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IGBT
This Insulated Gate Bipolar Transistor (IGBT) features a robust and
cost effective Field Stop (FS) Trench construction, and provides
superior performance in demanding switching applications, offering
both low on state voltage and minimal switching loss.
Features www.onsemi.com
• Extremely Efficient Trench with Field Stop Technology
• TJmax = 175°C
• Soft Fast Reverse Recovery Diode 75 A, 600 V
• Optimized for High Speed Switching VCEsat = 1.70 V
• 5 ms Short−Circuit Capability EOFF = 1.0 mJ
• These are Pb−Free Devices
C
Typical Applications
• Solar Inverters
• Uninterruptible Power Supplies (UPS)
• Welding G
Collector current IC A
@ TC = 25°C 100
@ TC = 100°C 75
TO−247
Diode Forward Current IF A G CASE 340L
@ TC = 25°C 100 C
E STYLE 4
@ TC = 100°C 75
Diode Pulsed Current IFM 200 A
TPULSE Limited by TJ Max
MARKING DIAGRAM
Pulsed collector current, Tpulse ICM 200 A
limited by TJmax
Power Dissipation PD W
@ TC = 25°C 595
@ TC = 100°C 265
Operating junction temperature TJ −55 to +175 °C A = Assembly Location
range Y = Year
WW = Work Week
Storage temperature range Tstg −55 to +175 °C
G = Pb−Free Package
Lead temperature for soldering, 1/8” TSLD 260 °C
from case for 5 seconds
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be Device Package Shipping
assumed, damage may occur and reliability may be affected.
NGTB75N60FL2WG TO−247 30 Units / Rail
(Pb−Free)
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal resistance junction−to−case, for IGBT RqJC 0.28 °C/W
Thermal resistance junction−to−case, for Diode RqJC 0.62 °C/W
Thermal resistance junction−to−ambient RqJA 40 °C/W
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NGTB75N60FL2WG
TYPICAL CHARACTERISTICS
200 200
VGE = 20 V VGE = 20 V
180 TJ = 25°C 180 13 V
IC, COLLECTOR CURRENT (A)
200 160
VGE = 20 V
180 TJ = −55°C IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
to 13 V 140
160
120
140 11 V
120 100
100 80
80 10 V
60
60
7V 40 TJ = 150°C
40 9V
20 20
8V TJ = 25°C
0 0
0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8 9 10 11 12 13
VCE, COLLECTOR−EMITTER VOLTAGE (V) VGE, GATE−EMITTER VOLTAGE (V)
Figure 3. Output Characteristics Figure 4. Typical Transfer Characteristics
VCE, COLLECTOR−EMITTER VOLTAGE (V)
2.50 100,000
TJ = 25°C
IC = 75 A
1.50 IC = 25 A 1000
Coes
1.00 100
Cres
0.50 10
0 1
−75 −50 −25 0 25 50 75 100 125 150 175 200 0 10 20 30 40 50 60 70 80 90 100
TJ, JUNCTION TEMPERATURE (°C) VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 5. VCE(sat) vs. TJ Figure 6. Typical Capacitance
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NGTB75N60FL2WG
TYPICAL CHARACTERISTICS
70 16
VCE = 400 V
12
50
10
40
8
30
6
20
TJ = 150°C 4
VCE = 400 V
10 2 VGE = 15 V
TJ = 25°C IC = 75 A
0 0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 50 100 150 200 250 300 350
VF, FORWARD VOLTAGE (V) QG, GATE CHARGE (nC)
Figure 7. Diode Forward Characteristics Figure 8. Typical Gate Charge
3.0 1000
Eon
2.5
SWITCHING TIME (ns)
td(off)
SWITCHING LOSS (mJ)
2.0
td(on)
Eoff
1.5 100 tf
1.0 tr
VCE = 400 V VCE = 400 V
VGE = 15 V VGE = 15 V
0.5 IC = 75 A
IC = 75 A
Rg = 10 W Rg = 10 W
0 10
0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Switching Loss vs. Temperature Figure 10. Switching Time vs. Temperature
6 1000
VCE = 400 V
VGE = 15 V
5
TJ = 150°C
td(off)
SWITCHING TIME (ns)
Rg = 10 W Eon
SWITCHING LOSS (mJ)
4
tf
3 100 td(on)
Eoff
2 tr
VCE = 400 V
VGE = 15 V
1
TJ = 150°C
Rg = 10 W
0 10
15 25 35 45 55 65 75 85 95 105 15 25 35 45 55 65 75 85 95 105
IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)
Figure 11. Switching Loss vs. IC Figure 12. Switching Time vs. IC
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NGTB75N60FL2WG
TYPICAL CHARACTERISTICS
14 10,000
VCE = 400 V
VCE = 400 V VGE = 15 V
12
VGE = 15 V TJ = 150°C
SWITCHING LOSS (mJ)
