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ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
APL5308/9
APL5308/9 15 D : XXXXX - Date Code ; 15 - 1.5V
XXXXX 15
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Marking Information
SOT-23-3 and SOT-23-5 packages
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, CIN = 1µF, COUT = 4.7µF, TA= -40 to 85°C. Typical values refer
to TA = 25°C.
APL5308/9
Symbol Parameter Test Conditions Unit
Min. Typ. Max.
VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2% VOUT VOUT +2% V
1.5V≤VOUT<2.0V - 1 1.2
No load - 60 100
IQ Quiescent Current µA
IOUT = 300mA - 450 500
APL5308/9
Symbol Parameter Test Conditions Unit
Min. Typ. Max.
OTS Over Temperature Shutdown - 150 - °C
Over Temperature Shutdown Hysteresis Hysteresis - 30 - °C
TC Output Voltage Temperature Coefficient - 50 - ppm/°C
TJ Junction Temperature 0 - 125 °C
COUT Output Capacitor - 2.2 - µF
ESR 0.01 0.1 1 Ohm
Note 3 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT+1V.
Quiescent Current vs. Input Voltage Quiescent Current vs. Output Current
APL5308/9-33
APL5308/9-33
450 450
IOUT=0mA 400
400
VIN=5V
300 300
250 250
200 200
150 150
100 100
50 50
0 0
0 1 2 3 4 5 6 0 100 200 300 400 500
2.5
Output Voltage (V)
3.30
Output Voltage (V)
VOUT=2.5V
2 3.30
1 3.29
0.5 3.28
0 3.28
0 1 2 3 4 5 -40 -20 0 20 40 60 80 100 120 140
2.55 1.84
2.54
1.83
2.53
1.82
2.52
2.51 1.81
2.50
1.80
2.49
2.48 1.79
2.47
1.78
2.46
2.45 1.77
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
-20
500
Dropout Voltage (mV)
-30
PSRR (dB)
400
VOUT=2.5V -40
300
-50
200 - 60
VOUT=2.8V
100 VOUT=3.3V - 70
0 -80
20 50 100 200 500 1 k 2k 5k 10k 20k 50k 100k 200k
0 50 100 150 200 250 300
Output Current (mA) Frequency (HZ)
VIN=4.5V~5.5V
VOUT COUT=1µF
IOUT=10mA
VIN=5V
COUT=1µF
VOUT
IOUT=1mA~300mA
0.7
0.6
Power Dissipation (W)
0.5
SOT-89
0.4
0.3
0.2 SOT-25
0.1
0
0 25 50 75 100 125
Pin Description
PIN
I/O FUNCTION
NO. NAME
Package Information
SOT-23-3
D
e
SEE
VIEW A
E1
b c
e1
0.25
A2
GAUGE PLANE
A1
SEATING PLANE
L
0
VIEW A
S SOT-23-3
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.30 0.035 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Package Information
SOT-23-5
D
e
SEE
VIEW A
E1
E
b c
e1
0.25
A2
GAUGE PLANE
SEATING PLANE
A1
L
0
VIEW A
S SOT-23-5
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.30 0.035 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Package Information
SOT-89
D A
D1 C
E1
E
H
e L
e1
B1 B
S SOT-89
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.40 1.60 0.055 0.063
B 0.44 0.56 0.017 0.022
B1 0.36 0.48 0.014 0.019
C 0.35 0.44 0.014 0.017
D 4.40 4.60 0.173 0.181
D1 1.62 1.83 0.064 0.072
E 2.29 2.60 0.090 0.102
E1 2.13 2.29 0.084 0.090
e 1.50 BSC 0.059 BSC
e1 3.00 BSC 0.118 BSC
H 3.94 4.25 0.155 0.167
L 0.89 1.20 0.035 0.047
OD0 P0 P2 P1 A
E1
F
W
B0
K0 A0 OD1 B A
B
SECTION A-A
T
SECTION B-B
d
H
A
T1
Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±
2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
SOT-23-3 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.05 1.0 MIN. 3.20±0.20 3.10±
0.20 1.50±0.20
-0.00 -0.40
Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±
2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
SOT-23-5 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.05 1.0 MIN. 3.20±0.20 3.10±
0.20 1.50±0.20
-0.00 -0.40
Application A H T1 C d D W E1 F
12.4+2.00 13.0+0.50
178.0±
2.00 50 MIN. 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05
-0.00 -0.20
SOT-89 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 8.0±0.10 2.0±0.05 1.5 MIN. 4.80±0.20 4.50±
0.20 1.80±0.20
-0.00 -0.40
SOT-23-5
SOT-89
TP tp
Critical Zone
TL to TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
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