Professional Documents
Culture Documents
z Low Temperature Coefficient ` RoHS compliant and compatible with the current require-
z Thermal Shutdown Protection ` Suitable for use in SnPb or Pb-free soldering processes.
5 4 5 4 5 4 3
2 3 2 3 2 3 2
VIN GND EN/EN EN/EN NC GND EN/EN GND VIN GND VOUT
VIN VOUT
NC 8 EN/EN 4 3
EN/EN 1 6 NC NC 2 7 NC
GND
GND 2 5 NC GND 3 6 NC 2
VIN 3 7 4 VOUT VIN 4 5 VOUT
EN/EN GND
RT9198A
VIN VIN VOUT VOUT
CIN COUT
1uF 1uF
-
MOS Driver
+
Error
Amplifier VOUT
Current-Limit
and
Thermal
Protection
GND
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, TA = 25°C, unless otherwise specified)
To be continued
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layers thermal conductivity test board
of JEDEC 51-3 thermal measurement standard. The case point of θJC is on the exposed pad for the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
85
1.8 80
No Load
75
1.7 70
65
1.6 60
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
EN Pin Shutdown Threshold vs. Temperature Current Limit vs. Input Voltage
1.5 600
RT9198/A-15 RT9198/A-15
VIN = 3.3V CIN = COUT = 1uF
EN Pin Threshold Voltage (V)
500
1
450
0.75
400
0.5
350
0.25 300
-50 -25 0 25 50 75 100 125 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5
Temperature (°C) Input Voltage (V)
200
TJ = 25°C
PSRR (dB)
-20
150
TJ = -40°C -40
100
ILOAD = 100mA
-60
50
ILOAD = 10mA
0 -80
0 0.05 0.1 0.15 0.2 0.25 0.3 10
0.01 100
0.1 1K
1 10K
10 100K
100 1M
1000
Load Current (A) Frequency (kHz)
(Hz)
Input Voltage
Deviation (V)
Input Voltage
Deviation (V)
5 5
4 4
3 3
Deviation (mV)
Deviation (mV)
Output Voltage
Output Voltage
20 50
0 0
-20 -50
CIN = COUT = 1uF ILOAD= 1mA to 50mA CIN = COUT = 1uF ILOAD = 1mA to 250mA
100 400
(mA)
(mA)
50 200
0 0
Deviation (mV)
Output Voltage
Deviation (mV)
Output Voltage
50 50
0 0
-50 -50
EN Pin Voltage
CIN = COUT = 1uF ILOAD = 1mA CIN = COUT = 1uF ILOAD = 1mA
10 10
(V)
(V)
5 5
0 0
Output Voltage
Output Voltage
2 2
(V)
1
(V)
0 0
Noise Noise
VIN = 4.5V VOUT = 1.8V VIN = 4.5V VOUT = 1.8V
CIN = COUT = 1uF ILOAD = 150mA CIN = COUT = 1uF No Load
400 400
200 200
Noise (μV)
Noise (μV)
0 0
-200 -200
-400 -400
COUT = 1uF
1.001
resistance of IC package, PCB layout, the rate of
Stable surroundings airflow and temperature difference between
0.10
junction to ambient. The maximum power dissipation can
be calculated by following formula :
0.01
RT9198/A-15xU5 PD(MAX) = ( TJ(MAX) - TA ) / θJA
COUT = 1μF, X7R Simulation Verify
0.00 Where T J(MAX) is the maximum operating junction
0 50 100 150 200 250 300
temperature 125°C, TA is the ambient temperature and the
Load Current (mA)
θJA is the junction to ambient thermal resistance.
Figure 1
700
Maximum Power Dissipation (mW) 1
WDFN-6L 2x2
600
500
SOT-23-3/SOT-23-5
400 TSOT-23-3/TSOT-23-5
300
SC 70-5
200 SC-82
100
0
0 15 30 45 60 75 90 105 120 135
Ambient Temperature (°C)
H
D
L
C B
A
A1
b
H
D
L
C B
A
A1
e
H
D
L
C B
A
A1
b
H
D
L
C B
A
A1
e
H
D
L
C B
A
A1
e
D H
e
L
C B
b b1
A
A1
e
D
L
E E1
A A2
A1
b
D D2
E E2
SEE DETAIL A
1
e
b 2 1 2 1
A
A3
A1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.