Remove power.
17. Remove the substitue filaments and replace the filament wires.
18. Reconnect or tighten all fittings and check all connections.
19. Replace the Detector Amplifier plastic shield, cover, and thumb nuts.
21. Apply air and carrier to analyzer.
22. Apply power.
23. When analyzer temperature stabilizes, perform Test Procedure 5 (Detector

Balance).
3.8 TP 8: COLUMN TRAIN PROBLEMS
CAUTION


requirements.
1. Stop Analysis at the end of the analysis and make no sample injection until
2. Reduce isothermal and programmed temperature oven air temperatures by

reducing oven air pressures to zero psig.
3. Open Isothermal oven.
3-6 2000-SVC, C1
4. Inspect for disconnected or loose tubing connections or broken column in the
column train from the carrier regulator outlet to the column vent. Reconnect or
tighten all tubing fittings. Check for leaks and make necessary repairs. If
corrections or repairs were made, proceed to step 8.
5. Loosen the fitting connecting the column to the LSV and verify carrier presence
with a leak indicator solution.
6. If carrier flow is not present or is insufficient, continue disconnecting fittings at

each connection in the column train working back toward the carrier supply
one-at-a time, checking for the presence of carrier. When full or nonrestricted
carrier flow is detected, the trouble has been isolated between the present and
last connection checked. Make necessary repair(s). Reconnect or tighten all
fittings and check for leaks.
7. If carrier flow is present and not restricted, reconnect the fitting to the LSV.
Beginning at the column vent, work back toward the previously disconnected
fitting, loosing each fitting in the column train one-at-a-time, checking each
loosened fitting for the presence of carrier. When full or nonrestricted carrier
flow is detected, the trouble has been isolated between the present and last
connection checked. Make necessary repairs. Reconnect or tighten all fittings
and check for leaks.
8. Check for correct carrier flow adjustment. Perform Test Procedure 2 (Carrier
and Makeup Gas Flow Adjustments) and Test Procedure 5 (Detector Balance),
as applicable.
3.9 TP 9: BASELINE CYCLIC TEMPERATURE CONTROLLER (TCD)
1. Refer to temperature control troubleshooting section and monitor temperature

zones for stability and control from the manual temperature control screen.
Alarms relating to unstable temperature may be present (Out of Control).
2. Check for sufficient oven air supply.
3. If temperatures are stable, temperature as a cause can be eliminated.
3.10 TP 10: BASELINE CYCLIC CARRIER REGULATOR
1. Observe the carrier and column pressure gauges in isothermal conditions.

Often contaminated, dirty or cyclic regulator performance can be observed as
the carrier pressure oscillates between two pressure gauge indications. The
gauge pointer movement can be as little as ±1/4 psig or as great as several
pounds.
2. If the outlet pressure of the regulator is cyclic, replace regulator.
3. If performance is questionable, replace regulator.
3.11 TP 11: BASELINE CYCLIC FLOW CONTROLLER
1. If the cyclic baseline is not a function of the isothermal oven temperature or the
carrier regulator, and a flow controller is installed, the flow controller should be
replaced.
2000-SVC, C1 3-7
2. Perform Test Procedure 31 (Checking Temperature Table Values) and Test
Procedure 10 (Baseline Cyclic Carrier Regulator), as applicable.
3.12 TP 12: COMMON USAGE OF GASES
1. Are other analyzers serviced from the same burner air, carrier, or burner fuel
source, experiencing noise? If Yes, then the noise problem is most likely related
to a common utility gas, tubing, fitting, or regulator.
2. Perform Test Procedure 13 (Utility Gas Contamination Procedure).
3.13 TP 13: UTILITY GAS CONTAMINATION PROCEDURE
1. Verify Burner Fuel is UHP Hydrogen (FID ONLY). If not, replace hydrogen
cylinder with UHP Hydrogen. If noise is eliminated, this test is completed. If
noise is still present, continue to step 2.
2. Verify carrier purity. If purity questionable, replace carrier gas cylinder. If noise is
eliminated, this test is completed. If noise is still present, continue to step 3.
3. Replace burner fuel cylinder (FID ONLY). If noise is eliminated, this test is
completed. If noise is still present, continue to step 4.
4. Replace carrier or burner fuel cylinder regulators. If noise is eliminated, this test
is completed. If noise is still present, continue to step 5.
5. Replace or wash tubing from cylinder regulator to analyzer.
6. Disassemble and clean Detector (see “Cleaning FID/Collector” in Section 4).
3.14 TP 14: BURNER AIR CATALYTIC CLEANUP UNIT
1. Determine if air cleanup unit is operational and at operating temperature.

Perform Test Procedure 31 (Checking Temperature Table Values), steps 1 to 3,
8 and 9.
2. If available, connect high purity bottled air to burner air connection. If noise
disappears, see “Repairing Air Cleanup Unit” in Section 4.
3. If bottled air is not available, see “Repairing Air Cleanup Unit” in Section 4.
3.15 TP 15: COAXIAL CABLE
CAUTION


requirements.
3-8 2000-SVC, C1
1. Open isothermal oven door.
2. Gently move or touch coaxial cable, while monitoring detector output on

recorder. Some movement of signal is normal, but spikes of noise should not
occur.
3. If noise spikes are systematically generated, check the coaxial cable

connections.
4. If the connections are correct and tight, replace coaxial cable.
3.16 TP 16: FID REDUCED SENSITIVITY
CAUTION


requirements.
1. Stop analysis at the end of the current cycle and make no sample injection until
the procedure is complete.
2. Check analyzer attenuation in Manual Control Mode. Perform Test Procedure

31 (Checking Temperature Table Values), steps 1 and 2.
3. Verify sufficient sample flow to sample system.
4. Verify sample valve is functioning correctly.
5. Check to ensure correct carrier type: Helium, Nitrogen, etc.
6. Verify correct sample valve ON and OFF times in method table. Perform Test
Procedure 34 (Checking Method Table Configuration).
7. Refer to the application data sheet supplied with your chromatograph and check
carrier, makeup gases particularly splitter flow, and make any necessary
adjustments. Balance detector using Test Procedure 5 (Carrier or Makeup Gas
Regulator).
8. If significant corrections were made in steps 2 through 7, run a single cycle

analysis to determine if sensitivity has improved. If sensitivity is now
satisfactory, Test Procedure 16 is complete. If sensitivity is still reduced,
continue to step 9.
9. Verify detector gain jumper installed correctly.
2000-SVC, C1 3-9
10. Perform Test Procedure 29 (FID Polarizing Voltage Test). If sensitivity is normal,
Test Procedure 16 is complete. If sensitivity continues to be reduced, continue
to step 11.
11. Clean FID as described in “Cleaning FID/Collector” in Section 4.
12. Apply power and gases to analyzer. After temperature stabilizes, check
sensitivity. If satisfactory, Test Procedure 16 is complete. If not, perform steps
13 through 15.
13. Replace electrometer and repeat step 12.
14. Replace coaxial cable and repeat step 12.
15. Replace FID and repeat step 12.
3.17 TP 17: FID WILL NOT LIGHT
CAUTION
Do not ignite the FID flame if the temperature is below operational

level. Low oven temperature will result in condensation damage to
the flame cell.
1. Ensure burner air and burner fuel are adjusted to the values shown on
application data sheets.
2. If flows and pressures cannot be adjusted, Perform Test Procedure 32 (Plugged

Jet or Flame Arrester) to test for jet or air restriction.
3. Remove power and open the Controller front door. Locate the Detector
Amplifier on the left side wall of the Controller and remove the six thumb nuts,
cover, and plastic shield.
4. Connect AC voltmeter leads to TB16 terminals 3 and 4 on the Detector

Amplifier.
5. On the Chroma Board screen, press the F4 (Manual Ignitor On) soft key to
ignite the cell flame. The meter should indicate 1.2 to 1.5 volts AC. If voltage is
not present, the ignitor could be shorted to ground, the auto ignite board could
be defective, or wiring could be disconnected. If the voltage is present, the
defect could be an open ignitor coil.
6. Turn off the burner fuel to extinguish the FID flame and then remove power from
the analyzer.
7. Disconnect the wires from TB16 terminals 3 and 4. Connect an ohmmeter

between these two wires to measure the resistance of the ignitor coil.
8. The resistance of the ignitor coil should measure 0.1 to 1 ohm. If an extremely
high resistance is measured, and the ignitor coil is open, replace the ignitor.
See “Flame Ignitor” in Section 4.
9. Connect the ohmmeter leads to one of the wires and chassis ground.
3-10 2000-SVC, C1
10. Measure the resistance of the ignitor coil to ground. If maximum ohms is not
measured, the ignitor is shorted to ground. Replace the ignitor (see “Flame
Ignitor” in Section 4).
11. Reconnect the ignitor wires to TB16 terminals 3 and 4.
12. If the ignitor coil was replaced, apply power to the analyzer. On the Chroma
Board screen, press the F4 (Manual Ignitor On) soft key. If the FID ignites,
proceed to step 14.
13. If the ignitor is operating properly and no voltage is present between TB16
terminals 3 and 4 when step 11 is performed, replace the Detector Amplifier.
14. Remove power and replace the Detector Amplifier plastic shield, cover, and
thumb nuts. Close and tighten the Controller front door.
3.18 TP 18: VERIFICATION FID FLAME IS IGNITED
One of the primary products of combustion is water. Water vapor produced by the
FID flame is discharged from the FID vent. One way to verify the FID flame is
ignited is to observe the condensation of the water vapor.
1. Disconnect the FID vent and hold a reflective surface such as a mirror, wrench
or other suitable object at such an angle that you can see the reflective surface.
2. If the FID flame is ignited, you will be able to see the condensed water vapor
form on the reflective surface.
3.19 TP 19: SAMPLE VALVE ACTUATION AIR
CAUTION


requirements.
1. Check valve assignment in method tables.
2. Verify actuation air is being applied to the sample valve. Gently loosen the two
1/8 inch fittings at the actuator. Apply “Leak Tech”, “Snoop” or other similar
liquid leak detector to the back of the fittings.
3. From the background screen turn on valve 1. The outside actuation tube fitting
should produce bubbles. Turn off valve 1. The bubbles should now be
produced on the inside fitting.
2000-SVC, C1 3-11
4. If no air is present, check to ensure air is being applied to solenoid valve by
loosening the solenoid air supply inlet connection and test for the presence of
air with a leak detection solution. If air is applied to the solenoid valve, test to
ensure that the solenoid actuation voltage is being applied.
5. Turn off purge air to analyzer.
6. Open the Controller front door.
7. Connect voltmeter leads across DC Solenoid Driver PCB S1 terminals 1 and 2.

From the Background screen operate valve 1. The voltage to the 4-way
solenoid valve should measure 110 Vdc when the valve is on and zero Vdc
when the valve is off.
8. If the voltage is being applied, yet the valve is not switching, replace the
solenoid valve.
9. If no voltage is present, remove power and disconnect both solenoid valve

leads from S1 terminals 1-2.
10. Apply power and repeat step 7.
11. If no voltage is present, check the AC voltage to the DC Solenoid Driver PCB.
Adjust the voltmeter to read 120 Vac.
12. Connect the voltmeter leads between J( terminals 1 and 2. If voltage is present,
proceed to step 15.
13. If 120 Vac is not present, check the voltage at Solenoid #1 VAC J9A terminals 1
and 2. If voltage is present at J9A terminals 1 and 2, check the connections at
both ends of the cable connecting J9A and J9.
14. Remove power and disconnect the cable between J9A and J9. Check
continuity between J9A terminals 1, 2, and 3 and J9 terminals 1, 2, and 3,
respectively. If any wires are open replace the cable, apply power and repeat
step 11.
15. Apply power to analyzer and switch DC solenoid driver using procedure in step
7.
16. If voltage does not switch, replace DC solenoid valve driver PCB.
17. If voltage does not switch, replace Chroma I/O board.
19. Apply purge air and power.
20. Allow temperature to equilibrate.
21. Perform an analysis to verify analyzer operation.
3.20 TP 20: DOUBLE SAMPLING
1. Request an analysis run on stream 10 (calibration).
3-12 2000-SVC, C1
2. Verify double apex peaks by analyzing calibration standard of individually
resolved peaks.
3. When the analysis begins, stop the analysis at the end of the cycle.
4. Schedule Sample Valve Off at cycle time plus 20 seconds.
5. Run a second analysis. When the second analysis begins, stop analysis at the
end of the cycle. If valve is double sampling, the peak shape will now be
normal in most cases.
6. Schedule valve off at normal cycle time.
7. Manually switch the Sample Valve Off and observe the chromatogram. A
second set of peaks may now appear. (This is another indication of double
sampling.)
8. Turn off power, carrier, and sample supply to the analyzer.
9. Replace sample valve seals and stem (see “Sample Valve Repair” in Section 4).
10. Restore carrier, sample, and power.
11. Request calibration analysis to verify problem is solved.
3.21 TP 21: VARIABLE SAMPLE SIZE
1. For a liquid sample valve, observe the analyzer effluent sample flow rotometer
for the presence of bubbles. The sample pressure and temperature must be
such that the sample pressure at the sample valve is 25 psig above the bubble
point of the sample.
2. Ensure that the sample pressure at the sample valve is above the bubble point
of the sample.
3. A booster pump may be necessary for process sample if the supply pressure is
below the bubble point of the sample or the sample flow rate is not adequate at
the supply pressure.
4. Compare the temperature zone temperatures with those of your application

data sheets sent with your chromatograph. Perform Test Procedure 31
(Checking Temperature Table Values) and make any necessary table
corrections. Bubbles at the sample valve effluent generally indicate the sample
temperature is above the bubble point of the sample. Carrier gas displacement
of sample stem groove volume may be occurring due to leaking valve seals,
causing varying sample size.
5. Increase sample flow and backpressure by adjusting metering valves at sample

system. Perform an analysis and check repeatability. If the analyzer repeats,
proceed to step 11.
6. For a vapor sample valve, ensure the sample valve effluent is referenced at
atmospheric pressure. A sample shutoff valve may be required or is not
operating or is not functioning properly.
2000-SVC, C1 3-13
8. Turn off power and air to the analyzer.
9. Open isothermal oven door and the programmed temperature cover (if
applicable). Remove the cover to access the column.
10. Leak test column train. When complete, close ovens with reverse procedure of
step 9.
11. If leaks were found, restore air and power. After temperatures stabilize, perform
an analysis to test repeatability. If analyzer repeats, Test Procedure 21 is
complete.
12. Repair sample valve, replacing stem and seals (see “Sample Valve Repair” in
Section 4).
13. Apply air, carrier, sample, and power to the analyzer. Let temperatures stabilize
and perform an analysis and check the repeatability.
3.22 TP 22: OPEN TEMPERATURE SENSOR
CAUTION


requirements.
1. Remove power and purge air from the analyzer.
2. Let all temperature zones cool to ambient.
3. Open the Controller side door.
4. Disconnect the sensor and measure its resistance value. The resistance of the
temperature probe should be approximately 440 ohms at 75 degrees F. If open
(extremely high), replace probe. The respective probes may be tested at the
locations given below:
Temperature J48A
Zone Board Terminals Assignment
1 4 & 5 Isothermal Oven

2 4 & 5 Programmed Temperature Oven
3 4 & 5 LSV
4 4 & 5 Detector
5 4 & 5 Methanizer/Air Cleanup
3-14 2000-SVC, C1
5. If temperature probe is open, replace the temperature probe.
6. Close and tighten the Controller side door.
3.23 TP 23: SHORTED TEMPERATURE SENSOR
CAUTION


requirements.
4. Disconnect the sensor and measure its resistance value. The resistance of the
temperature probe should be approximately 440 ohms at 75 degrees F. If
shorted or considerable lower, replace probe. The respective probes may be
tested at the locations given below:
Temperature J48A

3 4 & 5 LSV
4 4 & 5 Detector
5. If temperature probe is shorted, replace the probe.
2000-SVC, C1 3-15
3.24 TP 24: LOSS OF OVEN AIR
CAUTION


requirements.
1. Disconnect power and shut off air to analyzer.
3. Disconnect the oven air pressure switch by removing the connector from J42B
on the DTC Backplane PCB (see Figure 3-1).
J42B
Figure 3-1. DTC BACKPLANE PCB
4. Connect an ohmmeter between the terminals of the connector removed from

J42B.
3-16 2000-SVC, C1
5. Apply oven air pressure.
6. Unscrew the pressure switch slightly and check for leakage to ensure air is
present at the switch.
7. Tighten pressure switch.
8. The switch should close. Remove air and the switch should open. If switch
does not function as described, replace the oven air pressure switch.
3.25 TP 25: ISOTHERMAL OVEN OVERTEMP SENSOR OPEN
CAUTION


requirements.
1. Remove power from the analyzer.
4. Check for loose connections at the specified terminal connections.
5. Disconnect the thermocouple sensor from J49A terminals 1 and 2 of the Zone 1
Temperature Zone PCB.
6. Connect ohmmeter leads between the two disconnected wires and measure the
resistance value. If the resistance is extremely high, the thermocouple is open.
Replace thermocouple.
7. After repairs, close and tighten the Controller side door.
8. Restore air and power.
2000-SVC, C1 3-17
3.26 TP 26: ZONE INPUT SENSOR OPEN
CAUTION


requirements.
4. Check for loose connections at the specified terminal connections.
5. Disconnect the RTD sensor from J49A terminals 4 and 5 of the appropriate
Temperature Zone PCB.
6. Connect ohmmeter leads between the two disconnected wires and measure the
resistance value. Typical resistance will be approximately 430 to 450 ohms at
ambient temperature. If resistance is extremely high, the RTD is open.
Replace the RTD. The respective probes may be tested at the locations given
below:
Temperature J49A

3 4 & 5 LSV
4 4 & 5 Detector
3.27 TP 27: OPEN OR SHORTED HEATER
CAUTION

3-18 2000-SVC, C1
CAUTION

requirements.
3. Locate heater terminal strip connections.
Temperature
Service Zone Board J49B
Isothermal Oven Zone 1 1 and 2

Programmed Temp Zone 2 1 and 2
LSV (120 Vac) Zone 3 1 and 2, 5 and 6
LSV (220 Vac in, 120 V heaters) Zone 3 2 and 3, 4 and 5
LSV (220 Vac in, 220 V heaters) Zone 3 1 and 2, 5 and 6
Detector Zone 4 1 and 2
Methanizer/Air Cleanup Zone 5 1 and 2
4. Check for a loose connection at the defective temperature control circuit.
5. Remove one of the two wires to the defective temperature zone heater.
Connect an ohmmeter across these heater wires and measure the resistance
of the heater.
6. If open, the measurement will be extremely high. Typical resistance value is 10

to 120 ohms. Also check for shorted heater to ground. A shorted heater may
have opened the heater fuse.
7. Perform Test Procedure 28 (Open Fuse to AC Conditioning Board).
8. If resistance indicates the heater is opened or shorted, replace the defective

heater (see “Replacing Heaters” in Section 4).
3.28 TP 28: OPEN FUSE TO AC CONDITIONING BOARD
CAUTION


requirements.
2000-SVC, C1 3-19
3. Locate Fuses F1 and F2 on the AC Conditioning Board.
4. Remove the fuse(s) in question and test with an ohmmeter. The measurement
should be approximately zero ohms. If the fuse is open, the measurement will
be extremely high.
5. Replace blown fuse. Since a blown fuse may indicate other possible
malfunctions or failures, continue with this procedure to verify the analyzer’s
operational status.
6. Test for shorted heater by performing Test Procedure 27 (Open or Shorted

