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Principles of electronic materials and devices, 2nd edition [Book Review]

Article  in  IEEE Electrical Insulation Magazine · August 2005

DOI: 10.1109/MEI.2005.1490003 · Source: IEEE Xplore

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J.J. Shea
Schneider-Electric
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need to be aware of the potential limi-
tations that could be imposed on
lead-based products and be aware of
alternative lead-free solders.
A wide range of various lead-free
solders are described in this book along
with underlying fundamentals that are
key to practical applications. The book
begins with reasons why lead is toxic to
the environment, industry trends, and
current legislation. The next chapter
covers fundamental technology, in-
cluding conventional lead-containing
solder technology, physical properties,
metallurgical properties, failure
modes, alloy design, and thermo-
mechanical fatigue of solders in gen-
eral. This technical background lays
the foundation for understanding sol-
der requirements.
The next 14 chapters cover a variety
of solder alloy compositions and prop-
erties. These include binary, ternary,
quaternary, and higher-element sys-
tems. Examples of these alloys use tin,
silver, bismuth, copper, indium, zinc,
and gallium in various ranges and per-
centages. There are phase curves and
stress-strain curves for alloys de-
scribed. There are also high-tempera-
ture and low-temperature (relative to
63Sn/37Pb alloy) alloys. The remain-
ing chapters are devoted to applica-
tions and various aspects of the indus-
tries that use solders. There are details
on PCB surface finishes, intermetallics,
microstructure of SnAg, reliability,
conductive adhesives, tin coating
chemistry, role of bismuth, and pro-
duction defects.
This reference text is a practical
handbook containing a wealth of in-
formation on lead-free solders and can
serve as a guide to selecting the most
appropriate lead-free solder alloy for a
given application. Those working with
solder—especially lead-based sol-
ders—will find this a very interesting
and practical book for not only finding
a replacement solder but for under-
standing the physical and metallurgical
requirements of solders in general.
This book could also be used in a grad-
uate materials science curriculum.
62
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Principles of Electronic
Materials and Devices,
2nd Edition
S.O. Kasap
McGraw Hill
1221 Avenue of the Americas
New York, NY 10020
Phone +1 800 352 3566
Fax +1 212 512 4105
http://www.mhhe.com
ISBN 0-07-239342-4
745 pp. - $100 (Hardback), 2002
As electronic accessories become
more common in a variety of applica-
tions, there is a greater need for engi-
neers and scientists to develop and ad-
vance electronic materials and devices.
This text contains a broad range of top-
ics in electronic materials and devices,
mainly intended for an undergraduate
course. While in-depth detail is not in-
tended, the author injects a wonderful,
semi-quantitative level of description
in the text. Concepts presented with
many detailed illustrations and superb
writing are presented in a way to con-
vey the physical ideas with a minimum
of mathematics. Unlike many college
level texts, there are more than 130
worked-out examples to reinforce
learning and understanding. There are
over 470 professionally prepared illus-
trations and a CD, included with the
book, contains all the figures in color
PDF and PowerPoint formats, making
it easier for overhead or electronic pre-
sentations.
The broad range of topics covers ma-
terials science concepts, electrical and
thermal conduction in solids, quan-
tum-physics, theory of solids, dielectric
materials and insulation, and magnetic
and optical properties of materials. For
example, there is a good comparison of
different capacitor types illustrating the
physical mechanisms and dielectric
properties of electrolytic, mica, polyes-
ter, ceramics, tantalum, and others.
There is even a section, although very
basic, on dielectric breakdown in solids,
liquids, and gases.
The book reads more like a physics
book, filled with practical, well-illus-
trated and explained topics that are
pertinent to engineers, physicists, and
scientists today. Even though the text
is intended for an undergraduate
course, it could easily be used by the
engineering community as general ref-
erence text, especially for those who
only occasionally use electronic com-
ponents but need to understand the ba-
sic physics behind devices.
Practical Injection Molding
by B.A. Olmsted and M.E. Davis
Marcel Dekker
270 Madison Ave.
New York, NY 10016
http://www.dekker.com
Phone +1 800 228 1160
Fax +1 845 796 1772
217 pp. - $ 99.75
Many electrical and electronic com-
ponents are fabricated by injection
molding. This book is intended to pro-
vide an understanding of the principles
of injection molding to people respon-
sible for operating and maintaining in-
jection-molding equipment. The book
first discusses the polymers and fillers
used in injection molding and the key
physical properties that determine the
suitability for injection molding. Vari-
ous parts of injection molding equip-
ment are then described from the load-
ers and dryers through the parts of the
injection unit to clamping systems and
the mold.
In each chapter there are many sug-
gestions offered to use the equipment
properly and avoid common problems.
Following a description of the equip-
ment is a very useful chapter on cor-
rectly setting the operating parame-
ters, such as mold venting and cooling,
selecting the right screw, heat and pres-
sure control, selecting injection rate,
and screw speed. Injection molding of
thermoset is also addressed. There is
an extensive chapter on troubleshoot-
ing molding problems. In all, this
would be a useful book for anyone op-
erating the equipment and trying to
mold parts successfully.
K. F. Schoch, Jr.
IEEE Electrical Insulation Magazine