td(off)
6 tr
Eoff 100 tf
4
0 10
5 15 25 35 45 55 65 75 85 5 15 25 35 45 55 65 75 85
Rg, GATE RESISTOR (W) Rg, GATE RESISTOR (W)
Figure 13. Switching Loss vs. Rg Figure 14. Switching Time vs. Rg
6 1000
5
Eon
SWITCHING LOSS (mJ)
td(off)
4
td(on)
3 100 tf
Eoff tr
2
VGE = 15 V VGE = 15 V
TJ = 150°C TJ = 150°C
1 IC = 75 A
IC = 75 A
Rg = 10 W Rg = 10 W
0 10
150 200 250 300 350 400 450 500 550 600 650 150 200 250 300 350 400 450 500 550 600 650
VCE, COLLECTOR−EMITTER VOLTAGE (V) VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 15. Switching Loss vs. VCE Figure 16. Switching Time vs. VCE
1000 1000
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
100
50 ms 100
dc operation
10
100 ms
Single Nonrepetitive 1 ms 10
1 Pulse TC = 25°C
Curves must be derated
linearly with increase
in temperature VGE = 15 V, TC = 150°C
0.1 1
1 10 100 1000 1 10 100 1000
VCE, COLLECTOR−EMITTER VOLTAGE (V) VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 17. Safe Operating Area Figure 18. Reverse Bias Safe Operating Area
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NGTB75N60FL2WG
TYPICAL CHARACTERISTICS
2.5 TJ = 175°C, IF = 75 A
130
TJ = 175°C, IF = 75 A
2.0
110
1.5
90
1.0 TJ = 25°C, IF = 75 A
TJ = 25°C, IF = 75 A
70
0.5
50 0
100 300 500 700 900 1100 1300 100 300 500 700 900 1100 1300
diF/dt, DIODE CURRENT SLOPE (A/m) diF/dt, DIODE CURRENT SLOPE (A/m)
Figure 19. trr vs. diF/dt (VR = 400 V) Figure 20. Qrr vs. diF/dt (VR = 400 V)
Irm, REVERSE RECOVERY CURRENT (A)
50 3.5
TJ = 175°C, IF = 75 A
VF, FORWARD VOLTAGE (V)
40 3.0
IF = 75 A
30 2.5
IF = 50 A
20 2.0
TJ = 25°C, IF = 75 A
IF = 25 A
10 1.5
0 1.0
100 300 500 700 900 1100 1300 −75 −50 −25 0 25 50 75 100 125 150 175 200
diF/dt, DIODE CURRENT SLOPE (A/m) TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Irm vs. diF/dt (VR = 400 V) Figure 22. VF vs. TJ
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NGTB75N60FL2WG
TYPICAL CHARACTERISTICS
1
SQUARE−WAVE PEAK R(t) (°C/W)
RqJC = 0.282
50% Duty Cycle
0.1 20%
10%
5% Junction R1 R2 Rn Case Ri (°C/W) Ci (J/°C)
0.01 2% 0.0270 0.0037
0.0243 0.0130
0.0225 0.0445
0.0554 0.0571
C1 C2 Cn 0.1121 0.0892
0.001
0.0409 0.7725
Duty Factor = t1/t2
Peak TJ = PDM x ZqJC + TC
Single Pulse
0.0001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1
ON−PULSE WIDTH (s)
Figure 23. IGBT Transient Thermal Impedance
1
RqJC = 0.604
SQUARE−WAVE PEAK R(t) (°C/W)
20%
0.1 10%
Ri (°C/W) Ci (J/°C)
5% Junction R1 R2 Rn Case 0.006394 0.000156
0.007900 0.001266
2%
0.008527 0.003708
0.025491 0.003923
0.01 0.022800 0.013870
C1 C2 Cn 0.121738 0.008214
Single Pulse
0.363338 0.275226
Duty Factor = t1/t2
Peak TJ = PDM x ZqJC + TC
0.001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1
ON−PULSE WIDTH (s)
Figure 24. Diode Transient Thermal Impedance
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NGTB75N60FL2WG
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NGTB75N60FL2WG
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NGTB75N60FL2WG
PACKAGE DIMENSIONS
TO−247
CASE 340L−02
ISSUE F
−T− NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
C Y14.5M, 1982.
−B− 2. CONTROLLING DIMENSION: MILLIMETER.
E
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
U L A 20.32 21.08 0.800 8.30
N B 15.75 16.26 0.620 0.640
4
C 4.70 5.30 0.185 0.209
A D 1.00 1.40 0.040 0.055
−Q− E 1.90 2.60 0.075 0.102
1 2 3 0.63 (0.025) M T B M F 1.65 2.13 0.065 0.084
G 5.45 BSC 0.215 BSC
H 1.50 2.49 0.059 0.098
P J 0.40 0.80 0.016 0.031
−Y− K 19.81 20.83 0.780 0.820
L 5.40 6.20 0.212 0.244
K N 4.32 5.49 0.170 0.216
P --- 4.50 --- 0.177
Q 3.55 3.65 0.140 0.144
U 6.15 BSC 0.242 BSC
W 2.87 3.12 0.113 0.123
W J
STYLE 4:
F 2 PL H PIN 1. GATE
G 2. COLLECTOR
D 3 PL 3. EMITTER
4. COLLECTOR
0.25 (0.010) M Y Q S
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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