Heater).
7. Apply power to analyzer and determine if the fuse fails (opens).
8. If fuse fails, replace the AC Conditioning Board.
3.29 TP 29: FID POLARIZING VOLTAGE TEST
CAUTION


requirements.
1. Stop the analysis.
2. Open the Controller front door.
3. Locate the Detector Amplifier on the left side wall of the Controller. Remove the
six thumb nuts, cover, and plastic shield from the Detector Amplifier.
4. Connect a DC voltmeter from Detector Amplifier TB16 terminal 5 to chassis

ground. The meter should indicate -110 volts DC. If voltage is -110 VDC, Test
Procedure 29 is complete. If the voltage is less than -110 VDC continue with
step 5.
5. Disconnect the wire to the polarizer at TB16 terminal 5 and measure the
voltage as in step 4.
3-20 2000-SVC, C1
6. If the voltage indication is below -110 VDC at the 110 volt power supply, replace
the 110 volt power supply.
7. If the voltage is -110 VDC, remove power from the analyzer and shut down
carrier and makeup gases.
8. Remove polarizer wire from TB16 terminal 3 and connect an ohmmeter

between the disconnected wire and chassis ground. The meter should indicate
an extremely high resistance (infinity), meter maximum. A lower resistance
value may indicate a short, or presence of corrosion or water. The high value
gives no assurance that the polarizer is contacting the jet.
9. If any repairs were made, the sensitivity should be checked by applying power
to the analyzer and allowing temperatures to equilibrate. Balance detector per
Test Procedure 5 (Detector Balance) and perform an analysis. If analysis
demonstrates correct sensitivity, Test Procedure 29 is complete.
10. Remove power from the analyzer and shut down carrier and makeup gases.
11. Clean the detector cell. See “Cleaning FID/Collector” in Section 4.
12. Reconnect the wire to TB16 terminal 3 and apply power to the analyzer.
13. Measure with a DC voltmeter between the jet and chassis ground for -110 VDC.
Once confirmed remove power for reassembling.
14. Complete FID assembly.
15. Close and tighten the Controller front door and the isothermal oven door.
16. Apply carrier, makeup gas, and power.
17. Allow temperatures to equilibrate and perform an analysis to confirm correct

sensitivity and detector operation.
3.30 TP 30: “FLAME OUT” LED REMAINS ON AFTER FID FLAME IGNITION
CAUTION


requirements.
Do not ignite the FID flame if the isothermal oven temperature is

below operational level. Low oven temperature will result in
condensation damage to the flame cell.
2000-SVC, C1 3-21
1. Stop Analysis at the end of analysis cycle and make no sample injections until
2. Perform Test Procedure 1 (Carrier, Makeup, and Utility Gas Supplies) and Test
Procedure 2 (Carrier and Makeup Gas Flow Adjustments), if not previously
checked.
3. Remove power from the analyzer and open the Controller front door.
4. Locate the Detector Amplifier on the left side wall of the Controller and remove
the six thumb nuts, cover, and plastic shield from the Detector Amplifier.
5. Disconnect the thermocouple wires connected to Detector Amplifier TB16

terminals 1 and 2.
6. Connect an ohmmeter between the two thermocouple leads. The ohmmeter

reading should indicate continuity. If it does not, the thermocouple is open.
Replace the thermocouple (see “FID Repair/Replacing the Thermocouple” in
Section 4).
7. Connect the ohmmeter between one of the thermocouple leads and chassis
ground. The resistance should be high. If it is not high, the thermocouple may
be shorted to chassis ground. Replace the thermocouple (see “FID Repair/
Replacing the Thermocouple” in Section 4).
8. Reconnect the thermocouple wires.
9. Apply power to the analyzer.
10. Connect a digital voltmeter across capacitor C6 (see Figure 3-2).
C6
Figure 3-2. FID AMPLIFIER SHOWING C6 LOCATION
11. Extinguish the FID flame. The “Flame Out” LED should illuminate. The DVM
should indicate 2.5 mV or less.
12. Ignite flame and the LED should go out. The DVM should indicate 3.0 mV or
greater.
3-22 2000-SVC, C1
13. If the electronics does not perform as described in steps 9 through 11, remove
power and replace the Detector Amplifier.
14. Perform FID cell maintenance for cleaning jet and flame out thermocouple (see
“FID Jet Inspection and Cleaning” in Section 4).
15. Replace the plastic shield, cover, and thumb nuts on the Detector Amplifier.
3.31 TP 31: CHECKING TEMPERATURE TABLE VALUES
Verify that the software and hardware temperature parameter values are correct and
have not been inadvertently changed. To perform this operation, it is necessary to
access the temperature configuration table and the manual temperature control
mode.
1. Press the F1 soft key until the Background screen is displayed (see Figure 3-3).
2020-9A (C) 1997
*** Alarm ***
*** Alarm *** 11-Mar-1997 TUE 08:16:01
*** Alarm ***

entered
Exit Manual Cur Report,

To Control Basic I/O & Alarms
Commands Options
F1 F2 F3 F4
2. On the Background screen press the F2 (Manual Control) soft key.
2000-SVC, C1 3-23
3. On the Manual Control Mode screen (see Figure 3-4), press the F4 (Press. &
Temp. Control) soft key.
****** Manual Control Mode ******

Valves:- - - - - - - Time:00000
Enter Valve: [0] Cycle Time:00000
RECORDER: Method Tbl: 000
Offset : 0 % Stream: 01
Attn : 5 Purging: 01
Off Chroma Bar Trend Peaks: 00
PURGE SELECT: :0 State: Idle
Start Crest End Peak
Time Time Time Area Type
Last: 52 55 73 18032 Val-Bas
38 43 51 15322 Bas-Val
Exit Detector Manually Press. &

to and Zero Temp.
Bckgrnd Graphics Baseline Control
F1 F2 F3 F4
Figure 3-4. MANUAL CONTROL MODE SCREEN
4. On the Pres & Temp Control screen (see Figure 3-5), cursor up or down to
highlight TEMP CONFIGURATION.
**** Pres and Temp Control ****
TEMP CONTROL
PRES CONTROL
TEMP CONFIGURATION
Temp
Bd View
Escape Config Alarms
F1 F2 F3 F4
Figure 3-5. PRESSURE AND TEMPERATURE CONTROL SCREEN
3-24 2000-SVC, C1
5. Press the F2 (Temp Bd Config) soft key to view the Temp Config Table screen
(see Figure 3-6). The temperature configuration table is factory set, and is NOT
intended to be field modified. However, in the unlikely event that one of the
parameters was changed, the values should be compared to those in the table
listing provided with chromatograph.
**** Temp Config Table ****

Zone Low High
Num Name Limit(C) Limit(C)
1 ISO-OVEN -40.00 90.00
2 PROG. OVEN -40.00 250.00
3 T/C CELL -40.00 260.00
4 LSV -40.00 250.00
5 TEMP ZONE5 -40.00 550.00
Exit
F1 F2 F3 F4
Figure 3-6. TEMPERATURE CONFIGURATION TABLE SCREEN
6. If the values shown in the temperature table agree with those of the listing,
there is no need for table modification. Exit this screen by pressing the F1 (Exit)
soft key and go to step 8.
7. If the values do not agree, the values have been changed since the analyzer
was shipped from the factory. The correct value(s) should be entered. To
modify the temperature configuration table, refer to the “Digital Temperature
Controller” in Section 4 of the Operator’s Manual.
8. Confirm the values of the Manual Temperature Control Mode table.
2000-SVC, C1 3-25
9. On the Pressure and Temperature Control screen (Figure 3-5), cursor up or
down until TEMP CONTROL is highlighted. Press the F2 (Manual Temp
Control) soft key to access the Manual Temperature Control Mode screen (see
Figure 3-7).
**** Manual Temperature Control Mode ****

Zone Config Actual SP Rate
ISO-OVEN ISO 79.9C 80.0C 0.0
PROG. OVEN PROG/C 220.1C 220.0C 30.0
T/C CELL SWITCH 199.8C 200.0C 10.0
LSV ISO 199.9C 200.0C 10.0
Valve # : [0] Time : 0125

Zone # : 2 State : Pk Back
Set Point: 220.00
Ramp Rate: 30.0000 T-Rating Ver
VALVES : - - - - - - T2 290C
Accept Zero Span

Escape Control All All
Point Zones Zones
F1 F2 F3 F4
Figure 3-7. MANUAL TEMPERATURE CONTROL MODE SCREEN
10. Compare the set point values of temperature zones 1 through 5 with those of
the factory table listing that was provided with the chromatograph. If the values
agree, there is no need to modify the table. Exit this screen by pressing the F1
(Escape) soft key and proceed to step 12.
11. If the values do not agree, the values have been changed since the analyzer
was shipped from the factory. The correct values should be entered.
12. Return to the background screen by repeatedly pressing the F1 soft key until
the Background screen is displayed.
13. From the Background screen press the F1 (Exit to Commands) soft key.
14. On the Commands screen(see Figure 3-8), cursor up or down to highlight

TABLE EDIT. Then press the F2 (Methods) soft key to access the methods
tables.
3-26 2000-SVC, C1
****** COMMANDS ******
ANALYSIS CONTROL
REPORTS
TABLE EDIT
PRINTER
STORAGE & CONFIG.
NAMES
MISC.
TESTING/SETUP
SIM DISTILLATION
Go to Other
Background Methods Tables
F1 F2 F3 F4
Figure 3-8. COMMANDS SCREEN
15. When the Method Table #?? screen appears, enter “1” for the method and then
press the F2 (Edit the Table) soft key.
16. The Cal Define & Cycle Time screen appears. Press the F1 (Continue) soft key
to display the first eight lines of Method Table # 01 (see Figure 3-9).
***** Method Table #01 *****
Time Function Value

0001 Temp. Contrl Two
0120 Noise Calc On
0125 Noise Calc Off
0128 Auto Zero N/A
0130 Skp, Nxt,Str= Nine
0132 Valve On One
0155 Valve Off One
0160 Distillation On
More Below
Exit Insert Delete Cal Define

Line Line & Cycle
Time
F1 F2 F3 F4
Figure 3-9. METHOD TABLE SCREEN
2000-SVC, C1 3-27
17. Move the cursor up or down to highlight the time associated with Temperature
Control Function Two. Then move the cursor to the right to highlight the value
“Two”. The Temperature Control screen appears (see Figure 3-10).
***** Temperature Control *****
Entry Zone Set Point Ramp Rate

C C/MIN
01 PROG. OVEN 220.0 30.00
02 ISO-OVEN 50.0 0.100
03 ISO-OVEN 0.0000 0.0000
04 ISO-OVEN 0.0000 0.0000
05 ISO-OVEN 0.0000 0.0000
06 ISO-OVEN 0.0000 0.0000
07 ISO-OVEN 0.0000 0.0000
08 ISO-OVEN 0.0000 0.0000
More Below
Exit
F1 F2 F3 F4
Figure 3-10. TEMPERATURE CONTROL SCREEN
18. Compare the set point and ramp rate values with those in the factory table
listings provided with your chromatograph. If they agree, press the F1 (Exit)
soft key. If they do not agree, modify the Temperature Control screen as
explained in “Digital Temperature Controller” (Section 4 in the Operator’s
Manual).
19. Return to background screen by repeatedly pressing the F1 soft key until the
Background screen is displayed.
3.32 TP 32: PLUGGED JET OR BREATHER
CAUTION


requirements.
3-28 2000-SVC, C1
2. If the jet is totally plugged, flame will be extinguished. If restricted, the flame
could possibly still be burning at low intensity.
3. Extinguish flame by reducing burner air, fuel and carrier to zero by rotating
regulator adjustment counterclockwise until burner air fuel and carrier gauges
indicate zero. When flame is out, the “Flame Out” LED will illuminate.
4. Connect flow meter (e.g. bubble tower) to FID vent.
5. Increase carrier pressure to value indicated on the application data sheets

provided with the chromatograph. Both carrier pressure and carrier vent flow
measurement at the FID vent should be the same as indicated on data sheets.
If values are the same, jet and flame arrester are not plugged, Test Procedure
32 is complete. If values are low or nonexistent, the jet or flame arrester may
be plugged.
6. Reduce the temperature programmed (if applicable) and isothermal oven air
pressures to zero psig as indicated by their respective gauges.
7. Open the isothermal oven door.
8. If applicable, remove the temperature programmed temperature oven covers.
9. Disconnect the column fitting at the bottom of the FID. Connect the loose
column end to a flow meter.
10. Measure the carrier flow. If flow is restored to the expected measurement, the
jet or breather is plugged. Proceed to step 12. If flow is deficient, reconnect the
column to the FID and perform step 11.
11. Perform Test Procedure 1 (Carrier, Makeup and Utility Gas Supplies), Test
Procedure 2 (Carrier and Makeup Gas Flow Adjustments), and Test Procedure
8 (Column Train Problems), as applicable. If flow is restored, Test Procedure 32
is complete.
12. Remove the breather and replace with a female connector. Attach the flow
meter to the open end of connector. Measure the carrier flow. If flow is restored
to normal, the flame arrester is plugged. Replace the flame arrester.
13. Repeat steps 4 and 5 above. If flow remains restricted, the jet is plugged.
14. Inspect jet by removing FID cap (see “FID Repair” in Section 4). If jet plugging
can not be corrected by removing accumulated matter on jet tip, the FID must
be replaced. The FID must be returned to the factor for jet replacement. See
“FID Repair” in Section 4 for instruction on removing and reinstalling the FID.
15. Disconnect flow meter, reconnect and tighten all fittings, check for leaks,
reattach programmed temperature oven cover and close isothermal oven door
using reverse procedure of steps 7 and 8.
3.33 TP 33: PEAK DISCRIMINATION
1. Request a calibration analysis.
2000-SVC, C1 3-29
2. Observe the peak areas and new response factors. If a greater percentage
change has occurred in the peak height, peak area, and response factors in the
heavier components than in the lighter, the presence of peak discrimination is
apparent.
4. Perform Test Procedure 8 (Column Train Problems).
5. Routine validation comparisons will help in the early detection of discrimination.
3.34 TP 34: CHECKING METHOD TABLE CONFIGURATION
Verify the method configuration tables as follows:
1. Press the F1 soft key until the Background screen is displayed (see Figure
3-11).
2020-9A (C) 1997
*** Alarm ***
*** Alarm *** 11-Mar-1997 TUE 08:16:01
*** Alarm ***

entered
Exit Cur Report

To Manual Basic I/O & Alarms
Commands Control Options
F1 F2 F3 F4
2. On the Background screen press the F1 (Exit to Commands) soft key.
3. On the Commands screen (see Figure 3-12) cursor to highlight TABLE EDIT.
Then press the F2 (Methods) soft key.
3-30 2000-SVC, C1
****** COMMANDS ******
ANALYSIS CONTROL
REPORTS
TABLE EDIT
PRINTER
STORAGE & CONFIG.
NAMES
MISC.
TESTING/SETUP
SIM DISTILLATION
Go to Other
Background Methods Tables
F1 F2 F3 F4
Figure 3-12. COMMANDS SCREEN
4. When the Method Table #?? screen appears, enter “1” for the method number
and then press the F2 (Edit the Table) soft key.
5. The Cal Define & Cycle Time screen appears. Press the F1 (Continue) soft key
to display the first eight lines of Method Table # 01 (see Figure 3-13).
***** Method Table #01 *****
Time Function Value

0001 Temp. Contrl Two
0120 Noise Calc On
0125 Noise Calc Off
0128 Auto Zero N/A
0132 Valve On One
0155 Valve Off One
0160 Distillation On
More Below
Exit Insert Delete Cal Define

Line Line & Cycle
Time
F1 F2 F3 F4
Figure 3-13. METHOD TABLE SCREEN
2000-SVC, C1 3-31
6. Refer to the table listings provided with your chromatograph. The function
scheduling should be similar to the following:
PROCESS STREAM METHOD TABLE
Method Table #01
Time Function Value

0001 Temp. Contrl One
0128 Auto Zero N/A
0132 Valve On One
0155 Valve Off One
0165 Baseline Proj Forward
0172 Forced Gate On @ Valley
0175 Component One
0178 Forced Gate Off @ Valley
0182 Component Two
0188 Component Three
0208 Component Four
0214 Component Five
0247 Component Six
0262 Component Seven
0290 Component Eight
0710 Stream Step N/A
0768 Component Nine
0769 Component Ten
0770 Component Eleven
0771 Component Twelve
0772 Component Thirteen
0773 Component Fourteen
0774 Component Fifteen
0775 Component Sixteen
0776 Component Seventeen
0777 Component Eighteen
0778 Component Nineteen
0779 Component Twenty
3-32 2000-SVC, C1
CALIBRATION STREAM METHOD TABLE
Method Table #10
Time Function Value

0120 Noise Calc On
0125 Noise Calc Off
0128 Auto Zero N/A
0132 Valve On One
0155 Valve Off One
0160 Slope Detect On Now
0160 Peak Width Eight
0175 Component One
0175 Component One
0182 Component Two
0188 Component Three
0208 Component Four
0217 Component Five
0217 Baseline Force @ Valley
0247 Component Six
0262 Component Seven
0290 Component Eight
0312 Component Nine
0343 Component Ten
0359 Component Eleven
0390 Component Twelve
0424 Component Thirteen
0440 Component Fourteen
0462 Component Fifteen
0509 Component Sixteen
0540 Component Seventeen
0570 Component Eighteen
0601 Component Nineteen
0650 Slope Detect Off
0710 Stream Step N/A
2000-SVC, C1 3-33
The various time coded functions are defined as follows. Section 4 of the Operator's
Manual contains more complete descriptions of these functions.

This function ensures that the temperature of the isothermal oven is at the set point
value prior to sample injection.
0120 Noise Calc On

0125 Noise Calc Off
This function samples the baseline to determine the random noise level of the
baseline and is applicable only to slope detection.
0128 Auto Zero N/A

This function establishes a baseline zero reference point in the controller. It in effect
compensates for the detector offset from electrical zero. Should this function fail or
not be scheduled, errors could occur in gating, peak detection, post analysis
calculations and peak concentration calculations as a result of errors in baseline
correction.
0130 Skp Nxt,Str= Nine

The function at time 0130 causes the next timed function at 0132 to not be
executed. Thus, when the next stream is stream 9 (a blank run), the sample valve
on command will not occur and a sample will not be injected. Should this function
not be scheduled, a whole chromatogram would be saved as a blank run. The
result would be a total or near cancellation of the analysis in the post analysis
calculation.
0132 Valve On One

This function causes the sample injection by inserting the sample volume contained
in the machined groove in valve stem into the injection chamber of the sample valve.
Once in the injection chamber, the liquid sample is vaporized and carried into the
column train by carrier gas. Should this function fail or not be scheduled, no sample
injection would occur.
0155 Valve Off One

This function withdraws the sample machined groove from the injection chamber
into the sample chamber, where liquid sample continually flows across the stem in
preparation for the next injection. Should this function fail or not be scheduled, only
the initial sample injection would occur; the sample loop would never be refilled.
0165 Baseline Proj Forward

This function is used in baseline correction of individual gated peaks.

This function immediately forces integration to begin and designates the peak
topology for the start to be a valley, doing a perpendicular drop to the baseline.
0175 Component One

This function designates which component is being integrated at gate on command.

