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Board (MCPCB), Insulated Metal Substrate(IMS or IMPCB), Thermally conductive PCBs, etc… but
they all mean the same thing and perform the same way.
metal base and a copper foil. The copper foil is etched into the desired circuit pattern and the
metal base draws heat away from this circuit through the thin dielectric.
Lower copper weights than suggested by the IPC heat-rise charts can be used.
companies are also looking to take advantage of the benefits of these constructions. While a single
layer construction is the simplest, other configuration options are available at Amitron, including:
Flexible Aluminum PCBs
One of the newest developments in IMS materials is flexible dielectrics. These materials
feature a polyimide resin system with ceramic fillers which provides excellent electrical
aluminum material like 5754 or similar, the product can be formed to achieve a variety of
shapes and angles which can eliminate costly fixtures, cables and connectors. Although
these materials are flexible, they are intended to be bent into place and remain in place.
They are not suited for applications that are intended to be flexed regularly.
The most common construction is a 2-Layer or 4-Layer Sub-assembly made from conventional FR-4.
Bonding this layer to an aluminum base with thermal dielectrics can help dissipate heat, improve
loss characteristics.
substrate while the solder fillet creates a seal without the need for special gaskets
more layers of circuitry buried in the dielectric with blind vias acting as either thermal
vias or signal vias. While more expensive and less efficient at transferring heat as a
single layer designs, they provide a simple and effective solution for heat dissipation in
Copper core can allow both direct electrical connections as well as with insulated
through holes.