This function immediately forces integration to stop and designates the peak end
and topology to be a valley, doing a perpendicular drop to baseline.
3-34 2000-SVC, C1
NOTE
All other gate and component descriptions are similarly defined.
3.35 TP 35: VENT BACK PRESSURE
1. Ensure FID or TCD detector vent is vented to atmospheric pressure.
2. Check for insect infestations in vent or atmospheric vent.
3. Replace flame arrester. Check for water in the detector. If necessary clean FID
(see “Cleaning FID/Collector” in Section 4).
3.36 TP 36: PRINTER TEST
1. On the Background screen, press the F1 (Exit to Commands) soft key.
2. Cursor to PRINTER and then press the F2 (Test Printer) soft key. A string of
characters should print.
3. If characters do not print, cursor to TESTING/SETUP and then press the F3

(Hardware Setup) soft key.
4. Match baud rate, parity, parity check and data bits to printer setup.
5. Check the power. The Disconnect switch or circuit breaker to printer must be
ON.
6. Look for alarm lights and take corrective action.
7. Check serial cable connected to the printer input.
8. Ensure printer has serial interface installed and set up correctly, using the
printer or interface operations manual.
3.37 TP 37: RESIDUAL SAMPLE
1. Start sample analysis.
2. Observe the chromatogram. At the end of the cycle, stop the analysis NOW.
3. Perform Test Procedure 31 (Checking Temperature Table Values), steps 1 to 3

and 8, to access the Manual Mode. Reduce the attenuation for maximum
sensitivity.
4. Observe baseline for additional peaks to elute.
5. If peaks elute, analyzer is experiencing a residual sample analysis. After all

peaks have eluted, proceed to step 6. If peaks do not elute, Test Procedure 37
is complete.
6. Turn off power and sample to analyzer. Replace sample valve seals and O-
rings (see “Sample Valve Repair” in Section 4).
2000-SVC, C1 3-35
7. Restore power and allow temperature zones to come to temperature and
stabilize.
8. Perform two regular analyses.
9. In second analysis, determine if residual sample problem is repaired using

steps 2 to 5.
3.38 TP 38: TREND OUTPUT
CAUTION


requirements.
2. Remove access cover to terminals on right hand side of electronics housing.
3. Verify if trend board output is set up for 4-20 ma or 0-5 VDC.
4. If current output, disconnect one wire from the output to be tested, and place
the milliammeter in series with the load. See output terminal assignment
below.
TREND OUTPUT TERMINAL ASSIGNMENT
TREND CHANNEL TB7 + TB7 - SHIELD
1 1 2 5
2 3 4 5
3 6 7 10
4 8 9 10
5 11 12 15
6 13 14 15
7 16 17 20
8 18 19 20
9 21 22 25
10 23 24 25
11 26 27 30
12 28 29 30
13 31 32 35
14 33 34 35
15 36 37 40
16 38 39 40
5. Turn analyzer power on.
3-36 2000-SVC, C1
7. On the Commands screen, cursor down to TESTING/SETUP and then press

the F2 (Diagnostic Tests) soft key.
8. On the Diagnostic Tests screen, cursor down to DIAGNOSTIC TOOLS and

then press the F3 (Trend Output Test) soft key.
9. Enter the a trend test value. The output signal at the meter should respond to
equivalent percentage of output. Test for low, middle, and high.
10. If output does not respond or does not reach the expected output value, check
the following:
a. Connect meter to the output terminal strip TB7 (see connection list
below) of the analyzer and repeat step 9. If functioning normally,
problem is in loop wiring, connection, or input device and proceed to
step 11.
b. Check wiring from analyzer output to input of receiving device.
c. Access Trend Table and determine if it is setup correctly. Make any

necessary corrections.
d. Substitute trend board. Existing board may be defective.
11. If board functions normal locally, but receiving device is not correctly reporting
signal, check the following:
a. With authorized permission, remove one wire from input device of loop
to be tested and connect the ammeter in series (voltage parallel).
Perform step 9 to determine if loop wiring to input device is functional.
b. Check and verify input device input requirement and configuration.
c. Determine if an input shunt resistor is needed and determine value.
d. Input device may need calibrated or rescaled.
3.39 TP 39: DIGITAL I/O PCB
CAUTION


requirements.
2000-SVC, C1 3-37
2. On the Commands screen, cursor down to TESTING/SETUP and then press

the F2 (Diagnostic Tests) soft key.
3. On the Diagnostic Tests screen, cursor down to DIAGNOSTIC TOOLS and

then press the F2 (Digital Output Test) soft key and follow screen instructions.
4. Connect ohmmeter between output terminal of Digital PCB and output common
using proper polarity (these are transistor outputs).
5. If Digital I/O PCB functions, check for data entry.
6. If Digital I/O PCB does not function, it is defective. Replace the Digital I/O PCB.
3.40 TP 40: VISTA WORKSTATION COMMUNICATION TEST
CAUTION


requirements.
1. Open electronics control section door of chromatograph.
2. Observe LED’s 1 and 3 of the Single Board Computer (SBC).
3. If top LED is not active (flickering), there is no transmit activity. The analyzer is
off line with VWS. This must be corrected by accessing the Command Mode
parameters.
4. If command parameters are correct, replace the Single Board Computer.
5. If the bottom LED is not active (flickering), there is no data receive activity. The
VWS is not functioning or there is a possible wiring or connection problem.
6. If it is not a wiring or connection problem, replace the Single Board Computer.
3-38 2000-SVC, C1
3.41 TP 41: LOW CARRIER PRESSURE
CAUTION


requirements.
1. Check to ensure that the carrier has not been shut off. If so, restore carrier
supply.
2. Disconnect power and shut off air to analyzer.
3. Disconnect oven carrier pressure switch at J23A terminals 1 and 2.
4. Connect ohmmeter leads between the two wires previously disconnected from
J23A terminals 1 and 2.
5. Apply carrier pressure of at least 80 psi.
6. The switch contacts should close. Remove carrier pressure; switch contacts
should open.
7. If switch does not function as described, remove carrier pressure and replace
pressure switch.
8. If switch functions as described in step 7, but the alarm remains after the switch
wiring has been reconnected and carrier applied, replace Chroma I/O PCB.
3.42 TP 42: LOW SAMPLE FLOW HARDWARE ALARM
CAUTION


requirements.
1. Check to ensure that the sample flow has not been shut off. If so, restore
sample flow.
2000-SVC, C1 3-39
2. Disconnect power to the analyzer.
3. Disconnect sample flow switch at J23E terminals 1 and 2.
4. Connect ohmmeter leads between these two wires.
5. With sample flowing, the switch should open. Stop sample flow and the switch
should close.
6. If switch does not function as described, replace flow switch.
7. If switch functions as described in step 5, but the alarm remains after the switch
wiring has been reconnected and sample flow established, replace Chroma I/O
PCB.
3.43 TP 43: PROGRAMMED TEMPERATURE OVEN COOL DOWN
CAUTION


requirements.
1. Stop Analysis at the end of this analysis cycle.
2. Check air pressure for correct adjustment. Perform Test Procedure 1 (Carrier,
3. Check all temperature control parameters. Perform Test Procedure 31

(Checking Temperature Table Values), and correct any errors.
4. Access the Manual Temperature Control Mode by performing steps 1 to 3, 8

and 9 of Test Procedure 31 (Checking Temperature Table Values). Change
Zone 2 set point to 220 and rate to 50.
5. Monitor the actual zone 2 temperature. When it reaches 100 degrees, change
the set point to the normal initial set point value and rate to 0.1.
6. You should hear the coolant solenoid valve operate and hear a sudden
discharge of air into the programmed temperature oven.
7. If you do not hear the solenoid valve operate, override the X purge using the
procedure given in Section 4 of the Operator’s Manual. If you hear the solenoid
valve switch, proceed to step 23.
8. Open electronics housing door. LED DS8 should be illuminated. If not, replace
temperature control board.
3-40 2000-SVC, C1
9. Access the Manual Temperature Control Mode by performing steps 1 to 3, 8
and 9 of Test Procedure 31 (Checking Temperature Table Values). Change
zone 2 set point to 220 and rate to 50.
10. Connect voltmeter leads across J42D terminals 1 and 2 and check for the
presence of zero VAC.
11. Monitor the actual zone 2 temperature. When it reaches 100 degrees, change
the set point to the initial set point value and rate to 0.1.
12. Connect voltmeter leads across J42D terminals 1 and 2 and check for the
presence of 115 VAC. If voltage is present, replace the solenoid valve.
13. If no voltage is measured between J42D terminals 1 and 2, check for presence
of 115 VAC between J42C terminals 1 and 2.
14. If voltage is not present at J42C terminals 1 and 2, check for 115 VAC at J46A
terminals 1 and 2.
15. If voltage is present at J46A terminals 1 and 2, shut off power and replace
motherboard.
16. If voltage is present at J46D terminals 1 and 2, remove power from the
analyzer.
17. Disconnect the solenoid valve coil wires from J42D terminals 1 and 2 and
connect an ohmmeter between the solenoid valve wire leads. The solenoid coil
will have a small resistance. Check each lead to chassis ground. If shorted to
ground or questionable, replace solenoid valve or coil. Inspect leads for bare
insulation that could contact chassis or other grounded part and make
necessary repairs.
18. Disconnect the solenoid valve coil wires from J42D terminals 1 and 2 and
connect an ohmmeter between the solenoid valve wire leads. If the coil
resistance is extremely high or infinity, replace the solenoid valve or coil and
fuse. Repeat procedure in step 17.
19. Apply power to the analyzer.
20. Check vortex cooler efficiency in the following manner. Access the Manual
Temperature Control Mode by performing steps 1 to 3, 8 and 9 of Test
Procedure 31 (Checking Temperature Table Values). Change zone 2 set point
to 0 deg and rate to 0.1.
21. Monitor the actual zone 2 temperature until temperature measurement is stable.
WARNING
Discharge air from the vortex cooler is extremely hot and can cause
severe burns.
22. Protecting your hands with insulated gloves, adjust the vortex cooler at the
discharge end for maximum cooling (minimum temperature) as indicated on
actual zone temperature.
2000-SVC, C1 3-41
23. Enter set point at initial temperature.
24. Close and secure all doors and all covers.
3.44 TP 44: STREAM SWITCHING
CAUTION


requirements.
1. Check valve assignment in method tables.
2. Verify stream is active. Make necessary changes.
3. If electric solenoid valve stream switching is used, proceed to step 6.
4. If air operated valves are used for stream switching, verify actuation air is being
applied to the stream select valve actuator. Gently loosen the two fittings at the
actuator. Apply “Leak Tech”, “Snoop” or other similar liquid leak detector to the
back of the fittings.
5. Request an analysis for the steam in question. At stream step, the stream will
begin to purge as indicated on the background screen. Actuation air will be
applied to the respective actuator, producing bubbles at the loose fitting. When
the next different stream is selected, bubbles should cease at the present
actuation line. If the actuation is double acting, air will be present at the other
actuation line and bubbles will be produced by the leak detector. All streams
can be tested in this manner. Reconnect or tighten each fitting that was
loosened.
6. If no air is present, check to ensure air is being applied to solenoid valve by

loosening the solenoid valve air supply inlet connection. Loosen the inlet air
fitting and test for the presence of air with a leak detection solution.
7. If air is applied to the solenoid valve, test to ensure that the solenoid actuation
voltage is being applied.
8. Turn off purge air to analyzer and Override X purge.
9. Loosen the four screws that retain the front cover of the heater box.
10. Request an analysis for the stream in question. At stream step the stream will
begin to purge as indicated on the background screen. Connect voltmeter
3-42 2000-SVC, C1
leads across the stream switch soleniod valve (process) or the calibration
solenoid valve (calibration). The voltage to the solenoid valve should measure
110 VDC when the valve is on and zero volts when the valve is off. If the
voltage is being applied, yet the valve is not switching, replace the solenoid
valve.
11. If no voltage is present, remove power and disconnect both solenoid valve
leads.
12. Connect an ohmmeter between the two solenoid valve coil leads. If open,
(extremely high resistance), replace the solenoid valve or coil.
13. Reconnect solenoid valve coil leads.
14. Apply power to analyzer and switch D.C. solenoid driver using procedure in step
8.
15. If voltage does not switch, replace D.C solenoid valve driver PCB.
16. If voltage does not switch, replace Chroma I/O board.
17. Reconnect and tighten all loose or disconnected fittings, and check for and
repair any leaks.
18. Close and secure all doors and all covers.
19. Apply purge air and power.
21. Perform an analysis and verify analyzer operation.
2000-SVC, C1 3-43

P.O. Box 831
Lewisburg, WV 24901

Fax (304) 645-4236

Fax (304) 647-1837

3-44 2000-SVC, C1
SECTION 4. REPAIR
4.1 REPLACING HEATERS
Refer to Figure 4-1 for component location when replacing heaters.
Temperature
Sensor
Detector
Thermocouple
Methanizer Liquid Sample

Valve
Oven
Heater
Figure 4-1. ANALYZER OVEN COMPARTMENT
CAUTION

See “Air Purging” in Section 4 of the Operator’s Manual for the X-

Purge Override function. Do not perform Override until you have read
Section 4 completely and you understand and can perform the
procedure properly.
4.1.1 Isothermal Temperature Oven Heater
1. Open the Controller front and side doors and the isothermal oven door.
2. On the Zone 1 PCB in the Digital Temperature Controller, disconnect J49B and
remove the isothermal oven heater wires from pins 1 and 2.
3. On the Zone 1 PCB, disconnect J49A and remove the thermocouple wires from
pins 1 and 2.
4. On the DTC Backplane PCB disconnect J42A and remove the thermocouple
wires from pins 1 and 2.
5. Connect a small feeder wire (at least 36 inches long) to one of the heater wires.
2000-SVC, C1 4-1
6. In the isothermal oven disconnect the 1/4-inch fitting from the heater.
7. Extract the heater assembly from the clamp.
8. Withdraw the heater and wires from the feedthrough grommet and into the
oven.
9. Connect the wires from the new heater assembly to the feeder wire pulled
through the tubing.
10. Install the new heater assembly using the reverse procedure, pulling the wires
through the tubing.
4.1.2 Sample Valve Heater
WARNING
Sample valve repair may necessitate the venting of flammable

substances into the atmosphere surrounding the analyzer. Remove
power from all sources of ignition in the immediate area. Do not open
any purged enclosures that remain powered.
Ensure proper safety equipment is worn, such as rubber gloves and

face shield or safety glasses.
CAUTION


procedure properly.
1. Remove power, sample flow, and air from analyzer and allow to cool.
2. Open the Controller front and side doors, and the isothermal oven door.
3. Locate the Zone Sense Board and disconnect the LSV heater and sensor
wires.
4. Withdraw the free end of the vaporizer cable from beneath the Card Cage into
the Controller housing.
4-2 2000-SVC, C1
5. Inside the isothermal oven, loosen any cable clamps securing the vaporizer
cable assembly and free the cable.
6. Disconnect all tubing connections to the LSV in the isothermal oven.
7. Disconnect the air lines from the LSV actuator.
8. Disconnect all tubing connections to the LSV in the isothermal oven.
9. Support the valve with your hand and remove the four Allen screws securing
the valve to the analyzer.
10. Withdraw the sample valve body from the oven.
11. Remove the vaporizer assembly collar from the valve, separate the vaporizer
halves, and remove the vaporizer.
12. Reassemble and connect the vaporizer using the reverse procedure.
4.2 SAMPLE VALVE REPAIR
You must take extreme care to avoid having the sample lines exert force on the
sample connections of the Model 791 Liquid Sample Valve. For example, if stiff 1/4-
inch tubing or heat-traced lines are bent into position and attached to the valve, the
force will cause premature failure of the valve and possibly bend the stem. A loop of
1/8-inch tubing or a flex hose is recommended between the valve and the sample
line (this may be insulated if necessary).
It is also important to use two wrenches when tightening the sample line
conncections to the sample chamber. One wrench must be used to back up the
force applied to tighten the fitting (direct wrench force will bend the stem).
Refer to Figure 4-2 for typical sample valve component location.
4 6
3 7
1 5 8
2
9
22
21
17
20
16
15 14
19 18 13 12 11 10
Figure 4-2. LIQUID SAMPLE VALVE
WARNING
2000-SVC, C1 4-3
Sample valve repair may necessitate the venting of flammable
substances into the atmosphere surrounding the analyzer. Remove
power from all sources of ignition in the immediate area. Do not open
any purged enclosures that remain powered.
Ensure proper safety equipment is worn, such as rubber gloves and

face shield or safety glasses.
CAUTION


procedure properly.
4.2.1 Disassembly
1. Stop the analysis at the end of a cycle.
2. Turn off power, carrier, sample, and air to the analyzer.
3. Remove the two cone point set screws (1 in Figure 4-2) from the cylinder (22).
4. Slide the cylinder (22) off of piston (21) and body (2).
5. Using an Allen wrench, rotate the sleeve (20) counterclockwise until it is loose.
6. Unscrew the body (2) from the flange (13) and vaporizer chamber (10).
7. Remove the vaporizer chamber (10) from the flange (13).
8. Slide the seal (3) from the stem (12) using sample chamber (4).
9. Withdraw the piston (21) and the rod assembly (18) from the sleeve (20).
10. This will free the seal (3) from the stem (12).
11. Inspect the seals for visible imperfections. If imperfections are found, replace
the seals.
12. Inspect the stem for visible imperfections. If imperfections are found, replace
the stem.
13. Remove the rear valve seat (14) from the body (2).
14. Remove the nine Belleville springs (15) from the body (2).
4-4 2000-SVC, C1
15. Remove the O-ring (19) from the body (2) and piston (21).
16. Unscrew the piston rod (18) from the piston (21). and extract the stem assembly
(12) from the piston rod (18).
17. Remove the O-ring (16) from the piston rod (18).
18. Unscrew the sleeve (20) from the body (2).
19. Remove the O-ring (17) from the sleeve (20).
4.2.2 Reassembly Procedure
NOTE
In all steps the lubricant used is High Vacuum Grease.
1. Clean the seals (3) with acetone and dry them.
2. Clean the sample chamber (10) with acetone and dry it.
3. Lightly lubricate O-Ring (17), sleeve threads (2), and internal threads and bore
of the body (2) with High Vacuum Grease.
4. Install the O-ring (17) onto the sleeve (20).
5. Screw the sleeve (20) into the body (2) until the back of the sleeve (20) is flush
with the ears on the back of the body (2), then back the sleeve (20) out 1-1/2
turns.
6. Lightly lubricate the O-ring (16) and the threads of the piston rod (18). Install
the O-ring (16) onto the piston rod (18). Do not allow grease to enter the small
hole through the center of the piston.
7. Insert the stem assembly (12) into the rear of the piston rod (18). Screw the
piston rod (18) into the piston (21) and tighten to 27-30 in-lb. Do not overtighten
or bend the rod or stem! Do not allow grease to contact the stem.
8. Lightly lubricate the two O-rings (19). Install the O-rings (19) onto the body (2)
and the piston (21).
9. Insert the piston (21) and the rod assembly (18) into the sleeve (20). Be careful
not to cut the O-ring. Fully insert the piston (21) until it contacts the stops.
10. Stack the nine Belleville springs (15) (stack opposed) onto the 1/4-inch thin wall
plastic tubing. Using the tubing as a guide, slide the springs (15) over the stem
(12) into the bore of the body (2).
11. Install the rear valve seat (14) over the stem (12) and let it rest against the
springs (15). Do not allow the seat to scratch the stem.
12. Clean all the exposed area of the stem (12) with acetone. Ensure the stem and
groove are free of grease and contamination. Inspect the stem for visible
imperfections. If imperfections are found, replace the stem.
2000-SVC, C1 4-5
13. Slide the first cleaned seal (3) over the stem (12) using the “A” end of Seal
Insertion Tool TL-791A006B. The 30° angle (pointed end) of the seal (3) must
face the springs (15).
14. Slide the cleaned sample chamber (4) over the stem onto the seal (3).
15. Slide the second cleaned seal (3) over the stem (12) using the “B” end of Seal
Insertion Tool TL-791A006B. The 30° angled (pointed end) of the seal (3) faces
out, away from the sample chamber (4).
16. Install the vaporizer chamber (10) into the flange (13) as shown. Lightly
lubricate the threads on the body (2). Screw the body (2) into the flange (13)
against the vaporizer chamber (10) until tight. The sample chamber (4) should
be loose in the assembly at this point. If not, back out the sleeve (20) until the
sample chamber (4) is loose. Use the end of a 0.156 Allen wrench in the slot
of the sleeve (20) to adjust to the point of eliminating the longitudinal play of the
sample chamber (4).
17. Tighten the sleeve (20) in five 1/4-turn increments (1-1/4 turns total) to preload
the seals.
18. Lightly lubricate the inside bore of the cylinder (22). Align the fittings on the
cylinder (22) with the sample chamber (4) tubes, or with air lines if servicing.
Slide the cylinder (22) onto the piston (21) and the body (2). Install two cone
point set screws (1) into the cylinder #(22) and tighten into the groove on the
body (2).
NOTE
Immediately after installing new seals, slight leakage may occur. If

the valve is allowed to sit for several hours, the new seal will “bed-in”
and form a leak-free seal. Heating the valve to operating temperature
will accelerate this process. In general, LSV and GC should be at
stable operating temperature before applying sample pressure and
performing an analysis.
4.3 COLUMN INSTALLATION OR REPLACEMENT
Refer to Figure 4-1 for column location.
CAUTION

4.3.1 Column Removal
1. If analyzer is running and a column is to be replaced, stop the analysis.
4-6 2000-SVC, C1
3. Reduce Isothermal Oven temperature by reducing oven air pressure to zero
psig.
4. Shut off carrier and other FID makeup gases (if applicable).
5. Open isothermal oven door.
6. To remove the column, loosen the fittings on bothe ends of the column and
gently extract the column from the respective fitting connections.
7. Loosen any screw securing the column to the column mounting brackets and
remove the column.
4.3.2 Packed Column Installation
1. Install the column, orienting it in such a way that one end can be connected to
the fitting at the LSV and the other into the bottom of the detector.
2. Fasten and secure column in place at the column mounting bracket with the
retaining screws.
3. Insert the column end into the appropriate fitting connection and finger-tighten
the nut. Then tighten it an additional 1/4 turn and test column for a secure
connection.
4. Apply carrier gas and leak check. Further tighten the two fittings as required to
ensure no leaks are present.
5. Close and secure the Isothermal Oven door.
6. Apply air and makeup gases.
7. Allow zone temperatures to come to stabilizes.
8. Check and adjust carrier and makeup gases flow rates.
9. Ignite FID (if applicable).
4.3.3 Capillary Column Installation
1. Inspect the ends of the column. The ends should be round and burr free. If
either column end is not round or burr free, the column end must be trimmed as
described in paragraph 4.3.4.
2. Insert the end of the column through the back of the tubing nut.
3. Insert the column end through the new ferrule.
4. Slide the ferrule down the length of the column approximately three inches.
5. Insert the extended column length and the end of the ferrule into the
appropriate tubing connection at the sample valve.
6. Connect the tubing nut and finger-tighten; then tighten it an additional 1/4-turn
with an open-end wrench.
2000-SVC, C1 4-7
7. Test the column for a secure connection by gently pulling the column at the 1/8-
inch tubing nut. Any withdraw should be corrected. Continue to tighten the nut
until the column is securely connected at the fitting.
8. Repeat steps 1 through 7 for the other end of the column.
9. For columns connected to a Model 799 FID, insert the column end into the FID
analysis inlet connection until it stops against the jet. Then withdraw the column
approximately 1/16-inch and tighten the nut finger tight. Tighten the nut an
additional 1/4-turn with an open-end wrench, then check it for a secure fit.
NOTE
If a metal capillary column is used, particular care should be taken to

ensure that the column does not contact the jet. The metal column
will conduct electricity and could cause an electrical short at the jet.
10. Apply carrier gas and check for leaks. Further tighten the two fittings as
required to stop any leaks.
11. Install all analyzer covers and doors.
12. Perform the analyzer startup procedure as described in the Operator’s Manual.
4.3.4 Cutting Capillary Columns
The procedure for cutting Glass or Metal Capillary Columns is the same, except that
a small sharp file may be used to score metal columns.
NOTE
Do not use high speed cutting wheels or grinders to cut capillary

columns. This type of cutting generates heat that can damage the
column and the resultant column cuttings could plug the column.
1. Use a diamond or ceramic scoring tool to score the surface of the outside
tubing wall approximately one inch from the end of the column. Take care not to
cut through the tubing wall.
2. Wipe the scored area clean to prevent material from entering the column.
3. Secure the column with your fingers 1/2-inch on each side of the score and
gently bend the tubing at the score, in the direction opposite the score. When
the score point opens, bend the tubing back towards the score. The tubing
should make a clean break.
4. Inspect the end of the column for roundness and ensure it is burr free. If the
end is not round and burr free, repeat the procedure until it is.
5. The column is now ready for installation.
4.4 FID REPAIR
Refer to Figure 4-3 for FID component location.
4-8 2000-SVC, C1
CAUTION
This repair should only be attempted by people who are properly

trained and posses the expertise for this repair.
NOTE
Before disposing of any residual insulating materials, ensure that

disposal methods comply with all applicable regulatory restrictions.
Breather Microdot
Adapter Connector
Thermocouple
Polarizer
Ignitor
Jet
Figure 4-3. FLAME IONIZATION DETECTOR
4.4.1 FID Cell Access
CAUTION


procedure properly.
The thermocouple, polarizer and ignitor assembly elements are fragile

and can be easily damaged if not handled with extreme care. Do not
touch the end of the elements.
2000-SVC, C1 4-9
CAUTION
Caution should be used when working with the soldering iron. The
soldering iron, melted solder and heated wiring can cause severe
burns. Safety glasses and protective gloves should be used to
protect against hot molten solder and hot surfaces. Personal
protective equipment such as goggles , face shield, lab coat and
rubber gloves should be used while cleaning with solvents such as
acetone. Cleaning with solvents should be done in a well ventilated
area.
1. If power is applied to the analyzer, turn it off.
2. Turn off oven air to the Isothermal Oven and allow all temperature zones to
cool.
4. For temperature programmed units, you must remove the insulated covers
surrounding the FID cell body to access any of the FID cell internal
components.
4.4.2 Replacing the Breather
1. Disconnect the red coaxial cable located on the top of the detector.
2. Loosen the breather set screw using a 0.050-inch Allen wrench, then extract
the adapter fitting from the detector.
3. Using a 9/16-inch open-end wrench and a 1/2-inch backup wrench, disconnect

the 1/4-inch vent connection from the breather.
4. Remove the breather with adapter fitting from the analyzer oven.
5. Remove the adapter fitting from the breather using 3/4-inch and 1/2-inch open-
end wrenches.
6. Using a 3/4-inch open-end wrench and a 1/2-inch backup wrench, remove the
1/4-inch male connector from the existing breather.
7. Remove the existing Teflon tape from the nipple of the adapter fitting and apply
new tape.
8. Remove the existing Teflon tape from the male connector and apply new tape.
9. Install the detector outlet adapter into the breather and finger tighten. Finish
tightening using 3/4-inch and 1/2-inch open-end wrenches.
10. Install the 1/4-inch male connector into the breather using 3/4-inch and 1/2-inch
open-end wrenches.
11. Connect the 1/4-inch detector vent tubing to the breather. Finger tighten, then
tighten with a 9/16-inch open-end wrench and a 1/2-inch backup wrench.
12. Ensure the detector vent O-ring is in place in the adapter fitting.
4-10 2000-SVC, C1
13. Finish installing the breather by inserting the cylindrical end of the adapter
fitting completely into the detector outlet and tightening the set screw with a
0.050-inch Allen wrench. Note the set screw will fit into the groove of the
adapter fitting when installed correctly.
14. Reconnect the red coaxial cable to the top of the detector.
15. Close and secure the isothermal oven door.
4.4.3 Replacing the Thermocouple Assembly
1. Disconnect the red coaxial cable located on the top the detector.
2. Locate the thermocouple assembly as identified by the two red and black
wires.
3. If applicable, remove any cable ties and free the wiring to expose the wire
splices.
4. Cut and remove the heat shrink and glass tape from the red and black wires to
expose the soldered connections.
5. Using a 40 watt soldering iron, disconnect the wiring splice.
6. Using a 3/8-inch open-end wrench, carefully remove the thermocouple. Note

its location for reassembly.
7. Carefully insert the replacement thermocouple into the detector body and finger
tighten, taking care not to damage it. Finish tightening using a 3/8-inch open-
end wrench.
8. Roll each end of the red and black wires of the new thermocouple assembly
between your forefinger and thumb, causing the wire ends to be tightly spiral
wrapped.
9. Using the 40 watt soldering iron and approved high temperature solder, “tin” the
wire ends.
10. Spread or expand the end of approved heat shrink to allow easy installation
over the solder connection.
11. Install the heat shrink over each of the wires and slide it as far as possible from
the connection. This will prevent premature shrinking of it when the connection
is soldered.
12. Overlap the “tinned” ends of the red wire from the analyzer electronics and red
element assembly wire, then solder the wires together using approved high
temperature solder and the 40 watt soldering iron.
13. Repeat step 12 for the black wire.
14. Apply a short wrap of glass tape over each connection.
15. Slide the heat shrink over the soldered connection and shrink it with a heat gun.
2000-SVC, C1 4-11
16. Reconnect the red coaxial cable to the top of the detector.
4.4.4 Accessing the Polarizer and Ignitor Detector Elements
The following procedure is used to access the polarizer and ignitor detector
elements.
1. Disconnect the red coaxial cable located on the top of the detector.
2. Cut cable ties securing the detector element assembly wiring and straighten the
wires to increase accessibility.
3. Remove the breather as described in paragraph 4.4.2.
4. Visually trace the capillary tubing connections from the detector to the nearest
unions. Place temporary tape labels on each side of the union tubing
connections.
5. Disconnect the associated capillary connections at the unions.
NOTE
Steps 6 through 8 are required only for Temperature Programmed

analyzers.
6. Rotate the detector cover latch counterclockwise until it is freed from the
detector body.
7. Slide the detector cover from the detector heater housing and set aside.
8. Remove enough of the insulation from the detector heater housing to expose
the polarizer and ignitor; retain it for later use.
9. Position the wiring and capillary tubing such that the housing can be lifted from
the detector base up over the detector, then lift off the housing, fully exposing
the detector body and elements.
4.4.5 Replacing The Polarizer
1. After accessing the detector elements as described in paragraph 4.4.4, locate

the polarizer as identified by the element with the single green wire.
splices.
3. Cut and remove the heat shrink and glass tape from the green wire to expose
the soldered connection.
4. Using a 40 watt soldering iron, disconnect the wire splice.
5. Using a 3/8-inch open-end wrench, carefully remove the polarizer assembly.

Note its location for reassembly.
4-12 2000-SVC, C1
6. Carefully insert the replacement polarizer into the detector body and finger
end wrench.
7. Roll each end of the green wire of the new polarizer between your forefinger
and thumb, causing the wire ends to be tightly spiral wrapped.
wire ends.
10. Install heat shrink over each wire and slide it as far as possible from the
connection. This will prevent premature shrinking when the connection is
soldered.
11. Overlap and solder the “tinned” ends of the green wire from the wiring harness
and the green polarizer assembly wire using approved high temperature solder
and 40 watt soldering iron.
12. Apply a short wrap of glass tape over the connection.
13. Slide the heat shrink over the taped connection and shrink it with a heat gun.
14. Close the detector as described in paragraph 4.4.7.
4.4.6 Replacing The Ignitor Assembly
1. After accessing the detector elements as described in paragraph 4.4.4, locate

the ignitor as identified by the element with the two white wires.
splices.
3. Cut and remove the heat shrink and glass tape from the two white wires to
expose the soldered connections.
4. Using a 40 watt soldering iron, disconnect the wiring splice.
5. Using a 3/8-inch open-end wrench, continue loosening and carefully remove

the Ignitor assembly. Note its location for reassembly.
6. Carefully insert the replacement ignitor into the detector body and finger
end wrench.
7. Roll each end of the two white wires of the new ignitor between your forefinger
and thumb, causing the wire ends to be tightly spiral wrapped.
wire ends.
2000-SVC, C1 4-13
10. Overlap and solder the “tinned” ends of one white wire from the wiring harness
and one white ignitor assembly wire and solder the wires together using
approved high temperature solder and 40 watt soldering iron.
11. Repeat this operation for the remaining white wire.
12. Apply a short wrap of glass tape over each connection.
13. Slide the heat shrink over the taped connection and shrink it with a heat gun.
14. Close the detector as described in paragraph 4.4.7.
4.4.7 Closing the Detector After Replacing the Polarizer or Ignitor
The following procedure is used to close the detector after replacing the polarizer or
ignitor.
1. Verify that all work inside the detector housing is complete.
2. Route the wiring up through the top of the detector housing .
NOTE
Steps 3 through 6 are required only for Temperature Programmed

analyzers.
3. Slide the housing down over the insulation and detector body onto the base.
The housing must slide over the circular base and rest on the mounting
bracket.
4. Bend the capillary tubing back into place, then route the wiring to the back of
the detector housing and install insulation into the housing.
5. Install the detector cover by channeling the cover slot through the machined
groove in the detector body, while sliding the cover into place. Note that the
wiring exits through the slot in the cover, and that the capillary tubing exits the
can through the sheared edge of the top cover.
6. Rotate the detector cover latch clockwise until is secured by the detector. Note
the small slot in the latch also fits into the same machined groove the cover fits.
7. Install the breather as explained in paragraph 4.4.2.
8. Using the previously installed temporary labels, connect the capillary tubes to
their respective unions.
9. Remove the temporary labels.
10. Install cable ties to secure the detector wiring.
11. Install the red coaxial cable to the connector on top of the detector.
4-14 2000-SVC, C1
4.4.8 Cleaning the FID Jet
NOTE
Steps 1 and 2 are required only for Temperature Programmed

analyzers.
1. Remove the three screws securing the detector can assembly, using a 9/64-
inch Allen wrench or ball driver.
2. Extract the can from the isothermal oven.
3. CENELEC and CSA Model 799 flame ionization detectors are identified by the
presence of three packing adapter nuts (5/8-inch, 1/2-inch and 7/16-inch).
Other models contain only two packing adapter nuts (5/8-inch and 1/2-inch).
4. On CENELEC AND CSA models, loosen the 7/16-inch packing adapter nut
using a 7/16-inch open-end wrench, backed up with a 1/2-inch open-end
wrench on the
1/2-inch packing adapter nut. Continue to loosen by hand until disconnected.
5. For all models, loosen the 1/2-inch packing adapter nut using a 1/2-inch open-
end wrench with a 5/8-inch open-end back-up wrench. Continue to loosen by
hand until disconnected.
6. Withdraw the column and associated ferrules and adapters from the detector.
7. Loosen the 5/8-inch adapter fitting from the bottom of the detector.
8. Extract the jet with the adapter fitting from the jet cavity in the detector.
9. Inspect the end of the jet for damage. It should not be pitted or plugged. If
pitted, replace with a new jet.
10. Insert a 0.016-inch diameter piano wire into the jet and rod it out. If the piano
wire will not pass through, replace the jet.
11. Using a syringe and protective equipment and clothing, flush the jet with a mild
solvent such as acetone; then blow dry with 15 psig clean air, nitrogen or
helium.
12. Use a 5/8-inch adapter fitting to insert the jet into the jet cavity. Finger tighten
and finish tightening using a 5/8-inch open-end wrench.
13. Insert the column end, ferrule and adapter nut into the detector inlet and finger
tighten; then loosen 1/8 turn.
14. If the ferrule was loose and slid any length on the column, continue to push the
column into the detector analysis inlet until it stops.
15. Withdraw the column approximately one mm and tighten the 1/2-inch adapter
nut finger tight. Tighten the nut an additional 1/4 turn with a 1/2-inch open-end
wrench; then check it for a secure fit by gently attempting to pull the column
slightly away from the detector. Carefully tighten the adapter until the column is
secure.
2000-SVC, C1 4-15
16. For CENELEC and CSA models, slide the 7/16-inch packing adapter nut and
ferrule toward the detector and install finger tight. Tighten the nut an additional
1/4 turn with a 7/16-inch open-end wrench.
17. For temperature programmed units, install the detector can assembly and
secure it with the hex head screws using a 9/64-inch Allen wrench or ball driver.
Be sure to align the three holes such that the edge of the can is parallel with
edge of the temperature programmed oven.
4.4.9 Cleaning the Collector
1. For temperature programmed units, remove the temperature programmed oven

covers as described in paragraph 4.4.8.
2. Disconnect the column and remove the jet as described in paragraph 4.4.8.
3. Remove the breather as described in paragraph 4.4.2.
4. Remove the thermocouple as described in paragraph 4.4.3.
5. Access the detector elements as described in paragraph 4.4.4.
6. Remove the polarizer and ignitors described in paragraphs 4.4.5 and 4.4.6.
7. Use a small stainless steel brush precleaned with acetone to remove chloride
accumulations from the collector, by inserting the brush through the detector
inlet connection and briskly scrubbing with an in-and-out motion.
8. Install the detector elements as described in paragraph 4.4.4.
9. Install the column as described in paragraph 4.3.2 or 4.3.3.
10. For temperature programmed units, install and secure the temperature
programmed oven covers.
4.4.10 Replacing the FID Cable Assembly
NOTE
This procedure requires a special tool, Insertion Tool ABB P/N

TL799M013-1, to assist in passing the cable through the insulation
between the Control Housing and the Oven.
1. Disconnect the Microdot connector located on the top of the detector (see
Figure 4-3).
2. Cut the cable just below where it passes through the Oven into the Control
Housing and remove the cable from the Oven.
3. Disconnect the other end of the cable from the FID Amplifier Assembly and
remove the cable from the Control Housing.
4-16 2000-SVC, C1
4. Remove the grommets from the grommet holes (located in the bottom of the
Control Housing and the top of the Oven) that will accommodate the routing of
the new cable.
5. The new FID Cable Assembly has a Microdot connector on one and and a BNC
connector on the other end (see Figure 4-4). Screw the Microdot connector end
of the new cable assembly into the Insertion Tool.
Microdot BNC
Connector Connector
Figure 4-4. FID CABLE ASSEMBLY
6. Pass the Insertion Tool through the grommet holes from the Control Housing to
the Oven.
7. Remove the Insertion Tool from the cable connector.
8. Make a slit in each grommet from the outer diameter to the inner hole. (This is
necessary because the cable connector will not pass through the grommet.)
9. Position the cable in the grommets in the Control Housing and the Oven.
10. Push the grommets into the grommet holes.
11. Connect the cable connectors to their respective locations (BNC connector to
the FID Amplifier Assembly and Microdot connector to the top of the detector).
4.5 FILAMENT TCD REPAIR
Refer to Figure 4-5 for Filament Thermal Conductivity Detector (TCD) component
location.
Reference Measure
Filament Filament
Reference Vent
Sample In
Sample Vent
Reference In TC Assembly
Figure 4-5. FILAMENT TC DETECTOR
2000-SVC, C1 4-17
CAUTION

trained and possess the expertise for this repair.
4.5.1 T/C Detector Access
CAUTION

analyzer are declassified when purge is removed, and a danger exists
for fire, explosion, damage to property and injury or death to plant
personnel during the nonpurged time. Obtain proper permits such as
hot work, etc.

procedure properly.
The filaments are fragile and can be easily damaged if not handled
with extreme care. Do not touch the end of the elements.
Caution should be used when working with a soldering iron. Safety

glasses and protective gloves should be used to protect against hot
molten solder and hot surfaces. Personal protective equipment such
as goggles, face shield, lab coat and rubber gloves should be used
while cleaning with solvents such as acetone. Cleaning with solvents
should be done in a well ventilated area.
cool.
4.5.2 Removing the Filaments
1. Use a Phillips screwdriver to loosen the two Phillips head screws located on
the front underside of the mounting bracket.
2. Remove the mounting bracket cover by sliding it out and away from the detector
assembly.
3. Remove the insulating material from the mounting bracket.
4. If they are not already labeled, label the wire pair connected to the
measurement filament “M” and the wire pair connected to the reference filament
“R”.
4-18 2000-SVC, C1
5. If the detector filament wiring connections are spliced, perform steps 6 through
8. If they are not spliced, go to step 9.
6. Position the detector wiring such that the wired splices can be accessed.
7. Cut and remove the heat shrink from each of the spliced filament wire
connections to expose the soldered connections.
8. Using a 40 watt soldering iron, de-solder and disconnect the wire splices.
9. If the detector filament wiring connections are not spliced, cut the existing
detector harness wires approximately three inches from the detector end.
10. Remove the harness retaining clamp and free the harness.
11. Clean the area around the two detector filaments to reduce the chance of
foreign particles entering the detector cavity when the filaments are removed.
12. Loosen the two detector filament retaining gland nuts with a 3/8-inch open-end
wrench. Continue to loosen by hand.
13. Carefully extract the filaments from the detector cell cavity.
4.5.3 Installing the Filaments
Replacement filament installation kits are supplied with two cable glands, a wire
spreader, 736 RTV, high temperature solder, and heat shrink.
1. Cut the four filament wires approximately the same length as the wires on the
filaments that were removed.
2. Insert one pair of filament wires through the threaded end of the gland nut, then
carefully insert the filament into the detector cell cavity marked “M”
(measurement).
3. Slide the nut down the length of the wires to insert and align it with the
measurement cavity.
4. Tighten the cable gland finger tight, then finish tightening with a 3/8-inch open-
end wrench.
5. Insert the second pair of filament wires through the threaded end of the gland
nut, then carefully insert the filament into the detector cell cavity marked “R”
(reference).
6. Slide the nut down the length of the wires to insert and align it with the
reference cavity.
7. Tighten the cable gland finger tight, then finish tightening with a 3/8-inch open-
end wrench.
8. Using wire strippers, remove approximately 1/4 inch of insulation from the end
of each detector filament wire.
2000-SVC, C1 4-19
4.5.4 Filament Checkout
1. Obtain a multimeter and select the ohms function and a range capable of
measuring 40 ohms.
2. Connect one multimeter lead to each wire of the measurement filament

(installed in the detector cavity labeled “M”). The resistance measurement
should be approximately 40 ohms.
3. Connect one multimeter lead to each wire of the reference filament (installed in
the detector cavity labeled “R”). The resistance measurement should be within
one ohm of the measurement filament resistance.
4. If the resistance measurements are not within one ohm of each other, ensure
the multimeter is connected and functioning correctly, and that the correct meter
function is selected.
5. If the detector filaments are not in tolerance, the detector filaments are
defective. The filaments must be replaced and the checkout repeated.
6. Neither filament should contact the detector cell body. Connect the multimeter
leads to one of the filament wires and the detector cell body. The meter reading
should range from several hundred megohms to infinity.
7. Repeat this measurement for each of the other three filament wires. If all
resistance measurements are correct, go to subsection 4.5.5. If any resistance
is too low, go to step 8.
8. If the resistance measurement is approximately 20 ohms, filament being tested

is contacting the internal wall of the detector cell cavity. When this occurs,
carefully loosen the gland of the suspect filament. Continue to loosen by hand
and withdraw first the gland, then the filament from the detector cell body
(taking care not to touch or damage the filament).
9. Inspect the filament for damage or bending. If it is damaged, the filament pair
will have to be replaced.
10. If the filament is slightly bent, use small needle nose pliers to gently and
carefully bend it straight.
11. If the filament orientation now appears to be correct, reinstall the detector
filament and repeat the complete checkout. If it fails again, replace the detector
filament pair and repeat the harness checkout.
12. If the filament is damaged during this attempted correction process, the
filament pair will have to be replaced.
4.5.5 Connecting the Filaments
1. Roll the ends of each stripped harness wire between your thumb and index
finger to tightly spiral wrap the wire ends.
2. Using a 40 watt soldering iron and approved high temperature solder, “tin” each
of the harness wire ends.
4-20 2000-SVC, C1
3. Roll the ends of each stripped filament wire between your thumb and index
of the filament wire ends.
5. Slide the insulating sheath of each filament back to reveal the stranded wire,
install approved heat shrink over each of the four filament wires, and slide it as
far from the free wire end as possible.
6. Select a harness assembly wire with the “R” label designation and overlap the
“tinned” ends of this harness wire with one of the reference filament wires.
7. Solder the wires using a 40 watt soldering iron and approved high temperature
solder. Apply solder sparingly, allowing it to flow evenly. Do not overheat the
solder or a high resistance connection could result.
8. Repeat steps 6 and 7 for the remaining harness wire labeled “R” and reference
filament wire.
9. Repeat steps 6 through 8 for the harness wires labeled “M” and the
measurement wires.
10. Slide heat shrink over each connection and shrink with a heat source.
4.5.6 Leak Test
1. Restore carrier to the analyzer and establish carrier flow to both the
measurement and reference ports of the detector.
2. Verify carrier and reference flow using a flow meter. Typically the flows should
be 30 to 40cc per minute if packed columns are used; 10 to 15 cc per minute if
0.53 mm ID capillary columns are used, and 3 to 5 cc per minute if 0.32 mm ID
capillary columns are used.
3. Test for leaks around the detector filament gland nut with a nonconductive liquid
leak detection solution. Correct all leaks before proceeding.
4. Shut off the carrier supply to the analyzer.
5. Gently remove any excess leak detection solution with a soft cloth or tissue and
blow dry with 15 psig clean dry air, helium or nitrogen.
4.5.7 Potting The Filaments (CENELEC and CSA Only)
Perform this procedure if you know that your analyzer is constructed to CENELEC
or CSA specifications or the if existing detector filament is potted.
1. Gently slide the insulation sheath out of and away from the gland nut.
2. Using a syringe filled with Silastic compound “Dow 736 RTV,” completely fill the
gland cavity with the Silastic compound.
3. With the insulation still pulled away from the gland nut, use needle nosed pliers
to install the wire spreader.
2000-SVC, C1 4-21
4. Separate and insert filament wires into the slots on either side of the spreader.
The spreader should be positioned between the end of the sheath insulation
and the back of the gland nut.
5. Press the spreader into the recess in the gland nut. The retainer must be
installed such that it is not in anyway tilted. It is normal for the retainer to
protrude slightly from the gland recess.
6. Slide the sheath insulation toward the wire spreader until it contacts the face of
the spreader.
7. Replace the mounting bracket insulation.
8. Install the mounting bracket cover and secure it with two Phillips head screws.
4.6 THERMISTOR TCD REPAIR
Refer to Figure 4-6 for Thermistor Thermal Conductivity Detector (TCD) component
location.
Cable Top Cover
Top Sleeve Standoffs
Measure Reference
Thermistor Thermistor
Figure 4-6. THERMISTOR TC DETECTOR
CAUTION

trained and possess the expertise for this repair.
4-22 2000-SVC, C1
4.6.1 T/C Detector Access
CAUTION

analyzer are declassified when purge is removed, and a danger exists
for fire, explosion, damage to property and injury or death to plant
personnel during the nonpurged time. Obtain proper permits such as
hot work, etc.

procedure properly.
The filaments are fragile and can be easily damaged if not handled
with extreme care. Do not touch the end of the elements.
Caution should be used when working with a soldering iron. Safety

glasses and protective gloves should be used to protect against hot
molten solder and hot surfaces. Personal protective equipment such
as goggles, face shield, lab coat and rubber gloves should be used
while cleaning with solvents such as acetone. Cleaning with solvents
should be done in a well ventilated area.
cool.
4.6.2 Removing the Thermistors
1. Use a Phillips screwdriver to loosen the two Phillips head screws located on
the top cover.
2. Remove the top cover by sliding it out and away from the detector assembly.
3. Remove the top sleeve from the detector assembly.
4. If they are not already labeled, label the wire pair connected to the
measurement thermistor “M” and the wire pair connected to the reference
thermistor “R”.
5. Position the detector wiring such that the wired splices can be accessed.
6. Cut and remove the heat shrink from each of the spliced thermistor wire
connections to expose the soldered connections.
7. Using a 40 watt soldering iron, de-solder and disconnect the wire splices.
2000-SVC, C1 4-23
8. Clean the area around the two detector thermistors to reduce the chance of
foreign particles entering the detector cavity when the thermistors are removed.
9. If necessary, remove the two standoffs that hold the top cover in place and
retain them for re-installation.
10. Loosen the two detector thermistor retaining gland nuts with a 5/16-inch open-
end wrench. Continue to loosen by hand.
11. Carefully extract the thermistors from the detector cell cavity.
4.6.3 Installing the Thermistors
Replacement thermistor installation kits are supplied with a matched pair of

thermistor assemblies, high temperature solder, and heat shrink tubing.
1. Cut the four thermistor wires approximately the same length as the wires on the
thermistors that were removed.
2. Insert one thermistor assembly into the detector cell cavity marked "M"
(measurement) and screw the cable gland finger tight.
3. Finish tightening the cable gland with a 5/16-inch open-end wrench.
4. Insert the second thermistor assembly into the detector cell cavity marked “R”
(reference) and screw the cable gland finger tight.
5. Finish tightening the cable gland with a 5/16-inch open-end wrench.
6. Using wire strippers, remove approximately 1/4 inch of insulation from the end
of each detector thermistor wire.
4.6.4 Thermistor Checkout
1. Obtain a multimeter and select the ohms function and a range capable of
measuring 40 ohms.
2. Connect one multimeter lead to each wire of the measurement thermistor

(installed in the detector cavity labeled “M”). The resistance measurement
should be approximately 40 ohms.
3. Connect one multimeter lead to each wire of the reference thermistor (installed
in the detector cavity labeled “R”). The resistance measurement should be
within one ohm of the measurement thermistor resistance.
4. If the resistance measurements are not within one ohm of each other, ensure
the multimeter is connected and functioning correctly, and that the correct meter
function is selected.
5. If the detector thermistors are not in tolerance, the detector thermistors are
defective. The matched set of thermistor assemblies must be replaced and the
checkout repeated.
4-24 2000-SVC, C1
6. Neither thermistor should contact the detector cell body. Connect the
multimeter leads to one of the thermistor wires and the detector cell body. The
meter reading should range from several hundred megohms to infinity.
7. Repeat this measurement for each of the other three thermistor wires. If all
resistance measurements are correct, go to subsection 4.6.5. If any resistance
is too low, go to step 8.
8. If the resistance measurement is approximately 20 ohms, the thermistor being

tested is contacting the internal wall of the detector cell cavity. When this
occurs, carefully loosen the gland of the suspect thermistor. Continue to loosen
by hand and withdraw the gland and thermistor from the detector cell body
(taking care not to touch or damage the thermistor).
9. Inspect the thermistor for damage or bending. If it is damaged, the matched set
of thermistor assemblies will have to be replaced.
10. If the thermistor is slightly bent, use small needle nose pliers to gently and
carefully bend it straight.
11. If the thermistor orientation now appears to be correct, reinstall the detector
thermistor and repeat the complete checkout. If it fails again, replace the
matched set of thermistor assemblies and repeat the harness checkout.
12. If the thermistor is damaged during this attempted correction process, the
matched set of thermistor assemblies will have to be replaced.
4.6.5 Connecting the Thermistors
1. Roll the ends of each stripped harness wire between your thumb and index
of the harness wire ends.
3. Roll the ends of each stripped thermistor wire between your thumb and index
of the thermistor wire ends.
5. Install approved heat shrink over each of the four thermistor wires and slide it
as far from the free wire end as possible.
6. Select a harness assembly wire with the “R” label designation and overlap the
“tinned” ends of this harness wire with one of the reference thermistor wires.
7. Solder the wires using a 40 watt soldering iron and approved high temperature
solder. Apply solder sparingly, allowing it to flow evenly. Do not overheat the
solder or a high resistance connection could result.
8. Repeat steps 6 and 7 for the remaining harness wire labeled “R” and reference
thermistor wire.
2000-SVC, C1 4-25
9. Repeat steps 6 through 8 for the harness wires labeled “M” and the
measurement wires.
10. Slide heat shrink over each connection and shrink with a heat source.
4.6.6 Leak Test
1. Restore carrier to the analyzer and establish carrier flow to both the
measurement and reference ports of the detector.
2. Verify carrier and reference flow using a flow meter. Typically the flows should
be 30 to 40cc per minute if packed columns are used; 10 to 15 cc per minute if
0.53 mm ID capillary columns are used, and 3 to 5 cc per minute if 0.32 mm ID
capillary columns are used.
3. Test for leaks around the detector thermistor gland nut with a nonconductive
liquid leak detection solution. Correct all leaks before proceeding.
4. Shut off the carrier supply to the analyzer.
5. Gently remove any excess leak detection solution with a soft cloth or tissue and
blow dry with 15 psig clean dry air, helium or nitrogen.
4.7 FPD REPAIR
CAUTION


procedure properly.
4.7.1 Replacing the Photomultiplier Assembly
Refer to Figure 4-7 as you perform this procedure.
4-26 2000-SVC, C1
FPD
Electrometer
Cables
Cables
Nuts Nuts
Photomultiplier Photomultiplier
Version 1 Version 2
FPD Electrometer in Controller Housing FPD Electrometer in FPD Enclosure Box
Figure 4-7. FPD PHOTOMULTIPLIER ASSEMBLY END VIEW
2. Turn off oven air to the isothermal oven and allow all temperature zones to cool.
3. Turn off air supply to air cleanup unit.
4. Open the door on the left side of the analyzer.
5. Disconnect the cables to the Photomultiplier Assembly and set them aside.
6. Remove the four nuts securing the Photomultiplier Assembly to the analyzer,
being careful to retain the nuts to reinstall the Photomultiplier Assembly.
7. Carefully pull the Photomultiplier Assembly straight out of the analyzer.
8. Reinstall the Photomultiplier Assembly in reverse order of removing it.
2000-SVC, C1 4-27
4.7.2 Replacing the Photomultiplier Assembly O-Ring

O-Ring
Figure 4-8. PHOTOMULTIPLIER TUBE SHOWING O-RING
1. Perform steps 1 through 7 of paragraph 4.7.1.
2. Take the O-Ring off the end of the Photomultiplier shaft.
3. Lubricate the new O-Ring with a slight film of silicone grease.
4. Insert the new O-Ring on the Photomultiplier shaft.
5. Reinstall the Photomultiplier Assembly in reverse order of removing it.
4.7.3 Replacing the Burner Block
Vent Line
Mounting
Screws
Thermocouples
H2 and/or Sample
Carrier
Heaters
Sulfur Addition
Wafer
Figure 4-9. BURNER BLOCK
4-28 2000-SVC, C1
5. Disconnect the thermocouple leads from the Burner Block.
6. Disconnect the heater leads from the Burner Blcok.
7. Disconnect the sample line from the Burner Blcok.
8. Disconnect the vent line from the Burner Block.
9. Disconnect the hydrogen (H2) and carrier lines from the Burner Block.
10. Remove the bracket screws that fasten the Burner Block to the oven.
11. Slide the Burner Block off the end of the Photomultiplier Assembly and remove
the Burner Block from the oven.
12. Install the new Burner Block in reverse order of removing it.
4.7.4 Replacing the Burner Block O-Rings
Refer to Figure 4-10 when performing this procedure.

O-Ring O-Ring
45051-5-18 45051-4-106
O-Ring O-Ring
45051-4-13 45051-4-106
Figure 4-10. BURNER BLOCK, SHOWING O-RINGS
1. Perform steps 1 through 4 of paragraph 4.7.3.
2. To remove a particular O-Ring, carefully remove the associated connector and

then remove the O-Ring.
3. Lubricate the new O-Ring with a slight film of silcone grease.
4. Insert the new O-Ring and reinstall the connector.
4.8 REPAIRING THE METHANIZER/AIR CLEANUP ASSEMBLY
The Vista II Series Gas Chromatographs use two different models of Methanizer/Air
Cleaner Assembly, Model 781 and Model 805. These are essentially the same
except for appearance.
2000-SVC, C1 4-29
The Methanizer/Air Cleanup Assembly comes from the factory supplied with both air
cleanup and methanizer tubes. Your application may require the use of both the air
cleanup and methanizer tubes or only the air cleanup tube. The larger tube is used
for air cleanup and the smaller tube for the methanizer. If a tube is not being used,
its inlet and outlet connections will be plugged. It is necessary to replace only the
tube that is in use.
Refer to Figure 4-11 for Methanizer/Air Cleanup Assembly component location.
CAUTION


procedure properly.
Let the Methanizer/Air Cleanup Assembly cool a minimum of 30

minutes prior to disassembly. Internal surface temperatures can
cause severe burns if they are touched before they have cooled.
No asbestos is used in any assembly or component part of the

Methanizer/Air Cleanup Assembly. Therefore, all residual insulating
materials may be disposed of without regulator restrictions.
The high temperatures present under normal operating conditions

can cause wiring insulation to become brittle and fragile.
Ceramic temperature probes should always be considered fragile.

When servicing the Methanizer/Air Cleanup Assembly, these
component parts must be handled with great care to avoid damage.
4.8.1 Removing the Methanizer/Air Cleanup Assembly
5. Label the tubing on both sides of the associated unions with temporary
numbered tape labels. The labels are later used to ensure correct tubing
connections when the air cleanup/methanizer is reinstalled.
4-30 2000-SVC, C1
Harness Assy
3 1 2 4
4 2 1 3
Air
Cleanup
Tube
Methanizer
Tube
MODEL 781 MODEL 805
Figure 4-11. METHANIZER/AIR CLEANUP ASSEMBLY
6. Using 7/16-inch and 5/16-inch open-end wrenches, disconnect the tubing

connections from the reducing unions.
7. Disconnect any retaining clamps that are securing the harness.
8. Remove the four Phillips head screws attaching the support brackets to the
isothermal oven wall. Secure the unit with your hand while removing the final
top screws.
9. Lay the Methanizer/Air Cleanup Assembly on a suitable work surface within the
constrained length of the heater harness. If only the catalytic tubes are to be
replaced, the harness will not require further disconnection.
10. Model 781 only: Remove the four Phillips head screws attaching the support
bracket to the top unit end caps and lay them aside.
CAUTION
Wait 30 minutes before proceeding to open the Methanizer/Air

Cleanup Assembly.
11. Mark the top and bottom caps and housing with a grease pencil or permanent
marker. When the caps are replaced with the marks aligned, the support
bracket holes will be correctly aligned.
12. Using a 9/64-inch Allen wrench, remove the four Allen head screws attaching
the air cleanup/methanizer top cap to the outer housing.
2000-SVC, C1 4-31
13. Grasp the housing and top cap. Withdraw the internal body assembly from the
housing.
14. Using tweezers or a small screw driver, remove the insulation from around the
body assembly. Retain it for later use.
4.8.2 Removing the Catalytic Tubes
1. Using a 1/4-inch open-end wrench, disconnect the catalytic connections from

the bottom side of the cap.
2. To remove a catalytic tube, remove the Phillips head screw and flat washer
located in the center of the body at the opposite end from the harness.
3. Grasp the long coiled or “pig tail” end of the tubing and pull the short nutted end
through the body assembly.
4. Repeat steps 2 and 3 for the second catalytic tube, if it is present.
5. Carefully rotate the body assembly and remove the Phillips head retaining
screw and flat washer.
6. Note the location of the cartridge heater, temperature probes and

thermocouple. Carefully extract the cartridge heater, probes and thermocouple
from the air cleanup body.
7. Inspect the probe end of the wiring harness for damage. If any harness wiring
or devices are damaged, replace the harness as described in Paragraphs 4.8.4
and 4.8.5.
4.8.3 Installing the Catalytic Tubes
1. To install the air cleanup tube, insert the short end of the catalytic air tube
through the larger tube passage of the body and align it with the inside air inlet
port connection of the top cap.
2. To install the methanizer tube, insert the short end of the catalytic methanizer
tube through the smaller tube passage of the body and align it with the inside
methanizer inlet port connection.
3. Insert the tube fitting into the cap and tighten the inlet fitting nut finger tight.
4. Repeat step 3 for the second catalytic tube, if applicable.
5. Assemble the flat washer and screw.
6. Insert the flat washer retaining screw assembly into the center hole located in
the end of the body assembly opposite the harness and tighten it with the
Phillips screwdriver.
7. If a new tube is being installed, a small loop or “pig tail” should be coiled in the
tubing to compensate for the excess tubing length. If installing an existing tube,
the pig tail will already be present.
4-32 2000-SVC, C1
8. Bend and position the coiled tubing such that the end fitting can be inserted into
the corresponding air or methanizer outlet connection port located on the
bottom of the top cap.
9. Tighten all inside catalytic tube inlet and outlet fittings, using a 1/4-inch open-
end wrench.
4.8.4 Packing the Housing
1. Pack a small amount of insulation around the probes, thermocouple, heater,

and associated wiring of the body assembly and set the assembly aside.
2. Using a 9/64-inch Allen wrench, loosen and remove the four Allen head screws
attaching the air cleaner/methanizer bottom cap to the outer housing. Separate
and set the bottom cap aside.
3. Carefully insert and press the body assembly into the outer housing.
4. Align the top cap with the marks on the outer housing. This will align the
mounting bracket holes in the top cap.
5. Install the four Allen head screws that secure the top cap to the outer housing
and tighten with a 9/64-inch Allen wrench.
6. Place a small quantity of insulation into the housing cavity and gently pack it
down using an object such as a screwdriver. Continue adding and packing in
insulation until the cavity is filled, taking care not the damage any wiring.
7. Install the bottom cap, aligning the mark on the cap with the mark on the
housing. This will align the bottom mounting bracket holes.
8. Install the four Allen head screws to secure the bottom cap to the housing, and
tighten with a 9/64-inch Allen wrench.
9. Model 781 only: Install the two mounting brackets with four Phillips head
screws. The mounting brackets should be aligned parallel to one another.
4.8.5 Installing the Methanizer/Air Cleanup Assembly
1. Attach the Methanizer/Air Cleanup Assembly to the interior of the isothermal

oven wall. Secure the air cleanup/methanizer with your hand while installing the
four Phillips head screws through the support bracket holes and into the
mounting holes located in the isothermal oven back interior wall.
2. Connect the tube connections to their respective reducing unions while

matching the numbers on the temporary labels.
3. Remove the temporary tape labels.
4. Apply carrier and air to the Methanizer/Air Cleanup Assembly.
5. Using a liquid leak detection solution, test for leaks and make necessary repairs
before proceeding.
6. Route the heater harness in the oven interior, following the same path as the
original harness installation.
2000-SVC, C1 4-33
7. Connect heater one wires to J48E terminals 1 and 2, and connect heater two
wires to J48E terminals 5 and 6.
8. Connect the temperature sensor wires to terminals 1 through 6, as follows:
Overtemp Thermocouple: yellow (+) to 1

Overtemp Thermocouple: red (-) to 2
RTD sensor: 4 and 5
Shield (individual): 3
Composite Shield: 6
9. Close and secure the isothermal oven door, and the Controller front and side
doors.
4.8.6 Air Cleanup Testing
1. Restore burner air to the cleanup unit by adjusting the burner air regulator for
the correct burner air pressure as indicated at the burner air pressure indicator.
2. If a methanizer is used, restore carrier gas by adjusting the carrier regulator for
the correct carrier pressure indication at the carrier pressure indicator.
3. Using a suitable liquid leak detection solution, test and repair any leaks that
may be present in the connections loosened or disconnected during the
maintenance procedure.
4. Close the isothermal oven door and secure the latch.
5. Restore carrier gas, oven air and fuel gas, if necessary, by adjusting the
regulators for the correct indications at the pressure indicators.
6. After ensuring the area is safe, and the proper permits are in effect, apply AC
power.
7. To check the temperature of the Methanizer/Air Cleanup Assembly, exit to the

Background screen by pressing the F1 soft key.
8. Access the Manual Control Mode screen by pressing the F2 (Manual Control)
soft key.
9. Access the Pressure and Temperature Control Mode by pressing the F4 (Press.
and Temp. Control) soft key.
10. From the Pres and Temp Control screen, position the cursor up or down to
highlight TEMP CONTROL and press the F2 (Manual Temperature Control) soft
key to access the Manual Temperature Control Screen.
11. On the Manual Temperature Control screen observe the setpoint value. If
necessary, change the setpoint of the air cleanup/methanizer temperature
controller to 450° C.
12. The temperature of the Methanizer/Air Cleanup Assembly can also be

monitored from this screen. The time required to achieve stability is two hours.
4-34 2000-SVC, C1
13. Press the F1 soft key as necessary to return to the Background screen.
4.8.7 Air Cleanup Final Preparation
1. Restore all utility gases and verify that the pressures and flow rates are correct.
These include oven air, purge air, carrier, burner fuel, and burner air. If the
faces of the pressure gauges were previously marked and the marked location
is known to be correct, simply adjust the pressure regulators until the gauge
pointers are aligned with the pressure indicating marks. Refer to the
engineering data package supplied with your analyzer for the correct values.
2. After sufficient air purge time and when authorized by your safety administrator,
apply power to the analyzer.
3. Verify that all Digital Temperature Control setpoint values are correct. Refer to
the engineering data package supplied with your analyzer for the correct values.
4. Allow the temperature controlled zone temperatures to equilibrate.
5. Verify that sample is being introduced to and is sufficiently flowing through the
analyzer sample valve.
6. Perform a minimum of three analyses to verify correct chromatographic

response and analysis reports. Minor adjustments or calibration may be
necessary to achieve desired analysis results.
7. Once analyzer operation and performance have been verified, place the
analyzer back in service.
4.9 REPAIRING THE CARRIER GAS PANEL (ANALOG)
4.9.1 Removing the Carrier Gas Panel
1. Open the Control Housing access panel (see Figure 4-12).
(1) Open Control

Housing Access
Panel
(2) Remove screw
Figure 4-12. CARRIER GAS PANEL FROM RIGHT SIDE
2000-SVC, C1 4-35
2. Remove the screw from the Carrier Gas Panel (see Figure 4-12).
4. In the isothermal oven, remove tubing connections as shown in Figure 4-13.
(4) Remove tubing

connections
(5) Unscrew
feedthroughs
Figure 4-13. FRONT RIGHT SIDE OF OVEN
5. In the isothermal oven, unscrew the feedthroughs (see Figure 4-13) and pull
them downward approximately 0.5 inches; it is not necessary to completely
remove them.
6. Open the Controller front door to gain access the mother board.
7. In the Control Housing access area, unplug the alarm switches from the mother
board and unscrew them from the manifold (see Figure 4-14).
(7) Unscrew alarm

switches
(8) Remove plugs
(9) Remove socket

head screws
Figure 4-14. CONTROL HOUSING ACCESS AREA, RIGHT SIDE OF ANALYZER
4-36 2000-SVC, C1
8. In the Control Housing access area, remove the plugs from the manifold (see
Figure 4-14).
9. In the Control Housing access area, remove the five socket head screws from
the manifold (see Figure 4-14).
10. Carefully remove the Carrier Gas Panel.
4.9.2 Replacing a Regulator
1. Remove the Carrier Gas Panel from the analyzer.
2. Disconnect the lines from the back of the regulator.
3. Remove the regulator adjusting knob.
4. Remove the nut securing the regulator to the panel.
5. Remove the regulator from the panel.
6. Remove the adjusting knob from the new regulator.
7. Insert the new regulator through the hole in the panel.
8. Fasten the nut securing the regulator to the panel.
9. Install the adjusting knob on the regulator.
10. Reinstall the lines on the back of the regulator.
11. Install the Carrier Gas Panel in the analyzer.
4.9.3 Replacing a Gauge
2. Disconnect the line from the back of the gauge.
3. Loosen the screws on the plate that secures the gauge to the panel and then
remove the plate.
4. Remove the gauge from the panel.
5. Insert the new gauge through the hole in the panel.
6. Install the plate that secures the gauge to the panel.
7. Tighten the screws holding the gauge and plate to the panel.
8. Reinstall the line on the back of the gauge.
2000-SVC, C1 4-37
4.9.4 Installing the Carrier Gas Panel
1. Insert the Carrier Gas Panel into the Control Housing access area of the
analyzer controller.
2. In the Control Housing access area, install the five socket head screws into the
manifold (see Figure 4-14), making sure the sealing gasket is in place.
3. In the Control Housing access area, install the plugs into the unused ports of
the manifold (see Figure 4-14).
4. In the Control Housing access area, screw the alarm switches into the manifold
(see Figure 4-14) and plug the ware harness into their original locations on the
mother board.
5. In the isothermal oven, reinstall the feedthroughs (see Figure 4-13).
6. In the isothermal oven, reinstall tubing connections as shown in Figure 4-13.
7. Close the isothermal oven door.
8. Install the screw in the Carrier Gas Panel (see Figure 4-12).
9. Close the Control Housing access panel.
10. Close the Controller front door.
4.10 REPLACING THE ELECTRONIC PRESSURE CONTROL (EPC) PANEL
4.10.1 Removing the EPC Panel
This procedure is similar to that for removing the analog Carrier Gas Panel
(paragraph 4.9.1).
1. Open the Control Housing access panel.
2. Remove the two screws holding the EPC cover and remove the cover panel.
4. In the isothermal oven, disconnect the EPC feedthrough tube nuts.
5. In the isothermal oven, unscrew the feedthroughs and pull them downward
approximately 0.5 inches; it is not necessary to remove them completely.
6. Open the Controller front door to gain access to the mother board.
7. At the left side of the mother board, disconnect the EPC Panel cable from J44.
8. On the EPC Multibus PCB in the card cage, disconnect the EPC Panel cable
from J43 (near the bottom of the PCB).
9. In the Control Housing access area, unplug the alarm switches from the mother
board and unscrew them from the manifold.
10. In the Control Housing access area, remove the plugs from the manifold.
4-38 2000-SVC, C1
11. In the Control Housing access area, remove the five socket head screws from
the manifold.
12. Remove the four screws holding the Purge Air Panel in place and carefully pull
the panel forward and down.
13. On the side wall behind the Purge Air Panel remove the lock nut on the pipe
nipple which retains the EPC Panel cables (see Figure 4-15).
Lock Nut
Figure 4-15. EPC PANEL CABLE LOCK NUT
14. Remove the screw on the side of the EPC panel.
15. Carefully remove the EPC Panel.
4.10.2 Installing the EPC Panel
Install the new EPC Panel in the reverse order of removal, following the steps of
paragraph 4.10.1.
4.11 CALIBRATING THE ELECTRONIC PRESSURE CONTROLLER
The EPC should only require calibration if a component has been replaced. You
should only need to calibrate the particular zone affected by the servicing. To
calibrate a zone:
1. Determine the zone that needs calibration.
2000-SVC, C1 4-39
3. Eliminate any back pressure to the zone by loosening the feedthrough fitting
associated with the zone to be calibrated (see Figure 4-16).
ELECTRONIC PRESSURE CONTROL
1 2 3 4 5
ZONE FITTINGS
Figure 4-16. LOCATION OF ZONE FITTINGS
4. On the Controller, verify the Background screen is displayed and then press the
F2 (Manual Control) soft key.
5. On the Manual Control Mode screen press the F4 (Press. & Temp. Control) soft
key.
6. On the Pres and Temp Control screen (see Figure 4-17), cursor to PRES
CONTROL and press the F2 (Manual Pressure Control ) soft key.
***** Pres and Temp Control *****
TEMP CONTROL
PRES CONTROL
TEMP CONFIGURATION
Manual Pressure View

Escape Pressure Config Alarms
Control
F1 F2 F3 F4
Figure 4-17. PRESSURE AND TEMPERATURE CONTROL SCREEN
4-40 2000-SVC, C1
7. On the Manual Pressure control Mode screen (see Figure 4-18), enter the zone
number of the zone you want to calibrate.
**** Manual Pressure Control Mode ****

Zone Config Actual SP Rate
COLUMN ISO 0.0241 0.0000 0.0000
ANALYSIS ISO 0.360 0.0000 0.0000
SELECTOR ISO 0.699 0.0000 0.0000
ANALYSIS ISO 0.0000 0.0000 0.0000
COLUMN PROG 0.00167 0.0000 1.0000
Valve # : [0] Time : 0125
Zone # : 1 State : Idle
Set Point : 0.00000000
Ramp Rate : 1.0000000 Ver A
VALVES : --3-5-------
Accept Calibrate
Escape Control Zone
Point
F1 F2 F3 F4
Figure 4-18. MANUAL PRESSURE CONTROL MODE SCREEN
8. Press the F3 (Calibrate Zone) soft key. The GCC displays “Calibrate zone, hold
switch on board.”
9. Hold down the switch on the EPC Multibus PCB. The GCC displays “Are You
Sure?”
10. Continue holding down the switch and press “Y” on the keyboard to save the
new calibration.
11. When the GCC displays “This zone has been calibrated,” release the switch.
12. If the Set Point shows an unexpected value, enter the desired set point value.
(The unexpected value is an offset corrected by the calibration; this is a
software reporting function only, which is not used by the system.)
13. Retighten the fitting loosened in step 3.
2000-SVC, C1 4-41
4.12 REPAIRING PURGE AIR PANEL COMPONENTS
4.12.1 Removing the Purge Air Panel
1. Remove the four screws holding the panel in place (see Figure 4-19).
Mounting
Screws
Figure 4-19. PURGE AIR PANEL FASTENERS
2. Carefully pull the panel forward.
4.12.2 Replacing a Regulator
1. Remove the Purge Air Panel from the analyzer.
2. Disconnect the lines from the back of the regulator, using 1/2-inch and
9/16-inch open-end wrenches.
3. Remove the regulator adjusting knob.
4. Remove the nut and sealing gasket securing the regulator to the panel.
5. Remove the regulator from the panel.
6. Remove the adjusting knob from the new regulator.
7. Insert the new regulator through the hole in the panel.
8. Install the sealing gasket and fasten the nut securing the regulator to the panel.
9. Install the adjusting knob on the regulator.
10. Reinstall the lines on the back of the regulator.
11. Install the Purge Air Panel in the analyzer.
4.12.3 Replacing a Gauge
2. Disconnect the line from the back of the gauge, using a 9/16-inch open-end
wrench.
4-42 2000-SVC, C1
3. Loosen the screws on the plate that secures the gauge to the panel and then
remove the plate.
4. Remove the gauge and sealing gasket from the panel.
5. Insert the new gauge and sealing gasket through the hole in the panel.
6. Install the plate that secures the gauge to the panel.
7. Tighten the screws holding the gauge and plate to the panel.
8. Reinstall the line on the back of the gauge.
4.12.4 Installing the Purge Air Panel
1. Carefully put the panel back in place, aligning the mounting holes.
2. Install the four screws that hold the panel in place.
4.13 SETTING JUMPERS
The following paragraphs describe how to set the various PCB jumpers.
4.13.1 Backplane PCB
The Controller Backplane PCB has six jumpers to set up (see Figure 4-20).
JP5 JP1
JP3
JP2
JP6
JP4
Figure 4-20. BACKPLANE PCB JUMPER LOCATIONS
2000-SVC, C1 4-43
Jumpers JP1 and JP5 are used to bypass pressure switch connection points for
certain analyzer configurations. Since the purge switches are daisy chained in
series, it is necessary to jumper across switches that are not connected. Jumper
JP1 has its shunt installed between pins 1 and 2 for standard or Sparger oven
usage; the shunt is installed between pins 2 and 3 for temperature programmed
applications. Jumper JP5 has its shunt installed between pins 1 and 2 for single
purge area; the shunt is installed between pins 2 and 3 for dual purge location
applications.
Jumpers JP2, JP3 and JP6 are associated with the purge alarm switch closures
applied to the Chroma I/O PCB. Jumper JP2 has its shunt installed between pins 1
and 2 for X Purge applications only; the shunt is installed between pins 2 and 3 for Y
or Z purge applications. Jumper JP3 has its shunt installed between pins 1 and 2 for
standard analyzers; the shunt is installed between pins 2 and 3 for temperature
programmed and Sparger applications. Jumper JP6 has its shunt installed between
pins 1 and 2 for single purge configurations; the shunt is installed between pins 2
and 3 for dual purge applications.
Jumper JP4 is used to connect two detectors to a single Chroma I/O PCB. The
location of the jumper shunt depends on the revision of the Backplane PCB.
Backplane PCBs that do not have JP5 and JP6 are artwork revision D or earlier,
while those having JP5 and JP6 are artwork revision E or later.
• For revision D or earlier, the shunt is installed between pins 1 and 2 when the
outputs of two detector amplifiers are applied to a single Chroma I/O PCB; the
shunt is installed between pins 2 and 3 for normal operation (a Chroma I/O
PCB dedicated to a single detector amplifier).
• Revision E or later: the shunt goes between pins 1 and 2 for normal operation
(a Chroma I/O PCB dedicated to a single detector amplifier); the shunt is
installed between pins 2 and 3 when the outputs of two detector amplifiers are
applied to a single Chroma I/O PCB.
4.13.2 DTC Backplane PCB
The Digital Temperature Controller (DTC) PCB has eight jumpers and one switch to
set up (see Figure 4-21 for location).
Switch SW1 is used to save configuration information to protected memory. Its use
is described in “Digital Temperature Controller” in Section 4 of the Operator’s
Manual, by the statement “Hold down the switch on the DTC Backplane PCB.”
4-44 2000-SVC, C1
JP4
JP1
JP5
JP6
J2
JP
3
JP3
SW
JP2
1
SW1
J3
Figure 4-21. DTC BACKPLANE PCB SWITCH AND JUMPER LOCATIONS
Jumpers J2 and J3 are T-Rating jumpers. The jumper shunts must be installed
exactly as shown below to ensure the temperature control operates properly. If they
are set incorrectly, T-Rating disagreement alarms will result (0 = no jumper; 1 =
jumper installed).
Pins T5 T4A T4 T3B T3 T2C T2 T1

1-2 0 1 0 1 0 1 0 1
3-4 0 0 1 1 0 0 1 1
5-6 0 0 0 0 1 1 1 1
7-8 Shunts installed in these positions Zone 1

9-10 allow set points (for the respective Zone 2
11-12 zones) to be above the T-Rating, Zone 3
13-14 for explosion proof zones only. Zone 4
15-16 Zone 5
JP1 is the service diagnostics jumper. For normal operation the shunt is installed
between pins 1 and 2. For service diagnostic screen use (only) the shunt is
installed between pins 2 and 3. After servicing, the shunt must be reinstalled
between pins 1 and 2.
JP4 is the VAC Conditioning Board jumper. If the analyzer has one VAC
Conditioning PCB installed, the shunt should be between pins 2 and 3. If the
2000-SVC, C1 4-45
analyzer has two VAC Conditioning PCBs installed, the shunt should be between
pins 1 and 2.
JP2, JP3, JP5, and JP6 are the jumpers for the temperature zone boards. These
jumpers are required for the software to recognize unused zones. Jumpers are
installed from the even pins of unused zones to the even pins of used zones, for
both Micro #1 (JP2 and JP3) and Micro #2 (JP5 and JP6). If all zones are in use, no
jumpers are installed. Zone jumpers are identified as follows:
Micro #1 Pin Micro #2 Pin

Zone 1 JP3-2 JP5-2
Zone 2 JP3-4 JP5-4
Zone 3 JP3-6 JP5-6
Zone 4 JP2-2 JP6-2
Zone 5 JP2-4 JP6-4
Example: if Zone 5 is not used, one jumper must be run between JP2-4 and JP2-2
or one of the other pins listed under Micro #1 Pins, and a second jumper must be
run between JP6-4 and JP6-2 or one of the other pins listed under Micro #2 Pins.
4.13.3 DTC Zone PCB
There can be up to five zone boards, one for each designated temperature zone.
The only jumper on a zone board is JP1 (see Figure 4-22). How this jumper is set
depends on the type of temperature sensor used for the zone. The jumper shunt
should be between pins 1 and 2 for a 400 ohm platinum probe sensor; it should be
between pins 2 and 3 for a thermocouple sensor.
JP1
Figure 4-22. DTC ZONE BOARD JUMPER LOCATION
4.13.4 VAC Conditioning PCB
There can be either one or two VAC Conditioning PCBs, depending on the
application. Each board has two jumpers to be set, JP4 and JP5 (see Figure 4-23).
These jumpers are set according to the voltage supplied to the board, as follows
(JP4 is the hot side and JP5 is the neutral side):
Applied Voltage JP4 Shunt JP5 Shunt

32 VAC 1-2 1-2
110 VAC 3-4 3-4
220 VAC 5-6 5-6
4-46 2000-SVC, C1
JP4
JP5
Figure 4-23. VAC CONDITIONING BOARD JUMPER LOCATIONS
4.13.5 Front Panel PCB
There is one adjustment and three jumpers on this board (see Figure 4-24). The
adjustment is potentiometer R56, which is used to set the display contrast for
optimum viewing.
The jumpers relate to the LOCOM option. JP5 has its shunt is between pins 1 and 2
for normal operation, between pins 2 and 3 for LOCOM installations. JP6 and JP7
have the shunts in place for normal operation and the shunts removed for LOCOM
installations.
JP7 JP6 JP5
R56
Figure 4-24. FRONT PANEL PCB ADJUSTMENT AND JUMPER LOCATIONS
4.13.6 FID Amplifier PCB
The jumper on this PCB relates to intercolumn detector usage. For normal operation
shunts should be installed in the first two positions at the right side of J18. These
2000-SVC, C1 4-47
shunts are removed for an application using intercolumn detectors (see Figure
4-25).
J18
Figure 4-25. FID AMPLIFIER PCB JUMPER LOCATIONS
4.13.7 Filament TCD Amplifier PCB
The jumpers on this PCB relate to amplifier gain, single or dual carrier, temperature
ranges, intercolumn detectors, and special testing (see Figure 4-26 for location).
GAIN JUMPERS CARRIER JUMPERS

WT11 - WT13 WT7 - WT10
TEMPERATURE JUMPERS
WT1 - WT6
Figure 4-26. FILAMENT TCD AMPLIFIER PCB JUMPER LOCATIONS
The gain jumper is normally connected between WT11 and WT12. For high gain
applications this jumper is connected between WT12 and WT13.
4-48 2000-SVC, C1
The carrier jumper is normally connected between WT9 and WT10 (single carrier).
For dual carrier applications this jumper is connected between WT7 and WT8.
The temperature jumpers are normally connected between WT1 and WT2 and
between WT4 and WT5 (low temperature). For high temperature applications these
jumpers are connected between WT1 and WT3 and between WT4 and WT6.
For normal operation shunts should be installed in the first two positions at the right
side of J18. These shunts are removed for an application using intercolumn
detectors.
The jumper between WT14 and WT15 must be in place for normal operation. It is
only removed when when hi-pot testing is to be performed.
4.13.8 Thermistor TCD Amplifier Interface PCB
The Thermistor Amplifier Interface PCB currently supports one or two Thermistor
Amplifier PCBs (see Figure 4-27).
FOR FUTURE FOR FUTURE

AMPLIFIER #1 AMPLIFIER #2
EXPANSION EXPANSION
1 2 3 1 2 3 1 2 3 1 2 3
JP2 JP1 JP1A JP2A
Figure 4-27. THERMISTOR AMPLIFIER INTERFACE PCB JUMPER LOCATIONS
For single detector applications, one Thermistor Amplifier PCB is used, mounted in
the Amplifier #1 position. Jumpers JP-1, JP-2, JP-1A and JP-2A all have their
shunts between terminals 1 and 2. The output signal is routed through J13A.
For dual detector applications, two Thermistor Amplifier PCBs are used, mounted in
the Amplifier #1 and Amplifier #2 positions. Jumpers JP-1, JP-2 and JP-2A all have
their shunts between terminals 1 and 2. Jumper JP-1A has its shunt between
terminals 2 and 3. The output signal of Amplifier #1 is routed through J13A and the
output signal of Amplifier #2 is routed through J13B.
2000-SVC, C1 4-49
4.13.9 EPC Multibus PCB
This board has one jumper and one switch to set up (see Figure 4-28).
JP1 is the service diagnostics jumper. For normal operation the shunt is installed
between pins 1 and 2. For installation and service the shunt is installed between
pins 2 and 3. After installation or service, the shunt must be reinstalled between
pins 1 and 2.
Switch SW1 is used to save configuration information to protected memory. Its use
is described in “Electronic Pressure Control Option” in Section 4 of the Operator’s
Manual, by the statement “Hold down the switch on the Electronic Pressure Control
PCB.”
SW1 JP1
Figure 4-28. EPC MULTIBUS PCB JUMPER LOCATION
4-50 2000-SVC, C1
4.13.10 EPC Control PCB
This board has a single jumper, JP2 (see Figure 4-29). For normal operation JP2
has a shunt between pins 2 and 3. For servicing of the block, the shunt is placed
between pins 1 and 2 to turn off the heater.
JP2
Figure 4-29. EPC CONTROL PCB JUMPER LOCATION
4.13.11 Chroma I/O PCB
This board has two jumpers which are mutually exclusive. When there is only one
Chroma I/O PCB in the system, or the board is used as Chroma I/O PCB #1 in a
simultaneous dual detector system, the jumper will be located between the
terminals of JP1 (see Figure 4-30). This jumper is part of the printed circuit trace on
all Chroma I/O PCBs.
JP2 JP2
JP1 JP1
CHROMA I/O BOARD #1 CHROMA I/O BOARD #1
Figure 4-30. CHROMA I/O PCB JUMPERS
When a second Chroma I/O PCB is used, Chroma I/O PCB must have the JP1
jumper trace cut and a jumper installed between the JP2 terminals.
2000-SVC, C1 4-51
4.13.12 Power Supply PCB
This board has two jumpers to verify (see Figure 4-31). JP4 should always have a
shunt between pins 1 and 2. JP2 has its shunt between pins 1 and 2 for normal
operation, between pins 2 and 3 for factory test mode.
1 2 3
JP2
1 2 3
JP4
JP2 JP4
OPERATING MODE: 1 TO 2 ALWAYS SET
DIAGNOSTIC MODE: 2 TO 3 1 TO 2
Figure 4-31. POWER SUPPLY PCB JUMPERS
4.14 VALCO DIAPHRAGM VALVE REPAIR
The Valco DV22-2110 ten-port diaphragm valve is used in some Vista II GCs (see
Figure 4-32). This procedure and the accompanying illustrations were reprinted with
permission of VICI, Houston, TX, USA.
Figure 4-32. VALCO 10-PORT DIAPHRAGM VALVE
4.14.1 Removing the Valve
1. Tag all valve connections.
2. Using a 1/4-inch wrench, remove the connections from the valve cap.
4-52 2000-SVC, C1
3. Using a 7/64-inch hex key wrench, loosen the clamp ring screw.
4. Remove the valve from the clamp ring and take it out of the analyzer.
4.14.2 Repairing the Valve
1. Place the valve on a clean work surface.
2. Note the location of port 1 on the valve, opposite the air inlet (see Figure 4-33).
Figure 4-33. CAP ORIENTATION
3. Using a 9/64-inch hex key wrench, remove the screw from the valve cap (see
Figure 4-34).
Figure 4-34. EXPLODED VIEW OF VALCO DIAPHRAGM VALVE
2000-SVC, C1 4-53
4. Carefully remove the valve cap from the two alignment pins.
5. Set the cap aside, with the polished side up so that it does not get scratched.
6. Remove the old diaphragm.
7. Remove the plungers.
8. Install new plungers, ensuring that the counterbored end is up toward the valve
cap (see Figure 4-34).
9. Install new diaphragm, ensuring that the marking “TOP” is toward the valve cap.
If there is no marking, ensure the indentation in the diaphragm is toward the valve
body (see Figure 4-34).
10. Reinstall the valve cap, verifying that port 1 is correctly located.
11. Install the valve cap screw and tighten with a 9/64-inch hex key wrench.
4.14.3 Reinstalling the Valve
1. Place the valve in the clamp ring and rotate it to the orientation of the valve that
was removed.
2. Using a 7/64-inch hex key wrench, tighten the clamp ring screw.
3. Install the connections to the valve cap, matching the numbering on the valve to
the tags on the connections.
4. Using a 1/4-inch wrench, tighten each connection.
4.15 VistaNET DEBUG MONITOR
4.15.1 Purpose
The VistaNET Communications Board in the Card Cage has an on-board debug
monitor that allows examination of the token bus communications. Several
parameters accessible from the debug connector allow the technician to easily
troubleshoot common problems.
CAUTION
You must work carefully with the Debug Monitor. Inserting erroneous
information can cause networking problems. If such problems occur
you must reset the network to reinstate proper operation.
4.15.2 Making the Connections
The VistaNET Communications Board has a connector that allows a serial cable to
be connected to the board. ABB Process Analytics Aftermarket Spares can provide
this cable (P/N 3617695-1). The RS-232 communications protocol allows the use of
a laptop PC for access. Included in Windows 95 is the Hillgraeve HyperTerminal
Application, which emulates several popular devices. This cable should be
connected to the Communications Board (see Figure 4-35) and to the appropriate
COM port (Domain 1 or 2) on the laptop PC.
4-54 2000-SVC, C1
J4
COMMUNICATIONS
PCB
COMMUNICATIONS
PCB
D E B U G J3
DOMAIN 1 J2
DOMAIN 2 J1
Figure 4-35. COMMUNICATIONS BOARD DEBUG CONNECTION
On the laptop PC, set the terminal emulation to VT100, and the associated serial
parameters to 9600 baud, 8 data bits, no parity, 1 stop bit, no handshaking.
4.15.3 Startup
When you have set up the terminal application and connected to the
communications board, press <CTRL> A to invoke the Main Menu (see Figure
4-36).
Figure 4-36. MAIN MENU
When you exit the application, press <CTRL> Z to end the session.
2000-SVC, C1 4-55
CAUTION
Always end the session before exiting the monitor. While the monitor
is intended to be non-invasive, it can affect operation over time.
Some performance parameters are degraded by the monitor program.
The Main Menu is divided into three sections: the Information Display at the top of
the screen, Menu Items just below this information, and Statistical Data between the
two horizontal lines.
4.15.4 Information Display
Firmware Revision Indicates the part number and revision of the

communications board firmware. The last digit of the
revision indicates the position of the high-speed jumper
on the board (L indicates low speed operation, H
indicates high-speed operation).
IRQ Indicates “0” when the laptop PC is connected to the GC

Communications Board.
Adapter Segment Indicates “000H” when the laptop PC is connected to the

GC Communications Board.
4.15.5 Menu Items
Dump Memory Entered as DM XXXX where XXXX is the hexadecimal

address to be examined. Memory is dumped by screen.
Pressing the Enter key will scroll to the next block. The
Escape key aborts the command. Figure 4-37 illustrates
this screen.
Figure 4-37. TYPICAL DUMP MEMORY SCREEN
4-56 2000-SVC, C1
Fill Memory Entered as FM XXXX YYYY ZZ where XXXX is the
starting address, YYYY ending, ZZ pattern to be used to
fill the memory block (all in hex).
Read Memory Entered as RM XXXX where XXXX is the hexadecimal

address to be examined.
Dump Packet Entered as DP X where X = 0 to 16, indicating the buffer

address of the packet to be examined (0 is the DP RAM
buffer last uploaded to the host).
Write Memory Entered as WM XXXX YY where XXXX is the

hexadecimal address to be written with pattern YY (all in
hex).
Read/Write Memory Entered as RWM XXXX YY where XXXX is the

hexadecimal addressed to be written with pattern YY, then
read (all in hex).
Show Registers Entered as SR (see Figure 4-38). The internal register

contents of the 80C152 microcontroller are shown. Refer
to the manufacturer’s data sheet for an explanation of the
contents. Type MM to return to the Main Menu.
Figure 4-38. TYPICAL SHOW REGISTERS SCREEN
Ignore Token Entered as IT, used for software loading tests. In this
mode, the communications board remains part of the
token bus, however tokens are merely passed, and no
UDP packets are transmitted or received at this node.
THIS COMMAND IS NOT TO BE USED IN THE FIELD.
2000-SVC, C1 4-57
Main Menu From the SFR display, this command returns to the main
menu.
WARNING
The Promiscuous Mode command is used only in the factory.
Promiscuous Mode Entered as PM, this command is used in software

troubleshooting. In this mode, this node receives all UDP
packets, whether destined for this station or not.
Reset Statistics Entered as RS, this command resets the cumulative

statistics collected at this node.
Reset stats Globally Entered as RG, this command resets all cumulative
statistics collected at all nodes by sending a reset
statistics command to all nodes by transmitting a special
token.
CAUTION
The Dump History command is rather invasive, and may cause this
station to drop tokens.
Dump History Entered as DH, the history buffer maintained at this node
is displayed (see Figure 4-39).
Figure 4-39. TYPICAL DUMP HISTORY SCREEN
Displayed are the source addresses of the last 255

stations to send a token on the wire. Note that the
4-58 2000-SVC, C1
address of the station displaying this buffer is not seen.
The location of the asterisks (***) shows the starting point
of the display. The escape key will return to the main
menu. Pressing Enter will display the content of the next
buffer captured.
4.15.6 Statistical Display
On the screen, several items of interest to the technician are displayed. The
Statistical Display is divided, roughly, into three columns: Transmit, Receive and
General Statistics. Following is an explanation of each screen element.
Transmit Statistics
Transmit Requests Number of requests for UDP transmission from the host.
Buffers Recycled Number of requests for UDP transmissions processed

by this board.
Transmits Number of UDP transmissions successfully made.
Transmit Errors Number of UDP transmissions not acknowledged by the

destination (or acknowledgement was lost on line).
Retries Number of UDP transmissions retried. Under normal

conditions, such as a station off-line, this will be exactly
twice the number of Transmit Errors.
Collisions Number of times this station has detected a loss of

transmission on the wire due to collision with another
station or overcome by noise.
Last Destination Address of the destination of the last UDP transmission.
Tokens Issued Number of times this station has detected a dead line
and the slot assignment time has expired, resulting in an
issuance of a token.
Tokens Dropped Number of times the token destination did not accept
the token, or the token was lost. This indicates the
number of times this station has seen a station go off-line,
or line noise caused the packet to be corrupted.
Tokens Passed Number of tokens processed by this station.
Receive Statistics
Receives Number of packets sent to this station.
Errors Number of unintelligible packets received by this station.

Since there is an error condition, it is indeterminate
whether this was a UDP packet or a token.
Last Error Encoded error condition indicating the failure detected

by a receiver error, as follows:
2000-SVC, C1 4-59
1. Overrun - indicates a new character received
before the last was processed.
2. Collision Abort - indicates a collision occurred

during reception.
4. Alignment - indicates a new start of frame was

detected before an end of frame.
8. CRC Error - indicates the CRC was in error.
16. Unknown - indicates more than one error condition

existed during reception.
32. DMA Overrun - indicates the sending station

attempted to send a packet larger than UDP size,
524 bytes.
Uploads Number of packets moved from the receive buffer pool

into dual port memory for transfer to the host.
Queued Number of interrupts issued to the host to retrieve an

uploaded packet.
Dequeued Number of interrupts issued to this board from the host

indicating acknowledgement of a queued packet.
Backups Number of times this station has run out of receive buffers
due to host interrupt latency.
Invalid Nnumber of times the host issued unknown commands

to this board.
Tokens Received Number of tokens received by this station. Tokens are

broadcast objects, all tokens are seen by every station.
Tokens Dumped Number of tokens disposed of due to load at this station,

or another station issued a token (indicating a receiver
problem at that station). A token was seen on the wire
while this station had a token.
General Statistics
Address This station’s wire address.
Mode Indicates the Software State of this station. These

conditions are additive, bits encoded as follows:
1. Receive Request Pending - A UDP packet has

been received and needs processing.
2. Receive Buffer Needed - The receiver buffer pool

is full. When one is available, re-enable the
receiver.
4-60 2000-SVC, C1
4. Transmit Requested - A UDP packet is in dual port
memory and needs to be transmitted.
8. Transmit Completed - The last UDP transmission

was successful, notify host.
16. Transmit in Error - The last UDP transmission was

in error, notify host.
32. Upload Completed - The last DMA transfer to the

host is completed, notify host a UDP packet has
been received.
64. Initialization Requested - The host has requested

the board reinitialize itself.
128. Line Timer Expired - The current transmission is

taking too long, go into override mode. The
communications board will attempt to clear line
condition. (Caused by incorrect line biasing.)
256. Send Token - A token is ready to be sent to the

next station in the token algorithm.
512. Terminal Input Pending - Carriage return pressed

by debug operator, Process command.
1024. Debug Mode - Update screen each pass through

processing loop.
2048. End of Interrupt - Send end of interrupt to host

interrupt process.
4096. Initialization Completed - Send initialization

complete message to host.
Input Address of next buffer to fill in receive buffer pool.
Output Address of next buffer to empty into dual ported RAM.
Max Slack Maximum difference between input and output, or host

efficiency (lag).
Gap Device Location of next device in gap search algorithm.
Token Dest Location of next non-gap update token.
Next Alive Address of next station detected on the line.
Next Recvd Address of the source address of the token seen on the
wire subsequent to this station sending a token.
Rate Number of total detected errors per billion opportunities

to generate errors.
2000-SVC, C1 4-61

P.O. Box 831
Lewisburg, WV 24901

Fax (304) 645-4236

Fax (304) 647-1837

4-62 2000-SVC, C1
SECTION 5. REPLACEMENT PARTS
5.1 ORDERING INFORMATION
This section provides a listing of replacement parts, with part number and
description.
NOTE
Since the component parts specific to any given system are defined by
the particular application, you should refer to the “Recommended Spare
Parts Lists” in the Data Package supplied with the analyzer, to obtain the
full and correct part number for the desired part or assembly.
The following information, found in the Data Package and on the analyzer
nameplate, should be included in any communication concerning replacement parts
or components:
• Process Analytics Model Number of the analyzer
• Process Analytics Customer Order Number
• Analyzer Part Number (P/N) and serial number
• For serial numbered subassemblies such as PC boards, include the serial

number and the part number (including dash number and revision letter) for the
subassembly in the request
• Applicable references from the “Recommended Spare Parts List” of the Data
Package, included with each analyzer
• Description of part
Contact the Service Manager for specific ordering instructions. Include a complete
description of the component, analyzer, symptoms and problems with your request.
ABB Process Analytics, Inc.

Attention: Service Manager
P.O. Box 831
Lewisburg, WV 24901
Telephone: (304) 647-4358

Fax: (304) 645-4236
The remainder of this section lists the replaceable parts and components by their
location in the equipment. Part numbers and drawing numbers listed here are for
identification purposes only. When you order parts for replacement, use the list of
parts included in the Engineering Data Package provided with your equipment to
ensure you have the correct version of each part.
2000-SVC, C1 5-1
5.2 GC CONTROLLER
5.2.1 Back of Front Panel (see Figure 5-1)
Description Part Number
Display Panel 81943A008-1

Front Panel PCB 802A008B-1
Lo Comm PCB 733A037D-1
Lo Comm
Front Panel
PCB
PCB
Lo Comm
Cable Display
Panel
Figure 5-1. BACK OF FRONT PANEL
5.2.2 GCC Chassis (see Figure 5-2)
FID Amplifier 81943A040-1

Fuse for FID Amplifier (1 amp) 3615087-03
Filament TCD Amplifier 81943A041-1
Fuse for TCD Amplifier (0.375 amp) 3615086-04
Thermistor TCD Amplifier PCB 802A023B-1
Thermistor Amplifier Interface PCB 802A024B-1
RFI Filter (115 VAC) 3617199-1
RFI Filter (220 VAC) 3617189-1
Power Supply PCB 759A002D-1
Solenoid Driver PCB 802A001B-1
Carrier Alarm Pressure Switch, 75 psi 3617302-2508
Pressure Sensor 3615565-6
FPD Amplifier* 3525647-1
*see paragraph 5.7.1 for alternate location
5-2 2000-SVC, C1
RFI Filter
Power Supply Pressure

PCB Sensors
FID Amplifier
and/or
TCD Amplifier
or
FPD Amplifier
Solenoid Driver Carrier

PCB Alarm
Switch
Figure 5-2. CHASSIS COMPONENTS
5.2.3 Card Cage (see Figure 5-3)
Chroma I/O PCB 3528515-2

Digital I/O PCB 3528770-4
Analog Output PCB (Current) 733A096B-2
Analog Output PCB (Voltage) 3528289-1
VistaNET Communication PCB 3617198-1
Electronic Pressure Control PCB 802A013B-1
Single Board Computer PCB (application dependent–see Data Package)
Chroma I/O PCB #2 or Analog Output

Communications PCB PCB #1
Chroma I/O PCB

#1 Analog Output PCB #2
or Digital I/O PCB #2
Single Board
Computer PCB Digital I/O PCB #1
Electronic Pressure
Control PCB
Figure 5-3. CARD CAGE COMPONENTS
2000-SVC, C1 5-3
5.2.4 Components on Right Side Door (see Figure 5-4)
Panel Assembly 81943A026-1

DTC Zone PCB 802A007B-2
0.25 A 3AG fast acting Fuse 3615087-01
25 amp Fuse, semiconductor type 3616470-25
AC Conditioning PCB 802A009B-2
AC Conditioning PCB
(has both fuses)
Panel
Assembly
DTC Zone
PCB
Figure 5-4. RIGHT SIDE DOOR OF GCC
5.3 PURGE AIR PANEL (see Figure 5-5)
Heater Air Pressure Switch 3617302-1037

1/4-inch Tubing 3617355-2
1/8-inch Tubing 3617355-1
Solenoid Valve 800K005-1
Solenoid Valve Gasket 3617331-1
Pressure Relieving Regulator 3616975-1
Pressure Gauge, 0-110 psi 44726-4
Regulator Gasket 81943D033-1
Gauge Gasket 81943D033-2
Pressure
Gauge Heater Air
Pressure Switch
1/4-inch
0 0 Tubing
Pressure Solenoid 1/8-inch

Regulator Valve Tubing
Figure 5-5. PURGE AIR PANEL
5-4 2000-SVC, C1
5.4 ELECTRONIC PRESSURE CONTROL PANEL (DIGITAL) (see Figure 5-6)
Proportional Valve l 3617341-1

O-Ring Kit 801K001-1
Control PCB 802A011B-1
Sensor PCB 802A012B-1
Heater 81943A042-1
Metric Allen Wrenches TL161-1
Proportional
Valve
Sensor PCB
Heater
Control PCB
Figure 5-6. ELECTRONIC PRESSURE CONTROL PANEL
5.5 CARRIER GAS PANEL (see Figure 5-7)
Pressure Regulator, 0-100 3617409-1

Pressure Regulator, 0-30 3617409-2
Pressure Gauge, 0-100 44726-4
Pressure Gauge, 0-30 44726-2
Hydrogen Fuel Restrictor 3617360-1
Carrier Gas Filter 3617370-1
Gauges
0 0 0 0 Filter/Restrictor
Regulators
Figure 5-7. CARRIER GAS PANEL
2000-SVC, C1 5-5
5.6 ISOTHERMAL OVEN COMPONENTS (see Figure 5-8)
NOTE
Part Numbers are incomplete without dash numbers. See the Recommended
Spare Parts List (in the Engineering Data Package) for application-specific
information.
Oven Heater Kit, 115 V 1000W 800K007-1

Temperature Sensor, Platinum 3617330-1
Makeup Valve 3616890-1
Splitter Valve 3616890-2
Metering Valve 3529409-1
Restrictor Valve 3616446-1
Liquid Sample Valve (see paragraph 5.6.1)
Flame Ionization Detector (see paragraph 5.6.2)
Thermal Conductivity Detector (see paragraph 5.6.3)
Micro TC Detector (see paragraph 5.6.4)
M2CP Valve (see paragraph 5.6.5)
Methanizer/Air Clean Up Model 781 (see paragraph 5.6.6)
Methanizer/Air Clean Up Model 805 (see paragraph 5.6.7)
Temperature
Sensor
Detector
Thermocouple
Methanizer Liquid Sample

Valve
Oven
Heater
Figure 5-8. ISOTHERMAL OVEN COMPONENTS
5-6 2000-SVC, C1
5.6.1 Liquid Sample Valve (see Figure 5-9)
O-Ring Seal Kit 791K003N-1

0.125 inch Stem (per application) 791A008B-_
0.125 inch Seal (per application) 791M001B-_
0.062 inch Stem (per application) 791A009B-_
0.062 inch Seal (per application) 791M028B-_
Vaporizer (per application) 805A015-_
Seal Insertion Tool TL-791A006B
Seals Stem
Figure 5-9. LIQUID SAMPLE VALVE
5.6.2 Flame Ionization Detector (FID) (see Figure 5-10)
Maintenance Kit 799K003-1

Jet 3617156-2
Ignitor Assy 794A007B-1
Thermocouple Assy 794A008B-1
Polarizer Assy 794A009B-1
Column kits are application dependent–see Data Package for correct part
Capillary Column Kit NEC 799K001N-1
Packed Column Kit NEC 799K001N-2
Packed Column Kit CENELEC 799K001N-3
Capillary Column Kit CENELEC 799K001N-4
Wire Splice Kit 800K001-1
Microdot Cable Insertion Kit 799K006-1
Thermocouple
Polarizer
Ignitor
Jet
Figure 5-10. FID COMPONENTS
2000-SVC, C1 5-7
5.6.3 Filament Type Thermal Conductivity Detector (see Figure 5-11)
Filament Kit NEC 800K003-1

Filament Kit CENELEC/CSA 800K003-2
Reference Measure
Filament Filament
Reference Vent
Sample In
Sample Vent
Reference In TC Assembly
Figure 5-11. FILAMENT TYPE TCD COMPONENTS
5.6.4 Thermistor Type Thermal Conductivity Detector (see Figure 5-12)
Thermistor Assembly, matched pair 798A002B-1

Wire Splice Kit 800K001-1
Cable
Measure Reference
Thermistor Thermistor
Measurement Reference
Vent Vent
Measurement Reference
In In
Figure 5-12. THERMISTOR TYPE TCD COMPONENTS
5-8 2000-SVC, C1
5.6.5 M2CP Valve (see Figure 5-13)
10 port Slider (per application) 3527366-_

Fitting Kit 753K002N-11
O-Ring Kit 764K001N-2
Carrier Assy SPV 3527273-1
Slider
Carrier
Figure 5-13. M2CP VALVE COMPONENTS
5.6.6 Model 781 Methanizer/Air Clean Up System (see Figure 5-14)
Methanizer Tube 781A002C-1

Air Cleanup Tube 781A003C-1
115V Heater Kit 805K001-1
230V Heater Kit 805K001-2
Sensor Kit 805K002-1
Crimper 3617469-1
Harness Assy
Air Cleanup Tube
4 2 1 3
Methanizer Tube
Figure 5-14. MODEL 781 METHANIZER/AIR CLEAN UP SYSTEM
2000-SVC, C1 5-9
5.6.7 Model 805 Methanizer/Air Clean Up System (see Figure 5-15)
Methanizer Tube 805A017-1

Air Cleanup Tube 805A018-1
Heater 3617474-1
Sensor Kit 805K002-1
Crimper 3617469-1
Metric Hex Wrench TL-161
Air Cleanup T ube Methanizer T ube
Figure 5-15. MODEL 805 METHANIZER/AIR CLEAN UP SYSTEM
5.6.8 Valco Diaphragm Valve (see Figure 5-16)
Valve, 10-port 8230442-1

Clamp Ring 8230443-1
Plunger & Diaphragm Kit 8230560-1
Alignment Pin 8230577-1
Air Fitting 8230567-1
Connection Nut 3616312-4
Connection Ferrule 3616313-4
HEX HEAD
SCREW
PLUNGER ENLARGED
CAP
TO SHOW
COUNTERBORED END
DIAPHRAGM
PLUNGERS
ALIGNMENT
PINS
BODY
Figure 5-16. VALCO DIAPHRAGM VALVE
5-10 2000-SVC, C1
5.7 FLAME PHOTOMETRIC DETECTOR (FPD)
5.7.1 Transformer and Photomultiplier Components (see Figure 5-17)
Transformer 3617648-1
Capillary Tubing, Burner Fuel (not shown) 5514584-39
Coaxial Cable Assy 3528546-1
Photomultiplier Assy 804A003-1
Solenoid, 3 Way (for X Purge) 3616261-3
Pressure Sensor 3615565-6
FPD Electrometer* 804A010-1
*see paragraph 5.2.2 for alternate location
Burner Block (see paragraph 5.7.2)
Pressure Sensor
Solenoid
Transformer
0 0
FPD Electrometer
Coaxial Cable
Photomultiplier
Burner Block
Figure 5-17. VISTA II SHOWING FPD COMPONENTS
2000-SVC, C1 5-11
5.7.2 Burner Block Components (see Figure 5-18)
Burner Block Assy 804A005-1

Heater Cartridge, 70W 3617444-1
Thermocouple Washer Assy 3617462-1
Electrode Nut (not shown) 804A004-1
Jet 3617432-1
O-Ring 15/16-in OD, Fluorocarbon 45051-4-106
O-Ring 11/16-in OD, Teflon 45051-5-18
O-Ring 3/8-in OD, Fluorocarbon 45051-4-13
Breather Vent 3528205-1
Breather Line 753A038-5
Fitting 804M009-1
Sulfur Addition Wafer 3617453-_
Breather O-Ring O-Ring

Vent 45051-5-18 45051-4-106
Sulfur
Addition
Wafer
Breather O-Ring O-Ring

Fitting Line 45051-4-13 45051-4-106
Figure 5-18. BURNER BLOCK COMPONENTS
5.8 TEMPERATURE PROGRAMMED OVEN (see Figure 5-19)
Heater Assy 795A002B-1

Model 794 Flame Ionization Detector 794A001B-2
Model 795 Thermal Conductivity Detector 795A001B-2
5-12 2000-SVC, C1
Detector
(FID shown)
Heater
Figure 5-19. TEMPERATURE PROGRAMMED OVEN
5.8.1 Flame Ionization Detector with Heater Block (see Figure 5-20)
Heater Block 795A002B-1

Flame Ionization Detector 799A001B-2
(see paragraph 5.6.2 for FID component parts)
Detector
Heater
Block
Insulation
Figure 5-20. FID WITH HEATER BLOCK
2000-SVC, C1 5-13
5.8.2 Filament Type TC Detector with Heater Block (see Figure 5-21)
Heater Block 795A002B-1

Fialement Type Thermal Conductivity Detector 798A001B-2
(see paragraph 5.6.3 for Filament Type TCD component parts)
Detector
Heater
Block
Insulation
Figure 5-21. FILAMENT TYPE TCD WITH HEATER BLOCK
5-14 2000-SVC, C1
SECTION 6. DRAWINGS AND DIAGRAMS
6.1 USE OF DRAWINGS
The drawings and diagrams contained in this manual are of a general nature. Since analyzer
configuration depends on the particular application, you should refer to the drawings provided
in the engineering drawings supplied with your analyzer as the final authority. In addition there
is an Application Data Package which contains information on application-dependent
components or subassemblies, outline and mounting diagrams, and flow diagrams.
6.2 LIST OF DRAWINGS AND DIAGRAMS
The following drawings and diagrams, which make up this section of the manual, provide
general information about the analyzer that is not covered elsewhere.
Figure No. Description
6-1 Overall System Block Diagram

6-2 Analytical Section Block Diagram
6-3 Control Section Block Diagram
2000-SVC, C1 6-1
Air In PURGE AIR
PANEL
Heater Air
Purge Air
Digital Out
Analog Out
Sample In Recorder
OVEN GCC
Printer
VistaNET
Burner Fuel
Burner Air
Carrier
Air In
H2 In CARRIER
GAS
PANEL
Carrier In
ANALYTICAL SECTION CONTROL SECTION
Figure 6-1. OVERALL SYSTEM BLOCK DIAGRAM
6-2 2000-SVC, C1
PURGE AIR PANEL
Regulator
& Gauge
Air In Regulator
& Gauge
Solenoid Solenoid
Valve Valve
Heater Air
Purge Air
Purge Air
OVEN
Heater
Sample In Sample Selector To Control

Column Detector
Valve Valve Section
Sample
Return Burner Fuel
Burner Air
Carrier
Air In Adj
Valve
H2 In Adj
Valve
Carrier Adj
In Valve
CARRIER GAS PANEL (Analog)
Figure 6-2. ANALYTICAL SECTION BLOCK DIAGRAM
2000-SVC, C1 6-3
To LOCOM
Circuit
Display LOCOM
PCB
Keypad
from Analytical Front

Detector Chroma
Panel
Section Ampl I/O PCB
PCB
SBC Trend
PCB #1
Analog
EPC
Outputs
Sensors Power
Trend
Supply
#2
PCB
EPC
Control EPC
Digital
PCB Multibus
I/O #1
PCB Digital
Zone Inputs &
PCB Outputs
Digital
(5) DTC
I/O #2
Backplane
AC PCB
Cond VistaNET
PCB Multibus VistaNET
PCB Domains
GCC
Figure 6-3. CONTROL SECTION BLOCK DIAGRAM
6-4 2000-SVC, C1

P.O. Box 831
Lewisburg, WV 24901
General Information: Telephone: (304) 647-4358

Fax: (304) 645-4236
Aftermarket Spares: Telephone: (304) 647-1736

Fax: (304) 647-1837

ABB Analytical, a busines unit of ABB Automation
Process Analytics Division Bomem Division Extrel Division Hartman & Braun Division Pastech Division
843 N. Jefferson Street 450 St.-Jean Baptiste 575 Epsilon Drive Heerstrasse 136 - Hortonwood 37
Lewisburg, WV 24901 Avenue Pittsburgh, PA 15238 D-60488 Frankfurt am Main Telford, Shropshire
USA Quebec, Quebec USA Germany TF1 4GT
Canada G2E 5S5 United Kingdom
Office: (304) 647-4358 Office: (412) 963-7530 Office: 49-6196-800-0
FAX: (304) 645-4236 Office: (418) 877-2944 FAX: (412) 963-6578 FAX: 49-6196-800-1119 Office: 44-1952-670-477
FAX: (418) 877-2834 FAX: 44-1952-670-455
Pastech Division Americas Bahrain Benelux France
U.S.A. Office Office: (281) 556-8102 Office: 973-725377 Office: 31-294-417291 Office: 33-3-8774-0611
6100 West By Northwest FAX: (281) 556-8157 FAX: 973-725332 FAX: 31-294-413656 FAX: 33-3-8774-7939
Blvd.
Suite 160
Houston, TX 77040 United Kingdom
Germany Italy Singapore
USA
Office: 49-6196-800-0 Office: 39-2-26232936 Office: 65-776-5711 Office: 44-1952-670-477
Office: (713) 460-9541 FAX: 44-1952-670-455
FAX: 49-6196-800-1119 FAX: 39-2-26232685 FAX: 65-779-7351
FAX: (713) 460-5918
9907

Vista II Series Gas Chromatograph: Service Manual

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Vista II Series Gas Chromatograph: Service Manual

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SERVICE MANUAL

2000-SVC C1: July 1999

Material contained within this manual is proprietary information of

Specifications subject to change without notice.

©1999, ABB Process Analytics

Valco Instruments Co. Inc., drawings and text reprinted

For further information or assistance contact:

ABB Process Analytics

General Information: Telephone: (304) 647-4358

Aftermarket Spares: Telephone (304) 647-1736

Please include Sales Order Number, Tag Number,

Date of issue for each version of this manual:

Revision status of each page in this manual:

Page No. Revision Status

ABB Process Analytics Inc.

General Information: Telephone (304) 647-4358

Aftermarket Spares: Telephone (304) 647-1736

Please include Sales Order Number, Tag Number,

Section Title Page

GLOSSARY ......................................................................................................................... G-1

1.1 EQUIPMENT DESCRIPTION ............................................................................................... 1-1

2.1 TROUBLESHOOTING GUIDELINES .................................................................................... 2-1

Section Title Page

2.4.7 T-Rating Disagreement ................................................................................................ 2-16

Section Title Page

SECTION 3. TEST PROCEDURES

3.1 TP 1: CARRIER, MAKEUP, AND UTILITY GAS SUPPLIES ................................................. 3-1

4.1 REPLACING HEATERS ........................................................................................................ 4-1

Section Title Page

4.1.2 Sample Valve Heater ..................................................................................................... 4-2

Section Title Page

4.9.3 Replacing a Gauge ...................................................................................................... 4-37

SECTION 5. REPLACEMENT PARTS

5.1 ORDERING INFORMATION ................................................................................................. 5-1

Section Title Page

5.6.4 Thermistor Type Thermal Conductivity Detector ............................................................ 5-8

6.1 USE OF DRAWINGS ............................................................................................................ 6-1

Figure Title Page

1-1 Typical Vista II Series Gas Chromatograph ........................................................................... 1-1

2-1 Example of Baseline Offset ................................................................................................... 2-1

3-1 DTC Backplane PCB ........................................................................................................... 3-16

4-1 Analyzer Oven Compartment ................................................................................................ 4-1

Figure Title Page

4-10 Burner Block, Showing O-Rings .......................................................................................... 4-29

5-1 Back of Front Panel ............................................................................................................... 5-2

Figure Title Page

5-20 FID with Heater Block ......................................................................................................... 5-13

6-1 Overall System Block Diagram .............................................................................................. 6-2

ABB Process Analytics Inc.

General Information: Telephone (304) 647-4358

Aftermarket Spares: Telephone (304) 647-1736

Please include Sales Order Number, Tag Number,

A/D converter device that converts an analog signal to a digital value

analyzer Vista II Series gas chromatograph

ASCII American Standard Code for Information Interchange

benchmark sample known to be a definite concentration; used to compare an

CENELEC Comite’ Europeen de Normalisation Electrotechnique; the European

concentration the amount of a specific substance within a sample

CPU Central Processing Unit; controls analyzer, collects and manipulates

DCS Distributed Control System

Data Package application-specific engineering information (such as component tables,

detector random electronic signals picked up by a sensing device in the absence

DTC Digital Temperature Controller